Semiconductor package having a compartment shield structure for stress relief

Abstract

The present invention relates to a semiconductor package having a compartment shield design that disperses stress, and more specifically, is characterized by comprising a substrate portion on which a plurality of electronic components are mounted, a molding portion that protects the electronic components mounted on the substrate portion, an electromagnetic shielding portion formed in a part of the molding portion and corresponding to each electronic component and forming a plurality of shielding zones to shield electromagnetic waves between the electronic components, and a mitigation portion for mitigating thermal stress caused by the difference in thermal expansion rates between the electromagnetic shielding portion and the molding portion.

Description

Technology Field

[0001] The present invention relates to a semiconductor package, and more specifically, to a semiconductor package having a compartment shield design that disperses stress, which has a structure resistant to deformation caused by heat, allows for the application of a long and wide shielding area, and improves mechanical and electrical reliability. Background Technology

[0003] Electronic devices are becoming smaller and operating at high frequencies, and accordingly, the importance of semiconductor packaging technology embedded in these devices is being highlighted.

[0004] Meanwhile, along with the miniaturization of semiconductor packages, semiconductor packaging technology requires workability during package mounting and mechanical and electrical reliability after mounting.

[0005] Various electronic devices are equipped with multiple semiconductor packages manufactured with various structures as well as various electronic components for signal exchange; it is known that these semiconductor packages and electronic components emit electromagnetic waves during electrical operation.

[0006] Electromagnetic waves that cause electromagnetic interference (EMI) are defined as composite waves of electric and magnetic fields. When current flows through a conductor, the electric and magnetic fields formed by this current are combined and called electromagnetic waves.

[0007] Currently, on the motherboard of an electronic device where various signal-exchanging electronic components, including multiple semiconductor packages manufactured with various structures, are installed simultaneously, if electromagnetic waves are emitted from semiconductor packages and devices mounted at close intervals, they can directly or indirectly affect the semiconductor packages mounted in the surrounding area, potentially causing damage to the chip circuits.

[0008] Therefore, the development of technology capable of solving these problems is required.

[0009] The background technology of the present invention is disclosed in Korean Registered Patent Publication No. 10-2240759 (Registered on April 9, 2021; Title of Invention: Electronic Device and Method for Manufacturing the Same). The problem to be solved

[0011] The present invention aims to provide a semiconductor package having a compartment shield design that disperses stress, which has a structure resistant to deformation caused by heat, allows for the application of a long and wide shielding area, and improves mechanical and electrical reliability. means of solving the problem

[0013] A semiconductor package having a compartment shield design for dispersing stress according to the present invention may include: a substrate portion on which a plurality of electronic components are mounted; a molding portion that protects the electronic components mounted on the substrate portion; an electromagnetic shielding portion formed in a part of the molding portion, corresponding to each of the electronic components, and forming a plurality of shielding zones to shield electromagnetic waves between the electronic components; and a relief portion for alleviating thermal stress caused by a difference in the rate of thermal expansion between the electromagnetic shielding portion and the molding portion.

[0014] The above molding part may be formed of an epoxy molding compound (EMC).

[0015] The electromagnetic shielding portion may include a trench portion formed in the molding portion; and a shielding metal portion filled in the trench portion.

[0016] The above trench may be V-shaped, narrowing toward the substrate.

[0017] The above mitigation portion may be a spaced-out area formed such that the above electromagnetic shielding portion is spaced apart at a predetermined distance.

[0018] The length and arrangement of the above-mentioned mitigation part may be changed according to the frequency of the electronic component.

[0019] A sputter film formed by sputtering is formed on the upper part of the molding portion, and the sputter film is electrically connected to the ground of the substrate portion and can form a continuous ground network with the electromagnetic shielding portion. Effects of the invention

[0021] According to the present invention, not only is electromagnetic shielding achieved by the electromagnetic shielding part, but thermal stress caused by the difference in thermal expansion rates can also be relieved by the relaxation part formed in the separation area of ​​the electromagnetic shielding part, thereby preventing cracks and improving mechanical and electrical reliability. Brief explanation of the drawing

[0023] FIG. 1 is a plan view schematically showing a semiconductor package according to a first embodiment of the present invention. FIG. 2 is an enlarged view of portion A of FIG. 1 schematically showing a semiconductor package according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a semiconductor package according to a first embodiment of the present invention. FIG. 4 is a plan view schematically showing a semiconductor package according to a second embodiment of the present invention. FIG. 5 is an enlarged view of part B of FIG. 4 schematically showing a semiconductor package according to a second embodiment of the present invention. FIG. 6 is a cross-sectional view schematically showing a semiconductor package according to a second embodiment of the present invention. FIG. 7 is a drawing showing various shapes of a stress distribution portion of a semiconductor package according to a second embodiment of the present invention. Specific details for implementing the invention

[0024] Hereinafter, a semiconductor package according to the first embodiment of the present invention will be described in detail with reference to the attached drawings.

[0025] FIG. 1 is a plan view schematically showing a semiconductor package according to a first embodiment of the present invention, FIG. 2 is an enlarged view of portion A of FIG. 1 schematically showing a semiconductor package according to a first embodiment of the present invention, and FIG. 3 is a cross-sectional view schematically showing a semiconductor package according to a first embodiment of the present invention.

[0026] Referring to FIGS. 1 to 3, a semiconductor package (100) having a compartment shield design for dispersing stress according to the first embodiment of the present invention may include a substrate portion (110), a molding portion (130), an electromagnetic shielding portion (140), and a mitigation portion (150).

[0027] The substrate portion (110) can support the electronic component (120), molding portion (130), electromagnetic shielding portion (140), and mitigation portion (150) described later, and can provide an electrical connection to the electronic component (120).

[0028] Although not illustrated, the substrate portion (110) according to the present embodiment may be exemplified as a multilayer printed circuit board in which a substrate body, a wiring layer, and a ground layer are stacked in multiple layers.

[0029] More specifically, the substrate body forms the general appearance of the substrate portion (110) and can support the wiring layer and the ground layer. Additionally, the substrate body may be formed to have a flat plate shape with the upper and lower surfaces arranged parallel to each other. As the material for the substrate body, a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a resin in which these resins are impregnated into a core material such as glass fiber (glass fiber, glass cloth, glass fabric) together with an inorganic filler, such as an insulating material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, or BT (Bismaleimide Triazine) may be used.

[0030] The wiring layer is disposed inside the substrate body and functions as a transmission path for power or signals to electronic components. The wiring layer according to the present embodiment may be formed in the shape of a strip or plate inside the substrate body. The wiring layer may be formed in multiple layers. The multiple wiring layers may be arranged spaced apart from each other along the vertical direction inside the substrate body. As the material for the wiring layer, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used.

[0031] The ground layer is placed inside the substrate body and spaced apart from the wiring layer. The ground layer can function as a configuration for grounding electronic components (120) and electromagnetic shielding parts (140). The ground layer according to the present embodiment may be formed in the shape of a strip or plate inside the substrate body. The ground layer may be formed in multiple numbers. The multiple ground layers may be spaced apart from each other along the vertical direction inside the substrate body. In this case, each ground layer may be placed between adjacent wiring layers. As the material for the ground layer, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used.

[0032] The grounding layer may be grounded by having its end penetrate the side of the substrate body and be exposed to the outside through the side of the substrate body. In this case, the end surface of the grounding layer may be positioned on the same plane as the side of the substrate body.

[0033] The electronic component (120) can be mounted on the substrate (110).

[0034] The electronic component (120) according to the present embodiment may be provided in multiple numbers.

[0035] The electronic components (120) may be spaced apart from each other on the substrate (110). The electronic components (120) may be positioned so that their lower surface faces the upper surface of the substrate (110), and may be electrically connected to a connection terminal via a solder bump or solder ball formed of a material such as lead (Pb) or tin (Sb).

[0036] The molding part (130) can function as a configuration that protects the electronic component (120) mounted on the substrate part (110).

[0037] The molding portion (130) is positioned to surround an electronic component (120) mounted on a substrate portion (110) and can seal the electronic component (120). The molding portion (130) according to the present embodiment may include an insulating polymer material.

[0038] The molding part (130) can be formed from an epoxy molding compound (EMC).

[0039] In this embodiment, the molding part (130) is made of an epoxy molding compound, but is not limited thereto, and may be made of a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a prepreg including an inorganic filler or / and glass fiber, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine).

[0040] The molding part (130) can prevent the electronic component (120) from being damaged by external impact or foreign substances.

[0041] The molding portion (130) can be formed by applying or injecting an insulating polymer material onto the substrate portion (110) while the electronic component (120) is mounted on the substrate portion (110), and can be formed to have a shape of approximately a rectangular parallelepiped.

[0042] The electromagnetic shielding section (140) is formed in a part of the molding section (130) and corresponds to each electronic component (120), and can function as a configuration that forms a plurality of shielding zones (a) to shield electromagnetic waves between electronic components (120).

[0043] The electromagnetic shielding portion (140) may include a trench portion (142) formed in the molding portion (130) and a shielding metal portion (144) filled in the trench portion (142).

[0044] More specifically, the trench portion (142) is formed by removing a portion of the molding portion (130) with a laser or the like, and the shielding metal portion (144) can be formed by inserting a metal material into the trench portion (142).

[0045] The metal material forming the shielding metal part (144) may be made of conductive metals such as aluminum (Al), copper (Cu), silver (Ag), magnetic metals such as nickel (Ni), iron (Fe), alloys such as nickel-silver alloy, stainless steel, etc.

[0046] These shielding metal parts (144) can be formed by filling the trench part (142) with a paste containing conductive materials such as nickel (Ni), silver (Ag), and copper (Cu) powder.

[0047] The trench section (142) may be V-shaped, narrowing toward the substrate section (110). Due to the cross-sectional shape of the trench section (142), the shielding metal section (144) may be formed in an inverted trapezoidal shape. This prevents thermal deformation of the shielding metal section (144), thereby preventing the shielding metal section (144) from detaching or lifting, and in particular, prevents the shielding metal section (144) from expanding and falling out during the post-heating process.

[0048] Furthermore, stress is concentrated due to the difference in the number of thermal expansions between the shielding metal part (144) and the molding part (130), but the V-shaped structure can reduce the possibility of cracking by dispersing the stress to the inclined surface.

[0049] In addition, due to the V-shaped structure, it is easy to remove residue when processing the trench section (142) with a laser or etching, and because there is less reflection of laser light or heat accumulation, clean processing is possible, and by guiding the metal material of the shielding metal section (144) to flow well to the bottom, the possibility of filling defects can be reduced.

[0050] In this embodiment, the shape of the trench section (142) is shown as a V-shape, but it is not limited to this and can be changed to various shapes such as an 11 shape or a T shape.

[0051] The mitigation part (150) can function as a configuration to mitigate thermal stress caused by the difference in thermal expansion rates between the electromagnetic shielding part (140) and the molding part (130).

[0052] The mitigation section (150) may be formed as a spaced-out area formed such that the electromagnetic shielding section (140) is spaced apart at a predetermined distance.

[0053] Continuously arranging the electromagnetic shielding sections (140) increases mechanical strength, but cracks or delamination may occur due to thermal expansion. To prevent this, the spacing between the electromagnetic shielding sections (140) forms a relaxation section (150), thereby mitigating deformation caused by heat.

[0054] To elaborate, since the metal shielding part and the molding part (130) have different coefficients of thermal expansion (CTE), particularly in the post-heating process, strong tensile or compressive stress is generated around the electromagnetic shielding part (140) due to the difference in coefficients of thermal expansion. The mitigation part (150) has a structure in which the electromagnetic shielding part (140) is separated so as not to be continuous, allowing each shielding metal part (144) to have room to absorb the difference. Therefore, thermal stress caused by the difference in thermal expansion rates can be mitigated.

[0055] The length and arrangement of the electromagnetic shielding section (140) can be changed according to the frequency of the electronic component (120) by the mitigation section (150). That is, electromagnetic waves have wavelengths, and the structure of the electromagnetic shielding section (140) can also be adjusted based on those wavelengths.

[0056] For example, if the electronic component (120) has a low frequency (long wavelength), shielding can be effectively achieved even if the length of the separation area, i.e., the relaxation part (150), is long, and if it has a high frequency (short wavelength), electromagnetic waves leak out even through a small relaxation part (150), so making the relaxation part (150) narrower can improve shielding reliability.

[0057] A sputter film (160) may be formed on the upper part of the molding portion (130). The sputter film (160) may be formed by a sputtering process.

[0058] The sputtering process can form a sputter film (160) by spraying a thin layer of a conductive material, such as copper or stainless steel, onto the surface of the molding part (130).

[0059] The sputter film (160) formed in this way is electrically connected to the ground layer on the side of the substrate (110), thereby forming an electromagnetic shield and a noise path.

[0060] More specifically, the sputter film (160) can block electromagnetic waves entering from the outside or electromagnetic waves generated internally from being emitted to the outside. Additionally, the sputter film (160) can form a continuous shielding ground network with the shielding metal part (144) by being electrically connected to the ground layer of the substrate part (110).

[0061] This prevents external noise from being rapidly discharged along the ground and transmitted to the circuit. In particular, since the continuity of the conductive region is important for the electromagnetic shielding effect, the sputter film (160) can compensate for this.

[0062] In addition, since the sputter film (160) is present on the upper part of the molding part (130), it is possible to suppress the electric field concentration phenomenon that may occur around the electronic component (120) and maintain a stable electric field distribution.

[0063] Hereinafter, a semiconductor package (200) having a compartment shield design that disperses stress according to a second embodiment of the present invention will be described.

[0064] FIG. 4 is a plan view schematically showing a semiconductor package according to a second embodiment of the present invention, FIG. 5 is an enlarged view of part B of FIG. 4 schematically showing a semiconductor package according to a second embodiment of the present invention, FIG. 6 is a cross-sectional view schematically showing a semiconductor package according to a second embodiment of the present invention, and FIG. 7 is a drawing showing various shapes of a stress distribution portion of a semiconductor package according to a second embodiment of the present invention.

[0065] Referring to FIGS. 4 to 7, a semiconductor package (200) having a compartment shield design for dispersing stress according to a second embodiment of the present invention may include a substrate portion (210), a molding portion (230), an electromagnetic shielding portion (240), and a stress dispersion portion (250).

[0066] Since the substrate portion (210), the electronic component (220) mounted on the substrate portion (210), and the molding portion (230) are identical to the substrate portion (110), the electronic component (120), and the molding portion (130) of the first embodiment of the present invention, a detailed description is provided as described above.

[0067] The electromagnetic shielding portion (240) is formed in a part of the molding portion (230) and corresponds to each electronic component (220), and can function as a configuration that forms a plurality of shielding zones (a) to shield electromagnetic waves between electronic components (220).

[0068] The electromagnetic shielding portion (240) may include a trench portion (242) formed in the molding portion (230) and a shielding metal portion (244) filled in the trench portion (242). More specifically, the trench portion (242) may be formed by removing a portion of the molding portion (230) with a laser or the like, and the shielding metal portion (244) may be formed by inserting a metal material into the trench portion (242).

[0069] The metal material forming the shielding metal part (244) may be made of conductive metals such as aluminum (Al), copper (Cu), silver (Ag), magnetic metals such as nickel (Ni), iron (Fe), alloys such as nickel-silver alloy, stainless steel, etc.

[0070] These shielding metal parts (244) can be filled into the trench part (242) with a conductive paste containing nickel (Ni), silver (Ag), and copper (Cu) powder.

[0071] The trench section (242) can be formed in a shape corresponding to the shape of the stress distribution section (250) described later.

[0072] Additionally, the trench portion (242) may be V-shaped, narrowing toward the substrate portion (210). Due to the cross-sectional shape of the trench portion (242), the shielding metal portion (244) may be formed in an inverted trapezoidal shape. This prevents thermal deformation of the shielding metal portion (244), thereby preventing the shielding metal portion (244) from detaching or lifting, and in particular, prevents the metal shielding portion from expanding and falling off during the post-heating process.

[0073] Furthermore, stress is concentrated due to the difference in the number of thermal expansions between the shielding metal part (244) and the molding part (230), but the V-shaped structure can reduce the possibility of cracking by dispersing the stress to the inclined surface.

[0074] In addition, due to the V-shaped structure, it is easy to remove residue when processing the trench section (242) with a laser or etching, and because there is less reflection of laser light or heat accumulation, clean processing is possible, and by guiding the metal material of the shielding metal section (244) to flow well to the bottom, the possibility of filling defects can be reduced.

[0075] The stress distribution section (250) can function as a configuration that disperses force when the electromagnetic shielding section (240) is deformed by heat. Here, the post-heating process is reflow, molding curing, underfill curing, etc., and the stress concentration phenomenon caused by thermal expansion and contraction can be mitigated by the stress distribution section (250).

[0076] The stress distribution portion (250) may be disposed at the end or corner portion of the electromagnetic shielding portion (240). More specifically, as illustrated, the stress distribution portion (250) may be a circular or polygonal shape disposed at the end or corner portion of the electromagnetic shielding portion (240). (Refer to FIG. 7 (a), (b), and (c))

[0077] To elaborate, if the electromagnetic shielding part (240) has a right-angle (90-degree) corner, stress may be concentrated at the corner during thermal expansion or contraction, causing cracks to occur. Additionally, stress may be concentrated at the end of the electromagnetic shielding part (240), causing cracks to occur.

[0078] To prevent this, curved or polyhedral structures, such as circles and polygons (e.g., triangles, rhombuses, hexagons), allow stress to be naturally distributed and transmitted. As a result, cracks can be prevented by physically removing the crack initiation point or changing the direction of stress.

[0079] In addition, since the shielding metal part (244) and the molding part (230) have different coefficients of thermal expansion (CTE), particularly in the post-heating process, strong tensile or compressive stress is generated around the electromagnetic shielding part (240) due to the difference in coefficients of thermal expansion. The stress distribution part (250) acts as a buffer against such anisotropic deformation, thereby preventing the occurrence of gaps or cracks at the boundary where the materials meet due to the difference in thermal expansion between the different materials.

[0080] In addition, when cooling by the post-heating process, the shielding metal part (244) and the molding part (230) may experience peeling or lifting due to shrinkage or expansion stress, but the stress distribution part (250) can change this transfer path to naturally induce the relief of internal stress, and in terms of durability, resistance to stress is increased, so the possibility of cracking can be significantly reduced.

[0081] A sputter film (260) may be formed on the upper part of the molding portion (230). The sputter film (260) may be formed by a sputtering process. Since the sputter film (260) of this embodiment is identical to the sputter film (160) of the first embodiment of the present invention, a detailed description is replaced by the description above.

[0082] Meanwhile, although not shown, the electromagnetic shielding part (140, 240) may be applied to both the relaxation part (150) of the first embodiment and the stress distribution part (250) of the second embodiment.

[0083] That is, the relaxation part (150) and the stress distribution part (250) can be used together in a complementary manner, so they can be used selectively depending on shielding performance or design flexibility.

[0084] As described above, according to the semiconductor package having a compartment shield design that disperses stress according to the present invention, not only is electromagnetic shielding achieved by the electromagnetic shielding part, but thermal stress caused by the difference in thermal expansion rates can also be relieved by the relief part formed in the spacing area of ​​the electromagnetic shielding part, thereby preventing cracks and improving mechanical and electrical reliability.

[0085] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom.

[0086] Therefore, the true technical scope of protection of the present invention should be determined by the patent claims. Explanation of the symbols

[0088] 100, 200: Semiconductor package 110, 210: Substrate part 120, 220: Electronic components 130, 230: Molding part 140, 240: Electromagnetic shielding section 142, 242: Trench section 144, 244: Shielding metal part 150: Mitigation part 160, 260: Sputter film 250: Stress distribution section

Claims

Claim 1 A semiconductor package having a compartment shield design that disperses stress, characterized in that: a substrate portion on which a plurality of electronic components are mounted; a molding portion that protects the electronic components mounted on the substrate portion; an electromagnetic shielding portion formed in a part of the molding portion and corresponding to each of the electronic components, and forming a plurality of shielding zones to shield electromagnetic waves between the electronic components; and a mitigation portion spaced apart from the electromagnetic shielding portion to mitigate the transmission path of thermal stress caused by the difference in thermal expansion rates between the electromagnetic shielding portion and the molding portion, wherein the electromagnetic shielding portion includes a trench portion formed in the molding portion; and a shielding metal portion filled in the trench portion, wherein the mitigation portion is a spaced-apart area formed between the electromagnetic shielding portion and the molding portion, formed with a gap to mitigate the transmission of thermal stress, and wherein the length and arrangement of the mitigation portion are set according to the frequency of the electronic components. Claim 2 A semiconductor package having a stress-dispersing compartment shield design, wherein, in claim 1, the molding portion is formed of an epoxy molding compound (EMC). Claim 3 delete Claim 4 A semiconductor package having a stress-dispersing compartment shield design, wherein, in claim 1, the trench portion is V-shaped and narrows toward the direction of the substrate portion. Claim 5 delete Claim 6 delete Claim 7 A semiconductor package having a compartment shield design that disperses stress, characterized in that, in claim 1, a sputter film formed by sputtering is formed on the upper part of the molding portion, and the sputter film is electrically connected to the ground of the substrate portion and forms a continuous ground network with the electromagnetic shielding portion.

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