Insert injection apparatus for forming a resin coating layer inside a pipe

Abstract

An insert injection device for forming a resin coating layer inside a pipe is disclosed. The disclosed insert injection device for forming a resin coating layer inside a pipe comprises: a pipe fixing part for fixing the pipe; an insert member for moving an insertion part inserted into the interior of the pipe while spaced apart from the inner surface of the pipe; an injection member for inserting resin into an injection space which is a spaced-apart space between the inner surface of the pipe and the insertion part; and a cooling member for curing the resin coated on the inner surface of the pipe.

Description

Technology Field

[0001] The present invention relates to an insert injection device with improved process efficiency, and more specifically, to an insert injection device for forming a resin coating layer inside a pipe with high process efficiency. Background Technology

[0003] Multiple pipes can be connected to each other to create a path for fluid to move.

[0004] With the development of industry, there are frequent instances of using chemicals harmful to the human body within processes, and these fluid chemicals travel within the process along pipes installed therein.

[0005] However, fluid chemicals often cause internal damage to pipes due to physical and chemical reactions, which reduces the pipes' durability and has resulted in dangerous situations where chemicals leak to the outside.

[0006] Therefore, recently, pipes are being used with an additional coating applied to the inside, but the manufacturing of coated pipes involved assembling the pipe and the coated part by joining the coated part to the inside of the pipe.

[0007] Consequently, there was a problem in which the manufacturing efficiency of coated pipes was significantly reduced because the coated parts became separated due to the bonding force between the pipe and the coated parts, or because a large amount of time and cost was consumed in the fixed bonding process between the pipe and the coated parts.

[0008] In addition, there were difficulties in forming a profile to control fluid flow in the coating inside the pipe.

[0009] Related literature includes Korean registered patents No. 10-2006602, No. 10-1898443, and No. 10-1672542. The problem to be solved

[0011] The present invention is intended to provide an insert injection device for forming a resin coating layer inside a pipe with high process efficiency. means of solving the problem

[0013] According to one embodiment of the present invention for achieving the above objective, an insert injection device for forming a resin coating layer inside a pipe is provided, comprising: a pipe fixing part for fixing a pipe; an insert member for moving an insertion part inserted into the interior of the pipe while spaced apart from the inner surface of the pipe; an injection member for inserting a resin into an injection space which is a spaced-apart space between the inner surface of the pipe and the insertion part; and a cooling member for curing a resin coated on the inner surface of the pipe.

[0014] Additionally, according to another embodiment of the present invention for achieving the above objective, the invention comprises: a first die having a first mold formed as part of the outer shape of a pipe; a second die having a second mold formed as a shape complementary to the first mold, which is positioned to face the first die and can be coupled with the first die; an insert member axially connected on the second die and selectively inserted into the interior of a pipe fixed to the second die; an injection member positioned on the second die and inserting resin into an injection space between the pipe fixed to the second die and the insert member; a cooling member having the first mold and the second mold, positioned to surround the outer surface of the pipe fixed to the second die, and curing the resin coated on the inner surface of the pipe; and a processor connected to the first die, the second die, the insert member, the cooling member, and the injection member to control the first die, the second die, the cooling member, the insert member, and the injection member, wherein the insert member has an outer diameter that is on the second die An insert injection device is provided that forms a resin coating layer inside a pipe by repeatedly moving the insert portion, which is smaller than the inner diameter of a fixed pipe, a sealing portion connected to the rear of the insert portion to seal the injection space formed between the insert portion and the pipe from the outside, and a driving portion connected to the sealing portion to move the insert portion and the sealing portion; the insert portion is spaced apart from the pipe fixed to the second die in a first state, and the insert portion is inserted into the pipe fixed to the second die to form the injection space between the pipe and the insert portion. Effects of the invention

[0016] According to one embodiment of the present invention, by injecting resin into the inner surface of a pipe and simultaneously curing the resin, the process time for coating the inner surface of a pipe can be significantly reduced.

[0017] In addition, according to one embodiment of the present invention, process efficiency can be significantly improved by automatically performing a series of processes for coating the inner surface of a pipe without a separate process of bonding a cured resin inside the pipe.

[0018] In addition, according to one embodiment of the present invention, since a profile for forming vortices and turbulence inside a pipe can be formed simultaneously with cooling the resin, manufacturing efficiency can be greatly improved. Brief explanation of the drawing

[0020] FIG. 1 is a combined perspective view showing an insert injection device for forming a resin coating layer inside a pipe according to one embodiment of the present invention. FIG. 2 is an exploded perspective view showing an insert injection device for forming a resin coating layer inside a pipe according to one embodiment of the present invention. FIG. 3 is an exploded perspective view of a first die according to one embodiment of the present invention. FIG. 4 is a perspective view showing an insert member according to one embodiment of the present invention. FIG. 5 is a top view showing a first state in which an insertion part is spaced apart from a pipe according to one embodiment of the present invention. FIG. 6 is a top view showing a second state in which an insertion part according to one embodiment of the present invention is inserted into a pipe. Figure 7 is an enlarged view showing area A of Figure 6. FIG. 8 is a cross-sectional view showing the state in which an insert is inserted into a pipe according to one embodiment of the present invention. FIG. 9 is a cross-sectional view showing the first die and the second die combined with an insertion part inserted into a pipe according to one embodiment of the present invention. Figure 10 is an enlarged view showing the state in which resin is injected into the injection space in the state of Figure 9. FIG. 11 is a cross-sectional view showing the cooling of a resin filled in an injection space according to one embodiment of the present invention. FIG. 12 is a cross-sectional view showing a protrusion-forming part rotating in a protruding state according to one embodiment of the present invention. FIG. 13 is a perspective view showing a coated pipe according to one embodiment of the present invention. Specific details for implementing the invention

[0021] In order to fully understand the structure and effects of the present invention, preferred embodiments of the present invention are described with reference to the attached drawings. However, the present invention is not limited to the embodiments described below, but can be implemented in various forms and various modifications can be made. The description of the embodiments is provided merely to ensure that the invention is complete and to fully inform those skilled in the art of the scope of the invention. In the attached drawings, the components are depicted with their sizes enlarged compared to their actual size for convenience of explanation, and the proportions of each component may be exaggerated or reduced.

[0022] Where a component is described as being "on" or "in contact" with another component, it should be understood that while it may be directly touching or connected to the other component, there may also be another component in between. On the other hand, where a component is described as being "immediately on" or "in contact" with another component, it should be understood that there is no other component in between. Other expressions describing the relationship between components, such as "between" and "directly between," can be interpreted in the same way.

[0023] Terms such as "first," "second," etc., may be used to describe various components, but said components shall not be limited by said terms. Such terms may be used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0024] A singular expression includes a plural expression unless the context clearly indicates otherwise. Terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and may be interpreted as implying that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may be added.

[0025] Unless otherwise defined, the terms used in the embodiments of the present invention may be interpreted in the sense commonly known to those skilled in the art.

[0026] Hereinafter, an insert injection device for forming a resin coating layer inside a pipe according to an embodiment of the present invention will be described with reference to FIGS. 1 to 13.

[0028] FIG. 1 is a combined perspective view showing an insert injection device (1) forming a resin coating layer inside a pipe according to one embodiment of the present invention, FIG. 2 is an exploded perspective view showing an insert injection device (1) forming a resin coating layer inside a pipe according to one embodiment of the present invention, FIG. 3 is an exploded perspective view of a first die (100) according to one embodiment of the present invention, and FIG. 4 is a perspective view showing an insert member (300) according to one embodiment of the present invention.

[0029] An insert injection device (1) according to one embodiment of the present invention is a device for coating the inside of a pipe (P) by an insert injection method, and includes a pipe fixing part, an insert member, an injection member, and a cooling member.

[0030] The pipe fixing part fixes the pipe and may include a first die (100) and a second die (200). A first frame (S1, see FIG. 3) which is part of the outer shape of the pipe (P) is formed in the first die (100). The second die (200) is positioned to face the first die (100) and can be combined with the first die (100), and a second frame (S2) which has a shape complementary to the first frame (S1) is formed in the second die (200).

[0031] The insert member (300) moves the insert portion inserted into the interior of the pipe while being spaced apart from the inner surface of the pipe. The insert member (300) is axially connected to the second die (200), so that the insert portion can be selectively inserted into the interior of the pipe (P) fixed to the second die (200).

[0032] The injection member (400) inserts resin into the injection space, which is a spaced-apart space between the inner surface of the pipe and the insertion part. The injection member (400) can insert resin (E, see FIG. 10) into the space between the pipe (P) fixed to the second die (200) and the insert member (300) by being placed in the second die (200).

[0033] And the cooling member (500) cures the resin coated on the inner surface of the pipe. The cooling member (500) is positioned between the first die (100) and the first mold (S1) and between the second die (200) and the second mold (S2) to cure the resin.

[0034] The first die (100) is positioned on the upper part of the second die (200) and can be located on the upper part of the insert injection device (1). In addition, the first die (100) can fix the upper part of the pipe (P) fixed to the second die (200).

[0035] Additionally, the first die (100) may include a first plate (101) having a first frame (S1) formed at the bottom, a first injection part (401, see FIG. 9) of an injection member (400) formed inside the first plate (101) and connecting resin supplied from the outside in the direction of the first frame (S1), and a first cooling part (501) of a cooling member (500) disposed at the bottom of the first plate (101) and cooling the upper area of ​​the pipe (P).

[0036] The first plate (101) can contact the upper region of the pipe (P) to fix the upper region of the pipe (P) and can contact the upper surface of the second die (200).

[0037] The shape of the first plate (101) can vary, and it is sufficient if it is large enough to cover the pipe (P) fixed to the second die (200).

[0038] As shown in FIG. 9, the first injection part (401) forms an injection member (400) together with the second injection part (402) disposed inside the second die (200), and can form a path through which a resin (E) is injected to coat the inner surface of the pipe (P).

[0039] In addition, the first cooling unit (501) is positioned on the lower surface of the first plate (101) and can be positioned between the first die (100) and the first frame (S1). Here, the first frame (S1) may have a shape corresponding to the upper region of the pipe (P).

[0040] A cooling channel (not shown) through which cooling water flows may be arranged adjacent to the first frame (S1) inside the first cooling unit (501). Accordingly, when a pipe (P) is arranged in the first cooling unit (501), after resin is applied to the inside of the pipe (P), the first cooling unit (501) can cool the upper region of the pipe (P).

[0041] The second die (200) is positioned below the first die (100) and may be located below the insert injection device (1) that forms a resin coating layer inside the pipe. In addition, the second die (200) can fix the lower part of the pipe (P) fixed to the second die (200).

[0042] That is, the second die (200) can fix the lower region of the pipe (P) for coating the inner surface, and the first die (100) can fix the upper region of the pipe (P).

[0043] In addition, a second frame (S2) corresponding to the lower shape of the pipe (P) is formed on the upper part of the second die (200), and a second injection part (402) connected to the first injection part (401) and supplied through the first injection part (401) can be arranged to inject the resin into the second injection space (C2) inside the pipe (P).

[0044] The second frame (S2) can form the outer shape of the pipe (P) together with the first frame (S1) formed on the lower surface of the first die (100). In addition, the second frame (S2) can be positioned facing the first frame (S1).

[0045] Accordingly, when the pipe (P) is seated on the second frame (S2) of the second die (200) and the first die (100) is combined with the second die (200), the first frame (S1) and the second frame (S2) can come into contact with the outer surface of the pipe (P) and wrap around the outer surface of the pipe (P).

[0046] Additionally, the second frame (S2) may correspond to the lower shape of the pipe (P), and the second cooling unit (502) may be positioned between the second die (200) and the second frame (S2).

[0047] The second injection part (402) forms an injection member (400) together with the first injection part (401), and is connected to the first injection part (401) so that resin supplied from the outside can be guided into the second injection space (C2).

[0048] That is, the injection member (400) is composed of a first injection part (401) disposed in the first die (100) and a second injection part (402) disposed in the second die (200), and can form a path for resin to flow into the pipe (P) through the first injection part (401) and the second injection part (402). The second injection part (402) can be formed to penetrate the first frame (S1) and be connected to the first injection space (C1) described later.

[0049] In addition, a valve (not shown) connected to a processor (10) is disposed inside the injection member (400), so that the injection speed and amount of resin flowing into the injection member (400) can be controlled by the control of the processor (10).

[0050] The second cooling unit (502) is positioned on the upper part of the second die (200), and a second frame (S2) corresponding to the lower shape of the pipe (P) can be formed in the second cooling unit (502).

[0051] A cooling channel (not shown) through which cooling water flows may be arranged adjacent to the second frame (S2) inside the second cooling section (502). Accordingly, when a pipe (P) is arranged in the second cooling section (502), the second cooling section (502) can cool the lower region of the pipe (P) after resin is applied to the inside of the pipe (P).

[0052] Additionally, an insert injection device (1) according to one embodiment of the present invention may include a processor (10) and a memory (20). The processor (10) is embedded in the insert injection device (1) and can perform overall control of the insert injection device (1).

[0053] For example, the processor (10) can be connected to the first die (100), the second die (200), the insert member (300), the injection member (400), and the cooling member (500) to control each of them. That is, the operation and control of each device described below can be performed by the processor (10).

[0054] Here, the processor (10) may include one or more of a central processing unit (CPU), a controller, an application processor (AP), a communication processor (CP), and an ARM processor.

[0055] The memory (20) is contained within the insert injection device (1) and, specifically, can be implemented as at least one of a flash memory type, ROM, RAM, hard disk type, multimedia card micro type, or card type memory (e.g., SD or XD memory, etc.).

[0056] The memory (20) can store the operation and control process of the pre-set insert injection device (1).

[0057] The insert member (300) can be selectively inserted into the pipe (P) seated in the second die (200) to form a second injection space (C2) inside the pipe (P) into which a resin for coating the inner surface of the pipe (P) is injected.

[0058] Specifically, the insert member (300) may include an insertion part (321) having an outer diameter (321D, see FIG. 10) smaller than the inner diameter (PD, see FIG. 10) of a pipe (P) fixed to the second die (200), a sealing part (320) connected to the rear of the insertion part (321) to seal the injection space (C1, C2) formed between the insertion part (321) and the pipe (P) from the outside, and a driving part (330) connected to the sealing part (320) to move the insertion part (321) and the sealing part (320).

[0059] Referring to FIG. 10, the insertion part (321) may have an outer diameter (321D) smaller than the inner diameter (PD) of the pipe (P) fixed to the second die (200).

[0060] Accordingly, as illustrated in FIG. 10, when the insertion part (321) is inserted into the pipe (P), a second injection space (C2) in which resin can be injected can be formed between the inner surface of the pipe (P) and the outer surface of the insertion part (321).

[0061] The sealing part (320) is placed at the end of the pipe (P) to prevent the resin from leaking out.

[0062] In addition, the sealing part (320) may come into direct contact with the pipe (P). Also, the sealing part (320) may be spaced apart from the end of the pipe (P) so that resin can be injected up to the end of the pipe (P) by contacting the end of the first frame (S1) and the second frame (S2).

[0063] The shape of the insert portion (321) may correspond to the internal shape of the pipe (P), and the insert portion (321) may be selectively replaced with the insert member (300) according to the shape of the pipe (P).

[0064] Additionally, referring to FIG. 7, the insertion part (321) may include an insertion protrusion (321a) that protrudes further than the pipe (P) when inserted into the pipe (P).

[0065] Accordingly, the insertion protrusion (321a) can form a first injection space (C1) for injecting resin into the inner surface of the pipe (P). That is, a pre-set space is formed between the insertion protrusion (321a) and the first frame (S1), and this space corresponds to the first injection space (C1). The first injection space (C1) is connected to the second injection space (C2).

[0066] Accordingly, the resin can be evenly injected into the second injection space (C2) on the inner surface of the pipe (P) along the first injection space (C1) formed along the outer surface of the insertion protrusion (321a) that protrudes further than the pipe (P).

[0067] Additionally, the insertion part (321) may include a projection forming part (322) that selectively protrudes from the surface of the insertion part (321) to form a screw profile inside the pipe (P).

[0068] The protrusion forming part (322) can be selectively protruded by the processor (10), and can be protruded by the processor (10) after the resin injected into the injection space (C1, C2) has been cooled for a preset cooling time. Here, the resin (E) may be in a state before being completely cooled.

[0069] In addition, the processor (10) can pressurize the sealing part (320) to seal the inside of the pipe (P) based on information that the processor (10) recognizes a leak in the second injection space (C2) by the sensor (600, see FIG. 13).

[0070] For example, the processor (10) can adjust the pressure of the sealing part (320) using information from the sensor (600) that is measured in real time. Here, the sensor (600) may include a camera, a 3D scanning sensor, a pressure sensor, etc.

[0071] In addition, the sensor (600) may be placed in at least one of the first die (100) and the second die (200).

[0072] Accordingly, the processor (10) can prevent the resin from leaking by additionally pressurizing the sealing part (320). Here, the sealing part (320) can be pressurized by the driving part (330).

[0073] The driving unit (330) is connected to the sealing unit (320) and can move the insertion unit (321) and the sealing unit (320). That is, the driving unit (330) can provide a driving force that repeatedly moves between the first state and the second state.

[0075] Hereinafter, with reference to FIGS. 5 to 12, the operation of an insert injection device (1) according to one embodiment of the present invention will be described in detail.

[0076] FIG. 5 is a top view showing a first state in which an insertion part (321) according to an embodiment of the present invention is spaced apart from a pipe (P); FIG. 6 is a top view showing a second state in which an insertion part (321) according to an embodiment of the present invention is inserted into a pipe (P); FIG. 7 is an enlarged view showing area A of FIG. 6; FIG. 8 is a cross-sectional view showing a state in which an insertion part (321) is inserted into a pipe (P) according to an embodiment of the present invention; FIG. 9 is a cross-sectional view showing that a first die (100) and a second die (200) are combined in a state in which an insertion part (321) is inserted into a pipe (P) according to an embodiment of the present invention; FIG. 10 is an enlarged view showing a state in which resin (E) is injected into injection spaces (C1, C2) in the state of FIG. 9; FIG. 11 is a cross-sectional view showing that the resin (E) filled in injection spaces (C1, C2) is cooled according to an embodiment of the present invention; FIG. 12 is a view according to an embodiment of the present invention This is a cross-sectional view showing the protrusion-forming part (322) rotating in a protruding state.

[0077] First, as shown in FIGS. 5 and 8, a pipe (P) can be placed on the second die (200) while the first die (100) and the second die (200) are spaced apart.

[0078] At this time, the pipe (P) can be stably fixed on the second frame (S2) formed in the second die (200) and the second cooling unit (502).

[0079] In addition, the insert member (300) may be in a first state in which the insert part (321) is spaced apart from the pipe (P) fixed to the second die (200).

[0080] Here, the processor (10) can determine the seating status of the pipe (P) through the sensor (600). Accordingly, if the pipe (P) is not seated in the correct position, the processor (10) can notify the user of the status by turning on a warning light or sounding a warning.

[0081] Next, as illustrated in FIGS. 6 and 9, the insert member (300) moves in the direction of Q1 where the pipe (P) is located, and the insert portion (321) of the insert member (300) can be inserted into the pipe (P).

[0082] Accordingly, the insert member (300) may be in a second state in which the insert portion (321) is inserted into the pipe (P) fixed to the second die (200) to form an injection space (C1, C2) between the pipe (P) and the insert portion (321).

[0083] Here, the injection space may include a first injection space (C1) formed along the outer surface of the insertion protrusion (321a) and a second injection space (C2) connected to the first injection space (C1) and formed between the inner surface of the pipe (P) and the outer surface of the insertion part (321).

[0084] In addition, the lower and end portions of the pipe (P) can be covered by the second die (200), the second cooling portion (501), and the sealing portion (320).

[0085] Afterward, as shown in FIG. 1, the first die (100) can be joined to the upper part of the second die (200). Accordingly, the entire outer surface of the pipe (P) can be sealed by the first die (100), the second die (200), and the sealing part (320).

[0086] Here, the sensor (600) can measure the size of the second injection space (C2) formed between the inner surface of the pipe (P) and the outer surface of the insertion part (321) in real time, and can also measure the size of the remaining space in the second injection space (C2) where resin is not injected in real time.

[0087] Subsequently, as illustrated in FIG. 14, the processor (10) can control the injection member (400) to inject resin (E) in the injection direction (R) through the first injection part (401) and the second injection part (402) of the injection member (400). The resin can be injected into the second injection space (C) through the second injection part (402) and the first injection space (C1).

[0088] At this time, the processor (10) can determine the amount of resin (E) to be filled into the injection space (C1, C2) and the injection speed according to the size of the measured injection space (C1, C2).

[0089] That is, the processor (10) can determine the size of the injection space and the injection speed of the resin to fill the injection space based on the preset time for coating one pipe (P).

[0090] At this time, the resin may be composed of various types of mixed resin materials, but the fluidity and cooling rate according to viscosity may differ depending on the type. Accordingly, based on the viscosity and cooling rate information of the resin (E) stored in the memory (20), the processor (10) can determine the injection rate of the resin (E).

[0091] In addition, the processor (10) can inject resin (E) into the injection spaces (C1, C2) at a first speed and simultaneously cool the injected resin (E) through the cooling member (500), and inject resin at a second speed slower than the first speed based on the remaining second injection space (C2) measured in real time. That is, the processor (10) can reduce the injection speed of the resin according to the size of the remaining space in which resin is not injected among the injection spaces, and if the size of the remaining space decreases to below a preset threshold size, the injection speed of the resin can be reduced to a second speed.

[0092] Here, the cooling member (500) is positioned to surround the outer surface of a pipe (P) fixed to a second die (200) having a first frame (S1) and a second frame (S2), and can cure the resin (E) coated on the inner surface of the pipe (P).

[0093] Accordingly, when the resin (E) fills the injection space at a first speed and cools down to a certain extent, the viscosity of the resin (E) filling the injection space can increase.

[0094] Afterwards, by injecting the resin (E) at a second speed slower than the first speed, the rapid flow of the resin (E) with increased viscosity is prevented, thereby preventing overloading of the injection member (400) and achieving stable flow of the resin (E) while cooling, and at the same time, the overall cooling speed of the resin (E) can be improved.

[0095] Additionally, the processor (10) can determine the cooling time of the resin (E) based on the size of the injection space (C1, C2) that is filled in real time and the remaining space among the injection space (C1, C2).

[0096] That is, since the resin (E) injected into the injection space (C1, C2) is simultaneously injected and cooled, the processor (10) can determine the remaining cooling time by considering the speed and fluidity of the resin (E) filling the injection space (C1, C2).

[0097] Afterward, the processor (10) can determine the injection speed and cooling time by comparing the time for coating the resin (E) inside the pipe (P) with the preset time based on the overall cooling time and injection speed.

[0098] In addition, the processor (10) can determine the cooling time based on at least one of the size of the injection space (C1, C2) measured by the sensor (600) and the viscosity and cooling rate of the resin (E) stored in the memory (20) before injecting the resin.

[0099] For example, as the size of the injection space (C1, C2) increases, the cooling time may be longer, and as the viscosity of the resin (E) increases, the injection speed of the resin (E) slows down, so the cooling time may be increased.

[0100] Meanwhile, as illustrated in FIG. 12, the processor (10) can protrude the protrusion-forming part (322) before the resin (E) is completely cooled after filling the injection space (C1, C2). That is, the processor (10) can protrude the protrusion-forming part (322) after the resin (E) injected into the injection space (C1, C2) has cooled for a preset time determined by the cooling time determined by the processor (10).

[0101] Accordingly, even if the insert member (300) moves backward while the protrusion forming part (322) protrudes and the insert part (321) rotates, the resin (E) inserted into the injection space (C1, C2) is in a state of being hardened to a certain degree, so it may not flow out to the outside.

[0102] Afterwards, the processor (10) rotates the insertion part (321) while the protrusion forming part (322) is protruding, and simultaneously moves the insert member (300) backward to form a screw thread on the inner circumference of the pipe (P), and as the insert member (300) moves backward, the resin (E) injected into the injection space (C1, C2) through the cooling member (500) can be continuously cooled.

[0103] Here, the insertion part (321) can be rotated clockwise or counterclockwise (K1, K2) with respect to the central axis of the insertion part (321), and the processor (10) can determine the rotation time (PRM, etc.) and the speed at which the insert member (300) moves backward by considering the shape of the profile to be formed inside the pipe (P).

[0104] Additionally, the processor (10) can determine the speed at which the insert member (300) moves backward based on the cooling state of the resin (E).

[0105] Next, after a certain cooling time, the resin (E) becomes cooled, and the first die (100) and the second die (200) are separated, so that a coated pipe (P) as shown in FIG. 16 can be completed.

[0106] Accordingly, the insert injection device (1) for forming a resin coating layer inside a pipe according to one embodiment of the present invention can significantly reduce the process time for coating the inner surface of a pipe (P) by simultaneously injecting and curing a resin (E) on the inner surface of a pipe (P) while the pipe (P) is continuously inserted.

[0107] In addition, the insert injection device (1) that forms a resin coating layer inside the pipe automatically performs a series of processes, so there is no separate process of bonding the cured resin (E) inside the pipe (P), and thus the process efficiency can be greatly improved.

[0108] In addition, even when a profile is required to form vortices and turbulence inside the pipe (P), the resin (E) can be cooled and the profile formed simultaneously, so manufacturing efficiency can be greatly improved.

[0110] Although various embodiments of the present invention have been described individually above, each embodiment is not required to be implemented alone, and the configuration and operation of each embodiment may be implemented in combination with at least one other embodiment.

[0111] Furthermore, although preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above. Various modifications are possible by those skilled in the art without departing from the essence of the invention as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present invention.

Claims

Claim 1 An insert injection device for forming a resin coating layer inside a pipe, comprising: a pipe fixing part for fixing the pipe; an insert part inserted into the interior of the pipe while spaced apart from the inner surface of the pipe; an insert member for moving the insert part; an injection member for inserting resin into an injection space which is a spaced-apart space between the inner surface of the pipe and the insert part; a cooling member for curing the resin coated on the inner surface of the pipe; a sensor for measuring the size of the injection space and the size of the remaining space in the injection space where the resin is not injected; and a processor for controlling the insert injection device, wherein the processor determines the amount of resin injected into the injection space and the injection speed according to the size of the remaining space. Claim 2 An insert injection device for forming a resin coating layer inside a pipe, wherein the pipe fixing part comprises: a first die having a first frame formed therein, which is part of the outer shape of the pipe; and a second die arranged to face the first die and capable of being coupled with the first die, having a second frame formed therein, which has a shape complementary to the first frame. Claim 3 In claim 2, the cooling member is disposed between the first die and the first mold, and between the second die and the second mold, to form a resin coating layer inside a pipe that cures the resin, an insert injection device. Claim 4 An insert injection device for forming a resin coating layer inside a pipe, comprising: an insert member including an insert portion having an outer diameter smaller than the inner diameter of the pipe, a sealing portion connected to the rear surface of the insert portion to seal the injection space from the outside; and a driving portion connected to the sealing portion to move the insert portion and the sealing portion. Claim 5 delete Claim 6 In claim 1, the processor forms an insert injection device that reduces the injection speed from a first speed to a second speed according to the size of the remaining space, thereby forming a resin coating layer inside the pipe. Claim 7 In claim 6, the processor determines the cooling time of the resin according to at least one of the size of the injection space, the viscosity of the resin stored in memory, and the cooling rate information, and forms a resin coating layer inside the pipe, an insert injection device. Claim 8 In claim 1, the insert portion includes a projection-forming portion that selectively protrudes from the surface of the insert portion to form a screw profile inside the pipe, and the processor forms a resin coating layer inside the pipe by protruding the projection-forming portion after the resin injected into the injection space has been cooled for a preset cooling time. Claim 9 In claim 8, the processor forms an insert injection device that forms a resin coating layer inside a pipe by rotating the insert part while the protrusion-forming part is in a protruding state and simultaneously moving the insert member backward to form a screw thread on the inner circumference of the pipe.

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