Digital Electronic Card Inspection System and Method Thereof

Abstract

The present invention relates to a digital electronic card inspection system for diagnosing the soundness of a digital electronic card for power plant equipment control, wherein the digital electronic card comprises an electronic circuit board and a component mounted on the electronic circuit board; a test module in which the digital electronic card to be diagnosed is mounted and which tests the loop operation state of the digital electronic card by inputting and outputting a virtual operation signal; an inspection module that measures characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data according to whether power is applied and the operation state of the digital electronic card; a determination module that determines whether the digital electronic card is abnormal by analyzing the test results of the test module and the measurement data of the inspection module; and a design verification module that determines whether the cause of the abnormality is a defect in the component itself or a design error in the electronic circuit board based on the determination results of the determination module.

Description

Technology Field

[0001] The present invention relates to a digital electronic card inspection system and method. Background Technology

[0002] Generally, large-scale plant facilities such as power plants have numerous sensors and control devices intricately connected, and multiple electronic cards are used to control them.

[0003] For the stable operation of the facilities, it is essential to periodically inspect the soundness of these electronic cards and prevent failures in advance.

[0004] Conventional electronic card inspection systems were limited to testing a single module (electronic card) and primarily checked only the normality of analog input / output functions.

[0005] In other words, since the electronic card was installed in the tester and a simulated signal was applied to check only whether the output value was within the normal range, there were limitations in precisely diagnosing the deterioration state of the internal components of the electronic card, minute heat generation, or internal bonding defects that could not be detected with the naked eye.

[0006] In addition, conventional technology only takes measures to replace the component when a failure is detected, and fails to determine whether the failure is due to the lifespan of the component itself or a structural problem caused by the pattern of the electronic circuit board or a design error in the component. As a result, there was a problem in that the fundamental cause of the repeated occurrence of the same failure could not be resolved. Prior art literature

[0007] Korean Patent Registration No. 10-0777041 (Registered November 09, 2007) The problem to be solved

[0008] The objective of the present invention is to provide a digital electronic card inspection system and method. means of solving the problem

[0009] The present invention relates to a digital electronic card inspection system for diagnosing the soundness of a digital electronic card for power plant equipment control, wherein the digital electronic card comprises an electronic circuit board and a component mounted on the electronic circuit board; a test module in which the digital electronic card to be diagnosed is mounted and which tests the loop operation state of the digital electronic card by inputting and outputting a virtual operation signal; an inspection module that measures characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data according to whether power is applied and the operation state of the digital electronic card; a determination module that determines whether the digital electronic card is abnormal by analyzing the test results of the test module and the measurement data of the inspection module; and a design verification module that determines whether the cause of the abnormality is a defect in the component itself or a design error in the electronic circuit board based on the determination results of the determination module.

[0010] The above test module includes an input unit, a signal processing unit, a communication unit, and an output unit for simulating a power plant site cabinet environment, wherein the input unit receives an analog signal regarding the operating status of the power plant equipment and converts it into a digital signal, the signal processing unit processes the signal transmitted from the input unit into a control signal, the communication unit transmits the control signal externally, and the output unit can convert the control signal into an analog signal for controlling the power plant equipment and output it.

[0011] The above inspection module may include: a component characteristic inspection unit for inspecting electrical characteristics between component pins of the digital electronic card; a thermal inspection unit for inspecting surface heat distribution of the digital electronic card; a micro-thermal inspection unit for inspecting micro-heating in localized areas of the digital electronic card; and a transparency inspection unit for inspecting the internal structure of components of the digital electronic card.

[0012] The component characteristic inspection unit measures the impedance characteristics between component pins while the power of the digital electronic card is cut off to derive 3-axis data of voltage, current, and frequency or inductance, capacitance, and resistance data; the thermal inspection unit detects the surface thermal gradient of the digital electronic card while power is applied and operating to acquire isotherm coordinate data of the semiconductor chip surface and confirms temperature deviations by comparing this with normal data; the micro-thermal inspection unit uses an InSb (Indium Antimonide) sensor to detect micro-heating caused by gate defects, oxide cracks, metal melt, or metal particles inside the semiconductor chip in the abnormal heat distribution area identified by the thermal inspection unit, and measures the heat coordinates and heat area; and the transparency inspection unit transmits through the component interior or junction at the heat location measured by the micro-thermal inspection unit to determine an abnormal connection state including at least one of a circuit board pattern defect, a bonding defect of the solder ball under the chip, chip molding peeling, an open or short circuit of a connection part, and the ingress of foreign matter. It is possible.

[0013] The above determination module can use at least one of the 2D or 3D coordinate distribution shape of the impedance measurement value obtained from the inspection module, the isotherm coordinates of the semiconductor surface, the coordinates and area of ​​the micro-heating part, and the captured shape data of the device connection part as input data for AI (artificial intelligence), compare and analyze the deviation between normal part data, generate a soundness determination result, and transmit it to the above design verification module.

[0014] The design verification module inputs abnormal component information received from the judgment module into a software model containing location and rating information of the printed circuit board of the digital electronic card and the mounted component to verify the presence or absence of design defects. The verification is performed using at least one of impedance change at a specific frequency, variability of rated current and voltage, loss of output signal relative to input, or temperature change of the component environment as an analysis variable. If the cause of the abnormality is confirmed to be a pattern design defect of the electronic circuit board as a result of the verification, the corresponding defect information can be fed back to the judgment module for display.

[0015] The present invention relates to a method for diagnosing the soundness and verifying the design of a digital electronic card, comprising: (a) a step of applying a simulated signal to a digital electronic card to be diagnosed and verifying the operating state in loop units; (b) a step of selectively setting an inspection path for a component of the digital electronic card according to the result of the verification in step (a) and whether power is applied, thereby obtaining characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data; (c) a step of selecting abnormal components by comparing and analyzing the operating state and the characteristic data with previously stored normal data; and (d) a step of verifying the design data of an electronic circuit board using the selected abnormal component information and determining whether there is a design defect.

[0016] The above step (a) may include: an input step for receiving an analog signal regarding the operating status of a power plant facility and converting it into a digital signal; a signal processing step for processing the converted signal into a control signal; a communication step for transmitting the control signal to the outside; and an output step for performing a loop operation simulating a power plant site cabinet environment by converting the control signal back into an analog signal and outputting it.

[0017] Step (b) above may first perform a first inspection to measure the impedance characteristics between component pins while the power is off if the loop operation state is abnormal as a result of the verification in Step (a), and if the result of the first inspection is abnormal, perform the design verification in Step (d); if the loop operation state is normal as a result of the verification in Step (a) or after the first inspection is completed, perform a second inspection to detect the overall thermal gradient of the component surface while the power is applied, and if the result of the second inspection is abnormal, perform the design verification in Step (d); perform a third inspection to precisely measure the fine heat spectrum using an InSb sensor for the abnormal heat distribution area identified as a result of the second inspection, and if the result of the third inspection is abnormal, perform the design verification in Step (d); and perform a fourth inspection to determine the abnormal connection state by viewing the internal structure of the location identified as a result of the third inspection.

[0018] The above step (d) may include determining whether the cause of the abnormality identified in the above step (c) is due to a pattern of the electronic circuit board or a component design error rather than a defect in the component itself, and if it is determined to be a design error, generating feedback data to derive an improvement plan and displaying it to the user or providing it as analysis data for the above step (c). Effects of the invention

[0019] According to the present invention, a digital electronic card inspection system and method are provided. Brief explanation of the drawing

[0020] FIG. 1 is a block diagram showing a system for diagnosing the soundness of a digital electronic card according to an embodiment of the present invention, and FIG. 2 is a flowchart illustrating a method for diagnosing the soundness and verifying the design of a digital electronic card according to an embodiment of the present invention, and FIG. 3 is a flowchart illustrating the characteristic data acquisition step of the soundness diagnosis and design verification method of a digital electronic card according to an embodiment of the present invention, and FIG. 4 is a flowchart illustrating when a test loop operates normally in a method for diagnosing the soundness and verifying the design of a digital electronic card according to an embodiment of the present invention, and FIGS. 5 and 6 are flowcharts illustrating when a test loop operates abnormally in a method for diagnosing the soundness and verifying the design of a digital electronic card according to an embodiment of the present invention. Specific details for implementing the invention

[0021] The present invention will be described in more detail below with reference to the drawings.

[0022] The attached drawings are merely examples illustrated to further explain the technical concept of the present invention, and therefore the concept of the present invention is not limited to the attached drawings. Additionally, the sizes and spacing, etc., in the attached drawings may be exaggerated from reality to explain the relationships between the components.

[0023] A digital electronic card inspection system (hereinafter referred to as the “inspection system”) according to an embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 shows a system for diagnosing the soundness of a digital electronic card according to an embodiment of the present invention.

[0024] An inspection system according to one embodiment of the present invention is intended to diagnose the soundness of a digital electronic card, which is a core component of power plant equipment control, and includes a test module (100), an inspection module (200), a judgment module (300), and a design verification module (400).

[0025] The present invention is characterized by its technical features in that, unlike conventional methods that merely checked input and output signals, it provides an integrated solution that organically combines loop testing simulating an actual operating environment with precise physical characteristic inspection, and further verifies the cause of failure by comparing it with design data.

[0026] Referring to FIG. 1, the test module (100) is configured to be equipped with a digital electronic card to be diagnosed, and tests the loop operation state of the digital electronic card by inputting and outputting a virtual operation signal. The test module (100) includes an input unit (110), a signal processing unit (120), a communication unit (130), and an output unit (140).

[0027] The input unit (110) simulates and receives an analog signal of operating status received from sensors at the power plant site and performs the function of converting it into a digital signal, and the signal processing unit (120) processes the signal transmitted from the input unit (110) into a control signal according to a preset logic. In addition, the communication unit (130) performs a communication protocol to transmit the control signal to the outside (on the site cabinet side), and the output unit (140) converts the control signal into an analog signal for finally controlling power plant equipment (valves, pumps, etc.) and outputs it.

[0028] That is, the test module (100) is configured to first verify whether the CPU and memory of the digital electronic card logically and perfectly execute the entire control loop from input to output by forming a signal flow identical to the cabinet environment of the actual power plant site.

[0029] The specific signal flow and determination process within the test module (100) is as follows. The determination module (300) generates a virtual signal simulating a field signal, such as a transmitter signal or a contact signal, and transmits it to the input section (110) of the test module (100).

[0030] The input unit (110) transmits a field signal to the signal processing unit (120) through the communication unit (130), and the signal processing unit (120) generates a final control signal, such as pump ON / OFF or valve OPEN / CLOSE, according to the field signal conditions.

[0031] The generated control signal is transmitted to the output unit (140) via the communication unit (130) and output externally. At this time, the output signal of the output unit (140) is fed back to the judgment module (300), and the judgment module (300) determines whether a normal output has been produced according to the control logic of the signal processing unit (120).

[0032] The inspection module (200) measures characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data depending on whether power is applied and the operating state of the digital electronic card, and includes a component characteristic inspection unit (210), a thermal inspection unit (220), a micro-thermal inspection unit (230), and a transparency inspection unit (240). These detect faulty components as if they were precisely struck through stepwise and in-depth inspections.

[0033] The component characteristic inspection unit (210) inspects the impedance characteristics between component pins when the digital electronic card is in a power-off state. Inspection in a power-off state is intended to prevent secondary damage that may occur when power is applied to an already damaged component.

[0034] Specifically, the component characteristic inspection unit (210) inputs a fine test signal to a component on a circuit board to derive voltage-current-frequency 3-axis data (VIF Curve) or inductance-capacitance-resistance data (LCR Parameter). Through this, not only simple open circuits / short circuits but also fine distortions in the characteristic curve caused by internal degradation of the component can be detected. At this time, the AI ​​(artificial intelligence) of the judgment module (300) performs the judgment in the following manner.

[0035] AI receives as input the voltage-current or inductance-capacitance (x, y 2-dimensional variable) measured when connected between component pins, and the coordinates of the voltage-current-frequency or inductance-capacitance-resistance (x, y, z 3-dimensional variable) measurements with one additional variable added.

[0036] Subsequently, the center slope, area / volume, and balance in quadrants or 3D space of the resulting 2D or 3D coordinate distribution shape are analyzed, and this is compared and determined with measurement data between component pins at the same location within a normal card; if a difference occurs between the two shapes, the corresponding component is determined to be defective.

[0037] The thermal inspection unit (220) inspects the surface thermal gradient of a digital electronic card that is powered on and in operation.

[0038] This is to detect that even if the electronic card operates normally, its lifespan is rapidly shortened if a specific component overheats. The thermal inspection unit (220) scans the overall temperature distribution using an area unit sensor such as a thermal imaging camera and compares it with the reference thermal gradient data of a normal component to primarily identify thermal distribution areas that are abnormally high or low in temperature.

[0039] Specifically, the thermal inspection unit (220) acquires isotherm coordinate data of the semiconductor chip surface using a thermal imaging camera under normal operating conditions of the digital electronic card.

[0040] The acquired isotherm coordinates are input into an AI algorithm, which compares and analyzes them with the previously stored isotherm values ​​of a normal digital electronic card chip. As a result of the comparison, if a temperature deviation (such as distortion of the isotherm pattern) exceeding the allowable range occurs between the normal data and the measured data, the corresponding component is determined to be defective.

[0041] The micro-heat inspection unit (230) measures the micro-heat location, spectrum, and heat area of ​​a local surface using an InSb (Indium Antimonide) sensor for the abnormal heat distribution area identified by the heat inspection unit (220).

[0042] The reason InSb sensors are used here is that they have higher quantum efficiency and faster response speeds than general thermal imaging sensors (such as bolometers), allowing them to detect minute temperature changes of several mK (millikelvin) at specific coordinate points (dots) on the surface of a semiconductor chip. This enables the precise pinpointing of overload locations in specific dies or circuits within the chip, rather than the entire chip.

[0043] More specifically, the micro-heat inspection unit (230) precisely detects micro-heat generated by gate rupture inside the semiconductor chip, oxide crack, metal melt between integrated circuits, or bridge formation caused by metal particles.

[0044] At this time, the fine heating patterns between the normal semiconductor and the abnormal semiconductor installed in the digital electronic card can be clearly distinguished by the difference in heating coordinates and the difference in heating area.

[0045] In addition, in the case of the above micro-heat inspection unit (230), the coordinates and the area of ​​the micro-heating part on the semiconductor surface, measured under normal operating conditions of the digital electronic card, are used as input data for the AI.

[0046] The AI ​​compares the input coordinate and area data with the surface values ​​of the semiconductor at the same location on a normal digital electronic card, and determines the corresponding component as defective if a deviation occurs.

[0047] The viewing inspection unit (240) inspects the inside of the part or the joint at the heat source measured by the micro-heat inspection unit (230) by viewing through it.

[0048] Specifically, the inspection unit (240) uses imaging equipment such as X-ray, CT, and ultrasound to photograph and verify circuit patterns that are not visible to the naked eye inside the printed circuit board, chip connection parts, conductor coating and connection status inside via holes, and the condition of solder ball joints on the bottom of the chip.

[0049] The criteria for judging the imaging results of each fluoroscopic device are as follows. The fluoroscopic inspection unit (240) determines through X-ray and CT analysis whether the connection part is separated and causing a loss of signal or power, whether the non-connection part is connected and causing a short circuit that causes leakage current or high temperature, whether the connection part and part of the component are damaged and causing an open circuit, short circuit, or performance degradation, or whether foreign matter has entered and caused a short circuit or impedance change.

[0050] In particular, the ultrasonic equipment analyzes abnormal sound wave signals to determine micro-damage and damage caused by lifting inside the semiconductor component. Additionally, the fluoroscopic inspection unit (240) obtains a photographic image of the component connection part inside the electronic card using X-ray, CT, and ultrasonic measuring instruments while the operating power of the digital electronic card is turned off. This photographic image becomes input data for the AI, and the AI ​​determines component defects by checking the deviation from the shape of the connection part inside the component of a normal digital electronic card.

[0051] The judgment module (300) analyzes the test results of the test module (100) and the measurement data of the inspection module (200) to determine whether the digital electronic card is abnormal.

[0052] The judgment module (300) determines the final soundness by comprehensively analyzing the measurement results (impedance curve, isotherm, heat coordinate / area, projection shape, etc.) of each inspection unit described above.

[0053] The design verification module (400) determines whether the cause of the abnormality is a defect in the component itself or a design error in the electronic circuit board based on the judgment result of the judgment module (300).

[0054] Specifically, since the location and normality of the component are determined in the judgment module (300) and analysis unit, the design verification module (400) inputs the results into a software model containing the printed circuit board of the digital electronic card, the location of the mounted component, and rating information.

[0055] The design verification module (400) verifies the root cause of the failure by evaluating whether the part determined to be defective is an accidental random failure or is due to design errors such as printing patterns or part ratings / placement.

[0056] In addition, if conditions that may cause problems with signal integrity, such as the influence of electromagnetic interference (EMI), are identified, design improvement plans can be derived to prevent failure. At this time, the judgment criteria of the design verification module (400) include analysis variables such as changes in circuit / component impedance at a specific frequency, variability in rated current and voltage, loss of output signal (voltage) relative to input, and temperature changes in the environment of components mounted on the printed circuit board.

[0057] With reference to FIGS. 2 and FIGS. 3, the operation and inspection method of an inspection system according to an embodiment of the present invention will be described.

[0058] FIG. 2 is a flowchart illustrating a method for diagnosing the soundness and design verification of a digital electronic card according to an embodiment of the present invention, and FIG. 3 is a flowchart illustrating a step for acquiring characteristic data among the method for diagnosing the soundness and design verification of a digital electronic card according to an embodiment of the present invention.

[0059] Referring to FIG. 2, a simulated signal is first applied to the digital electronic card to be diagnosed, and the operating status of the loop unit is checked (S100). This is performed by simulating the power plant operating environment through the test module (100).

[0060] Next, depending on the verification result of step S100 and whether power is applied, an inspection path is selectively set for the components of the digital electronic card to obtain characteristic data (S200).

[0061] Subsequently, the judgment module (300) compares and analyzes the operation status and characteristic data with the stored normal data to select abnormal parts (S300), and the design verification module (400) verifies the design data of the electronic circuit board using the selected abnormal part information and determines whether there is a design defect (S400). If it is determined to be a design error, feedback data is generated and displayed to derive an improvement plan (S500).

[0062] Referring to Fig. 3, the process of acquiring specific characteristic data in step S200 is explained.

[0063] If the result of checking the loop operation status of the test module is abnormal, a first test (S210) is performed first to measure the impedance characteristics between component pins while the power is off.

[0064] On the other hand, if the loop operation state of the test module is normal, or if the first inspection is completed and it is confirmed that there is no electrical damage to the component itself, a second inspection (S220) is performed to obtain isotherm coordinates of the component surface while power is applied and compare and analyze them with normal data using AI.

[0065] After the second inspection, a third inspection (S230) is performed in which the coordinates and area of ​​the micro-heating part are precisely measured using an InSb sensor and compared with AI, and then a fourth inspection (S240) is performed in which the shape of the connection part obtained by viewing the internal structure is compared with AI to check for physical damage and bonding defects.

[0066] Referring to FIGS. 4 to 6 below, a specific inspection flow according to an embodiment of the present invention, which branches according to the result of checking the loop operation status of the test module (100), will be described.

[0067] FIG. 4 is a flowchart showing the case where the test loop operates normally in the method for diagnosing the soundness and verifying the design of a digital electronic card according to an embodiment of the present invention.

[0068] Referring to FIG. 4, when the test module is operating normally (YES), the system enters the thermal inspection unit (220) for preventive maintenance and performs a second inspection.

[0069] The normality of the thermal inspection unit is determined by [Condition 2]. If the thermal inspection unit is not normal (NO), the design verification module (400) immediately intervenes to verify whether there is a design error.

[0070] If the verification results indicate a design error (YES), design improvement plans are derived and improved parts / components are replaced; if the results indicate no design error (NO), the relevant parts are replaced and repairs are performed.

[0071] If the thermal inspection unit is normal (YES), enter the micro-thermal inspection unit (230) and perform a third inspection. Whether the micro-thermal inspection unit is normal is determined by [condition 3].

[0072] If the micro-heat inspection unit is not normal (NO), move to the design verification module (400) in the same way as above to verify whether there is a design error and take appropriate measures (deriving a design improvement plan or replacing parts).

[0073] If the micro-thermal inspection unit is normal (YES), enter the fluoroscopic inspection unit (240) and perform the fourth inspection. Whether the fluoroscopic inspection unit is normal is determined by [Condition 4]. If the fluoroscopic inspection unit is not normal (NO), move to the design verification module (400) to verify whether there is a design error and take action.

[0074] Finally, if the X-ray inspection unit is also normal (YES), the system determines the corresponding digital electronic card to be normal and terminates the inspection.

[0075] FIGS. 5 and 6 are flowcharts illustrating the case where a test loop operates abnormally in a method for diagnosing the soundness and verifying the design of a digital electronic card according to an embodiment of the present invention. FIG. 6 shows the flow after connection point 'A' in FIG. 5.

[0076] Referring to FIG. 5, if the test module does not operate normally (NO), the system first performs a first inspection through the component characteristic inspection unit (210) while the power is off. The criteria for the first inspection follow [Condition Equation 1]. The subsequent flow continues to FIG. 6 through connection point 'A'.

[0077] Referring to FIG. 6, if the result of the first inspection is not normal (NO), the process moves to the design verification module (400) to verify whether there is a design error. If there is a design error (YES), a design improvement plan is derived and replacement is performed; if there is no design error (NO), part replacement and repair are performed.

[0078] If the result of the first inspection is normal (YES), that is, if there is no problem with the impedance characteristics of the component, power is applied to perform the second inspection of the thermal inspection unit. If the result of the second inspection (condition 2) is not normal (NO), the process moves to the design verification module (400) to identify the cause.

[0079] If the result of the second inspection is normal (YES), the third inspection of the micro-thermal inspection unit is performed. If the result of the third inspection (condition 3) is not normal (NO), it moves to the design verification module (400).

[0080] If the result of the third inspection is normal (YES), the fourth inspection of the fluoroscopic inspection unit is performed. If the result of the fourth inspection (condition 4) is not normal (NO), it moves to the design verification module (400).

[0081] It is worth noting that the result of the fourth inspection is normal (YES). Although the loop operation was abnormal (starting point of Fig. 5), since all component unit inspections (first to fourth inspections) were found to be normal, it is determined that the problem is not with individual components but with the electronic card itself (e.g., defective PCB pattern), and the electronic card is replaced.

[0082] The specific details of the conditional expressions applied at each of the above steps are as follows.

[0083] [Condition 1] is based on the deviation between the coordinate value of the impedance characteristic variable between the measured component pins and the reference coordinate value of the normal component. Specifically, the judgment module (300) determines that it is abnormal when the impedance measurement variable coordinate (x, y) or (x, y, z) value between the component pins > the set value (allowable deviation from the normal measurement variable coordinate).

[0084] Here, the measurement variable coordinates include a 2-axis coordinate consisting of current (x) and voltage (y), or a 3-axis coordinate consisting of current, voltage, frequency (x, y, z) or inductance, capacitance, and resistance (L, C, R).

[0085] [Condition 2] determines the uniformity of the temperature distribution on the surface of a part, and determines it as abnormal if the temperature difference between the temperature gradient isotherms within the part > the set value (allowable deviation from the normal temperature difference). In other words, it detects signs of thermal abnormalities by monitoring whether a sudden temperature change (gradient) occurs at a specific point on the surface of the part differently from the surroundings.

[0086] [Condition 3] is a criterion for determining the positional alignment and heat generation area of ​​a micro hot spot acquired through the InSb sensor.

[0087] Specifically, a case is determined as abnormal if the local heating coordinates (x, y) on the component surface ≠ normal heating coordinates (x, y), or if the difference in the local heating area on the component surface > the difference in the normal heating area. This is intended to pinpoint and identify minute abnormal heating occurring in a specific die or circuit inside the chip, rather than the heating of the entire chip.

[0088] [Condition 4] determines whether there is a defect in the physical structure based on the results of the projection image analysis. Specifically, it is determined to be abnormal if any of the following are found: an open connection circuit, a short connection circuit, damage to the connection (abnormal shape), or the ingress of foreign matter into the connection. This is a step to finally confirm defects that are impossible to identify with the naked eye, such as cracks in the solder balls under the BGA or open circuits inside the multilayer substrate.

[0089] As described above, the present invention can precisely select abnormal components by organically combining 3-axis impedance measurement in a power-off state and micro thermal inspection and fluoroscopic inspection in a power-off state through a systematic inspection logic based on [Condition 1] to [Condition 4].

[0090] Furthermore, through design data verification, structural design defects rather than simple failures can be identified, thereby achieving the effect of securing the fundamental reliability of the equipment.

[0091] That is, through the inspection system and method according to one embodiment of the present invention, the function of a control loop unit and the operational soundness of digital components, which could not be verified in existing inspection systems, can be determined at the system level.

[0092] In addition, by organically combining 3-axis impedance measurement in a non-powered state with InSb micro-thermal inspection and fluoroscopic inspection in a powered state, abnormal components can be precisely identified. Furthermore, through design data verification, structural design defects rather than simple failures can be detected, thereby ensuring the fundamental reliability of the equipment.

[0093] Although the present invention has been described with reference to an embodiment illustrated in the accompanying drawings, this is merely illustrative, and those skilled in the art will understand that various modifications can be made to the present invention. Accordingly, the technical scope of protection of the present invention should be determined by the appended claims.

Claims

Claim 1 A system for diagnosing the soundness of a digital electronic card for power plant equipment control comprises: a digital electronic card including an electronic circuit board and a component mounted on the electronic circuit board; a test module in which the digital electronic card to be diagnosed is mounted and which tests the loop operation state of the digital electronic card by inputting and outputting a virtual operation signal; an inspection module that measures characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data according to whether power is applied and the operation state of the digital electronic card; a determination module that determines whether the digital electronic card is abnormal by analyzing the test results of the test module and the measurement data of the inspection module; and a design verification module that determines whether the cause of the abnormality is a defect in the component itself or a design error in the electronic circuit board based on the determination results of the determination module; wherein the inspection module comprises: a component characteristic inspection unit that inspects the electrical characteristics between component pins of the digital electronic card; a thermal inspection unit that inspects the surface heat distribution of the digital electronic card; and a micro-thermal inspection unit that inspects micro-heating in localized areas of the digital electronic card. A digital electronic card inspection system comprising: a transparent inspection unit for inspecting the internal structure of the components of the digital electronic card. Claim 2 In claim 1, the test module comprises an input unit, a signal processing unit, a communication unit, and an output unit for simulating a power plant site cabinet environment, wherein the input unit receives an analog signal regarding the operating status of the power plant equipment and converts it into a digital signal, the signal processing unit processes the signal transmitted from the input unit into a control signal, the communication unit transmits the control signal to the outside, and the output unit converts the control signal into an analog signal for controlling the power plant equipment and outputs it, thereby forming a digital electronic card inspection system. Claim 3 delete Claim 4 In claim 1, the component characteristic inspection unit measures the impedance characteristics between component pins while the power of the digital electronic card is cut off to derive 3-axis data of voltage-current-frequency or inductance-capacitance-resistance data; the thermal inspection unit detects the surface thermal gradient of the digital electronic card operating with power applied to acquire isotherm coordinate data of the semiconductor chip surface and confirms the temperature deviation by comparing it with normal data; the micro-thermal inspection unit uses an InSb (Indium Antimonide) sensor to detect micro-heating caused by gate defects, oxide cracks, metal melt, or metal particles inside the semiconductor chip regarding the abnormal heat distribution area confirmed by the thermal inspection unit, and measures the heat coordinates and heat area; and the transparency inspection unit transmits through the component interior or junction at the heat location measured by the micro-thermal inspection unit to determine at least one of the following: missing circuit board patterns, bonding defects of solder balls under the chip, chip molding peeling, open or short circuit of the connection part, and ingress of foreign matter. A digital electronic card inspection system that determines abnormal connection status including Claim 5 A digital electronic card inspection system according to claim 1, wherein the judgment module uses at least one of the following as input data for AI (artificial intelligence): a 2D or 3D coordinate distribution shape of an impedance measurement value obtained from the inspection module, isotherm coordinates of a semiconductor surface, coordinates and area of ​​a micro-heating part, and captured shape data of a device connection part, to compare and analyze deviations between normal part data and generate a soundness judgment result, and transmits it to the design verification module. Claim 6 A digital electronic card inspection system according to claim 1, wherein the design verification module inputs abnormal component information received from the judgment module into a software model containing location and rating information of the printed circuit board of the digital electronic card and the mounted component to verify the presence or absence of a design defect, wherein the verification is performed using at least one of impedance change at a specific frequency, variability of rated current and voltage, loss of output signal relative to input, or temperature change of the component environment as an analysis variable, and if the cause of the abnormality is confirmed to be a pattern design defect of the electronic circuit board as a result of the verification, the corresponding defect information is fed back to the judgment module to display. Claim 7 A method for diagnosing the soundness and verifying the design of a digital electronic card comprises: (a) applying a simulated signal to a digital electronic card to be diagnosed and verifying the operating state in loop units; (b) selectively setting an inspection path for a component of the digital electronic card based on the verification result of step (a) and whether power is applied, thereby obtaining characteristic data including at least one of electrical characteristic, thermal characteristic, and physical characteristic data; (c) comparing and analyzing the operating state and the characteristic data with previously stored normal data to identify abnormal components; and (d) a step of verifying design data of an electronic circuit board using the selected abnormal component information and determining whether there is a design defect; wherein step (b) comprises, if the loop operation state is abnormal as a result of the verification in step (a), first performing a first inspection to measure impedance characteristics between component pins while the power is cut off, and if the result of the first inspection is abnormal, performing the design verification in step (d); if the loop operation state is normal as a result of the verification in step (a) or after the first inspection is completed, performing a second inspection to detect the overall thermal gradient of the component surface while the power is applied, and if the result of the second inspection is abnormal, performing the design verification in step (d); performing a third inspection to precisely measure a fine heat spectrum using an InSb sensor for the abnormal heat distribution area identified as a result of the second inspection, and if the result of the third inspection is abnormal, performing the design verification in step (d); and performing a fourth inspection to determine an abnormal connection state by viewing the internal structure of the location confirmed as a result of the third inspection. Claim 8 A digital electronic card inspection method according to claim 7, wherein step (a) comprises: an input step for receiving an analog signal regarding the operating status of a power plant facility and converting it into a digital signal; a signal processing step for processing the converted signal into a control signal; a communication step for transmitting the control signal to the outside; and an output step for performing a loop operation simulating a power plant site cabinet environment by converting the control signal back into an analog signal and outputting it. Claim 9 delete Claim 10 A digital electronic card inspection method according to claim 7, wherein step (d) comprises determining whether the cause of the abnormality identified in step (c) is due to a pattern design error of the electronic circuit board rather than a defect in the component itself, and, if determined to be a design error, generating feedback data for deriving an improvement plan and displaying it to the user or providing it as analysis data for step (c).

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