Display device and method of manufacturing the same

Abstract

The display device includes a display panel comprising at least one pixel, a printed circuit board electrically connected to the pixel, a heat dissipation layer disposed between the display panel and the printed circuit board and graphite, a cover layer disposed on one side of the heat dissipation layer and a resin, and a side cover member covering the side of the heat dissipation layer.

Description

Technology Field

[0001] The present invention relates to a display device and a method for manufacturing the same. More specifically, it relates to a display device comprising a multi-functional member that performs heat dissipation, electromagnetic interference (EMI) shielding, and electrostatic discharge (ESD) shielding. Background Technology

[0002] Generally, a display device includes a display panel and a display panel driver. The display panel displays an image based on an input image and includes a plurality of gate lines, a plurality of data lines, and a plurality of pixels. The display panel driver includes a gate driver that provides a gate signal to the plurality of gate lines, a data driver that provides a data voltage to the data lines, and a driving control unit that controls the operation of the gate driver and the data driver.

[0003] The above display device may generate heat during operation. If the display device is not properly heat-dissipated, it may overheat and be damaged. Generally, in the case of OLED self-emissive displays, current for light emission is delivered to organic EL diodes, generating heat. This heat causes degradation, such as burn-in of the EL material, which degrades image quality. Furthermore, if this heat comes into contact with the human body from the front of the display, it may cause human injury, such as burns.

[0004] In addition, the display device may generate electromagnetic waves during operation. If the electromagnetic waves are not properly shielded and a user is exposed to them for a long time, there is a risk that it may cause health problems for the user. In addition, the display device may generate static electricity during operation. If the static electricity is not properly shielded, the display device may malfunction or be damaged. The problem to be solved

[0005] One objective of the present invention is to provide a display device including a multi-functional member with improved thermal conductivity.

[0006] Another objective of the present invention is to provide a method for manufacturing the display device.

[0007] However, the objectives of the present invention are not limited to the objectives described above and may be expanded in various ways without departing from the spirit and scope of the present invention. means of solving the problem

[0008] To achieve one objective of the present invention as described above, a display device according to one embodiment of the present invention comprises a display panel, a printed circuit board, a heat dissipation layer, a cover layer, and a side cover member. The display panel comprises at least one pixel. The printed circuit board is disposed below the display panel and is electrically connected to the pixel. The heat dissipation layer comprises graphite and is disposed between the display panel and the printed circuit board. The cover layer is disposed on one surface of the heat dissipation layer facing the printed circuit board. The side cover member covers the side of the heat dissipation layer.

[0009] In one embodiment, the cover layer may include the same material as the side cover member.

[0010] In one embodiment, the cover layer may include a material different from that of the side cover member.

[0011] In one embodiment, the cover layer may comprise at least one material selected from the resin group consisting of acrylic, epoxy, polyurethane, and silicone.

[0012] In one embodiment, the cover layer may further comprise at least one material selected from a group of fillers consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube. The mass ratio of the resin group included in the cover layer may be about 30 wt% to about 90 wt%. The mass ratio of the filler group included in the cover layer may be about 10 wt% to about 70 wt%.

[0013] In one embodiment, the average thickness of the heat dissipation layer may be greater than the average thickness of the cover layer. The average thickness of the heat dissipation layer may be about 10 μm to about 1000 μm. The average thickness of the cover layer may be about 5 μm to about 50 μm.

[0014] In one embodiment, the thermal conductivity of the heat dissipation layer may be approximately 100 W / (m·K) to 1700 W / (m·K).

[0015] In one embodiment, the cover layer is adhered to one surface of the heat dissipation layer and may include polyethylene terephthalate (PET).

[0016] In one embodiment, a contact hole penetrating the cover layer in the thickness direction may be defined in the cover layer. The heat dissipation layer may be connected to the printed circuit board through the contact hole.

[0017] In one embodiment, the display device may further include an adhesive layer disposed between the display panel and the heat dissipation layer. The average thickness of the adhesive layer may be greater than the average thickness of the cover layer and smaller than the average thickness of the heat dissipation layer. The adhesive layer bonds the heat dissipation layer and the display panel together and may include polyethylene terephthalate.

[0018] To achieve one objective of the present invention as described above, a display device according to one embodiment of the present invention comprises a display panel, a printed circuit board, a heat dissipation layer, a first cover layer, and a second cover layer. The display panel comprises at least one pixel. The printed circuit board is disposed below the display panel and is electrically connected to the pixel. The heat dissipation layer comprises graphite and is disposed between the display panel and the printed circuit board. The first cover layer is disposed on one side of the heat dissipation layer facing the printed circuit board and extends from said side to cover a portion of the side of the heat dissipation layer. The second cover layer is disposed on the other side of the heat dissipation layer opposite to said side and extends from said side to contact the first cover layer.

[0019] In one embodiment, the first cover layer is adhered to one side of the heat dissipation layer and may include polyethylene terephthalate. The second cover layer combines the heat dissipation layer and the display panel on the other side of the heat dissipation layer and may include polyethylene terephthalate.

[0020] In one embodiment, a contact hole penetrating the first cover layer in the thickness direction may be defined in the first cover layer. The heat dissipation layer may be connected to the printed circuit board through the contact hole.

[0021] In one embodiment, the first cover layer and the second cover layer may be integrally formed to define a single metal coating layer that surrounds all of the one surface, the other surface, and the side surface of the heat dissipation layer. The average thickness of the metal coating layer may be about 1 μm to about 20 μm.

[0022] To achieve another objective of the present invention as described above, a method for manufacturing a display device according to one embodiment of the present invention comprises the steps of forming a cover layer on one side of a heat dissipation layer comprising graphite, forming an adhesive layer on another side opposite to the one side of the heat dissipation layer, and covering the side of the heat dissipation layer using a polymer material or a metal material.

[0023] In one embodiment, the step of forming the cover layer on one surface of the heat dissipation layer may include the step of unfolding a graphite sheet in a roll state, the step of coating a material forming the cover layer on one surface of the graphite sheet, and the step of cutting the graphite sheet and the coated cover layer. In the step of covering the side of the heat dissipation layer, the side of the heat dissipation layer may be surrounded by a side cover member.

[0024] In one embodiment, the step of forming the cover layer on one surface of the heat dissipation layer may include the step of unfolding a graphite sheet in a roll state, the step of cutting the graphite sheet to form the heat dissipation layer, and the step of coating a material that forms the cover layer on one surface of the heat dissipation layer. In the step of covering the side of the heat dissipation layer, the side of the heat dissipation layer may be surrounded by a side cover member.

[0025] In one embodiment, the step of covering the side of the heat dissipation layer may include the step of stretching the cover layer from one side of the heat dissipation layer to the side, the step of forming the adhesive layer from the other side of the heat dissipation layer to the side, and the step of bringing the cover layer and the adhesive layer into contact with each other so that the cover layer and the adhesive layer seal the side of the heat dissipation layer.

[0026] In one embodiment, the step of forming the cover layer on the one surface of the heat dissipation layer may include the step of unfolding a graphite sheet in a roll state, the step of cutting the graphite sheet to form the heat dissipation layer, and the step of plating the heat dissipation layer so that the cover layer surrounds the one surface, the other surface, and the side surface of the heat dissipation layer. In the step of forming the adhesive layer on the other surface opposite to the one surface of the heat dissipation layer, the adhesive layer may come into contact with the cover layer surrounding the heat dissipation layer.

[0027] In one embodiment, the method for manufacturing the display device may further include the steps of forming a contact hole penetrating the cover layer in the thickness direction and electrically connecting the cover layer and a printed circuit board through the contact hole. The cover layer may comprise at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, polyethylene terephthalate, and silicone. Effects of the invention

[0028] A display device according to embodiments of the present invention may include a cover layer for covering a heat dissipation layer comprising graphite. Accordingly, it is possible to prevent impurities, such as particles, from entering the display panel or printed circuit board from the surface of the heat dissipation layer. In addition, since the display device includes a multi-functional member comprising the heat dissipation layer and the cover layer, it can easily perform the roles of electromagnetic shielding and electrostatic shielding.

[0029] In a method for manufacturing a display device according to embodiments of the present invention, since the cover layer covering the heat dissipation layer is formed by coating, attaching, or plating the heat dissipation layer, a separate lamination process involving heat is not required to protect the heat dissipation layer, and accordingly, defects occurring in the display device can be reduced. Therefore, the reliability of the display device can be improved.

[0030] However, the effects of the present invention are not limited to the effects described above, and may be extended in various ways without departing from the spirit and scope of the present invention. Brief explanation of the drawing

[0031] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention. Figure 2 is a cross-sectional view showing the unfolded state of a cross section cut along the line I-I' of the display device of Figure 1. Figure 3 is a cross-sectional view showing the bent state of a cross section cut along the line I-I' of the display device of Figure 1. Figure 4 is a cross-sectional view showing a cross-section of a part of the display panel of Figure 1. FIG. 5 is a cross-sectional view showing a cross-section along the line II-II' of a multi-functional member included in the display device of FIG. 1. FIGS. 6 to 11 are drawings for explaining an example of a method for manufacturing the display device of FIG. 1. FIGS. 12 and FIGS. 13 are drawings for explaining other examples of a method for manufacturing the display device of FIG. 11. FIG. 14 is a cross-sectional view showing a cross- section of a display device according to another embodiment of the present invention. FIG. 15 is a cross-sectional view showing a cross-section of a multi-functional member and a circuit board included in the display device of FIG. 14. FIGS. 16 to 18 are drawings for explaining a method of manufacturing the display device of FIG. 14. FIG. 19 is a cross-sectional view showing a cross- section of a display device according to another embodiment of the present invention. FIG. 20 is a cross-sectional view showing a cross-section of a multi-functional member included in the display device of FIG. 19. FIG. 21 is a drawing for explaining a method of manufacturing the display device of FIG. 19. FIG. 22 is a cross-sectional view showing a cross- section of a display device according to another embodiment of the present invention. FIG. 23 is a cross-sectional view showing a cross-section of a multi-functional member and a circuit board included in the display device of FIG. 22. FIG. 24 is a drawing for explaining a method of manufacturing the display device of FIG. 22. FIG. 25 is a cross-sectional view showing a cross- section of a display device according to another embodiment of the present invention. FIG. 26 is a cross-sectional view showing a cross-section of a multi-functional member included in the display device of FIG. 25. Specific details for implementing the invention

[0032] With respect to the embodiments of the present invention disclosed in the text, specific structural or functional descriptions are provided merely for the purpose of explaining the embodiments of the present invention, and the embodiments of the present invention may be implemented in various forms and should not be interpreted as being limited to the embodiments described in the text.

[0033] The present invention is capable of various modifications and may take various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0034] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0035] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationship between components, such as "between" and "exactly between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way.

[0036] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0037] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0038] Meanwhile, if an embodiment can be implemented differently, a function or operation specified within a particular block may occur differently from the order specified in the flowchart. For example, two consecutive blocks may actually be executed substantially simultaneously, or, depending on the related function or operation, said blocks may be executed in reverse order.

[0039] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted.

[0040] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention.

[0041] Referring to FIG. 1, a display device (DD) according to one embodiment of the present invention may be a device that is activated according to an electrical signal. For example, the display device (DD) may be a small display device used in small electronic devices such as smartphones, mobile phones, smartwatches, game consoles, and cameras. Additionally, the display device (DD) may be a medium-to-large display device used in medium-to-large electronic devices such as laptops, tablet PCs, televisions, computer monitors, vehicle monitors, and external billboards.

[0042] In this specification, a plane may be defined by a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). For example, the second direction (DR2) may intersect the first direction (DR1) perpendicularly. Additionally, a third direction (DR3) may intersect the plane perpendicularly.

[0043] The display device (DD) may include a display panel (DP), a pixel (PX), a plurality of gate lines (GL), a plurality of data lines (DL), a gate driver (GDV), a driver circuit (CC), and a printed circuit board (PCB).

[0044] The display panel (DP) may include a display area (DA), a peripheral area (PA), a bending area (BA), and a pad area (PDA). As the display device (DD) includes the display panel (DP), the display device (DD) may also include a display area (DA), a peripheral area (PA), a bending area (BA), and a pad area (PDA).

[0045] The display area (DA) may be an area that displays an image by generating light or adjusting the transmittance of light provided from an external light source. At least one pixel (PX) may be disposed in the display area (DA). For example, a display panel (DP) may include at least one pixel (PX).

[0046] A pixel (PX) can generate an image by emitting light. For example, a plurality of pixels (PX) may be arranged in a first direction (DR1) and a second direction (DR2). Additionally, a pixel (PX) may include a plurality of subpixels that emit light of different colors. For example, the subpixels may include a red subpixel emitting red light, a green subpixel emitting green light, and a blue subpixel emitting blue light.

[0047] A plurality of gate lines (GL) and a plurality of data lines (DL) may be disposed in a display area (DA). The gate lines (GL) and the data lines (DL) may intersect each other. The gate lines (GL) may extend in a first direction (DR1). Each of the gate lines (GL) may be spaced apart from each other in a second direction (DR2). The data lines (DL) may extend along the second direction (DR2). Each of the data lines (DL) may be spaced apart from each other in a first direction (DR1). Within the display area (DA), a pixel (PX) may be disposed in an area where one of the gate lines (GL) and one of the data lines (DL) intersect. The pixel (PX) may be electrically connected to the gate line and the data line.

[0048] The peripheral area (PA) may be adjacent to the display area (DA). For example, the peripheral area (PA) may surround at least a portion of the display area (DA). The peripheral area (PA) may be an area that does not display an image. However, the peripheral area (PA) according to the embodiments of the present invention is not necessarily limited thereto, and an image may be displayed in at least a portion of the peripheral area (PA). For example, a light-emitting pixel (PX) may be placed in at least a portion of the peripheral area (PA).

[0049] A gate driver (GDV) for driving a pixel (PX) may be disposed in the peripheral area (PA). The gate driver (GDV) can transmit gate signals, such as light emission control signals and scan signals, to the pixel (PX) through gate lines (GL). The pixel (PX) can emit light based on the gate signals.

[0050] The bending region (BA) may be adjacent to the surrounding region (PA). For example, the bending region (BA) may be adjacent to one side of the surrounding region (PA) in the second direction (DR2). The bending region (BA) may be bent along the bending axis (BAX). For example, the bending axis (BAX) may extend along the first direction (DR1). The bending axis (BAX) may be a central axis that bends the display panel (DP) in the bending region (BA). However, although the display panel (DP) is shown in FIG. 1 as being bent in the bending region (BA), the display panel (DP) according to embodiments of the present invention is not necessarily limited thereto, and a flexible circuit film connected to one end of the display panel (DP) in the bending region (BA) may be bent along the bending axis (BAX), and the other end of the flexible circuit film opposite to the one end may be electrically connected to a printed circuit board (PCB).

[0051] The pad area (PDA) may be adjacent to the bending area (BA). For example, the pad area (PDA) may be adjacent to one side of the bending area (BA) in a second direction (DR2). The driving circuit (CC) may be placed on the display panel (DP). In one embodiment, the driving circuit (CC) may include a data driving unit. For example, the driving circuit (CC) may provide a data signal for driving a pixel (PX). The pixel (PX) may emit light based on the data signal.

[0052] A printed circuit board (PCB) may be adjacent to a display panel (DP) located in a pad area (PDA). At least a portion of the printed circuit board (PCB) may overlap with at least a portion of the display panel (DP) located in the pad area (PDA). In one embodiment, the printed circuit board (PCB) may include a power voltage generating unit. For example, the printed circuit board (PCB) may generate a power voltage to supply to a pixel (PX).

[0053] FIG. 2 is a cross-sectional view showing the unfolded state of the display device of FIG. 1 cut along the line I-I'. FIG. 3 is a cross-sectional view showing the bent state of the display device of FIG. 1 cut along the line I-I'. FIG. 4 is a cross-sectional view showing a cross-section of a part of the display panel of FIG. 1. FIG. 5 is a cross-sectional view showing a cross-section of a multi-functional member included in the display device of FIG. 1 along the line II-II'.

[0054] Referring to FIGS. 2 to 5, the display device (DD) may include a display panel (DP) driving circuit (CC), a multi-functional member (MFE), a side cover member (SM), a printed circuit board (PCB), an anisotropic conductive film (ACF), an optical functional layer (OL), and a window layer (WN). The multi-functional member (MFE) may include a heat dissipation layer (HDL), a cover layer (CVL), and an adhesive layer (ADL).

[0055] A display panel (DP) may include a substrate (SUB), a first insulating layer (ISL), an active layer (ACT), a second insulating layer (ISL2), a gate electrode (GE), a third insulating layer (ISL3), a source electrode (SE), a drain electrode (DE), a fourth insulating layer (ISL4), a pixel electrode (PE), an emitting layer (EML), a common electrode (CME), and an encapsulation layer (ENL). The encapsulation layer (ENL) may include a first encapsulation layer (ENL1), a second encapsulation layer (ENL2), and a third encapsulation layer (ENL3).

[0056] A substrate (SUB) can form the base of a display panel (DP). In one embodiment, the substrate (SUB) may be a transparent insulating substrate. For example, the substrate (SUB) may include glass, quartz, plastic, etc. These may be used alone or in combination with each other.

[0057] The first insulating layer (ISL1) may be disposed on a substrate (SUB). The first insulating layer (ISL1) may prevent impurities from the substrate (SUB) from diffusing into the active layer (ACT). The first insulating layer (ISL1) may include an inorganic insulating material such as silicon, silicon nitride, or silicon oxide. The active layer (ACT) may be disposed on the first insulating layer (ISL1).

[0058] The active layer (ACT) may include amorphous silicon, polycrystalline silicon, or an oxide semiconductor. The active layer (ACT) may include an impurity-doped source region and a drain region, and a channel region disposed between the source region and the drain region.

[0059] A second insulating layer (ISL2) may be disposed on a first insulating layer (ISL1). The second insulating layer (ISL2) may cover an active layer (ACT) on the first insulating layer (ISL1). In one embodiment, the second insulating layer (ISL2) may have a substantially uniform thickness along the profile of the active layer (ACT). However, the second insulating layer (ISL2) according to embodiments of the present invention is not necessarily limited thereto, and the second insulating layer (ISL2) may have a substantially flat upper surface that sufficiently covers the active layer (ACT) and does not create a step around the active layer (ACT). The second insulating layer (ISL2) may comprise an inorganic insulating material.

[0060] The gate electrode (GE) may be disposed on the second insulating layer (ISL2). The gate electrode (GE) may overlap with the channel region of the active layer (ACT) in a planar manner. The gate electrode (GE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0061] A third insulating layer (ISL3) may be disposed on a second insulating layer (ISL2). The third insulating layer (ISL3) may cover a gate electrode (GE) on the second insulating layer (ISL2). In one embodiment, the third insulating layer (ISL3) may have a substantially uniform thickness along the profile of the gate electrode (GE). However, the third insulating layer (ISL3) according to embodiments of the present invention is not necessarily limited thereto, and the third insulating layer (ISL3) may have a substantially flat upper surface that sufficiently covers the gate electrode (GE) and does not create a step around the gate electrode (GE).

[0062] A source electrode (SE) and a drain electrode (DE) may be disposed on a third insulating layer (ISL3). The source electrode (SE) and the drain electrode (DE) may contact an active layer (ACT) through a contact hole penetrating the second insulating layer (ISL2) and the third insulating layer (ISL3). The source electrode (SE) and the drain electrode (DE) may overlap the source region and the drain region of the active layer (ACT), respectively. Each of the source electrode (SE) and the drain electrode (DE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. The active layer (ACT), the gate electrode (GE), the source electrode (SE), and the drain electrode (DE) may define a transistor (TR) for operating a pixel (e.g., a pixel (PX) in FIG. 1).

[0063] The fourth insulating layer (ISL4) may be disposed on the third insulating layer (ISL3). The fourth insulating layer (ISL4) may have a substantially flat upper surface. The fourth insulating layer (ISL4) may include an organic insulating material such as polyimide (PI). In one embodiment, a contact hole may be defined in the fourth insulating layer (ISL4) to expose a portion of the upper surface of the drain electrode (DE). However, the fourth insulating layer (ISL4) according to embodiments of the present invention is not necessarily limited thereto, and a hole may be defined in the fourth insulating layer (ISL4) to expose a portion of the upper surface of the source electrode (SE).

[0064] A pixel defining film (PDL) may be disposed on a fourth insulating layer (ISL4). The pixel defining film (PDL) may partially cover a pixel electrode (PE). Additionally, a hole may be defined in the pixel defining film (PDL) to expose at least a portion of the pixel electrode (PE). For example, the hole in the pixel defining film (PDL) may expose the central portion of the pixel electrode (PE), and the pixel defining film (PDL) may cover the edge of the pixel electrode (PE). The pixel defining film (PDL) may comprise the same material as the fourth insulating layer (ISL4).

[0065] A pixel electrode (PE) may be disposed on a fourth insulating layer (ISL4). In one embodiment, the pixel electrode (PE) may contact a drain electrode (DE) through the hole. However, the pixel electrode (PE) according to the embodiments of the present invention is not necessarily limited thereto, and the pixel electrode (PE) may contact a source electrode (SE) through the hole. The pixel electrode (PE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. For example, the pixel electrode (PE) may include silver (Ag) and indium tin oxide (ITO).

[0066] The light-emitting layer (EML) may be disposed on the pixel defining film (PDL). The light-emitting layer (EML) may be disposed on the pixel electrode (PE) exposed by the hole of the pixel defining film (PDL). The light-emitting layer (EML) may include an organic light-emitting material. The organic light-emitting material may include a low-molecular-weight organic compound or a high-molecular-weight organic compound. However, the present invention is not limited thereto, and the light-emitting layer (EML) may include materials such as quantum dots.

[0067] A common electrode (CE) may be disposed on an emitting layer (EML). The common electrode (CE) may include metals, alloys, conductive metal oxides, conductive metal nitrides, transparent conductive materials, etc. For example, the common electrode (CE) may include aluminum (Al), platinum (Pt), silver (Ag), magnesium (Mg), gold (Au), chromium (Cr), tungsten (W), titanium (Ti), etc. These may be used alone or in combination. The pixel electrode (PE), the emitting layer (EML), and the common electrode (CE) may define a light-emitting element (EE).

[0068] A first encapsulation layer (ENL1) may be disposed on a common electrode (CE). The first encapsulation layer (ENL1) may cover a light-emitting element (LED). The first encapsulation layer (ENL1) may have a substantially uniform thickness along the profile of the common electrode (CE). A second encapsulation layer (ENL2) may be disposed on the first encapsulation layer (ENL1). The second encapsulation layer (ENL2) may have a substantially flat top surface without creating a step around the first encapsulation layer (ENL1). A third encapsulation layer (ENL3) may be disposed on the second encapsulation layer (ENL2). The third encapsulation layer (ENL3) may have a substantially uniform thickness and a substantially flat top surface. The first to third encapsulation layers (ENL1, ENL2, ENL3) may seal a display area (DA) to protect the light-emitting element (EE) from external impurities.

[0069] A driving circuit (CC) may be mounted on the display panel (DP). The driving circuit (CC) may be placed on a portion that overlaps with the pad area (PDA) of the display panel (DP).

[0070] A multi-functional member (MFE) may be positioned at the bottom of a display panel (DP). For example, the multi-functional member (MFE) may be positioned at the bottom of an unbent portion of the display panel (DP) (e.g., a portion overlapping with the display area (DA) and surrounding area (PA) of the display panel (DP). The multi-functional member (MFE) may perform the function of dissipating heat generated from the display panel (DP) to the outside, supporting the display panel (DP), or shielding light incident from the outside.

[0071] The heat dissipation layer (HDL) may include graphite. In one embodiment, the heat dissipation layer (HDL) may include natural graphite or artificial graphite. For example, the heat dissipation layer (HDL) may be pure graphite. A first surface (S1) of the heat dissipation layer (HDL) may face a printed circuit board (PCB). For example, the first surface (S1) of the heat dissipation layer (HDL) may face the opposite direction of the third direction (DR3). A second surface (S2) opposite to the first surface (S1) of the heat dissipation layer (HDL) may face a display panel (DP). For example, the second surface (S2) of the heat dissipation layer (HDL) may face the third direction (DR3).

[0072] In the present specification, the first surface (S1) of the heat dissipation layer (HDL) may be referred to as one surface of the heat dissipation layer (HDL), and the second surface (S2) of the heat dissipation layer (HDL) may be referred to as the other surface of the heat dissipation layer (HDL).

[0073] In one embodiment, the thermal conductivity of the heat dissipation layer (HDL) may be about 100 W / (m·K) to about 1700 W / (m·K). Preferably, the thermal conductivity of the heat dissipation layer (HDL) may be about 500 W / (m·K) to about 1700 W / (m·K). The heat dissipation layer (HDL) can efficiently spread heat generated from the display device (DD) to eliminate hot spots in specific parts of the display device (DD) and lower the overall heat (temperature) of the display device (DD).

[0074] In one embodiment, the average thickness of the heat dissipation layer (HDL) may be about 10 μm to about 1000 μm. Preferably, the average thickness of the heat dissipation layer (HDL) may be about 10 μm to about 100 μm.

[0075] A cover layer (CVL) may be disposed on a first surface (S1) of a heat dissipation layer (HDL). For example, the cover layer (CVL) may completely cover the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVL) may be a coating layer coated on the first surface (S1) of the heat dissipation layer (HDL). In another embodiment, the cover layer (CVL) may be an adhesive layer adhered to the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVL) may cover the first surface (S1) of the heat dissipation layer (HDL) while having a substantially uniform thickness.

[0076] In one embodiment, the cover layer (CVL) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc. These may be used alone or in combination.

[0077] In another embodiment, the cover layer (CVL) may include a resin and a filler. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride (BN), graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. Specifically, the mass ratio of the resin included in the cover layer (CVL) may be 30 wt% to 90 wt%, and the mass ratio of the filler included in the cover layer (CVL) may be 10 wt% to 70 wt%.

[0078] In another embodiment, the cover layer (CVL) may include an adhesive material. For example, the cover layer (CVL) may include polyethylene terephthalate (PET). In other words, the cover layer (CVL) may be a one-sided adhesive PET that is adhered to the first surface (S1) of the heat dissipation layer (HDL).

[0079] In one embodiment, the cover layer (CVL) may come into contact with a printed circuit board (PCB). Specifically, when the cover layer (CVL) includes a conductive material, as the cover layer (CVL) comes into contact with the printed circuit board (PCB), the multi-functional member (MFE) can more easily perform the roles of electromagnetic interference (EMI) shielding and electrostatic discharge (ESD) shielding.

[0080] In one embodiment, the average thickness of the cover layer (CVL) may be about 5 μm to 50 μm. In one embodiment, the average thickness of the cover layer (CVL) may be smaller than the average thickness of the heat dissipation layer (HDL).

[0081] The adhesive layer (ADL) may be disposed on the second surface (S2) of the heat dissipation layer (HDL). The adhesive layer (ADL) may be disposed between the heat dissipation layer (HDL) and the display panel (DP) in cross-section. In one embodiment, the adhesive layer (ADL) may bond the heat dissipation layer (HDL) and the display panel (DP) together. For example, the adhesive layer (ADL) may include polyethylene terephthalate. In other words, the adhesive layer (ADL) may be double-sided adhesive PET that can be bonded to the second surface (S2) of the heat dissipation layer (HDL) and the surface of the display panel (DP) facing the heat dissipation layer (HDL).

[0082] In one embodiment, the average thickness of the adhesive layer (ADL) may be about 5 μm to about 55 μm. In one embodiment, the average thickness of the adhesive layer (ADL) may be greater than the average thickness of the cover layer (CVL). In one embodiment, the average thickness of the adhesive layer (ADL) may be smaller than the average thickness of the heat dissipation layer (HDL). In one embodiment, the thermal conductivity of the adhesive layer (ADL) may be lower than the thermal conductivity of the heat dissipation layer (HDL).

[0083] The side cover member (SM) can cover the side (S3) of the heat dissipation layer (HDL). For example, the side cover member (SM) can completely surround the side (S3) of the heat dissipation layer (HDL). In one embodiment, the edge portion of the cover layer (CVL) can come into contact with the side cover member (SM). For example, the side cover member (SM) can surround the said edge portion of the cover layer (CVL). In one embodiment, the edge portion of the adhesive layer (ADL) can come into contact with the side cover member (SM). For example, the side cover member (SM) can surround the said edge portion of the adhesive layer (ADL).

[0084] In one embodiment, the side cover member (SM) may include acrylic, epoxy, polyurethane, boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. In one embodiment, the side cover member (SM) may include the same material as the cover layer (CVL). In another embodiment, the side cover member (SM) may include a different material from the cover layer (CVL).

[0085] In one embodiment, the side cover member (SM) may be formed by coating on the side (S3) of the heat dissipation layer (HDL). In another embodiment, the side cover member (SM) may be formed on the side (S3) of the heat dissipation layer (HDL) through a sealing process.

[0086] A printed circuit board (PCB) can be placed beneath a cover layer (CVL). As the display panel (DP) is bent in the bending region (BA), the printed circuit board (PCB) can be electrically connected to the display panel (DP). For example, the printed circuit board (PCB) can be electrically connected to the display panel (DP) through an anisotropic conductive film (ACF).

[0087] An optical functional layer (OL) may be disposed on a display panel (DP). The optical functional layer (OL) may be a layer that performs an optical function of controlling light. In one embodiment, the optical functional layer (OL) may be a polarizing layer. The optical functional layer (OL) may be disposed in a display area (DA) and a peripheral area (PA). The optical functional layer (OL) may polarize light incident on the display panel (DP) from the outside. The optical functional layer (OL) may be stretched in one direction. The direction of stretching of the optical functional layer (OL) may be the absorption axis, and the direction perpendicular to the direction of stretching may be the transmission axis. However, the optical functional layer (OL) according to the embodiments of the present invention is not necessarily limited to a polarizing layer and may be various types of functional layers that perform optical functions. For example, the optical functional layer (OL) may include a color filter layer.

[0088] A window layer (WN) may be placed on an optical functional layer (OL). The window layer (WN) may be placed in a display area (DA), a peripheral area (PA), and a bending area (BA). The window layer (WN) may protect the display panel (DP) and the optical functional layer (OL). The window layer (WN) may include tempered glass, reinforced plastic, etc. The window layer (WN) may be formed as a single layer or may have a structure in which multiple functional layers are laminated. The window layer (WN) may prevent the occurrence of defects such as fingerprints, scratches, dents, or impacts on the display panel (DP) and the optical functional layer (OL).

[0089] As described above, the display device (DD) may include a cover layer (CVL) and a side cover member (SM) for covering the first surface (S1) and the side surface (S3) of the heat dissipation layer (HDL) containing graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from the surface of the heat dissipation layer (HDL) from entering the display panel (DP) or the printed circuit board (PCB).

[0090] FIGS. 6 to 11 are drawings for explaining an example of a method for manufacturing the display device of FIG. 1.

[0091] In the following, content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly explained.

[0092] Referring to FIGS. 6 to 8, after a graphite sheet (GPS) in a roll state is unfolded, a cover material (CM) can be formed on a first surface (S1) of the unfolded portion of the graphite sheet (GPS). A cover layer (CVL) can be formed on the first surface (S1) of the unfolded portion of the graphite sheet (GPS) using the cover material (CM). For example, the cover material (CM) can be evenly applied to the first surface (S1) of the graphite sheet (GPS) in a powder or liquid state using a device such as a dispenser. Accordingly, the first surface (S1) of the graphite sheet (GPS) can be coated using the cover material (CM). However, the process of forming the cover material (CM) and the cover layer (CVL) according to the embodiments of the present invention is not necessarily limited thereto, and a film-shaped cover layer (CVL) may be manufactured using the cover material (CM), and the film-shaped cover layer (CVL) may be attached to a graphite sheet (GPS).

[0093] The cover material (CM) may be a material that forms the cover layer (CVL) of FIG. 2. In one embodiment, the cover material (CM) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc. These may be used alone or in combination.

[0094] In another embodiment, the cover material (CM) may include a resin and a filler. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. Specifically, the mass ratio of the resin included in the cover material (CM) may be 30 wt% to 90 wt%, and the mass ratio of the filler included in the cover material (CM) may be 10 wt% to 70 wt%.

[0095] In another embodiment, the cover material (CM) may include an adhesive material. For example, the cover material (CM) may include polyethylene terephthalate. In other words, the cover material (CM) may be a one-sided adhesive PET that is adhered to one side of the graphite sheet (GPS).

[0096] Referring to FIG. 9, an adhesive layer (ADL) may be formed on the second surface (S2) of the unfolded portion of the graphite sheet (GPS). For example, the adhesive layer (ADL) may be adhered to the second surface (S2) of the unfolded portion of the graphite sheet (GPS). After the cover layer (CVL) and the adhesive layer (ADL) are formed on each side of the graphite sheet (GPS), the structure formed by combining the graphite sheet (GPS), the cover layer (CVL), and the adhesive layer (ADL) may be cut to a specific size. For example, the structure may be cut along a cutting line (CUT). Accordingly, the cut structure may be manufactured into a multi-functional member (e.g., the multi-functional member (MFE) of FIG. 2). Additionally, the graphite sheet (GPS) may be cut to a specific size to form a heat dissipation layer (HDL).

[0097] Referring to FIG. 10, the side of the manufactured multi-functional member may be exposed. For example, the side (S3) of the heat dissipation layer (HDL) may be exposed. A side cover member (SM) may be formed on the exposed side (S3) of the heat dissipation layer (HDL). For example, the side (S3) of the heat dissipation layer (HDL) may be coated using the side cover member (SM). As another example, the side (S3) of the heat dissipation layer (HDL) may be sealed using the side cover member (SM). In one embodiment, the side cover member (SM) may simultaneously cover not only the side (S3) of the heat dissipation layer, but also the edge portion of the adhesive layer (ADL) and the edge portion of the cover layer (CVL).

[0098] Referring to FIG. 11, a display panel (DP) may be disposed on the multi-functional member, and a printed circuit board (PCB) may be disposed on the lower part of the multi-functional member. For example, the multi-functional member may be bonded to the display panel (DP) through an adhesive layer (ADL). The multi-functional member may be in contact with the printed circuit board (PCB). Accordingly, the display device (DD) of FIG. 1 can be manufactured.

[0099] As described above, in the method for manufacturing a display device (DD), since a cover layer (CVL) covering a heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and accordingly, defects occurring in the display device (DD) can be reduced. Therefore, the reliability of the display device (DD) can be improved.

[0100] In addition, since a cover layer (CVL) can be formed on the graphite sheet (GPS) while unfolding the graphite sheet (GPS) in a roll state, the manufacturing cost and time of the display device (DD) can be reduced.

[0101] FIGS. 12 and FIGS. 13 are drawings for explaining other examples of a method for manufacturing the display device of FIG. 11.

[0102] The method of manufacturing a display device (DD) described with reference to FIGS. 12 and 13 may be substantially the same or similar as the method of manufacturing a display device (DD) described with reference to FIGS. 6 to 11, except that the order of the cutting process of the graphite sheet (GPS) and the process of forming the cover layer (CVL) and the adhesive layer (ADL) is different.

[0103] In the following, content that overlaps with what has been explained with reference to FIGS. 6 to FIGS. 11 may be omitted or briefly explained.

[0104] Referring to FIGS. 2, FIG. 12, and FIG. 13, a graphite sheet (GPS) in a roll state can be unfolded, and then the graphite sheet (GPS) can be cut along a cutting area (CA) to form a heat dissipation layer (HDL). The cutting area (CA) may have a specific size and pattern for manufacturing a heat dissipation layer (HDL) to be used in the manufacture of a display device. A cover material (CM) can be formed on a first surface (S1) of the heat dissipation layer (HDL). Subsequently, a cover layer (CVL) can be formed by applying the cover material (CM) entirely on the first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADL) can be formed on a second surface (S2) of the heat dissipation layer (HDL). Subsequently, a side cover member (SM) can be formed on a side surface (S3) of the heat dissipation layer (HDL), and thereby a multi-functional member (MFE) can be manufactured. A display device (DD) of FIG. 1 can be manufactured by combining a display panel (DP) and a printed circuit board (PCB) with a multi-functional component (MFE).

[0105] In other words, the manufacturing method of a display device described with reference to FIGS. 6 to 11 includes the process of forming a cover layer (CVL) on a graphite sheet (GPS) in a roll state and cutting the graphite sheet (GPS), but the manufacturing method of a display device described with reference to FIGS. 12 and 13 may include the process of forming a cover layer (CVL) on a heat dissipation layer (HDL) after cutting the graphite sheet (GPS) in a roll state.

[0106] As described above, in the method for manufacturing a display device (DD), since a cover layer (CVL) covering a heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and accordingly, defects occurring in the display device (DD) can be reduced. Therefore, the reliability of the display device (DD) can be improved.

[0107] FIG. 14 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. FIG. 15 is a cross-sectional view showing a cross-section of a multi-functional member and a circuit board included in the display device of FIG. 14.

[0108] The display device (DDa) described with reference to FIGS. 14 and 15 may be substantially identical or similar to the display device (DD) described with reference to FIGS. 1 to 5, except for the cover layer (CVLa) and the contact portion (CP).

[0109] In the following, content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly explained.

[0110] Referring to FIGS. 14 and 15, the display device (DDa) may include a multi-functional member (MFEa). The multi-functional member (MFEa) may include a heat dissipation layer (HDL), a cover layer (CVLa) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADL) disposed on a second surface (S2) of the heat dissipation layer (HDL).

[0111] At least one contact hole (H) penetrating the cover layer (CVLa) in the thickness direction (e.g., the third direction (DR3)) may be defined in the cover layer (CVLa). Multiple contact holes (H) may be arranged in a plane. For example, multiple contact holes (H) may be arranged in the first direction (DR1) and / or the second direction (DR2). However, the number and arrangement of contact holes (H) according to the embodiments of the present invention are not necessarily limited thereto.

[0112] The heat dissipation layer (HDL) and the printed circuit board (PCB) can be connected to each other through a contact hole (H). For example, the heat dissipation layer (HDL) and the printed circuit board (PCB) can be electrically or physically connected to each other through a contact portion (CP) that fills the contact hole (H). The contact portion (CP) can contact a first surface (S1) of the heat dissipation layer (HDL) and one surface of the printed circuit board (PCB). In one embodiment, the contact portion (CP) may include a conductive material.

[0113] In one embodiment, the contact portion (CP) may be formed integrally with the heat dissipation layer (HDL). For example, the contact portion (CP) may be a part of the heat dissipation layer (HDL) protruding toward the printed circuit board (PCB) from a first surface (S1) of the heat dissipation layer (HDL). In another embodiment, the contact portion (CP) may be formed integrally with the printed circuit board (PCB). For example, the contact portion (CP) may be a part of the printed circuit board (PCB) protruding toward the heat dissipation layer (HDL) from the said surface of the printed circuit board (PCB). In yet another embodiment, the contact portion (CP) may be a separate component from the heat dissipation layer (HDL) and the printed circuit board (PCB), respectively. For example, the contact portion (CP) may be a conductive tape such as an anisotropic conductive film, a thermally conductive adhesive, a conductive material, etc. However, the contact portion (CP) according to the embodiments of the present invention is not necessarily limited thereto.

[0114] In one embodiment, the cover layer (CVLa) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc. These may be used alone or in combination.

[0115] In another embodiment, the cover layer (CVLa) may include an adhesive material. For example, the cover layer (CVLa) may include polyethylene terephthalate. In other words, the cover layer (CVLa) may be a one-sided adhesive PET that is adhered to the first surface (S1) of the heat dissipation layer (HDL).

[0116] However, the materials included in the cover layer (CVLa) according to the embodiments of the present invention are not necessarily limited thereto, and the cover layer (CVLa) may include resin and fillers. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination.

[0117] As described above, the display device (DDa) may include a cover layer (CVLa) and a side cover member (SM) for covering the first surface (S1) and the side surface (S3) of the heat dissipation layer (HDL) containing graphite, respectively. Accordingly, it is possible to prevent impurities, such as particles, from the surface of the heat dissipation layer (HDL) from entering the display panel (DP) or the printed circuit board (PCB). In addition, the heat dissipation layer (HDL) and the printed circuit board (PCB) may be connected to each other through a contact hole (H). Accordingly, the multi-functional member (MFEa) can more easily perform electrostatic shielding and electrostatic shielding roles.

[0118] FIGS. 16 to 18 are drawings for explaining a method of manufacturing the display device of FIG. 14.

[0119] The method of manufacturing a display device (DDa) described with reference to FIGS. 16 to 18 may be the same or similar as the method of manufacturing a display device (DD) described with reference to FIGS. 6 to 11, except for the process of forming a contact hole (H).

[0120] In the following, content that overlaps with what has been described with reference to FIGS. 6 to 11, FIGS. 14, and FIGS. 15 may be omitted or briefly explained.

[0121] Referring to FIGS. 16 to 18, a masking tape (MT) can be attached to a first surface (S1) of a graphite sheet (GPS). The masking tape (MT) can be attached to a specific location on the first surface (S1) of the graphite sheet (GPS). For example, the masking tape (MT) can be attached to a location on the first surface (S1) of the graphite sheet (GPS) where a contact hole (H) is formed. After the masking tape (MT) is attached, a cover material (CM) can be formed on the first surface (S1) of the graphite sheet (GPS). After the cover material (CM) is evenly coated on the first surface (S1) of the graphite sheet (GPS), the masking tape (MT) can be removed from the graphite sheet (GPS) to form a cover layer (CVLa) in which the contact hole (H) is defined. After forming a cover layer (CVLa), a graphite sheet (GPS) is cut to produce a multi-functional member (MFEa) of FIG. 14, and a display device (DDa) can be produced by combining the multi-functional member (MFEa), a display panel (e.g., a display panel (DP) of FIG. 2), and a printed circuit board (e.g., a printed circuit board (PCB) of FIG. 2) with each other.

[0122] However, the process of forming the contact hole (H) according to the embodiments of the present invention is not necessarily limited thereto, and after the first surface (S1) of the graphite sheet (GPS) is entirely covered with a cover material (CM), a portion of the cover material (CM) may be removed to form a cover layer (CVLa) in which the contact hole (H) is defined.

[0123] As described above, in the method for manufacturing a display device (DDa), since a cover layer (CVLa) covering a heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and accordingly, defects occurring in the display device (DDa) can be reduced. Therefore, the reliability of the display device (DDa) can be improved.

[0124] In addition, since the contact hole (H) is formed using masking tape (MT), the manufacturing process and time of the multi-functional member (MFEa) that performs electromagnetic shielding and electrostatic shielding can be shortened.

[0125] FIG. 19 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. FIG. 20 is a cross-sectional view showing a cross-section of a multi-functional member included in the display device of FIG. 19.

[0126] The display device (DDb) described with reference to FIGS. 19 and 20 may have the same or similar manufacturing method as the display device (DD) described with reference to FIGS. 1 to 5, except for the cover layer (CVLb) and the adhesive layer (ADLb).

[0127] In the following, content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly explained.

[0128] Referring to FIGS. 19 and 20, the display device (DDb) may include a multi-functional member (MFEb). The multi-functional member (MFEb) may include a heat dissipation layer (HDL), a cover layer (CVLb) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADLb) disposed on a second surface (S2) of the heat dissipation layer (HDL). In this specification, the cover layer (CVLb) may be referred to as the first cover layer, and the adhesive layer (ADLb) may be referred to as the second cover layer.

[0129] In one embodiment, the cover layer (CVLb) may cover a portion of the first surface (S1) and side surface (S3) of the heat dissipation layer (HDL). For example, the cover layer (CVLb) may extend from the first surface (S1) of the heat dissipation layer (HDL) to cover a portion of the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLb) may be adhered to the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLb) may include polyethylene terephthalate. In other words, the cover layer (CVLb) may be one-sided adhesive PET. However, the material included in the cover layer (CVLb) according to the embodiments of the present invention is not necessarily limited thereto, and the cover layer (CVLb) may include resin and / or filler.

[0130] In one embodiment, the adhesive layer (ADLb) may cover a portion of the second surface (S2) and side surface (S3) of the heat dissipation layer (HDL). For example, the adhesive layer (ADLb) may extend from the second surface (S2) of the heat dissipation layer (HDL) to cover a portion of the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the adhesive layer (ADLb) may bond the heat dissipation layer (HDL) and the display panel (DP) together on the second surface (S2) of the heat dissipation layer (HDL). In other words, the adhesive layer (ADLb) may be double-sided adhesive PET.

[0131] In one embodiment, the cover layer (CVLb) and the adhesive layer (ADLb) can cover the side (S3) of the heat dissipation layer (HDL) entirely. For example, the cover layer (CVLb) and the adhesive layer (ADLb) each come into contact with each other on the side (S3) of the heat dissipation layer (HDL), and the cover layer (CVLb) can surround the side (S3) of the heat dissipation layer (HDL) entirely together with the adhesive layer (ADLb).

[0132] As described above, the display device (DDb) may include a cover layer (CVLb) and an adhesive layer (ADLb) for covering a first surface (S1), a second surface (S2), and a side (S3) of a heat dissipation layer (HDL) containing graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from the surface of the heat dissipation layer (HDL) from entering the display panel (DP) or printed circuit board (PCB).

[0133] In addition, unlike the display device (DD) of FIG. 19, the display device (DDb) of FIG. 1 may not include a side cover member (e.g., the side cover member (SM) of FIG. 2). For example, in the display device (DDb) of FIG. 19, the cover layer (CVLb) and the adhesive layer (ADLb) completely surround the side (S3) of the heat dissipation layer (HDL), so the cover layer (CVLb) and the adhesive layer (ADLb) can perform the role of the side cover member.

[0134] FIG. 21 is a drawing for explaining a method of manufacturing the display device of FIG. 19.

[0135] The method of manufacturing a display device (DDb) described with reference to FIG. 21 may be the same or similar as the method of manufacturing a display device (DD) described with reference to FIG. 6 to FIG. 11, except for the process of covering the side (S3) of the heat dissipation layer (HDL) using a cover layer (CVLb) and an adhesive layer (ADLb).

[0136] In the following, content that overlaps with what has been described with reference to FIGS. 6 to 11, FIGS. 19, and FIG. 20 may be omitted or briefly explained.

[0137] Referring to FIG. 21, a material forming a cover layer (CVLb) can be applied entirely on a first surface (S1) of a heat dissipation layer (HDL). A material forming an adhesive layer (ADLb) can be applied entirely on a second surface (S2) of a heat dissipation layer (HDL). Pressure or heat can be applied to the material forming the cover layer (CVLb) so that the material forming the cover layer (CVLb) covers a portion of the side surface (S3) of the heat dissipation layer (HDL). Pressure or heat can be applied to the material forming the adhesive layer (ADLb) so that the material forming the adhesive layer (ADLb) covers a portion of the side surface (S3) of the heat dissipation layer (HDL). Pressure or heat can be applied until the material forming the adhesive layer (ADLb) and the material forming the cover layer (CVLb) come into contact with each other on the side surface (S3) of the heat dissipation layer (HDL). Accordingly, a cover layer (CVLb) covering a portion of the first surface (S1) of the heat dissipation layer (HDL) and the side surface (S3) of the heat dissipation layer (HDL), and an adhesive layer (ADLb) covering a portion of the second surface (S2) of the heat dissipation layer (HDL) and the side surface (S3) of the heat dissipation layer (HDL) may be formed. Accordingly, a multi-functional member (MFEb) of FIG. 19 is manufactured, and a display device (DDb) may be manufactured by combining the multi-functional member (MFEb), a display panel (e.g., the display panel (DP) of FIG. 2), and a printed circuit board (e.g., the printed circuit board (PCB) of FIG. 2) with each other.

[0138] As described above, in the method for manufacturing a display device (DDb), a cover layer (CVLb) is formed to cover a heat dissipation layer (HDL). Therefore, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and accordingly, defects occurring in the display device (DDb) can be reduced. Accordingly, the reliability of the display device (DDb) can be improved.

[0139] In addition, by applying heat or pressure to the material forming the cover layer (CVLb) and the adhesive layer (ADLb), respectively, the cover layer (CVLb) and the adhesive layer (ADLb) that cover the side (S3) of the heat dissipation layer (HDL) are formed, thereby reducing the time and cost for manufacturing the display device (DDb).

[0140] FIG. 22 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. FIG. 23 is a cross-sectional view showing a cross-section of a multi-functional member and a circuit board included in the display device of FIG. 22.

[0141] The display device (DDc) described with reference to FIGS. 22 and 23 may be substantially the same or similar to the display device (DDb) described with reference to FIGS. 19 and 20, except for the cover layer (CVLc) and the contact portion (CP).

[0142] In the following, content that overlaps with what has been explained with reference to FIGS. 19 and FIGS. 20 may be omitted or briefly explained.

[0143] Referring to FIGS. 22 and 23, the display device (DDc) may include a multi-functional member (MFEc). The multi-functional member (MFEc) may include a heat dissipation layer (HDL), a cover layer (CVLc) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADLc) disposed on a second surface (S2) of the heat dissipation layer (HDL).

[0144] At least one contact hole (H) penetrating the cover layer (CVLc) in the thickness direction (e.g., the third direction (DR3)) may be defined in the cover layer (CVLc). Multiple contact holes (H) may be arranged in a plane. For example, multiple contact holes (H) may be arranged in the first direction (DR1) and / or the second direction (DR2). However, the number and arrangement of contact holes (H) according to the embodiments of the present invention are not necessarily limited thereto.

[0145] The heat dissipation layer (HDL) and the printed circuit board (PCB) can be connected to each other through a contact hole (H). For example, the heat dissipation layer (HDL) and the printed circuit board (PCB) can be electrically or physically connected to each other through a contact portion (CP) that fills the contact hole (H). The contact portion (CP) can contact a first surface (S1) of the heat dissipation layer (HDL) and one surface of the printed circuit board (PCB). In one embodiment, the contact portion (CP) may include a conductive material.

[0146] In one embodiment, the contact portion (CP) may be formed integrally with the heat dissipation layer (HDL). For example, the contact portion (CP) may be a part of the heat dissipation layer (HDL) protruding toward the printed circuit board (PCB) from a first surface (S1) of the heat dissipation layer (HDL). In another embodiment, the contact portion (CP) may be formed integrally with the printed circuit board (PCB). For example, the contact portion (CP) may be a part of the printed circuit board (PCB) protruding toward the heat dissipation layer (HDL) from the said surface of the printed circuit board (PCB). In yet another embodiment, the contact portion (CP) may be a separate component from the heat dissipation layer (HDL) and the printed circuit board (PCB), respectively. For example, the contact portion (CP) may be a conductive tape such as an anisotropic conductive film, a thermally conductive adhesive, a conductive material, etc. However, the contact portion (CP) according to the embodiments of the present invention is not necessarily limited thereto.

[0147] As described above, the display device (DDc) may include a cover layer (CVLc) and an adhesive layer (ADLc) for covering a first surface (S1), a second surface (S2), and a side (S3) of a heat dissipation layer (HDL) containing graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from the surface of the heat dissipation layer (HDL) from entering the display panel (DP) or printed circuit board (PCB).

[0148] In addition, the heat dissipation layer (HDL) and the printed circuit board (PCB) can be connected to each other through contact holes (H). Accordingly, the multi-functional component (MFEc) can more easily perform electrostatic shielding and electrostatic shielding roles.

[0149] FIG. 24 is a drawing for explaining a method of manufacturing the display device of FIG. 22.

[0150] The manufacturing method of the display device (DDc) described with reference to FIG. 24 may be the same or similar as the manufacturing method of the display device (DD) described with reference to FIG. 6 to FIG. 11, except for the process of covering the side (S3) of the heat dissipation layer (HDL) using the cover layer (CVLc) and the adhesive layer (ADLc) and the process of forming the contact hole (H). Additionally, the manufacturing method of the display device (DDc) described with reference to FIG. 24 may be the same or similar as the manufacturing method of the display device (DDb) described with reference to FIG. 21, except for the process of forming the contact hole (H).

[0151] In the following, content that overlaps with what has been described with reference to FIGS. 6 to 11 and FIGS. 21 to 23 may be omitted or briefly explained.

[0152] Referring to FIG. 24, heat or pressure may be applied to the material forming the cover layer (CVLc) and the material forming the adhesive layer (ADLc), respectively, to form the cover layer (CVLc) and the adhesive layer (ADLc) that cover the side (S3) of the heat dissipation layer (HDL). Additionally, a portion of the cover layer (CVLc) may be removed to form a contact hole (H). The contact hole (H) may be formed using a masking tape (e.g., the masking tape (MT) of FIG. 16). However, the process of forming the contact hole (H) according to the embodiments of the present invention is not necessarily limited thereto.

[0153] In one embodiment, the process of applying heat or pressure may be performed before the process of forming the contact hole (H). In another embodiment, the process of applying heat or pressure may be performed after the process of forming the contact hole (H). In yet another embodiment, the process of applying heat or pressure may be performed simultaneously with the process of forming the contact hole (H).

[0154] As described above, in the method for manufacturing a display device (DDc), since a cover layer (CVLc) covering a heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and accordingly, defects occurring in the display device (DDc) can be reduced. Accordingly, the reliability of the display device (DDc) can be improved.

[0155] In addition, since the contact hole (H) is formed using the masking tape, the manufacturing process and time of the multi-functional member (MFEc) that performs electromagnetic shielding and electrostatic shielding can be shortened.

[0156] In addition, by applying heat or pressure to the materials forming the cover layer (CVLc) and the adhesive layer (ADLc), respectively, the cover layer (CVLc) and the adhesive layer (ADLc) that cover the side (S3) of the heat dissipation layer (HDL) are formed, thereby reducing the time and cost for manufacturing the display device (DDc).

[0157] FIG. 25 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. FIG. 26 is a cross-sectional view showing a cross-section of a multi-functional member included in the display device of FIG. 25.

[0158] The display device (DDd) described with reference to FIGS. 25 and 26 may be substantially the same or similar to the display device (DD) described with reference to FIGS. 1 to 5, except for the cover layer (CVLd).

[0159] In the following, content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly explained.

[0160] Referring to FIGS. 25 and 26, the multi-functional member (MFEd) may include a heat dissipation layer (HDL), a cover layer (CVLd) covering the heat dissipation layer (HDL), and an adhesive layer (ADL) disposed on the cover layer (CVLd). In one embodiment, the cover layer (CVLd) may include a conductive metallic material. For example, the metallic material may include aluminum (Al), copper (Cu), silver (Ag), etc. These may be used alone or in combination with each other. In one embodiment, the cover layer (CVLd) may be a metal coating layer. For example, the cover layer (CVLd) may be formed through a plating process. In one embodiment, the average thickness of the cover layer (CVLd) may be about 1 μm to about 20 μm.

[0161] In one embodiment, the cover layer (CVLd) may surround all of the first surface (S1), the second surface (S2), and the side (S3) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLd) may be in contact with a printed circuit board (PCB). An adhesive layer (ADL) may be adhered to one surface of the cover layer (CVLd). The adhesive layer (ADL) may connect the multi-functional member (MFEd) and the display panel (DP).

[0162] As described above, the display device (DDd) may include a cover layer (CVLd) for covering a first surface (S1), a second surface (S2), and a side (S3) of a heat dissipation layer (HDL) containing graphite. Accordingly, it is possible to prevent impurities such as particles from the surface of the heat dissipation layer (HDL) from entering the display panel (DP) or printed circuit board (PCB).

[0163] As described above, in the method for manufacturing a display device (DDd), since a cover layer (CVLd) is formed by plating a heat dissipation layer (HDL), a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), thereby reducing defects occurring in the display device (DDd). Accordingly, the reliability of the display device (DDd) can be improved. Industrial applicability

[0164] The present invention may be applied to display devices and electronic devices including the same. For example, the present invention may be applied to high-resolution smartphones, mobile phones, smartpads, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, etc.

[0165] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0166] DD, DDa, DDb, DDc, DDd: Display device MFE, MFEa, MFEb, MFEc, MFEd: Lack of multi-functionality CVL, CVLa, CVLb, CVLc, CVLd: Cover layer ADL, ADLb, ADLc: Adhesive layer HDL: Thermal layer GPS: Graphite sheet DP: Display Panel PCB: Printed Circuit Board S1: First surface of the heat dissipation layer S2: Second surface of the heat dissipation layer S3: Side of the heat dissipation layer

Claims

Claim 1 A display panel comprising at least one pixel; a printed circuit board disposed below the display panel and electrically connected to the pixel; a heat dissipation layer comprising graphite and disposed between the display panel and the printed circuit board; and a cover layer disposed on one side of the heat dissipation layer facing the printed circuit board. A display device comprising a resin and a side cover member covering the side of the heat dissipation layer, wherein the cover layer has a contact hole defined that penetrates the cover layer in the thickness direction, the contact hole extends from the lower surface of the heat dissipation layer to the upper surface of the printed circuit board, and a contact portion filling the contact hole electrically connects the heat dissipation layer and the printed circuit board, wherein the cover layer comprises at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, and silicone, and the cover layer further comprises at least one material selected from the group of fillers consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube, and wherein the mass ratio of the resin group included in the cover layer is greater than the mass ratio of the filler group included in the cover layer. Claim 2 A display device according to claim 1, wherein the cover layer comprises the same material as the side cover member. Claim 3 A display device according to claim 1, wherein the cover layer comprises a material different from that of the side cover member. Claim 4 delete Claim 5 A display device according to claim 1, characterized in that the mass ratio of the resin group included in the cover layer is 30 wt% to 90 wt%, and the mass ratio of the filler group included in the cover layer is 10 wt% to 70 wt%. Claim 6 A display device according to claim 1, characterized in that the average thickness of the heat dissipation layer is greater than the average thickness of the cover layer, the average thickness of the heat dissipation layer is 10 μm to 1000 μm, and the average thickness of the cover layer is 5 μm to 50 μm. Claim 7 A display device according to claim 1, characterized in that the thermal conductivity of the heat dissipation layer is 100 W / (m·K) to 1700 W / (m·K). Claim 8 A display device according to claim 1, characterized in that the cover layer is adhered to one surface of the heat dissipation layer and comprises polyethylene terephthalate (PET). Claim 9 delete Claim 10 A display device according to claim 1, further comprising an adhesive layer disposed between the display panel and the heat dissipation layer, wherein the average thickness of the adhesive layer is greater than the average thickness of the cover layer and less than the average thickness of the heat dissipation layer, and wherein the adhesive layer bonds the heat dissipation layer and the display panel together and comprises polyethylene terephthalate. Claim 11 A display panel comprising at least one pixel; a printed circuit board disposed below the display panel and electrically connected to the pixel; a heat dissipation layer comprising graphite and disposed between the display panel and the printed circuit board; a first cover layer disposed on one side of the heat dissipation layer facing the printed circuit board and extending from said side to cover a portion of the side of the heat dissipation layer; A display device comprising a second cover layer disposed on a surface opposite to one surface of the heat dissipation layer and extending from the other surface to contact the first cover layer, wherein the first cover layer has a contact hole defined that penetrates the first cover layer in the thickness direction, the contact hole extends from the lower surface of the heat dissipation layer to the upper surface of the printed circuit board, and a contact portion filling the contact hole electrically connects the heat dissipation layer and the printed circuit board, wherein the first cover layer comprises at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, and silicone, and the first cover layer further comprises at least one material selected from the group of fillers consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube, wherein the mass ratio of the resin group included in the first cover layer is greater than the mass ratio of the filler group included in the first cover layer. Claim 12 A display device according to claim 11, wherein the first cover layer is adhered to one side of the heat dissipation layer and comprises polyethylene terephthalate, and the second cover layer combines the heat dissipation layer and the display panel on the other side of the heat dissipation layer and comprises polyethylene terephthalate. Claim 13 A display device according to claim 12, wherein the first cover layer has a contact hole that penetrates the first cover layer in the thickness direction, and the heat dissipation layer is connected to the printed circuit board through the contact hole. Claim 14 A display device according to claim 11, wherein the first cover layer and the second cover layer are integrally formed to define a single metal coating layer that surrounds all of the one side, the other side, and the side of the heat dissipation layer, and wherein the average thickness of the metal coating layer is 1 μm to 20 μm. Claim 15 A step of forming a cover layer on one side of a heat dissipation layer containing graphite; a step of forming an adhesive layer on the other side of the heat dissipation layer opposite to the one side; a step of covering the side of the heat dissipation layer using a polymer material or a metal material; a step of forming a contact hole penetrating the cover layer in the thickness direction; A method for manufacturing a display device comprising the step of electrically connecting the heat dissipation layer and the printed circuit board through the contact hole, wherein the contact hole extends from the lower surface of the heat dissipation layer to the upper surface of the printed circuit board, and a contact portion filling the contact hole electrically connects the heat dissipation layer and the printed circuit board, wherein the cover layer comprises at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, and silicone, and the cover layer further comprises at least one material selected from the group of fillers consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube, and wherein the mass ratio of the resin group included in the cover layer is greater than the mass ratio of the filler group included in the cover layer. Claim 16 A method for manufacturing a display device according to claim 15, wherein the step of forming the cover layer on one surface of the heat dissipation layer comprises: a step of unfolding a graphite sheet in a roll state; a step of coating a material forming the cover layer on one surface of the graphite sheet; and a step of cutting the graphite sheet and the coated cover layer, and wherein, in the step of covering the side of the heat dissipation layer, the side of the heat dissipation layer is surrounded by a side cover member. Claim 17 A method for manufacturing a display device according to claim 15, wherein the step of forming the cover layer on one surface of the heat dissipation layer comprises: a step of unfolding a graphite sheet in a roll state; a step of cutting the graphite sheet to form the heat dissipation layer; and a step of coating a material that forms the cover layer on one surface of the heat dissipation layer, wherein in the step of covering the side of the heat dissipation layer, the side of the heat dissipation layer is surrounded by a side cover member. Claim 18 A method for manufacturing a display device according to claim 15, wherein the step of covering the side of the heat dissipation layer comprises: stretching the cover layer from one side of the heat dissipation layer to the side; forming the adhesive layer from the other side of the heat dissipation layer to the side; and bringing the cover layer and the adhesive layer into contact with each other so that the cover layer and the adhesive layer seal the side of the heat dissipation layer. Claim 19 A method for manufacturing a display device according to claim 15, wherein the step of forming the cover layer on the one surface of the heat dissipation layer comprises: the step of unfolding a graphite sheet in a roll state; the step of cutting the graphite sheet to form the heat dissipation layer; and the step of plating the heat dissipation layer such that the cover layer surrounds the one surface, the other surface, and the side surface of the heat dissipation layer, and wherein, in the step of forming the adhesive layer on the other surface opposite to the one surface of the heat dissipation layer, the adhesive layer is in contact with the cover layer surrounding the heat dissipation layer. Claim 20 delete

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