Multilayer ceramic capacitor

Abstract

We provide a multilayer ceramic capacitor that is resistant to cracks and the like in the ceramic body. A multilayer ceramic capacitor comprising a plurality of ceramic layers, a plurality of first internal electrodes, and a plurality of second internal electrodes stacked in the height direction, a first main surface and a second main surface facing each other in the height direction, a first cross section and a second cross section facing each other in the length direction orthogonal to the height direction, and a first side and a second side section facing each other in the width direction orthogonal to the height direction and the length direction, and a first external electrode and a second external electrode formed on the outer surface of the ceramic body, wherein the first internal electrode is drawn out through the first cross section and is electrically connected to the first external electrode, and the second internal electrode is drawn out through the second cross section and is electrically connected to the second external electrode, wherein when viewed from a cross-sectional plane parallel to the first side and the second side, the first external electrode is formed in an L-shape on the first cross section and the first main surface, and the R dimension of the ridge where the first main surface, the first cross section, the first side, the second cross section, and the second side surface meet is the same as the second main surface and It shall be larger than the R dimension of the ridge where the first section, the first side, the second section, and the second side meet.

Description

Technology Field

[0001] The present invention relates to a multilayer ceramic capacitor. Background Technology

[0002] Multilayer ceramic capacitors are widely used in various devices, including electronic devices and electrical devices (hereinafter referred to as "electronic devices, etc."). For example, a typical structure of a multilayer ceramic capacitor is disclosed in Patent Document 1 (Japanese Patent Publication No. JP 2000-100647).

[0003] Recently, the miniaturization and high-functionality of electronic devices have been progressing rapidly. Due to the miniaturization of electronic devices, the internal volume (space volume) of devices housing electronic circuits composed of electronic components is becoming very small. Furthermore, with the increase in the high functionality of electronic devices, the number of electronic components required to construct electronic circuits is rapidly increasing.

[0004] Consequently, as electronic devices become smaller and more functional, there is a growing demand for miniaturization of the electronic components that constitute electronic circuits. For example, in the case of multilayer ceramic capacitors, ultra-thin products with ceramic bodies having a thickness of tens of micrometers are being commercialized. Prior art literature

[0005] Japanese Patent Publication No. JP 2000-100647 The problem to be solved

[0006] As mentioned above, due to the miniaturization and increased functionality of electronic devices, there is a demand for the miniaturization and, in particular, thinning of electronic components; however, in the case of multilayer ceramic capacitors, the decrease in mechanical strength against external forces due to thinning is becoming a problem.

[0007] Meanwhile, multilayer ceramic capacitors are often mounted on a substrate or a substrate-like material (hereinafter collectively referred to as "substrate") by, for example, the reflow soldering process described below.

[0008] First, a substrate to be mounted is prepared. Electrodes are formed on the main surface of the substrate, and cream solder is applied in advance to the surface of the electrodes. Next, a mounting device including a nozzle is prepared. Then, after adsorbing the top surface (second main surface) of the multilayer ceramic capacitor with the nozzle, the bottom surface (first main surface) of the multilayer ceramic capacitor is placed onto a pair of electrodes on the substrate that have cream solder applied thereon by moving the nozzle. Next, the substrate on which the multilayer ceramic capacitor is placed is heated to melt the cream solder, and then the entire thing is cooled to solidify the cream solder again, thereby mounting the multilayer ceramic capacitor onto the electrodes of the substrate.

[0009] In this reflow soldering process, when placing a multilayer ceramic capacitor onto an electrode of a substrate with a nozzle, a ridge, which is the outer edge of the bottom surface (first main surface) of the ceramic body, collides with the substrate or the electrode formed on the substrate, causing cracks, etc. (hereinafter collectively referred to as "cracks, etc.") to occur in the ceramic body. In particular, in multilayer ceramic capacitors that have been thinned and have reduced mechanical strength against external forces, cracks, etc. in the ceramic body that occur during mounting, etc., are a very serious problem.

[0010] Therefore, the present invention aims to provide a multilayer ceramic capacitor in which cracks are unlikely to occur in the ceramic body even when the ridge, which is the outer edge of the bottom surface (first main surface) of the ceramic body, collides with a substrate or an electrode formed on the substrate, for example, during mounting. means of solving the problem

[0011] To solve the aforementioned conventional problems, a multilayer ceramic capacitor according to one embodiment of the present invention comprises a plurality of ceramic layers, a plurality of first internal electrodes and a plurality of second internal electrodes stacked in the height direction, a first main surface and a second main surface facing in the height direction, a first end surface and a second end surface facing in the length direction orthogonal to the height direction, and a first side surface and a second side surface facing in the width direction orthogonal to the height direction and the length direction, and a first external electrode and a second external electrode formed on the outer surface of the ceramic body, wherein the first internal electrode is drawn out through the first end surface and is electrically connected to the first external electrode, and the second internal electrode is drawn out through the second end surface and is electrically connected to the second external electrode, wherein when viewed from a cross-sectional plane parallel to the first side surface and the second side surface, the first external electrode is formed in an L-shape on the first end surface and the first main surface, and the second external electrode is formed on the second end surface And it is formed in an L-shape on the first main surface, and the R dimension of the ridge where the first main surface, the first cross section, the first side section, the second cross section, and the second side section meet is greater than the R dimension of the ridge where the second main surface, the first cross section, the first side section, the second cross section, and the second side section meet. Effects of the invention

[0012] In a multilayer ceramic capacitor according to one embodiment of the present invention, since the R dimension of the ridge where the first main surface (bottom surface; mounting surface) and the first cross-section, first side surface, second cross-section, and second side surface meet is large, it is difficult for cracks to occur in the ceramic body even if these ridges collide with a substrate or an electrode formed on the substrate during mounting. Brief explanation of the drawing

[0013] FIG. 1 is a perspective view of a multilayer ceramic capacitor (100) according to a first embodiment, showing the multilayer ceramic capacitor (100) from the first main surface (1A) side. FIG. 2 is a perspective view of a multilayer ceramic capacitor (100), showing the multilayer ceramic capacitor (100) from the second main surface (1B) side. FIG. 3 is a cross-sectional view of a multilayer ceramic capacitor (100), showing the cross-sectional view of the XX portion indicated by the dotted arrow in FIG. 1(A). FIG. 4 is a main cross-sectional view of a multilayer ceramic capacitor (100). FIGS. 5(A) to (D) are explanatory diagrams showing the process in an example of a method for manufacturing a multilayer ceramic capacitor (100). FIGS. 6(E) to (J) follow FIG. 5(D) and are explanatory diagrams showing a process in an example of a method for manufacturing a multilayer ceramic capacitor (100). FIG. 7 is a cross-sectional view of a multilayer ceramic capacitor (200) according to a second embodiment. FIGS. 8(A) to (D) are explanatory diagrams showing the process in an example of a method for manufacturing a multilayer ceramic capacitor (200). FIGS. 9(E) to (J) follow FIG. 8(D) and are explanatory diagrams showing a process in an example of a method for manufacturing a multilayer ceramic capacitor (200). Specific details for implementing the invention

[0014] Hereinafter, embodiments for carrying out the present invention will be described together with the drawings.

[0015] Meanwhile, each embodiment is an exemplary representation of an embodiment of the present invention, and the present invention is not limited to the contents of the embodiments. Furthermore, the contents described in other embodiments may be combined and implemented, and the contents of such implementations are also included in the present invention. Additionally, the drawings are intended to aid in understanding the specification and may be schematically depicted; consequently, the ratios of dimensions of the depicted components or between components may not match the ratios of these dimensions described in the specification. Furthermore, there may be cases where components described in the specification are omitted from the drawings, or where the number of components is omitted in the drawings.

[0016] [First embodiment]

[0017] FIGS. 1, FIGS. 2, FIGS. 3, and FIGS. 4 each show a multilayer ceramic capacitor (100) according to a first embodiment. FIGS. 1 is a perspective view of the multilayer ceramic capacitor (100) and shows the multilayer ceramic capacitor (100) from the side of the first main surface (1A). FIGS. 2 is also a perspective view of the multilayer ceramic capacitor (100) and shows the multilayer ceramic capacitor (100) from the side of the second main surface (1B). FIGS. 3 is a cross-sectional view of the multilayer ceramic capacitor (100) and shows the cross-sectional view of the XX portion indicated by the dotted arrow in FIGS. 1(A). FIGS. 4 is a main cross-sectional view of the multilayer ceramic capacitor (100).

[0018] Meanwhile, the drawing shows the height direction (T), length direction (L), and width direction (W) of the multilayer ceramic capacitor (100), and these directions may be mentioned in the following description. In this embodiment, the stacking direction of the ceramic layer (1a) to be described later is set as the height direction (T) of the multilayer ceramic capacitor (100).

[0019] A multilayer ceramic capacitor (100) comprises a ceramic body (1). The ceramic body (1) is made of a rectangular shape and has a first main surface (1A) and a second main surface (1B) facing in the height direction (T), a first cross section (1C) and a second cross section (1D) facing in the length direction (L), and a first side surface (1E) and a second side surface (1F) facing in the width direction (W).

[0020] The dimensions of the ceramic body (1) are arbitrary, but for example, it is preferable that one of the dimensions in the length direction (L) and the width direction (W) is 1.0 mm or less and the other is 0.5 mm or less. It is also preferable that the dimension in the height direction (T) is 0.1 mm or less. When the present invention is implemented, even in a miniaturized and thin-layered multilayer ceramic capacitor (100) as described below, the R dimension of the ridge where the first main surface (1A), which is the mounting surface, and the first cross section (1C), the first side surface (1E), the second cross section (1D), and the second side surface (1F) meet is large, so when mounting, the occurrence of cracks, etc. in the ceramic body (1) is suppressed even if these ridges collide with the first main surface of the ceramic body or the electrode formed on the substrate.

[0021] The ceramic body (1) is composed of a ceramic layer (1a), a first internal electrode (2), a second internal electrode (3), and a dummy internal electrode (4) stacked together. The ceramic layer (1a), the first internal electrode (2), the second internal electrode (3), and the dummy internal electrode (4) are stacked in the height direction (T) of the ceramic body (1).

[0022] Meanwhile, the dummy internal electrode (4) is an electrode provided as a lower external electrode of the first external electrode (5) and the second external electrode (6), as described later, and is not primarily intended to form a capacitance.

[0023] The material of the ceramic body (1) (ceramic layer (1a)) is optional, but, for example, dielectric ceramics with BaTiO3 as the main component may be used. However, dielectric ceramics with other materials as the main component, such as CaTiO3, SrTiO3, and CaZrO3, may be used instead of BaTiO3.

[0024] The thickness of the ceramic layer (1a) is arbitrary, but, for example, it can be about 0.3㎛ to 2.0㎛ in the effective region of capacitance formation where the first internal electrode (2) and the second internal electrode (3) are formed.

[0025] The number of layers of the ceramic layer (1a) is arbitrary, but, for example, it can be 1 to 6000 layers in the effective region of capacitance formation where the first internal electrode (2) and the second internal electrode (3) are formed.

[0026] On both the upper and lower sides of the ceramic body (1), a protective layer (outer layer) composed only of a ceramic layer (1a) is provided, without the first internal electrode (2) and the second internal electrode (3) being formed. However, in this embodiment, a dummy internal electrode (4) is formed in the protective layer. The thickness of the protective layer is arbitrary, but for example, it can be about 5㎛ to 150㎛. Meanwhile, the thickness of the ceramic layer (1a) of the protective layer may be greater than the thickness of the ceramic layer (1a) of the effective region for capacitance formation where the first internal electrode (2) and the second internal electrode (3) are formed. In addition, the material of the ceramic layer (1a) of the protective layer may be different from the material of the ceramic layer (1a) of the effective region.

[0027] As can be seen in FIG. 3, the first internal electrode (2) extends in the longitudinal direction (L) of the ceramic body (1), and one end is drawn out to the first cross section (1C) of the ceramic body (1). The second internal electrode (3) extends in the longitudinal direction (L) of the ceramic body (1), and one end is drawn out to the second cross section (1D) of the ceramic body (1). Meanwhile, it is preferable that the first internal electrode (2) and the second internal electrode (3) are stacked alternately in principle.

[0028] The dummy internal electrode (4), provided as a lower external electrode of the first external electrode (5) and the second external electrode (6), has a smaller length (L) dimension than the first internal electrode (2) and the second internal electrode (3). One end of the dummy internal electrode (4) is drawn out to either the first cross-section (1C) or the second cross-section (1D) of the ceramic body (1). Additionally, the dummy internal electrode (4) positioned closest to the first main surface (1A) of the ceramic body (1) is exposed to the first main surface (1A) of the ceramic body (1).

[0029] Meanwhile, the dummy internal electrode (4) is positioned closest to the first main surface (1A) of the ceramic body (1) at least at the first external electrode (5) and the second external electrode (6), respectively, and there is only one layer exposed to the first main surface of the ceramic body (1).

[0030] The material of the main component (metal component) of the first internal electrode (2), the second internal electrode (3), and the dummy internal electrode (4) is optional, but in this embodiment, Ni was used. However, other metals such as Cu, Ag, Pd, and Au may be used instead of Ni. In addition, Ni, Cu, Ag, Pd, and Au may be alloys with other metals. The first internal electrode (2), the second internal electrode (3), and the dummy internal electrode (4) may contain other components such as ceramics in addition to the metal component.

[0031] The thickness of the first internal electrode (2), the second internal electrode (3), and the dummy internal electrode (4) is arbitrary, but for example, it can be about 0.3㎛ to 1.5㎛.

[0032] A first external electrode (5) and a second external electrode (6) are formed on the outer surface of a ceramic body (1). When looking at a cross-sectional view parallel to the first side (1E) and the second side (1F), the first external electrode (5) is formed in an L-shape on the first cross section (1C) and the first main surface (1A), and the second external electrode (6) is formed in an L-shape on the second cross section (1D) and the first main surface (1A). The first external electrode (5) is electrically connected to the first internal electrode (2) at the first cross section (1C). The second external electrode (6) is electrically connected to the second internal electrode (3) at the second cross section (1D).

[0033] The first external electrode (5) and the second external electrode (6) have the same multilayer structure. In this embodiment, the first external electrode (5) and the second external electrode (6) include, in order from bottom to top, a lower external electrode, a Cu-plated external electrode layer (7) formed on the outer side of the lower external electrode, a Ni-plated external electrode layer (8) formed on the outer side of the Cu-plated external electrode layer (7), and an Au-plated external electrode layer (9) formed on the outer side of the Ni-plated external electrode layer (8). However, the structure and material of the first external electrode (5) and the second external electrode (6) are arbitrary and are not limited to these structures and materials. Furthermore, the dimensions such as the thickness, width, and length of the first external electrode (5) and the second external electrode (6) are also arbitrary and can be freely set. In particular, various variations can be adopted regarding the number of layers, material, and dimensions of the plated external electrode layers.

[0034] Next, the lower external electrodes of the first external electrode (5) and the second external electrode (6) will be described. The lower external electrode is the electrode that becomes the lower part when the plated external electrode layer is formed on its outer side.

[0035] The lower external electrode of the first external electrode (5) is composed of the end of the first internal electrode (2) drawn out to the first cross-section (1C) and the dummy internal electrode (4), and the main surface of the dummy internal electrode (4) exposed to the first main surface (1A). FIG. 3 illustrates a structure in which the first external electrode (5) includes four layers of dummy internal electrodes (4) as the lower external electrode, the upper main surface of the dummy internal electrode (4) positioned closest to the first main surface (1A) among them is exposed to the first main surface (1A), and the end of the remaining three layers of dummy internal electrodes (4) is drawn out to the first cross-section (1C). However, the number of layers of the dummy internal electrode (4) of the first external electrode (5) is arbitrary, and it is sufficient to include at least one layer that is positioned closest to the first main surface (1A) of the ceramic body (1) and whose upper main surface is exposed to the outside from the first main surface (1A) of the ceramic body (1).

[0036] Likewise, the lower external electrode of the second external electrode (6) is composed of the end of the second internal electrode (3) drawn out to the second cross-section (1D), the end of the dummy internal electrode (4), and the end of the dummy internal electrode (4) exposed to the first main surface (1A). FIGS. 3 and 4 illustrate a structure in which the second external electrode (6) includes four layers of dummy internal electrodes (4) as the lower external electrode, the upper side of the dummy internal electrode (4) positioned closest to the first main surface (1A) among them is exposed to the first main surface (1A), and the end of the remaining three layers of dummy internal electrodes (4) is drawn out to the second cross-section (1D). However, the number of layers of the dummy internal electrode (4) of the second external electrode (6) is arbitrary, and it is sufficient to include at least one layer that is positioned closest to the first main surface (1A) of the ceramic body (1) and whose upper main surface is exposed to the outside from the first main surface (1A) of the ceramic body (1).

[0037] As described above, the end of the first internal electrode (2) drawn out through the first cross-section (1C) of the ceramic body (1) and the end of the second internal electrode (3) drawn out through the second cross-section (1D) of the ceramic body (1) are also part of the lower external electrode of the first external electrode (5) and the second external electrode (6). In FIGS. 3 and 4, the end of the first internal electrode (2) and the end of the second internal electrode (3) are not shown as part of the first external electrode (5) and the second external electrode (6) because the drawings become complex (the lines drawn from the symbol "5" in the drawing showing the first external electrode (5) and the symbol "6" in the drawing showing the second external electrode (6) are omitted).

[0038] The lower external electrode of the first external electrode (5) and the second external electrode (6) functions as a lower portion for forming a Cu-plated external electrode layer (7) on its outer side. Meanwhile, as described above, in this embodiment, the end of the first internal electrode (2) drawn out through the first cross section (1C), the end of the dummy internal electrode (4), the end of the second internal electrode (3) drawn out through the second cross section (1D), and the end of the dummy internal electrode (4) are also parts of the lower external electrode of the first external electrode (5) and the second external electrode (6). In the first cross section (1C), the ends of the first internal electrode (2) and the dummy internal electrode (4), which are multiple linear-shaped electrodes extending in the width direction (W), and in the second cross section (1D), the ends of the second internal electrode (3) and the dummy internal electrode (4), which are multiple linear-shaped electrodes extending in the width direction (W), are each exposed at a distance (with the ends of the linear-shaped ceramic layer (1a) extending in the width direction (W) in between), but even though the ends of the first internal electrode (2), the ends of the second internal electrode (3), and the dummy internal electrode (4) are arranged at a distance, they function as a lower portion when forming the plated external electrode layer.

[0039] The first external electrode (5) and the second external electrode (6) include a Cu-plated external electrode layer (7) on the outer side of the lower external electrode. The Cu-plated external electrode layer (7) primarily functions to improve moisture resistance. Meanwhile, it is also preferable for the Cu-plated external electrode layer (7) to include Ni. In this case, dissolution of the external electrode layer to the solder can be suppressed.

[0040] The first external electrode (5) and the second external electrode (6) include a Ni-plated external electrode layer (8) on the outside of the Cu-plated external electrode layer (7). The Ni-plated external electrode layer (8) primarily functions to improve solder heat resistance and bonding properties. Meanwhile, it is also preferable that the Ni-plated external electrode layer (8) contains P. In this case, the mechanical strength of the external electrode layer can be improved.

[0041] The first external electrode (5) and the second external electrode (6) include an Au-plated external electrode layer (9) on the outside of the Ni-plated external electrode layer (8). The Au-plated external electrode layer (9) primarily functions to improve the wettability of the external electrode layer to the solder.

[0042] As can be seen from FIGS. 1 and 2, the multilayer ceramic capacitor (100) of the present embodiment has a ridge (E11) where the first main surface (1A) and the first cross-section (1C) are in contact, a ridge (E12) where the first main surface (1A) and the first side surface (1E) are in contact, a ridge (E13) where the first main surface (1A) and the second cross-section (1D) are in contact, and a ridge (E14) where the first main surface (1A) and the second side surface (1F) are in contact, and each R dimension of the ridge (E21) where the second main surface (1B) and the first cross-section (1C) are in contact, a ridge (E22) where the second main surface (1B) and the first side surface (1E) are in contact, a ridge (E23) where the second main surface (1B) and the second cross-section (1D) are in contact, and a ridge (E24) where the second main surface (1B) and the second side surface (1F) are in contact It is larger than the dimensions.

[0043] In this embodiment, a separate process is provided in the manufacturing process to increase the R dimension for the ridge (E11) where the first main surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first main surface (1A) and the first side surface (1E) meet, the ridge (E13) where the first main surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first main surface (1A) and the second side surface (1F) meet. Meanwhile, regarding the ridge (E21) where the second surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet, a process to increase the R dimension is not provided in the manufacturing process.

[0044] In a multilayer ceramic capacitor (100), the first main surface (1A) of a ceramic body (1) including a first external electrode (5) and a second external electrode (6) is a mounting surface for a substrate (as described above, "substrate" includes "substrate equivalent to a substrate"). Since the R dimensions of the ridge (E11) where the first main surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first main surface (1A) and the first side (1E) meet, the ridge (E13) where the first main surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first main surface (1A) and the second side (1F) meet are large (because the round is large), when placing the multilayer ceramic capacitor (100) on a substrate or the like to mount it, the impact is mitigated even if these ridges collide with the substrate or the electrode formed on the substrate, so that cracks or the like are suppressed in the ceramic body (1).

[0045] Meanwhile, it is preferable that the R dimensions of each of the ridge (E11) where the first main surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first main surface (1A) and the first side surface (1E) meet, the ridge (E13) where the first main surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first main surface (1A) and the second side surface (1F) meet, for example, be 1 μm or more and 10 μm or less. This is because if it is less than 1 μm, the effect of suppressing cracks, etc., from occurring in the ceramic body (1) is small. In addition, if it exceeds 10 μm, the process of increasing the R dimensions of each of these ridges takes time, which lowers the productivity of the multilayer ceramic capacitor. Meanwhile, it is preferable that the R dimensions of each of the ridge (E21) where the second surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet be, for example, less than 1 μm. This is because in this case, there is no need to provide a separate process to increase the R dimensions of each of these ridges.

[0046] Additionally, as can be seen from FIG. 1 and FIG. 2, the multilayer ceramic capacitor (100) of the present embodiment has an R dimension of an edge (C11) where the first main surface (1A), the first cross-section (1C), and the first side surface (1E) meet, an edge (C12) where the first main surface (1A), the first side surface (1E), and the second cross-section (1D) meet, an edge (C13) where the first main surface (1A), the second cross-section (1D), and the second side surface (1F) meet, and an edge (C14) where the first main surface (1A), the second side surface (1F), and the first cross-section (1C) meet, an edge (C21) where the second main surface (1B), the first cross-section (1C), and the first side surface (1E) meet, an edge (C22) where the second main surface (1B), the first side surface (1E), and the second cross-section (1D) meet, and an edge (C2) where the second main surface (1B) and the second The R dimension of the corner (C23) where the cross section (1D) and the second side (1F) meet, and the corner (C24) where the second main surface (1B), the second side (1F), and the first cross section (1C) meet, is larger than the R dimension of the second side (1F) and the second cross section (1C). This is due to the fact that the R dimensions of each ridge (E11) where the first main surface (1A) and the first cross section (1C) meet, the ridge (E12) where the first main surface (1A) and the first side (1E) meet, the ridge (E13) where the first main surface (1A) and the second cross section (1D) meet, and the ridge (E14) where the first main surface (1A) and the second side (1F) meet are larger than the R dimensions of each ridge (E21) where the second main surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second main surface (1B) and the first side (1E) meet, the ridge (E23) where the second main surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second main surface (1B) and the second side (1F) meet. In other words, the corner where two ridges with a large R dimension intersect has a larger R dimension than the corner where two ridges with a small R dimension intersect.

[0047] Since the R dimension of the first main surface (1A) and the first cross-section (1C) and the first side surface (1E) of the multilayer ceramic capacitor (100) are large, when the multilayer ceramic capacitor (100) is placed on a substrate or the like for mounting, the impact is mitigated even if these edges collide with the substrate or an electrode formed on the substrate, so that cracks or the like are suppressed in the ceramic body (1).

[0048] In the present embodiment, a plurality of embossing holes (10) are formed on the second main surface (1B) of the ceramic body (1). In the present embodiment, a plurality of embossing holes (10) of the same shape and same dimensions are formed on the second main surface (1B) of the ceramic body (1) in a state aligned in the longitudinal direction (L) and the width direction (W).

[0049] In the present application documents, an embossing hole refers to a hole having a bottom with a concave shape. The concave shape may be hemispherical or non-hemispherical. The dimensions, number, arrangement, spacing, and area formed of the embossing holes (10) are arbitrary and can be appropriately set. The method of forming the embossing holes (10) is also arbitrary. Meanwhile, whether an embossing hole (10) is formed on the second main surface (1B) can be easily verified by comparing it with another surface of the ceramic body (1) (e.g., the first main surface (1A), etc.).

[0050] In the multilayer ceramic capacitor (100), the second main surface (1B) of the ceramic body (1) is a surface that is adsorbed by, for example, the nozzle of a mounter device during mounting, and is a surface that is susceptible to impact by the nozzle. In the multilayer ceramic capacitor (100) of this embodiment, since a plurality of embossing holes (10) are formed on the second main surface (1B) of the ceramic body (1), even if impact is applied by the nozzle, etc., the ceramic body (1) is resistant to impact, and the occurrence of cracks, etc. is suppressed. Meanwhile, if the embossing holes (10) are fine enough to be within one to several tens of layers of ceramic layers (1a), the impact resistance of the ceramic body (1) can be improved well. However, if the depth of the embossing holes (10) becomes too large, it may conversely lower the overall strength of the ceramic body (1), so it is necessary not to make the depth of the embossing holes (10) too large.

[0051] The multilayer ceramic capacitor (100) of the present embodiment can be manufactured, for example, by the method shown in FIG. 5(A) to FIG. 6(J).

[0052] First, a ceramic green sheet (11a) is prepared to manufacture the ceramic layer (1a) of the ceramic body (1) shown in FIG. 5(A). Meanwhile, the ceramic green sheet (11a) is prepared as a mother ceramic green sheet (50) in which a plurality of ceramic green sheets (11a) are arranged in a matrix shape to manufacture a plurality of multilayer ceramic capacitors (100) in batches.

[0053] Although the process is omitted, first, dielectric ceramic powder, binder resin, solvent, etc. are prepared and wet-mixed to produce a ceramic slurry.

[0054] Next, a ceramic slurry is applied in the shape of a sheet onto a carrier film using a die coater, gravure coater, micro gravure coater, etc., and dried to produce a mother ceramic green sheet (50).

[0055] Next, as shown in FIG. 5(A), a conductive paste (12) for forming a first internal electrode (2), a conductive paste (13) for forming a second internal electrode (3), and a conductive paste (14) for forming a dummy internal electrode (4) are applied (e.g., printed) in a desired pattern shape on the main surface of a predetermined ceramic green sheet (11a) in a mother ceramic green sheet (50). For example, a conductive paste can be used that is a mixture of a solvent, a binder resin, a metal powder (e.g., Ni powder), etc.

[0056] Next, as shown in FIG. 5(B), a mother ceramic green sheet (50) is stacked in a predetermined order and compressed to produce a mother micro-ceramic body (60) in which a plurality of micro-ceramic bodies (11) are arranged in a matrix shape.

[0057] Next, as shown in FIG. 5(C), a jig (70) having a plurality of convex portions (70a) formed on its upper surface is prepared. Subsequently, the lower surface of a mother micro-ceramic body (60) is pressed against the convex portions (70a) of the jig (70). As a result, as shown in FIG. 4(D), a plurality of embossing holes (10) are formed on the second surface (1B) of each micro-ceramic body (11) of the mother micro-ceramic body (60).

[0058] Next, as shown in FIG. 6(E), the mother micro-ceramic body (60) is cut into each micro-ceramic body (11).

[0059] Next, a micro-ceramic body (11) is fired in a predetermined profile to produce a ceramic body (1) shown in FIG. 6(F). At this time, a conductive paste (12) is fired simultaneously inside the ceramic body (1) to form a first internal electrode (2), a conductive paste (13) is fired simultaneously to form a second internal electrode (3), and a conductive paste (14) is fired simultaneously to form a dummy internal electrode (4).

[0060] Next, a jig (80) is prepared as shown in FIG. 6(G). Then, the second main surface (1B) of the ceramic body (1) is fixed to the upper main surface of the jig (80). Subsequently, the first main surface (1A) of the ceramic body (1) is cut, for example, by sandblasting, so that the upper main surface of the dummy internal electrode (4) positioned closest to the first main surface (1A) of the ceramic body (1) is exposed to the first main surface (1A) of the ceramic body (1).

[0061] At this time, simultaneously, each ridge (E11) where the first surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first surface (1A) and the first side (1E) meet, the ridge (E13) where the first surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first surface (1A) and the second side (1F) meet are each cut, so that the R dimensions of each ridge (E11) where the first surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first surface (1A) and the first side (1E) meet, the ridge (E13) where the first surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first surface (1A) and the second side (1F) meet are such that the second surface (1B) and the first cross-section (1C) meet The R dimensions of each ridge (E21), the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet become larger (the round becomes larger).

[0062] Next, as shown in FIG. 6(H), the end of the first internal electrode (2), the second internal electrode (3), and the dummy internal electrode (4) drawn out through the first cross section (1C) and the second cross section (1D), and the upper main surface of the dummy internal electrode (4) exposed on the first main surface (1A) are made into lower external electrodes, and after applying a predetermined catalyst as needed to the surface of these lower external electrodes, electroless plating is performed to form a Cu plated external electrode layer (7).

[0063] Next, as shown in FIG. 6(I), a Ni-plated external electrode layer (8) is formed on the outer side of the Cu-plated external electrode layer (7) by performing electroless plating after applying a predetermined catalyst as needed.

[0064] Next, as shown in FIG. 6(J), an Au-plated external electrode layer (9) is formed on the outer side of the Ni-plated external electrode layer (8) by performing electroless plating after applying a predetermined catalyst as needed. By the above, a first external electrode (5) is formed in an L-shape on the first cross-section (1C) and the first main surface (1A) of the ceramic body (1), and a second external electrode (6) is formed in an L-shape on the second cross-section (1D) and the first main surface (1A) of the ceramic body (1), and a multilayer ceramic capacitor (100) according to the first embodiment is completed.

[0065] [Second embodiment]

[0066] FIG. 7 shows a multilayer ceramic capacitor (200) according to a second embodiment. FIG. 7 is a cross-sectional view of the multilayer ceramic capacitor (200).

[0067] The multilayer ceramic capacitor (200) according to the second embodiment has added a change to a part of the configuration of the multilayer ceramic capacitor (100) according to the first embodiment described above.

[0068] Specifically, in the multilayer ceramic capacitor (100), a dummy internal electrode (4) was used as part of the lower external electrode of the first external electrode (5) and the second external electrode (6). The multilayer ceramic capacitor (200) changed this and omitted the dummy internal electrode (4). Instead, the multilayer ceramic capacitor (200) formed a NiCr thin film layer (27) by sputtering as the lower external electrode of the first external electrode (25) and the second external electrode (26). The NiCr thin film layer (27) has high adhesion to the ceramic body (1) and serves as an excellent lower external electrode of the first external electrode (25) and the second external electrode (26).

[0069] Additionally, the multilayer ceramic capacitor (100) included, in order, a Cu-plated external electrode layer (7), a Ni-plated external electrode layer (8), and an Au-plated external electrode layer (9) on the outer side of the lower external electrode as the plated external electrode layers of the first external electrode (5) and the second external electrode (6). The multilayer ceramic capacitor (200) modified this so that, in order, a Ni-plated external electrode layer (28) and an Au-plated external electrode layer (29) were formed on the outer side of the NiCr thin film layer (27), which is the lower external electrode, as the plated external electrode layers of the first external electrode (25) and the second external electrode (26).

[0070] The other configuration of the multilayer ceramic capacitor (200) was made the same as that of the multilayer ceramic capacitor (100).

[0071] The multilayer ceramic capacitor (200), like the multilayer ceramic capacitor (100), has a ridge (E11) where the first main surface (1A) and the first cross section (1C) are in contact, a ridge (E12) where the first main surface (1A) and the first side (1E) are in contact, a ridge (E13) where the first main surface (1A) and the second cross section (1D) are in contact, and a ridge (E14) where the first main surface (1A) and the second side (1F) are in contact, and each R dimension of the ridge (E21) where the second main surface (1B) and the first cross section (1C) are in contact, a ridge (E22) where the second main surface (1B) and the first side (1E) are in contact, a ridge (E23) where the second main surface (1B) and the second cross section (1D) are in contact, and a ridge (E24) where the second main surface (1B) and the second side (1F) are in contact, and each R dimension of the ridge (E24) where the second main surface (1B) and the second side (1F) are in contact. Therefore, when the multilayer ceramic capacitor (200) is placed on a substrate or the like for mounting, the impact is mitigated even if these ridges collide with the substrate or the electrode formed on the substrate, so the occurrence of cracks, etc. in the ceramic body (1) is suppressed.

[0072] The multilayer ceramic capacitor (200) of the present embodiment can be manufactured, for example, by the method shown in FIGS. 8(A) to FIGS. 9(J).

[0073] First, a ceramic green sheet (11a) is prepared to manufacture the ceramic layer (1a) of the ceramic body (1) shown in FIG. 8(A). The ceramic green sheet (11a) is prepared as a mother ceramic green sheet (50) to manufacture a plurality of multilayer ceramic capacitors (100) in batches.

[0074] Next, as shown in FIG. 8(A), a conductive paste (12) for forming a pre-prepared first internal electrode (2) and a conductive paste (13) for forming a second internal electrode (3) are applied in a desired pattern shape on the main surface of a predetermined ceramic green sheet (11a) in the mother ceramic green sheet (50). Meanwhile, since the multilayer ceramic capacitor (200) does not include a dummy internal electrode, there is no case where a conductive paste for forming a dummy internal electrode is applied.

[0075] Next, as shown in FIG. 8(B), mother ceramic green sheets (50) are stacked in a predetermined order and compressed to produce a mother micro-ceramic body (60).

[0076] Next, as shown in FIG. 8(C), the lower main surface of the mother micro-ceramic body (60) is pressed against a jig (70) having a plurality of convex portions (70a) formed on the upper main surface, and as shown in FIG. 8(D), a plurality of embossing holes (10) are formed on the second main surface (1B) of each micro-ceramic body (11).

[0077] Next, as shown in FIG. 9(E), the mother micro-ceramic body (60) is cut into each micro-ceramic body (11).

[0078] Next, a micro-ceramic body (11) is fired in a predetermined profile to produce a ceramic body (1) shown in FIG. 9(F).

[0079] Next, as shown in FIG. 9(G), a jig (80) is prepared. Then, the second main surface (1B) of the ceramic body (1) is fixed to the upper main surface of the jig (80). Subsequently, for example, sandblasting is performed to cut the ridge (E11) where the first main surface (1A) and the first cross-section (1C) meet, the ridge (E12) where the first main surface (1A) and the first side surface (1E) meet, the ridge (E13) where the first main surface (1A) and the second cross-section (1D) meet, and the ridge (E14) where the first main surface (1A) and the second side surface (1F) meet, respectively, thereby increasing the R dimensions of these surfaces.

[0080] Next, as shown in FIG. 9(H), a NiCr thin film layer (27) is formed by sputtering as a lower external electrode of the first external electrode (25) and the second external electrode (26).

[0081] Next, as shown in FIG. 9(I), a Ni-plated external electrode layer (28) is formed on the outer side of the NiCr thin film layer (27), which is the lower external electrode of the first external electrode (25) and the second external electrode (26), by performing electroless plating after applying a predetermined catalyst as needed.

[0082] Next, as shown in FIG. 9(J), an Au-plated external electrode layer (29) is formed on the outer side of the Ni-plated external electrode layer (28) by performing electroless plating after applying a predetermined catalyst as needed. By the above, a first external electrode (25) is formed in an L-shape on the first cross-section (1C) and the first main surface (1A) of the ceramic body (1), and a second external electrode (26) is formed in an L-shape on the second cross-section (1D) and the first main surface (1A) of the ceramic body (1), thereby completing a multilayer ceramic capacitor (200) according to the second embodiment.

[0083] The above describes a multilayer ceramic capacitor (100, 200) according to an embodiment. However, the present invention is not limited to the above description, and various modifications may be added according to the spirit of the present invention.

[0084] For example, the above embodiment includes a process of increasing the R dimensions of each ridge (E11) where the first surface (1A) and the first cross section (1C) meet, the ridge (E12) where the first surface (1A) and the first side (1E) meet, the ridge (E13) where the first surface (1A) and the second cross section (1D) meet, and the ridge (E14) where the first surface (1A) and the second side (1F) meet, but does not include a process of increasing the R dimensions of each ridge (E21) where the second surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet. However, by modifying this to add a process of increasing the R dimensions of the ridge (E21) where the second surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet, and applying varying intensity to the extent of increasing the R dimensions in the two processes, the R dimensions of the ridge (E11) where the first surface (1A) and the first cross section (1C) meet, the ridge (E12) where the first surface (1A) and the first side (1E) meet, the ridge (E13) where the first surface (1A) and the second cross section (1D) meet, and the ridge (E14) where the first surface (1A) and the second side (1F) meet, The R dimensions of the ridge (E21) where the second surface (1B) and the first cross section (1C) meet, the ridge (E22) where the second surface (1B) and the first side (1E) meet, the ridge (E23) where the second surface (1B) and the second cross section (1D) meet, and the ridge (E24) where the second surface (1B) and the second side (1F) meet may be made larger than the respective R dimensions.

[0085] In addition, in the above embodiment, an embossing hole (10) was formed on the second main surface (1B) of the ceramic body (1), but in the multilayer ceramic capacitor of the present invention, the embossing hole (10) is not an essential component and can be omitted.

[0086] A multilayer ceramic capacitor according to one embodiment of the present invention is as described in the section of "Means for solving the problem".

[0087] In this multilayer ceramic capacitor, it is also desirable that the R dimension of the ridges where the first main surface, the first cross-section, the second cross-section, the first side, and the second side contact each other is 1 μm or more and 10 μm or less. This is because if it is less than 1 μm, the effect of suppressing cracks, etc., from occurring in the ceramic body when these ridges collide with a substrate, etc. is small. In addition, if it exceeds 10 μm, the productivity of the multilayer ceramic capacitor decreases because the process of increasing the R dimension of each of these ridges takes time.

[0088] In addition, it is also desirable that the R dimension of the edge where the first surface, the first cross-section, and the first side surface meet, the edge where the first surface, the first side surface, and the second cross-section meet, and the edge where the first surface, the second side surface, and the first cross-section meet is greater than the R dimension of the edge where the second surface, the first cross-section, and the first side surface meet, the edge where the second surface, the first side surface, and the second cross-section meet, the edge where the second surface, the second cross-section, and the second side surface meet, and the edge where the second surface, the second side surface, and the first cross-section meet. In this case, since the R dimension of the first main surface and the first cross-section and the first side surface contacting the corner provided on the mounting surface side, the first main surface and the first side surface and the second cross-section contacting the corner, the first main surface and the second cross-section and the second side surface contacting the corner, and the first main surface and the second side surface and the first cross-section contacting the corner is large, when placing the multilayer ceramic capacitor on a substrate or the like to mount it, the impact is mitigated even if these corners collide with the substrate or the electrode formed on the substrate, so the occurrence of cracks, etc. in the ceramic body is suppressed.

[0089] In addition, it is desirable to form a plurality of embossed holes on the second main surface of the ceramic body. In this case, for example, when the second main surface is adsorbed by the nozzle of a mounter device, the ceramic body is resistant to impact even when impact is applied by the nozzle, thereby suppressing the occurrence of cracks or the like in the ceramic body.

[0090] It is also preferable that the first external electrode and the second external electrode each include a lower external electrode and at least one plated external electrode layer formed on the outer side of the lower external electrode. In this case, the plated external electrode layer can be easily formed on the outer side of the lower external electrode, for example by electroless plating, with the lower external electrode as the bottom.

[0091] In addition, it is also preferable that the lower external electrode has a smaller longitudinal dimension than the first internal electrode and the second internal electrode, and includes a dummy internal electrode exposed on the first main surface of the ceramic body. In this case, the first external electrode and the second external electrode, which have a relatively large surface area on the first main surface of the ceramic body, can be easily formed.

[0092] It is also desirable that the dummy internal electrode, the first internal electrode, and the second external electrode be formed of the same material. In this case, there is no need to prepare a separate material to form the dummy internal electrode, which is the lower external electrode, thereby improving the productivity of the multilayer ceramic capacitor.

[0093] It is also desirable for the dummy internal electrode to have Ni as its main component. In this case, the ceramic body, the first internal electrode, the second external electrode, and the dummy internal electrode can be easily manufactured by so-called simultaneous firing.

[0094] It is also desirable for the lower external electrode to be a thin film. In this case, the lower external electrode can be easily formed, for example, by sputtering.

[0095] In this case, it is also desirable for the thin film to have NiCr as its main component. In this case, the adhesion to the ceramic body is high, making it an excellent lower external electrode for the first and second external electrodes.

[0096] It is also preferable that the plated external electrode layer comprises at least one selected from a Cu-plated external electrode layer, a Ni-plated external electrode layer, and an Au-plated external electrode layer. In this case, various functions can be exhibited in each plated external electrode layer to form an excellent first external electrode and a second external electrode.

[0097] It is also preferable that the plated external electrode layer includes a Ni-plated external electrode layer formed on the outer side of the lower external electrode and an Au-plated external electrode layer formed on the outer side of the Ni-plated external electrode layer. In this case, the Ni-plated external electrode layer can primarily function to improve solder heat resistance and bonding properties, and the Au-plated external electrode layer (9) can primarily function to improve the wettability of the external electrode layer with respect to the solder.

[0098] It is also preferable that the plated external electrode layer includes a Cu plated external electrode layer formed on the outer side of the lower external electrode, a Ni plated external electrode layer formed on the outer side of the Cu plated external electrode layer, and an Au plated external electrode layer formed on the outer side of the Ni plated external electrode layer. In this case, the Cu plated external electrode layer (7) can primarily function to improve moisture resistance, the Ni plated external electrode layer can primarily function to improve solder heat resistance and bonding properties, and the Au plated external electrode layer (9) can function to improve the wettability of the external electrode layer with respect to the solder.

[0099] It is also desirable for the Ni-plated external electrode layer to contain P. In this case, the mechanical strength of the external electrode layer is improved.

[0100] It is also desirable for the Cu-plated external electrode layer to contain Ni. In this case, dissolution of the external electrode layer with respect to solder can be suppressed.

[0101] It is also desirable that one of the longitudinal dimension and the width dimension is 1.0 mm or less, and the other is 0.5 mm or less. In addition, it is desirable that the height dimension is 0.1 mm or less. Even when the present invention is applied to a miniaturized and thin-layered multilayer ceramic capacitor, the R dimension of the ridge where the first main surface, which is the mounting surface, and the first cross-section, first side, second cross-section, and second side contact is large, so that cracks or the like are suppressed in the ceramic body even if these ridges collide with a substrate or an electrode formed on the substrate during mounting. Explanation of the symbols

[0102] 1: Ceramic body 1a: Ceramic layer 1A: 1st face 1B: 2nd face 1C: First section 1D: Second section 1E: 1st side 1F: 2nd side 2: First internal electrode 3: Second internal electrode 4: Dummy internal electrode 5: First external electrode 6: Second external electrode 7: Cu-plated external electrode layer 8, 28: Ni-plated external electrode layer 9, 29: Au-plated external electrode layer 27: NiCr thin film layer (lower external electrode) 10: Embossed hole

Claims

Claim 1 A ceramic body comprising a plurality of ceramic layers, a plurality of first internal electrodes, and a plurality of second internal electrodes stacked in the height direction, a first main surface and a second main surface facing in the height direction, a first end surface and a second end surface facing in the length direction orthogonal to the height direction, and a first side surface and a second side surface facing in the width direction orthogonal to the height direction and the length direction, and a first external electrode and a second external electrode formed on the outer surface of the ceramic body, wherein the first internal electrode is drawn out through the first end surface and is electrically connected to the first external electrode, and the second internal electrode is drawn out through the second end surface and is electrically connected to the second external electrode, wherein when viewed from a cross-sectional plane parallel to the first side surface and the second side surface, the first external electrode is formed in an L-shape on the first end surface and the first main surface, and the second external electrode A multilayer ceramic capacitor formed in an L-shape on the second cross section and the first main surface, wherein the R dimension of the first ridge portion where the first main surface, the first cross section, the first side, the second cross section, and the second side contact is greater than the R dimension of the second ridge portion where the second main surface, the first cross section, the first side, the second cross section, and the second side contact is, and the ceramic of the first ridge portion covered by the first external electrode and the second external electrode has the same composition. Claim 2 A multilayer ceramic capacitor according to claim 1, wherein the R dimension of the first ridge portion is 1 μm or more and 10 μm or less. Claim 3 A multilayer ceramic capacitor according to claim 1, wherein the R dimension of the edge where the first surface, the first cross-section, and the first side surface contact, the edge where the first surface, the first side surface, and the second cross-section contact, the edge where the first surface, the second cross-section, and the second side surface contact, and the edge where the first surface, the second side surface, and the first cross-section contact is greater than the R dimension of the edge where the second surface, the first cross-section, and the first side surface contact, the edge where the second surface, the first side surface, and the second cross-section contact, the edge where the second surface, the second cross-section, and the second side surface contact, and the edge where the second surface, the second side surface, and the first cross-section contact. Claim 4 A multilayer ceramic capacitor according to claim 1, wherein a plurality of embossed holes are formed on the second main surface. Claim 5 A multilayer ceramic capacitor according to claim 1, wherein the first external electrode and the second external electrode each comprise a lower external electrode and at least one plated external electrode layer formed on the outer side of the lower external electrode. Claim 6 A multilayer ceramic capacitor according to claim 5, wherein the lower external electrode has a lengthwise dimension smaller than that of the first internal electrode and the second internal electrode, and includes a dummy internal electrode exposed on the first main surface of the ceramic body. Claim 7 A multilayer ceramic capacitor according to claim 6, wherein the dummy internal electrode, the first internal electrode, and the second external electrode are formed of the same material. Claim 8 In claim 6, a multilayer ceramic capacitor in which the internal electrode of the dummy is composed mainly of Ni. Claim 9 In paragraph 5, a multilayer ceramic capacitor in which the lower external electrode is a thin film. Claim 10 In claim 9, the above thin film is a multilayer ceramic capacitor having NiCr as the main component. Claim 11 A multilayer ceramic capacitor according to claim 5, wherein the plated external electrode layer comprises at least one selected from a Cu plated external electrode layer, a Ni plated external electrode layer, and an Au plated external electrode layer. Claim 12 A multilayer ceramic capacitor according to claim 11, wherein the plated external electrode layer comprises a Ni-plated external electrode layer formed on the outer side of the lower external electrode and an Au-plated external electrode layer formed on the outer side of the Ni-plated external electrode layer. Claim 13 A multilayer ceramic capacitor according to claim 11, wherein the plated external electrode layer comprises a Cu plated external electrode layer formed on the outer side of the lower external electrode, a Ni plated external electrode layer formed on the outer side of the Cu plated external electrode layer, and an Au plated external electrode layer formed on the outer side of the Ni plated external electrode layer. Claim 14 A multilayer ceramic capacitor according to claim 11, wherein the Ni-plated external electrode layer comprises P. Claim 15 A multilayer ceramic capacitor according to claim 11, wherein the Cu-plated external electrode layer comprises Ni. Claim 16 A multilayer ceramic capacitor according to any one of claims 1 to 15, wherein one of the longitudinal dimension and the width dimension is 1.0 mm or less and the other is 0.5 mm or less. Claim 17 A multilayer ceramic capacitor according to any one of claims 1 to 15, wherein the height dimension is 0.1 mm or less.

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