Plating device and plating method

Abstract

The purpose is to suppress or prevent the shape, movement, etc. of each component positioned between the substrate and the anode from being transferred to the plating film. A plating apparatus comprising: a plating tank for holding a plating solution; a substrate holder for holding and supporting a substrate with the surface to be plated facing downward; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; a diaphragm support member pressing the upper surface of the diaphragm, the diaphragm support member having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, wherein the center of the circumscribed circle including the plurality of first-shaped openings is eccentric from the center of rotation of the substrate holder.

Description

Technology Field

[0001] The present invention relates to a plating apparatus and a plating method. Background Technology

[0002] As a plating apparatus capable of performing plating treatment on a substrate, a so-called face-down or cup-type plating apparatus is known as described in International Publication No. 2003 / 079684 (Patent Document 1). Such a plating apparatus is equipped with a plating tank in which an anode is disposed while holding a plating solution, and a substrate holder (also called a plating head) disposed above the anode and holding and supporting a substrate as a cathode.

[0003] In such a face-down type plating apparatus, the anode is structurally positioned at the bottom of the plating tank, so it is necessary to separate all parts above the anode for maintenance work such as anode replacement. This series of operations has the problem of poor workability, taking time, and worsening the operating rate of the plating apparatus. To solve this problem, International Publication No. 2003 / 079684 (Patent Document 1) adopts a configuration in which a withdrawal unit capable of being withdrawn from the plating tank is provided and the anode is placed in the withdrawal unit. Prior art literature

[0004] International Publication No. 2003 / 079684 The problem to be solved

[0005] However, in the plating tank, in addition to the anode, a membrane (diaphragm) is sometimes positioned above the anode to partition the anode chamber on the anode side and the cathode chamber on the substrate side. The diaphragm seals the plating solution in each chamber—the anode chamber and the cathode chamber—to each other, allowing metal ions in the plating solution to pass from the anode chamber to the cathode chamber, while preventing additives in the plating solution from passing from the cathode chamber to the anode chamber. Although this diaphragm is a consumable component that requires periodic replacement, it is positioned below components on the substrate holder side, such as resistors and paddles, and is installed in the plating tank via a sealed structure to partition and seal each chamber. Consequently, there is a problem with the extensive effort required for disassembly and installation during replacement. Furthermore, since the diaphragm and the anode are spaced apart, there is a concern that the height dimensions of the integrated unit may increase.

[0006] Furthermore, from the perspective of improving the quality of the plating film formed on the substrate, it is necessary to suppress or prevent the transfer of the shape, movement, etc., of each component positioned between the substrate and the anode to the plating film. Additionally, from the perspective of improving the quality of the plating film, it is also necessary to pay attention to reducing residual bubbles within the cathode chamber.

[0007] The present invention aims to solve at least some of the aforementioned problems. One of the objectives of the present invention is to facilitate the maintenance of diaphragms and the like placed in a face-down plating apparatus. Furthermore, one of the objectives of the present invention is to facilitate the installation of diaphragms in the plating tank in a face-down plating apparatus. Additionally, one of the objectives of the present invention is to easily and reliably seal each chamber within the plating tank by means of diaphragms in a face-down plating apparatus. One of the objectives of the present invention is to suppress or prevent the transfer of the shape, movement, etc., of each component placed between the substrate and the anode to the plating film. One of the objectives of the present invention is to reduce residual bubbles in the cathode chamber. means of solving the problem

[0008] According to one aspect of the present invention, a plating apparatus is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding and supporting a substrate with a surface to be plated downward; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support member pressing the upper surface of the diaphragm, the diaphragm support member having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, wherein the center of the circumscribed circle including the plurality of first-shaped openings is eccentric from the center of rotation of the substrate holder.

[0009] In addition, according to one aspect of the present invention, a plating tank for holding a plating solution, and

[0010] A plating apparatus is provided comprising a substrate holder that holds and supports a substrate, an anode disposed opposite to the substrate, a diaphragm disposed between the substrate and the anode, and a diaphragm support member that presses the diaphragm, having a surface and a back surface, and a plurality of beams that define a plurality of openings penetrating between the surface and the back surface, wherein at least some of the beams are chamfered on the back surface side that contacts the diaphragm.

[0011] According to one aspect of the present invention, a plating method is provided for plating a substrate with the surface to be plated facing downward, wherein the plating tank is prepared having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, a diaphragm support member pressing the upper surface of the diaphragm, a plurality of first-shaped openings, and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and the plating method is provided for plating the substrate while rotating the substrate in a state in which the center of rotation of the substrate is eccentric from the center of the circumscribed circle including the plurality of first-shaped openings of the diaphragm support member.

[0012] In addition, according to one aspect of the present invention, there is a plating method for plating a substrate, and

[0013] A plating method is provided, comprising: preparing a plating bath having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, and a diaphragm support member pressing the diaphragm, wherein the diaphragm support member has a plurality of beams defining a plurality of openings, and at least some of the beams are chamfered on the side in contact with the diaphragm, and plating the substrate using the plating bath. Brief explanation of the drawing

[0014] FIG. 1 is a perspective view illustrating the overall configuration of a plating apparatus according to one embodiment. FIG. 2 is a plan view illustrating the overall configuration of a plating apparatus according to one embodiment. FIG. 3 is a perspective view of the plating module seen from the front lower side. Figure 4 is a perspective view of the longitudinal section of the plating module. Figure 5 is a perspective view of a cross-section of a plating module. FIG. 6a is an enlarged perspective view showing a part of the anode holder assembly. Figure 6b is an explanatory diagram illustrating the installation structure of the diaphragm and anode. FIG. 7 is a perspective view of a cross-sectional view of a plating module at the cathode liquid inlet. Figure 8 is a plan view of an anode holder assembly. FIG. 9 is a perspective view of the anode holder assembly seen from above. FIG. 10 is a perspective view of the anode holder assembly seen from below. FIG. 11 is a perspective view of the anode holder assembly seen from below with the anode fixing plate made transparent. Figure 12 is a bottom view of the diaphragm support. FIG. 13a is an enlarged perspective view of a part of the diaphragm support. FIG. 13b is a perspective view showing a further enlarged portion of the diaphragm support. Specific details for implementing the invention

[0015] Hereinafter, a plating apparatus (1000) according to an embodiment of the present invention will be described with reference to the drawings. Also, the drawings are schematically illustrated to facilitate understanding of the characteristics of objects, and the dimensional ratios of each component, etc., cannot be said to be the same as the actual ones. In addition, some drawings show XYZ orthogonal coordinates for reference. Among these orthogonal coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0016] FIG. 1 is a perspective view illustrating the overall configuration of a plating device (1000) of the present embodiment. FIG. 2 is a plan view illustrating the overall configuration of a plating device (1000) of the present embodiment. As shown in FIG. 1 and FIG. 2, the plating device (1000) comprises a load port (100), a conveying robot (110), an aligner (120), a pre-wet module (200), a pre-soak module (300), a plating module (400), a cleaning module (500), a spin rinse dryer (600), a conveying device (700), and a control module (800).

[0017] A load port (100) is a module for receiving a wafer (substrate) stored in a cassette, such as a FOUP not shown in the plating device (1000), or for taking out a substrate from the plating device (1000) into the cassette. In this embodiment, four load ports (100) are arranged in a horizontal direction, but the number and arrangement of load ports (100) are arbitrary. A transport robot (110) is a robot for transporting substrates and is configured to transport substrates between a load port (100), an aligner (120), a pre-wet module (200), and a spin rinse dryer (600). When transporting substrates between the transport robot (110) and the transport device (700), the transport robot (110) and the transport device (700) can transport the substrates through a temporary placement stand (not shown).

[0018] An aligner (120) is a module for aligning the position of a reference plane or notch of a substrate in a predetermined direction. In this embodiment, two aligners (120) are arranged in a horizontal direction, but the number and arrangement of the aligners (120) are arbitrary. The pre-wet module (200) replaces the air inside the pattern formed on the surface of the substrate with the treatment solution by wetting the surface to be plated of the substrate before plating with a treatment solution such as pure water or degassed water. The pre-wet module (200) is configured to perform a pre-wet treatment that facilitates the supply of plating solution inside the pattern by replacing the treatment solution inside the pattern with a plating solution during plating. In this embodiment, two pre-wet modules (200) are arranged in an up-down direction, but the number and arrangement of the pre-wet modules (200) are arbitrary.

[0019] The pre-soak module (300) is configured to perform a pre-soak treatment to clean or activate the under-plating surface by etching away, for example, an oxide film with high electrical resistance existing on the surface of a seed layer formed on the plated surface of a substrate prior to plating treatment, using a treatment solution such as sulfuric acid or hydrochloric acid. In this embodiment, two pre-soak modules (300) are arranged in an up-and-down direction, but the number and arrangement of the pre-soak modules (300) are arbitrary. The plating module (400) performs a plating treatment on the substrate. In this embodiment, there are two sets of 12 plating modules (400) arranged in three units in the up-and-down direction and four units in the horizontal direction, so a total of 24 plating modules (400) are provided, but the number and arrangement of the plating modules (400) are arbitrary.

[0020] The cleaning module (500) is configured to perform a cleaning treatment on the substrate to remove plating solution and the like remaining on the substrate after the plating treatment. In this embodiment, two cleaning modules (500) are arranged in an up-and-down direction, but the number and arrangement of the cleaning modules (500) are arbitrary. The spin rinse dryer (600) is a module for drying the substrate after the cleaning treatment by rotating it at high speed. In this embodiment, two spin rinse dryers (600) are arranged in an up-and-down direction, but the number and arrangement of the spin rinse dryers (600) are arbitrary. The transport device (700) is a device for transporting the substrate between multiple modules within the plating device (1000). The control module (800) is configured to control multiple modules of the plating device (1000) and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0021] An example of a series of plating processes by a plating device (1000) is described. First, a substrate stored in a cassette is brought into a load port (100). Subsequently, a return robot (110) takes the substrate out of the cassette in the load port (100) and returns the substrate to an aligner (120). The aligner (120) aligns the position of the substrate, such as a reference plane or notch, in a predetermined direction. The return robot (110) then delivers the substrate, aligned by the aligner (120), to a pre-wet module (200).

[0022] The pre-wet module (200) performs a pre-wet treatment on the substrate. The return device (700) returns the substrate, on which the pre-wet treatment has been performed, to the pre-soak module (300). The pre-soak module (300) performs a pre-soak treatment on the substrate. The return device (700) returns the substrate, on which the pre-soak treatment has been performed, to the plating module (400). The plating module (400) performs a plating treatment on the substrate.

[0023] The return device (700) returns the substrate on which plating treatment has been performed to the cleaning module (500). The cleaning module (500) performs cleaning treatment on the substrate. The return device (700) returns the substrate on which cleaning treatment has been performed to the spin rinse dryer (600). The spin rinse dryer (600) performs drying treatment on the substrate. The return robot (110) receives the substrate from the spin rinse dryer (600) and returns the substrate on which drying treatment has been performed to the cassette of the load port (100). Finally, the cassette containing the substrate is discharged from the load port (100).

[0024] In addition, the configuration of the plating device (1000) described in FIG. 1 or FIG. 2 is merely an example, and the configuration of the plating device (1000) is not limited to the configuration of FIG. 1 or FIG. 2.

[0025] [Plating Module]

[0026] Next, the plating module (400) will be described. Additionally, since the plurality of plating modules (400) of the plating device (1000) according to the present embodiment have the same configuration, one plating module (400) will be described.

[0027] FIG. 3 is a perspective view of the plating module viewed from the front side below. FIG. 4 is a perspective view of the longitudinal section of the plating module. FIG. 5 is a perspective view of the transverse section of the plating module. FIG. 6a is an enlarged perspective view showing a part of the anode holder assembly. FIG. 6b is an explanatory diagram explaining the installation structure of the diaphragm and the anode. FIG. 7 is a perspective view of the longitudinal section of the plating module at the cathode liquid inlet. FIG. 8 is a plan view of the anode holder assembly. FIG. 9 is a perspective view of the anode holder assembly viewed from above. FIG. 10 is a perspective view of the anode holder assembly viewed from below. In addition, the direction indicated by the arrow Y in FIG. 3 indicates the front-rear direction of the plating module (400), and the front plate (cover part) (640) side of the anode holder (610) is the front side, and the opposite side is the rear side.

[0028] The plating apparatus (1000) according to the present embodiment is a plating apparatus of the type referred to as a face-down type or cup type, which holds and supports a substrate (Wf) horizontally for plating, as shown in FIG. 4. The plating module (400) of the plating apparatus (1000) according to the present embodiment mainly comprises a plating tank (10), a substrate holder (20), also referred to as a plating head, which holds and supports the substrate (Wf), a rotation mechanism, a tilting mechanism, and a lifting mechanism (not shown) for rotating, tilting, and lifting the substrate holder (20), a diaphragm (50) that divides the inside of the plating tank (10) into a cathode chamber (Cc) and an anode chamber (Ca), and an anode (60) positioned facing the substrate (Wf) below the substrate (Wf). However, the tilting mechanism may be omitted.

[0029] The plating tank (10) according to the present embodiment is constructed by a container having a bottom with an opening at the top. The plating tank (10) according to the present embodiment is equipped with an upper tank (11) and a lower tank (12). The plating tank (10) forms an internal space of approximately cylindrical shape for storing plating solution with the upper tank (11) and the lower tank (12). As for the plating solution, it may be a solution containing ions of metal elements constituting the plating film, and the specific examples thereof are not particularly limited. In the present embodiment, copper plating treatment is used as an example of plating treatment, and copper sulfate solution is used as an example of plating solution. In addition, in the present embodiment, the plating solution contains a predetermined additive. However, it is not limited to this configuration, and the plating solution may be composed without the additive.

[0030] A paddle (30) is positioned near a substrate (Wf) inside a plating tank (10). The paddle (30) reciprocates in a direction approximately parallel to the surface to be plated of the substrate (Wf), thereby generating a strong flow of plating solution on the surface of the substrate (Wf). By doing so, the ions in the plating solution near the surface of the substrate (Wf) are homogenized, thereby improving the uniformity of the plating film formed on the surface of the substrate (Wf).

[0031] A porous resistor (40) is disposed below the paddle (30) inside the plating tank (10). Specifically, the resistor (40) is composed of a porous plate member having a plurality of holes (pores). The plating solution on the side below the resistor (40) can pass through the resistor (40) and flow to the side above the resistor (40). This resistor (40) is a member provided to promote the uniformity of the electric field formed between the anode (60) and the substrate (Wf). By disposing of such a resistor (40) in the plating tank (10), the uniformity of the film thickness of the plating film (plating layer) formed on the substrate (Wf) can be easily achieved. Furthermore, the resistor (40) is not an essential component in this embodiment, and this embodiment may be configured without the resistor (40).

[0032] In this embodiment, an anode holder assembly (6) is disposed within the lower tank (12) of the plating tank (10), and the anode holder assembly (6) is configured to include a diaphragm (50), an anode (60), and a variable anode mask (650). That is, by inserting and mounting the anode holder assembly (6) into the plating tank (10), the diaphragm (50), the anode (60), and the variable anode mask (650) are disposed within the plating tank (10).

[0033] In this embodiment, the diaphragm (50) and the anode (60) are positioned below the variable anode mask (650) inside the plating tank (10) (Figs. 5 and 6a). In this embodiment, a configuration is adopted in which the anode (60) is positioned in close contact with the diaphragm (50). The diaphragm (50) divides the interior of the plating tank (10) vertically into an anode chamber (Ca) (a chamber on the lower side of the diaphragm (50)) and a cathode chamber (Cc) (a chamber on the upper side of the diaphragm (50)). The diaphragm (50) is configured, for example, by overlapping a neutral membrane and an ion exchange membrane. The configuration of the diaphragm (50) is an example, and other configurations may be taken. The diaphragm (50) is fixed by being pressed against the holder body (620) from below by a seal pressing ring (51) while a seal (704) is inserted between the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) at its outer periphery (Figs. 6a, 6b). A seal surface (704A) is formed between the lower surface of the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) and the upper surface of the outer periphery of the diaphragm (50). The seal (704) can be placed, for example, in a seal groove provided in an annular shape along the entire circumference of the lower surface of the annular portion (621) of the holder body (620) / anode holder (610). In this manner, in the present embodiment, the plating tank (10) of the anode holder assembly (6) can be configured to be divided vertically by a diaphragm (50). Accordingly, when the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) and the plating tank (10) are sealed, the plating tank (10) is configured to be divided into an anode chamber (Ca) and a cathode chamber (Cc) with the diaphragm (50) as the boundary.

[0034] In the anode chamber (Ca), an anode solution (plating solution) is supplied from an anode solution inlet (12C) provided on the bottom wall of the plating tank (10), and the anode solution is discharged from an anode solution outlet (not shown) provided on the side wall of the plating tank (10), for example. In the cathode chamber (Cc), a cathode solution (plating solution) is supplied from a cathode solution inlet (680) and discharged from a cathode solution outlet (not shown). A plating solution (cathode solution) containing additives such as an accelerator is introduced into the cathode chamber (Cc), and a plating solution (anode solution) that does not contain additives or has a low concentration of additives is introduced into the anode chamber (Ca). The diaphragm (50) allows metal ions in the plating solution to pass from the anode room (Ca) to the cathode room (Cc), while preventing additives in the plating solution from passing from the cathode room (Cc) to the anode room (Ca).

[0035] The anode (60) is positioned in close contact with the lower surface of the diaphragm (50). The specific type of the anode (60) is not particularly limited, and a soluble anode or an insoluble anode may be used. In this embodiment, an insoluble anode is used as the anode (60). The specific type of this insoluble anode is not particularly limited, and platinum or iridium oxide may be used.

[0036] In this embodiment, a variable anode mask (650) is provided on the upper side (substrate (Wf) side) of the anode (60) and the diaphragm (50). The variable anode mask (650) is an electric field control member that controls the electric field directed from the anode (60) toward the substrate (Wf) by having an opening that exposes the anode (60) inside the blade (651) and by adjusting the range in which the anode (60) is exposed by the blade (651). As shown in FIG. 5, the variable anode mask (650) of this embodiment is equipped with a plurality of blades (651) and adjusts the opening dimensions of the opening that exposes the anode (60) by means of a mechanism similar to the aperture of a camera.

[0037] Anode Holder Assembly

[0038] Below, details of the anode holder assembly (also referred to as a withdrawal unit) (6) will be described. In this embodiment, the diaphragm (50), the anode (60), and the variable anode mask (650) are installed in the anode holder (610), and these are integrally formed as the anode holder assembly (6) (Figs. 3 and 4). In other embodiments, the variable anode mask (650) may be omitted or provided separately from the anode holder assembly (6). The anode holder assembly (6) is installed so as to be withdrawable in the plating tank (10) (lower tank (12)). As shown in Figs. 3 and 4, the anode holder assembly (6) is inserted into the plating tank (10) through an opening (12B) provided on the front side of the plating tank (10) and mounted in the plating tank (10). The opening (12B) of the plating tank (10) is blocked by the front plate (cover part) (640) of the anode holder (610) and is sealed tightly by the seal (702), (703) (described later).

[0039] The anode holder assembly (6) comprises an anode holder (610), a diaphragm (50) installed on the anode holder (610), an anode (60), and a variable anode mask (650). In another embodiment, the variable anode mask (650) may be omitted or provided separately from the anode holder assembly (6).

[0040] (Anode holder)

[0041] The anode holder (610) is provided with a holder body (620) and a front plate (640). The holder body (620) is a member that holds and supports a diaphragm (50), an anode (60), and a variable anode mask (650). The front plate (640) is a member that blocks the opening (12B) of the plating tank (10) and liquid-tightly seals the inside of the plating tank (10) from the outside. Since the holder body (620) is a part that forms the main part of the anode holder (610), the outer periphery of the anode holder (610) represents the outer periphery of the holder body (620), and the outer periphery of the holder body (620) represents the outer periphery of the anode holder (610).

[0042] · Holder body

[0043] The holder body (620) is provided with an annular portion (621), a diaphragm support portion (622) integrally provided on the inner side of the annular portion (621), and a flange (623) provided on the upper surface of the annular portion (621). The annular portion (621) and the flange (623) constitute the outer periphery of the holder body (620) / anode holder (610). The annular portion (621) and the flange (623) may be collectively referred to as the outer periphery of the holder body (620) / anode holder (610), or each may be referred to as the outer periphery of the holder body (620) / anode holder (610).

[0044] As shown in FIG. 4, the annular portion (621) forms the lower part of the outer circumference of the holder body (620) / anode holder (610), and a diaphragm support portion (622) having a plurality of openings that expose a diaphragm (50) (an area corresponding to the anode (60)) is disposed therein. In another embodiment, the diaphragm support portion (622) may be omitted, and the portion of the diaphragm support portion (622) may be a single opening.

[0045] As shown in FIGS. 8 and 9, the diaphragm support member (622) is a mesh portion including a plurality of openings, and as shown in FIGS. 4 and 5, it contacts the upper surface of the diaphragm (50) and supports the diaphragm (50) from above. As shown in FIGS. 4 and 5, the diaphragm support member (622) has a honeycomb structure (inside of the circumscribed circle (Rm)) having a plurality of honeycomb-shaped openings arranged in a hexagonal shape, and a plurality of beams (622B) extending radially from the apex of the outermost circumference of the honeycomb structure to the annular portion (621) of the holder body (620) / anode holder (610). In FIG. 8, Rm represents the circumscribed circle of the honeycomb structure, and the inside of this circumscribed circle (Rm) represents the honeycomb structure. The circumscribed circle (Rm) corresponds approximately to the outer shape (projected shape) of the substrate (Wf). However, in this embodiment, as shown in FIG. 8, the center of the honeycomb structure, i.e., the center (Cm) of the circumscribed circle (Rm), is eccentric from the rotation center / rotation center axis (Cw) of the substrate holder (20) (substrate (Wf)). By this configuration, the plating film formed on the substrate (Wf) does not acquire the pattern of the diaphragm support (622), thereby suppressing or preventing a decrease in the uniformity of the plating film thickness. If the center (Cm) of the honeycomb structure and the rotation center (Cw) of the substrate (Wf) are not eccentric (offset), there is a high possibility that an area where the electric field is shielded by the beam (622A) will be created even when the substrate (Wf) is rotated.

[0046] The flange (623) forms the upper part of the outer periphery of the holder body (620) / anode holder (610) and forms the installation part inside the plating tank (10). As shown in FIGS. 8 and 9, the flange (623) is an annular member and has an opening in the central part that exposes a diaphragm (50) (an area corresponding to the anode (60)). The flange (623) is firmly and liquid-tightly fixed to the annular part (621) of the holder body (620) / anode holder (610) by a fixing method using a fastening member, welding, joining, etc. A seal may be placed between the flange (623) and the annular part (621) to liquid-tightly fix the two. In this embodiment, the flange (623) is provided separately from the annular portion (621), but if the variable anode mask (650) is not installed in the anode holder (610), the flange (623) may be provided integrally with the annular portion (621). An annular seal groove is formed along the entire circumference on the upper surface of the flange (623), and an annular seal (701) is disposed in the seal groove. In this embodiment, as shown in FIG. 4, an annular projection is provided on the inner part of the upper surface of the flange (623) that is slightly higher than other parts, and a seal (701) is disposed on this annular projection.

[0047] ·Front plate

[0048] As shown in FIGS. 3 and 4, the front plate (640) comprises a front plate body (641) and a frame member (642). The frame member (642) is fitted onto the outer surface of the front plate body (641) so as to be movable in the front-rear direction relative to the front plate body (641). The front plate body (641) and the frame member (642) are fitted together with a strength such that they do not detach from each other. As shown in FIG. 4, an annular seal (703) is arranged, for example, around the entire circumference of the outer surface of the front plate body (641), and the seal (703) tightly seals the space between the front plate body (641) and the frame member (642). The seal (703) is arranged, for example, within an annular seal groove that is arranged around the entire circumference of the outer surface of the front plate body (641). The seal (703) may be placed within a seal groove that is arranged in an annular shape around the entire circumference of the inner surface of the frame member (642). A flange (12A) that protrudes downward and left and right directions is provided around the opening (12B) of the lower plate (12) of the plating tank (10). An annular seal (702) is arranged around the entire circumference of the opening (12B) on the front surface of the flange (12A), so that the seal (702) seals the space between the flange (12A) and the front plate (640) (frame member (642)). For example, the seal (702) is placed within an annular seal groove arranged around the entire circumference of the opening (12B) on the front surface of the flange (12A). The flange (12A) forms part of the lower body (12), but may be provided integrally with the lower body (12), or provided separately from other parts of the lower body (12) and fixed tightly to other parts by means of a fixing method using a fastening member, welding, joining, etc. Additionally, the seal (702) may be placed within a seal groove that is provided in an annular shape around the entire circumference of the back surface of the frame member (642).

[0049] Additionally, if sufficient surface area can be secured for the frame member (642) of the front plate (640) to come into contact with the side wall (front side) of the lower part (12), the flange (12A) may be omitted.

[0050] As shown in FIGS. 3 and 4, the front plate (640) is fixed to the flange (12A) of the lower tank (12) by a plurality of fastening members (802) penetrating the frame member (642). The fastening members (802) may be bolts, screws, or any other fastening members. However, it is desirable that they be easy to detach for maintenance of the anode holder assembly (6) (anode holder (610)). As the frame member (642) of the front plate (640) is fixed to the flange (12A) of the plating tank (10) by the fastening members (802), the frame member (642) and the flange (12A) are sealed by a seal (702). At this time, the frame member (642) moves in the forward and backward directions relative to the front plate body (641), so that the seal (702) can be elastically deformed appropriately, thereby allowing the sealing performance of the seal (702) to be fully exerted. As a result, when the anode holder (610) (anode holder assembly (6)) is mounted in the plating tank (10), the inside of the plating tank (10) is liquid-tightly sealed from the outside by the seal (702) between the front plate (640) of the anode holder (610) and the flange (12A) of the plating tank (10).

[0051] (Diaphragm)

[0052] As shown in FIG. 4 and FIG. 6a, the outer periphery of a diaphragm (50) is installed on the lower surface of the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) with a seal (704) interposed therein. As shown in FIG. 6a, a plurality of fastening members (803) penetrate the seal pressing ring (51), the diaphragm (50), and the seal (704) and are screw-coupled to the annular portion (621), so that the outer periphery of the diaphragm (50) is installed on the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) in a state where it is sealed by the seal (704). The seal (704) may be placed, for example, in a seal groove formed annularly over the entire circumference of the lower surface of the annular portion (621) ( FIG. 6a). A plurality of fastening members (803) may be bolts, screws, or any other fastening members, and are, for example, evenly distributed over the entire circumference of the seal pressing ring (51). The diaphragm support (622) and the annular portion (621) may be combined and referred to as the diaphragm support.

[0053] (Anode)

[0054] As shown in FIG. 6b, the anode (60) is installed on the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) so as to be in close contact with the lower surface of the diaphragm (50) by means of an anode fixing plate (62) and a diaphragm pressing portion (810). The anode (60) is supported from below and held in a predetermined position by means of a plurality of diaphragm pressing portions (810) that penetrate the anode fixing plate (62) and contact the lower surface of the anode (60) to press the anode (60) against the diaphragm (50). At this time, although not shown in FIGS. 6a and 6b, since the upper surface of the diaphragm (50) is pressed from above by the diaphragm support part (622) of the holder body (620) / anode holder (610) (e.g., FIG. 5), the diaphragm (50) and the anode (60) are fitted and held by the upper diaphragm support part (622) and the lower diaphragm pressing part (810). The anode fixing plate (62) is also referred to as a back plate.

[0055] The diaphragm pressing part (810) can be made of a bolt, a spacer, or any other support member. Additionally, FIG. 6b is described in a schematic representation to emphasize the gap between the anode (60) and the anode fixing plate (62) formed by the plurality of diaphragm pressing parts (810).

[0056] As shown in FIG. 6a, the anode fixing plate (62) is fixed to the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) through a plurality of spacers (804A) (only one is shown in FIG. 6a) on the outer side of the seal pressing ring (51). The anode fixing plate (62) is fixed to the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610) by a plurality of fastening members (804) that penetrate the anode fixing plate (62) and the spacers (804A) and screw-couple to the annular portion (621). Accordingly, a gap is formed between the outer periphery of the holder body (620) / anode holder (610) and the anode fixing plate (62) (between the seal pressing ring (51) and the anode fixing plate (62), and between the annular member (621) and the anode fixing plate (62)). Gas (e.g., oxygen) generated from the anode (60) can pass through these gaps and move to the outside of the holder body (620) / anode holder (610).

[0057] A plurality of fastening members (804) may be bolts, screws, or any other fastening members, and are, for example, evenly distributed over the entire circumference on the outer side of the seal pressing ring (51).

[0058] As shown in FIG. 6b, a predetermined gap is formed between the lower surface of the anode (60) and the anode fixing plate (62) by the tip side of the diaphragm pressing part (810). Additionally, on the outer side of the anode (60), gaps are provided at one or more locations in the circumferential direction between the seal pressing ring (51) and the anode fixing plate (62), and between the annular member (621) and the anode fixing plate (62), and gas accumulated between the lower surface of the anode (60) and the anode fixing plate (62) is discharged to the outside by passing through these gaps. The anode fixing plate (lower surface plate) (62) has the function of adjusting the amount of gas accumulated on the lower surface of the anode (60) to a predetermined amount, thereby suppressing the voltage of the anode from fluctuating as a large amount of gas simultaneously escapes from the lower surface of the anode. By doing so, the reduction in the uniformity of the plating film thickness can be suppressed.

[0059] In this embodiment, the anode (60) is a plate-shaped member having a plurality of through holes (not shown). The anode (60) may be a lath (metal mesh) structure, or a plate-shaped member having a plurality of through holes (see International Publication No. 2023 / 188371). Since the anode (60) has a plurality of through holes, the upper surface of the anode (60) is always maintained in a wet state with the plating solution (anode solution) supplied from the through holes even during the electrode reaction. Since the diaphragm (50) is an ion-permeable membrane capable of penetrating and wetting with the plating solution, the anode (60) reacts with the plating solution on the surface facing the substrate (the location where the diaphragm (50) is in close contact or nearby) and cations (e.g., hydrogen ions H₃) +) is transmitted to the cathode chamber (Cc), i.e., the substrate side, through the diaphragm (50). Thus, an ion conduction path (current path) is formed from the substrate side surface of the anode (60) (the location where the diaphragm (50) is in close contact or nearby) through the interior of the diaphragm (50) to the substrate (Wf). Meanwhile, gas bubbles generated on the surface of the anode (60) cannot pass through the diaphragm (50) and move to the back side (bottom side) of the anode (60) through a plurality of through holes of the anode (60). The bubbles accumulate on the bottom side of the anode (60) (between the anode (60) and the back plate (62)), then move to the outside of the seal pressing ring (51) and are discharged outside the plating tank (10) through an exhaust passage (not shown).

[0060] Since the upper surface of the anode (60) is in close contact with the lower surface of the diaphragm (50), the accumulation of gas generated from the anode (60) between the anode (60) and the diaphragm (50) is suppressed or prevented, and the movement to the cathode chamber is suppressed or prevented, and the uniformity of the plating film thickness formed on the substrate (Wf) is suppressed or prevented by affecting the electric field between the anode (60) and the substrate (Wf).

[0061] (Variable anode mask)

[0062] As shown in FIG. 4, the variable anode mask (650) is installed on the annular portion (621) of the holder body (620) / anode holder (610) at a position slightly higher than the diaphragm support portion (622) (Fig. 5, etc.). The variable anode mask (650) is equipped with a plurality of blades (651) and an annular driving member (652) on which the plurality of blades (651) are installed and which adjusts the aperture (opening diameter) by these blades (651). A driving shaft (670) as shown in FIG. 3 and FIG. 5 is installed in the driving member (652), and as the driving shaft (670) is moved in the forward and backward direction by an actuator (not shown), the driving member (652) rotates and the aperture (opening diameter) by the plurality of blades (651) is adjusted. In one example, an actuator (not shown) is positioned on the side of the lower tank (12) of the plating tank (10) adjacent to the front plate (640) (opening (12B) of the lower tank (12)) of the anode holder (610), and the shaft of the actuator extends parallel to the drive shaft (670), so that the shaft of the actuator and the drive shaft (670) are connected at their ends through a connecting member (671) (see International Publication No. 2003 / 079684 (Patent Document 1)). The drive shaft (670) and the front plate (640) (front plate body (641)) are sealed with a suitable seal (not shown, see, for example, Patent Document 1). The actuator can be configured by a known linear actuator (e.g., a motor and a ball screw).

[0063] (1st page)

[0064] The flange (623) of the holder body (620) / anode holder (610) is an annular member as shown in FIG. 9 and has an opening in the center that exposes a diaphragm (50) (an area corresponding to the anode (60)). On the upper surface of the flange (623), a seal (701) is disposed along the entire circumference as shown in FIGs. 4, 5, 8 and 9. This seal (701) seals the outer periphery (flange (623)) of the holder body (620) / anode holder (610) and the lower surface of the flange (12D) of the plating tank (10). A sealing surface (701A) is formed between the upper surface of the outer periphery (flange (623)) of the holder body (620) / anode holder (610) and the lower surface of the flange (12D) of the plating tank (10), which face each other with the seal (701) in between, to seal the outer periphery of the holder body (620) / anode holder (610) and the plating tank (10) (see FIG. 4). As shown in FIGS. 4 and 5, when the outer periphery (flange (623)) of the holder body (620) / anode holder (610) is fixed to the flange (12D) of the plating tank (10) by means of a plurality of fastening members (801) that penetrate the flange (11A) of the upper tank (11) of the plating tank (10) and the flange (12D) of the lower tank (12), the seal (701) is configured to elastically deform under appropriate pressure to exhibit sealing properties. The plurality of fastening members (801) are, for example, evenly distributed over the entire circumference. The fastening members (801) may be bolts, screws, or any other fastening members.

[0065] (Second Siil-myeon)

[0066] On the front surface of the flange (12A) of the lower tank (12) of the plating tank (10), an annular seal (702) is arranged around the entire circumference of the opening (12B), as shown in FIG. 4. This seal (702) seals the flange (12A) of the plating tank (10) and the frame member (642) of the front plate (640). In other words, it tightly seals the opening (12B) of the plating tank (10). Between the front surface of the flange (12A) of the plating tank (10) and the back surface of the frame member (642) of the front plate (640), which face each other with the seal (702) in between, a sealing surface (702A) is formed to seal the front plate (640) and the plating tank (10) (see FIG. 4). As shown in FIGS. 3 and 4, when the front plate (640) of the anode holder (610) is fixed to the flange (12A) of the plating tank (10) by means of a plurality of fastening members (802), the seal (702) is configured to elastically deform with appropriate pressure to exhibit sealing properties. At this time, since the frame member (642) of the front plate (640) can move in the front and rear directions relative to the front plate body (641), the frame member (642) can be moved relative to the front plate body (641) so that the frame member (642) elastically deforms the seal (702) with appropriate pressure by the degree of tightening of the plurality of fastening members (802). The plurality of fastening members (802) can be evenly distributed over the entire circumference, for example, as shown in FIG. 4, etc.

[0067] Here, when the flange (623) of the holder body (620) / anode holder (610) is fixed to the flange (12D) of the plating tank (10) by a fastening member (801), that is, when the seal (701) is elastically deformed, the flange (12D) of the plating tank (10) receives an upward and downward force from the fastening member (801), so there is a concern that the seal (702) placed on the flange (12A) of the plating tank (10) receives an upward and downward force, and thus does not properly seal the space between the flange (12A) and the frame member (642). Therefore, in the present embodiment, the frame member (642) in the front plate (640) is made movable in the forward and backward directions relative to the front plate body (641), and the frame member (642) is pressed against the flange (12A) independently from the front plate body (641) by fastening the fastening member (802), thereby appropriately compressing and elastically deforming the seal (702) to make it properly sealed. For example, by changing the degree of tightening of the upper and lower fastening members (802), the seal (702) can be elastically deformed with appropriate pressure from the upper and lower.

[0068] (3rd Siil-myeon)

[0069] Additionally, in the front plate (640), the front plate body (641) and the frame member (642) are sealed by an annular seal (703). A sealing surface (703A) is formed between the outer surface of the front plate body (641) and the inner surface of the frame member (642), which face each other with the seal (703) in between, to seal the front plate body (641) and the frame member (642) (see FIG. 4). As a result, the inside of the plating tank (10) is properly sealed from the outside. The frame member (642) is fitted and installed against the front plate body (641) with a strength that prevents it from falling off the front plate body (641). The seal (703) is, for example, placed in an annular sealing groove provided along the entire circumference of the outer surface of the front plate body (641). Additionally, the seal (703) may be placed in a seal groove that is arranged in an annular shape along the entire circumference of the inner surface of the frame member (642).

[0070] (Cathode fluid passage)

[0071] As shown in FIGS. 7 and 10, the anode holder (610) is provided with a cathode fluid passage (681) that communicates with the cathode fluid inlet (680) of the front plate (640) at the bottom of the holder body (620) / anode holder (610). The cathode fluid passage (681) is partitioned by the lower surface of the thin-walled portion of the annular portion (621) of the holder body (620) / anode holder (610), the front plate body (641), the bottom wall (613), and the side walls (614 to 617), except for a portion of the thickness at the bottom of the outer periphery (annular portion (621)) of the holder body (620) / anode holder (610). The side wall (614) is formed in a shape that follows the outer circumference of the diaphragm support (622) (Fig. 7, Fig. 10), and one or more cutouts (614a) are provided on the upper part of the side wall (614) (Fig. 7). The cutouts (614a) form the outlet of the cathode fluid passage (681). That is, the cathode fluid passage (681) has an inlet communicating with the cathode fluid inlet (680) and an outlet (cutout (614a)) that opens upward toward the diaphragm (50). The cathode fluid introduced from the cathode fluid inlet (680) passes through the cathode fluid passage (681) and is supplied from the cutout (614a) to the upper part of the diaphragm support (622) (i.e., the cathode chamber (Cc) which is upward toward the diaphragm (50)).

[0072] As shown in FIG. 7, the cathode fluid inlet (680) is positioned at the bottom of the cathode chamber (Cc) in the lower part of the holder body (620) / anode holder (610), so that the amount of residual cathode fluid remaining in the cathode chamber (Cc) can be minimized. The bottom surface (bottom wall (613)) of the cathode fluid passage (681) is also located below the anode fixing plate (62) and at the bottom of the cathode chamber (Cc).

[0073] (Bus Bar)

[0074] A bus bar (660) is positioned near the center in the width direction of the front plate (640) (front plate body (641)) (Figs. 3 and 5). As shown in Fig. 10, the bus bar (660) extends rearward from the front plate (640) (front plate body (641)) to near the center of the lower surface of the anode (60), and is electrically and mechanically connected to a boss (60A) (terminal part) that protrudes downward and is electrically and mechanically connected to the anode (60) near the center of the lower surface of the anode (60), for example, by a fastening member (805). The bus bar (660) and the front plate (640) (front plate body (641)) are sealed by an appropriate seal (not shown, see, for example, Patent Document 1). The fastening member (805) may be a bolt, a screw, or any other fastening member.

[0075] FIG. 11 is a downward perspective view of an anode holder assembly (6) with the anode fixing plate (62) made transparent. FIG. 12 is a bottom view of a diaphragm support (622). FIG. 13a is an enlarged perspective view of a part of the diaphragm support (622). FIG. 13b is a further enlarged perspective view of a part of the diaphragm support (622).

[0076] When the anode holder assembly (6) is viewed from below, the diaphragm support member (622) is positioned inside the anode (60) and the diaphragm (50) (Figs. 4 and 5), but in Fig. 11, for convenience of explanation, the diaphragm support member (622) is shown visible at the position of the anode (60). In Fig. 11, examples of the arrangement of the seal pressing ring (51) and the fastening member (803) (Fig. 6a) for fastening the diaphragm (50), the fastening member (804) (Fig. 6a) for fastening the anode fixing plate (62), and the diaphragm pressing member (810) (Fig. 6b) for pressing the diaphragm (50) through the anode (60) from below can also be seen.

[0077] As shown in FIGS. 12, 13a, and 13b, on the lower side of the beam (622A) of the diaphragm support (622), that is, the side in contact with the diaphragm (50), a chamfer is performed to form a chamfered portion (624A). Additionally, the upper and lower surfaces of the diaphragm support (622) may be referred to as the upper surface and the lower surface, respectively. In this example, a configuration is shown in which the chamfered portion (624A) is a C-shaped chamfer. Furthermore, as shown in FIG. 12, the outermost beam (622A) of the honeycomb structure may have a chamfer formed only on the side facing the honeycomb structure. In other words, the chamfered portion (624A) provided on the outermost beam (622A) of the honeycomb structure may be provided only on the side facing the honeycomb structure. In other words, a chamfer (624A) may be provided on the side of the beam (622A) of the diaphragm support (622) that contacts the diaphragm and on the side facing the honeycomb opening. In another embodiment, the chamfer (624A) provided on the outermost beam (622A) of the honeycomb structure may be provided on the side facing the honeycomb structure and on the side not facing it.

[0078] The reason for providing the chamfered portion (624A) is to improve the situation where residual bubbles may occur due to bubbles being trapped in the part of the beam (between the diaphragm and the beam) that contacts the diaphragm (50) when the cathode chamber (Cc) is filled with liquid. Such residual bubbles can cause plating quality problems, such as bubble adhesion to the substrate and partial plating unevenness.

[0079] As described above, by providing a chamfer (624A) on the lower side of the beam (622A) positioned on the cathode chamber (Cc) side of the diaphragm (50), the contact area of ​​the beam (622A) with the diaphragm (50) is reduced, thereby reducing residual bubbles in the cathode chamber (Cc). This allows for the prevention of plating quality problems, such as bubble adhesion to the substrate and partial plating unevenness. Furthermore, by providing the chamfer (624A) only on the lower side of the beam (622A), both beam strength and the reduction of residual bubbles can be achieved.

[0080] Since the circumscribed circle (Rm) shown in FIG. 8 corresponds approximately to the projection of the substrate (Wf), if a chamfer (624A) is provided on the beam (622A) of the honeycomb structure inside the circumscribed circle (Rm), it is expected that plating quality problems such as bubble adhesion to the substrate (Wf) and partial plating unevenness can be prevented, but a similar chamfer may also be provided on the beam (622B). Furthermore, regardless of whether the center (Cm) of the honeycomb structure and the rotation center / rotation center axis (Cw) of the substrate holder (20) (substrate (Wf)) are eccentric or not, the chamfer described above can reduce residual bubbles. The chamfer described above can also be applied to the diaphragm support of a vertical plating device. In addition, the chamfer described above is not limited to a C-shaped chamfer, and can be any shape of chamfer as long as it exhibits the effect of reducing bubble adhesion.

[0081] According to the above embodiment, the following effects are exerted.

[0082] (1) In the anode holder (610), the outer periphery of the diaphragm (50) and the outer periphery of the holder body (620) / anode holder (610) can be properly sealed by a seal (704).

[0083] (2) The outer periphery of the anode holder (610) and the interior of the plating tank (10) can be properly sealed by a seal (701) so as to divide the interior of the plating tank (10) into upper and lower seals (anode seal, cathode seal).

[0084] (3) According to the above configuration (1) and (2), by mounting the anode holder (610) on the plating tank (10), the interior of the plating tank (10) can be partitioned and sealed into a cathode chamber and an anode chamber above and below the diaphragm (50).

[0085] (4) The area between the front plate (640) of the anode holder (610) and the opening (12B) of the plating tank (10) can be properly sealed by a seal (702). At this time, the seal (702) can be properly elastically deformed by moving the frame member (642) of the front plate (640) in the forward and backward directions.

[0086] (5) The frame member (642) of the front plate (640) and the front plate body (641) can be properly sealed by a seal (703).

[0087] (6) By the configuration of (4) and (5) above, the anode holder (610) is mounted in the plating tank (10), thereby allowing the inside of the plating tank (10) to be properly sealed from the outside.

[0088] (Other embodiments)

[0089] (1) If the inside of the plating tank (10) can be tightly sealed from the outside by means such as studying the configuration of the seal (704) between the front plate (640) and the plating tank (10), the front plate body (641) and the frame member (642) can be made into a single front plate (640), and the seal (703) can be omitted.

[0090] (2) In the above embodiment, a back plate (62) for adjusting the amount of gas accumulated on the lower side of the anode (60) is provided, but instead of the back plate (62), a bubble buffer ring is provided to surround the anode (60), and the amount of bubbles generated from the anode and accumulated on the lower side is adjusted by the height of the bubble buffer ring (International Publication No. 2023 / 188371).

[0091] In the above-described embodiment, at least the following forms are identified.

[0092] [1] According to one embodiment, the plating device is provided with a plating tank for holding a plating solution, a substrate holder for holding and supporting a substrate with the surface to be plated downward, and an anode holder assembly mounted horizontally in the plating tank through a side wall opening of the plating tank, the anode holder having one or more openings in the center, an anode installed in the anode holder, and a diaphragm installed in the anode holder above the anode. The anode holder assembly has one or more sealing surfaces that seal the inside of the plating tank from the outside, and one or more sealing surfaces that divide the inside of the plating tank into upper and lower sections. For convenience of explanation, the one or more sealing surfaces that seal the inside of the plating tank from the outside are referred to as sealing surfaces for sealing the plating tank, and the one or more sealing surfaces that divide the inside of the plating tank into upper and lower sections are referred to as sealing surfaces for dividing the inside of the plating tank.

[0093] According to this configuration, in a face-down type plating apparatus, the diaphragm and anode, which require periodic maintenance, are integrated into a pull-out anode holder, thereby facilitating the maintenance of the diaphragm and anode. That is, the anode holder assembly, which holds and supports the anode and diaphragm and is positioned at the bottom of the plating tank, can be removed from the plating tank, allowing for the replacement of the anode and diaphragm (including the replacement of the entire anode holder assembly) to be performed outside the plating tank.

[0094] According to this configuration, by mounting an anode holder assembly (anode holder) in a plating tank, the inside of the plating tank can be sealed from the outside, and the inside of the plating tank can be divided into upper and lower seals (anode seal, cathode seal). That is, the inside of the plating tank can be sealed from the outside by one or more sealing surfaces for sealing the plating tank, and the inside of the plating tank can be divided into upper and lower seals (anode seal, cathode seal) by another one or more sealing surfaces for dividing the inside of the plating tank.

[0095] In addition, since the installation of the diaphragm into the plating tank is also performed by mounting the anode holder in the plating tank, the installation of the diaphragm into the plating tank can be facilitated.

[0096] [2] According to the form, one or more sealing surfaces that divide the plating tank into upper and lower sections have a first sealing surface that seals between the diaphragm and the anode holder, and a second sealing surface that seals between the outer periphery of the anode holder and the plating tank.

[0097] According to this configuration, since the diaphragm is installed in the anode holder with the diaphragm sealed before mounting the anode holder assembly into the plating tank, when mounting the anode holder assembly into the plating tank, the outer periphery of the anode holder and the plating tank are sealed, so the inside of the plating tank can be divided into upper and lower sections.

[0098] [3] According to the form, the diaphragm is installed on the outer periphery of the anode holder with a first seal member interposed therebetween on the outer periphery of the diaphragm, and the first seal surface is formed between the outer periphery of the diaphragm and the outer periphery of the anode holder.

[0099] According to this configuration, the diaphragm and the anode holder can be sealed with a simple configuration.

[0100] [4] According to one embodiment, the plating tank has a first flange having a lower surface exposed to the space within the plating tank, and the anode holder has a second flange provided on the upper part of the outer periphery, and the anode holder is installed on the lower surface of the first flange of the plating tank with an annular second seal member interposed on the upper surface of the second flange, and the second seal surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating tank.

[0101] According to this configuration, the anode holder and the plating tank can be securely sealed along the entire perimeter through the surfaces facing each other in the vertical direction of the anode holder and the plating tank. By doing so, the anode holder and the plating tank can be securely sealed along the entire perimeter without being affected by the sealing surface blocking the opening of the plating tank side wall.

[0102] [5] According to one form, the second flange of the anode holder is installed with respect to the first flange of the plating tank by one or more fastening members, and the second seal member is configured to be elastically deformed between the first flange and the second flange by fastening the fastening members.

[0103] According to this form, the outer periphery of the anode holder can be fixed at a predetermined position within the plating tank by one or more fastening members, and the second sealing member can be elastically deformed to securely seal the outer periphery of the anode holder and the plating tank.

[0104] [6] According to the form, one or more sealing surfaces that seal the inside of the plating tank from the outside have a third sealing surface that seals the anode holder and the opening of the plating tank.

[0105] According to this configuration, the inside of the plating tank can be sealed from the outside around the opening in the side wall of the plating tank into which the anode holder assembly is inserted.

[0106] [7] According to one embodiment, the anode holder has a front plate provided at one end to block the opening of the plating tank, and the front plate has a front plate body and a frame member that is slidably fitted around the front plate body. The frame member is installed with respect to the side wall around the opening of the plating tank or a third flange provided around the opening of the plating tank via a third seal member, and a third seal surface is formed between the frame member and the side wall around the opening of the plating tank or the third flange provided around the opening of the plating tank, and the frame member is fitted to the front plate body via a fourth seal member, and a fourth seal surface is formed between the inner surface of the frame member and the outer surface of the front plate body. When a third flange is provided, the third flange is part of the plating tank.

[0107] According to this configuration, even if the third seal member is misaligned by vertical force, the frame member can be pressed in the front-rear direction against the plating tank side wall / third flange, thereby ensuring that the third seal member is reliably elastically deformed between the plating tank and the frame member to provide sealing. As a result, the plating tank and the frame member can be reliably sealed by the third seal member. Additionally, the front plate body and the frame member can be sealed by the fourth seal member. Consequently, the inside of the plating tank can be reliably sealed from the outside.

[0108] [8] According to one form, the frame member is installed by one or more fastening members on the side wall around the opening of the plating tank or on the third flange provided around the opening of the plating tank, and the third seal member is configured to be elastically deformed between the frame member and the side wall or the third flange by fastening the fastening members.

[0109] According to this form, the front plate can be installed on the side wall of the plating tank by means of one or more fastening members, and the third sealing member can be modified to securely seal the opening of the plating tank and the front plate.

[0110] [9] According to the form, the frame member is fitted into the front plate body, and the fourth seal member is configured to elastically deform between the frame member and the front plate body.

[0111] According to this form, by fitting the frame member into the front plate body, the fourth sealing member can be elastically deformed to securely seal the frame member and the front plate body.

[0112]

[10] According to one form, the anode holder has an outer periphery and a diaphragm support that supports the upper surface of the diaphragm, having a plurality of openings on the inner side of the outer periphery.

[0113] According to this shape, the upper surface of the diaphragm can be properly pressed by the diaphragm support of the anode holder, thereby preventing the diaphragm from bending upward.

[0114]

[11] According to one embodiment, the plurality of openings of the diaphragm support have a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and the center of the circumscribed circle containing the plurality of first-shaped openings is eccentric from the center of rotation of the substrate holder.

[0115] According to this configuration, since the center of the pattern of the diaphragm support is eccentric from the rotation center / rotation center axis of the substrate, the plating film can suppress the transfer of the pattern shape of the diaphragm support, thereby improving the film thickness uniformity of the plating film.

[0116]

[12] According to the form, the structure consisting of the openings of the first shape above is a honeycomb structure.

[0117] According to this configuration, the diaphragm support can secure a larger opening area while supporting with sufficient strength in the central part of the diaphragm where bending is likely to be greater. In other words, it is possible to suppress the bending of the diaphragm while suppressing the influence of the electric field between the substrate and the anode.

[0118]

[13] According to one form, the opening of the plurality of second shapes is formed between a plurality of beams extending radially from the apex of the outermost part of the honeycomb structure to the outer part.

[0119] According to this shape, a larger opening area can be secured while maintaining the necessary strength of support in the region near the outer periphery of the diaphragm, where the likelihood of increased bending is low.

[0120]

[14] According to one form, the anode is a plate-shaped member having a plurality of through holes and is placed in close contact with the lower surface of the diaphragm, and further has a back plate spaced apart from the lower surface of the anode by a predetermined distance, and the amount of gas generated from the anode that remains on the lower surface of the anode is controlled by the back plate.

[0121] According to this configuration, since the anode and the diaphragm are in close contact with each other, the height dimension of the anode holder assembly integrating the anode and the diaphragm can be suppressed, allowing the anode holder assembly to be configured compactly.

[0122] According to this configuration, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent gas generated from the anode from accumulating between the diaphragm and the anode, thereby suppressing or preventing the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plating film thickness. In addition, by controlling the amount of gas remaining on the lower surface after passing through multiple through holes of the anode using a back plate, it is possible to suppress or prevent a large amount of gas from simultaneously escaping from the lower surface of the anode and causing fluctuations in the anode voltage. By doing so, it is possible to suppress or prevent the degradation of the film thickness uniformity of the plating film.

[0123]

[15] According to one form, the anode holder has a cathode liquid inlet for supplying plating liquid as cathode liquid to the cathode chamber.

[0124] According to this configuration, since the cathode liquid inlet is provided in the anode holder, the configuration of the plating bath can be made more compact.

[0125]

[16] According to one form, the cathode fluid inlet is positioned below the diaphragm, and the anode holder is provided with a cathode fluid passage having an inlet communicating with the cathode fluid inlet below the diaphragm and an outlet opening above the diaphragm.

[0126] According to this configuration, since the cathode liquid inlet is located below the diaphragm and at the lowest part of the cathode chamber, the residual cathode liquid remaining in the cathode chamber can be minimized. Furthermore, because cathode liquid is introduced from the bottom of the anode holder and supplied to the upper part of the diaphragm (cathode chamber), it becomes easy to form a seal surface against the plating tank at the upper part of the outer periphery of the anode holder. With this structure, it is easy to form a seal surface between the outer periphery of the anode holder and the plating tank with a simple configuration, and it is easy to secure sufficient volume of the anode chamber.

[0127]

[17] According to the form, a variable anode mask is further provided above the diaphragm.

[0128] According to this configuration, the variable anode mask can also be integrated into the pullable anode holder, making maintenance of the variable anode mask easier.

[0129]

[18] According to one form, a method of dividing a plating tank into an anode chamber and a cathode chamber is provided, the anode holder having an anode and a diaphragm installed therein, and the anode holder having one or more sealing surfaces that seal the inside of the plating tank from the outside and one or more sealing surfaces that divide the inside of the plating tank into upper and lower chambers, the anode holder is mounted on the plating tank through an opening in the side wall of the plating tank, and the anode holder is used to seal the inside of the plating tank from the outside and, at the same time, the inside of the plating tank is divided into the anode chamber and the cathode chamber at the top and bottom of the diaphragm.

[0130] A method including is provided.

[0131] [A1] According to one embodiment, a plating apparatus is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding and supporting a substrate with the surface to be plated downward; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support member for pressing the upper surface of the diaphragm, wherein the diaphragm support member has a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and the center of the circumscribed circle including the plurality of first-shaped openings is eccentric from the center of rotation of the substrate holder.

[0132] According to this configuration, since the center of the pattern of the diaphragm support is eccentric from the rotation center / rotation center axis of the substrate, the plating film can suppress the transfer of the pattern shape of the diaphragm support, thereby improving the film thickness uniformity of the plating film.

[0133] [A2] According to one form, the structure formed by the plurality of first-shaped openings is a honeycomb structure.

[0134] According to this configuration, the diaphragm support can secure a larger opening area while supporting with sufficient strength in the central part of the diaphragm where bending is likely to be greater. In other words, it is possible to suppress the bending of the diaphragm while suppressing the influence of the electric field between the substrate and the anode.

[0135] [A3] According to one embodiment, the plurality of second-shaped openings are formed between a plurality of beams extending radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery of the diaphragm support.

[0136] According to this shape, a larger opening area can be secured while maintaining the necessary strength of support in the region near the outer periphery of the diaphragm, where the likelihood of increased bending is low.

[0137] [A4] According to one embodiment, the anode is a plate-shaped member having a plurality of through holes and is disposed in close contact with the lower surface of the diaphragm, and further comprises a back plate spaced apart from the lower surface of the anode by a predetermined distance, and the amount of gas generated from the anode that remains on the lower surface of the anode is adjusted by the back plate.

[0138] According to this configuration, since the anode and the diaphragm are in close contact with each other, the height dimension of the anode holder assembly integrating the anode and the diaphragm can be suppressed, allowing the anode holder assembly to be configured compactly.

[0139] According to this configuration, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent gas generated from the anode from accumulating between the diaphragm and the anode, thereby suppressing or preventing the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plating film thickness. In addition, by controlling the amount of gas remaining on the lower surface after passing through multiple through holes of the anode using a back plate, it is possible to suppress or prevent a large amount of gas from simultaneously escaping from the lower surface of the anode and causing fluctuations in the anode voltage. By doing so, it is possible to suppress or prevent the degradation of the film thickness uniformity of the plating film.

[0140] [A5] According to the form, a variable anode mask is further provided above the diaphragm.

[0141] According to this configuration, it is also possible to improve the film thickness uniformity of the plating film by adjusting the exposed area of ​​the anode using a variable anode mask.

[0142] [A6] According to one embodiment, the plurality of first-shaped openings and the plurality of second-shaped openings are defined by a plurality of beams, and at least some of the beams are chamfered on the side in contact with the diaphragm.

[0143] According to this configuration, by providing a chamfer to the shape of the beam positioned on the cathode chamber side of the diaphragm, the contact area of ​​the beam with the diaphragm is reduced, thereby reducing residual bubbles in the cathode chamber. This effectively prevents plating quality problems, such as bubble adhesion to the substrate and localized plating unevenness. Furthermore, by providing a chamfer only on the lower surface of the beam, it is possible to achieve both beam strength and a reduction in residual bubbles.

[0144] [A7] According to the form, the beam defining the plurality of first-shaped openings is chamfered.

[0145] In a plurality of first-shaped opening regions that roughly correspond to the projection of the substrate, residual bubbles can be effectively reduced, thereby preventing plating quality problems such as bubble adhesion to the substrate and partial plating unevenness.

[0146] [A8] According to one embodiment, a plating apparatus is provided having a plating tank for holding a plating solution, a substrate holder for holding and supporting a substrate, an anode disposed opposite to the substrate, a diaphragm disposed between the substrate and the anode, and a diaphragm support member for pressing the diaphragm, having a surface and a back surface, and having a plurality of beams defining a plurality of openings penetrating between the surface and the back surface, and at least some of the beams are chamfered on the back surface side that contacts the diaphragm.

[0147] The diaphragm support can be positioned on the substrate side and / or the anode side with respect to the diaphragm.

[0148] According to this configuration, by providing a chamfer on the contact side of the beam of the diaphragm support with the diaphragm, the contact area of ​​the beam with the diaphragm is reduced, thereby reducing residual bubbles in the plating solution. This effectively prevents plating quality problems, such as bubble adhesion to the substrate and localized plating unevenness. Furthermore, by providing a chamfer only on the contact side of the beam, it is possible to achieve both beam strength and a reduction in residual bubbles.

[0149] [A9] A plating method for plating a substrate with the surface to be plated facing downward, wherein a plating tank is prepared having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, a diaphragm support member pressing the upper surface of the diaphragm, a plurality of first-shaped openings, and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and plating the substrate while rotating the substrate in a state where the center of rotation of the substrate is eccentric from the center of the circumscribed circle including the plurality of first-shaped openings of the diaphragm support member.

[0150] According to this configuration, since the center of the pattern of the diaphragm support is eccentric from the rotation center / rotation center axis of the substrate, the plating film can suppress the transfer of the pattern shape of the diaphragm support, thereby improving the film thickness uniformity of the plating film.

[0151] [A10] According to one embodiment, a plating method for plating a substrate is provided, wherein the plating tank is prepared having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, a diaphragm support member pressing the diaphragm, and a plurality of beams defining a plurality of openings, and at least some of the beams are chamfered on the side in contact with the diaphragm support member, and the plating method is provided for plating the substrate using the plating tank.

[0152] The diaphragm support can be positioned on the substrate side and / or the anode side with respect to the diaphragm.

[0153] According to this configuration, by providing a chamfer on the contact side of the beam of the diaphragm support with the diaphragm, the contact area of ​​the beam with the diaphragm is reduced, thereby reducing residual bubbles in the plating solution. This effectively prevents plating quality problems, such as bubble adhesion to the substrate and localized plating unevenness. Furthermore, by providing a chamfer only on the contact side of the beam, it is possible to achieve both beam strength and a reduction in residual bubbles.

[0154] Although embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from its intent, and it is understood that the present invention includes equivalents thereof. Furthermore, any combination of embodiments and variations is possible within the scope of solving at least a part of the above-described problem or exhibiting at least a part of the effect, and any combination or omission of each component described in the claims and specification is possible.

[0155] All disclosures, including the specification, claims, drawings, and abstract of International Publication No. 2003 / 079684 (Patent Document 1) and International Publication No. 2023 / 188371, are incorporated herein in their entirety by reference. Explanation of the symbols

[0156] 6: Anode holder assembly 10: Plating tank 11: Upper house 12: Sub-unit 12A: Flange 12B: Opening 12C: Anode fluid inlet 12D: Flange 20: Substrate holder 30: Paddle 40: Resistor 50: Septum 51: Seal pressing ring 60: Anode 60A: Boss 62: Anode fixing plate 400: Plating Module 610: Anode holder 613: Low wall 614 to 617: Sidewalls 614a: Cutoff 620: Holder body 621: Fantasy Section 622: Septum support 622A: Beam 622B: Beam 623: Flange 640: Front plate 641: Front plate main body 642: Frame missing 650: Variable anode mask 651: Blade 652: Driving member 660: Bus Bar 670: Drive shaft 671: Connecting member 680: Cathode fluid inlet 681: Cathode fluid passage 701 to 704: Seal 701A to 704A: Seam 801 to 805: Fastening members 804A: Spacer 810: Diaphragm press 1000: Plating device Rm: circumscribed circle Cm: Center of the circumscribed circle Cw: Center of rotation (axis of rotation) Wf: Substrate

Claims

Claim 1 A plating apparatus comprising: a plating tank for holding a plating solution; a substrate holder for holding and supporting a substrate with the surface to be plated facing downward; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; a diaphragm support member pressing the upper surface of the diaphragm, the diaphragm support member having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, wherein the center of the circumscribed circle including the plurality of first-shaped openings is eccentric from the center of rotation of the substrate holder. Claim 2 In claim 1, the structure formed by the plurality of first-shaped openings is a plating device having a honeycomb structure. Claim 3 A plating device according to paragraph 2, wherein the plurality of second-shaped openings are formed between a plurality of beams extending radially from the apex of the outermost circumference of the honeycomb structure to the outer circumference of the diaphragm support. Claim 4 A plating apparatus according to claim 1, wherein the anode is a plate-shaped member having a plurality of through holes and is disposed in close contact with the lower surface of the diaphragm, and further comprises a back plate spaced apart from the lower surface of the anode by a predetermined distance, and by means of the back plate, adjusts the amount of gas generated from the anode that remains on the lower surface of the anode. Claim 5 A plating apparatus according to any one of claims 1 to 4, further comprising a variable anode mask disposed above the diaphragm. Claim 6 A plating apparatus according to claim 1, wherein the plurality of first-shaped openings and the plurality of second-shaped openings are defined by a plurality of beams, and at least some of the beams are chamfered on the side in contact with the diaphragm. Claim 7 A plating apparatus according to claim 6, wherein a chamfer is performed on the beam defining the plurality of first-shaped openings. Claim 8 A plating apparatus comprising: a plating tank for holding a plating solution; a substrate holder for holding and supporting a substrate; an anode disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support member for pressing the diaphragm, having a surface and a back surface, and having a plurality of beams defining a plurality of openings penetrating between the surface and the back surface, wherein at least some of the beams are chamfered on the back surface side that contacts the diaphragm. Claim 9 A plating method for plating a substrate with the surface to be plated facing downward, wherein a plating tank is prepared having an anode facing the substrate, a diaphragm disposed between the substrate and the anode, a diaphragm support member pressing the upper surface of the diaphragm, a plurality of first-shaped openings, and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and plating the substrate while rotating the substrate in a state where the center of rotation of the substrate is eccentric from the center of the circumscribed circle including the plurality of first-shaped openings of the diaphragm support member. Claim 10 A plating method for plating a substrate, comprising: an anode facing the substrate; a diaphragm disposed between the substrate and the anode; a diaphragm support member pressing the diaphragm; a plurality of beams defining a plurality of openings; and a diaphragm support member having a diaphragm support member having a chamfer on the side in contact with the diaphragm, wherein at least some of the beams are chamfered. A plating method for plating the substrate using the plating tank.

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