Wafer processing apparatus including wireless sensor wafer and wafer chuck

Abstract

The present invention relates to a wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck. According to one embodiment of the present invention, compared to a conventional sensor-mounted wafer, a battery or a battery and a microprocessor are excluded, and a wireless sensor wafer including a sensor module, a communication module, and a power receiving module is used, and a wafer chuck including a wireless power supply unit that wirelessly supplies power to the sensor module and the communication module of the wireless sensor wafer, and a wireless communication unit that receives sensing data while performing wireless communication with the communication module of the wireless sensor wafer, thereby wirelessly supplying power to the wireless sensor wafer and allowing sensing data generated from the wireless sensor wafer to be transmitted to the wafer chuck in real time. This overcomes the limitations of process condition constraints caused by the internal battery in conventional sensor-mounted wafers, and allows for real-time monitoring of sensing data to create optimized process conditions in a short time. Furthermore, by eliminating the battery and microprocessor, concerns about failure of the wireless sensor wafer can be eliminated, and since a conventional storage device (FOUP) is not required, the process can be completed at a low cost and in a short time, thereby allowing the user to use the present invention in various processes.

Description

Technology Field

[0001] The present invention relates to a wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck. Background Technology

[0003] Semiconductor devices are manufactured through numerous processes, including a process of depositing a material film on a wafer, a process of patterning the deposited material film into the required shape, and a cleaning process to remove unnecessary residues from the wafer.

[0004] In order to carry out these processes, the process of loading the wafer into the wafer chuck inside the chamber, processing the wafer, and then unloading it outside is repeated several times.

[0005] Methods for securing a wafer to a wafer chuck inside the process chamber during the wafer loading stage include using hardware structures such as clamps, securing the wafer by adsorbing the back side using a vacuum (vacuum chuck), securing it to the wafer chuck in a natural state using gravity, and securing it using the electrical piezoelectric effect.

[0006] Various methods can be used to dechuck a fixed wafer from a wafer chuck after the processing process, depending on the method used to fix the wafer.

[0007] Meanwhile, process conditions and the operating status of the equipment must be carefully monitored during the execution of each process.

[0008] For example, precise monitoring is essential for optimal semiconductor yield while controlling the temperature of the chamber or wafer, gas injection conditions, pressure conditions, plasma density, or exposure distance.

[0009] If errors occur in process conditions related to temperature, plasma, pressure, flow rate, and gas, or if equipment malfunctions, numerous defects will result, which is critical to the overall yield.

[0010] In conventional technology, process conditions within a chamber were measured indirectly during semiconductor manufacturing; however, research has continued to directly measure internal chamber conditions or the state of wafers loaded into the chamber to improve semiconductor yield.

[0011] One of them is SOW (Sensor On Wafer) related technology.

[0012] In a conventional method, a process is carried out using a wireless wafer equipped with a battery and a microprocessor, and then the wireless wafer is loaded into a FOUP containing a special electronic device for storing the wireless wafer and transferring it to equipment, and then the measurement values ​​are downloaded from the memory within the wireless wafer and analyzed, and then the process conditions are changed and the wireless wafer is loaded back into the equipment.

[0013] Repeat this process until optimal process conditions are found.

[0014] Meanwhile, as a prior art document related to the aforementioned SOW, there is Korean Registered Patent No. 10-2016398 (published September 2, 2019) titled 'Sensor-mounted wafer and storage device thereof'.

[0015] The above Korean registered patent describes a sensor-mounted wafer comprising a sensor, a communication unit, a control unit, a battery, a charging circuit, and a memory, and a sensor-mounted wafer storage device comprising a battery, a wireless charging circuit, a wireless communication circuit, a controller, and a user interface.

[0016] However, in the case of the prior art described in such prior patent documents, the battery and control unit are mounted on the sensor-mounted wafer, so its use in high-temperature and cryogenic processes is limited and the measurement range of data is narrow. Furthermore, since the sensor-mounted wafer must be stored in a FOUP, which is a storage device used for charging and data communication, there are problems such as reduced process speed and decreased accuracy.

[0017] In other words, the technical content described in the aforementioned prior art and the conventional process monitoring system using a sensor-mounted wafer (wireless wafer sensor, SOW) have a structure in which a battery (thin-film battery) and a microprocessor are placed inside the sensor-mounted wafer; consequently, there are problems such as a narrow range of process conditions that can be monitored and increased costs, measurement time, and result verification time.

[0018] Furthermore, while the control of these process conditions is an essential element in various semiconductor processes, the current reality is that their use is extremely limited because the battery and microprocessor inside the sensor-mounted wafer are frequently exposed to high or ultra-low temperatures, causing failures, and measuring process conditions costs tens of millions of won per hour. The problem to be solved

[0020] Accordingly, the present invention has been conceived against the aforementioned background and comprises a wafer processing device including a wireless sensor wafer and a wafer chuck, wherein a battery or a battery and a microprocessor are excluded compared to a conventional sensor-mounted wafer and the wireless sensor wafer includes a sensor module, a communication module, and a power receiving module, and a wireless power supply unit that wirelessly supplies power to the sensor module and communication module of the wireless sensor wafer, and a wireless communication unit that receives sensing data while performing wireless communication with the communication module of the wireless sensor wafer. By utilizing this wafer chuck, power can be wirelessly supplied to the wireless sensor wafer and sensing data generated from the wireless sensor wafer can be transmitted to the wafer chuck in real time, thereby overcoming the limitations of process condition constraints caused by the internal battery in conventional sensor-mounted wafers, and allowing for the creation of optimized process conditions in a short time by monitoring sensing data in real time, eliminating concerns about failure of the wireless sensor wafer due to the exclusion of the battery and microprocessor, and eliminating the need for a conventional storage device (FOUP), thereby enabling the completion of the process at low cost and in a short time, allowing the user to utilize the present invention in various processes. The purpose is to provide.

[0021] The objectives of the present invention are not limited thereto, and other unmentioned objectives will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0023] To achieve this purpose, an embodiment of the present invention provides a wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck, wherein the wafer processing apparatus comprises a wireless sensor wafer excluding a battery or a battery and a microprocessor, and a wafer chuck on which the wireless sensor wafer is mounted, the wafer processing apparatus comprising: a casing module having a space formed therein; at least one sensor module installed within the space; a communication module installed within the space; and a power receiving module installed within the space and electrically connected to the sensor module and the communication module; a wireless sensor wafer; a base portion; a wireless power supply portion installed in the base portion and wirelessly supplying power to the power receiving module; and a wafer chuck including a wireless communication portion installed in the base portion, performing wireless communication with the communication module and receiving sensing data generated from the sensor module.

[0024] In addition, a wafer processing device comprising a wireless sensor wafer and a wafer chuck is provided, characterized by including a microprocessor unit that is electrically connected to the wafer chuck and receives and analyzes the sensing data.

[0025] In addition, the present invention provides a wafer processing device comprising a wireless sensor wafer and a wafer chuck, characterized by including a memory unit electrically connected to the microprocessor unit and storing the sensing data and the analysis data analyzed by the microprocessor unit. Effects of the invention

[0027] According to one embodiment of the present invention, compared to a conventional sensor-mounted wafer, a battery or a battery and a microprocessor are excluded, and a wireless sensor wafer including a sensor module, a communication module, and a power receiving module is used, and a wafer chuck including a wireless power supply unit that wirelessly supplies power to the sensor module and the communication module of the wireless sensor wafer, and a wireless communication unit that receives sensing data while performing wireless communication with the communication module of the wireless sensor wafer, thereby wirelessly supplying power to the wireless sensor wafer and allowing sensing data generated from the wireless sensor wafer to be transmitted to the wafer chuck in real time. This overcomes the limitations of process condition constraints caused by the internal battery in conventional sensor-mounted wafers, and allows for real-time monitoring of sensing data to create optimized process conditions in a short time. Furthermore, by eliminating the battery and microprocessor, concerns about failure of the wireless sensor wafer can be eliminated, and since a conventional storage device (FOUP) is not required, the process can be completed at a low cost and in a short time, thereby allowing the user to use the present invention in various processes. Brief explanation of the drawing

[0029] FIG. 1 is a drawing showing a state in which a wireless sensor wafer is placed on a wafer chuck in a wafer processing apparatus including a wireless sensor wafer and a wafer chuck according to an embodiment of the present invention. Figure 2 is a diagram showing the state in which the wireless sensor wafer and the wafer chuck are separated in Figure 1. FIG. 3 is a block diagram of a wafer processing apparatus including a wireless sensor wafer and a wafer chuck according to an embodiment of the present invention. Figure 4 is a cross-sectional view of a wireless sensor wafer. Figure 5 is a diagram showing the structure of a wafer chuck. Figure 6 is a diagram showing an example of a wireless power supply unit and a wireless communication unit installed in a wafer chuck. Specific details for implementing the invention

[0030] Hereinafter, some embodiments of the present invention will be described in detail with reference to the exemplary drawings. It should be noted that in assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description is omitted.

[0031] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the present invention. These terms are intended only to distinguish the components from other components, and the essence, order, or sequence of the components is not limited by the terms. Where it is stated that a component is "connected," "combined," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that another component may also be "connected," "combined," or "connected" between each component.

[0032] FIG. 1 is a drawing showing a state in which a wireless sensor wafer is placed on a wafer chuck in a wafer processing apparatus including a wireless sensor wafer and a wafer chuck according to an embodiment of the present invention. FIG. 2 is a drawing showing a state in which the wireless sensor wafer and the wafer chuck are separated in FIG. 1. FIG. 3 is a block diagram of a wafer processing apparatus including a wireless sensor wafer and a wafer chuck according to an embodiment of the present invention. FIG. 4 is a drawing showing a cross-section of a wireless sensor wafer. FIG. 5 is a drawing showing the structure of a wafer chuck. FIG. 6 is a drawing showing an example of a wireless power supply unit and a wireless communication unit installed on a wafer chuck.

[0033] As illustrated in the drawings, according to one embodiment of the present invention, a wafer processing device (100) comprising a wireless sensor wafer (101) excluding a battery or a battery and a microprocessor, and a wafer chuck (103) on which the wireless sensor wafer (101) is mounted, the device comprises: a casing module (105) having a space formed inside; at least one sensor module (107) installed in the space; a communication module (301) installed in the space; and a power receiving module (303) installed in the space and electrically connected to the sensor module (107) and the communication module (301); the wireless sensor wafer (101); a base part (109); and a wireless power supply unit (305) installed on the base part (109) and wirelessly supplying power to the sensor module (107) and the communication module (301). A wafer processing device (100) comprising a wireless sensor wafer (101) and a wafer chuck (103) is provided, characterized by including a wafer chuck (103) that includes a wireless communication unit (307) installed in a base unit (109), performs wireless communication with a communication module (301), and receives sensing data generated from a sensor module (107).

[0034] Below, each component is explained in detail.

[0035] First, the wireless sensor wafer (101) has a configuration in which a battery or a battery and a microprocessor are largely excluded when compared to the conventional 'sensor-mounted wafer' described above.

[0036] The wireless sensor wafer (101) can measure the temperature, tilt, etc. of the wafer chuck (103) described later, and can measure vibrations generated in the semiconductor equipment.

[0037] The wireless sensor wafer (101) includes a casing module (105), a sensor module (107), and a communication module (301).

[0038] The casing module (105) has a structure in which a space is formed inside.

[0039] The casing module (105) may be formed in a structure in which an upper casing (105a) and a lower casing (105b) are combined.

[0040] The casing module (105) can be processed to form a space by grinding the parts excluding the outermost parts of the upper casing (105a) and the lower casing (105b), or by using a wet etching process.

[0041] A sensor module (107), a communication module (301), and a power receiving module (303) are installed in the internal space of the casing module (105).

[0042] Meanwhile, the casing module (105) may have a coating layer (not shown) formed on its surface, which is coated with a ceramic material or the like that is resistant to chemical and physical reactions.

[0043] Additionally, the casing module (105) may be formed such that an electromagnetic shielding layer (405) surrounds the elements (sensor module (107), communication module (301), power receiving module (303), etc.) to prevent electromagnetic waves from penetrating into the elements within the space on the inside.

[0044] And the casing module (105) may have a structure in which an electromagnetic shielding layer (405) is formed within the inner space and a filling material (407) is filled in the remaining space.

[0045] The filler (407) may be provided as, for example, a ceramic material or a polymer-based cured resin.

[0046] The sensor module (107) is installed in a space formed inside the casing module (105).

[0047] The sensor module (107) may include a visual detector, a camera, etc., and may include a sensor that senses dosage, laser light, UV, EUV, temperature, pressure, humidity, etc.

[0048] The communication module (301) is installed in a space formed inside the casing module (105).

[0049] The communication module (301) may include a wireless communication device.

[0050] The communication module (301) may include a short-range communication module for short-range communication.

[0051] The short-range communication module can be selected from Bluetooth, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus) modules.

[0052] The power receiving module (303) is installed in a space formed inside the casing module (105).

[0053] The power receiving module (303) is electrically connected to the sensor module (107) and the communication module (301).

[0054] The power receiving module (303) receives power wirelessly from the wireless power supply unit (305) included in the wafer chuck (103) to be described later, and applies power to the sensor module (107) and the communication module (301).

[0055] Meanwhile, the sensor module (107), communication module (301), and power receiving module (303) described above can be mounted on a PCB board (409) installed within the internal space of the casing module (105).

[0057] Next, the wafer chuck (103) is installed in the inner lower part of a chamber (not shown) where various processes are performed.

[0058] The wafer chuck (103) includes a base part (109), a wireless power supply part (305), and a wireless communication part (307).

[0059] The base part (109) may have a structure in which a support is formed extending downward from the circular disc shape.

[0060] The wireless power supply unit (305) is installed in the base unit (109).

[0061] The wireless power supply unit (305) wirelessly supplies power to the power receiving module (303) of the wireless sensor wafer (101).

[0062] The wireless power supply unit (305) can be provided in the form of a coil, for example.

[0063] The wireless power supply unit (305) can receive power from an external power source and transmit power to the power receiving module (303) of the wireless sensor wafer (101) using an induction method, an electromagnetic wave method, etc.

[0064] The wireless communication unit (307) is installed in the base unit (109).

[0065] The wireless communication unit (307) performs wireless communication with the communication module (301) of the wireless sensor wafer (101).

[0066] The wireless communication unit (307) receives sensing data generated from the sensor module (107) of the wireless sensor wafer (101) through the communication module (301) of the wireless sensor wafer (101).

[0067] The wireless communication unit (307) can be provided in the form of a coil, for example.

[0068] The wireless communication unit (307) may include, for example, a short-range communication module for short-range communication.

[0069] The short-range communication module can be selected from Bluetooth, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus) modules.

[0071] Meanwhile, a wafer processing device (100) including a wireless sensor wafer and a wafer chuck according to one embodiment of the present invention may include a microprocessor unit (309) that is electrically connected to the wafer chuck (103) and receives and analyzes sensing data.

[0072] In one embodiment of the present invention, a microprocessor that was previously installed in a 'sensor-mounted wafer' is electrically connected to a wafer chuck (103) rather than the sensor-mounted wafer to analyze sensing data applied from a wireless sensor wafer (101).

[0073] Meanwhile, a wafer processing device (100) including a wireless sensor wafer and a wafer chuck according to one embodiment of the present invention may include a memory unit (311) that is electrically connected to a microprocessor unit (309) and stores sensing data and analysis data analyzed by the microprocessor unit (309).

[0074] The sensing data and analysis data stored in the memory unit (311) can be displayed through an external display (not shown) so that an administrator can view the information.

[0076] As described above, according to one embodiment of the present invention, compared to a conventional sensor-mounted wafer, a battery or a battery and a microprocessor are excluded, and a wireless sensor wafer including a sensor module, a communication module, and a power receiving module is used, and a wafer chuck including a wireless power supply unit that wirelessly supplies power to the sensor module and the communication module of the wireless sensor wafer, and a wireless communication unit that receives sensing data while performing wireless communication with the communication module of the wireless sensor wafer, thereby wirelessly supplying power to the wireless sensor wafer and allowing the sensing data generated from the wireless sensor wafer to be transmitted to the wafer chuck in real time. This overcomes the limitations of process condition constraints caused by the internal battery in conventional sensor-mounted wafers, and allows for real-time monitoring of sensing data to create optimized process conditions in a short time. Furthermore, by excluding the battery and the microprocessor, concerns about failure of the wireless sensor wafer can be eliminated, and since a conventional storage device (FOUP) is not required, the process can be completed at a low cost and in a short time, thereby allowing the user to use the present invention in various processes.

[0077] Although it has been described above that all components constituting an embodiment of the present invention are combined or operate as a single unit, the present invention is not necessarily limited to such an embodiment. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate.

[0078] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0080] 100: Wafer processing device including a wireless sensor wafer and a wafer chuck 101 : Wireless sensor wafer 103 : Wafer Chuck 105 : Casing Module 105a : Upper casing 105b : Lower casing 107 : Sensor module 109 : Base section 301 : Communication module 303 : Power receiving module 305 : Wireless Power Supply 307 : Wireless Communications Department 309 : Microprocessor section 311: Memory section 401 : Power receiver 403 : Sensor 405 : Electromagnetic shielding layer 407 : Filler 409 : PCB board

Claims

Claim 1 A wafer processing device comprising a wireless sensor wafer excluding a battery or a battery and a microprocessor, and a wafer chuck on which the wireless sensor wafer is mounted, the device comprising: a casing module having a space formed therein; at least one sensor module installed within the space; a communication module installed within the space; and a power receiving module installed within the space and electrically connected to the sensor module and the communication module; a wireless sensor wafer; a base portion; and a wireless power supply portion installed on the base portion and wirelessly supplying power to the power receiving module. A wafer chuck comprising: a wireless communication unit installed on the base portion, performing wireless communication with the communication module, and receiving sensing data generated from the sensor module; wherein the casing module has a coating layer formed on its surface that is coated with a ceramic material resistant to chemical and physical reactions; wherein the casing module has an electromagnetic shielding layer formed on its inner side to surround the elements, including the sensor module, the communication module, and the power receiving module, to prevent electromagnetic wave penetration into the elements within the space; wherein the casing module has a filler material provided as a ceramic material or a polymer-based curing resin filled in the remaining space after the electromagnetic shielding layer is formed within the inner space; wherein the casing module is formed in a structure in which an upper casing and a lower casing are combined, and the space is formed by grinding the portions excluding the outermost parts of the upper casing and the lower casing, or by processing through a wet etching process to form the space; wherein the sensor module, the communication module, and the power receiving module are the A wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck, characterized in that the wireless power supply unit and the wireless communication unit are each provided in the form of a coil and installed on a PCB board installed within the internal space of a casing module. Claim 2 A wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck, characterized in that, in claim 1, it includes a microprocessor unit electrically connected to the wafer chuck and receiving and analyzing the sensing data. Claim 3 A wafer processing apparatus comprising a wireless sensor wafer and a wafer chuck, characterized in that, in claim 2, it includes a memory unit electrically connected to the microprocessor unit and storing the sensing data and the analysis data analyzed by the microprocessor unit.

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