Liquid immersion cooling platform

Abstract

A two-phase liquid immersion cooling system is described in which a heat-generating computer component causes a dielectric fluid to evaporate from its liquid phase. Subsequently, the dielectric vapor condenses back into the liquid phase and is used to cool the computer component. By utilizing a pressure control vessel and a pressure controller, the disclosed system can operate at a pressure below ambient pressure. By controlling the pressure at which the system operates, the user can influence the temperature at which the dielectric fluid evaporates, thereby achieving increased performance from the given computer component. A self-healing computing system can be created by utilizing a robotic arm and a slot-in computing component.

Description

Technology Field

[0001] The present invention relates to a liquid immersion cooling computing system, namely, a liquid immersion cooling computing system utilizing pressure and / or steam management. Background Technology

[0002] Conventional computing and / or server systems use air to cool various components. Conventional liquid or water-cooled computers use a flowing fluid to remove heat from computer components, but avoid direct contact between the components and the fluid itself. Advancements in electrically non-conductive fluids and / or dielectric fluids enable the use of immersion cooling, which allows computer components and other electronic devices to be submerged in a dielectric or electrically non-conductive fluid to remove heat directly from the components into the fluid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for proper cooling. means of solving the problem

[0003] In the disclosed embodiments of the present invention described below, in order to create a significantly improved computer system utilizing liquid immersion cooling, the use of a steam and pressure management system as well as a power management system may be utilized individually or in combination.

[0004] Embodiments of the disclosed invention relate to a pressure control vessel that can be used to accommodate a liquid immersion cooling computing system. In some embodiments, the pressure control vessel accommodates a sufficient amount of liquid dielectric fluid to substantially immerse heat-generating computer components and also accommodates an atmosphere containing a gaseous dielectric fluid. Embodiments further include a condensation system for cooling and for converting the gaseous dielectric fluid into a liquid dielectric fluid. The disclosed pressure management system enables the disclosed embodiment to operate under vacuum, thereby causing the dielectric fluid to evaporate and reducing the temperature at which the computing system operates. The disclosed embodiment enables an increase in the density of computer components and / or computing power due to the described improved temperature management system. Brief explanation of the drawing

[0005] FIGS. 1 and FIGS. 2 illustrate schematic diagrams of a pressure control vessel according to an exemplary embodiment. FIG. 3 illustrates the outer portion of an exemplary embodiment of a pressure control vessel (110). FIG. 4 illustrates an exemplary embodiment of a top structure including a plurality of pressure control vessels. FIG. 5 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected to a central power source. FIG. 6 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected in series. FIGS. 7a through 7d illustrate exemplary embodiments of a cooling computing system having an inner robot arm, an airlock, and an outer robot arm. FIGS. 8a through 8c illustrate exemplary embodiments of a rack system. FIGS. 9a through 9g illustrate exemplary embodiments of a chassis for mounting various components. FIGS. 10a through 10f illustrate exemplary embodiments of a pressure control vessel. FIG. 11 illustrates an exemplary cooling and steam management system for a pressure-controlled vessel. FIGS. 12a to 12e illustrate other embodiments of the container. Figure 13 illustrates an example of a freestanding container. FIG. 14 illustrates an example of an external housing for a freestanding container. FIGS. 15a through 15d illustrate an exemplary magazine positioned on a platform that can extend outside the container. FIG. 16 illustrates a steam recovery system according to an exemplary embodiment. FIG. 17 illustrates an exemplary embodiment of a rack power distribution system. FIG. 18 illustrates an example of a heating element for a immersion cooling system according to an exemplary embodiment. FIGS. 19a and FIGS. 19b illustrate a filter comprising three cores according to an exemplary embodiment. FIGS. 20a and FIGS. 20b illustrate an exemplary robot system. FIGS. 21a and FIGS. 21b illustrate an exemplary guide pin mechanism between the chassis and the rack. FIG. 22 illustrates an exemplary connector having self-aligning features. Specific details for implementing the invention

[0006] In the following description, specific details such as specific quantities, sizes, arrangements, configurations, components, etc., are described to provide a complete understanding of the embodiments disclosed herein. However, it will be apparent to those skilled in the art that the present disclosure can be practiced without such specific details. In many cases, such considerations and other details may be omitted where they are not necessary for a complete understanding of the present disclosure and are included within the capabilities of those skilled in the art.

[0007] The equipment, components, systems, and subsystems of some of the disclosed embodiments below are described in relation to trade names. It will be apparent to those skilled in the art that the present disclosure can be implemented with many similar components, whether similar components are developed and / or sold under a specific trade name, and that features and / or limitations associated with components of a specific trade name are not essential to the practice of the disclosed invention.

[0008] Dielectric fluid

[0009] One mode of immersion cooling is to use a fluid that is thermally conductive but electrically substantially non-conductive or substantially dielectric. Examples of such fluids include Novec 7100, of engineered fluids While including part of a series, the described invention is not limited to any specific dielectric fluid. Some immersion fluids typically have a boiling point at the temperature at which the computer components being cooled are to be operated. All computer components, as well as other embodiments of the disclosed system, are preferably made of a material that does not dissolve or otherwise break down within the pressure-controlled vessel when in contact with the dielectric fluid. In some embodiments, the boiling point of the dielectric fluid at standard atmospheric pressure may be less than about 100 °C, or less than about 80 °C, or less than about 60 °C, or less than about 50 °C, or less. In some embodiments, the boiling point of the dielectric fluid at standard atmospheric pressure may be greater than about 60 °C, or greater than about 40 °C, or greater than about 30 °C, or greater than about 20 °C. Certain embodiments of the immersion cooling fluid generally have a low vapor pressure. Some embodiments of the immersion cooling fluid are fluorocarbons and / or fluorinated ketones. Certain embodiments of the dielectric fluid may have the chemical formula (CF3)2CFCF2OCH3, C4F9OCH3, or CF3CF2CF2CF2OCH3, or a similar formula. Certain dielectric fluids include hydrofluoroethers and methoxy-nonafluorobutane.

[0010] Other desirable characteristics of the immersion cooling fluid include low toxicity, non-flammability, and / or low surface tension. In some embodiments, the immersion cooling fluid does not substantially damage computer components and / or connections, wires, cables, seals, and / or adhesives associated with computer components at the pressure and temperature used for liquid immersion cooling. Some dielectric fluids have a dielectric constant in the range of about 1.8 to about 8 and a dielectric strength of about 15 megavolts per meter (15 MV / m). In some embodiments, the dielectric fluid has a dielectric strength of at least about 5 MV / m, or at least about 8 MV / m, or at least about 10 MV / m, or at least about 12 MV / m. In some embodiments, the dielectric fluid has a dielectric strength of about 3 MV / m or less, or about 5 MV / m or less, or about 8 MV / m or less. In the disclosed embodiment, in order to prevent damage to the computer component at intervals and conditions of a specific application example, any liquid in contact with the computer component (170) has a sufficiently large dielectric strength.

[0011] Some dielectric fluids have a critical heat flux of at least about 10 W / cm2, or at least about 15 W / cm2, or at least about 18 W / cm2, or at least about 20 W / cm2. Some dielectric fluids have a critical heat flux of about 15 W / cm2 or less, or about 10 W / cm2 or less, or about 8 W / cm2 or less, or about 5 W / cm2 or less.

[0012] FIG. 1 illustrates a schematic diagram of a cooling computing system (110) according to an exemplary embodiment. An embodiment of the disclosed cooling computing system (110) (or, which may all be interchangeably used, a computing system, a system, a vessel, or a pressure-controlled vessel) may utilize a liquid dielectric fluid (140) to cool a computer component (170) by immersing the component in a bath of fluid. As electricity passes through the component (170), the component (170) generates heat. As the component (170) heats up, the performance of the component may be reduced or the component may be damaged to a point of failure. It is advantageous to maintain several computing components at a stable and relatively low temperature. In some embodiments, the computer component (170) may be maintained at about 80°C or less, or about 70°C or less, or about 65°C or less, or about 60°C or less, or about 55°C. In some embodiments, the computer component (170) may be maintained at approximately 60°C or above 50°C or above 40°C or above 35°C or above 30°C. As the computer component (170) heats up, heat is transferred to the liquid dielectric fluid (140) surrounding the component (170). When the liquid dielectric fluid reaches its boiling point, it will convert from the liquid phase to the gaseous phase and rise out of the liquid bath (142). The component (170) within the dielectric fluid bath (142) may generally be maintained around the boiling point of the specific dielectric fluid (140) being used.

[0013] When the liquid dielectric fluid is heated to its evaporation point and begins to become gas at the pressure used for the given application, bubbles of dielectric vapor will rise out of the liquid bath (142) and up to the top of the system (110). Subsequently, the vapor is cooled to its condensation point using a condenser (130). Depending on the configuration of the system (110), the heating and cooling of the dielectric fluid from the liquid phase to the vapor phase and vice versa can generate a convection current as illustrated in FIG. 2.

[0014] In some embodiments, when the system is operated, the computer component (170) will be completely submerged in the liquid dielectric fluid (140). In other words, the upper portion of the computer component (170) is located below the level of the dielectric fluid (140). It will be understood that as heat from the computer component causes the dielectric fluid to change from a liquid phase to a gaseous phase, small bubbles of the dielectric fluid vapor come into contact with the computer component. Such a component will still be considered to be entirely submerged in the liquid phase of the dielectric fluid. In some embodiments, the computer component (170) may be submerged in the liquid phase of the dielectric fluid (140). In one exemplary embodiment, the computer component will be considered submerged if any part of the computer component, including, but not limited to, a motherboard, chip, server, card, blade, GPU, or CPU, and / or any peripheral components, comes into direct contact with the liquid phase of the dielectric fluid (140). In a specific embodiment, the computer component (170) may be at least partially submerged in the liquid phase of the dielectric fluid (140). If the computer component (170) is not submerged but is sufficiently cooled by the dielectric vapor, the computer component will be considered to be at least partially submerged.

[0015] In some existing immersion cooling systems, since the fluid is continuously boiling, the dielectric fluid must be continuously added to the dielectric fluid bath. Failure to add the dielectric fluid to the bath (142) can result in the level of the dielectric fluid in the bath (142) dropping until the component is exposed to a gaseous atmosphere and is not properly cooled. This can result in a decrease in the performance of the component (170) or damage to it.

[0016] In some embodiments, there may be a number of operating modes that can be described as a fluid management system related to a dielectric fluid in a liquid state. These modes may include (1) initial filling, which is a process of transferring the dielectric fluid from a storage system into a container; (2) continuous leveling, which is a process of allowing an additive fluid to be added to the container or allowing excess fluid to be removed from the container; (3) unfilling, which is a process of allowing the fluid to be discharged from the container and placed into a storage system; and (4) operating filtering, which is a process of allowing the fluid to be continuously circulated through a filtering system to ensure the removal of any particulates.

[0017] In some embodiments, the first three liquid management objectives—initial filling, continuous leveling, and emptying—can be achieved through the same complete set of piping, pumps, and valves. A dedicated tank for storing liquid coolant can be used for storing new fluid and excess fluid that is removed and re-condensed during the vapor management process. Using a set of pipes and pumps, the coolant (or dielectric fluid) can be moved from the storage system to the vessel during filling and leveling, and can be moved out of the vessel and back into the storage system during the emptying operation.

[0018] In some embodiments, motion filtering, which is the fourth liquid management objective, may be achieved through a series of skimmers and / or filters. The first stage may be a large particle filter located within the bottom of the vessel. The purpose of this filter is to prevent particles that are too large to be handled in subsequent stages from entering the rest of the system. The second stage may be an intermediate particulate filter placed in-line within the piping system between the first and third stages. This second stage intermediate particulate filter may utilize a small barrel-style filter to remove particulates that are too small to be removed by the first stage filter but too large to be handled by the third stage filter. The third stage filter may consist of one or more parallel filters supporting various types of filter configurations. In some embodiments, a specific style of filter will be determined by performing an analysis of the fluid after the fluid has been exposed to and operated with a set of hardware components located within the vessel environment. Different hardware and / or components may generate different types of particulates and chemicals that may need to be filtered to ensure the long lifespan and efficiency of the dielectric fluid.

[0019] Pressure management

[0020] Generally, the immersion cooling fluid must be kept free of dust, water, and / or other contaminants. As the computer component (170) comes into direct contact with the immersion cooling fluid (140), minor contaminants may cause a short circuit in the computer component or damage thereto. Additionally, water or water vapor that can contaminate the dielectric fluid may reduce the dielectric properties of the fluid, including, without limitation, dielectric strength, once the fluid begins to become contaminated. If the dielectric strength of the dielectric fluid is reduced, the computer component may be short-circuited or otherwise damaged during operation. One way to reduce contamination is to operate the immersion cooling system within an enclosure maintained at or slightly above atmospheric pressure.

[0021] When the computer component (170) is in operation, heat generated from the initial use of the computer component causes some dielectric liquid (140) to evaporate into gas. If the immersion cooling system is confined within a substantially enclosed housing, this evaporation typically increases the atmospheric pressure within the housing. By using a pressure relief valve, an expansion enclosure, and / or other techniques, the pressure increase can be limited and / or the pressure within the housing can be maintained at atmospheric pressure or only slightly above atmospheric pressure. Maintaining a slightly positive pressure within the enclosure can help reduce the penetration of dust, water vapor, or other contaminants into the immersion cooling computing system.

[0022] The present embodiment utilizes an enclosed pressure control vessel (110) (or cooling computing system (110)) enclosure to accommodate computing components (170) and immersion cooling equipment, as well as associated power, networking connections, wiring connections, and others within the pressure control vessel. In contrast to conventional models, the pressure control vessel (110) can be maintained at least under a slight vacuum, thereby reducing the boiling point of the dielectric fluid (140) to a temperature below that boiling point at standard atmospheric pressure.

[0023] By operating the computing and immersion cooling system under vacuum, the component (170) can be maintained at a reduced, low-pressure boiling point of the dielectric fluid (140). This has the advantage of increased cooling, which allows more electricity to pass through the components (170), thereby resulting in higher performance of the components. By controlling the pressure within the pressure control vessel (110), the boiling point of the dielectric fluid (140) can also be controlled, thereby allowing the same fluid (140) to be used under a wider range of conditions. Many embodiments benefit from colder temperatures, but certain computer components (170) may have an ideal range, and performance may be reduced at temperatures lower than that range. By controlling the pressure within the pressure control vessel (110), the boiling point of the immersion cooling fluid (140) can also be controlled. In a specific embodiment, using the disclosed pressure management system, the pressure can be dynamically controlled in response to when the computing system is started, stopped, or other changes in conditions, thereby controlling the boiling point of the dielectric fluid (140).

[0024] In addition to reducing the boiling point of the dielectric fluid (140) by operating within a pressure control vessel (110) at a pressure lower than ambient pressure, the computer component (170) itself may be modified to more efficiently transfer heat away from the computer component (170) and into the dielectric fluid (140). By increasing the surface area of ​​the component (170), for example, the chip, exposed to the liquid dielectric fluid (140), heat transfer between the component (170) and the bath (142) of the dielectric fluid (140) may be increased. An exemplary device for increasing the surface area may be a copper boiler or a copper disk that can be attached to the chip of another computer component (170). In certain embodiments, the adhesive used will be selected based on its ability to transfer heat and its solubility in the dielectric cooling fluid. A preferred adhesive exhibits high thermal conductivity and low solubility in the selected dielectric fluid.

[0025] FIG. 1 illustrates a schematic diagram of an exemplary embodiment of a disclosed computing system. An embodiment of the disclosed system comprises a pressure control vessel (110) (or a computing system (110) to be cooled), a pressure controller (150), a submerged cooling system comprising at least a predetermined volume of dielectric fluid (140) and a condensation structure (130), and a desired computer component (170). The pressure system may be configured to maintain a desired degree of pressure reduction. The pressure control vessel (110) may be configured to maintain negative pressure while still allowing multiple penetrations into the pressure control vessel (110) for various connections, including, but not limited to, power, data, networking, cooling water, and / or communication systems. Some embodiments utilize sealed and / or marine-grade connections. Operating a computer system within a pressure control vessel (110) at a pressure below ambient pressure requires a series of modifications to the system as a whole. Such modifications are described below, some of which are readily understood by those skilled in the art.

[0026] FIG. 3 illustrates the outer portion of an exemplary embodiment of a pressure control vessel (110). In some embodiments, the disclosed pressure control vessel (110) is at least about 2 feet high, or at least about 3 feet high, or at least about 4 feet high, or at least about 5 feet high. In some embodiments, the pressure control vessel is about 3 feet or less high, or about 4 feet or less high, or about 5 feet or less high.

[0027] In certain embodiments, the pressure control vessel has an internal volume of at least about 100 cubic feet, or at least about 150 cubic feet, or at least about 200 cubic feet, or at least about 250 cubic feet, or at least about 300 cubic feet, or at least about 350 cubic feet, or at least about 400 cubic feet.

[0028] In some embodiments, the pressure control vessel will be configured to contain, during operation, about 12 vertical inches of liquid dielectric fluid and about 36 vertical inches of dielectric fluid vapor. In certain embodiments, the ratio of liquid volume to gas volume helps to generate convection and helps to direct the dielectric vapor toward a condensation structure, which converts the vapor back into liquid. In some embodiments, the pressure control vessel is configured to contain, during operation, a ratio of the volume of liquid dielectric fluid to the volume of gas dielectric fluid of about 1:6. In other embodiments, the pressure control vessel is configured to contain, during operation, a ratio of the volume of liquid dielectric fluid to the volume of gas dielectric fluid of about 1:3, or about 1:5, or about 1:8, or about 1:10, or about 1:15.

[0029] In one exemplary embodiment, the pressure management system may include a pressure controller (150). The pressure controller (150) may be a vacuum source, for example, the pressure controller (150) may be a vacuum pump that can be connected to the pressure control vessel (110). In some embodiments, the vacuum pump (150) may be located at a remote location, and the vacuum may be delivered to the pressure control vessel (110) using piping and / or tubing. In a preferred embodiment, a pressure sensor (180) is housed within the pressure control vessel (110) and is used to regulate and / or maintain a desired negative pressure within the pressure control vessel (110). In some embodiments, the pressure sensor (180) and / or the pressure controller (190) are connected to a processor, and the processor monitors the pressure within the pressure control vessel (110) using the pressure sensor (180) and regulates the pressure using the pressure controller (190).

[0030] Some embodiments include an operator protection mechanism. In one exemplary embodiment, the operator protection mechanism may be a locking mechanism that prevents the system from operating when any cover or service panel for the pressure control vessel is not in place. In one exemplary embodiment, the operator protection mechanism may include a controller for immediately cutting off power to the system in the event of an unauthorized intrusion into one of the doors or panels of the pressure control vessel. In addition to providing life safety features, the operator protection mechanism may also provide enhanced operational security features for deployments in which sensitive data is housed within the vessel. A high level of assurance in the efficiency of the disk protection mechanism can be achieved by ensuring that the equipment cannot be accessed during normal operation without cutting off power to the system. Additionally, in some embodiments, the disk protection mechanism may utilize a runtime stored encryption key to protect data located in the pressure control vessel.

[0031] In certain embodiments, in addition to denying unsafe access to the pressure control vessel, sensors may be deployed to ensure that the system operates as designed. The primary sensor package may include a temperature sensor in the vapor space; a temperature sensor in the liquid space; a humidity sensor in the vapor space; and / or a pressure sensor in the vapor space. To ensure that the system operates in a safe and accurate manner, the readings of these sensors may be monitored by software and / or a human operator. In some embodiments, sensor data will be recorded or subsequently analyzed.

[0032] In some embodiments, additional sensors may be integrated within the vessel or the upper structure (as defined below). Such sensors may include, for example, a FLIR-based thermal imaging camera; a VESDA or other type of smoke inhalation detector; and / or a refrigerant leak detector designed to detect leakage of dielectric fluid into the surrounding environment.

[0033] In some embodiments, the vessel and / or upper structure may be equipped with an indicator light related to the operating state of the system.

[0034] Although the cooling computing system (110) is often referred to as a pressure controller system (110), those skilled in the art will understand that many or all of the benefits of the cooling computing system (110) can be realized without using a "pressure controller system."

[0035] Steam management system

[0036] Liquid immersion cooling systems can be operated in different ways. Some can be operated by directly and continuously cooling the immersion fluid. Others can be operated by allowing the liquid to reach its maximum liquid phase temperature and then boiling it into the vapor phase. An immersion cooling system operated by allowing the liquid to evaporate is referred to as a two-phase immersion cooling system. Two-phase immersion cooling systems often allow the dielectric fluid to boil and / or evaporate, and regularly add an additive fluid to replace the fluid lost to the atmosphere.

[0037] The disclosed embodiment utilizes a liquid immersion cooling system contained within a pressure control vessel (110). This has the advantage of no loss of the dielectric fluid (140) even after the dielectric fluid is converted into a gaseous form. Within a closed or substantially closed pressure control vessel (110), the gaseous dielectric fluid can be condensed and re-added to a bath (142) of liquid dielectric fluid (140) that is actively used to cool the computing component (170). The condensation step can be carried out in any convenient manner, for example, by moving the process water through a thermally conductive tube. The condensation structure (130) may include radiator fins and / or similar equipment that increase the surface area of ​​the condenser, thereby enabling more and / or faster condensation of the gaseous dielectric fluid and allowing it to be returned to a liquid form. In some embodiments, the process water is at ambient temperature and is not actively cooled. In other embodiments, the process water may be quenched using evaporative cooling, a dry cooling tower, and / or other methods of chilling process water known in the art.

[0038] In some embodiments, there may be two interfaces between the pressure control vessel and the external system. The first interface may be a process water supply interface. This may be a pipe that delivers process water from a facility providing quenched process water to a distribution manifold on the pressure control vessel. The second interface may be a process water return interface. This may be a pipe that returns process water to a facility providing quenched water. Process water may be returned to the facility after the process water has flowed through the pressure control vessel and the associated cooling components. The cooling components may include, for example, a condenser, a condensing coil, and / or a radiator within the vessel, as well as a coil that removes heat from any powered component, such as a motor, a pump, and / or a utility cabinet. In some embodiments, there may be two interfaces between the upper structure and the external system. Such interfaces may be similar or substantially similar to the two interfaces between the pressure control vessel and the external system.

[0039] In some embodiments, the position of the condensation structure (130) within the pressure control vessel (110) may be configured to optimize the flow of the vapor phase dielectric fluid and to increase the condensation rate and / or efficiency. In some embodiments, the geometry of the pressure control vessel (110) itself may be controlled to increase the rate and / or efficiency of condensation.

[0040] In one exemplary embodiment, the position of the condensation structure (130) can facilitate and optimize the placement (e.g. by a robot) of the computer component (170) within the container (or removal of the computer component (170) from the container). For example, the condensation structure (130) may be positioned on the side (or side wall) of the container so that the condensation structure (130) is not located between the lid of the container and the computer component (170). Thus, when the lid is opened, the robot can directly remove the computer (170) without any interference with the condensation structure (130). This arrangement of the condensation structure can rationalize the placement and removal of the computer component (170) and thereby provide significant advantages in the autonomous operation of the container. In one exemplary embodiment, the condensation structure (130) may be positioned on a shelf within the container.

[0041] As illustrated in FIGS. 1 through 3, in one exemplary embodiment, the pressure control vessel is about 10 feet long, about 4 feet wide, and about 4 feet high. The bath (142) is about 130 gallons A dielectric fluid (140) may be generated within the pressure control vessel (110). This leaves a layer of liquid dielectric fluid about 12 inches deep within the immersion cooling tank at the bottom of the pressure control vessel, while most of the volume of the pressure control vessel is gas. The ceiling of the pressure control vessel is lower in the middle of the longitudinally extending structure. The ceiling and / or cover (120) is angled upward and rises as it approaches the side walls of the pressure control vessel (110). A condensation structure (130) extends longitudinally on two sides of the pressure control vessel (110). In this exemplary embodiment, the condensation structure (130) is about 12 inches wide and about 24 inches high and extends substantially the entire length of the pressure control vessel (110). The condensation structure (130) comprises a radiator-like material having large surface area fins that are cooled using flowing process water. Some embodiments may additionally or alternatively include a heat exchanger.

[0042] As illustrated in FIG. 2, a structural arrangement within the pressure control vessel (110) directs the convective flow of the dielectric fluid vapor when it rises from the liquid bath (142) after boiling. The structural arrangement directs the convective flow upward toward the ceiling of the pressure control vessel, where the flow is directed toward a large surface area of ​​the condensation structure (130) and condensed back into liquid form. Subsequently, the dielectric fluid (140) flows back into the liquid bath (142). In this way, the total amount of dielectric fluid (140) can be preserved within this closed housing. Using convection to circulate the dielectric fluid vapor enables the disclosed embodiment to operate without a mechanical pump to circulate the dielectric liquid, thereby reducing the total energy consumption of the disclosed system.

[0043] Certain embodiments may utilize additional tanks and / or storage containers of dielectric fluid that can be used during system startup and / or shutdown to enable redundant and robust control of the level of the liquid dielectric fluid in cases where the pressure control vessel must be opened.

[0044] FIG. 11 illustrates an exemplary cooling and steam management system (600) for a pressure control vessel (110). In this exemplary embodiment, the cooling and steam management system (600) may include a quenched process water storage unit (611) that extends through a cooling coil (132) to cause condensation of the dielectric fluid (140). After passing through the cooling coil (132), the process water may proceed to a process water return storage unit (612). The cooling and steam management system (600) may also include a tank for a steam storage unit (614) and a tank for a dielectric fluid storage unit (615). The tanks (614 and 615) may provide the dielectric fluid or steam when necessary, for example, during system startup and / or shutdown. In one exemplary embodiment, the tanks (614 and 615) may be coupled through a condensation structure (616). In the event of an oversupply of steam in the tank (614), the condensation structure (616) can remove the steam and add it to the fluid storage tank (615) as a dielectric fluid.

[0045] In some embodiments, during operation, the pressure control vessel is maintained at about 3 psi lower than ambient atmospheric pressure, which helps to lower the boiling point of the dielectric fluid and thereby helps to lower the operating temperature of the computer chip and other components. In some embodiments, the pressure control vessel (110) is maintained at least about 2 psi lower than ambient pressure, or at least about 4 psi, or at least about 6 psi, or at least about 8 psi, or at least about 10 psi lower than ambient pressure.

[0046] In some embodiments, it may be necessary to select components having a certain tolerance for pressure fluctuations. It may be desirable to use components capable of withstanding a wide range of pressures so that the coolant boiling point and, consequently, the general operating temperature of the entire system can be manipulated by adjusting the operating pressure of the system. Considering the operating characteristics of the two-phase system, standard operating conditions for some embodiments may exhibit a variation between ±4 PSIg. Under certain conditions, such as during rapid startup or shutdown of the system, an additional difference of 3 PSIg may occur. In some embodiments, system level adjustments may be made to better control these variables and maintain them within a more controlled and defined range.

[0047] In a specific embodiment, the computer component (170) is operated at a pressure at least about 3% lower than the ambient pressure, or at least about 5% lower, or at least about 10% lower, or at least about 15% lower, or at least about 20% lower, or at least about 25% lower, or at least about 30% lower.

[0048] In some embodiments, the pressure control vessel is maintained during operation at less than about 750 torr, or less than about 710 torr, or less than about 650 torr, or less than about 600 torr, or less than about 550 torr, or less than about 500 torr, or less than about 450 torr, or less than about 400 torr. In some embodiments, the pressure control vessel is maintained during operation at more than about 650 torr, or more than about 600 torr, or more than about 550 torr, or more than about 500 torr, or more than about 450 torr, or more than about 400 torr, or more than about 300 torr.

[0049] Some embodiments utilize a vapor scrubbing process and / or an initial purging process to control the gaseous atmosphere within a pressure-controlled vessel. These processes remove a portion of the gaseous atmosphere from the pressure-controlled vessel and eliminate undesirable parts of the atmosphere, such as air and water vapor. These and other undesirable parts of the atmosphere can be separated based on the temperature at which the vapor condenses into a liquid. Due to the specific properties and boiling points of dielectric fluids, many naturally occurring contaminants can be removed using this method. Removing fluids that cannot be easily condensed helps maintain the purity of the dielectric fluid. A fluid will be considered as not easily condensed if, at standard atmospheric pressure, the condensation point of the fluid is less than about 20°C higher than the condensation point of the dielectric fluid, or if, at standard atmospheric pressure, the condensation point of the fluid is less than 10°C.

[0050] In order to reduce the amount of dielectric fluid lost when the pressure control vessel is opened and / or exposed to atmospheric conditions during maintenance, start and / or shutdown operations, a blanket of an inert gas, such as nitrogen gas, may be introduced into the pressure control vessel. As illustrated in FIG. 11, the cooling and steam management system (600) may include an inert gas tank (613) capable of supplying inert gas to reduce dielectric fluid loss.

[0051] Some disclosed embodiments may include substantially standalone server and / or computing systems. In some embodiments, special seals and / or connections may be used to reduce the total number of intrusions into the pressure control vessel (110). Some embodiments combine power, water, vacuum, and networking connections into a bundle of lines, thereby minimizing intrusions into the pressure control vessel and reducing the potential for leakage while the system is under vacuum.

[0052] FIG. 4 illustrates an exemplary embodiment of a superstructure comprising a plurality of pressure control vessels. In this exemplary embodiment, two pressure control vessels (110) are pre-piped, pre-wired, and housed within a modular signal superstructure (210). This allows the embodiment to be pre-manufactured and delivered as a substantially complete standalone system. The modular system may be configured to be connected to other modular embodiments of the disclosed computing system. In some embodiments, the modular superstructure (210) will require only a single power connection and will be pre-wired to a suitable electronic device to supply the required voltage to computer components and / or other electronic components.

[0053] FIG. 5 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected to a central power source. FIG. 6 illustrates an exemplary data center embodiment showing a plurality of pressure control vessels connected in series with one another. In these exemplary embodiments, the pressure control vessels (110) may or may not be placed within a higher structure.

[0054] FIGS. 7a through 7d illustrate exemplary embodiments of a cooling computing system having an inner robot arm, an airlock, and an outer robot arm. In these exemplary embodiments, a component (170) can be removed and the removed component can be transferred to an airlock (220) using an inner robot arm (230) housed within a pressure control vessel (110). By using the airlock (220), the component (170) can be removed without substantially collapsing the pressure, atmosphere, dielectric fluid, and / or other conditions within the pressure control vessel (110). Once the component (170) is removed from the pressure control vessel (110), a replacement component can be introduced into the pressure control vessel (110) using the airlock (220). Subsequently, the replacement component can be installed by the inner robot arm (230). The use of components that can be installed in a "slot-in" manner, such as blade servers and chassis, can significantly facilitate this process.

[0055] A breakdown of conditions within a pressure control vessel can be detected by a sensor, for example, a pressure sensor, placed within the pressure control vessel. Such a breakdown may be indicated by conditions deviating from the standard range of operating conditions by at least 10%. A significant breakdown of conditions within a pressure control vessel may be indicated by conditions deviating from the standard range of operating conditions by at least 30%.

[0056] In a specific embodiment, a standalone diagnostic program that analyzes the performance of a component within a pressure control vessel (110) may be operated. If the component (170) does not perform as desired, the component may be automatically removed and / or replaced using a robotic arm (230). In this way, a self-healing, standalone server and / or computing system may be created. In a specific embodiment, such a self-healing system may be pre-manufactured and pre-wired to create a modular unit that can be transported or delivered to a remote location using conventional methods to provide significantly high-efficiency computing power requiring limited setup and / or maintenance.

[0057] In some embodiments, the first steam management objective of cooling the steam and causing it to condense back from a gaseous state to a liquid state is achieved entirely within a closed system of the vessel through the use of a condensation coil. Process water will be piped through the condensation coil within the vessel. The shape and geometry of the vessel itself will facilitate the flow of steam from the bath area to the coil area, and gravity will serve to pull the re-condensed liquid back into the bath area.

[0058] In some embodiments, a second steam management objective for monitoring and maintaining the internal pressure of the vessel is achieved through the use of an integrated pressure sensor within the vessel and a purge system. In some embodiments, the purge system will be used to remove excess steam from the vessel and to condense it back into a liquid for storage in a liquid storage tank.

[0059] In some embodiments, a third steam management objective for controlling and removing non-condensable components of steam present during system startup is achieved through the same mechanism as in the second objective. A purge system may be used to cause the system to become underpressurized during the initial startup of the system and to remove any non-condensable gas from the system.

[0060] In some embodiments, a fourth vapor management objective for controlling the inert gas overlay can be achieved using a dedicated nitrogen overlay supply system. This overlay allows the coolant to be retained below the top of the vessel, thereby minimizing the loss of coolant during the period the vessel is open to service internal components. Dedicated piping from a set of nitrogen storage tanks through a set of dedicated overlay pipes within the vessel will enable the addition of the inert overlay when the operator intends to open the system. This gas, along with any other non-condensables, can be removed during a non-condensable removal process that may be performed at system startup. The overlay vapor management process can be managed and monitored via control system software based on user commands and system status monitoring.

[0061] Ballast Block

[0062] In some embodiments of the disclosed system as illustrated in FIG. 1, the pressure control vessel (110) may include a deeper bath section (142) for accommodating most of the dielectric fluid (140) and a wider shelf area (112) adjacent to the bath. A board, card, chip, blade, and / or any other computer component (170) is substantially accommodated within the deeper bath section (142) of the pressure control vessel (110). The wider shelf area (112) may also accommodate liquid dielectric fluid (140) and / or collect dielectric fluid (140) that has been re-condensed from the vapor phase into the liquid phase. In certain embodiments, the depth of the dielectric fluid within the pressure control vessel (110) may be increased using a ballast block (160). By using a ballast block (160), any undesirable volume on the shelf can be occupied, thereby displaced any dielectric fluid (140) that may be on the shelf (112), and the level of the liquid can be raised without the need to add additional dielectric liquid (140). In some embodiments, the ballast block (160) includes riser feet (161), such riser feet allow the fluid to flow under the ballast block (160), thereby allowing the condensed liquid to continue flowing into a deeper bath portion of the pressure control vessel without the flow being obstructed by the ballast block (160).

[0063] The ballast block (160) may be manufactured from any material that does not interfere with the operation of the disclosed immersion cooling system. The ballast block may be manufactured from a material including, but not limited to, metal, rubber, silicone, and / or polymer. Preferred materials do not substantially dissolve in the dielectric fluid. The block must be denser than the dielectric fluid, but does not need to be solid. In a preferred embodiment, the block will have a handle or cut out that allows the block to be handled and manipulated more easily. Some embodiments of the ballast block (160) utilize interlocking top and bottom sections that allow the blocks to be stacked on top of each other in a secure manner. The interlocking top and bottom sections reduce the risk of the block damaging any nearby components if the block slides or otherwise displaces from its intended position. In some embodiments, the interlocking top portion includes a recess that aligns with a pit and / or rise portion on the bottom portion so that the bottom block does not obstruct fluid flow and the block can be securely stacked on the top portion of the bottom block to occupy a substantial volume, thereby allowing the level of the dielectric liquid to be raised without the need to add a substantial amount of additional dielectric liquid.

[0064] In some embodiments, the ballast block (160) is configured to extend along the entire length of the pressure control vessel (110) and / or shelf (112). In other embodiments, the ballast block (160) may have substantially any size that allows the block to be handled. In such embodiments, a number of modular ballast blocks may be configured to displace a large or small volume as desired. In some embodiments, a single ballast block has external dimensions of about 2 feet in length, about 3 feet in length, or about 4 feet in length or more, and about 6 inches in width, or about 8 inches in width, or about 12 inches in width or more, and about 1 inch in height, or about 3 inches in height, or about 6 inches in height, or about 8 inches in height, or more than 8 inches in height.

[0065] Upper structure

[0066] The disclosed computing system is composed of several components, all of which may be attached directly or indirectly to a physical superstructure (210) as illustrated in FIG. 4. The superstructure (210) enables pre-wired and pre-piped connections of any required electrical systems, sensor systems, control systems, power systems, fluid control systems, pressure control systems, and / or communication systems. This enables faster and simpler deployment in the field and allows for testing in the factory before delivery to the customer.

[0067] The upper structure (210) is typically manufactured from metal components and may be a skid mounted or configured to be handled by a forklift, hoist, or crane. In some embodiments, the upper structure (210) is configured to fit within a standard container to aid in transport. The upper structure (210) and associated components may be configured to have a total weight of less than about 58,000 lbs and may be divided into smaller sub-components to aid in transport without special equipment. In some embodiments, the upper structure (210) and associated components will have a weight of less than about 50,000 lbs, or less than about 40,000 lbs, or less than about 30,000 lbs, or less than about 20,000 lbs. In some embodiments, the upper structure (210) and associated components will have a weight of approximately 5,000 lbs or more, or approximately 10,000 lbs or more, or approximately 20,000 lbs or more, or approximately 30,000 lbs or more. Embodiments of the upper structure (210) may have any size and / or shape. Many embodiments are large enough to accommodate a number of pressure control vessels (110), server racks (310), and associated liquid immersion cooling equipment, as well as necessary equipment for managing power transmission and distribution and network connectivity.

[0068] By adjusting the overall design of the upper structure (210), it is possible to accommodate the specific characteristics of each deployment, including customizing the type and amount of power and process water interconnects to meet the needs of the existing facilities.

[0069] A control and management system for all components within the disclosed pressure control vessel may be included as part of the disclosed computing system. A preferred embodiment of the disclosed system includes all mechanical systems necessary to maintain and operate a two-phase liquid immersion cooling environment, including necessary pumps, valves, regulators, a steam management system, a pressure management system, and other associated components.

[0070] The upper structure (210) may be an open frame design or may include side panels and access doors. This allows it to be deployed within or outside an existing structure at a site location. The upper structure (210) may be modified to include weathering features so that it can be deployed in harsh environments. In some embodiments, the upper structure may be a skid / module framework.

[0071] Various systems, features and / or capabilities may be integrated into the upper structure (210) to support, monitor, and manage other components of the pressure control vessel and any environment contained within or associated with the pressure control vessel. In some embodiments, such systems may include, among many others, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental management capabilities, security features such as access control, and / or surveillance features.

[0072] Power system

[0073] Some embodiments of the upper structure (210) are designed to accommodate various electrical input means and to connect them to an existing power distribution system installed within the upper structure. One of many exemplary embodiments includes a 415V input to a main breaker, which then distributes the 415V AC input to a series of power shelves that convert the 415V AC input to a 12V DC output. In a preferred embodiment, this conversion is performed substantially in a single conversion step, thereby reducing the loss efficiency typically associated with such conversion. A typical computer server location typically converts incoming industrial electricity from a high AC voltage, such as 415V, to a reduced AC voltage, such as 120V. This conversion results in energy loss as heat. Under normal circumstances, this can result in an energy loss of about 6%. Subsequently, the 120V electricity must be further converted into DC current for use by various computer components. This second conversion results in a second energy loss as heat of about 6%. By directly converting industrial electricity of about 415V to about 12V DC, energy loss as heat can be reduced.

[0074] Another exemplary embodiment may include a connection to a power shelf with a 480V AC input, such a power shelf converts the 480V AC input into a 48V DC output, which is then distributed to a series of intermediate power sources that convert the 48V DC input into various DC outputs, including, for example, 12V, 5V, 3.5V, 3.3V, and others.

[0075] In some embodiments, there may be a single set of power supplies, or multiple power supplies operating at different input and output voltages. The exact configuration will be adjusted to meet the needs of the specific equipment being installed and the conditions of the application example. The specific design of the power system can be adjusted to meet the needs of the specific environment in which the disclosed computing system is deployed. Customization may include the type, capacity, and interface for both the input and output of power to the system.

[0076] In some embodiments, the rack power distribution system may include a modular power system and / or a set of modular power systems. The specific configuration of the modular power system or the systems is not particularly important as long as it can deliver the desired amount and type of power to the rack. Accordingly, the modular power systems may be configured in parallel, in series, or in combination thereof to provide one or more multiple power distribution paths. The specific path to the rack may be direct or indirect and may often depend on the components involved, the amount and type of power, and / or the desired configuration. If desired, the path to the rack may include distributing power to a chassis located within the rack. The distributed power may be delivered at one or more desired voltages, which may vary depending on the configuration and components. In some cases, the desired voltage may include, for example, 12V, 5V, and / or 3.5V. In some embodiments, where a chassis is used, it may utilize one or more subsystems. Such a subsystem may include any desired subsystem that does not interfere with the desired amount and type of power to be delivered to the rack. However, as an example, a power-on-package subsystem may be used. Such a package may, if desired, accept AC current and convert it to DC current, and / or convert it to the opposite. For example, a particularly useful power-on-package subsystem may be designed to accept input power of 208, 240, 380, 400, 415, 480, and / or 600 volts AC and to convert it directly to DC power, e.g., 48V DC.

[0077] Modular power systems or systems may be powered directly or indirectly in any convenient manner. For example, a modular power system may be powered directly through a primary electrical distribution system within the chassis. Depending on the type and amount of power and other components, the chassis may establish electrical continuity between the power distribution path and the chassis itself using an interface, for example, a set of spring-loaded pins or other suitable connector interfaces. Subsequently, continuity may be established between the corresponding interface connector and any desired power input interface on a desired server or other computing component located in the chassis. In some embodiments, power-on-package modules may be utilized within each chassis to convert the voltage directly to an appropriate level within the chassis itself. This may be used for various types of power distribution, but may be particularly useful, for example, in 48V distribution. FIG. 17 illustrates an exemplary embodiment of a rack power distribution system (950). In this exemplary embodiment, the rack (310) can receive an AC input (960) from the AC interface (311) of the rack (310). The power distribution system (950) can generate a DC output (320) and distribute the DC output (320) to one or more chassis (400).

[0078] In some embodiments, the primary concern is to ensure reliable power supply to computer components within the rack. To this end, some embodiments utilize blade-level power or computer component-level power that can supply a specific input voltage and provide the required output voltage to the blade and / or component-level power. Some embodiments integrate multiple power sources within each blade to provide redundancy.

[0079] In some embodiments, one or more switches may require power. An exemplary switch may be a standard data center-grade switch equipped with a suitable interface for connecting to a backplane and for providing rack-level communication to each blade. Some embodiments distribute only a single voltage, which may be achieved by an interface system and a power rail having a connector for delivering voltage directly to the power input rail or via an intermediate connector, so as to be positioned between the power lead and the rack-level voltage distribution system, acting as an interface between the power rail and each blade.

[0080] In some embodiments, there may be one or more power rails that distribute primary voltage along the bottom of the rack. These rails may be supplied from one or more primary power rectifiers, similarly located outside the pressure control vessel, and delivered to each rack via a cable or busbar system. At this level, using a higher voltage, e.g. 48 volts, can reduce the required current transfer capacity of the distribution system and allow for efficient interfacing between the distribution rail(s) and the load interface.

[0081] In some embodiments, there will be two primary power distribution systems located within the upper structure platform. The first is the Primary Equipment Power System (PEPS) and the second is the Secondary Equipment Power System (SEPS). The purpose of the PEPS is to provide electrical service to the components within the vessel. This system may be a high-voltage, high-current distribution system that accepts inputs through copper conductors or busbar systems and delivers them to the primary power source, which is responsible for providing operating current to the chassis, computer components, and / or other critical load equipment. Power will enter the upper structure at a designated point and terminate at a master service disconnect breaker. All power redundancy components used within the electrical service and system will be located upstream of this point. This input will be a high voltage, such as, for example, 415 or 480 volts AC. The primary equipment load will be driven by a power source or rectifier supplied from a breaker panel downstream of the master disconnect breaker.

[0082] The purpose of the SEPS is to provide electrical service to all infrastructure support systems and components located within the upper structure. As components required as part of the secondary equipment infrastructure can anticipate low input voltages, the SEPS may be powered by a step-down transformer connected upstream of the PEPS master service isolation breaker via secondary service isolation.

[0083] This arrangement will enable the upper structural support and infrastructure system, including all applicable components powered by the SEPS, to be turned on and operated without delivering primary power to the rest of the system components. All aspects of the management and control system, as well as the steam control system, will be able to operate independently of the operation of the PEPS.

[0084] In some embodiments, an uninterruptible power supply (UPS) is included as part of or in addition to the power distribution system. Including the UPS enables the disclosed computing system to operate continuously even in the event of a temporary interruption to the external power supply.

[0085] Components of the disclosed power distribution system may include, but are not limited to, commercially available components such as uninterruptible power supplies, DC power systems, AC power systems, and / or power control and monitoring systems. Some such components may include, but are not limited to, Vertiv products such as Liebert and / or Chloride UPS products, dual-conversion online UPSs, line-interactive UPSs, standby UPSs, lithium-ion battery UPSs, and combinations thereof. UPS products may be single-phase or three-phase. Other exemplary power distribution system components may include, for example, Emerson Network Power products, NetSure DC power systems, Vertiv, Liebert, Chloride, and / or NetSure power distribution units, and related components such as, for example, inverters, rectifiers, transfer switches, and combinations thereof. Commercially available monitoring units, controller units, and / or software associated with such components may also be integrated into a particular disclosed embodiment.

[0086] Pressure control vessels and pressure management systems

[0087] An embodiment of the disclosed system includes a pressure control vessel designed to accommodate a two-phase liquid immersion cooling system. The pressure control vessel (110) accommodates a bath (142) of dielectric cooling fluid (140), a condenser (130) equipped with a cooling coil (132) for condensing the gaseous dielectric fluid into a liquid, and a physical mechanism and / or equipment necessary to maintain computer components (170) and distribute power from a power system to equipment and components located within the pressure control vessel (110).

[0088] During operation, the pressure control vessel (110) may be maintained at a slight vacuum. It will be understood that in order to operate a computing system within a pressure control vessel (110) maintained at negative pressure, various special connections and considerations must be taken into account.

[0089] Some embodiments of the disclosed system utilize a series of optical fiber Media Transfer Protocol (MTP) interfaces that allow fiber connectivity into a pressure control vessel (110) in addition to exiting panels and cable trays to distribute fibers to racks (310). This arrangement reduces the total number of penetrations into the pressure control vessel (110) and, consequently, lowers the possibility of leakage within the vessel.

[0090] Some embodiments of the pressure control vessel (110) include sensors to ensure safe operation. These sensors may include, without limitation, a temperature sensor, a fluid level sensor, a pressure sensor (180), a gas partial pressure sensor, a position sensor, an electric sensor, a microphone, and / or a camera to ensure and / or automate the operation of the system.

[0091] In one exemplary embodiment, the temperature sensor may include, without limitation, a sensor for measuring the temperature of a gas phase within a pressure control vessel (110), a sensor for measuring the temperature of a liquid phase within a pressure control vessel, a sensor for measuring the temperature of water and / or other process fluids, and / or a sensor for measuring the temperature of other components including a computer component (170). In some embodiments, the temperature of the computer component may be measured using a thermocouple, a thermistor, and / or a silicon sensor. In some embodiments, the system may rely on information provided by the component itself and retrieved or monitored through the use of a generally accepted communication protocol, such as a device-provided API, or other programmatic interfaces such as JSON via HTTPT or SNMP, to determine the equipment temperature.

[0092] Some embodiments may include various life safety features to ensure user safety. These features may include, but are not limited to, automatic electromagnetic locking mechanisms, fail-safe systems, fire and / or smoke detection and / or suppression systems, ventilation systems, and / or backup lighting. In certain embodiments, these features may be included as part of a comprehensive platform.

[0093] A specific embodiment includes automatic vapor detection based on a leak detection system to ensure that any fluid loss within a pressure control vessel is quickly detected. Such a system may include a pressure sensor (180) within a pressure control vessel (110) that monitors pressure to ensure there is no actual leak, and / or a gas sensor placed outside the pressure control vessel that detects the presence of any dielectric vapor that may leak outside the pressure control vessel.

[0094] The specific design, arrangement, and / or layout of an embodiment of the disclosed system may be adjusted based on the conditions under which such system is deployed. In some embodiments, the size, material, internal system, component mounting and configuration options, and interfaces between the pressure control vessel (110), computer components (170), and power system may all be adjusted based on the conditions under which the system is used.

[0095] Rack system

[0096] FIGS. 8a through 8c illustrate exemplary embodiments of a rack system (310) (or rack (310)). The rack (310) may serve as an intermediary between an electrical and communication system installed within a pressure control vessel (110) and computing equipment (170) installed within the rack (310). To control the spacing, orientation, position, and / or configuration of the computer components (170) within the pressure control vessel (110), the computer components (170) may be mounted on the rack (310). In one exemplary embodiment, each computer component (170) may be installed within a chassis (400) before being mounted on the pressure control vessel (110).

[0097] The rack (310) may be any physical structure that can be used to mount computer components (170), including, but not limited to, any frame, bracket, support, or other structure. Computer components (170) will be considered mounted on the rack (310) when they are attached directly or indirectly to the rack (310) and maintained in a substantially stationary position. Some embodiments may include using a dedicated mechanical guide plate, as a wiring harness attached to a bulkhead fitting, and / or using an intermediate power source and backplane receiver (331) to distribute power and signals within the rack.

[0098] A specific design of the rack system (310) may be adjusted based on the conditions under which the system is deployed. Some embodiments of the rack (310) may include a dedicated switch. In some embodiments, uplink interfaces may be connected to the computing equipment (170) in the rack via a fiber infrastructure and / or downlink access interfaces via a backplane receiver (331) interface or any other suitable computing equipment connection method.

[0099] In a specific embodiment, the rack system (310) may include a housing for one or more intermediate power sources capable of distributing an appropriate voltage from a power interface to other equipment installed within the rack (310). An interface for interconnecting power from the distribution system to the intermediate power sources may be integrated into the design of the rack (310) and, accordingly, may be eliminated by isolating the interface between the various rack, power, and communication systems and / or replaced by an alternative rack configuration.

[0100] FIG. 8a illustrates a top view of a rack (310). In this exemplary embodiment, the rack (310) includes an AC interface (311) and a data interface (312). The rack (310) also includes a pair of power sources, a power source (313) and a redundant power source (314) (or backup power source). The rack (310) may also include a rectifier and a controller. The redundant power source (314) (and / or the rectifier and controller) allows the rack (310) to be repaired quickly or to continue functioning even if the primary power source is deactivated. The rack (310) may optionally include a converter (315). The rack (310) is configured to accommodate a plurality of chassis (400) and to hold the chassis (400) in a substantially stationary position.

[0101] In some embodiments, the entire rack (310) may be submerged in a dielectric fluid. This may include submerging a rectifier, power connection, and / or data connection in the dielectric fluid during operation. In some embodiments, plastic insulation and / or cable shielding may be removed to reduce and / or prevent plastic contamination of the dielectric fluid. In some embodiments, the dielectric fluid may serve to insulate otherwise exposed cables and / or connections.

[0102] FIG. 8b illustrates a perspective view of a rack (310) comprising a plurality of chassis (400). The disclosed configuration of the rack facilitates excellent hot swappability of the chassis (400). In this exemplary embodiment, the rack (310) may include a plurality of AC cables (318) connecting an AC interface (311) to a power source (313) and / or a redundant power source (314). The power source (313) and / or the redundant power source (314) may generate a DC output (320) that can be delivered to a backplane receiver (331) via a DC cable (321). The rack (310) may also include a plurality of data cables (319) connecting a data interface (312) to a backplane receiver (331). The backplane receiver (331) may be used to supply data from a data connection on the lower part of the chassis (400) to a data connection located on the upper part of the rack.

[0103] FIG. 8c illustrates a side view of the rack (310). In some embodiments, the rack (310) provides mechanical stabilization and / or housing for the chassis (400) and its components. Additionally, the rack (310) assists in routing power and data cables from the top of the rack (310), which is generally accessible within the container, to the bottom of the rack (310), where the cables are connected to the chassis (400).

[0104] Chassis and Interface System

[0105] In one exemplary embodiment, the purpose of the disclosed chassis system (400) is to serve as a standardized physical mediating component between a conventional and / or intentionally constructed computing component (170) and the disclosed rack system (310). In one exemplary embodiment, the purpose of the backplane receiver (331) is to provide a slot-in interface between the chassis (400) and the rack (310) to allow power and signal distribution between a power source in the power system and a network switch in the communication system with the various computing components (170) installed in the chassis (400).

[0106] In some embodiments, the pressure control vessel of the present disclosure may include at least one rack (310) that may include one or more servers, e.g., blade servers. Each server may be attached to a chassis (400) (also referred to as a server case or case). FIGS. 9a through 9g illustrate exemplary embodiments of a chassis (400) for mounting various components (170). The chassis may facilitate installing the server on the rack of the pressure control vessel or removing it from the system. In some embodiments, other electronic components of the pressure control vessel may be mounted within the chassis. For example, any part of computer components or hardware, e.g., a motherboard, chip, card, GPU, or CPU, may be mounted within the chassis. As another example, components such as a power supply, a power interface, or a network communication interface may be mounted within the chassis.

[0107] In one exemplary embodiment, the chassis can serve as a common interface between a component (e.g., a server) and a pressure control vessel. The chassis can provide various mounting, power, and connectivity features that can be customized based on the characteristics or design of the component. In other words, various aspects of the chassis can be modified based on the design specifications of the component. Thus, the chassis can accommodate almost any model or type of hardware. For example, the chassis can facilitate the use of specially designed hardware or off-the-shelf hardware.

[0108] An embodiment of the chassis (400) may include components designed to allow the application of existing commercial components, the use of customer-designed components, and / or the use of a special chassis for special applications. An embodiment may include a standard motherboard and an adaptation kit for special components. In certain embodiments, such components include a Gigabyte motherboard with an NVidia GPU and / or a Supermicro motherboard with an Intel CPU.

[0109] FIG. 9a illustrates a chassis (400) for mounting a server in a rack according to an exemplary embodiment. In this exemplary embodiment, the chassis (400) may be a rectangular box comprising a rear wall (410) and two side walls (420). The rear wall (410) may include a plurality of holes (411) to facilitate fluid circulation within the chassis (400). The chassis (400) may include guide rails (421) on each of the side walls (420).

[0110] FIG. 9b illustrates a plurality of components inside a chassis (400) according to an exemplary embodiment. In this exemplary embodiment, the rear wall (410) is removed. Accordingly, FIG. 9b illustrates a server (430) comprising a power module (431), a GPU module (432), a CPU module (433), and an interface card (434). In one exemplary embodiment, the components inside the chassis (400) may include components used in a blade server, such as a CPU module (433) and a GPU module (432). Additionally, the components inside the chassis (400) may include other components not typically included in a server, such as a power module (431) or an interface card (434). Since the chassis (400) does not require conventional air cooling equipment, the chassis (400) does not include any fans or heat sinks inside the chassis. Therefore, the chassis has a very thin profile relative to the computing power of the chassis.

[0111] FIG. 9c illustrates a schematic diagram of the components within the chassis. In this exemplary embodiment, a server motherboard (445), a plurality of power modules (431), and an interface card (434) are mounted on the chassis (400). Storage devices and / or other peripheral components may also be mounted on the chassis (400) together with the backplane interface (330) and / or power modules and communication system modules.

[0112] In one example, a mounting interface may be added to or removed from the chassis so that a piece of hardware is secured to the chassis. On the inner surface of the chassis (400), a provision may be made that allows a component (e.g., motherboard, GPU, CPU, interface card, and other related components) to be mounted to the chassis. This provision is a mounting interface. A specific arrangement of the chassis system (400) may vary depending on the equipment and / or components to be attached to the chassis (400) and / or rack. Some embodiments of the chassis (400) may feature interchangeable mounting plates that can be used for equipment attachment. A set of standard mounting plates may be used for common or frequently used components.

[0113] The style or form factor of the power and network interface modules within the chassis system (400) may be adjusted based on the needs and requirements regarding specific components and / or user-specific equipment. In one example, the power subsystem of the chassis may be modified to address the needs regarding specific components. In another example, the size of the chassis may be designed to accommodate a piece of hardware of any size. In yet another example, the chassis may provide different networking options depending on the network connection card installed in the chassis. Due to these and other features of the chassis, the chassis can accommodate various components. Consequently, the assembly or removal of these components of the pressure control vessel can be simplified and, accordingly, automated. For example, the chassis may include a blade server, and a robot can easily install the chassis into or remove it from the rack of the pressure control vessel. Thus, the robot can remove and replace the blade server without any human intervention, thereby minimizing human exposure to the dielectric fluid.

[0114] In one exemplary embodiment, the chassis may include a microcontroller capable of communicating with a management system of a pressure-controlled vessel. The microcontroller may receive sensor data from various sensors positioned inside or outside the chassis. For example, the chassis may include a sensor for detecting whether the chassis is properly positioned within a rack. If a server can be connected to a rack, the server is properly positioned within the rack. The sensor may determine whether the chassis is properly positioned within the rack. Accordingly, the sensor may transmit data to the microcontroller, and using the data, the microcontroller may provide a signal to the management system indicating whether the chassis is properly positioned within the rack.

[0115] In one embodiment, the microcontroller may be coupled to a switch capable of turning on or off power to a component mounted within the chassis. The microcontroller may receive a power on or off signal from a management system, and in response to receiving such a signal, the microcontroller may transmit a signal to the switch to turn on or off power to a component, for example, a server. In one exemplary embodiment, the microcontroller may receive operational data from the server, and the microcontroller may relay this data to the management system. The operational data is a key performance indicator of the server and may represent its performance. The operational data may include the speed of the computer, degradation of the computer, power consumption, circuit temperature, and system bandwidth.

[0116] In one exemplary embodiment, a microcontroller can monitor, manage, and control the electrical and telecommunications facilities of a blade server. For example, by monitoring indicators such as electrical current (i.e., amperage) and voltage, it ensures that the system can protect itself, for example, by ensuring that no over-current or under-current is provided.

[0117] In one exemplary embodiment, the chassis may include a structure that enables a robot to grasp and remove the chassis. For example, the chassis may have the shape of a rectangular box having a front section, a rear section, and side walls. The chassis may also include a top wall and a bottom wall. The top wall of the chassis may include a plate that can be coupled to a robot arm. When the plate is used, the robot arm can grasp the plate for unloading and other handling operations.

[0118] In one exemplary embodiment, the chassis may include mechanical guide rails and placement pins to ensure proper alignment and insertion of the chassis within the rack. The mechanical guide rails may be positioned on the side walls of the chassis.

[0119] In one exemplary embodiment, the chassis may include various features to facilitate fluid flow. For example, the chassis may have the shape of a rectangular box having a front section, a rear section, and side walls. The chassis may also include a top wall and a bottom wall. In this example, at least one of the walls of the chassis may include a fluid flow hole through the entire wall. For example, the rear wall may include a plurality of holes capable of facilitating fluid flow in and out of the chassis when the chassis is submerged in a liquid bath.

[0120] In one exemplary embodiment, the chassis may include an opening to ensure the drainage of all fluid within the chassis when the chassis is removed from the liquid bath. For example, to cool computer components held by a rack, the rack may be placed within the liquid bath. To remove the server, a robot may grasp the plate of the chassis and raise the chassis out of the rack (thereby removing the chassis from the liquid bath). When the chassis is removed from the liquid bath, a certain amount of fluid may remain within the chassis. The chassis may include a notch or drain in the bottom wall of the chassis to ensure that the fluid can escape even if the pressure control vessel is not perfectly flat. The notch or drain may be located at the corner of the bottom wall.

[0121] In one exemplary embodiment, the chassis may include a power interface and / or a communication interface. Such interfaces may electrically couple components mounted within the chassis to a rack and / or pressure control vessel. The power interface and / or communication interface may be located on the backplane. For example, a server mounted within the chassis may be connected to the chassis interfaces via various wires and cables. When the chassis is placed within a rack, the interface may be electrically coupled to another interface connected to the rack (i.e., backplane receiver) and / or the pressure control vessel. Electrical coupling between the two interfaces (e.g., backplane and backplane receiver) may provide power to the server and connect the server to a communication network inside or outside the pressure control vessel. Coupling between the two interfaces may occur automatically during the mechanical insertion of the chassis into the rack. Similarly, removal of the chassis from the rack may separate the server from the rack and / or pressure control vessel.

[0122] In some embodiments, providing standardized interconnectivity through the backplane interface (330) and the communication system interface can minimize the possibility of the data interface being incorrectly connected and reduce the need to troubleshoot connectivity issues.

[0123] In a specific embodiment, the chassis (400) will include a set of standard power and network interfaces. The network interface may be in the form of a Cat6A or Cat7 compatible RJ45 interface for connection to a 1G or 10G Ethernet interface on the equipment motherboard. In such an embodiment, the power interface may include a set of standard Molex-style connectors for connection to the standard motherboard and / or peripheral components.

[0124] In one exemplary embodiment, the pressure control vessel may include an internal database that stores information regarding components installed in the system. The internal database may be a repository of components installed in the pressure control vessel. For example, the internal database may store the manufacture and models of all servers and power supplies installed in the system. Because components of the system may be exchanged or replaced, for example by a robot, the management system can continuously track changes and update the information stored in the internal database. The pressure control vessel may be connected to an external database via a network.

[0125] In one exemplary embodiment, each chassis may be associated with a unique serial number, for example, displayed as a barcode on the chassis. When a component is placed within the chassis, the component's specifications (or the component's manufacture and model) may be associated with the unique serial number and stored in an external database. Subsequently, when the chassis is installed within a pressure control vessel, the pressure control vessel may retrieve the component by finding the unique serial number in the external database. For example, a robot arm may scan the barcode on the chassis, and a management system may use the barcode to search the external database. The management system may update an internal database using the information obtained from the external database. Similarly, when the chassis is removed from the pressure control vessel, a robot arm may scan the barcode associated with the chassis, and the management system may update the internal database to indicate that the component mounted on the chassis is no longer installed within the system.

[0126] In one exemplary embodiment, the chassis may include an RFID tag. The robot arm of the pressure control vessel may include a scanner capable of emitting radio frequencies to detect the RFID tag. When the robot arm handles the chassis, the robot arm can scan the RFID tag and provide a unique serial number to a management system to update an internal database.

[0127] In one exemplary embodiment, the chassis may include an identification plate that may include a user-specific asset identification number. This asset identification number may be stored in association with a component mounted within the chassis. In some embodiments, the identification plate may be a chip configured to store the asset identification number.

[0128] In one exemplary embodiment, the chassis may include a pump to improve fluid flow within the chassis. To maximize heat exchange between components within the chassis and a liquid bath, the chassis may include a pump capable of circulating fluid within the chassis and around the components. The pump may draw fluid from multiple conduits spread around the chassis and propel fluid out of the chassis, or vice versa.

[0129] In one exemplary embodiment, the chassis may include several conduits around the chassis to dry the chassis and the components mounted therein. When the chassis is pulled out of the liquid bath, a certain amount of liquid may remain in the chassis or the components inside it. The chassis may include several conduits capable of guiding a flow of gas within the chassis or around the components to facilitate the drying of the chassis and the components. In one exemplary embodiment, a pressure control vessel may expose the chassis to a flow of gas before delivering the chassis to a user. For example, the chassis may include an input pipe for receiving the flow of gas, and the pressure control vessel may provide the flow of gas through the input pipe.

[0130] FIG. 9d illustrates a bottom wall (415) of a chassis (400) according to an exemplary embodiment. In this exemplary embodiment, the bottom wall (415) may include a power interface (416) and a communication interface (417). FIG. 9d illustrates a guide rail (421) on a side wall (420) of the chassis (400).

[0131] FIG. 9e illustrates a top wall (425) of a chassis (400) according to an exemplary embodiment. In this exemplary embodiment, the top wall (425) may include a pair of plates (426) and handles (427). A robot arm can pick up the chassis (400) using the plates (426).

[0132] FIG. 9f illustrates a side wall (420) of a chassis (400) according to an exemplary embodiment. In this exemplary embodiment, the side wall (420) may include a guide rail (421). FIG. 9f also illustrates a rear wall (410), a handle (427), and a power interface (416).

[0133] FIG. 9g illustrates an exploded view of a bottom drain hole (450) of a chassis (400) according to an exemplary embodiment. In this exemplary embodiment, the bottom drain hole (450) may be positioned at the corners of the bottom wall (415), the side wall (420), and the rear wall (410).

[0134] FIGS. 10a through 10f illustrate exemplary embodiments of a pressure control vessel (500). In particular, FIG. 10a illustrates an exemplary embodiment of a vessel (500), for example, a 600 KW skid. The exemplary embodiment includes a modular skid. The vessel (500) may include a plurality of forklift tubes (514) that assist in moving and delivering the vessel (500) to a desired location. The vessel (500) may accommodate power and communication inputs (511) and process water from a process water pipe (512) with minimal penetration through the vessel itself. These connections may be positioned at the top of the vessel and thereby facilitate close packing of the modular vessel within the data center. In some embodiments, to accommodate vertical stacking of multiple modular vessels within the data center, the connections may be positioned at the front and / or side of the vessel. In some embodiments, the vessel may include vertical spacing that helps the vessels to be stacked vertically on top of each other. The vertical space may create additional space for connections, air flow, and / or insulation between the containers. By vertically stacking the containers, excellent power density can be achieved on a square foot basis. In some embodiments, the container (500) may include a power and communication box configured to accommodate an input (511) and distributed power and network connectivity throughout the container (500). The container (500) may include a sealing cover (515) that can facilitate the addition and / or removal of components to the container (500).

[0135] FIG. 10b illustrates another drawing of the container (500). In some embodiments, a stock of replacement components may be stored within the container (500) so that components can be replaced using a robotic system within the container without opening the container. The robotic system may be operated using a gantry motor (516). In such embodiments, when a component is destroyed or needs to be repaired, a replacement component is installed into the system, and the destroyed or otherwise removed component may be stored in the cassette until the cassette is fully filled. At the point of fullness, the cassette containing the removed component may be removed from the container, and a new cassette with a new replacement component may be inserted into the container for future use. In some embodiments, the disclosed container has a length of about 15 feet, a width of about 7 feet, and a height of about 10 feet. In some embodiments, the disclosed system may provide 600 kW of computing power within about 150 square feet.

[0136] In some embodiments, the vessel (500) may also include one or more bellows tanks (517). The bellows tanks (517) may be used to regulate pressure within the vessel. When the disclosed computing and / or cooling system is initially activated, the expanding dielectric fluid may be directed toward the bellows tanks, thereby preventing it from being lost to the environment and / or preventing pressure from accumulating within the vessel. In some embodiments, the bellows tanks (517) may be large enough to hold about twice the amount of liquid dielectric fluid within the vessel.

[0137] FIG. 10c illustrates a cross-sectional view of a vessel (500). The lower portion of the vessel (500) may include a rack (310) and / or a chassis (400) for housing computing components. Above the rack, a condenser coil (132) for cooling and condensing any dielectric vapor is located. Power may be distributed within the vessel using power bus bars (518). This allows power to be distributed to individual computing components in an excellent, interchangeable manner. The power bus bars (518) allow the vessel to receive external power using only one or a few intrusions through the vessel. This design simplifies the installation and operation of the vessel system. In some embodiments, each power bus bar may provide 600 amps for power to five racks. In such embodiments, there may be two sets of bus bars, one on each side of the vessel. In some embodiments, the bus bars do not include plastic insulation. Plastic may be considered a contaminant of some dielectric fluid and may generally be avoided in some embodiments.

[0138] In some embodiments, the vessel (500) may include a desiccant (519). In some embodiments, dielectric vapor may be removed from the head space of the vessel (500) and condensed in a manner that allows any non-condensable component to be removed from the dielectric fluid. Water will not condense under the same conditions as many dielectric fluids. Therefore, such a system may be used to remove water contaminants from the dielectric fluid.

[0139] In some embodiments, the vessel (500) may include a fluid filter (520), a fluid pipe (521), and a fluid pump (522). In some embodiments, the dielectric fluid may be added to the vessel in such a way that the liquid dielectric fluid flows out of the rack (310) and into the sump area (523). Subsequently, the fluid may be filtered using the fluid filter (520) and pumped out of the vessel using the fluid pump (522) and the fluid pipe (521). This system circulates fresh, filtered dielectric fluid through the vessel, and accordingly, the dielectric fluid may be reused to cool computing components.

[0140] FIG. 10d illustrates a cross-sectional view of a vessel (500). In this embodiment, the level of the liquid dielectric fluid may be maintained at a fluid level (524) higher than the height of the rack (310) and / or the computing components inside it. Consequently, the rack (310) and / or computing components may be submerged in the dielectric fluid. Above the fluid level (524), for example, up to a half level (525), there may be saturated dielectric vapor. In some embodiments, the saturated dielectric vapor is maintained below the half level (525), which may be about half the height of the condenser coil (132). Above the saturated vapor, in some embodiments, a head space may be located that may contain less dense dielectric vapor.

[0141] In the exemplary embodiment of FIG. 10d, the cooling coil (132) is positioned over the shelf area. Thus, when the robot (526) places or removes the chassis (400), the cooling coil (132) is not located within the path. This arrangement of the cooling coil (132) can streamline the placement and removal of the chassis (400) and thereby provide significant advantages in the autonomous operation of the container.

[0142] communication system

[0143] An embodiment of the disclosed communication system is designed to provide standardized layer 1 to 3 connectivity and management interfaces for equipment within or associated with the disclosed upper structure (210), pressure control vessel (110), and / or computing system.

[0144] In some embodiments, a series of MTP interfaces provides the ability to bring a number of high-density multimode fiber connections into a pressure control vessel (110). Once accommodated in the pressure control vessel (110), the fiber connections can be divided into individual switch-level connections using a set of dedicated breakout cables, a breakout interface, a patch panel, and / or a distribution patch panel for a rack (310).

[0145] Some embodiments of the disclosed system may include a dedicated fiber patch panel interface port in each rack (310), thereby enabling connection to an internally installed switch system via a short patch panel. In other embodiments, there may be a dedicated patch panel, or a set of patch panels, extending from each switch system to an MTP distribution interface.

[0146] In some embodiments, the interface between the switch system and the chassis (400) may be made through a backplane interface (330) and / or through some other mechanism that may or may not include the use of a backplane connector. In some embodiments, there may be no intermediate rack-level switch system. Such embodiments may use a set of centralized switches within the pressure control vessel (110) to connect to various computing devices located inside.

[0147] A typical interface between the switch system and the chassis (400) can be achieved using a patch panel that is attached to the rack (310) and wired to the backplane system (330) by a patch cable that connects the ports on the patch panel to the appropriate ports on the switch system.

[0148] In some embodiments, there may be a small (6U) rack rail area comprising a patch panel that interconnects communication system cabinets to MTP interfaces on each pressure control vessel (110), and a centralized communication system distribution switch that serves to interconnect switch systems to each other and / or the outside world. In such embodiments, the end-user or customer may choose to install their own routing gear within this space and provide external connectivity to it to serve as a connection point between the disclosed computing system and the outside world, or to operate fiber connectivity between the pressure control vessel (110) or the upper structure (210) and the existing network environment.

[0149] The access, communication, and / or networking components used in the embodiment of the communication system environment may be standard equipment or user-specific. The rack (310) and backplane interface (330) system may include the ability to replace the switch system located within each rack (310) by removing the existing switch, replacing it with any standard switch (e.g., a 1U switch), and re-wire the desired interface to the backplane network interface panel.

[0150] In a specific embodiment, a product designed to interface directly with the backplane system (330) may be used. Such a product may utilize a chassis (400) patch panel system and / or a direct electrical interface specifically designed to interconnect switch ports through a specially constructed internetworking interface, through a commercially available protocol, or through specifications for designing a network-level interconnectivity interface.

[0151] In some embodiments, the connectivity between each blade or chassis and the switch may include a plurality of interfaces. One interface may be a standard switch port, which may be a standard port available on commercially available switches. A common interface may be 1GBASE-T or 10GBASE-T, which enables the use of Cat6 or Cat7 twisted pair copper connections between the switch and the host device. Another interface may be a switch-to-backplane mediating device, which may consist of a patch panel equipped with a standard patch cable running from the standard switch port to the front side of the patch panel and a set of hard-wired connections from the rear side of the patch panel to the signal interface of the signal backplane. Alternatively, this may consist of a special cable and / or a standard RJ45 interface running from the switch port to the board to establish connectivity between the standard switch port and the backplane. Another interface may be an interface system signal backplane that distributes a signal path from the standard switch port along the printed circuit board (PCB). One or more of the signal paths may terminate at a connector on the PCB to which the signal backplane interface is to be connected. Another interface may be a chassis signal backplane interface. This may be a connector located on the chassis itself that pairs with a connector on the interface system signal backplane. This serves as an interface between the interface system signal backplane and the chassis itself. Another interface may be a chassis network interface. This may be a standard patch interface that allows the connection of a patch cable from the chassis network interface to an RJ45 interface on a server attached to the chassis.

[0152] Robot system

[0153] In some embodiments of the disclosed system, a potential method to address the need for excellent interchangeability of components within a pressure control vessel (110). The need for the ability to remotely remove and replace a faulty component (170) can be addressed through a robot.

[0154] Specific embodiments of the combination of the disclosed systems may include an internal robot arm (230) and / or an external robot arm (240). In some embodiments, for example, for cryptocurrency applications and / or specific high-performance computing environments, excellent interchangeability of components may not be required. In other hyperscale GPU and CPU environments, this may be a fundamental requirement. Embodiments of the disclosed robot system enable replacement of the chassis and / or other computer components without interruption of any other components. In some embodiments, a faulty card and / or component may be automatically and / or programmatically replaced and / or stored. This enables short and medium-term, fully isolated and autonomous operation of embodiments of the disclosed system.

[0155] The internal robot arm (230) mechanism is located within the pressure control vessel (110) environment. As illustrated in FIGS. 7a through 7d, in an exemplary embodiment, a removal sequence may be initiated when a card or component is not functioning properly. When the removal sequence is initiated, the internal arm (230) will remove the appropriate computer component (170) and / or associated chassis (400) from the rack (310), move it to the airlock (220) located within the pressure control vessel (110), and signal the completion of the removal sequence. Once this sequence is completed, the internal airlock door (222) will be closed, the airlock pressure will be equal to the pressure of the outside atmosphere, and the external airlock door (224) will be opened. Once the external door (224) is opened, the external robot arm (240) will remove the chassis (400) from the airlock (220) and place it into an empty storage slot.

[0156] In some embodiments, before the airlock (220) is opened to the external environment, the airlock (220) will be purged with nitrogen and / or other inert and / or non-condensable gas. In such embodiments, this has the effect of reducing or preventing the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, a one-way valve will be fitted to the airlock, in the inner portion, the outer portion, or both. In an embodiment having a one-way valve in both the inner and outer portions of the airlock, purging of the airlock will prevent cross-contamination of the external environment into the atmosphere inside the pressure control vessel (110) and will also prevent the loss of dielectric vapor.

[0157] When the card or component replacement sequence is initiated, the external robot arm (240) will remove the replacement component and / or chassis (400) from the storage slot and place such component into the airlock (220). Once completed, the external airlock door (224) will be closed, the airlock pressure will equalize with the pressure inside the pressure control vessel (110), and the internal door (222) will be opened. Once the internal door (222) is opened, the internal robot arm (230) will remove the chassis (400) from the airlock (220) and insert it into the appropriate rack (310).

[0158] When coupled with a remotely accessible management system, the internal and external robot arms (230 and 240) enable remote operation and management of a data center environment. This can reduce the need for human operators to remain available and reduce costs and / or downtime. In some embodiments, the external robot arm (240) is mounted on a movable base, thereby enabling a single external robot arm system to serve as a multi-inventory of the disclosed computing system.

[0159] When integrated with customer-developed workflow management systems and virtualization technologies, the disclosed robotic system enables the development of fully autonomous and self-healing data center solutions, which can provide the maximum level of system reliability.

[0160] In some embodiments, an asset tag and / or production batch code having a unique human and / or machine-readable serial number may be included in each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tag may include a printed barcode or QR code and may enable automatic part identification by an embodiment of the disclosed robotic system. The tag code may also be used in conjunction with a management software system to provide detailed component information related to inventory management and automation systems. The tag and any associated adhesive or other component are preferably manufactured from a material compatible with dielectric fluids. The tag is preferably located on the chassis within a spot where it can be read when the chassis is inserted into a rack. In some embodiments, a secondary or additional tag may be located on a different region of the chassis to assist in component identification and / or inventory management.

[0161] An embodiment of the disclosed robotic system allows any individual chassis to be temporarily removed and replaced, and this process is referred to as "re-seating." This is useful when it is determined that a hard power cycle of the component is required during troubleshooting. Re-seating achieves this by disconnecting all power, waiting a short time, and then reconnecting it.

[0162] Some embodiments allow individual cards and / or chassis to be removed from a pressure-controlled vessel through an airlock. In some embodiments, a robotic system will remove the chassis from its slot in the rack, move it to the airlock, and signal the completion of this task so that the airlock can be opened and the card and / or chassis can be removed. Some embodiments allow replacement components and / or chassis to be placed into a specific rack slot through the same airlock used for removal. In some embodiments, a robotic system will remove the chassis from the airlock, place it into a suitable rack slot, and signal the completion of this task.

[0163] Robot on the internal system

[0164] Embodiments of the disclosed system may include a "robot inside" robot system. In such embodiments, the pressure control vessel may be extended to accommodate a robot arm operating within the vessel. The vessel may also be arranged to accommodate the movement or transfer of computer components and / or chassis on a rack containing computer components being operated. It will be understood that the pressure control vessel may also be referred to as a tank, a pod, and / or a vacuum chamber. Alternatively, it will be understood that a specific component of the pressure control vessel may be referred to as a tank or a pod.

[0165] FIG. 10e illustrates an embodiment of the disclosed system having a gantry robot (526) configured to remove, replace, and / or install a computing component, for example, a chassis (400) of a rack (310). In some embodiments, the gantry robot (526) may also be configured to remove, replace, and / or install a DC rectifier and / or other components of a power distribution system. It will be understood that some embodiments of the disclosed computer components and power distribution components may be designed to be excellently interchangeable and may include handles or other features that facilitate handling by the gantry robot (526). In some embodiments, the gantry robot (526) is arranged to move in both the x and y directions and may drop in the z direction to remove and / or install a replacement component. In some embodiments, the gantry robot (526) includes a gripping tool for gripping the chassis (400) and / or power, for example, the gripping tool may grip a plate (426).

[0166] FIG. 10e illustrates a top cross-sectional view of an exemplary embodiment of the disclosed tank. In some embodiments, an array of racks (310) may be filled with chassis (400) and / or computing boards. In some embodiments, each chassis (400) may utilize about 6 kW of power, and each rack (310) may include 10 chassis. Thus, in an embodiment including 10 such racks (310), the vessel may utilize about 600 kW of power for computing purposes. In some embodiments, additional racks (310) and / or chassis (400) magazines (527) and DC power rectifiers may be stored within the vessel (500) to be used as replacement components, and / or space may be provided for storing components removed from the vessel (500).

[0167] Robot on the external system

[0168] FIGS. 12a through 12e illustrate other embodiments of the container. In particular, FIG. 12a illustrates an embodiment of the container (700) in which a gantry robot (526) is located outside a tank (710) that accommodates a chassis (400) and / or computing components. In this embodiment, the tank (710) may be small, but may need to be opened more frequently to allow the external gantry robot (526) to access the chassis (400) and / or power inside the tank (710). Additionally, replacement equipment may be stored and / or accommodated within a modular enclosure, such as a storage unit (716) located outside the tank (710). In some embodiments, the tank (710) may have a plurality of doors (711), thereby limiting the exposure of the interior of the tank (710) when a single door (711) is opened for the removal, installation, and / or replacement of a component or chassis (400). In such embodiments, to prevent the tank from being unnecessarily opened, a replacement component may be stored on the outside of the tank (710).

[0169] Additionally, the vessel (700) may include one or more transformers (712), electrical distribution panels (713), process water pipes (512), and electrical chases (714). The vessel (700) may also include a programmable logic controller (PLC) cabinet (715) for monitoring and controlling the status of various equipment within the vessel (700). The transformers (712), electrical distribution panels (713), process water pipes (512), electrical chases (714), and PLC cabinet (715) may be located on the outside of the tank (710).

[0170] FIG. 12b illustrates a cross-sectional view of a vessel (700) having a tank (710) accessible to an external gantry robot (526). In this exemplary embodiment, a condenser coil (132), a rack (310), and a bellows (717) are located within the tank (710). FIG. 12c illustrates a side view of a vessel (700) having a tank (710) with an external gantry robot and a plurality of doors (711). In this exemplary embodiment, the tank (710) includes a fluid pump for removing fluid from a sump area and sending fluid to a fluid filter (520) through a fluid pipe (521). The vessel (700) also includes a magazine (718) for storing replacement equipment. In this exemplary embodiment, the magazine (718) is located outside the tank (710). In some embodiments, to reduce the total volume of liquid dielectric fluid in the tank (710), a spacing member and / or ballast block (160) may be used.

[0171] FIG. 12d illustrates a rack (310) according to an exemplary embodiment. In some embodiments, a redundant power supply (314) may be positioned on the opposite side of the rack (310) adjacent to and opposite to the primary power supply (313). Additionally, power and / or data cables (318 and 319) may be routed in an alternative configuration to accommodate specific requirements of a particular deployment. In this exemplary embodiment, a backplane receiver (331) is positioned below the rack (310).

[0172] FIG. 12e illustrates an exemplary hinged door (711) that may be used in some alternative embodiments of the disclosed tank (710). In some embodiments, a sliding door may be used in contrast to a hinged door to reduce or prevent flow induction within the dielectric vapor. Slowly sliding the door open will disturb the dielectric vapor less than rotating the hinged door open and mixing the flow.

[0173] Management system

[0174] The management system is a web-based interface between the user of the disclosed computing system and the computing system itself. An embodiment of the management system provides an operational view of the computing system and enables the monitoring and management of various components, including the pressure control vessel (110), the robot system, the communication system, the power system, and / or all other systems and components. In one exemplary embodiment, the management system may be implemented within the PLC cabinet (715) of FIG. 12a. In another exemplary embodiment, the management system may be implemented within the power and communication box (513) of FIG. 10a. In each embodiment, the power management system may be implemented as a control device or other suitable device, for example, as a software program on a computer.

[0175] In a specific embodiment, a set of data points accessible via a simple network management protocol may be made available to the user of the management system, thereby enabling monitoring of key operation parameters through a third-party monitoring system. A full operation log may be maintained, and a chart may be provided for reviewing the user's operation condition data.

[0176] Regular maintenance of system components can be planned and maintained through a management system. Users can receive regular reminders for routine maintenance and are aware of such maintenance being performed within the interface. All of this data can be maintained as part of operation log information for historical operation review.

[0177] In some embodiments, operation functions may also be exposed through an API interface, thereby enabling remote program monitoring and management of the computing system and associated components. A full set of operation monitoring and warning functions may be included to notify the operator in the event of any occurrence.

[0178] A centralized server version or a hosting cloud-based management version of the management system may be used by customers with multiple pressure-controlled vessel computing systems. This provides the operator with a single programmatic and user-accessible interface for managing a fleet of pressure-controlled vessel computing systems.

[0179] In some embodiments, a software-based interface module enables interaction with a computing platform and a third-party management utility, such as Microsoft System Center and VMWare VCenter. User and API interfaces provided by the management system enable full interaction with the disclosed robot system, thereby enabling full remote and programmatic autonomous operation and management of the disclosed computing platform.

[0180] In some embodiments, the control system enables the coordination and control of operations, including temperature, pressure, flow rate, and / or power management. In some embodiments, the user authentication system enables multiple distinct users to authenticate to the system. Some embodiments include a role-based and / or element-based permission system. In such embodiments, an administrator can configure multiple roles to which users may be associated and / or apply specific permissions outside of a user's role assignment to individual users.

[0181] Some embodiments incorporate video management to provide the user with the ability to record and retrieve video feeds from a camera that may be located within the vessel and / or superstructure. In some embodiments, the camera may acquire visual data that can be analyzed by a processor. In such embodiments, the processor may utilize computer vision technology to control the operation of the vessel system, the robot system, and / or the superstructure system in response to the acquired visual data.

[0182] In some embodiments, the control system and software may be configured to generate reports related to the operation and status of the entire system and / or individual subsystems and / or components of the disclosed computing platform.

[0183] Exemplary combined system embodiments

[0184] It will be understood that the disclosed system may be used individually or in combination. There are numerous embodiments of combined computing systems that can be adapted to various use cases.

[0185] One exemplary embodiment is the Crypto Series. This is an ultra-high density embodiment of the disclosed technology utilizing intentionally constructed computing hardware, a rack (310) having guide plates and wiring harnesses designed for said hardware, a modified embodiment of the architecture of a communication system (360), and a 1 MW pressure control vessel (110) and a power distribution system. Typical users of such embodiments are people who wish to perform cryptocurrency mining or other ultra-high power density processes using custom computing components, or manufacturers of computing components who wish to develop full-range two-phase liquid immersion cooling systems that integrate their hardware.

[0186] Another exemplary embodiment is the GPU Series. This is an implementation of high-density GPU supercomputing of the disclosed technology. This implementation will enable the use of customer-manufactured chassis (400), rack (310), and backplane interface (330) technologies designed to integrate a motherboard from Gigabyte and a GPU from NVidia using NVidia NVLink technology to facilitate ultra-high-speed GPU-to-GPU communication. Typical users of this technology include general-purpose parallel processing applications that enable the use of GPU-based computing and memory capabilities, including graphics rendering, particle simulation, and general research activities.

[0187] Another exemplary embodiment is the CPU Series. This is an embodiment of high-density CPU computing of the disclosed technology. This embodiment will enable the use of a high-performance Supermicro-based motherboard, an Intel Xeon CPU, a high-speed network interface, high-speed memory, and solid-state storage for local storage. Typical users of this technology include data centers, enterprises, cloud / VPS hosting providers, and service providers that utilize high-performance computing for their own internal applications or to provide to third-party customers and other organizations.

[0188] Another exemplary embodiment includes the Edge Series. This is a scaled-down embodiment of the disclosed computing system, specifically designed for remote / field deployment or within or with conventional business and data center environments. This embodiment focuses on weather-resistant environments with full remote monitoring and management capabilities. Target users of this technology may be operators of field-deployed and distributed technology, such as network operators and other organizations with distributed field infrastructure, and operators of existing facilities who wish to augment their computing capabilities with minimal modifications to existing facilities or structures. This system may incorporate various improvements to external structures to simplify the connection of utility services, including electricity, water, and network connectivity to the system.

[0189] Standalone example

[0190] Some disclosed embodiments do not rely on an external water supply. Such embodiments may include a closed-loop chiller for cooling water or other fluids that can be circulated through a condenser as described above. Using a closed-loop chiller instead of an external supply of cooling water enables substantially independent embodiments.

[0191] FIG. 13 illustrates an example of a standalone vessel (750). An exemplary embodiment of FIG. 13 utilizes a skid-mounted closed-loop chiller (719) to allow coolant or other liquid to be used in a condenser within a pod or immersion tank (710). By utilizing a closed-loop chiller, the need for an external source of coolant can be eliminated, thereby resulting in a standalone data center solution that requires only an external source of power and network connectivity for full operation. The vessel (750) may also include bellows (717), a door (711), a gantry robot (526), ​​an electrical distribution panel (713), a PLC cabinet (715), and a magazine (718).

[0192] In some embodiments, the closed-loop chiller (719) may be a skid-mounted closed-loop chiller enclosed within the outer housing of a modular pressure-controlled vessel. In such embodiments, heat is transferred from the computer components to the dielectric liquid in the tank (710). This process converts the dielectric liquid into dielectric vapor as described above. The dielectric vapor rises within the tank (710) and is cooled by a condenser, thereby converting the dielectric vapor back into dielectric liquid. Subsequently, the heat transferred from the dielectric vapor to the condenser is transferred from the condenser to the refrigerant or condensing fluid in the condenser and then to the closed-loop chiller (719). In some embodiments, the chiller (719) removes heat from the refrigerant or condensing fluid using vapor compression, a compressor, an evaporator, a heat exchanger, or other closed-loop method for cooling the refrigerant or condensing fluid. The heat from the refrigerant or condensing fluid is finally dissipated through air cooling. In some embodiments, this results in a standalone, modular, air-cooled, two-phase liquid immersion computing system. The air cooling in some standalone embodiments is surprising, as the field of immersion cooling is generally known to be contrasted with air cooling, particularly air cooling of standalone devices.

[0193] Some disclosed embodiments may be provided in a form factor having a space-saving footprint. An exemplary embodiment comprises a single rack containing 10 blades or servers immersed in a dielectric liquid as described above. In some embodiments, each server may consume about 6 kW of power. Thus, some exemplary embodiments provide about 60 kW of computing power within a small footprint.

[0194] The exemplary embodiment illustrated in FIG. 13 is housed within a footprint of about 4 feet 2 inches deep, about 8 feet 8.5 inches wide, and about 8 feet 8 inches high. This exemplary embodiment includes about 60 kW of computer power as well as other operating components and systems and is housed within an area of ​​about 36.3 square feet. It will be understood that the operating components of the vessel may, without limitation, include tanks or pods containing dielectric fluid, condensers, power, and data connections for computer components. Such vessels may also include sensors, control equipment, power cabinets, bellows (717), vacuum systems, fluid filters, purge systems, and / or other components. Some standalone embodiments may include an external housing. In some embodiments, the external housing may surround the vessel, provide structural support, be skid-mounted, ventilate, be weather-resistant and / or waterproof, and / or be decorative. In some embodiments, the outer housing of the freestanding vessel may include a radiator coil, a fan grate, a heat transfer component, and / or an air-cooling component to facilitate the use of a closed-loop chiller.

[0195] In some embodiments, the standalone computing system provides computing power of at least about 1.5 kW per square foot, at least about 1.6 kW per square foot, at least about 1.65 kW per square foot, at least about 1.8 kW per square foot, at least about 2.0 kW per square foot, or at least about 3.0 kW per square foot. In some embodiments, the standalone computing system provides computing power of about 1.5 kW or less per square foot, about 1.6 kW or less per square foot, about 1.65 kW or less per square foot, about 1.8 kW or less per square foot, about 2.0 kW or less per square foot, or about 3.0 kW or less per square foot. It will be understood that the height of the standalone system can be adjusted and thereby provide more or less computing power within a given footprint.

[0196] It will be understood that in order to create various potential embodiments of various form factors, the dimensions, components, arrangements, and configurations of the disclosed exemplary embodiments may be modified, added, and / or subtracted.

[0197] In some embodiments, the standalone computing system may include a robotic system, such as a gantry robot (526), ​​configured to remove, replace, and / or install, for example, a blade server, power supply, or other components, such as a chassis (400). The standalone system may include an "inside robot" or "outside robot" system. In an embodiment having a small footprint, a small magazine (718) of replacement components may be used. In some embodiments, the magazine (718) of replacement components may be attached to the outside of the tank (710) as shown in FIG. 13. In some embodiments, the tank (710), rack, computer components, power supply, replacement magazine (718), and gantry robot (526) may be arranged so that the gantry robot (526) can remove, replace, and / or install components while moving substantially in only one direction. In cases where multiple components are arranged substantially linearly, the gantry robot (526) may be moved along a single axis to remove, replace, and / or install a desired component without moving in a second direction. It will be understood that in addition to moving along a single linear direction, the gantry robot (526) may raise and lower the component.

[0198] Using a small form factor, such as in the embodiment illustrated in FIG. 13, allows a standalone 2PLIC system to be easily transported. The integration of a closed-loop chiller (719) enables the 2-phase liquid immersion cooling system to be used in remote conditions where access to a substantial source of quenched water may not be available. Additionally, eliminating the need for external cooling water creates, in some embodiments, a standalone computing system requiring only two external connections, namely a power and a data connection.

[0199] In some embodiments, the computing system may be housed within an external housing as illustrated in FIG. 14. In some embodiments, the components schematically identified in FIG. 13 and / or disclosed herein may be housed within the external housing. In some embodiments, the volume of the external housing may be configured based on anticipated cooling requirements, the configuration of a closed-loop chiller and / or the environment in which the standalone computing system is expected to be deployed.

[0200] The disclosed standalone, self-healing, small form factor embodiments can be used as a standalone solution to provide substantial computing power in almost any location or environment. In some applications, multiple small computing systems may be placed in close proximity to each other and / or linked together to form a cluster. In some embodiments, the outer housing is arranged so that maintenance and / or service operations can be performed by accessing only one or two sides of the outer housing. This arrangement allows individual standalone computing systems to be placed at a reduced or minimal distance between each standalone system.

[0201] In one exemplary embodiment, a cluster of four exemplary standalone computing systems is strategically positioned to enable about 240 kW of standalone computing power within a footprint of about 140 square feet. In some embodiments, these units can communicate power and / or data with each other, thereby enabling the operation of a multi-unit cluster with only a single external power connection and a single data connection. In some embodiments, a data center may be constructed using a number of small computing systems or a number of clusters of such computing systems.

[0202] While some disclosed embodiments and / or the computing systems disclosed herein may be used in modern data centers and / or climate-controlled environments, some embodiments of the disclosed standalone computing systems may be deployed in remote locations and / or under harsh environmental conditions. In some embodiments, the external housing may be weather-resistant, waterproofed, and / or otherwise arranged to withstand exposure to harsh environments for extended periods. Some disclosed embodiments enable the rapid deployment of significant computing resources to remote or difficult locations. Some standalone embodiments may be arranged to operate in substantially any location with access to power and data connections. In some embodiments, an uninterruptible power supply and / or generator may be operably connected to the computing system to provide more reliable and consistent access to power.

[0203] Some disclosed standalone embodiments are designed to be stackable. Some stackable embodiments may be designed to have reduced height. Certain embodiments may have a height of about 5'5", a depth of 5'6", and a width of 9'. This can result in about 60 kW of computing power in a 42 square foot footprint. Such units can be stacked vertically to provide 120 kW of computing power within the same 42 square foot footprint.

[0204] Embodiments of the disclosed computing system can be stacked, and multiple stacks can be arranged adjacent to each other. This can reduce the need for corridor space between individual computing systems and thereby enable a higher overall power density within the data center.

[0205] Some embodiments may be designed to be fully operable and maintainable by accessing only one side of the standalone computing system. Such embodiments may be advantageous because they help to place the standalone systems very closely together. Additionally, in some standalone embodiments, the entire settling tank may be removed and / or replaced by accessing only one side of the device. In certain embodiments, the tank may be mounted individually as a modular and / or skid.

[0206] In some embodiments, standalone computing systems may be arranged vertically to utilize a smaller footprint. A vertical design embodiment of the disclosed system can provide about 60 kW of computing power within a footprint of about 22.9 square feet. As in some other disclosed embodiments, some vertically oriented standalone computing systems may be placed close together. Also, as described with some other embodiments, some vertically oriented standalone computing systems may be operated and maintained with access to only one side of the device. In some embodiments, the entire tank may be removed from the external housing and replaced. This arrangement enables rapid replacement of multiple blade servers and / or other computing components.

[0207] Movable embodiment

[0208] A standalone computing system that does not require an external source of cooling water enables new computing applications. In some embodiments, power may be supplied to the system using a generator, thereby eliminating the need to connect the system to an external and / or static power source. In some embodiments, the system may rely on wireless data communication.

[0209] In particular, in standalone embodiments that do not rely on static power or wired data communication, a fully portable computing system may be implemented. The disclosed embodiments include a vehicle-mounted standalone computing system that can be utilized to provide substantial computing power in almost any environment. In some embodiments, a truck-mounted wireless computing system may be carried within the wireless communication range of an existing or temporary network and may provide a substantial amount of computing power without significant setup or installation time.

[0210] Natural water examples

[0211] In some embodiments, the computing system may be arranged to be used on a boat, vessel, oil rig, floating platform, or other vessel or structure located in close proximity to the water stream. In such embodiments, a condenser used to convert dielectric vapor back into dielectric liquid as described herein may be cooled using water from the water stream. In one exemplary embodiment, the modular computing system may include a water intake, a water outlet, and a pump or impeller. The pump and / or impeller may cause water to flow from the water stream, through the condenser, and then back into the water stream. Some embodiments may include filters and / or process components designed to protect the condenser, piping, and other computing system components from potential contaminants within the water stream. In some embodiments, the condenser and other components are arranged to withstand prolonged contact with salty water, such as seawater, or brine.

[0212] Horizontal magazine exchange

[0213] In some embodiments, a magazine of replacement components may be stored outside the tank and within the external housing of the computing system. For example, replacement components such as chassis, servers, blades, and / or power components may be removed from the magazine and used to replace components within the tank. The magazine may be positioned on a platform configured to extend outside the external housing of the computing system so as to allow components to be replaced from the magazine.

[0214] In one non-limiting example, in the event of a malfunction of a blade server in a tank, a robotic arm can be used to extract the non-operating component from the tank and move the non-operating component to a storage slot in a magazine. Subsequently, the robotic arm can remove the functional blade server from the magazine and install it where the non-operating server was previously installed, thereby replacing the non-operating server with a new operational server.

[0215] Over time, the magazine will accumulate non-operating components that may have been replaced with new operating components to enable the robot system to continue long-term operation. In some embodiments, the magazine is positioned on a platform that may extend to the outside of an outer housing, thereby allowing an operator to access the magazine. In some embodiments, the platform is configured to rotate the magazine from a substantially vertical position to a substantially horizontal position so that components can slide in and out of the magazine.

[0216] In some embodiments, components can be moved, loaded, and / or received using a height-adjustable cart, and accordingly, a human operator does not need to lift the components or support their weight while removing or replacing the components from the magazine. It will be understood that a magazine configured to rotate to a substantially horizontal position can also assist in loading functional components into the magazine as well as removing non-functional components.

[0217] FIGS. 15a through 15d illustrate an exemplary magazine (810) positioned on a platform (820) that may extend outside the container. In FIG. 15a, the magazine (810) may be connected to a platform comprising a rotating member (821), a support member (822), and a rail (823). In some embodiments, the support member (822) may be connected to a rail (823) that allows the support member (822) to move while supporting the weight of the magazine (810) and any server or other components stored within the magazine. In the exemplary embodiment of FIG. 15a, the platform (820) is in an extended position.

[0218] As illustrated in FIG. 15b, during normal operation, the support member (822) may be retracted relative to the external housing of the computing system. The magazine (810) may be stored on the rail (823) during normal operation. In some embodiments, the weight of the magazine (823) is supported by the support member (822) and the rail (823), regardless of the position of the support member (822) on the rail (823).

[0219] In some embodiments, computer components used with the disclosed embodiments, such as servers, may be denser and / or heavier than conventional computer components. In some embodiments, due to the increased cooling capacity of the disclosed embodiments, the blade server may have a weight of at least about 50 lbs, or at least about 60 lbs, or at least about 70 lbs, or at least about 80 lbs, or at least about 90 lbs, or at least about 100 lbs. In some embodiments, the blade server may have a weight of about 50 lbs or less, or about 60 lbs or less, or about 70 lbs or less, or about 80 lbs or less, or about 90 lbs or less, or about 100 lbs or less. As illustrated in FIG. 15b, the magazine (810) can hold a plurality of chassis (400) or blade servers, and individual blade servers may have a weight of about 73 lbs. When three such servers are loaded into the magazine, the combined weight of the magazine (810) and the servers may be about 395 lbs.

[0220] In some embodiments, the server used is a blade server mounted on a chassis. The server and / or chassis may include a backplane system to assist in the installation and removal of the server within the computing system. In some embodiments, the server may be an immersion server that does not include a fan or other air cooling device. In some embodiments, individual server boards may include 16 GPUs and may be configured to consume about 6 kW of power. In some embodiments, the servers are 1.5U servers. Some disclosed servers may be 1 Otto Immersion Unit (OIU) servers. Such servers are 1.5U high and are configured for liquid immersion cooling. In some embodiments, a single tank within the computing system may be configured to accommodate 10 1OIU servers and operate at about 60 kW of power when all 10 servers are operating at substantially full power. In some embodiments, the computing system may include one or two such tanks. In some embodiments, the computing system may include multiple tanks, such as, for example, 10 such tanks.

[0221] In some embodiments, as shown in FIG. 15a, when the magazine is extracted from the computing system, the support member moves from the storage location along the rail and can be cantilevered to the outside of the outer housing of the computing system.

[0222] Additionally, as illustrated in FIGS. 15c and 15d, the magazine may be pulled outward along a rail or otherwise slid and may be cantilevered outward from the computing system. In some embodiments, as illustrated in FIGS. 15c and 15d, the entire magazine and the components contained within the magazine may be removed using a magazine removal tool. In such embodiments, the magazine removal tool may be used to lift the magazine from a support member and a sliding rail in order to transport the magazine.

[0223] In some embodiments, once the magazine is moved to the outside of the computing system, the platform can rotate the magazine to a substantially horizontal position. Subsequently, the server housed within the magazine can slide out of the magazine.

[0224] FIGS. 15a through 15d illustrate an exemplary series of steps for removing a server from a magazine according to an exemplary embodiment. In an exemplary embodiment, the magazine may be attached to a linear guide rail system behind an access door. As illustrated in FIGS. 15c and 15d, the magazine may be pulled out of the computing system and cantilevered outside of it. The magazine may be pulled out of the computing system manually, or moved out using a motorized or automated system. As illustrated in FIG. 15d, the magazine may be rotated about 90 degrees to orient the server and / or other components housed within the magazine to a substantially horizontal position. Once in a substantially horizontal position, the server and / or other components may slide out of the magazine and onto a cart or other tool configured to house the server and / or other components. As illustrated in FIG. 15c, a scissor-lift cart may be adjusted to a convenient height for housing the server or other components. By using a height-adjustable cart equipped with a rolling surface, the server can be transferred from the magazine onto the cart without the need for a human operator to support the weight of the server. As illustrated in FIG. 15d, once the server is slid onto the cart equipped with a sliding or rolling surface, the server or other components can be transported to any location for replacement or service. It will be understood that new components can be loaded into the magazine using substantially the same steps in the reverse order.

[0225] In some alternative embodiments, the magazine may be supported on a rotatable and extendable arm without a rail. In such embodiments, the magazine may be stored in a substantially vertical position within the external housing of the computing system during normal operation. When it is determined that a component within the magazine needs to be replaced, the magazine may be extended outside the external housing using the extendable arm. When the magazine is extended beyond the external housing, the magazine may be rotated from a substantially vertical position to a substantially horizontal position, and accordingly, the component stored within the magazine may be removed horizontally from the magazine.

[0226] bellows

[0227] In some embodiments, bellows and / or a vapor collection system may be used. Before some disclosed embodiments are initially activated, the dielectric fluid, computer components such as servers, and other system components may be in thermal equilibrium. When the computing system is activated, computer components such as servers may begin to generate heat, and such heat may be dissipated into the dielectric fluid. This process causes some of the dielectric fluid to change from a liquid state to a vapor state. As the temperature of the fluid increases, a larger proportion of the dielectric fluid may change to the vapor phase. In a closed system, an increase in the volume of dielectric vapor may result in increased pressure within the system. In some embodiments, a tank containing the dielectric fluid may be in contact with the recovery system and the fluid and / or vapor.

[0228] FIG. 16 illustrates a steam recovery system (900) according to an exemplary embodiment. The recovery system (900) is connected to a tank (710) containing dielectric steam. The dielectric steam may flow from the tank (710) through piping to one or more bellows (905). In some embodiments, the steam recovery system (900) includes an expanding and collapsing bellows (905) configured to receive the dielectric steam, thereby reducing or eliminating any pressure buildup within the tank (710). When the system is cooled or when a portion of the dielectric steam condenses into the dielectric liquid, the bellows may collapsing or shrink to substantially maintain pressure equilibrium within the tank (710).

[0229] In some embodiments, the steam recovery system (900) includes a valve (912) configured to allow ambient air to enter the steam recovery system. In such embodiments, the dielectric steam may be mixed with ambient air. Mixing the dielectric steam with ambient air may reduce the temperature of the dielectric steam. In some embodiments, the mixed air / steam may be directed through a carbon bed (911). The carbon medium within the carbon bed (911) may be configured to draw in the dielectric steam while allowing ambient air to pass through the carbon medium and, for example, to be vented from the system (900) through an outlet valve (913). In this way, the heated dielectric steam may be cooled and captured by the carbon medium.

[0230] When operated for a sufficient period of time, the embodiment of the computing system will reach a stable thermal state based on the power capacity of the computing components used. When more or less computing power is used, more or less dielectric fluid may be changed to dielectric vapor. This causes the bellows (905) to expand and / or contract in response to the heat dissipated into the dielectric fluid.

[0231] In some embodiments, the bellows (905) may comprise one or more pouches. Each pouch may comprise a laminate composition of metal foil and polymer. The bellows pouches may be connected to the vapor recovery system piping and to each other in series or in parallel. In some embodiments, the total volume of the expanded bellows pouches may be at least about 15% of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches may be at least about 20%, or at least about 23%, or at least about 25% or more of the liquid fluid volume of the tank. In some embodiments, the total volume of the expanded bellows pouches may be about 40% or less, or about 30% or less, or at least about 25% or less of the liquid fluid volume of the tank.

[0232] In some embodiments, once the computing system reaches thermal stabilization, the steam recovery system (900) may be closed to the cooling ambient air, and a valve that allows air to be exhausted to the outside of the system may be closed. In some embodiments, the carbon bed may be configured to be open only to the tank and bellows using a valve. In some embodiments, a desorption heater configured to transfer heat to the carbon medium may be activated to raise the temperature of the carbon medium. As the temperature of the carbon medium rises, any dielectric fluid previously captured by the carbon medium may be moved out of the carbon and back into the tank, and in such a tank, the dielectric fluid may be condensed back into the dielectric fluid as described above.

[0233] In some embodiments, when power is supplied to the computing system below a previous steady state, a portion of the dielectric fluid in a vapor state may be reduced, and in some embodiments, the bellows may contract to accommodate the reduction of the dielectric vapor. In some embodiments, a valve allowing ambient air to enter the bellows is opened to allow air to enter the bellows and further reduce any pressure difference. In some embodiments, instead of ambient air, nitrogen may be used to reduce the pressure difference and also prevent any potential contaminants from being introduced from the ambient air.

[0234] In some embodiments, the bellows and / or steam recovery system may be entirely or substantially passive. In some embodiments, the bellows and / or steam recovery system may be powered and / or automated based on sensor data from temperature, pressure, and / or power sensors deployed throughout the computing system.

[0235] In some embodiments, a computing system having a vapor recovery system does not emit, even if the system is not a closed system. In some embodiments, ambient air or nitrogen may be introduced into the system and exhausted outside the system without releasing any or substantially none of the dielectric fluid into the ambient atmosphere.

[0236] Exemplary Examples

[0237] The disclosed embodiments enable an increase in the density of computer components and / or computing power. In some embodiments comprising two-phase liquid immersion-cooled computer components (170) within a pressure-controlled vessel (110), the components may be separated from each other by less than about 1 inch, less than about 0.7 inches, or less than about 0.5 inches. In some embodiments, individual components may be separated by more than about 0.3 inches, or more than about 0.5 inches, or more than about 0.7 inches, or more than about 1 inch, or more than about 1.5 inches.

[0238] Some disclosed embodiments enable improved power usage efficiency (PUE) compared to a conventional data center. Use of the disclosed embodiments enables a reduction in the use of energy to cool computer components (170), thereby reducing the total energy use of the data center and bringing the PUE closer to 1.0. Some embodiments relate to a data center comprising two-phase liquid immersion cooling computer components within a pressure control vessel (110), wherein the data center has a PUE of less than about 1.15, or less than about 1.10, or less than about 1.08, or less than about 1.05. Some embodiments relate to a data center comprising two-phase liquid immersion cooling computer components within a pressure control vessel (110), wherein the data center has a PUE greater than about 1.05, or greater than about 1.06, or greater than about 1.08, or greater than about 1.10.

[0239] In some embodiments, a thermally conductive condensable dielectric fluid is provided for use in a two-phase liquid immersion cooling system. The computer component operates below ambient atmospheric pressure, which lowers the temperature at which the dielectric fluid evaporates, thereby maintaining the liquid phase of the dielectric fluid at a temperature lower than that of standard atmospheric pressure. The computer component generates heat during operation. The generated heat is transferred to the dielectric fluid in contact with the computer component, causing the dielectric fluid to evaporate into a gas. The gaseous dielectric fluid can be condensed using a condenser. Ambient temperature, or quenched process water, passes through the condenser. When the gaseous dielectric fluid is cooled by the condenser, it condenses back into the liquid phase and falls back into a bath of liquid dielectric fluid.

[0240] Some disclosed embodiments relate to high-density data centers. A typical data center contains about 1 megawatt (MW) of computing power distributed over about 10,000 square feet. A high-performance data center may contain about 1 MW of computing power distributed over about 6,000 square feet. The disclosed embodiments relate to a data center containing a two-phase liquid immersion cooling computer component (170) within a pressure control vessel (110), wherein the data center utilizes about 1 MW of computing power distributed over about 3,000 square feet, or about 1,500 square feet, or about 1,000 square feet, or about 800 square feet, or about 600 square feet. In some embodiments, a plurality of pressure control vessels containing the disclosed computing system may be arranged in rows and powered by a central power source. In some embodiments, a plurality of embodiments of the disclosed computing system may be connected in series with each other.

[0241] The disclosed embodiment contains a liquid immersion cooling computer component (170) within a pressure control vessel (110), and accordingly, the component is isolated from air contaminants by the pressure control vessel and by being immersed in the dielectric liquid (140). Some disclosed embodiments relate to a data center operating under minimum air infiltration and / or cleaning requirements. In some embodiments, the data center operates without a HEPA filter or equivalent, or without a MERV 11 filter or equivalent, or without a MERV 8 filter or equivalent.

[0242] The disclosed embodiment contains a liquid immersion cooling computer component (170) within a pressure control vessel (110), and accordingly, the component is not cooled by air consisting of gas. The disclosed embodiment includes a data center that operates without a cooling fan and / or any other similar device for circulating air.

[0243] The disclosed embodiments relate to an environmentally friendly data center. In some embodiments, the data center contains a liquid immersion cooling computer component (170) within a pressure control vessel (110) and consumes little to no water for the cooling process. Some embodiments utilize a closed-loop dry cooling tower to cool the condensation structure (130) and to reduce the temperature of the water circulating through the disclosed condensation structure (130) to condense dielectric fluid vapor into dielectric fluid liquid. Such embodiments operate without significant input or output of water, because the closed-loop dry cooling tower does not rely on a stream of water or evaporative cooling for the cooling operation. Some data center embodiments use and / or discharge less than about 10,000 gallons of water per day, or less than about 1,000 gallons of water per day, or less than about 100 gallons of water per day, or less than about 10 gallons of water per day, or 0 gallons of water per day. Some data center embodiments use and / or discharge more than about 100 gallons of water per day, or more than about 1,000 gallons of water per day, or more than about 10,000 gallons of water per day.

[0244] The disclosed embodiments relate to a computing system comprising: a pressure control vessel operably connected to a pressure controller and / or a vacuum source, the pressure control vessel comprising an inner portion and an outer portion configured to contain an atmosphere within the inner portion; a thermally conductive, condensable dielectric fluid of a predetermined volume; a rack for mounting computer components, wherein the computer components are arranged such that when mounted on the rack, they are at least partially submerged within the volume of the thermally conductive dielectric fluid; and a condensation structure, wherein the volume of the thermally conductive dielectric fluid, the rack, the computer components, and the condensation structure are contained within the pressure control vessel. Some embodiments relate to a cooling system comprising a pressure control vessel including an inner portion, wherein the vessel is configured to operably connect to a pressure controller to reduce the pressure in the inner portion to below the atmosphere, and wherein the pressure control vessel is configured to contain a thermally conductive, condensable dielectric fluid in liquid and gaseous phases of a predetermined volume; and one or more computer components arranged such that they are at least partially submerged within the liquid phase of a predetermined volume of the thermally conductive, condensable dielectric fluid. and includes a condenser for condensing a gaseous dielectric fluid into a liquid dielectric fluid.

[0245] In some embodiments, the pressure control vessel is mounted within a superstructure, and the blade server is configured to be interchangeable without interfering with the computing system; the pressure control vessel is operably connected to a power source, a water source, and a networking connection; the pressure control vessel includes an opening at the top and a cover configured to seal the opening, the cover configured to direct rising steam from the middle of the pressure control vessel to the side of the pressure control vessel; the pressure control vessel has an interior volume of about 100 cubic feet to about 300 cubic feet, and / or the pressure control vessel includes a ratio of liquid dielectric fluid to gas dielectric fluid of about 1:3 to about 1:8. Some embodiments further include a ballast block, a blade server and a blade server chassis, a robotic arm and an airlock, and / or a purge system, the airlock is configured to allow access to the interior of the pressure control vessel without substantially interfering with the atmosphere within the pressure control vessel, and the purge system is configured to remove contaminants from the volume of the thermally conductive dielectric fluid. In some embodiments, the purge system is configured to remove a portion of the atmosphere from the pressure control vessel, condense any dielectric fluid from the atmosphere, and dispose of any remaining vapor. In some embodiments, the purge system is configured to condense at least a portion of the gaseous dielectric fluid and dispose of gaseous contaminants.

[0246] Some embodiments relate to a method for cooling computer components, such method comprising: providing a housing, wherein the housing comprises a thermally conductive condensable dielectric fluid and a heat-generating computer component, and the housing is configured to withstand at least a small vacuum; operating the computer component, wherein the operation of the computer component generates heat and the computer component is in contact with the dielectric fluid; and creating a vacuum within the housing, wherein the pressure within the housing is at least less than about 1 atmosphere. Some embodiments further comprise maintaining a vacuum within the housing, wherein the pressure within the housing is less than about 1 atmosphere while the computer component is operating, evaporating the dielectric fluid from a liquid state to a gaseous state using heat generated by the computer component, and condensing the dielectric fluid from a gaseous state to a liquid state using a condenser, and removing a fluid that cannot be easily condensed from the dielectric fluid. In some embodiments, and / or a step of replacing a part of the computer component while the system is operating. In certain embodiments, the step of removing a non-condensable fluid comprises isolating a part of the gaseous atmosphere from within the housing, and condensing any dielectric fluid from the gaseous atmosphere; The method includes the step of returning the condensed dielectric fluid to the housing, and the step of discarding any remaining portion of the gaseous atmosphere, and / or the housing is configured to generate convection.

[0247] Some embodiments relate to a method for cooling a computer component, comprising the step of operating the computer component at a pressure below ambient pressure, wherein the computer component is in contact with a thermally conductive dielectric fluid. Some embodiments further comprise the steps of evaporating the dielectric fluid and condensing the dielectric fluid at a pressure below ambient pressure.

[0248] Some embodiments relate to a method for cooling a computer component, such method comprising: providing a thermally conductive condensable dielectric fluid in a liquid phase and a gas phase; and operating a computer component at a pressure below ambient atmospheric pressure in the presence of the thermally conductive condensable dielectric fluid, wherein the computer component is in at least partial contact with the thermally conductive condensable dielectric fluid in the liquid phase. Some embodiments further comprise the steps of evaporating the dielectric fluid from the liquid phase to the gas phase using at least a portion of any heat generated by the computer component being operated; condensing at least a portion of the dielectric fluid from the gas phase to the liquid phase; removing at least a portion of the fluid that cannot be easily condensed from the dielectric fluid; and / or replacing at least one computer component while the computer component is being operated.

[0249] Some embodiments relate to a method for cooling a computer component, such as: a step of operating the computer component at a pressure at least 1 psi lower than ambient pressure, wherein the computer component is in at least partial contact with a thermally conductive dielectric fluid, and the boiling point of the dielectric fluid is less than about 80°C. Some embodiments further comprise a step of condensing the dielectric fluid under conditions such that the computer component does not exceed about 80°C.

[0250] It will be understood that various disclosed embodiments may include some or all of the components otherwise described herein. Specific components and their characteristics may be adjusted based on the characteristics of each specific embodiment. Modifications may include the use of higher or lower density power, cooling, and network connectivity systems, pressure management systems, steam management systems, and the selection of special equipment and components.

[0251] From the foregoing, those skilled in the art will be able to easily identify the essential nature of the disclosure without departing from the scope and spirit of the disclosure; and may make various changes and modifications to configure the disclosure for various uses and conditions. The foregoing embodiments are merely illustrative and should not be construed as limiting the scope of the disclosure.

[0252] Heating and cooling of the tank in response to a shock event

[0253] In one exemplary embodiment, the immersion cooling system or vessel may comprise a tank, a computing device, a robot, an absorption unit, a bellows, and a management system. The tank may be a pressure-controlled tank maintained at (or within the range of) atmospheric pressure. The tank may comprise a bath area and a sump area, and the computing device may be immersed in the dielectric fluid within the bath area of ​​the tank. The computing device may be connected to a network and may perform various processing tasks while immersed in the dielectric fluid. The tank may comprise a cover for accessing the bath area, the computing device, and the sump area. The tank may be fluidically coupled to the bellows and the absorption unit, and a plurality of valves may selectively connect or disconnect the tank from the bellows and the absorption unit, thereby allowing dielectric vapor to be delivered to the bellows and / or the absorption unit, or vice versa. The robot may be a gantry robot capable of raising the computing device from the tank of the vessel when the cover of the tank is opened. The robot can place the elevated computing device into a magazine provided for the storage of the computing device. The robot can also elevate the computing device from the magazine and place it in place of the elevated computing device from the tank.

[0254] In one exemplary embodiment, the tank may include a heating element, for example, a plurality of heating rods, and a portion of the heating rods is at least partially submerged in the dielectric fluid. The tank may include a plurality of sensors, for example, a temperature sensor, a pressure sensor, or sensors that provide operational data (e.g., current, voltage, work load, etc.) associated with a computing device. The temperature sensor may be located inside the bath or in a region above the bath. Using the data received from the sensor, the vessel's management system may operate the heating element to regulate or control the temperature or temperature fluctuations of the dielectric fluid in the tank (and / or the pressure or pressure fluctuations of the dielectric vapor). FIG. 18 illustrates an example of a heating element (1000) for a submerged cooling system according to an exemplary embodiment. The heating element (1000) may include a plurality of heating rods (1010). Each heating rod may include a plurality of wires (1011) that can be connected to the power supply of the tank. The tank controller can heat the bath area of ​​the tank by controlling the heating element (1000), for example, during various operations of the tank. In this exemplary embodiment, the heating element (1000) can be mounted within the bath of the tank and can be completely submerged in the dielectric fluid.

[0255] In one exemplary embodiment, the heating element is separated from the computing device, and the heating element does not process data. The heating element may be specified to generate heat only and not perform any other functions. The heating element can be easily controlled, particularly for the operation of the tank (e.g., startup operation), the exchange of components, or other times when control is required. The heat generated by the heating element can be adjusted when evaluating data representing the size of the bellows and other aspects of the system, for example, pressure or temperature.

[0256] In particular, sudden changes in the power consumption or workload of computing devices (caused, for example, by end-user activity or the absence of such activity) can lead to sudden changes in the amount of heat generated by the computing devices within the vessel. This, in turn, can cause sudden temperature changes within the tank or bath, which can lead to sudden changes in pressure within the tank (since pressure and temperature are directly related in a closed insulation system, i.e., PV = nRT). These pressure fluctuations can damage the vessel and introduce contaminant gases (e.g., air) or particulates (e.g., dust) into the tank. These pressure fluctuations can also cause leakage of dielectric fluid from the tank. To offset the effects of these pressure fluctuations, bellows or absorption units can be used to remove excess steam from the tank or to introduce steam into the tank when the pressure drops. However, by using heating elements, the capacity of the bellows and absorption units may be reduced, thereby allowing for the design of a more space-efficient vessel. If the heating element is not used, the bellows may rupture in the event of an excessive increase in pressure.

[0257] The heating element enables the regulation of temperature changes within a tank or bath, thereby facilitating controlled transitions between various operating load conditions that may occur in the computing device during operation. For example, in the event of a sudden decrease in the computing device's operating workload, the heat generated by the computing device may drop sharply. This can cause a rapid decrease in the internal pressure of the tank. The heating element can add heat to the tank to control the decrease in the temperature of the dielectric fluid, for example, during a shutdown process. In other words, the heating element can balance the pressure and temperature of the tank in the event of a sudden change in the computing device's workload—that is, a shock event. Consequently, the vessel requires much smaller bellows and absorption units to maintain the tank's atmospheric pressure.

[0258] In one exemplary embodiment, the vessel management system may determine how much heat to add to the tank in response to a shock event, for example, an increase or decrease in the internal pressure or temperature of the tank. In one exemplary embodiment, the rate of drop (or increase) in temperature or pressure may determine how much heat to add to the tank. For example, in an event where the dielectric fluid temperature level of the tank decreases by a certain amount over a certain number of minutes, the management system may activate a heating element to add a certain amount of heat to the tank (for example, to maintain the temperature and pressure of the system). This added heat may stop the decrease in temperature or slow down the rate at which the temperature drops. The management system may stop the heating element from adding heat to the system when the tank is in a steady state, for example, when the rate at which the pressure or temperature drops is below a threshold value. In another exemplary embodiment, the actual temperature of the dielectric fluid within the tank may determine how much heat to add to the tank when an increase or decrease in the workload of the computing device is initiated.

[0259] In one exemplary embodiment, the management system may activate the heating element when a shock event is detected, for example, before, during, or after a start operation, boost operation, deceleration operation, or shutdown operation. The management system may detect the operating mode of the vessel (e.g., start or shutdown) by receiving sensor data (e.g., from a temperature or pressure sensor in the tank) or data from a computing device (e.g., current, voltage, temperature, work load, data transfer, etc.). The heating element may adjust or regulate changes in temperature or pressure within the tank to minimize the deviation of pressure from atmospheric pressure. Alternatively, in the absence of operation of the heating element according to the technology disclosed herein, the vessel must absorb or store excess gas generated as a result of rapid heating of the computing device, or the vessel must desorb or supply gas to offset a pressure drop resulting from a rapid drop in heat generation of the computing device.

[0260] During the startup operation, when the computing device starts operation, the temperature of the tank—for example, the temperature of the dielectric fluid in the bath—is below a threshold value. The startup operation may occur, for example, when the vessel has just been turned on and the tank is at a low temperature. Because the computing device heats up rapidly, it may generate a large amount of steam when the dielectric fluid is at a low temperature. Accordingly, before, during, or after the startup operation, the management system may activate a heating element to heat the dielectric fluid, thereby increasing the temperature of the dielectric fluid in a controlled manner and minimizing steam generation by the computing device. For example, the heating element may gradually increase the temperature of the dielectric fluid to the threshold temperature before the computing device is turned on. Otherwise, in order to maintain the tank at atmospheric pressure, the vessel would have to accommodate an excess amount of steam, which may require a large capacity in the bellows and absorption unit.

[0261] During a boost operation (e.g., when the tank temperature is below a threshold value), the tank temperature, for example, the temperature of the dielectric fluid within the bath, may increase faster than the threshold rate. A boost operation may occur, for example, when a computing unit is in operation and the workload of the computing unit increases significantly due to, for example, increased customer demand. A rapid increase in the workload of the computing unit can increase the amount of heat generated by the computing unit, and consequently increase the amount of steam generated by the computing unit. Accordingly, before, during, or after the boost operation, the management system may activate a heating element to heat the dielectric fluid, thereby controlling the increase in the temperature of the dielectric fluid and minimizing steam generation by the computing unit. Otherwise, to maintain the tank at atmospheric pressure, the vessel would have to accommodate an excess amount of steam, which may require a large capacity for storage and absorption in the bellows and absorption unit.

[0262] During a shutdown operation (e.g., when the tank temperature exceeds a threshold value), the tank temperature, for example, the temperature of the dielectric fluid within the bath, may decrease faster than the threshold rate. A shutdown operation may occur, for example, when a computing unit is in operation and the workload of the computing unit is significantly reduced due to, for example, a decrease in customer demand. A sharp decrease in the workload of the computing unit can reduce the amount of heat generated by the computing unit, thereby causing a sharp decrease in the pressure within the tank. Accordingly, before, during, or after the shutdown operation, the management system may activate a heating element to heat the dielectric fluid, thereby controlling the reduction of the dielectric fluid temperature and minimizing the pressure drop within the tank. Otherwise, to maintain the tank at atmospheric pressure, the vessel would have to generate an excess amount of steam, which may require large storage or release capacities in the bellows and absorption unit.

[0263] During a shutdown operation (or controlled shutdown process), the vessel is ordered to be turned off while the temperature of the tank, for example, the temperature of the dielectric fluid in the bath, exceeds a threshold value. Since the computing unit may abruptly stop heat generation, the pressure inside the tank may drop rapidly. Accordingly, before, during, or after the shutdown operation, the management system may activate a heating element to heat the dielectric fluid, thereby controllingly reducing the temperature of the dielectric fluid and minimizing the pressure drop. For example, the heating element may heat the dielectric fluid gradually so that the temperature of the dielectric fluid drops slowly when the computing unit is turned off. Otherwise, to maintain the tank at atmospheric pressure, the vessel would have to generate an excess amount of steam, which may require large storage or desorption capacities in the bellows and absorption unit.

[0264] In one exemplary embodiment, as the vessel responds to a shock event, the management system (or other system) may add steam or fluid to the tank or remove steam or fluid from the tank in order to maintain the tank pressure at a pressure close to atmospheric pressure. For example, steam or fluid may be removed from the tank as the tank temperature increases, and steam or fluid may be added to the tank as the tank temperature decreases.

[0265] The vessel may utilize various mechanisms to add steam or fluid to the tank or to remove steam or fluid from the tank. In one exemplary embodiment, the vessel may utilize bellows as a mechanism for adding steam to the tank or removing steam from the tank. In another exemplary embodiment, the vessel may utilize an absorption / desorption unit (hereinafter referred to as the "absorption unit") to add steam to the tank or to remove steam from the tank. In yet another exemplary embodiment, the vessel may utilize a pressurized container to add steam to the tank or to remove steam from the tank. In yet another exemplary embodiment, the vessel may utilize a combination of the aforementioned mechanisms to add steam or fluid to the tank or to remove steam or fluid from the tank. In yet another exemplary embodiment, the vessel may maintain the pressure of the tank using a heating element and a combination of one or more of the aforementioned mechanisms.

[0266] For example, during a startup operation, the management system can maintain the pressure of the tank using a combination of a heating element and a bellows. In one example, before turning on the computing device, the management system can activate the heating element to heat the dielectric fluid. At some point (e.g., before, after, or during heating), the management system can open the valve connecting the bellows to the tank, thereby facilitating the delivery of dielectric steam to the bellows. Delivering dielectric steam to the bellows in this way can prevent an uncontrolled increase in the tank pressure, thereby allowing the temperature of the dielectric fluid to increase while the tank pressure is maintained (e.g., within a tolerance range).

[0267] Similarly, during the start-up operation, the management system can maintain the pressure of the tank using a combination of a heating element and an absorption unit. At some point (e.g., before, after, or during heating), the management system can open a valve connecting the absorption unit to the tank, thereby facilitating the transfer of dielectric steam to an absorption unit, such as a carbon bed, capable of absorbing or retaining dielectric steam within the absorption unit. Similarly, during the start-up operation, the management system can maintain the pressure of the tank using a combination of a heating element and a pressurized container. At some point (e.g., before, after, or during heating), the management system can open a valve connecting the pump and the pressurized container to the tank, thereby facilitating the transfer of dielectric steam to the pressurized container using the pump. The pressurized container can store dielectric steam.

[0268] As another example, during interruption operation, the management system can maintain the pressure of the tank using a combination of a heating element and a bellows. In one example, after the computing device is turned off, the management system can activate the heating element to heat the dielectric fluid. At some point (e.g., before, after, or during heating), the management system can open the valve connecting the bellows to the tank, thereby facilitating the delivery of dielectric steam to the tank. Delivering dielectric steam to the tank in this way can prevent an uncontrolled decrease in tank pressure, thereby allowing the temperature of the dielectric fluid to decrease while the tank pressure is maintained (e.g., within a tolerance range).

[0269] Similarly, during interruption operation, the management system can maintain the pressure of the tank using a combination of a heating element and an absorption unit. At some point (e.g., before, after, or during heating), the management system can open a valve connecting the absorption unit to the tank, thereby facilitating the delivery of dielectric steam to the tank. In the case of a carbon bed as the absorption unit, the management system can activate the carbon bed to release captured or absorbed dielectric molecules. The management system can activate the carbon bed, for example, by transmitting a signal to a switch to turn on a heating device within the carbon bed. In one example, as the pressure of the tank drops, the carbon bed can be heated to release dielectric steam and minimize the pressure drop.

[0270] Similarly, during interruption operation, the management system can maintain the pressure of the tank using a combination of a heating element and a pressurized container. At certain points (e.g., before, after, or during heating), the management system can open the valve connecting the pressurized container to the tank, thereby facilitating the delivery of dielectric steam to the tank.

[0271] In one exemplary embodiment, a trade-off may be made between the use of bellows and the use of an absorption unit. The bellows is a passive device, while the absorption unit is an active device. A bellows-based system may be more power-efficient than an absorption-unit-based system because the bellows does not require active heating. However, the bellows occupies more space than the absorption unit, and the absorption-unit-based system provides a greater degree of control and functionality. In this regard, efficiency, control, and space may be some of the design constraints.

[0272] In one exemplary embodiment, an uncontrolled interruption may occur in the vessel. For example, an uncontrolled interruption may occur in the vessel due to a loss of power. In this exemplary embodiment, an emergency interruption process may be implemented to resolve potential pressure fluctuations within the tank. For example, the vessel may have a backup or uninterruptible power supply ("UPS") capable of supplying power to the vessel and its management system (or other systems). If the management system receives a signal from a sensor indicating that the pressure within the tank is dropping below an acceptable threshold value as a result of the loss of power and cooling of the system, it may direct the opening of a bypass valve in the management system. The bypass valve may connect the tank to an environment outside the tank. The bypass valve may introduce air into the tank and, accordingly, normalize the pressure within the tank (thereby, the tank or bellows will not be crushed). Subsequently, during a start-up operation, the vessel may purge the air introduced into the tank.

[0273] In one exemplary embodiment, a management system (or other system) may use a table, matrix, or map (“Map”) to determine how to respond to a shock event. In one exemplary embodiment, the Map may display temperature changes as inputs and may display how much heat to add to the tank in response to the temperature changes as outputs. In one exemplary embodiment, the Map may include data as inputs related to steam temperature, tank pressure, fluid level within the tank or sump area, fluid pressure within the pump or filter, pressure difference, humidity level, and alumina condition. In response to these inputs, the Map may provide outputs such as operating parameters for the condenser, heating element, pump, bellows valve, carbon blower valve, carbon discharge valve, and computing device. The Map may define various states regarding the operation of the vessel. The management system may receive various data from sensors provided throughout the vessel. Using the Map, the management system may convert such data into operating parameters for the vessel’s devices, e.g., bellows, absorption unit, valve, heating element, pump, condenser, and computing device.

[0274] In one exemplary embodiment, the vessel may be operated at a temperature near the boiling point of the dielectric fluid and at a pressure near atmospheric pressure. However, those skilled in the art will recognize that the vessel may be operated at other temperature and pressure ranges based on the optimal operating temperature for the operation of the computing device. In one exemplary embodiment, the optimal operating temperature of the system is approximately 137°F ± 8°. In one exemplary embodiment, the optimal operating pressure of the system is approximately atmospheric pressure (e.g., 101,325 Pa) ± 5,000 Pa. In this exemplary embodiment, during a shock event, the management system will want to maintain the temperature and pressure of the vessel within these ranges.

[0275] Although in some exemplary embodiments of this disclosure, a management system is described as a system programmed to perform various tasks in a shock event, those skilled in the art will recognize that other systems disclosed in this disclosure may be programmed to perform such tasks.

[0276] In one exemplary embodiment, the vessel may be operated under three operating modes. In the first operating mode, the tank may be operated at atmospheric pressure. In the second operating mode, the tank may be operated in a pressure range significantly away from atmospheric pressure. In the third operating mode, the vessel may be operated at atmospheric pressure at times and at times in a pressure range significantly away from atmospheric pressure. The third operating mode may be a combination of the first mode and the second mode. In one exemplary embodiment, a management system may determine the operating mode of the vessel. For example, the management system may operate the vessel based on rules defined for the management system, for example, pressurize the vessel at 5 AM every morning and return it to atmospheric pressure at night; or pressurize the vessel during the peak of the work load determined by sensor data. As another example, the management system may use a machine learning algorithm to predict the operating mode for the vessel. For example, the machine learning algorithm may use external data, such as weather conditions, calendar data, usage data, etc., as well as sensor data, to predict which operating mode is most efficient under the given situation. The user of the system can provide labeled data to the management system that can extrapolate the data to create a model for predicting the operation mode.

[0277] In one exemplary embodiment, the management system may perform a specific routine before the tank lid can be opened. For example, if the vessel is instructed to open the tank lid, the condensation system may cool the system for a predetermined period before the management system allows the lid to be opened. The condensation system can minimize the vapor within the tank and, accordingly, minimize the loss of dielectric vapor to the environment when the lid is opened.

[0278] In one exemplary embodiment, the immersion cooling system may be a modular system. For example, a group of each component of the system may be mounted on separate skids, such as a condensation skid, a heating skid, a bellows skid, an absorption unit skid, etc. These skids may be moved and deployed for various applications.

[0279] Dielectric Fluid Circulation and Filtration

[0280] In one exemplary embodiment, the vessel may include a pump for circulating a dielectric fluid through the tank. For example, the tank may include a sump area and a bath area. The bath area may keep a computing device submerged in the dielectric fluid. The sump area may be located after the bath area, or the sump area may be fluidly connected to the bath area. For example, the sump area may receive a flood of dielectric fluid from the bath area, and for example, the dielectric fluid may flow over the wall of the bath area adjacent to the sump area. The pump may draw dielectric fluid from the sump area and pass such fluid through a filter. After the filter, the dielectric fluid may be returned to the bath area. The vessel may include various pipes coupling the sump area, the pump, the filter, and the bath area.

[0281] In one exemplary embodiment, a predetermined amount of dielectric fluid is provided in a vessel so that the bath area is filled with dielectric fluid and there is an overflow of dielectric fluid within the sump area. The filled bath area ensures that the computing device is completely submerged in the dielectric fluid. A pump can draw dielectric fluid from the sump area and deliver it to the bath area, for example, through a filter. Because there is more dielectric fluid in the tank than the capacity of the bath area to hold, the bath area is always full (especially when the pump is operating). However, depending on the temperature of the tank, the level of dielectric fluid in the sump area may change, as dielectric fluid may evaporate from the bath area and dielectric fluid from the sump area may replace the evaporated fluid in the tank.

[0282] In one exemplary embodiment, the tank may have the shape of a rectangular box. The dielectric fluid may flow beyond the top of one of the short sides into the sump area adjacent to the short side. A pump may draw in the dielectric fluid and return or reintroduce such dielectric fluid to a location within the tank where the induction of fluid disturbance or turbulence within the bath can be minimized (since disturbance or turbulence can cause cavitation within the fluid). In particular, the greater the distance between the flood area and the reintroduction point, the less turbulence is associated with the reintroduction of fluid into the tank. For example, if the dielectric fluid floods from the top of the first side of the bath, the pump may return the dielectric fluid to the bottom of the side opposite the first side. The pump may return the dielectric fluid to the corner of the bottom side, which minimizes fluid disturbance or turbulence within the bath.

[0283] In one exemplary embodiment, the vessel may include two pumps. Each pump can independently draw fluid from the sump area and deliver it to the bath area. Providing a vessel with two separate and independent pumps can improve the service life of the vessel. Additionally, if one of the pumps fails for any reason, the vessel can continue to operate without interruption until the failed pump is replaced.

[0284] In one exemplary embodiment, the vessel may include a filter. The filter may include one or more cores. Each core may filter the dielectric fluid for different types of contaminants, particles, materials, diluents, or solutes. In one exemplary embodiment, the cores may be selected based on the characteristics of the dielectric fluid and contaminants that may be introduced into the dielectric fluid. For example, contaminants may include solder and resin used during the manufacturing process of electronic boards used in computing devices. The dielectric fluid may act as a cleaning agent for resins, solder, dust, dirt, or anything else in the system. Solder and resin (or other materials) may be washed away from electronic boards after the electronic boards are immersed in the dielectric fluid. The filter may remove solder and resin (or other materials) from the dielectric fluid. If these materials are not removed from the dielectric fluid, when the dielectric fluid evaporates, these materials will be deposited as a layer on the heat-generating components of the computing device, for example, the processor. Consequently, such a layer thermally isolates or insulates the heat-generating components from the dielectric fluid, thereby reducing the efficiency of heat transfer from these components to the dielectric fluid. Consequently, the components may be heated and destroyed more frequently.

[0285] In one exemplary embodiment, the filter may include two cores, one core may include activated carbon (charcoal) and the other core may include activated aluminum. For example, the ratio of activated carbon to activated aluminum may be 3 to 1. As another example, the filter may include four cores, three cores may include activated carbon and one core may include activated aluminum.

[0286] In one exemplary embodiment, the filter may include a stripe for testing the acidity of a dielectric fluid. The stripe may be a pH indicator, litmus paper, or other indicator. In some cases, the dielectric fluid may become acidic after interacting with certain components of the tank. The stripe may come into contact with the dielectric fluid, and if the dielectric fluid is acidic, the color may change. The filter may include a color detection sensor, the color detection sensor may detect a change in color within the stripe, and if a change in the color of the stripe is detected, it may transmit a signal to a management system (or other system). In one exemplary embodiment, the stripe may be placed inside a container or chamber that includes a glass shield. Thus, the change in the color of the stripe can be seen from outside the container. A camera may be placed in the vicinity of the container. The camera may take a picture of the stripe (behind the glass shield) and transmit such a picture to the management system. When the management system (or the user of the system) detects a color change of the stripe (using data provided by a camera or color sensor), the management system may trigger a healing action, for example, notify the maintenance system or stop the system.

[0287] In one exemplary embodiment, the camera may be a pan-tilt-zoom camera. A filter cover may be mounted on the top of the sump area. The filter cover may be installed after another cover that provides access to the bath area. The filter cover may include a filter, and the camera may be installed on the filter cover. In one embodiment, the camera may be installed directly below the filter cover. Thus, when the camera is rotated, the camera can capture the shape of the stripe, the sump area (the area below the camera), and the area above the bath area.

[0288] FIGS. 19a and FIGS. 19b illustrate a filter comprising three cores according to an exemplary embodiment. As illustrated in FIGS. 19a, the filter may include a cover (1050) that can be mounted on the tank, following another cover that provides access to, for example, a computing device installed within the tank. Each core of the filter may be connected to the cover (1050). The cover (1050) may include three caps (1060), each cap providing access to one of the cores. FIGS. 19b illustrates a structure (1070) mounted on the cover (1050). The structure (1070) may support various filter cores and other components, for example, a filter core (1071), a camera (1072), and an electromechanical valve (1073). On another side of the structure (1070), two other filter cores (not shown in FIG. 19b) may be present.

[0289] In this exemplary filter, a camera and two color sensors are attached to the cover. The camera and color sensors can acquire data related to the acidity of the dielectric fluid (based on the color of the stripes) and transmit such data to a management system.

[0290] In one exemplary embodiment, the filter may be mounted on a chassis that can be removed by a robot. The chassis may include a connection interface for detachably connecting the chassis (and the filter provided therein) to various pipes provided within the tank. Thus, when the management system determines that the filter needs to be replaced, the robot may raise the chassis to the outside of the tank and place the filter into a magazine.

[0291] In one exemplary embodiment, the management system may notify the user when service or replacement of the filter is required. For example, the management system may include a timer or counter that is activated when the filter is installed in the vessel. If the management system determines that the filter has operated for longer than a threshold time, the management system may send a notification to the user (or other entity). As another example, the management system may activate the timer or counter only when the vessel is in operation, when the pump is active, or when a dielectric fluid (as determined by a fluid sensor within the filter) passes through the filter. If the management system determines that the filter has operated for longer than a threshold time, the management system may send a notification to the user. As yet another example, the management system may determine a pressure difference for the filter, and the management system may notify the user of service or replacement of the filter when the pressure difference exceeds a threshold pressure. In particular, the filter may include an input pipe and an output pipe, and there may be a pressure sensor on the input pipe and a pressure sensor on the output pipe. Each pressure sensor can transmit a pressure reading to a management system. If the pressure difference between the readings of the pressure sensors exceeds a threshold pressure, the management sensor can determine that the filter is clogged. Accordingly, the management system can notify the user of the service or replacement of the filter. As another example, the filter may include a sensor indicating the flow rate to the filter. The management system can use the flow rate to determine whether the filter needs to be serviced. As yet another example, the management system can use a machine learning model to determine when to replace the filter. Such a model can receive training data from a central server representing operational data for filters for multiple containers connected to the server.

[0292] In one exemplary embodiment, the sump area and / or bath area may include one or more fluid level sensors. During startup or a rapid increase in workload, the fluid level in the sump area decreases as the dielectric fluid evaporates within the bath area. However, as the pump circulates the dielectric fluid, the fluid level within the bath area remains constant, i.e., the computing unit is kept submerged. Conversely, during shutdown or a rapid decrease in workload, the fluid level in the sump area may decrease.

[0293] A fluid level sensor can provide data related to fluid levels within the sump and bath areas to a management system. If the fluid level in the sump area decreases after the vessel is started (or while the vessel is operating in a normal state), there may be a leak in the tank. Similarly, if the fluid level in the bath area decreases at a certain point, there may be a problem with the fluid circulation system, for example, a pump failure. Accordingly, the management system can continuously monitor the fluid level data provided by the fluid level sensor and notify the user in the event of an unexpected drop in the fluid level within the sump or bath area.

[0294] In one exemplary embodiment, the pump may draw fluid from the sump area (or bath area) and supply the fluid to a drain valve connected to the tank body. When the valve is opened, the pump may drain the sump area (or bath area) or provide a sample to the user of the vessel. The sample may be provided to a laboratory for testing. In one exemplary embodiment, the user may instruct the vessel to drain the tank using a management system. In response, the management system may open the drain valve, and the pump may direct fluid from the sump area (or, for example, even the bath area when a connection is provided to the bath area) to the drain valve. For example, there may be a valve connection between the bath area and the sump area, and upon the event where a drain instruction is received, the valve connection may connect the bath area to the sump area, and accordingly, the bath area drains the dielectric fluid into the sump area, and the pump drains the sump area. In one exemplary embodiment, the pump may draw the dielectric fluid directly from the tank area.

[0295] Robot system

[0296] In one exemplary embodiment, the vessel may include a robotic system, for example, a gantry robot configured to raise a computing device from a bath area of ​​the tank or a magazine placed near the tank. The gantry robot may also place the computing device within the bath area or the magazine.

[0297] A gantry robot (or robot) may include a series of linear actuators. For example, the robot may include actuators for movement along multiple directions, e.g., horizontal and vertical directions, respectively. A management system (or other system) may control how far or how fast each of these actuators moves. In one exemplary embodiment, the actuators may be configured to move on one or more tracks. Actuator-based or track-based systems may lose their accuracy over time (e.g., due to drifting or wear and tear). Therefore, in this exemplary embodiment, to detect the robot's accurate relative position, the tank (or its various components) may include one or more calibration zones or flags. For example, one or more critical components or locations of the container with which the robot interacts, e.g., a magazine, a first server rack, a second server rack, or a home position, may include flags, and such flags may be detected by the robot after the robot reaches the location or place of the critical components. The flag can notify the robot of the exact location of important components or places.

[0298] In one exemplary embodiment, the flag may be a physical object, an RFID tag, a color, an alphanumeric code, a QR code, etc. In one exemplary embodiment, the sensor detecting the flag may be a motion sensor, an RFID detector, a camera, etc. In one exemplary embodiment, the camera may determine the distance between the robot and various objects and provide feedback related to the distance to the robot. In one exemplary embodiment, the camera may provide video data to a management system, and based on the video data, the management system may determine the exact position of the robot within the container. In one exemplary embodiment, the management system may determine the position of the robot by, for example, scanning a QR code, counting components within the tank, etc. In one exemplary embodiment, images from the camera may be used to determine the robot's proximity to an object or whether the robot has properly grasped or positioned the chassis. In one exemplary embodiment, the management system may use object recognition technology to determine the position of the robot. In one exemplary embodiment, the management system may use artificial intelligence technology to determine the position of the robot. The management system may calibrate the robot using object recognition technology or artificial intelligence.

[0299] In one exemplary embodiment, the container may include a home position, a magazine, and two racks. A management system (or other system) may instruct the robot to raise a computing device, for example, from the second rack. The robot may move from the home position to the magazine and then to the first and second racks. When the robot approaches each of these positions or components, the robot's sensors may detect an associated flag for the position or component. An advantage of the flag system is that the robot can still detect the robot's position regarding a critical component or position even if another component or position is removed from the container. This is because the flag is always located at the same position for each critical component or position associated with such a flag. For example, even if the first rack is removed from the container, the robot can find the flag for the second rack, correct the robot's position regarding the second rack, and remove the computing device from the second rack. Similarly, even if the second rack is moved slightly from its position within the container, the robot can locate the flag for the second rack, correct the robot's position relative to the second rack, and remove the computing device from the second rack.

[0300] In one exemplary embodiment, the gantry robot may receive instructions to remove or replace various components of the vessel, such as computing devices, filters, etc. In one exemplary embodiment, such instructions may be provided by a management system (or another system). The management system may provide instructions in response to decisions made by the management system (or another system), the user of the vessel, or a system outside the vessel. For example, the management system may receive and monitor various data points related to the operation of the computing device, such as voltage levels, temperatures, and other operational characteristics. If the computing device exceeds a determined or predetermined threshold value for the computing device, the management system is programmed to instruct the robot to replace the computing device.

[0301] As another example, the user of the vessel may instruct the management system to provide instructions to the robot for removing the computing device. As yet another example, the management system includes an Application Programming Interface (API) for receiving instructions from a system outside the vessel. For example, the vessel may communicate with a top-level organization and management platform that can instruct the management system (via the API) to remove the computing device from the tank.

[0302] In one exemplary embodiment, the robot may raise a computing device from a tank or magazine. In this exemplary embodiment, the computing device may be located within a chassis that includes a connecting plate. The robot may include a linkage mechanism and a guide pin capable of interfacing with the connecting plate. The robot may also include one or more load cells that measure positive or negative force or pressure applied to the robot.

[0303] The robot may start from its home position and move toward the tank (or rack containing the computing device). At the tank, the robot may detect a flag associated with the tank that indicates to the robot that it is located in the tank. Subsequently, the robot may move a predetermined distance from the flag so that it is positioned precisely (or substantially) on the computing device. Once the robot is positioned on the top of the computing device, the robot may rapidly descend from that top position to a position a few inches away from the computing device (or a position equal to or further than the length of the guide pin, for example, 50% further than the guide pin). At such a point (i.e., a few inches away from the computing device), the robot may approach the computing device more slowly so that the robot's guide pin makes initial contact with the connecting plate. Once the robot makes initial contact, the robot will continue to move downward at the same slow speed until the robot presses the connecting plate (of the chassis) with a threshold pressure exceeding the limit. At such a point, the robot's coupling mechanism can be activated (e.g., fingers can be opened), thereby interconnecting the robot with the computing device. The coupling mechanism may be an armature-based coupling mechanism comprising multiple fingers. When the coupling mechanism is closed, the robot can provide feedback to the management system, that the coupling system has been closed. The management system can instruct the robot to raise the computing device. The robot can slowly pull the chassis upward by a few inches, thereby confirming that it has properly grasped the chassis. Subsequently, the robot can move rapidly upward to its top position. At such a point, the robot can move to any position instructed by the management system, for example, a magazine or another rack.

[0304] In one exemplary embodiment, the robot may place a computing device within a tank or magazine. For example, while holding the chassis, the robot may move over a slot (or one of its racks) in the tank and drop or place the chassis into the tank (or magazine). Once the robot is positioned over the tank, the robot begins to move rapidly downward until it is positioned a few inches above a first alignment point (or mating point) between the chassis and the tank (or rack). The design of the chassis and tank may determine the distance from the tank to which the robot must descend slowly. In particular, the robot may descend slowly to one or two inches above the alignment point (where the chassis guide rail contacts the rack groove). The robot may move slowly toward the tank so that the rack groove can move within the chassis guide rail. A management system may receive and monitor data from load cells and other sensors and accordingly ensure that the chassis is not misaligned. For example, feedback of an excessive force on the load cell may indicate misalignment between the groove and the guide rail. If misalignment is detected, the management system may stop the lowering operation.

[0305] In one exemplary embodiment, in addition to the groove and guide rail, the chassis and rack may include an additional alignment mechanism. For example, after an initial occlusion between the chassis and the rack using the groove and guide rail, a guide pin mechanism may be provided on the rack and the chassis to further align the rack and the chassis. The guide pin mechanism may include a pin on the rack and an occlusion hole on the chassis. After the initial occlusion, the robot may move downward more quickly until it reaches a second alignment mechanism (or a few inches further than the size of the guide pin, e.g., 2 inches further). Here, the second alignment mechanism may be a guide pin mechanism. The robot moves downward slowly so that the pin on the rack can connect with the occlusion hole on the chassis. The robot continues to move downward slowly until a load cell provides feedback indicating that the chassis has been inserted, e.g., until the load cell detects positive pressure. At this point, the linkage mechanism may be inactive, and the robot may move upward (slowly for a few inches and then quickly) and back to that home position.

[0306] In one exemplary embodiment, the chassis or rack may include a presence detection pin. When the presence detection pin engages with a corresponding receiver, the management system may receive a signal from the receiver. Such a signal may indicate that the chassis is properly positioned. In this exemplary embodiment, the robot may disable the coupling mechanism only after the receiver has provided a signal to the management system.

[0307] During a lifting or lowering motion, the management system can receive and monitor data from load cells as well as other sensors (e.g., motion sensors, tile sensors, rotation sensors, accelerometers, etc.). This data can ensure that the chassis does not collide or become misaligned, or that the robot properly grips the chassis. If the management system determines that the chassis is somewhat collided or misaligned, or that the robot is tilted or rotated (e.g., due to a poor connection between the robot and the chassis), the management system can stop the lifting or lowering motion.

[0308] FIGS. 20a and FIGS. 20b illustrate an exemplary robot system (1100). FIGS. 20a illustrates a robot system (1100) that may be a gantry robot comprising a plate (1110). The gantry robot may move within a tank and may raise a computing device using the plate (1110). FIGS. 20b illustrates a plate (1110) that may include a coupling mechanism (1111) and a guide pin (1112). The coupling mechanism (1111) may include a plurality of fingers (1113) mechanically coupled to one or more armatures. When the coupling mechanism is positioned within a connecting plate of a chassis, the armature may be activated and the fingers may move to hold the connecting plate.

[0309] FIGS. 21a and FIGS. 21b illustrate an exemplary guide pin mechanism between a chassis (1150) and a rack (1160). In this exemplary embodiment, the rack (1160) may include two guide pins (1161) (for each chassis (1150)), and the chassis (1150) may include two interlocking holes (1151) configured to receive the guide pins (1161). When a robot lowers the chassis (1150) onto the rack (1160), the guide pin mechanism ensures a proper electrical connection between the chassis (1150) and the rack (1160).

[0310] In one exemplary embodiment, the robot is a robot arm. The robot arm can move on a rail provided on the side of the tank. In one exemplary embodiment, each chassis can be pulled using a piston and connected to a channel located at the top of the piston. The channel can transfer the chassis to a magazine, for example, using a rail system.

[0311] In one exemplary embodiment, the robot may include a calibration system that may include a plurality of sensors. The calibration system may determine whether the robot has exceeded its normal operating range. For example, a tilt sensor may notify the robot that the robot is unbalanced or tilted. As another example, a load cell may provide a signal to the robot when the robot is unable to move freely, for example, when it collides with an object.

[0312] In one exemplary embodiment, the robot may use artificial intelligence or machine learning technology to provide hot swapping or as a safety mechanism.

[0313] In one exemplary embodiment, the container may include a plurality of cameras. In this example, one camera may be mounted on the robot, and another may be mounted on the wall of the container. The cameras may be mounted in a manner that allows the user to always view the moving components of the container. The container may also include a user interface displayed on a display device, for example, a monitor. When the robot raises or lowers the chassis, the user interface may display video supplied from the cameras. In this way, if something goes wrong with the robot's movement, the user can take action.

[0314] In one exemplary embodiment, the robot system may be a vision-based system connected to active control. The active control enables a reference point to be transmitted backward through logic, which will determine the proximity to a proximity switch. In one exemplary embodiment, the robot system may be an AI robot system. In one exemplary embodiment, the robot system may be an automatic calibration system. In one embodiment, the robot system may be a logic-controlled active loop-based system that is pre-programmed and capable of calibration based on the distance from a resting state to an active state.

[0315] Absorption / Detachment Unit

[0316] In one exemplary embodiment, the absorption unit may be a carbon-bed-based system. The absorption unit may be a round drum. An aluminum framework may be positioned inside the absorption unit, and such a framework may include a copper ribbon heating element extended throughout the entire framework. The height and radius of the absorption unit may be designed based on the size of the vessel and the volume of the fluid within the tank.

[0317] The absorption unit may be sealed and may contain activated carbon within a framework. The absorption unit may include an inlet and an outlet. In one embodiment, the absorption unit may include a cooling system, and, for example, cold air may flow through the center of the absorption unit without coming into contact with the carbon. Such a system enables the carbon to be cooled through convection.

[0318] In one exemplary embodiment, activated carbon enables the absorption or attachment of dielectric vapor. When tank balance (e.g., creation of pressure or vacuum) is required, the control system can connect the absorption unit to the tank by opening a valve. The control system can activate or initiate power to a copper heating ribbon element, which can heat the carbon. Subsequently, the carbon releases dielectric fluid molecules as vapor, which can then be returned to the tank.

[0319] In one exemplary embodiment, pressure and temperature sensors may be located within the carbon bed to prevent pressure or temperature from exceeding the conditions.

[0320] In one exemplary embodiment, the absorption unit may include a control loop bypass to release (or pressurize) pressure in an emergency. This is a safety feature of the vessel. The absorption unit has a valve that separates the absorption unit from the tank. If the valve fails, an overpressure condition may exist. For example, if the outlet of the absorption unit is blocked, the control system may open the bypass valve. When the bypass valve is opened, dielectric vapor may proceed to the atmosphere, thereby preventing the explosion of the absorption unit. If a vacuum condition exists within the tank, the valve may be opened, thereby allowing air to proceed into the tank, preventing the tank from being crushed.

[0321] In one exemplary embodiment, the vessel may include a plurality of safety bypass valves. For example, during a startup operation, the computing device may generate an excess amount of steam. A valve that allows steam to escape from the tank to the absorption unit may fail. Consequently, there may be an overpressurized condition within the tank that the bellows cannot handle. An emergency bypass valve may open to release a portion of the steam into the atmosphere.

[0322] As another example, during startup, an excess amount of steam may enter the absorption unit. This can create overpressurization conditions within the absorption unit. Consequently, the bypass valve of the absorption unit may be opened to release the steam into the atmosphere.

[0323] In one exemplary embodiment, in addition to pressure and temperature, the management system may receive and monitor data from the absorption unit related to the power of the absorption unit. The management system ensures that current flows through the absorption unit. The management system may shut off the absorption unit if there is an overcurrent problem or an over-pressure condition.

[0324] Chassis self-alignment

[0325] In one exemplary embodiment, the chassis may include a self-aligning feature. The self-aligning feature may include a plate that can move (i.e., float) relative to the chassis. One or more input ports or output ports (or connectors) may be on the plate. The chassis (and plate) may include an occlusion hole capable of receiving a guide pin to align the plate and accommodate the ports. In one exemplary embodiment, the port may be an ExaMAX® connector.

[0326] In one exemplary embodiment, the self-aligning feature may include several alignment mechanisms. For example, as a first self-aligning mechanism, the rack and chassis may have grooves and guide rails. As a second self-aligning mechanism, the rack may include a tapered pin with rounded ends. The pin may advance into a catch hole within the chassis. When the pin is inserted into the occlusal hole (or catch hole), it causes final precision alignment between the connector on the chassis and the interface on the rack (i.e., backplane). Until the time the connector is ready to be paired with its occlusal part, the alignment pin ensures that the floating pair perfectly matches the relative orientation of the connector being approached for insertion.

[0327] In one exemplary embodiment, the connectors of the chassis and rack may include their own alignment mechanism, and, for example, pins may be part of the connector.

[0328] In one exemplary embodiment, the connector may include a plurality of stage mechanisms for self-alignment, comprising a whole external alignment catch and a finer internal alignment catch.

[0329] In one exemplary embodiment, the plate may be the backplane of the rack.

[0330] FIG. 22 illustrates an exemplary connector having self-aligning features. Such a connector may include guide pins and other guide features to ensure proper connection between pairs.

[0331] Immersion cooling process

[0332] 1. It is a method:

[0333] As a step of at least partially immersing computer components in a thermally conductive, condensable dielectric fluid:

[0334] The above computer component is mounted within a chassis including a backplane to receive power from a rack; and

[0335] A step in which, when the computer component is operated, the computer component is configured to dissipate heat within the dielectric fluid;

[0336] The step of condensing the gas phase of the dielectric fluid into the liquid phase of the dielectric fluid using a condenser;

[0337] A method in which the above rack is located within a tank comprising a pressure controller for reducing or increasing the internal pressure of the tank.

[0338] 2. The method of Example 1, wherein the tank has a computing power density of at least 300 W of computing power distributed across each square foot of space.

[0339] 3. The method of Example 1, further comprising the step of removing the chassis from the rack using a robot, wherein the robot is positioned within the tank.

[0340] 4. The method of Example 3, further comprising the step of delivering the chassis to an airlock using the robot, wherein the airlock is configured to allow access to the inner part of the tank without substantially interfering with the pressure within the tank.

[0341] 5. In Example 4,

[0342] Step of opening the inner door of the above airlock;

[0343] A step of placing the above chassis within the above airlock;

[0344] A step of closing the inner door of the above airlock;

[0345] A step of making the pressure of the above airlock equal to atmospheric pressure; and

[0346] A method further comprising the step of opening the outer door of the airlock.

[0347] 6. The method of Example 3, further comprising the step of storing the chassis in a magazine using the robot.

[0348] 7. The method of Example 6, wherein the magazine is disposed on a platform comprising a support member, a rotating member, and a rail.

[0349] 8. Method of Example 3, wherein the robot is a gantry robot configured to remove, replace, or install the chassis.

[0350] 9. A method according to Example 8, wherein the gantry robot is configured to move in a horizontal plane and descend vertically.

[0351] 10. In Example 9, the robot is a device configured to remove, replace, or install a component of a power distribution system.

[0352] 11. Method according to Example 10, wherein the robot includes a gripping tool for gripping the chassis.

[0353] 12. A method according to Example 1, wherein the tank is mounted within an upper structure comprising a plurality of tanks.

[0354] 13. The method of Example 1, further comprising the step of removing contaminants from the dielectric fluid.

[0355] 14. The method of Example 1, further comprising the step of removing gaseous contaminants.

[0356] 15. The method of Example 1, further comprising the step of providing power, a network connection, and a process fluid to the tank.

[0357] 16. Method according to Example 1, wherein the tank comprises an opening at the top and a removable cover.

[0358] 17. Method of Example 1, wherein the tank comprises an internal volume of about 100 cubic feet to about 300 cubic feet.

[0359] 18. Method of Example 1, wherein the chassis does not include a heat sink and a fan.

[0360] 19. Method according to Example 1, wherein the chassis comprises a blade server, a processor, a power supply, or an interface card.

[0361] 20. In Example 19, the device is electrically connected to an interface card, wherein the backplane is Cat6A or Cat7 compatible with an RJ45 interface for connection to a 1G or 10G Ethernet interface.

[0362] Vessel Design and Configuration for Immersion Cooling

[0363] 1. It is a device and:

[0364] A tank configured to maintain a thermally conductive, condensable dielectric fluid;

[0365] A pressure controller for reducing or increasing the internal pressure of the above tank;

[0366] A rack at least partially submerged in the above dielectric fluid;

[0367] A condenser for condensing the gas phase of the above dielectric fluid; and

[0368] A device comprising a robot configured to move a chassis within the above rack.

[0369] 2. In Example 1, the device comprises a modular skid including a plurality of forklift tubes.

[0370] 3. In Example 1, the tank is a device having a computing power density of at least 300 W of computing power distributed across each square foot of space.

[0371] 4. The device according to Example 1, wherein the outer part of the device includes a power input and a communication input.

[0372] 5. In Example 4,

[0373] The above power input and communication input are electrically connected to the box; and

[0374] The above box is a device that distributes power input and communication input to the rack using a plurality of wires.

[0375] 6. In Example 5, the rack comprises a backplane receiver configured to distribute power and communication signals to the chassis.

[0376] 7. In Example 6, the chassis includes a backplane, and the backplane is:

[0377] To receive power and communication signals from the backplane receiver of the above rack; and

[0378] A device configured to distribute the above power and communication signals to computer components within the chassis.

[0379] 8. An apparatus according to Example 5, wherein the plurality of wires do not include a plastic insulation portion.

[0380] 9. The device of Example 5, wherein the rack includes a transformer.

[0381] 10. In Example 1, the device is stackable.

[0382] 11. The device of Example 1, wherein the device comprises a magazine for storing replacement components.

[0383] 12. In Example 11, the robot is configured to remove the chassis from the rack and place the chassis into the magazine.

[0384] 13. In Example 12, the magazine is a device positioned on a platform comprising a rotating member, a supporting member, and a rail.

[0385] 14. In Example 13, the device is configured such that the platform guides the magazine to the outside of the device.

[0386] 15. In Example 1, the device comprises a dryer configured to remove water vapor contaminants from the device.

[0387] 16. In Example 1,

[0388] sump area;

[0389] pump; and

[0390] Includes more filters;

[0391] A device configured such that the pump removes the dielectric fluid from the sump region and passes the dielectric fluid through the filter before delivering the dielectric fluid to the bath portion of the tank.

[0392] 17. An apparatus according to Example 1, wherein the dielectric fluid has a boiling point within the range of 20°C to 100°C.

[0393] 18. The apparatus of Example 1, wherein the dielectric fluid comprises a chemical of the formula (CF3)2CFCF2OCH3, C4F9OCH3, CF3CF2CF2CF2OCH3, hydrofluoroether, or methoxy-nonafluorobutane.

[0394] 19. The device of Example 1, further comprising a lock that prevents the device from operating when either the cover or the door of the device is not fixed.

[0395] 20. The device of Example 1, further comprising a controller configured to cut off power to the device in the event of unauthorized access to the cover or door.

[0396] Robots and automation for immersion cooling

[0397] 1. It is a device and:

[0398] A tank configured to maintain a thermally conductive, condensable dielectric fluid;

[0399] A pressure controller for reducing or increasing the internal pressure of the above tank;

[0400] A computer component that is at least partially submerged in the above dielectric fluid;

[0401] A condenser for condensing the gas phase of the above dielectric fluid; and

[0402] A device comprising a robot configured to pick up the above computer components.

[0403] 2. The apparatus of Example 1, further comprising an airlock.

[0404] 3. In Example 2, the device wherein the airlock includes an inner door and an outer door.

[0405] 4. In Example 3, the airlock is configured to receive an inert gas to purge the gaseous phase of the dielectric fluid before the outer door is opened.

[0406] 5. A device in which the robot is located on the outside of the tank in Example 3.

[0407] 6. A device in which the robot is positioned within the tank in Example 3.

[0408] 7. In Example 6, the robot is configured to remove the computer component from the rack and to transfer the computer component to the airlock.

[0409] 8. In Example 7, the robot is:

[0410] To open the inner door of the above airlock;

[0411] To place the above computer components within the airlock;

[0412] To close the inner door of the above airlock;

[0413] So that the pressure of the above airlock becomes equal to atmospheric pressure; and

[0414] A device further configured to open the outer door of the above airlock.

[0415] 9. The apparatus of Example 8, further comprising a second robot located on the outside of the tank.

[0416] 10. In Example 9, the device wherein the second robot is configured to remove the computer component from the airlock when the outer door is opened.

[0417] 11. In Example 9, the device wherein the second robot is configured to place the computer component within a storage slot.

[0418] 12. In Example 9, the airlock is configured such that the pressure of the airlock becomes equal after the outer door is closed.

[0419] 13. In Example 1, the device is configured to receive commands from a server located outside the device.

[0420] 14. In Example 1, the computer component is a device located within a chassis displaying an asset tag.

[0421] 15. In Example 14, the device is configured such that the robot scans the charity tag and relays the asset tag to a management system.

[0422] 16. In Example 1, the robot is a device configured to remove, replace, or install the computer component, wherein the robot is a gantry robot.

[0423] 17. In Example 16, the device is configured such that the gantry robot moves horizontally and vertically.

[0424] 18. In Example 1, the robot is a device configured to remove, replace, or install a component of a power distribution system.

[0425] 19. A device according to Example 18, wherein the component of the power distribution system is a transformer or a power source.

[0426] 20. In Example 1, the robot comprises a gripping tool for gripping the computer component.

[0427] Ballast block for immersion cooling

[0428] 1. It is a device and:

[0429] As a tank:

[0430] A bath portion for holding thermally conductive condensable dielectric fluid and computer components; and

[0431] A tank comprising a shelf portion configured to hold at least one ballast block;

[0432] A pressure controller for reducing or increasing the internal pressure of the above tank;

[0433] A condenser for condensing the gas phase of the above dielectric fluid; and

[0434] A device comprising a robot configured to pick up the above computer components.

[0435] 2. In Example 1, the device wherein the lower point of the bath portion has a height lower than the height of the shelf portion.

[0436] 3. The device of Example 1, wherein the bath portion is configured such that the computer component is at least partially submerged in the dielectric fluid.

[0437] 4. A device according to Example 3, wherein the computer component is a blade server, a processor, a power supply, or a transformer.

[0438] 5. The apparatus of Example 1, wherein the level of the dielectric fluid is sufficiently high to cover at least a portion of the shelf portion.

[0439] 6. A device according to Example 1, wherein the shelf portion is located next to the condenser.

[0440] 7. An apparatus according to Example 6, wherein the shelf portion is configured to receive condensed dielectric fluid from the condenser.

[0441] 8. An apparatus according to Example 1, wherein the ballast block is configured to occupy the volume of the tank above the shelf in order to displace the dielectric fluid from the shelf to a region above the bath portion.

[0442] 9. An apparatus according to Example 1, wherein the ballast block comprises a plurality of rising pits to allow the dielectric fluid to flow below the ballast block.

[0443] 10. An apparatus according to Example 1, wherein the ballast block cannot be dissolved in the dielectric fluid.

[0444] 11. An apparatus according to Example 1, wherein the ballast block is made of metal, rubber, silicone, or a polymer.

[0445] 12. An apparatus according to Example 1, wherein the ballast block is denser than the dielectric fluid.

[0446] 13. The apparatus of Example 1, wherein the ballast block has a handle, a cutout, or a plate for removing or replacing the ballast block.

[0447] 14. In Example 13, the robot is configured to raise the ballast block using the handle, cut-out, or plate.

[0448] 15. The device of Example 1, wherein the ballast block is configured to interlock with another ballast block from the upper side or lower side of the ballast block.

[0449] 16. In Example 15, the interlocking is a device that prevents the other ballast block from sliding.

[0450] 17. In Example 15, the other ballast block is configured to be positioned on the upper side or lower side of the ballast block.

[0451] 18. An apparatus according to Example 15, wherein the ballast block comprises a recessed portion on the upper side of the ballast block, and accordingly, the rising pit of the other ballast block is configured to be locked within one of the recessed portions of the ballast block.

[0452] 19. An apparatus according to Example 1, wherein the ballast block is configured to extend over at least 40% of the total length of the shelf portion.

[0453] 20. In Example 1, the ballast block has external dimensions of about 2 feet in length, about 8 inches in width, and about 1 inch in height.

[0454] Server case for immersion cooling

[0455] 1. It is a device and:

[0456] A tank configured to maintain a thermally conductive, condensable dielectric fluid;

[0457] A pressure controller for reducing or increasing the internal pressure of the above tank;

[0458] A chassis at least partially submerged in the above dielectric fluid;

[0459] A condenser for condensing the gas phase of the above dielectric fluid; and

[0460] A device comprising a robot configured to lift the above chassis.

[0461] 2. In Example 1, the chassis is a device that does not require a heat sink and a fan.

[0462] 3. The device according to Example 1, wherein the chassis includes a blade server.

[0463] 4. In Example 1, the chassis comprises a processor, a power supply, or an interface card.

[0464] 5. In Example 4, the interface card is a Cat6A or Cat7 device compatible with an RJ45 interface for connection to a 1G or 10G Ethernet interface.

[0465] 6. A device according to Example 1, wherein the chassis is removablely attached to a rack.

[0466] 7. In Example 6, the chassis comprises a backplane for providing a slot-in interface between the chassis and the rack.

[0467] 8. In Example 7, the backplane is a device configured to distribute power and signals received from the rack within the chassis.

[0468] 9. In Example 8, the device wherein the backplane is configured to transmit power and data to a blade server through a cable.

[0469] 10. The device according to Example 1, wherein the chassis is a substantially rectangular box comprising a rear wall and two side walls, and the rear wall has a plurality of holes to facilitate the circulation of the dielectric fluid within the chassis.

[0470] 11. The device of Example 10, wherein the chassis includes guide rails on each of the two side walls.

[0471] 12. The device of Example 1, wherein the chassis includes a mounting interface for holding computer components.

[0472] 13. A device according to Example 1, wherein the chassis includes a plate, and the robot is configured to raise the chassis using the plate.

[0473] 14. The device of Example 1, wherein the chassis includes a microcontroller.

[0474] 15. In Example 14, the microcontroller is:

[0475] To receive sensor data from a sensor mounted on the chassis indicating whether the chassis is properly positioned within the rack; and

[0476] A device configured to transmit the above sensor data to a management system.

[0477] 16. In Example 14, the microcontroller is:

[0478] To receive power signals from the management system; and

[0479] A device configured to transmit the above power signal to a switch configured to cut off power within the chassis.

[0480] 17. In Example 14, the microcontroller is:

[0481] To receive operation data from a computer component mounted within the chassis; and

[0482] A device configured to transmit the above-mentioned operation data to a management system.

[0483] 18. In Example 14, the device, wherein the microcontroller is configured to control the electrical and communication facilities of the blade server.

[0484] 19. The device of Example 1, wherein the chassis includes an RFID tag.

[0485] 20. In Example 19, the device is configured such that the robot scans an RFID tag and transmits a signal to a management system.

[0486] Steam management for immersion cooling using bellows

[0487] 1. It is a device and:

[0488] A tank configured to hold a thermally conductive, condensable dielectric fluid and computer components;

[0489] A pressure controller for reducing or increasing the internal pressure of the above tank;

[0490] A steam management system for condensing the gas phase of the above dielectric fluid; and

[0491] A device comprising a robot configured to pick up the above computer components.

[0492] 2. An apparatus according to Example 1, wherein the steam management system includes a condensation structure within the tank.

[0493] 3. The device according to Example 2, wherein the condensation structure comprises a thermally conductive tube, a coil, or a radiator fin.

[0494] 4. An apparatus according to Example 2, wherein the condensation structure is configured to be coupled to a source of cooling liquid, and accordingly, the cooling liquid passes through the condensation structure.

[0495] 5. In Example 2, the device is configured to rapidly cool the cooling liquid using an evaporative cooling or dry cooling tower.

[0496] 6. In Example 2, the device wherein the steam management system includes an inlet pipe and an outlet pipe.

[0497] 7. In Example 6, the device is configured such that the inlet pipe receives the cooling liquid from a quenching liquid supply source and guides the cooling liquid through a condensation structure.

[0498] 8. In Example 6, the device is configured such that the outlet pipe receives the cooling liquid from the condensation structure and returns the cooling liquid to a quenching liquid supply source.

[0499] 9. In Example 1, the steam management system comprises a storage unit for storing the dielectric fluid.

[0500] 10. In Example 9, the steam management system is configured to direct the dielectric fluid in the tank away from the storage unit.

[0501] 11. In Example 1, the steam management system comprises a steam storage unit for storing steam of the dielectric fluid.

[0502] 12. An apparatus according to Example 11, wherein the steam storage unit is a bellows.

[0503] 13. In Example 12, the bellows is configured to expand or contract to maintain internal pressure of the tank.

[0504] 14. The device of Example 12, wherein the bellows comprises one or more pouches.

[0505] 15. In Example 11, the steam storage unit comprises a valve that allows air to move into the steam management system in order to lower the temperature of the steam of the dielectric fluid.

[0506] 16. In Example 15, the vapor storage unit is a device operably connected to a carbon bed to separate the vapor of the dielectric fluid from the air.

[0507] 17. An apparatus according to Example 16, wherein the carbon bed comprises a desorption heater configured to heat the carbon bed and raise the temperature of the carbon bed.

[0508] 18. The device according to Example 1, wherein the steam management system includes a filter.

[0509] 19. An apparatus according to Example 17, wherein the filter is configured to remove air and water vapor.

[0510] 20. In Example 1, the steam management system is:

[0511] Includes an inert gas storage unit; and

[0512] A device configured to introduce an inert gas from the inert gas storage unit into the tank during a start operation or a stop operation.

Claims

Claim 1 As a system: a tank configured to maintain the liquid and gaseous phases of a fluid; a structure within the tank configured to maintain one or more computer components at least partially submerged in the liquid phase of the fluid during the operation of the system, wherein the one or more computer components are configured to process data; a vapor recovery system fluidly communicating with the tank, receiving the gaseous phase of the fluid and condensing it into the liquid phase of the fluid to maintain pressure equilibrium within the tank; and a heating element configured to heat the liquid phase of the fluid in the tank. A system comprising: a controller configured to control the heating element; wherein the controller is configured to receive data relating to the operational load, temperature, or both of the one or more computer components, and to control the heating element based on the operational load, temperature, or both of the one or more computer components; wherein the steam recovery system comprises bellows configured to receive the gaseous phase of the fluid, and the bellows are operable to reduce the pressure rise within the tank, and the controller is also configured to receive data relating to the size of the bellows, and the controller is also configured to control the heating element based on the size of the bellows. Claim 2 A system according to claim 1, wherein the heating element is configured to be completely submerged in the liquid phase during the operation of the system. Claim 3 In claim 1, the system further comprises a temperature sensor or a pressure sensor, wherein the sensor is operably connected to the controller. Claim 4 A system according to claim 1, wherein the controller is configured to cause the heating element to heat the liquid phase of the fluid during or prior to the start operation. Claim 5 A system according to claim 1, wherein the controller is configured to cause the heating element to heat the liquid phase of the fluid when the temperature of the liquid phase of the fluid is below a threshold temperature. Claim 6 A system according to claim 1, wherein the controller is configured to cause the heating element to heat the liquid phase of the fluid during or prior to a boost operation. Claim 7 In paragraph 6, the boost operation is a system identified by the controller in response to an indication that the operation load of the one or more computer components will be increased. Claim 8 A system according to claim 1, further comprising a pressure management system, wherein the controller is configured to activate the pressure management system. Claim 9 A system according to claim 1, wherein the controller is configured to operate the heating element to maintain the temperature of the liquid phase of the fluid within a threshold value range below the boiling point of the fluid. Claim 10 In paragraph 1, the heating element is a system in which data cannot be processed. Claim 11 A method for cooling computer components comprising: operating one or more computer components in a submerged cooling system configured to cool the computer components; receiving sensor data related to the operational load, temperature, or both of the one or more computer components from a sensor located in a tank, wherein the tank is configured to hold: (a) a liquid phase and a gas phase of a fluid in a bath area of ​​the tank; and (b) one or more computer components at least partially submerged in the liquid phase of the fluid in the bath area, wherein the one or more computer components are configured to process data; (c) a heating element at least partially submerged in the liquid phase of the fluid in the bath area; and (d) a sensor; activating the heating element based on the sensor data; and removing and replacing one or more of the one or more computer components while the submerged cooling system continues to cool the remaining computer components among the one or more computer components; and deactivating the heating element based on the sensor data. Claim 12 A method according to claim 11, further comprising the step of detecting the operating mode of one or more computer components, wherein the operating mode is a start mode, a boost mode, a deceleration mode, or a stop operation. Claim 13 In paragraph 12, the above-mentioned startup mode is a method in which the one or more computer components are inactive for a predetermined period before the operation of the one or more computer components. Claim 14 In paragraph 12, the boost mode is a method in which an increase in the operating load of the one or more computer components is expected. Claim 15 A two-phase liquid immersion cooling system for cooling computer components, wherein the two-phase liquid immersion cooling system comprises: a heating element within a bath region of a tank of the two-phase liquid immersion cooling system—the heating element does not process data—and the heating element comprises: a plurality of heating rods configured to be at least partially submerged in a two-phase dielectric fluid within the bath region of the tank; A two-phase liquid immersion cooling system comprising: a power supply operably connected to a plurality of heating rods to supply power to the heating element; and a controller operably connected to receive data from one or more sensors, wherein the controller is configured to activate or deactivate the heating element based on data received from the one or more sensors, and the controller is configured to maintain a constant temperature of the two-phase liquid immersion cooling system for cooling a computer component while the workload of the computer component changes, and the controller is configured to cause the heating element to heat the liquid phase of the fluid during or prior to a boost operation, wherein the boost operation is identified by the controller in response to an indication that the operating load of the one or more computer components will increase. Claim 16 In claim 15, the one or more sensors are selected from temperature sensors, pressure sensors, current sensors, voltage sensors, work load sensors, and combinations thereof, in a two-phase liquid immersion cooling system. Claim 17 In paragraph 1, each computer component is selected from the group consisting of a motherboard, a chip, a server, an interface card blade server, a GPU, and a CPU, in a system. Claim 18 A system according to claim 1, wherein the structure is a rack comprising a power supply, a data interface, and a plurality of chassis, wherein one or more computer components are installed within the chassis, and the chassis is configured to be removed and replaced while continuously cooling the remaining computer components among the one or more computer components. Claim 19 In claim 11, the method wherein the immersion cooling system comprises an opening configured to allow access to one or more computer components without disturbing the atmosphere within the system. Claim 20 In paragraph 19, the method wherein the opening is a movable lid. Claim 21 A two-phase liquid immersion cooling system according to claim 15, further comprising a filter configured to remove contaminants, particles, substances, diluents, and solutes from the above two-phase liquid immersion cooling system. Claim 22 A two-phase liquid immersion cooling system according to claim 21, wherein the filter comprises one or more cores, and the one or more cores comprise an absorbent material. Claim 23 In claim 22, the absorbent material comprises at least one of activated aluminum and activated carbon, in a two-phase liquid immersion cooling system.

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