Electronic device

Abstract

The present embodiment relates to an electronic device. An electronic device according to one aspect comprises: a housing having a first heat dissipation fin disposed on its outer surface; a substrate disposed within the housing; and a first electronic component connected to the substrate and disposed within the housing. A concave groove is disposed on the inner surface of the housing, and a protrusion is disposed on the outer surface of the housing in an area that overlaps vertically with the area forming the groove. At least a portion of the first electronic component is coupled to the groove, and the first heat dissipation fin has a shape that protrudes from the surface of the protrusion.

Description

Technology Field

[0001] This embodiment relates to an electronic device. Background Technology

[0003] Recent power electronics technology demands high power and high power density. To achieve high power, components with higher power capabilities must be selectively configured to increase efficiency and be implemented as miniaturized products with low heat loss.

[0004] In addition, each component must be positioned to maximize space efficiency, while simultaneously considering factors such as insulation distances between components and power paths. Furthermore, seismic resistance and cooling performance are important design parameters that are desired to be optimized to achieve high power density.

[0005] Examples of electronic components placed inside an electronic device include inductors for obtaining inductance or transformers for voltage conversion. Such electronic components are placed within a housing that forms the external shape of the electronic device. Electronic components generate heat through operation. The generated heat can cause overloading of each electronic component, which can impair setting functions and lead to failure. Therefore, a structure or means for heat dissipation of components within the electronic device is required. Prior art literature

[0007] Korean Published Patent Application No. 10-2021-0030778 (Published March 18, 2021) The problem to be solved

[0008] The present invention is proposed to improve upon the above-mentioned problems and aims to provide an electronic device capable of compactly combining electronic components within a housing space and improving heat dissipation efficiency. means of solving the problem

[0010] An electronic device according to the present embodiment comprises: a housing having a first heat dissipation fin disposed on its outer surface; a substrate disposed within the housing; and a first electronic component connected to the substrate and disposed within the housing. A concave groove is disposed on the inner surface of the housing, and a protrusion is disposed on the outer surface of the housing in an area that overlaps vertically with the area forming the groove. At least a portion of the first electronic component is coupled to the groove, and the first heat dissipation fin has a shape that protrudes from the surface of the protrusion. Effects of the invention

[0012] Through this embodiment, the vertical overlapping structure between the heat dissipation fins and the electronic components has the advantage that the driving heat of the electronic components can be easily radiated to the outside through the heat dissipation fins.

[0013] In addition, due to the horizontal overlapping structure between the electronic component and the multiple heat dissipation fins, the driving heat of each of the multiple electronic components can be dissipated in various directions through the placement area of ​​the heat dissipation fins.

[0014] In addition, due to the embedded structure of electronic components within the housing, the vertical height of the space within the housing for arranging electronic components can be reduced, which has the advantage of facilitating the miniaturization of electronic devices. Brief explanation of the drawing

[0016] FIG. 1 is a perspective view illustrating the external appearance of an electronic device according to a first embodiment of the present invention. FIG. 2 is a plan view showing the top surface of an electronic device according to a first embodiment of the present invention. FIG. 3 is an exploded perspective view of an electronic device according to a first embodiment of the present invention. FIG. 4 is a drawing of FIG. 3 shown from a different angle. FIGS. 5 to 10 are drawings illustrating the arrangement structure of electronic components within a housing according to a first embodiment of the present invention from various angles. FIG. 11 is a drawing illustrating a modified example of a protrusion arrangement structure according to the first embodiment of the present invention. FIG. 12 is a perspective view illustrating the external appearance of an electronic device according to a second embodiment of the present invention. FIG. 13 is an exploded perspective view of an electronic device according to a second embodiment of the present invention. FIG. 14 is a drawing of FIG. 13 shown from a different angle. FIG. 15 is a perspective view showing the lower surface of a housing according to a second embodiment of the present invention. FIG. 16 is a plan view showing the lower surface of a housing according to a second embodiment of the present invention. FIGS. 17 to 21 are drawings illustrating the arrangement structure of electronic components from various angles to explain the heat dissipation structure of an electronic device according to a second embodiment of the present invention. Specific details for implementing the invention

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0018] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0019] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0020] Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “at least one of A and B and C (or more than one),” it may include one or more of all combinations that can be combined with A, B, and C.

[0021] In addition, terms such as first, second, A, B, (a), (b), etc. may be used to describe the components of the embodiments of the present invention.

[0022] These terms are intended merely to distinguish a component from other components and are not limited by the essence, order, sequence, etc. of the component.

[0023] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0024] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0025] The electronic device according to the present embodiment comprises a housing and electronic components disposed within the housing, and may include an electronic control unit, a converter, a pump and oil pump control unit, a charger, etc. However, this is exemplary, and the electronic device may include various devices comprising at least one electronic component disposed within the housing.

[0026] FIG. 1 is a perspective view showing the exterior of an electronic device according to a first embodiment of the present invention, FIG. 2 is a plan view showing the top surface of an electronic device according to a first embodiment of the present invention, FIG. 3 is an exploded perspective view of an electronic device according to a first embodiment of the present invention, FIG. 4 is a drawing showing FIG. 3 from a different angle, and FIG. 5 to 10 are drawings showing the arrangement structure of electronic components within a housing according to a first embodiment of the present invention from various angles.

[0027] Referring to FIGS. 1 to 10, an electronic device (10) according to the first embodiment of the present invention may include a housing (100), a cover (200), a substrate (300), and electronic components (310, 330).

[0028] The housing (100) can form the external shape of the electronic device (10). A space (102) for accommodating electronic components and a substrate (300) may be provided within the housing (100). For example, the housing (100) includes a bottom plate (110) and a side plate (120) that protrudes upward from the edge of the bottom plate (110), and the space (102) may be partitioned from other areas by the upper surface of the bottom plate (110) and the inner surface of the side plate (120). The housing (100) may be formed in a box shape with an open top surface. The housing (100) may have a rectangular cross-sectional shape. When a cover (200) is attached to the housing (100), the upper surface of the space (102) may be covered.

[0029] A groove (130) to which a first electronic component (310), to be described later, is coupled may be disposed on the inner surface of the housing (100). The groove (130) may have a shape that is more concave than other areas from the inner surface of the housing (100). As shown in FIG. 3, the groove (130) may have a shape that is more concave downward from the upper surface of the bottom plate (110) than other areas. When a plurality of first electronic components (310) are provided, the groove (130) may be provided in a plurality corresponding to the number of first electronic components (310) and arranged to be spaced apart in the horizontal direction. Here, the horizontal direction may refer to the first direction (X) or the second direction (Y) to be described later.

[0030] A plurality of grooves (130) in which a plurality of first electronic components (310) are disposed may each be disposed closer to the edge of the housing (100) than to the center of the housing (100). A plurality of grooves (130) may be disposed adjacent to the side plate (120). As described above, the housing (100) may have a rectangular cross-sectional shape. For example, the housing (100) may include a plurality of long sides and a plurality of short sides facing each other. In this case, a plurality of grooves (130) may be disposed adjacent to the side plate (120) disposed in the area forming the short side of the housing (100). At least one of the plurality of grooves (130) may be disposed adjacent to the side plate (120) forming the long side of the housing (100).

[0031] A protrusion (135, see FIG. 7) may be disposed in an area corresponding to the placement area of ​​the groove (130) on the outer surface of the housing (100). The protrusion (135) may have a shape that protrudes more from the outer surface of the housing (100) than other areas. As shown in FIG. 7, the protrusion (135) may have a shape that protrudes downward from the lower surface of the bottom plate (110) than other areas. Accordingly, the lower surface of the housing (100) may include a plurality of surfaces that are stepped in the vertical direction. For example, the lower surface of the housing (100) may include a first surface (137) and a second surface that is stepped downward relative to the first surface (137). The second surface may be the lower surface of the protrusion (135). The space within the groove (130), which is the placement area of ​​the first electronic component (310), may be disposed such that at least a portion overlaps horizontally with the first surface (137).

[0032] A coupling surface (112) to which a second electronic component (330), to be described later, is coupled may be disposed on the inner surface of the housing (100). The coupling surface (112) may be disposed on the lower plate (110). When multiple second electronic components (330) are provided, the coupling surface (112) may be provided in multiple numbers corresponding to the number of second electronic components (330) and may be disposed along the horizontal direction. The coupling surface (112) may have a stepped shape that is higher than the upper surface of the lower plate (110), but alternatively, it may be disposed to form the same plane as the upper surface of the lower plate (110).

[0033] Heat dissipation fins (140) may be disposed on the outer surface of the housing (100). The heat dissipation fins (140) may have a shape that protrudes outward from the outer surface of the housing (100) more than other areas. Heat dissipation can be achieved more easily by increasing the surface area of ​​the housing (100) through the heat dissipation fins (140).

[0034] The heat dissipation fins (140) may have a shape that protrudes downward from the lower surface of the lower plate (110). As illustrated in FIGS. 1 and 2, the heat dissipation fins (140) may have a plate shape. The heat dissipation fins (140) may be provided in multiple numbers and arranged along a first direction (X). Each of the multiple heat dissipation fins (140) may have a length direction in a second direction (Y) perpendicular to the first direction (X). The heat dissipation fins (140) may be arranged to overlap with the electronic components (310, 330) in the vertical direction. For example, the heat dissipation fins (140) may include a first heat dissipation fin (144) that overlaps with the first electronic component (310) in the vertical direction and a second heat dissipation fin (142) that overlaps with the second electronic component (330) in the vertical direction. The first heat dissipation fin (144) and the second heat dissipation fin (142) can be arranged along the first direction (X).

[0035] As described above, a protrusion (135) may be disposed in an area corresponding to the formation area of ​​the groove (130) on the lower surface of the housing (100) where the first electronic component (310) is disposed. Accordingly, some of the heat dissipation fins (140) may be disposed to overlap with the protrusion (135). In this case, the formation area of ​​the heat dissipation fin (140) that overlaps with the protrusion (135) may have a shape that protrudes from the outer surface of the protrusion (135). Specifically, in the case of the first heat dissipation fin (144) that overlaps with the first electronic component (310) in the vertical direction, one area may have a shape that protrudes downward from the lower surface of the protrusion (135), and the other area may be connected to the side of the protrusion (135) that protrudes from the lower surface of the lower plate (110). Accordingly, the surface area of ​​the protrusion (135) may be increased through the first heat dissipation fin (144).

[0036] The vertical length of the first heat dissipation fin (144) protruding from the lower surface of the protrusion (135) may be shorter than the vertical length of the second heat dissipation fin (142) protruding from the first surface (137) of the housing (100). The lower surface of the first heat dissipation fin (144) may form a flat plane with the lower surface of the second heat dissipation fin (142).

[0037] As illustrated in FIG. 4, a fan mounting space (119) may be disposed on the outer surface of the housing (100) facing one end of the heat dissipation fin (140). A fan (450, see FIG. 3), which will be described later, is disposed in the fan mounting space (119), and the fan (450) can generate air in a second direction (Y) toward the heat dissipation fin (140). Additionally, the first direction (X) gap (147, see FIG. 1) between the first heat dissipation fin (144) and the second heat dissipation fin (142) is formed to be longer than the first direction (X) gap between the plurality of first heat dissipation fins (144) and the plurality of second heat dissipation fins (142), so that air through the fan (450) is introduced into the gap between the first heat dissipation fin (144) and the second heat dissipation fin (142), thereby increasing the heat dissipation efficiency. The first direction (X) gap between the first heat dissipation fin (144) and the second heat dissipation fin (142) can be named as an air inlet.

[0038] A third heat dissipation fin (150) may be disposed on the side of the housing (100). The third heat dissipation fin (150) may have a shape that protrudes in a first direction (X) from the side of the housing (100). The third heat dissipation fin (150) may be provided in multiple numbers and disposed along a second direction (Y). The side of the housing (100) on which the third heat dissipation fin (150) is disposed may be a side adjacent to the area of ​​placement of multiple grooves (130). Accordingly, the third heat dissipation fin (150) may be disposed to overlap with the first electronic component (310) along the first direction (X). When the first electronic component (310) is combined within the home (130), the first electronic component (310) can dissipate heat through multiple paths via the first heat dissipation fin (144) which is overlapped in the vertical direction and the third heat dissipation fin (150) which is overlapped in the first direction (X).

[0039] The electronic device (10) may include a cover (200). The cover (200) may be coupled to the housing (100). By coupling the cover (200), the upper surface of the space (102) inside the housing (100) may be covered. The cover (200) may include a plate-shaped body and a rib (210, see FIG. 4) protruding from the bottom of the body. The rib (210) may be provided in multiple numbers and arranged along the edge of the body. A rib groove (105) to which the rib (210) is coupled is arranged on the side of the housing (100), and by coupling the rib (210) and the rib groove (105), the coupling of the cover (200) to the housing (100) may be guided.

[0040] An inner cover (250) may be disposed on the lower surface of the cover (200). The inner cover (250) may be disposed on the housing (100). The inner cover (250) includes a plurality of holes (252), and heat from the space (102) inside the housing (100) may be discharged to the outside through the plurality of holes (252).

[0041] The electronic device (10) may include a substrate (300). The substrate (300) may be a printed circuit board (PCB). The substrate (300) is formed in a plate shape, and a plurality of components for driving the electronic device (10) may be disposed on the upper or lower surface. The substrate (300) may be disposed in a space (102) within a housing (100).

[0042] The substrate (300) may be electrically connected to electronic components (310, 330). The electronic components (310, 330) may include a first electronic component (310) and a second electronic component (330). The first electronic component (310) may include an inductor for obtaining inductance or a transformer for voltage conversion. The first electronic component (310) may include a core and a coil wound on the outer surface of the core. The coil may extend outward from the core and be electrically connected to the substrate (300). The second electronic component (330) may include an FET element. The second electronic component (330) may be mounted on the lower surface of the substrate (300) facing the lower plate (110). The first electronic component (310) and the second electronic component (330) can each generate heat by driving. The first electronic component (310) and the second electronic component (330) can each be provided in multiple quantities.

[0043] Each of the plurality of first electronic components (310) can be coupled to the groove (130). When the first electronic components (310) are coupled within the groove (130) as shown in FIG. 7, at least a portion of the first electronic components (310) may be arranged to overlap with the first surface (137) of the lower surface of the housing (100) in the first direction (X). The first electronic components (310) may be arranged to overlap with the first heat dissipation fin (144) in the vertical direction. At least a portion of the first electronic components (310) may be arranged to overlap with the second heat dissipation fin (142) in the horizontal direction. At least a portion of the first electronic components (310) may be arranged to overlap with the third heat dissipation fin (150) in the first direction (X). Accordingly, the heat generated by the operation of the first electronic component (310) is dispersed in the vertical direction and the first direction (X) through the first heat dissipation fin (144) and the third heat dissipation fin (150), thereby improving heat dissipation efficiency.

[0044] When the first electronic component (310) is coupled within the home (130), the first electronic component cover (320) is coupled to the bottom plate (110) to cover the upper surface of the first electronic component (310). The first electronic component cover (320) includes a hole through which the coil of the first electronic component (310) passes, and the coil of the first electronic component (310) can be connected to the substrate (300) by passing through the hole of the first electronic component cover (320). Through the first electronic component cover (320), the generation of electrical noise between the first electronic component (310) and other electronic components can be minimized.

[0045] The second electronic component (330) may be mounted on the lower surface of the substrate (300). The second electronic component (330) may be placed on the coupling surface (112) of the housing (100). A heat dissipation pad (340) may be placed between the coupling surface (112) and the second electronic component (330). The heat dissipation pad (340) is provided with a material having excellent thermal conductivity so that heat generated by the operation of the second electronic component (330) can be easily conducted to the housing (100).

[0046] The second electronic component (330) can be arranged to overlap the heat dissipation fin (140) in the vertical direction. The second electronic component (330) can be arranged to overlap the second heat dissipation fin (142) in the vertical direction. Accordingly, heat generated by the operation of the second electronic component (330) can be easily dissipated through the heat dissipation pad (340) and the second heat dissipation fin (142) of the housing (100).

[0047] The electronic device (10) may include a fan (450). The fan (450) may be placed on the lower surface of the housing (100), which is the placement area of ​​the heat dissipation fin (140). The fan (450) may be placed in the fan mounting space (119). The fan (450) may be placed facing the heat dissipation fin (140) in a second direction (Y). The fan (450) may discharge air in the second direction (Y) toward the heat dissipation fin (140). The fan (450) may be provided in multiple numbers and arranged along the first direction (X). As shown in FIG. 8, at least some of the air discharged from the fan (450) flows into the gap (147) between the first heat dissipation fin (144) and the second heat dissipation fin (142), thereby easily dissipating heat conducted to the first heat dissipation fin (144) or the second heat dissipation fin (142). Additionally, due to the embedded structure of the first electronic component (310) within the home (130), at least a portion of the first electronic component (310) may be arranged to overlap with the fan (450) in the second direction (Y), and accordingly, the heat dissipation efficiency may be improved due to the structure placed on the air flow path generated from the fan (450).

[0048] The electronic device (10) may include a lower cover (410, 430). The lower cover (410, 430) may be coupled to the lower surface of the housing (100). By coupling the lower cover (410, 430), the placement area of ​​the heat dissipation fin (140) may be covered. In FIGS. 1 and 2, the electronic device (10) is illustrated without the lower cover (410, 430). The lower cover (410, 430) may include a bottom plate (410) and a plurality of side plates (430) disposed on both sides of the bottom plate (410). One of the plurality of side plates (430) may be formed as one body with the bottom plate (410), and the other may be detachably coupled to the bottom plate (410). A fan (450) is attached to one of the plurality of side plates (430), and the side plate (430) to which the fan (450) is attached may be provided with a hole for introducing air into the fan (450). The bottom plate (410) may be arranged to overlap with the heat dissipation fins (140) in the vertical direction. As the air discharged from the fan (450) is not emitted to the outside by the connection of the bottom cover (410, 430) but is guided into the area between the plurality of heat dissipation fins (140), the heat dissipation efficiency may be improved.

[0049] Meanwhile, based on the arrangement area of ​​the plurality of heat dissipation fins (140), a partition section (149, see FIG. 1) with a shape protruding downward from the lower surface of the housing (100) is arranged on both edges of the first direction (X), thereby preventing heat generated from the fan (450) from radiating to an area other than the set area. The vertical length of the partition section (149) may be longer than the vertical length of the heat dissipation fins (140), and a bottom plate (410) may be coupled between the plurality of partition sections (149).

[0050] The electronic device (10) may include a side cover (440). The side cover (440) may be attached to the side of the housing (100) where the third heat dissipation fin (150) is positioned. The side cover (440) may include a plurality of heat exhaust holes. Air generated from the fan (450) may pass through the lower surface of the housing (100), be guided to the positioning area of ​​the third heat dissipation fin (150), and be discharged to the outside through the heat exhaust holes of the side cover (440).

[0051] According to the embodiment, the vertical overlapping structure between the heat dissipation fins and the electronic components has the advantage that the driving heat of the electronic components can be easily radiated to the outside through the heat dissipation fins. In addition, as shown in FIG. 9, due to the vertical and horizontal overlapping structure between the electronic components and the plurality of heat dissipation fins, the driving heat of each of the plurality of electronic components can be dissipated in various directions through the placement area of ​​the heat dissipation fins. Furthermore, due to the embedded structure of the electronic components within the housing, the vertical height of the space within the housing for placing the electronic components can be reduced, thus providing the advantage of facilitating the miniaturization of the electronic device.

[0052] Meanwhile, in this embodiment, a structure for embedding a part of the first electronic component (310) through a groove (130) within the housing (100) is illustrated as an example, but this is not limited thereto. As shown in FIG. 11, the groove for arranging the first electronic component (310) can be implemented through the inner space of a protrusion (135) protruding downward from the lower surface of the housing (100). That is, the vertical length of the protrusion (135) may be the same as the vertical length of the first electronic component (310) or the vertical length of the heat dissipation fin (140). In this case, the lower surface of the protrusion (135) may form a plane identical to the lower surface of the heat dissipation fin (140), and the protrusion (135) and the heat dissipation fin (140) may be arranged to overlap in the horizontal direction.

[0053] An electronic device according to the second embodiment of the present invention will be described.

[0054] FIG. 12 is a perspective view showing the exterior of an electronic device according to a second embodiment of the present invention, FIG. 13 is an exploded perspective view of an electronic device according to a second embodiment of the present invention, FIG. 14 is a drawing showing FIG. 13 from a different angle, FIG. 15 is a perspective view showing the lower surface of a housing according to a second embodiment of the present invention, FIG. 16 is a plan view showing the lower surface of a housing according to a second embodiment of the present invention, and FIG. 17 to 21 are drawings showing the arrangement structure of electronic components from various angles to explain the heat dissipation structure of an electronic device according to a second embodiment of the present invention.

[0055] In this embodiment, other parts are identical to the first embodiment, except for differences in the arrangement structure of the heat dissipation fins and protrusions. Therefore, the characteristic parts of this embodiment will be described below, and for the remaining parts, the description according to the first embodiment will be used.

[0056] Referring to FIGS. 12 to 21, an electronic device (20) according to a second embodiment of the present invention may include a housing (1100), a cover (1200), a substrate (1300), and electronic components (1310, 1330).

[0057] The housing (1100) can form the external shape of the electronic device (20). A space (1102) for accommodating electronic components and a substrate (1300) may be disposed within the housing (1100). For example, the housing (1100) includes a bottom plate (1110) and a side plate (1120) that protrudes upward from the edge of the bottom plate (1110), and the space (1102) may be partitioned from other areas by the upper surface of the bottom plate (1110) and the inner surface of the side plate (1120). The housing (1100) may be formed in a box shape with an open top surface. The housing (1100) may have a rectangular cross-sectional shape. When a cover (1200) is attached to the housing (1100), the upper surface of the space (1102) may be covered.

[0058] A groove (1130) to which a first electronic component (1310), to be described later, is coupled may be disposed on the inner surface of the housing (1100). The groove (1130) may have a shape that is more concave than other areas from the inner surface of the housing (1100). As shown in FIG. 14, the groove (1130) may have a shape that is more concave downward from the upper surface of the bottom plate (1110) than other areas. When a plurality of first electronic components (1310) are provided, the groove (1130) may be provided in a plurality corresponding to the number of first electronic components (1310) and arranged to be spaced apart in the horizontal direction. Here, the horizontal direction may refer to the first direction (X) or the second direction (Y) to be described later.

[0059] A plurality of grooves (1130) in which a plurality of first electronic components (1310) are disposed may each be disposed closer to the edge of the housing (1100) than to the center of the housing (1100). A plurality of grooves (1130) may be disposed adjacent to the side plate (1120). As described above, the housing (1100) may have a rectangular cross-sectional shape. For example, the housing (1100) may include a plurality of long sides and a plurality of short sides facing each other. In this case, a plurality of grooves (1130) may be disposed adjacent to the side plate (1120) disposed in the area forming the short side of the housing (1100) or the side plate (1120) disposed in the area forming the long side of the housing (1100).

[0060] A protrusion (1135, see FIG. 16) may be disposed in an area corresponding to the placement area of ​​the groove (1130) on the outer surface of the housing (1100). The protrusion (1135) may have a shape that protrudes more than other areas from the outer surface of the housing (1100). As shown in FIG. 16, the protrusion (1135) may have a shape that protrudes downward from the lower surface of the bottom plate (1110) than other areas. Accordingly, the lower surface of the housing (1100) may include a plurality of surfaces that are stepped in the vertical direction. For example, as shown in FIG. 17, the lower surface of the housing (1100) may include a first surface (1137) and a second surface that is stepped downward relative to the first surface (1137). The second surface may be the lower surface of the protrusion (1135). The space within the groove (1130), which is the placement area of ​​the first electronic component (1310), can be arranged such that at least a portion overlaps horizontally with the first surface (1137).

[0061] The protrusions (1135) may be provided in multiple numbers corresponding to the number of first electronic components (1310). The multiple protrusions (1135) may be spaced apart in a first direction (X) or a second direction (Y). Between the multiple protrusions (1135), the lower surface of the lower plate (1110) may be disposed.

[0062] A coupling surface (1112) to which a second electronic component (1330), to be described later, is coupled may be disposed on the inner surface of the housing (1100). The coupling surface (1112) may be disposed on the lower plate (1110). When multiple second electronic components (1330) are provided, the coupling surface (1112) may be provided in multiple numbers corresponding to the number of second electronic components (1330) and may be arranged along the horizontal direction. The coupling surface (1112) may have a stepped shape that is higher than the upper surface of the lower plate (1110), but alternatively, it may be disposed to form the same plane as the upper surface of the lower plate (1110).

[0063] A heat dissipation fin (1140) may be disposed on the outer surface of the housing (1100). The heat dissipation fin (1140) may have a shape that protrudes outward from the outer surface of the housing (1100) more than other areas. Heat dissipation can be achieved more easily by increasing the surface area of ​​the housing (1100) through the heat dissipation fin (1140). The area where the heat dissipation fin (1140) is disposed on the surface of the housing (1100) may be named a heat dissipation area (1600, see FIG. 15), and at both ends of the second direction (Y) of the heat dissipation area (1600), a partition (1149) that partitions the heat dissipation area (1600) and the outer area of ​​the electronic device (20) may be disposed. The heat dissipation area (1600) may be disposed between a plurality of partitions (1149).

[0064] The partition (1149) may include a through hole (1149a) penetrating from one side to the other. Air may flow into the heat dissipation area (1600) through the through hole (1149a).

[0065] The heat dissipation fin (1140) may have a shape that protrudes downward from the lower surface of the lower plate (1110). As shown in FIGS. 15 to 17, the heat dissipation fin (1140) may have a plate shape. The heat dissipation fin (1140) may be provided in multiple numbers and arranged along the second direction (Y). Each heat dissipation fin (1140) may have a length direction in the first direction (X).

[0066] The heat dissipation fins (1140) may be arranged to overlap with the electronic components (1310, 1330) in the vertical direction. For example, the heat dissipation fins (1140) may include a first heat dissipation fin (1144) that overlaps with the first electronic component (1310) in the vertical direction, and a second heat dissipation fin (1142) that overlaps with the second electronic component (1330) in the vertical direction.

[0067] The first heat dissipation fin (1144) may be arranged to overlap with the protrusion (1135). The first heat dissipation fin (1144) may have a shape that protrudes outward from the outer surface of the protrusion (1135). Based on a single protrusion (1135), the first heat dissipation fin (1144) may be provided in multiple numbers and arranged spaced apart along the second direction (Y). The first heat dissipation fin (1144) may have a shape that protrudes downward from the lower surface of the protrusion (1135). The first heat dissipation fin (1144) may have a shape that protrudes horizontally from the side of the protrusion (1135). The area of ​​the first heat dissipation fin (1144) that protrudes downward from the lower surface of the protrusion (1135) can be named the first part (1144a, see FIG. 15), and the area that protrudes horizontally from the side of the protrusion (1135) can be named the second part (1144b). As the protrusion (1135) is provided in multiple numbers, the spacing between the first heat dissipation fins (1144) placed at the ends of each of the two adjacent protrusions (1135) may be greater than the spacing between the multiple first heat dissipation fins (1144) placed on a single protrusion (1135).

[0068] In other words, a heat dissipation area through a plurality of first heat dissipation fins (1144) arranged based on a single protrusion (1135) can be named a first area (1620). The second direction (Y) spacing between the plurality of first heat dissipation fins (1144) arranged in the first area (1620) may be greater than the second direction (Y) spacing between the plurality of first areas (1620). The second direction (Y) spacing between the plurality of first heat dissipation fins (1144) arranged in the first area (1620) may be greater than the first direction (X) spacing between the plurality of first areas (1620). Accordingly, a channel (1710, see FIG. 16) through which air flows may be formed between the mutually opposing sides of adjacent protrusions (1135).

[0069] The second heat dissipation fin (1142) may have a shape that protrudes downward from the lower surface of the lower plate (1110). The second heat dissipation fin (1142) may be arranged to overlap with the second electronic component (1330) in the vertical direction. The heat dissipation area through the second heat dissipation fin (1142) may be named the second area (1610). The second area (1610) may be arranged spaced apart from the first area (1620) in the first direction (X) or the second direction (Y).

[0070] The through hole (1149a) of the partition (1149) may be arranged to overlap horizontally with the horizontal separation area between the first area (1620) and the second area (1610). For example, as shown in FIG. 15, the through hole (1149a) may be arranged to overlap in the second direction (Y) with the first direction (X) separation area between the first area (1620) and the second area (1610). Accordingly, outside air may flow into the area between the plurality of heat dissipation fins (1140) through the through hole (1149a), thereby increasing the heat dissipation efficiency.

[0071] The lower surface of the first heat dissipation fin (1144) and the lower surface of the second heat dissipation fin (1142) can form the same plane. Accordingly, the vertical length of the first heat dissipation fin (1144) protruding from the lower surface of the protrusion (1135) may be shorter than the vertical length of the second heat dissipation fin (1142).

[0072] As illustrated in FIGS. 14 and 15, a fan (1450) may be placed in the heat dissipation area (1600). The fan (1450) may be attached to the heat dissipation area (1600) through a bracket (1460) attached to the lower surface of the lower plate (1110). The fan (1450) may be placed to overlap the first area (1620) and the second area (1610) in the first direction (X). The fan (1450) may discharge air into the heat dissipation area (1600). As illustrated in FIG. 15, the air discharged from the fan (1450) may pass through the second area (1610) and the first area (1620) sequentially. In this case, the air flow may be smooth through the spaced-apart spaces between the plurality of second areas (1610) and the spaced-apart spaces between the plurality of first areas (1620). As illustrated in FIG. 16, the second region (1610) is arranged to overlap with the area between the plurality of first regions (1620) in the first direction (X), and air passing between the plurality of second heat dissipation fins (1142) within the second region (1610) can be discharged to the outside of the heat dissipation region (1600) through the plurality of first heat dissipation fins (1144) or the plurality of first regions (1620).

[0073] Meanwhile, between the plurality of heat dissipation fins (1140) and between the first region (1620) and the second region (1610), a reinforcing member (1149, see FIG. 15) that interconnects the plurality of heat dissipation fins (1140) is disposed, so that the strength of each of the plurality of heat dissipation fins (1140) can be reinforced.

[0074] The description of the cover (1200) and inner cover (1250) inside the electronic device (20) according to the present embodiment is to be based on the description of the cover (200) and inner cover (250) inside the electronic device (10) according to the first embodiment.

[0075] The electronic device (20) may include a substrate (1300). The substrate (1300) may be a printed circuit board (PCB). The substrate (1300) is formed in a plate shape, and a plurality of components for driving the electronic device (20) may be disposed on the upper or lower surface. The substrate (1300) may be disposed in a space (1102) within a housing (1100).

[0076] The substrate (1300) may be electrically connected to electronic components (1310, 1330). The electronic components (1310, 1330) may include a first electronic component (1310) and a second electronic component (1330). The first electronic component (1310) may include an inductor for obtaining inductance or a transformer for voltage conversion. The first electronic component (1310) may include a core and a coil wound on the outer surface of the core. The coil may extend outward from the core and be electrically connected to the substrate (1300). The second electronic component (1330) may include an FET element. The second electronic component (1330) may be mounted on the lower surface of the substrate (1300) facing the lower plate (1110). The first electronic component (1310) and the second electronic component (1330) can each generate heat by driving. The first electronic component (1310) and the second electronic component (1330) can each be provided in multiple quantities.

[0077] Each of the plurality of first electronic components (1310) can be coupled to the groove (1130). As shown in FIG. 18, when the first electronic components (1310) are coupled within the groove (1130), at least a portion of the first electronic components (1310) may be arranged to overlap with the first surface (1137) of the lower surface of the housing (1100) in the first direction (X). The first electronic components (1310) may be arranged to overlap with the first heat dissipation fin (1144) in the vertical direction. At least a portion of the first electronic components (1310) may be arranged to overlap with the second heat dissipation fin (1142) in the horizontal direction. Accordingly, heat generated by the operation of the first electronic components (1310) is dispersed in the vertical direction through the first heat dissipation fin (1144), thereby improving heat dissipation efficiency. In addition, as described above, since the first heat dissipation fin (1144) has a shape in which at least a portion protrudes horizontally from the side of each protrusion (1135), the heat generated by the operation of the first electronic component (1130) can also be dispersed in the horizontal direction.

[0078] When the first electronic component (1310) is coupled within the home (1130), the first electronic component cover (1320) is coupled to the bottom plate (1110) to cover the upper surface of the first electronic component (1310). The first electronic component cover (1320) includes a hole through which the coil of the first electronic component (1310) passes, and the coil of the first electronic component (1310) can be connected to the substrate (1300) by passing through the hole of the first electronic component cover (1320). Through the first electronic component cover (1320), the generation of electrical noise between the first electronic component (1310) and other electronic components can be minimized.

[0079] The second electronic component (1330) may be mounted on the lower surface of the substrate (1300). The second electronic component (1330) may be placed on the bonding surface (1112) of the housing (1100). A heat dissipation pad (1340) may be placed between the bonding surface (1112) and the second electronic component (1330). The heat dissipation pad (1340) is provided with a material having excellent thermal conductivity so that heat generated by the operation of the second electronic component (1330) can be easily conducted to the housing (1100).

[0080] The second electronic component (1330) can be arranged to overlap the heat dissipation fin (1140) in the vertical direction. The second electronic component (1330) can be arranged to overlap the second heat dissipation fin (1142) in the vertical direction. Accordingly, heat generated by the operation of the second electronic component (1330) can be easily dissipated through the heat dissipation pad (1340) and the second heat dissipation fin (1142) of the housing (1100).

[0081] The electronic device (20) may include a fan (1450). The fan (1450) may be placed on the lower surface of the housing (1100), which is the placement area of ​​the heat dissipation fin (1140). The fan (1450) may be placed facing the heat dissipation fin (1140) in a first direction (X). The fan (1450) may discharge air in the first direction (X) toward the heat dissipation fin (1140). The fan (1450) may be provided in multiple numbers and arranged along a second direction (Y). As shown in FIG. 19, the air discharged from the fan (1450) may pass through a second area (1610), which is the placement area of ​​the second heat dissipation fin (1142), and a first area (1620), which is the placement area of ​​the first heat dissipation fin (1144). Accordingly, heat dissipation efficiency can be improved due to the structure placed on the air flow path generated from the fan (1450).

[0082] The electronic device (20) may include a lower cover (1410, 1440, see FIG. 13). The lower cover (1410, 1440) may be coupled to the lower surface of the housing (100). By coupling the lower cover (1410, 1440), the lower surface of the heat dissipation area (1600), which is the placement area of ​​the heat dissipation fins (1140), may be covered. The lower cover (1410, 1440) may include a plurality of lower plates (1420, 1440) and a side plate (1430). The side plate (1430) may be formed as one body with one of the plurality of lower plates (1420, 1440). A plurality of bottom plates (1420, 1440) are arranged to cover the lower surface of the heat dissipation area (1600), and a side plate (1430) may be coupled to the side of the housing (1100) to cover the side of the protrusion (1135) or the area between the plurality of protrusions (1135). At least one of the bottom plates (1420, 1440) or the side plate (1430) includes a hole for discharging air that has passed through the heat dissipation area (1600) to the outside, and the air discharged from the fan (1450) may pass through the second area (1610) and the first area (1620) sequentially and be discharged to the outside.

[0083] According to the embodiment, the vertical overlapping structure between the heat dissipation fins and the electronic components has the advantage that the driving heat of the electronic components can be easily radiated to the outside through the heat dissipation fins. In addition, due to the vertical and horizontal overlapping structure between the electronic components and the plurality of heat dissipation fins, the driving heat of each of the plurality of electronic components can be dissipated in various directions through the placement area of ​​the heat dissipation fins. In particular, compared to the first embodiment, there is an advantage that air flow can be smoothly facilitated as an air flow path is formed through the horizontal spacing between the plurality of protrusions, and heat can also be dissipated through the sides of each of the plurality of protrusions.

[0084] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0085] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

Claim 1 An electronic device comprising: a housing having a first heat dissipation fin disposed on its outer surface; a substrate disposed within the housing; and a first electronic component disposed within the housing and connected to the substrate, wherein a concave groove is disposed on the inner surface of the housing, and a protrusion is disposed on the outer surface of the housing in an area that overlaps vertically with the area forming the groove, at least a portion of the first electronic component is coupled to the groove, and the first heat dissipation fin has a shape protruding from the surface of the protrusion, wherein the groove and the first electronic component are provided in a plurality and are spaced apart along the horizontal direction, and the protrusions are provided in a plurality corresponding to the number of grooves and are spaced apart along the horizontal direction, and a channel through which air flows is formed between the plurality of protrusions. Claim 2 An electronic device according to claim 1, comprising a second electronic component disposed on the surface of the substrate, and having a second heat dissipation fin disposed on the outer surface of the housing that overlaps the second electronic component in an upward and downward direction. Claim 3 An electronic device according to claim 2, wherein the outer surface of the housing includes a first surface and a second surface that are stepped in the vertical direction, the second heat dissipation fin is disposed on the first surface, and the first heat dissipation fin is disposed on the second surface. Claim 4 In claim 3, the first electronic component is an electronic device in which at least a portion of it overlaps with the first surface in a horizontal direction. Claim 5 An electronic device according to claim 3, wherein the first heat dissipation fin and the second heat dissipation fin are each disposed on the lower surface of the housing, and the vertical length of the first heat dissipation fin is shorter than the vertical length of the second heat dissipation fin. Claim 6 An electronic device according to claim 1, wherein the first heat dissipation fin is disposed on the lower surface of the housing, the groove is disposed adjacent to one side of the housing, and the housing includes a third heat dissipation fin protruding from the one side. Claim 7 An electronic device according to claim 2, wherein the first heat dissipation fin and the second heat dissipation fin have a plate shape having a longitudinal direction in the second direction, and the first heat dissipation fin and the second heat dissipation fin are each provided in a plurality and arranged spaced apart along a first direction perpendicular to the second direction. Claim 8 An electronic device according to claim 7, comprising a fan disposed at one end of the first heat dissipation fin and the second heat dissipation fin to discharge air in the second direction. Claim 9 An electronic device according to claim 8, wherein the spacing between the first heat dissipation fin and the second heat dissipation fin is greater than the spacing between the plurality of first heat dissipation fins or the spacing between the plurality of second heat dissipation fins. Claim 10 In claim 9, the fan is an electronic device in which at least a portion overlaps the area between the first heat dissipation fin and the second heat dissipation fin and the second direction. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 An electronic device according to claim 1, comprising a second electronic component disposed on the surface of the substrate, wherein a second heat dissipation fin is disposed on the outer surface of the housing and overlaps the second electronic component in an up-and-down direction, and at least a portion of the plurality of second heat dissipation fins overlaps the second direction separation area between the plurality of protrusions and the first direction perpendicular to the second direction. Claim 15 An electronic device according to claim 14, comprising a fan disposed on the surface of the housing and discharging air toward the first heat dissipation fin and the second heat dissipation fin. Claim 16 In claim 15, the first heat dissipation fin is an electronic device positioned behind the second heat dissipation fin based on the direction of air flow discharged from the fan. Claim 17 An electronic device according to claim 16, comprising a partition portion disposed on the outside of the first heat dissipation fin and the second heat dissipation fin on the housing to guide the flow of air. Claim 18 An electronic device according to claim 17, wherein through holes are disposed in the area between the first heat dissipation fin and the second heat dissipation fin and in the partition portion that overlaps in the second direction. Claim 19 An electronic device according to claim 2, comprising a heat dissipation pad disposed between the second electronic component and the inner surface of the housing. Claim 20 In paragraph 2, the vertical length of the protrusion is the same as the vertical length of the first heat dissipation fin.

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