Manufacturing method of display device and apparatus for manufacturing display device

Abstract

A method for manufacturing a display device according to one embodiment of the present disclosure may include the step of providing an ink comprising light-emitting elements on a manufacturing substrate; and the step of aligning the light-emitting elements using a mold comprising a plurality of groove patterns.

Description

Technology Field

[0001] The present disclosure relates to a method for manufacturing a display device and an apparatus for manufacturing a display device. Background Technology

[0002] With the recent rise in interest in information displays, research and development on display devices is continuously being carried out. The problem to be solved

[0003] One objective of the present disclosure is to provide a method for manufacturing a display device and an apparatus for manufacturing a display device, wherein the alignment of light-emitting elements is improved. means of solving the problem

[0004] According to one embodiment of the present disclosure, a method for manufacturing a display device may be provided, comprising the steps of: providing an ink containing light-emitting elements on a manufacturing substrate; and aligning the light-emitting elements using a mold having a plurality of groove patterns.

[0005] According to an embodiment, a method for manufacturing a display device may be provided, wherein the step of aligning the light-emitting elements comprises: a step of a pressure placed on one side of the mold pushing the mold; a step of the mold applying pressure to the light-emitting elements; and a step of aligning the light-emitting elements in correspondence with the plurality of groove patterns of the mold.

[0006] According to an embodiment, a method for manufacturing a display device may be provided, wherein the mold includes light-emitting element regions, and the step of applying pressure to the light-emitting elements is performed such that each position where the light-emitting elements are aligned corresponds to each position of the light-emitting element regions.

[0007] According to an embodiment, a method for manufacturing a display device may be provided, wherein the light-emitting element region is a groove region formed in the mold.

[0008] According to an embodiment, a method for manufacturing a display device may be provided, wherein the step of aligning the light-emitting elements includes the step of the plurality of groove patterns of the mold contacting the light-emitting elements disposed on the manufacturing substrate.

[0009] According to an embodiment, a method for manufacturing a display device may be provided, wherein the mold has a roller shape, and the step of aligning the light-emitting elements includes the step of rolling the mold on the manufacturing substrate.

[0010] According to an embodiment, a method for manufacturing a display device may be provided, wherein the step of aligning the light-emitting elements includes the step of a pressure having a roller shape rolling on the mold so that the mold applies pressure to the light-emitting elements.

[0011] According to an embodiment, a method for manufacturing a display device may be provided, further comprising the step of providing a bank protruding in the thickness direction of the manufacturing substrate on the manufacturing substrate; the step of providing ink includes the step of receiving the ink within a space defined by the bank; the mold includes a base portion; and a protrusion connected to the base portion; and includes a mold movement limiting region where the protrusion is not disposed; and the step of aligning the light-emitting elements includes the step of applying pressure to the light-emitting element in a part of the mold; and the step of the mold contacting the bank in the mold movement limiting region.

[0012] According to an embodiment, a method for manufacturing a display device may be provided, further comprising the step of cleaning the surface of the mold with a cleaning device after the step of aligning the light-emitting elements.

[0013] According to an embodiment, a method for manufacturing a display device may be provided, further comprising the step of a cleaning device cleaning the surface of the mold; wherein the mold has a roller shape, the area of ​​the outer surface along the circumference of the mold is smaller than the area of ​​the manufacturing substrate, and the step of cleaning the surface of the mold is performed simultaneously with the step of aligning the light-emitting elements.

[0014] According to an embodiment, a method for manufacturing a display device may be provided, further comprising the steps of: providing an alignment electrode on the manufacturing substrate; and forming an electric field using the alignment electrode, wherein the light-emitting elements are aligned based on the electric field.

[0015] According to an embodiment, a method for manufacturing a display device may be provided in which the step of forming the electric field and the step of aligning the light-emitting elements using the mold are performed simultaneously.

[0016] According to an embodiment, a method for manufacturing a display device may be provided, wherein the mold comprises a base portion and a protrusion connected to the base portion, the protrusion comprises a light-emitting element region formed by incorporating a portion thereof, and the direction in which the light-emitting elements aligned on the manufacturing substrate extend is the same as the direction in which the light-emitting element region extends.

[0017] According to an embodiment, a method for manufacturing a display device may be provided in which the mold has elastic properties.

[0018] According to one embodiment of the present disclosure, a display device manufactured according to a method for manufacturing a display device may be provided.

[0019] According to one embodiment of the present disclosure, a manufacturing apparatus for a display device may be provided, comprising: a mold disposed on a stage; and a pressure configured to apply pressure toward the stage from the mold to the mold, wherein the mold comprises: a base portion; and a protrusion connected to the base portion and including a groove area formed by a portion of the protrusion being recessed.

[0020] According to an embodiment, a manufacturing device for a display device may be provided, wherein the pressure and the mold can be moved to be adjacent to or spaced apart from the stage.

[0021] According to an embodiment, a manufacturing device for a display device may be provided, wherein the mold has a roller shape.

[0022] According to an embodiment, a manufacturing device for a display device may be provided, wherein the pressure has a roller shape.

[0023] According to an embodiment, a manufacturing device for a display device may be provided, further comprising a probe device disposed on the stage and providing an electrical signal to form an electric field on a manufacturing substrate provided on the stage. Effects of the invention

[0024] According to one embodiment of the present disclosure, a method for manufacturing a display device and an apparatus for manufacturing a display device may be provided, wherein the alignment of light-emitting elements is improved. Brief explanation of the drawing

[0025] FIGS. 1 and FIGS. 2 are a schematic perspective view and a cross-sectional view showing a light-emitting element according to one embodiment. FIG. 3 is a schematic plan view showing a display device according to an embodiment. FIG. 4 is a schematic plan view showing a subpixel according to an embodiment. FIG. 5 is a schematic cross-sectional view according to I~I' of FIG. 4. FIGS. 6 to 13 are drawings showing a manufacturing apparatus for a display device according to a first embodiment. FIGS. 14 and FIGS. 15 are drawings showing a manufacturing apparatus for a display device according to a second embodiment. FIG. 16 is a drawing showing a manufacturing apparatus for a display device according to a third embodiment. FIGS. 17 to 19 are flowcharts illustrating a method for manufacturing a display device according to an embodiment. FIGS. 20, FIGS. 25, and FIGS. 30 are plan views by process step (or operation) illustrating a method for manufacturing a display device according to an embodiment. FIGS. 21 to 23, FIGS. 26 to 28, FIG. 31, FIG. 32, and FIG. 34 are cross-sectional views by process step (or operation) showing a manufacturing apparatus for a display device according to an embodiment. FIGS. 24, FIGS. 29, and FIGS. 33 are cross-sectional views of process steps (or operations) illustrating a method for manufacturing a display device according to an embodiment. FIG. 35 is a flowchart illustrating a method for manufacturing a display device according to another embodiment. FIG. 36 is a schematic perspective view showing a manufacturing apparatus for a display device according to another embodiment. Specific details for implementing the invention

[0026] The present disclosure is capable of various modifications and may take various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present disclosure to specific forms, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present disclosure.

[0027] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present disclosure, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0028] In this disclosure, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Furthermore, when a part such as a layer, film, region, or plate is described as being "on" another part, this includes not only cases where it is "immediately above" another part, but also cases where there is another part in between. Additionally, in this specification, when a part such as a layer, film, region, or plate is described as being formed "on" another part, the direction in which it is formed is not limited to the upward direction only, but includes cases where it is formed in the lateral or downward direction. Conversely, when a part such as a layer, film, region, or plate is described as being "below" another part, this includes not only cases where it is "immediately below" another part, but also cases where there is another part in between.

[0029] The present disclosure relates to a method for manufacturing a display device and an apparatus for manufacturing a display device. Hereinafter, a method for manufacturing a display device and an apparatus for manufacturing a display device according to an embodiment will be described with reference to the attached drawings.

[0030] Before describing the method for manufacturing a display device ('DD' in FIG. 3) and the apparatus for manufacturing the display device (see '1' in FIG. 6), the light-emitting element (LD) included in the display device (DD) according to the embodiment will be described with reference to FIG. 1 and FIG. 2.

[0031] FIGS. 1 and FIGS. 2 are a schematic perspective view and a cross-sectional view showing a light-emitting element according to one embodiment.

[0032] Although pillar-type light-emitting diodes (LDs) are illustrated in FIGS. 1 and 2, the type and / or shape of the light-emitting diode (LD) is not limited thereto.

[0033] A light-emitting element (LD) may include a second semiconductor layer (SCL2) and a first semiconductor layer (SCL1), and an active layer (AL) interposed between the first and second semiconductor layers (SCL1, SCL2). For example, if the extension direction of the light-emitting element (LD) is the length (L) direction, the light-emitting element (LD) may include a first semiconductor layer (SCL1), an active layer (AL), and a second semiconductor layer (SCL2) sequentially stacked along the length (L) direction. The light-emitting element (LD) may further include an electrode layer (ELL) and an insulating film (INF).

[0034] The light-emitting element (LD) may have a columnar shape extending along one direction. The light-emitting element (LD) may have a first end (EP1) and a second end (EP2). A first semiconductor layer (SCL1) may be adjacent to the first end (EP1) of the light-emitting element (LD), and a second semiconductor layer (SCL2) may be adjacent to the second end (EP2). An electrode layer (ELL) may be adjacent to the first end (EP1).

[0035] A light-emitting element (LD) can be manufactured into a columnar shape through etching methods, etc. In this specification, the columnar shape encompasses rod-like shapes or bar-like shapes that are long in the length (L) direction (i.e., the aspect ratio is greater than 1), such as a cylindrical column or a polygonal column, and the shape of the cross-section is not particularly limited. For example, the length (L) of the light-emitting element (LD) may be greater than its diameter (D) (or the width of the cross-section).

[0036] The light-emitting element (LD) may have a size ranging from the nanoscale to the microscale. For example, the light-emitting element (LD) may each have a diameter (D) (or width) and / or length (L) in the nanoscale to microscale range. However, the size of the light-emitting element (LD) is not limited thereto.

[0037] The first semiconductor layer (SCL1) may be a semiconductor layer of the first conductivity type. The first semiconductor layer (SCL1) is disposed on the active layer (AL) and may include a semiconductor layer of a different type from the second semiconductor layer (SCL2). For example, the first semiconductor layer (SCL1) may include a P-type semiconductor layer. For example, the first semiconductor layer (SCL1) may include at least one semiconductor material among InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include a P-type semiconductor layer doped with a first conductivity type dopant such as Mg. However, the material constituting the first semiconductor layer (SCL1) is not limited thereto, and various other materials may also constitute the first semiconductor layer (SCL1).

[0038] The active layer (AL) is disposed between the first semiconductor layer (SCL1) and the second semiconductor layer (SCL2) and may have a single-quantum well or multi-quantum well structure. The position of the active layer (AL) is not limited to a specific example and can be varied depending on the type of light-emitting device (LD).

[0039] A clad layer doped with a conductive dopant may be formed on the upper and / or lower portions of the active layer (AL). For example, the clad layer may be formed as an AlGaN layer or an InAlGaN layer. Depending on the embodiment, materials such as AlGaN and InAlGaN may be used to form the active layer (AL), and various other materials may also constitute the active layer (AL).

[0040] The second semiconductor layer (SCL2) may be a semiconductor layer of the second conductivity type. The second semiconductor layer (SCL2) is disposed on the active layer (AL) and may include a semiconductor layer of a different type from the first semiconductor layer (SCL1). For example, the second semiconductor layer (SCL2) may include an N-type semiconductor layer. For example, the second semiconductor layer (SCL2) may include any one of the semiconductor materials InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include an N-type semiconductor layer doped with a second conductivity type dopant such as Si, Ge, Sn, etc. However, the material constituting the second semiconductor layer (SCL2) is not limited to this, and the second semiconductor layer (SCL2) may be composed of various other materials.

[0041] When a voltage greater than the threshold voltage is applied across the ends of the light-emitting element (LD), electron-hole pairs combine in the active layer (AL), causing the light-emitting element (LD) to emit light. By controlling the light emission of the light-emitting element (LD) using this principle, the light-emitting element (LD) can be used as a light source for various light-emitting devices, including pixels of display devices.

[0042] An insulating film (INF) may be disposed on the surface of a light-emitting device (LD). The insulating film (INF) may be formed on the surface of the light-emitting device (LD) to surround at least the outer surface of the active layer (AL), and may additionally surround a portion of the first and second semiconductor layers (SCL1, SCL2). The insulating film (INF) may be formed as a single film or a double film, but is not limited thereto and may be composed of multiple films. For example, the insulating film (INF) may include a first insulating film comprising a first material and a second insulating film comprising a second material different from the first material.

[0043] The insulating film (INF) can expose both ends of a light-emitting element (LD) having different polarities. For example, the insulating film (INF) can expose one end of each of the electrode layer (ELL) and the second semiconductor layer (SCL2) adjacent to the first and second ends (EP1, EP2) of the light-emitting element (LD).

[0044] The insulating film (INF) may be composed of a single layer or multiple layers, including one insulating material selected from silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), and titanium oxide (TiOx). However, it is not necessarily limited to the examples described in the present disclosure. For example, according to other embodiments, the insulating film (INF) may be omitted.

[0045] According to the embodiment, when an insulating film (INF) is provided to cover the surface of a light-emitting element (LD), particularly the outer surface of an active layer (AL), electrical stability of the light-emitting element (LD) can be ensured. Furthermore, when an insulating film (INF) is provided on the surface of the light-emitting element (LD), surface defects of the light-emitting element (LD) can be minimized, thereby improving lifespan and efficiency. In addition, even when multiple light-emitting elements (LDs) are arranged in close proximity to each other, unwanted short circuits between the light-emitting elements (LDs) can be prevented.

[0046] The electrode layer (ELL) may be disposed on the first semiconductor layer (SCL1). The electrode layer (ELL) may be adjacent to the first end (EP1). The electrode layer (ELL) may be electrically connected to the first semiconductor layer (SCL1).

[0047] A portion of the electrode layer (ELL) may be exposed. For example, the insulating film (INF) may expose one side of the electrode layer (ELL). The electrode layer (ELL) may be exposed in an area corresponding to the first end (EP1). According to an embodiment, a side of the electrode layer (ELL) may be exposed. For example, the insulating film (INF) may not cover at least a portion of the side of the electrode layer (ELL) while covering the sides of the first semiconductor layer (SCL1), the active layer (AL), and the second semiconductor layer (SCL2), respectively. In this case, electrical connection to other components of the electrode layer (ELL) adjacent to the first end (EP1) may be facilitated. According to an embodiment, the insulating film (INF) may expose a portion of the side of the first semiconductor layer (SCL1) and / or the second semiconductor layer (SCL2), as well as the side of the electrode layer (ELL).

[0048] According to an embodiment, the electrode layer (ELL) may be an ohmic contact electrode. However, the present disclosure is not necessarily limited to the examples described above. For example, the electrode layer (ELL) may be a Schottky contact electrode.

[0049] According to an embodiment, the electrode layer (ELL) may comprise one of chromium (Cr), titanium (Ti), aluminum (Al), gold (Au), nickel (Ni), or oxides or alloys thereof. However, the present disclosure is not necessarily limited to the examples described above. According to an embodiment, the electrode layer (ELL) may be substantially transparent. For example, the electrode layer (ELL) may comprise indium tin oxide (ITO). Accordingly, emitted light may pass through the electrode layer (ELL).

[0050] The structure and shape of the light-emitting element (LD) are not limited to the examples described above, and the light-emitting element (LD) may have various structures and shapes depending on the embodiment. For example, the light-emitting element (LD) may further include an additional electrode layer disposed on one side of the second semiconductor layer (SCL2) and adjacent to the second end (EP2).

[0051] FIG. 3 is a schematic plan view showing a display device according to an embodiment.

[0052] The display device (DD) is configured to emit light. Referring to FIG. 3, the display device (DD) may include a substrate (SUB) and a pixel (PXL) disposed on the substrate (SUB). Although not shown in the drawing, the display device (DD) may further include a driving circuit (e.g., a scanning driving unit and a data driving unit), wiring, and pads for driving the pixel (PXL).

[0053] The display device (DD) may include a display area (DA) and a non-display area (NDA). The non-display area (NDA) may refer to an area outside the display area (DA). The non-display area (NDA) may surround at least a portion of the display area (DA).

[0054] A substrate (SUB) may constitute a base member of a display device (DD). The substrate (SUB) may be a rigid or flexible substrate or film. For example, the substrate (SUB) may be a rigid substrate made of glass or reinforced glass, a flexible substrate made of plastic or metal (or a thin film), or at least one insulating layer. The material and / or physical properties of the substrate (SUB) are not particularly limited. In one embodiment, the substrate (SUB) may be substantially transparent. Here, "substantially transparent" may mean that it can transmit light above a certain transmittance. In another embodiment, the substrate (SUB) may be translucent or opaque. Additionally, the substrate (SUB) may include a reflective material depending on the embodiment.

[0055] The display area (DA) may refer to an area where pixels (PXL) are placed. The non-display area (NDA) may refer to an area where pixels (PXL) are not placed. Driving circuits, wiring, and pads connected to the pixels (PXL) of the display area (DA) may be placed in the non-display area (NDA).

[0056] According to one example, pixels (PXL) may be arranged according to a stripe or pentile arrangement structure, but are not limited thereto, and various embodiments may be applied to the present disclosure.

[0057] According to an embodiment, a pixel (PXL) may include a first subpixel (SPXL1), a second subpixel (SPXL2), and a third subpixel (SPXL3). The first subpixel (SPXL1), the second subpixel (SPXL2), and the third subpixel (SPXL3) may each be a subpixel. At least one first subpixel (SPXL1), a second subpixel (SPXL2), and a third subpixel (SPXL3) may constitute a single pixel unit capable of emitting light of various colors.

[0058] For example, each of the first subpixel (SPXL1), the second subpixel (SPXL2), and the third subpixel (SPXL3) may emit light of a predetermined color. For example, the first subpixel (SPXL1) may be a red pixel emitting red light (e.g., a first color), the second subpixel (SPXL2) may be a green pixel emitting green light (e.g., a second color), and the third subpixel (SPXL3) may be a blue pixel emitting blue light (e.g., a third color). However, the color, type, and / or number, etc., of the first subpixel (SPXL1), the second subpixel (SPXL2), and the third subpixel (SPXL3) constituting each of the pixel units are not limited to specific examples.

[0059] Hereinafter, a subpixel (SPXL) according to an embodiment will be described with reference to FIGS. 4 and FIGS. 5.

[0060] FIG. 4 is a schematic plan view showing a subpixel according to an embodiment. The subpixel (SPXL) shown in FIG. 4 may be one of the first to third subpixels (SPXL1, SPXL2, SPXL3) described above.

[0061] Referring to FIG. 4, a subpixel (SPXL) (or display device (DD)) may include a light-emitting region (EMA) and a non-light-emitting region (NEA). The subpixel (SPXL) may include an alignment electrode (ELT), light-emitting elements (LD), a bank (BNK), a first contact portion (CNT1), a second contact portion (CNT2), and a contact electrode (CNE). According to an embodiment, the alignment electrode (ELT) may include a first electrode (ELT1) and a second electrode (ELT2). The contact electrode (CNE) may include a first contact electrode (CNE1) and a second contact electrode (CNE2).

[0062] The emitting region (EMA) may be an area where a light-emitting element (LD) is provided and light is emitted. The non-emitting region (NEA) may be an area where a light-emitting element (LD) is not placed and light is not emitted.

[0063] The light-emitting region (EMA) may overlap with the opening (OPN) defined by the bank (BNK) when viewed in a plane. Light-emitting elements (LDs) may be placed within the light-emitting region (EMA).

[0064] Light-emitting diodes (LDs) may not be placed in the non-emissive region (NEA). A portion of the non-emissive region (NEA) may overlap with the bank (BNK) when viewed in a planar view.

[0065] A bank (BNK) may form (or provide) an opening (OPN). For example, the bank (BNK) may have a shape protruding in the thickness direction of the substrate (SUB) (e.g., the third direction (DR3)) and may have a shape that surrounds a predetermined area. Accordingly, an opening (OPN) in which the bank (BNK) is not placed may be formed. According to an embodiment, the bank (BNK) may form a space in which a fluid can be received. For example, an ink ('INK' in FIG. 24) containing a light-emitting element (LD) may be provided in the space in which the fluid can be received so that the light-emitting element (LD) can be placed within the opening (OPN).

[0066] A bank (BNK) can define an emitting region (EMA) and a non-emitting region (NEA). When viewed in a plane, the bank (BNK) may surround at least a portion of the emitting region (EMA). For example, the area where the bank (BNK) is placed may be the non-emitting region (NEA). As an area where the bank (BNK) is not placed, the area where the light-emitting element (LD) is placed may be the emitting region (EMA).

[0067] At least a portion of the light-emitting elements (LDs) may be disposed between the first electrode (ELT1) and the second electrode (ELT2). The light-emitting elements (LDs) may be aligned between the first electrode (ELT1) and the second electrode (ELT2). The light-emitting elements (LDs) may form (or constitute) a light-emitting unit (EMU). The light-emitting unit (EMU) may refer to a unit encompassing adjacent light-emitting elements (LDs).

[0068] The first electrode (ELT1) and the second electrode (ELT2) may be spaced apart from each other. For example, the first electrode (ELT1) and the second electrode (ELT2) may be spaced apart from each other along the first direction (DR1) in the light-emitting region (EMA) and may each extend along the second direction (DR2).

[0069] According to an embodiment, the first electrode (ELT1) may be a first alignment electrode, and the second electrode (ELT2) may be a second alignment electrode.

[0070] The first electrode (ELT1) and the second electrode (ELT2) may each receive a first alignment signal and a second alignment signal during the step in which light-emitting elements (LDs) are aligned. The first alignment signal and the second alignment signal may have different waveforms, potentials, and / or phases. Accordingly, an electric field is formed between the first electrode (ELT1) and the second electrode (ELT2), so that the light-emitting elements (LDs) can be aligned between the first electrode (ELT1) and the second electrode (ELT2).

[0071] The first electrode (ELT1) can be electrically connected to a circuit element (e.g., a driving transistor) through a first contact portion (CNT1). According to an embodiment, the first electrode (ELT1) can provide an anode signal. The first electrode (ELT1) can provide a first alignment signal.

[0072] The second electrode (ELT2) can be electrically connected to the power wiring and the second contact portion (CNT2). According to an embodiment, the second electrode (ELT2) can provide a cathode signal. The second electrode (ELT2) can provide a second alignment signal.

[0073] Each of the first and second electrodes (ELT1, ELT2) may be composed of a single layer or multiple layers. For example, each of the first and second electrodes (ELT1, ELT2) may include at least one reflective electrode layer comprising a reflective conductive material, and may optionally further include at least one transparent electrode layer and / or a conductive capping layer.

[0074] The light-emitting elements (LDs) can be aligned between the first electrode (ELT1) and the second electrode (ELT2). For example, the light-emitting elements (LDs) can be aligned and / or connected in parallel with each other between the first electrode (ELT1) and the second electrode (ELT2).

[0075] In one embodiment, each light-emitting element (LD) is aligned in a second direction (DR2) between a first electrode (ELT1) and a second electrode (ELT2) and can be electrically connected to the first and second electrodes (ELT1, ELT2).

[0076] A first end (EP1) of the light-emitting element (LD) may be positioned adjacent to a first electrode (ELT1), and a second end (EP2) of the light-emitting element (LD) may be positioned adjacent to a second electrode (ELT2). The first end (EP1) may or may not overlap with the first electrode (ELT1). The second end (EP2) may or may not overlap with the second electrode (ELT2).

[0077] In one embodiment, the first end (EP1) of each of the light-emitting elements (LDs) may be electrically connected to the first electrode (ELT1) through the first contact electrode (CNE1). In another embodiment, the first end (EP1) of each of the light-emitting elements (LDs) may be directly connected to the first electrode (ELT1). In yet another embodiment, the first end (EP1) of each of the light-emitting elements (LDs) may be electrically connected only to the first contact electrode (CNE1) and not to the first electrode (ELT1).

[0078] Similarly, the second end (EP2) of each of the light-emitting elements (LDs) may be electrically connected to the second electrode (ELT2) through the second contact electrode (CNE2). In another embodiment, the second end (EP2) of each of the light-emitting elements (LDs) may be directly connected to the second electrode (ELT2). In yet another embodiment, the second end (EP2) of each of the light-emitting elements (LDs) may be electrically connected only to the second contact electrode (CNE2) and not to the second electrode (ELT2).

[0079] A first contact electrode (CNE1) and a second contact electrode (CNE2) may be disposed on the first end (EP1) and the second end (EP2) of the light-emitting elements (LDs), respectively.

[0080] A first contact electrode (CNE1) may be disposed on the first ends (EP1) so as to be electrically connected to the first ends (EP1) of the light-emitting elements (LDs). In one embodiment, the first contact electrode (CNE1) may be disposed on the first electrode (ELT1) and electrically connected to the first electrode (ELT1). In this case, the first ends (EP1) of the light-emitting elements (LDs) can be connected to the first electrode (ELT1) through the first contact electrode (CNE1).

[0081] The second contact electrode (CNE2) may be disposed on the second ends (EP2) so as to be electrically connected to the second ends (EP2) of the light-emitting elements (LDs). In one embodiment, the second contact electrode (CNE2) may be disposed on the second electrode (ELT2) and electrically connected to the second electrode (ELT2). In this case, the second ends (EP2) of the light-emitting elements (LDs) can be connected to the second electrode (ELT2) through the second contact electrode (CNE2).

[0082] The structure of the subpixel (SPXL) according to the embodiment is not necessarily limited to the example described above with reference to FIG. 4, and the subpixel (SPXL) may include various appropriate structures.

[0083] FIG. 5 is a schematic cross-sectional view according to I to I' of FIG. 4. FIG. 5 may be a schematic cross-sectional view showing a subpixel (SPXL) according to an embodiment.

[0084] Referring to FIG. 5, the subpixel (SPXL) may include a substrate (SUB), a pixel circuit layer (PCL), and a display element layer (DPL).

[0085] The substrate (SUB) can provide an area where the pixel circuit layer (PCL) and the display element layer (DPL) are placed. The substrate (SUB) may be the base surface of the subpixel (SPXL).

[0086] A pixel circuit layer (PCL) may be disposed on a substrate (SUB). The pixel circuit layer (PCL) may include a transistor and a plurality of insulating layers. The transistor may be a thin-film transistor and, depending on the embodiment, a driving transistor. Any one of the plurality of insulating layers may be disposed on the transistor. The structure of the pixel circuit layer (PCL) is not limited to specific examples and may include various structures.

[0087] A display element layer (DPL) may be disposed on a pixel circuit layer (PCL). The display element layer (DPL) may include an insulating pattern (INP), a first electrode (ELT1), a second electrode (ELT2), a first insulating film (INS1), a bank (BNK), a light-emitting element (LD), a second insulating film (INS2), a first contact electrode (CNE1), a third insulating film (INS3), and a second contact electrode (CNE2).

[0088] The insulating pattern (INP) may protrude in the thickness direction of the substrate (SUB) (e.g., the third direction (DR3)). The insulating pattern (INP) may provide a surface on which the first electrode (ELT1) and the second electrode (ELT2) are arranged.

[0089] The first electrode (ELT1) and the second electrode (ELT2) may be disposed on the pixel circuit layer (PCL) and the insulating pattern (INP). As described above, the first electrode (ELT1) and the second electrode (ELT2) may be alignment electrodes for aligning light-emitting elements (LD).

[0090] A portion of each of the first electrode (ELT1) and the second electrode (ELT2) can be placed on an insulating pattern (INP) to form a reflective wall. Accordingly, the light emission efficiency of the display device (DD) can be improved.

[0091] According to an embodiment, the first electrode (ELT1) may be electrically connected to the light-emitting element (LD) through the first contact electrode (CNE1). The second electrode (ELT2) may be electrically connected to the light-emitting element (LD) through the second contact electrode (CNE2).

[0092] A first insulating film (INS1) may be disposed on a pixel circuit layer (PCL), a first electrode (ELT1), and a second electrode (ELT2). The first insulating film (INS1) can stabilize the connection between the electrode components and reduce external influences. The first insulating film (INS1) may comprise one of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), and titanium oxide (TiOx). However, the present disclosure is not limited to the examples described above.

[0093] The bank (BNK) may protrude in the thickness direction of the substrate (SUB) (e.g., the third direction (DR3)). The bank (BNK) may include organic materials such as acrylates resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, polyesters resin, polyphenylenesulfides resin, or benzocyclobutene (BCB). However, it is not necessarily limited thereto, and the bank (BNK) may include various types of inorganic materials including silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum nitride (AlNx), aluminum oxide (AlOx), zirconium oxide (ZrOx), hafnium oxide (HfOx), or titanium oxide (TiOx).

[0094] A light-emitting element (LD) may be disposed on a first insulating film (INS1). According to an embodiment, the light-emitting element (LD) may emit light based on electrical signals provided from a first contact electrode (CNE1) and a second contact electrode (CNE2).

[0095] The light-emitting element (LD) can be placed within the area enclosed by the bank (BNK). Accordingly, the light-emitting region (EMA) can be defined as the area where the light-emitting element (LD) is placed. The light-emitting element (LD) can be placed between adjacent insulating patterns (INP).

[0096] The second insulating layer (INS2) can be placed on the light-emitting element (LD). The second insulating layer (INS2) can cover the active layer (AL) of the light-emitting element (LD).

[0097] The second insulating film (INS2) may expose at least a portion of the light-emitting element (LD). For example, the second insulating film (INS2) may not cover the first end (EP1) and the second end (EP2) of the light-emitting element (LD), and accordingly, the first end (EP1) and the second end (EP2) of the light-emitting element (LD) may be exposed and electrically connected to the first contact electrode (CNE1) and the second contact electrode (CNE2), respectively.

[0098] When a second insulating film (INS2) is formed on the light-emitting elements (LD) after the alignment of the light-emitting elements (LD) is completed, the light-emitting elements (LD) may be prevented from deviating from their aligned positions.

[0099] The second insulating film (INS2) may be composed of a single layer or multiple layers and may include various types of inorganic materials, including silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum nitride (AlNx), aluminum oxide (AlOx), zirconium oxide (ZrOx), hafnium oxide (HfOx), or titanium oxide (TiOx). However, the present disclosure is not limited to the examples described above.

[0100] The first contact electrode (CNE1) and the second contact electrode (CNE2) may be disposed on the first insulating film (INS1). The first contact electrode (CNE1) may be electrically connected to the first end (EP1) of the light-emitting element (LD). The second contact electrode (CNE2) may be electrically connected to the second end (EP2) of the light-emitting element (LD).

[0101] The first contact electrode (CNE1) can be electrically connected to the first electrode (ELT1) through a contact hole penetrating the first insulating film (INS1), and the second contact electrode (CNE2) can be electrically connected to the second electrode (ELT2) through a contact hole penetrating the first insulating film (INS1).

[0102] The first contact electrode (CNE1) and the second contact electrode (CNE2) may include a conductive material. For example, the first contact electrode (CNE1) and the second contact electrode (CNE2) may include a transparent conductive material comprising one of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and ITZO (Indium Tin Zinc Oxide). However, they are not necessarily limited to the examples described above.

[0103] The third insulating film (INS3) may be disposed on the first insulating film (INS1), the first contact electrode (CNE1), the second contact electrode (CNE2), and the second insulating film (INS2). The third insulating film (INS3) may be composed of a single layer or multiple layers and may include various types of inorganic materials, including silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum nitride (AlNx), aluminum oxide (AlOx), zirconium oxide (ZrOx), hafnium oxide (HfOx), or titanium oxide (TiOx).

[0104] The structure of the subpixel (SPXL) according to the embodiment is not necessarily limited to the examples described above. For example, the subpixel (SPXL) may further include additional banks disposed on the bank (BNK). Additionally, the subpixel (SPXL) may further include a color conversion layer comprising quantum dots configured to change the wavelength of light emitted from the light-emitting element (LD). For example, the color conversion layer may be disposed on the same layer as the display element layer (DPL) or disposed on the display element layer (DPL). Additionally, the subpixel (SPXL) may further include a color filter layer that selectively transmits light of a specific wavelength band.

[0105] Hereinafter, with reference to FIGS. 6 to 16, a manufacturing apparatus (1) for a display device according to an embodiment will be described. Any content that may overlap with the previously described content will be explained briefly or will not be repeated.

[0106] First, with reference to FIGS. 6 to 13, a manufacturing apparatus (1) for a display device according to a first embodiment will be described. FIGS. 6 to 13 are drawings showing a manufacturing apparatus for a display device according to a first embodiment.

[0107] FIG. 6 is a schematic perspective view showing a manufacturing apparatus (1) for a display device according to a first embodiment. FIG. 7 is a schematic cross-sectional view showing a manufacturing apparatus (1) for a display device according to a first embodiment.

[0108] Referring to FIGS. 6 and 7, the manufacturing device (1) of the display device may include a stage (100), a rail (120), a printer support (140), an ink printer (160), a probe device (180), a pressure (PRS), and a mold (IM).

[0109] According to an embodiment, a manufacturing device (1) for a display device may perform a process on a substrate (200) for manufacturing a display device to provide (or manufacture) a display device (DD) according to the embodiment. According to an embodiment, the substrate (200) for manufacturing a display device may be collectively referred to as a substrate (SUB) for convenience. A light-emitting element (LD), etc., may be disposed on the substrate (200) for manufacturing a display device to form a pixel (PXL) (or sub-pixel (SPXL)). Hereinafter, for convenience of explanation, the substrate (200) for manufacturing a display device will be referred to as a manufacturing substrate (200).

[0110] The stage (100) can support a manufacturing substrate (200). The stage (100) can be placed on a rail (120). The stage (100) can provide an area where the manufacturing substrate (200) is placed. The manufacturing substrate (200) can be loaded or unloaded on the stage (100). According to an embodiment, the stage (100) may have a rigid material, but the present disclosure is not necessarily limited thereto.

[0111] The stage (100) can change the position of the manufacturing substrate (200). For example, the position of the stage (100) can be changed along the rail (120).

[0112] The rail (120) may be a path along which the stage (100) moves. Accordingly, the manufacturing substrate (200) may be moved along the rail (120). The rail (120) may extend along a process direction (e.g., a first direction (DR1)) for the manufacturing substrate (200).

[0113] The printer support (140) is positioned at a location relative to the process direction and can be connected (or coupled) to the ink printer (160). According to an embodiment, the printer support (140) may be configured to move along a first direction (DR1). Accordingly, the ink printer (160) can be moved by the printer support (140). According to an embodiment, the printer support (140) may be a gantry.

[0114] An ink printer (160) may be connected to a printer support (140) and configured to supply (or provide) ink (see 'INK' in FIG. 22) containing a light-emitting element (LD). For example, when a manufacturing substrate (200) is positioned adjacent to the ink printer (160), the ink printer (160) may dispense ink (INK). Accordingly, ink (INK) may be supplied onto the manufacturing substrate (200).

[0115] The ink printer (160) can be moved in a first direction (DR1) or a second direction (DR2). For example, the ink printer (160) can be coupled to the printer support (140) to be moved in the first direction (DR1) and / or the second direction (DR2). The ink printer (160) can be moved along the first direction (DR1) as the printer support (140) moves in the first direction (DR1).

[0116] According to an embodiment, the ink printer (160) may be referred to as a dispenser.

[0117] A probe device (180) may be placed on a stage (100). The probe device (180) may be placed adjacent to one side of a manufacturing substrate (200). According to an embodiment, the probe device (180) may be placed on one side and the other side of the manufacturing substrate (200), respectively.

[0118] According to an embodiment, the probe device (180) may be referred to as a probe module. The probe device (180) may include a probe support (182), a probe moving part (184), and a probe unit (186).

[0119] The probe device (180) can supply (or provide) an electrical signal to the manufacturing substrate (200). The probe device (180) can form an electric field on the manufacturing substrate (200). For example, the probe unit (186) can provide an electrical signal on a pad formed on the manufacturing substrate (200), and the provided signal is provided to an alignment electrode (ELT) so that an electric field can be formed in the area where the light-emitting element (LD) is aligned.

[0120] A probe support (182) may be placed on a stage (100). The probe support (182) may provide an area where a probe moving part (184) and a probe unit (186) are placed. According to an embodiment, the probe support (182) may be placed on one side and the other side of a manufacturing substrate (200). However, the area and number of probe support (182) may be appropriately changed.

[0121] The probe moving part (184) may be placed on the probe support part (182). The probe moving part (184) may change the position of the probe unit (186). For example, the probe moving part (184) may move the probe unit (186) in a direction parallel to the first direction (DR1). The probe moving part (184) may move the probe unit (186) in a direction parallel to the second direction (DR2). The probe moving part (184) may move the probe unit (186) in a direction parallel to the third direction (DR3). Accordingly, the position of the probe unit (186), configured to supply an electrical signal to the manufacturing substrate (200), may be appropriately controlled and, according to the embodiment, may be changed to correspond to the position of the pad of the manufacturing substrate (200).

[0122] The probe unit (186) can be connected to the probe moving part (184). The probe unit (186) can supply an electrical signal to form an electric field on the manufacturing substrate (200). For example, the probe unit (186) can be moved in the first to third directions (DR1 to DR3) by the probe moving part (184) and can come into contact with a pad on the manufacturing substrate (200).

[0123] According to the embodiment, a plurality of probe units (186) may be provided, and the probe units (186) may be disposed on one side and / or the other side of the manufacturing substrate (200). The area and number of probe units (186) disposed may be appropriately changed.

[0124] A pressure (PRS) may be positioned on one side of a mold (IM). According to an embodiment, the pressure (PRS) may come into contact with the mold (IM). For example, the pressure (PRS) may come into contact with the base portion of the mold (IM) (see '620' in FIG. 8). According to an embodiment, the pressure (PRS) may be positioned at a location spaced apart from the ink printer (160) in the process direction (e.g., the first direction (DR1)).

[0125] The movement of the pressure (PRS) can correspond to the movement of the mold (IM). The pressure (PRS) can move the mold (IM). For example, as the pressure (PRS) moves in a direction parallel to the third direction (DR3), the position of the mold (IM) can be moved in a direction parallel to the third direction (DR3). According to an embodiment, the direction in which the pressure (PRS) moves may be parallel to the direction of gravity.

[0126] The pressure (PRS) can apply pressure to the mold (IM). For example, the pressure (PRS) can push the mold (IM) in one direction, and accordingly, apply pressure to an object (e.g., a light-emitting element (LD)) that the mold (IM) contacts. The pressure (PRS) can be configured to apply pressure to the mold (IM) from the mold (IM) toward the manufacturing substrate (200). For example, the pressure (PRS) can be configured to apply pressure to the mold (IM) from the mold (IM) toward the stage (100).

[0127] The pressure (PRS) may include a material of a rigid material and may have physical properties suitable for applying pressure to the mold (IM). However, the present disclosure is not necessarily limited to the examples described above.

[0128] The mold (IM) can be placed on the pressure (PRS). For example, the mold (IM) can be in contact with one side of the pressure (PRS). The mold (IM) can be placed on the pressure (PRS) such that the protrusion ('640' in FIG. 8) faces the manufacturing substrate (200).

[0129] The mold (IM) can be moved to be adjacent to the manufacturing substrate (200) (or stage (100)) and can be moved to be spaced apart from the manufacturing substrate (200) (or stage (100)). For example, the mold (IM) can be moved by a pressure (PRS) along a direction parallel to the thickness direction of the manufacturing substrate (200). According to an embodiment, the mold (IM) can be moved along the direction of gravity to push a target (e.g., a light-emitting element (LD)) on the manufacturing substrate (200).

[0130] According to an embodiment, the mold (IM) may have elastic properties. Accordingly, when the mold (IM) applies pressure to the light-emitting element (LD), the pose of the light-emitting element (LD) can be changed while preventing damage to the light-emitting element (LD). For example, the mold (IM) may include an elastomer. However, the present disclosure is not limited to the examples described above. According to an embodiment, the mold (IM) may include a flexible polymer film and may include various other materials.

[0131] The mold (IM) may include a plurality of groove patterns. According to an embodiment, the mold (IM) may include a structure patterned at a micro scale or a nano scale. For example, the mold (IM) may include a template in which a plurality of grooves are formed in a material. According to an embodiment, each of the plurality of groove patterns may correspond to an arrangement position and arrangement pose of a light-emitting element (LD) aligned on a substrate (SUB).

[0132] The shape of the mold (IM) related thereto will be explained in conjunction with FIGS. 8 to 12.

[0133] FIGS. 8 to 12 are schematic drawings showing the shape of a mold according to an embodiment. FIGS. 8, 10 to 12 are schematic cross-sectional views showing the shape of a mold (IM) according to an embodiment. FIG. 9 is a schematic plan view showing the shape of a mold (IM) according to an embodiment.

[0134] FIG. 8 is a schematic enlarged view of the EA1 region of FIG. 7. FIG. 9 is a schematic plan view showing the structure of a mold (IM) corresponding to the region of the subpixel (SPXL) described above with reference to FIG. 4. FIG. 10 to 12 are schematic cross-sectional views showing the shape of a mold (IM) according to a partially modified embodiment.

[0135] Referring to FIGS. 8 and 9, the mold (IM) may include a base portion (620) and a protrusion (640). According to an embodiment, the mold (IM) may include a light-emitting element region (660) and a mold movement limiting region (680). According to an embodiment, a plurality of protrusions (640) may be provided and disposed on the base portion (620). According to an embodiment, the light-emitting element region (660) may be referred to as a groove region.

[0136] For convenience of explanation, in FIG. 9, the mold movement limiting area (680) is indicated by a thicker dashed line than the light-emitting element area (660). In FIG. 9, when the process of aligning the light-emitting element (LD) using the mold (IM) is performed, the relative positions of the first electrode (ELT1), the second electrode (ELT2), the light-emitting element (LD), and the bank (BNK) with respect to the mold (IM) are each indicated by a predetermined line. For example, the position of the light-emitting element (LD) is indicated by a single dashed line, and the positions of the first electrode (ELT1) and the second electrode (ELT2) are indicated by two dashed lines. Additionally, the position of the bank (BNK) is indicated to correspond to the mold movement limiting area (680).

[0137] According to an embodiment, a plurality of grooves (e.g., groove patterns) may be formed in the mold (IM). Here, the formed grooves may refer to one or more of a groove formed between protrusions (640), a light-emitting element region (660) formed within a protrusion (640), and a mold movement limiting region (680).

[0138] The base portion (620) may be a base surface on which the protrusion (640) is placed. The protrusion (640) may be placed on the base portion (620).

[0139] In some areas of the base portion (620), the protrusion (640) may not be disposed, and accordingly, a portion of the base portion (620) may be exposed. According to an embodiment, in some areas of the base portion (620) where the protrusion (640) is not disposed, the portion may be provided (or formed) as a mold movement restriction area (680).

[0140] According to an embodiment, when a process of aligning a light-emitting element (LD) using a mold (IM) is performed, the mold movement limiting area (680) may overlap with the area (BNK') where the bank is placed when viewed in a planar view. In this case, the bank (BNK) having a protruding shape can prevent the mold (IM) from being excessively adjacent to the manufacturing substrate (200), thereby preventing damage to the light-emitting element (LD) and improving processability.

[0141] The protrusion (640) may be disposed on one side of the base portion (620). The protrusion (640) may protrude in the thickness direction of the base portion (620) (e.g., a direction parallel to the third direction (DR3)). According to an embodiment, the protrusion (640) may not be disposed within the mold movement limiting area (680).

[0142] The protrusion (640) (or mold (IM)) may include a light-emitting element region (660). For example, each of the protrusions (640) may further include a groove, so that a light-emitting element region (660) defined by being recessed in one direction may be formed in each of the protrusions (640). Multiple light-emitting element regions (660) may be provided, each corresponding to a region of light-emitting elements (LDs) to be aligned (or arranged).

[0143] According to an embodiment, the light-emitting element region (660) may extend in the same direction as the direction in which each light-emitting element (LD) extends (e.g., the first direction (DR1) in FIG. 9). The light-emitting element region (660) may extend in a direction in which the first electrode (ELT1) and the second electrode (ELT2) are spaced apart from each other (e.g., the first direction (DR1) in FIG. 9).

[0144] Accordingly, when the mold (IM) pushes the light-emitting element (LD), the position of the light-emitting element (LD) can be changed to correspond to the light-emitting element region (660). For example, when the mold (IM) pushes the light-emitting element (LD), the light-emitting element (LD) can be rotated to correspond to the light-emitting element region (660). Additionally, the light-emitting elements (LDs) can be arranged so as to face from the region where the first electrode is placed (ELT1') toward the region where the second electrode is placed (ELT2').

[0145] According to an embodiment, when a process of aligning light-emitting elements (LDs) using a mold (IM) is performed, the light-emitting element region (660) may overlap with the region (LD') where the light-emitting elements are placed when viewed on a plane. Since the light-emitting elements (LDs) are arranged to correspond to a plurality of groove patterns (e.g., light-emitting element region (660)) of the mold (IM), the light-emitting elements (LDs) can be easily placed to correspond to a position desired by the user.

[0146] Additionally, the light-emitting element region (660) corresponds to an area where each individual light-emitting element (LD) is aligned, so that the light-emitting elements (LDs) are electrically adjacent to each other (e.g., clumping of light-emitting elements (LDs)) and abnormal operation can be substantially prevented. That is, the mold (IM) applies pressure to the light-emitting elements (LDs), so that each of the positions where the light-emitting elements (LDs) are aligned corresponds to each of the light-emitting element regions (660).

[0147] Ultimately, the arrangement desired by the user can be easily realized, thereby improving processability. In addition, as the alignment of the light-emitting elements (LDs) is improved, the proportion of light-emitting elements (LDs) operating normally increases significantly, and accordingly, the luminous efficiency of the light-emitting elements (LDs) and the light emission efficiency of the display device (DD) can be improved.

[0148] Meanwhile, according to the embodiment, the shape of the protrusion (640) for forming the light-emitting element region (660) can be varied.

[0149] For example, referring to FIG. 8, the protrusion (640) may have a groove having a triangular shape in cross-section. A groove having a triangular prism shape may be formed in the protrusion (640). At this time, the groove forming the light-emitting element region (660) may have a size corresponding to the size of the bottom surface of the light-emitting element (LD) in the region (LD') where the light-emitting element is placed. According to the present embodiment, the process for forming the light-emitting element region (660) can be simplified, and since a groove corresponding to the size of the light-emitting element (LD) is formed in the region (LD') where the light-emitting element is placed, the alignment of the light-emitting element (LD) can be achieved more closely.

[0150] Next, referring to FIG. 10, the protrusion (640) according to one embodiment may have a sharply indented valley shape with a curved surface in cross-section. Accordingly, the light-emitting element region (660) may be defined along the curved surface overall. In this case, pressure may be applied to the light-emitting element (LD) along the curved surface in the region (LD') where the light-emitting element is placed.

[0151] Next, referring to FIG. 11, the protrusion (640) according to one embodiment may have a smooth curved shape in cross-section that corresponds to the size of the bottom surface of the light-emitting element (LD) in the area (LD') where the light-emitting element is placed. For example, the light-emitting element area (660) may have a shape that corresponds to the bottom surface of the light-emitting element (LD) in the area (LD') where the light-emitting element is placed, on the surface facing the light-emitting element (LD).

[0152] Next, referring to FIG. 12, the protrusion (640) according to one embodiment may have a generally gentle curved shape, which is larger than the bottom surface size of the light-emitting element (LD) in the area (LD') where the light-emitting element is placed in cross-section. For example, the light-emitting element area (660) may have a gentle curved shape on the surface facing the light-emitting element (LD) in the area (LD') where the light-emitting element is placed.

[0153] However, the shape of the protrusion (640) and the light-emitting element region (660) is not necessarily limited to the examples described above, and the shape of the protrusion (640) and the light-emitting element region (660) may be appropriately changed within the scope of maintaining the technical features of the present disclosure. For example, a portion of the outer surface of the protrusion (640) may have a curved surface or a flat surface, and depending on the embodiment, the protrusion (640) may include a gently curved surface region or a sharp vertex region.

[0154] Meanwhile, the manufacturing device (1) of the display device according to the embodiment may further include a cleaning device (CLE). The cleaning device (CLE) may be configured to clean the mold (IM). The cleaning device (CLE) may remove the light-emitting element (LD) and ink provided on the mold (IM) after (or during) the process of aligning the light-emitting element (LD). Accordingly, when a process using the mold (IM) is subsequently performed, excessive supply of ink (INK) onto the manufacturing substrate (200) may be prevented, and process precision may be improved. According to the embodiment, when cleaning the mold (IM), the cleaning device (CLE) may be positioned adjacent to the outer surface of the mold (IM) (e.g., the surface on which the protrusion (640) is placed). This may be for efficiently removing the ink (INK) remaining on the mold (IM).

[0155] According to an embodiment, the cleaning device (CLE) may include a drain device configured to absorb ink (INK). Also, according to an embodiment, the cleaning device (CLE) may be configured to spray a cleaning solution to clean the surface of the mold (IM) on which ink (INK) remains. Also, according to an embodiment, the cleaning device (CLE) may include a drying device to dry the surface of the mold (IM) on which ink (INK) remains. However, the present disclosure is not necessarily limited to the examples described above.

[0156] Next, with reference to FIGS. 14 and FIGS. 15, a manufacturing apparatus (1) for a display device according to a second embodiment will be described. FIGS. 14 and FIGS. 15 are drawings showing a manufacturing apparatus for a display device according to a second embodiment.

[0157] Content that may overlap with the aforementioned content is explained briefly or without repetition, and the explanation focuses on the distinguishing features of the first embodiment.

[0158] In FIG. 14, for convenience of explanation, the stage (100) and the manufacturing substrate (200) are shown, and the other components of the manufacturing device (1) of the display device are omitted.

[0159] Referring to FIGS. 14 and 15, the manufacturing apparatus (1) of the display device according to the second embodiment differs from the manufacturing apparatus (1) of the display device according to the first embodiment in that the mold (IM) has a roller shape.

[0160] According to an embodiment, the mold (IM) is provided in a roller shape and can be rolled on a manufacturing substrate (200). For example, the mold (IM) may have a structure in which a plurality of groove patterns are formed on the outer surface of the roller. Accordingly, when the mold (IM) is rolled on the manufacturing substrate (200), the light-emitting element (LD) can be aligned by the mold (IM).

[0161] For example, the manufacturing device (1) of the display device may further include a roller moving part (MP) and a rolling part (RP). The roller moving part (MP) can move the mold (IM) in a process direction (e.g., a direction parallel to the first direction (DR1)). The rolling part (RP) can rotate the mold (IM) provided in a roller shape. That is, in response to the movement of the rolling part (RP) and the roller moving part (MP), the mold (IM) can be rolled on the manufacturing substrate (200), and during the process of rolling the mold (IM), light-emitting elements (LDs) on the manufacturing substrate (200) can be aligned to correspond to the groove pattern of the mold (IM).

[0162] According to an embodiment, a cleaning machine (CLE) may be positioned adjacent to a mold (IM) provided in a roller shape and may clean the mold (IM) in a manner similar to the above. For example, after the alignment process of the mold (IM) is performed, the cleaning machine (CLE) may clean the mold (IM).

[0163] However, according to the embodiment, while the alignment process of the mold (IM) is performed, the cleaning machine (CLE) may simultaneously clean the mold (IM). For example, if the area of ​​the outer surface along the circumference of the mold (IM) is smaller than the area of ​​the manufacturing substrate (200), it may be appropriate to perform the cleaning process of the cleaning machine (CLE) while the alignment process of the mold (IM) is performed. That is, one side of the mold (IM) can perform the alignment process of the light-emitting element (LD), and the other side of the mold (IM) can perform the cleaning process of the cleaning machine (CLE), thereby preventing damage to the process precision.

[0164] Next, with reference to FIG. 16, a manufacturing apparatus (1) for a display device according to a third embodiment will be described. FIG. 16 is a drawing showing a manufacturing apparatus for a display device according to a third embodiment. FIG. 16 illustrates the manufacturing apparatus (1) for a display device according to a third embodiment with a cross-sectional structure.

[0165] Content that may overlap with the aforementioned content is explained briefly or without repetition, and the explanation focuses on the distinguishing features of the first embodiment.

[0166] Referring to FIG. 16, the manufacturing apparatus (1) of the display device according to the third embodiment differs from the manufacturing apparatus (1) of the display device according to the first embodiment in that the pressure (PRS) has a roller shape, and the process of aligning the light-emitting element (LD) is performed by the pressure (PRS) having a roller shape pressing the mold (IM).

[0167] According to an embodiment, the manufacturing device (1) of the display device has a pressure (PRS) having a roller shape and can push the mold (IM) as the pressure (PRS) rolls. According to an embodiment, the mold (IM) may have an overall film shape, and accordingly, at least a portion may be moved by the roller.

[0168] According to an embodiment, the manufacturing device (1) of the display device may include a step compensation part (420), a fixing part (440), an in-feed roller (460), and an out-feed roller (480).

[0169] A step difference compensation unit (420) is positioned on the stage (100) to compensate for a step difference that occurs during the rolling process of the pressure (PRS). For example, the step difference compensation unit (420) may protrude in the thickness direction of the manufacturing substrate (200) (e.g., the third direction (DR3)) and may have a thickness corresponding to the thickness of the manufacturing substrate (200) overall. According to an embodiment, the step difference compensation unit (420) may be positioned on one side of the manufacturing substrate (200), on the side corresponding to the position before the pressure (PRS) is rolled. The step difference compensation unit (420) may be positioned on the other side of the manufacturing substrate (200), on the side corresponding to the position after the pressure (PRS) is rolled.

[0170] The fixing part (440) can press a portion of the area extending from the mold (IM) to tightly fix the position of the mold (IM). According to an embodiment, the fixing part (440) may be positioned adjacent to the position prior to the rolling of the pressure (PRS).

[0171] The in-feed roller (460) and the out-feed roller (480) are configured to rotate so as to move the mold (IM). For example, a portion of the mold (IM) may be moved in one direction by the in-feed roller (460) to be adjacent to the manufacturing substrate (200), and a portion of the mold (IM) may be moved in one direction by the out-feed roller (480) to be spaced apart from the manufacturing substrate (200).

[0172] According to the embodiment, the pressure (PRS) can press the mold (IM) as it is rolled on the mold (IM). That is, the pressure (PRS) can sequentially push other regions from a part of the mold (IM), and accordingly, the alignment operation of the light-emitting element (LD) throughout the manufacturing substrate (200) can be performed.

[0173] Meanwhile, the structure of the manufacturing device (1) of the display device according to the third embodiment is not necessarily limited to the example described above. According to the embodiment, the manufacturing device (1) of the display device may further include a tension roller to maintain the tension of the mold (IM) according to a standard.

[0174] Next, with reference to FIGS. 17 to 36, a method for manufacturing a display device (DD) according to an embodiment will be described. Content that may overlap with the previously described content will be briefly explained or not repeated.

[0175] First, with reference to FIGS. 17 to 34, a method for manufacturing a display device (DD) according to one embodiment will be described. For convenience of explanation, first to third embodiments corresponding to each individual step of the method for manufacturing a display device (DD) will be described.

[0176] FIGS. 17 to 19 are flowcharts illustrating a method for manufacturing a display device according to an embodiment. FIG. 17 may be a flowchart schematically illustrating a method for manufacturing a display device (DD) according to an embodiment. FIGS. 18 and 19 may be flowcharts specifically illustrating a step (S1600) of aligning light-emitting elements according to an embodiment. For example, FIGS. 18 and FIGS. 19 may each illustrate a step (S1600) of aligning light-emitting elements according to individual embodiments.

[0177] FIGS. 20, FIGS. 25, and FIGS. 30 are plan views of process phases (or acts) illustrating a method for manufacturing a display device according to an embodiment. FIGS. 20, FIGS. 25, and FIGS. 30 may schematically show a structure corresponding to the subpixel (SPXL) described above with reference to FIG. 4.

[0178] FIGS. 21 to 23, FIGS. 26 to 28, FIGS. 31, FIG. 32, and FIG. 34 are cross-sectional views by process step (or operation) showing a manufacturing apparatus for a display device according to an embodiment. FIGS. 21, FIG. 26, FIG. 31, and FIG. 34 may be cross-sectional views schematically showing a manufacturing apparatus (1) for a display device according to a first embodiment. FIGS. 22, FIG. 27, and FIG. 32 may be cross-sectional views schematically showing a manufacturing apparatus (1) for a display device according to a second embodiment. FIGS. 23 and FIGS. 28 may be cross-sectional views schematically showing a manufacturing apparatus (1) for a display device according to a third embodiment.

[0179] FIGS. 24, FIGS. 29, and FIGS. 33 are cross-sectional views of process steps (or operations) illustrating a method for manufacturing a display device according to an embodiment. FIGS. 24, FIGS. 29, and FIGS. 33 may represent schematic cross-sectional areas according to II to II' of FIGS. 4.

[0180] Referring to FIG. 17, a method for manufacturing a display device (DD) according to an embodiment may include the steps of providing an alignment electrode on a manufacturing substrate (S1200), providing ink on a manufacturing substrate (S1400), and aligning a light-emitting element (S1600).

[0181] Referring to FIGS. 17 and FIGS. 20, in the step (S1200) of providing an alignment electrode on a manufacturing substrate, an alignment electrode (ELT) can be patterned (or formed) on the manufacturing substrate (200).

[0182] Although not shown in the drawing, a pixel circuit layer (PCL) can be formed on the manufacturing substrate (200) prior to placing the alignment electrode (ELT). Individual components of the pixel circuit layer (PCL) can typically be formed by patterning a conductive layer (or metal layer), inorganic material, or organic material by performing a process using a mask.

[0183] In the step (S1200) of providing alignment electrodes on a manufacturing substrate, a first electrode (ELT1) and a second electrode (ELT2) are formed, and a path in which light-emitting elements (LDs) are arranged can be defined.

[0184] Meanwhile, after forming the alignment electrode (ELT), the first insulating film (INS1) may be placed on the alignment electrode (ELT), and a bank (BNK) protruding in the thickness direction of the manufacturing substrate (200) may be placed (or provided). Accordingly, an opening (OPN) surrounded by the bank (BNK) may be formed.

[0185] Referring to FIGS. 17, 21 to 25, in the step (S1400) of providing ink on a manufacturing substrate, ink (INK) can be supplied (or sprayed) onto the manufacturing substrate (200). The ink (INK) can be provided by the ink printer (160) described above with reference to FIG. 6, which is capable of spraying fluid.

[0186] According to an embodiment, the ink (INK) may refer to a liquid mixture that can be emitted by an ink printer (160). For example, the ink (INK) may include a light-emitting element (LD) and a solvent (SLV). According to an embodiment, the light-emitting element (LD) may be contained in the ink (INK) in a predetermined range of solid content. According to an embodiment, the solvent (SLV) may have fluidity, and accordingly, the light-emitting element (LD) may be dispersed in the solvent (SLV). The solvent (SLV) may refer to a fluid material that is not a solid phase, which allows the light-emitting element (LD) to be dispersed. According to an embodiment, the solvent (SLV) may include an organic solvent. For example, the solvent (SLV) may be one of PGMEA (Propylene Glycol Methyl Ether Acetate), DGPE (Dipropylene Glycol n-Propyl Ether), and TGBE (Triethylene Gylcol n-Butyl Ether). However, the present disclosure is not limited to the examples described above, and the solvent (SLV) may include various organic solvents.

[0187] In the step (S1400) of providing ink on a manufacturing substrate, the ink (INK) may be accommodated in a space defined by a bank (BNK). According to an embodiment, the light-emitting elements (LD) contained in the ink (INK) may be randomly positioned on the first insulating film (INS1). For reference, FIG. 24 is a drawing showing a structure corresponding to FIG. 4, and the arrangement in FIG. 24 such that the bottom surface of the light-emitting elements (LD) is shown in cross-section may be a state in which the light-emitting elements (LD) are normally arranged.

[0188] In the step (S1400) of providing ink on a manufacturing substrate, the pressure (PRS) and mold (IM) according to each of the first to third embodiments (see FIGS. 21 to 23) may be arranged to be spaced apart from the ink (INK).

[0189] Referring to FIGS. 26 to 30, in the step (S1600) of aligning light-emitting elements, light-emitting elements (LDs) can be aligned according to a predetermined arrangement. For example, the light-emitting elements (LDs) can be aligned to correspond to the pattern structure of the mold (IM).

[0190] According to the present disclosure, the step (S1600) of aligning light-emitting elements can be performed in various ways.

[0191] First, a step (S1600) of aligning light-emitting elements according to one embodiment will be explained in conjunction with FIG. 18.

[0192] Referring to FIG. 18, the step of aligning the light-emitting element (S1600) may include the step of forming an electric field using an alignment electrode (S1612), the step of aligning the light-emitting element with the mold (S1614), the step of separating the mold from the light-emitting element (S1616), and the step of cleaning the mold (S1618).

[0193] According to an embodiment, after the step of forming an electric field using an alignment electrode (S1612) is performed, the mold may perform the step of aligning the light-emitting elements (S1614) so ​​that the light-emitting elements (LDs) can be aligned. However, the present disclosure is not necessarily limited to the examples described above. According to an embodiment, after the step of aligning the light-emitting elements by the mold (S1614) is performed, the step of forming an electric field using an alignment electrode (S1612) may be performed.

[0194] Referring to FIGS. 18, 26 to 30, in the step (S1612) of forming an electric field using alignment electrodes, an electrical signal may be provided to the first electrode (ELT1) and the second electrode (ELT2), and accordingly, an electric field may be formed between the first electrode (ELT1) and the second electrode (ELT2). According to an embodiment, the light-emitting element (LD) may be moved by a force based on the formed electric field (e.g., a dielectrophoresis (DEP) force). According to an embodiment, the electrical signal may be an alternating current signal. The alternating current signal may be any one of a sine wave, a triangular wave, a step wave, a square wave, a trapezoidal wave, and a pulse wave, but is not limited thereto and may have various known alternating current signal forms.

[0195] Next, referring to FIGS. 18 and FIGS. 26 to 30, in the step (S1614) where the mold aligns the light-emitting elements, the light-emitting elements (LDs) can be aligned in correspondence with the pattern structure of the mold (IM). For example, in this step, the light-emitting elements (LDs) can be rotated to correspond to the light-emitting element region (660) of the protrusion (640). That is, the protrusion (640) can contact the light-emitting element (LD) in the light-emitting element region (660) and apply pressure so that the protrusion (640) changes the pose of the light-emitting element (LD).

[0196] According to the embodiment, each light-emitting element region (660) may correspond to each light-emitting element (LD), and accordingly, the light-emitting elements (LD) may be rotated in correspondence with the corresponding light-emitting element region (660). Accordingly, as described above, the alignment of the light-emitting elements (LD) may be improved.

[0197] That is, if the light-emitting elements (LDs) are aligned simply by using an electric field, some of the light-emitting elements (LDs) may be aligned abnormally. However, since the mold (IM) aligns the light-emitting elements (LDs) to correspond to the arrangement structure desired by the user, the light-emitting elements (LDs) can be arranged normally. In addition, since the light-emitting element region (660) corresponds to each individual light-emitting element (LD), the phenomenon of the light-emitting elements (LDs) clumping together is effectively prevented.

[0198] In this step, the mold (IM) of the manufacturing device (1) of the display device according to the first embodiment can be pressed by a pressure (PRS). (See FIG. 26) Accordingly, as described above, the mold (IM) can apply pressure to the light-emitting element (LD) so that the light-emitting element (LD) is in contact with the light-emitting element (LD). According to the first embodiment, one surface of the mold (IM) having a plurality of groove patterns formed thereon (e.g., the area where the light-emitting element region (660) is formed) can come into contact with the light-emitting elements (LD) in its entirety. That is, the mold (IM) according to the first embodiment has a shape that extends in a planar direction in its entirety, so that the light-emitting elements (LD) on the manufacturing substrate (200) can be aligned in its entirety (e.g., simultaneously).

[0199] In addition, at this stage, the mold (IM) of the manufacturing device (1) of the display device according to the second embodiment can be rolled to contact the light-emitting element (LD) and pressure can be applied to rotate the light-emitting element (LD). That is, the mold (IM) having a roller shape can be rotated by the rolling part (RP) and moved along the process direction by the roller moving part (MP), and the mold (IM) can be rolled and moved and the light-emitting element (LD) can be rotated.

[0200] In addition, at this stage, the pressure (PRS) of the manufacturing device (1) of the display device according to the third embodiment can be rolled along the process direction, and the pressure (PRS) can pressurize the mold (IM) as it is rolled. Accordingly, the mold (IM) can sequentially apply pressure to the light-emitting elements (LDs). According to the embodiment, the position of the pressure (PRS) before rolling is indicated by a dotted line (PRS'), and the position of the pressure (PRS) after rolling is indicated by a solid line.

[0201] Meanwhile, in this step, the movement of the mold (IM) is restricted by the bank (BNK), so that abnormal behavior of the mold (IM) can be prevented. For example, a protrusion (640) may not be placed in a part of the base portion (620) of the mold (IM), and accordingly, a mold movement restriction area (680) may be formed. According to an embodiment, the mold (IM) is provided with pressure by a pressure (PRS), but the base portion (620) contacts the bank (BNK) in the mold movement restriction area (680), and excessive movement of the mold (IM) may be restricted. According to an embodiment, when the mold (IM) and the bank (BNK) contact each other in the mold movement restriction area (680), a part of the mold (IM) may contact the light-emitting element (LD).

[0202] Accordingly, the mold (IM) applies pressure to the light-emitting element (LD) to rotate the light-emitting element (LD), while preventing excessive pressure from being applied to the light-emitting element (LD) and preventing damage to the light-emitting element (LD).

[0203] Referring to FIG. 18 and FIG. 31 to FIG. 33, in the step (S1616) where the mold is separated from the light-emitting element, the mold (IM) can be separated from the light-emitting element (LD) on the manufacturing substrate (200).

[0204] For example, the pressure (PRS) and the mold (IM) can be moved in a third direction (DR3) to be separated from the ink (INK). At this time, the light-emitting elements (LDs) may be aligned by the mold (IM) to correspond to a structure intended by the user.

[0205] Referring to FIG. 18 and FIG. 34, in the step of cleaning the mold (S1618), the cleaning machine (CLE) can clean the mold (IM).

[0206] For example, the light-emitting element (LD) and solvent (SLV) remaining on the mold (IM) can be removed, and accordingly, the mold (IM) can be provided in a state suitable for further processing. As an example, a structure in which a cleaning device (CLE) according to the first embodiment cleans the mold (IM) is illustrated in FIG. 34. In addition, the cleaning device (CLE) is positioned below the mold (IM) with respect to the direction of gravity, so that the fluid ink (INK) can be removed more efficiently.

[0207] Meanwhile, when using the manufacturing device (1) of the display device according to the second embodiment, a cleaning device (CLE) disposed on one side of the mold (IM) having a roller shape can clean the mold (IM). When using the manufacturing device (1) of the display device according to the third embodiment, a cleaning device (CLE) disposed on one side of the out-feed roller (480) can clean the mold (IM).

[0208] Next, with reference to FIG. 19, a step (S1600) of aligning light-emitting elements according to another embodiment will be described.

[0209] Referring to FIG. 19, the step of aligning the light-emitting element (S1600) may include the step of aligning the mold with the light-emitting element (S1622) when an electric field is formed using an alignment electrode, the step of separating the mold from the light-emitting element (S1624), and the step of cleaning the mold (1626).

[0210] That is, the step (S1600) of aligning the light-emitting element according to the present embodiment is different from the embodiment described above with reference to FIG. 18 in that the operation of the alignment electrode (ELT) forming an electric field and the operation of the mold (IM) aligning the light-emitting element (LD) are performed simultaneously.

[0211] For example, the light-emitting element (LD) can be rotated based on the electric field formed by the alignment electrode (ELT) and also rotated by the mold (IM). In this case, the alignment operation of the light-emitting element (LD) is performed by two types of external forces, so the alignment operation of the light-emitting element (LD) can be performed more closely.

[0212] Next, with reference to FIGS. 35 and 36, a method for manufacturing a display device (DD) according to another embodiment will be described. Any content that may overlap with the previously described content will be explained briefly or not repeated.

[0213] FIG. 35 is a flowchart illustrating a method for manufacturing a display device according to another embodiment. FIG. 36 is a schematic perspective view illustrating a device for manufacturing a display device according to another embodiment.

[0214] A method for manufacturing a display device (DD) according to another embodiment may be suitable for cases where the area of ​​the outer surface along the circumference of the mold (IM) is smaller than the area of ​​the manufacturing substrate (200), using the manufacturing device (1) of the display device according to the second embodiment.

[0215] According to an embodiment, a method for manufacturing a display device (DD) according to another embodiment may include the step of forming an electric field using an alignment electrode (S1642), the step of aligning a light-emitting element with a mold and cleaning the mold with a cleaning device (S1644), and the step of separating the mold from the light-emitting element (S1646).

[0216] According to an embodiment, the operation of a mold (IM) rotating and aligning a light-emitting element (LD) and the operation of a cleaning device (CLE) cleaning the mold (IM) can be performed within the same process. For example, a mold (IM) having a roller shape can be rolled in a process direction (e.g., a first direction (DR1)) and apply pressure to the light-emitting element (LD). At this time, one side of the mold (IM) can come into contact with an ink (INK) containing a light-emitting element (LD), while the other side of the mold (IM) can be cleaned by the cleaning device (CLE). Accordingly, while the mold (IM) aligns the light-emitting element (LD), the surface of the mold (IM) is continuously cleaned, so that even if the area along the circumference of the mold (IM) is smaller than the area of ​​the manufacturing substrate (200), no additional process may be required, and the process can be simplified.

[0217] Although the present disclosure has been described with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the present disclosure without departing from the spirit and scope of the present disclosure as set forth in the claims below.

[0218] Accordingly, the technical scope of the present disclosure should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0219] LD: Light-emitting element DD: Display device PXL: Pixel ELT: Alignment electrode BNK: Bank IM: Mold PRS: Pressure RP: Rolling section MP: Roller moving section CLE: Cleaning machine

Claims

Claim 1 A method for manufacturing a display device, comprising: a step of providing an ink containing light-emitting elements on a manufacturing substrate; and a step of aligning the light-emitting elements by applying pressure to the light-emitting elements using a mold having a plurality of groove patterns after the ink containing the light-emitting elements is placed on the manufacturing substrate. Claim 2 A method for manufacturing a display device according to claim 1, wherein the step of aligning the light-emitting elements comprises: a step of a pressure disposed on one surface of the mold pushing the mold; a step of the mold applying pressure to the light-emitting elements; and a step of aligning the light-emitting elements in correspondence with the plurality of groove patterns of the mold. Claim 3 A method for manufacturing a display device according to claim 2, wherein the mold includes light-emitting element regions, and the step of applying pressure to the light-emitting elements by the mold is performed such that each position where the light-emitting elements are aligned corresponds to each position of the light-emitting element regions. Claim 4 A method for manufacturing a display device according to claim 3, wherein the light-emitting element region is a groove region formed in the mold. Claim 5 A method for manufacturing a display device according to claim 1, wherein the step of aligning the light-emitting elements comprises the step of the plurality of groove patterns of the mold contacting the light-emitting elements disposed on the manufacturing substrate. Claim 6 A method for manufacturing a display device according to claim 1, wherein the mold has a roller shape, and the step of aligning the light-emitting elements includes the step of rolling the mold on the manufacturing substrate. Claim 7 A method for manufacturing a display device according to claim 1, wherein the step of aligning the light-emitting elements comprises the step of a pressure having a roller shape rolling on the mold so that the mold applies pressure to the light-emitting elements. Claim 8 A method for manufacturing a display device according to claim 1, further comprising the step of providing a bank protruding in the thickness direction of the manufacturing substrate on the manufacturing substrate; wherein the step of providing ink comprises the step of receiving the ink within a space defined by the bank, and the mold comprises a base portion; and a protrusion connected to the base portion; and comprises a mold movement limiting region in which the protrusion is not disposed, and the step of aligning the light-emitting elements comprises the step of applying pressure to the light-emitting element in a part of the mold; and the step of the mold contacting the bank in the mold movement limiting region. Claim 9 A method for manufacturing a display device according to claim 1, further comprising the step of a cleaning device cleaning the surface of the mold after the step of aligning the light-emitting elements. Claim 10 A method for manufacturing a display device according to claim 1, further comprising the step of a cleaning device cleaning the surface of the mold; wherein the mold has a roller shape, the area of ​​the outer surface along the circumference of the mold is smaller than the area of ​​the manufacturing substrate, and the step of cleaning the surface of the mold is performed simultaneously with the step of aligning the light-emitting elements. Claim 11 A method for manufacturing a display device according to claim 1, further comprising the steps of: providing an alignment electrode on the manufacturing substrate; and forming an electric field using the alignment electrode; wherein the light-emitting elements are aligned based on the electric field. Claim 12 A method for manufacturing a display device according to claim 11, wherein the step of forming the electric field and the step of aligning the light-emitting elements using the mold are performed simultaneously. Claim 13 A method for manufacturing a display device according to claim 1, wherein the mold comprises: a base portion; and a protrusion connected to the base portion; wherein the protrusion includes a light-emitting element region formed by incorporating a portion thereof, and the direction in which the light-emitting elements aligned on the manufacturing substrate extend is the same as the direction in which the light-emitting element region extends. Claim 14 A method for manufacturing a display device according to claim 1, wherein the mold has elastic properties. Claim 15 A display device manufactured according to the method of manufacturing a display device according to claim 1. Claim 16 A manufacturing apparatus for a display device, comprising: a mold disposed on a stage; and a pressure configured to apply pressure toward the stage from the mold to the mold; wherein the mold comprises a base portion; and a protrusion connected to the base portion and including a groove area formed by a portion of the protrusion being recessed. Claim 17 In claim 16, the manufacturing apparatus for a display device, wherein the pressure and the mold can be moved to be adjacent to or spaced apart from the stage. Claim 18 In claim 16, the mold is a manufacturing device for a display device having a roller shape. Claim 19 In claim 16, the pressure is a manufacturing device for a display device having a roller shape. Claim 20 A manufacturing apparatus for a display device according to claim 16, further comprising: a probe device disposed on the stage and providing an electrical signal to form an electric field on a manufacturing substrate provided on the stage.

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