Multi-stimulation device for pain management and physical therapy

Abstract

A composite stimulation device for pain management and physical therapy according to an embodiment of the present invention comprises: a first electrode having a predetermined surface area exposed to the outside to form a stimulation surface; a thermoelectric element having one surface that absorbs / excites heat when one surface absorbs / excites heat and the other surface that absorbs / excites heat when one surface absorbs / excites heat, and one surface that contacts the back surface of the electrode to supply cold or hot air; a first heat sink having a block shape and a predetermined thickness that contacts the other surface of the thermoelectric element; a second heat sink having a fin array formed thereon that is coupled to the first heat sink and has a surface area that emits heat into the atmosphere; a fan that generates airflow on the second heat sink; and a control board configured to control the thermoelectric element or the first electrode, wherein the control board controls the medium-frequency stimulation by the first electrode or the absorption / excitation of the thermoelectric element to form a cold stimulation or a warm stimulation on the stimulation surface, and the second heat sink is characterized in that when the stimulation surface faces the front, the direction in which the fins of the fin array protrude faces the rear direction.

Description

Technology Field

[0001] The present invention relates to a complex stimulation device for pain management and physical therapy, and more specifically, to a complex stimulation device that can be used for various indications by providing a portable handpiece capable of administering medical cold stimulation, warm stimulation, and medium-frequency complex stimulation. Background Technology

[0003] Generally, heat and inflammation occurring at the lesion (treatment site) destroy cells and delay the healing process. Conventionally, medical devices used for the management and treatment of lesions include cold stimulators and hot stimulators.

[0004] Cold stimulators constrict blood vessels in a limited area, temporarily reducing the size of blood cells; this vasoconstriction reduces the amount of blood flowing to the wound site. Cold stimulation temporarily inhibits nerve transmission, alleviating pain, and minimizes cell destruction at the wound site, which can reduce swelling and inflammation.

[0005] In addition, cold stimulation has the advantage of facilitating the absorption of drugs. The fact that cold stimulation is more effective than electrical stimulation for drug absorption is disclosed in the 2002 paper "FARMACOTERAPIA A LOCALIZZZIONE MIRATA MEDIANTE 'CRIOELETTROFORESI' NELLE PATOLOGIE ARTICOLARI E MUSCOLARI" by A. Aloisi, M. Matera, and R. Potenza. According to the aforementioned paper, drug absorption is most efficient when the temperature is maintained between -5°C and 0°C using ice or similar means. Indications for cryotherapy using cold stimulation include acute contusion, muscle spasms, muscle rigidity, tachycardia, functional cardiac arrhythmia, fasciitis, myofascial disorders, sprains, myalgia, pain relief, and reduction of bleeding.

[0006] Meanwhile, thermal stimulators provide treatment by applying thermal stimulation to the affected area. Thermal stimulators apply thermal stimulation to mild pain, such as muscle pain or joint pain, to provide a hot compress effect and can help improve blood circulation. Indications for thermal compresses using thermal stimulation include increased blood flow, muscle relaxation, increased metabolism, pain relief, and increased tissue viscoelasticity.

[0007] Hot and cold stimulation can be used not only for medical purposes but also for skin care. By supplying warmth or cold to the skin, it enhances stimulation, restores bodily balance, and relieves fatigue, thereby helping to maintain clear and elastic skin.

[0008] Thermoelectric elements are used as components in such hot and cold stimulation generating devices. Among thermoelectric elements, the Peltier element utilizes the Peltier effect, a phenomenon in which heat is absorbed or generated by an electric current. Conventionally, water cooling was used to lower the temperature of ceramics below freezing using Peltier elements. While water cooling offers high cooling efficiency, it has the disadvantage of requiring a separate device to cool the water, which makes the system complex and increases manufacturing costs. Additionally, there is the inconvenience of having to manage the cooling water separately, and there is a risk of leakage or freezing. Furthermore, water-cooled devices using Peltier elements have the disadvantage of requiring a larger volume for the stimulation device to achieve high efficiency.

[0009] To address this, the applicant disclosed the prior art, Korean Registered Patent No. 1193935, an air-cooled cold and hot stimulation generating device. Through the aforementioned prior patent, the applicant disclosed a stimulation device capable of acting as both a cold stimulator and a hot stimulator by configuring a heat exchanger comprising a thermoelectric element, a heat block, a heat pipe, and a heat fin.

[0010] However, the prior art of the present applicant had limitations in that, due to the characteristics of the air-cooled heat exchanger, heat fins had to be sufficiently formed in the longitudinal direction, resulting in a somewhat large volume of the product's head and poor center of gravity, which did not provide a superior user experience. In addition, due to the volume occupied by the heat exchanger, it was not easy to mount a separate battery and charging module on the handpiece, causing the inconvenience of having to connect a power cable to use it.

[0011] Meanwhile, in addition to temperature-based treatments using cold and hot stimulation, medium-frequency stimulation is primarily used as a physical therapy method to stimulate and relax muscles using electrical medium frequencies. Medium frequencies produce the effect of stimulating and relaxing muscles by delivering medium frequencies to the muscles through electrodes. By physically stimulating muscles, medium frequencies can promote blood circulation within the muscles and reduce inflammation. Indications for medium-frequency therapy include pain control, muscle contraction / relaxation, increased blood flow, absorption of edema / hematoma, inflammation relief, promotion of wound healing, and facilitation of urination.

[0012] As mentioned above, the indications and effects of hot and cold stimulation can create synergy with those of medium-frequency therapy. Combined stimulation with hot and cold and medium frequency can significantly improve muscle pain relief and recovery speed, making it particularly effective for pain relief and physical therapy for athletes.

[0013] The applicant has devised a composite stimulation device that can be implemented as a rechargeable handpiece equipped with a battery by improving the air-cooled cooling structure to ensure sufficient heat conductivity while minimizing the volume of the product, adding a medium-frequency electrode structure to the stimulation part, and minimizing the space occupied by the heat block and substrate. Prior art literature

[0015] Korean Registered Patent No. 1193935 The problem to be solved

[0016] The present invention aims to provide a composite stimulation device capable of generating hot and cold stimulation via air cooling and combining hot and cold stimulation with medium-frequency stimulation. means of solving the problem

[0018] A composite stimulation device for pain management and physical therapy according to an embodiment of the present invention comprises: a first electrode having a predetermined surface area exposed to the outside to form a stimulation surface; a thermoelectric element having one surface that absorbs / excites heat when one surface absorbs / excites heat and the other surface that absorbs / excites heat when one surface absorbs / excites heat, and one surface that contacts the back surface of the electrode to supply cold or hot air; a first heat sink having a block shape and a predetermined thickness that contacts the other surface of the thermoelectric element; a second heat sink having a fin array formed thereon that is coupled to the first heat sink and has a surface area that emits heat into the atmosphere; a fan that generates airflow on the second heat sink; and a control board configured to control the thermoelectric element or the first electrode, wherein the control board controls the medium-frequency stimulation by the first electrode or the absorption / excitation of the thermoelectric element to form a cold stimulation or a warm stimulation on the stimulation surface, and the second heat sink is characterized in that when the stimulation surface faces the front, the direction in which the fins of the fin array protrude faces the rear direction.

[0019] According to one embodiment, when the stimulation surface faces the front, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are arranged in that order, and may be arranged along the same axis as the stimulation surface.

[0020] According to one embodiment, a compound layer may be formed on the contact surface where the first heat sink and the second heat sink are joined.

[0021] According to one embodiment, a compound layer may be formed on the contact surface where the first electrode and the thermoelectric element are joined.

[0022] According to one embodiment, the compound layer is a layer coated with a viscous liquid and may include thermal grease, thermally conductive paste, thermally conductive silicone, or a thermally conductive composite.

[0023] According to one embodiment, a second electrode is further included at a distance from the outer surface of the first electrode, the second electrode is in contact with the skin of the human body and functions as a ground electrode, and the stimulation surface may be formed by including the first electrode and the second electrode.

[0024] According to one embodiment, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are provided in the stimulation portion constituting the head of the housing, the control board is provided in the handle portion of the housing, and the handle portion may include a rechargeable battery that supplies power to the control board.

[0025] According to one embodiment, the handle portion may be divided into a first zone and a second zone, wherein the control board is provided in the first zone and the battery is provided in the second zone.

[0026] According to one embodiment, the control substrate may be provided in the first zone in a stack structure in which a first control substrate and a second control substrate are stacked. Effects of the invention

[0028] According to the present invention, a heat dissipation module is composed of a block-shaped first heat sink capable of effectively absorbing and storing heat applied to a thermoelectric element, and a second heat sink having a fin array formed for heat dissipation. The first heat sink is formed with a metal member having a predetermined thickness while minimizing the surface area, and thus has a high heat capacity, allowing it to receive and store heat from the thermoelectric element so that heat does not accumulate in the thermoelectric element with a thin volume. The second heat sink has a structure with a large surface area, configured to receive the heat stored in the first heat sink and release it into the air. The present invention improves the air-cooling efficiency of the thermoelectric element by combining two types of heat sinks, and due to the improved cooling efficiency, the volume of the second heat sink is minimized, so the stimulation part of the housing is not elongated, and a complex stimulation device can be implemented with a compact handpiece.

[0029] In addition, the present invention improves the efficiency of heat conduction by forming a compound layer on the bonding surface where two types of heat sinks are joined. When two types of metal heat sinks are fastened using screws or the like, it is theoretically impossible to achieve a bonded connection where the two metal surfaces are in complete contact. The compound layer is a viscous liquid that improves heat conduction, and by forming a layer on the bonding surface, it causes the first heat sink and the second heat sink to be completely bonded, thereby significantly improving the efficiency of heat conduction from the first heat sink to the second heat sink.

[0030] In addition, the present invention allows the first electrode and the second electrode to be configured together on the stimulation surface so that the ground electrode comes into contact with the skin, thereby minimizing leakage current during medium-frequency stimulation, improving stimulation efficiency, and ensuring user convenience in using the product. Brief explanation of the drawing

[0032] FIG. 1 is a perspective view of a complex stimulation device according to an embodiment of the present invention. Figure 2 is an exploded view of the stimulation part of a complex stimulation device. FIG. 3 is a heat sink according to an embodiment of the present invention. FIG. 4 is an exploded view of the handle portion according to an embodiment of the present invention. FIG. 5 is an item configuration for testing a heat sink according to an embodiment of the present invention. Figure 6 shows the heat sink structure of the item according to the experimental example of Figure 5. Figure 7 shows the measurement of the experimental example of Figure 5. Specific details for implementing the invention

[0033] The various embodiments described in this document are illustrative for the purpose of clearly explaining the technical concept of the invention and disclosure, and are not intended to limit them to specific embodiments. The technical concept of the invention and disclosure includes various modifications, equivalents, alternatives, and embodiments selectively combined from all or part of each embodiment described in this document. Furthermore, the scope of rights of the technical concept of the invention and disclosure is not limited to the embodiments presented below or the specific descriptions thereof.

[0034] Terms used in this document, including technical or scientific terms, may have the meaning generally understood by those skilled in the art to which the invention and disclosure pertain.

[0035] Expressions used in this document, such as "includes," "may include," "is equipped," "may be equipped," "has," and "may have," imply that functions, operations, or components exist as the subject feature and do not exclude the existence of other additional features. In other words, such expressions should be understood as open-ended terms implying the possibility of including other embodiments.

[0036] Singular expressions used in this document may include the meaning of the plural form unless the context otherwise indicates, and this applies likewise to singular expressions described in the claims.

[0037] Expressions used in this document such as “A, B, and C,” “A, B, or C,” “A, B, and / or C,” or “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one of A, B, and / or C,” “at least one selected from A, B, and C,” “at least one selected from A, B, or C,” “at least one selected from A, B, and / or C,” etc., may mean each of the listed items or all possible combinations of the listed items. For example, “at least one selected from A and B” may refer to (1) A, (2) at least one of A, (3) B, (4) at least one of B, (5) at least one of A and at least one of B, (6) at least one of A and B, (7) at least one of B and A, and (8) all of A and B.

[0038] The expression "based on" as used in this document is used to describe one or more factors affecting an act or action of a decision or judgment described in the phrase or sentence containing such expression, and this expression does not exclude additional factors affecting said act or action of a decision or judgment.

[0039] As used in this document, the expression that a certain component (e.g., a first component) is "connected" or "connected" to another component (e.g., a second component) may mean not only that the said certain component is directly connected or connected to the said other component, but also that it is connected or connected through a new other component (e.g., a third component).

[0040] The expression "configured to" as used in this document may have meanings such as "set to," "capable of," "modified to," "made to," or "able to," depending on the context, and is distinguished from the meaning of "consist."

[0041] Various embodiments of the present disclosure will be described below with reference to the accompanying drawings. In the accompanying drawings and the description thereof, identical or substantially equivalent components may be given the same reference numerals. Furthermore, in the description of the various embodiments below, the description of identical or corresponding components may be omitted, but this does not mean that such components are not included in the embodiments.

[0042] FIG. 1 is a perspective view of a complex stimulation device (1) according to an embodiment of the present invention.

[0043] Referring to FIG. 1, the complex stimulation device (1) may be provided as a housing of a handpiece, and the housing may be composed of a stimulation portion (10) and a handle portion (30) to which a first electrode (11) and a second electrode (13) are exposed. The complex stimulation device (1) may include, as internal components, a first electrode (11), a second electrode (13), a thermoelectric element (20), a first heat sink (31), a second heat sink (33), a fan (70), and a control board (60).

[0044] The stimulation unit (10) is provided with a first electrode (11), a second electrode (13), a thermoelectric element (20), a first heat sink (31), a second heat sink (33), and a fan (70), and can form the head of the housing. The stimulation unit (10) can perform medium frequency, cold stimulation, and warm stimulation through the configurations described below. The stimulation unit (10) cools the thermoelectric element (20) in an air-cooling manner in which the fan (70) cools the heat sinks (31, 33), and a ventilation opening (101) is formed in the housing where the heat sinks (31, 33) are located in the stimulation unit (10) to quickly discharge heat generated from the heat sinks (31, 33) to the outside.

[0045] In this embodiment, the thermoelectric element (20) may use a thermistor, which is a device utilizing a temperature change in electrical resistance; a device utilizing the Seebeck effect, which is a phenomenon in which an electromotive force is generated by a temperature difference; and a Peltier element utilizing the Peltier effect, in which heat is absorbed or generated by an electric current.

[0046] The first electrode (11) may have a predetermined surface area exposed to the outside to form a stimulating surface. The second electrode (13) may be formed at a distance from the outer surface of the first electrode (11). The second electrode (13) may come into contact with the skin of the human body and function as a ground electrode, and a stimulating surface may be formed by including the first electrode (11) and the second electrode (13). In this embodiment, the first electrode (11) may be disc-shaped and may form a stimulating surface with a predetermined amount of curvature in the center, forming a convex central portion. The second electrode (13) may be provided with a circular band structure and spaced apart from the first electrode (11) so as not to conduct electricity with the first electrode (11). An insulating material may be inserted into the spaced-apart space between the first electrode (11) and the second electrode (13). The stimulation surface formed by the first electrode (11) and the second electrode (13) is designed so that the first electrode (11) and the second electrode (13) come into contact simultaneously when in contact with the user's skin through the curvature of the first electrode (11). The second electrode (13) is grounded by contacting the skin and forms a voltage difference with the first electrode (11), thereby applying medium-frequency stimulation to the contacted skin surface. Additionally, the temperature of the first electrode (11) can be varied due to the thermoelectric element (20) on the rear side, which will be described later, so that cold stimulation or hot stimulation can be delivered to the skin simultaneously.

[0047] FIG. 2 is an exploded view of the stimulation part (10) of the composite stimulation device (1). Referring to FIG. 2, the composite stimulation device (1) according to the present embodiment is arranged in the order of a first electrode (11), a thermoelectric element (20), a first heat sink (31), a second heat sink (33), and a fan (70) when the stimulation surface faces the front, and may be arranged along the same axis as the stimulation surface.

[0048] When one side of the thermoelectric element (20) absorbs / excites heat with the applied current, the other side generates / absorbs heat, and one side can be in contact with the back surface of the first electrode (11) to supply cold or hot air.

[0049] Notably, in the configuration arrangement of the air-cooled heat exchanger according to the present embodiment, the first electrode (11) is contacted and coupled to the front side based on the thermoelectric element (20), and the first heat sink (31) and the second heat sink (33) are sequentially coupled to the rear side. As an example, when the thermoelectric element (20) is a Peltier element, if the front side of the thermoelectric element (20) generates heat, the rear side of the thermoelectric element (20) absorbs heat, and if the front side absorbs heat, the rear side generates heat. Generally, since heat is generated on both sides of the thermoelectric element (20), it is common for the heat dissipation configuration to be arranged on the front and rear sides. However, in the present embodiment, since the front side of the thermoelectric element (20) comes into direct contact with the user's skin and transmits cold and warm air due to heat absorption or heat generation, the heat dissipation configuration is limited to being arranged on the rear side of the thermoelectric element (20). More precisely, in order for the heat absorption function to be exerted on the rear surface of the thermoelectric element (20), it is important to rapidly cool the rear surface of the thermoelectric element (20) when it generates heat. This is because only then can the cooled rear surface of the thermoelectric element (20) generate heat again when the thermoelectric element (20) changes from a warm stimulus to a cold stimulus, thereby allowing the heat absorption operation to be performed smoothly on the front surface.

[0050] Accordingly, unlike the heat exchanger structure of a conventional thermoelectric element (20), the thermoelectric element (20) according to the present embodiment has a design constraint that a heat dissipation structure cannot be arranged on the front and rear sides of the thermoelectric element (20) and must be formed only on one side, the rear side. Therefore, the air cooling performance on the rear side determines whether a product capable of simultaneously performing cold and warm stimulation can be implemented.

[0051] The heat dissipation structure according to the present embodiment will be described in detail below. A binding portion (110) may be formed on the rear surface of the first electrode (11). The binding portion (110) is configured to accommodate a thermoelectric element (20) in a groove so that the thermoelectric element (20) is fitted and coupled. At this time, it is preferable that the binding portion (110) be configured as a groove with a partition wall formed so that it can contact not only the front surface but also the side surface of the thermoelectric element (20). The thermoelectric element (20) is contacted and coupled to the first electrode (11) through the binding portion (110), and a compound layer (5) may be formed on the front surface of the thermoelectric element (20) that is fitted and contacted to the first electrode (11). In this embodiment, for the cooling efficiency of the heat dissipation plate configured in a unidirectional manner, the first heat dissipation plate (31) and the second heat dissipation plate (33) may have a compound layer (5) formed on the contact surface where they are coupled. Additionally, a compound layer (5) may be formed on the contact surface where the first electrode (11) and the thermoelectric element (20) are joined.

[0052] In this embodiment, the compound layer (5) is a layer coated with a viscous liquid and may include thermal grease, thermally conductive paste, thermally conductive silicone, or a thermally conductive composite.

[0053] The compound layer (5) increases thermal conductivity due to the characteristics of the material, and it is noteworthy that the compound is applied in a viscous liquid form. This further improves thermal conductivity from metal to metal by filling the fine non-contact voids on the metal-to-metal bonding surface with the compound layer (5).

[0054] In this embodiment, the heat sink (31, 33) is composed of two pieces: a first heat sink (31) and a second heat sink (33). The thermoelectric element (20) is provided in the form of a plate with a relatively thin thickness due to its characteristics. Therefore, the thermoelectric element (20) has a low heat capacity due to the characteristics of the material. In this embodiment, the reason the heat sink is provided in two pieces is to compensate for the low heat capacity of the thermoelectric element (20). First, the first heat sink (31) is configured to have a high heat capacity by forming a volume with a block-shaped metal material. To prevent the thermoelectric element (20) from rapidly heating up due to the high heat capacity, the first heat sink (31) is configured to receive heat first, and then the second heat sink (33) is configured to cool by forming a high surface area.

[0055] At this time, a compound layer (5) is formed between the first heat sink (31) and the second heat sink (33). The compound layer (5) fills the fine irregularities or voids on the metal bonding surface with a viscous liquid so that they are completely bonded when the metal materials of the first heat sink (31) and the second heat sink (33) are bonded, and significantly improves the thermal conductivity between the metals.

[0056] FIG. 3 is a heat sink (31, 33) according to an embodiment of the present invention.

[0057] Referring to FIG. 3, the first heat sink (31) may be provided in a block shape having a predetermined thickness and in contact with the other side of the thermoelectric element (20). A compound layer (5) may be applied to the upper surface of the first heat sink (31). Additionally, a screw hole for coupling with the second heat sink (33) may be formed on the upper surface of the first heat sink (31).

[0058] The second heat sink (33) may be coupled to the first heat sink (31) and may have a fin array formed to constitute a surface area that releases heat into the atmosphere. The fin array may be in the form of a plurality of plate-shaped rods arranged with irregularities to form a high surface area. A screw hole may be formed through the second heat sink (33) for coupling with the first heat sink (31). Both the first heat sink (31) and the second heat sink (33) are provided with a metallic material having high thermal conductivity, and thus the two can be coupled using a screw. In the assembly process, even if the two metals are fastened strongly using a screw, the contact surface between the first heat sink (31) and the second heat sink (33) cannot achieve a state of complete contact due to the characteristics of the metal processing. In addition, if the design is such that multiple screw holes are formed in the first heat sink (31) and the second heat sink (33) to further strengthen contact adhesion, a sufficient fin array cannot be formed in the second heat sink (33), and thus cooling efficiency cannot be secured. Therefore, the connection between the first heat sink (31) and the second heat sink (33) is a major consideration in the design to secure cooling efficiency, and in this embodiment, a compound layer (5) is formed to achieve contact adhesion between the two metals while increasing thermal conductivity.

[0059] Meanwhile, the second heat sink (33) can be positioned so that when the stimulating surface faces the front, the direction in which the fins of the fin array protrude faces the rear. A fan (70) located at the rear of the head can generate airflow to the second heat sink (33). This is because, as an embodiment of the heat exchanger configuration described above, sufficient thermal conductivity and cooling efficiency are achieved, so the implementation of hot and cold stimulation is possible even if the fin array of the second heat sink (33) is not secured in the up-down and longitudinal directions relative to the product of FIG. 1. Ultimately, the heat exchange configuration according to this embodiment may be configured such that the second heat sink (33) faces the rear direction relative to the product of FIG. 1, and air cooling is performed directly from the fan (70) positioned at the rear, thereby forming an assembly structure that is desirable in terms of cooling efficiency. In addition, as the second heat sink (33) is configured in the rear direction, the product reference stimulation part (10) of FIG. 1 is formed short in the front-back direction, so the center of gravity is stabilized and the user's feel can be improved.

[0060] FIG. 4 is an exploded view of a handle portion (30) according to an embodiment of the present invention.

[0061] A control board (60) is provided in the handle portion (30), and a rechargeable battery (40) that supplies power to the control board may be included. The control board (60) is configured as a circuit that controls a thermoelectric element (20) or a first electrode (11), and can form a cold stimulus or a warm stimulus on the stimulus surface by controlling the medium-frequency stimulation by the first electrode (11) or the heat absorption / heat generation of the thermoelectric element (20).

[0062] Referring to FIG. 4, the handle portion (30) is divided into a first zone (301) and a second zone (303), and a control board (60) may be provided in the first zone (301) and a battery (40) may be provided in the second zone (303).

[0063] The control board (60) may be provided in the first zone (301) in a stacked structure in which the first control board (601) and the second control board (603) are stacked. In one embodiment, the first control board (601) may be equipped with a medium frequency module, and the second control board (603) may be equipped with a power supply module for controlling the thermoelectric element (20).

[0064] A connection portion (600) for stacked coupling may be formed between the first control board (601) and the second control board (603). The connection portion (600) may be provided as a pin for power supply, and the second control board (603) may share the power applied to the first control board (601) through the connection portion (600).

[0066] < Heat Sink Experiment Examples - Heat Sink Performance Test >

[0067] Below, a performance test of the first heat sink (31) and the second heat sink (33) according to the embodiment of the present invention disclosed in FIG. 3 is described. The disclosed first heat sink (31) and the second heat sink (33) are compared with the heat dissipation structure of the first generation product of the applicant's prior art, Korean Registered Patent No. 1193935.

[0068] Through this experimental example, it is confirmed that the thermal / cooling efficiency of the heat sink structure according to the embodiment composed of two pieces and the thermal / cooling efficiency differ depending on the presence or absence of a compound layer are verified. The experimental example is described in detail below.

[0069] FIG. 5 is a configuration of items for testing heat sinks (31, 33) according to an embodiment of the present invention. FIG. 6 shows the structure of a heat sink according to the experimental example of FIG. 5. Referring to FIG. 5 and FIG. 6, Test Item 1 and Test Item 2 are items using a two-piece heat dissipation module equipped with a first heat sink (31) and a second heat sink (33) according to the embodiment of FIG. 3 described above, and are hereinafter referred to as "new type". Both Test Item 1 and Test Item 2 are equipped with a first heat sink (31) and a second heat sink (33), but Test Item 1 applies a module that forms a compound (5) layer, while Test Item 2 is an item that does not form a compound (5) layer, and the two are distinguished.

[0070] Test specimens 3 and 4 are related products of the applicant disclosed in Korean Registered Patent No. 1193935, in which a heat dissipation module consisting of a single heat sink is used. Hereinafter, this is referred to as the "old type." Although test specimens 3 and 4 are equipped with the same heat dissipation module, test specimen 3 applies a module in which a compound (5) layer is formed at the bottom, and test specimen 4 is an item in which a compound (5) layer is not formed, so the two are distinguished.

[0071] Figure 7 shows the measurement of an experimental example.

[0072] The test method is as follows.

[0073] After checking the ambient temperature to ensure it is identical to the initial experimental environment, a thermometer tip is connected to the electrode ceramic of the test specimen. Before operating the test specimen, the surface temperature of the electrode ceramic is checked, and then the cooling mode and heating mode of the test specimen are activated. Using a stopwatch, the change in the surface temperature of the electrode ceramic is measured in 10-second intervals for up to 2 minutes. For each test specimen, the cooling mode and heating mode were measured once each. The measurement conditions are as shown in [Table 1].

[0074] division Test sample 1 Test sample 2 Test sample 3 Test sample 4 Model version New model New model rectangle rectangle Compound O X O X Ambient temperature (°C) 23.5 23.7 24 23.9 Electrode surface temperature (°C) 22.6 22.4 22.6 23.0

[0075] The performance evaluation criteria are as follows.

[0076] The cooling mode was selected in order of the fastest time for the surface temperature of the electrode ceramic. The heating mode was selected in order of the fastest time for the surface temperature of the electrode ceramic.

[0077] The experimental results are as follows.

[0078] [Table 2] shows the results of the cooling performance measurement experiment.

[0079] division Test sample 1 Test sample 2 Test sample 3 Test sample 4 Model version New model New model rectangle rectangle Compound O X O X Time (minutes / seconds) Electrode surface temperature (°C) 0 / 0 22.6 22.4 22.6 23.0 0 / 10 19.0 21.9 20.2 20.6 0 / 20 15.3 20.7 17.9 18.1 0 / 30 12.0 19.6 15.9 16.2 0 / 40 9.2 18.4 14.3 14.8 0 / 50 7.3 17.5 13.2 13.6 1 / 00 5.9 16.6 12.2 12.6 1 / 10 4.7 16.0 11.3 11.9 1 / 20 4.1 15.4 10.6 11.3 1 / 30 3.7 14.9 9.9 10.8 1 / 40 3.4 14.6 9.5 10.5 1 / 50 3.2 14.3 9.2 10.2 2 / 00 3.0 14.0 8.9 9.9

[0080] [Table 2]

[0081] Referring to [Table 2], the cooling performance test results were evaluated in the order of Test Sample 1 > Test Sample 3 > Test Sample 4 > Test Sample 2. According to the test results, it can be confirmed that the compound (5) layer has a greater influence on cooling performance than the two-piece structure of the heat sink. Next, it can be confirmed that without the compound (5) layer, the heat dissipation module consisting of the two-piece first heat sink (31) and second heat sink (33) has excellent cooling performance.

[0082] When all the compound (5) layers are formed, Test 1, which consists of the first heat sink (31) and the second heat sink (33), showed a temperature difference of 5.9℃ in cooling performance compared to Test 3, which consists of one heat sink.

[0083] In addition, Test Product 1, which is composed of a compound (5) layer and a first heat sink (31) and a second heat sink (33), showed a temperature difference of 6.9℃ in cooling performance compared to Test Product 4, which has a conventional heat dissipation module.

[0084] [Table 3] shows the results of the thermal performance measurement experiment.

[0085] division Test sample 1 Test sample 2 Test sample 3 Test sample 4 Model version New model New model rectangle rectangle Compound O X O X Time (minutes / seconds) Electrode surface temperature (°C) 0 / 0 22.8 22.8 22.7 22.6 0 / 10 24.7 23.2 24.9 23.9 0 / 20 27.0 24.0 26.4 25.9 0 / 30 28.7 24.8 28.2 27.4 0 / 40 30.5 25.7 29.2 29.0 0 / 50 31.9 26.5 30.5 30.2 1 / 00 33.3 27.3 31.7 31.5 1 / 10 34.4 28.1 33.0 32.3 1 / 20 35.2 28.8 33.4 33.5 1 / 30 36.0 29.5 34.3 34.3 1 / 40 35.9 30.1 34.8 35.1 1 / 50 36.1 30.7 35.5 35.8 2 / 00 36.1 31.3 36.2 36.3

[0086] Referring to [Table 3], the thermal performance test results showed similar results with no significant temperature variation. However, in this experiment as well, it was confirmed that the presence or absence of the compound (5) layer in the two-piece heat sink structure caused a significant difference of about 5°C.

[0087] Although the technical concept of the present invention and disclosure has been explained by the embodiments described above, the technical concept of the present invention includes various substitutions, modifications, and changes that can be made within the scope of understanding of those skilled in the art to which the present invention pertains. Furthermore, it should be understood that such substitutions, modifications, and changes may be included within the scope of the appended claims. Explanation of the symbols

[0089] 1: Complex stimulation device 5: Compound 10: Stimulating area 11: First electrode 13: Second electrode 20: Thermoelectric element 30: Handle part 31: First heat sink 33: Second heat sink 110: Fastener 101: Ventilation 301: Zone 1 303: Zone 2 40: Battery 60: Control board 600: Connection 601: First control board 603: Second control board 70: Fan

Claims

Claim 1 A first electrode having a predetermined surface area exposed to the outside to form a stimulating surface; a thermoelectric element in which, when one side absorbs / excites heat by an applied current, the other side generates / absorbs heat, and one side is in contact with the back surface of the first electrode to supply cold or heat; a first heat sink in the shape of a block having a predetermined thickness and in contact with the other side of the thermoelectric element; a second heat sink coupled to the first heat sink and having a fin array formed thereon that constitutes a surface area for releasing heat into the atmosphere; and a fan that generates airflow to the second heat sink. A composite stimulation device for pain management and physical therapy, comprising a circuit configuration for controlling the thermoelectric element or the first electrode, and a control board that controls medium-frequency stimulation by the first electrode or heat absorption / heat generation of the thermoelectric element to form a cold stimulation or a warm stimulation on the stimulation surface, wherein the second heat sink is arranged such that when the stimulation surface faces the front, the direction in which the fins of the fin array protrude faces the rear direction, and a compound layer is formed on the contact surface where the first heat sink and the second heat sink are joined. Claim 2 A composite stimulation device for pain management and physical therapy according to claim 1, characterized in that when the stimulation surface faces the front, the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are arranged in that order and are arranged along the same axis as the stimulation surface. Claim 3 delete Claim 4 A composite stimulation device for pain management and physical therapy according to claim 1, characterized in that a compound layer is formed on the contact surface where the first electrode and the thermoelectric element are combined. Claim 5 A composite stimulation device for pain management and physical therapy according to claim 1, wherein the compound layer is a layer coated with a viscous liquid and comprises thermal grease, thermally conductive paste, thermally conductive silicone, or a thermally conductive composite. Claim 6 A composite stimulation device for pain management and physical therapy according to claim 1, further comprising a second electrode formed at a distance from the outer surface of the first electrode, wherein the second electrode contacts the skin of the human body and functions as a ground electrode, and wherein the stimulation surface is formed by including the first electrode and the second electrode. Claim 7 A complex stimulation device for pain management and physical therapy according to claim 1, wherein the first electrode, the thermoelectric element, the first heat sink, the second heat sink, and the fan are provided in a stimulation portion constituting the head of the housing, the control board is provided in a handle portion of the housing, and the handle portion includes a rechargeable battery that supplies power to the control board. Claim 8 A complex stimulation device for pain management and physical therapy according to claim 7, wherein the handle portion is divided into a first zone and a second zone, the control board is provided in the first zone, and the battery is provided in the second zone. Claim 9 A complex stimulation device for pain management and physical therapy according to claim 8, characterized in that the control board is provided in the first zone in a stacked structure in which a first control board and a second control board are stacked.

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