Semiconductor device test system with performing various tests

Abstract

A semiconductor device test system according to an embodiment of the present invention may include a loader in which a plurality of semiconductor devices are prepared; a handler that arranges at least some of the plurality of semiconductor devices prepared in the loader into a test tray; an unloader located adjacent to the handler and waiting before the semiconductor device that has been tested is removed to the outside; a transfer having one end located adjacent to the handler and the other end extended in the longitudinal direction, which transports the test tray along the longitudinal direction; and a plurality of test cells formed to be able to exchange the transfer and the test tray, which evaluate the performance of the semiconductor device in a predetermined temperature environment and are each disposed on the side of the transfer.

Description

Technology Field

[0001] The present invention relates to a test cell for evaluating the performance of a semiconductor device and a semiconductor device test system comprising the test cell for evaluating the performance of a semiconductor device. Background Technology

[0002] A device performance tester is a device used to inspect various devices (e.g., semiconductor components, modules, SSDs, and various other electronic components; hereinafter referred to as semiconductor devices) after they have been manufactured. Such a device performance tester artificially creates various environments for the connected device to verify whether the device is operating normally.

[0003] Devices that have completed inspection can be classified into good products, re-inspection products, defective products, etc., by a handler linked to the inspection results. Here, the handler may be a device that mounts multiple packaged devices onto a device performance tester and / or separates devices that have completed testing from the device performance tester and classifies them according to the results.

[0004] The tester can continuously perform inspections by exchanging the tray loaded with devices to be tested and the tray loaded with devices that have completed testing through a handler.

[0005] Meanwhile, a type of device performance test is the temperature load test. The temperature load test is a test designed to verify whether a device satisfies the required performance conditions under specific temperature conditions (high to low temperatures).

[0006] In order to reduce the performance evaluation time for multiple semiconductor devices, a system including multiple handlers and testers was conventionally used. However, an increase in the number of handlers was a factor that increased costs and the overall system footprint. The problem to be solved

[0007] The problem that the present invention aims to solve is to provide a semiconductor device test system capable of efficiently evaluating the performance of a large number of semiconductor devices using a single handler.

[0008] In addition, the problem that the present invention aims to solve is to provide a semiconductor device test system with excellent space efficiency by minimizing the installation space of the system.

[0009] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] A semiconductor device test system according to an embodiment of the present invention for solving the above problem may include a loader in which a plurality of semiconductor devices are prepared; a handler that arranges at least some of the plurality of semiconductor devices prepared in the loader into a test tray; an unloader located adjacent to the handler and waiting before the semiconductor device that has been tested is taken out to the outside; a transfer having one end located adjacent to the handler and the other end extended in the longitudinal direction, which transports the test tray along the longitudinal direction; and a plurality of test cells formed to be able to exchange the transfer and the test tray, which evaluate the performance of the semiconductor device in a predetermined temperature environment and are each disposed on the side of the transfer.

[0011] The test cell may include a test chamber for evaluating the performance of the semiconductor device in the temperature environment, comprising a plurality of sockets electrically connectable to a plurality of the semiconductor devices arranged on the test tray; a soak chamber prepared to receive the test tray from the transfer and expose the semiconductor device to the temperature environment; and a desoak chamber prepared to receive the test tray from the test chamber and return the semiconductor device to an external environment.

[0012] The above soak chamber and the above diso chamber can be aligned along the height direction on the side of the transfer.

[0013] The above transfer can be configured to receive the test tray, which has completed testing, from the disock chamber while transferring the test tray to the soak chamber for testing.

[0014] The above transfer may include a first holding part formed to transfer the test tray to the soak chamber and a second holding part positioned above or below the first holding part and formed to receive the test tray from the disodium chamber.

[0015] The test cell may further include a pressurizer located above the plurality of sockets and pressurizing the test tray that is transferred to the upper side of the plurality of sockets via the soak chamber so that the semiconductor device is electrically connected to the sockets.

[0016] The above pressurizer may include a pressurizing block that moves up and down between an initial height and a lowering height to selectively pressurize the semiconductor device.

[0017] The outlet of the above soak chamber is located adjacent to the pressurizing block of the above initial height, and the inlet of the above desoak chamber may be located adjacent to the pressurizing block of the above lowering height.

[0018] A plurality of the above test cells may be installed in a multilayer structure along an axis parallel to the longitudinal direction on at least one side of the transfer.

[0019] The above transfer may include a support rack extended along the longitudinal direction, a longitudinal transfer unit extended in the height direction that moves along the longitudinal direction on the support rack, and a height transfer unit that moves along the height direction on the longitudinal transfer unit while supporting the test tray and transfers each of the test cells and the test tray.

[0020] The height direction transfer unit may include a rotator that rotates the test tray around the height direction so that the test tray, which is distinguished as front and back, can be transferred in the forward direction to each of the test cells located on opposite sides with respect to the length direction as the reference axis.

[0021] The above transfer may further include a cell identification sensor located on the test cell and recognizing an identifier formed to distinguish between different test cells.

[0022] Some of the above test cells may be set to a temperature environment different from that of the others.

[0023] The above transfer can sequentially transfer the test tray to each of the test cells set to different temperature environments so that the test tray returns to the handler after experiencing all tests for different temperature environments.

[0024] A semiconductor device test system according to an embodiment of the present invention for solving the above problem may include: a loader in which a plurality of semiconductor devices are prepared; a handler that arranges at least some of the plurality of semiconductor devices prepared in the loader into a test tray; an unloader located adjacent to the handler and waiting before the semiconductor devices that have been tested are taken out to the outside; a plurality of test cells that evaluate the performance of the semiconductor devices arranged in the test tray in a predetermined temperature environment; a transfer that transfers the test tray from the handler to each of the test cells according to a predetermined test order or transfers the test trays that have been tested from each of the test cells to the handler according to a predetermined return order; and a buffer rack located adjacent to the transfer that temporarily stores the test trays in the event that a situation occurs in which the transfer cannot receive the test trays at the location where the test trays are to be delivered during the process of transferring the test trays according to the test order or the return order.

[0025] Some of the plurality of test cells may be positioned on one side relative to the transfer, and other parts of the plurality of test cells may be positioned on the opposite side relative to the transfer.

[0026] The above buffer rack may include a rotator that selectively rotates the test tray so that the test tray, which is formed with a structure that distinguishes the front and back, can be stored in the forward direction.

[0027] The above buffer rack may further include a direction identification sensor that identifies a direction identifier formed on the test tray to identify the front and back of the test tray.

[0028] The above transfer may include a rotator that selectively rotates the test tray so that the test tray, which is formed with a structure that distinguishes the front and back, can be stored in the forward direction.

[0029] The above transfer has a transfer path extending from a first position closest to the handler to a second position furthest from the handler, and the buffer rack may be positioned adjacent to a point that is more than halfway along the transfer path.

[0030] The above buffer rack may include a first storage section in which the test trays that were not transported according to the above test order are temporarily stored, and a second storage section in which the test trays that were not transported according to the above return order are temporarily stored.

[0031] The above buffer rack may include a storage detection sensor that detects the presence or absence of the test tray inside the buffer rack.

[0032] A semiconductor device test system according to an embodiment of the present invention for solving the above problem may include: a test chamber that evaluates the performance of a semiconductor device in a test space set to a predetermined temperature environment, comprising a plurality of sockets electrically connectable to a plurality of semiconductor devices arranged on a test tray; a soak chamber located on one side of the test space and prepared for the test tray received from the outside to be exposed to the temperature environment; a desoak chamber located on one side of the test space at a height different from that of the soak chamber, prepared for the test tray to be received from the test chamber and returned to an external environment, and a transfer that exchanges the test tray with the soak chamber and the desoak chamber.

[0033] The above transfer can remove the test tray located inside the disock chamber while transferring a new test tray into the interior of the soak chamber.

[0034] The above transfer may include a holding part configured to enter the interior of the above soak chamber or the above dissoil chamber to pick up or place the test tray.

[0035] The holding part may include a hook that holds the test tray while rotated at a certain angle with the forward / backward direction as the central axis, a forward / backward frame that supports the hook so as to be angle-adjustable with the forward / backward direction as the central axis, and a guide rail that supports the forward / backward frame so as to be able to move back and forth along the forward / backward direction.

[0036] The above soak chamber may include a soak feeder that is movable from the internal space of the soak chamber to the test space and pulls the test tray to position it on the upper side of a plurality of sockets.

[0037] The above test chamber may further include a pressurizer that presses the test tray placed by the soak feeder toward a plurality of sockets.

[0038] The above disock chamber may include a disock feeder that is movable from the test space to the internal space of the disock chamber and pulls the test tray, which has been released from the pressurizer, to position it in the internal space of the disock chamber.

[0039] The above disock chamber may have an inlet formed at a height corresponding to the height of the test tray located above a plurality of sockets, into which the test tray enters.

[0040] The test chamber may further include an elastic support member that elastically supports the test tray by being positioned adjacent to a plurality of sockets so that the test tray located on a plurality of sockets rises to the height of the entrance of the disock chamber when the pressure of the pressurizer is released.

[0041] The above soak feeder may include a feeding hook having a shape that can be inserted into a groove formed on the test tray and moving between the internal space of the soak chamber and the test space while inserted into the groove.

[0042] The above disock chamber may include a disock feeder that is movable from the test space to the internal space of the disock chamber and pulls the test tray located in the test space to position it in the internal space of the disock chamber.

[0043] A test cell according to an embodiment of the present invention for solving the above problem may include a test chamber that evaluates the performance of a semiconductor device in a test space set to a predetermined temperature environment, comprising a plurality of sockets electrically connectable to a plurality of semiconductor devices arranged on a test tray; a soak chamber located on one side of the test space and prepared for the test tray received from the outside to be exposed to the temperature environment; and a desoak chamber located on one side of the test space at a height different from that of the soak chamber, prepared for the test tray to be received from the test chamber and for the test tray to be returned to the external environment.

[0044] Other specific details of the present invention are included in the detailed description and drawings. Effects of the invention

[0045] According to embodiments of the present invention, at least the following effects are achieved.

[0046] A large number of test chambers can be installed relative to the installation space, thereby increasing the efficiency of the semiconductor device performance evaluation process.

[0047] Since one handler can be used per system, the burden on equipment costs relative to performance can be reduced.

[0048] By setting some of the test chambers to different temperature conditions, it is possible to evaluate the performance of semiconductor devices under multiple temperature conditions using a single system.

[0049] Even if a single handler utilizes multiple test chambers, tray logistics congestion can be effectively prevented.

[0050] The effects according to the present invention are not limited to those exemplified above, and various other effects are included in this specification. Brief explanation of the drawing

[0051] FIG. 1 is an overall perspective view of a semiconductor device test system according to one embodiment of the present invention. FIG. 2 is a conceptual plan view of a semiconductor device test system according to one embodiment of the present invention. FIG. 3 is a conceptual diagram illustrating a direction identification sensor identifying the direction of a test tray according to one embodiment of the present invention. FIG. 4 is a conceptual diagram illustrating the configuration of a buffer rack according to one embodiment of the present invention. FIG. 5 is an overall perspective view of a transfer according to one embodiment of the present invention. FIG. 6 is a drawing showing the state in which the outer frame of a transfer according to one embodiment of the present invention has been removed. FIG. 7 is a conceptual drawing illustrating a height-direction transfer unit according to one embodiment of the present invention. FIG. 8 is a detailed drawing of a holding part according to one embodiment of the present invention. FIG. 9 is a drawing illustrating the normal state of a hook according to one embodiment of the present invention. FIG. 10 is a drawing showing a state in which a hook according to one embodiment of the present invention is rotated to hold a test tray. FIG. 11 is a conceptual drawing illustrating a holding unit transporting a test tray according to one embodiment of the present invention. FIG. 12 is a drawing illustrating a test cell according to one embodiment of the present invention. FIG. 13 is a conceptual drawing illustrating a test cell according to one embodiment of the present invention. FIG. 14 is a conceptual drawing illustrating the movement of a test tray according to one embodiment of the present invention. FIG. 15 is a conceptual diagram illustrating the exchange of a test tray between a transfer and a test cell according to one embodiment of the present invention. FIG. 16 is a drawing showing a soak feeder or desoak feeder and a test tray in part. Specific details for implementing the invention

[0052] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0053] Furthermore, the embodiments described herein will be explained with reference to cross-sectional views and / or schematic drawings, which are exemplary illustrations of the present invention. Accordingly, the form of the exemplary drawings may be modified due to manufacturing techniques and / or tolerances, etc. Additionally, in each drawing of the present invention, each component may be depicted slightly enlarged or reduced for convenience of explanation. Throughout the specification, the same reference numerals refer to the same components.

[0054] Hereinafter, the present invention will be described with reference to the drawings for explaining a semiconductor device test system according to an embodiment of the present invention.

[0055] FIG. 1 is an overall perspective view of a semiconductor device test system according to an embodiment of the present invention. The example shown in FIG. 1 is an exemplary view of a semiconductor device test system (1) according to an embodiment of the present invention, and the present invention is not limited to the embodiment of FIG. 1.

[0056] As illustrated in FIG. 1, in one embodiment of the present invention, another semiconductor device test system (1) may be configured to include a handler (100), a loader (200), an unloader (300), a transfer (400), and a test cell (500).

[0057] The handler (100) may be a unit that receives semiconductor devices requiring testing from an external source and holds semiconductor devices for which testing is completed. The handler (100) may include internal modules necessary to ensure that semiconductor devices are properly logisticsd and loaded and / or unloaded. For example, the handler (100) may be configured to include a stacker, a pick-and-place unit, a table, etc., to assist in logistics using user trays and test trays.

[0058] Here, the user tray may be a tray on which the semiconductor device is loaded when the semiconductor device prior to testing is supplied to the handler (100) or when the semiconductor device after testing is taken out to the outside.

[0059] In this regard, the test tray may be a tray on which a semiconductor device to be tested is transferred. The test tray may have multiple inserts corresponding to the socket arrangement of the test cell (500). The semiconductor device may be transferred while mounted on these inserts, and after performing the test, it may be returned to the handler (100).

[0060] With the semiconductor device mounted in the insert of the test tray, the top (or upper surface) and bottom (or lower surface) may each be exposed to the outside of the test tray. The exposed top (or upper surface) portion may be pressed by a pressurizer described later, and the bottom (or lower surface) portion may be inserted into a socket.

[0061] A pick-and-place unit can be used to transport semiconductor devices loaded in a user tray to a test tray, to transfer semiconductor devices loaded in a test tray to a user tray, or to classify semiconductor devices that have completed testing by grade. For example, semiconductor devices may be classified into good products, defective products, re-inspection, etc., or may be classified into further subdivisions as needed. To ensure smooth logistics, the handler (100) may include multiple such pick-and-place units.

[0062] The loader (200) is a unit that receives user trays and semiconductor devices from the outside and supplies them to the handler (100). The loader (200) can be implemented in various configurations as needed. The user trays and semiconductor devices supplied to the loader (200) may be supplied by automated equipment or supplied by an operator.

[0063] The loader (200) may be positioned in close contact with the handler (100) so that the semiconductor device transport path with the handler (100) is short. A pick-and-place unit and / or a transfer unit equivalent thereto may be positioned in the part of the handler (100) that is in close contact with the loader (200) to feed semiconductor devices and / or user trays prepared inside the loader (200) into the handler (100).

[0064] For example, the loader (200) prepares semiconductor devices on a user tray in units of 1 lot, and the handler (100) can transport at least a portion of the 1 lot to a test tray so that the semiconductor devices are accommodated in each insert.

[0065] The unloader (300) may be a unit that waits before a semiconductor device that has completed testing is shipped out. The unloader (300) may be implemented in various configurations as needed. An empty user tray may be waiting in the unloader (300), and this empty user tray may be supplied by automated equipment or supplied by an operator.

[0066] Similar to the loader (200), the unloader (300) may be positioned in close contact with the handler (100) so that the semiconductor device transport path with the handler (100) is short. In the part of the handler (100) that is in close contact with the unloader (300), a pick-and-place unit and / or a transfer unit equivalent thereto may be positioned to transfer the semiconductor device that has completed testing to a user tray prepared inside the unloader (300).

[0067] Multiple semiconductor devices can be sorted in the unloader (300) according to grades assigned based on test results. Good devices waiting in the unloader (300) can be taken out and undergo subsequent processes. Additionally, defective devices waiting in the unloader (300) can be discarded. Also, devices of the re-inspection grade waiting in the unloader (300) can be transferred back to the loader (200).

[0068] The transfer (400) may be a unit that transfers a test tray between the handler (100) and each test cell (500). In a semiconductor device test system (1) according to one embodiment of the present invention, the transfer (400) may have a shape that extends along the longitudinal direction with respect to the handler (100).

[0069] More specifically, the transfer (400), loader (200), and unloader (300) may be positioned in close contact with one side of the handler (100). The loader (200) and the unloader (300) may be positioned symmetrically with respect to each other with the transfer (400) in between. Accordingly, according to one embodiment of the present invention, the loading operation of the loader (200), the transfer operation of the transfer (400), and / or the unloading operation of the unloader (300) may be performed sequentially on one side of the handler (100). Additionally, according to one embodiment of the present invention, the loader (200) and the unloader (300) are positioned in close contact with both sides of the transfer (400), so that the transfer distance of the semiconductor device inside the handler (100) can be shortened.

[0070] The form of the transfer (400) may be such that the entire system has a high aspect ratio. A key feature of the semiconductor device test system (1) according to one embodiment of the present invention may be that a single handler (100) handles the logistics of a plurality of test cells (500).

[0071] A transfer (400) having a long length can have its longitudinal shear portion in close contact with the handler (100). At the shear of the transfer (400), a test tray exchange between the handler (100) and the transfer (400) can be performed.

[0072] The rear end of the transfer (400) extends in the longitudinal direction, and the length of the transfer (400) can be determined according to the number of test cells (500) installed. As the number of test cells (500) increases, the length of the transfer (400) can also be increased.

[0073] To reduce the length burden of the transfer (400), the test cell (500) may optionally be arranged in a multi-layered structure. In this case, the transfer (400) may be configured to transport the test tray in the length direction as well as the height direction. Likewise, to reduce the length burden of the transfer (400), the test cell (500) may be symmetrically arranged in both directions of the transfer (400).

[0074] The test cell (500) is formed to exchange a test tray with the transfer (400) and may be a unit for evaluating the performance of a semiconductor device. More specifically, the test cell (500) may provide a predetermined temperature environment while the supplied test tray is mounted on a socket. For example, the test cell (500) may test whether the semiconductor device operates normally in an environment within the range of minus 40 degrees Celsius to plus 130 degrees Celsius. A detailed description of the test cell (500) will be provided later.

[0075] At this time, since one embodiment of the present invention includes a plurality of test cells (500), the plurality of test cells (500) may each be set to different test conditions as needed. For example, some of the plurality of test cells (500) may be set to perform a test on a semiconductor device in a high-temperature environment, and others may be set to perform a test on a semiconductor device in a low-temperature environment.

[0076] Alternatively, some of the multiple test cells (500) and others may be for testing semiconductor devices of different types.

[0077] Meanwhile, FIG. 1 is illustrated with a total of eight test cells (500) arranged in a multilayer structure on both sides of the transfer (400), but this arrangement is merely exemplary and the present invention is not limited to such an arrangement. That is, the number and / or arrangement of the test cells (500) may have various modified embodiments.

[0078] Continuing the explanation with reference to FIG. 2, FIG. 2 is a conceptual plan view of a semiconductor device test system according to one embodiment of the present invention.

[0079] The user can install multiple test cells (500) to match the desired test process throughput, and the transfer (400) can be formed with a set length and shape according to the number and arrangement of the test cells (500).

[0080] As shown in FIG. 2, if multiple test cells (500) are used according to the user's needs, the length of the transfer (400) can also be increased accordingly (in this case, the length of the transfer is increased by arranging the test cells in the longitudinal direction as an example, but it is also possible to increase the height of the transfer by stacking the test cells in a high layer).

[0081] For convenience of explanation, the position closest to the handler (100) on the test tray transfer path (md) of the transfer (400) is referred to as the first position, and the position furthest apart is referred to as the second position.

[0082] For example, the first position is the location where the transfer (400) exchanges the test tray with the handler (100), and the second position may be the location where the transfer (400) exchanges the test tray with respect to the test cell (500) furthest from the handler (100).

[0083] The transfer (400) can transfer test trays to each test cell (500) in a predetermined order by means of a control unit that controls each element included in the semiconductor device test system (1) according to one embodiment of the present invention.

[0084] For convenience of explanation, the order in which the transfer (400) delivers the test tray to each test cell (500) to conduct the test is referred to as the test order. Additionally, the order in which the transfer (400) receives the test tray from each test cell (500) upon completion of the test in the test cell (500) is referred to as the return order.

[0085] When supplying a test tray to each test cell (500), the transfer (400) can move to a first position to receive the test tray, and then move to the test cell (500) corresponding to the test sequence to deliver the test tray. After delivering the test tray to the test cell (500), the transfer (400) can return to the first position to receive the test tray again in order to supply the test tray to the next test cell (500). That is, whenever the transfer (400) delivers a test tray to the test cell (500), it can return to the handler (100) to receive a new test tray.

[0086] Alternatively, as in the example described above, if there are test cells (500) with different test conditions among each test cell (500), the test order may be a sequence in which the test tray sequentially circulates all test cells (500) with different test conditions. For example, the control unit may set the test order for each test tray so that the test tray returns to the handler (100) after undergoing tests according to high temperature and low temperature environments at least once each.

[0087] When retrieving a test tray from each test cell (500), the transfer (400) moves to the test cell (500) corresponding to the return order, and then can retrieve the test tray that has been tested from the test cell (500).

[0088] Similar to when conducting a test, the transfer (400) can move to a first location after receiving the test tray and deliver the recovered test tray to the handler (100). That is, whenever the transfer (400) recovers a test tray, it can move to the handler (100), deliver the recovered test tray, and then move to the test cell (500) corresponding to the next return sequence.

[0089] However, during this process, a situation may occur where the test tray cannot be received at the location where the transfer (400) intends to deliver the test tray. The situation where the test tray cannot be received may be due to a temporary or time-consuming problem.

[0090] For example, it would be ideal for the tests to be completed sequentially in each test cell (500) in accordance with the test order. However, due to various reasons such as realistic conditional limitations, differences in test types, or differences in set temperatures, a situation may occur where the tests are completed in a different order from the test order.

[0091] Typically, the control unit can set the return order so that the test tray is retrieved starting from the test cell (500) where the test started first. However, in the above situation, a situation may occur where the test ends at the next test cell (500) before the unloading and / or sorting operation of the unloading and / or sorting equipment is finished.

[0092] In this case, even if the test tray is returned according to the return order, the transfer (400) remains in a waiting state until the work is completed at the handler (100), which may result in a longer overall process time.

[0093] Additionally, there may be cases where the transfer (400) moves to supply a new test tray to a test cell (500) that has completed testing, but the test is not successfully completed at the test cell (500) that will receive the test tray.

[0094] In such cases, the transfer (400) had to wait until the test of the test cell (500) was finished, or change the test order to supply the test tray to the next test cell (500) first. However, if the test cell (500) corresponding to the next order is located at a remote location relative to the test cell (500) in the previous order, the transport path of the transfer (400) became longer. Such additional waiting time or increase in the transport path was a factor that could increase the overall process time.

[0095] In preparation for such a situation, a semiconductor device test system (1) according to one embodiment of the present invention may further include a buffer rack (600).

[0096] The buffer rack (600) may be a unit for temporarily storing test trays that have not been properly moved according to the test order and / or return order. The buffer rack (600) may be implemented in various embodiments in which a plurality of test trays are loaded inside.

[0097] The buffer rack (600) can be positioned in close contact with the side of the transfer (400), similar to the test cell (500). The location of the buffer rack (600) can be at a point more than halfway when the transfer path of the transfer (400) is divided (md).

[0098] If a situation occurs where the test tray is not transported smoothly, the control unit can store the test tray back in the handler (100) if the current location of the test tray being transported by the transfer (400) is close to the handler (100).

[0099] Conversely, if the current location of the test tray being transported by the transfer (400) is close to the buffer rack (600), the control unit can control the transfer (400) to store the test tray in the buffer rack (600).

[0100] Meanwhile, depending on the semiconductor device being tested and / or the equipment used, the front and rear of the test tray may be distinguished.

[0101] However, referring to FIG. 2, some test cells (500) may be placed on opposite sides of the transfer (400). Therefore, in order to always store the test tray in the buffer rack (600) in the forward direction, at least one of the transfer (400) and the buffer rack (600) may include a rotator.

[0102] The rotator can be configured to rotate the test tray around the height axis of FIG. 1 as the central axis. The configuration of such a rotator may include various conventional embodiments.

[0103] Hereinafter, with reference to FIG. 3, a method for a transfer (400) and / or buffer rack (600) to identify the forward / reverse direction of a test tray (tt) will be described. FIG. 3 is a conceptual diagram illustrating a direction identification sensor identifying the direction of a test tray according to an embodiment of the present invention.

[0104] A direction identifier (tt1) may be placed on one side of the test tray (tt). For example, the direction identifier (tt1) may be placed on the front of the test tray (tt). The direction identifier (tt1) may be protruding or recessed relative to an adjacent area, formed as a through hole, or provided in the form of an optically recognizable code.

[0105] If the direction identifier (tt1) is protruding or recessed compared to an adjacent area, or is provided as a through hole, the direction identification sensor (640) can identify the direction identifier (tt1) by measuring the distance to each point on the test tray (tt). The direction identification sensor (640) can be provided to measure distance based on various methods such as optical, sound waves, and electromagnetic waves.

[0106] Meanwhile, in this case, the direction identifier (tt1) may have a form in which multiple protrusions, depressions, or penetrations are arranged in a line. The spacing of the arrangement of these multiple protrusions, depressions, or penetrations may be intended to provide binarized information. For example, the binarized information may be identification information assigned to the corresponding test tray (tt).

[0107] In this regard, if the direction identifier (tt1) is provided in the form of an optically recognizable code, the direction identification sensor (640) may be provided as a scanner capable of recognizing the direction identifier (tt1). At this time, the direction identifier (tt1) may include a code representing identification information of the test tray (tt).

[0108] Meanwhile, the control unit can determine the direction of the test tray (tt) based on the position of the direction identifier (tt1) on the test tray (tt). For example, if the direction identifier (tt1) is located in front of the test tray (tt) that has entered the transfer (400) and / or buffer rack (600), the control unit can recognize that the test tray (tt) has entered in the forward direction.

[0109] More specifically, the control unit can determine the location of the direction identifier (tt1) based on the difference between the entry time of the test tray (tt) and the time of recognition of the direction identifier (tt1) by the direction identification sensor (640).

[0110] To determine the entry point of the test tray (tt), the transfer (400) and / or buffer rack (600) may further include an entry detection switch(s). The entry detection switch(s) may be a switch formed to be pressed as the test tray (tt) enters the transfer (400) and / or buffer rack (600).

[0111] The entry detection switch(s) normally maintains a protruding state, but can be pressed when the test tray (tt) enters. The entry detection switch(s) may include an inclined surface so that it is pressed as the test tray (tt) enters in the entry direction (a1).

[0112] When the entry detection switch(s) is pressed, the control unit can receive an entry signal containing information that the test tray (tt) has entered the transfer (400) and / or buffer rack (600). Additionally, when the direction identification sensor (640) recognizes the direction identifier (tt1), it can transmit a direction identification signal to the control unit.

[0113] The control unit can determine that the test tray (tt) has entered in the forward direction if the difference in reception time between the entry signal and the direction identification signal is within a preset time. In contrast, the control unit can determine that the test tray (tt) has entered in the reverse direction if the difference in reception time between the entry signal and the direction identification signal exceeds a preset time. If the test tray (tt) has entered in the reverse direction, the control unit can operate a rotator to rotate the test tray (tt) 180 degrees.

[0114] Continuing the explanation with reference to FIG. 4, FIG. 4 is a conceptual drawing illustrating the configuration of a buffer rack according to one embodiment of the present invention.

[0115] As illustrated in FIG. 4, the buffer rack (600) may be configured to include a first storage section (610) and a second storage section (620). Each of the first storage section (610) and the second storage section (620) may be provided in a form that can store a plurality of test trays.

[0116] For example, the following description assumes that the first storage section (610) and the second storage section (620) are formed to store a plurality of test trays stacked in the height direction (see FIG. 1). In this embodiment, the test trays stored inside the first storage section (610) and / or the second storage section (620) may be stacked sequentially from the bottom of the storage space (hereinafter, storage space). However, the present invention is not limited to such an embodiment, and the first storage section (610) and the second storage section (620) may include various modified embodiments.

[0117] The first storage unit (610) may be a unit in which test trays that were not transported according to the test order are temporarily stored. Accordingly, the second storage unit (620) may be a unit in which test trays that were not transported according to the return order are temporarily stored.

[0118] The first storage unit (610) and / or the second storage unit (620) may include a storage detection sensor (630) for detecting whether a test tray is stored inside. The storage detection sensor (630) may have various embodiments for determining the presence or absence of a test tray.

[0119] For example, the storage detection sensor (630) may be a distance measuring sensor. The storage detection sensor (630) may be positioned on the upper surface of the storage space inside the first storage section (610) and / or the second storage section (620) and installed to measure the distance to the lower surface of the storage space.

[0120] In this case, if the distance measured by the storage detection sensor (630) is smaller than the distance measured by the storage detection sensor (630) to the bottom of the storage space, the control unit can determine that a test tray is stored inside the first storage unit (610) and / or the second storage unit (620).

[0121] As another example, the storage detection sensor (630) may be provided as a load sensor for measuring weight. In this case, the storage detection sensor (630) may be placed on the bottom side of the storage space to measure the weight of the test trays stacked in the storage space. If the weight measured by the storage detection sensor (630) is not zero, the control unit may determine that a test tray is stored inside the first storage unit (610) and / or the second storage unit (620).

[0122] Alternatively, as another example, the storage detection sensor (630) may include a plurality of switches arranged along the height direction of the storage space within the storage space. In this case, one switch may be pressed each time a test tray is stacked one by one. The switch pressed by the test tray may transmit a storage signal to the control unit. When the storage signal is received, the control unit may determine that a test tray is stored inside the first storage unit (610) and / or the second storage unit (620).

[0123] The control unit can change the transport order of the test trays as needed when the test trays are stored in the first storage unit (610) and / or the second storage unit (620).

[0124] For example, if receiving the test tray from the buffer rack (600) is faster than receiving the test tray from the handler (100) in order for the transfer (400) to deliver the test tray to the next test cell (500), the control unit can control the transfer (400) so that the transfer (400) receives the test tray from the first storage unit (610) and delivers it to the test cell (500) corresponding to the next test order.

[0125] Alternatively, as another example, if the transfer (400) moves to the test cell (500) according to the return order, but the test is not completed at the test cell (500) and the test tray is stored in the second storage unit (620), the control unit can control the transfer (400) so that the transfer (400) retrieves the test tray from the second storage unit (620) and transfers it to the handler (100).

[0126] Accordingly, the semiconductor device test system (1) according to one embodiment of the present invention can minimize the waiting time of the transfer (400), and in the event of unexpected congestion in logistics, the wasted time can be minimized by utilizing the buffer rack (600).

[0127] Hereinafter, a transfer according to an embodiment of the present invention will be described with reference to FIGS. 5 to 10.

[0128] FIG. 5 is an overall perspective view of a transfer according to one embodiment of the present invention.

[0129] As illustrated in FIG. 5, a transfer (400) according to one embodiment of the present invention may include a support rack (410), a longitudinal transfer unit (420), and a height transfer unit (430).

[0130] The support rack (410) may be configured to extend along the longitudinal direction to provide a longitudinal transfer distance for the transfer (400). The support rack (410) may be implemented as various skeletal structures, such as a rack, rail, or frame, that can support the longitudinal transfer unit (420) so that it can be transferred in the longitudinal direction.

[0131] For example, a rail extending in the longitudinal direction may be located at the bottom of the support rack (410). This rail may be intended to support the longitudinal movement of the longitudinal transfer unit (420). Hereinafter, the rail located at the bottom of the support rack (410) is referred to as the longitudinal transfer rail for convenience.

[0132] The longitudinal transfer unit (420) may be a unit that moves back and forth along the longitudinal direction on the support rack (410). The lower part of the longitudinal transfer unit (420) may be coupled to the longitudinal transfer rail so as to move back and forth along the longitudinal direction.

[0133] The longitudinal transfer section (420) may have its upper portion extended along the height direction. The height of the longitudinal transfer section (420) may be set considering the number of layers of the test cell (500). The height of the longitudinal transfer section (420) may be set so that a test tray can be delivered to the test cell (500) placed on the top layer.

[0134] The height-direction transfer unit (430) may be a unit that transfers a test tray to and from a handler (100) and / or a test cell (500). The height-direction transfer unit (430) may be vertically movably coupled to the body of the length-direction transfer unit (420).

[0135] The height-direction transfer unit (430) can receive a test tray from the handler (100) at the first position described above, or deliver a test tray to the handler (100). The first position is located on the front side of the support rack (410) and can be located at a height where the exchange between the handler (100) and the test tray (tt) takes place.

[0136] The test tray can be transferred in the longitudinal and / or vertical directions to a position corresponding to the test cell (500) being transferred by the longitudinal transfer unit (420) and / or the vertical transfer unit (430) while being held inside the vertical transfer unit (430).

[0137] Hereinafter, the longitudinal transfer unit (420) and the height transfer unit (430) will be described in detail with reference to FIG. 6. FIG. 6 is a drawing showing the state in which the outer frame of the transfer according to one embodiment of the present invention has been removed.

[0138] As illustrated in FIG. 6, the longitudinal transfer unit (420) may include a height transfer rail (421) extended along the height direction. The height transfer rail (421) may be formed to extend along the height direction on one side of the body portion of the longitudinal transfer unit (420). The height transfer rail (421) may support the vertical movement of the height transfer unit (430). The rear end of the height transfer unit (430) is vertically coupled to the height transfer rail (421) and may be vertically moved by a driving unit controlled by a control unit.

[0139] The height-direction transfer unit (430) may have a shape in which two rectangular modules are stacked in the height direction. Each rectangular module may have both ends in the width direction open. A test tray may be taken out of the height-direction transfer unit (430) to the outside through the open part of the height-direction transfer unit (430), or brought in from the outside into the height-direction transfer unit (430).

[0140] Continuing the explanation with reference to FIG. 7, FIG. 7 is a conceptual drawing illustrating a height-direction transfer unit according to one embodiment of the present invention.

[0141] As illustrated in FIG. 7, the height-direction transfer unit (430) according to one embodiment of the present invention may be in the form of a stacked first transfer chamber (431) and a second transfer chamber (432). At this time, since the first transfer chamber (431) and the second transfer chamber (432) may be identical or similar to the rectangular module described above, a redundant description is omitted.

[0142] In the internal space of the first transfer chamber (431), the first holding part (4310) may be positioned to be movable in the width direction. The first holding part (4310) can pick up a test tray waiting to be tested from the handler (100). Additionally, the first holding part (4310) can transfer the picked-up test tray to the test cell (500). At this time, the first holding part (4310) can transfer the test tray to the soak chamber (510) described later.

[0143] The first holding part (4310) can move between both ends of the first transfer chamber (431). When the first holding part (4310) moves to one end of the first transfer chamber (431), it may be for the purpose of transferring the test tray to a test cell (500) located on one side of the transfer (400). In contrast, when the first holding part (4310) moves to the other end of the first transfer chamber (431), it may be for the purpose of transferring the test tray to a test cell (500) located on the other side of the transfer (400).

[0144] In the internal space of the second transfer chamber (432), the second holding part (4320) may be positioned to be movable in the width direction. The second holding part (4320) can place a test tray that has finished testing on the handler (100). Additionally, the second holding part (4320) can pick up a test tray that has finished testing from the test cell (500). At this time, the second holding part (4320) can pick up the test tray from the disock chamber (520) described later.

[0145] The second holding part (4320) can move between both ends of the second transfer chamber (432). When the second holding part (4320) moves to one end of the second transfer chamber (432), it may be to receive a test tray from a test cell (500) located on one side of the transfer (400). In contrast, when the second holding part (4320) moves to the other end of the second transfer chamber (432), it may be to receive a test tray from a test cell (500) located on the other side of the transfer (400).

[0146] Meanwhile, although not shown, the height-direction transfer unit (430) may include a rotator as needed so that the test tray can always be transferred to the test cell (500) in the forward direction. The rotator may be installed in various configurations inside the first transfer chamber (431) and / or the second transfer chamber (432).

[0147] The first transfer chamber (431) and the second transfer chamber (432) may be arranged in an aligned manner along the height direction. This arrangement may take into account the positions of the soak chamber (510) and the diso-soak chamber (520) described later.

[0148] The positional relationship between the first transfer chamber (431) and the second transfer chamber (432) allows the second holding unit (4320) to retrieve the test tray from the test cell (500) while the first holding unit (4310) is transferring the test tray to the test cell (500), thereby having the effect of shortening the overall process time.

[0149] Although not illustrated, cell identification sensors may be placed at both ends in the width direction of the first transfer chamber (431) and / or the second transfer chamber (432). The cell identification sensors may be sensors for distinguishing different test cells (500).

[0150] An identifier representing each test cell (500) may be formed on the exterior of the test cell (500). For example, the identifier may be located on the surface of the test cell (500) facing the transfer (400). This identifier may be an optically recognizable marker or code, or may be provided in a form that is recessed or protrudes from an adjacent surface.

[0151] The cell identification sensor may be provided as a sensor capable of recognizing the identifier, corresponding to the format of the identifier. If the identifier is an optically recognizable marker or code, the cell identification sensor may be provided as a reader, scanner, etc., for reading the marker or code. In contrast, if the identifier is in a form that is recessed or protrudes from an adjacent surface, the cell identification sensor may be provided as a distance measuring sensor to detect the identifier.

[0152] The control unit can determine the current position of the height-direction transfer unit (430) based on information regarding the identifier detected by the cell identification sensor. Based on the determined position, the control unit can control each driving unit driving the transfer (400) to move the height-direction transfer unit (430) to a position facing the test cell (500) corresponding to the order according to the test order and / or return order.

[0153] The first holding section (4310) and the second holding section (4320) may be provided with identical or similar configurations, differing only in the transfer chambers arranged therein. For convenience of explanation, the first holding section (4310) and the second holding section (4320) will be referred to together as "holding section" below.

[0154] With reference to FIGS. 8 to 11, the description of the holding part of the present invention continues. FIG. 8 is a detailed drawing illustrating a holding part according to one embodiment of the present invention.

[0155] As illustrated in FIG. 8, the first holding part (4310) may be configured to include a hook (4311a, 4311b), a reciprocating frame (4312), and a guide rail (4313). Accordingly, the second holding part (4320) may be configured to include a hook (4311a, 4311b), a reciprocating frame (4312), and a guide rail (4323).

[0156] To distinguish between the guide rail (4313) of the first holding part (4310) and the guide rail (4323) of the second holding part (4320), the former is referred to as the upper guide rail (4313) and the latter as the lower guide rail (4323). Additionally, the configuration of the first holding part (4310) is mainly described below, and since the configuration of the second holding part (4320) is similar to the configuration of the first holding part (4310), the description of the overlapping parts is omitted.

[0157] Hooks (4311a, 4311b) can be divided into a first hook (4311a) and a second hook (4311b) depending on their position.

[0158] The first hook (4311a) protrudes and extends toward one end relative to the reciprocating frame (4312), and may be provided in a form where the end is bent vertically downward. Various structures for selectively holding a test tray may be formed at the tip of the first hook (4311a). For example, two plate-shaped members arranged facing each other similarly to a clamp may be positioned at the tip of the first hook (4311a).

[0159] The first hook (4311a) may be for delivering a test tray to a test cell (500) located to the left of the transfer (400) based on FIG. 1, or for receiving a test tray from a test cell (500) located to the left of the transfer (400).

[0160] The second hook (4311b) protrudes and extends toward the other end of the reciprocating frame (4312), and may be provided in a form where the end is bent vertically downward. Various structures for selectively holding a test tray may be formed at the tip of the second hook (4311b). For example, two plate-shaped members arranged facing each other similarly to a clamp may be positioned at the tip of the second hook (4311b).

[0161] The second hook (4311b) may be for delivering a test tray to a test cell (500) located to the right of the transfer (400) based on FIG. 1, or for receiving a test tray from a test cell (500) located to the right of the transfer (400).

[0162] The reciprocating frame (4312) may be a frame capable of moving back and forth in the left / right direction inside the transfer chamber. The first hook (4311a) and the second hook (4311b) may be supported on the reciprocating frame (4312) so as to be angle-adjustable with the reciprocating direction as the central axis. This will be described later with reference to FIGS. 9 and 10.

[0163] The upper guide rail (4313) may be a rail that supports the reciprocating frame (4312) of the first holding part (4310) to enable reciprocating movement. The upper guide rail (4313) may be symmetrically arranged on both sides of the first transfer chamber (431) to support movement in the width direction of the reciprocating frame (4312).

[0164] The lower guide rail (4323) may be a rail that supports the reciprocating frame (4312) of the second holding part (4320) to enable reciprocating movement. The lower guide rail (4323) may be symmetrically arranged on both sides of the second transfer chamber (432) to support the movement of the reciprocating frame (4312) in the width direction.

[0165] The height direction transfer unit (430) may include at least one driving unit provided in various forms for angle adjustment of the first hook (4311a) and / or the second hook (4311b) and for the reciprocation of the reciprocation frame (4312). Such driving units may include various embodiments such as motors, linear actuators, gear structures, etc., and may be controlled by a control unit.

[0166] Continuing the explanation with reference to FIGS. 9 and 10, FIG. 9 is a drawing illustrating the normal state of a hook according to an embodiment of the present invention. In contrast, FIG. 10 is a drawing illustrating the state in which a hook according to an embodiment of the present invention is rotated to hold a test tray.

[0167] As illustrated in FIGS. 9 and 10, the reciprocating frame (4312) may be configured to include a movable frame (4312a) and a movable shaft (4312b). The movable frame (4312a) may be a frame that moves back and forth on the guide rail (4313), with both ends supported by the guide rail (4313). The movable shaft (4312b) may be mounted inside the movable frame (4312a) such that a first hook (4311a) and a second hook (4311b) are connected to both ends, and the shaft may be rotatably mounted around the reciprocating direction (arrow direction in FIGS. 9 and 10) as a central axis. Additionally, the movable shaft (4312b) may be moved along the reciprocating direction relative to the movable frame (4312a) while inserted inside the movable frame (4312a).

[0168] The first hook (4311a) to the second hook (4311b) can hold the test tray in a state as shown in FIG. 10 and release the holding of the test tray in a state as shown in FIG. 9. In order to hold the test tray only when the first hook (4311a) and the second hook (4311b) are rotated, a coupling structure corresponding to the first hook (4311a) and the second hook (4311b) may be formed on the test tray.

[0169] The coupling structure formed on the test tray may have various modified embodiments in which the first hook (4311a) and the second hook (4311b) do not interfere with each other in a state like that of FIG. 9, and only interfere with each other in a state like that of FIG. 10.

[0170] For example, the coupling structure formed on the test tray may be provided as a protruding part protruding downward from the bottom of the test tray. As shown in FIG. 9, in an upright state, the hook (4311a) may be positioned adjacent to the protruding part but may be in a non-contact state with the protruding part.

[0171] Then, as shown in FIG. 10, when the movable shaft (4312b) is rotated counterclockwise, the hook (4311a) connected to the movable shaft (4312b) can be rotated counterclockwise together. When the hook (4311a) is rotated together with the movable shaft (4312b), a protruding part can be inserted between the clamps of the hook (4311a).

[0172] When the protruding part is inserted between the clamps of the hook (4311a), the side of the hook (4311a) supports the bottom surface of the test tray, and the clamps support both ends of the protruding part. In this state, when the hook (4311a) moves back and forth, the test tray can be held by the hook (4311a) and move back and forth together.

[0173] Continuing the explanation with reference to FIG. 11, FIG. 11 is a conceptual drawing illustrating a holding part transporting a test tray according to an embodiment of the present invention. More specifically, FIG. 11(a) may be a drawing showing the initial position of the holding part. In this regard, FIG. 11(b) may be a drawing showing the movable frame in a state where it has advanced to its maximum extent. Additionally, FIG. 11(c) may be a drawing showing the movable shaft in a state where it has advanced to its maximum extent relative to the movable frame.

[0174] As illustrated in FIG. 11(a), the movable frame (4312a) and the movable shaft (4312b) can initially be aligned at the center of the first transfer chamber (431) or the second transfer chamber (432). In this state, the height transfer unit (430) can move from the handler (100) to the test cell (500) or from the test cell (500) to the handler (100).

[0175] The following description is based on the first hook (4311a) delivering the test tray (tt) to the test cell (500). Since the second hook (4311b) delivering the test tray (tt) to the test cell (500) is similar to the first hook (4311a), the description is omitted.

[0176] When it arrives near the test cell (500) that is the transfer target, the first hook (4311a) rotates from an upright state to a rotated state so as to hold the test tray (tt). When the rotation of the first hook (4311a) is completed, the control unit can advance the movable frame (4312a) toward the first hook (4311a) as shown in FIG. 11(b).

[0177] Since the movable frame (4312a) and the test tray (tt) are initially positioned in the center of the transfer chamber (431, 432), more than half of the test tray (tt) may still remain inside the transfer chamber (431, 432) when the movable frame (4312a) is advanced to its maximum extent.

[0178] When the forward movement of the movable frame (4312a) is completed, the control unit can advance the movable shaft (4312b) toward the first hook (4311a) as shown in FIG. 11(c). When the forward movement to the movable shaft (4312b) is completed, more than half of the test tray (tt) can be exposed to the outside of the transfer chamber (431, 432). This state is a state in which more than half of the test tray (tt) has entered the test cell (500), and subsequently, the test tray (tt) can be stably entered into the test cell (500) by the transfer unit inside the test cell (500).

[0179] The movement of the test tray (tt) from the test cell (500) into the interior of the transfer chamber (431, 432) through the holding part can proceed in the reverse order of the above description, so the description is omitted.

[0180] Hereinafter, a test cell according to an embodiment of the present invention will be described with reference to FIGS. 12 and 13.

[0181] FIG. 12 is a drawing illustrating a test cell according to an embodiment of the present invention. In contrast, FIG. 13 is a drawing conceptually illustrating a test cell according to an embodiment of the present invention.

[0182] As described above, the test cell (500) is a unit that exchanges the transfer (400) and the test tray and evaluates the performance of the semiconductor device in a predetermined temperature environment. The temperature environment of the test cell (500) can be set according to the user's needs, and each test cell (500) may be optionally set to provide different temperature environments. For example, each test cell (500) may be set to one of room temperature, high temperature, and low temperature conditions according to the user's needs.

[0183] As illustrated in FIGS. 12 to 13, a test cell (500) according to one embodiment of the present invention may include a soak chamber (510), a desoak chamber (520), a test chamber (530), and a pressurizer (540).

[0184] The test chamber (530) may be a chamber in which the performance of semiconductor devices arranged on a test tray is evaluated. In order to shorten the overall process time, the internal space of the test chamber (530) (hereinafter, test space; 532) may be maintained at a predetermined temperature once set to a predetermined temperature environment until the testing of the necessary semiconductor devices is completed.

[0185] The test chamber (530) may include a test unit (531) capable of evaluating the performance of a plurality of semiconductor devices on a test tray. The test unit (531) is positioned at the bottom of the test space (532) and can evaluate the performance of semiconductor devices exposed to a predetermined temperature environment.

[0186] For evaluating the performance of a semiconductor device, the test unit (531) may include a plurality of sockets. The plurality of sockets may be formed at the upper part of the test unit (531) to have a positional relationship corresponding to a plurality of semiconductor devices mounted on a test tray. Each socket may be electrically connected to a semiconductor device mounted inside.

[0187] The semiconductor device can exchange electrical signals with the test unit (531) through the socket. The test unit (531) can exchange electrical signals with each of the semiconductor devices and evaluate the performance of each semiconductor device.

[0188] The soak chamber (510) may be a chamber where the test tray is waited before entering the interior of the test chamber (530). More specifically, the soak chamber (510) may be a chamber where the test tray, which has been exposed to a room temperature environment, is prepared before entering the test space.

[0189] Inside the soak chamber (510), the semiconductor device on the test tray can be aged to a predetermined temperature so that it is not damaged even when exposed to the temperature environment of the test space (532). Additionally, by undergoing the aging step, it is prevented that the temperature performance evaluation is not properly performed due to the temperature difference between the test tray and the test space (532), or that the temperature environment of the test space (532) is significantly changed due to the temperature difference with the test tray.

[0190] The desoak chamber (520) may be a chamber where the tested semiconductor device and test tray are kept before being transported outside. The test tray may be prepared to be returned to the external environment from inside the desoak chamber (520). The semiconductor device enters the desoak chamber (520) in a state adapted to the environment inside the test chamber (530) and may be aged inside the desoak chamber (520) to return to room temperature.

[0191] The pressurizer (540) may be located at the upper part of the test space (532). The pressurizer (540) may be located directly above a plurality of sockets formed in the test unit (531). A test tray that has passed through the soak chamber (510) may be pressed downward by the pressurizer (540) while positioned above the plurality of sockets. In order for the test tray to be mounted in the socket by the pressurization of the pressurizer (540), the soak chamber (510) may be placed so that the test tray is aligned between the pressurizer (531) and the plurality of sockets.

[0192] Due to the pressurizing action of the pressurizer (540), each semiconductor device loaded on the test tray can be pressed in the direction of the socket. As a result, each semiconductor device can be mounted inside the corresponding socket. With the test tray pressed downward by the pressurizer (540), the test unit (531) can perform a test of the semiconductor device.

[0193] The pressurizer (540) may include a pressurizing block (541) that moves up and down between an initial height and a lowered height. The pressurizing block (541) is provided with a shape corresponding to a test tray, and when lowered to a lowered height, it can press the test tray located above the test unit (531) downward. In this state, semiconductor devices on the test tray can each be pressed by the pressurizing block (541) and mounted into the interior of the socket.

[0194] Meanwhile, the soak chamber (510), dissoak chamber (520) and / or test chamber (530) may be configured to include at least one gate (G). Each gate (G) may be positioned as a type of gate valve to maintain the atmosphere of the chamber's internal space.

[0195] More specifically, a gate (G) formed on one side wall of the soak chamber (510) to separate the external space from the internal space of the soak chamber (510) may be the entrance side gate of the soak chamber (510). The entrance side gate of the soak chamber (510) may be positioned adjacent to or in close contact with the transfer (400) so as to face the side of the transfer (400).

[0196] Accordingly, a gate (G) formed on the other end wall of the soak chamber (510) and / or on the one end wall of the test chamber (530) to separate the internal space of the soak chamber (510) from the test space (532) may be the exit side gate of the soak chamber (510). The exit side gate of the soak chamber (510) may serve to prevent the atmospheres of the two chambers from mixing with each other between the soak chamber (510) and the test chamber (530).

[0197] A gate (G) formed on the other end wall of the disodium chamber (520) and / or on the one end wall of the test chamber (530), which separates the internal space of the disodium chamber (520) from the test space (532), may be the inlet gate of the disodium chamber (520). The inlet gate of the disodium chamber (520) may serve to prevent the atmospheres of the two chambers from mixing with each other between the disodium chamber (520) and the test chamber (530).

[0198] A gate (G) formed on one side wall of the disoc chamber (520) to separate the external space from the internal space of the disoc chamber (520) may be the exit side gate of the disoc chamber (520). The exit side gate of the disoc chamber (520) may be positioned adjacent to or in close contact with the transfer (400) so as to face the side of the transfer (400).

[0199] As illustrated in FIG. 13, in one embodiment of the present invention, the test cell (500) may have a soak chamber (510) and a desoak chamber (520) aligned along the height direction. Additionally, the desoak chamber (520) may be positioned below the soak chamber (510).

[0200] This positional relationship may be a layout that takes into account the height change of the test tray inside the test chamber (530).

[0201] The soak chamber (510) is positioned at a height adjacent to the initial height of the pressurizing block (541), and the desoak chamber (520) is positioned at a height adjacent to the lowering height of the pressurizing block (541), so that the movement path of the test tray inside the test cell (500) can be minimized.

[0202] Specifically, the exit gate of the soak chamber (510) can be located directly below the pressure block (541) located at the initial height. As a result, when the test tray is moved after the exit gate is opened, the pressure block (541) may not interfere with the movement of the test tray.

[0203] Additionally, the entrance gate of the disoc chamber (520) may have a height adjacent to the pressure block (541) located at a lowered height. More specifically, the entrance gate of the disoc chamber (520) may be located at a height parallel to the test tray placed on the test unit (531) when the pressure block (541) is in a released state. As a result, the test tray located above the multiple sockets can move the shortest distance and enter the entrance gate of the disoc chamber (520).

[0204] Meanwhile, since the soak chamber (510) and the desoak chamber (520) are aligned side by side, there may be an advantage in that the footprint of the test cell (500) according to one embodiment of the present invention is minimized.

[0205] Hereinafter, with reference to FIG. 14, the process of moving a test tray inside a test cell according to an embodiment of the present invention will be described. FIG. 14 is a conceptual drawing illustrating the movement of a test tray according to an embodiment of the present invention.

[0206] As shown in FIG. 14, when the height-direction transfer section (430) of the transfer (400) faces the test cell (500), the soak chamber (510) and the first transfer chamber (431) may face each other, and the second transfer chamber (432) and the disoque chamber (520) may face each other.

[0207] One test tray (tt) may be placed in the first transfer chamber (431) according to the test sequence and moved from the inside of the first transfer chamber (431) to the inside of the soak chamber (510) by the first holding part (4310; see FIGS. 7 to 11). The hook (4311a) of the first holding part (4310) can transfer the test tray (tt) from the inside of the first transfer chamber (431) to the inside of the soak chamber (510). When the first transfer chamber (431) transfers the test tray (tt), the entrance gate of the soak chamber (510) is opened and can be closed when the entry of the test tray (tt) is completed.

[0208] The test tray (tt) transferred to the soak chamber (510) can be aged for a certain period of time inside the soak chamber (510). When the test tray (tt) is ready for the temperature environment, the exit gate of the soak chamber (510) can be opened.

[0209] Afterward, the test tray (tt) can be moved from inside the soak chamber (510) to the upper side of a plurality of sockets by means of the soak feeder (described later) of the soak chamber (510). To this end, the soak feeder may be provided to be movable from the internal space of the soak chamber (510) to the test space (532). A detailed description of the soak feeder will be provided later. After the soak feeder places the test tray (tt) on the upper side of the plurality of sockets, the soak feeder can return to the interior of the soak chamber (510). At this time, the exit gate of the soak chamber (510) can be closed again.

[0210] After that, the pressure block (541) can be lowered to press the semiconductor device into the socket. The pressure block (541) can maintain the lowered height while the test is in progress. When the pressure applied by the pressure block (541) is released, the inlet gate of the disock chamber (520) is opened, and the disock feeder (described later) can pick up the test tray (tt) from the socket.

[0211] The disocfeeder can be provided in the same or similar manner as the soakfeeder, and can be movable between the internal space of the disoc chamber (520) and the test space (532) in a manner similar to the soakfeeder. A detailed description of the disocfeeder will be provided later.

[0212] When the disoc feeder pulls the test tray (tt) into the internal space of the disoc chamber (520), the entrance gate of the disoc chamber (520) can be closed again. After that, the test tray (tt) can be prepared to return to room temperature.

[0213] When it is time for the test tray (tt) waiting in the dissipation chamber (520) to be returned, the second transfer chamber (432) can be moved to a position facing the dissipation chamber (520). When the second transfer chamber (432) arrives, the exit gate of the dissipation chamber (520) is opened, and the hook (4311a) of the second holding part (4320) enters the interior of the dissipation chamber (520) to collect the test tray (tt). The test tray (tt) is pulled by the hook (4311a), moved to the second transfer chamber (432), and then returned to the handler (100). When the hook (4311a) collects the test tray (tt), the exit gate of the dissipation chamber (520) can be closed again.

[0214] As described above, according to one embodiment of the present invention, the test tray (tt) may have a 'U'-shaped transfer path. In other words, the movement between the soak chamber (510) and the test chamber (530) and the movement between the desoak chamber (520) and the test chamber (530) may have paths that overlap when viewed from above.

[0215] As a result, the movement path of the test tray (tt) on the horizontal plane is minimized, which has the advantage of miniaturizing the installation space of the entire equipment. This advantage enables the installation of multiple test cells (500) in the same space, thereby allowing an embodiment according to the present invention to have a superior processing speed relative to the installation space.

[0216] Hereinafter, with reference to FIG. 15, test tray logistics according to an embodiment of the present invention will be described. FIG. 15 is a conceptual diagram illustrating the exchange of test trays between a transfer and a test cell according to an embodiment of the present invention.

[0217] As illustrated in FIG. 15, according to one embodiment of the present invention, the height-direction transfer unit (430) can transfer the test tray (tt) to the soak chamber (510) and simultaneously retrieve the test tray (tt) from the disoche chamber (520).

[0218] For example, in a situation where the height-direction transfer unit (430) intends to transfer a test tray (tt) according to the test sequence, there may be a test tray (tt) waiting for the return sequence in the disock chamber (520) of the corresponding test cell (500).

[0219] In this case, the control unit can cause the first holding unit (4310) to transfer the test tray (tt) according to the test order to the soak chamber (510), and the second holding unit (4320) to take out the test tray (tt) that is the return order.

[0220] Accordingly, according to one embodiment of the present invention, the height-direction transfer unit (430) can perform the transfer of the test tray (tt) to the soak chamber (510) and the retrieval of the test tray (tt) from the de-soak chamber (520) in a single movement, thereby effectively reducing the number of times the height-direction transfer unit (430) must move between the handler (100) and each test cell (500). This reduction in the number of movements can lead to a reduction in the overall process time.

[0221] Additionally, while the test tray (tt) exchange between the transfer (400), the soak chamber (510), and the desoak chamber (520) is taking place, another test tray (tt) may be pressed against the pressure block (541) in the test space (532) and the test of the semiconductor devices may be performed.

[0222] When the test of a test tray (tt) located inside the test chamber (530) is completed and moved to the desoak chamber (520), a test tray (tt) that was waiting in the soak chamber (510) can be newly entered into the test chamber (530). Therefore, according to one embodiment of the present invention, continuous process execution is possible for a plurality of test trays (tt), and thus the overall process time can be shortened.

[0223] Hereinafter, the soak feeder and the diso feeder will be described with reference to FIG. 16.

[0224] FIG. 16 is a drawing showing a soak feeder or a desoak feeder and a test tray in part. The soak feeder and the desoak feeder may be configured in substantially similar ways, differing only in their placement location and role.

[0225] As shown in FIG. 16, the soak feeder and diso feeder may include a hook housing (551) and a feeding hook (552).

[0226] The hook housing (551) may be a frame that moves from inside the soak chamber (510) and / or the desoak chamber (520) to the test space (532).

[0227] The hook housing (551) included in the soak feeder is provided to be movable from the internal space of the soak chamber (510) to the test space (532), and the hook housing (551) included in the desoak feeder can be provided to be movable from the internal space of the desoak chamber (520) to the test space (532).

[0228] The driving unit for moving the hook housing (551) can be implemented by various conventional technologies. For example, the hook housing (551) may be moved by a linear actuator with extendable length, an LM guide, etc., or by a motor and gear structure, etc.

[0229] Additionally, the hook housing (551) may be configured to be vertically movable. Alternatively, the feeding hook (552) may be configured to be vertically movable relative to the hook housing (551). The driving unit implementing such vertical movement may likewise be configured in various embodiments.

[0230] At least two feeding hooks (552) may protrude from the lower side of the hook housing (551). The feeding hooks (552) may have a shape that can be inserted into a corresponding groove (tt2) formed on the test tray (tt).

[0231] A pair of feeding hooks (552) may have an adjustable spacing relative to each other. A configuration for adjusting the spacing of a pair of feeding hooks (552) can be implemented by various conventional driving units. The initial spacing between a pair of feeding hooks (552) may be the same as or similar to the initial spacing of a pair of grooves (tt2) formed on a test tray (tt).

[0232] Clamping of the test tray (tt) by the feeding hook (552) can be performed as follows. First, the control unit may align a pair of feeding hooks (552) above a pair of grooves (tt2), and then lower the feeding hooks (552) and / or the hook housing (551) so that the feeding hooks (552) are inserted into the interior of the grooves (tt2). After that, with the feeding hooks (552) inserted into their respective corresponding grooves (tt2), the control unit may narrow or widen the gap between the feeding hooks (552). In this state, the pair of feeding hooks (552) apply forces in opposite directions to the inner walls of the grooves (tt2), so that the test tray (tt) can be clamped by the pair of feeding hooks (552).

[0233] The control unit moves the hook housing (551) forward and backward while the test tray (tt) is clamped, so that the feeding hook (552) pulls the test tray (tt). For example, in the case of a soak feeder, the test tray (tt) is pulled from inside the soak chamber (510) onto the test unit (531), and in the case of a desoak feeder, the test tray (tt) on the test unit (531) can be pulled into the desoak chamber (520).

[0234] When the test tray (tt) is moved to the target position, the control unit can restore the spacing of a pair of feeding hooks (552) to their original state so that the test tray (tt) is placed at the target position. The control unit can then raise and / or move the feeding hooks (552) and / or the hook housing (551) back to their initial positions within the chamber.

[0235] In the above description, an example was given of pulling a test tray (tt) by adjusting the spacing of a pair of feeding hooks (552), but the present invention is not necessarily limited to such an example. For example, it may also be possible to pull a test tray (tt) by inserting a single feeding hook (552) into a groove (tt2).

[0236] Although not illustrated, a test chamber (530) according to one embodiment of the present invention may further include an elastic support member. The elastic support member is located around a plurality of sockets and may include an elastic member. Based on the elastic force of the elastic member, the elastic support member can elastically support a test tray located on the socket upward. While supported by the elastic support member, the test tray may be located at the same or similar height as the inlet gate of the disock chamber.

[0237] The configuration and location of the elastic support member may have various embodiments. For example, one or more elastic support members may be disposed in an area adjacent to the socket in the test unit to elastically support the frame portion surrounding the insert in the test tray. Additionally, for example, the elastic support member may be formed to be retractable from the upper surface of the test unit.

[0238] When the test tray is pressurized by a pressurizer, at least a portion of the elastic support can be inserted into the interior of the test unit by the downward pressing force. In this state, the semiconductor device mounted on the insert can be mounted in the socket and electrically connected to the socket.

[0239] When the pressurizer is released, the elastic support can raise the test tray back to the height of the disock chamber entrance based on elastic force. Due to the elastic support of the elastic support, the semiconductor device mounted in the socket can be raised together with the test tray and separated from the socket.

[0240] When an elastic support is included, damage to the semiconductor device due to insufficient separation between the semiconductor device and the socket can be prevented when the disock feeder pulls the test tray.

[0241] Meanwhile, although not illustrated, each test tray (tt) according to one embodiment of the present invention may have an RFID (radio frequency identification) chip embedded in it. Each RFID chip may store ID information that can identify the mounted test tray (tt).

[0242] Additionally, the handler (100), loader (200), unloader (300), transfer (400), soak chamber (510), desoak chamber (520), test chamber (530) and / or buffer rack (600) may each include a reader capable of reading these RFID chips.

[0243] As a result, in the case of the present invention, there is an advantage in being able to determine the current location of each test tray (tt), what test is being performed, and what test has been performed. For example, if the ID information of a test tray is read by a reader of a specific test chamber (530), the control unit can determine that the test tray has performed a test by the specific test chamber (530).

[0244] Additionally, by identifying the locations of these test trays, the control unit can control the transfer (400) so that if congestion occurs in a specific area within the system, test trays close to the buffer rack (600) are stored in the buffer rack (600).

[0245] For example, the reader may be configured to repeat the reading operation at preset intervals. If the ID information read by the reader is not changed after a predetermined period of time, the control unit may determine that a test tray blockage has occurred at that location.

[0246] However, the method by which the control unit identifies the stagnation phenomenon is not limited to this, and the control unit may be configured to determine whether stagnation exists by comprehensively considering the position of each test tray and the remaining test time of the test chamber.

[0247] A person skilled in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts should be interpreted as being included within the scope of the present invention. Explanation of the symbols

[0248] 1: Semiconductor Device Test System 100: Handler 200: Loader 300: Unloader 400: Transfer 410: Support rack 420: Longitudinal feed unit 421: Height transfer rail 430: Height transfer unit 431, 432: Transfer chambers 4311a, 4311b: Hooks 4312: Advance / Retreat Frame 4312a: Movable Frame 4312b: Movable shaft 4313, 4323: Guide rail 4310, 4320: Holding section 500: Test cell 510: Soak Chamber 520: Disach Chamber 530: Test chamber 531: Test unit 532: Test space 540: Pressurizer 541: Pressure block 551: Hook housing 552: Feeding Hook 600: Buffer Rack 610: 1st Storage Unit 620: 2nd Storage Unit 630: Storage detection sensor 640: Direction identification sensor G: Gate tt: Test Tray tt1: Direction identifier s: Entry detection switch

Claims

Claim 1 A semiconductor device test system using multiple test cells, comprising: a loader in which multiple semiconductor devices are prepared; a handler for arranging at least some of the multiple semiconductor devices prepared in the loader into a test tray; an unloader located adjacent to the handler and waiting before the semiconductor devices that have been tested are removed to the outside; a transfer having one end located adjacent to the handler and the other end extending in the longitudinal direction, and transporting the test tray along the longitudinal direction; and a plurality of test cells formed to exchange the transfer and the test tray, each evaluating the performance of the semiconductor device in a predetermined temperature environment and each positioned to the side of the transfer; wherein some of the multiple test cells are set to a temperature environment different from that of the others, and the transfer sequentially transports the test tray to each of the test cells set to a different temperature environment so that the test tray returns to the handler after experiencing testing in the different temperature environments. Claim 2 A semiconductor device test system using a plurality of test cells according to claim 1, wherein the test cell comprises a plurality of sockets electrically connectable to a plurality of semiconductor devices arranged on a test tray, and a test chamber for evaluating the performance of the semiconductor devices in the temperature environment; a soak chamber that receives the test tray from the transfer and is prepared for the semiconductor devices to be exposed to the temperature environment; and a desoak chamber that receives the test tray from the test chamber and is prepared for the semiconductor devices to be returned to an external environment. Claim 3 A semiconductor device test system using a plurality of test cells according to claim 1, wherein the plurality of test cells are arranged along an axis parallel to the longitudinal direction on at least one side of the transfer and installed in a multilayer structure. Claim 4 A semiconductor device test system using a plurality of test cells, wherein the transfer comprises: a support rack extended along the longitudinal direction; a longitudinal transfer unit extended in the height direction and moved along the longitudinal direction on the support rack; and a height transfer unit that moves along the height direction on the longitudinal transfer unit while supporting the test tray and transfers each of the test cells and the test tray. Claim 5 A semiconductor device test system using a plurality of test cells, wherein the height direction transfer unit comprises a rotator that rotates the test tray around the height direction so as to be able to transfer the test tray, which is distinguished as front and back, in a forward direction to each of the test cells located on opposite sides with respect to the length direction as a reference axis. Claim 6 A semiconductor device test system using a plurality of test cells, wherein the transfer further comprises a cell identification sensor located on the test cell and recognizing an identifier formed to distinguish between different test cells.

Images