Cleaning apparatus, lithography apparatus, and article manufacturing method

Abstract

The present invention provides a cleaning device for performing gas cleaning within a chamber, comprising: a gas flow path configured to receive gas within the chamber and send gas into the chamber; a filter disposed within the gas flow path and configured to adsorb organic substances within the gas flowing through the gas flow path; a weight measuring device configured to measure the weight of the filter; a humidity detector configured to detect the humidity of the gas within the gas flow path; and a controller configured to control gas cleaning, wherein the controller is configured to estimate the adsorption state of organic substances within the filter based on the measurement result of the weight measuring device and the detection result of the humidity detector.

Description

Technology Field

[0001] The present invention relates to a cleaning device, a lithography device, and a method for manufacturing articles. Background Technology

[0002] A cleaning device comprising a filter for adsorbing organic substances in air is disposed within a lithography apparatus to clean the gas (e.g., air) in a chamber for performing a process to form a pattern on a substrate. In this cleaning device, the adsorption state of organic substances within the filter is required to determine the replacement timing of the filter. Japanese Patent Publication No. 2007-311722 discloses a method for detecting the life of a chemical filter based on the transmittance of an optical member when the optical member is placed in an exposure device to be exposed to the downstream gas of a chemical filter disposed in an air conditioning system and the optical member is irradiated with light having the same wavelength as in the exposure step.

[0003] In the method described in Japanese Patent Publication No. 2007-311722, it is necessary to arrange an optical member, and also to guide light having the same wavelength as in the exposure step to the optical member and measure the transmittance of the optical member, thereby complicating the arrangement of the device. The problem to be solved

[0004] The present invention provides an advantageous technology for easily obtaining the adsorption state of organic substances with high precision, for example, in a filter of a clean device. means of solving the problem

[0005] According to one aspect of the present invention, a cleaning device for performing gas cleaning within a chamber is provided, comprising: a gas flow path configured to receive gas within the chamber and send gas into the chamber; a filter disposed within the gas flow path and configured to adsorb organic substances within the gas flowing through the gas flow path; a weight measuring device configured to measure the weight of the filter; a humidity detector configured to detect the humidity of the gas within the gas flow path; and a controller configured to control gas cleaning, wherein the controller is configured to estimate the adsorption state of organic substances within the filter based on the measurement result of the weight measuring device and the detection result of the humidity detector.

[0006] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Brief explanation of the drawing

[0007] FIG. 1 is a schematic diagram illustrating an example of the arrangement of a cleaning device according to a first embodiment. Figures 2a and 2b are drawings illustrating the weight details of a chemical filter. Figure 3 is a diagram illustrating an example of humidity-moisture content information. Figure 4 is a diagram showing the relationship between the usage period (number of days) of a chemical filter and the amount of organic material adsorbed. FIG. 5 is a schematic diagram showing an example of the arrangement of a cleaning device according to a second embodiment. Figure 6 is a schematic diagram showing an example of the arrangement of a lithography device (imprint device). Specific details for implementing the invention

[0008] Hereinafter, embodiments are described in detail with reference to the accompanying drawings. It should be noted that the following embodiments are not intended to limit the scope of the claimed invention. While many features are described in the embodiments, the invention is not limited to requiring all such features, and many such features may be appropriately combined. Additionally, in the accompanying drawings, the same reference numerals are assigned to identical or similar components, and redundant descriptions thereof are omitted.

[0009] <First Embodiment>

[0010] Hereinafter, a cleaning device (100) according to a first embodiment of the present invention will be described. The cleaning device (100) according to this embodiment is a device for performing gas cleaning within a chamber (CMB) in which a forming part for forming a pattern on a substrate is accommodated. The cleaning device (100) can be understood as an environment control device for controlling the environment within the chamber.

[0011] FIG. 1 is a schematic diagram showing an example of the arrangement of a cleaning device (100) according to a first embodiment. The cleaning device (100) according to the present embodiment may include a gas flow path (11), a blower (12), a cooling device (13), a chemical filter (14), a heating device (15), and a particle capture filter (16). The blower (12), the cooling device (13), the chemical filter (14), the heating device (15), and the particle capture filter (16) are arranged within the gas flow path (11). Additionally, the cleaning device (100) may include a humidity detector (21), temperature detectors (22, 23), a weight measuring device (24), a controller (25), and a notification device (26). Note that the arrows in FIG. 1 indicate the flow of gas.

[0012] A gas flow path (11) (air flow path) is arranged to receive gas (e.g., air) within a chamber (CMB) and to send the gas into the chamber (CMB). The gas flow path (11) can be understood as being part of a circulation system that circulates the gas within the chamber (CMB). In the arrangement example of FIG. 1, the gas flow path (11) is arranged to receive only the gas within the chamber (CMB). However, the gas flow path (11) may be arranged to receive gas from outside the chamber (CMB) in addition to the gas within the chamber (CMB).

[0013] The blower (12) sends gas to the gas flow path (11). By the operation of the blower (12), the gas can be circulated so that the gas in the chamber (CMB) is received by the gas flow path (11) and the gas received by the gas flow path (11) is sent to the chamber (CMB). In the arrangement example of FIG. 1, the blower (12) is positioned upstream of the cooling device (13) in the gas flow path (11), but it should be noted that the position of the blower (12) is not limited thereto. The position of the blower (12) is arbitrary as long as gas flow can be formed in the gas flow path.

[0014] A cooling device (13) cools the gas received by the gas flow path (11). The cooling device (13) is positioned, for example, as a heat exchanger for cooling the gas. The gas passing through the cooling device (13) is supplied to a chemical filter (14). The chemical filter (14) is a filter for adsorbing organic matter in the gas flowing within the gas flow path (11). When the gas passes through the chemical filter (14), the organic matter in the gas is reduced (removed). The gas passing through the chemical filter (14) is adjusted to a predetermined temperature by a heating device (15), and then the gas is sent to the chamber (CMB) through a particle capture filter (16). The particle capture filter (16) is a filter for capturing particles in the gas flowing through the gas flow path (11). A HEPA filter or a ULPA filter is used as the particle capture filter (16).

[0015] A humidity detector (21) (humidity sensor) detects the humidity of the gas in the gas flow path (11). In this embodiment, the humidity detector (21) is positioned to detect the humidity of the gas upstream of the chemical filter (14) in the gas flow path (11). More specifically, as shown in FIG. 1, the humidity detector (21) is positioned between the cooling device (13) and the chemical filter (14) to detect the humidity of the gas cooled by the cooling device (13).

[0016] A temperature detector (22) (temperature sensor) detects the temperature of the gas in the gas flow path (11). In this embodiment, the temperature detector (22) is positioned to detect the temperature of the gas upstream of the chemical filter (14) in the gas flow path (11). More specifically, as shown in FIG. 1, the temperature detector (22) is positioned between the cooling device (13) and the chemical filter (14) to detect the temperature of the gas cooled by the cooling device (13).

[0017] A temperature detector (23) (temperature sensor) detects the temperature of the gas heated by the heating device (15). In this embodiment, the temperature detector (23) is positioned between the heating device (15) and the particle capture filter (16). When the temperature detector (23) is positioned in this manner, the controller (25) can control the heating device (15) based on the detection result of the temperature detector (23) so that the temperature of the gas heated by the heating device (15) is set to a predetermined temperature. That is, the gas whose temperature has been adjusted to a predetermined temperature by the heating device (15) is supplied to the chamber (CMB) from the gas flow path (11), thereby precisely adjusting the temperature inside the chamber (CMB).

[0018] The weight measuring device (24) measures the weight of the chemical filter (14). In this embodiment, as described below, the weight measuring device (24) may be used to estimate the adsorption state of organic material within the chemical filter (14). In this case, the chemical filter (14) adsorbing organic material generally includes activated carbon as a filter material. The total capacity (hereinafter referred to as adsorption capacity) capable of adsorbing (capturing) organic material by the chemical filter (14) may be within the range of 5% to 10% of the weight of the chemical filter (14). For example, if 10 kg of chemical filter (14) is used, the adsorption capacity is 500 to 1,000 g. Accordingly, it is desirable for the weight measuring device (24) to have a measurement resolution of 1 g (preferably 0.1 g). Note that in this embodiment, the adsorption capacity may be defined as weight.

[0019] The controller (25) is configured by a computer (information processing unit) including a processor such as a central processing unit (CPU) and a storage unit such as memory, and controls each component of the cleaning device (100). The controller (25) according to the present embodiment controls the cleaning and temperature control of the gas in the chamber (CMB) by controlling the blower (12), the cooling device (13), and the heating device (15). In addition, the controller (25) according to the present embodiment estimates the adsorption state of organic material in the chemical filter (14) based on the measurement result of the weight measuring device (24) and the detection result of the humidity detector (21). In addition, the controller (25) according to the present embodiment determines the replacement timing (replacement cycle) of the chemical filter (14) based on the estimated adsorption state of organic material for the chemical filter (14).

[0020] The notification device (26) notifies the user of various information by displaying various information on a display device (display) that functions as a user interface or by transmitting various information to an information terminal owned by the user. In this embodiment, the notification device (26) may be used to notify the adsorption state of organic material in the chemical filter (14) or the replacement timing of the chemical filter (14).

[0021] [Method for Estimating the Adsorption State of Organic Materials]

[0022] A method for estimating the adsorption state of organic material within the chemical filter (14) by the controller (25) will be described below. The controller (25) can estimate the adsorption amount or the adsorption potential amount within the chemical filter (14) as the adsorption state of organic material within the chemical filter (14). The adsorption amount of organic material within the chemical filter (14) is the amount of organic material already adsorbed within the chemical filter (14), and may also be simply referred to as the "adsorption amount" below. Furthermore, the adsorption potential amount of organic material within the chemical filter (14) is the amount of organic material that is still adsorbable in the chemical filter (14), that is, the amount of organic material that can be adsorbed by the chemical filter (14) in the future, and is simply referred to as the "adsorption potential amount" below. In this embodiment, the adsorption amount and the adsorption potential amount may be defined by weight.

[0023] FIGS. 2a and 2b are drawings showing the details of the weight of a chemical filter (14). FIGS. 2a and 2b illustrate different measurement dates of the weight of the chemical filter (14) by a weight measuring device (24). FIG. 2a shows the details of the weight of the chemical filter (14) on measurement date (A). On measurement date A, the temperature inside the chamber (CMB) is 20°C and the humidity is 50%. FIG. 2b shows the details of the weight of the chemical filter (14) on measurement date B. On measurement date B, the temperature inside the chamber (CMB) is 20°C and the humidity is 40%.

[0024] As shown by the following equation (1), the controller (25) measures the total weight (W) of the chemical filter (14), which is the measured value of the weight measuring device (24). all The dry weight (W) of the chemical filter (14) from ) dry ) and moisture weight (W wet The value obtained by excluding ) is the adsorption amount (W oc It can be estimated as ). In addition, as shown by the following equation (2), the controller (25) has an adsorption capacity (W toc Adsorption amount (W) from ) ocThe value obtained by subtracting ) is the adsorbable amount (W roc It can be estimated as ).

[0025] W oc = W all - W dry - W wet ...(1)

[0026] W roc = W toc - W oc ...(2)

[0027] In this case, the dry weight (W) of the chemical filter (14) dry ) can be defined as the weight of the chemical filter (14) in a state where organic material has not yet been adsorbed and no moisture is contained (i.e., dry state). The dry weight (W) of the chemical filter (14) dry ) can be obtained from the specifications of the chemical filter (14). However, the dry weight (W dry If ) is not specified in the specifications, it can be obtained by experiment. For example, the dry weight (W) of the chemical filter (14). dry ) can be obtained based on the result of measuring the weight of the chemical filter (14) while the chemical filter (14) is placed in a gas atmosphere having a known reference humidity. The chemical filter (14) placed in a gas atmosphere having a known reference humidity may contain a moisture amount corresponding to the reference humidity. For this reason, the moisture amount (weight) contained in the chemical filter (14) can be calculated based on the reference humidity. Accordingly, the calculated moisture amount is the dry weight (W dry To obtain ), the weight of the chemical filter (14) is subtracted from the measured value.

[0028] Weight of moisture (W) contained in the chemical filter (14) wet) can be determined (calculated) based on information (hereinafter referred to as humidity-moisture content information) representing the relationship between the humidity of the gas in the gas flow path (11) and the moisture content of the chemical filter (14). FIG. 3 shows an example of humidity-moisture content information. The horizontal axis of FIG. 3 represents the relative humidity in the gas flow path (11), and the vertical axis represents the moisture content of the chemical filter (14). Relative humidity is defined as the ratio of the actual amount of moisture (vapor) contained to the maximum amount of moisture (saturated vapor) that can be contained in the gas (e.g., air) at a given temperature. The moisture content of the chemical filter (14) can be defined as the amount of moisture (weight) contained in the chemical filter (14) placed in an atmosphere of relative humidity.

[0029] In this embodiment, as illustrated in FIG. 3, the controller (25) has humidity-moisture content information for each temperature of the gas in the gas flow path (11). The controller (25) then determines the moisture content of the chemical filter (14) from the detection result of the humidity detector (21) (humidity of the gas in the gas flow path (11)) based on the humidity-moisture content information selected according to the detection result of the temperature detector (22) (temperature of the gas in the gas flow path (11)). Note that FIG. 3 shows humidity-moisture content information when the temperature of the gas in the gas flow path (11) is 18°C, 20°C, and 22°C. This is merely an example, and the temperature is not limited to these temperatures.

[0030] In this case, humidity-moisture content information can be generated in advance by experiments, etc. The result obtained by measuring the weight of the chemical filter (14) while the chemical filter (14) is placed in an atmosphere of gas having a predetermined temperature and a predetermined humidity is obtained for the state at different humidity. Thus, humidity-moisture content information can be generated for the corresponding temperature. This experiment is performed by changing the temperature of the atmosphere to generate humidity-moisture content information for each temperature.

[0031] [How to Determine the Replacement Timing for Chemical Filters]

[0032] A method for determining the replacement timing of the chemical filter (14) by the controller (25) will be described below. The controller (25) determines the estimated adsorption state (adsorption amount (W)) for the chemical filter (14). oc ) or adsorbable amount (W roc The replacement timing of the chemical filter (14) can be determined based on )). For example, the controller (25) can determine the replacement timing of the chemical filter (14) based on information indicating the adsorption state of the chemical filter (14) during the usage period (e.g., days) of the chemical filter (14). Additionally, the controller (25) notifies the user (operator) of the determined replacement timing of the chemical filter (14) through the notification device (26).

[0033] FIG. 4 shows the usage period (number of days) and the amount of organic material adsorbed (W) in the chemical filter (14). oc It represents the relationship between ). The controller (25) indicates the estimated adsorption amount (W) at least twice as the replacement timing of the chemical filter (14). oc Adsorption amount (W) based on ) oc ) adsorption capacity (W toc The period (number of days) to reach ) can be determined. More specifically, the controller (25) can determine the estimated adsorption amount (W) at least twice. oc An approximation line is obtained for ), and the approximation line is the adsorption capacity (W toc The period (number of days) that intersects with ) is determined as the replacement timing of the chemical filter (14).

[0034] As described above, in the cleaning device (100) of the present embodiment, the adsorption state of organic material in the chemical filter (14) is estimated based on the measurement result of the weight measuring device (24) and the detection result of the humidity detector (21). Accordingly, the complex device arrangement can be simplified, and the adsorption state of organic material in the chemical filter (14) can be easily obtained with high precision.

[0035] In the cleaning device (100) of the present embodiment, a plurality of chemical filters (14) may be stacked. In this case, a weight measuring device (24) may be positioned to measure the total weight of the plurality of chemical filters (14) or to measure the weight of each of the plurality of chemical filters (14). Additionally, the cleaning device (100) may be positioned to adsorb inorganic substances in the gas flowing through the gas flow path (11) (hereinafter referred to as an inorganic substance filter). In this case, it should be noted that the weight measuring device (24) should not be positioned to measure the total weight of the chemical filters (14) and the inorganic substance filter, because the inorganic substance filter has the characteristic of reducing weight when inorganic substances are adsorbed (captured). That is, if the weight measuring device (24) measures the total weight of the chemical filters (14) and the inorganic substance filter, it is difficult to accurately estimate the adsorption state of organic substances within the chemical filters (14) based on the measurement results of the weight measuring device (24). Accordingly, when an inorganic material filter is placed, the weight of the chemical filter (14) is preferably measured independently of the inorganic material filter. Note that the weight of the chemical filter (14) can be measured by a measuring device placed outside the cleaning device (100). In this case, the controller (25) can estimate the adsorption state of organic material in the chemical filter (14) based on the measurement result of the measuring device placed outside.

[0036] <Second Embodiment>

[0037] Hereinafter, a cleaning device (200) according to a second embodiment of the present invention will be described. FIG. 5 is a schematic diagram showing an example of the arrangement of the cleaning device (200) according to the second embodiment. The cleaning device (200) according to this embodiment differs from the cleaning device (100) of the first embodiment in that the humidity detector (21) and the temperature detector (22) have different arrangements. It should be noted that this embodiment basically inherits the first embodiment, and matters other than those described below follow the first embodiment.

[0038] A humidity detector (21) according to the present embodiment is positioned to detect the humidity of the gas on the upstream and downstream sides of the chemical filter (14) in the gas flow path (11). More specifically, the humidity detector (21) may include a first humidity detector (21a) for detecting the humidity of the gas on the upstream side of the chemical filter (14) in the gas flow path (11) and a second humidity detector (21b) for detecting the humidity of the gas on the downstream side of the chemical filter (14) in the gas flow path (11).

[0039] A temperature detector (22) according to the present embodiment is positioned to detect the temperature of the gas at each of the upstream and downstream sides of the chemical filter (14) in the gas flow path (11). More specifically, the temperature detector (22) may include a first temperature detector (22a) for detecting the temperature of the gas at the upstream side of the chemical filter (14) in the gas flow path (11) and a second temperature detector (22b) for detecting the temperature of the gas at the downstream side of the chemical filter (14) in the gas flow path (11).

[0040] For example, when the humidity of the gas passing through the chemical filter (14) changes, the chemical filter (14) absorbs or evaporates the water in the chemical filter (14). More specifically, when the humidity of the gas passing through the chemical filter (14) increases, the chemical filter (14) adsorbs (absorbs) water, and thus the humidity on the downstream side of the chemical filter (14) is lower than the humidity on the upstream side. Due to the influence of the heat (heat of adsorption) generated by the adsorption of water within the chemical filter (14), the temperature on the downstream side of the chemical filter (14) is higher than the temperature on the upstream side. On the other hand, when the humidity of the gas passing through the chemical filter (14) decreases, the chemical filter (14) evaporates water, and thus the humidity on the downstream side of the chemical filter (14) is higher than the humidity on the upstream side. Also, due to the influence of the evaporation of water within the chemical filter (14), the temperature on the downstream side of the chemical filter (14) is lower than the temperature on the upstream side.

[0041] In this manner, when the humidity and temperature of the gas differ from each other at the upstream and downstream sides of the chemical filter (14) within the gas flow path (11), a state occurs in which the chemical filter (14) adsorbs or evaporates water. That is, the chemical filter (14) is set to an unsaturated state, and the weight of the chemical filter (14) is not stable. Therefore, when using the measurement results of the weight measuring device (24) obtained in this state, it is difficult to accurately estimate the adsorption state of organic material within the chemical filter (14).

[0042] The controller (25) according to the present embodiment estimates the adsorption state of organic material within the chemical filter (14) when the difference between the humidity detected by the first humidity detector (21a) and the humidity detected by the second humidity detector (21b) is smaller than the humidity threshold. Additionally or alternatively, the controller (25) estimates the adsorption state of organic material within the chemical filter (14) when the difference between the temperature detected by the first temperature detector (22a) and the temperature detected by the second temperature detector (22b) is smaller than the temperature threshold. The humidity threshold and the temperature threshold are set as thresholds capable of determining the saturated state or a state near the saturated state of the chemical filter (14). Thus, the adsorption state of organic material within the chemical filter (14) set to a saturated state can be estimated with high precision. In this case, when the chemical filter (14) is set to a saturated state, the detection result of the first humidity detector (21a) is almost identical to the detection result of the second humidity detector (21b). For this reason, the adsorption state of organic material in the chemical filter (14) can be estimated based on the detection result of one of the first humidity detector (21a) and the second humidity detector (21b).

[0043] <Epidemis of a Lithography Device>

[0044] An embodiment of a lithography apparatus according to the present invention will be described. Examples of lithography apparatus include an exposure apparatus for exposing a substrate to light to transfer a pattern of a mask onto the substrate, and an imprint apparatus for forming a pattern of an imprint material on a substrate using a mold. An imprint apparatus will be exemplified as a lithography apparatus.

[0045] FIG. 6 is a schematic diagram illustrating an example of the arrangement of an imprint device (IMP) as an example of a lithography device of the present embodiment. In FIG. 6, directions perpendicular to each other on a plane parallel to the surface of the substrate (34) are defined as the X and Y directions, and directions perpendicular to the X and Y directions are defined as the Z direction.

[0046] An imprint device (IMP) may include a forming device (30) for forming a pattern on a substrate, a chamber (40) for receiving the forming device (30), and a cleaning device (50) for performing gas cleaning within the chamber (40). The chamber (40) corresponds to a chamber (CMB) of a first or second embodiment. The cleaning device (100) described with reference to the first embodiment or the cleaning device (200) described with reference to the second embodiment may be applied as the cleaning device (50).

[0047] A forming device (30) brings an imprint material (36) supplied on a substrate (34) into contact with a mold (31) and applies curing energy to the imprint material (36) to form a pattern of a cured product on the substrate (34) having a pattern of convex and concave portions of the mold (31) transferred thereto. More specifically, the forming device (30) supplies the imprint material (36) to the substrate (34) in the form of a plurality of droplets and cures the imprint material (36) while the mold (31), having a pattern of concave and convex portions formed thereon, is in contact with the imprint material (36) on the substrate (34). The gap between the mold (31) and the substrate (34) is widened to separate the mold (31) from the cured imprint material (36), so that the pattern of the mold (31) can be transferred to the imprint material (36) on the substrate (34). A series of operations is referred to as "imprint processing" and is performed for each of the multiple shot areas on the substrate (34).

[0048] As illustrated in FIG. 6, the forming device (30) according to the present embodiment may include an imprint head (32) for holding and supporting a mold (31), a curing device (33), a stage (35) for holding and supporting a substrate (34), a supply device (37), and a controller (38). The controller (38) is formed by, for example, a computer including a CPU and memory, and performs imprint processing by controlling each component of the imprint device (10). Note that the controller (38) may be placed independently of the controller (25) of the cleaning device (50) (100 or 200), but may be placed as part of the controller (25) or may include the controller (25) as part of the controller (38).

[0049] The mold (31) is generally formed from a material such as quartz that can transmit light (ultraviolet light). In the mold (31), a pattern having convex and concave portions to be transferred to the imprint material (36) on the substrate is formed in a partial region (31a) (mesa region) as a part extending from the surface on the substrate side toward the substrate side. As the substrate (34), ceramic, metal, semiconductor, resin, etc. are used. A member made of a material different from the material of the substrate may be formed on the surface of the substrate as needed. More specifically, the substrate (34) is a silicon wafer, a semiconductor compound wafer, silica glass, etc. As needed, an adhesive layer may be provided before the application of the imprint material to improve adhesion between the imprint material and the substrate.

[0050] The imprint head (32) drives the mold (31) in the Z direction so that the mold (31) is held and supported, the mold (31) comes into contact with the imprint material (36) on the substrate (34), or the mold (31) is separated from the cured imprint material (36) on the substrate (34). The stage (35) drives the substrate (34) in the X and Y directions so that the substrate (34) is held and supported and alignment between the mold (31) and the substrate (34) is performed. The curing device (33) cures the imprint material (36) by irradiating light (e.g., ultraviolet) through the mold (31) onto the imprint material (36) on the substrate (34) while the mold (31) and the imprint material (36) on the substrate (34) are in contact with each other. Additionally, the supply device (37) (distributor) supplies the imprint material (36) onto the substrate (34) in the form of multiple droplets.

[0051] As an imprint material, a curable composition (also referred to as an uncured resin) that hardens upon receiving curing energy is used. As the curing energy, electromagnetic waves, heat, etc. are used. The electromagnetic waves are light selected from a wavelength range of 10 nm (inclusive) to 1 mm (inclusive), such as infrared, visible light, ultraviolet light, etc.

[0052] A curable composition is a composition that is cured by light irradiation or heating. A photocurable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as needed. The non-polymerizable compound is at least one material selected from the group comprising sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, and polymer components.

[0053] The imprint material is applied as a film on a substrate by a spin coater or a slit coater. Alternatively, the imprint material may be applied on the substrate in the form of a droplet, an island, or a film formed by connecting a plurality of droplets using a liquid injection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s (inclusive) to 100 mPa·s (inclusive).

[0054] <Epidemis of a method for manufacturing an article>

[0055] A method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article, for example, a microdevice or a device having a microstructure such as a semiconductor device. The method for manufacturing an article according to the present embodiment includes the steps of forming a pattern on a substrate using the lithography apparatus, processing the substrate on which the pattern is formed through the formation step, and manufacturing an article from the substrate processed through the processing step. The manufacturing method also includes other known steps (e.g., oxidation, deposition, deposition, doping, planarization, etching, resist removal, dicing, bonding, and packaging). The method for manufacturing an article according to the present embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0056] <Other embodiments>

[0057] Embodiments(s) of the present invention may be realized by a computer of a system or device comprising one or more circuits (e.g., application-specific integrated circuits (ASICs)) that read and execute computer-executable instructions (e.g., one or more programs) recorded on a storage medium (more fully referred to as a 'non-transient computer-readable storage medium') to execute one or more of the functions of the aforementioned embodiments(s), and / or by a method executed by the computer of the system or device by reading and executing computer-executable instructions from the storage medium to execute one or more of the functions of the aforementioned embodiments(s) and / or by controlling one or more circuits to execute one or more of the functions of the aforementioned embodiments(s). The computer may include one or more processors (e.g., a central processing unit (CPU), a microprocessing unit (MPU)) and may include a network of individual computers or individual processors for reading and executing computer-executable instructions. Computer-executable instructions may be provided to the computer, for example, from a network or a storage medium. The storage medium may include one or more of, for example, a hard disk, random access memory (RAM), read-only memory (ROM), storage of a distributed computing system, an optical disc (for example, a compact disc (CD), a digital multifunction disc (DVD) or a Blu-ray disc (BD)™), a flash memory device, a memory card, etc.

[0058] (Other examples)

[0059] The present invention can be realized in a process in which a program realizing one or more functions of the above embodiments is supplied to a system or device via a network or storage medium, and one or more processors in a computer of the system or device read and execute the program.

[0060] In addition, it can also be implemented by a circuit that realizes one or more functions (e.g., an ASIC).

[0061] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be interpreted in the broadest sense to include structures and functions equivalent to all such variations.

Claims

Claim 1 A cleaning device for performing gas cleaning within a chamber, comprising: a gas flow path configured to receive gas within the chamber and send the gas into the chamber; a filter disposed within the gas flow path and configured to adsorb organic substances within the gas flowing through the gas flow path; a weight measuring device configured to measure the weight of the filter; a humidity detector configured to detect the humidity of the gas at each of the upstream and downstream sides of the filter within the gas flow path; and a controller configured to control the gas cleaning, wherein the controller is configured to estimate the adsorption state of the organic substances within the filter based on the measurement result of the weight measuring device and the detection result of the humidity detector, which are obtained when the difference between the humidity of the gas at the upstream side and the humidity of the gas at the downstream side is smaller than a humidity threshold value. Claim 2 A cleaning device according to claim 1, wherein the controller is configured to determine a moisture weight representing the weight of moisture contained in the filter based on the detection result of the humidity detector, and to estimate the adsorption state based on a value obtained by subtracting the dry weight of the filter and the determined moisture weight from the weight of the filter measured by the weight measuring device. Claim 3 A cleaning device according to paragraph 2, wherein the controller is configured to determine the moisture weight based on the detection result of the humidity detector and information indicating the relationship between the humidity of the gas in the gas flow path and the moisture content of the filter. Claim 4 A cleaning device according to paragraph 3, further comprising a temperature detector configured to detect the temperature within the gas flow path, wherein the controller has information regarding the temperature of each gas within the gas flow path and is configured to determine the moisture weight based on the information selected according to the detection result of the temperature detector. Claim 5 A cleaning device according to claim 1, further comprising a temperature detector configured to detect the temperature of the gas at each of the upstream and downstream sides of the filter in the gas flow path, and the controller configured to estimate the adsorption state based on the measurement result of the weight measuring device and the detection result of the humidity detector, wherein the difference between the temperature of the upstream gas and the temperature of the downstream gas detected by the temperature detector is smaller than a temperature threshold. Claim 6 A cleaning device according to claim 1, wherein the controller is configured to estimate as the adsorption state one of the amount of organic material already adsorbed in the filter and the amount of organic material still adsorbable in the filter. Claim 7 A cleaning device according to claim 1, wherein the controller is configured to determine the replacement timing of the filter based on the adsorption state estimated for the filter. Claim 8 In claim 7, the cleaning device is configured such that the controller notifies the determined replacement timing of the filter. Claim 9 A lithography apparatus for forming a pattern on a substrate, comprising: a forming device configured to form a pattern on the substrate; a chamber configured to accommodate the forming device; and a cleaning device configured to perform gas cleaning within the chamber as defined in any one of claims 1 to 8. Claim 10 A method for manufacturing an article, comprising: a step of forming a pattern on a substrate using a lithography device specified in claim 9; a step of processing the substrate that has undergone the forming step; and a step of manufacturing an article from the substrate that has undergone the processing step. Claim 11 delete Claim 12 delete

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