Test array for wirelessly testing an angled device under test using a carrier structure with an opening

Abstract

The present invention relates to a test array for wirelessly testing an angular device under test, wherein the test array comprises a carrier structure and a socket for the device under test coupled to the carrier structure. The socket for the device under test is configured to establish electrical contact with an inner surface of the angular device under test or with a connector disposed on the inner surface of the angular device under test. The carrier structure includes an opening that extends perpendicularly to the outer surface of a first outer surface of the angular device under test in a direction away from the socket of the device under test.

Description

Technology Field

[0001] An embodiment according to the present invention relates particularly to a test array for wireless testing using a carrier structure having an opening.

[0002] An embodiment according to the present invention relates to a socket for wireless testing of an L-shaped antenna in a package module equipped with automated test equipment. Background Technology

[0003] Test arrays can be used to test devices under test (e.g., antenna-in-package devices) capable of receiving and / or emitting electromagnetic radiation. Typically, the device under test has a flat shape with two opposing surfaces so that it can be mounted, for example, into a device under test socket (e.g., an Over-the-Air (OTA) socket for near-field testing of an antenna-in-package device), with one surface facing the device under test socket and the other facing away from the device under test socket. For example, the device under test can be positioned so that the surface containing the device under test's antenna faces away from the device under test socket.

[0004] However, the shape of the device under test may not be flat. For example, the device under test may have an angular shape, such as an L-shape. Additionally, the angular device may be configured to emit and / or receive electromagnetic radiation on at least one external surface. For example, the angular device under test may have one or more antenna arrays (or other antennas) on one or two external surfaces. Consequently, the flexibility regarding the available orientation of the external surfaces of the device under test may be reduced. For example, to align the angular test device in a socket, a specific orientation may be required to match the shape. Furthermore, if one external surface is oriented away from the carrier structure supporting the socket, the other external surface may need to be oriented at an angle relative to the carrier structure. However, the carrier structure may cause interference with the electromagnetic radiation received and / or emitted from the external surfaces. Interference may increase if the external surfaces are oriented at an angle relative to the carrier structure.

[0005] Angled devices under test may experience difficulties in terms of interference with the device's orientation and carrier structure, which can affect test efficiency, accuracy, and reproducibility.

[0006] Therefore, a test array is needed to improve the balance between test efficiency, accuracy, and reproducibility.

[0007] Embodiments of the present invention relate to a test array for wirelessly testing an angular (e.g., L-shaped) device under test (e.g., an L-shaped antenna package device under test), wherein the test array comprises a carrier structure (e.g., a PCB test fixture or a load board), and the test array comprises a socket under test coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly or coupled with an extender assembly and / or a PCB interposer between the carrier structure and the socket under test), and the socket under test is configured to establish electrical contact with an inner surface of the angular (e.g., L-shaped) device under test (e.g., an inner surface of the angular device under test opposite to a second outer surface of the angular device under test) or a connector arranged on the inner surface of the angular (e.g., L-shaped) device under test, wherein the carrier structure (e.g., a test fixture PCB or a load board) is far from the socket of the device under test in the direction of the outer surface vertical line of the first outer surface of the angular device under test (e.g., the main radiation of the antenna structure on the first outer surface of the device under test). It includes an opening (e.g., a hole or cutout) that extends in the direction away from the device socket being tested.

[0008] A socket for the device under test enables the device under test to be coupled with a test array. Additionally, electrical contact enables the transmission of at least one electrical power, one or more control signals, one or more measurement signals, or generally one or more electrical or optical signals between the test array and the device under test coupled to the socket for the device under test.

[0009] An opening in the carrier structure reduces interference from electromagnetic fields emitted or received by the device under test (when coupled to the device socket under test). Since the opening extends perpendicularly to the first outer surface of the angled device under test, interference with electromagnetic fields emitted or received from the first outer surface of the angled device under test is reduced. Consequently, flexibility in selecting the orientation of the first outer surface is increased. Furthermore, the opening may be configured to receive at least some of the device socket under test, the device under test, and the antenna structure for testing the first outer surface. Thus, at least some of the electromagnetic wave transmission between the first outer surface and the antenna structure may occur within the opening (thus reducing interference). Furthermore, it should be noted that this arrangement allows for the implementation of a test array with a small structural height. For example, by providing an opening in the carrier structure, there is no need to have a large gap between the device under test and the carrier structure. Rather, the device under test may be placed close to the plane of the carrier structure or may reach the plane of the carrier structure. Therefore, this design is particularly advantageous in situations where the spacing between the carrier structure and the handler is very limited. Furthermore, this array is highly suitable for testing a device under test with two antennas on two sides, as an antenna substantially parallel to the carrier structure can be positioned closer to the carrier structure compared to conventional socket arrays, leaving more space between the device antenna under test and the associated test antenna without increasing the required height of the entire array including the test antenna. Another antenna that can be substantially perpendicular to the carrier structure can still be well tested, as the opening of the carrier structure is positioned next to the main radiation direction of the additional antenna or the main radiation direction of the additional antenna, thereby reducing falsification of the measurement results.

[0010] In conclusion, this test array provides excellent accuracy by reducing the influence of the carrier structure, while enabling wireless testing of angular devices using a relatively small space.

[0011] The test array can be used for short-range testing, for example, for antenna-in-package devices. The test array can be used to test electromagnetic waves in the 5G frequency band.

[0012] According to one embodiment, the socket of the device under test is configured to accommodate the angular device under test, so that the surface vertical line of the first outer surface of the angular (e.g., L-shaped) device under test is parallel to the surface (e.g., main surface) of the carrier structure (e.g., load board) within a tolerance of + / - 15 degrees.

[0013] Therefore, the first outer surface can receive and / or emit electromagnetic waves in a direction arranged mainly parallel to the surface of the carrier structure. Consequently, interference in the carrier structure is reduced by the opening of the carrier structure and varies less along the transmission path of the electromagnetic waves. Furthermore, this direction allows the second outer surface to move away from the carrier structure, thereby reducing interference on the second outer surface as well.

[0014] According to an embodiment, the device socket under test is configured to place the angular device under test, such that a second outer surface of the angular (e.g., L-shaped) device under test (e.g., a surface including a radiation structure) is positioned away from a carrier structure (e.g., a load board), and the surface vertical line of the second outer surface of the angular (e.g., L-shaped) device under test is perpendicular to the surface of the carrier structure (e.g., a load board), and is positioned within a tolerance of + / - 15 degrees.

[0015] The second outer surface is essentially positioned away from the carrier structure, thereby reducing interference with the carrier structure. Furthermore, the test antenna can be efficiently positioned and aligned on the opposite side of the second outer surface.

[0016] According to one embodiment, the opening is a hole that penetrates the entire thickness of the carrier structure.

[0017] Therefore, the opening realizes a through hole to further reduce interference. For example, by using a hole that passes through the entire thickness of the carrier structure, the device under test can be positioned in such a way that radiation from the first outer surface (or a significant lobe of the antenna located on the first outer surface of the device under test) extends into the plane of the carrier structure (at least the area of ​​the carrier structure where the opening is located). Thus, in some cases, the device under test may extend into the hole of the carrier structure. This enables a very compact test array. On the other hand, accurate measurement results can be obtained even when a significant lobe of the antenna located on the first outer surface of the device under test (e.g., a main lobe or a strong side lobe) or a significant near-field component extends into the plane of the carrier structure.

[0018] Additionally, the opening may provide access (e.g., in a routeable form for one or more electrical cables) to a device (e.g., a signal source and / or a signal receiver) located on the side of the carrier structure facing away from the socket of the device under test.

[0019] According to one embodiment, the extension of the opening in the direction perpendicular to the outer surface of the first outer surface of the angled device under test (e.g., in a direction away from the socket of the device under test in the main radiation direction of the antenna structure on the first outer surface of the device under test) is at least two wavelengths, at least three wavelengths, or at least four wavelengths (e.g., free space wavelengths or wavelengths of the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest frequency of the angled device under test (e.g., the lowest frequency of the antenna-in-package (AiP) module constituting the device under test or included in the device under test).

[0020] It has been found that interference with the carrier structure is significantly reduced if there is an opening of the dimensions defined above. The propagation of electromagnetic waves within the opening can be improved. For example, the opening may cover the entire near-field area (or at least 60% or at least 80% of the near-field area) of an antenna arranged on the first outer surface of the device under test and / or a portion of the far-field area of ​​the antenna arranged on the first outer surface of the device under test (e.g., a distance of 2D from the antenna). 2 If it is greater than / λ, where D is the hardness or diameter of the antenna, it may also cover. Therefore, the distortion of the antenna characteristics of the antenna arranged on the first outer surface of the device under test due to the presence of the aperture can be reduced by the carrier structure.

[0021] According to one embodiment, the extension of the opening in a direction perpendicular to the outer surface vertical line of the first outer surface of the angled device under test (e.g., the width of the opening in a direction parallel to the first outer surface) is greater than the extension of the radial structure on the first outer surface of the device under test (or greater than twice the extension of the radial structure, or greater than three times the extension of the radial structure), or the extension of the opening in a direction perpendicular to the outer surface vertical line of the first outer surface of the angled device under test (e.g., the width of the opening in a direction parallel to the first outer surface) is greater than the extension of the device under test (or greater than twice the extension of the device under test, or greater than three times the extension of the device under test).

[0022] Because the extension of the opening (e.g., lateral extension or "width") is larger than the radiating structure or the device under test, interference from the wall of the opening at the end of the extension can be reduced. For example, by selecting an appropriately large extension of the opening, the opening can cover the entire near-field area (or at least 60% or at least 80% of the near-field area) of the antenna placed on the first outer surface of the device under test. Thus, the distance between the device under test and the carrier structure plane is small, or even if the device under test reaches the carrier structure plane, the influence of the carrier structure can be kept small.

[0023] According to an embodiment, the expansion of the opening is selected such that the distance between the edge of the angled device under test or the edge of the antenna package device and the carrier structure is at least one wavelength (e.g., free space wavelength or wavelength of the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test (e.g., at the lowest operating frequency of an AiP (Antenna-in-Package) module constituting the device under test or included in the device under test) (where there is no material of the carrier structure within a one-wavelength distance from the edge of the angled device under test or the edge of the antenna package device).

[0024] It has been recognized that effects on the emission and / or reception of one or more antennas that can be placed on the first outer surface and may be caused by the carrier structure (e.g., beamforming, reflection, standing wave formation, and interference) are significantly reduced at this distance. Furthermore, this distance can be easily provided by providing an opening in the carrier structure, while keeping the dimensions of the test array significantly small.

[0025] According to one embodiment, the device socket under test is configured such that when the device under test is inserted into the device socket under test, at least a portion of the device under test is located in the opening (e.g., the location of the device under test in the test socket extends into the opening).

[0026] Using this arrangement allows the size of the test array to be kept reasonably small, and the device under test is positioned in an area where interference with the carrier structure is sufficiently small.

[0027] According to one embodiment, the device socket under test is configured such that the device socket under test extends into an opening (for example, the device location under test of the device socket under test extends into an opening).

[0028] Therefore, the device socket under test allows the device under test to be inserted relatively deeply into the opening. Consequently, the device socket under test offers greater compatibility with various device sizes and provides more options for positioning the device under test within the opening. Additionally, this method enables a relatively small structural height, allowing the test array to be used without performance degradation even when there is a small gap between the handler and the device socket under test.

[0029] According to one embodiment, the test array includes a first antenna or antenna structure (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)) configured to receive a signal radiated from a first outer surface of an angled device being tested or configured to emit a signal received from a first outer surface of an angled device.

[0030] The first antenna or antenna device enables the establishment of a wireless connection with the device under test at the device socket under test. Thus, the first antenna or antenna structure enables the device under test to be tested. The device socket under test orients the device under test in a defined manner so that the first antenna or antenna structure can be accurately oriented with respect to the angled device under test. An opening in the carrier structure allows a relatively undistorted wireless connection between the antenna on the first outer surface of the device under test and the first antenna or antenna structure.

[0031] According to an embodiment, the test array comprises a first antenna or antenna structure (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)), wherein the hole of the first antenna or antenna structure is positioned at a certain distance from a first outer surface of an angled device under test so that a surface vertical line of the first outer surface of the angled device under test passes through the hole of the first antenna or antenna structure (at least when a second antenna or antenna structure is positioned in an operating position).

[0032] It has been recognized that a preferred design of the socket for the device under test can accommodate the device under test such that a surface vertical line of the first outer surface of the device under test passes through a hole in the first antenna or antenna structure. The first outer surface (or the antenna structure of the first outer surface of the device under test) may be configured to emit and / or receive (e.g., via beamforming) such that the main lobe is oriented perpendicular to the first outer surface. Thus, by arranging the socket for the device under test and the first antenna such that a surface vertical line of the first outer surface of the device under test passes through a hole in the first antenna or antenna structure, wireless communication between the device under test and the first antenna or antenna structure, or generally wireless testing of the device under test using the first antenna or antenna structure, can be improved.

[0033] According to one embodiment, the first antenna or antenna structure is arranged at least partially in an opening (e.g., an open area surrounded by a carrier structure; e.g., a plane of the carrier structure).

[0034] The opening can be extended in a direction perpendicular to the surface of the carrier structure so that the first antenna structure can be arranged. Thus, the carrier structure is compatible with other first antenna structures. Additionally, if the device under test is placed at least partially inside the opening, the transmission path between the first antenna structure and the device under test can be arranged at least partially inside the opening. As a result, the reduced configuration height of the test array can be reduced without significantly degrading the test results.

[0035] According to one embodiment, the radiation hole of the first antenna or antenna structure is arranged at least partially in an opening (e.g., an open area surrounded by a carrier structure, e.g., a plane of the carrier structure).

[0036] This arrangement of radiation holes allows electromagnetic waves emitted and / or received from the radiation holes to travel at least partially within the openings. Consequently, the gap between the carrier structure and the handler can be kept small, and distortion caused by the handler (which can move at a certain distance from the carrier structure) can be kept within acceptable limits.

[0037] According to one embodiment, the first antenna or antenna structure is mounted to have a fixed position relative to the device socket under test.

[0038] These fixed positions allow for the repetitive combination and testing of multiple angled devices of the device under test, so that the multiple angled devices of the device under test have the same or similar geometric relationship with the first antenna or antenna structure. As a result, the accuracy and reproducibility of the test can be improved.

[0039] According to one embodiment, the first antenna or antenna structure is mechanically attached to the arm of a handler (configured to insert the angled device under test into the socket of the device under test), so that the first antenna or antenna structure is movable (wherein, when the handler presses the angled device under test into the test socket, the first antenna or antenna structure is at least partially aligned in the opening).

[0040] The arm allows the first antenna or antenna structure to move, thereby enabling the removal of the first antenna or antenna structure (e.g., to more easily connect the device under test to the device under test socket) or the readjustment of the first antenna or antenna structure. If the handler is configured to insert the angled device under test into the device under test socket, the handler facilitates the connection and positioning of the first antenna or antenna structure while connecting the angled device under test to the device under test socket. For example, the first antenna or antenna structure may be in a fixed positional relationship with a pressurizer that presses the device under test into the device under test socket. For example, the pressurizer may be directly connected to the first antenna or antenna device. Thus, a very stable and well-reproducible positional alignment can be achieved between the first antenna or antenna structure and the device under test.

[0041] According to one embodiment, when a handler places the first antenna or antenna structure in an operating position (or equivalently, when the handler inserts the angled device under test into a test socket or when the handler presses the device under test into a test socket), the first antenna or antenna structure is configured to be connected to a signal source and / or a signal receiver through a blind-coupled microwave connection (e.g., a blind-coupled (hollow) waveguide connection).

[0042] The signal source causes the first antenna or antenna structure to emit a signal (e.g., to be received by the antenna array of the angular device under test) and / or the signal receiver to evaluate the received signal (e.g., emitted by the antenna or antenna array of the angular device under test and received by the first antenna or antenna structure), thus facilitating testing of the angular device under test for both the signal source and the signal receiver. A blindly coupled microwave connection facilitates coupling (e.g., manual and / or automatic) between the signal source and / or signal receiver and the first antenna or antenna structure. Thus, efficient testing is possible even in a configuration where the first antenna or antenna structure is movable (as described above).

[0043] According to one embodiment, the test array comprises a second antenna or antenna structure (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)) configured to receive a second outer surface of the angled device under test or a signal radiated from the second outer surface, and / or a second antenna or antenna structure configured to emit a signal to be received from the second outer surface of the angled device under test (at least when the second antenna or antenna structure is placed in an operating position) (or equivalently when a handler inserts the angled device under test into a test socket or when a handler presses the device under test into the test socket).

[0044] The 2nd An antenna or antenna structure enables testing of the antenna structure on a second outer surface of the device under test. The second antenna or antenna structure benefits from the orientation of the second outer surface defined by the socket of the device under test. The first and second antennas or antenna structures can perform testing of the device under test using signals emitted and / or received by the antennas or antenna structures on the first and second outer surfaces of the device under test (e.g., simultaneously or sequentially) without the need to reassemble the angled device under test in a different orientation (e.g., at a different socket of the device under test). Thus, high test throughput can be achieved.

[0045] According to one embodiment, the test array comprises a second antenna or antenna structure (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)), wherein the hole of the second antenna or antenna structure is positioned at a certain distance from the second outer surface of the angled device under test so that a surface vertical line of the second outer surface of the angled device under test passes through the hole of the second antenna or antenna structure (at least when the second antenna or antenna structure is positioned in an operating position) (or equivalently, when a handler inserts the angled device under test into a test socket or when a handler presses the device under test into a test socket).

[0046] It has been recognized that a preferred design of the socket for the device under test can accommodate the device under test such that a surface vertical line of the second outer surface of the device under test can pass through a hole in the second antenna or antenna structure. The second outer surface (or the antenna structure on the second outer surface of the device under test) may be configured to emit and / or receive such that the main lobe is oriented perpendicular to the second outer surface (e.g., via beamforming). Thus, by arranging the socket for the device under test and the second antenna or antenna structure so that a surface vertical line of the second outer surface of the device under test passes through a hole in the second antenna or antenna structure, wireless communication between the device under test and the second antenna or antenna structure, or generally wireless testing of the device under test using the second antenna or antenna structure, can be improved.

[0047] According to one embodiment, the second antenna or antenna structure is mechanically attached to the arm of a handler (configured to insert and / or press the angled device under test into the socket of the device under test), so that the second antenna or antenna structure is movable. For example, the first and second antennas or antenna structures may be attached to the same or common handler, or each may be attached to an individual handler.

[0048] The arm allows the second antenna or antenna structure to move, enabling the removal of the second antenna or antenna structure (e.g., to more easily connect the angled device under test to the device socket under test) or the readjustment of the second antenna or antenna structure. If the handler is configured to insert the angled device under test into the device socket under test, the handler facilitates the connection and positioning of the first antenna or antenna structure while connecting the angled device under test to the device socket under test. For a common handler, the first and second antenna structures may be arranged in a predetermined direction to facilitate the orientation of the first and second antenna structures relative to the first and second outer surfaces. For a separate arm, a user-defined orientation of the first and second antenna structures is possible. Additionally, the pressurizer that presses the second antenna or antenna structure and the device under test into the device socket under test may be in a fixed positional relationship. Thus, the relative position between the device under test and the second antenna or antenna structure can be very accurate and well repeatable, which improves test repeatability. For example, a pressurizer that pressurizes the device under test into the device socket under test can be directly (mechanically) connected to a second antenna or antenna structure, which provides particularly good accuracy.

[0049] According to one embodiment, the second antenna or antenna structure is part of a pressurizer for pressing the angled device under test into the device socket under test, or the second antenna or antenna structure is configured to move together with the pressurizer for pressing the angled device under test into the device socket under test (wherein, for example, the pressurizer is arranged so that the pressurizer or part of the pressurizer is between the second antenna or antenna structure and the second outer surface of the angled device when the device under test is inserted into the device socket under test) (and wherein, for example, the pressurizer is arranged so that the pressurizer or part of the pressurizer is between the first antenna or antenna structure and the first outer surface of the angled device when the angled device under test is inserted into the device socket under test).

[0050] Therefore, the second antenna or antenna structure can move together with the pressurizer and thus move (e.g., to more easily connect the angled device under test to the socket of the device under test) or readjust (e.g., its direction). Since the pressurizer is configured to press the angled device under test into the socket of the device under test, the pressurizer facilitates the connection and positioning of the second antenna or antenna structure while connecting the angled device under test to the socket of the device under test. Using this arrangement allows for good positional accuracy. Furthermore, mechanical collision between the pressurizer and the second antenna or antenna structure can be reliably avoided.

[0051] According to an embodiment, the second antenna or antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-coupled microwave connection (e.g., a blind-coupled (hollow) waveguide connection) when the handler places the second antenna or antenna structure in an operating position (or equivalently, when the handler inserts the angled device under test into a test socket, or when the handler presses the device under test into a test socket).

[0052] The signal source causes the second antenna or antenna structure to emit a signal (e.g., to be received by the antenna array of the angular device under test) and / or the signal receiver to evaluate the received signal (e.g., emitted by the antenna or antenna array of the angular device under test and received by the second antenna or antenna structure), thereby facilitating testing of the angular device under test for both the signal source and the signal receiver. A blindly coupled microwave connection can facilitate coupling (e.g., manual and / or automatic) between the signal source and / or signal receiver and the second antenna or antenna structure. Thus, efficient testing is possible even in a configuration where the second antenna or antenna structure is movable (as described above).

[0053] According to one embodiment, the socket of the device under test includes an angled recess or an angled removal configured to support and / or align the device under test. Side walls may be present at one or both ends of the angled recess or angled removal.

[0054] The angled recess or angled removal each has two (or more) contact surfaces (e.g., angles) that can make contact with the first and second outer surfaces of the device under test. These contact surfaces can realize a predetermined orientation and / or position of the angled device under test (at least partially). The predetermined orientation and / or position of the angled device under test can help establish electrical connections and improve the reproducibility and accuracy of the test. One or more optional sidewalls may further restrict lateral movement of the angled device under test, but generally allow for smooth insertion of the device under test into the device socket under test with good guidance.

[0055] According to one embodiment, the socket of the device under test includes one or more coaxial pogo pins (which may extend from the lower surface of the socket of the device under test in contact with a PCB test fixture or load board to the upper surface of the socket of the device under test in contact with a second inner surface of the angled device under test) to establish an electrical connection between the PCB test fixture or load board and the angled device under test (wherein, for example, a first end of the coaxial pogo pin may contact a pad of the PCB test fixture or load board, and wherein, for example, a second end of the coaxial pogo pin may contact a pad of the angled device under test or a connector of the angled device under test).

[0056] Pogo pins are generally pressed for use and enable the device socket under test to establish stable electrical contact with the device under test when the device under test is coupled to the device socket under test (e.g., when a handler / pressurizer presses into the device socket under test). For example, a coaxial spring (or spring-loaded pin) enables high-frequency interconnection to the device socket under test.

[0057] According to an embodiment, the test array comprises at least two sockets of devices under test (e.g., two identical devices under test) configured to support each angular device under test, wherein the at least two sockets of devices under test are positioned to set the location of each angular device under test (e.g., back-to-back so that the first outer surface of each angular device under test is aligned in the opposite (avoidance) direction).

[0058] A test array having at least two sockets for devices under test enables testing multiple devices under test at once (e.g., simultaneously or sequentially; e.g., within one cycle after a handler places a device under test into a socket for devices under test). Additionally, since each first outer surface of each angled device under test is aligned in an opposite (avoiding) direction, interference between signals emitted and / or received from each first outer surface is reduced.

[0059] According to one embodiment, the test array comprises at least two rows (e.g., parallel rows) of device sockets under test, wherein the device sockets under test are configured to support each angular device under test, and at least two rows of device sockets under test are arranged to position each angular device under test (e.g., back-to-back; for example, the sides of the device sockets under test where the first outer surface of the device under test is located are arranged in an avoidance direction relative to each other), and each first outer surface of each angular device under test is aligned in an opposite (avoidance) direction.

[0060] This arrangement improves the trade-off between arranging multiple devices under test at increased density and reducing interference between signals emitted or received from each first outer surface.

[0061] According to an embodiment, the carrier structure comprises at least two openings and a solid intermediate section (e.g., a solid bar) between them, wherein two or more sockets of a device under test are arranged in the solid intermediate section between the openings, and one or more of the device under test positions among the sockets of the device under test are aligned toward the first opening of the at least two openings, and one or more of the device under test positions among the sockets of the device under test are aligned toward the second opening of the at least two openings (so that the devices under test inserted into the two sockets of the device under test in the solid intermediate section arranged back-to-back are aligned toward different openings).

[0062] This arrangement improves the trade-off between arranging multiple devices under test at increased density and reducing interference between signals emitted and / or received from each first outer surface. Furthermore, the first and / or second openings may form a common opening for multiple devices under test, which may cause less interference than multiple openings for each device under test. In other words, the openings can be extended and associated with multiple devices under test. Thus, the antenna lobes or antenna structures of multiple devices under test may reach the common opening. However, if the side lobe levels of adjacent devices under test sharing the common opening are sufficiently low, or if the adjacent devices under test are tested at sufficiently different frequencies, it is possible to test multiple devices under test simultaneously. Furthermore, the absence of conductive or dielectric material in the (common) opening may help reduce crosstalk between adjacent devices under test.

[0063] One embodiment of the present invention relates to a test array for wireless testing of an angular (e.g., L-shaped) device under test (e.g., an L-shaped antenna in a package device under test), wherein the test array comprises a carrier structure (e.g., a PCB test fixture or a load board), wherein the test array comprises a socket for the device under test coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly or via an extender assembly and / or a PCB interposer between the carrier structure and the device under test socket), wherein the device under test socket is configured to establish electrical contact with a connector arranged on the inner surface of the angular (e.g., L-shaped) device under test (e.g., an inner surface of the angular device under test opposite to a second outer surface of the angular device under test) or on the inner surface of the angular (e.g., L-shaped) device under test, and wherein the device under test socket is configured to place the angular device under test such that a surface vertical line of the first outer surface of the angular (e.g., L-shaped) device under test is + / - with respect to the surface of the load board (e.g., the main surface). A second outer surface (e.g., a surface containing a radiation structure) of an angled (e.g., L-shaped) device under test is moved away from the load board so as to be parallel within a tolerance of 15 degrees, and a surface vertical line of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the load board within a tolerance of + / - 15 degrees, wherein the carrier structure (e.g., a test fixture PCB or a load board) includes an opening (e.g., a hole or cutout) that moves away from the socket of the device under test in the direction of the outer surface vertical line of the first outer surface of the angled device under test (e.g., moving away from the socket of the device under test in the direction of the main radiation of the antenna structure on the first outer surface of the device under test).

[0064] This test array combines the various advantages mentioned above. Brief explanation of the drawing

[0065] The drawings are not necessarily to scale, but instead generally focus on explaining the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings, where: FIG. 1 shows a schematic cross-sectional view of an example of a test array for wirelessly testing an angled device under test; FIG. 2a shows a schematic cross-sectional view through a first example of an angled device under test; FIG. 2b shows a schematic cross-sectional view through a second example of an angled device under test; FIG. 3 shows a perspective view of an angled device under test; FIG. 4 shows the simulation results of the far-field emitted by the antenna element of the first antenna array on the first outer surface of the device under test illustrated in FIG. 3; FIG. 5 shows a perspective view of an angled device under test; FIG. 6 shows the simulation results of the far-field emitted by the antenna element of the first antenna array on the first outer surface of the device under test illustrated in FIG. 5; FIG. 7a shows a perspective view of an example of a device under test; FIG. 7b shows a different view of the device under test shown in FIG. 7a; FIG. 8 shows a schematic plan view illustrating an example of a test array; FIG. 9 shows a schematic cross-sectional view of a socket for a device under test having a device under test, an example of a test array having a carrier structure; FIG. 10 is a perspective view showing an example of a device socket under test; FIG. 11a shows an example of a test array having a carrier structure, a schematic cross-sectional view of a device socket under test having a device under test; FIG. 11b shows a perspective view of the test array illustrated in FIG. 11a; FIG. 12 shows a schematic plan view of another example of a test array having multiple devices under test; FIG. 13 shows a schematic plan view illustrating another example of a test array including multiple devices under test. Specific details for implementing the invention

[0066] Elements that are identical or equivalent, or elements that have the same or equivalent function, are indicated by the same or equivalent reference numbers in the following description, even if they appear in other drawings.

[0067] In the following description, numerous details are presented to provide a more comprehensive description of the embodiments of the present invention. However, those skilled in the art will understand that embodiments of the present invention can be practiced without these specific details. In other cases, well-known structures and devices are shown in the form of block diagrams instead of details to avoid obscuring embodiments of the present invention. Additionally, features of the various embodiments described below may be optionally combined with one another unless specifically stated otherwise.

[0068] FIG. 1 shows a schematic cross-sectional view of an example of a test array (100) for wireless testing of an angled device (140) under test.

[0069] The test array (100) includes a carrier structure (110) and a device socket (130) under test coupled to the carrier structure (110). The device socket (130) under test is configured to establish electrical contact with a connector (not shown in FIG. 1) arranged on the inner surface (142) of the angled device (140) under test. The carrier structure includes an opening (120) that extends away from the device socket (130) under test in the direction of the outer surface vertical line (143a) of the first outer surface (141a) of the angled device (140) under test.

[0070] The carrier structure (110) may be a printed circuit board (PCB) test fixture or load board (or may include such). The carrier structure (110) may include, for example, an area having a flat surface. The socket (130) of the device under test may be placed on the top (e.g., flat surface) of the carrier structure (110) or may be coupled to the carrier structure (110) through one or more intermediate devices or structures.

[0071] The test array (100) illustrated in FIG. 1 may be used, for example, to test the angled device (140) itself (e.g., the antenna structure does not detect electromagnetic radiation emitted from the angled device under test) or to test the angled device (140) under test together with one or more additional antennas. For example, the test array (100) may be used to test the power consumption of the device (140) under test or the interference between the antennas of the device (140) under test. Alternatively, the test array (100) may be configured to wirelessly test one or more antenna structures of the device under test.

[0072] The socket (130) of the device under test is configured to contact the inner surface (142) of the device under test, so that the outer surface of the device under test (140) is completely (or at least mostly) separated from the socket (130) of the device under test and the carrier (110). Therefore, the effect of the device socket (130) and / or the carrier structure (110) on radiation (and the corresponding test) emitted (and / or received) from the outer surface of the device under test (140) is reduced. Additionally, the opening (120) reduces the effect of the carrier structure (110) on the device under test, thereby reducing the effect on the test results.

[0073] The angled device (140) under test may be, for example, an antenna-in-package (AiP) device (or may include such). The angled device (140) under test may have, for example, an L-shape (as abstractly illustrated in FIG. 1). For example, the device under test may be a device in which a first plate (141a) is connected to a second plate (141b), wherein the first plate (141a) and the second plate (141b) may be angled at least 90 degrees (e.g., within a tolerance of + / - 15 degrees) to each other. The angled device (140) under test may include a first outer surface (144a) (e.g., of the first plate (141a)) and a second outer surface (144b) (e.g., of the second plate (141b)), wherein, for example, the first and second outer surfaces (144a, b) are angled to each other at least essentially 270 degrees (e.g., within a tolerance of + / - 15 degrees). The inner surface (142) of the angled device (140) under test may include a first inner surface (142a) (e.g., of the first plate (141a)) and a second inner surface (142b) (e.g., of the second plate (141b)), wherein, for example, the first and second inner surfaces (142a, b) are angled at least essentially 90 degrees to each other (e.g., within a tolerance of + / - 15 degrees). The first inner surface (142a) and the second outer surface (144a) may be arranged parallel to each other, for example. The second inner surface (142b) and the second outer surface (144b) may be arranged parallel to each other, for example.

[0074] The device socket (130) under test may be configured to position the device under test (140) such that the second outer surface (144b) of the device under test (140) is away from the carrier structure (110). The device socket (130) under test may be configured to position the device under test (140) such that the surface vertical line (143b) of the second outer surface (144b) of the device under test is perpendicular to the surface (112) of the carrier structure (110) within a tolerance of + / - 15 degrees. The second outer surface (144b) may be arranged parallel to the surface (112) of the carrier structure (110).

[0075] FIG. 2a shows a schematic cross-sectional view through a first example of an angled device (240) under test, which can replace the angled device (140) under test.

[0076] The device (240) under test includes a first plate (241a) and a second plate (241b), which are angled at 90 degrees relative to each other (e.g., within a tolerance of + / - 15 degrees). The first plate (241a) includes a first outer surface (244a) and a first inner surface (242a), and the second plate (241b) includes a second outer surface (244b) and a second inner surface (242b).

[0077] In the example illustrated in FIG. 2a, the first outer surface (244a) comprises a first antenna array (246a) having four antenna elements. However, the first outer surface (244a) may (additionally or alternatively) comprise other types of antennas (e.g., single antennas and / or circularly polarized antennas) and a different number of antenna elements or antenna arrays. Alternatively, the second outer surface (244b) may comprise the first antenna array (246a). The first antenna array (246a) may be configured to receive and / or transmit electromagnetic radiation.

[0078] The device (240) under test may also include a connector (248), for example, an array connector. In the example illustrated in FIG. 2a, the (array) connector (248) is arranged on a second inner surface (242b). Alternatively, the (array) connector (248) may be arranged on a first inner surface (242a) or (for example, if there are multiple (array) connectors (248)) on the first and second inner surfaces (242a, b). The (array) connector (248) is electrically connected to at least one first antenna element (for example, all antenna elements) of the first antenna array (246a). Thus, an electrical signal applied to the (array) connector (248) can cause the first antenna array (246a) to emit electromagnetic radiation. Alternatively, electromagnetic radiation received by the first antenna array (246a) can generate an electrical signal at the (array) connector (248). The (array) connector (248) may be one or more solder balls or may include them. The (array) connector (248) may be configured to connect the device under test (140) (e.g., an antenna-in-package module) to a system (e.g., a mobile phone or the socket of the device under test (130)) and may enable the transmission of signals such as power signals, digital signals, and radio frequency (RF) of intermediate frequency (IF).

[0079] The first antenna array (246a) may be directly electrically connected to the (array) connector (248) or indirectly coupled to the (array) connector (248) (e.g., there are additional electrical components in between). For example, the additional electrical components may include one or more of an amplifier, a filter, a switch, a resistor, a capacitor, and an integrated circuit. In the example illustrated in FIG. 2a, the additional electrical components include an antenna network (249) (e.g., a silicon die). The antenna network (249) may be configured to convert an intermediate frequency (IF) signal into a mmWave signal (e.g., a 5G bandwidth such as the 24 GHz to 53 GHz range) and / or vice versa. Alternatively or additionally, the antenna network (249) may be configured to control the beamforming of the first antenna array (246a) (at least partially).

[0080] FIG. 2b shows a schematic cross-sectional view through a second example of an angled device (240a) under test, which can replace the angled device (140) under test.

[0081] A second example of the angled device (240a) under test essentially corresponds to the first example of the angled device (240) under test illustrated in FIG. 2a, and the same elements are designated by the same reference number, but further includes a second antenna array (246b) on the second outer surface (244b). The second antenna array (246b) may have similar features to the first antenna array (246a). The second antenna array (246b) may also be electrically connected to at least one of the (array) connector (248) and the antenna network (249). Alternatively, the second antenna array (246b) may be electrically connected to a separate (array) connector and / or a separate antenna network.

[0082] The device socket (130) under test may be configured to position the angled device (140) under test (e.g., the angled device (240) or the angled device (240a) under test), such that the first outer surface (144a) of the angled device (140) under test (e.g., the first outer surface (244a)) is spaced apart from the surface (112) of the carrier structure (110). The device socket (120) under test may be configured to position the angled device (140) under test so that the surface vertical line (143a) of the first outer surface (144a) of the angled device (140) under test is parallel to the surface (112) of the carrier structure (110) within a tolerance of, for example, + / - 15 degrees (as exemplarily illustrated in FIG. 1). The first outer surface (144a) can be arranged perpendicularly to the surface (112) of the carrier structure (110).

[0083] The socket (120) of the device under test may be configured to position the angled device (140) under test, wherein the distance (e.g., first distance (114)) between the first outer surface (144a) of the angled device under test (140) and the carrier structure (110) (e.g., surface (112)) is at least two wavelengths (or at least 10 mm, or at least 30 mm, or at least 45 mm) at the lowest frequency of the device under test (140). The angled device (140) under test may operate in a frequency band of the 5G standard, for example, in the range of 24 GHz to 53 GHz (e.g., frequency range (2). In this case, the lowest frequency may be 24 GHz with a wavelength of 12.5 mm. For example, the space between the first surface (144a) and the surface (112) of the carrier structure (110) may be 25 mm or more (i.e., twice 12.5 mm).

[0084] FIG. 3 shows a perspective view of an angled device (340) under test, which can replace the angled device (140) under test. The device under test (340) includes a first outer surface (344a) having a first antenna array having four antenna elements and a second outer surface (344b) having a second antenna array having four antenna elements. At least one antenna element may include at least one parasitic patch. In the example illustrated in FIG. 3, each antenna element has four parasitic patches surrounding a central antenna structure. The first outer surface (344a) includes two central antenna arrays (345a, b). There is no metallized surface near the device under test (340).

[0085] FIG. 4 shows the simulation results of the far-field emitted by the antenna elements (e.g., antenna elements (345a or 345b)) of the first antenna array on the first outer surface (344a) of the device (340) under test shown in FIG. 3. For simplification, note that the far-field simulation shown in FIG. 3 starts at the center of the antenna array on the first outer surface (344a) (e.g., between the central antenna elements (345a, b)). However, the far-field simulation may have at least essentially the same shape when starting at the center of one of the central antenna elements (345a, b). The far-field region shows distinct lobes oriented perpendicularly to the two central antenna elements (345a, b) of the first outer surface (344a) (however, if the device (340) under test is applied to a system (e.g., a system providing a metallized backplane), back-direction radiation may be reduced or suppressed).

[0086] FIG. 5 shows a perspective view of an angled device (540) under test, which can replace the angled device (140) under test. The device under test (540) includes a first outer surface (544a) having a first antenna array having four antenna elements and a second outer surface (544b) having a second antenna array having four antenna elements. The first antenna array of the first outer surface (544a) includes two central antenna elements (545a, b). A metal (e.g., copper) surface (550) is located 2 mm away from the first outer surface (544a).

[0087] FIG. 6 shows the simulation results of the far-field emitted by the antenna elements (e.g., antenna elements (545a, b)) of the first antenna array of the first outer surface antenna array (544a) of the device (530) under test shown in FIG. 5 (preferably considering a metal surface (550)). Compared to the results shown in FIG. 4, the far-field shows less prominent radiation oriented perpendicularly to the two central antenna elements of the first outer surface (544a). Instead, the intensity of the far-field is more evenly distributed around the device (540) under test, with separate main lobes in the surface direction perpendicular to the first outer surface (544a) and in two other directions. These results demonstrate that nearby metalized surfaces can affect the far-field emitted by the device (540) under test, thereby reducing the accuracy and / or reproducibility of the test. For example, metalized surfaces can reduce the spatial selectivity of the beamforming antenna array and / or change the orientation of the main lobes.

[0088] Therefore, having an opening in the carrier structure and optionally having a spacing as described above (e.g., two or more wavelengths, or 10 mm or more, or 30 mm or more, or 45 mm or more) can improve the accuracy and / or reproducibility of the test.

[0089] FIG. 7a shows a perspective view of an example of a device (740) under test. The device (740) under test includes a first inner surface (742a) and a second inner surface (742b). In the example illustrated in FIG. 7a, the device under test includes a first plate (741a) having the first inner surface (742a) and a second plate (741b) having the second inner surface (742b). The first and second plates (741a, b) are mechanically (and optionally electrically) connected by a flexible conductive structure such as three flexible printed circuits (747a, b, c). The first and second plates (741a, b) may be movable relative to each other (e.g., rotatable or bendable) (e.g., to facilitate manufacturing or assembly in a system). However, the mobility of the plates can facilitate connection to the device socket under test in some cases, but may complicate the test in others. Alternatively, the first and second plates (741a, b) may be fixedly positioned relative to each other.

[0090] The device under test (740) consists of a connector or array connector (748) and a silicon die (749) (or other antenna circuit) on a second inner surface (742b). The silicon die (749) may be electrically contacted indirectly through the array connector (748) or directly through electrical contacts of the silicon die (749) itself (not shown in FIG. 7a). The device under test socket described herein is configured to establish electrical contact with the inner surface of the device under test (740), for example, the array connector (748) on the second inner surface (742b).

[0091] FIG. 7b shows a different perspective view of the device (740) under test illustrated in FIG. 7a. The device under test (740) comprises a first outer surface (744a) (located on the first plate (741a)) and a second outer surface (744b) (located on the second plate (741b)). The first and second outer surfaces (744a, b) (or, for example, each antenna or antenna structure formed or arranged on the first and second outer surfaces) are configured to emit and / or receive electromagnetic radiation. To this end, antenna elements (e.g., antenna arrays) may be arranged at least partially on the first and / or second outer surfaces (744a, b) or at least partially within the first and / or second plates (741a, b). In the example illustrated in FIG. 7b, the first and second outer surfaces (744a, b) are configured to emit and / or receive electromagnetic radiation. Alternatively, only the first outer surface (744a, b) or only the second outer surface (744a, b) may be configured to emit and / or receive electromagnetic waves.

[0092] In the example illustrated in FIG. 1, the device socket (130) under test may be configured to accommodate, for example, the angled device (140) under test (or, for example, the angled device (740) under test, which may replace, for example, the angled device (140) under test), and may be configured such that the surface vertical line (143a) of the first outer surface (141a) of the angled (e.g., L-shaped) device under test (or the first outer surface (741a)) is parallel to the surface (e.g., main surface) of the carrier structure (e.g., load board) within a tolerance of + / - 15 degrees. Alternatively, the device socket (130) under test may be configured to accommodate the angled device (140) under test (or the angled device (740)) under test at a different angle.

[0093] In the example illustrated in FIG. 1, the device socket (130) under test is configured to position the angled device (140) (or angled device (740)) under test so that the second outer surface (144b) of the angled (e.g., L-shaped) device (140) (e.g., a surface including a radiating structure) (or the second outer surface (744b)) under test is positioned away from the carrier structure (110) (e.g., a load board), and the surface vertical line (143b) of the second outer surface (144b) of the angled (e.g., L-shaped) device (140) (or the second outer surface 744b) under test is perpendicular to the surface of the carrier structure (e.g., a load board) within a tolerance of + / - 15 degrees.

[0094] In the example illustrated in FIG. 1, the opening (110) forms a blind hole that does not pass through the entire thickness of the carrier structure (110). The blind hole can reduce the risk of components falling off (e.g., during mounting). Alternatively, the opening (110) may be a through hole that passes through the entire thickness of the carrier structure (110). The through hole can reduce interference caused by the carrier structure (110) and facilitate the guiding of an electrical connection to a side of the carrier structure (e.g., a signal source and / or a signal receiver) on the opposite side of the device socket (130) being tested.

[0095] An extension (121) of an opening in the direction of the outer surface vertical line (143a) of the first outer surface (144a) of the angled device (140) under test (e.g., the main radiation direction of the antenna structure located on the first outer surface of the device under test away from the socket (130) of the device under test, a direction parallel to the x-axis in the example of FIG. 1, e.g., the negative x-direction) may be at least two wavelengths, at least three wavelengths, or at least four wavelengths (e.g., free space wavelengths or wavelengths of the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest frequency of the angled device under test (e.g., the lowest frequency of the antenna-in-package (AiP) module that constitutes the device under test or is included in the device under test). For example, the angled device (140) under test may operate in the frequency band of the 5G standard, e.g., 24 GHz to 53 GHz (e.g., frequency range 2). In this case, the lowest frequency is 24 GHz and the (free space) wavelength may be (approximately) 12.5 mm. The extension (121) of the opening in the direction of the outer surface vertical line (143a) of the first outer surface (144a) may be, for example, 25 mm or more (i.e., twice 12.5 mm).

[0096] FIG. 8 shows a schematic plan view of an example of a test array (800). The test array (100) illustrated in FIG. 1 may look at least like the drawing in FIG. 8 when viewed from above. In other words, all features, functions, and details described in relation to the test array (800) may optionally be used (or implemented) in the test array (100), and vice versa.

[0097] The test array (800) includes a carrier structure (810) having an opening (820) and a device socket (830) capable of placing a device (840) under test. The opening (820) has a rectangular shape. However, the opening (820) may have other shapes such as a circle, an ellipse, and a polygon. The opening (820) may include one or more rounded edges.

[0098] The opening includes an extension (821) of the opening in the direction of the outer surface vertical line (843a) of the first outer surface (844a) of the angled device (840) under test (in the x-axis direction of FIG. 8b), or equivalently, an extension (821) in the direction of the outer surface vertical line of the test socket surface configured for the first inner surface of the angled device (840) under test. For example, the extension (821) may be greater than two wavelengths, greater than three wavelengths, or greater than four wavelengths (e.g., free space wavelength) at the lowest frequency of antenna operation of the device under test.

[0099] The extension (822) of the opening (820) in a direction perpendicular to the outward surface vertical line (843a) of the first outer surface (844a) of the angled device (840) under test (e.g., the width of the opening (820) in a direction parallel to the first outer surface (844a) parallel to the y-axis in FIG. 8) is, for example, larger than the extension (823) of the device (840) under test (or, for example, larger than the extension (823) of the radiation structure on the first outer surface (844a) of the device under test). The extension (822) may be, for example, larger than 2 wavelengths, larger than 3 wavelengths, or larger than 4 wavelengths at the lowest frequency of antenna operation of the device under test (e.g., free space wavelength).

[0100] By using the extensions (821, 822) of these openings, it is possible to have electromagnetic characteristics suitable for wireless testing of the device under test, for example, when the antenna or antenna structure of the device under test radiates in the direction of the surface vertical line (823), or when the device under test receives radiation along the direction of the surface vertical line (823).

[0101] FIG. 9 illustrates a schematic cross-section of an example of a test array (900) having a carrier structure (910) and a device socket (930) under test, which may be configured to support a device under test (940). The carrier structure (910) includes an opening (920) extending away from the device socket (930) under test in the direction of the outer surface vertical line (843a) of the first outer surface (944a) of the device under test (940) at the angle at the device socket (930) (or equivalently, in the direction of the outer surface vertical line of the first surface of the device socket under test, which adapts around the first inner surface of the device under test (940) at the angle at the device socket (930), and in the example illustrated in FIG. 9, the opening (920) is a hole passing through the entire thickness of the carrier structure (910). Alternatively, the opening (920) may be a blind hole.

[0102] The device socket (930) under test is configured such that when the device under test (940) is inserted into the device socket (930) under test, at least a portion of the device under test (940) is positioned in the opening (920). In the example illustrated in FIG. 9, the device socket (930) under test is configured such that the device socket (930) under test extends into the opening (920) (e.g., partially or entirely through the opening (920)). As a result, a portion of the device under test (940) can be inserted into the device socket (930) under test and extend into the opening (920). Alternatively, the device socket (930) under test can be positioned entirely over the opening (920) (i.e., not extending into the opening (920)), and the device under test (940) can be dimensioned so that it extends into the opening (920) when inserted into the device socket (930) under test. However, in other embodiments, the device being tested may not extend to the opening (920).

[0103] According to an embodiment, the test array includes a first antenna or antenna structure (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)) configured to receive a signal radiated from a first outer surface of an angled device being tested or configured to emit a signal received from a first outer surface of an angled device.

[0104] The extension of the opening (920) may be selected such that the distance (924) between the edge of the angled device under test (e.g., the first outer surface (944a) of FIG. 9) or the edge of the antenna-in-package device and the carrier structure (910) (e.g., the distance between the edge of the angled device under test or the edge of the antenna-in-package device and the nearest edge of the opening) is at least one wavelength (e.g., the free-space wavelength or the wavelength of the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest frequency of the angled device under test (940) (e.g., the lowest frequency of the antenna-in-package (AiP) module constituting the device under test (940) or included in the device under test (940)) (while there is no material of the carrier structure (910) within one wavelength distance at the edge of the angled device under test (940) or at the edge of the antenna-in-package device).

[0105] The device socket (930) under test includes one or more coaxial pogo pins (932) to establish an electrical connection between the carrier structure (910) (e.g., a PCB test fixture or load board of the carrier structure (910)) and the angled device (940) under test. The pogo pins (932) may extend, for example, from the lower surface of the device socket (930) under test (which may contact the PCB test fixture or load board of the carrier structure (910)) to the upper surface of the device socket (930) under test (which may contact the second inner surface (942b) of the angled device (940) under test). For example, the first end of the coaxial pogo pin (932) may contact a pad of the PCB test fixture or load board (e.g., the carrier structure 930). The second end of the coaxial pogo pin may come into contact with a pad of the angled device (940) under test or a connector of the angled device (940) under test. The pogo pin (932) may extend, for example, beyond the upper surface of the device socket (930) under test, wherein the pogo pin (932) is configured to shorten when the device (940) under test is inserted into the device socket (940) under test.

[0106] In the example illustrated in FIG. 9, the test array (900) includes a first antenna or antenna structure (950) and a second antenna or antenna structure (952). However, the test array (900) may include only one of the first and second antenna or antenna structures (950, 952).

[0107] A first antenna or antenna structure (950) (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)) is configured to receive a signal radiated from a first outer surface (944a) of an angled device (940) under test (or more precisely, an antenna or antenna structure placed on the first outer surface (944a)) or to emit a signal received from the first outer surface (944a) of an angled device (940) (or more precisely, an antenna or antenna structure placed on the first outer surface (944a)). To this end, the first antenna or antenna structure (950) may be positioned at a certain distance from the first outer surface (944a) of the angled device (940) under test, and may be positioned so that the surface vertical line of the first outer surface (944a) of the angled device (940) under test (or equivalently the surface vertical line of the first surface of the socket of the device under test adjacent to the first inner surface of the device under test) passes through the hole of the first antenna or antenna structure (950). Alternatively, the first antenna or antenna structure (940) may be positioned at a different location and / or direction.

[0108] The first antenna or antenna structure (950) is arranged at least partially in an opening (e.g., an open area surrounded by the carrier structure (910); e.g., the plane of the carrier structure (910)). In the example illustrated in FIG. 9, the first outer surface (944a) and the opening of the first antenna or antenna structure (950) are arranged so that the transmission path between them is offset (in a direction perpendicular to the surface of the carrier structure (910)) from the center plane of the carrier structure (910). Alternatively, the transmission path between the first outer surface (944a) and the opening of the first antenna or antenna structure (950) may be arranged within the center plane of the carrier structure (910).

[0109] In the example illustrated in FIG. 9, the radiating hole (951a) of the first antenna or antenna structure (950) is arranged outside the opening (920). Alternatively, the radiating hole (951a) of the first antenna or antenna structure (950) may be arranged at least partially in the opening (920) (e.g., an open area surrounded by the carrier structure (910); e.g., the plane of the carrier structure (910)).

[0110] The first antenna or antenna structure (950) may be mounted to have a fixed position relative to the device socket (930) under test. Alternatively, the first antenna or antenna structure (950) may be configured to be movable relative to the device socket (930) under test. A movable first antenna or antenna device (952) may increase accessibility to the device socket (930) under test (e.g., to insert the device (940) under test).

[0111] For example, the first antenna or antenna structure (950) may be mechanically attached to the arm of the handler so that the first antenna or antenna structure (950) can move. The handler may be configured to insert the angled device (940) under test into the device socket (930) under test. For example, when the handler presses the angled device (950) under test into the test socket (930), the first antenna or antenna structure (950) may be positioned at least partially in the opening (920).

[0112] In the example illustrated in FIG. 9, the first antenna or antenna structure (950) includes (or is connected to) a first coaxial cable (953a) connected (or connectable) to a first signal source and / or a first signal receiver (956a). However, other forms of electrical signal transmission (e.g., a hollow waveguide structure) may be used instead. Alternatively or additionally, the first antenna or antenna structure (950) may be connected to another device (e.g., configured to perform or support testing of the device under test). The first coaxial cable (953a) may extend, for example, through an opening (920). Alternatively, the coaxial cable (953a) may extend through an opening other than the opening (920) or may not extend through an opening (e.g., extending from the side of a carrier structure such as the socket (940) of the device under test and / or the first antenna or antenna structure (950)).

[0113] Alternatively, when the handler places the first antenna or antenna structure (950) in an operating position (or, equivalently, when the handler inserts the angled device (940) under test into the test socket (930), or when the handler presses the device (940) under test into the test socket (930), the first antenna or antenna structure (950) may be configured to be connected to a signal source and / or a first signal receiver (956a) via a blind-coupled microwave connection (e.g., a blind-coupled (hollow) waveguide connection).

[0114] A second antenna or antenna structure (952) (e.g., a single-hole antenna (e.g., dual linear polarization or circular polarization)) is configured to receive a signal radiated from a second outer surface (944b) of the angled device (940) under test (or more precisely, an antenna or antenna structure arranged on the second outer surface) and / or is configured to emit a signal received from the second outer surface (944b) of the angled device (940) under test (or more precisely, an antenna or antenna structure arranged on the second outer surface) (at least when the second antenna or antenna structure (952) is placed in an operating position) (or, equivalently, when a handler inserts the angled device (940) under test into a test socket (930) or when a handler presses the device (940) under test into the test socket (930).

[0115] A hole (951b) of the second antenna or antenna structure (952) is positioned at a certain distance from the second outer surface (944b) of the angled device (940) under test, so that a surface vertical line of the second outer surface (944b) of the angled device (940) under test passes through the hole (951b) of the second antenna or antenna structure (952) (at least when the second antenna or antenna structure (952) is positioned in an operating position) (or, equally, when a handler inserts the angled device (940) under test into the test socket (930), or when a handler presses the device (940) under test into the test socket (930).

[0116] The second antenna or antenna structure (952) is mechanically attached to the arm of the handler (the handler may be configured to insert and / or press the angled device (940) under test into the device socket (930) under test), and the second antenna or antenna structure (952) is made movable.

[0117] FIG. 9 shows an example of an antenna structure that can be used with or without a handler. Alternatively, both of the first and second antenna structures (950, 952) may be coupled / attached to a handler, or neither may be coupled / attached to a handler. The first and second antennas or antenna structures (950, 952) may be attached to the same / common handler or each may be attached to an individual handler.

[0118] The second antenna or antenna structure (952) may be coupled to a pressurizer for pressing the angled device (940) under test into the device socket (930) under test, or, for example, the second antenna or antenna structure (952) may be configured to move together with a pressurizer for pressing the angled device (940) under test into the device socket (930) under test (wherein, for example, the pressurizer is arranged so that when the device under test (940) is inserted into the device socket (930) under test, the pressurizer or a part of the pressurizer is between the second antenna or antenna structure (952) and the second outer surface (944b) of the angled device (940) under test) (and / or wherein, for example, when the angled device (940) under test is inserted into the device socket (930) under test, the pressurizer or a part of the pressurizer is between the first antenna or antenna structure (950) and the first angled device (940) under test (Arranged to be between the outer surfaces (944a)).

[0119] When the handler places the second antenna or antenna structure (952) in an operating position (or equivalently, when the handler inserts the angled device (940) under test into the test socket (930), or when the handler presses the device (940) under test into the test socket (930), the second antenna or antenna structure (952) is configured to be connected to a second signal source and / or a second signal receiver (956b) via a blind-coupled microwave connection (e.g., a blind-coupled (hollow) waveguide connection).

[0120] In the example illustrated in FIG. 9, the second antenna or antenna structure (952) includes (or is connected to) a second coaxial cable (953b) connected (or connectable) to a second signal source and / or signal receiver (956b). However, other forms of electrical signal transmission may be used instead. Alternatively or additionally, the second antenna or antenna structure (952) may be connected to another device. The second coaxial cable (953b) may extend through the opening (920). Alternatively, the second coaxial cable (953b) may extend through an opening other than the opening (920) (as illustrated in FIG. 9) or may not extend through the opening (e.g., to the same side as the device socket (940) and / or the first antenna or antenna structure (950) under test).

[0121] Note that the test array (900) illustrated in FIG. 9 has two separate signal sources and / or signal receivers (956a, b). However, the test array (900) may have a common (e.g., single) signal source and / or signal receiver, which may be connected to the first and second antennas or antenna structures (950, 952) via separate or common electrical connections (e.g., coaxial cables).

[0122] In conclusion, the test array according to FIG. 9 enables efficient testing of the device under test, wherein partially placing the device socket under test and the first antenna (950) within the opening (920) helps to reduce the structural height. However, even if the device socket under test and / or the first antenna or antenna structure are not partially placed within the opening, the test array can still be implemented with a relatively small structural height because the opening allows the device socket under test and the first antenna or antenna structure to be placed close to the carrier structural plane.

[0123] FIG. 10 shows a perspective view of an example of a device socket (1030) that may be used in all embodiments disclosed herein, for example. The device socket (1030) may be configured to accommodate all devices under test described herein and may be part of all test arrays described herein. The device under test (1030) includes an angled recess or angled removal (1060) configured to support and / or align the device under test. The angled recess or angled removal (1060) includes a first contact surface (1062a) configured to abut a first inner surface (e.g., first inner surface (142a, 242a)) of the device under test and a second contact surface (1062b) configured to abut a second inner surface (e.g., second inner surface (142b, 242b, or 942b)) of the device under test. The first contact surface (1062a) and the second contact surface (1062b) may be arranged at a contact surface angle, and the sum of the contact surface angle (e.g., 270 degrees) and the angle between the first and second inner surfaces of the device under test (e.g., 90 degrees) is at least 360 degrees in essence. For example, if the first and second inner surfaces of the device under test may be arranged at a 90-degree angle, the contact surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0124] All surfaces of the socket (1030) of the device under test may be configured to establish electrical contact with the inner surface of the device under test. For example, the first and / or second contact surfaces (1062a, b) may be configured to establish electrical contact with the inner surface of the device under test and / or to provide a ground plane for the antenna structure of the device under test. To this end, the first and / or second contact surfaces (1062a, b) may comprise or be formed of an electrically conductive material (e.g., one or more of gold, copper, iron, and nickel). Alternatively, the first and / or second contact surfaces may comprise or be formed of a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first and / or second contact surfaces (1062a, b) may include one or more (local) socket connectors (1065) (or conductive pads, pogo pins, spring-loaded contacts, or other similar contact structures for contacting the device under test). The socket connectors (1065) are positioned so that when the device under test is placed in the device socket (1060) under test, the connectors (1065) establish an electrical connection with the inner surface of the device under test or the corresponding connector (e.g., array connectors (248, 748)).

[0125] The device socket (1030) under test includes a support (1064) comprising a main socket structure (1064a) and a leg socket structure (1064b). Both the main socket structure (1064a) and the leg socket structure (1064b) have a rectangular prism shape (optional, with rounded corners), wherein at least two edges of the leg socket structure (1064b) are smaller (shorter) than two edges (e.g., the corresponding edges) of the main socket structure (1064a). The main socket structure (1064a) and the leg socket structure (1064b) may have the same height, for example. The side (1061) of the leg socket structure (1064b) is arranged at the same height as the side of the main socket structure (1064a), and the other three sides of the leg socket structure (1064b) are recessed relative to the other three sides (corresponding) of the main socket structure (1064a). Thus, the leg socket structure (1064b) can be accommodated, for example, by an opening of a carrier structure (or other structure in between), whereby lateral movement of the socket (1030) under test is limited by the side surface of the leg socket structure (1064b).

[0126] The device socket (1030) under test may additionally or alternatively include one or more protrusions (1066) extending from the support (1064) (e.g., main socket structure (1064a)) toward the carrier structure. The protrusions (1066) may be shafts (e.g., cylindrical) or may include shafts. The protrusions (1066) may be received by a recess of the carrier structure (or other structures therein). Alternatively or additionally, the device socket (1030) under test may include one or more through holes configured to receive attachment elements such as pins or screws.

[0127] In the example illustrated in FIG. 10, the angled recess or angled removal part (1060) extends into the main socket structure (1064a) and the leg socket structure (1064b). Alternatively, the angled recess or angled removal part (1060) may extend only into the main socket structure (1064a).

[0128] The angled recess or angled removal (1060) may have corresponding side walls (1068a, b) at both ends (only one of which can be seen directly in FIG. 10). The side walls (1068a, b) face each other and are arranged at least essentially parallel to each other (optional tapering is ignored). In the example shown in FIG. 10, the side walls (1068a, b) are oriented perpendicular to the first and second contact surfaces (1062a, b) or at least approximately perpendicularly. The side walls (1068a, b) may restrict lateral movement of the device under test within the angled recess or angled removal (1060), but still allow for smooth and well-guided insertion of the device under test into the angled recess or angled removal (860) and smooth extraction of the device under test. Alternatively, the angled recess or angled removal portion (1060) may be composed of only a single side wall, thereby increasing flexibility, for example, in relation to positioning.

[0129] The angled recess or angled removal portion (1060) may include at least one tapering, for example, so that a cross section (e.g., parallel to the first or second contact surface (1062a, b)) decreases outwardly toward the first or second contact surface (1062b). In the example illustrated in FIG. 10, the angled recess or angled removal portion (1060) includes first and second taperings. According to the first tapering, the distance between the side walls (1068a, b) decreases toward the first contact surface (1062a). According to the second tapering, the three side walls of the main socket structure (1064a) surrounding the second contact surface (1062b) have a cross section that decreases toward the second contact surface (1062b). The tapering can have an automatic adjustment function and facilitates inserting the device under test into an angled recess or an angled removal part (1060).

[0130] The device socket (1030) under test may have adjacent openings (1069) that intersect with an angled recess or an angled removal portion (1060). In the example illustrated in FIG. 10, the device socket under test (1030) includes four adjacent openings (1069) arranged next to the corner of the second contact surface (1062b). Alternatively, the device socket under test (1030) may include any other number of adjacent openings (1069) at other locations adjacent to the second contact surface (1062b) (and / or the first contact surface (1062a)). For example, the adjacent openings may be adjusted to prevent the device under test from tilting, such as when the device under test is inserted into the socket (830). However, the adjacent openings may also help to remove the device under test from the socket (830).

[0131] The angled recess or angled removal (1060) may include additional recesses or protrusions to fit, for example, the shape of the device under test. For example, the angled recess or angled removal (1060) illustrated in FIG. 10 includes a step (1067) on the first contact surface (1062a). The step (1067) may be adjusted to fit, for example, the structural features of the second inner surface or provide a support surface for the device under test to form a space underneath (e.g., to grip the device under test).

[0132] The device socket (1030) under test may include a blind coupling interface. In the example illustrated in FIG. 10, the main socket structure (1064a) includes two (e.g., blind) coupling recesses (1061a, b). Alternatively, the main socket structure (1064a) may include any other number of coupling recesses. The coupling recesses (1061a, b) are configured to receive (e.g., blind) coupling protrusions of a pressurizer or handler (e.g., handler (754)). Alternatively, or additionally, the main socket structure (1064a) may include one or more (e.g., blind) coupling protrusions, configured to be received, for example, by the (e.g., blind) coupling recesses of the pressurizer or handler (e.g., handler (754)).

[0133] In conclusion, the socket (1030) can accommodate the angular device under test and establish electrical contact with the angular device under test. Since the device under test can be positioned (aligned) within the angular recess or angular removal portion (1060), wireless testing of the device under test is possible using an antenna structure or antenna on both outer surfaces of the angular device under test. The device under test is well aligned with the socket, making it easy to arrange the device under test in a compact array. Additionally, distortion of the radiation characteristics of the antenna or antenna structure of the device under test by the socket can be kept significantly small. The socket can be easily attached to a carrier structure and can be used in all embodiments disclosed herein.

[0134] FIG. 11a shows a schematic cross-sectional view of an example of a test array (1100) having a carrier structure (1110) (e.g., a printed circuit board test fixture or a load board) and a device under test socket (1130) having a device under test (1140) (e.g., an L-shaped device under test). The carrier structure (1110) includes an opening (1120) that extends away from the device under test socket (1030) in the direction of the outer surface vertical line (1143a) of the first outer surface (1144a) of the angled device under test (1140) (or equivalently, in the direction of the outer surface vertical line of the first surface of the device under test socket adjacent to the first inner surface of the device under test). The test array (1100) includes a first antenna or antenna structure (1150) configured to receive a signal radiated from a first outer surface (1144a) of the angled device (1140) under test (or more precisely, an antenna or antenna structure arranged on the first outer surface (1144a)) and / or a first antenna or antenna structure (1150) configured to emit a signal received from the first outer surface (1144a) of the angled device (1140) (or more precisely, an antenna or antenna structure arranged on the first outer surface (1144a)). The device socket (1130) under test is configured such that the device socket (1130) under test extends into an opening (1120).

[0135] FIG. 11b shows a perspective view of the test array (1100) illustrated in FIG. 11a. A first antenna or antenna structure (1150) is partially arranged in an opening (1120) (wherein one or more electrical connections of the first antenna or antenna structure are arranged, for example, under a carrier structure (1110)).

[0136] The extension (1122) (e.g., width) of the opening (1120) in the direction perpendicular to the outer surface vertical line (1143a) of the first outer surface (1144a) of the angled device (1140) under test (or the direction in contact with the first inner surface of the device under test, perpendicular to the outer surface vertical line of the socket of the device under test) is larger than the extension (1123) (e.g., same direction) of the device (1140) under test.

[0137] The opening (1120) has larger dimensions on the opposite side of the device socket (1130) under test (or, in other words, the section surrounding the first antenna or antenna structure (1150)). Thus, the opening (1120) provides sufficient space for the first antenna or antenna structure (1150). In particular, the opening (1120) has a rectangular bottom shape (optional, the edges are rounded) with a wider section on the opposite side of the device socket (1130) under test. For example, the opening widens from the device socket under test toward the first antenna or antenna structure (e.g., in steps).

[0138] As can be seen in the example shown in FIG. 11b, the carrier structure (1110) may include additional openings in addition to the opening (1120).

[0139] FIG. 12 shows a schematic plan view of another example of a test array (1200) having a plurality of devices under test (1240a, b, c, d). The test array (1200) includes a carrier structure (1210) (which may include all carrier structures described herein) (e.g., a printed circuit board test fixture or a load board) and four (e.g., four or a different number) sockets for devices under test (1230a, b, c, d) (which may be all device sockets under test described herein). However, the test array (1200) may include different amounts of device sockets under test (e.g., two, three, five, six or more).

[0140] The carrier structure (1210) includes an opening (1220) that extends far in the direction of the outer surface vertical line of the first outer surface of the angled device (1240) under test from the device under test (1230a-d) (or equally in the direction of the outer surface vertical line of the first surface of the device socket under test adjacent to the first inner surface of the device under test). Thus, a plurality of devices (1240a-d) share a common opening. The common opening can reduce interference caused by the carrier structure (1210) (e.g., compared to a plurality of openings with respective boundaries that can cause interference) and can also reduce crosstalk between the devices under test.

[0141] The device socket (1230) under test is arranged along the edge of the opening (1220). The device socket (1230) under test may be arranged spaced apart from the opening (1220), arranged at the same height as the opening (1220), or arranged to overlap with the opening (1220) (e.g., when viewed from above).

[0142] Multiple devices under test (1240a-d) may be arranged in a row (1215a) as shown in FIG. 12. Additionally, a row (1215b) of each first antenna (1250a to 1250d) may be arranged on the opposite side of the devices under test (and facing each device under test). The test array (1200) can test multiple devices under test (1240a-d), thereby improving test efficiency. For example, tests can be performed simultaneously to increase time efficiency. Alternatively, tests can be performed continuously to reduce crosstalk between the devices under test (1240a-d).

[0143] The device sockets (1230a-d) under test are arranged to accommodate each angular device (1240a-d) under test, so that the first outer surface of each angular device (1240a-1240d) under test (the first outer surface (1244a) of the first device under test (1240a) in FIG. 12 is shown as an example) is aligned in the same direction (e.g., the positive x direction in FIG. 12). Aligning in the same direction allows the device sockets (1230a-d) under test to be densely arranged while keeping crosstalk between adjacent devices under test significantly small.

[0144] The test array (1200) comprises four first antennas or antenna structures (1250a, b, c, d) (which may be any of the first antennas or antenna structures described herein) (e.g., side-measuring antennas). However, the test array (1200) may comprise a different number of first antennas or antenna structures (1250a-d), for example, the same number as the device sockets (1230a-d) under test. In the example illustrated in FIG. 12, each device socket (1230a-d) under test is assigned to one of the first antennas or antenna structures (1250a-d) (or vice versa). Each of the first antenna or antenna structure (1250a-d) is configured to receive a signal radiated from the first outer surface (or more precisely, the antenna or antenna structure placed on each first outer surface) of the specified angled device (1240a-d) under test, or is configured to emit a signal received from the first outer surface (or more precisely, the antenna or antenna structure placed on the first outer surface) of the specified angled device (1240a-d) under test.

[0145] At least one hole in the first antenna or antenna structure (1250a-d) may be positioned at a distance from each of the first outer surfaces of the angled device (1240a-d) under test, such that the surface vertical line of the first outer surface of the angled device (1240a-d) under test (or equivalently the surface vertical line of the first surface in contact with the first inner surface of each device socket under test) may pass through each hole in the first antenna or antenna structure (1250a-d).

[0146] In the example illustrated in FIG. 12, the test array (1200) does not include a second antenna or antenna structure so as not to obscure the device (1240a-d) being tested. However, the test array (1200) may include only a first antenna or antenna structure (i.e., no second antenna or antenna structure), only a second antenna or antenna structure (i.e., no first antenna or antenna structure), or both a first and second antenna or antenna structure.

[0147] The carrier structure (1210) may define a board limit (1213) (e.g., handler docking plate limit), which defines an area (e.g., rectangular frame) surrounding an area that supports mounting the device socket (1230a-d) under test.

[0148] In conclusion, a test array (1200) having a common opening in the sockets of multiple devices under test supports efficient testing (e.g., simultaneous testing) of multiple angular devices under test, thereby enabling the achievement of a small structural height and maintaining significantly low crosstalk between multiple devices under test. Having an opening in the carrier structure makes it easier to achieve these goals.

[0149] FIG. 13 shows a schematic plan view of another example of a test array (1300) having a plurality of devices under test (1340). The test array (1300) includes a carrier structure (1310) (which may include all carrier structures described herein) (e.g., a printed circuit board test fixture or a load board) and eight (e.g., eight identical) sockets for devices under test (1330) (which may be all device sockets under test described herein). However, the test array (1300) may include different amounts of device sockets under test (e.g., two, three, five, six or more).

[0150] At least two device sockets (1330) under test are arranged (e.g., back-to-back) so that the angled device (1340) under test is aligned such that the first outer surface (1344a) of each angled device under test is aligned in the opposite (avoiding) direction (or equivalently, the first surface of each of two adjacent device sockets under test is aligned such that it is in contact with the first inner surface of each device under test).

[0151] For the sake of visibility, only the leftmost device socket under test (1330) in FIG. 13 is discussed, and thus reference numerals 1330a and 1330b are provided. However, the same principle applies to the remaining device sockets under test (1330). The first device socket under test (1330a) is configured such that each device under test (1340) is arranged such that each first outer surface (1344a) faces a first direction (e.g., the negative x direction in FIG. 13). The second device socket under test (1330b) is configured such that each device under test (1340) is arranged such that each first outer surface (1344a) faces a second direction (e.g., the positive x direction in FIG. 13) which is opposite to (e.g., not parallel to) the first direction. Consequently, the respective first outer surfaces (1344a, 1344b) of the devices under test (1340a, 1340b) arranged in the first and second device sockets under test (1330a, b) face in opposite directions. Consequently, the first antenna or antenna structure (1350a, 1350b) assigned to each of the first and second device sockets under test (1330a, b) may be arranged in opposite directions (e.g., separate openings of the carrier structure). Additionally, the first antenna or antenna structure (1350a, 1350b) assigned to each of the first and second device sockets under test (1330a, b) may be arranged so as to be positioned between the first antenna or antenna structure (1350a, 1350b) assigned to the first and second device sockets under test (1330a, b) (e.g., sandwiched with a gap). This arrangement reduces the risk of cross-talk between the devices under test (1340a, 1340b) coupled to the first and second device sockets under test (1330a, b).

[0152] The test array (1300) comprises two rows (e.g., parallel rows) (1315a, b) of device sockets (1330) under test, wherein the device sockets (1330) under test are configured to support each angular device (1340) under test, and at least two rows (1315a, b) of device sockets (1340) under test are arranged to place each angular device (1340) under test (e.g., back-to-back; e.g., the sides of the device sockets (1330) under test where the first outer surface (1344a) of the device (1340) under test is located are arranged in opposite directions relative to each other, and the first outer surface (1344a) of each angular device (1340) under test is aligned in the opposite (avoided) direction. Additionally, there are two rows (1316a, 1316b) of the first antenna, where two rows (1315a, 1315b) are arranged between the first antenna or the two rows (1316a, 1316b) of the first antenna structure. For example, a first (common) opening (1320a) is arranged in the area between the first row (1315a) of the device socket under test and the first row (1316a) of the first antenna, and a second (common) opening (1320b) is arranged in the area between the second row (1315b) of the device socket under test and the second row (1316b) of the first antenna. This arrangement improves the trade-off between crosstalk reduction and increased packing density.

[0153] The carrier structure (1310) includes two openings (1320a, b) with a solid intermediate section (1325) (e.g., a solid bar) between them, wherein, for example, eight device sockets (1330) under test are arranged in the solid intermediate section (1325) between the openings (1320a, b). For example, four device sockets under test (1330) are aligned toward the first opening (1320a) of the two openings (1320a, b). The other four device sockets under test, for example, are aligned toward the second opening (1320b) of the two openings (1320a, b). In the example illustrated in FIG. 13, the device under test (1340) is inserted into the device under test socket (1330) of the solid middle section (1325) arranged back-to-back and aligned toward different openings (1320a, b).

[0154] For example, at least two distances between the device sockets (1330) under test may be essentially the same. For example, the distance may be the same for all device sockets (1330) under test (e.g., the pitch between sockets may be regular). As a result, inserting the device under test (1340) becomes easier. For insertion, the device under test may need to be rotated 180° before insertion.

[0155] In conclusion, a test array (1300) having two parallel openings is suitable for achieving high test efficiency, because it can simultaneously test many devices under test with low cross torque in a structure with a small structural height.

[0156] Implementation alternatives

[0157] While some aspects have been described in the context of a device, it is clear that these aspects also represent descriptions of the corresponding method, where the block or device corresponds to a method step or a feature of the method step. Likewise, aspects described in the context of a method step also represent descriptions of the corresponding block, item, or feature of the corresponding device.

[0158] The embodiments described above are merely for illustrating the principles of the invention. Modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. Accordingly, it is intended to be limited only by the scope of the claims set forth below and not by the specific details presented through the description and explanation of the embodiments described herein.

Claims

Claim 1 A test array (100; 800; 900; 1100; 1200; 1300) for wirelessly testing an angular device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, wherein the test array comprises a carrier structure (110; 810; 910; 1110; 1210; 1310); and the test array comprises a socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test coupled to the carrier structure (110; 810; 910; 1110; 1210; 1310), and the device under test The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to establish electrical contact with a connector (248; ​​748) arranged on the inner surface (142) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test or on the inner surface (142) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, and the carrier structure (110; 810; 910; 1110; 1210; 1310) An opening (120; 820; 920; 1120; 1220; 1320a, b) extending in the direction of the vertical line (143a; 843a; 1143a) of the outer surface of the first outer surface (144a; 244a; 344a; 544a; 744a; 840; 940; 1140; 1240a-d; 1340) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1344a) of the angular device (140; 240; 340; 544a; 744a; 844a; 944a; 1144a; 1244a device socket (130; 830; 930; 1030; 1130; 1230a-d; 1340) under test at the above-mentioned device socket (130; 830; 930; 1030; 1130; 1230a-d; 1340) under test, of the outer surface vertical line (143a; 843a; 1143a) of the above-mentioned device socket (130; 830; 930; 1030; 1130; 1230a-d; 1340) under test Including, test array(100; 800; 900; 1100; 1200; 1300). Claim 2 In claim 1, the socket of the device under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to position the angular device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), and the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1240a-d; 1340) of the angular device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340); The surface vertical line (143a; 843a; 1143a) of the (1344a) is parallel to the surface of the carrier structure (110; 810; 910; 1110; 1210; 1310) within a tolerance of + / - 15 degrees, the test array (100; 800; 900; 1100; 1200; 1300). Claim 3 In claim 1, the device socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) under test is configured to position the angular device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, wherein the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angular device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test is the carrier structure (110; 810; 910; Moving away from 1110; 1210; 1310), - the surface vertical line (143b) of the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test is perpendicular to the surface of the carrier structure (110; 810; 910; 1110; 1210; 1310) within a tolerance of + / - 15 degrees, the test array (100; 800; 900; 1100; 1200; 1300). Claim 4 In claim 1, the opening (120; 820; 920; 1120; 1220; 1320a, b) is a hole-in, test array (100; 800; 900; 1100; 1200; 1300) extending through the entire thickness of the carrier structure (110; 810; 910; 1110; 1210; 1310). Claim 5 In claim 1, the extension (121; 821) of the opening (120; 820; 920; 1120; 1220; 1320a, b) in the direction of the vertical line (143a; 843a; 1143a) of the outer surface of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540) under test is the angled device (140; 240; 340; 540; A test array (100; 800; 900; 1100; 1200; 1300) having at least 2 wavelengths or at least 3 wavelengths or at least 4 wavelengths at the lowest operating frequency of 740; 840; 940; 1140; 1240a-d; 1340). Claim 6 In claim 1, the extension (822; 1122) of the opening (120; 820; 920; 1120; 1220; 1320a, b) in a direction perpendicular to the vertical line (143a; 843a; 1143a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540) under test; Larger than the extension of the radiating structure on the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) of the above test, or the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a) of the above test angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340); A test array (100; 800; 900; 1100; 1200; 1300) in which an extension (822; 1122) of an opening in a direction perpendicular to the outer surface vertical line (143a; 843a; 1143a) of the device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is larger than an extension (823; 1123) of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340). Claim 7 In claim 1, the extension (924) of the opening (120; 820; 920; 1120; 1220; 1320a, b) is such that the distance between the edge of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test or the edge of the package device which is an antenna and the carrier structure (110; 810; 910; 1110; 1210; 1310) is at least one wavelength at the lowest operating frequency of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test is at least one wavelength. Array(100; 800; 900; 1100; 1200; 1300). Claim 8 In claim 1, the device socket under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) is such that when the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is inserted into the device socket under test (130; 830; 930; 1030; 1130; 1230a-d; 1330), at least a part of the device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) has an opening (120; 820; A test array (100; 800; 900; 1100; 1200; 1300) configured to be located in 920; 1120; 1220; 1320a, b). Claim 9 In claim 1, the device socket under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured such that the device socket under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) extends to the opening (120; 820; 920; 1120; 1220; 1320a, b), a test array (100; 800; 900; 1100; 1200; 1300). Claim 10 In claim 1, the test array is configured to receive a signal radiated from a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) and / or the first outer surface (144a; 244a; 344a; 544a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340); A test array (100; 800; 900; 1100; 1200; 1300) comprising a first antenna or antenna structure (950; 1150; 1250a-d; 1350) configured to emit a signal to be received at 744a; 844a; 944a; 1144a; 1244a; 1344a). Claim 11 In claim 1, the test array comprises a first antenna or antenna structure (950; 1150; 1250a-d; 1350), and a hole (951a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is arranged at a distance from a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) of the angled device (140; 240; A test array (100; 800; 900; 1100; 1200; 1300) such that a surface vertical line (143a; 843a; 1143a) of a first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the first outer surface (144a; 244a; 344a; 344a; 344a; 344a; 344a; 344a; 844a; 944a; 1144a; 1244a; 1344a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350) extends through a hole (951a) of the first antenna or antenna structure. Claim 12 In claim 1, the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is at least partially arranged in an opening (120; 820; 920; 1120; 1220; 1320a, b), a test array (100; 800; 900; 1100; 1200; 1300). Claim 13 In claim 9, the radiating hole (951a) of the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is arranged at least partially in an opening (120; 820; 920; 1120; 1220; 1320a, b), in a test array (100; 800; 900; 1100; 1200; 1300). Claim 14 In claim 9, the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is mounted to have a fixed position relative to the device socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) under test, test array (100; 800; 900; 1100; 1200; 1300). Claim 15 In claim 9, the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is mechanically attached to the arm of a handler (954), so that the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is movable, forming a test array (100; 800; 900; 1100; 1200; 1300). Claim 16 In claim 9, the first antenna or antenna structure (950; 1150; 1250a-d; 1350) is configured to be connected to a signal source and / or signal receiver (956a, b) via a blind coupled microwave connection when the handler (954) places the first antenna or antenna structure (950; 1150; 1250a-d; 1350) in an operating position, a test array (100; 800; 900; 1100; 1200; 1300). Claim 17 In claim 1, the test array is configured to receive a signal radiated from a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, or a second antenna or antenna (952) structure configured to emit a signal to be received from a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) of the angled device (140; 240; 340; 544b; 744b; 944b) of the angled device (140; 244b; 344b; 544b; 744b; 944b) under test. Including, test array(100; 800; 900; 1100; 1200; 1300). Claim 18 In claim 1, the test array comprises a second antenna or antenna structure (952), and a hole (951b) of the second antenna or antenna structure (952) is arranged at a certain distance from a second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, so as to be a second outer surface (144b; 244b; 344b) of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test. A test array (100; 800; 900; 1100; 1200; 1300) in which a surface vertical line (143b) of 544b; 744b; 944b) extends through a hole (951b) of the second antenna or antenna structure (952). Claim 19 In claim 17, the second antenna or antenna structure (952) is mechanically attached to the arm of the handler (954) so ​​that the second antenna or antenna structure (952) is movable, in a test array (100; 800; 900; 1100; 1200; 1300). Claim 20 In claim 18, the second antenna or antenna structure (952) is part of a pressurizer (954) for pressurizing the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test into the device socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) under test, or the second antenna or antenna structure (952) is part of a pressurizer (954) for pressurizing the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test into the device socket (130; 830; 930; A test array (100; 800; 900; 1100; 1200; 1300) configured to be movable together with a pressurizer (954) for applying pressure to 1030; 1130; 1230a-d; 1330). Claim 21 In claim 17, the second antenna or antenna structure (952) is configured to be connected to a signal source and / or signal receiver (956a, b) via a blind coupled microwave connection when the handler (954) places the second antenna or antenna structure (952) in an operating position, in a test array (100; 800; 900; 1100; 1200; 1300). Claim 22 In claim 1, the socket under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) comprises a test array (100; 800; 900; 1100; 1200; 1300) comprising an angled recess or angled removal portion (1060) configured to support and / or align an angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340). Claim 23 In claim 1, the test array (100; 800; 900; 1100; 1200; 1300) comprises one or more coaxial pogo pins (932) for establishing an electrical connection between a PCB test fixture or load board and the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test. Claim 24 In claim 1, the test array comprises at least two device sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) configured to support each of the angled devices (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, and the at least two device sockets (130; 830; 930; 1030; 1130; 1230a-d; 1330) under test position each of the angled devices (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test. A test array (100; 800; 900; 1100; 1200; 1300) in which the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of each of the angled devices (140; 240; 340; 544a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of each of the angled devices (140; 240; 340; 540; 740; 840; 940; 1100; 1200; 1300) of the test is aligned in opposite directions. Claim 25 In claim 1, the test array comprises at least two rows (1315a, b) of the device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330), and the device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) are configured to support each angular device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340), and at least two of the device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) Rows (1315a, b) are arranged to accommodate each angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, and a test array (100; 800; 900; 1100;) in which the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of each angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is aligned in opposite directions. 1200; 1300). Claim 26 In claim 1, the carrier structure (110; 810; 910; 1110; 1210; 1310) comprises at least two openings (120; 820; 920; 1120; 1220; 1320a, b), with a solid intermediate portion (1325) between them, and the two or more device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) are arranged in the solid intermediate portion (1325) between the openings (1320a, b), and one or more device positions under test among the device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) are at least two A test array (100; 800; 900; 1100; 1200; 1300), wherein one or more device positions under test among the device sockets under test (130; 830; 930; 1030; 1130; 1230a-d; 1330) are aligned toward the first opening (1320a) of the openings (1320a, b), and at least two openings (1320b) of the device positions under test are aligned toward the second opening (1320b). Claim 27 A test array (100; 800; 900; 1100; 1200; 1300) for wirelessly testing an angular device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, wherein the test array comprises a carrier structure (110; 810; 910; 1110; 1210; 1310); and the test array comprises a socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the device under test coupled to the carrier structure (110; 810; 910; 1110; 1210; 1310), and the device under test The socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to establish electrical contact with the inner surface of the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test or with the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) under test, and the socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) is configured to establish electrical contact with the angled device (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is configured to be positioned, - the surface vertical line (143a; 843a; 1143a) of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the angled device under test is parallel to the load board surface within a tolerance of + / - 15 degrees, and - the second outer surface (144b; of the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) is positioned such that the surface vertical line (143a; 843a; 1143a) is parallel to the load board surface within a tolerance of + / - 15 degrees, and - the second outer surface (144b; of the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) 244b; 344b; 544b; 744b;944b) moves away from the load board, and the surface vertical line (143b) of the second outer surface (144b; 244b; 344b; 544b; 744b; 944b) of the angled device under test is perpendicular to the load board surface within a tolerance of + / - 15 degrees, and the carrier structure (110; 810; 910; 1110; 1210; 1310) is moved away from the device socket (130; 830; 930; 1030; 1130; 1230a-d; 1330) of the angled device under test (140; 240; 340; 540; 740; 840; 940; 1140; 1240a-d; 1340) in a direction away from the device socket (130; 830; 930; 1030; 1130; 1230a-d; 1340) 1. A test array (100; 800; 900; 1100; 1200; 1300) comprising an opening (120; 820; 920; 1120; 1220; 1320a, b) extending in the direction of the vertical line (143a; 843a; 1143a) of the outer surface of an outer surface (144a; 244a; 344a; 544a; 744a; 844a; 944a; 1144a; 1244a; 1344a) of the3a; 843a; 1143a)

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