Pattern rendering device and pattern rendering method

Abstract

A pattern drawing device (EX) for forming a pattern on a substrate (P) by projecting a beam (LB) onto a substrate (P) in a main projection direction while modulating the intensity of the beam (LB) from a light source (LS) according to pattern information, and for scanning the beam (LB) in the main projection direction, a plurality of scanning units (Un) including a deflection member (PM) that deflects the beam (LB) from the light source (LS) and is arranged such that the scanning trajectories of the beam (LB) projected onto the substrate (P) are offset from each other, and an electro-optical deflection device (BDU) capable of adjusting the deflection angle of the beam (LB) to switch the beam (LB) from the light source (LS) to a deflected state or a non-deflected state and to shift the scanning trajectory of the beam (LB) to a sub-scanning direction that intersects the main projection direction, in order to supply the beam (LB) from the light source (LS) to each of the plurality of scanning units (Un) in a time-division manner.

Description

Technology Field

[0001] The present invention relates to a pattern drawing apparatus and a pattern drawing method for drawing a pattern by scanning a spot light irradiated onto an irradiated object. Background Technology

[0002] As an example of a drawing device using a rotating polygon mirror, an electrophotographic image forming device is known, as disclosed in Japanese Patent Publication No. 2009-220489, which repeatedly deflects a beam from a laser diode (LD) through a polygon mirror and scans the deflected beam on a photosensitive body through an fθ lens. In the image forming device disclosed in Japanese Patent Publication No. 2009-220489, a temperature change within a writing unit including a laser diode (LD), a rotating polygon mirror, and an fθ lens is predicted from a change in the driving current of the laser diode (LD). Then, in order to correct the magnification error of the fθ lens (magnification error in the main scanning direction of the beam) caused by the temperature change, the frequency of the writing clock signal, which serves as a reference when controlling the lighting of the laser diode (LD) in response to the image signal, is changed. However, when the pattern of the image to be drawn is a pattern for an electronic device, as described in Japanese Patent Publication No. 2009-220489, even if the magnification error is corrected only by changing the frequency of the clock signal, it is not possible to respond meticulously with high-precision magnification correction. means of solving the problem

[0003] A first aspect of the present invention is a pattern drawing device for forming a pattern on a substrate by projecting a beam onto a substrate in a main projection direction while modulating the intensity of the beam from a light source according to pattern information, and for scanning the beam in the main projection direction, a plurality of scanning units including a deflection member that deflects the beam from the light source, and a scanning device having a plurality of scanning units arranged such that the scanning trajectories of the beams projected onto the substrate are offset from each other, and an electro-optical deflection device capable of adjusting the deflection angle of the beam to switch the beam from the light source to a deflected state or a non-deflectioned state and to shift the scanning trajectory of the beam to a secondary scanning direction that intersects the main projection direction, in order to supply the beam from the light source to each of the plurality of scanning units in a time-division manner.

[0004] A second aspect of the present invention is a pattern drawing method for forming a pattern on a substrate by projecting a beam onto a substrate and scanning in a main scanning direction while modulating the intensity of the beam from a light source according to pattern information, wherein each of a plurality of scanning units arranged such that the scanning trajectories of the beam projected onto the substrate are offset from one another, each of which scans the beam from the light source in the main scanning direction using a deflection member, and, in order to supply the beam from the light source to each of the plurality of scanning units in a time-division manner, the beam from the light source is switched to a deflection state or a non-deflection state, and the scanning trajectory of the beam scanned by each of the plurality of scanning units is shifted to a sub-scanning direction that intersects the main scanning direction.

[0005] A third aspect of the present invention is a pattern drawing device that forms a pattern on a substrate by projecting a drawing beam modulated according to pattern information onto the substrate to scan in a main scanning direction and by moving the substrate and the drawing beam relative to each other in a sub-scanning direction intersecting the main scanning direction. The device comprises: a scanning device having a plurality of scanning units, each including a scanning member for scanning the drawing beam, arranged such that the scanning trajectories of the drawing beams are offset from each other; a beam switching device having a plurality of first electron-optical members for selectively supplying a beam from a light source device that generates the drawing beam to each of the plurality of scanning units; and a beam deflection device having a second electron-optical member that deflects the beam from the light source device incident on each of the plurality of scanning units in a direction corresponding to the sub-scanning direction so that the scanning position of the drawing beam scanned in the main scanning direction is displaced in the sub-scanning direction. Brief explanation of the drawing

[0006] FIG. 1 is a diagram showing the schematic configuration of a device manufacturing system including an exposure device that performs photolithography on a substrate of a first embodiment. Figure 2 is a configuration diagram showing the configuration of an exposure device. Figure 3 is a detailed view showing the state in which a substrate is wound on a rotating drum shown in Figure 2. Figure 4 is a drawing showing the drawing line of spot light scanned on a substrate and the alignment mark formed on the substrate. Figure 5 is a diagram showing the optical configuration of the scanning unit shown in Figure 2. Figure 6 is a configuration diagram of the beam switching unit shown in Figure 2. Figure 7 is a diagram showing the configuration of the light source device shown in Figure 2. FIG. 8 is a time chart showing the relationship between the clock signal generated by the signal generator shown in FIG. 7, the drawing bit sequence data, and the beam emitted from the polarizing beam splitter. FIG. 9 is a diagram showing the configuration of the signal generation unit shown in FIG. 7, which has the function of stretching and contracting the correction pixels. FIG. 10 is a diagram showing the truth table of preset values ​​output by the preset unit shown in FIG. 9. FIG. 11 is a time chart showing each clock pulse of the clock signal generated by the clock generator shown in FIG. 9, the count value of the second divider counter circuit, the output timing of the pixel shift pulse, and the switching timing of the logic information of the pixel of the serial data input to the driving circuit shown in FIG. 7. FIG. 12 is a block diagram showing the electrical configuration of the exposure device shown in FIG. 2. FIG. 13 is a time chart showing an origin signal output from the origin sensor of FIG. 5 provided in each scanning unit and an incident permission signal generated by the selection element driving control unit shown in FIG. 12 according to the origin signal. Figure 14 is a diagram showing the configuration of the drawing data output unit shown in Figure 12. FIG. 15 is a time chart showing a pixel shift pulse output from the transmission timing switching unit of FIG. 9 during the period when the drawing permission signal generated by the drawing permission signal generating unit shown in FIG. 14 and the drawing permission signal is high. Figure 16 is a diagram showing the relationship between the position of the stretched drawing line and the delay time within the range of the maximum scan length. FIG. 17 is a drawing showing the configuration of a light source device in a modified example of the first embodiment. FIG. 18 is a diagram showing the configuration of the clock signal generator shown in FIG. 17. FIG. 19 is a timing chart explaining the operation of the clock signal generator of FIG. 18. FIG. 20 is a diagram showing the configuration of a signal generating unit provided inside a light source device in a second embodiment. FIG. 21a is a drawing showing a first example of the configuration of the delay circuit shown in FIG. 20, and FIG. 21b is a drawing showing a second example of the configuration of the delay circuit shown in FIG. 20. FIG. 22 is a time chart showing signals output from each part of the signal generating unit shown in FIG. 20. FIG. 23a is a diagram illustrating a pattern drawn when local magnification correction is not performed, and FIG. 23b is a diagram illustrating a pattern drawn when local magnification correction (reduction) is performed according to the time chart shown in FIG. 22. FIG. 24 is an explanatory diagram of Variant Example 1 of each of the above embodiments, and is a diagram showing an example of the arrangement of a drawing optical element when a drawing optical element is used instead of an electro-optical element that modulates the intensity of a spot light according to the pattern data described in each of the above embodiments (including variations). FIG. 25 is an explanatory diagram of Variant Example 4 of each of the above embodiments, schematically showing the relationship between the arrangement of the condensing lens, the selection optical element, the collimator lens, and the unit-side incident mirror in the beam switching unit described in each of the above embodiments (including variations), and the arrangement of the second cylindrical lens in the scanning unit. FIG. 26 is an explanatory diagram of Variant Example 5 of each of the above embodiments (including variations), and is a diagram showing the main part configuration of an scanning unit using a galvanometer mirror instead of a polygon mirror. FIG. 27 is an explanatory diagram of Variant Example 6 of each of the above embodiments (including variations), and is a perspective view of a scanning unit that scans a spot light in an arc shape by means of a mechanical rotation mechanism. FIG. 28 is a drawing showing in detail the configuration of a wavelength conversion unit within a pulse light generating unit of a light source device in a third embodiment. FIG. 29 is a diagram showing the light path of a beam from a light source device to a first selection optical element in a third embodiment. FIG. 30 is a diagram showing the configuration of the optical path from the selection optical element to the next stage selection optical element and the driver circuit of the selection optical element in the third embodiment. FIG. 31 is a diagram illustrating the beam selection and beam shift at the incident mirror on the selection unit side behind the selection optical element. Figure 32 is a diagram illustrating the behavior of the beam from the polygon mirror to the substrate. FIG. 33 is a drawing showing part of the schematic configuration of a tandem drawing device in a modified example of the third embodiment. FIG. 34 is a drawing showing the configuration of a beam switching member provided in correspondence with one scanning unit within a beam switching section according to a fourth embodiment. FIG. 35 is a diagram showing a configuration in which the selection optical element and the unit-side incident mirror constituting the beam switching unit shown in FIG. 6 or FIG. 24 are replaced with the configuration of FIG. 34. FIG. 36 is a drawing showing an example of the configuration of the beam shifter unit shown in FIG. 35. FIG. 37a is a diagram showing an example of a beam deflection member using an electro-optical element having electrodes formed on opposing parallel sides of a transparent crystalline medium formed in a prism shape (triangle) with a predetermined thickness, and FIG. 37b is a KTN (KTa 1 -X Nb xO3) This is a drawing showing an example of a beam deflection member using an electro-optical element based on a crystal. Specific details for implementing the invention

[0007] A pattern drawing apparatus and a pattern drawing method according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings, citing suitable embodiments. Furthermore, the embodiments of the present invention are not limited to these embodiments and include various modifications or improvements. That is, the components described below include those that can be easily conceived by those skilled in the art and are substantially identical, and the components described below can be appropriately combined. In addition, various omissions, substitutions, or modifications of components may be made within the scope of not departing from the gist of the present invention.

[0008] [First Embodiment]

[0009] FIG. 1 is a diagram showing the schematic configuration of a device manufacturing system (10) including an exposure device (EX) that performs an exposure treatment on a substrate (exposed body) (P) of a first embodiment. In addition, in the following description, unless otherwise specifically noted, an XYZ orthogonal coordinate system is established with the direction of gravity as the Z direction, and the X direction, Y direction, and Z direction are explained following the arrows shown in the drawing.

[0010] The device manufacturing system (10) is a system (substrate processing device) that manufactures an electronic device by performing a predetermined treatment (such as photolithography) on a substrate (P). The device manufacturing system (10) is a manufacturing system in which a manufacturing line is established to manufacture, for example, a flexible display as an electronic device, a film-shaped touch panel, a film-shaped color filter for a liquid crystal display panel, flexible wiring, or a flexible sensor. Below, the description is based on the premise that the electronic device is a flexible display. Examples of flexible displays include organic EL displays and liquid crystal displays. The device manufacturing system (10) has a so-called Roll-to-Roll structure in which a substrate (P) is sent from a supply roll (FR1) that is wound in a roll shape with a flexible sheet-shaped substrate (sheet substrate) (P), various processes are continuously performed on the sent substrate (P), and then the substrate (P) after various processes is wound onto a recovery roll (FR2). The substrate (P) has a strip-shaped shape in which the direction of movement (transport direction) of the substrate (P) is the long length direction (long length) and the width direction is the short length direction (short length). In the first embodiment, an example is shown in which a film-shaped substrate (P) passes through at least a processing device (first processing device) (PR1), a processing device (second processing device) (PR2), an exposure device (third processing device) (EX), a processing device (fourth processing device) (PR3), and a processing device (fifth processing device) (PR4) until it is wound onto a recovery roll (FR2).

[0011] In addition, in the first embodiment, the X direction is the direction in which the substrate (P) moves from the supply roll (FR1) to the recovery roll (FR2) in the horizontal plane (conveying direction). The Y direction is the width direction of the substrate (P) in the horizontal plane, which is orthogonal to the X direction (short length direction). The Z direction is the direction orthogonal to the X and Y directions (upward direction) and is parallel to the direction in which gravity acts.

[0012] The substrate (P) may be, for example, a resin film, or a foil made of a metal or alloy such as stainless steel. As for the material of the resin film, at least one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin may be used. In addition, the thickness and rigidity (Young's modulus) of the substrate (P) may be within a range such that no folds or irreversible wrinkles are formed on the substrate (P) due to buckling when passing through the conveyor path of the device manufacturing system (10). As a base material for the substrate (P), films such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) with a thickness of about 25 μm to 200 μm are typical suitable sheet substrates.

[0013] Since the substrate (P) may be subjected to heat during each process performed in the processing device (PR1), processing device (PR2), exposure device (EX), processing device (PR3), and processing device (PR4), it is desirable to select a substrate (P) made of a material that does not have a significantly large coefficient of thermal expansion. For example, the coefficient of thermal expansion can be suppressed by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide. In addition, the substrate (P) may be a single layer of ultra-thin glass with a thickness of about 100 μm manufactured by the float method, etc., or a laminate in which the resin film, foil, etc., described above are laminated to the ultra-thin glass.

[0014] However, the flexibility of the substrate (P) refers to the property of being able to bend the substrate (P) without it being sheared or broken even when a force of the magnitude of its own weight is applied to the substrate (P). Also, the property of bending due to a force of the magnitude of its own weight is included in flexibility. Furthermore, the degree of flexibility changes depending on the material, size, and thickness of the substrate (P), the layer structure formed on the substrate (P), and environmental factors such as temperature or humidity. In any case, if the substrate (P) is properly wound onto a conveying direction changing member, such as a conveying roller or a rotating drum, provided in the conveying path of the device manufacturing system (10) according to the first embodiment, and the substrate (P) can be conveyed smoothly without buckling or folding, or damage (tearing or opening) occurs, then it can be said to be within the range of flexibility.

[0015] The processing device (PR1) is a coating device that performs a coating treatment on a substrate (P) while conveying the substrate (P), which has been conveyed from the supply roll (FR1), toward the processing device (PR2) at a predetermined speed in the conveying direction (+X direction) along the length direction. The processing device (PR1) selectively or uniformly applies a photosensitive functional liquid to the surface of the substrate (P). The substrate (P), on which the photosensitive functional liquid has been applied to the surface, is conveyed toward the processing device (PR2).

[0016] The processing device (PR2) is a drying device that performs a drying treatment on the substrate (P) while conveying the substrate (P), which has been conveyed from the processing device (PR1), toward the exposure device (EX) at a predetermined speed in the conveying direction (+X direction). The processing device (PR2) removes solvents or water contained in the photosensitive functional solution by means of a blower that sprays drying air (hot air), such as hot air or dry air, onto the surface of the substrate (P), an infrared light source, a ceramic heater, etc., thereby drying the photosensitive functional solution. By doing so, a film that becomes a photosensitive functional layer (photosensitive layer) is formed selectively or uniformly on the surface of the substrate (P). Additionally, the photosensitive functional layer may be formed on the surface of the substrate (P) by attaching a dry film to the surface of the substrate (P). In this case, instead of the processing device (PR1) and the processing device (PR2), an attachment device (processing device) that attaches the dry film to the substrate (P) can be provided.

[0017] Here, a typical example of this photosensitive functional solution (layer) is a photoresist (in liquid or dry film form), but there are materials that do not require development treatment, such as a photosensitive silane coupling agent (SAM) in which the hydrophilicity of the portion exposed to ultraviolet light is modified, or a photosensitive reducing agent in which plating reducing groups are exposed in the portion exposed to ultraviolet light. When a photosensitive silane coupling agent is used as the photosensitive functional solution (layer), the pattern portion exposed to ultraviolet light on the substrate (P) is modified from hydrophilic to hydrophilic. Therefore, by selectively applying a conductive ink (ink containing conductive nanoparticles such as silver or copper) or a liquid containing semiconductor material onto the hydrophilic portion, a pattern layer can be formed that serves as an electrode, semiconductor, insulator, or connecting wiring constituting a thin-film transistor (TFT). When a photosensitive reducing agent is used as the photosensitive functional solution (layer), plating reducing groups are exposed in the pattern portion exposed to ultraviolet light on the substrate (P). Therefore, after exposure, the substrate (P) is immediately immersed for a certain period of time in a plating solution containing palladium ions, etc., thereby forming (precipitating) a pattern layer of palladium. This plating treatment is an additive process, but it may also be based on an etching treatment as a subtractive process. In that case, the substrate (P) sent to the exposure device (EX) may have a base material of PET or PEN, a metallic thin film such as aluminum (Al) or copper (Cu) deposited on its surface either entirely or selectively, and a photoresist layer additionally laminated thereon. In the first embodiment, a photosensitive reducing agent is used as the photosensitive functional solution (layer).

[0018] The exposure device (EX) is a processing device that performs an exposure treatment on a substrate (P) while conveying the substrate (P), which has been conveyed from the processing device (PR2), toward the processing device (PR3) at a predetermined speed in the conveying direction (+X direction). The exposure device (EX) irradiates a light pattern corresponding to a pattern for an electronic device (for example, a pattern such as electrodes or wiring of a TFT constituting an electronic device) onto the surface of the substrate (P) (the surface of the photosensitive functional layer, i.e., the photosensitive surface). By doing so, a latent image (modified part) corresponding to the pattern is formed on the photosensitive functional layer.

[0019] In the first embodiment, the exposure device (EX) is a direct-drawing exposure device that does not use a mask, a so-called raster scan exposure device (pattern drawing device). As will be explained in detail below, the exposure device (EX) conveys the substrate (P) in the +X direction (sub-scanning direction) and scans the spot light SP of the exposure pulse-shaped beam (LB) (pulse beam) in one dimension in the scanning direction (Y direction) on the surface to be irradiated (photosensitive surface) of the substrate (P) and modulates (on / off) the intensity of the spot light SP at high speed according to pattern data (drawing data, pattern information). By doing so, a light pattern according to a predetermined pattern such as an electronic device, circuit, or wiring is drawn and exposed on the surface to be irradiated of the substrate (P). That is, through the secondary scanning of the substrate (P) and the primary scanning of the spot light SP, the spot light SP is scanned two-dimensionally relative to the surface to be irradiated of the substrate (P), thereby drawing and exposing a predetermined pattern on the substrate (P). Also, since the substrate (P) is transported along the transport direction (+X direction), the exposure area W, where the pattern is exposed by the exposure device (EX), is provided in multiple numbers at predetermined intervals along the longitudinal direction of the substrate (P) (see FIG. 4). Since an electronic device is formed in this exposure area W, the exposure area W is also a device formation area. Furthermore, since the electronic device is composed of multiple pattern layers (layers on which a pattern is formed) overlapping each other, the pattern corresponding to each layer may be exposed by the exposure device (EX).

[0020] The processing device (PR3) is a wet processing device that performs wet processing on the substrate (P) while conveying the substrate (P), which has been conveyed from the exposure device (EX), toward the processing device (PR4) at a predetermined speed in the conveying direction (+X direction). In the first embodiment, the processing device (PR3) performs plating processing, which is a type of wet processing, on the substrate (P). That is, the substrate (P) is immersed for a predetermined time in a plating solution stored in a processing tank. By doing so, a pattern layer according to a latent image is deposited (formed) on the surface of the photosensitive functional layer. That is, depending on the difference between the irradiated portion and the non-irradiated portion of the spot light SP on the photosensitive functional layer of the substrate (P), a predetermined material (e.g., palladium) is selectively formed on the substrate (P), and this becomes the pattern layer.

[0021] In addition, when a photosensitive silane coupling agent is used as the photosensitive functional layer, a coating treatment or plating treatment of a liquid (e.g., a liquid containing conductive ink, etc.), which is a type of wet treatment, is performed by the processing device (PR3). In this case as well, a pattern layer corresponding to the latent image is formed on the surface of the photosensitive functional layer. That is, depending on the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate (P) and the irradiated portion, a predetermined material (e.g., conductive ink or palladium, etc.) is selectively formed on the substrate (P), and this becomes the pattern layer. Also, when a photoresist is adopted as the photosensitive functional layer, a development treatment, which is a type of wet treatment, is performed by the processing device (PR3). In this case, a pattern corresponding to the latent image is formed on the photosensitive functional layer (photoresist) through this development treatment.

[0022] The processing device (PR4) is a cleaning and drying device that performs cleaning and drying treatment on the substrate (P) while conveying the substrate (P) that has been returned from the processing device (PR3) toward the recovery roll (FR2) at a predetermined speed in the conveying direction (+X direction). The processing device (PR4) performs cleaning with pure water on the substrate (P) that has undergone wet treatment, and then dries the substrate (P) at a temperature below the glass transition temperature until the moisture content of the substrate (P) becomes below a predetermined value.

[0023] In addition, when a photosensitive silane coupling agent is used as the photosensitive functional layer, the processing device (PR4) may be an annealing and drying device that performs annealing and drying treatments on the substrate (P). For the annealing treatment, high-intensity pulsed light from, for example, a strobe lamp is irradiated onto the substrate (P) to strengthen the electrical bonding between the nanoparticles contained in the coated conductive ink. When a photoresist is used as the photosensitive functional layer, a processing device (wet processing device) (PR5) that performs an etching treatment and a processing device (cleaning and drying device) (PR6) that performs cleaning and drying treatments on the substrate (P) that has undergone etching treatment may be provided between the processing device (PR4) and the recovery roll (FR2). By doing so, when a photoresist is used as the photosensitive functional layer, a pattern layer is formed on the substrate (P) by performing an etching treatment. That is, depending on the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate (P) and the irradiated portion, a predetermined material (e.g., aluminum (Al) or copper (Cu), etc.) is selectively formed on the substrate (P), and this becomes a pattern layer. The processing device (PR5, PR6) has the function of conveying the substrate (P) sent to the receiving roll (FR2) in the conveying direction (+X direction) at a predetermined speed. A plurality of processing devices (PR1~PR4) (including processing devices (PR5, PR6) as needed) have the function of conveying the substrate (P) in the +X direction configured as a substrate conveying device.

[0024] In this way, the substrate (P) on which each process has been performed is recovered by the recovery roll (FR2). After undergoing at least each process of the device manufacturing system (10), one pattern layer is formed on the substrate (P). As described above, since an electronic device is constructed by overlapping multiple pattern layers, in order to create an electronic device, each process of the device manufacturing system (10) as shown in FIG. 1 must be performed at least twice. Therefore, by mounting the recovery roll (FR2) on which the substrate (P) is wound as a supply roll (FR1) to another device manufacturing system (10), the pattern layer can be stacked. By repeating such operations, an electronic device is formed. After processing, the substrate (P) is in a state where multiple electronic devices are arranged side by side along the elongation direction of the substrate (P) at a predetermined interval. That is, the substrate (P) has become a multi-faceted chamfered substrate.

[0025] The recovery roll (FR2) that recovers the substrate (P) formed with electronic devices arranged side by side may be mounted on a dicing device not shown. The dicing device equipped with the recovery roll (FR2) divides (dices) the substrate (P) after processing into multiple electronic devices by each electronic device (exposure area W, which is the device formation area). The dimensions of the substrate (P) are, for example, the width direction (the direction in which the short length becomes about 10 cm to 2 m) and the length direction (the direction in which the long length becomes 10 m or more. In addition, the dimensions of the substrate (P) are not limited to the dimensions mentioned above.

[0026] FIG. 2 is a configuration diagram showing the configuration of an exposure device (EX). The exposure device (EX) is housed within a temperature control chamber (ECV). By maintaining the interior of this temperature control chamber (ECV) at a predetermined temperature and humidity, the shape change of the substrate (P) being transported inside is suppressed by the temperature, and the humidity is set to account for the hygroscopicity of the substrate (P) and the charge of electrostatic charge generated during transport. The temperature control chamber (ECV) is placed on an installation surface (E) of a manufacturing plant through passive or active anti-vibration units (SU1, SU2). The anti-vibration units (SU1, SU2) reduce vibrations from the installation surface (E). This installation surface (E) may be the floor surface of the factory itself, or it may be a surface on a pedestal that is exclusively installed on the floor surface to create a horizontal surface. The exposure device (EX) is equipped with at least a substrate transport mechanism (12), two light source devices (light sources) (LS(LSa, LSb)) of the same configuration, a beam conversion unit (including an electro-optical deflection device) (BDU), an exposure head (scanning device) (14), a control device (16), a plurality of alignment microscopes (AM1m, AM2m) (also, m=1, 2, 3, 4), and a plurality of encoders (ENja, ENjb) (also, j=1, 2, 3, 4). The control device (control unit) (16) controls each part of the exposure device (EX). This control device (16) includes a computer and a recording medium on which a program is recorded, and functions as the control device (16) of the first embodiment by the computer executing the program.

[0027] The substrate transport mechanism (12) constitutes a part of the substrate transport device of the device manufacturing system (10), and transports the substrate (P) transported from the processing device (PR2) at a predetermined speed within the exposure device (EX), and then sends it to the processing device (PR3) at a predetermined speed. By this substrate transport mechanism (12), the transport path of the substrate (P) transported within the exposure device (EX) is defined. The substrate transport mechanism (12) has, in order from the upstream side (-X direction side) of the transport direction of the substrate (P), an edge position controller (EPC), a driving roller (R1), a tension adjustment roller (RT1), a rotating drum (cylindrical drum) (DR), a tension adjustment roller (RT2), a driving roller (R2), and a driving roller (R3).

[0028] The edge position controller (EPC) adjusts the position of the substrate (P) being conveyed from the processing device (PR2) in the width direction (the short direction of the substrate (P) as the Y direction). That is, the edge position controller (EPC) moves the substrate (P) in the width direction and adjusts the position of the substrate (P) in the width direction so that the position of the end (edge) of the substrate (P), which is being conveyed with a predetermined tension, falls within a range of ± tens of μm to tens of μm (allowable range) relative to the target position. The edge position controller (EPC) has a roller on which the substrate (P) is placed while with a predetermined tension, and an edge sensor (end detection unit) not shown that detects the position of the end (edge) of the substrate (P) in the width direction. The edge position controller (EPC) moves the roller of the edge position controller (EPC) in the Y direction based on the detection signal detected by the edge sensor to adjust the position of the substrate (P) in the width direction. The driving roller (nip roller) (R1) rotates while maintaining both the front and back sides of the substrate (P) being conveyed from the edge position controller (EPC) to convey the substrate (P) toward the rotating drum (DR). Additionally, the edge position controller (EPC) may appropriately adjust the position of the substrate (P) in the width direction so that the length direction of the substrate (P) being wound onto the rotating drum (DR) is always orthogonal to the center axis (AXo) of the rotating drum (DR), and may also appropriately adjust the parallelism between the rotation axis of the roller of the edge position controller (EPC) and the Y axis to correct the tilt error in the direction of travel of the substrate (P).

[0029] The rotating drum (DR) has a central axis (AXo) that extends in the Y direction and intersects the direction in which gravity acts, and a cylindrical outer surface with a certain radius from the central axis (AXo). The rotating drum (DR) supports (holds) a portion of the substrate (P) by bending it into a cylindrical shape in the elongated direction along this outer surface (cylindrical surface), and rotates around the central axis (AXo) to transport the substrate (P) in the +X direction. The rotating drum (DR) supports the area (part) on the substrate (P) where the beam (LB) (spot light SP) from the exposure head (14) is projected with its outer surface. The rotating drum (DR) supports (holds in close contact) the substrate (P) from the side opposite to the side where the electronic device is formed (the side where the photosensitive surface is formed). On both sides of the rotating drum (DR) in the Y direction, a shaft (Sft) supported by annular bearings is provided so that the rotating drum (DR) rotates around the central axis (AXo). This shaft (Sft) rotates around the central axis (AXo) at a constant rotational speed by applying rotational torque from a rotational driving source (e.g., a motor or a reduction gear mechanism, etc.) not shown, which is controlled by a control device (16). Additionally, for convenience, a plane parallel to the YZ plane including the central axis (AXo) is called the central plane Poc.

[0030] The drive rollers (knee rollers) (R2, R3) are arranged at a predetermined interval along the conveying direction (+X direction) of the substrate (P) to provide a predetermined looseness (allowance) to the substrate (P) after exposure. The drive rollers (R2, R3), like the drive roller (R1), rotate while maintaining both the front and back sides of the substrate (P) to convey the substrate (P) toward the processing device (PR3). The tension adjustment rollers (RT1, RT2) are pressed in the -Z direction and apply a predetermined tension in the elongation direction to the substrate (P) wound and supported by the rotating drum (DR). By doing so, the tension in the elongation direction applied to the substrate (P) on the rotating drum (DR) is stabilized within a predetermined range. The control device (16) rotates the drive rollers (R1~R3) by controlling a rotational drive source (e.g., a motor or a reduction gear, etc.) not shown. In addition, the rotation axis of the drive rollers (R1 to R3) and the rotation axis of the tension adjustment rollers (RT1, RT2) are parallel to the center axis (AXo) of the rotating drum (DR).

[0031] The light source device (LS(LSa, LSb)) generates and emits a pulse-shaped beam (pulse beam, pulsed light, laser) LB. This beam (LB) is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency (oscillation frequency, predetermined frequency) of the beam (LB) is denoted as Fa. The beam (LB) emitted by the light source device (LS(LSa, LSb)) is incident on the exposure head (14) through the beam conversion unit (BDU). The light source device (LS(LSa, LSb)) emits and emits the beam (LB) at the emission frequency Fa according to the control of the control device (16). The configuration of this light source device (LS(LSa, LSb)) will be described in detail below, but in the first embodiment, a fiber amplifier laser light source (harmonic laser light source) is used, which is composed of a semiconductor laser element that generates pulsed light in the infrared wavelength band, a fiber amplifier, and a wavelength conversion element (harmonic generating element) that converts the amplified pulsed light in the infrared wavelength band into pulsed light in the ultraviolet wavelength band, and obtains high-intensity ultraviolet pulsed light with an oscillation frequency Fa of several hundred MHz and a emission time of one pulse of light of about picoseconds. In addition, in order to distinguish between the beam (LB) from the light source device (LSa) and the beam (LB) from the light source device (LSb), the beam (LB) from the light source device (LSa) may be denoted as LBa, and the beam (LB) from the light source device (LSb) may be denoted as LBb.

[0032] The beam switching unit (BDU) injects a beam (LB) (LBa, LBb) from two light source devices (LS(LSa, LSb)) into two of the plurality of scanning units (Un) (also, n=1, 2,···, 6) constituting the exposure head (14), and switches the scanning unit (Un) into which the beam (LB) (LBa, LBb) is injected. Specifically, the beam switching unit (BDU) injects a beam (LBa) from a light source device (LSa) into one of the three scanning units (U1~U3) and injects a beam (LBb) from a light source device (LSb) into one of the three scanning units (U4~U6). Additionally, the beam switching unit (BDU) switches the scanning unit (Un) into which the beam (LBa) is incident among the scanning units (U1~U3), and switches the scanning unit (Un) into which the scanning beam (LBb) is incident among the scanning units (U4~U6).

[0033] The beam switching unit (BDU) switches the scanning unit (Un) into which beams (LBa) and LBb are incident so that beam (LBn) is incident on the scanning unit (Un) that performs scanning of spot light SP. That is, the beam switching unit (BDU) incidents beam (LBa) from the light source device (LSa) onto one scanning unit (Un) among the scanning units (U1~U3) that performs scanning of spot light SP. Likewise, the beam switching unit (BDU) incidents beam (LBb) from the light source device (LSb) onto one scanning unit (Un) among the scanning units (U4~U6) that performs scanning of spot light SP. This beam switching unit (BDU) will be explained in detail next. Additionally, regarding the injection units (U1~U3), the injection unit (Un) that performs the injection of spot light SP is switched in the order U1→U2→U3, and regarding the injection units (U4~U6), the injection unit (Un) that performs the injection of spot light SP is switched in the order U4→U5→U6.

[0034] The exposure head (14) is a so-called multi-beam type exposure head that arranges multiple scanning units (Un(U1~U6)) of the same configuration. The exposure head (14) draws a pattern on a part of a substrate (P) supported by the outer surface (circular surface) of a rotating drum (DR) using multiple scanning units (Un(U1~U6)). Since the exposure head (14) repeatedly performs pattern exposure for electronic devices on the substrate (P), the exposure area (electronic device formation area) W where the pattern is exposed is provided in multiple numbers at predetermined intervals along the elongation direction of the substrate (P) (see FIG. 4). Multiple scanning units (Un(U1~U6)) are arranged in a predetermined arrangement relationship. Multiple scanning units (Un(U1~U6)) are arranged in a zigzag arrangement in two rows in the conveying direction of the substrate (P) with the center plane Poc in between. The odd-numbered scanning units (U1, U3, U5) are arranged in a single row at a predetermined distance along the Y direction, upstream (-X direction side) of the substrate (P)'s transport direction with respect to the center plane Poc. The even-numbered scanning units (U2, U4, U6) are arranged in a single row at a predetermined distance along the Y direction, downstream (+X direction side) of the substrate (P)'s transport direction with respect to the center plane Poc. The odd-numbered scanning units (U1, U3, U5) and the even-numbered scanning units (U2, U4, U6) are arranged symmetrically with respect to the center plane Poc.

[0035] Each scanning unit (Un(U1~U6)) projects a beam (LB) from a light source device (LS(LSa, LSb)) onto the irradiated surface of the substrate (P) so as to converge onto a spot light SP, and scans the spot light SP in one dimension using a rotating polygon mirror (PM) (see FIG. 5). The spot light SP is scanned in one dimension on the irradiated surface of the substrate (P) by the polygon mirror (deflection member) (PM) of each scanning unit (Un(U1~U6)). Through the scanning of this spot light SP, a linear drawing line (scan line) SLn (also, n=1, 2,···, 6) is defined, in which a pattern of one line is drawn on the substrate (P) (on the irradiated surface of the substrate (P)). The configuration of this scanning unit (Un) will be explained in detail next.

[0036] Scanning unit (U1) scans spot light SP along the drawing line (SL1), and similarly, scanning units (U2 to U6) scan spot light SP along the drawing line SL2 to SL6. The drawing lines (SLn(SL1 to SL6)) of the plurality of scanning units (Un(U1 to U6)) are set to meet without being separated from each other in the Y direction (the width direction of the substrate (P), the main scanning direction), as shown in FIG. 3 and FIG. 4. In addition, the beam (LB) from the light source device (LS(LSa, LSb)) incident on the scanning unit (Un) through the beam conversion unit (BDU) may be denoted as LBn. Also, the beam (LBn) incident on the scanning unit (U1) may be denoted as LB1, and the beam (LBn) incident on the scanning units (U2 to U6) may be denoted as LB2 to LB6. This drawing line (SLn(SL1~SL6)) represents the scanning trajectory of the spot light SP of the beam (LBn(LB1~LB6)) scanned by the scanning unit (Un(U1~U6)). The beam (LBn) incident on the scanning unit (Un) may be a linearly polarized beam (P-polarized or S-polarized) polarized in a predetermined direction, and in the first embodiment, it is a P-polarized beam.

[0037] As shown in FIG. 4, each scanning unit (Un(U1~U6)) divides the scanning area so that the plurality of scanning units (Un(U1~U6)) collectively cover the entire width direction of the exposure area W. By doing so, each scanning unit (Un(U1~U6)) can draw a pattern in each of the plurality of areas (drawing ranges) divided in the width direction of the substrate (P). For example, if the scanning length in the Y direction (length of the drawing line (SLn)) by one scanning unit (Un) is set to about 20~60mm, then by arranging a total of 6 scanning units (Un), consisting of 3 odd-numbered scanning units (U1, U3, U5) and 3 even-numbered scanning units (U2, U4, U6), in the Y direction, the width in the Y direction that can be drawn is expanded to about 120~360mm. The length of each drawing line (SLn (SL1~SL6)) (length of the drawing range) is, in principle, the same. That is, the scanning distance of the spot light SP of the beam (LBn) scanned along each of the drawing lines (SL1~SL6) is, in principle, the same. In addition, if you want to widen the width of the exposure area W, you can do so by increasing the length of the drawing line (SLn) itself or by increasing the number of scanning units (Un) arranged in the Y direction.

[0038] In addition, each actual drawing line (SLn (SL1~SL6)) is set to be slightly shorter than the maximum length (maximum scanning length) for which the spot light SP can actually scan the surface to be irradiated. For example, when the drawing magnification in the main irradiation direction (Y direction) is the initial value (no magnification correction), if the scanning length of the drawing line (SLn) capable of drawing a pattern is set to 30 mm, the maximum scanning length of the spot light SP on the surface to be irradiated is set to approximately 31 mm, with a margin of about 0.5 mm on each side of the drawing start point (scanning start point) and the drawing end point (scanning end point) of the drawing line (SLn). By setting it in this way, it becomes possible to finely adjust the position of the 30 mm drawing line (SLn) in the main irradiation direction or finely adjust the drawing magnification within the range of the maximum scanning length of the spot light SP, which is 31 mm. The maximum scanning length of the spot light SP is not limited to 31 mm, but is determined mainly by the aperture of the fθ lens (FT) (see FIG. 5) provided behind the polygon mirror (rotating polygon mirror) (PM) within the scanning unit (Un).

[0039] Multiple drawing lines (SLn (SL1~SL6)) are arranged in a zigzag pattern in two rows along the circumferential direction of the rotating drum (DR) with the center plane Poc in between. The odd-numbered drawing lines (SL1), SL3, and SL5 are located on the surface to be irradiated of the substrate (P) on the upstream side (-X direction side) of the substrate (P) in the transport direction with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, and SL6 are located on the surface to be irradiated of the substrate (P) on the downstream side (+X direction side) of the substrate (P) in the transport direction with respect to the center plane Poc. The drawing lines (SL1~SL6) are approximately parallel to the width direction of the substrate (P), that is, the center axis (AXo) of the rotating drum (DR).

[0040] Drawing lines (SL1), SL3, and SL5 are arranged in a straight line in a single row at a predetermined interval along the width direction (main scanning direction) of the substrate (P). Likewise, drawing lines SL2, SL4, and SL6 are arranged in a straight line in a single row at a predetermined interval along the width direction (main scanning direction) of the substrate (P). At this time, drawing line SL2 is positioned between drawing line (SL1) and drawing line SL3 with respect to the width direction of the substrate (P). Likewise, drawing line SL3 is positioned between drawing line SL2 and drawing line SL4 with respect to the width direction of the substrate (P). Drawing line SL4 is positioned between drawing line SL3 and drawing line SL5 with respect to the width direction of the substrate (P), and drawing line SL5 is positioned between drawing line SL4 and drawing line SL6 with respect to the width direction of the substrate (P). In this way, multiple drawing lines (SLn(SL1~SL6)) are arranged to be offset from each other with respect to the Y direction (main scanning direction).

[0041] The primary beam direction of the spot light SP of beams (LB1), LB3, and LB5, which are scanned along each of the odd-numbered drawing lines (SL1), SL3, and SL5, is a one-dimensional direction and is the same direction. The primary beam direction of the spot light SP of beams (LB2), LB4, and LB6, which are scanned along each of the even-numbered drawing lines SL2, SL4, and SL6, is a one-dimensional direction and is the same direction. The primary beam direction of the spot light SP of beams (LB1), LB3, and LB5, which are scanned along these drawing lines (SL1), SL3, and SL5, and the primary beam direction of the spot light SP of beams (LB2), LB4, and LB6, which are scanned along the drawing lines SL2, SL4, and SL6, may be opposite to each other. In the first embodiment, the primary beam direction of the spot light SP of the beam (LB1), LB3, and LB5 scanned along the drawing lines (SL1), SL3, and SL5 is the -Y direction. Additionally, the primary beam direction of the spot light SP of the beam (LB2), LB4, and LB6 scanned along the drawing lines SL2, SL4, and SL6 is the +Y direction. As a result, the end of the drawing line (SL1), SL3, and SL5 on the drawing start side and the end of the drawing line SL2, SL4, and SL6 on the drawing start side are adjacent or partially overlap with respect to the Y direction. Additionally, the end of the drawing line SL3 and SL5 on the drawing end side and the end of the drawing line SL2 and SL4 on the drawing end side are adjacent or partially overlap with respect to the Y direction. When arranging each drawing line (SLn) such that the ends of adjacent drawing lines (SLn) in the Y direction partially overlap, for example, the overlap in the Y direction, including the drawing start point or drawing end point, may be within a range of a few percent or less with respect to the length of each drawing line (SLn). Furthermore, connecting drawing lines (SLn) in the Y direction means making the ends of the drawing lines (SLn) adjacent or partially overlapping with respect to the Y direction.

[0042] In addition, the width (dimension in the X direction) of the drawing line (SLn) in the auxiliary scanning direction is the thickness according to the size (diameter) φ of the spot light SP. For example, if the size (dimension) φ of the spot light SP is 3μm, the width of the drawing line (SLn) is also 3μm. The spot light SP may be projected along the drawing line (SLn) so as to overlap by a predetermined length (for example, 7 / 8 of the size φ of the spot light SP). Also, when connecting adjacent drawing lines (SLn) in the Y direction (for example, drawing line (SL1) and drawing line SL2), it is preferable to overlap by a predetermined length (for example, 7 / 8 of the size φ of the spot light SP).

[0043] In the first embodiment, since the beam (LB)(LBa, LBb) from the light source device (LS(LSa, LSb)) is pulsed light, the spot light SP projected onto the drawing line (SLn) during the drawing process becomes discrete depending on the oscillation frequency Fa (e.g., 400 MHz) of the beam (LB)(LBa, LBb). Therefore, it is necessary to overlap the spot light SP projected by one pulse of the beam (LB) with the spot light SP projected by the next pulse in the drawing direction. The amount of overlap is set by the size φ of the spot light SP, the scanning speed (drawing speed) Vs of the spot light SP, and the oscillation frequency Fa of the beam (LB). The effective size φ of the spot light SP is 1 / e of the peak intensity of the spot light SP when the intensity distribution of the spot light SP is approximated by a Gaussian distribution. 2(or 1 / 2) is determined. In the first embodiment, the scanning speed Vs and oscillation frequency Fa of the spot light SP are set so that the spot light SP overlaps by approximately φ × 7 / 8 with respect to the effective size (dimension) φ. Accordingly, the projection interval along the main projection direction of the spot light SP becomes φ / 8. Therefore, regarding the secondary projection direction (a direction orthogonal to the drawing line (SLn)), it is preferable to set the substrate (P) to move by a distance of approximately 1 / 8 of the effective size φ of the spot light SP between one scan of the spot light SP along the drawing line (SLn) and the next scan. Additionally, the exposure amount to the photosensitive functional layer on the substrate (P) can be set by adjusting the peak value of the beam (LB) (pulsed light). However, if one wishes to increase the exposure amount in a situation where the intensity of the beam (LB) cannot be increased, the overlap amount in the main or secondary scanning direction of the spot light SP can be increased by any of the following: a decrease in the scanning speed Vs of the main scanning direction of the spot light SP, an increase in the oscillation frequency Fa of the beam (LB), or a decrease in the transport speed Vt of the secondary scanning direction of the substrate (P). The scanning speed Vs of the main scanning direction of the spot light SP increases in proportion to the rotation speed (rotation speed Vp) of the polygon mirror (PM).

[0044] Each scanning unit (Un(U1~U6)) irradiates each beam (LBn) toward the substrate (P) such that, at least in the XZ plane, each beam (LBn) travels toward the central axis (AXo) of the rotating drum (DR). By doing so, the optical path (beam central axis) of the beam (LBn) traveling from each scanning unit (Un(U1~U6)) toward the substrate (P) becomes parallel to the normal of the irradiated surface of the substrate (P) in the XZ plane. Additionally, each scanning unit (Un(U1~U6)) irradiates the beam (LBn) toward the substrate (P) such that the beam (LBn) irradiating the drawing line (SLn(SL1~SL6)) is perpendicular to the irradiated surface of the substrate (P) within the plane parallel to the YZ plane. That is, regarding the direction of the spot light SP on the irradiated surface, the beam (LBn (LB1~LB6)) projected onto the substrate (P) is scanned in a telecentric state. Here, a line (or optical axis) perpendicular to the irradiated surface of the substrate (P) passing through the midpoint of each predetermined drawing line (SLn (SL1~SL6)) defined by each scanning unit (Un (U1~U6)) is called the irradiation center axis (Len (Le1~Le6)).

[0045] Each of these scanning center axes (Len(Le1~Le6)) is a line connecting the drawing lines (SL1~SL6) and the center axis (AXo) in the XZ plane. The scanning center axes (Le1, Le3, Le5) of the odd-numbered scanning units (U1, U3, U5) are oriented in the same direction in the XZ plane, and the scanning center axes (Le2, Le4, Le6) of the even-numbered scanning units (U2, U4, U6) are oriented in the same direction in the XZ plane. In addition, the scanning center axes (Le1, Le3, Le5) and the scanning center axes (Le2, Le4, Le6) are set such that the angle with respect to the center plane Poc in the XZ plane is ±θ1 (see FIG. 2).

[0046] A plurality of alignment microscopes (AM1m (AM11~AM14), AM2m (AM21~AM24)) shown in FIG. 2 are provided along the Y direction to detect a plurality of alignment marks (MKm (MK1~MK4)) formed on the substrate (P) shown in FIG. 4. The plurality of alignment marks (MKm (MK1~MK4)) are reference marks for aligning the substrate (P) relative to a predetermined pattern drawn on the exposure area W on the irradiated surface of the substrate (P). The plurality of alignment microscopes (AM1m (AM11~AM14), AM2m (AM21~AM24)) detect the plurality of alignment marks (MKm (MK1~MK4)) on the substrate (P) supported by the outer circumferential surface (circular surface) of the rotating drum (DR). A plurality of alignment microscopes (AM1m (AM11~AM14)) are provided upstream (-X direction) of the substrate (P) in the transport direction, above the area to be irradiated (the area enclosed by the drawing lines (SL1~SL6)) on the substrate (P) by the spot light SP of the beam (LBn (LB1~LB6)) from the exposure head (14). Additionally, a plurality of alignment microscopes (AM2m (AM21~AM24)) are provided downstream (+X direction) of the substrate (P) in the transport direction, above the area to be irradiated (the area enclosed by the drawing lines (SL1~SL6)) on the substrate (P) by the spot light SP of the beam (LBn (LB1~LB6)) from the exposure head (14).

[0047] The alignment microscope (AM1m (AM11~AM14), AM2m (AM21~AM24)) has a light source that projects alignment illumination light onto a substrate (P), an observation optical system (including an objective lens) that obtains an enlarged image of a local area (observation area) Vw1m (Vw11~Vw14) and Vw2m (Vw21~Vw24) including an alignment mark (MKm) on the surface of the substrate (P), and an imaging element such as a CCD or CMOS that captures the enlarged image with a high-speed shutter according to the transport speed Vt of the substrate (P) while the substrate (P) is moving in the transport direction. The imaging signal (image data) captured by each of the plurality of alignment microscopes (AM1m (AM11~AM14), AM2m (AM21~AM24)) is sent to a control device (16). The mark position detection unit (106) (see FIG. 12) of the control device (16) detects the position (mark position information) of the alignment marks (MKm (MK1~MK4)) on the substrate (P) by performing image analysis of the multiple imaging signals sent thereto. In addition, the illumination light for alignment is light in a wavelength band that has almost no sensitivity to the photosensitive functional layer on the substrate (P), for example, light with a wavelength of about 500~800 nm.

[0048] Multiple alignment marks (MK1 to MK4) are provided around each exposure area W. Multiple alignment marks (MK1, MK4) are formed at regular intervals Dh along the longitudinal direction of the substrate (P) on both sides of the width direction of the substrate (P) in the exposure area W. Alignment mark (MK1) is formed on the -Y direction side of the width direction of the substrate (P), and alignment mark (MK4) is formed on the +Y direction side of the width direction of the substrate (P). These alignment marks (MK1, MK4) are arranged so that they are in the same position with respect to the longitudinal direction (X direction) of the substrate (P) when the substrate (P) is not deformed by receiving high tension or thermal processing. Additionally, alignment marks (MK2, MK3) are formed along the width direction (short direction) of the substrate (P) in the margins on the +X direction and -X direction sides of the exposure area W, between the alignment mark (MK1) and the alignment mark (MK4). The alignment marks (MK2, MK3) are formed between the exposure area W and the exposure area W. The alignment mark (MK2) is formed on the -Y direction side of the width direction of the substrate (P), and the alignment mark (MK3) is formed on the +Y direction side of the substrate (P).

[0049] In addition, the Y-direction spacing between the alignment mark (MK1) arranged at the end of the substrate (P) on the -Y direction side and the alignment mark (MK2) in the margin area, the Y-direction spacing between the alignment mark (MK2) in the margin area and the alignment mark (MK3), and the Y-direction spacing between the alignment mark (MK4) arranged at the end of the substrate (P) on the +Y direction side and the alignment mark (MK3) in the margin area are all set to the same distance. These alignment marks (MKm (MK1~MK4)) may be formed together when forming the pattern layer of the first layer. For example, when exposing the pattern of the first layer, the alignment mark pattern may also be exposed together around the exposure area W where the pattern is exposed. In addition, the alignment marks (MKm) may be formed within the exposure area W. For example, they may be formed along the outline of the exposure area W as within the exposure area W. In addition, a pattern portion at a specific location or a portion of a specific shape among the patterns of an electronic device formed within the exposure area W may be used as an alignment mark (MKm).

[0050] As shown in FIG. 4, the alignment microscopes (AM11, AM21) are positioned to capture an alignment mark (MK1) located within the observation area (detection area) Vw11, Vw21 by the objective lens. Similarly, the alignment microscopes (AM12~AM14, AM22~AM24) are positioned to capture an alignment mark (MK2~MK4) located within the observation area Vw12~Vw14, Vw22~Vw24 by the objective lens. Accordingly, the plurality of alignment microscopes (AM11~AM14, AM21~AM24) are arranged along the width direction of the substrate (P) in the order of AM11~AM14 and AM21~AM24 from the -Y direction side of the substrate (P), corresponding to the positions of the plurality of alignment marks (MK1~MK4). In addition, in Fig. 3, the observation area Vw2m (Vw21~Vw24) of the alignment microscope (AM2m (AM21~AM24)) is omitted.

[0051] Multiple alignment microscopes (AM1m (AM11~AM14)) are configured such that, with respect to the X direction, the distance between the exposure position (drawing line (SL1~SL6)) and the observation area Vw1m (Vw11~Vw14) is shorter than the length of the exposure area W in the X direction. Likewise, multiple alignment microscopes (AM2m (AM21~AM24)) are configured such that, with respect to the X direction, the distance between the exposure position (drawing line (SL1~SL6)) and the observation area Vw2m (Vw21~Vw24) is shorter than the length of the exposure area W in the X direction. Additionally, the number of alignment microscopes (AM1m, AM2m) provided in the Y direction can be changed according to the number of alignment marks (MKm) formed in the width direction of the substrate (P). Also, the size of the irradiated surface of the substrate (P) in each observation area Vw1m (Vw11~Vw14) and Vw2m (Vw21~Vw24) is set according to the size of the alignment mark (MK1~MK4) or the alignment precision (position measurement precision), but is approximately 100~500 μm.

[0052] As shown in FIG. 3, scale portions (SDa, SDb) having annular markings formed along the entire circumferential direction of the outer surface of the rotating drum (DR) are provided at both ends of the rotating drum (DR). These scale portions (SDa, SDb) are diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (e.g., 20 μm) along the circumferential direction of the outer surface of the rotating drum (DR), and are configured as incremental scales. These scale portions (SDa, SDb) rotate integrally with the rotating drum (DR) around a central axis (AXo). A plurality of encoders (ENja, ENjb) (also j=1, 2, 3, 4) serving as scale reading heads for reading the scale portions (SDa, SDb) are provided to face these scale portions (SDa, SDb) (see FIG. 2 and FIG. 3). In addition, in Fig. 3, the encoder (EN4a, EN4b) is omitted.

[0053] The encoders (ENja, ENjb) optically detect the rotation angle position of the rotating drum (DR). Four encoders (ENja(EN1a, EN2a, EN3a, EN4a)) are provided opposite the scale portion (SDa) provided at the end of the rotating drum (DR) on the -Y direction side. Likewise, four encoders (ENjb(EN1b, EN2b, EN3b, EN4b)) are provided opposite the scale portion (SDb) provided at the end of the rotating drum (DR) on the +Y direction side.

[0054] The encoders (EN1a, EN1b) are positioned upstream (-X direction side) of the substrate (P)'s transport direction with respect to the center plane Poc and are arranged on the installation orientation line Lx1 (see FIG. 2 and FIG. 3). The installation orientation line Lx1 is a line connecting the projection position (reading position) of the measurement light beam of the encoders (EN1a, EN1b) onto the scale portion (SDa, SDb) and the center axis (AXo) in the XZ plane. In addition, the installation orientation line Lx1 is a line connecting the observation area Vw1m (Vw11~Vw14) of each alignment microscope (AM1m (AM11~AM14)) and the center axis (AXo) in the XZ plane. That is, multiple alignment microscopes (AM1m (AM11~AM14)) are also arranged on the installation orientation line Lx1.

[0055] The encoders (EN2a, EN2b) are positioned upstream (-X direction side) of the substrate (P)'s transport direction with respect to the center plane Poc, and are also positioned downstream (+X direction side) of the substrate (P)'s transport direction compared to the encoders (EN1a, EN1b). The encoders (EN2a, EN2b) are positioned on the installation orientation line Lx2 (see FIG. 2 and FIG. 3). The installation orientation line Lx2 is a line connecting the projection position (reading position) of the measurement light beam of the encoders (EN2a, EN2b) onto the scale portion (SDa, SDb) in the XZ plane with the center axis (AXo). This installation orientation line Lx2 is positioned at the same angle as the irradiation center axes (Le1, Le3, Le5) in the XZ plane and is superimposed.

[0056] The encoders (EN3a, EN3b) are positioned downstream (+X direction side) of the substrate (P)'s transport direction with respect to the center plane Poc and are arranged on the installation orientation line Lx3 (see FIG. 2 and FIG. 3). The installation orientation line Lx3 is a line connecting the projection position (reading position) on the scale portion (SDa, SDb) of the measurement light beam of the encoders (EN3a, EN3b) in the XZ plane with the center axis (AXo). This installation orientation line Lx3 is superimposed on the irradiation center axes (Le2, Le4, Le6) at the same angle in the XZ plane. Accordingly, the installation orientation line Lx2 and the installation orientation line Lx3 are set so that the angle with respect to the center plane Poc in the XZ plane is ±θ1 (see FIG. 2).

[0057] The encoders (EN4a, EN4b) are positioned downstream (+X direction side) of the substrate (P) in the transport direction from the encoders (EN3a, EN3b) and are arranged on the installation orientation line Lx4 (see FIG. 2). The installation orientation line Lx4 is a line connecting the projection position (reading position) of the measurement light beam of the encoders (EN4a, EN4b) onto the scale portion (SDa, SDb) and the central axis (AXo) in the XZ plane. In addition, the installation orientation line Lx4 is a line connecting the observation area Vw2m (Vw21~Vw24) of each alignment microscope (AM2m (AM21~AM24)) and the central axis (AXo) in the XZ plane. That is, multiple alignment microscopes (AM2m (AM21~AM24)) are also arranged on the installation orientation line Lx4. These installation orientation lines Lx1 and Lx4 are set so that, in the XZ plane, the angle with respect to the center plane Poc is ±θ2 (see FIG. 2).

[0058] Each encoder (ENja (EN1a~EN4a), ENjb (EN1b~EN4b)) projects a measurement light beam toward the scale section (SDa, SDb) and outputs a detection signal, which is a pulse signal, to the control device (16) by photoelectrically detecting the reflected light beam (diffracted light). The rotation position detection unit (108) (see FIG. 12) of the control device (16) measures the rotation angle position and angle change of the rotating drum (DR) with submicron resolution by counting the detection signal (pulse signal). From this angle change of the rotating drum (DR), the transport speed Vt of the substrate (P) can also be measured. The rotation position detection unit (108) counts the detection signals from each encoder (ENja (EN1a~EN4a), ENjb (EN1b~EN4b)) individually.

[0059] Specifically, the rotation position detection unit (108) has a plurality of counter circuits (CNja (CN1a~CN4a), CNjb (CN1b~CN4b)). The counter circuit (CN1a) counts the detection signal from the encoder (EN1a), and the counter circuit (CN1b) counts the detection signal from the encoder (EN1b). Likewise, the counter circuits (CN2a~CN4a, CN2b~CN4b) count the detection signal from the encoders (EN2a~EN4a, EN2b~EN4b). Each counter circuit (CNja (CN1a~CN4a), CNjb (CN1b~CN4b)) resets the count value corresponding to the encoder (ENja, ENjb) that detected the origin mark (origin pattern) (ZZ) shown in FIG. 3, which is formed on a part of the circumferential direction of the scale section (SDa, SDb), to 0 when each encoder (ENja (EN1a~EN4a), ENjb (EN1b~EN4b)) detects the origin mark (ZZ).

[0060] Either one of the count values ​​of these counter circuits (CN1a, CN1b) or their average value is used as the rotation angle position of the rotating drum (DR) on the installation orientation line Lx1, and either one of the count values ​​of the counter circuits (CN2a, CN2b) or their average value is used as the rotation angle position of the rotating drum (DR) on the installation orientation line Lx2. Likewise, either one of the count values ​​of the counter circuits (CN3a, CN3b) or their average value is used as the rotation angle position of the rotating drum (DR) on the installation orientation line Lx3, and either one of the count values ​​of the counter circuits (CN4a, CN4b) or their average value is used as the rotation angle position of the rotating drum (DR) on the installation orientation line Lx4. In addition, except for cases where the rotating drum (DR) is rotated eccentrically with respect to the center axis (AXo) due to manufacturing errors of the rotating drum (DR), the count values ​​of the counter circuits (CN1a, CN1b) are, in principle, identical. Likewise, the count values ​​of the counter circuits (CN2a, CN2b) are identical, and the count values ​​of the counter circuits (CN3a, CN3b) and the counter circuits (CN4a, CN4b) are also identical.

[0061] As described above, the alignment microscope (AM1m (AM11~AM14)) and encoders (EN1a, EN1b) are positioned on the installation orientation line Lx1, and the alignment microscope (AM2m (AM21~AM24)) and encoders (EN4a, EN4b) are positioned on the installation orientation line Lx4. Accordingly, the position of the substrate (P) on the installation orientation line Lx1 can be measured with high precision based on the position detection of the alignment mark (MKm (MK1~MK4)) by image analysis of the multiple image signals captured by the multiple alignment microscopes (AM1m (AM11~AM14)) and the information of the rotation angle position of the rotating drum (DR) at the moment the alignment microscope (AM1m) captures (count value based on the encoders (EN1a, EN1b)). Likewise, based on the position detection of alignment marks (MKm (MK1~MK4)) by image analysis of multiple imaging signals captured by multiple alignment microscopes (AM2m (AM21~AM24)) and the information of the rotation angle position of the rotating drum (DR) at the moment captured by the alignment microscope (AM2m) (count value based on encoders (EN4a, EN4b)), the position of the substrate (P) on the installation orientation line Lx4 can be measured with high precision.

[0062] In addition, the count values ​​of the detection signals from encoders (EN1a, EN1b), the count values ​​of the detection signals from encoders (EN2a, EN2b), the count values ​​of the detection signals from encoders (EN3a, EN3b), and the count values ​​of the detection signals from encoders (EN4a, EN4b) are reset to zero at the moment when each encoder (ENja, ENjb) detects the origin mark (ZZ). 10 Likewise, when the first position on the substrate (P) is returned to the position on the installation orientation line Lx4, the count value of the detection signal based on the encoder (EN4a, EN4b) becomes the first value (e.g., 100).

[0063] However, the substrate (P) is wound on the inner side of the scale portions (SDa, SDb) at both ends of the rotating drum (DR). In FIG. 2, the radius from the center axis (AXo) of the outer surface of the scale portions (SDa, SDb) is set to be smaller than the radius from the center axis (AXo) of the outer surface of the rotating drum (DR). However, as shown in FIG. 3, the outer surface of the scale portions (SDa, SDb) may be set to be the same surface as the outer surface of the substrate (P) wound on the rotating drum (DR). That is, the radius (distance) from the center axis (AXo) of the outer surface of the scale portions (SDa, SDb) and the radius (distance) from the center axis (AXo) of the outer surface (surveyed surface) of the substrate (P) wound on the rotating drum (DR) may be set to be the same. By this, each encoder (ENja (EN1a~EN4a), ENjb (EN1b~EN4b)) can detect scale portions (SDa, SDb) at a position in the same diameter direction as the irradiated surface of the substrate (P) wound on the rotating drum (DR). Therefore, the Abbe error caused by the difference between the measurement position and the processing position (drawing lines (SL1~SL6)) by the encoders (ENja, ENjb) in the diameter direction of the rotating drum (DR) can be reduced.

[0064] However, since the thickness of the substrate (P) as the subject to irradiation varies significantly, ranging from tens of μm to hundreds of μm, it is difficult to always make the radius of the outer surface of the scale portion (SDa, SDb) and the radius of the outer surface of the substrate (P) wound on the rotating drum (DR) the same. Therefore, in the case of the scale portion (SDa, SDb) shown in FIG. 3, the radius of the outer surface (scale surface) is set to match the radius of the outer surface of the rotating drum (DR). In addition, it is possible to configure the scale portion (SDa, SDb) as individual discs and mount the disc (scale disc) on the same axis as the shaft (Sft) of the rotating drum (DR). In that case as well, it is preferable to make the radius of the outer surface (scale surface) of the scale disc and the radius of the outer surface of the rotating drum (DR) the same, to the extent that the Abbe error falls within the allowable limit.

[0065] From the above, based on the position of the alignment mark (MKm (MK1~MK4)) on the substrate (P) detected by the alignment microscope (AM1m (AM11~AM14)) and the count value based on the encoder (EN1a, EN1b) (either one or the average of the count values ​​of the counter circuit (CN1a, CN1b)), the control device (16) determines the starting position for the drawing exposure of the exposure area W in the long direction (X direction) of the substrate (P). In addition, since the length of the exposure area W in the X direction is already known, the control device (16) determines the starting position for the drawing exposure whenever a predetermined number of alignment marks (MKm (MK1~MK4)) are detected. And, when the count value based on the encoder (EN1a, EN1b) at the time the exposure start position is determined is set to the first value (e.g., 100), when the count value based on the encoder (EN2a, EN2b) becomes the first value (e.g., 100), the starting position for the drawing exposure of the exposure area W in the long direction of the substrate (P) is located on the drawing lines (SL1), SL3, and SL5. Accordingly, the scanning unit (U1, U3, U5) can start scanning the spot light SP based on the count value of the encoder (EN2a, EN2b). Also, when the count value based on the encoder (EN3a, EN3b) becomes the first value (e.g., 100), the starting position for the drawing exposure of the exposure area W in the long direction of the substrate (P) is located on the drawing lines SL2, SL4, and SL6. Accordingly, the scanning unit (U2, U4, U6) can initiate scanning of spot light SP based on the count value of the encoder (EN3a, EN3b).

[0066] Normally, by applying a predetermined tension in the elongation direction to the substrate (P) using tension adjustment rollers (RT1, RT2), the substrate (P) is pressed against the rotating drum (DR) and conveyed along with the rotation of the rotating drum (DR). However, there is a possibility that the substrate (P) may slip against the rotating drum (DR) due to reasons such as the rotation speed Vp of the rotating drum (DR) being too fast, or the tension applied to the substrate (P) by the tension adjustment rollers (RT1, RT2) becoming too low or too high. [This is a case of [unclear]

[0067] [Unclear] Accordingly, the amount of slip on the substrate (P) can be calculated based on the count value from the encoders (EN1a, EN1b) at the moment the alignment mark (MKmA) is captured by the alignment microscope (AM1m), and the count value from the encoders (EN4a, EN4b) at the moment the alignment mark (MKmA) is captured by the alignment microscope (AM2m). In this way, the amount of slip on the substrate (P) can be measured by additionally installing the alignment microscope (AM2m) and the encoders (EN4a, EN4b).

[0068] Next, the optical configuration of the scanning units (Un(U1~U6)) will be described with reference to FIG. 5. Also, since each scanning unit (Un(U1~U6)) has the same configuration, only the scanning unit (U1) will be described, and the description of the other scanning units (Un) will be omitted. Also, in FIG. 5, the direction parallel to the irradiation center axis (Len(Le1)) is called the Zt direction, and the direction in which the substrate (P) moves from the processing unit (PR2) through the exposure unit (EX) toward the processing unit (PR3) on a plane orthogonal to the Zt direction is called the Xt direction, and the direction orthogonal to the Xt direction on a plane orthogonal to the Zt direction is called the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 5 are three-dimensional coordinates obtained by rotating the three-dimensional coordinates of X, Y, and Z in FIG. 2 around the Y-axis so that the Z-axis direction becomes parallel to the irradiation center axis (Len(Le1)).

[0069] As shown in FIG. 5, within the scanning unit (U1), along the direction of travel of the beam (LB1) from the incident position of the beam (LB1) to the irradiated surface (substrate (P)), a reflective mirror (M10), a beam expander (BE), a reflective mirror (M11), a polarizing beam splitter (BS1), a reflective mirror (M12), a shift optical element (parallel plate) (SR), a deflection adjustment optical element (prism) (DP), a field aperture (FA), a reflective mirror (M13), a λ / 4 wave plate (QW), a cylindrical lens (CYa), a reflective mirror (M14), a polygonal mirror (PM), an fθ lens (FT), a reflective mirror (M15), and a cylindrical lens (CYb) are provided. Additionally, within the scanning unit (U1), an origin sensor (origin detector) (OP1) for detecting the timing at which the scanning unit (U1) can start drawing is provided, as well as an optical lens system (G10) and a light detector (DT) for detecting reflected light from the surface to be scanned (substrate (P)) through a polarizing beam splitter (BS1).

[0070] A beam (LB1) incident on a scanning unit (U1) travels in the direction of -Zt and is incident on a reflecting mirror (M10) tilted at 45° with respect to the XtYt plane. The axis of the beam (LB1) incident on the scanning unit (U1) is incident on the reflecting mirror (M10) such that it is coaxial with the scanning center axis (Le1). The reflecting mirror (M10) functions as an incident optical element that incidents the beam (LB1) on the scanning unit (U1), and reflects the incident beam (LB1) in the direction of -Xt along an optical axis (AXa) set parallel to the Xt axis toward a reflecting mirror (M11) located at -Xt from the reflecting mirror (M10). Therefore, the optical axis (AXa) is orthogonal to the scanning center axis (Le1) within a plane parallel to the XtZt plane. The beam (LB1) reflected from the reflecting mirror (M10) passes through a beam expander (BE) positioned along the optical axis (AXa) and is incident on the reflecting mirror (M11). The beam expander (BE) expands the diameter of the transmitted beam (LB1). The beam expander (BE) has a condensing lens (Be1) and a collimator lens (Be2) that makes the beam (LB1), which diverges after being converged by the condensing lens (Be1), into parallel light.

[0071] The reflecting mirror (M11) is positioned at a 45° angle with respect to the YtZt plane and reflects the incident beam (LB1) (optical axis (AXa)) in the -Yt direction toward the polarizing beam splitter (BS1). The polarization separation surface of the polarizing beam splitter (BS1), which is installed away from the reflecting mirror (M11) in the -Yt direction, is positioned at a 45° angle with respect to the YtZt plane and reflects the P-polarized beam and transmits the linearly polarized beam (S-polarized) polarized in a direction orthogonal to the P-polarized beam. Since the beam (LB1) incident on the scanning unit (U1) is a P-polarized beam, the polarizing beam splitter (BS1) reflects the beam (LB1) from the reflecting mirror (M11) in the -Xt direction and guides it toward the reflecting mirror (M12).

[0072] The reflecting mirror (M12) is positioned at an angle of 45° with respect to the XtYt plane and reflects the incident beam (LB1) in the -Zt direction toward the reflecting mirror (M13) located at the -Zt direction from the reflecting mirror (M12). The beam (LB1) reflected from the reflecting mirror (M12) passes through a shift optical element (SR), a deflection adjustment optical element (DP), and a field aperture (FA) along an optical axis (AXc) parallel to the Zt axis and is incident on the reflecting mirror (M13). The shift optical element (SR) is located in a plane (XtYt plane) orthogonal to the direction of travel (optical axis (AXc)) of the beam (LB1) and adjusts the center position within the cross-section of the beam (LB1) in two dimensions. The shift optical element (SR) is composed of two quartz parallel plates (Sr1, Sr2) arranged along the optical axis (AXc), and the parallel plate (Sr1) can be inclined around the Xt axis, and the parallel plate (Sr2) can be inclined around the Yt axis. By inclining the parallel plates (Sr1, Sr2) around the Xt axis and the Yt axis, respectively, the position of the center of the beam (LB1) is shifted by a small amount in two dimensions in the XtYt plane, which is orthogonal to the direction of travel of the beam (LB1). The parallel plates (Sr1, Sr2) are driven by an actuator (driving unit) not shown under the control of a control device (16).

[0073] The deflection adjustment optical member (DP) finely adjusts the tilt of the beam (LB1) with respect to the optical axis (AXc) that has been reflected from the reflecting mirror (M12) and passed through the shift optical member (SR). The deflection adjustment optical member (DP) is composed of two wedge-shaped prisms (Dp1, Dp2) arranged along the optical axis (AXc), and each of the prisms (Dp1, Dp2) is independently provided to rotate 360° around the optical axis (AXc). By adjusting the rotation angle positions of the two prisms (Dp1, Dp2), parallelism between the axis of the beam (LB1) reaching the reflecting mirror (M13) and the optical axis (AXc), or parallelism between the axis of the beam (LB1) reaching the irradiated surface of the substrate (P) and the irradiation center axis (Le1) is achieved. Additionally, the beam (LB1) after being deflected by two prisms (Dp1, Dp2) may be horizontally shifted within a plane parallel to the cross-section of the beam (LB1), and the horizontal shift can be restored to its original state by the preceding shift optical member (SR). These prisms (Dp1, Dp2) are driven by an actuator (driver) not shown under the control of a control device (16).

[0074] In this way, the beam (LB1) passing through the shift optical element (SR) and the deflection adjustment optical element (DP) passes through the circular aperture of the field aperture (FA) and reaches the reflective mirror (M13). The circular aperture of the field aperture (FA) is an aperture that cuts the lower portion of the intensity distribution within the cross-section of the beam (LB1) expanded by the beam expander (BE). If the circular aperture of the field aperture (FA) is made into a variable iris aperture with adjustable aperture, the intensity (luminance) of the spot light SP can be adjusted.

[0075] A reflecting mirror (M13) is positioned at an angle of 45° with respect to the XtYt plane and reflects an incident beam (LB1) toward a reflecting mirror (M14) in the +Xt direction. The beam (LB1) reflected from the reflecting mirror (M13) is incident on the reflecting mirror (M14) through a λ / 4 wave plate (QW) and a cylindrical lens (CYa). The reflecting mirror (M14) reflects the incident beam (LB1) toward a polygon mirror (rotating multi-faceted mirror, main deflection member) (PM). The polygon mirror (PM) reflects the incident beam (LB1) toward an fθ lens (FT) having an optical axis (AXf) parallel to the Xt axis in the +Xt direction. The polygon mirror (PM) deflects (reflects) the incident beam (LB1) in one dimension within a plane parallel to the XtYt plane in order to scan the spot light SP of the beam (LB1) on the irradiated surface of the substrate (P). Specifically, the polygon mirror (PM) has a rotation axis AXp extending in the Zt axis direction and a plurality of reflective surfaces (RP) formed around the rotation axis AXp (in this embodiment, the number of reflective surfaces (RP) Np is set to 8). By rotating this polygon mirror (PM) around the rotation axis AXp in a predetermined rotation direction, the reflection angle of the pulse-shaped beam (LB1) irradiated on the reflective surfaces (RP) can be continuously changed. By doing so, the reflection direction of the beam (LB1) is deflected by one reflective surface (RP), and the spot light SP of the beam (LB1) irradiated on the irradiated surface of the substrate (P) can be scanned along the main irradiation direction (the width direction of the substrate (P), the Yt direction).

[0076] That is, the spot light SP of the beam (LB1) can be scanned along the irradiation direction by one reflective surface (RP). For this reason, the number of drawing lines (SL1) through which spot light SP is scanned on the irradiated surface of the substrate (P) in one rotation of the polygon mirror (PM) is at most 8, which is equal to the number of reflective surfaces (RP). The polygon mirror (PM) rotates at a constant speed by a rotational driving source (e.g., a motor or a reduction gear mechanism, etc.) (RM) under the control of the control device (16). As previously explained, the effective length of the drawing line (SL1) (e.g., 30 mm) is set to be less than or equal to the maximum scanning length (e.g., 31 mm) through which spot light SP can be scanned by this polygon mirror (PM), and in the initial setting (design), the center point of the drawing line (SL1) (the point through which the irradiation center axis (Le1) passes) is set at the center of the maximum scanning length.

[0077] The cylindrical lens (CYa) converges the incident beam (LB1) onto the reflective surface (RP) of the polygon mirror (PM) with respect to the non-scanning direction (Zt direction) orthogonal to the primary scanning direction (rotation direction) of the polygon mirror (PM). That is, the cylindrical lens (CYa) converges the beam (LB1) onto the reflective surface (RP) into a slit shape (long elliptical shape) extending in a direction parallel to the XtYt plane. By using the cylindrical lens (CYa), in which the generatrix is ​​parallel to the Yt direction, and the cylindrical lens (CYb) described later, the effect can be suppressed even if the reflective surface (RP) is tilted with respect to the Zt direction (the tilt of the reflective surface (RP) with respect to the normal of the XtYt plane). For example, the irradiation position of the beam (LB1) (drawing line (SL1)) irradiated on the irradiated surface of the substrate (P) can be suppressed from deviating in the Xt direction due to a slight tilt error at each reflective surface (RP) of the polygon mirror (PM).

[0078] An fθ lens (scanning lens system) (FT) having an optical axis (AXf) extending in the direction of the Xt axis is a telecentric scanning lens that projects a beam (LB1) reflected by a polygon mirror (PM) onto a reflecting mirror (M15) so as to be parallel to the optical axis (AXf) in the XtYt plane. The angle of incidence θ of the beam (LB1) to the fθ lens (FT) changes according to the rotation angle (θ / 2) of the polygon mirror (PM). The fθ lens (FT) projects the beam (LB1) through the reflecting mirror (M15) and the cylindrical lens (CYb) to an image height position on the illuminated surface of the substrate (P) that is proportional to the angle of incidence θ. If the focal length is fo and the image height position is y, the fθ lens (FT) is designed to satisfy the relationship y = fo × θ (distortion aberration). Therefore, by this fθ lens (FT), it becomes possible to accurately scan the beam (LB1) in the Yt direction (Y direction) at a constant speed. When the angle of incidence θ to the fθ lens (FT) is 0 degrees, the beam (LB1) incident on the fθ lens (FT) travels along the optical axis (AXf).

[0079] The reflecting mirror (M15) reflects the beam (LB1) from the fθ lens (FT) in the -Zt direction toward the substrate (P) through the cylindrical lens (CYb). By the fθ lens (FT) and the cylindrical lens (CYb), whose generatrix is ​​parallel to the Yt direction, the beam (LB1) projected onto the substrate (P) converges into a minute spot light SP with a diameter of several μm (e.g., 3 μm) on the irradiated surface of the substrate (P). In addition, the spot light SP projected onto the irradiated surface of the substrate (P) is one-dimensionally scanned by the polygon mirror (PM) by the drawing line (SL1) extending in the Yt direction. Furthermore, the optical axis (AXf) of the fθ lens (FT) and the irradiation center axis (Le1) lie on the same plane, and that plane is parallel to the XtZt plane. Accordingly, the beam (LB1) traveling along the optical axis (AXf) is reflected in the -Zt direction by the reflecting mirror (M15) and projected onto the substrate (P) coaxial with the irradiation center axis (Le1). In the first embodiment, at least the fθ lens (FT) functions as a projection optical system that projects the beam (LB1), deflected by the polygon mirror (PM), onto the irradiated surface of the substrate (P). In addition, at least the reflecting member (reflecting mirror (M11~M15)) and the polarizing beam splitter (BS1) function as an optical path deflection member that bends the optical path of the beam (LB1) from the reflecting mirror (M10) to the substrate (P). Through this optical path deflection member, the incident axis of the beam (LB1) incident on the reflecting mirror (M10) and the irradiation center axis (Le1) can be made approximately the same axis. Regarding the XtZt plane, the beam (LB1) passing through the scanning unit (U1) passes through an approximately U-shaped or U-shaped optical path, then proceeds in the -Zt direction and is projected onto the substrate (P).

[0080] In this way, while the substrate (P) is being transported in the X direction, the spot light SP of the beam (LBn (LB1~LB6)) can be scanned in one dimension in the main irradiation direction (Y direction) by each scanning unit (Un (U1~U6)), thereby allowing the spot light SP to be scanned in two dimensions relative to the irradiated surface of the substrate (P).

[0081] In addition, as an example, when the effective length of the drawing line (SLn(SL1~SL6)) is set to 30 mm and spot light SP with an effective size φ of 3 μm is overlapped by 7 / 8, i.e., 2.625 μm (= 3 × 7 / 8) μm, and the spot light SP is irradiated along the drawing line (SLn(SL1~SL6)), the spot light SP is irradiated at intervals of 0.375 μm. Therefore, the number of spot light SP irradiated in one scan is 80,000 (= 30 [mm] / 0.375 [μm]). In addition, if the transfer speed (transport speed) Vt of the substrate (P) in the auxiliary scanning direction is set to 0.6048 mm / sec and the spot light SP is scanned at intervals of 0.375 μm in the auxiliary scanning direction as well, the time difference Tpx between the start of the first scan (initial scanning) along the drawing line (SLn) and the start of the next scan is approximately 620 μsec (= 0.375 [μm] / 0.6048 [mm / sec]). This time difference Tpx is the time it takes for the polygon mirror (PM) of the 8 reflective surfaces (RP) to rotate by one surface (45 degrees = 360 degrees / 8). In this case, since the time for one rotation of the polygon mirror (PM) needs to be set to approximately 4.96 msec (= 8 × 620 [μsec]), the rotation speed Vp of the polygon mirror (PM) is set to approximately 201.613 rotations per second (= 1 / 4.96 [msec]), that is, approximately 12096.8 rpm.

[0082] Meanwhile, the maximum incident angle (corresponding to the maximum scanning length of the spot light SP) at which the beam (LB1) reflected from one reflective surface (RP) of the polygon mirror (PM) effectively enters the fθ lens (FT) is almost determined by the focal length and maximum scanning length of the fθ lens (FT). For example, in the case of a polygon mirror (PM) with eight reflective surfaces (RP), the ratio of the rotation angle α that contributes to actual scanning (scanning efficiency) to the rotation angle of 45 degrees per one reflective surface (RP) is expressed as α / 45 degrees. In the first embodiment, the rotation angle α that contributes to actual scanning is set to 15 degrees, so the scanning efficiency becomes 1 / 3 (= 15 degrees / 45 degrees), and the maximum incident angle of the fθ lens (FT) becomes 30 degrees (±15 degrees centered on the optical axis (AXf). Therefore, the time Ts required to scan the spot light SP for the maximum scanning length (e.g., 31 mm) of the drawing line (SLn) is given by Ts = Tpx × scanning efficiency, and in the case of the above numerical example, the time Ts is approximately 206.666···μsec (=620〔μsec〕 / 3). Since the effective scanning length of the drawing line (SLn(SL1~SL6)) in the first embodiment is set to 30 mm, the scanning time Tsp for one scan of the spot light SP along this drawing line (SLn) is approximately 200 μsec (=206.666···〔μsec〕×30〔mm〕 / 31〔mm〕). Therefore, since it is necessary to irradiate 80,000 spot lights SP (pulsed light) during this time Tsp, the emission frequency (oscillation frequency) Fa of the beam (LB) from the light source device (LS(LSa, LSb)) becomes Fa ≈ 80,000 times / 200 μs ec = 400 MHz.

[0083] The origin sensor (OP1) shown in FIG. 5 generates an origin signal SZ1 when the rotational position of the reflective surface (RP) of the polygon mirror (PM) reaches a predetermined position where scanning of the spot light SP by the reflective surface (RP) can be initiated. In other words, the origin sensor (OP1) generates an origin signal SZ1 when the angle of the reflective surface (RP) that will now perform scanning of the spot light SP reaches a predetermined angle position. Since the polygon mirror (PM) has eight reflective surfaces (RP), the origin sensor (OP1) outputs the origin signal SZ1 eight times during the period in which the polygon mirror (PM) rotates once. The origin signal SZ1 generated by this origin sensor (OP1) is sent to the control device (16). After the origin sensor (OP1) generates the origin signal SZ1, scanning along the drawing line (SL1) of the spot light SP is initiated after a delay time Td1 has elapsed. That is, this origin signal SZ1 is information indicating the drawing start timing (scan start timing) of the spot light SP by the scanning unit (U1).

[0084] The origin sensor (OP1) has a beam transmitting system (opa) that emits a laser beam (Bga) of a non-photosensitive wavelength band onto a reflective surface (RP) with respect to a photosensitive functional layer of a substrate (P), and a beam receiving system (opb) that receives a reflected beam (Bgb) of the laser beam (Bga) reflected from the reflective surface (RP) and generates an origin signal SZ1. The beam transmitting system (opa), although not illustrated, has a light source that emits a laser beam (Bga) and an optical member (such as a reflective mirror or lens) that projects the laser beam (Bga) emitted by the light source onto the reflective surface (RP). The beam receiving system (opb), although not illustrated, has a light receiving unit including a photoelectric conversion element that receives the received reflected beam (Bgb) and converts it into an electrical signal, and an optical member (such as a reflective mirror or lens) that guides the reflected beam (Bgb) reflected from the reflective surface (RP) to the light receiving unit. The beam transmitting system (opa) and the beam receiving system (opb) are positioned so that when the rotational position of the polygon mirror (PM) reaches a predetermined position immediately before the scanning of the spot light SP by the reflective surface (RP) begins, the beam receiving system (opb) can receive the reflected beam (Bgb) of the laser beam (Bga) emitted by the beam transmitting system (opa). Additionally, the origin sensors (OPn) provided in the scanning units (U2~U6) are denoted as OP2~OP6, and the origin signals SZn generated from the origin sensors (OP2~OP6) are denoted as SZ2~SZ6. The control device (16) manages which scanning unit (Un) will now perform the scanning of the spot light SP based on these origin signals SZn (SZ1~SZ6). In addition, there are cases where the delay time Tdn until the scanning of spot light SP according to the drawing lines SL2~SL6 by the scanning unit (U2~U6) is started after the origin signal SZ2~SZ6 is generated is represented as Td2~Td6.

[0085] The photodetector (DT) shown in FIG. 5 has a photoelectric conversion element that converts incident light into photoelectric. A predetermined reference pattern is formed on the surface of a rotating drum (DR). The portion of the rotating drum (DR) where the reference pattern is formed is made of a material with a low reflectance (10 to 50%) for the wavelength band of the beam (LB1), and other portions of the rotating drum (DR) where the reference pattern is not formed are made of a material with a reflectance of 10% or less or a material that absorbs light. Accordingly, when the substrate (P) is not wound (or is in a state through the transparent part of the substrate (P)), a spot light SP of a beam (LB1) from a scanning unit (U1) is irradiated onto an area where a reference pattern of a rotating drum (DR) is formed, the reflected light passes through a cylindrical lens (CYb), a reflective mirror (M15), an fθ lens (FT), a polygon mirror (PM), a reflective mirror (M14), a cylindrical lens (CYa), a λ / 4 wave plate (QW), a reflective mirror (M13), a field aperture (FA), a deflection adjustment optical member (DP), a shift optical member (SR), and a reflective mirror (M12) and is incident on a polarizing beam splitter (BS1). Here, a λ / 4 wave plate (QW) is provided between the polarizing beam splitter (BS1) and the substrate (P), specifically between the reflective mirror (M13) and the cylindrical lens (CYa). By this, the beam (LB1) irradiated onto the substrate (P) is converted from P-polarized to circularly polarized beam (LB1) by this λ / 4 wavelength plate (QW), and the reflected light incident from the substrate (P) to the polarization beam splitter (BS1) is converted from circularly polarized to S-polarized by this λ / 4 wavelength plate (QW). Therefore, the reflected light from the substrate (P) passes through the polarization beam splitter (BS1) and is incident on the photodetector (DT) through the optical lens system (G10).

[0086] At this time, while a pulse-shaped beam (LB1) is continuously incident on the scanning unit (U1), the rotating drum (DR) is rotated so that the scanning unit (U1) scans the spot light SP, thereby irradiating the outer surface of the rotating drum (DR) with the spot light SP in two dimensions. Accordingly, an image of the reference pattern formed on the rotating drum (DR) can be acquired by the photodetector (DT).

[0087] Specifically, the change in intensity of the photoelectric signal output from the photodetector (DT) is digitally sampled in response to the clock signal LTC (generated by the light source device (LS)) for pulse emission of the beam (LB1) (spot light SP) to acquire one-dimensional image data in the Yt direction. In addition, in response to the measurement value of the encoder (EN2a, EN2b) that measures the rotation angle position of the rotating drum (DR) on the drawing line (SL1), one-dimensional image data in the Yt direction is arranged in the Xt direction at a certain distance in the sub-scanning direction (for example, 1 / 8 of the size φ of the spot light SP) to acquire two-dimensional image information of the surface of the rotating drum (DR). Based on the two-dimensional image information of the reference pattern of the rotating drum (DR) acquired in this way, the control device (16) measures the inclination of the drawing line (SL1) of the scanning unit (U1). The inclination of this drawing line (SL1) may be a relative inclination between each scanning unit (Un(U1~U6)) or an inclination with respect to the center axis (AXo) of the rotating drum (DR) (absolute inclination). It goes without saying that the inclination of each drawing line SL2~SL6 can also be measured in the same way.

[0088] Additionally, a plurality of scanning units (Un(U1~U6)) are maintained in a main body frame not illustrated so that each of the plurality of scanning units (Un(U1~U6)) can rotate around the central axis of irradiation (Len(Le1~Le6)). When each scanning unit (Un(U1~U6)) rotates around the central axis of irradiation (Len(Le1~Le6)), each drawing line (SLn(SL1~SL6)) also rotates around the central axis of irradiation (Len(Le1~Le6)) on the irradiated surface of the substrate (P). Consequently, each drawing line (SLn(SL1~SL6)) becomes inclined with respect to the Y direction. Even when each scanning unit (Un(U1~U6)) rotates around the irradiation center axis (Len(Le1~Le6)), the relative positional relationship between the beam (LBn(LB1~LB6)) passing through each scanning unit (Un(U1~U6)) and the optical member within each scanning unit (Un(U1~U6)) does not change. Therefore, each scanning unit (Un(U1~U6)) can scan spot light SP along the drawing line (SLn(SL1~SL6)) rotated on the irradiated surface of the substrate (P). This rotation of each scanning unit (Un(U1~U6)) around the irradiation center axis (Len(Le1~Le6)) is performed by an actuator not shown under the control of the control device (16).

[0089] Therefore, the control device (16) can maintain the parallel state of multiple drawing lines (SLn(SL1~SL6)) by rotating the scanning unit (Un(U1~U6)) around the irradiation center axis (Len(Le1~Le6)) according to the slope of each drawing line (SLn) measured. In addition, if the substrate (P) or the exposure area W is distorted (deformed) based on the position of the alignment mark (MKm) detected using the alignment microscope (AM1m, AM2m), it is necessary to distort the drawing pattern accordingly. Therefore, when the control device (16) determines that the substrate (P) or the exposure area W is distorted (deformed), it rotates the scanning unit (Un (U1~U6)) around the central axis of the scan (Len (Le1~Le6)) to slightly tilt each drawing line (SLn) in the Y direction according to the distortion (deformation) of the substrate (P) or the exposure area W. At that time, in this embodiment, as described later, it is possible to control the pattern drawn along each drawing line (SLn) according to a specified magnification (e.g., on the order of ppm) or to control each drawing line (SLn) individually to slightly shift in the sub-scanning direction (the Xt direction in FIG. 5).

[0090] In addition, even if the irradiation center axis (Len) of the scanning unit (Un) and the axis on which the scanning unit (Un) actually rotates (rotation center axis) do not perfectly coincide, it is sufficient if both are the same axis within a predetermined allowable range. This predetermined allowable range is set so that the difference between the actual drawing start point (or drawing end point) of the drawing line (SLn) when the scanning unit (Un) is rotated by an angle θsm and the drawing start point (or drawing end point) of the design drawing line (SLn) when the scanning unit (Un) is rotated by a predetermined angle θsm, assuming that the irradiation center axis (Len) and the rotation center axis perfectly coincide, is within a predetermined distance (e.g., the size φ of the spot light SP) with respect to the main irradiation direction of the spot light SP. In addition, even if the optical axis of the beam (LBn) actually incident on the scanning unit (Un) does not perfectly coincide with the rotational center axis of the scanning unit (Un), it is sufficient if it is the same axis within the aforementioned predetermined allowable range.

[0091] FIG. 6 is a configuration diagram of a beam switching unit (BDU). The beam switching unit (BDU) has a plurality of selective optical elements (AOMn(AOM1~AOM6)), a plurality of focusing lenses (CD1~CD6), a plurality of reflective mirrors (M1~M14), a plurality of unit-side incident mirrors (IM1~IM6), a plurality of collimator lenses (CL1~CL6), and absorbers (TR1, TR2). The selective optical elements (AOMn(AOM1~AOM6)) are transmissive to beams (LB) (LBa, LBb) and are acousto-optic modulators (AOM) driven by ultrasonic signals. These optical components (selective optical elements (AOM1~AOM6), condensing lenses (CD1~CD6), reflective mirrors (M1~M14), unit-side incident mirrors (IM1~IM6), collimator lenses (CL1~CL6), and absorbers (TR1, TR2)) are supported by a plate-shaped support member (IUB). This support member (IUB) supports these optical components from above (+Z direction) the plurality of scanning units (Un(U1~U6)) and from below (-Z direction). Accordingly, the support member (IUB) also has the function of insulating the space between the selective optical elements (AOMn(AOM1~AOM6)) that serve as heat sources and the plurality of scanning units (Un(U1~U6)).

[0092] The beam (LBa) from the light source device (LSa) is guided to the absorber (TR1) by having its optical path bent into a wavy shape by the reflecting mirrors (M1 to M6). Likewise, the beam (LBb) from the light source device (LSb) is also guided to the absorber (TR2) by having its optical path bent into a wavy shape by the reflecting mirrors (M7 to M14). Below, the case where all the selection optical elements (AOMn (AOM1 to AOM6)) are in the off state (a state where no ultrasonic signal is applied) is described above.

[0093] A beam (LBa) (parallel light beam) from a light source device (LSa) travels in the +Y direction parallel to the Y-axis, passes through a condensing lens (CD1), and is incident on a reflecting mirror (M1). The beam (LBa) reflected in the -X direction from the reflecting mirror (M1) passes straight through a first selection optical element (AOM1) placed at the focal position (beam waist position) of the condensing lens (CD1), becomes a parallel light beam again by a collimator lens (CL1), and reaches a reflecting mirror (M2). The beam (LBa) reflected in the +Y direction from the reflecting mirror (M2) passes through a condensing lens (CD2) and is reflected in the +X direction from a reflecting mirror (M3).

[0094] The beam (LBa) reflected in the +X direction from the reflecting mirror (M3) passes straight through the second selection optical element (AOM2) positioned at the focal position (beam waist position) of the condensing lens (CD2), becomes a parallel beam again by the collimator lens (CL2), and reaches the reflecting mirror (M4). The beam (LBa) reflected in the +Y direction from the reflecting mirror (M4) passes through the condensing lens (CD3) and is reflected in the -X direction from the reflecting mirror (M5). The beam (LBa) reflected in the -X direction from the reflecting mirror (M5) passes straight through the third selection optical element (AOM3) positioned at the focal position (beam waist position) of the condensing lens (CD3), becomes a parallel beam again by the collimator lens (CL3), and reaches the reflecting mirror (M6). The beam (LBa) reflected in the +Y direction from the reflecting mirror (M6) is incident on the absorber (TR1). This absorber (TR1) is an optical trap that absorbs the beam (LBa) to suppress leakage of the beam (LBa) to the outside.

[0095] A beam (LBb) (parallel light beam) from a light source device (LSb) travels in the +Y direction parallel to the Y-axis and is incident on a reflecting mirror (M13). The beam (LBb) reflected in the +X direction from the reflecting mirror (M13) is reflected in the +Y direction from the reflecting mirror (M14). The beam (LBb) reflected in the +Y direction from the reflecting mirror (M14) passes through a condensing lens (CD4) and is then reflected in the +X direction from the reflecting mirror (M7). The beam (LBb) reflected in the +X direction from the reflecting mirror (M7) passes straight through a fourth selection optical element (AOM4) placed at the focal position (beam waist position) of the condensing lens (CD4), becomes a parallel light beam again by the collimator lens (CL4), and reaches the reflecting mirror (M8). The beam (LBb) reflected in the +Y direction from the reflecting mirror (M8) is reflected in the -X direction from the reflecting mirror (M9) after passing through the condensing lens (CD5).

[0096] The beam (LBb) reflected in the -X direction from the reflecting mirror (M9) passes straight through the fifth selection optical element (AOM5) positioned at the focal position (beam waist position) of the condensing lens (CD5), becomes a parallel beam again by the collimator lens (CL5), and reaches the reflecting mirror (M10). The beam (LBb) reflected in the +Y direction from the reflecting mirror (M10) passes through the condensing lens (CD6) and is reflected in the +X direction from the reflecting mirror (M11). The beam (LBb) reflected in the +X direction from the reflecting mirror (M11) passes straight through the sixth selection optical element (AOM6) positioned at the focal position (beam waist position) of the condensing lens (CD6), becomes a parallel beam again by the collimator lens (CL6), and reaches the reflecting mirror (M12). The beam (LBb) reflected in the -Y direction from the reflecting mirror (M12) is incident on the absorber (TR2). This absorber (TR2) is an optical trap that absorbs the beam (LBb) to suppress leakage of the beam (LBb) to the outside.

[0097] As described above, the selection optical elements (AOM1 to AOM3) are arranged in series along the direction of travel of the beam (LBa) to sequentially transmit the beam (LBa) from the light source device (LSa). Additionally, the selection optical elements (AOM1 to AOM3) are arranged such that a beam waist of the beam (LBa) is formed inside each selection optical element (AOM1 to AOM3) by means of a focusing lens (CD1 to CD3) and a collimator lens (CL1 to CL3). By doing so, the diameter of the beam (LBa) incident on the selection optical elements (acoustic-optic modulation elements) (AOM1 to AOM3) is reduced, thereby increasing diffraction efficiency and responsiveness. Likewise, the selection optical elements (AOM4 to AOM6) are arranged in series along the direction of travel of the beam (LBb) to sequentially transmit the beam (LBb) from the light source device (LSb). In addition, the selection optical elements (AOM4~AOM6) are arranged such that a beam waist of the beam (LBb) is formed inside each selection optical element (AOM4~AOM6) by means of a focusing lens (CD4~CD6) and a collimator lens (CL4~CL6). By doing so, the diameter of the beam (LBb) incident on the selection optical elements (acoustic-optic modulation elements) (AOM4~AOM6) is reduced, thereby increasing the diffraction efficiency and improving responsiveness.

[0098] Each selective optical element (AOMn(AOM1~AOM6)) generates a first-order diffracted light as an ejected beam (beam (LBn)) by diffracting the incident beam (zero-order light) LB (LBa, LBb) at a diffraction angle according to the high frequency when an ultrasonic signal (high-frequency signal) is applied. In the first embodiment, the beam (LBn) ejected as a first-order diffracted light from each of the plurality of selective optical elements (AOMn(AOM1~AOM6)) is referred to as the beam (LB1~LB6), and each selective optical element (AOMn(AOM1~AOM6)) is treated as having the function of deflecting the optical path of the beam (LB) (LBa, LBb) from the light source device (LSa, LSb). However, since the generation efficiency of the first-order diffracted light in the actual acousto-optic modulation element is about 80% of that of the zero-order light, the beams (LBn(LB1~LB6)) deflected from each of the selector optical elements (AOMn(AOM1~AOM6)) are lower than the intensity of the original beam (LB) (LBa, LBb). Also, when any one of the selector optical elements (AOMn(AOM1~AOM6)) is turned on, about 20% of the zero-order light that travels straight without diffracting remains, but it is finally absorbed by the absorbers (TR1, TR2).

[0099] As shown in FIG. 6, each of the plurality of selection optical elements (AOMn(AOM1~AOM6)) is installed to deflect a beam (LBn(LB1~LB6)), which is a deflected first-order diffracted light, in the -Z direction with respect to the incident beam (LB)(LBa, LBb). The beam (LBn(LB1~LB6)) that is deflected and emitted from each of the selection optical elements (AOMn(AOM1~AOM6)) is projected onto a unit-side incident mirror (IM1~IM6) provided at a position at a predetermined distance from each of the selection optical elements (AOMn(AOM1~AOM6)), and is reflected therein in the -Z direction to be coaxial with the irradiation center axis (Le1~Le6). The beams (LB1~LB6) reflected from the unit-side incident mirrors (IM1~IM6) (hereinafter also simply referred to as mirrors (IM1~IM6)) pass through each of the openings (TH1~TH6) formed in the support member (IUB) and are incident on each of the scanning units (Un(U1~U6)) along the central axis of irradiation (Le1~Le6).

[0100] In addition, since the selective optical element (AOMn) is a diffraction grating that causes a periodic change in refractive index in a predetermined direction within a transmission member by ultrasound, when the incident beam (LB) (LBa, LBb) is linearly polarized (P-polarization or S-polarization), the polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of the first-order diffracted light is maximized. As shown in FIG. 6, when each selective optical element (AOMn) is installed to diffractically deflect the incident beam (LB) (LBa, LBs) in the -Z direction, the periodic direction of the diffraction grating generated within the selective optical element (AOMn) is also in the -Z direction, so the polarization direction of the beam (LB) from the light source device (LS(LSa, LSb)) is set (adjusted) to match it.

[0101] The configuration, function, and operation of each selection optical element (AOMn (AOM1~AOM6)) may be identical to one another. Multiple selection optical elements (AOMn (AOM1~AOM6)) turn on / off the generation of diffracted light that diffracts the incident beam (LB) (LBa, LBb) depending on the on / off of the driving signal (high frequency signal) from the control device (16). For example, when the selection optical element (AOM1) is in the off state because the driving signal (high frequency signal) from the control device (16) is not applied, it transmits the beam (LBa) from the incident light source device (LSa) without diffracting it. Therefore, the beam (LBa) that has passed through the selection optical element (AOM1) passes through the collimator lens (CL1) and is incident on the reflection mirror (M2). Meanwhile, when a driving signal (high frequency signal) from the control device (16) is applied to the selection optical element (AOM1), it diffracts the incident beam (LBa) toward the mirror (IM1). That is, the selection optical element (AOM1) switches by this driving signal. The mirror (IM1) selects the beam (LB1), which is the first-order diffracted light diffracted by the selection optical element (AOM1), and reflects it toward the scanning unit (U1). The beam (LB1) reflected from the selection mirror (IM1) passes through the opening (TH1) of the support member (IUB) and is incident on the scanning unit (U1) along the irradiation center axis (Le1). Accordingly, the mirror (IM1) reflects the incident beam (LB1) so that the optical axis of the reflected beam (LB1) is coaxial with the irradiation center axis (Le1). Also, when the selective optical element (AOM1) is turned on, the zero-order light (intensity of about 20% of the incident beam) of the beam (LB) that passes straight through the selective optical element (AOM1) passes through the subsequent collimator lenses (CL1~CL3), condensing lenses (CD2~CD3), reflective mirrors (M2~M6), and selective optical elements (AOM2~AOM3) and reaches the absorber (TR1).

[0102] Likewise, when the selection optical element (AOM2, AOM3) is off because the driving signal (high frequency signal) from the control device (16) is not applied, it transmits the incident beam (LBa) (zero-order light) to the collimator lens (CL2, CL3) side (reflective mirror (M4, M6) side) without diffracting it. On the other hand, when the selection optical element (AOM2, AOM3) is in a state where the driving signal from the control device (16) is applied, it directs the beam (LB2) and LB3, which are the first-order diffracted light of the incident beam (LBa), toward the mirror (IM2, IM3). This mirror (IM2, IM3) reflects the beam (LB2) and LB3 diffracted by the selection optical element (AOM2, AOM3) toward the scanning unit (U2, U3). The beams (LB2) and LB3 reflected from the mirrors (IM2, IM3) pass through the openings (TH2, TH3) of the support member (IUB), become coaxial with the central axis of the irradiation (Le2, Le3), and enter the scanning unit (U2, U3).

[0103] In this way, the control device (16) switches one of the selectable optical elements (AOM1 to AOM3) by turning on / off (high / low) the driving signal (high frequency signal) to be applied to each of the selectable optical elements (AOM1 to AOM3), and switches whether the beam (LBa) is directed toward the subsequent selectable optical elements (AOM2, AOM3) or absorber (TR1), or whether one of the deflected beams (LB1 to LB3) is directed toward the corresponding scanning unit (U1 to U3).

[0104] Additionally, when the selection optical element (AOM4) is in an off state because the driving signal (high frequency signal) from the control device (16) is not applied, it transmits the beam (LBb) from the incident light source device (LSb) to the collimator lens (CL4) side (reflective mirror (M8) side) without diffracting it. Also, when the selection optical element (AOM4) is in a state where the driving signal from the control device (16) is applied, it directs the beam (LB4), which is the first diffracted light of the incident beam (LBb), toward the mirror (IM4). This mirror (IM4) reflects the beam (LB4) diffracted by the selection optical element (AOM4) toward the scanning unit (U4). The beam (LB4) reflected from the mirror (IM4) becomes coaxial with the irradiation center axis (Le4), passes through the opening (TH4) of the support member (IUB), and is incident on the scanning unit (U4).

[0105] Likewise, when the selection optical element (AOM5, AOM6) is off because the driving signal (high frequency signal) from the control device (16) is not applied, it transmits the incident beam (LBb) to the collimator lens (CL5, CL6) side (the reflection mirror (M10, M12) side) without diffracting it. On the other hand, when the selection optical element (AOM5, AOM6) is in a state where the driving signal from the control device (16) is applied, it directs the beam (LB5) and LB6, which are the first-order diffracted light of the incident beam (LBb), toward the mirror (IM5, IM6). This mirror (IM5, IM6) reflects the beam (LB5) and LB6 diffracted by the selection optical element (AOM5, AOM6) toward the scanning unit (U5, U6). The beams (LB5) and LB6 reflected from the mirrors (IM5, IM6) are coaxial with the central axis of the irradiation (Le5, Le6), pass through the openings (TH5, TH6) of the support member (IUB), and are incident on the scanning unit (U5, U6).

[0106] In this way, the control device (16) switches one of the selectable optical elements (AOM4~AOM6) by turning on / off (high / low) the driving signal (high frequency signal) to be applied to each of the selectable optical elements (AOM4~AOM6), thereby switching whether the beam (LBb) is directed toward the subsequent selectable optical elements (AOM5, AOM6) or absorber (TR2), or whether one of the deflected beams (LB4)~LB6 is directed toward the corresponding scanning unit (U4~U6).

[0107] As described above, the beam switching unit (BDU) is equipped with a plurality of selection optical elements (AOMn (AOM1~AOM3)) arranged in series along the propagation direction of the beam (LBa) from the light source device (LSa), thereby switching the optical path of the beam (LBa) and selecting one scanning unit (Un) (U1~U3) to which the beam (LBn (LB1~LB3)) is incident. Accordingly, the beam (LBn (LB1~LB3)), which is the first diffracted light of the beam (LBa) from the light source device (LSa), can be incident on each of the three scanning units (Un) (U1~U3) in sequence. For example, if you want to inject a beam (LB1) into a scanning unit (U1), the control device (16) turns on only the selection optical element (AOM1) among the plurality of selection optical elements (AOM1~AOM3), and if you want to inject a beam (LB3) into a scanning unit (U3), you turn on only the selection optical element (AOM3).

[0108] Likewise, the beam switching unit (BDU) is equipped with a plurality of selection optical elements (AOMn (AOM4~AOM6)) arranged in series along the propagation direction of the beam (LBb) from the light source device (LSb), thereby switching the optical path of the beam (LBb) and selecting one scanning unit (Un (U4~U6)) into which the beam (LBn (LB4~LB6)) is incident. Accordingly, the beam (LBn (LB4~LB6)), which is the first diffracted light of the beam (LBb) from the light source device (LSb), can be incident on each of the three scanning units (Un (U4~U6)) in sequence. For example, if you want to inject a beam (LB4) into a scanning unit (U4), the control device (16) turns on only the selection optical element (AOM4) among the plurality of selection optical elements (AOM4~AOM6), and if you want to inject a beam (LB6) into a scanning unit (U6), you turn on only the selection optical element (AOM6).

[0109] These multiple selection optical elements (AOMn (AOM1~AOM6)) are provided corresponding to multiple scanning units (Un (U1~U6)) and switch whether to incident a beam (LBn) on the corresponding scanning unit (Un). Furthermore, in the first embodiment, the selection optical elements (AOM1~AOM3) are referred to as the first optical element module, and the selection optical elements (AOM4~AOM6) are referred to as the second optical element module. Additionally, the scanning units (U1~U3) corresponding to the selection optical elements (AOM1~AOM3) of the first optical element module are referred to as the first scanning module, and the scanning units (U4~U6) corresponding to the selection optical elements (AOM4~AOM6) of the second optical element module are referred to as the second scanning module. Accordingly, scanning of the spot light SP is performed in parallel at one of the scanning units (Un) of the first scanning module and at one of the scanning units (Un) of the second scanning module.

[0110] As described above, in the first embodiment, the rotation angle α that contributes to the actual scanning of the polygon mirror (PM) of the scanning unit (Un) is set to 15 degrees, so the scanning efficiency becomes 1 / 3. Therefore, for example, while one scanning unit (Un) rotates by an angle (45 degrees) per reflection surface (RP), the angle at which spot light SP can be scanned is 15 degrees, and in other angle ranges (30 degrees), spot light SP cannot be scanned, and the beam (LBn) incident on the polygon mirror (PM) during that time is wasted. Therefore, while the rotation angle of the polygon mirror (PM) of one scanning unit (Un) is set to an angle that does not contribute to actual scanning, the beam (LBn) is incident on another scanning unit (Un), thereby causing the spot light SP to be scanned by the polygon mirror (PM) of the other scanning unit (Un). Since the scanning efficiency of the polygon mirror (PM) is 1 / 3, it is possible to perform scanning of the spot light SP by distributing the beam (LBn) to the other two scanning units (Un) during the period between one scanning unit (Un) scanning the spot light SP and performing the next scanning. Therefore, in the first embodiment, a plurality of scanning units (Un (U1~U6)) are divided into two groups (scanning modules), three scanning units (U1~U3) are designated as the first scanning module, and three scanning units (U4~U6) are designated as the second scanning module.

[0111] By this, for example, while the polygon mirror (PM) of the scanning unit (U1) rotates 45 degrees (1 reflection surface (RP)), the beam (LBn (LB1~LB3)) can be incident sequentially on any one of the three scanning units (U1~U3). Thus, each of the scanning units (U1~U3) can perform scanning of spot light SP in sequence without wasting the beam (LBa) from the light source device (LSa). Likewise, while the polygon mirror (PM) of the scanning unit (U4) rotates 45 degrees (1 reflection surface (RP)), the beam (LBn (LB4~LB6)) can be incident sequentially on any one of the three scanning units (U4~U6). Thus, the scanning units (U4~U6) can perform scanning of spot light SP in sequence without wasting the beam (LBb) from the light source device (LSb). In addition, during the period from when each scanning unit (Un) starts scanning the spot light SP until it starts the next scanning, the polygon mirror (PM) rotates by exactly one angle (45 degrees) of reflection surface (RP).

[0112] In the first embodiment, each of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module performs scanning of spot light SP in a predetermined order, so in response to this, the control device (16) switches the three selection optical elements (AOMn(AOM1~AOM3, AOM4~AOM6)) of each optical element module to ON in a predetermined order, and switches the scanning unit (Un(U1~U3, U4~U6)) into which the beam (LBn(LB1~LB3, LB4~LB6)) is incident in order. For example, if the sequence of scanning spot light SP of the three scanning units (U1~U3, U4~U6) of each scanning module is U1→U2→U3, U4→U5→U6, the control device (16) switches the three selectable optical elements (AOMn(AOM1~AOM3, AOM4~AOM6)) of each optical element module to ON in the order of AOM1→AOM2→AOM3, AOM4→AOM5→AOM6, and switches the scanning unit (Un) to which the beam (LBn) is incident in the order of U1→U2→U3, U4→U5→U6.

[0113] In addition, while the polygon mirror (PM) rotates by an angle (45 degrees) of one reflection surface (RP), in order for the three scanning units (Un(U1~U3, U4~U6)) of each scanning module to perform scanning of spot light SP in sequence, each polygon mirror (PM) of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module must rotate while satisfying the following conditions. The conditions are that each polygon mirror (PM) of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module must be synchronously controlled so that they have the same rotational speed Vp, and at the same time, the rotational angle position (angle position of each reflection surface (RP)) of each polygon mirror (PM) must be synchronously controlled so that they have a predetermined phase relationship. The rotational speed Vp of the polygon mirrors (PM) of the three scanning units (Un) of each scanning module rotates equally, which is called synchronous rotation.

[0114] Each selection optical element (AOMn (AOM1~AOM6)) of the beam switching unit (BDU) only needs to be turned on during the single scanning period of the spot light SP by each polygon mirror (PM) of the scanning unit (Un (U1~U6)). Also, if the number of reflective surfaces of the polygon mirror (PM) is Np and the rotation speed of the polygon mirror (PM) is Vp (rpm), the time Tpx corresponding to the rotation angle of one reflective surface (RP) of the polygon mirror (PM) is Tpx = 60 / (Np × Vp) [second]. For example, when the number of reflective surfaces Np is 8 and the rotation speed Vp [rpm] is 1.20968, the time Tpx is approximately 0.62 milliseconds. This is approximately 1.6129 kHz when converted to frequency, and it means that an acousto-optic modulation element with a significantly lower response frequency can be used compared to an acousto-optic modulation element for high-speed modulation of a beam (LB) of ultraviolet wavelength in response to pattern data (drawing data) at tens of MHz. Therefore, a beam (LB1~LB6) (first-order diffracted light) with a large diffraction angle with respect to the incident beam (LB) (zero-order light) can be used, and it becomes easy to arrange mirrors (IM1~IM6) that separate the deflected beams (LB1~LB6) with respect to the path of the beam (LB) passing straight through the selection optical element (AOM1~AOM6).

[0115] FIG. 7 is a diagram showing the configuration of a light source device (pulse light source device, pulse laser device) (LSa(LSb)). The light source device (LSa(LSb)) as a fiber laser device comprises a pulse light generating unit (20) and a control circuit (22). The pulse light generating unit (20) comprises a DFB semiconductor laser element (30, 32), a polarizing beam splitter (34), an electro-optical element (intensity modulation unit) (36) as a light modulator for drawing, a driving circuit (36a) of the electro-optical element (36), a polarizing beam splitter (38), an absorber (40), an excitation light source (42), a combiner (44), a fiber light amplifier (46), a wavelength conversion optical element (sometimes referred to as a wavelength conversion element) (48, 50), and a plurality of lens elements (GL). The control circuit (22) comprises a signal generating unit (22a) that generates a clock signal LTC and a pixel shift pulse BSC. Additionally, in order to distinguish between the pixel shift pulse BSC output from the signal generating unit (22a) of the light source device (LSa) and the pixel shift pulse BSC output from the signal generating unit (22a) of the light source device (LSb), the pixel shift pulse BSC from the light source device (LSa) may be represented as BSCa and the pixel shift pulse BSC from the light source device (LSb) may be represented as BSCb.

[0116] The DFB semiconductor laser element (first solid-state laser element) (30) generates a pulse-shaped beam (pulse beam) S1 that is very sharp or acute at a predetermined frequency oscillation frequency Fa (e.g., 400 MHz), and the DFB semiconductor laser element (second solid-state laser element) (32) generates a pulse-shaped beam S2 that is gentle (time-broad) at a predetermined frequency oscillation frequency Fa (e.g., 400 MHz). The emission timing of the beam S1 generated by the DFB semiconductor laser element (30) and the beam S2 generated by the DFB semiconductor laser element (32) are synchronized. Although the energy per pulse of both beams S1 and S2 is approximately the same, their polarization states are different from each other, so the peak intensity is stronger in beam S1. These end beams S1 and S2 are linearly polarized light, and their polarization directions are orthogonal to each other. In this first embodiment, the polarization state of end beam S1 generated by the DFB semiconductor laser element (30) is described as S-polarization, and the polarization state of end beam S2 generated by the DFB semiconductor laser element (32) is described as P-polarization. These end beams S1 and S2 are light in the infrared wavelength band.

[0117] The control circuit (22) controls the DFB semiconductor laser elements (30, 32) so that end lights S1 and S2 emit light in response to the clock pulse of the clock signal LTC sent from the signal generator (22a). By this, the DFB semiconductor laser elements (30, 32) emit end lights S1 and S2 at a predetermined frequency (oscillation frequency) Fa in response to each clock pulse (oscillation frequency Fa) of the clock signal LTC. This control circuit (22) is controlled by the control device (16). The period (=1 / Fa) of the clock pulse of the clock signal LTC is called the reference period Ta. The end lights S1 and S2 generated from the DFB semiconductor laser elements (30, 32) are guided to the polarizing beam splitter (34).

[0118] In addition, the clock signal LTC, which serves as this reference clock signal, is the base of the pixel shift pulse BSC (BSCa, BSCb) supplied to each of the counter sections (CONn (CON1~CON6)) (see FIG. 14) for specifying the row-direction address in the memory circuit of the bitmap-shaped pattern data, as will be described in detail later. Also, the signal generation section (22a) receives from the control device (16) the overall magnification correction information TMg for performing overall magnification correction of the drawing line (SLn) on the irradiated surface of the substrate (P), and the local magnification correction information CMgn (CMg1~CMg6) for performing local magnification correction of the drawing line (SLn). As will be explained in detail later, this allows for fine adjustment of the length (scan length) of the drawing line (SLn) on the irradiated surface of the substrate (P). The expansion (fine adjustment of the scanning length) of this drawing line (SLn) can be performed within the range of the maximum scanning length of the drawing line (SLn) (e.g., 31 mm). Furthermore, the overall magnification correction in the first embodiment is, simply put, to correct the magnification of the entire scanning direction of the drawing line (SLn) equally by uniformly fine-adjusting the projection interval (i.e., the oscillation frequency of the spot light) of the spot light SP projected along the main scanning direction while keeping the number of spot lights included in one pixel (1 bit) of the drawing data constant. In addition, the local magnification correction in the first embodiment is simply explained as follows: by targeting a pixel (1 bit) located at each of the discrete correction points set on a drawing line, and increasing or decreasing the number of spot lights to be included in the pixel of the correction point relative to the number of spot lights to be included in an adjacent pixel, the size of the pixel at each correction point drawn on the substrate is slightly expanded in the direction of the main drawing.

[0119] The polarizing beam splitter (34) transmits S-polarized light and reflects P-polarized light, thereby guiding the end light S1 generated by the DFB semiconductor laser element (30) and the end light S2 generated by the DFB semiconductor laser element (32) to the electro-optical element (36). Specifically, the polarizing beam splitter (34) transmits the S-polarized end light S1 generated by the DFB semiconductor laser element (30) to guide the end light S1 to the electro-optical element (36). Additionally, the polarizing beam splitter (34) reflects the P-polarized end light S2 generated by the DFB semiconductor laser element (32) to guide the end light S2 to the electro-optical element (36). The DFB semiconductor laser elements (30, 32) and the polarizing beam splitter (34) constitute a pulsed light source unit (35) that generates end light S1 and S2.

[0120] The electro-optical element (intensity modulation unit) (36) is transparent to the end light S1 and S2, and, for example, an electro-optical modulator (EOM) is used. The electro-optical element (36) switches the polarization state of end light S1 and S2 by the driving circuit (36a) in response to the high / low state of the drawing bit sequence data SBa (SBb). The drawing bit sequence data SBa is generated based on pattern data (bit pattern) according to the pattern that each of the scanning units (U1 to U3) is to be exposed to, and the drawing bit sequence data SBb is generated based on pattern data (bit pattern) according to the pattern that each of the scanning units (U4 to U6) is to be exposed to. Accordingly, the drawing bit sequence data SBa is input to the driving circuit (36a) of the light source device (LSa), and the drawing bit sequence data SBb is input to the driving circuit (36a) of the light source device (LSb). Since the wavelength band of the DFB semiconductor laser element (30) and the DFB semiconductor laser element (32) is longer than 800 nm, an electro-optical element (36) with a polarization state switching response of about GHz can be used.

[0121] Pattern data (drawing data) is provided for each scanning unit (Un), and the pattern drawn by each scanning unit (Un) is divided into pixels of dimension Pxy set according to the size φ of the spot light SP, and each of the multiple pixels is represented as logic information (pixel data) according to the pattern. That is, this pattern data is bitmap data composed of logic information of multiple pixels decomposed into two dimensions, with the direction according to the main beam direction (Y direction) of the spot light SP as the row direction and the direction according to the sub-transport direction (X direction) of the substrate (P) as the column direction. The logic information of this pixel is 1 bit of data of "0" or "1". The logic information of "0" means that the intensity of the spot light SP irradiated on the substrate (P) is set to a low level (non-drawing), and the logic information of "1" means that the intensity of the spot light SP irradiated on the substrate (P) is set to a high level (drawing). In addition, the dimension of the pixel in the primary scanning direction (Y direction) is denoted as Py, and the dimension in the secondary scanning direction (X direction) is denoted as Px.

[0122] The logical information of a single column of pixels in the pattern data corresponds to a single drawing line (SLn(SL1~SL6)). Accordingly, the number of pixels in a single column is determined by the pixel dimensions Pxy on the illuminated surface of the substrate (P) and the length of the drawing line (SLn). This pixel dimension Pxy is set to be equal to or greater than the size φ of the spot light SP; for example, if the effective size φ of the spot light SP is 3㎛, the pixel dimension Pxy is set to be at least 3㎛. According to the logical information of a single column of pixels, the intensity of the spot light SP projected onto the substrate (P) along a single drawing line (SLn(SL1~SL6)) is modulated. This logical information of a single column of pixels is called serial data DLn. That is, the pattern data is bitmap data in which serial data DLn is arranged in a column direction. The serial data DLn of the pattern data of the scanning unit (U1) is represented as DL1, and likewise the serial data DLn of the pattern data of the scanning units (U2 to U6) is represented as DL2 to DL6.

[0123] Also, since the three scanning units (U1~U3 (U4~U6)) of the scanning module repeat the operation of scanning the spot light SP once in a predetermined order, in correspondence, the serial data DL1~DL3 (DL4~DL6) of the pattern data of the three scanning units (U1~U3 (U4~U6)) of the scanning module are also output to the driving circuit (36a) of the light source device (LSa (LSb)) in a predetermined order. The serial data DL1~DL3 that are output sequentially to the driving circuit (36a) of the light source device (LSa) is called the drawing bit sequence data SBa, and the serial data DL4~DL6 that are output sequentially to the driving circuit (36a) of the light source device (LSb) is called the drawing bit sequence data SBb.

[0124] For example, in the case where the sequence of the scanning unit (Un) performing the scanning of the spot light SP in the first scanning module is U1→U2→U3, first, serial data DL1 of one column is output to the driving circuit (36a) of the light source device (LSa), and then serial data DL2 of one column is output to the driving circuit (36a) of the light source device (LSa), and in the same manner, serial data DL1~DL3 of one column constituting the drawing bit sequence data SBa is output to the driving circuit (36a) of the light source device (LSa) in the sequence DL1→DL2→DL3. After that, serial data DL1~DL3 of the next column is output to the driving circuit (36a) of the light source device (LSa) as drawing bit sequence data SBa in the sequence DL1→DL2→DL3. Likewise, in the second scanning module, when the sequence of the scanning unit (Un) performing the scanning of the spot light SP is U4→U5→U6, first, serial data DL4 of one column is output to the driving circuit (36a) of the light source device (LSb), and then serial data DL5 of one column is output to the driving circuit (36a) of the light source device (LSb), and in the same manner, serial data DL4~DL6 of one column constituting the drawing bit sequence data SBb is output to the driving circuit (36a) of the light source device (LSb) in the sequence DL4→DL5→DL6. After that, serial data DL4~DL6 of the next column is output to the driving circuit (36a) of the light source device (LSb) as drawing bit sequence data SBb in the sequence DL4→DL5→DL6. The specific configuration for outputting the drawing bit sequence data SBa (SBb) to the driving circuit (36a) of this light source device (LSa (LSb)) will be described in detail below.

[0125] When the logic information of one pixel of the drawing bit sequence data SBa (SBb) input to the driving circuit (36a) is in a low ("0") state, the electro-optical element (36) guides the incident light S1 and S2 to the polarizing beam splitter (38) without changing their polarization state. On the other hand, when the logic information of one pixel of the drawing bit sequence data SBa (SBb) input to the driving circuit (36a) is in a high ("1") state, the electro-optical element (36) changes the polarization state of the incident light S1 and S2, that is, changes the polarization direction by 90 degrees, and guides them to the polarizing beam splitter (38). In this way, the driving circuit (36a) drives the electro-optical element (36) based on the drawing bit sequence data SBa (SBb), and when the logic information of the pixel of the drawing bit sequence data SBa (SBb) is in a high state ("1"), the electro-optical element (36) converts the S-polarized end light S1 into the P-polarized end light S1 and converts the P-polarized end light S2 into the S-polarized end light S2.

[0126] The polarizing beam splitter (38) transmits P-polarized light and guides it to the combiner (44) through the lens element (GL), and reflects S-polarized light and guides it to the absorber (40). The light (long light) that passes through this polarizing beam splitter (38) is represented as the beam (Lse). The oscillation frequency of this pulse-shaped beam (Lse) is Fa. The excitation light source (42) generates excitation light, and the generated excitation light passes through the optical fiber (42a) and is guided to the combiner (44). The combiner (44) combines the beam (Lse) irradiated from the polarizing beam splitter (38) with the excitation light and outputs it to the fiber optical amplifier (46). The fiber optical amplifier (46) is doped with a laser medium that is excited by the excitation light. Accordingly, within the fiber optical amplifier (46) in which the synthesized beam (Lse) and the excitation light are transmitted, the laser medium is excited by the excitation light, thereby amplifying the beam (Lse) as a terminal light. As the laser medium doped into the fiber optical amplifier (46), rare earth elements such as erbium (Er), ytterbium (Yb), and thulium (Tm) are used. This amplified beam (Lse) is emitted from the ejection end (46a) of the fiber optical amplifier (46) along a predetermined divergence angle, converges or collimates by a lens element (GL), and is incident on a wavelength conversion optical element (48).

[0127] A wavelength conversion optical element (first wavelength conversion optical element) (48) converts an incident beam (Lse) (wavelength λ) into a second harmonic with a wavelength of half λ by means of second harmonic generation (SHG). As the wavelength conversion optical element (48), a PPLN (Periodically Poled LiNbO3) crystal, which is a quasi-phase matching (QPM) crystal, is preferably used. Additionally, it is possible to use a PPLT (Periodically Poled LiTaO3) crystal, etc.

[0128] The wavelength conversion optical element (second wavelength conversion optical element) (50) generates a third harmonic with a wavelength of 1 / 3 of λ by Sum Frequency Generation (SFG) of the second harmonic (wavelength λ / 2) converted by the wavelength conversion optical element (48) and the residual light (wavelength λ) that is not converted by the wavelength conversion optical element (48). This third harmonic becomes ultraviolet light (beam (LB)) having a peak wavelength in a wavelength band of 370 mm or less (e.g., 355 nm).

[0129] As shown in FIG. 8, when the logic information of one pixel of the drawing bit sequence data SBa(SBb) applied to the driving circuit (36a) is low ("0"), the electro-optical element (intensity modulation unit) (36) guides the incident end light S1 and S2 to the polarizing beam splitter (38) without changing their polarization state. Therefore, the beam (Lse) passing through the polarizing beam splitter (38) becomes end light S2. Consequently, the P-polarized LBa(LBb) finally output from the light source device (LSa(LSb)) has the same oscillation profile (time characteristics) as end light S2 from the DFB semiconductor laser element (32). That is, in this case, the beam (LBa(LBb)) has a low pulse peak intensity and a blunt, broad characteristic over time. Since the fiber optical amplifier (46) has low amplification efficiency for the end light S2, which has such low peak intensity, the beam (LBa(LBb)) emitted from the light source device (LSa(LSb)) is light that is not amplified to the energy required for exposure. Therefore, from the perspective of exposure, the result is that the light source device (LSa(LSb)) is practically not emitting the beam (LBa(LBb)). That is, the intensity of the spot light SP irradiated onto the substrate (P) becomes low. However, during the period when the pattern is not exposed (non-exposure period), the ultraviolet band beam (LBa(LBb)) originating from the end light S2 is continuously irradiated even at a slight intensity. Therefore, when the drawing line (SL1~SL6) remains in the same position on the substrate (P) for a long time (for example, when the substrate (P) is stopped due to a problem with the transport system, etc.), it is preferable to provide a movable shutter in the ejection window (not shown) of the beam (LBa(LBb)) of the light source device (LSa(LSb)) and close the ejection window.

[0130] Meanwhile, as shown in FIG. 8, when the logic information of one pixel of the drawing bit sequence data SBa(SBb) applied to the driving circuit (36a) is high ("1"), the electro-optical element (intensity modulation unit) (36) changes the polarization state of the incident end light S1 and S2 and guides them to the polarization beam splitter (38). Therefore, the beam (Lse) passing through the polarization beam splitter (38) becomes end light S1. Accordingly, the beam (LBa(LBb)) emitted from the light source device (LSa(LSb)) is generated from end light S1 from the DFB semiconductor laser device (30). Since the end light S1 from the DFB semiconductor laser device (30) has a strong peak intensity, it is efficiently amplified by the fiber optical amplifier (46), and the P-polarized beam (LBa(LBb)) output from the light source device (LSa(LSb)) has the energy required for the exposure of the substrate (P). That is, the intensity of the spot light SP irradiated onto the substrate (P) becomes a high level.

[0131] In this way, since an electro-optical element (36) as a drawing light modulator is provided within the light source device (LSa(LSb)), by controlling one electro-optical element (intensity modulation unit) (36), the intensity of the spot light SP scanned by the three scanning units (U1~U3(U4~U6)) of the scanning module can be modulated according to the pattern to be drawn. Accordingly, the beam (LBa(LBb)) emitted from the light source device (LSa(LSb)) becomes an intensity-modulated drawing beam.

[0132] Here, in the first embodiment, even during periods when drawing bit sequence data SBa (DL1~DL3) and SBb (DL4~DL6) are not applied to the driving circuit (36a), beams (LBa) and LBb originating from end light S2 are emitted from the light source devices (LSa, LSb). Therefore, even if the effective scanning length of the drawing line (SLn) (e.g., 30mm) is set within a range less than or equal to the maximum scanning length (e.g., 31mm) for which the spot light SP can be scanned, in reality, the spot light SP is scanned along the main scanning direction over the entire range of the maximum scanning length. However, the intensity of the spot light SP projected at a location other than the drawing line (SLn) is at a low level. Accordingly, the drawing line (SLn) referred to in the first embodiment refers to a scanning line that is drawn, that is, one in which the intensity of the spot light SP is modulated and scanned by each serial data DL1~DL6. Therefore, the scanning period of the spot light SP along the drawing line (SLn) and the period during which the logical information of each pixel of the serial data DLn is output are approximately the same.

[0133] In addition, in the configuration of FIG. 7, the DFB semiconductor laser element (32) and the polarization beam splitter (34) can be omitted, and only the end light S1 from the DFB semiconductor laser element (30) can be directed to the fiber optical amplifier (46) in the form of a burst wave by switching the polarization state of the electro-optical element (36) based on pattern data (drawing bit sequence data SBa, SBb, or serial data DLn). However, if this configuration is adopted, the incident periodicity of the end light S1 to the fiber optical amplifier (46) is greatly disrupted depending on the pattern to be drawn. That is, if the end light S1 from the DFB semiconductor laser element (30) is not incident on the fiber optical amplifier (46) for a period of time, and then the end light S1 is incident on the fiber optical amplifier (46), the end light S1 immediately after incident is amplified at a greater amplification rate than usual, and there is a problem that a beam with a greater intensity than specified is generated from the fiber optical amplifier (46). Accordingly, in the first embodiment, as a preferred embodiment, this problem is solved by introducing a latent light S2 (broad pulse light with low peak intensity) from a DFB semiconductor laser element (32) into the fiber optical amplifier (46) during the period when latent light S1 is not introduced into the fiber optical amplifier (46).

[0134] Additionally, although the electro-optical element (36) is switched, the DFB semiconductor laser element (30, 32) may be driven based on pattern data (drawing bit sequence data SBa, SBb or serial data DLn). In this case, the DFB semiconductor laser element (30, 32) functions as a drawing light modulator (intensity modulation unit). That is, the control circuit (22) controls the DFB semiconductor laser element (30, 32) based on the drawing bit sequence data SBa (DL1~DL3) and SBb (DL4~DL6) to selectively (alternately) generate end light S1 and S2 that oscillate in a pulse shape at a predetermined frequency Fa. In this case, the polarizing beam splitter (34, 38), electro-optical element (36), and absorber (40) are unnecessary, and one of the end beams S1 and S2, which are selectively pulsed from either of the DFB semiconductor laser elements (30, 32), is directly incident on the combiner (44). At this time, the control circuit (22) controls the driving of each DFB semiconductor laser element (30, 32) so that the end beam S1 from the DFB semiconductor laser element (30) and the end beam S2 from the DFB semiconductor laser element (32) are not simultaneously incident on the fiber optical amplifier (46). That is, when the spot light SP of each beam (LBn) is irradiated onto the substrate (P), the DFB semiconductor laser element (30) is controlled so that only the end beam S1 is incident on the fiber optical amplifier (46). In addition, when the spot light SP of each beam (LBn) is not irradiated onto the substrate (P) (making the intensity of the spot light SP very low), the DFB semiconductor laser element (32) is controlled so that only the end light S2 is incident on the fiber optical amplifier (46). In this way, whether or not to irradiate the beam (LBn) onto the substrate (P) is determined based on the logic information (high / low) of the pixel. Also, in this case, the polarization state of the end lights S1 and S2 may both be P-polarized.

[0135] Here, the light source device (LSa(LSb)) emits a beam (LBa(LBb)) such that, during the scanning of the spot light SP, N spots (in the first embodiment, N=8) are projected along the main projection direction for one pixel of dimension Pxy on the surface to be irradiated of the substrate (P). The beam (LBa(LBb)) emitted from this light source device (LSa(LSb)) is generated in response to the clock pulse of the clock signal LTC generated by the signal generator (22a). Accordingly, in order to project N spot light SPs (where N is an integer greater than or equal to 2) for one pixel of dimension Pxy, when the scanning speed of the spot light SP relative to the substrate (P) in the main projection direction is Vs, the signal generator (22a) needs to generate a clock pulse of the clock signal LTC with a reference period Ta (=1 / Fa) determined as Pxy / (N×Vs) or Py / (N×Vs). For example, if the length of the effective drawing line (SLn) is 30 mm and the scanning time Tsp is 200 μs, the scanning speed Vs of the spot light SP becomes 150 m / sec. And, when the pixel dimensions Pxy (Px and Py) are 3㎛, which is the same as the effective size of the spot light SP, and N is 8, the reference period Ta = 3㎛ / (8 × 150 m / sec) = 0.0025 μs ec, and the frequency Fa (= 1 / Ta) becomes 400 MHz.

[0136] In principle, since N (=8) spot light SPs correspond to one pixel, whenever N (8) clock pulses of the clock signal LTC are output, the logical information of the pixel in the drawing bit sequence data SBa (SBb), which consists of serial data DL1~DL3 (DL4~DL6) output to the driving circuit (36a), is shifted by one in the row direction. As shown in FIG. 8, when the logical information ("1") as pixel data of a certain pixel starts to be output and then 8 clock pulses are output, the logical information of the next pixel, "0," is output. Then, in order to locally scale-correct the length of each drawing line (SL1)~SL3 (SL4~SL6), for the pixels to be corrected (hereinafter, correction pixels) that are discretely spaced at equal intervals on each drawing line (SL1~SL3 (SL4~SL6)), N±m (m is an integer greater than or equal to 1 having the relationship m < N) spot light SPs correspond. Accordingly, for the correction pixel, when a clock pulse of N±m clock signal LTC is output, the logic information of the pixel in the drawing bit sequence data SBa (SBb) output to the driving circuit (36a) is shifted by one in the row direction. For example, when N is 8 and m is 1, 7 or 9 spot light SPs are projected for the correction pixel. Accordingly, the correction pixel is stretched in the main projection direction, and as a result, each of the drawing lines (SL1) to SL3 (SL4 to SL6) is stretched overall. For non-corrected pixels other than the correction pixel, 8 spot light SPs are projected. The designation of this correction pixel and the stretching rate (magnification) in the main projection direction of the correction pixel are determined based on local magnification correction information (correction information) CMgn, which includes correction position information Nv for designating the correction pixel and magnification information SCA representing the stretching rate (magnification) in the main projection direction of the correction pixel. In addition, the magnification information SCA is information indicating a value of “±m”. This local magnification correction information CMgn (CMg1~CMg6) is provided for each injection unit (Un(U1~U6)).

[0137] In the first embodiment, when local magnification correction is not performed, 80,000 spot light SPs are scanned along the main projection direction per drawing line (SLn), and since there are 8 spot light SPs per pixel, the number of pixels per drawing line (SLn) (the number of logical information in serial data DLn) becomes 10,000 (= 80,000 / 8). Also, since "N" is 8 and "m" is 1, when local magnification correction is performed, 7 or 9 (N±m) spot light SPs are irradiated onto the correction pixel, but since the number of pixels per drawing line (SLn) remains 10,000, the number of spot light SPs irradiated onto one drawing line (SLn) becomes greater or less than 80,000. For example, in the case of elongation, 9 spot light SPs are projected onto the correction pixel, so if there are 40 correction pixels per drawing line (SLn), the number of spot light SPs projected onto one drawing line (SLn) becomes 80040. Also, in the case of reduction, 7 spot light SPs are projected onto the correction pixel, so if there are 40 correction pixels per drawing line (SLn), the number of spot light SPs projected onto one drawing line (SLn) becomes 79960.

[0138] FIG. 9 is a diagram showing the configuration of a signal generator (22a) having the function of extending a correction pixel of a light source device (LSa(LSb)). The signal generator (22a) has a clock generator (oscillator) (60), a correction pixel designation unit (62), and a transmission timing switching unit (64). The clock generator (60), the correction pixel designation unit (62), and the transmission timing switching unit (64), etc., can be configured by integrating them using an FPGA (Field Programmable Gate Array).

[0139] The clock generator (60) generates a clock signal (reference clock signal) LTC with an oscillation frequency Fa according to the total magnification correction information TMg. In the first embodiment, when the total magnification correction information TMg is 0, the clock generator (60) generates a clock pulse (clock signal LTC) with an oscillation frequency Fa of 400 MHz. Accordingly, in this case, the light source device (LS (LSa, LSb)) emits a pulse-shaped beam (LB) (LBa, LBb) at 400 MHz. Also, in the first embodiment, when the oscillation frequency Fa is 400 MHz, the rotation speed Vp of the polygon mirror (PM) is set so that 80,000 spot lights SP are irradiated at intervals of 0.375 μm along the main projection direction, so the scanning length of the drawing line (SLn) becomes 30 mm. When the oscillation frequency Fa becomes higher than 400 MHz due to the overall magnification correction information TMg, the projection interval of the spot light SP in the main projection direction on the irradiated surface of the substrate (P) becomes shorter, and as a result, the drawing line (SLn) becomes shorter than 30 mm. Conversely, when the oscillation frequency Fa becomes lower than 400 MHz due to the overall magnification correction information TMg, the projection interval of the spot light SP in the scanning direction on the irradiated surface of the substrate (P) becomes longer, and as a result, the drawing line (SLn) becomes longer than 30 mm. In this way, the overall magnification of the drawing line (SLn) can be adjusted by the overall magnification correction information TMg. According to this overall magnification correction information TMg, the length of the dimension Pxy in the direction of the pixel on the irradiated surface of the substrate (P) is expanded, but in this first embodiment, the overall magnification correction information TMg is set to 0 (oscillation frequency Fa = 400 MHz), so the dimension Pxy of the pixel becomes approximately the same size φ of the spot light SP. The clock signal LTC generated by the clock generator (60) is sent to the control circuit (22) and also to the correction pixel designation unit (62) and the transmission timing switching unit (64).

[0140] The correction pixel designation unit (62) designates at least one pixel placed at a specific location among a plurality of pixels arranged along each drawing line (SLn (SL1~SL6)) as a correction pixel. The correction pixel designation unit (62) designates a correction pixel based on correction location information (set value) Nv, which is part of local magnification correction information (correction information) CMgn (CMg1~CMg6). The correction location information Nv of the local magnification correction information (correction information) CMgn is information for designating a correction pixel at each of a plurality of discrete locations at equal intervals on the drawing line (SLn) according to the drawing magnification of the pattern drawn along the drawing line (SLn) (or the magnification in the direction of the main drawing of the drawing line (SLn)), and is information indicating the distance interval (equal interval) between the correction pixels. By this, the correction pixel designation unit (62) can designate multiple pixels arranged at discrete positions at equal intervals on the drawing lines (SLn (SL1~SL6)) as correction pixels. Among the multiple pixels lined up along each drawing line (SLn (SL1~SL6)), any pixels not designated as correction pixels become non-corrected pixels; therefore, it can be said that the correction pixel designation unit (62) designates non-corrected pixels by designating correction pixels. Furthermore, when the value of “m” in “N±m” is constant, the number of correction pixels designated increases as the stretching rate of the drawing lines (SLn (SL1~SL6)) to be corrected increases.

[0141] The transmission timing switching unit (transmission timing control unit) (64) controls (switches) the transmission timing of the logic information of each pixel of the serial data DLn (DL1~DL6) based on the correction position information Nv of the local magnification correction information CMgn (CMg1~CMg6) and based on the magnification information SCA of the local magnification correction information CMgn (CMg1~CMg6). That is, when the pixel where the spot light SP is scanned along the drawing line (SLn (SL1~SL6)) is the correction pixel, the transmission timing of the logic information of the pixel of the serial data DLn (i.e., logic information for each pixel in the row direction of the pattern data) transmitted (supplied) to the driving circuit (36a) is switched so that the correction pixel expands based on the magnification information SCA of the local magnification correction information CMgn (CMg1~CMg6).

[0142] Specifically, the transmission timing switching unit (64) switches the transmission timing of the logic information of each pixel of the serial data DLn (DL1~DL6) transmitted to the driving circuit (36a) so that when the spot light SP scans a pixel that is not a correction pixel (normal pixel, non-corrected pixel) on the drawing line (SLn (SL1~SL6)), N clock pulses (spot light SP) of the clock signal LTC correspond to one pixel, and when the spot light SP scans a correction pixel on the drawing line (SLn (SL1~SL6)), N±m clock pulses (spot light SP) of the clock signal LTC correspond to one pixel. That is, the transmission timing switching unit (64) switches (controls) the transmission timing of the logic information of each pixel of the serial data DLn (DL1~DL6) transmitted to the driving circuit (36a) so that when the spot light SP scans a normal pixel on the drawing line (SLn (SL1~SL6)), the logic information of the next pixel is output to the driving circuit (36a) when N clock pulses of the clock signal LTC occur, and when the spot light SP scans a correction pixel on the drawing line (SLn (SL1~SL6)), the logic information of the next pixel is output to the driving circuit (36a) when N±m clock pulses of the clock signal LTC occur. The value of “±m” is determined based on the magnification information SCA, which is part of the local magnification correction information CMgn (CMg1~CMg6).

[0143] The correction pixel designation unit (62) designates a plurality of correction pixels placed on the drawing line (SLn) of the scanning unit (Un) to which the beam (LBn) is incident by the beam switching unit (BDU) using the correction position information Nv of the local magnification correction information CMgn corresponding to the scanning unit (Un) to which the beam (LBn) is incident. The transmission timing switching unit (64) switches the transmission timing of the logic information of each pixel of the serial data DLn corresponding to the scanning unit (Un) to which the beam (LBn) is incident, based on the correction pixels on the drawing line (SLn) of the scanning unit (Un) to which the beam (LBn) is incident designated by the correction pixel designation unit (62) and the magnification information SCA of the local magnification correction information CMgn corresponding to the scanning unit (Un) to which the beam (LBn) is incident.

[0144] In the case of the light source device (LSa), the beam (LBa) (LB1~LB3) from the light source device (LSa) is guided to one of the scanning units (Un) of the first scanning modules (U1~U3) by the first optical element modules (AOM1~AOM3) of the beam conversion unit (BDU). Accordingly, the correction pixel designation unit (62) of the signal generation unit (22a) of the light source device (LSa) designates a correction pixel based on the correction position information Nv of the local magnification correction information CMgn corresponding to one scanning unit (Un) to which the beam (LBn) is incident among the scanning units (U1~U3). Additionally, the transmission timing switching unit (64) of the signal generation unit (22a) of the light source device (LSa) switches the transmission timing of the logic information for each pixel of the serial data DLn corresponding to the one scanning unit (Un) to which the beam (LBn) is incident, based on the magnification information SCA of the local magnification correction information CMgn of the one scanning unit (Un) to which the beam (LBn) is incident among the scanning units (U1~U3) and the correction pixel designated by the correction pixel designation unit (62). For example, when the beam (LB2) is incident on the scanning unit (U2), the correction pixel designation unit (62) of the light source device (LSa) designates a plurality of pixels arranged at discrete positions at equal intervals on the drawing line SL2 as correction pixels based on the correction position information Nv of the local magnification correction information CMg2 corresponding to the scanning unit (U2). And, the transmission timing switching unit (64) of the signal generation unit (22a) of the light source device (LSa) switches the transmission timing of the logic information of each pixel of the serial data DL2 corresponding to the scanning unit (U2) based on the correction pixel on the drawing line SL2 designated by the correction pixel designation unit (62) and the magnification information SCA of the local magnification correction information CMg2.

[0145] Also, in the case of the light source device (LSb), the beam (LBb) (LB4~LB6) from the light source device (LSb) is guided to one of the scanning units (Un) of the second scanning modules (U4~U6) by the second optical element modules (AOM4~AOM6) of the beam conversion unit (BDU). Accordingly, the correction pixel designation unit (62) of the signal generation unit (22a) of the light source device (LSb) designates a correction pixel based on the correction position information Nv of the local magnification correction information CMgn corresponding to one scanning unit (Un) to which the beam (LBn) is incident among the scanning units (U4~U6). Additionally, the transmission timing switching unit (64) of the signal generation unit (22a) of the light source device (LSb) switches the transmission timing of the logic information for each pixel of the serial data DLn corresponding to the one scanning unit (Un) to which the beam (LBn) is incident, based on the magnification information SCA of the local magnification correction information CMgn of the one scanning unit (Un) to which the beam (LBn) is incident among the scanning units (U4~U6) and the correction pixel designated by the correction pixel designation unit (62). For example, when the beam (LB6) is incident on the scanning unit (U6), the correction pixel designation unit (62) of the light source device (LSb) designates a plurality of pixels placed at discrete positions at equal intervals on the drawing line SL6 as correction pixels based on the correction position information Nv of the local magnification correction information CMg6 corresponding to the scanning unit (U6). And, the transmission timing switching unit (64) of the light source device (LSb) switches the transmission timing of the logic information of each pixel of the serial data DL6 corresponding to the scanning unit (U6) based on the correction pixel on the drawing line SL6 designated by the correction pixel designation unit (62) and the magnification information SCA of the local magnification correction information CMg6.

[0146] To explain the correction pixel designation unit (62) in detail, the correction pixel designation unit (62) has a first division counter circuit (70) and delay elements (72, 74). The first division counter circuit (70) is a subtraction counter, and a clock pulse (reference clock pulse) of a clock signal LTC is input. The first division counter circuit (70) has a count value C1 preset to correction position information (set value) Nv, and decreases the count value C1 whenever a clock pulse of the clock signal LTC is input. When the count value C1 becomes 0, the first division counter circuit (70) outputs a matching signal Ida of 1 pulse. That is, the first division counter circuit (70) outputs a matching signal Ida when counting the clock pulse of the clock signal LTC by the correction position information Nv. This matching signal Ida indicates that the next pixel is a correction pixel, and the first division counter circuit (70) designates the correction pixel by outputting the matching signal Ida. When the matching signal Ida is output, the spot light SP of the beam (LBn) emitted according to the next clock pulse is projected onto the correction pixel. The matching signal Ida output by the first division counter circuit (70) is input to the first division counter circuit (70) through the delay element (72). When the matching signal Ida is input, the first division counter circuit (70) becomes a preset state, and when a new clock pulse of the clock signal LTC is input, it presets the count value C1 to the correction position information (set value) Nv. By doing this, multiple correction pixels can be designated at equal intervals along the drawing line (SLn). In addition, specific values ​​of the correction position information Nv are exemplified below.

[0147] This matching signal Ida is output to the transmission timing switching unit (64) as a setting signal Spp of one pulse through the delay element (74). The delay elements (72, 74) delay the input matching signal Ida for a certain period of time before outputting it. The delay time (certain period) of the delay elements (72, 74) is shorter than the reference period Ta of the clock signal LTC. By doing so, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the count value C1 of the first divider counter circuit (70) can be preset to the correction position information Nv simultaneously with the input of the next clock pulse. Also, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the setting signal Spp can be output to the transmission timing switching unit (64) before the next clock pulse is input.

[0148] To explain the transmission timing switching unit (64) in detail, the transmission timing switching unit (64) has a preset unit (76), a second frequency divider counter circuit (78), and delay elements (80, 82). The preset unit (76) outputs a preset value indicating how many clock pulses (spot light SP) of the clock signal LTC correspond to the next pixel in order to divide the clock pulses (spot light SP) of the clock signal LTC that occur continuously for each pixel. In this preset unit (76), magnification information SCA (composed of stretching information POL and stretching rate information REC), which is part of the local magnification correction information CMgn, is input. This stretching information POL is information indicating whether to stretch or shrink the correction pixel, and stretching rate information REC is information indicating at what ratio the correction pixel is stretched or stretched relative to the normal pixel. As previously mentioned, N±m spot light SPs (clock pulses of the clock signal LTC) correspond to the correction pixels, and the scaling information SCA is information representing these "±m". Furthermore, the polarity "±" of "±m" corresponds to the stretching information (polarity information) POL, and "m" corresponds to the stretching rate information REC. When the value of the 1-bit stretching information POL is high (logic value "1"), it signifies the polarity "+" (stretching the correction pixel), and when it is low (logic value "0"), it signifies the polarity "-" (shrinking the correction pixel). During one scan period of the spot light SP, the same scaling information SCA is input. Therefore, all designated correction pixels on one drawing line (SLn) are stretched or shrunk by the same scaling rate. Additionally, in the first embodiment, m is set to 1 by the stretching rate information REC.

[0149] During the period when a 1-pulse setting signal Spp is not generated (i.e., the period when the logic value of the setting signal Spp is "0"), the pixel through which the spot light SP is scanned in the main direction becomes a normal pixel other than a correction pixel. Therefore, for a normal pixel, since N (=8) spot light SPs (clock pulses of the clock signal LTC) correspond to one pixel, the preset unit (76) outputs a preset value of "7" to the second divider counter circuit (78) during the period when a 1-pulse setting signal Spp is not input. On the other hand, when a 1-pulse setting signal Spp (logic value "1") is generated, the pixel through which the spot light SP is scanned from now on becomes a correction pixel. Accordingly, for the correction pixel, since N±m (=8±1) spot light SP (clock pulse of clock signal LTC) correspond to one pixel, when the preset unit (76) receives a setting signal Spp of one pulse, it outputs a preset value of 7±1 to the second divider counter circuit (78). For example, when the extension information POL is "+" (extension), the preset unit (76) outputs a preset value of "8", and when the extension information POL is "-" (reduction), the preset unit (76) outputs a preset value of "6". Accordingly, the truth table of the preset values ​​output by the preset unit (76) in the first embodiment is shown as in FIG. 10.

[0150] That is, as shown in the truth table of FIG. 10, the preset unit (76) outputs a preset value of “7” to the second divider counter circuit (78) regardless of the extension information POL during the period when a 1-pulse setting signal Spp is not input (i.e., the period when the logic value of the setting signal Spp is “0”). Also, when a 1-pulse setting signal Spp (logic value is “1”) is input to the preset unit (76), it outputs a preset value (“6” or “8”) according to the extension information POL to the second divider counter circuit (78). When the extension information POL is “1” (extension), the preset unit (76) outputs a preset value of “8” to the second divider counter circuit (78), and when the extension information POL is “0” (reduction), it outputs a preset value of “6” to the second divider counter circuit (78).

[0151] The second division counter circuit (78) is a subtraction counter, and the clock pulse of the clock signal LTC is input. The second division counter circuit (78) has the count value C2 preset to the preset value output from the preset unit (76), and decreases the count value C2 whenever the clock pulse of the clock signal LTC is input. When the count value C2 becomes 0, the second division counter circuit (78) outputs a matching signal Idb of 1 pulse. That is, the second division counter circuit (78) outputs the matching signal Idb when counting the clock pulse of the clock signal LTC by the preset value. This matching signal Idb is information indicating a section of one pixel and is output as a pixel shift pulse BSC (BSCa, BSCb) through the delay element (82). When this pixel shift pulse BSC (BSCa, BSCb) occurs, the logical information of the pixel of serial data DLn output to the driving circuit (36a) is shifted by one in the row direction. That is, when the pixel shift pulse BSC (BSCa, BSCb) occurs, the logical information of the next pixel in the row direction is input to the driving circuit (36a). When the pixel shift pulse BSCa occurs, the logical information of the pixel of serial data DL1~DL3 input to the driving circuit (36a) of the light source device (LSa) is shifted by one in the row direction, and similarly, when the pixel shift pulse BSCb occurs, the logical information of the pixel of serial data DL4~DL6 input to the driving circuit (36a) of the light source device (LSb) is shifted by one in the row direction.

[0152] The matching signal Idb output by the second division counter circuit (78) is input to the second division counter circuit (78) through the delay element (80). When the matching signal Idb is input to the second division counter circuit (78), it becomes a preset state, and when a clock pulse of the clock signal LTC is newly input, it presets the count value C2 to the preset value output from the preset section (76). By doing so, the transmission timing of the logic information of each pixel of the serial data DLn can be switched so that when the spot light SP scans a normal pixel, the logic information of the next pixel is output when 8 clock pulses of the clock signal LTC occur, and when the spot light SP scans a corrected pixel, the logic information of the next pixel is output when 7 or 9 clock pulses of the clock signal LTC occur.

[0153] Additionally, the delay element (80, 82) outputs the input match signal Idb after delaying it for a certain period of time, and the delay time (certain period) is shorter than the reference period Ta of the clock signal LTC. By doing so, after the clock pulse of the clock signal LTC is input and the count value C2 becomes 0, the count value C2 of the second divider counter circuit (78) can be preset to the preset value output from the preset unit (76) simultaneously with the input of the next clock pulse. Also, after the clock pulse of the clock signal LTC is input and the count value C2 becomes 0, the pixel shift pulse BSC (BSCa, BSCb) can be output from the signal generator (22a) before the next clock pulse is output.

[0154] In this way, until the clock pulse of the clock signal LTC is output for the number of correction position information Nv, that is, until the spot light SP passes through the correction pixel, the setting signal Spp of 1 pulse is not generated, so when the count value C2 becomes 0, the second division counter circuit (78) is preset to the preset value “7” output from the preset unit (76). Accordingly, whenever 8 clock pulses of the clock signal LTC are output, a pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator (22a), and the logic information of the pixel of the serial data DLn input to the driving circuit (36a) is shifted by 1 in the row direction. Accordingly, at the timing when the spot light SP being scanned in the main projection direction passes through a pixel that is not subject to correction (normal pixel), 8 spot light SPs are projected for 1 pixel.

[0155] And, whenever the clock pulse of the clock signal LTC is output for the number of correction position information Nv, that is, whenever the spot light SP passes through the correction pixel, a setting signal Spp of 1 pulse according to the matching signal Ida from the first division counter circuit (70) is input to the preset unit (76). Accordingly, the count value C2 of the second division counter circuit (78) is preset to a preset value ("6" or "8") according to the extension information POL output from the preset unit (76) whenever the clock pulse of the clock signal LTC is output for the number of correction position information Nv. Therefore, when the extension information POL is "0", the count value C2 of the second division counter circuit (78) is preset to a preset value of "6", so when 7 clock pulses of the clock signal LTC are output, a pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator (22a). Also, when the expansion information POL is "1", the count value C2 of the second division counter circuit (78) is preset to a preset value of "8", so when 9 clock pulses of the clock signal LTC are output, pixel shift pulses BSC (BSCa, BSCb) are output from the signal generator (22a). When these pixel shift pulses BSC (BSCa, BSCb) are output, the logic information of the pixel of the serial data DLn input to the driving circuit (36a) is shifted by 1 in the row direction. Therefore, at the timing when the spot light SP being scanned in the main projection direction passes through the correction pixel, 7 or 9 spot light SPs are projected for one pixel. As a result, correction pixels arranged discretely at equal intervals (Nv interval of the clock pulse of the clock signal LTC) on the drawing line (SLn) can be expanded.

[0156] 1. If the number of pixels in a drawing line (SLn) is set to 10,000 and 40 correction pixels are placed at equal intervals on the drawing line (SLn), the correction pixels are placed at intervals of 250 pixels. In this case, the number of pixels other than the correction target (normal pixels) is 9,960. When the number of spot light SP (clock pulse of clock signal LTC) of the correction pixels is 7 (when the stretching information POL is "0"), the number of spot light SP projected from one drawing line (SLn) becomes 79,960 (= 80,000 - 40, or = 9,960 × 8 + 40 × 7), and the correction position information Nv becomes 1,999 (= 7,9960 / 40). Therefore, when looking at one drawing line (SLn), if the initial value of the scan length (length of the drawing line (SLn)) in the case without local magnification correction is 30 mm, the scan length reduced by local magnification correction is reduced by 15 μm (= 3 μm × 1 / 8 × 40) because 40 spot light SPs are not irradiated, and the magnification becomes 0.9995 (= 29.985 / 30), that is, -500 ppm. Also, when the number of spot light SPs (clock pulses of the clock signal LTC) of the correction pixel is 9 (when the stretching information POL is "1"), the number of spot light SPs projected from one drawing line (SLn) becomes 80040 (= 80000 + 40, or = 9960 × 8 + 40 × 9), and the correction position information Nv becomes 2001 (= 80040 / 40). Therefore, when looking at 1 drawing line (SLn), if the initial value of the scanning length (length of the drawing line (SLn)) in the case without local magnification correction is 30 mm, the scanning length extended by local magnification correction is extended by 15 μm (= 3 μm × 1 / 8 × 40) because 40 extra spot light SPs are irradiated, and the magnification becomes 1.0005 (= 30.015 / 30), that is, + 500 ppm.In addition, as described above, the clock pulse of the clock signal LTC is generated at a predetermined frequency (oscillation frequency) Fa regardless of whether local magnification correction is performed, so the projection interval of the spot light SP along the drawing line (SLn) is constant, and in the first embodiment, the size φ of the spot light SP is set to 3㎛, and the spot light SP is projected while overlapping by 7 / 8 along the main projection direction. That is, the projection interval of the spot light SP becomes 0.375㎛, which is 1 / 8 of the size φ of the spot light SP, and the amount of stretching per pixel in the correction pixel also becomes ±0.375㎛.

[0157] The correction position information (set value) Nv of this local magnification correction information CMgn (CMg1~CMg6) can be changed arbitrarily and is set appropriately according to the magnification of the drawing line (SLn). For example, the correction position information Nv may be set so that there is only one correction pixel located on the drawing line (SLn). Although the drawing line SL can also be stretched by the overall magnification correction information TMg, local magnification correction allows for finer, minute magnification correction. For example, if the oscillation frequency Fa is 400 MHz and the initial value of the scanning length (drawing range) of the drawing line (SLn) is 30 mm, when the scanning length of the drawing line (SLn) is stretched or extended by 15 μm (ratio 500 ppm) by the overall magnification correction information TMg, the oscillation frequency Fa must be increased or decreased by approximately 0.2 MHz (ratio 500 ppm), making such adjustment difficult. Furthermore, even if adjustment is possible, the oscillation frequency Fa is switched to the adjusted oscillation frequency after a certain delay (time constant), so the desired magnification cannot be obtained during that time. In addition, when the correction ratio of the drawing magnification is set to 500 ppm or less, for example, several ppm to tens of ppm, the local magnification correction method, which increases or decreases the number of spot lights in discrete correction pixels, can perform high-resolution correction more easily than the overall magnification correction method, which changes the oscillation frequency Fa of the light source device (LSa(LSb)). Of course, if both the overall magnification correction method and the local magnification correction method are used in combination, the advantage of being able to perform high-resolution correction while corresponding to a large correction ratio of the drawing magnification is obtained.

[0158] In addition, m is set to 1 by the stretching rate information REC, but m can be an integer greater than or equal to 1 having the relationship m < N. Also, the value of the correction position information Nv is kept constant in one drawing line (SLn), but the correction position information Nv may be changed in one drawing line (SLn). In this case, there is no change in the fact that multiple correction pixels are designated at discrete positions on the drawing line (SLn), but by changing the correction position information Nv, the spacing between correction pixels can be made non-uniform. In addition, for every scan of the beam along the drawing line (SLn) or every rotation of the polygon mirror (PM), the position of the correction pixels may be changed without changing the number of correction pixels on the drawing line (SLn).

[0159] Additionally, the clock pulse of the clock signal LTC generated by the clock generator (60) is input to the first division counter circuit (70) of the correction pixel designation unit (62) and the second division counter circuit (78) of the transmission timing switching unit (64) through the gate circuit (GTa). This gate circuit (GTa) is a gate that opens during the period when the drawing permission signal SQn, which will be described later, is high (logic value 1). That is, the first division counter circuit (70) and the second division counter circuit (78) count the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high. This drawing permission signal SQn (SQ1~SQ6) is a signal indicating whether to permit drawing by scanning the spot light SP of the corresponding scanning unit (Un(U1~U6)), and drawing is permitted only during the period when it is high. That is, only during the period when this drawing permission signal SQn (SQ1~SQ6) is high, the spot light SP of the corresponding scanning unit (Un(U1~U6)) is scanned along the drawing line (SLn(SL1~SL6)), and its intensity is modulated based on the serial data DLn (DL1~DL6).

[0160] Accordingly, three drawing permission signals SQ1 to SQ3 corresponding to scanning units (U1 to U3) are applied to the gate circuit (GTa) of the light source device (LSa). The gate circuit (GTa) of the light source device (LSa) outputs a clock pulse of the clock signal LTC input during the period when any of the drawing permission signals SQ1 to SQ3 are high (H). Likewise, three drawing permission signals SQ4 to SQ6 corresponding to scanning units (U4 to U6) are applied to the gate circuit (GTa) of the light source device (LSb). The gate circuit (GTa) of the light source device (LSb) outputs a clock pulse of the clock signal LTC input during the period when any of the drawing permission signals SQ4 to SQ6 are high (H). As described above, the drawing line (SLn) refers to a range in which the intensity is modulated by the serial data DLn within the range of the maximum scanning length in which the spot light SP is scanned along the main scanning direction. In this way, by counting the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high, the first division counter circuit (70) can accurately specify the correction pixel located on the drawing line (SLn), and the second division counter circuit (78) can accurately partition the pixel located on the drawing line SL.

[0161] FIG. 11 is a time chart showing the clock pulse of the clock signal LTC, the count value C2 of the second divider counter circuit (78), the output timing of the pixel shift pulse BSC (BSCa, BSCb), and the switching timing of the logic information of the pixel of the serial data DLn input to the driving circuit (36a). Also, in FIG. 11, for convenience, the size φ of the spot light SP of the beam (LB) generated in response to the clock pulse of the clock signal LTC is shown as being very small relative to the pixel dimension Pxy. As shown in FIG. 11, the second divider counter circuit (78) decreases the count value C2 whenever the clock pulse of the clock signal LTC is input, and outputs a match signal Idb (not shown) when the count value C2 becomes 0. According to this match signal Idb, the pixel shift pulse BSC (BSCa, BSCb) is output. This pixel shift pulse BSC (BSCa, BSCb) is output during the period from the clock pulse when the count value C2 becomes 0 until the next clock pulse is input. According to this pixel shift pulse BSC (BSCa, BSCb), the logical information of the pixel of the serial data DLn input to the driving circuit (36a) is shifted by one in the row direction. That is, when the pixel shift pulse BSC (BSCa, BSCb) is output, the logical information of the pixel of the next row is output to the driving circuit (36a). FIG. 11 shows an example in which the logical information of the pixel is switched in the order of “0” → “1” → “1” → “0” according to the output of the pixel shift pulse BSC (BSCa, BSCb).

[0162] Although not shown, the first divider counter circuit (70) decreases the count value C1 whenever a clock pulse of the clock signal LTC is input, and outputs a match signal Ida when the count value C1 becomes 0. Based on this match signal Ida, a setting signal Spp (value is “1”) is generated and input to the preset section (76). After the first divider counter circuit (70) outputs the match signal Ida, when a new clock pulse of the clock signal LTC is input, it presets the count value C1 to the correction position information Nv.

[0163] The second division counter circuit (78) presets the count value C2 to a preset value output from the preset unit (76) simultaneously with the input of the clock pulse of the next clock signal LTC when the count value C2 becomes 0. This preset unit (76) outputs a preset value of "7" when the setting signal Spp (value "1") is not generated. Therefore, during the period when a 1-pulse setting signal Spp is not generated (the period when the logic value of the setting signal Spp is "0"), a pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator (22a) whenever 8 clock pulses of the clock signal LTC are generated. Accordingly, during the period when a 1-pulse setting signal Spp is not generated, 8 spot lights SP are projected along the main projection direction for 1 pixel (normal pixel).

[0164] Meanwhile, when a setting signal Spp (value "1") is input to the preset unit (76) (when the count value C1 of the first divider counter circuit (70) becomes "0"), the preset value from the preset unit (76) becomes a value ("6" or "8") according to the stretching information POL. Accordingly, when a setting signal Spp (logic value "1") of one pulse is generated, seven or nine clock pulses of the clock signal LTC are generated, and then a pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator (22a). Therefore, when a setting signal Spp of one pulse is generated, seven or nine spot lights SP are projected along the main projection direction for one pixel (corrected pixel). In the example shown in FIG. 11, when the setting signal Spp occurs, the preset value is set to "6", so when 7 clock pulses occur, the pixel shift pulse BSC (BSCa, BSCb) is output. Next, until the count value C1 of the first division counter circuit (70) becomes 0 again, the logic value of the setting signal Spp remains "0", so the preset value of the count value C2 of the second division counter circuit (78) is returned to "7".

[0165] Additionally, although the correction pixel designation unit (62) and the transmission timing switching unit (64) are provided inside the signal generation unit (22a), the correction pixel designation unit (62) and the transmission timing switching unit (64) may be provided outside the signal generation unit (22a) as inside the control circuit (22), or the correction pixel designation unit (62) and the transmission timing switching unit (64) may be provided outside the control circuit (22). In this case, the correction pixel designation unit (62) and the transmission timing switching unit (64) may be provided inside the beam control device (104) described later (for example, inside the drawing data output unit (114)).

[0166] FIG. 12 is a block diagram showing the electrical configuration of an exposure device (EX). The control device (16) of the exposure device (EX) has a polygon drive control unit (100), a selection element drive control unit (102), a beam control unit (104), a mark position detection unit (106), and a rotation position detection unit (108). In addition, the origin signal SZn (SZ1~SZ6) output by the origin sensor (OPn) (OP1~OP6) of each scanning unit (Un(U1~U6)) is input to the polygon drive control unit (100) and the selection element drive control unit (102). In addition, in the example shown in FIG. 12, a beam (LBa(LBb)) from a light source device (LSa(LSb)) is diffracted by a selection optical element (AOM2)(AOM5), and the beam (LB2)(LB5), which is the first diffracted light, is incident on a scanning unit (U2)(U5).

[0167] The polygon drive control unit (100) drives and controls the rotation of the polygon mirror (PM) of each scanning unit (Un(U1~U6)). The polygon drive control unit (100) has a rotation drive source (motor or reduction gear, etc.) (RM) that drives the polygon mirror (PM) of each scanning unit (Un(U1~U6)), and drives and controls the rotation of the polygon mirror (PM) by driving and controlling the rotation of this motor. The polygon drive control unit (100) synchronously rotates each of the polygon mirrors (PM) of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module so that the rotation angle positions of the polygon mirrors (PM) of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module have a predetermined phase relationship. Specifically, the polygon drive control unit (100) controls the rotation of the polygon mirrors (PM) of a plurality of scanning units (Un(U1~U6)) such that the rotation speed (number of rotations) Vp of the polygon mirrors (PM) of the three scanning units (Un(U1~U3, U4~U6)) of each scanning module are equal to each other, and the phase of the rotation angle position is offset by a certain angle. In addition, the rotation speed Vp of the polygon mirrors (PM) of each scanning unit (Un(U1~U6)) is all made equal.

[0168] In the first embodiment, as described above, the rotation angle α of the polygon mirror (PM) contributing to the actual scanning is set to 15 degrees, so the scanning efficiency of the polygon mirror (PM) with eight octagonal reflection surfaces (RP) becomes 1 / 3. In the first scanning module, the scanning of spot light SP by three scanning units (Un) is performed in the order U1→U2→U3. Accordingly, in this order, each polygon mirror (PM) of the scanning units (U1~U3) is synchronously controlled by the polygon driving control unit (100) so that the phase of the rotation angle position of each polygon mirror (PM) of these three scanning units (U1~U3) is offset by 15 degrees and rotates at a constant speed. Also, in the second scanning module, the scanning of spot light SP by three scanning units (Un) is performed in the order U4→U5→U6. Accordingly, in this order, each polygon mirror (PM) of each of the three scanning units (U4~U6) is synchronously controlled by the polygon drive control unit (100) so that the phase of the rotation angle position of each polygon mirror (PM) of each of the three scanning units (U4~U6) is offset by 15 degrees and rotates at a constant speed.

[0169] Specifically, as shown in FIG. 13, the polygon driving control unit (100), for example, with respect to the first scanning module, controls the rotational phase of the polygon mirror (PM) of the scanning unit (U2) so that the origin signal SZ2 from the origin sensor OP2 of the scanning unit (U2) is delayed by time Ts based on the origin signal SZ1 from the origin sensor (OP1) of the scanning unit (U1). The polygon driving control unit (100) controls the rotational phase of the polygon mirror (PM) of the scanning unit (U3) so that the origin signal SZ3 from the origin sensor (OP3) of the scanning unit (U3) is delayed by 2 × time Ts based on the origin signal SZ1. This time Ts is the time for the polygon mirror (PM) to rotate 15 degrees (maximum scanning time of spot light SP), and in the first embodiment, it is approximately 206.666···μsec (=Tpx × 1 / 3 = 620〔μsec〕 / 3). By this, the phase difference of the rotation angle position of each polygon mirror (PM) of each scanning unit (U1~U3) is offset by 15 degrees in the order of U1, U2, and U3. Accordingly, the three scanning units (U1~U3) of the first scanning module can perform scanning of spot light SP in the order of U1→U2→U3.

[0170] Likewise, with respect to the second scanning module, the polygon driving control unit (100) controls the rotational phase of the polygon mirror (PM) of the scanning unit (U5) so that, for example, the origin signal SZ5 from the origin sensor (OP5) of the scanning unit (U5) is delayed by time Ts based on the origin signal SZ4 from the origin sensor (OP4) of the scanning unit (U4). The polygon driving control unit (100) controls the rotational phase of the polygon mirror (PM) of the scanning unit (U6) so that the origin signal SZ6 from the origin sensor (OP6) of the scanning unit (U6) is delayed by 2 × time Ts based on the origin signal SZ4. By doing so, the phase of the rotational angle position of each polygon mirror (PM) of each scanning unit (U4~U6) is offset by 15 degrees in the order of U4, U5, and U6. Accordingly, the three scanning units (Un(U4~U6)) of the second scanning module can perform scanning of spot light SP in the order of U4→U5→U6.

[0171] The selection element driving control unit (beam switching driving control unit) (102) controls the selection optical elements (AOMn (AOM1~AOM3, AOM4~AOM6)) of each optical element module of the beam switching unit (BDU) and distributes the beams (LB) (LBa, LBb) from the light source device (LS (LSa, LSb)) to the three scanning units (Un (U1~U3, U4~U6)) of each scanning module in order from when one scanning unit (Un) of each scanning module starts scanning the spot light SP until when the next scanning starts. In addition, the polygon mirror (PM) rotates 45 degrees from when one scanning unit (Un) starts scanning the spot light SP until when the next scanning starts, and the time interval is time Tpx (=3×Ts).

[0172] Specifically, when the origin signal SZn (SZ1~SZ6) is generated, the selection element driving control unit (102) applies a driving signal (high frequency signal) HFn (HF1~HF6) to the selection optical element (AOMn (AOM1~AOM6)) corresponding to the scanning unit (Un (U1~U6)) that generated the origin signal SZn (SZ1~SZ6) for a certain amount of time (on time Ton) after the origin signal SZn is generated. By doing so, the selection optical element (AOMn) to which the driving signal (high frequency signal) HFn is applied becomes ON for the amount of ON time Ton, and can cause a beam (LBn) to be incident on the corresponding scanning unit (Un). Also, since the beam (LBn) is incident on the scanning unit (Un) that generated the origin signal SZn, the beam (LBn) can be incident on the scanning unit (Un) that can perform scanning of the spot light SP. Also, this on time Ton is a time less than or equal to time Ts.

[0173] The origin signals SZ1 to SZ3 generated from the three scanning units (U1 to U3) of the first scanning module are generated in the order of SZ1 → SZ2 → SZ3 at intervals of time Ts. Accordingly, driving signals (high frequency signals) HF1 to HF3 are applied to each selection optical element (AOM1 to AOM3) of the first optical element module in the order of AOM1 → AOM2 → AOM3 at intervals of time Ts for a duration of time Ton. Therefore, the first optical element module (AOM1 to AOM3) can switch one scanning unit (Un) into which a beam (LBn (LB1 to LB3)) from the light source device (LSa) is incident in the order of U1 → U2 → U3 at intervals of time Ts. By doing so, the scanning unit (Un) that performs the scanning of the spot light SP can be switched in the order of U1 → U2 → U3 at intervals of time Ts. In addition, during the time (Tpx = 3 × Ts) from when the scanning unit (U1) starts scanning the spot light SP and when it starts the next scanning, a beam (LBn (LB1~LB3)) from the light source device (LSa) can be incident on any one of the three scanning units (Un) (U1~U3) in sequence.

[0174] Likewise, the origin signals SZ4 to SZ6 generated from the three scanning units (U4 to U6) of the second scanning module are generated in the order of SZ4 → SZ5 → SZ6 at time intervals of Ts. Accordingly, driving signals (high frequency signals) HF4 to HF6 are applied to each selection optical element (AOM4 to AOM6) of the second optical element module in the order of AOM4 → AOM5 → AOM6 at time intervals of Ts for a duration of Ton. Therefore, the second optical element module (AOM4 to AOM6) switches one scanning unit (Un) into which the beam (LBn (LB4 to LB6)) from the light source device (LSb) is incident in the order of U4 → U5 → U6 at time intervals of Ts. By doing so, the scanning unit (Un) that performs the scanning of the spot light SP can be switched in the order of U4 → U5 → U6 at time intervals of Ts. In addition, during the time (Tpx = 3 × Ts) between when the scanning unit (U4) starts scanning the spot light SP and when it starts the next scanning, a beam (LBn (LB4~LB6)) from the light source device (LSb) can be incident on any one of the three scanning units (Un (U4~U6)) in sequence.

[0175] To further explain the selection element driving control unit (102) in detail, the selection element driving control unit (102) generates a plurality of incident permission signals LPn (LP1~LP6) that become H (high) for a certain amount of time (on time Ton) after the origin signal SZn (SZ1~SZ6) is generated, as shown in FIG. 13. These plurality of incident permission signals LPn (LP1~LP6) are signals that allow the corresponding selection optical element (AOMn (AOM1~AOM6)) to be turned on. That is, the incident permission signals LPn (LP1~LP6) are signals that allow the incident of a beam (LBn (LB1~LB6)) to the corresponding scanning unit (Un (U1~U6)). Then, the selection element driving control unit (102) applies a driving signal (high frequency signal) HFn (HF1~HF6) to the corresponding selection optical element (AOMn (AOM1~AOM6)) for an ON time Ton during which the incident permission signal LPn (LP1~LP6) is H (high), and sets the corresponding selection optical element (AOMn) to an ON state (a state that generates first-order diffracted light). For example, the selection element driving control unit (102) applies driving signals HF1~HF3 to the corresponding selection optical element (AOM1~AOM3) for a certain time Ton during which the incident permission signal LP1~LP3 is H (high). By doing so, beams (LB1~LB3) from the light source device (LSa) are incident on the corresponding scanning unit (U1~U3). Additionally, the selection element driving control unit (102) applies driving signals (high frequency signals) HF4~HF6 to the corresponding selection optical elements (AOM4~AOM6) for a certain amount of time Ton during which the incident permission signals LP4~LP6 are H (high). By doing so, beams (LB4)~LB6) from the light source device (LSb) are incident on the corresponding scanning units (U4~U6).

[0176] As shown in FIG. 13, the incident permission signals LP1 to LP3 corresponding to the three selectable optical elements (AOM1 to AOM3) of the first optical element module have rising timings that become H (high) offset by time Ts in the order LP1→LP2→LP3, and the on-times Ton that become H (high) do not overlap with each other. Therefore, the scanning unit (Un) into which the beam (LBn (LB1 to LB3)) is incident switches in the order U1→U2→U3 at intervals of time Ts. Similarly, the incident permission signals LP4 to LP6 corresponding to the three selectable optical elements (AOM4 to AOM6) of the second optical element module have rising timings that become H (high) offset by time Ts in the order LP4→LP5→LP6, and the on-times Ton that become H (high) do not overlap with each other. Accordingly, the scanning unit (Un) into which the beam (LBn (LB4~LB6)) is incident is switched in the order of U4→U5→U6 at time intervals Ts. The selection element driving control unit (102) outputs the generated plurality of incident permission signals LPn (LP1~LP6) to the beam control device (104).

[0177] The beam control device (beam control unit) (104) controls the emission frequency Fa of the beam (LB) (LBa, LBb, LBn), the magnification of the drawing line (SLn) where the spot light SP of the beam (LB) is drawn, and the intensity modulation of the beam (LB). The beam control device (104) is equipped with an overall magnification setting unit (110), a local magnification setting unit (112), a drawing data output unit (114), and an exposure control unit (116). The overall magnification setting unit (overall magnification correction information memory unit) (110) stores the overall magnification correction information TMg sent from the exposure control unit (116) and outputs the overall magnification correction information TMg to the signal generation unit (22a) of the control circuit (22) of the light source device (LS(LSa, LSb)). The clock generation unit (60) of the signal generation unit (22a) generates a clock signal LTC of an oscillation frequency Fa according to the overall magnification correction information TMg.

[0178] The local magnification setting unit (local magnification correction information storage unit, correction information storage unit) (112) stores the local magnification correction information (correction information) CMgn sent from the exposure control unit (116) and outputs the local magnification correction information CMgn to the signal generation unit (22a) of the control circuit (22) of the light source device (LS (LSa, LSb)). Based on this local magnification correction information CMgn, the position of the correction pixel on the drawing line (SLn) is specified, and the magnification is determined. The signal generation unit (22a) of the control circuit (22) outputs a pixel shift pulse BSC (BSCa, BSCb) according to the correction pixel determined based on this local magnification correction information CMgn and the magnification. Additionally, the local magnification setting unit (112) stores local magnification correction information CMgn (CMg1~CMg6) for each scanning unit (Un(U1~U6)) sent from the exposure control unit (116). Then, the local magnification setting unit (112) outputs local magnification correction information CMgn corresponding to the scanning unit (Un) that performs the scanning of the spot light SP to the signal generation unit (22a) of the light source device (LS(LSa, LSb)). That is, the local magnification setting unit (112) outputs local magnification correction information CMgn corresponding to the scanning unit (Un) that generated the origin signal SZn (SZ1~SZ6) to the signal generation unit (22a) of the light source device (LSa(LSa, LSb)) which is the source of the beam (LBn) incident on the scanning unit (Un).

[0179] For example, if the scanning unit (Un) that generated the origin signal SZn (i.e., the scanning unit (Un) that will now perform the scanning of the spot light SP) is any of the scanning units (U1 to U3), the local magnification setting unit (112) outputs local magnification correction information CMgn corresponding to the scanning unit (Un) that generated the origin signal SZn to the signal generating unit (22a) of the light source device (LSa). Likewise, if the scanning unit (Un) that generated the origin signal SZn is any of the scanning units (U4 to U6), the local magnification setting unit (112) outputs local magnification correction information CMgn corresponding to the scanning unit (Un) that generated the origin signal SZn to the signal generating unit (22a) of the light source device (LSb). By this, a pixel shift pulse BSC (BSCa, BSCb) corresponding to a scanning unit (Un(U1~U3, U4~U6)) that performs scanning of spot light SP for each scanning module is output from the output timing switching unit (64) of the light source device (LS(LSa, LSb)). By this, the scanning length can be adjusted individually for each drawing line (SLn).

[0180] The drawing data output unit (114) outputs one column of serial data DLn corresponding to the scanning unit (Un) (the scanning unit (Un) that will now perform the scanning of the spot light SP) among the three scanning units (Un) (U1~U3) of the first scanning module, as drawing bit sequence data SBa, to the driving circuit (36a) of the light source device (LSa). Additionally, the drawing data output unit (114) outputs one column of serial data DLn (DL4~DL6) corresponding to the scanning unit (Un) (the scanning unit (Un) that will now perform the scanning of the spot light SP) among the three scanning units (Un(U4~U6)) of the second scanning module, as drawing bit sequence data SBb, to the driving circuit (36a) of the light source device (LSb). Regarding the first scanning module, the sequence of scanning units (U1 to U3) that perform scanning of spot light SP is U1→U2→U3, so the drawing data output unit (114) outputs serial data DL1~DL3 that are repeated in the sequence DL1→DL2→DL3 as drawing bit sequence data SBa. Regarding the second scanning module, the sequence of scanning units (U4~U6) that perform scanning of spot light SP is U4→U5→U6, so the drawing data output unit (114) outputs serial data DL4~DL6 that are repeated in the sequence DL4→DL5→DL6 as drawing bit sequence data SBb.

[0181] Using FIG. 14, the configuration of the drawing data output unit (114) is described in detail. The drawing data output unit (114) has a first data output unit (114a) that outputs drawing bit sequence data SBa and a second data output unit (114b) that outputs drawing bit sequence data SBb. The first data output unit (114a) has three generation circuits (GE1, GE2, GE3) corresponding to each of the scanning units (U1~U3) (selection optical elements (AOM1~AOM3)) and a three-input OR gate unit (GT1m). The generation circuit (GE1) has a memory unit (BM1), a counter unit (CON1), a two-input AND gate unit (GT1a, GT1b), and a drawing permission signal generation unit (OSM1). The generation circuit (GE2) has a memory section (BM2), a counter section (CON2), two-input AND gate sections (GT2a, GT2b), and a drawing permission signal generation section (OSM2). The generation circuit (GE3) has a memory section (BM3), a counter section (CON3), two-input AND gate sections (GT3a, GT3b), and a drawing permission signal generation section (OSM3). The second data output section (114b) has three generation circuits (GE4, GE5, GE6) corresponding to each of the scanning units (U1~U3) (selection optical elements (AOM1~AOM3)) and a three-input OR gate section (GT2m). The generation circuit (GE4) has a memory section (BM4), a counter section (CON4), two-input AND gate sections (GT4a, GT4b), and a drawing permission signal generation section (OSM4). The generation circuit (GE5) has a memory section (BM5), a counter section (CON5), two-input AND gate sections (GT5a, GT5b), and a drawing permission signal generation section (OSM5). The generation circuit (GE6) has a memory section (BM6), a counter section (CON6), two-input AND gate sections (GT6a, GT6b), and a drawing permission signal generation section (OSM6).

[0182] Each drawing permission signal generation unit (OSMn(OSM1~OSM6)) is configured by a oneshot multivibrator, etc. Each drawing permission signal generation unit (OSMn(OSM1~OSM6)) generates a drawing permission signal SQn (SQ1~SQ6) that adjusts the drawing start timing of the spot light SP by the corresponding scanning unit (Un(U1~U6)). An incident permission signal LPn (LP1~LP6) of the corresponding scanning unit (Un(U1~U6)) is input to each drawing permission signal generation unit (OSMn(OSM1~OSM6)), and based on this input incident permission signal LPn (LP1~LP6), a drawing permission signal SQn (SQ1~SQ6) is generated. For example, an incident permission signal LP1 is input to the drawing permission signal generator (OSM1), and the drawing permission signal generator (OSM1) generates a drawing permission signal SQ1 based on the input incident permission signal LP1. Likewise, incident permission signals LP2 to LP6 are input to the drawing permission signal generator (OSM2 to OSM6), and the drawing permission signal generator (OSM2 to OSM6) generates drawing permission signals SQ2 to SQ6 based on the input incident permission signals LP2 to LP6. During the period when the drawing permission signals SQn (SQ1 to SQ6) are high (H), serial data DLn (DL1 to DL6) of the corresponding scanning unit (Un(U1 to U6)) is output to the driving circuit (36a).

[0183] FIG. 15 is a time chart showing the drawing permission signal SQn generated by the drawing permission signal generation unit OSMn and the pixel shift pulse BSC output during the period when the drawing permission signal SQn is high (logic value 1). As described above, when the origin signal SZn (SZ1~SZ6) is generated, the incident permission signal LPn (LP1~LP6) is generated, which becomes high (H) for a certain period of time (on time Ton) after the origin signal SZn (SZ1~SZ6) is generated. Furthermore, it goes without saying that this on time Ton is a time less than or equal to time Ts, which is the maximum scanning time of the spot light SP of the scanning unit (Un). The drawing permission signal generation unit (OSMn(OSM1~OSM6)) generates a drawing permission signal SQn (SQ1~SQ6) that rises after the incident permission signal LPn (LP1~LP6) becomes high "1," that is, after the origin signal SZn (SZ1~SZ6) is generated and a delay time Tdn (Td1~Td6) has elapsed, and also falls simultaneously with or before the incident permission signal LPn (LP1~LP6) becomes low "0". For example, the drawing permission signal generation unit (OSM3) generates a drawing permission signal SQ3 that rises after the incident permission signal LP3 becomes high and a delay time Td3 has elapsed, and also falls simultaneously with or before the incident permission signal LP3 becomes low. These drawing permission signals SQ1~SQ3 become high (H) in the order of SQ1→SQ2→SQ3, and the times when they become high (H) do not overlap. Likewise, these drawing permission signals SQ4~SQ6 become high (H) in the order of SQ4→SQ5→SQ6, and the times when they become high (H) do not overlap. During the period when these drawing permission signals SQn (SQ1~SQ6) are actually high (H), the drawing of spot light SP is permitted on the irradiated surface of the substrate (P).

[0184] By varying this delay time Tdn, the position of the drawing line (SLn) on the substrate (P) can be shifted along the main scanning direction (Y direction). That is, by shortening the delay time Td, the position of the drawing line (SLn) in the main scanning direction is shifted toward the drawing start position side (opposite to the main scanning direction), and by lengthening the delay time Td, the position of the drawing line (SLn) in the main scanning direction is shifted toward the drawing end position side (main scanning direction side). In principle, this delay time Tdn is set so that the center point of the drawing line (SLn) is at the center (center point) of the maximum scanning length (e.g., 31 mm). Therefore, while the delay time Tdn remains constant, if the scanning length of the drawing line (SLn) is stretched by at least one of the overall magnification correction information TMg and the local magnification correction information CMgn, the center point of the drawing line (SLn) is not located at the center of the maximum scanning length. Accordingly, this delay time Tdn may be determined by the overall magnification correction information TMg and the local magnification correction information CMgn. By this delay time Tdn (Td1~Td6), each drawing line (SLn(SL1~SL6)) can be individually shifted along the main direction. The exposure control unit (116) generates delay information representing the delay time Tdn (Td1~Td6) based on the overall magnification correction information TMg and the local magnification correction information CMgn, and outputs the generated delay information to the drawing permission signal generation unit (OSMn(OSM1~OSM6)). The drawing permission signal generation unit (OSMn(OSM1~OSM6)) determines the delay time Tdn (Td1~Td6) of the drawing permission signal SQn (SQ1~SQ6) generated based on the input delay information.

[0185] FIG. 16 is a diagram showing the relationship between the position of the drawing line (SLn) stretched within the range of the maximum scan length and the delay time Td. The symbol MSLn represents the drawing line (SLn) of the maximum scan length. Also, the symbol SLna represents the drawing line (SLn) of the initial value that is not stretched, and the delay time Tdn in this case is represented as Tda. That is, the delay time Tda is set as the initial value so that the center point pa of the drawing line (SLna) comes to the center point pm of the maximum scan length. Also, the symbol SLnb represents the drawing line (SLn) when the drawing line (SLna) of the initial value is reduced by total magnification correction or local magnification correction, and the symbol SLnc represents the drawing line (SLn) when the drawing line (SLna) of the initial value is stretched by total magnification correction or local magnification correction.

[0186] If the delay time of the drawing line (SLnb) is set to the same delay time Tda as that of the drawing line (SLna), the drawing start timing becomes the same as that of the drawing line (SLna). Therefore, the drawing start point of the drawing line (SLnb) does not shift along the drawing direction relative to the drawing start point of the drawing line (SLna). However, in this case, since the drawing line (SLnb) is reduced relative to the drawing line (SLna), the drawing end point of the drawing line (SLnb) is offset from the drawing end point of the drawing line (SLna) toward the drawing start point. Consequently, the position of the center point pb of the drawing line (SLnb) is offset from the position of the center point pm of the drawing line MSLn with the maximum scanning length toward the drawing start point. Therefore, in the case of the drawing line (SLnb), the delay time Tdb may be determined based on the reduction ratio of the drawing line (SLnb) such that the center point pb of the drawing line (SLnb) coincides with the center point pm of the drawing line MSLn. In this case, the delay time Tdb becomes longer than the delay time Tda, and the drawing start point of the drawing line (SLnb) is shifted toward the drawing end point (main scanning direction) from the drawing start point of the drawing line (SLna).

[0187] Also, if the delay time of the drawing line (SLnc) is set to the same delay time Tda as that of the drawing line (SLna), the drawing start timing becomes the same as that of the drawing line (SLna). Therefore, the drawing start point of the drawing line (SLnc) does not shift along the main scanning direction relative to the drawing start point of the drawing line (SLna). However, in this case, since the drawing line (SLnb) is extended relative to the drawing line (SLna), the drawing end point of the drawing line (SLnc) deviates from the drawing end point of the drawing line (SLna) toward the drawing end point side (main scanning direction side). Consequently, the position of the center point pc of the drawing line (SLnc) deviates from the position of the center point pm of the drawing line MSLn with the maximum scanning length toward the drawing end point side. Therefore, in the case of the drawing line (SLnc), the delay time Tdc may be determined based on the elongation rate of the drawing line (SLnc) such that the center point pc of the drawing line (SLnc) coincides with the center point pm of the drawing line MSLn. In this case, the delay time Tdc becomes shorter than the delay time Tda, and the drawing start point of the drawing line (SLnc) is shifted toward the drawing start point side (opposite to the main scanning direction) from the drawing start point of the drawing line (SLna).

[0188] Returning to the description of FIG. 14, the drawing permission signals SQn (SQ1~SQ6) generated by each drawing permission signal generation unit (OSMn (OSM1~OSM6)) are input to one input terminal of the AND gate unit (GTnb (GT1b~GT6b)). Specifically, the drawing permission signal SQ1 is input to one input terminal of the AND gate unit (GT1b), and likewise, the drawing permission signals SQ2~SQ6 are input to one input terminal of the AND gate unit (GT2b~GT6b). The pixel shift pulse BSC (BSCa, BSCb) is input to the other input terminal of the AND gate unit (GTnb (GT1b~GT6b)). A pixel shift pulse BSCa from the signal generator (22a) of the light source device (LSa) is simultaneously input to the AND gate section (GT1b~GT3b), and a pixel shift pulse BSCb from the signal generator (22a) of the light source device (LSb) is simultaneously input to the AND gate section (GT4b~GT6b). As shown in FIG. 15, the AND gate section (GTnb(GT1b~GT6b)) outputs the input pixel shift pulse BSC (BSCa, BSCb) only during the time when the drawing permission signal SQn (SQ1~SQ6) input from the drawing permission signal generator (OSMn(OSM1~OSM6)) is high. Additionally, the pixel shift pulse BSCa (BSCb) is generated by the gate circuit (GTa) of FIG. 9 during the period when the drawing permission signals SQ1~SQ3 (SQ4~SQ6) are high.

[0189] In the three AND gate sections (GT1b~GT3b (GT4b~GT6b)), a pixel shift pulse BSCa (BSCb) is input to shift the pixels of the serial data DLn of the scanning unit (Un) corresponding to the drawing permission signal SQn which is high among the three drawing permission signals SQ1~SQ3 (SQ4~SQ6). To be more specific, during the period when the drawing permission signal SQ1 is high, a pixel shift pulse BSCa that shifts the pixels of the serial data DL1 of the scanning unit (U1) corresponding to the drawing permission signal SQ1 is input to the three AND gate sections (GT1b~GT3b). Also, during the period when the drawing permission signals SQ2 and SQ3 are high, a pixel shift pulse BSCa that shifts the pixels of serial data DL2 and DL3 of the scanning units (U2 and U3) corresponding to the drawing permission signals SQ2 and SQ3 is input to three AND gate sections (GT1b to GT3b). Likewise, during the period when the drawing permission signals SQ4 and SQ6 are high, a pixel shift pulse BSCb that shifts the pixels of serial data DL4 and DL6 of the scanning units (U4 and U6) corresponding to the drawing permission signals SQ4 and SQ6 is input to three AND gate sections (GT4b to GT6b).

[0190] Each memory unit (drawing data storage unit) (BMn (BM1~BM6)) is a memory that stores pattern data (bit map) according to the pattern that the corresponding scanning unit (Un (U1~U6)) must draw and expose. The counter unit (CONn (CON1~CON6)) is a counter for outputting the logical information of each pixel of the serial data DLn (DL1~DL6) among the pattern data stored in the memory unit (BMn) (BM1~BM6), in synchronization with the pixel shift pulse BSC (BSCa, BSCb) by one pixel in the row direction. By this, during the time when the drawing permission signal SQn (SQ1~SQ6) is high (H), the logical information of each pixel of the serial data DLn (DL1~DL6) of the corresponding scanning unit (Un (U1~U6)) is output in synchronization with the pixel shift pulse BSC (BSCa, BSCb) by one pixel in the row direction. For example, during the period when the drawing permission signal SQ1 (SQ2, SQ3) is high (H), the logical information of serial data DL1 (DL2, DL3) is output in synchronization with the pixel shift pulse BSCa, one pixel at a time. Also, during the period when the drawing permission signal SQ4 (SQ5, SQ6) is high (H), the logical information of serial data DL4 (DL5, DL6) is output in synchronization with the pixel shift pulse BSCb, one pixel at a time.

[0191] Additionally, serial data DLn (DL1~DL6) of pattern data stored in memory units (BMn) (BM1~BM6) is shifted in the column direction by an address counter not shown, etc. That is, the column read by the address counter not shown is shifted as the 1st column, 2nd column, 3rd column, ... and so on. The shift is performed, for example, at the timing when the input permission signal LP2 corresponding to the next scanning unit (U2) becomes high (timing when the origin signal SZ2 is generated), after all serial data DL1 is output for the memory unit (BM1) corresponding to the scanning unit (U1). The shift of serial data DL2 of pattern data stored in memory units (BM2) is performed at the timing when the input permission signal LP3 corresponding to the next scanning unit (U3) becomes high (timing when the origin signal SZ3 is generated), after all serial data DL2 is output. In addition, the shifting of the serial data DL3 of the pattern data stored in the memory unit (BM3) is performed after all of the serial data DL3 is output, at the timing when the incident permission signal LP1 corresponding to the scanning unit (U1) that performs the next scan becomes high (the timing when the origin signal SZ1 is generated). Also, the three scanning units (U1~U3) of the first scanning module perform the scanning of the spot light SP in the order of U1→U2→U3.

[0192] Likewise, the shifting of the serial data DL4 to DL6 of the pattern data stored in the memory unit (BM4 to BM6) is performed after all serial data DL4 to DL6 have been output, at the timing when the incident permission signals LP5, LP6, and LP4 corresponding to the scanning unit (U5, U6, U4) that performs the next scan become high (the timing when the origin signals SZ5, SZ6, and SZ4 are generated). In addition, the three scanning units (U4 to U6) of the second scanning module perform the scanning of the spot light SP in the order of U4→U5→U6.

[0193] Serial data DLn (DL1~DL6) output from memory unit (BMn) (BM1~BM6) is input to one input terminal of AND gate unit (GTna (GT1a~GT6a)). An incident permission signal LPn (LP1~LP6) is input to the other input terminal of AND gate unit (GTna (GT1a~GT6a)). Accordingly, AND gate unit (GTna (GT1a~GT6a)) outputs serial data DLn (DL1~DL6) during the period (time Ton) when the incident permission signal LPn (LP1~LP6) is high (H). By doing so, serial data DLn of a scanning unit (Un) that performs scanning of spot light SP is output. By this, serial data DLn (DL1~DL3) is output from the generation circuits (GE1~GE3) of the first data output unit (114a) in the order of DL1→DL2→DL3 and input to the 3-input OR gate unit (GT1m). Likewise, serial data DLn (DL4~DL6) is output from the generation circuits (GE4~GE6) of the second data output unit (114b) in the order of DL4→DL5→DL6 and input to the 3-input OR gate unit (GT2m).

[0194] The OR gate section (GT1m) repeatedly inputs serial data DLn (DL1→DL2→DL3) in the order of DL1→DL2→DL3 and outputs it to the driving circuit (36a) of the light source device (LSa) as drawing bit sequence data SBa. By this, the three scanning units (U1~U3) of the first scanning module can perform scanning of spot light SP in the order of U1→U2→U3 and draw and expose a pattern according to the pattern data. Likewise, the OR gate section (GT2m) repeatedly inputs serial data DLn in the order of DL4→DL5→DL6 and outputs it to the driving circuit (36a) of the light source device (LSb) as drawing bit sequence data SBb. By this, the three scanning units (U4~U6) of the second scanning module can perform scanning of spot light SP in the order of U4→U5→U6 and draw and expose a pattern according to the pattern data.

[0195] In addition, in the first embodiment, pattern data is prepared for each scanning unit (Un(U1~U6)), and for each scanning module, serial data DL1~DL3 and DL4~DL6 are output according to the sequence of scanning units (Un) that perform spot light SP scanning (U1→U2→U3, U4→U5→U6) from the pattern data of three scanning units (Un(U1~U3, U4~U6)). However, since the sequence of scanning units (Un) that perform spot light SP scanning is predetermined, for each scanning module, one pattern data may be prepared by combining each serial data DLn (DL1~DL3, DL4~DL6) of the pattern data of three scanning units (Un(U1~U3, U4~U6)). That is, for each scanning module, serial data DLn (DL1~DL3, DL4~DL6) of each column of pattern data of three scanning units (Un(U1~U3, U4~U6)) may be arranged according to the order of the scanning unit (Un) that performs the scanning of the spot light SP to construct one pattern data. In this case, the serial data DLn of the one pattern data constructed for each scanning module may be output sequentially starting from the first column according to the drawing permission signal SQn (SQ1~SQ3, SQ4~SQ6).

[0196] However, the exposure control unit (116) shown in FIG. 12 controls the overall magnification setting unit (110), the local magnification setting unit (112), and the drawing data output unit (114). The exposure control unit (116) receives position information of alignment marks (MKm (MK1~MK4)) on installation orientation lines Lx1 and Lx4 detected by the mark position detection unit (106), and rotation angle position information of the rotating drum (DR) on installation orientation lines Lx1~Lx4 detected by the rotation position detection unit (108) (count value based on counter circuits (CN1a~CN4a, CN1b~CN4b)). The exposure control unit (116) detects (determines) the starting position of the drawing exposure of the exposure area W in the sub-scanning direction (X direction) of the substrate (P) based on the position information of the alignment mark (MKm (MK1~MK4)) on the installation orientation line Lx1 and the rotation angle position of the rotating drum (DR) on the installation orientation line Lx1 (count value of the counter circuit (CN1a, CN1b)).

[0197] Then, the exposure control unit (116) determines whether the starting position for the drawing exposure of the substrate (P) has been conveyed to the drawing lines (SL1), SL3, and SL5 on the installation orientation line Lx2 based on the rotation angle position of the rotating drum (DR) on the installation orientation line Lx1 when the starting position for the drawing exposure is detected and the rotation angle position on the installation orientation line Lx2 (count value based on counter circuits (CN2a, CN2b)). When the exposure control unit (116) determines that the starting position for the drawing exposure has been conveyed to the drawing lines (SL1), SL3, and SL5, it controls the local magnification setting unit (112) and the drawing data output unit (114), etc., to start drawing by scanning the spot light SP in the scanning unit (U1, U3, U5).

[0198] In this case, the exposure control unit (116) outputs local magnification correction information CMg1 and CMg3 corresponding to the scanning unit (U1, U3) that performs spot light SP scanning to the local magnification setting unit (112) at the timing when the scanning unit (U1, U3) performs drawing exposure to the signal generation unit (22a) of the light source device (LSa). By this, the signal generation unit (22a) of the light source device (LSa) generates a pixel shift pulse BSCa that shifts the pixels of serial data DL1 and DL3 of the scanning unit (U1, U3) that performs spot light SP scanning, according to the local magnification correction information CMg1 and CMg3. According to this pixel shift pulse BSCa, the drawing data output unit (114) shifts the logic information of each pixel of serial data DL1 and DL3 corresponding to the scanning unit (U1, U3) that performs the scanning of spot light SP by one pixel. Likewise, at the timing when the scanning unit (U5) performs the drawing exposure, the exposure control unit (116) outputs local magnification correction information CMg5 corresponding to the scanning unit (U5) to the local magnification setting unit (112) and to the signal generation unit (22a) of the light source device (LSb). By this, the signal generation unit (22a) of the light source device (LSb) generates a pixel shift pulse BSCb that shifts the pixels of serial data DL5 corresponding to the scanning unit (U5) that performs the scanning of spot light SP, according to the local magnification correction information CMg5. According to this pixel shift pulse BSCb, the drawing data output unit (114) shifts the logical information of each pixel of the serial data DL5 of the scanning unit (U5) that performs the scanning of the spot light SP by one pixel.

[0199] After that, the exposure control unit (116) determines whether the starting position of the drawing exposure of the substrate (P) has been conveyed to the drawing lines SL2, SL4, and SL6 on the installation orientation line Lx3, based on the rotation angle position of the rotating drum (DR) on the installation orientation line Lx1 when the starting position of the drawing exposure is detected and the rotation angle position on the installation orientation line Lx3 (count value of the counter circuit (CN3a, CN3b)). If the exposure control unit (116) determines that the starting position of the drawing exposure has been conveyed to the drawing lines SL2, SL4, and SL6, it controls the local magnification setting unit (112) and the drawing data output unit (114) to additionally start the scanning of the spot light SP to the scanning unit (U2, U4, U6).

[0200] In this case, the exposure control unit (116) outputs local magnification correction information CMg2 corresponding to the scanning unit (U2) performing the spot light SP scanning to the local magnification setting unit (112) at the timing when the scanning unit (U2) performs the drawing exposure, to the signal generation unit (22a) of the light source device (LSa). By this, the signal generation unit (22a) of the light source device (LSa) generates a pixel shift pulse BSCa that shifts the pixels of the serial data DL2 of the scanning unit (U2) performing the spot light SP scanning, according to the local magnification correction information CMg2. According to this pixel shift pulse BSCa, the drawing data output unit (114) shifts the logic information of each pixel of the serial data DL2 of the scanning unit (U2) performing the spot light SP scanning by one pixel. Likewise, at the timing when the scanning unit (U4, U6) performs drawing exposure, the exposure control unit (116) outputs local magnification correction information CMg4 and CMg6 corresponding to the scanning unit (U4, U6) to the local magnification setting unit (112) and to the signal generation unit (22a) of the light source device (LSb). By this, the signal generation unit (22a) of the light source device (LSb) generates a pixel shift pulse BSCb that shifts the pixels of the serial data DL4 and DL6 of the scanning unit (U4, U6) performing the scanning of the spot light SP, according to the local magnification correction information CMg4 and CMg6. According to this pixel shift pulse BSCb, the drawing data output unit (114) shifts the logic information of each pixel of the serial data DL4 and DL6 of the scanning unit (U4, U6) performing the scanning of the spot light SP by one pixel.

[0201] As can be seen from the preceding FIG. 4, since the substrate (P) is transported in the +X direction, the drawing exposure in each of the drawing lines (SL1), SL3, and SL5 is performed first, and after the substrate (P) is transported further by a predetermined distance, the drawing exposure in each of the drawing lines SL2, SL4, and SL6 is performed. Meanwhile, since each polygon mirror (PM) of the three scanning units (U1~U3) of the first scanning module and each polygon mirror (PM) of the three scanning units (U4~U6) of the second scanning module are rotated with a predetermined phase difference, the origin signals SZ1~SZ3 and SZ4~SZ6 are continuously generated with a phase difference for time Ts, as shown in FIG. 13. Therefore, incident permission signals LPn (LP1~LP6) as shown in FIG. 13 are generated, and the AND gates (GT2a, GT4a, GT6a) in FIG. 14 are opened from the start time of the drawing exposure in the drawing lines (SL1), SL3, and SL5 until just before the start of the drawing exposure in the drawing lines SL2, SL4, and SL6, and serial data DL2, DL4, and DL6 are output. Consequently, before the start position of the drawing exposure in the exposure area W reaches the drawing lines SL2, SL4, and SL6, the pattern is drawn by the scanning of spot light SP by the scanning unit (U2, U4, U6).

[0202] Accordingly, in the configuration of FIG. 14, it is preferable to provide a selection gate circuit for each generation circuit (GEn(GE1~GE6)) that selects whether to send or prohibit the incident permission signal LPn (LP1~LP6) to the AND gate unit (GTna(GT1a~GT6a)) and the drawing permission signal generation unit (OSMn(OSM1~OSM6)) under the control of the exposure control unit (116). By doing so, the incident permission signal LPn (LP1~LP6) is input to the AND gate unit (GTna(GT1a~GT6a)) and the drawing permission signal generation unit (OSMn(OSM1~OSM6)) only during the period when the selection gate circuit of each generation circuit (GEn(GE1~GE6)) is open. Accordingly, the exposure control unit (116) can prohibit the output of serial data DL2, DL4, and DL6 by closing the selection gate circuit of the generation circuit (GE2, GE4, GE6) and opening the selection gate circuit of the generation circuit (GE1, GE3, GE5). Also, by closing the selection gate circuit of the generation circuit (GE2, GE4, GE6), the drawing permission signals SQ2, SQ4, and SQ6 are not generated. Therefore, while the selection gate circuit of the generation circuit (GE2, GE4, GE6) is closed, the generation of pixel shift pulses BSC (BSCa, BSCb) that shift the pixels of serial data DL2, DL4, and DL6 is also prohibited by the gate circuit (GTa) (see FIG. 9).

[0203] In addition, if a selection gate circuit is not provided in each generation circuit (GEn(GE1~GE6)), the exposure control unit (116) can effectively cancel the drawing exposure by the scanning unit (U2, U4, U6) by canceling all the logical information of the pixels corresponding to the serial data DL2, DL4, and DL6 among the drawing bit sequence data SBa and SBb output to the driving circuit (36a) of the light source device (LSa, LSb) to “0”. During the cancellation period, the serial data sequences DL2, DL4, and DL6 output from the memory unit (BM2, BM4, BM6) remain as the first sequence without being shifted. Then, after the starting position of the drawing exposure of the exposure area W reaches the drawing lines SL2, SL4, and SL6, the output of serial data DL2, DL4, and DL6 is started, and the serial data DL2, DL4, and DL6 are shifted in the column direction.

[0204] Likewise, the end position of the drawing exposure of the exposure area W first reaches the drawing lines (SL1), SL3, and SL5, and then, after a certain amount of time, reaches the drawing lines SL2, SL4, and SL6. Therefore, from the time the end position of the drawing exposure reaches the drawing lines (SL1), SL3, and SL5 until it reaches the drawing lines SL2, SL4, and SL6, the drawing exposure of the pattern is performed only by the scanning units (U2, U4, U6). Accordingly, the exposure control unit (116) can prohibit the output of serial data DL1, DL3, and DL5 by closing the selection gate circuit of the generation circuit (GE1, GE3, GE5) and opening the selection gate circuit of the generation circuit (GE2, GE4, GE6). In addition, by closing the selection gate circuit of this generation circuit (GE1, GE3, GE5), the generation of pixel shift pulses BSC (BSCa, BSCb) that shift the pixels of serial data DL1, DL3, and DL5 by the gate circuit (GTa) shown in FIG. 9 is also prohibited. Furthermore, in cases where a selection gate circuit is not provided in each generation circuit (GEn(GE1~GE6)), the exposure control unit (116) can effectively cancel the drawing exposure by the scanning unit (U1, U3, U5) by canceling all the logic information of the pixels corresponding to serial data DL1, DL3, and DL5 among the drawing bit sequence data SBa and SBb output to the driving circuit (36a) of the light source device (LSa, LSb) to “0”.

[0205] Additionally, the exposure control unit (116) calculates the distortion (deformation) of the substrate (P) or the exposure area W in sequence based on the position information of the alignment marks (MKm(MK1~MK4)) on the installation orientation lines Lx1 and Lx4 detected by the mark position detection unit (106) and the rotation angle position information of the rotating drum (DR) on the installation orientation lines Lx1 and Lx4 detected by the rotation position detection unit (108). For example, if the substrate (P) is deformed by receiving a large tension in the long direction or by receiving a thermal process, the shape of the exposure area W is also distorted (deformed), and the arrangement of the alignment marks (MKm(MK1~MK4)) does not become a square shape as shown in FIG. 4, but remains in a distorted (deformed) state. If the substrate (P) or the exposure area W is distorted, it is necessary to change the magnification of each drawing line (SLn) accordingly; therefore, the exposure control unit (116) generates at least one of the total magnification correction information TMg and the local magnification correction information CMgn based on the distortion of the substrate (P) or the exposure area W calculated. Then, at least one of the generated total magnification correction information TMg and the local magnification correction information CMgn is output to the total magnification setting unit (110) or the local magnification setting unit (112). By doing so, the precision of the overlapping exposures can be improved. Additionally, the exposure control unit (116) may generate correction tilt angle information for each drawing line (SLn) according to the distortion of the substrate (P) or the exposure area W. Based on this generated correction tilt angle information, the actuator described above rotates each scanning unit (Un (U1~U6)) around the irradiation center axis (Len (Le1~Le6)). By this, the precision of the overlapping exposures is further improved.The exposure control unit (116) may regenerate at least one of the total magnification correction information TMg and the local magnification correction information CMgn and the correction tilt angle information whenever the spot light SP is scanned by each scanning unit (Un(U1~U6)), whenever the spot light SP is scanned a predetermined number of times, or when the distortion trend of the substrate (P) or the exposure area W changes beyond an allowable range.

[0206] As described above, the exposure device (EX) of the first embodiment draws a pattern on a substrate (P) by relatively scanning the spot light SP along the drawing line (SLn) on the substrate (P) while intensity modulating the spot light SP of the beam (LB) (Lse, LBa, LBb, LBn) generated by the end light S1 and S2 from the pulse light source unit (35) according to the pattern. The exposure device (EX) is equipped with at least a memory unit (BMn), a clock generation unit (60), a light source control unit, a correction pixel designation unit (62), and a transmission timing switching unit (64). As described above, the memory unit (BMn) stores pattern data drawn by scanning the spot light SP of the scanning unit (Un). The clock generation unit (60) has a reference period Ta determined by Pxy / (N×Vs) and generates a clock signal LTC having N clock pulses per pixel dimension Pxy during the scanning of the spot light SP. The light source control unit is composed of at least a control circuit (22), an electro-optical element (36), a driving circuit (36a), and a drawing data output unit (114). The light source control unit controls the pulse light source unit (35) to generate a beam (LB) in response to the clock pulse of the clock signal LTC, and modulates the intensity of the beam (LB) based on the logic information for each pixel of the serial data DLn, which constitutes pattern data transmitted sequentially from the memory unit (BMn). The correction pixel designation unit (62) designates at least one pixel placed at a specific position among a plurality of pixels lined up on the drawing line (SLn) as a correction pixel. [Illegible] This is a story about a spotter who is a star and a starTherefore, the magnification of the drawing line (SLn) (the drawing pattern) can be finely corrected, allowing for precise superposition exposure at the micron order.

[0207] The exposure device (EX) comprises a polygon mirror (PM) that deflects a beam (LB) in one dimension and a plurality of scanning units (Un) having an optical lens member (at least including an fθ lens (FT) and a cylindrical lens (CYb)) into which the beam (LB) deflected from the polygon mirror (PM) is incident and focused as a spot light SP on a substrate (P). The exposure device (EX) draws a pattern on the substrate (P) by the spot light SP projected from each of the plurality of scanning units (Un). By doing so, the width of the exposure area W can be easily expanded.

[0208] The exposure device (EX) comprises a polygon drive control unit (100) that synchronously rotates each of the polygon mirrors (PM) such that the rotation angle position of each polygon mirror (PM) of the plurality of scanning units (Un) becomes a predetermined phase relationship, and a beam switching unit (BDU) that switches to guide a beam from a light source device (LSa (or LSb)) to one of the plurality of scanning units (Un) in sequence according to the rotation angle position of the polygon mirror (PM). By doing so, during the period from when one scanning unit (Un) starts scanning a spot light SP until it starts the next scanning, each of the plurality of scanning units (Un) can perform scanning of the spot light SP in sequence. As a result, the beam (LB) can be effectively utilized.

[0209] The exposure device (EX) is equipped with a local magnification setting unit (correction information storage unit) (112) that stores local magnification correction information (correction information) CMgn for designating a correction pixel to be corrected among a plurality of pixels located on a drawing line (SLn) for each of a plurality of scanning units (Un). The correction pixel designation unit (62) designates a correction pixel located on the drawing line (SLn) of a scanning unit (Un) where the beam (LB) is guided by a beam switching unit (BDU), based on the local magnification correction information CMgn corresponding to the scanning unit (Un) where the beam (LB) is guided. By doing so, the magnification of the drawing line (SLn) (the pattern being drawn) can be finely corrected for each drawing line (SLn) (scanning unit (Un)). Accordingly, the superposition precision of the pattern exposure is improved.

[0210] The local magnification correction information CMgn includes correction location information Nv for designating correction pixels at each of a discrete plurality of locations on the drawing line (SLn) according to the drawing magnification of the pattern being drawn along the drawing line (SLn). The correction pixel designation unit (62) designates a plurality of correction pixels discretely located on the drawing line (SLn) based on the correction location information Nv. The transmission timing switching unit (64) switches the transmission timing from the logic information memory unit (BMn) so that at each of the plurality of correction pixels located on the drawing line (SLn), clock pulses of N±m clock signals LTC correspond to the correction pixel. By doing this, the drawing line (SLn) (the pattern being drawn) can be magnified (stretched) without stains.

[0211] The local magnification correction information CMgn includes magnification information SCA for setting the value of “±m” according to the drawing magnification of the pattern being drawn along the drawing line (SLn). By this, the drawing line (SLn) (the pattern being drawn) can be stretched according to the drawing magnification.

[0212] The beam switching unit (BDU) is arranged in series along the direction of travel of the beam (LB) from the light source device (LSa (or LSb)) and has a plurality of selection optical elements (AOMn) that switch the optical path of the beam (LB) to select one scanning unit (Un) to which the beam (LB) is incident. Accordingly, the beam (LB) from the light source device (LSa (or LSb)) can be efficiently concentrated on one scanning unit (Un) to be exposed, thereby obtaining a high exposure amount. For example, when one beam (LB) from a light source device (LSa (or LSb)) is amplitude-divided into three using a plurality of beam splitters, and each of the three divided beams (LB) is guided to three scanning units (Un) through an acousto-optic modulation element (intensity modulation unit) (AOM) that modulates the serial data DLn, if the attenuation of the beam intensity in the acousto-optic modulation element for drawing is 20% and the attenuation of the beam intensity in each scanning unit (Un) is 30%, the intensity of the spot light SP in one scanning unit (Un) becomes approximately 18.67% when the intensity of the original beam (LB) is 100%. In addition, as in the first embodiment, when a beam (LB) from a light source device (LSa (or LSb)) is deflected by three selective optical elements (AOMn (AOM1~AOM3, AOM4~AOM6)) and incident on any one of three scanning units (Un (U1~U3, U4~U6)), when the attenuation of the beam intensity in the selective optical elements (AOMn) is 20%, the intensity of the spot light SP in one scanning unit (Un) becomes approximately 56% of the intensity of the original beam (LB).

[0213] A plurality of selection optical elements (AOMn) are provided corresponding to a plurality of scanning units (Un) and switch whether to incident a beam (LB) on the corresponding scanning unit (Un). Thus, among the plurality of scanning units (Un), one scanning unit (Un) to which the beam (LBn) should be incident can be easily selected.

[0214] In addition, in the first embodiment, the scanning efficiency of the polygon mirror (PM) is 1 / 3, and the number of scanning units (Un) to which beams (LBa) and LBb are distributed is 3. Therefore, 6 selection optical elements (AOMn (AOM1~AOM6)) are divided into 2 optical element modules (2 sets), and correspondingly, 6 scanning units (Un (U1~U6)) are divided into 2 scanning modules (2 sets). However, when the scanning efficiency of the polygon mirror (PM) is 1 / H and the number of scanning units (Un) and selection optical elements (AOMn) is Q, Q selection optical elements (AOMn) are divided into Q / H optical element modules (Q / H sets). Then, Q scanning units (Un) are divided into Q / H scanning modules. In this case, it is desirable that the number of selection optical elements (AOMn) included in each of the Q / H optical element modules (Q / H set) be the same, and that the number of scanning units (Un) included in each of the Q / H scanning modules (Q / H set) also be the same. In addition, it is desirable that Q / H be a positive number. That is, it is desirable that Q be a multiple of H. For example, if the scanning efficiency of the polygon mirror (PM) is 1 / 2 and the number of scanning units (Un) and selection optical elements (AOMn) is 6, the 6 selection optical elements (AOMn) are divided equally into 3 optical element modules (3 sets), and the 6 scanning units (Un) are divided equally into 3 scanning modules (3 sets).

[0215] In addition, in the first embodiment above, the shape of the polygon mirror (PM) is octagonal (with 8 reflective surfaces (RP)), but it may be hexagonal, heptagonal, or even nonagonal or more. By this, the scanning efficiency of the polygon mirror (PM) also changes. Generally, when conditions other than the number of reflective surfaces Np of the polygonal-shaped polygon mirror (PM) (for example, conditions such as the aperture or focal length of the fθ lens (FT)) are the same, as the number of reflective surfaces Np increases, the scanning efficiency of one reflective surface (RP) of the polygon mirror (PM) increases, and as the number of reflective surfaces decreases, the scanning efficiency of the polygon mirror (PM) decreases. Also, as the number of reflective surfaces Np increases, the shape of the polygon mirror (PM) becomes closer to a circle, so wind loss during rotation is reduced, and the polygon mirror (PM) can be rotated at a higher speed. For example, as in the previous example, if an 8-sided polygon mirror (PM) is used with a scanning efficiency of less than 1 / 3, it may be changed to a 24-sided (8 sides ÷ 1 / 3) polygon mirror (PM). However, in that case, in order to distribute the beam (LBa(LBb)) from one light source device (LSa(LSb)) to each of the three scanning units (Un) in a time-division manner, each of the 24-sided polygon mirrors (PM) of the three scanning units (Un) is synchronously rotated so that they have the same angle phase (so that the origin signal is generated at the same timing), and the two reflective surfaces of the polygon mirror (PM) are filtered so that one drawing is performed.

[0216] In addition, in the first embodiment above, the pixel dimensions Px and Py are of the same length (e.g., 3 μm), but the lengths of dimensions Px and Py may be different. The point is that the clock generator (60) has a reference period Ta determined as Py / (N×Vs) and generates a clock signal LTC having N clock pulses per pixel dimension Py during the scanning of the spot light SP.

[0217] [A variation of the first embodiment]

[0218] The above first embodiment may be modified as follows.

[0219] In the first embodiment above, N (=8) spot light SPs (clock pulses of the clock signal LTC) correspond to the normal pixel, and N±m (=8±1) spot light SPs (clock pulses of the clock signal LTC) correspond to the correction pixel. In addition, since the dimension Pxy of one pixel is set to 3㎛, which is the same as the size φ of the spot light SP, and the oscillation frequency Fa of the clock signal LTC is set to 400MHz, the projection interval of the spot light SP scanned along the main projection direction becomes 0.375㎛. Therefore, with respect to the main projection direction, the correction pixel becomes a size stretched by 0.375㎛ compared to the normal pixel with a dimension Pxy of 3㎛. That is, the ratio of the correction pixel stretching is 12.5 (=0.375 / 3)%. Also, when the value of “±m” determined by the magnification information SCA is “±2”, for a normal pixel with a dimension Pxy of 3㎛, the corrected pixel is stretched by 0.75㎛, and the ratio becomes 25 (=0.75 / 3)%.

[0220] Regarding this, if the dimension Pxy of a single pixel is set to 3㎛, which is the same as the size φ of the spot light SP, and the oscillation frequency Fa of the clock signal LTC is set to 800MHz, which is twice 400MHz, then 16 spot light SPs (clock pulses of the clock signal LTC) correspond to a normal pixel. Therefore, if the value of “±m” determined by the scaling information SCA is kept as “±1,” then 16±1 spot light SPs (clock pulses of the clock signal LTC) correspond to a corrected pixel. In this case, the projection interval of the spot light SP scanned in the main projection direction becomes 0.1875 (3×1 / 16)㎛. Therefore, with respect to the main projection direction, the corrected pixel is stretched by 0.1875㎛ compared to a normal pixel with a dimension Pxy of 3㎛, and the ratio becomes 6.25 (=0.1875 / 3)%. In addition, when the value of “±m” determined by the magnification information SCA is “±2”, for a normal pixel with a dimension Pxy of 3㎛, the corrected pixel is stretched by 0.375㎛, and the ratio becomes 12.5%. Therefore, increasing the oscillation frequency Fa of the clock signal LTC allows for finer magnification correction.

[0221] However, even when the oscillation frequency Fa is set higher than 400 MHz, there are cases where the DFB semiconductor laser elements (30, 32) of the pulse light generating unit (20) cannot generate pulse-shaped end lights S1 and S2 at the higher oscillation frequency Fa (e.g., 800 MHz). Also, if a DFB semiconductor laser element (30, 32) capable of responding to the higher oscillation frequency Fa is used, there is a problem that the cost becomes high. Therefore, in this modified example, the frequency of the spot light SP is set to 800 MHz by synthesizing the beam (LB) generated at the oscillation frequency Fb of 400 MHz.

[0222] In addition, in this modified example, the effective length of the drawing line (SLn(SL1~SL6)) is set to 30 mm, and spot light SP with an effective size φ of 3 μm is overlapped by 15 / 16, i.e., 2.8125 (= 3 × 15 / 16) μm, and the spot light SP is irradiated onto the substrate (P) (the surface to be irradiated on the substrate (P)) along the drawing line (SLn(SL1~SL6)). Accordingly, the projection interval of the spot light SP is 0.1875 μm, and the number of spot light SP irradiated in one scan is 160,000 (= 30 [mm] / 0.1875 [μm]). Also, the frequency of the spot light SP (oscillation frequency Fa) is set to 800 MHz, and the spot light SP is irradiated 160,000 times in one scan, so the time Tsp required for one scan of the spot light SP along the drawing line (SLn) is 200 μsec (= 160,000 [times] / 800 [MHz]), and the scanning speed Vs is 150 m / sec (= 30 [mm] / 200 [μsec]). In addition, regarding the auxiliary scanning direction, if the spot light SP is scanned at intervals of 0.1875 μm, the substrate (P) needs to advance by 0.1875 μm per time Tpx (=620 μsec), so the transport speed (transmission speed) Vt becomes approximately 0.3024 mm / sec (=0.1875 [μm] / 620 [μsec]). Also, the rotation speed Vp of the polygon mirror (PM) of this modified example is set to approximately 12096.8 rpm, the same as in the first embodiment.

[0223] FIG. 17 is a diagram showing the configuration of a light source device (LSa(LSb)) in the present variation. In addition, the same reference numerals are used for configurations identical to the first embodiment, and only different points are described. The light source device (LSa(LSb)) has a clock signal generator (150), two control circuits (152a, 152b), two pulse light generators (20 (hereinafter, 20a, 20b)), an OR gate (clock generator) (GX1), and a composite optical member (154).

[0224] The clock signal generator (150) has a reference period Tb determined by (Pxy×M) / (N×Vs) when Vs and N are integers greater than or equal to 2 for the scanning speed of the spot light SP and M is the number of pulse light generators (20) (pulse light source units (35)), and generates a plurality (M) of clock signals (first clock signals) CK with phases given by a correction time of 1 / M of the reference period Tb. This M is an integer greater than or equal to 2 and is an integer smaller than N. In this modified example, the number of clock pulses (spot light SP) per pixel N is 16, M is 2, Pxy is 3 μm, and Vs is 150 m / sec, so the reference period Tb = (3 μm × 2) / (16 × 150 m / sec) = 0.0025 μsec, and the frequency Fb (1 / Tc) is 400 MHz. Also, since the clock signal generator (150) generates a plurality (M) of clock signals with phases given by a correction time of 1 / M of the reference period Tb, it generates two clock signals CK with phases given by a correction time of 1 / 2 of the reference period Tb. These two clock signals CK are represented as CKa and CKb. That is, the clock signal generator (150) of this modified example generates clock signals CKa and CKb of 400 MHz with phases out of sync by half a period. The clock signal CKa generated by the clock signal generator (150) is output to the control circuit (152a) and the OR gate (GX1), and the clock signal CKb is output to the control circuit (152b) and the OR gate (GX1).

[0225] FIG. 18 is a diagram showing the configuration of a clock signal generator (150). The clock signal generator (150) has a clock generator (60), a one-shot pulse generator (LC), a two-input AND gate section (GX2, GX3), and a NOT gate section (GX4). As described in the first embodiment above, the clock generator (60) generates (generates) a clock signal CKs with an oscillation frequency Fc (period Tc = 1 / Fc) according to the total multiplier correction information TMg. In this variation, the clock generator (60) sets the total multiplier correction information TMg to 0, and when the total multiplier correction information TMg is 0, it generates a clock signal CKs with an oscillation frequency (emission frequency) Fc of 800 MHz. The clock signal CKs generated by the clock generator (60) is input to one of the input terminals of the AND gate unit (GX1, GX2) and the one-shot pulse generator (LC), respectively.

[0226] The one-shot pulse generator (LC) normally outputs a signal SDo with a logic value of "0", but when a clock pulse of the clock signal CKs occurs, it outputs a signal SDo with a logic value of "1" for a certain time Tdp starting from the falling end of the clock pulse. That is, the one-shot pulse generator (LC) inverts the logic value for a certain time Tdp according to the falling end of the clock pulse of the clock signal CKs. The time Tdp is set in the relationship Tc < Tdp < 2×Tc, and preferably, Tdp is set to ≈ 1.5×Tc. This signal SDo is input to the other input terminal of the AND gate section (GX3). The signal SDo is input to the other input terminal of the AND gate section (GX2) through the NOT gate section (GX4). That is, the signal inverted from the signal SDo is input to the AND gate section (GX2). The AND gate section (GX2) outputs a clock signal CKa based on the input clock signal CKs and the signal obtained by inverting the value of signal SDo. The AND gate section (GX3) outputs a clock signal CKb based on the input clock signal CKs and signal SDo. Accordingly, the AND gate section (GX2) outputs a clock pulse of the input clock signal CKs only when the logic value of signal SDo is "0", and the AND gate section (GX3) outputs a clock pulse of the input clock signal CKs only when the logic value of signal SDo is "1".

[0227] FIG. 19 is a timing chart explaining the operation of the clock signal generator (150) of FIG. 18. When the logic value of signal SDo is "0" (low), a clock pulse of clock signal CKs (this clock pulse is called the first clock pulse) is generated, and the value of the output signal (clock signal CKb) of the AND gate unit (GX3) becomes "0" (low). That is, the AND gate unit (GX3) does not output the input first clock pulse. On the other hand, when the logic value of signal SDo is "0", the value "1", which is obtained by inverting the value of signal SDo by the NOT gate unit (GX4), is input to the AND gate unit (GX2), so the value of the output signal (clock signal CKa) of the AND gate unit (GX2) becomes "1". That is, the AND gate unit (GX2) outputs the input first clock pulse.

[0228] When the clock pulse of clock signal CKs occurs while the logic value of signal SDo is in the state of "0", the one-shot pulse generator (LC) sets the logic value of signal SDo to "1" for a certain time Tdp starting from the falling of that clock pulse. Since the clock pulse of clock signal CKs occurs with a period Tc shorter than time Tdp, the logic value of signal SDo remains "1" at the timing when the next (second) clock pulse occurs. Therefore, the AND gate section (GX3) outputs the input second clock pulse, and the AND gate section (GX2) does not output the second clock pulse. Since the third clock pulse occurs after a certain time Tdp has elapsed from the falling of the first clock pulse, the logic of signal SDo is "0" at the timing when the third clock pulse occurs. Accordingly, the AND gate section (GX3) does not output the input third clock pulse, and the AND gate section (GX2) outputs the input third clock pulse. By repeating this operation, the AND gate section (GX2) generates a clock signal CKa by sifting out clock pulses of clock signals CKs with an oscillation frequency Fc of 800 MHz at intervals of one, and the AND gate section (GX3) generates a clock signal CKb by sifting out clock pulses of clock signals CKs with an oscillation frequency Fc of 800 MHz at intervals of one, such that the phase is offset by half a period with respect to the clock signal CKa. That is, the clock signal generator (150) divides the clock signal CKs with an oscillation frequency Fc of 800 MHz by half and also generates two clock signals CKa and CKb with phases offset by half a period from each other. Therefore, the oscillation frequency (emission frequency) Fb of these clock signals CKa, CKb becomes 400 MHz.

[0229] The control circuit (152a) controls the pulse light source unit (35) (specifically, DFB semiconductor laser elements (30, 32)) of the pulse light generation unit (20a) so that it emits end light S1 and S2 in response to each clock pulse of the clock signal CKa. By doing so, the frequency of the beam (LBa1 (LBb1)) emitted by the pulse light generation unit (20a) becomes 400 MHz. The control circuit (152b) controls the pulse light source unit (35) (specifically, DFB semiconductor laser elements (30, 32)) of the pulse light generation unit (20b) so that it emits end light S1 and S2 in response to each clock pulse of the clock signal CKb. As a result, the frequency of the beam (LBa)2 (LBb2) emitted by the pulse light generator (20b) becomes 400 MHz, and the phase of the ejection timing is offset by half a cycle with respect to the beam (LBa1 (LBb1)).

[0230] In addition, in this modified example, the end light S1 and S2 emitted by the DFB semiconductor laser elements (30, 32) of each pulse light generating unit (20a, 20b) is linearly polarized light with polarization directions orthogonal to each other, and also the DFB semiconductor laser elements (30) of the pulse light generating unit (20a, 20b) and the DFB semiconductor laser elements (32) of the pulse light generating unit (20a, 20b) are linearly polarized light with polarization directions orthogonal to each other. As a result, the beam (LBa1 (LBb1)) emitted from the pulse light generating unit (20a) and the beam (LBa)2 (LBb2) emitted from the pulse light generating unit (20b) become linearly polarized light that is orthogonal to each other. In this modified example, the polarization state of the end light S1 emitted by the DFB semiconductor laser element (30) of the pulse light generating unit (20a) and the end light S2 emitted by the DFB semiconductor laser element (32) of the pulse light generating unit (20b) are both S-polarized. Additionally, the polarization state of the end light S2 emitted by the DFB semiconductor laser element (32) of the pulse light generating unit (20a) and the end light S1 emitted by the DFB semiconductor laser element (30) of the pulse light generating unit (20b) are both P-polarized. Therefore, in this modified example, the beam (LBa1 (LBb1)) emitted by the pulse light generating unit (20a) becomes P-polarized light, and the beam (LBa)2 (LBb2) emitted by the pulse light generating unit (20b) becomes S-polarized light. Additionally, the polarization beam splitter (34) of the pulse light generating unit (20a) transmits S-polarized light and reflects P-polarized light, and the polarization beam splitter (34) of the pulse light generating unit (20b) transmits P-polarized light and reflects S-polarized light. Also, the polarization beam splitter (38) of the pulse light generating unit (20a) transmits P-polarized light and reflects S-polarized light, and the polarization beam splitter (38) of the pulse light generating unit (20b) transmits S-polarized light and reflects P-polarized light.

[0231] The OR gate section (GX1) synthesizes two clock signals CKa and CKb, whose input phases are out of sync by half a cycle, to generate (generate) one clock signal (reference clock signal) LTC. By doing so, each clock pulse (reference clock pulse) of the clock signal LTC is generated at an oscillation frequency Fa of 800 MHz (period Ta = 1 / Fa). Additionally, since the clock signal LTC is identical in frequency and phase to the clock signal CKs generated by the clock generator (60) of the clock signal generator (150), the OR gate section (GX1) does not need to be provided. In this case, the clock signal CKs generated by the clock generator (60) can be used as the clock signal LTC.

[0232] Additionally, the clock signal generator (150) may be configured to have a clock generator (60) and a variable delay circuit (not shown). In this case, the clock generator (60) generates (generates) a clock signal CKs with an oscillation frequency Fc of 400 MHz, and the variable delay circuit delays the clock signal CKs by half the period Tc (= 1 / Fc) of the clock signal CKs. The clock signal generator (150) outputs the clock signal CKs generated by the clock generator (60) as a clock signal CKa to the control circuit (152a) and the OR gate (GX1), and outputs the clock signal CKs delayed by half the period Tc by the variable delay circuit as a clock signal CKb to the control circuit (152b) and the OR gate (GX1).

[0233] This clock signal LTC is input through a gate circuit (GTa) to a correction pixel designation unit (62) and a transmission timing switching unit (64) having the same configuration as shown in FIG. 9, although not shown. In this modified example, based on this 800 MHz clock signal LTC, a correction pixel is designated, and the transmission timing of the logic information of each pixel of the drawing bit sequence data SBa (SBb) or serial data DL1~DL3 (DL4~DL6), that is, the timing of shifting the pixel of the logic information to be output, that is, the output timing of the pixel shift pulse SBCa (SBCb), is determined. This correction pixel designation unit (62) and the transmission timing switching unit (64) may be provided inside the light source device (LSa (LSb)) or outside the light source device (LSa (LSb)).

[0234] Then, the logic information of each pixel of the drawing bit sequence data SBa (SBb) or serial data DL1~DL3 (DL4~DL6), which is output sequentially according to the pixel shift pulse BSCa (BSCb) output from the transmission timing switching unit (64), is output to the driving circuit (36a) of the pulse light generating unit (20a, 20b) of the light source device (LSa (LSb)). Accordingly, the intensity of the beam (LBa1 (LBb1), LBa2 (LBb2)) emitted from the pulse light generating unit (20a, 20b) is modulated based on the drawing bit sequence data SBa (SBb) or serial data DL1~DL3 (DL4~DL6). In addition, the emitted beam (LBa1 (LBb1), LBa2 (LBb2)) is combined into one beam (LBa (LBb)) by the composite optical member (154). Since the oscillation frequency Fb of these beams (LBa1(LBb1)) and beam (LBa2(LB2b)) is the same at 400 MHz and their phases are out of half a period, a beam of 800 MHz (LBa(LBb)) is generated by the composite optical member (154). Accordingly, the generated beam (LBa(LBb)) with an oscillation frequency Fa (=800 MHz) is ejected from the light source device (LSa(LSb)).

[0235] The composite optical member (154) has at least a polarizing beam splitter (PBS) that combines a P-polarized beam (LBa1(LBb1)) emitted by a pulse light generator (20a) and an S-polarized beam (LBa)2(LBb2) emitted by a pulse light generator (20b), a mirror (M20, M21) that guides the beam (LBa1(LBb1)) emitted by the pulse light generator (20a) to the polarizing beam splitter (PBS), and a mirror (M22) that guides the beam (LBa)2(LBb2) emitted by the pulse light generator (20b) to the polarizing beam splitter (PBS). Since the polarizing beam splitter (PBS) has the characteristic of transmitting P-polarized light and reflecting S-polarized light, it transmits the beam (LBa1(LBb1)) and reflects the beam (LBa)2(LBb2). At this time, the polarization separation plane of the polarization beam splitter (PBS) is positioned to be tilted 45 degrees with respect to a plane orthogonal to the optical axis of the beam (LBa1(LBb1)) incident on the polarization beam splitter (PBS), and also tilted 45 degrees with respect to a plane orthogonal to the optical axis of the beam (LBa)2(LBb2) incident on the polarization beam splitter (PBS). As a result, the beam (LBa1(LBb1)) transmitted through the polarization beam splitter (PBS) and the beam (LBa)2(LBb2) reflected from the polarization beam splitter become on the same axis, so the beam (LBa1(LBb1)) and the beam (LBa)2(LBb2) are combined.

[0236] In addition, since the beam (LBa(LBb)) emitted from the light source device (LSa(LSb)) includes a P-biased beam (LB1)a(LB1b) and an S-biased beam (LB2)a(LB2b), the optical lens system (G10), the photodetector (DT), and the λ / 4 wavelength plate (QW) within the scanning unit (Un) shown in FIG. 5 may be omitted. In this case, the slope of the drawing line (SLn) cannot be detected. Also, if the slope of the drawing line (SLn) is to be detected, the bias states of the beam (LB1)a(LB1b) and the beam (LB2)a(LB2b) are all made identical (e.g., linear P-biased or circularly polarized) by means of a polarizing plate, etc. Then, the composite optical member (154) can be formed by synthesizing these two beams (LB1)a(LB1b) and beam (LB2)a(LB2b) so that they are coaxial with each other.

[0237] In this way, in the exposure device (EX) of the present modified example, the light source device (LSa(LSb)) intensity modulates a beam (LBa1(LBb1), LBa2(LBb2)) emitted at 400 MHz from two pulse light generating parts (20(20a, 20b)), and synthesizes the intensity-modulated beam (LBa1(LBb1), LBa2(LBb2)) to emit a beam (LBa(LBb)), so that the magnification of the drawing line (SLn) (the pattern being drawn) can be more finely corrected compared to the first embodiment.

[0238] In addition, if the intensity per unit area of ​​the beam (LBa1(LBb1), LBa2(LBb2)) is strong, scorching may occur in the polarizing beam splitter (PBS), etc. Therefore, in order to reduce the intensity per unit area, a magnifying lens (G20a, G20b) that magnifies the diameter of the beam (LBa1(LBb1), LBa2(LBb2)) and a collimator lens (CL20a, CL20b) that makes the magnified beam (LBa1(LBb1), LBa2(LBb2)) into parallel light may be provided. Also, reference numeral 160 is a light guide member including a reflector, etc., for guiding the combined beam (LBa(LBb)) to the beam profiler (162). This light guide member (160) collects (converges) the beam (LBa(LBb)) so that the beam (LBa(LBb)) becomes a spot light on the measurement plane of the beam profiler (162). The beam profiler (162) measures the two-dimensional light intensity distribution of the spot light of the collected beam (LBa(LBb)) with high precision. By doing so, the coaxiality of the beam (LBa1(LBb1)) and beam (LBa)2(LBb2) of the combined beam (LBa(LBb)) can be measured precisely. This light guide member (160) is configured to be able to move away from the optical axis position (optical path) of the beam (LBa(LBb)) by moving the reflector, etc.

[0239] In addition, in this modified example, 16 spot light SPs (clock pulses of the clock signal LTC) correspond to one pixel, but 8 spot light SPs (clock pulses of the clock signal LTC) may correspond to one pixel. If the projection spacing of the spot light SPs is set to 0.1875 μm, as in this modified example, 8 spot light SPs correspond to one pixel, so the dimension Pxy of one pixel becomes 1.5 (=0.1875 × 8) μm. Therefore, in this case, the size φ of the spot light SPs is also set to a size equal to or smaller than the dimension Pxy, that is, 1.5 μm or less. In this case as well, the same effect as in this modified example can be obtained, and since the pixel dimensions can be reduced, the resolution and resolution of the pattern can be dramatically refined, and the pattern can be drawn and exposed with higher precision.

[0240] The pixel dimensions Px and Py are of the same length (e.g., 3 μm), but the lengths of dimensions Px and Py may be different. The point is that the clock signal generator (150) has a reference period Tb determined by (Py × M) / (N × Vs), and generates a plurality (M) of clock signals (first clock signals) CK with phases given by a correction time of 1 / M of the reference period Tb.

[0241] [Second Embodiment]

[0242] Next, a second embodiment will be described. In the first embodiment (including variations), the projection interval of the spot light SP in the projection direction is kept constant, and the scanning length of the drawing line (SLn) is extended by locally changing the number of spot light SP (clock pulse of the clock signal LTC) per pixel of the correction pixel. In contrast, in the second embodiment, the number of spot light SP (clock pulse of the clock signal LTC) per pixel is kept constant, and the scanning length of the drawing line (SLn) is extended by locally changing the projection interval of the spot light SP in the projection direction.

[0243] In addition, in the second embodiment, the effective length of the drawing line (SLn (SL1~SL6)) is 30 mm, the size φ of the spot light SP is 3 μm, and in principle, the projection interval of the spot light SP in the main projection direction is 1 / 2 of the size φ of the spot light SP, i.e., 1.5 μm. Accordingly, the number of spot light SPs irradiated in one scan is 20,000 (= 30 [mm] / 1.5 [μm]). In addition, if the transfer speed (transport speed) Vt of the substrate (P) in the auxiliary scanning direction is set to 2.419 mm / sec and the spot light SP is scanned at intervals of 1.5 μm in the auxiliary scanning direction as well, the time difference Tpx between the start of the first scan (drawing start) along the drawing line (SLn) and the start of the next scan is approximately 620 μsec (= 1.5 [μm] / 2.419 [mm / sec]). This time difference Tpx is the time it takes for the polygon mirror (PM) of the 8 reflective surfaces (RP) to rotate by one surface (45 degrees = 360 degrees / 8). In this case, since the time for one rotation of the polygon mirror (PM) needs to be set to approximately 4.96 msec (= 8 × 620 [μsec]), the rotation speed Vp of the polygon mirror (PM) is set to approximately 201.613 rotations per second (= 1 / 4.96 [msec]), that is, approximately 12096.8 rpm.

[0244] In addition, the number of reflective surfaces Np of the polygon mirror (PM) is set to 8, and the scanning efficiency is set to 1 / 3. Therefore, the time Ts required to scan the spot light SP for the maximum scanning length of the drawing line (SLn) (e.g., 31 mm) is given by Ts = Tpx × scanning efficiency, and in the case of the numerical example above, the time Ts becomes approximately 206.666···μsec (620〔μsec〕 / 3). Since the effective scanning length when the drawing line (SLn(SL1~SL6)) is not extended (when the magnification is 1x) is set to 30 mm, the scanning time Tsp for one scan of the spot light SP along this drawing line (SLn) becomes approximately 200 μsec (= 206.666···〔μsec〕 × 30〔mm〕 / 31〔mm〕). Therefore, when the drawing line (SLn) is not stretched, it is necessary to irradiate 20,000 spot light SP (pulse light) during this time Tsp, so the emission frequency (oscillation frequency) Fe of the beam (LB) from the light source device (LS) is Fe ≈ 20,000 [times] / 200 [μsec] = 100 MHz. Also, the scanning speed Vs of the spot light SP is 30 [mm] / 200 [μsec] = 150 m / sec. In addition, in this second embodiment, the dimension Pxy of one pixel is set to 3 μm, which is the same as the effective size φ of the spot light SP, and two spot light SPs (clock pulses of the clock signal LTC) correspond to one pixel.

[0245] FIG. 20 is a diagram showing the configuration of a signal generator (22a) provided inside a light source device (LSa(LSb)) in a second embodiment. In addition, the same reference numerals are used for configurations similar to the first embodiment (including variations), and only different parts are described. This signal generator (22a) is provided inside the control circuit (22) as in the first embodiment, but it may be provided outside the control circuit (22). In addition, this signal generator (22a) may be provided outside the light source device (LSa(LSb)). In addition, in this second embodiment, local magnification correction information CMgn′ having correction position information Nv′ and stretching information (polarity information) POL′ is sent to the signal generator (22a) from the local magnification setting unit (112) shown in FIG. 12. This local magnification setting unit (112) stores local magnification correction information CMgn′ (CMg1′~CMg6') for each scanning unit (Un(U1~U6)). Similar to the first embodiment, the local magnification setting unit (112) outputs local magnification correction information CMgn′ corresponding to the scanning unit (Un) that performs the scanning of spot light SP to the signal generation unit (22a) of the light source device (LS(LSa, LSb)). Additionally, the local magnification correction information CMgn′ is information for performing local magnification correction.

[0246] The signal generation unit (22a) has a clock signal generation unit (200), a correction point designation unit (202), and a clock switching unit (204). The clock signal generation unit (200), the correction point designation unit (202), and the clock switching unit (204), etc., can be integrated and configured using a Field Programmable Gate Array (FPGA). The clock signal generation unit (200) has a reference period Te that is shorter than the period determined by φ / Vs, and also has a plurality (N) of clock signals CK that have a phase difference of 1 / N of the reference period Te. p(p=0, 1, 2,···, N-1) is generated. φ is the effective size of the spot light SP, and Vs is the relative velocity of the spot light SP in the direction of irradiation with respect to the substrate (P). In addition, if the reference period Te is longer than the period determined by φ / Vs, the spot light SP irradiated along the direction of irradiation is irradiated discretely on the surface to be irradiated of the substrate (P) at predetermined intervals. Conversely, if the reference period Te is shorter than the period determined by φ / Vs, the spot light SP is irradiated on the surface to be irradiated of the substrate (P) so as to overlap with each other with respect to the direction of irradiation. In the second embodiment, in principle, a pulse-shaped spot light SP with an oscillation frequency Fe of 100 MHz is irradiated so that the spot light SP overlaps by half the size φ, so the reference period Te becomes 1 / Fe = 1 / 100 [MHz] = 10 [nsec], and φ / Vs = 3 [㎛] / 150 [mm / sec] = 20 nsec. Also, since N = 50, the clock signal generator (200) provides 50 clock signals CK0~CK with a phase difference of 0.2 nsec (= 10 [nsec] / 50). 49 Creates.

[0247] Specifically, the clock signal generator (200) has a clock generator (oscillator) (60) and a plurality (N-1) delay circuits De (De01~De49). The clock generator (60) generates a clock signal CK0 consisting of clock pulses that oscillate at an oscillation frequency Fe (=1 / Te) according to the overall multiplier correction information TMg. In the second embodiment, the overall multiplier correction information TMg is set to 0, and the clock generator (60) generates a clock signal CK0 at an oscillation frequency Fe of 100 MHz (reference period Te = 10 nsec).

[0248] The clock signal (output signal) CK0 from the clock generator (60) is input to the first stage (leading) delay circuit (De01) of a plurality of delay circuits De (De01~De49) connected in series, and is also input to the first input terminal of the clock switching unit (204). This delay circuit (De (De01~De049)) receives the input signal, the clock signal CK p It outputs the signal after delaying it for a certain amount of time (Te / N = 0.2 nsec). Accordingly, the first stage delay circuit (De01) has a reference period Te (10 nsec) identical to the clock signal CK0 generated by the clock generator (60), and also outputs a clock signal (output signal) CK1 with a delay of 0.2 nsec relative to the clock signal CK0. Similarly, the second stage delay circuit (De02) has a reference period Te (10 nsec) identical to the clock signal (output signal) CK1 from the previous stage delay circuit (De01), and also outputs a clock signal (output signal) CK2 with a delay of 0.2 nsec relative to the clock signal CK1. Likewise, the third stage and subsequent delay circuits (De03~De49) also output clock signals (output signals) (CK2~CK) from the previous stage delay circuits ((De02)~De48). 48 The reference period Te (10 nsec) is the same as ), and also the clock signals CK2~CK 48 Regarding CK3~CK, the clock signal (output signal) with a delay of 0.2 nsec 49 Prints.

[0249] Clock signal CK0~CK 49 Since it is a signal with a phase difference of 0.2 nsec, the clock signal CK0 is the clock signal CK 49 The reference period Te (10 nsec) is the same as, and also the clock signal CK 49 Regarding this, it becomes a clock signal with an additional delay of 0.2 nsec and a signal offset by exactly one period. Therefore, clock signal CK0 is effectively clock signal CK 49Each clock pulse can be considered as a clock signal delayed by 0.2 nsec. Clock signals CK1~CK from the delay circuits (De01~De49) 49 It is input to the 2nd to 50th input terminals of the clock switching unit (204).

[0250] Each delay circuit De (De01~De49) uses a gate circuit (logic circuit) such as that shown in FIG. 21a or FIG. 21b, for example. In FIG. 21a, an input signal (clock signal CK) is input to one input terminal (In1). p It is configured by an AND gate circuit (GT10) in which ) is input and a high signal (logic value 1) is applied to the other input terminal (In2). Through this AND gate circuit (GT10), the input signal (clock signal CK) p For ), an output signal with a delay of 0.2 nsec (clock signal CK p+1 ) is output. Also, in FIG. 21b, an input signal (clock signal CK) is input to one input terminal (In1). p It is configured by an OR gate circuit (GT11) in which ) is input and a low signal (logic value 0) is applied to the other input terminal (In2). By this OR gate circuit (GT11), an output signal (clock signal CK) having a delay of 0.2 nsec with respect to the input signal (clock signal CKp) is generated. p+1 ) is output. In this way, each delay circuit De (De01~De49) may obtain a desired delay time by a gate circuit (logic circuit) made of multiple transistors, or it may be a simple one made by connecting one or two transistors.

[0251] The clock switching unit (204) receives 50 clock signals CK p (CK0~CK 49 CK, one of the clock signals p Select, and the selected clock signal CK pIt is a multiplexer (selection circuit) that outputs as a clock signal (reference clock signal) LTC. Therefore, the oscillation frequency Fa (=1 / Ta) of the clock signal LTC is, in principle, the clock signals CK0~CK 49 The oscillation frequency Fe (=1 / Ta), that is, equal to 100 MHz. The control circuit (22) controls the DFB semiconductor laser elements (30, 32) so that the end lights S1 and S2 emit light in response to each clock pulse of the clock signal LTC output from the clock switching unit (204). Accordingly, the oscillation frequency Fa of the pulse-shaped beam (LBa(LBb)) emitted from the light source device (LSa(LSb)) is, in principle, 100 MHz.

[0252] The clock switching unit (204) outputs a clock signal CK as a clock signal LTC at the timing when the spot light SP passes a specific correction point CPP located on the scan line. p , that is, the clock signal CK resulting from the generation of the beam (LBa(LBb)). p CK, another clock signal with a different phase difference p It switches to. The clock switching unit (204) selects a clock signal CK as a clock signal LTC at the timing when the spot light SP passes through the correction point CPP. p Using the clock signal LTC, the currently selected clock signal CK p A clock signal CK having a phase difference of 0.2 nsec with respect to p It switches by ±1. This switching clock signal is CK. p Whether the direction of the phase difference of ±1, that is, the direction in which the phase is delayed by 0.2 nsec, is the direction in which the phase advances by 0.2 nsec, is determined by the 1-bit stretching information (polarity information) POL′, which is part of the local scaling correction information (correction information) CMgn′ (CMg1′~CMg6').

[0253] When the extension information POL′ is high "1" (extension), the clock switching unit (204) outputs the clock signal CK as the current clock signal LTC.p Regarding , the clock signal CK with a phase delay of 0.2 nsec p+1 Selects and outputs as the clock signal LTC. Also, when the expansion information POL′ is low "0" (reduced), the clock switching unit (204) outputs the clock signal CK that is currently being output as the clock signal LTC. p CK, the clock signal with a phase advance of 0.2 nsec for p-1 Selects and outputs it as a clock signal LTC. For example, the clock switching unit (204) outputs a clock signal CK that is currently being output as the clock signal LTC. p Ga CK 11 In this case, when the extension information POL′ is high (H), the clock signal CK output as the clock signal LTC p clock signal CK 12 Switches to, and when the new information POL′ is low (L), the clock signal CK output as the clock signal LTC p clock signal CK 10 Switches to. During a single injection period of spot light SP, the same stretching information POL′ is input.

[0254] The clock switching unit (204) uses the stretching information POL′ of the local magnification correction information CMgn′ corresponding to the scanning unit (Un) into which the beam (LBn) is incident by the beam switching unit (BDU), and the clock signal CK output as the clock signal LTC. p It determines the direction in which the phase is misaligned (whether the phase is advancing or lagging). A beam (LBa) (LB1~LB3) from a light source device (LSa) is guided to one of the scanning units (U1~U3). Accordingly, the clock switching unit (204) of the signal generation unit (22a) of the light source device (LSa) outputs a clock signal CK as a clock signal LTC based on the stretching information POL′ of the local magnification correction information CMgn′ corresponding to one scanning unit (Un) among the scanning units (U1~U3) to which the beam (LBn) is incident. pThe direction in which the phase is offset is determined. For example, when a beam (LB2) is incident on a scanning unit (U2), the clock switching unit (204) of the light source device (LSa) outputs a clock signal CK as a clock signal LTC based on the stretching information POL′ of the local magnification correction information CMg2′ corresponding to the scanning unit (U2). p Determines the direction in which the phase deviates.

[0255] Additionally, a beam (LBb) (LB4~LB6) from the light source device (LSb) is guided to one of the scanning units (U4~U6). Accordingly, the clock switching unit (204) of the signal generating unit (22a) of the light source device (LSb) outputs a clock signal CK as a clock signal LTC based on the stretching information POL′ of the local magnification correction information CMgn′ corresponding to one scanning unit (Un) among the scanning units (U4~U6) to which the beam (LBn) is incident. p The direction in which the phase is misaligned is determined. For example, when a beam (LB6) is incident on a scanning unit (U6), the clock switching unit (204) of the light source device (LSb) determines the clock signal CK output as a clock signal LTC based on the stretching information POL′ of the local magnification correction information CMg6′ corresponding to the scanning unit (U6). p Determines the direction in which the phase deviates.

[0256] The correction point designation unit (202) designates a specific point on each drawing line (SLn (SL1~SL6)) as a correction point CPP. The correction point designation unit (202) designates a correction point CPP based on correction position information (set value) Nv ′ for designating a correction point CPP that is part of local magnification correction information (correction information) CMgn′ (CMg1′~CMg6'). The correction position information Nv ′ of this local magnification correction information CMgn′ is information for designating a correction point CPP at each of a plurality of discrete positions on the drawing line (SLn) at equal intervals according to the drawing magnification of the pattern being drawn along the drawing line (SLn) (or the magnification in the direction of the main drawing of the drawing line (SLn)), and is information indicating the distance interval (equal interval) between the correction point CPP and the correction point CPP. By this, the correction point designation unit (202) can designate a position discretely spaced at equal intervals on the drawing line (SLn (SL1~SL6)) as a correction point CPP. This correction point CPP is set between the projection positions (center positions of the spot light SP) of two adjacent spot light SPs projected along the drawing line (SLn).

[0257] The correction point designation unit (202) designates the correction point CPP using the correction position information Nv' of the local magnification correction information CMgn' corresponding to the scanning unit (Un) to which the beam (LBn) is incident by the beam conversion unit (BDU). Since the beam (LBa) (LB1~LB3) from the light source device (LSa) is guided to one of the scanning units (U1~U3), the correction point designation unit (202) of the signal generation unit (22a) of the light source device (LSa) designates the correction point CPP based on the correction position information Nv' of the local magnification correction information CMgn' corresponding to one scanning unit (Un) to which the beam (LBn) is incident among the scanning units (U1~U3). For example, when a beam (LB2) is incident on a scanning unit (U2), the correction point designation unit (202) of the light source device (LSa) designates a plurality of positions discretely arranged at equal intervals on a drawing line (SLn2) as correction points CPP, based on the correction position information Nv' of the local magnification correction information CMg2' corresponding to the scanning unit (U2).

[0258] Additionally, since the beam (LBb) (LB4~LB6) from the light source device (LSb) is guided to one of the scanning units (U4~U6), the correction point designation unit (202) of the signal generation unit (22a) of the light source device (LSb) designates a correction point CPP based on the correction position information Nv' of the local magnification correction information CMgn' corresponding to one scanning unit (Un) among the scanning units (U4~U6) to which the beam (LBn) is incident. For example, when the beam (LB6) is incident on the scanning unit (U6), the correction point designation unit (202) of the light source device (LSb) designates a plurality of positions discretely arranged at equal intervals on the drawing line (SLn6) as correction points CPP based on the correction position information Nv' of the local magnification correction information CMg6' corresponding to the scanning unit (U6).

[0259] To explain the correction point designation unit (202) in detail, the correction point designation unit (202) has a frequency divider counter circuit (212) and a shift pulse output unit (214). The frequency divider counter circuit (212) is a subtraction counter, and a clock pulse (reference clock pulse) of the clock signal LTC output from the clock switching unit (204) is input. The clock pulse of the clock signal LTC output from the clock switching unit (204) is input to the frequency divider counter circuit (212) through a gate circuit (GTa). The gate circuit (GTa) is a gate that opens during the period when the drawing permission signal SQn described in the first embodiment is high (H). That is, the frequency divider counter circuit (212) counts the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high. Three drawing perm...

Claims

Claim 1 A pattern drawing device comprising a plurality of drawing units that scan a spot light in a main scanning direction on a substrate, arranged in the main scanning direction, and drawing a pattern on the substrate by scanning the spot light by each of the drawing units, the pattern drawing device comprising: a light source device that emits a beam that becomes the spot light as a parallel laser light; a plurality of selection optical elements provided corresponding to each of the plurality of drawing units, arranged to transmit the parallel beam from the light source device in sequence, and generating a diffracted light beam in which the beam is deflected by diffraction when a driving signal is applied; a relay system that forms a beam waist of the beam between two of the selection optical elements that are in a relationship of front and rear in the order in which the beam is transmitted, and a branching mirror that reflects only the diffracted light beam generated from the selection optical elements toward one of the drawing units corresponding at the position of the beam waist. Claim 2 A pattern drawing device according to claim 1, wherein the relay system comprises: a first lens system in which a parallel beam transmitted through a selection optical element that becomes the front end is incident and concentrated to a position of the beam waist, and the selection optical element that becomes the front end is positioned at a front focal point; and a second lens system in which a selection optical element that becomes the rear end is positioned at a rear focal point, and the beam radiating from the beam waist is made into a parallel light beam. Claim 3 A pattern drawing device according to claim 2, wherein each of the plurality of selection optical elements is an acousto-optic modulation element that generates a parallel diffracted light beam deflected by a diffraction angle according to the frequency of the driving signal and a parallel zero-order light beam that proceeds without deflection while the driving signal is applied in an ON state, and the first lens system is formed by separating the position of the beam waist of the zero-order light beam generated when the ON state is in the direction of the diffracted light beam and the position of the beam waist of the diffracted light beam in the direction of the diffraction angle. Claim 4 A pattern drawing device according to claim 3, wherein the branching reflector has a reflective surface of a size that reflects only the diffracted light beam even when the diffracted light beam from the first lens system is slightly shifted in the direction of the diffraction angle. Claim 5 A pattern drawing device according to claim 4, wherein the light source device comprises a pulse light source unit that generates a longitudinal light, which is the source of the beam, in a pulse shape at a predetermined frequency Fa; an electro-optical modulator that modulates the peak intensity of the pulse-shaped longitudinal light by electrical control in response to drawing data corresponding to the pattern; an optical amplifier that amplifies the modulated pulse-shaped longitudinal light; and a wavelength conversion optical element that generates the harmonics of the amplified pulse-shaped longitudinal light as the pulse-shaped beam at the frequency Fa. Claim 6 A pattern drawing device according to claim 5, wherein the frequency Fa of the end light from the pulse light source is set to 100 MHz or 400 MHz. Claim 7 A pattern drawing apparatus according to claim 5 or claim 6, wherein the frequency Fa is set such that the period 1 / Fa of the frequency Fa is shorter than the time determined by φ / Vs, when the effective size of the spot light on the drawing line formed on the substrate by scanning the spot light is φ and the scanning speed of the spot light is Vs. Claim 8 A pattern drawing device according to any one of claims 1 to 6, wherein each of the plurality of drawing units comprises: a rotating polygon mirror that sequentially deflects the diffracted light beam incident through the branching mirror at each of the plurality of reflective surfaces for scanning the spot light; a scanning lens system that directs the diffracted light beam deflected from the rotating polygon mirror and concentrates it as the spot light on the substrate; and a home sensor that generates a home signal changing into a pulse shape indicating the timing for starting the drawing of a pattern by the spot light at every moment when each of the plurality of reflective surfaces of the rotating polygon mirror reaches a predetermined rotation angle. Claim 9 A pattern drawing device according to claim 8, wherein the number of reflection surfaces of the rotating polygon mirror Np is set to 360° / Np, and the number of drawing units n is set such that n times the number of rotation angles α becomes smaller than the number of rotation angles 360° / Np, when the number of rotation angles of the rotating polygon mirror corresponding to the effective scanning time when the diffracted light beam is incident on the main lens system and the spot light is actually scanned on the substrate. Claim 10 A pattern drawing apparatus according to claim 9, wherein the main lens system is a telecentric fθ lens system in which a change in the image height position from the optical axis of the spot light projected onto the substrate is proportional to a change in the angle of the diffracted light beam incident on the main lens system with respect to the optical axis, and the reflective surface of the rotating polygon mirror is disposed on the same plane of the fθ lens system. Claim 11 A pattern drawing device according to any one of claims 1 to 6, wherein between the selection optical element to which the beam from the light source device is first incident and the light source device, an expander system is further provided to convert the beam emitted from the light source device into a parallel light beam with a reduced beam diameter. Claim 12 A pattern drawing apparatus according to claim 11, wherein each of the plurality of drawing units further comprises a beam expander that converts the diffracted light beam reflected from the branching mirror into a parallel light with an expanded diameter, and an aperture having a circular opening for cutting a lower portion of the intensity distribution within the cross-section of the expanded diffracted light beam. Claim 13 A pattern drawing apparatus according to any one of claims 3 to 6, further comprising a driving control unit that generates the driving signal applied to the acousto-optic modulation element, wherein the driving control unit comprises a frequency modulation circuit that changes the frequency of the driving signal so as to change the diffraction angle of the acousto-optic modulation element in order to shift the position of the beam waist of the diffracted light beam reflected from the branch reflector in the direction of the diffraction angle. Claim 14 A pattern drawing device according to claim 13, wherein the reflective surface of the branching mirror is set to a size that reflects only the diffracted light beam separated at the position of the beam waist within the range of position change of the beam waist shifted by the frequency modulation circuit.

Images