Cutting device, and method for manufacturing a cut product

Abstract

A cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds and supports the object to be cut. The cutting mechanism cuts the object to be cut held and supported on the table. The imaging device captures an image of the object to be cut held and supported on the table. The object to be cut includes a plurality of marks formed in an imaging area by the imaging device. The cutting device further comprises a memory unit and a display unit. The memory unit stores the image and coordinates of each of the plurality of reference marks. The display unit displays, for each of the plurality of marks captured by the imaging device, the amount of discrepancy in the coordinates compared with a corresponding mark among the plurality of reference marks stored in the memory unit.

Description

Technology Field

[0001] The present invention relates to a cutting device and a method for manufacturing a cut product. Background Technology

[0002] Japanese Patent Publication No. 2018-142572 (Patent Document 1) discloses a cutting device for dividing a package substrate into individual package devices by cutting the package substrate along a line intended for division. In this cutting device, a plurality of alignment marks provided on the package substrate are detected. Then, a reference line, which is a straight line connecting an alignment mark that is the starting point of the line intended for division and an alignment mark that is the end point of the line intended for division, and the distance (maximum bending amount) between the alignment mark furthest from the reference line among the plurality of alignment marks corresponding to the line intended for division are calculated. Cutting of the package substrate is performed based on whether the calculated maximum bending amount is less than or equal to an allowable value (see Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. 2018-142572 The problem to be solved

[0004] In the cutting device disclosed in the above patent document 1, since the cutting method of the package substrate is determined after considering the maximum amount of bending of the package substrate, the planned splitting line is cut with high precision even in the case of a bent substrate. However, in the above patent document 1, there is no technology disclosed for further improving the quality of the package device (an example of a cut product) manufactured by the cutting device (an example of a cutting device).

[0005] The present invention has been made to solve these problems, and its purpose is to provide a cutting device capable of providing information to an operator that contributes to the quality improvement of a manufactured cut product, and a method for manufacturing a cut product capable of improving the quality of the manufactured cut product. means of solving the problem

[0006] A cutting device according to a certain aspect of the present invention cuts a workpiece. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds and supports the workpiece. The cutting mechanism cuts the workpiece held and supported on the table. The imaging device captures the workpiece held and supported on the table. The workpiece includes a plurality of marks formed in an imaging area by the imaging device. The cutting device further comprises a memory unit and a display unit. The memory unit stores the image and coordinates of each of the reference marks. The display unit displays, for each of the reference marks captured by the imaging device, the amount of discrepancy in the coordinates compared with a corresponding mark among the reference marks stored in the memory unit.

[0007] In addition, a method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the cutting device. The cutting device cuts a target object according to a preset cutting rule. The method for manufacturing a cut product includes a step of indicating the amount of coordinate deviation regarding each of a plurality of marks captured by an imaging device, a step of changing the setting of the cutting rule based on the amount of coordinate deviation, and a step of manufacturing a cut product by cutting a target object according to the cutting rule after the change. Effects of the invention

[0008] According to the present invention, a cutting device capable of providing information to an operator that contributes to improving the quality of a manufactured cut product, and a method for manufacturing a cut product capable of improving the quality of the manufactured cut product can be provided. Brief explanation of the drawing

[0009] Figure 1 is a plan view schematically illustrating a cutting device. FIG. 2 is a plan view schematically illustrating a retaining support member. Figure 3 is a schematic drawing illustrating the section III-III of Figure 2. FIG. 4 is a schematic diagram illustrating an example of an alignment mark shown on the ball / lead surface of a package substrate. Figure 5 is a diagram schematically illustrating the hardware configuration of a computer. FIG. 6 is a schematic diagram illustrating an example of an alignment mark used for alignment when cutting a package substrate along the long side direction. FIG. 7 is a schematic diagram illustrating a data table that manages data used in the first alignment. FIG. 8 is a schematic diagram illustrating an example of an alignment mark used for alignment when cutting a package substrate along the short side direction. FIG. 9 is a diagram schematically illustrating a data table that manages data used in the second alignment. FIG. 10 is a schematic diagram illustrating an example of an image showing the amount of misalignment calculated through the first alignment. Figure 11 is a flowchart showing the preparation steps for alignment. Figure 12 is a flowchart showing the sequence of alignment and cutting. Figure 13 is a flowchart showing the sequence of indicating the amount of misalignment of the alignment mark. FIG. 14 is a drawing illustrating an example of an image displayed on a monitor in step S320 of FIG. 13. Figure 15 is a flowchart showing the review procedure for the manufacturing conditions of electronic components. FIG. 16 is a drawing for explaining a first example of other information additionally displayed. FIG. 17 is a drawing for explaining a second example of other information additionally displayed. Fig. 18 is a diagram schematically illustrating an example of another image displayed on a monitor. FIG. 19 is a diagram schematically illustrating a first different example of a mark that stores coordinates in advance in a memory unit. FIG. 20 is a diagram schematically illustrating a second different example of a mark that stores coordinates in advance in a memory unit. Specific details for implementing the invention

[0010] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail using the drawings. In addition, the same or substantial parts in the drawings are denoted by the same reference numerals, and their descriptions are not repeated. Furthermore, each drawing is schematically drawn with objects appropriately omitted or exaggerated for ease of understanding.

[0011] [1. Composition]

[0012] <1-1. Configuration of the Cutting Device>

[0013] FIG. 1 is a schematic plan view illustrating a cutting device (1) according to the present embodiment. The cutting device (1) is configured to reorganize a package substrate (an example of a target to be cut) into a plurality of electronic components (an example of a cut part) by cutting the package substrate. In the package substrate, a substrate or lead frame on which a semiconductor chip is fixed is resin-sealed. In addition, the target to be cut does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not resin-sealed.

[0014] Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0015] Additionally, the cutting device (1) is configured to inspect each of the reorganized electronic components. In the cutting device (1), an image of each electronic component is captured, and an inspection of each electronic component is performed based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product."

[0016] In this example, a package substrate (P1) is used as the object to be cut, and the package substrate (P1) is reorganized into a plurality of electronic components (S1) by a cutting device (1). Hereinafter, among the two sides of the package substrate (P1), the resin-sealed side is referred to as the molded side, and the side opposite to the molded side is referred to as the ball / lead side. In addition, if the object to be cut is a substrate that is not resin-sealed, the side facing upward at the time of cutting (cutting surface) corresponds to the ball / lead side in this embodiment, and the side opposite to the cutting surface corresponds to the molded side in this embodiment.

[0017] As shown in FIG. 1, the cutting device (1) includes, as components, a cutting module (A1) and an inspection and storage module (B1). The cutting module (A1) is configured to manufacture a plurality of electronic components (S1) by cutting a package substrate (P1). The inspection and storage module (B1) is configured to inspect each of the manufactured plurality of electronic components (S1) and then store the electronic components (S1) in a tray. In the cutting device (1), each component is detachable and interchangeable with respect to other components.

[0018] The cutting module (A1) mainly includes a substrate supply unit (3), a positioning unit (4), a cutting table (5), a spindle unit (6), and a return unit (7).

[0019] The substrate supply unit (3) supplies the package substrates (P1) one by one to the positioning unit (4) by extruding the package substrates (P1) one by one from a magazine (M1) that accommodates a plurality of package substrates (P1). At this time, the package substrates (P1) are arranged with the ball / lead surface facing upward.

[0020] The positioning unit (4) determines the position of the package substrate (P1) by placing the package substrate (P1) extruded from the substrate supply unit (3) onto the rail unit (4a). After that, the positioning unit (4) returns the positioned package substrate (P1) to the cutting table (5).

[0021] The cutting table (5) holds and supports the package substrate (P) to be cut. Here, a cutting device (1) in a twin-cut table configuration having two cutting tables (5) is illustrated. The cutting table (5) includes a holding support member (5a), a rotation mechanism (5b), and a moving mechanism (5c). The holding support member (5a) holds and supports the package substrate (P1) by adsorbing the package substrate (P1) conveyed by the positioning member (4) from below. The rotation mechanism (5b) can rotate the holding support member (5a) in the horizontal plane in the direction θ1 of the drawing. The moving mechanism (5c) can move the holding support member (5a) along the Y-axis of the drawing.

[0022] FIG. 2 is a plan view schematically illustrating a retaining support member (5a). FIG. 3 is a diagram schematically illustrating a cross-section along line III-III of FIG. 2. Referring to FIG. 2 and FIG. 3, the retaining support member (5a) includes a retaining support member body (31) and a jig (32). The retaining support member body (31) is a rectangular metal member when viewed in a planar view. The jig (32) is installed above the retaining support member body (31). A package substrate (P1) is placed on the jig (32). In the Z-axis direction, a space (SP1) is formed between the retaining support member body (31) and the jig (32). A suction mechanism not illustrated is connected to the space (SP1).

[0023] The jig (32) includes a plate-shaped part (33) made of metal or resin and a rubber part (34). The jig (32) installed on the main body (31) of the retaining support member is replaceable. The rubber part (34) is composed of an elastic material, such as rubber, for example. Each of the plate-shaped part (33) and the rubber part (34) has a rectangular shape when viewed in a planar view. On the upper surface of the rubber part (34), a plurality of protrusions (PR1) are formed to be positioned in a matrix. In this example, 18 protrusions (PR1) are formed to be arranged in a 3x6 row.

[0024] A hole (H1) is formed in each protrusion (PR1). Each hole (H1) penetrates the rubber portion (34) and the plate portion (33). Through each hole (H1), the space (SP1) outside the holding support member (5a) is connected to the space (SP1). By performing suction by an unillustrated suction mechanism connected to the space (SP1), the package substrate (P1) is adsorbed through each hole (H1). As a result, the package substrate (P1) placed on the rubber portion (34) is adsorbed and held.

[0025] A groove (G1) is formed between two adjacent protrusions (PR1). Although details will be described later, the package substrate (P1) that is adsorbed and supported on the rubber part (34) is cut by the blade (6a) (described later). When the package substrate (P1) is cut, the blade (6a) is located within the groove (G1) and is also in a position that does not come into contact with the rubber part (34).

[0026] Referring again to FIG. 1, the spindle section (6) reorganizes the package substrate (P1) into a plurality of electronic components (S1) by cutting the package substrate (P1). Here, a cutting device (1) in a twin spindle configuration having two spindle sections (6) is illustrated. The spindle section (6) is movable along the X-axis and Z-axis of the drawing. Additionally, the cutting device (1) may be in a single spindle configuration having one spindle section (6).

[0027] The spindle section (6) includes a blade (6a) and a rotation axis (6c). The blade (6a) cuts the package substrate (P1) by rotating at high speed and reorganizes the package substrate (P1) into a plurality of electronic components (S1). The blade (6a) is mounted on the rotation axis (6c) while being fitted and supported by first and second flanges not shown. The first and second flanges are fixed to the rotation axis (6c) by fastening members not shown, such as nuts.

[0028] The spindle section (6) is provided with a cutting water nozzle, a cooling water nozzle, and a material scattering water nozzle. The cutting water nozzle sprays cutting water toward a high-speed rotating blade (6a). The cooling water nozzle sprays cooling water toward the vicinity of the cutting point of the package substrate (P1). The material scattering water nozzle sprays material scattering water to blow away cutting debris.

[0029] After the cutting table (5) adsorbs the package substrate (P1), the package substrate (P1) is captured by the first position verification camera (5d) to confirm the position of the package substrate (P1). The confirmation using the first position verification camera (5d) is, for example, the confirmation of the position of an alignment mark (AL1) provided on the package substrate (P1). The position information of the alignment mark (AL1) is, for example, used to determine the cutting line of the package substrate (P1).

[0030] FIG. 4 is a schematic diagram illustrating an example of an alignment mark (AL1) shown on the ball / lead surface of a package substrate (P1). As shown in FIG. 4, in this example, a plurality of alignment marks (AL1) are printed on the ball / lead surface of the package substrate (P1). In this example, each of the plurality of alignment marks (AL1) has a cross shape. Furthermore, the alignment mark (AL1) does not necessarily have to be a cross shape; it may be any shape as long as it is a characteristic shape (unique shape). Also, the plurality of alignment marks (AL1) do not necessarily have to be the same shape.

[0031] Referring again to FIG. 1, once the position of the alignment mark (AL1) is verified, the cutting line of the package substrate (P1) is determined based on the position information of the alignment mark (AL1). Based on the determined cutting line, the rotation angle of the rotation mechanism (5b) is adjusted, etc. These series of operations for adjusting the cutting position of the package substrate (P1) are also referred to as "alignment." Alignment will be explained in detail later.

[0032] After that, the cutting table (5) moves toward the spindle section (6) along the Y-axis of the drawing. After the cutting table (5) moves downward toward the spindle section (6), the package substrate (P1) is cut by moving the cutting table (5) and the spindle section (6) relative to each other. After that, if necessary, the package substrate (P1) is captured by a second position verification camera (6b) provided in the spindle section (6) to confirm the position of the package substrate (P1), etc. Confirmation using the second position verification camera (6b) is, for example, confirmation of the cutting position and cutting width of the package substrate (P1).

[0033] After the cutting of the package substrate (P1) is completed, the cutting table (5) moves in a direction spaced apart from the spindle part (6) along the Y-axis of the drawing while holding the reorganized plurality of electronic components (S1). During this movement process, the upper surface (ball / lead surface) of the electronic components (S1) is cleaned and dried by the first cleaner (5e). This cleaning may be performed, for example, by directly spraying cleaning water onto the upper surface of the electronic components (S1), or by supplying cleaning water to the upper surface of the electronic components (S1) through a brush or the like. Additionally, in the cutting device (1), two first cleaners (5e) arranged in the X-axis direction of the drawing are provided, but the number of first cleaners (5e) is not limited thereto.

[0034] The return unit (7) adsorbs the electronic component (S1) held and supported on the cutting table (5) from above and returns the electronic component (S1) to the inspection table (11) of the inspection and storage module (B1). During this return process, the lower surface (mold surface) of the electronic component (S1) is cleaned and dried by the second cleaner (7a). This cleaning may be performed, for example, by directly spraying cleaning water onto the lower surface of the electronic component (S1), or by supplying cleaning water to the lower surface of the electronic component (S1) through a brush or the like.

[0035] The inspection and storage module (B1) mainly includes an inspection table (11), a first optical inspection camera (12), a second optical inspection camera (13), a placement section (14), and an extraction section (15). Additionally, the first optical inspection camera (12) may be provided in the cutting module (A1).

[0036] The inspection table (11) holds and supports the electronic component (S1) for optical inspection of the electronic component (S1). The inspection table (11) is movable along the X-axis of the drawing. Additionally, the inspection table (11) can be inverted vertically. The inspection table (11) is provided with a holding support member that holds and supports the electronic component (S1) by adsorbing the electronic component (S1).

[0037] The first optical inspection camera (12) and the second optical inspection camera (13) capture images of both sides (ball / lead surface and mold surface) of the electronic component (S1). Based on the captured images (image data) generated by the first optical inspection camera (12) and the second optical inspection camera (13), various inspections of the electronic component (S1) are performed. Each of the first optical inspection camera (12) and the second optical inspection camera (13) is positioned to capture an upward image in the vicinity of the inspection table (11).

[0038] The first optical inspection camera (12) captures the mold surface of an electronic component (S1) that is transported to the inspection table (11) by the transport unit (7). Then, the transport unit (7) loads the electronic component (S1) onto the holding support member of the inspection table (11). After the holding support member adsorbs the electronic component (S1), the inspection table (11) is inverted vertically. The inspection table (11) moves upward toward the second optical inspection camera (13), and the ball / lead surface of the electronic component (S1) is captured by the second optical inspection camera (13).

[0039] An inspected electronic component (S1) is placed in the placement section (14). The placement section (14) is movable along the Y-axis of the drawing. The inspection table (11) places the inspected electronic component (S1) in the placement section (14).

[0040] The extraction unit (15) transfers the electronic components (S1) placed in the placement unit (14) to a tray. The electronic components (S1) are classified as "good" or "defective" based on the results of inspection using the first optical inspection camera (12) and the second optical inspection camera (13). Based on the results of the classification, the extraction unit (15) transfers each electronic component (S1) to a tray for good products (15a) or a tray for defective products (15b). That is, good products are stored in the tray for good products (15a), and defective products are stored in the tray for defective products (15b). Each of the tray for good products (15a) and the tray for defective products (15b) can be replaced with a new tray when filled with electronic components (S1).

[0041] The cutting device (1) further includes a computer (50) and a monitor (20). The monitor (20) is configured to display an image. The monitor (20) is configured as a display device, for example, a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0042] The computer (50) controls the operation of each part of, for example, the cutting module (A1) and the inspection and storage module (B1). The operation of, for example, the substrate supply unit (3), the positioning unit (4), the cutting table (5), the spindle unit (6), the return unit (7), the inspection table (11), the first optical inspection camera (12), the second optical inspection camera (13), the placement unit (14), the extraction unit (15), and the monitor (20) is controlled by the computer (50).

[0043] <1-2. Computer Hardware Configuration>

[0044] FIG. 5 is a schematic diagram illustrating the hardware configuration of a computer (50). As shown in FIG. 5, the computer (50) includes a control unit (70), an input / output I / F (interface) (90), an input unit (95), and a memory unit (80), and each component is electrically connected via a bus.

[0045] The control unit (70) includes a CPU (Central Processing Unit) (72), RAM (Random Access Memory) (74), and ROM (Read Only Memory) (76), etc. The control unit (70) is configured to control each component within the computer (50) and each component within the cutting device (1) according to information processing.

[0046] The input / output I / F (90) is configured to communicate with each component included in the cutting device (1) via a signal line. The input / output I / F (90) is used for transmitting data from the computer (50) to each component within the cutting device (1) and for receiving data transmitted from each component within the cutting device (1) to the computer (50). The input unit (95) is configured to receive instructions from a user (operator). The input unit (95) is composed of, for example, some or all of a touch panel, a keyboard, a mouse, and a microphone.

[0047] The memory unit (80) is composed of an auxiliary storage device, such as a hard disk drive or a solid-state drive. The memory unit (80) is configured to store, for example, a control program (81). Various operations in the cutting device (1) are realized by executing the control program (81) by the control unit (70). When the control unit (70) executes the control program (81), the control program (81) is deployed in the RAM (74). Then, the control unit (70) controls each component by interpreting and executing the control program (81) deployed in the RAM (74) through the CPU (72).

[0048] [2. Overview of Alignment]

[0049] As described above, in the cutting device (1), alignment is performed before the spindle part (6) cuts the package substrate (P1). Typically, the shapes of the multiple package substrates (P1) prepared for manufacturing electronic components (S1) are not exactly the same. For example, the curvature of the substrate differs slightly from package substrate (P1) to package substrate (P1). From the perspective of suppressing the degradation of the quality of the electronic component (S1) being manufactured, the cutting line of the package substrate (P1) must be adjusted according to the curvature of the package substrate (P1). Therefore, in the cutting device (1), alignment is performed before the spindle part (6) cuts the package substrate (P1). Next, an overview of the alignment will be explained.

[0050] In the cutting device (1), the shape and coordinates of the alignment mark (AL1) used for alignment are pre-registered. The coordinates of the alignment mark (AL1) that are pre-registered are used as a reference for alignment. The registration of the shape and coordinates of the alignment mark (AL1) is performed, for example, by an operator of the cutting device (1) (hereinafter also simply referred to as "operator"). Information indicating the shape and coordinates of the alignment mark (AL1) is pre-stored in the memory unit (80) of the computer (50).

[0051] FIG. 6 is a schematic diagram illustrating an example of an alignment mark (AL1) used for alignment (hereinafter also referred to as "first alignment") when cutting a package substrate (P1) along the length direction. Referring to FIG. 6, in this example, a plurality of alignment marks (AL1) corresponding to three cutting lines (CL1) extending in the long side direction are used as a reference during the first alignment.

[0052] FIG. 7 is a schematic diagram illustrating a data table (TB1) that manages data used for the first alignment. Referring to FIG. 7, the data table (TB1) manages shape information and coordinate information of each alignment mark (AL1) used as a reference during the first alignment. The shape information and coordinate information of each alignment mark (AL1) are generated based on the shape and coordinates of the alignment mark (AL1) registered by the operator described above. In the data table (TB1), a unique number (No.) is assigned to each alignment mark (AL1), and the shape, X coordinate value, and Y coordinate value of the alignment mark (AL1) correspond to each number. The data table (TB1) is stored in the memory unit (80) of the computer (50).

[0053] FIG. 8 is a schematic diagram illustrating an example of an alignment mark (AL1) used for alignment (hereinafter also referred to as "second alignment") when cutting a package substrate (P1) along the short side direction. Referring to FIG. 8, in this example, a plurality of alignment marks (AL1) corresponding to three cutting lines (CL1) extending in the short side direction are used as a reference during the second alignment.

[0054] FIG. 9 is a schematic diagram illustrating a data table (TB2) that manages data used for the second alignment. Referring to FIG. 9, the data table (TB2) manages shape information and coordinate information of each alignment mark (AL1) used as a reference during the second alignment. The shape information and coordinate information of each alignment mark (AL1) are generated based on the shape and coordinates of the alignment mark (AL1) registered by the operator described above. In the data table (TB2), a unique number (No.) is assigned to each alignment mark (AL1), and the shape, X coordinate value, and Y coordinate value of the alignment mark (AL1) correspond to each number. The data table (TB2) is stored in the memory unit (80) of the computer (50).

[0055] In the cutting device (1), a range for searching for an alignment mark (AL1) during the first alignment (hereinafter also referred to as the "first search range") is predetermined based on coordinate information managed in the data table (TB1). The first search range is composed of, for example, a plurality of search ranges. The first search range is composed of, for example, a plurality of search ranges centered on the coordinates of each alignment mark (AL1) managed in the data table (TB1).

[0056] In addition, in the cutting device (1), a range for searching for alignment marks (AL1) during the second alignment (hereinafter also referred to as the "second search range") is predetermined based on coordinate information managed in the data table (TB2). The second search range is composed of, for example, a plurality of search ranges. The second search range is composed of, for example, a plurality of search ranges centered on the coordinates of each alignment mark (AL1) managed in the data table (TB2).

[0057] A first alignment is performed by the first position verification camera (5d) capturing the package substrate (P1) while the long side direction of the package substrate (P1) follows the Y-axis. Specifically, a search is performed in the first search range on the image captured by the first position verification camera (5d), and the coordinates of each alignment mark (AL1) are detected and stored. Based on the coordinates of each alignment mark (AL1), the amount of misalignment is calculated as described below, and the cutting line of the package substrate (P1) is determined. Afterward, the angle of the rotation mechanism (5b) and the position of the blade (6a) are adjusted so that cutting is performed along the determined cutting line. A first alignment is performed in this sequence.

[0058] Additionally, a second alignment is performed by the first position verification camera (5d) capturing the package substrate (P1) while the short side direction of the package substrate (P1) follows the Y-axis. Specifically, a search is performed in the second search range on the image captured by the first position verification camera (5d), and the coordinates of each alignment mark (AL1) are detected and stored. Based on the coordinates of each alignment mark (AL1), the amount of misalignment is calculated as described below, and the cutting line of the package substrate (P1) is determined. Afterward, the angle of the rotation mechanism (5b) and the position of the blade (6a) are adjusted so that cutting is performed along the determined cutting line. The second alignment is performed in this manner.

[0059] In this way, in the cutting device (1), alignment is performed before cutting the package substrate (P1) by the spindle part (6). Accordingly, the cutting device (1) can appropriately cut the package substrate (P1) according to the bending state of each package substrate (P1), etc.

[0060] [3. Function to display alignment mark misalignment]

[0061] For example, there may be cases where the quality (e.g., cutting quality) of the electronic component (S1) manufactured through the alignment described above is insufficient. Additionally, there may be cases where a new improvement in the quality of the electronic component (S1) being manufactured is desired. In such cases, it is convenient if information contributing to the improvement of the quality of the electronic component (S1) being manufactured is provided to the operator from the cutting device (1).

[0062] In the cutting device (1), during the first alignment, for each alignment mark (AL1) detected through imaging by the first position verification camera (5d), the amount of coordinate misalignment compared with the corresponding alignment mark (AL1) among the multiple alignment marks (AL1) that serve as standards managed in the data table (TB1) is calculated, and the calculation result is stored in the memory unit (80). Additionally, during the second alignment, for each alignment mark (AL1) detected through imaging by the first position verification camera (5d), the amount of coordinate misalignment compared with the corresponding alignment mark (AL1) among the multiple alignment marks (AL1) that serve as standards managed in the data table (TB2) is calculated, and the calculation result is stored in the memory unit (80).

[0063] For example, the amount of misalignment calculated through each alignment is correlated with the warping state of the package substrate (P1). For example, if the quality of a manufactured electronic component (S1) is insufficient, by checking the amount of misalignment regarding the package substrate (P1) used to manufacture the electronic component (S1), it may be determined that the cause of the insufficient quality of the electronic component (S1) lies in the warping state of the package substrate (P1). Once the cause is determined, the quality of the electronic component (S1) can be improved by eliminating the cause. In other words, the amount of misalignment calculated through each alignment can be considered information that contributes to the improvement of the quality of the electronic component (S1).

[0064] In the cutting device (1), a function for displaying the amount of misalignment of the alignment mark is provided. The misalignment display function is a function that displays the amount of misalignment calculated through each alignment on the monitor (20). For example, among the plurality of package substrates (P1) cut by the cutting device (1), the amount of misalignment regarding the package substrate (P1) selected by the operator is displayed on the monitor (20).

[0065] FIG. 10 is a schematic illustration of an example of an image (IM1) showing the amount of misalignment in the X-axis direction calculated through the first alignment (indicated as "X-axis offset" in FIG. 14 described later). Referring to FIG. 10, the image (IM1) includes misalignment amount information (MA1, MA2, MA3). The image (IM1) is displayed, for example, on a monitor (20).

[0066] The misalignment information (MA1) indicates the misalignment of each alignment mark (AL1) corresponding to the cutting line (CL1) on the left (Fig. 6). The misalignment information (MA1) is composed by connecting and grouping multiple misalignments (MP1). The length between each misalignment (MP1) included in the misalignment information (MA1) and the reference line (SL1) on the left in the drawing indicates the misalignment of each alignment mark (AL1) in the X-axis direction.

[0067] The misalignment information (MA2) indicates the misalignment of each alignment mark (AL1) corresponding to the central cutting line (CL1) (Fig. 6). The misalignment information (MA2) is constructed by connecting and grouping multiple misalignments (MP1). The length between each misalignment (MP1) included in the misalignment information (MA2) and the central reference line (SL1) in the drawing indicates the misalignment of each alignment mark (AL1) in the X-axis direction.

[0068] The misalignment information (MA3) indicates the misalignment of each alignment mark (AL1) corresponding to the cutting line (CL1) on the right (Fig. 6). The misalignment information (MA3) is composed by connecting and grouping multiple misalignments (MP1). The length between each misalignment (MP1) included in the misalignment information (MA3) and the reference line (SL1) on the right in the drawing indicates the misalignment of each alignment mark (AL1) in the X-axis direction. Additionally, each reference line (SL1) may or may not be displayed on the monitor (20).

[0069] In this way, for each of the plurality of alignment marks (AL1) captured by the first position verification camera (5d) in the cutting device (1), the amount of misalignment of the coordinates (specifically, the amount of misalignment in the X-axis direction) compared with the corresponding alignment mark (AL1) among the plurality of reference alignment marks (AL1) stored in the memory unit (80) is displayed. By checking the amount of misalignment of each displayed coordinate, the operator can recognize, for example, the warping state of the package substrate (P1). Since the warping state of the package substrate (P1) is related to the quality of the electronic component (S1), the amount of misalignment of each coordinate can be considered information that contributes to the quality improvement of the electronic component (S1). Accordingly, the cutting device (1) can provide the operator with information that contributes to the quality improvement of the electronic component (S1) being manufactured by displaying the amount of misalignment of each alignment mark (AL1) on the monitor (20).

[0070] In addition, in the cutting device (1), the amount of misalignment of the alignment mark (AL1) captured by the first position verification camera (5d) is displayed in group units (specifically, in group units of the alignment mark (AL1) for each cutting line). By checking the amount of misalignment displayed in group units, the operator can more easily recognize, for example, the warping state of the electronic component (S1). Accordingly, the cutting device (1) can provide the operator with information that contributes to improving the quality of the electronic component (S1) being manufactured by displaying each amount of misalignment in group units on the monitor (20).

[0071] [4. Action]

[0072] <4-1. Alignment Preparation>

[0073] FIG. 11 is a flowchart illustrating the preparation steps for alignment. The processing shown in this flowchart is executed, for example, by the control unit (70) of the computer (50). Additionally, the following description applies to the case where all alignment marks (AL1) on a single package substrate (P1) have the same shape. If some or all of the alignment marks (AL1) within the single package substrate (P1) are different, the alignment preparation operation should be performed for each alignment mark (AL1). Since the preparation steps for the first alignment and the second alignment are substantially the same, the preparation steps for the first alignment are described here.

[0074] Referring to FIG. 11, the control unit (70) performs a registration process for each alignment mark (AL1) used for the first alignment (step S100). For this registration process, for example, a package substrate (P1) selected by an operator is placed on a holding support member (5a) such that its long side direction follows the Y-axis direction. The package substrate (P1) placed on the holding support member (5a) is captured by a first position verification camera (5d). For example, a plurality of alignment marks (AL1) are detected based on the image captured by the first position verification camera (5d), and among the detected plurality of alignment marks (AL1), a reference alignment mark (AL1) is selected by the operator. This selection is performed, for example, through an input unit (95) of a computer (50). Each image and coordinate of the selected reference alignment mark (AL1) is stored in a memory unit (80). By doing so, this registration process is completed.

[0075] After the completion of the registration process, the control unit (70) sets an area (imaging area) that is captured by the first position verification camera (5d) in the first alignment (step S110). In step S110, for example, a plurality of imaging areas are set. The plurality of imaging areas set in step S110 correspond to a plurality of search ranges included in the first search range described above. Information regarding the set imaging areas is stored in the memory unit (80). By doing so, the preparation for the first alignment is completed.

[0076] <4-2. Alignment and Cutting Motion>

[0077] FIG. 12 is a flowchart illustrating the sequence of alignment and cutting. The processing shown in this flowchart is executed by the control unit (70) of the computer (50) when, for example, the package substrate (P1) held and supported by the holding support member (5a) is positioned below the first position verification camera (5d). Additionally, since the respective sequences of the first alignment and the second alignment are substantially the same, the sequence of the first alignment and cutting is described here.

[0078] Referring to FIG. 12, the control unit (70) controls the first position verification camera (5d) to capture an uncaptured area among the plurality of capture areas set in step S110 of FIG. 11 (step S200). The control unit (70) detects an alignment mark (AL1) included in the image captured by the first position verification camera (5d) and acquires coordinate information of the detected alignment mark (AL1) (step S210). The control unit (70) calculates the amount of misalignment (sometimes simply referred to as "amount of misalignment") in the X-axis direction of the detected alignment mark (AL1) and stores the calculated amount of misalignment in the memory unit (80) (step S220).

[0079] The control unit (70) determines whether imaging has been completed for the entirety of the plurality of imaging areas set in step S110 of FIG. 11 (step S230). If it is determined that imaging has not been completed ("No" in step S230), the control unit (70) performs the processing of step S200 again.

[0080] Meanwhile, if it is determined that the imaging is completed in step S230 ("Yes" in step S230), the control unit (70) calculates a plurality (three in this example) of cutting lines based on the coordinate information of each of the detected plurality of alignment marks (AL1) (step S240).

[0081] The control unit (70) determines whether it is possible to correct the relative positional relationship between the cutting table (5) and the blade (6a) so that cutting is performed along the calculated cutting line (step S250). If it is determined that the positional relationship cannot be corrected ("No" in step S250), the cutting of the package substrate (P1) is not performed, and the processing shown in this flowchart is terminated. For example, if the blade (6a) comes into contact with the protrusion (PR1) (Fig. 3) of the rubber part (34) regardless of how the rotation angle of the rotating mechanism (5b) and the position of the blade (6a) are adjusted, it is determined that the positional relationship cannot be corrected.

[0082] Meanwhile, if it is determined that the positional relationship can be corrected ("yes" in step S250), the control unit (70) corrects the relative positional relationship between the cutting table (5) and the spindle unit (6) so that cutting is performed along the cutting line calculated in step S240 (step S260). After that, the control unit (70) controls the cutting table (5) and the spindle unit (6) to perform cutting of the package substrate (P1) (step S270).

[0083] <4-3. Display of Alignment Mark Misalignment Amount>

[0084] FIG. 13 is a flowchart showing the sequence of displaying the misalignment amount of the alignment mark (AL1). The processing shown in this flowchart is executed by the control unit (70) of the computer (50) when, for example, the operation to start the misalignment amount display function is performed by an operator.

[0085] Referring to FIG. 13, the control unit (70) determines whether the package substrate (P1), which is the target for displaying the amount of misalignment of the alignment mark (AL1), has been selected by the operator (step S300). If it is determined that the package substrate (P1) has not been selected ("No" in step S300), the control unit (70) waits until the package substrate (P1) is selected.

[0086] Meanwhile, when it is determined that a package substrate (P1) is selected ("Yes" in step S300), the control unit (70) reads the amount of misalignment of each alignment mark (AL1) of the selected package substrate (P1) from the memory unit (80) (step S310). The control unit (70) controls the monitor (20) to display each read amount of misalignment (step S320).

[0087] FIG. 14 is a drawing illustrating an example of an image displayed on a monitor (20) in step S320 of FIG. 13. As shown in FIG. 14, this image includes display areas (21, 22, 23, 24, 25, 26). In the display area (21), information specifying a package substrate (P1) selected by an operator is displayed. In the display area (22), an image showing the coordinates of each alignment mark (AL1) that serves as a reference in the first alignment is displayed. In the display area (23), an image showing the coordinates of each alignment mark (AL1) that serves as a reference in the second alignment is displayed.

[0088] In the display area (24), misalignment information generated based on the misalignment amount calculated in the first alignment is displayed. In the display area (25), misalignment information generated based on the misalignment amount calculated in the second alignment is displayed. In the graphs displayed in each of the display areas (24, 25), the scale is adjusted so that each misalignment amount is easy to visually recognize. In each of the display areas (24, 25), each reference line (SL1) (Fig. 10) may also be displayed. In the display area (26), coordinate information of each alignment mark (AL1) displayed in the display area (display area (22) or display area (23)) selected by the cursor (CS1) is displayed. The coordinate information of each alignment mark (AL1) in the display area (26) can be made easier to understand if it is presented in a separate table in group units (specifically, in group units of alignment marks (AL1) for each cutting line).

[0089] In this way, for each of the plurality of alignment marks (AL1) captured by the first position verification camera (5d) in the cutting device (1), the amount of misalignment of the coordinates (specifically, the amount of misalignment in the X-axis direction) compared with the corresponding alignment mark (AL1) among the plurality of reference alignment marks (AL1) stored in the memory unit (80) is displayed. According to the cutting device (1), by displaying the amount of misalignment of each alignment mark (AL1) on the monitor (20), information that contributes to the quality improvement of the electronic component (S1) being manufactured can be provided to the operator.

[0090] <4-4. Review of Manufacturing Conditions>

[0091] FIG. 15 is a flowchart showing the procedure for reviewing the manufacturing conditions of an electronic component (S1). The process shown in this flowchart is performed by an operator.

[0092] Referring to FIG. 15, the operator checks the misalignment information displayed on the monitor (20) (step S400). Based on the misalignment information displayed on the monitor (20), the operator changes the setting of the cutting rule for the package substrate (P1) (step S410). Examples of the cutting rule include the number of alignment marks (AL1) used during alignment and the algorithm for calculating the cutting line. The operator manufactures the electronic component (S1) again using the cutting device (1) with the changed cutting rule setting (step S420).

[0093] In this way, in the method of manufacturing this electronic component (S1), the setting of the cutting rule is changed based on the amount of misalignment of the alignment mark (AL1) displayed on the monitor (20). Accordingly, according to the method of manufacturing this electronic component (S1), the quality of the electronic component (S1) being manufactured can be improved through the review of the cutting rule.

[0094] [5. Features]

[0095] As described above, in the cutting device (1) according to the present embodiment, for each of the plurality of alignment marks (AL1) captured by the first position verification camera (5d), the amount of misalignment of the coordinates compared with the corresponding alignment mark (AL1) among the plurality of reference alignment marks (AL1) stored in the memory unit (80) is displayed. By checking the amount of misalignment of each displayed coordinate, the operator can recognize, for example, the warping state of the package substrate (P1). Since the warping state of the package substrate (P1) is related to the quality of the electronic component (S1), the amount of misalignment of each coordinate can be considered information that contributes to the quality improvement of the electronic component (S1). Accordingly, the cutting device (1) can provide the operator with information that contributes to the quality improvement of the electronic component (S1) being manufactured by displaying the amount of misalignment of each alignment mark (AL1) on the monitor (20).

[0096] Additionally, the cutting device (1) is an example of a "cutting device" in the present invention. The cutting table (5) is an example of a "table" in the present invention. The spindle part (6) is an example of a "cutting mechanism" in the present invention. The first position confirmation camera (5d) is an example of an "imaging device" in the present invention. The memory part (80) is an example of a "memory part" in the present invention. The monitor (20) is an example of a "display part" in the present invention. The input part (95) is an example of an "input part" in the present invention. The jig (32) is an example of a "holding support tool" in the present invention.

[0097] [6. Other embodiments]

[0098] The concept of the above-described embodiments is not limited to the embodiments described above. Below, an example of another embodiment to which the concept of the above-described embodiments can be applied will be described.

[0099] <6-1>

[0100] In the above embodiment, the misalignment amounts of a plurality of alignment marks (AL1) regarding a package substrate (P1) selected by an operator are displayed on the monitor (20) as misalignment amount information (misalignment amount information (MA1, MA2, MA3)) in group units corresponding to each cutting line (CL1). However, the plurality of misalignment amounts do not necessarily have to be displayed in group units. For example, in each of the misalignment amount information (MA1, MA2, MA3), the plurality of misalignment amounts (MP1) may be displayed on the monitor (20) without each misalignment amount (MP1) being connected by a line.

[0101] <6-2>

[0102] For example, in each of the display areas (24, 25) of FIG. 14, only information regarding the misalignment of the alignment mark (AL1) is displayed. However, for example, other information may be additionally displayed in each of the display areas (24, 25).

[0103] FIG. 16 is a drawing for explaining a first example of additional information displayed. Referring to FIG. 16, for example, in addition to misalignment information (MA1, MA2, MA3), cutting lines (CL11, CL12, CL13) and a reference line (SL1) may be displayed on the monitor (20). Each of the cutting lines (CL11, CL12, CL13) represents a cutting line actually used for cutting the package substrate (P1). By referring to the cutting lines (CL11, CL12, CL13), the operator can examine the relationship between each cutting line and the quality of the electronic component (S1).

[0104] FIG. 17 is a diagram illustrating a second example of additional information to be displayed. Referring to FIG. 17, for example, in addition to the example shown in FIG. 16, cutting line candidates (CL21, CL22, CL23) may be additionally displayed on the monitor (20). Each of the cutting line candidates (CL21, CL22, CL23) is calculated using an algorithm different from the algorithm used to calculate each of the cutting lines (CL11, CL12, CL13), for example. Examples of algorithms include an algorithm using the average value of the deviation amount and an algorithm using the least squares method. By referring to the cutting line candidates (CL21, CL22, CL23), the operator can consider adopting other cutting line candidates. Additionally, multiple cutting line candidates may be displayed for each cutting line.

[0105] <6-3>

[0106] FIG. 18 is a schematic diagram illustrating an example of another image displayed on a monitor (20). Referring to FIG. 18, this image includes display areas (27, 28, 29). In the display area (27), for example, an image of the display area (25) of FIG. 14 is displayed. For example, the image shown in FIG. 18 is displayed on the monitor (20) when the display area (25) is selected while the image of FIG. 14 is displayed on the monitor (20). For example, when the display area (24) is selected while the image of FIG. 14 is displayed on the monitor (20), the image of the display area (24) of FIG. 14 may be displayed in the display area (27).

[0107] A plurality of selection items are displayed in the display area (28), and each selection item corresponds to one of the plurality of misalignment information displayed in the display area (27). In this example, the selection item labeled "COL1" corresponds to the misalignment information on the left. The selection item labeled "COL2" corresponds to the misalignment information in the center. The selection item labeled "COL3" corresponds to the misalignment information on the right. In this example, "COL1" is selected.

[0108] In the display area (29), misalignment information corresponding to the item selected in the display area (28) is displayed. In addition to the misalignment information (MA1), the display area (29) displays a cutting line (CL1), blade position information (BL1) (specifically, the width of the blade is indicated by two straight lines), and rubber position information (RA1). The blade position information (BL1) is information indicating the position of the blade (6a) when cutting along the cutting line (CL1). In this example, the blade (6a) is located within the groove (G1). The rubber position information (RA1) is information indicating the position of the protrusion (PR1) when cutting along the cutting line (CL1). Additionally, in the display area (29), the positional relationship between the blade (6a) and the protrusion (PR1) is displayed when the inclination of the cutting line (CL1) is corrected. In addition, the slope of the misalignment information (MA1) is also corrected to match the slope correction of the cutting line (CL1).

[0109] In this way, in this cutting device (1), in addition to the cutting line, blade position information (BL1) and rubber position information (RA1) are also displayed on the monitor (20). Accordingly, this cutting device (1) can provide the operator with information indicating the positional relationship between the cutting line, the protrusion (PR1) of the rubber part (34), and the blade (6a). For example, when the manufacturing of an electronic component (S1) is stopped and the blade position information (BL1) and rubber position information (RA1) are superimposed, the operator can recognize that the manufacturing of the electronic component (S1) has stopped because if the manufacturing of the electronic component (S1) continues, the blade (6a) will come into contact with the protrusion (PR1).

[0110] <6-4>

[0111] In the above embodiment, the coordinates of a reference alignment mark (AL1) are stored in advance in a memory unit (80), and the amount of misalignment between the coordinates of the alignment mark (AL1) captured by the first position verification camera (5d) and the coordinates of the reference alignment mark (AL1) is calculated. By displaying the calculated amount of misalignment on the monitor (20), it is determined how much the package substrate (P1) captured by the first position verification camera (5d) is misaligned from the reference package substrate (P1). However, the reference for verifying misalignment between package substrates (P1) is not limited to the alignment mark (AL1). Below, information used as a reference will be explained in order.

[0112] (6-4-1)

[0113] FIG. 19 is a schematic diagram illustrating a first different example of a mark in which coordinates are stored in advance in a memory unit (80). Referring to FIG. 19, the mark (MK1) represents a portion of the package substrate (P1) after cutting where two cut grooves (CG1) intersect vertically and horizontally (an example of a characteristic portion of the appearance of the package substrate (P1) after cutting). For example, the coordinates of a reference mark (MK1) may be stored in advance in the memory unit (80), and for example, the amount of misalignment between the coordinates of the mark (MK1) detected in an image captured by a second position verification camera (6b) and the coordinates of the reference mark (MK1) may be displayed on the monitor (20). By doing so, the operator can be made aware of the amount of misalignment caused by the cutting of the package substrate (P1). In addition, for example, by checking how the amount of deviation changes for each truncation rule, it is possible to find a truncation rule that minimizes this amount of deviation.

[0114] (6-4-2)

[0115] FIG. 20 is a schematic diagram illustrating a second different example of a mark in which coordinates are stored in advance in a memory unit (80). Referring to FIG. 20, an inner mark (IN1) is printed on, for example, the mold surface of an electronic component (S1). For example, the coordinates of a reference inner mark (IN1) are stored in advance in the memory unit (80), and for example, the amount of misalignment between the coordinates of the inner mark (IN1) detected in an image captured by a second position verification camera (6b) and the coordinates of the reference inner mark (IN1) may be displayed on a monitor (20). By doing so, the operator can be made aware of the amount of misalignment of the inner mark (IN1) in each electronic component (S1).

[0116] The embodiments of the present invention have been described illustratively above. That is, the detailed description and the accompanying drawings have been disclosed for illustrative purposes. Accordingly, among the components described in the detailed description and the accompanying drawings, there may be components that are not essential for solving the problem. Therefore, just because such non-essential components are described in the detailed description and the accompanying drawings, such non-essential components should not be immediately recognized as essential.

[0117] Furthermore, the above embodiments are merely examples of the present invention in all respects. Various improvements and modifications are possible to the above embodiments within the scope of the present invention. That is, in the implementation of the present invention, specific configurations may be appropriately adopted depending on the embodiments.

[0118] [6. Bookmark]

[0119] In this specification, various technical ideas including at least the following technologies are disclosed.

[0120] <Technology 1>

[0121] (composition)

[0122] It is a cutting device that cuts a target object, and

[0123] A table that holds and supports the above-mentioned cutting object, and

[0124] A cutting mechanism for cutting the object to be cut, which is supported and held in the table above, and

[0125] The apparatus is equipped with an imaging device for capturing images of the cutting target object held and supported on the table, and

[0126] The above-mentioned cutting target includes a plurality of marks formed in an imaging area by the imaging device, and

[0127] The above cutting device is,

[0128] A memory unit that stores the respective images and coordinates of the aforementioned plurality of reference marks, and

[0129] A cutting device further comprising, for each of the plurality of marks captured by the above-described imaging device, a display unit that indicates the amount of discrepancy in coordinates compared with a corresponding mark among the plurality of marks that serve as a reference stored in the memory unit.

[0130] (Effects, etc.)

[0131] In this cutting device, for each of the multiple marks captured by the imaging device, the amount of coordinate misalignment compared with a corresponding mark among the multiple reference marks stored in the memory unit is displayed. By checking the amount of misalignment of each displayed coordinate, the operator of the cutting device can, for example, recognize the warping state of the object to be cut. Since the warping state of the object to be cut is related to the quality of the cut product, the amount of misalignment of each coordinate can be considered information that contributes to improving the quality of the cut product. Therefore, according to this cutting device, by displaying the amount of misalignment of each coordinate on the display unit, information that contributes to improving the quality of the manufactured cut product can be provided to the operator.

[0132] <Technology 2>

[0133] (composition)

[0134] The above plurality of marks are composed of a plurality of groups, and

[0135] Each of the above plurality of groups corresponds to the cutting line of the object to be cut by the cutting mechanism, and

[0136] The cutting device described in Technique 1, wherein the display unit displays the amount of deviation of the coordinates in each unit of the plurality of groups.

[0137] (Effects, etc.)

[0138] In this cutting device, the amount of misalignment of the coordinates of each mark captured by the imaging device is displayed in groups. By checking the amount of misalignment of the coordinates displayed in groups, the operator can more easily recognize, for example, the warping state of the object to be cut. Therefore, according to this cutting device, by displaying the amount of misalignment of each coordinate in groups on the display unit, information that contributes to improving the quality of the manufactured cut product can be provided to the operator.

[0139] <Technology 3>

[0140] (composition)

[0141] The apparatus further comprises a control unit that determines the cutting line for each of the plurality of groups based on the respective coordinates of the plurality of marks captured by the imaging device, and

[0142] The cutting device described in Technique 2, wherein the display unit further displays the cutting line determined by the control unit.

[0143] (Effects, etc.)

[0144] In this cutting device, a cutting line determined by the control unit is further displayed. The operator can verify the cutting line of the object to be cut by looking at the display unit. The cutting line of the object to be cut can be considered information that contributes to improving the quality of the cut product. Therefore, according to this cutting device, by further displaying the cutting line on the display unit, information that contributes to improving the quality of the manufactured cut product can be provided to the operator.

[0145] <Technology 4>

[0146] (composition)

[0147] The control unit determines one or more candidates for cutting lines corresponding to the cutting line based on the respective coordinates of the plurality of marks captured by the imaging device, and

[0148] A cutting device described in Technique 3, wherein the display unit further displays the one or more candidates for cutting lines determined by the control unit.

[0149] (Effects, etc.)

[0150] In this cutting device, one or more candidates for cutting lines determined by the control unit are further displayed. The operator can identify one or more candidates for cutting lines by looking at the display unit. Candidates for cutting lines can be considered information that contributes to improving the quality of the cut product. Therefore, according to this cutting device, by further displaying candidates for cutting lines on the display unit, information that contributes to improving the quality of the manufactured cut product can be provided to the operator.

[0151] <Technology 5>

[0152] (composition)

[0153] The above memory unit stores, for each of the plurality of cutting objects, the amount of deviation of the coordinates for each of the plurality of marks, and

[0154] The cutting device further comprises an input unit that receives an input for selecting one of the plurality of cutting targets, and

[0155] A cutting device described in any one of Techniques 1 to 4, wherein the display unit indicates the amount of deviation of the coordinates regarding the cutting target selected through the input unit.

[0156] (Effects, etc.)

[0157] In this cutting device, the amount of coordinate deviation of each mark regarding the cutting target selected by the operator is displayed. Accordingly, this cutting device can provide the operator with information indicating the amount of coordinate deviation of each mark regarding the cutting target selected by the operator.

[0158] <Technology 6>

[0159] (composition)

[0160] The above-mentioned cutting target is a package substrate, and

[0161] A cutting device described in any one of Techniques 1 to 5, wherein each of the plurality of marks is an alignment mark provided on the package substrate, a characteristic external part of the package substrate after cutting, or an inner mark provided on an electronic component reorganized by cutting the package substrate.

[0162] <Technology 7>

[0163] (composition)

[0164] The above table includes a holding support tool that holds and supports the cutting target, and

[0165] The above cutting mechanism cuts the object to be cut by means of a blade, and

[0166] A cutting device described in any one of Techniques 3 to 6, wherein the above-mentioned display portion further displays the holding support tool and the blade.

[0167] (Effects, etc.)

[0168] In this cutting device, in addition to the cutting line, a holding support tool and a blade are further indicated. Accordingly, this cutting device can provide the operator with information indicating the positional relationship of the cutting line, the holding support tool, and the blade.

[0169] <Technology 8>

[0170] (composition)

[0171] A method for manufacturing a cut product using a cutting device described in any one of Techniques 1 to 7, and

[0172] The above cutting mechanism cuts the object to be cut according to a preset cutting rule, and

[0173] A step of indicating the amount of deviation of the coordinates for each of the plurality of marks captured by the imaging device, and

[0174] A step of changing the setting of the cutting rule based on the amount of deviation of the indicated coordinates, and

[0175] A method for manufacturing a cut product, comprising a step of manufacturing the cut product by cutting the target object according to the cutting rule after modification.

[0176] (Effects, etc.)

[0177] In this method for manufacturing a cut product, the setting of the cutting rule is changed based on the amount of deviation of the indicated coordinates. Therefore, according to this method for manufacturing a cut product, the quality of the manufactured cut product can be improved by reviewing the cutting rule. Explanation of the symbols

[0178] 1: Cutting device 3: Substrate supply unit 4: Positioning unit 4a: Rail unit 5: Cutting table 5a: Retaining support member 5b: Rotating mechanism 5c: Moving mechanism 5d: 1st position verification camera 5e: 1st cleaner 6: Spindle section 6a: Blade 6b: Second position verification camera 6c: Rotation axis 7: Return section 7a: Second cleaner 11: Inspection table 12: First optical inspection camera 13: Second optical inspection camera 14: Placement section 15: Extraction section 15a: Tray for good products 15b: Tray for defective products 20: Monitor 21, 22, 23, 24, 25, 26, 27, 28, 29: Display area 31: Retaining support member body 32: Jig 33: Plate-shaped part 34: Rubber part 50: Computer 70: Control unit 72: CPU 74: RAM 76: ROM 80: Memory 81: Control Program 90: Input / Output I / F 95: Input section A1: Cutting module AL1: Alignment Mark B1: Inspection and Storage Module BL1: Blade position information CG1: Cut home CL1, CL11, CL12, CL13: Cutting lines CL21, CL22, CL23: Cutting line candidates CS1: Cursor G1: Home H1: Hole IM1: Image IN1: Inner Mark M1: Magazine MA1, MA2, MA3: Misalignment Information MK1: Mark MP1: Misalignment P1: Package substrate PR1: Protrusion RA1: Rubber position information S1: Electronic component SL1: Reference line SP1: Space TB1, TB2: Data Tables

Claims

Claim 1 A cutting device for cutting a target object, comprising a table for holding and supporting the target object, a cutting mechanism for cutting the target object held and supported on the table, and an imaging device for capturing the target object held and supported on the table, wherein the target object includes a plurality of marks formed in an imaging area by the imaging device, and the cutting device further comprises a memory unit for storing the coordinates of each of the plurality of marks that serve as references, and a display unit for displaying the amount of discrepancy of coordinates compared with a corresponding mark among the plurality of marks that serve as references stored in the memory unit for each of the plurality of marks captured by the imaging device, wherein the plurality of marks are composed of a plurality of groups, and each of the plurality of groups corresponds to a cutting line of the target object by the cutting mechanism, and the display unit displays the amount of discrepancy of coordinates for each unit of the plurality of groups. Claim 2 A cutting device for cutting a target object, comprising a table for holding and supporting the target object, a cutting mechanism for cutting the target object held and supported on the table, and an imaging device for capturing the target object held and supported on the table, wherein the target object includes a plurality of marks formed in an imaging area by the imaging device, and the cutting device further comprises a memory unit for storing the coordinates of each of the plurality of marks serving as a reference, and a display unit for displaying the amount of discrepancy of coordinates compared with a corresponding mark among the plurality of marks serving as a reference stored in the memory unit for each of the plurality of marks captured by the imaging device, wherein the memory unit stores the amount of discrepancy of coordinates for each of the plurality of marks for each of the plurality of targets for cutting, and the cutting device further comprises an input unit for receiving an input for selecting one of the plurality of targets for cutting, and the display unit for displaying the amount of discrepancy of coordinates for the target object for cutting selected through the input unit. Claim 3 A cutting device according to claim 1, further comprising a control unit that determines the cutting line based on the respective coordinates of the plurality of marks captured by the imaging device, and a display unit that further displays the cutting line determined by the control unit. Claim 4 A cutting device according to paragraph 3, wherein the control unit determines one or more candidates for cutting lines corresponding to the cutting line based on the respective coordinates of the plurality of marks captured by the imaging device, and the display unit further displays the one or more candidates for cutting lines determined by the control unit. Claim 5 A cutting device according to claim 1, wherein the object to be cut is a package substrate, and each of the plurality of marks is an alignment mark provided on the package substrate, a characteristic external part of the package substrate after cutting, or an inner mark provided on an electronic component reorganized by cutting the package substrate. Claim 6 A cutting device according to paragraph 3, wherein the table includes a holding support tool for holding and supporting the object to be cut, the cutting mechanism cuts the object to be cut by a blade, and the display part further displays the holding support tool and the blade. Claim 7 A method for manufacturing a cut product using a cutting device described in any one of claims 1 to 6, wherein the cutting device comprises the steps of: cutting the target object according to a preset cutting rule; displaying the amount of deviation of the coordinates for each of the plurality of marks captured by the imaging device; changing the setting of the cutting rule based on the displayed amount of deviation of the coordinates; and manufacturing the cut product by cutting the target object according to the cutting rule after the change. Claim 8 delete

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