Organic light emitting display device

Abstract

The present specification discloses an organic light-emitting display device. The organic light-emitting display device comprises: a pixel disposed in a display area; a wire extending from a connection interface to the display area, wherein the wire comprises: a first conductor layer; and a second conductor layer connecting a discontinuous portion of the first conductor layer above the first conductor layer.

Description

Technology Field

[0001] This specification relates to an organic light-emitting display device. Background Technology

[0002] An organic light-emitting display is a device that displays images by controlling the amount of light emitted by organic light-emitting elements. Organic light-emitting elements (such as organic light-emitting diodes) are self-emissive devices utilizing a thin light-emitting layer between electrodes, offering the advantage of being capable of thin-film formation. A typical organic light-emitting display has a structure in which a pixel driving circuit and organic light-emitting elements are formed on a substrate, and an image is displayed as light emitted from the organic light-emitting elements passes through the substrate or a barrier layer.

[0003] Since organic light-emitting displays are implemented without a separate light source, they can be manufactured to be thinner and lighter than conventional displays such as liquid crystal displays (LCDs). Therefore, organic light-emitting displays are easy to implement as flexible, bendable, and foldable displays, and can be designed in various forms.

[0004] Since the performance of various display devices, including organic light-emitting diodes (OLEDs), can be degraded by moisture penetration, they block the infiltration and / or propagation of moisture in various ways. In particular, various structures are being researched and applied to prevent moisture from penetrating and diffusing into the outer edges. The problem to be solved

[0005] The present specification aims to propose a structure for reducing damage and moisture permeability of an organic light-emitting display device. The problems described in this specification are not limited to those mentioned above, and other problems not mentioned will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0006] An organic light-emitting display device is provided according to one embodiment of the present specification. The organic light-emitting display device comprises: a pixel disposed in a display area; a wire extending from a connection interface to the display area, which is in a non-display area surrounding the display area, and the wire comprises: a first conductor layer; and a second conductor layer connecting a disconnected portion of the first conductor layer above the first conductor layer.

[0007] The first conductor layer may be formed of the same material as the source electrode or drain electrode of the thin-film transistor (TFT) included in the pixel of the display area. As an example, the first conductor layer may have a multilayer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are stacked in sequence.

[0008] The above organic light-emitting display device further includes an organic layer that covers the edge of the wire and extends along the wire, and the organic layer may have at least one disconnected section that is disconnected in the direction of extension.

[0009] The second conductor layer may be formed of the same material as the touch sensing element located on the upper part of the encapsulation layer covering the pixel. The organic light-emitting display device may further include a buffer layer located on the lower part of the second conductor layer.

[0010] The above wire is a low-level power supply (V) to the pixel of the above display area. SS It may be a wire that transmits ). In this case, the wire may surround the entire display area. Or, the wire may transmit a high-level power supply (V) to the pixels of the display area. DD ) or initialization power (V INI It can be a conductor that transmits ).

[0011] At least one of the first lower wire and the second lower wire may pass under the above wire. In this case, the first lower wire or the second lower wire may be made of the same material as the gate electrode of the thin-film transistor (TFT) included in the pixel of the display area.

[0012] An organic light-emitting display device is provided according to another embodiment of the present specification. The organic light-emitting display device comprises one or more pixel circuits; and power wiring that transmits power to the pixel circuits, wherein the power wiring may have a jumping structure through a conductor of an upper layer.

[0013] The conductor of the upper layer may be the same material as the touch sensing element located on the upper part of the encapsulation layer; or the bridge connecting the touch sensing element.

[0014] At least a portion of the above power wiring is covered with an organic layer, and the organic layer may be disconnected near the jumping structure. In this case, the organic layer may be formed of the same material as the planarization layer covering the top of the thin-film transistor in the display area.

[0015] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0016] The embodiments of this specification can provide a display device with improved moisture permeability and water propagation problems caused by damage around the conductor. Accordingly, the embodiments of this specification can provide an organic light-emitting display device with enhanced reliability. The effects according to the embodiments of this specification are not limited to those exemplified above, and a wider variety of effects are included within this specification. Brief explanation of the drawing

[0017] FIG. 1 illustrates an exemplary display device that may be included in an electronic device. FIG. 2 is a cross-sectional view schematically showing a display area and a non-display area of ​​a display device according to one embodiment of the present specification. FIGS. 3a and 3b are exemplary diagrams showing the outer structure of an organic light-emitting display device according to one embodiment of the present specification. FIGS. 4a to 4c are drawings showing the outer structure of an organic light-emitting display device according to another embodiment of the present specification. FIGS. 5a and 5b are drawings showing the outer structure of an organic light-emitting display device according to another embodiment of the present specification. Specific details for implementing the invention

[0018] The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0019] Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary and are not limited to the details illustrated in this specification. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise. In interpreting components, they are interpreted to include an error range even without separate explicit description.

[0020] In the case of descriptions of positional relationships, for example, where the positional relationship between two parts is described using expressions such as 'on,' 'above,' 'below,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used. When an element or layer is referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on the other element or in the middle. Where it is stated that a component is "connected," "coupled," or "joined" to another component, it should be understood that the component may be directly connected or joined to the other component, but that another component may be "interposed" between each component, or that each component may be "connected," "coupled," or "joined" through the other component.

[0021] Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.

[0022] The size and thickness of each component shown in the drawings are illustrated for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the illustrated components. Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

[0023] FIG. 1 illustrates an exemplary display device that may be included in an electronic device.

[0024] Referring to FIG. 1, the display device (100) includes at least one active area, and an array of pixels is formed in the active area. One or more inactive areas may be arranged around the active area. That is, the inactive areas may be adjacent to one or more sides of the active area. In FIG. 1, the inactive areas surround a rectangular active area. However, the shape of the active area and the shape / arrangement of the inactive areas adjacent to the active area are not limited to the example shown in FIG. 1. The active area and the inactive areas may be shapes suitable for the design of an electronic device equipped with the display device (100). Exemplary shapes of the active area include pentagons, hexagons, circles, ellipses, etc.

[0025] Each pixel within the display area may be associated with a pixel circuit. The pixel circuit may include one or more switching transistors and one or more driving transistors on a backplane. Each pixel circuit may be electrically connected to a gate line and a data line to communicate with one or more driving circuits, such as a gate driver and a data driver, located in the non-display area.

[0026] The driving circuit described above can be implemented as a thin film transistor (TFT) in the non-display area, as shown in FIG. 1. Such a driving circuit may be referred to as a gate-in-panel (GIP). Additionally, some components, such as a data driver IC, may be mounted on a separate printed circuit board and combined with a connection interface (PAD, bump, pin, etc.) placed in the non-display area using a circuit film such as a flexible printed circuit board (FPCB), chip-on-film (COF), or tape-carrier-package (TCP). The non-display area may be bent together with the connection interface so that the printed circuit (COF, PCB, etc.) can be located on the back of the display device (100).

[0027] The display device (100) may further include various additional elements for generating various signals or driving pixels within a display area. The additional elements for driving pixels may be an inverter circuit, a multiplexer, an electrostatic discharge circuit, etc. The display device (100) may also include additional elements associated with functions other than pixel driving. For example, the display device (100) may include additional elements that provide touch detection functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure detection functions, tactile feedback functions, etc. The aforementioned additional elements may be located in the non-display area and / or in an external circuit connected to the connection interface.

[0028] One or more edges of the display device (100) may be bent away from the central portion. Since one or more parts of the display device (100) may be bent, the display device (100) may be defined as substantially flat and bent portions. That is, a part of the display device (100) (e.g., wiring between the pad and the display area) is bent at a predetermined angle, and this part may be referred to as a bent portion. The bent portion includes a bent section that is actually bent with a predetermined bending radius. Although not always the case, the central portion of the display device (100) may be substantially flat, and the edges may be bent portions.

[0029] When the non-display area is bent, the non-display area is not visible or is only minimally visible from the front of the display device. A portion of the non-display area visible from the front of the display device may be covered by a bezel. The bezel may be formed as an independent structure, a housing, or other suitable element. A portion of the non-display area visible from the front of the display device may be hidden under an opaque mask layer, such as black ink (e.g., a polymer filled with carbon black). Such an opaque mask layer may be provided on various layers (touch sensor layer, polarization layer, cover layer, etc.) included in the display device (100).

[0030] A curved portion may be bent outward from the center, having a bending angle θ and a bending radius R with respect to the bending axis. The size of each of the curved portions does not need to be the same. Additionally, the bending angle θ around the bending axis and the radius of curvature R from the bending axis may differ for each curved portion.

[0031] FIG. 2 is a cross-sectional view schematically showing a display area and a non-display area of ​​a display device according to one embodiment of the present specification.

[0032] The illustrated display area (A / A) and non-display area (I / A) may be applied to at least a portion of the display area (A / A) and non-display area (I / A) described in FIG. 1. Hereinafter, the display device is described using an organic light-emitting display as an example.

[0033] In the case of an organic light-emitting display device, thin-film transistors (102, 104, 108), organic light-emitting elements (112, 114, 116), and various functional layers are located on the base layer (101) in the display area (A / A). Meanwhile, various driving circuits (e.g., GIP), electrodes, wiring, functional structures, etc. may be located on the base layer (101) in the non-display area (I / A).

[0034] The base layer (101) supports various components of the organic light-emitting display device (100). The base layer (101) may be formed of a transparent insulating material, such as glass, plastic, etc. The substrate (array substrate) is also referred to as a concept including a device and functional layer formed on the base layer (101), such as a switching TFT, a driving TFT, an organic light-emitting device, a protective film, etc.

[0035] A buffer layer (130) may be located on a base layer (101). The buffer layer is a functional layer for protecting a thin film transistor (TFT) from impurities, such as alkali ions, leaking from the base layer (101) or the underlying layers. The buffer layer may be composed of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof. The buffer layer (130) may include a multi-buffer and / or an active buffer.

[0036] A thin-film transistor is placed on the base layer (101) or buffer layer. The thin-film transistor may be in the form in which a semiconductor layer (active layer), a gate insulator layer, a gate electrode, an interlayer dielectric layer (ILD), and source and drain electrodes are sequentially stacked. Alternatively, the thin-film transistor may be in the form in which a gate electrode (104), a gate insulator layer (105), a semiconductor layer (102), and source and drain electrodes (108) are sequentially arranged as shown in FIG. 2.

[0037] The semiconductor layer (102) may be made of polysilicon (p-Si), in which case a certain region may be doped with impurities. Additionally, the semiconductor layer (102) may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. Furthermore, the semiconductor layer (102) may be made of oxide.

[0038] The gate electrode (104) can be formed from various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0039] The gate insulating layer (105) and the interlayer insulating layer (ILD) may be formed from insulating materials such as silicon oxide (SiOx) or silicon nitride (SiNx), and may also be formed from insulating organic materials. A contact hole in which the source and drain regions are exposed may be formed by selectively removing the gate insulating layer (105) and the interlayer insulating layer.

[0040] Source and drain electrodes (108) are formed in a single layer or multilayer shape using electrode material on a gate insulating layer (105) or an interlayer insulating layer (ILD). If necessary, a passivation layer (109) composed of an inorganic insulating material may cover the source and drain electrodes (108).

[0041] A planarization layer (107) may be positioned on a thin-film transistor. The planarization layer (107) protects the thin-film transistor and planarizes the top surface thereof. The planarization layer (107) can be configured in various forms, such as being formed from an organic insulating film such as BCB (Benzocyclobutene) or Acryl, or an inorganic insulating film such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be formed as a single layer or composed of double or multiple layers, allowing for various variations.

[0042] The organic light-emitting device may be in the form in which a first electrode (112), an organic light-emitting layer (114), and a second electrode (116) are sequentially arranged. That is, the organic light-emitting device may be composed of a first electrode (112) formed on a flattening layer (107), an organic light-emitting layer (114) located on the first electrode (112), and a second electrode (116) located on the organic light-emitting layer (114).

[0043] The first electrode (112) is electrically connected to the drain electrode (108) of the driving thin-film transistor through a contact hole. If the organic light-emitting display device (100) is of the top emission type, this first electrode (112) may be made of an opaque conductive material with high reflectivity. For example, the first electrode (112) may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. The first electrode (112) may be the anode of the organic light-emitting diode.

[0044] The bank (110) is formed in the remaining area excluding the light-emitting region. Accordingly, the bank (110) has a bank hole that exposes a first electrode (112) corresponding to the light-emitting region. The bank (110) may be made of an inorganic insulating material such as silicon nitride film (SiNx) or silicon oxide film (SiOx), or an organic insulating material such as BCB, acrylic resin, or imide resin.

[0045] An organic light-emitting layer (114) is positioned on a first electrode (112) exposed by a bank (110). The organic light-emitting layer (114) may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc. The organic light-emitting layer may be configured as a single light-emitting layer structure that emits one light, or as a structure composed of multiple light-emitting layers that emit white light.

[0046] A second electrode (116) is positioned on an organic light-emitting layer (114). When the organic light-emitting display device (100) is of the top emission type, the second electrode (116) is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), thereby emitting light generated in the organic light-emitting layer (114) to the top of the second electrode (116). The second electrode (116) may be the cathode of an organic light-emitting diode.

[0047] An encapsulation layer (120) is positioned on the second electrode (116). The encapsulation layer (120) prevents the penetration of oxygen and moisture from the outside to prevent oxidation of the light-emitting material and the electrode material. When an organic light-emitting device is exposed to moisture or oxygen, a pixel shrinkage phenomenon may occur in which the light-emitting area is reduced, or dark spots may appear within the light-emitting area. The encapsulation layer may be composed of an inorganic film made of glass, metal, aluminum oxide (AlOx), or silicon (Si)-based material, or it may have a structure in which an organic film (122) and an inorganic film (121-1, 121-2) are alternately stacked. In this case, the inorganic film (121-1, 121-2) serves to block the penetration of moisture or oxygen, and the organic film (122) serves to flatten the surface of the inorganic film (121-1, 121-2). If the encapsulation layer is formed as multiple thin film layers, the movement path of moisture or oxygen becomes longer and more complex compared to a single layer, making it difficult for moisture / oxygen to penetrate into the organic light-emitting diode.

[0048] On the encapsulation layer (120), a touch sensing line (154) and a touch driving line (152) are arranged to intersect with a touch insulating film (158) in between. A mutual capacitance (Cm) is formed at the intersection of the touch sensing line (154) and the touch driving line (152). Accordingly, the mutual capacitance (Cm) charges an electric charge by a touch driving pulse supplied to the touch driving line (152), and discharges the charged electric charge to the touch sensing line (154), thereby acting as a touch sensor.

[0049] The touch driving line (152) comprises a plurality of first touch electrodes and first bridges that electrically connect the first touch electrodes. The plurality of first touch electrodes are spaced apart at regular intervals along a first direction. Each of these plurality of first touch electrodes is electrically connected to an adjacent first touch electrode through a first bridge. The first bridge is placed on the same layer as the first touch electrode and can be electrically connected to the first touch electrode without a separate contact hole.

[0050] The touch sensing line (154) comprises a plurality of second touch electrodes and second bridges that electrically connect the plurality of second touch electrodes. The plurality of second touch electrodes are spaced apart at regular intervals along a second direction. Each of these plurality of second touch electrodes is electrically connected to an adjacent second touch electrode through a second bridge. The second bridge may be disposed on a different layer from the second touch electrode and may be electrically connected to the second touch electrode through a contact hole.

[0051] Each of the first and second touch electrodes and the first and second bridges can be formed into a single-layer or multi-layer structure using a conductive layer that has strong corrosion and acid resistance and good conductivity, such as aluminum (Al), titanium (Ti), copper (Cu), and molybdenum (Mo). For example, each of the first and second touch electrodes and the first and second bridges is formed into a stacked three-layer structure such as Ti / Al / Ti or Mo / Al / Mo.

[0052] Each of the touch driving line (152) and the touch sensing line (154) is connected to the touch driving unit through a routing line and a touch pad placed in a non-display area. Accordingly, the routing line transmits a touch driving pulse generated by the touch driving unit to the touch driving line (152) through the touch pad, and transmits a touch signal from the touch sensing line (154) to the touch pad.

[0053] A barrier film may be positioned on the encapsulation layer (120) to encapsulate the entire base layer (101). The barrier film may be a phase difference film or an optically isotropic film. In this case, an adhesive layer may be positioned between the barrier film and the encapsulation layer (120). The adhesive layer bonds the encapsulation layer (120) and the barrier film. The adhesive layer may be a heat-curing or natural-curing adhesive. For example, the adhesive layer may be composed of a material such as B-PSA (Barrier pressure sensitive adhesive).

[0054] Pixel circuits and light-emitting elements are not placed in the non-display area (I / A), but a base layer (101) and organic / inorganic functional layers (130, 105, 107, 120, etc.) may be present. Additionally, materials used in the composition of the display area (A / A) may be placed in the non-display area (I / A) for other purposes. For example, a metal (104') identical to the gate electrode of the display area TFT, or a metal (108') identical to the source / drain electrode, may be placed in the non-display area (I / A) for wiring or electrodes. Furthermore, a metal (112') identical to one electrode (e.g., anode) of the organic light-emitting diode may be placed in the non-display area (I / A) for wiring or electrodes.

[0055] The base layer (101), buffer layer (130), gate insulation layer (105), planarization layer (107), etc. of the non-display area (I / A) are the same as those described in the display area (A / A). The dam (190) is a structure that controls the organic film (122) from spreading too far into the non-display area (I / A). Various circuits and electrodes / wires placed in the non-display area (I / A) may be made of gate metal (104') and / or source / drain metal (108'). In this case, the gate metal (104') is formed from the same material as the gate electrode of the TFT and in the same process, and the source / drain metal (108') is formed from the same material as the source / drain electrode of the TFT and in the same process.

[0056] For example, the source / drain metal is a power source (e.g., low-level power (V)). SS ), high-level power (V DDIt can be used as wiring (108') etc. At this time, the power wiring (108') is connected to the metal layer (112'), and the cathode (116) of the organic light-emitting diode can receive power through the connection with the source / drain metal (108') and the metal layer (112'). The metal layer (112') contacts the power wiring (108') and extends along the outermost sidewall of the flattening layer (107) to contact the cathode (116) on the upper part of the flattening layer (107). The metal layer (112') may be a metal layer formed in the same process with the same material as the anode (112) of the organic light-emitting diode.

[0057] FIGS. 3a and 3b are exemplary diagrams showing the outer structure of an organic light-emitting display device according to one embodiment of the present specification.

[0058] FIG. 3a is an enlarged view of area A of FIG. 1, in which only specific conductive lines are shown, and other conductive lines (data lines, gate signal lines, etc.) are omitted. Meanwhile, FIG. 3a illustrates a bendable bending section (B). The bending section is as described in FIG. 1. Meanwhile, the encapsulation layer (120) of the structure described in FIG. 2 may cover part or all of area A. FIG. 3b shows the encapsulation layer (120) covering part of area A.

[0059] The above-mentioned conductor (108') extends from the connection interface (PAD) toward the display area. At this time, the conductor (108') may be formed on a single layer, or conductors (108' and 104') on two layers may be connected as illustrated.

[0060] The above wire (108') is a low-level power supply (V) to the pixel circuit of the display area. SS ), high-level power (V DD ) or initialization power (V INI It may be a conductor carrying ). In the example of Fig. 3a, the conductor on the left is a low-level power source (VSS It is a wire that transmits ), and the wire on the right is the initialization power (V INI It is a conductor that transmits ).

[0061] The above wire (108') may be formed of the same metal on the same layer as the source or drain electrode of the thin-film transistor (TFT) in the display area. In this case, the above wire (108') may be a metal having a multilayer structure stacked in the order of titanium (Ti), aluminum (Al), and titanium (Ti) (so-called Ti / Al / Ti). FIG. 3b shows a gate insulating layer (105) under the wire (108'), but this is only one example of an embodiment, and other layers may be placed under the wire (108').

[0062] The wire (108') composed of titanium (Ti) / aluminum (Al) / titanium (Ti) as exemplified is at risk of being etched when exposed to an etchant during a subsequent process, such as the anode formation process of an organic light-emitting diode. (In particular, aluminum is more susceptible to etching than titanium.) Since such unnecessary etching can cause wire defects, the corner regions of the wire (108') are covered with an organic layer (107). The organic layer (107) prevents damage (etching) to the sides of the wire (108') during the aforementioned process. At this time, for manufacturing efficiency, the organic layer (107) can be formed in the same process using the same material as the planarization layer on top of the thin-film transistor (TFT).

[0063] FIGS. 4a to 4c are drawings showing the outer structure of an organic light-emitting display device according to another embodiment of the present specification.

[0064] Recent display devices are trending toward maximizing the display area and reducing the non-display area (bezel) in response to aesthetic and functional demands. Additionally, as resolution increases, the number of various signal lines is increasing. Consequently, as shown in FIGS. 4a and 4b, there are a very large number of intersecting wires (404', 406', 408'). The wires in each layer are insulated by interlayer insulation layers (405-1, 405-2), but as shown in FIG. 3, it has become spatially very difficult to use two layers of metal connected by a jumping structure as a single wire. In other words, since the wires already designed in each layer occupy most of the space, there is no room to place additional conductors for connection with the wires above or below.

[0065] Meanwhile, the jumping structure also served to block the moisture penetration path by cutting the organic layer (107) as shown in FIG. 3b, but as the jumping structure was not used, the use of the organic layer (107) became restricted. As a result, some wires (408') were directly covered by the bag layer (420).

[0066] As described above, the wire (408') composed of titanium (408-1) / aluminum (408-3) / titanium (408-2) is exposed to an etchant, and as shown in FIG. 4c, more of the aluminum (408-2) can be etched. In that state, when the inorganic film of the encapsulation layer (420) covers the more inwardly recessed part (where the aluminum is etched inward), the inorganic film is not deposited sufficiently thickly, and a hollow groove (S) called a seam is formed.

[0067] The groove (S) created by this process is prone to damage such as cracking, creating a pathway for foreign substances, such as moisture, to penetrate. The penetrated moisture can cause corrosion of the wire or cause malfunction of the display device. Since the cracking phenomenon occurs on the side of the wire (408'), the inventors attempted to suppress the propagation of moisture by designing a complex side shape of the wire, but they were not very effective. Accordingly, the inventors devised a better structure to prevent damage and moisture penetration around the wire.

[0068] FIGS. 5a and 5b are drawings showing the outer structure of an organic light-emitting display device according to another embodiment of the present specification.

[0069] The above-described organic light-emitting display device employs an improved structure that prevents damage around the wires and blocks the propagation path of moisture. FIG. 5a is an enlarged view of section A of FIG. 1, and only specific wires are shown for convenience of explanation. Also, not all wires are shown by type. FIG. 5a illustrates a bendable bending section (B). Meanwhile, a sealing layer (120) of the structure described in FIG. 2 may cover part or all of area A. In this case, the sealing layer may cover only up to the lower part of the bending section (B), and the sealing layer may not be provided in the bending section (B) where damage due to bending is a concern.

[0070] The above-described organic light-emitting display device includes a display area and a non-display area. One or more pixels are arranged in the display area, and the pixel includes a pixel circuit and a light-emitting element.

[0071] The above wire (580) extends from the connection interface (PAD) to the display area. The above wire (580) may be a power wiring that transmits power to the pixel circuit and / or the light-emitting element. In this case, the above wire (580) may be formed on a single layer. Alternatively, the above wire (580) may have a jumping structure through a conductor (508') in the lower layer and a conductor (554) in the upper layer in a specific section as illustrated. The jumping structure may be provided between the bending section (B) and the display area. The jumping structure is connected via a contact hole or by a direct connection method. Thus, a driving voltage, electrical signal, etc., is applied to the connection interface (PAD), transmitted along the first conductor layer (508'), and in a specific section, transmitted along the second conductor layer (554).

[0072] The above wire (580) is a low-level power supply (V) to the pixel circuit of the display area. SS It may be a wire that transmits ). In this case, the wire (580) may surround the entire display area. Alternatively, the wire (580) may be a high-level power supply (V) to the pixel circuit of the display area. DD ) or initialization power (V INI It may also be a conductor carrying ). In the example of Fig. 5a, the conductor on the left is a low-level power source (V SS It is a wire that transmits ), and the wire on the right is the initialization power (V INI It can be a conductor that transmits ).

[0073] The first conductor layer (508') may be formed of the same material on the same layer as the source or drain electrode of the thin-film transistor (TFT) in the display area. In this case, the first conductor layer (508') may be a metal layer (so-called Ti / Al / Ti) having a multilayer structure stacked in the order of titanium (Ti), aluminum (Al), and titanium (Ti). FIG. 5b is illustrated with a gate insulating layer (505-1, 505-2) below the first conductor layer (580), but this is only one embodiment, and other layers may be placed below the first conductor layer (508').

[0074] The second conductor layer (554) connects the disconnected portion of the first conductor layer (508'). The second conductor layer (554) may be made of the same material as the touch sensing element located on top of the encapsulation layer (520) covering the pixel. The touch sensing element may include the first and second touch electrodes (152e, 154e) and the first and second bridges described in FIG. 2. That is, the conductor of the upper layer in the jumping structure may be made of the same material as the touch sensing element located on top of the encapsulation layer of the display area; or the bridge connecting the touch sensing element. A buffer layer (551) may be further provided below the second conductor layer (554), that is, between the second conductor layer (554) and the encapsulation layer (520). The buffer layer (551) may be provided to improve the adhesion between the touch sensing element and the second conductor layer (554) and / or to protect it. Meanwhile, the upper part of the second conductor layer (554) can be covered and protected by an insulating layer (560).

[0075] The organic layer (507) covers at least a portion of the conductor (580). That is, the organic layer (507) extends along the first conductor layer (508') and covers the upper portion of the first conductor layer (508'). The organic layer (507) may cover the entire upper surface of the first conductor layer (508'), but may cover only the edges without covering the middle portion of the upper surface. The organic layer (507) may be the same material as the flattening layer covering the upper portion of the thin-film transistor in the display area. When the organic layer (507) covers the side of the conductor (580) in this way, the occurrence of the side groove (S) described in FIG. 4c can be prevented. In addition, damage such as cracking caused by this is prevented, and the penetration of foreign substances such as moisture is also prevented.

[0076] The organic layer (507) has at least one disconnected section that is disconnected in the extensional direction, as shown in FIG. 5a or 5b. The disconnected section is provided to block the propagation of moisture through the organic layer (507) as described in FIG. 3. For example, the organic layer (507) may be disconnected near the jumping structure. The disconnected section may be provided in one or several types of wires as needed. The length of the disconnected section may be a distance at which moisture transmission is effectively blocked, for example, 20 micrometers (μm) to 50 micrometers (μm). Through such a structure, the organic layer involved in the propagation of moisture is minimized. That is, looking at the exemplary structure shown in FIG. 5, even if moisture penetrates at any point, the disconnected section prevents the moisture from spreading far through the organic layer. Accordingly, the organic light-emitting display device according to the embodiments of the present specification can have its reliability further improved by preventing defects and / or quality degradation caused by moisture penetration.

[0077] At least one of the first lower wire (104') and the second lower wire (106') may pass under the above wire (580). As previously described, the display area is provided at a high resolution, and the non-display area is reduced, and the number of intersecting wires is very large. The first lower wire (104') or the second lower wire (106') may be made of the same material as the gate electrode of the thin-film transistor (TFT) included in the pixel of the display area. The above wire (580) may be extended while passing through a bending section (B) that bends at a predetermined angle. At this time, the above wire (580) has a stress-reducing shape in the bending section (B). In FIG. 4a, the above wire (580) is exemplified as having a diamond-shaped stress-reducing shape in the bending section (B).

[0078] A coating layer may be provided to protect the conductors in the bending section (B) from moisture and other foreign substances. The coating layer has sufficient flexibility to be used in the bending section (B). The coating layer may be coated with a thickness determined to adjust the neutral plane in the bending section (B). More specifically, the thickness added by the coating layer in the bending section (B) may move the plane of the conductor and / or wiring structure closer to the neutral plane. Additionally, the coating layer is preferably a material that cures at low energy within a limited time so that the underlying components are not damaged during the curing process. As an example, the coating layer may be formed from a photo-curable acrylic resin (e.g., UV light, visible light, etc.). Additionally, one or more hygroscopic materials (getters) may be mixed into the coating layer to suppress the penetration of moisture through the coating layer.

[0079] Although the embodiments of this specification have been described in detail with reference to the attached drawings, this specification is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical concept. Accordingly, the embodiments disclosed in this specification are intended to explain, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments. The features of each of the various embodiments of the invention may be combined or combined with one another, either partially or wholly, and may be technically interconnected and operated in various ways by those skilled in the art. Furthermore, each embodiment may be implemented independently of one another or together in an associated relationship. The scope of protection of the invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the invention.

Claims

Claim 1 A pixel disposed in a display area; a wire extending from a connection interface to the display area, located in a non-display area surrounding the display area; and an organic layer extending along the wire and covering the edge of the wire, wherein the display area comprises a substrate, a thin-film transistor disposed on the substrate, a planarization layer disposed to cover the thin-film transistor, and an organic light-emitting device disposed on the planarization layer, comprising a first electrode, an organic light-emitting layer, and a second electrode, and the wire comprises a first conductor layer; An organic light-emitting display device comprising: a first conductor layer and a second conductor layer connecting a disconnected portion of the first conductor layer on top of the first conductor layer, wherein the first conductor layer is formed of the same material as the source electrode or drain electrode of the thin-film transistor, and the second conductor layer is formed of the same material as the touch sensing element on top of the encapsulation layer covering the pixel, and wherein the first conductor layer and the second conductor layer have a jumping structure in which they are electrically connected to each other, and in the region overlapping with the jumping structure, the organic material layer has at least one disconnected section in the extension direction. Claim 2 delete Claim 3 In claim 1, the organic light-emitting display device having a multilayer structure in which the first conductor layer is formed by stacking titanium (Ti), aluminum (Al), and titanium (Ti) in sequence. Claim 4 delete Claim 5 delete Claim 6 An organic light-emitting display device according to claim 1, further comprising a buffer layer below the second conductor layer. Claim 7 In claim 1, the wire is a low-level power source (V) to the pixel of the display area. SS An organic light-emitting display device that is a conductor transmitting ). Claim 8 In claim 7, the wire is an organic light-emitting display device surrounding the entire display area. Claim 9 In claim 1, the wire is a high-level power source (V) to the pixel of the display area. DD ) or initialization power (V INI An organic light-emitting display device that is a conductor transmitting ). Claim 10 An organic light-emitting display device according to claim 1, wherein at least one of a first lower wire and a second lower wire passes under the wire. Claim 11 In claim 10, the organic light-emitting display device wherein the first lower wire or the second lower wire is made of the same material as the gate electrode of the thin-film transistor. Claim 12 An organic light-emitting display device comprising: one or more pixel circuits; power wiring that transmits power to the pixel circuits; and an organic layer covering at least a portion of the power wiring, wherein the power wiring comprises a plurality of first conductors spaced apart from each other on the same layer; and a second conductor connecting the first conductors above the first conductors, wherein the second conductor has a jumping structure that directly contacts each of the plurality of first conductors, and has at least one disconnected section in which the connection of the organic layer is broken in an area overlapping with the jumping structure. Claim 13 In claim 12, the second conductor is an organic light-emitting display device that is made of the same material as a touch sensing element located on the upper part of the encapsulation layer or a bridge connecting the touch sensing element. Claim 14 delete Claim 15 An organic light-emitting display device according to claim 12, wherein the organic layer is formed of the same material as the planarization layer covering the top of a thin-film transistor in a display area.

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