Inspection method, inspection apparatus, and method of manufacturing display device comprising the inspection method

Abstract

The inspection device includes a first light-emitting unit, a half-mirror unit, and an imaging unit. The first light-emitting unit includes a first light source and a band-pass filter. The first light source emits first light having a first wavelength band. The band-pass filter selectively transmits second light having a second wavelength band with a bandwidth of 120 nm or less from the first light. The half-mirror unit directs the second light onto an object to be inspected. The imaging unit acquires an image of the object to be inspected upon which the second light is incident. Accordingly, the image includes interference fringes formed on the object to be inspected. Based on this, the location of the object to be inspected, including a transparent material, can be determined. As a result, the reliability of the inspection device is improved. Since the location of the object to be inspected is determined precisely, the dam included in the display device can be omitted. Accordingly, the dead space of the display device is reduced.

Description

Technology Field

[0001] The present invention relates to an inspection method, an inspection device, and a method for manufacturing a display device including the inspection method. More specifically, the present invention relates to an inspection method for inspecting the manufacturing quality of a display device, an inspection device for performing the same, and a method for manufacturing a display device including the inspection method. Background Technology

[0002] Flat panel displays are used as replacements for cathode ray tube displays due to their characteristics, such as lightweight and thin profiles. Representative examples of the aforementioned flat panel displays include liquid crystal displays and organic light-emitting diode displays.

[0003] The display device may include a display area and a non-display area. A light-emitting element that generates light may be disposed in the display area. The display device may include an encapsulation layer that encapsulates the display area to protect the light-emitting element. The encapsulation layer may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0004] The above organic encapsulation layer can be formed using an organic material such as a monomer. When forming the organic encapsulation layer, if a large amount of the organic material overflows to the edge of the display area, a defect in the display device may occur. The problem to be solved

[0005] One objective of the present invention is to provide an inspection method with improved reliability.

[0006] Another objective of the present invention is to provide an inspection device suitable for performing the above inspection method.

[0007] Another objective of the present invention is to provide a method for manufacturing a display device including the above inspection method.

[0008] However, the objectives of the present invention are not limited to the objectives described above and may be expanded in various ways without departing from the spirit and scope of the present invention. means of solving the problem

[0009] To achieve one objective of the present invention as described above, an inspection method according to one embodiment of the present invention may include the step of selectively transmitting a second light having a second wavelength band with a bandwidth of 120 nm or less among a first light having a first wavelength band and irradiating it onto an object to be inspected, and the step of obtaining a first image of the object to be inspected that has been irradiated with the second light.

[0010] According to one embodiment, the bandwidth of the second wavelength band may be 10 nm or less.

[0011] According to one embodiment, the first light may be white light and the second light may be yellow light.

[0012] According to one embodiment, the second wavelength band may be 570 nm to 580 nm.

[0013] According to one embodiment, the first image may include an interference fringe formed on the object to be inspected.

[0014] According to one embodiment, the inspection method may further include the step of irradiating a third light having the first wavelength band onto an object to be inspected, and the step of obtaining a second image of the object to be inspected upon which the third light was irradiated.

[0015] To achieve another objective of the present invention as described above, an inspection device according to one embodiment of the present invention may include a first light source emitting a first light having a first wavelength band and a first light emitting unit including a band pass filter that selectively transmits a second light having a second wavelength band with a bandwidth of 120 nm or less among the first light, a half mirror unit that incidents the second light on an object to be inspected, and a shooting unit that acquires a first image of the object to be inspected upon which the second light is incident.

[0016] According to one embodiment, the bandwidth of the second wavelength band may be 10 nm or less.

[0017] According to one embodiment, the first light may be white light and the second light may be yellow light.

[0018] According to one embodiment, the second wavelength band may be 570 nm to 580 nm.

[0019] According to one embodiment, the first image may include an interference pattern formed on the object to be inspected.

[0020] According to one embodiment, the inspection device may further include a second light-emitting unit comprising a second light source that emits a third light having the first wavelength band, and the half-mirror unit may cause the third light to be incident on the object to be inspected.

[0021] According to one embodiment, the inspection device may further include a control unit that controls the first light source and the second light source so that the first light and the third light are emitted alternately.

[0022] According to one embodiment, the imaging unit can acquire a second image of the inspection target upon which the third light is incident.

[0023] According to one embodiment, the imaging unit may include a camera barrel having a shape extending in a first direction, a camera disposed at a first end of the camera barrel and photographing the object to be inspected, and a lens disposed at a second end of the camera barrel opposite to the first end; the first light-emitting unit may further include a first light source barrel adjacent to the camera barrel in a second direction intersecting the first direction, providing a space for emitting the first light, and accommodating the band-pass filter; and the second light-emitting unit may further include a second light source barrel adjacent to the camera barrel in the second direction and providing a space for emitting the second light.

[0024] According to one embodiment, the half mirror portion may include a first half mirror disposed within the camera barrel and having a reflective surface disposed on the lens to reflect incident light toward the lens.

[0025] According to one embodiment, the half mirror unit may further include a second half mirror disposed within the first light source tube, a third half mirror disposed within the second light source tube, and a fourth half mirror disposed between the second light source and the third half mirror, which directs light reflected from the second half mirror to the third half mirror.

[0026] According to one embodiment, the half mirror portion may further include a second half mirror disposed within the first light source tube and reflecting the second light to the first half mirror, and a third half mirror disposed within the second light source tube and reflecting the third light to the first half mirror.

[0027] According to one embodiment, the half mirror portion may further include a rotating member that rotates the first half mirror such that when the first light is emitted, the reflective surface faces the second half mirror, and when the third light is emitted, the reflective surface faces the third half mirror.

[0028] To achieve another objective of the present invention as described above, a method for manufacturing a display device according to one embodiment of the present invention may include the steps of: forming a light-emitting element on a substrate; forming a first inorganic encapsulation layer on the light-emitting element; forming an organic encapsulation layer on the first inorganic encapsulation layer; selectively transmitting a second light having a second wavelength band with a bandwidth of 120 nm or less among a first light having a first wavelength band and irradiating it onto the organic encapsulation layer; obtaining an image of the organic encapsulation layer irradiated with the second light and inspecting the organic encapsulation layer; and forming a second inorganic encapsulation layer on the organic encapsulation layer. Effects of the invention

[0029] The inspection method selectively transmits light having a wavelength band with a relatively narrow bandwidth and irradiates it onto an object to be inspected. The image of the object to be inspected upon which the light is irradiated may include interference patterns formed on the object. Based on this, the location of the object to be inspected, including a transparent material, can be determined. Consequently, deviations in the determination of the object's location, which can vary depending on individual proficiency, can be reduced. In other words, the reliability of the inspection method can be improved.

[0030] In addition, by determining the location of the inspection target containing the transparent material, the dam included in the display device can be omitted. Accordingly, the dead space of the display device can be reduced.

[0031] However, the effects of the present invention are not limited to the effects described above, and may be extended in various ways without departing from the spirit and scope of the present invention. Brief explanation of the drawing

[0032] FIGS. 1 and FIGS. 2 are drawings showing an inspection device according to an embodiment of the present invention. FIG. 3 is a plan view showing an example of an object to be inspected by the inspection device of FIG. 1. Figure 4 is a cross-sectional view of Figure 3 cut along line II'. FIGS. 5 to 9 are drawings showing the results of inspecting a part of the object to be inspected in FIG. 4 with the inspection device of FIG. 1. FIG. 10 is a drawing showing a comparison of the results of inspecting another example of an object to be inspected by the inspection device of FIG. 1. FIG. 11 is a drawing showing an inspection device according to another embodiment of the present invention. FIGS. 12a to 12d are cross-sectional views illustrating a method for manufacturing a display device according to an embodiment of the present invention. Specific details for implementing the invention

[0033] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components will be omitted.

[0034] FIGS. 1 and FIGS. 2 are drawings showing an inspection device (1000) according to one embodiment of the present invention.

[0035] Referring to FIGS. 1 and 2, the inspection device (1000) may include a first light-emitting unit (EMP1), a second light-emitting unit (EMP2), a half mirror unit (HMP), an imaging unit (PTP), and a control unit (CTP).

[0036] The first light-emitting unit (EMP1) may include a first light source (LS1), a band-pass filter (BPF), and a first light source tube (BT1). The second light-emitting unit (EMP2) may include a second light source (LS2) and a second light source tube (BT2).

[0037] A first light source (LS1) can emit a first light (L1) having a first wavelength band. The first light source (LS1) can emit the first light (L1) in a first direction (DR1). A second light source (LS2) can emit a third light (L3) having the first wavelength band. The third light (L3) may be substantially the same as the first light (L1). The second light source (LS2) can emit the third light (L3) in a first direction (DR1). FIG. 1 is a diagram illustrating the case where the first light source (LS1) emits the first light (L1), and FIG. 2 is a diagram illustrating the case where the second light source (LS2) emits the third light (L3). In one embodiment, the first light (L1) and the third light (L3) may be emitted alternatively. This will be described in detail later.

[0038] In one embodiment, the first wavelength band may be approximately 380 nm to approximately 750 nm. That is, the first light (L1) and the third light (L3) may be visible light. Specifically, the first light (L1) and the third light (L3) may be white light. In other words, the bandwidth of the first light (L1) and the third light (L3) may be approximately 370 nm. The inspection device (1000) may use the first light (L1) and / or the third light (L3), which are visible light, so that the object to be inspected is visible to the human eye.

[0039] In one embodiment, the object to be inspected may be a semi-finished product or a finished product of a display device. In other words, the inspection device (1000) may be a device for inspecting the manufacturing quality of the semi-finished product or finished product of the display device. For example, the inspection device (1000) may inspect whether the manufactured semi-finished product or finished product of the display device is a good product or a defective product. The object to be inspected may be placed on a plane defined by a second direction (DR2) intersecting a first direction (DR1) and a third direction (DR3) intersecting the second direction (DR2). That is, the object to be inspected may be placed on the plane defined by the second direction (DR2) and the third direction (DR3), and the inspection device (1000) may inspect the object to be inspected in the first direction (DR1) while spaced apart from the plane.

[0040] A band-pass filter (BPF) may be placed within the first light source tube (BT1). That is, the band-pass filter (BPF) may be placed within the first light source tube (BT1) and may not be placed within the second light source tube (BT2). Specifically, the first light (L1) may be incident on the band-pass filter (BPF), and the third light (L3) may not be incident on the band-pass filter (BPF).

[0041] A bandpass filter (BPF) can be positioned below a first light source (LS1). The bandpass filter (BPF) can be positioned so that a first light (L1) emitted by the first light source (LS1) is incident. The bandpass filter (BPF) can transmit a second light (L2) having a second wavelength band among the first light (L1). In other words, the bandpass filter (BPF) can block the first light (L1) excluding the second light (L2). For example, the bandpass filter (BPF) can absorb or reflect the first light (L1) excluding the second light (L2). That is, the bandpass filter (BPF) can block a portion of the first light (L1) and transmit another portion of the first light (L1). Therefore, the bandpass filter (BPF) can selectively transmit the incident light.

[0042] In one embodiment, the bandwidth of the second light (L2) may be approximately 120 nm or less. That is, the bandpass filter (BPF) may selectively transmit the second light (L2) having a bandwidth of approximately 120 nm from the first light (L1) having a bandwidth of approximately 370 nm. For example, the bandpass filter (BPF) may transmit the second light (L2) having a wavelength band of approximately 630 nm to approximately 750 nm. In this case, the second light (L2) may be red light. The bandwidth of the second light (L2) may be approximately 120 nm, which is the difference between the maximum wavelength (e.g., approximately 750 nm) and the minimum wavelength (e.g., approximately 630 nm). That is, the bandpass filter (BPF) may block light having a wavelength of approximately 630 nm or less. However, the wavelength band of the second light (L2) having a bandwidth of approximately 120 nm is not limited to approximately 630 nm to approximately 750 nm. For example, the wavelength band of the second light (L2) having a bandwidth of approximately 120 nm can be arbitrarily selected within the wavelength band of visible light, approximately 380 nm to approximately 750 nm.

[0043] In one embodiment, the bandwidth of the second light (L2) may be approximately 100 nm or less. That is, the bandpass filter (BPF) may selectively transmit the second light (L2) having a bandwidth of approximately 100 nm from the first light (L1) having a bandwidth of approximately 370 nm. For example, the bandpass filter (BPF) may transmit the second light (L2) having a wavelength band of approximately 640 nm to approximately 740 nm. In this case as well, the second light (L2) may be red light. The bandwidth of the second light (L2) may be approximately 100 nm, which is the difference between the maximum wavelength (e.g., approximately 740 nm) and the minimum wavelength (e.g., approximately 640 nm). That is, the bandpass filter (BPF) may block light having a wavelength of approximately 630 nm or less and light having a wavelength of approximately 740 nm or more. However, the wavelength band of the second light (L2) having a bandwidth of approximately 100 nm is not limited to approximately 640 nm to approximately 740 nm. For example, the wavelength band of the second light (L2) having a bandwidth of approximately 100 nm can be arbitrarily selected within the wavelength band of visible light, approximately 380 nm to approximately 750 nm.

[0044] In one embodiment, the bandwidth of the second light (L2) may be approximately 80 nm or less. That is, the bandpass filter (BPF) may selectively transmit the second light (L2) having a bandwidth of approximately 80 nm from the first light (L1) having a bandwidth of approximately 370 nm. For example, the bandpass filter (BPF) may transmit the second light (L2) having a wavelength band of approximately 490 nm to approximately 570 nm. In this case, the second light (L2) may be green light. The bandwidth of the second light (L2) may be approximately 80 nm, which is the difference between the maximum wavelength (e.g., approximately 570 nm) and the minimum wavelength (e.g., approximately 490 nm). That is, the bandpass filter (BPF) may block light having a wavelength of less than approximately 490 nm and light having a wavelength greater than approximately 570 nm. However, the wavelength band of the second light (L2) having a bandwidth of approximately 80 nm is not limited to approximately 490 nm to approximately 570 nm. For example, the wavelength band of the second light (L2) having a bandwidth of approximately 80 nm can be arbitrarily selected within the wavelength band of visible light, approximately 380 nm to approximately 750 nm.

[0045] In one embodiment, the bandwidth of the second light (L2) may be approximately 40 nm or less. That is, the bandpass filter (BPF) may selectively transmit the second light (L2) having a bandwidth of approximately 40 nm from the first light (L1) having a bandwidth of approximately 370 nm. For example, the bandpass filter (BPF) may transmit the second light (L2) having a wavelength band of approximately 450 nm to approximately 490 nm. In this case, the second light (L2) may be blue light. The bandwidth of the second light (L2) may be approximately 40 nm, which is the difference between the maximum wavelength (e.g., approximately 490 nm) and the minimum wavelength (e.g., approximately 450 nm). That is, the bandpass filter (BPF) may block light having a wavelength of approximately less than 450 nm and light having a wavelength greater than approximately 490 nm. However, the wavelength band of the second light (L2) having a bandwidth of approximately 40 nm is not limited to approximately 450 nm to approximately 490 nm. For example, the wavelength band of the second light (L2) having a bandwidth of approximately 40 nm can be arbitrarily selected within the wavelength band of visible light, approximately 380 nm to approximately 750 nm.

[0046] In one embodiment, the bandwidth of the second light (L2) may be approximately 10 nm or less. That is, the bandpass filter (BPF) may selectively transmit the second light (L2) having a bandwidth of approximately 10 nm from the first light (L1) having a bandwidth of approximately 370 nm. For example, the bandpass filter (BPF) may transmit the second light (L2) having a wavelength band of approximately 570 nm to approximately 580 nm. In this case, the second light (L2) may be yellow light. The bandwidth of the second light (L2) may be approximately 10 nm, which is the difference between the maximum wavelength (e.g., approximately 580 nm) and the minimum wavelength (e.g., approximately 570 nm). That is, the bandpass filter (BPF) may block light having a wavelength of less than approximately 570 nm and light having a wavelength greater than approximately 580 nm. However, the wavelength band of the second light (L2) having a bandwidth of approximately 10 nm is not limited to approximately 570 nm to approximately 580 nm. For example, the wavelength band of the second light (L2) having a bandwidth of approximately 10 nm can be arbitrarily selected within the wavelength band of visible light, approximately 380 nm to approximately 750 nm.

[0047] Meanwhile, if the above-mentioned object to be inspected includes a transparent material, the inspection device (1000) needs to visualize the object to be inspected and inspect it.

[0048] A second light (L2) having a bandwidth relatively narrower than that of the first light (L1) may be irradiated onto the object to be inspected. By irradiating the second light (L2) having a relatively narrow bandwidth onto the object to be inspected, an interference fringe may be formed on the object to be inspected. The interference fringe may also be referred to as a moiré fringe. Based on the interference fringe, the object to be inspected, which includes the transparent material, may be visualized. That is, the inspection device (1000) may inspect the location of the object to be inspected, which includes the transparent material.

[0049] As the bandwidth of the second light (L2) irradiated onto the object to be inspected becomes narrower, the visibility of the interference fringe may increase. That is, the more the second light (L2) having a narrower bandwidth is irradiated, the clearer the interference fringe may become. As a result, the location of the object to be inspected, including the transparent material, can be determined more easily. For example, when the second light (L2) having a bandwidth of approximately 10 nm is irradiated, the visibility of the interference fringe formed on the object to be inspected may be higher than when the second light (L2) having a bandwidth of approximately 120 nm is irradiated. This may mean that the visibility of the interference fringe increases as the second light (L2) having a narrower bandwidth is irradiated onto the object to be inspected.

[0050] In other words, it may mean that the bandwidth of the second light (L2) can increase or decrease the visibility of the interference fringes, and that the second wavelength band of the second light (L2) can not increase or decrease the visibility of the interference fringes. For example, when the second light (L2) is red light having a wavelength band of approximately 630 nm to approximately 750 nm, the visibility of the interference fringes may be lower than when the second light (L2) is red light having a wavelength band of approximately 640 nm to approximately 740 nm. Also, when the second light (L2) is blue light having a wavelength band of approximately 450 nm to approximately 490 nm, the visibility of the interference fringes may be substantially the same as when the second light (L2) is green light having a wavelength band of approximately 500 nm to approximately 540 nm. That is, even if the light is of the same color, if a second light (L2) having a different bandwidth is irradiated, the visibility of the interference pattern may differ, and even if the second light (L2) has a different color and a different wavelength band, if the second light (L2) having the same bandwidth is irradiated, the visibility of the interference pattern may be substantially the same.

[0051] The inspection device (1000) can irradiate a third light (L2) having a relatively wide bandwidth to the inspection target when inspecting the visible configuration of the inspection target, and can irradiate a second light (L2) having a relatively narrow bandwidth to the inspection target when inspecting the invisible (i.e., transparent) configuration of the inspection target. Accordingly, the reliability of the inspection device (1000) can be improved.

[0052] The first light source tube (BT1) may have a shape that extends in a first direction (DR1). For example, the first light source tube (BT1) may have a cylindrical shape. However, the shape of the first light source tube (BT1) is not limited and may have various shapes. The first light source tube (BT1) may provide a space in which the first light source (LS1) emits the first light (L1). That is, the first light source tube (BT1) may provide the space so that the first light (L1) does not interfere with external light. The first light source tube (BT1) may accommodate a band-pass filter (BPF). That is, the band-pass filter (BPF) may be placed within the first light source tube (BT1). Therefore, the second light (L2) that passes through the band-pass filter (BPF) does not interfere with external light, thereby maintaining the bandwidth of the second light (L2).

[0053] Although not illustrated, the first light source tube (BPF) may have a filter replacement section. Through the filter replacement section, the band-pass filter (BPF) can be replaced. For example, a band-pass filter having a bandwidth of approximately 120 nm can be replaced through the filter replacement section with a band-pass filter having a bandwidth of approximately 10 nm. That is, a first band-pass filter having a first bandwidth included in the inspection device (1000) can be replaced with a second band-pass filter having a second bandwidth as needed.

[0054] The second light source tube (BT2) may have a shape that extends in the first direction (DR1). For example, the second light source tube (BT2) may have a shape similar to the first light source tube (BT1). The second light source tube (BT2) may be adjacent to the first light source tube (BT1). The second light source tube (BT2) may provide a space where the second light source (LS2) emits the third light (L3). That is, the second light source tube (BT2) may provide the space so that the third light (L3) does not interfere with external light.

[0055] The half mirror unit (HMP) may include a plurality of half mirrors. In one embodiment, the half mirror unit (HMP) may include first to fourth half mirrors (HM1, HM2, HM3, HM4). The half mirror unit (HMP) may cause a second light (L2) to be incident on the object to be inspected and a third light (L3) to be incident on the object to be inspected. That is, the plurality of half mirrors included in the half mirror unit (HMP) may be arranged at various positions and provided in various numbers so that the second light (L2) and the third light (L3) are incident on the object to be inspected.

[0056] The imaging unit (PTP) may include a camera barrel (CBT), a camera (CM), and a lens (LN). The imaging unit (PTP) may acquire a first image of the inspection target upon which the second light (L2) is incident. The imaging unit (PTP) may acquire a second image of the inspection target upon which the third light (L3) is incident.

[0057] The camera tube (CBT) may have a shape extending in a first direction (DR1). For example, the camera tube (CBT) may have a shape similar to the first light source tube (BT1) and the second light source tube (BT2). The camera tube (CBT), the first light source tube (BT1), and the second light source tube (BT2) may be adjacent to each other. For example, the camera tube (CBT), the first light source tube (BT1), and the second light source tube (BT2) may be arranged in a second direction (DR2). In the example of FIGS. 1 and 2, the second light source tube (BT2) is positioned between the camera tube (CBT) and the first light source tube (BT1), but is not limited thereto.

[0058] The camera barrel (CBT) may have a first end (E1) and a second end (E2) opposite to the first end (E1). The first end (E1) and the second end (E2) may be spaced apart in a first direction (DR1). The camera barrel (CBT) may provide a space for the camera (CM) to photograph and a focal length of the lens (LN). The camera barrel (CBT) may block interference from external light.

[0059] A camera (CM) may be positioned at the first end (E1) of a camera barrel (CBT). The camera (CM) may photograph the object to be inspected. For example, the camera (CM) may be a line scan camera.

[0060] The lens (LN) may be positioned at the second end (E2) of the camera barrel (CBT). That is, the camera (CM) and the lens (LN) may be spaced apart from each other. The lens (LN) may converge light reflected from the object to be inspected. The lens (LN) may be various lenses that control the path of the passing light. For example, the lens (LN) may be an objective lens, a magnification lens, a condensing lens, etc. The object to be inspected may be positioned below the lens (LN).

[0061] In one embodiment, the first half mirror (HM1) may be placed within the camera barrel (CBT). The first half mirror (HM1) may be placed on the lens (LN). The first half mirror (HM1) may have a reflective surface (RS) that reflects incident light toward the lens (LN).

[0062] In one embodiment, a second half mirror (HM2) may be placed within a first light source tube (BT1). The second half mirror (HM2) may reflect a second light (L2). For example, the second light (L2) incident on the first half mirror (HM1) in a first direction (DR1) may be reflected in a direction different from the first direction (DR1).

[0063] In one embodiment, the third half mirror (HM3) may be placed within the second light source tube (BT2). The third half mirror (HM3) may reflect incident light toward the first half mirror (HM1).

[0064] In one embodiment, the fourth half mirror (HM4) may be placed within the second light source tube (BT2). The fourth half mirror (HM4) may be placed between the second light source (LS2) and the third half mirror (HM3). The fourth half mirror (HM4) may transmit a portion of the incident light and reflect another portion of the incident light.

[0065] Referring to FIG. 1, the fourth half mirror (HM4) can reflect the second light (L2). That is, the second light (L2) can be reflected sequentially from the second half mirror (HM2), the fourth half mirror (HM4), the third half mirror (HM3), and the first half mirror (HM1) and incident on the object to be inspected. That is, the fourth half mirror (HM4) can cause the second light (L2) reflected from the second half mirror (HM2) to be incident on the third half mirror (HM3).

[0066] Referring to FIG. 2, the fourth half mirror (HM4) can transmit the third light (L3). That is, the third light (L3) can pass through the fourth half mirror (HM4), and can be sequentially reflected from the third half mirror (HM3) and the first half mirror (HM1) and incident on the object to be inspected.

[0067] The control unit (CTP) can control the first light source (LS1) and the second light source (LS2) so that the first light (L1) and the third light (L3) are emitted selectively. In one embodiment, the control unit (CTP) can control the first light source (LS1) and the second light source (LS2) so that they do not emit light simultaneously. Specifically, the control unit (CTP) can control the first light source (LS1) and the second light source (LS2) so that only one of them emits light, or so that neither the first light source (LS1) nor the second light source (LS2) emits light. In one embodiment, the inspection device (1000) includes the control unit (CTP) so that the second light source (LS2) can be used when inspecting the visible configuration of the object to be inspected (2000), and the first light source (LS1) can be used selectively when inspecting the invisible (i.e., transparent) configuration of the object to be inspected (2000).

[0068] FIG. 3 is a plan view showing an example of an inspection target (2000) that is inspected by the inspection device (1000) of FIG. 1. For example, the inspection target (2000) may be a semi-finished or finished product of a display device. Examples of the display device include an organic light-emitting display device, a liquid crystal display device, a plasma display device, a quantum dot display device, etc. Hereinafter, the inspection target (2000) is described in detail as an example of a semi-finished or finished product of an organic light-emitting display device, and the display device may refer to a semi-finished or finished product.

[0069] Referring to FIG. 3, the object to be inspected (2000) may be placed on the plane defined by the second direction (DR2) and the third direction (DR3).

[0070] The display device, which is the object to be inspected (2000), may include a display area (DA) and a non-display area (NDA). An image may be displayed in the display area (DA). The non-display area (NDA) may be located outside the display area (DA). For example, the non-display area (NDA) may have a shape that surrounds the display area (DA) in a plan view.

[0071] Multiple pixels may be arranged in the display area (DA). For example, the multiple pixels may be arranged in a matrix form along a second direction (DR2) and a third direction (DR3). For example, the second direction (DR2) may be perpendicular to the first direction (DR1), and the third direction (DR3) may be perpendicular to the second direction (DR2). Each of the multiple pixels may include a transistor and a light-emitting element. The light-emitting element may generate light.

[0072] Figure 4 is a cross-sectional view of Figure 3 cut along line II'.

[0073] Referring to FIGS. 3 and 4, the display device, which is the object to be inspected (2000), may include a substrate (100), a transistor (200), a gate insulating layer (111), an interlayer insulating layer (113), a first organic insulating layer (122), a second organic insulating layer (124), a light-emitting element (300), an encapsulation layer (400), a first dam (510), and a second dam (520). For example, the transistor (200) may include an active layer (210), a gate electrode (220), a source electrode (232), and a drain electrode (234). For example, the light-emitting element (300) may include a pixel electrode (310), a light-emitting layer (320), and a common electrode (330). For example, the encapsulation layer (400) may include a first inorganic encapsulation layer (410), an organic encapsulation layer (420), and a second inorganic encapsulation layer (430).

[0074] The substrate (100) may be a transparent insulating substrate. The substrate (100) may be a flexible substrate formed of plastic or the like. For example, the substrate (100) may include polyimide (PI). The substrate (100) may be a rigid substrate formed of quartz, synthetic quartz, calcium fluoride, fluorine-doped quartz, sodalime glass, non-alkali glass, etc.

[0075] The substrate (100) may have a display area (DA) and a non-display area (NDA). The non-display area (NDA) may include a first area (1A), a first dam area (DMA1), a second area (2A), a second dam area (DMA2), and a third area (3A). The first dam area (DMA1) is located outside the display area (DA) and may be spaced apart from the display area (DA). The second dam area (DMA2) is located outside the first dam area (DMA1) and may be spaced apart from the first dam area (DMA1). The first area (1A) may be located between the display area (DA) and the first dam area (DMA). The second area (2A) may be located between the first dam area (DMA1) and the second dam area (DMA2). The third area (3A) may be located outside the second dam area (DMA2).

[0076] In the example of FIG. 4, the outer side of the display area (DA) may mean the third direction (DR3). That is, the first dam area (DMA1) may be spaced apart from the display area (DA) in the third direction (DR3), and the second dam area (DMA2) may be spaced apart from the first dam area (DMA1) in the third direction (DR3).

[0077] The active layer (210) may be disposed on a display area (DA) on the substrate (100). For example, the active layer (210) may include a silicon semiconductor, an oxide semiconductor, etc. Examples of the silicon semiconductor include amorphous silicon, polycrystalline silicon, etc.

[0078] Although not illustrated in the drawing, a buffer layer may be disposed between the substrate (100) and the active layer (210). That is, the active layer (210) may be disposed on the indicated area (DA) on the buffer layer. The buffer layer can prevent impurities from the substrate (100) from diffusing into the active layer (210). The buffer layer may include an inorganic insulating material. An example of the inorganic insulating material is silicon oxide (SiO₂). x ), silicon nitride (SiN x ), titanium oxide (TiO x ), tantalum oxide (TaO x Examples include ) etc.

[0079] A gate insulating layer (111) may be disposed on a substrate (100). For example, the gate insulating layer (111) may be disposed entirely over a display area (DA) and a non-display area (NDA) on the substrate (100). The gate insulating layer (111) disposed over the display area (DA) may cover an active layer (210) on the substrate (100). For example, the gate insulating layer (111) may include an inorganic insulating material.

[0080] The gate electrode (220) may be placed in a display area (DA) on the gate insulating layer (111). The gate electrode (220) may be superimposed on the active layer (210). The gate electrode (220) may include a metal, a metal oxide, etc. Examples of the metal include silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), etc. These may be used alone or in combination with each other. However, the metal is not limited thereto. Examples of the metal oxide include indium tin oxide (ITO) and indium zinc oxide (IZO). These may be used alone or in combination with each other. However, the metal oxide is not limited thereto.

[0081] An interlayer insulating layer (113) may be disposed on a gate insulating layer (111). For example, the interlayer insulating layer (113) may be disposed entirely over a display area (DA) and a non-display area (PA) on the gate insulating layer (111). The interlayer insulating layer (113) disposed over the display area (DA) may cover a gate electrode (220) on the gate insulating layer (111). For example, the interlayer insulating layer (113) may include an inorganic insulating material.

[0082] The above buffer layer, gate insulating layer (111) and interlayer insulating layer (113) may be referred to as an inorganic insulating layer (110). The inorganic insulating layer (110) may be disposed entirely in the display area (DA) and non-display area (NDA) between the substrate (100) and the first organic insulating layer (122).

[0083] The source electrode (232) and the drain electrode (234) may be placed in a display area (DA) on the interlayer insulating layer (113). The source electrode (232) and the drain electrode (234) may each be connected to the active layer (210). The source electrode (232) and the drain electrode (234) may include a metal, a metal oxide, a metal nitride, a transparent conductive material, etc. The active layer (210), the gate electrode (220), the source electrode (232), and the drain electrode (234) may form a transistor (200). That is, the transistor (200) may be placed in a display area (DA) on the substrate (100).

[0084] The first organic insulating layer (122) is disposed in a display area (DA) on the interlayer insulating layer (113) and can cover the transistor (200). For example, the first organic insulating layer (122) may be a planarization layer. The first organic insulating layer (122) may cover the source electrode (232) and the drain electrode (234) on the interlayer insulating layer (113). The first organic insulating layer (122) may have a substantially flat upper surface without creating a step around the source electrode (232) and the drain electrode (234). The first organic insulating layer (122) may include an organic insulating material. Examples of the organic insulating material include photoresist, polyacrylic resin, polyimide resin, polyamide resin, silosan resin, acrylic resin, epoxy resin, etc. These may be used alone or in combination with each other. However, the organic insulating material is not limited thereto.

[0085] The pixel electrode (310) may be placed in a display area (DA) on the first organic insulating layer (122). The pixel electrode (310) may be connected to a source electrode (232) or a drain electrode (234). That is, the pixel electrode (310) may be placed on a transistor (200) and electrically connected to the transistor (200). The pixel electrode (310) may include a metal, a conductive metal nitride, a transparent conductive material, etc.

[0086] The second organic insulating layer (124) may be disposed in a display area (DA) on the first organic insulating layer (122). For example, the second organic insulating layer (124) may be a pixel defining film. The second organic insulating layer (124) may partially cover the pixel electrode (310) on the first organic insulating layer (122). The second organic insulating layer (124) may have a pixel opening that exposes at least a portion of the pixel electrode (310). The second organic insulating layer (124) may include an organic insulating material.

[0087] The first organic insulating layer (122) and the second organic insulating layer (124) may be referred to as the organic insulating layer (120).

[0088] The light-emitting layer (320) may be disposed on the pixel electrode (310) exposed by the pixel opening. That is, the light-emitting layer (320) may be disposed within the pixel opening. The light-emitting layer (320) may be disposed between the pixel electrode (310) and the common electrode (330). The light-emitting layer (320) may include at least one of an organic light-emitting material and quantum dots.

[0089] In one embodiment, the organic light-emitting material may include a low-molecular-weight organic compound or a high-molecular-weight organic compound. Examples of the low-molecular-weight organic compound include copper phthalocyanine, N,N'-diphenylbenzidine, and tris-(8-hydroxyquinoline)aluminum. Examples of the high-molecular-weight organic compound include poly(3,4-ethylenedioxythiophene), polyaniline, polyphenylenevinylene, and polyfluorene.

[0090] The common electrode (330) is disposed on the light-emitting layer (320) and may overlap with the pixel electrode (310). In one example, the common electrode (330) may be disposed entirely on the second organic insulating layer (124). In another example, the common electrode (330) may be disposed entirely over the display area (DA) and the non-display area (NDA). Alternatively, the common electrode (330) may be disposed only in the display area (DA). The common electrode (330) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0091] The pixel electrode (310), the light-emitting layer (320), and the common electrode (330) can form a light-emitting element (300). The light-emitting element (300) can be disposed on the first organic insulating layer (122).

[0092] A spacer (130) may be placed in the display area (DA) on the second organic insulating layer (124). The spacer (130) can maintain a separation distance between the mask (not shown) and the substrate (100) when forming the light-emitting layer (320). Thus, the spacer (130) can prevent defects in which the light-emitting layer (320) is imprinted or torn by the mask.

[0093] The spacer (140) may be formed of the same material as the second organic insulating layer (124). The second organic insulating layer (124) and the spacer (130) may be formed substantially simultaneously to have different heights.

[0094] The first dam (510) and the second dam (520) may be placed in a non-display area (NDA) on the substrate (100). The first dam (510) and the second dam (520) can prevent the organic material from overflowing (hereinafter overflow) toward the edge direction of the substrate (100) (e.g., the third direction (DR3) in FIG. 4) when forming an organic encapsulation layer (420) using an organic material such as a monomer.

[0095] For example, the first dam (510) may be placed in the first dam region (DMA1) on the interlayer insulation layer (113). That is, the first dam (510) may be spaced apart from the organic insulation layer (120) in the third direction (DR3).

[0096] For example, the second dam (520) may be placed in the second dam area (DMA2) on the interlayer insulation layer (113). That is, the second dam (520) is located outside the first dam (510) and may be spaced apart from the first dam (510) in a third direction (DR3).

[0097] Each of the first dam (510) and the second dam (520) may have a multilayer structure in which a plurality of layers are stacked. For example, the first dam (510) and the second dam (520) may each include a first layer (511, 521), a second layer (512, 522), and a third layer (513, 523). For example, the first layers (511, 521) may be formed substantially simultaneously with the first organic insulating layer (122). The second layers (512, 522) may be formed substantially simultaneously with the second organic insulating layer (124). The third layers (513, 523) may be formed substantially simultaneously with the spacer (130). However, this is exemplary and the present invention is not limited thereto.

[0098] A first opening (OP1) may be formed between the organic insulating layer (120) and the first dam (510). That is, the first opening (OP1) may be defined as a space separated from the organic insulating layer (120) by the first dam (510). The first opening (OP1) may overlap with the first region (1A).

[0099] A second opening (OP1) may be formed between the first dam (510) and the second dam (520). That is, the second opening (OP2) may be defined as a space separated from the first dam (510) by the second dam (520). The second opening (OP2) may overlap with the second area (2A).

[0100] The encapsulation layer (400) can be placed on the common electrode (330). The encapsulation layer (400) can cover the light-emitting element (300). The encapsulation layer (400) can encapsulate the display area (DA) to protect the light-emitting element (300) from external impurities.

[0101] The bag layer (400) may include at least one inorganic bag layer and at least one organic bag layer. For example, the bag layer (400) may include a first inorganic bag layer (410), an organic bag layer (420), and a second inorganic bag layer (430).

[0102] The first inorganic encapsulation layer (410) may be disposed on the common electrode (330). For example, the first inorganic encapsulation layer (410) may have a substantially uniform thickness along the profile of the common electrode (330).

[0103] The first inorganic encapsulation layer (410) and the second inorganic encapsulation layer (430) can be placed entirely over the display area (DA) and non-display area (NDA) on the substrate (100). That is, the first inorganic encapsulation layer (410) and the second inorganic encapsulation layer (430) cover the display area (DA) and can extend outward from the first dam (510).

[0104] The organic encapsulation layer (420) is disposed on the first inorganic encapsulation layer (410) and can cover the display area (DA). The organic encapsulation layer (420) can have a substantially flat upper surface without creating a step around the first inorganic encapsulation layer (410).

[0105] In exemplary embodiments, the organic encapsulation layer (420) may be formed by an inkjet process using an organic material such as a transparent monomer. In this case, if the amount of the organic material is large or the discharge location of the organic material is offset toward the outside of the substrate (100) (e.g., third direction (DR3)), an overflow phenomenon may occur in which the organic material overflows to the outside of the first dam (510). Therefore, it is necessary to check whether the overflow phenomenon has occurred. If the overflow phenomenon has not occurred, the organic encapsulation layer (420) may be located inside the first dam (510). For example, the edge (421a) of the organic encapsulation layer (420) may be located on the first dam (510). Alternatively, the edge (421b) of the organic encapsulation layer (420) may be located in the first region (1A).

[0106] In the event that the above overflow phenomenon occurs, the organic encapsulation layer (420) may be located on the outside of the first dam (510) and on the inside of the second dam (520). That is, although not shown in the drawing, the edge of the organic encapsulation layer (420) may be located in the second region (2A). Alternatively, the edge of the organic encapsulation layer (420) may be located on the outside of the second dam (520). That is, although not shown in the drawing, the edge of the organic encapsulation layer (420) may be located in the third region (3A).

[0107] Whether the overflow phenomenon has occurred can be inspected based on the clarity of the edge of the first dam (510). For example, if the edge of the organic encapsulation layer (420) is located inside the first dam (510), the edge of the first dam (510) may have relatively high clarity. That is, if the overflow phenomenon has not occurred, the edge of the first dam (510) may have relatively high clarity. Conversely, if the edge of the organic encapsulation layer (420) is located outside the first dam (510) (i.e., if the organic encapsulation layer (420) covers the first dam (510), the edge of the first dam (510) may have relatively low clarity. That is, if the overflow phenomenon has occurred, the edge of the first dam (510) may have relatively low clarity.

[0108] As a result, it is possible to check whether the overflow phenomenon has occurred based on the clarity of the edge of the first dam (510). That is, during the inkjet process of forming an organic encapsulation layer (420) containing an organic material such as a transparent monomer, when the edge of the first dam (510) has relatively low clarity, the discharge of the organic material can be stopped. Thus, the overflow phenomenon can be reduced.

[0109] That is, the inspection device (1000) can inspect whether the overflow phenomenon has occurred based on the clarity of the edge of the first dam (510) using a second light source (LS2) that emits a third light (L3) which is white light. Additionally, the inspection device (1000) can inspect whether other components have been manufactured as targeted using a second light source (LS2) that emits a third light (L3) which is white light. For example, it can inspect whether the inorganic insulating layer (110) is placed entirely over the display area (DA) and non-display area (NDA), or whether the second organic insulating layer (124) partially covers the pixel electrode (310).

[0110] However, since the organic encapsulation layer (420) contains the transparent monomer, the determination of whether the overflow phenomenon occurs based on clarity may vary depending on the individual's skill level. That is, distinguishing between relatively low clarity and relatively high clarity may vary depending on the individual's skill level. In addition, there is a problem in that it is difficult to precisely determine the position of the edge of the organic encapsulation layer (420).

[0111] FIGS. 5 to 9 are drawings showing the results of inspecting a part of the object to be inspected (2000) of FIG. 4 with the inspection device (1000) of FIG. 1. For example, FIGS. 5 to 9 are drawings showing the results of inspecting a part of the first dam area (DMA1), the first area (1A), and the display area (DA) of FIG. 4. Specifically, FIGS. 5 to 9 are drawings captured by a camera (CM) when the edge (421b) of the organic encapsulation layer (420) is located in the first area (1A) in the example of FIG. 4.

[0112] FIGS. 5 to 9 all show images taken by a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) by a first light-emitting unit (EMP1). FIGS. 5 to 9 also show images taken by a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a different bandwidth, using band-pass filters (BPF) having different bandwidths. Specifically, the first experimental result (RUN1) of FIG. 5 is an image taken by a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a wavelength band of approximately 630 nm to approximately 750 nm (i.e., a bandwidth of approximately 120 nm). The second experimental result (RUN2) of FIG. 6 is an image taken with a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a wavelength band of approximately 640 nm to approximately 740 nm (i.e., a bandwidth of approximately 100 nm). The third experimental result (RUN3) of FIG. 7 is an image taken with a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a wavelength band of approximately 490 nm to approximately 570 nm (i.e., a bandwidth of approximately 80 nm). The fourth experimental result (RUN4) of FIG. 8 is an image taken with a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a wavelength band of approximately 450 nm to approximately 490 nm (i.e., a bandwidth of approximately 40 nm). The fifth experimental result (RUN5) of FIG. 9 is an image taken with a camera (CM) of an object to be inspected (2000) irradiated with a second light (L2) having a wavelength band of approximately 570 nm to approximately 580 nm (i.e., a bandwidth of approximately 10 nm).

[0113] That is, the first experiment involved irradiating with red light having a bandwidth of approximately 120 nm, the second experiment involved irradiating with red light having a bandwidth of approximately 100 nm, the third experiment involved irradiating with green light having a bandwidth of approximately 80 nm, the fourth experiment involved irradiating with blue light having a bandwidth of approximately 40 nm, and the fifth experiment involved irradiating with yellow light having a bandwidth of approximately 10 nm. Referring to FIGS. 5 and 6, it can be seen that even when the same red light is irradiated, the visibility of the interference fringes (IF1, IF2) increases as the bandwidth of the second light (L2) irradiated on the organic encapsulation layer (420) becomes narrower.

[0114] The first to fifth experimental results (RUN1, RUN2, RUN3, RUN4, RUN5) each include interference fringes (IF1, IF2, IF3, IF4, IF5). The interference fringes may be generated by the phenomenon of light interference. More specifically, when light having a relatively narrow bandwidth (e.g., a bandwidth of approximately 120 nm or less) is irradiated onto an organic encapsulation layer (420) containing a transparent monomer, the interference fringes may appear on the organic encapsulation layer (420).

[0115] It can be observed that as the bandwidth of the second light (L2) irradiated onto the organic encapsulation layer (420) narrows, the visibility of the interference pattern (IF1, IF2, IF3, IF4, IF5) increases. In one embodiment, the position of the edge (421b) of the organic encapsulation layer (420) can be determined based on the interference pattern. Therefore, as the bandwidth of the second light (L2) irradiated onto the organic encapsulation layer (420) narrows, the position of the edge (421b) of the organic encapsulation layer (420) can be easily determined.

[0116] Each of the first to fifth experimental results (RUN1, RUN2, RUN3, RUN4, RUN5) indicates that the overflow phenomenon did not occur based on the high clarity of the edge (510a) of the first dam (510). However, depending on the individual's skill level, the clarity of the edge (510a) of the first dam (510) may be judged to be relatively low.

[0117] The first interference fringe (IF1) of the first experimental result (RUN1), the second interference fringe (IF2) of the second experimental result (RUN2), the third interference fringe (IF3) of the third experimental result (RUN3), the fourth interference fringe (IF4) of the fourth experimental result (RUN4), and the fifth interference fringe (IF5) of the fifth experimental result (RUN5) appear sequentially more clearly. Based on this, the edge (421b) of the organic encapsulation layer (420) can be determined to be located in the first region (1A). This means that the overflow phenomenon has not occurred. That is, as the bandwidth of the second light (L2) narrows, the deviation in which the position of the object to be inspected (2000) is determined differently depending on the individual's proficiency can be reduced. In other words, the reliability of the inspection device (1000) can be improved.

[0118] Additionally, as the bandwidth of the second light (L2) narrows, the position of the edge (421b) of the organic encapsulation layer (420) is determined more precisely, so the first dam (510) and the second dam (520) included in the display device, which is an example of an object to be inspected (2000), can be omitted. In other words, since the position of the edge (421b) of the organic encapsulation layer (420) is determined more precisely, the overflow phenomenon can be reduced even if the display device does not include the first dam (510) and the second dam (520). Accordingly, the dead space of the display device caused by the first dam (510) and the second dam (520) can be reduced.

[0119] FIG. 10 is a drawing showing the results of a comparison of another example of an inspection object (2000) that is inspected by the inspection device (1000) of FIG. 1.

[0120] The first image (IM1) is an image of an object to be inspected (2000) irradiated with a second light (L2) by a first light-emitting unit (EMP1) and is an image of an object to be inspected (2000) irradiated with a third light (L3) by a second light-emitting unit (EMP2) and is an image of an object to be inspected (2000) irradiated with a camera (CM). Specifically, the first image (IM1) is an image of an object to be inspected (2000) irradiated with a second light (L2) having a bandwidth of approximately 10 nm and is an image of an object to be inspected (2000) irradiated with a third light (L3) having a bandwidth of approximately 370 nm and is an image of an object to be inspected (2000) irradiated with a camera (CM).

[0121] The first image (IM1) includes an interference pattern (IF). Therefore, the first image (IM1) can be used to determine the location of a transparent material contained in the object to be inspected (2000). The second image (IM2) can be used to determine the arrangement relationship of visible components. Accordingly, the reliability of the inspection device (1000) can be improved by adjusting the bandwidth of the light irradiated onto the object to be inspected (2000) as needed.

[0122] FIG. 11 is a drawing showing an inspection device (1100) according to another embodiment of the present invention. Since the inspection device (1100) shown in FIG. 11 is identical to the inspection device (1000) shown in FIG. 1 except for the half mirror part (HM), the same reference numerals are used for identical components and redundant descriptions are omitted.

[0123] Referring to FIG. 11, the half mirror portion (HM) may include a first half mirror (HM1), a second half mirror (HM2), a third half mirror (HM3), and a rotating member (RM).

[0124] In one embodiment, the first half mirror (HM1) may be placed within the camera barrel (CBT). The first half mirror (HM1) may be placed on the lens (LN). The first half mirror (HM1) may have a reflective surface (RS) that reflects incident light toward the lens (LN).

[0125] In one embodiment, a second half mirror (HM2) may be disposed within a first light source tube (BT1). The second half mirror (HM2) may reflect the second light (L2) toward the first half mirror (HM1). For example, the second light (L2) incident on the first half mirror (HM1) in a first direction (DR1) may be reflected in a second direction (DR2).

[0126] In one embodiment, the third half mirror (HM3) may be placed within the second light source tube (BT2). The third half mirror (HM3) may reflect the third light (L3) toward the first half mirror (HM1).

[0127] In one embodiment, the rotating member (RM) can rotate the first half mirror (HM1). That is, by the rotating member (RM) rotating the first half mirror (HM1), the reflective surface (RS1) may face the second half mirror (HM2) or the reflective surface (RS2) may face the third half mirror (HM3). Specifically, when the first light (L1) is emitted, the reflective surface (RS1) may face the second half mirror (HM2), and when the third light (L3) is emitted, the reflective surface (RS2) may face the third half mirror (HM3). Accordingly, by rotating the first half mirror (HM1), the rotating member (RM) can select the light irradiated on the inspection object (2000) among the second light (L2) and the third light (L3).

[0128] FIGS. 12a to 12d are cross-sectional views illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0129] Referring to FIG. 12a, an active layer (210) can be formed on a display area (DA) on a substrate (100). For example, the active layer (210) can be formed using amorphous silicon, polycrystalline silicon, oxide semiconductor, etc.

[0130] A gate insulating layer (111) can be formed on the substrate (100) and the active layer (210). For example, the gate insulating layer (111) can be formed entirely over the display area (DA) and non-display area (NDA) on the substrate (110). For example, the gate insulating layer (111) can be formed using an inorganic insulating material.

[0131] The gate insulating layer (111) formed in the display area (DA) can cover the active layer (210) on the substrate (100).

[0132] A gate electrode (220) can be formed in a display area (DA) on the gate insulating layer (111). For example, the gate electrode (220) can be formed using a metal, a metal oxide, etc.

[0133] An interlayer insulating layer (113) can be formed on the gate insulating layer (111) and the gate electrode (220). For example, the interlayer insulating layer (113) can be formed entirely over the display area (DA) and non-display area (NDA) on the gate insulating layer (111). For example, the interlayer insulating layer (113) can be formed using an inorganic insulating material.

[0134] The interlayer insulating layer (113) formed in the display area (DA) can cover the gate electrode (220) on the gate insulating layer (111). For example, the interlayer insulating layer (113) can have a substantially uniform thickness along the profile of the gate insulating layer (111) and the gate electrode (220).

[0135] Contact holes can be formed in the gate insulating layer (111) and the interlayer insulating layer (113) so as to overlap with the active layer (210). Additionally, a source electrode (232) and a drain electrode (234) can be formed on the interlayer insulating layer (113) so as to overlap with each of the contact holes. The source electrode (232) and the drain electrode (234) can be connected to the active layer (210) through each of the contact holes. Accordingly, a transistor (200) including the active layer (210), the gate electrode (220), the source electrode (232), and the drain electrode (234) can be formed in the display area (DA) on the substrate (100).

[0136] A first organic insulating layer (122) covering a transistor (200) can be formed in a display area (DA) on a substrate (100). The first organic insulating layer (122) can cover an interlayer insulating layer (113), a source electrode (232), and a drain electrode (234). The first organic insulating layer (122) can be formed using an organic insulating material.

[0137] A contact hole may be formed in the first organic insulating layer (122). The contact hole may expose at least a portion of the upper surface of the drain electrode (234). A pixel electrode (310) may be formed in the display area (DA) on the first organic insulating layer (122). The pixel electrode (310) may be electrically connected to the drain electrode (234) through the contact hole. For example, the pixel electrode (310) may be formed using a metal, a conductive metal nitride, a transparent conductive material, etc.

[0138] A second organic insulating layer (124) may be formed in a display area (DA) on the first organic insulating layer (122). The second organic insulating layer (124) may partially cover the pixel electrode (310) on the first organic insulating layer (122). A pixel opening may be formed in the second organic insulating layer (124) to expose at least a portion of the pixel electrode (310). The second organic insulating layer (124) may be formed using an organic insulating material.

[0139] A spacer (130) can be formed in the display area (DA) on the second organic insulating layer (124). For example, the spacer (130) can be formed substantially simultaneously with the second organic insulating layer (124) using a halftone mask. In this case, the spacer (130) may contain the same material as the second organic insulating layer (124).

[0140] A first dam (510) and a second dam (520) may be formed in a non-display area (NDA) on the substrate (100). The first dam (510) may be formed in a first dam area (DMA1). The space from which the first dam (510) is spaced apart from the organic insulating layer (120) may be defined as a first opening (OP1).

[0141] The second dam (520) may be formed in the second dam area (DMA2). The space between the first dam (510) and the second dam (520) may be defined as the second opening (OP2).

[0142] The first dam (510) and the second dam (520) can be formed substantially simultaneously with at least one of the first organic insulating layer (122), the second organic insulating layer (124), and the spacer (130).

[0143] For example, the first dam (510) and the second dam (520) may each include a first layer (511, 521), a second layer (512, 522), and a third layer (513, 523). For example, the first layers (511, 521) may be formed substantially simultaneously with the first organic insulating layer (122). The second layers (512, 522) may be formed substantially simultaneously with the second organic insulating layer (124). The third layers (513, 523) may be formed substantially simultaneously with the spacer (130).

[0144] A light-emitting layer (320) can be formed on a display area (DA) on a pixel electrode (310). For example, the light-emitting layer (320) can be formed on the pixel electrode (310) exposed by the pixel opening of the second organic insulating layer (124). The light-emitting layer (320) can be formed using at least one of an organic light-emitting material and quantum dots.

[0145] A common electrode (330) can be formed in a display area (DA) on the light-emitting layer (320). For example, the common electrode (330) can be formed entirely on the second organic insulating layer (124). In exemplary embodiments, the common electrode (330) may be formed across the entire display area (DA) and non-display area (NDA). Alternatively, the common electrode (330) may be formed only in the display area (DA).

[0146] For example, the common electrode (330) can be formed using a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. Accordingly, a light-emitting element (300) including a pixel electrode (310), a light-emitting layer (320), and a common electrode (330) can be formed in a display area (DA) on a substrate (100) and an organic insulating layer (120).

[0147] Referring to FIG. 12b, a first inorganic encapsulation layer (410) can be formed on an interlayer insulating layer (113) and a common electrode (330). The first inorganic encapsulation layer (410) can cover a light-emitting element (300) on an organic insulating layer (120). For example, the first inorganic encapsulation layer (410) can be formed entirely over a display area (DA) and a non-display area (NDA) on a substrate (100) and an organic insulating layer (120). The first inorganic encapsulation layer (410) can be formed using an inorganic insulating material.

[0148] The first inorganic encapsulation layer (410) formed in the display area (DA) can cover the common electrode (330). The first inorganic encapsulation layer (410) formed in the non-display area (NDA) can cover the first dam (510) and the second dam (520). For example, the first inorganic encapsulation layer (410) may have a substantially uniform thickness along the profiles of the common electrode (330), the interlayer insulating layer (113), the first dam (510), and the second dam (520).

[0149] An organic encapsulation layer (420) covering a display area (DA) can be formed on the first inorganic encapsulation layer (410). For example, the organic encapsulation layer (420) can be formed using an organic material such as a transparent monomer.

[0150] In one embodiment, the organic encapsulation layer (420) may be formed by an inkjet process that ejects an ink or solution containing the organic material onto the substrate (100). In this case, a portion of the organic encapsulation layer (420) covering the display area (DA) may extend to a non-display area (NDA) located outside the display area (DA). That is, the edge of the organic encapsulation layer (420) may be located in the non-display area (NDA). Below, an example is described in which the edge (421b) of the organic encapsulation layer (420) is located in the first area (1A), as illustrated.

[0151] Referring to FIG. 1 and FIG. 12c, an organic encapsulation layer (420) can be inspected using an inspection device (1000). Specifically, among the first light (L1) having a first wavelength band emitted by the first light source (LS1) of the inspection device (1000), a second light (L2) having a second wavelength band with a relatively narrow bandwidth can be selectively transmitted and irradiated onto the organic encapsulation layer (420). The organic encapsulation layer (420) irradiated with the second light (L2) can be photographed by a camera (CM). That is, the photographing unit (PTP) can acquire an image of the organic encapsulation layer (420) and inspect the edge (421b) of the organic encapsulation layer (420).

[0152] By irradiating a second light (L2) with a relatively narrow bandwidth, an interference pattern (IF) can be formed on the organic encapsulation layer (420) containing the transparent monomer. Accordingly, by determining the location of the interference pattern (IF) formed on the organic encapsulation layer (420), the location of the organic encapsulation layer (420) containing the transparent monomer can be inspected. For example, the edge (421b) of the organic encapsulation layer (420) can be determined to be located inside the first dam (510). That is, it can be determined that the overflow phenomenon has not occurred.

[0153] Referring to FIG. 12d, a second inorganic encapsulation layer (430) can be formed on an organic encapsulation layer (420). Specifically, the second inorganic encapsulation layer (430) can be formed on the organic encapsulation layer (420) after determining that the overflow phenomenon has not occurred. For example, the second inorganic encapsulation layer (430) can be formed entirely over the display area (DA) and non-display area (NDA) on the substrate (100). The second inorganic encapsulation layer (430) can be formed using an inorganic insulating material.

[0154] According to a method for manufacturing a display device according to one embodiment of the present invention, the position of the edge (421b) of the organic encapsulation layer (420) can be precisely determined using an inspection device (1000). That is, the method for manufacturing the display device can precisely inspect whether the organic encapsulation layer (420) is preferably formed. Therefore, the reliability of the display device can be improved. In addition, the position of the organic encapsulation layer (420) can be determined even if the first dam (510) of the display device is omitted. Therefore, the dead space of the display device can be reduced. Industrial applicability

[0155] The present invention may be applied to a display device and an inspection device for an electronic device including the same. For example, the present invention may be applied to an inspection device for a high-resolution smartphone, mobile phone, smartpad, smart watch, tablet PC, vehicle navigation system, television, computer monitor, laptop, etc.

[0156] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0157] L1, L2, L3: 1st to 3rd light 1000: Inspection device 2000: Objects under inspection IM1, IM2: First and second images IF: Interference fringe LS1, LS2: First and second light sources BPF: Band-pass filter EMP1, EMP2: First and second light-emitting units HMP: Half mirror section CTP: Control section HM1, HM2, HM3, HM4: 1st to 4th half mirrors PTP: Imaging unit CBT: Camera barrel CM: Camera LN: Lens BT1, BT2: 1st and 2nd light source tubes RS: Reflective surface RM: Rotating member 100: Substrate 300: Light-emitting element 420: Organic encapsulation layer 410, 430: 1st and 2nd inorganic encapsulation layers

Claims

Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 A first light-emitting unit comprising a first light source emitting a first light having a first wavelength band and a band-pass filter that selectively transmits a second light having a second wavelength band in which the bandwidth, which is the difference between the maximum and minimum wavelengths of the first light, is 120 nm or less; a second light-emitting unit comprising a second light source emitting a third light having the first wavelength band; a half-mirror unit that incidents the second light and the third light on an object to be inspected; and a shooting unit that acquires a first image of the object to be inspected upon which the second light is incident, wherein the shooting unit comprises: a camera barrel having a shape extended in a first direction; and a camera disposed at a first end of the camera barrel and photographing the object to be inspected. An inspection device comprising a lens disposed at a second end opposite to the first end of the camera barrel, wherein the first light-emitting part further comprises a first light source barrel adjacent to the camera barrel in a second direction intersecting the first direction, providing a space for emitting the first light, and accommodating the band-pass filter, and the second light-emitting part further comprises a second light source barrel adjacent to the camera barrel in the second direction, providing a space for emitting the second light. Claim 8 An inspection device according to claim 7, characterized in that the bandwidth of the second wavelength band is 10 nm or less. Claim 9 An inspection device according to claim 8, characterized in that the first light is white light and the second light is yellow light. Claim 10 An inspection device according to claim 9, characterized in that the second wavelength band is 570 nm to 580 nm. Claim 11 In claim 7, the inspection device is characterized in that the first image includes an interference pattern formed on the object to be inspected. Claim 12 delete Claim 13 In claim 7, the inspection device further comprises a control unit that controls the first light source and the second light source so that the first light and the third light are emitted alternately. Claim 14 In claim 7, the inspection device is characterized in that the imaging unit acquires a second image of the inspection target upon which the third light is incident. Claim 15 delete Claim 16 In claim 7, the inspection device is characterized in that the half mirror part comprises a first half mirror having a reflective surface disposed within the camera barrel and disposed on the lens to reflect incident light toward the lens. Claim 17 In claim 16, the inspection device further comprises: a second half mirror disposed within the first light source tube; a third half mirror disposed within the second light source tube; and a fourth half mirror disposed between the second light source and the third half mirror, which directs light reflected from the second half mirror to the third half mirror. Claim 18 In claim 16, the inspection device further comprises: a second half mirror disposed within the first light source tube and reflecting the second light to the first half mirror; and a third half mirror disposed within the second light source tube and reflecting the third light to the first half mirror. Claim 19 In claim 18, the inspection device further comprises a rotating member that rotates the first half mirror such that when the first light is emitted, the reflective surface faces the second half mirror, and when the third light is emitted, the reflective surface faces the third half mirror. Claim 20 delete

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