Self-heating carrier module comprising a carrier unit in which a plurality of carriers are integrally coupled

Abstract

The present disclosure relates to a self-heating carrier module with improved maintainability and durability by applying a sliding detachable structure. Specifically, the carrier unit is configured to slide using guide rails and grooves, thereby enabling independent replacement and maintenance of damaged sections.

Description

Technology Field

[0001] The present invention relates to a self-heating carrier module, and more specifically, to a self-heating carrier module in which the outer carrier region to which an electrode is attached is modularized into a separate unit, so that when the carrier is damaged due to voltage application by the electrode or thermal stress concentration, only that unit can be independently separated and replaced, thereby facilitating maintenance.

[0002] This research was conducted with support from the following Republic of Korea National Research and Development Project.

[0003] [Project ID] 2410013085

[0004] [(Institution) Sub-project No.] 20023008

[0005] [Ministry Name] Ministry of Trade, Industry and Energy

[0006] [Name of Project Management (Specialized) Agency] Korea Institute of Industrial Technology Evaluation and Management

[0007] [Research Project Name] Excellent Corporate Research Institute Development Project (ATC+)

[0008] [Research Project Title] Development of a VOCs Reduction System Applying Self-Heating Carrier-Based Adsorption-Desorption Smart Control and ICT Technology for Energy Reduction (Over 10%)

[0009] [Name of Project Performing Organization] Youngjin IND Co., Ltd.

[0010] [Research Period] April 1, 2023 – December 31, 2026 Background Technology

[0011] Self-heating carrier modules are structured to generate heat directly by passing an electric current through the carrier, offering the advantage of rapidly and efficiently securing the temperatures required to decompose harmful gases in catalytic oxidation facilities. However, since these heating carriers are continuously exposed to high-temperature and high-voltage environments, structural stability and component lifespan management are directly linked to the operating costs of the equipment; therefore, a durability design suitable for these conditions is required.

[0012] Conventional heating carrier modules have primarily utilized a structure in which multiple unit carriers are stacked without separation and fixed as a single block. However, this structure has a problem in that voltage loads and thermal stress tend to concentrate in the carrier portion directly connected to the electrode, resulting in a significantly higher frequency of failure compared to the inner portion. Conventional carrier structures have limitations in that it is difficult to physically separate only the damaged outer portion, so the entire carrier, including the inner carrier, must be replaced even with only localized damage to the outer portion, making it inefficient.

[0013] Accordingly, there is a need for a structure in which the outer portion of the carrier, which is at high risk of damage by the electrode, is unitized or modularized so that only the corresponding outer module can be replaced independently in the event of damage.

[0014] The matters described in the background technology above are intended to aid in understanding the background of the invention and may include matters that are not disclosed prior art. Prior art literature

[0015] Japanese Patent Publication No. 2011-246340 (Title: Honeycomb structure and method of manufacturing the same) The problem to be solved

[0016] The present invention was devised to solve the problems of the prior art as described above, and the objective of the present invention is to provide a modular self-heating carrier module in which the outer carriers to which electrodes are attached are formed into an integrated module, so that when the outer carrier is damaged by high voltage or thermal stress applied from the electrode, only the damaged outer module can be replaced independently without discarding the inner carrier.

[0017] In addition, the purpose is to minimize physical damage or delamination of the electrode connection points that may occur during the replacement process by forming a structure in which the outer module with the attached electrode and the inner module are physically separable during maintenance or replacement of the carrier module.

[0018] In addition, another objective of the present invention is to provide a double module structure in which an inner module and an outer module are slidably coupled through a guide method, thereby reducing downtime of the equipment and significantly improving the convenience and economic efficiency of maintenance. means of solving the problem

[0019] A self-heating carrier module may include a plurality of first carriers, a plurality of second carriers disposed on the outside of the plurality of first carriers, and an electrode portion disposed on the outside of the plurality of second carriers, wherein at least some of the carriers among the plurality of second carriers that are electrically connected to the electrode portion may be integrally combined to form a second carrier unit, and the second carrier unit may be configured to be integrally detachable from the self-heating carrier module.

[0020] The plurality of second carriers of the self-heating carrier module may be characterized by forming a polygonal second carrier frame that surrounds the outer periphery of the entire plurality of first carriers.

[0021] The self-heating carrier module may be characterized in that a plurality of second carriers constituting the second carrier unit are integrally formed by mutually bonding them via a conductive adhesive.

[0022] The self-heating carrier module may further include a conductive partition disposed between the plurality of first carriers and the second carrier unit to electrically connect the plurality of first carriers and the second carrier unit.

[0023] A conductive buffer member may be disposed between the electrode portion and the second carrier unit of the self-heating carrier module, and the conductive buffer member may be disposed to be in close contact with the second carrier unit and the electrode portion.

[0024] The self-heating carrier module may further include a conductive case that accommodates the second carrier unit, and the second carrier unit may be characterized by being accommodated and fixed inside the conductive case to form an integral assembly.

[0025] The plurality of first carriers of the self-heating carrier module may be integrally combined with each other to form a first carrier unit, and the first carrier unit may be characterized by being detachably coupled with the second carrier unit.

[0026] The second carrier unit of the self-heating carrier module may be characterized by being detachably coupled to a second carrier adjacent to the second carrier unit among the plurality of second carriers.

[0027] The second carrier unit of the self-heating carrier module may be characterized by being detachably coupled to a first carrier adjacent to the second carrier unit.

[0028] The second carrier unit of the self-heating carrier module may further include a carrier guide formed on the second carrier unit to allow the second carrier unit to be slidably detached from an adjacent first carrier or second carrier.

[0029] The self-heating carrier module may further include a linear first guide coupling portion composed of a conductive material, and the first guide coupling portion may include a first guide rail formed on either the electrode portion or the second carrier unit, and a first guide groove formed on the other of the electrode portion or the second carrier unit into which the guide rail is inserted, and the first guide rail and the first guide groove may be slidably coupled to each other.

[0030] A conductive member may be disposed between the electrode portion and the second carrier unit of the self-heating carrier module, and may further include a linear second guide coupling portion composed of a conductive material, wherein the second guide coupling portion may include a second guide rail formed on either the electrode portion or the conductive member and a second guide groove formed on the other of the electrode portion or the second carrier unit into which the second guide rail is inserted. Effects of the invention

[0031] The modular self-heating carrier module according to the present invention has the following effects.

[0032] First, the economic efficiency and effectiveness of maintenance can be dramatically improved. Conventionally, even if localized damage occurred on the outer side of the carrier in contact with the electrode, the entire module had to be discarded. However, the present invention forms the outer carriers to which the electrode is attached into an integrated outer carrier module, so that if the outer carrier module is damaged due to thermal stress or electrical load caused by the electrode, only that part can be replaced independently. Through this, the inner carrier located on the inside can be reused as is, thereby reducing maintenance costs.

[0033] Second, damage to the electrode portion can be fundamentally prevented during carrier replacement. It can resolve issues such as delamination or physical damage to the electrode joint surface that frequently occur during the replacement of the outer carrier module. Since the outer carrier module is structurally integrated, physical stress applied to the electrode connection area can be minimized when replacing the inner carrier or removing the outer carrier module itself; this extends the durability of the electrode and prevents a decrease in heat generation efficiency caused by poor contact.

[0034] Third, rapid replacement via guides is possible. Since the carriers are formed with a structure that allows them to be separated from one another and can be slidably joined using a guide system, operators can quickly replace only the damaged module without a complex dismantling process. As a result, equipment downtime is reduced, which can increase the productivity of the gas treatment process. Brief explanation of the drawing

[0035] FIG. 1(a) is an exploded perspective view of a self-heating carrier module (10) according to one embodiment of the present invention. FIG. 1(b) is a combined perspective view of a self-heating carrier module (10) according to one embodiment of the present invention. FIG. 2(a) is a front view of a self-heating carrier module (10) according to an embodiment of the present invention. FIG. 2(b) is a front view of a self-heating carrier module (10-1) including a conductive partition (310) according to an embodiment of the present invention. FIG. 2(c) is a front view of a self-heating carrier module (10-2) including a conductive buffer member (320) according to an embodiment of the present invention. FIG. 2(d) is a front view of a self-heating carrier module (10-3) including a conductive case (330) according to an embodiment of the present invention. FIG. 3(a) is an exploded perspective view of a self-heating carrier module (10-4) having a first guide coupling part (410) arranged according to one embodiment of the present invention. FIG. 3(b) is a combined perspective view of a self-heating carrier module (10-4) having a first guide coupling part (410) arranged according to one embodiment of the present invention, and a drawing showing a detached form of a second carrier unit (120). FIG. 4(a) is an exploded perspective view of a self-heating carrier module (10-5) further comprising a conductive member (340) having a second guide coupling part (420) arranged thereon according to one embodiment of the present invention. FIG. 4(b) is a combined perspective view of a self-heating carrier module (10-5) having a second guide coupling part (420) arranged according to one embodiment of the present invention, and a drawing showing the form in which the second carrier unit (120) and the conductive member (340) are detached. Figure 5 is a plan view of Figure 4 seen from the top surface. FIG. 6(a) is an exploded perspective view of a self-heating carrier module (10-6) further comprising a divided conductive member (340D) having a second divided guide coupling part (420D) arranged thereon according to one embodiment of the present invention. FIG. 6(b) is a combined perspective view of a self-heating carrier module (10-6) having a second split guide coupling part (420D) arranged according to one embodiment of the present invention, and a drawing showing the form in which the second split carrier unit (120D) and the conductive member (340) are detached. Specific details for implementing the invention

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0037] The embodiments are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention.

[0038] The terms used herein are for describing specific embodiments and are not intended to limit the invention. Additionally, the singular form in this specification may include the plural form unless the context clearly indicates otherwise. Terms such as “comprising,” “having,” and “having” in this application are intended to specify the presence of features, numbers, steps, actions, components, parts, or combinations thereof of the invention, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0039] In the description of the embodiments, where each layer (film), region, pattern, or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad, or pattern, "on" and "under" include both being formed "directly" and "indirectly" through another layer. In addition, the reference for the top or bottom of each layer is, in principle, based on the drawings.

[0040] The drawings are intended solely to facilitate an understanding of the concept of the present invention and should not be interpreted as limiting the scope of the invention. Additionally, relative thicknesses, lengths, or sizes in the drawings may be exaggerated for convenience and clarity of explanation.

[0041] A self-heating carrier module according to one embodiment of the present invention is a device that generates heat in a carrier using an electric current, and may apply a method of arranging electrodes around the carrier. The self-heating carrier module can improve heating efficiency and secure a uniform temperature distribution by shortening the path of the current without obstructing the flow of fluid.

[0042] A carrier module according to one embodiment of the present invention is a structure that supports a catalyst component for decomposing / removing pollutants (exhaust gas, malodorous gas, carbon monoxide, hydrocarbons, nitrogen oxides, volatile organic compounds (VOCs), etc.), and can play a role in improving the efficiency and selectivity of the catalytic reaction by providing a large surface area to increase the physical and chemical stability of the catalyst.

[0043] Self-heating carrier modules according to one embodiment of the present invention can be pressed inward from a pressurizing device positioned on the outer side of the electrode portion and fixed in close contact with one another. Accordingly, the present invention can secure structural stability capable of withstanding vibration or shock without using separate fastening members such as bolts or clips, thereby simplifying the assembly process and providing the effect of reducing manufacturing costs. However, it is obvious that auxiliary fixing means may be added in consideration of extreme vibration environments.

[0044] FIG. 1(a) is an exploded perspective view of a self-heating carrier module (10) according to one embodiment of the present invention, and FIG. 1(b) is an assembled perspective view of a self-heating carrier module (10) according to one embodiment of the present invention.

[0045] Referring to FIG. 1, a self-heating carrier module (10) according to one embodiment of the present invention may include a carrier module (100) and an electrode portion (200) disposed on the outside of the carrier module (100).

[0046] The carrier module (100) may include a plurality of first carriers (111) and a plurality of second carriers (121) disposed outside the plurality of first carriers (111).

[0047] The carrier module (100) may be configured to include a front portion having a plurality of inlets, a main body portion having a plurality of flow paths communicating with each of the plurality of inlets, a rear portion having a plurality of discharge ports communicating with each of the plurality of flow paths, and a side portion having no inlets or discharge ports.

[0048] The carrier module (100) can be formed to be connected so that fluid introduced through the inlet of the front part passes through the flow path formed in the main body and is discharged through the outlet of the rear part.

[0049] The first carrier (111) and the second carrier (121) constituting the carrier module (100) are formed by attachment (or coupling) between side portions where a flow path is not formed.

[0050] The carrier module (100) is a structure that supports a catalyst component for decomposing / removing pollutants (exhaust gas, odorous gas, carbon monoxide, hydrocarbons, nitrogen oxides, volatile organic compounds VOCs, etc.), and can improve the efficiency and selectivity of the catalytic reaction by providing a large surface area to increase the physical and chemical stability of the catalyst.

[0051] The carrier module (100) may be coated with a catalyst, and the catalyst may be a metal oxide-based catalyst capable of decomposing / removing contaminant gas, a precious metal-based catalyst (Pt, Pd, Rh, Ir, Ru, etc.), a zeolite-based catalyst, an SCR-based catalyst, a photocatalyst, etc.

[0052] The carrier module (100) may include a monolithic honeycomb structure.

[0053] The carrier module (100) may be composed of a ceramic material (silicon carbide, etc.).

[0054] A plurality of first carriers (111) may be formed into a first carrier unit (110) in which at least some of the carriers are connected and combined with each other.

[0055] The second carrier unit (120) can be configured to be integrally detachable from the self-heating carrier module (10).

[0056] Among the plurality of second carriers (121), at least some carriers electrically connected to the electrode portion (200) may be integrally combined to form a second carrier unit (120).

[0057] Among the outer second carriers (121a), at least some carriers electrically connected to the electrode portion (200) may be integrally combined to form a second carrier unit (120).

[0058] The second carrier (121) may be configured with an outer second carrier (121a) positioned adjacent to the electrode portion (200) and an inner second carrier (121b) positioned on the outer side of the carrier module (100).

[0059] A second carrier (121) is disposed on the outside of the first carrier (111), and an electrode portion (200) is disposed on the outside of the second carrier (121), so that the carrier module (100) can generate heat from the current of the electrode.

[0060] The second carrier (121) can be formed as a polygonal second carrier frame that surrounds the entire outer periphery of a plurality of first carriers. This arrangement structure allows a complex plurality of carriers to be operated by dividing them into two main components: an inner first carrier area and an outer second carrier area. In particular, by providing a structure that allows only the outer part (second carrier unit), which is in direct contact with the external environment and has a high frequency of damage due to thermal stress or physical impact, to be selectively separated, an economic and convenient effect can be obtained in which only the damaged outer part can be easily attached and detached for maintenance without replacing the entire module.

[0061] The second carrier unit (120) can be formed integrally by being joined together via a conductive adhesive.

[0062] A conductive adhesive can be applied to the contact surface between the outer second carriers (121a) to bond them together, thereby forming a physically solid second carrier unit (120). At this time, the conductive adhesive can serve not only as a simple physical fixation but also as a medium to form an electrical conduction path between adjacent carriers, thereby allowing a uniform current to flow throughout the second carrier unit.

[0063] Conductive adhesives can be composed of a conductive binder.

[0064] The conductive adhesive can be formed as a paste or slurry in which a conductive filler based on a heat-resistant inorganic binder is dispersed. In this case, the conductive filler may be a mixture of metal powders with excellent conductivity, such as silver, copper, or nickel, or carbon-based materials such as graphite, carbon nanotubes, or silicon carbide, which can minimize the difference in the coefficient of thermal expansion with the carrier. Additionally, it may include a component that can minimize the difference in the coefficient of thermal expansion with the carrier.

[0065] FIG. 2(a) is a front view of a self-heating carrier module (10) according to an embodiment of the present invention. FIG. 2(b) is a front view of a self-heating carrier module (10-1) including a conductive partition (310) according to an embodiment of the present invention.

[0066] Referring to FIG. 2, a self-heating carrier module (10-1) may have a conductive partition (310) disposed between a plurality of first carriers (111) and second carrier units (120). The conductive partition (310) may electrically connect an inner region of the module (the region of the first carrier 111 or the first carrier unit 110) and an outer region (the region of the second carrier 121a or the second carrier unit 120).

[0067] The conductive partition (310) can physically partition the inner region of the module (the region of the first carrier 111 or the first carrier unit 110) and the outer region (the region of the second carrier 121a or the second carrier unit 120), and at the same time, perform the function of mediating electrical flow between the two regions.

[0068] The conductive partition (310) can serve as a barrier to prevent the first carrier (111) and the second carrier unit (120) from being fused together by heat or fixed by adhesive. Additionally, there is an advantage that maintenance is easy because the second carrier (121) placed on the outside can be independently separated and replaced when damaged.

[0069] The conductive bulkhead (310) can be arranged to surround the first carrier unit (110).

[0070] The first carrier (111) and the second carrier unit (120) (or the second carrier 121) are physically separated by a conductive partition (310), but are made of an electrically conductive material so as to be able to supply current uniformly, so that current can be evenly transmitted to the first carrier (111) without loss.

[0071] FIG. 2(c) is a front view of a self-heating carrier module (10-2) including a conductive buffer member (320) according to an embodiment of the present invention.

[0072] A conductive buffer member (320) may be disposed between the electrode portion (200) of the self-heating carrier module (10-2) and the second carrier unit (120).

[0073] The conductive buffer member (320) may be formed as a conductive member or a conductive elastic member and may be formed in close contact to fill the gap formed between the second carrier unit (120) and the electrode part (200). As a result, the current between the second carrier unit (120) and the electrode part (200) may be evenly distributed.

[0074] Generally, the surface of the carrier has fine irregularities or curves, so the flatness is uneven. Therefore, when the electrode part is directly attached (or bonded) to the surface of the carrier, a gap, which is a fine space between the electrode part and the carrier, may inevitably be formed. The conductive buffer member (320) can be formed to closely fill this gap without any gaps. This not only enhances the mechanical bond between the electrode part (200) and the second carrier unit (120), but also performs a buffering function that prevents damage to the carrier by absorbing stress caused by external vibrations or differences in thermal expansion coefficients.

[0075] In addition, since the conductive buffer member (320) is in close contact with the electrode part (200) and the second carrier unit (120), current can be supplied evenly, thereby preventing hot spot phenomena that occur when the current is concentrated only at specific contact points.

[0076] The conductive buffer member (320) can be formed with a porous structure. Due to the porous structure, it can be flexibly compressed and deformed, which is advantageous for filling voids. In addition, the porous structure allows for the simultaneous securing of heating function and flow performance.

[0077] The conductive buffer member (320) can be formed with an opening rate of 60% or more and 95% or less. Preferably, it can be formed to have an opening rate of 70% or more and less than 90%. Within this range, the conductive buffer member (320) can supply current evenly by having a dense internal framework and can fill fine irregularities on the surface of the carrier without gaps.

[0078] If the porosity becomes excessively high (e.g., 90% or more), the metal content and density decrease, causing a rapid decline in electrical conductivity and insufficient mechanical strength, which may lead to deformation or breakage during long-term use. Conversely, if the porosity becomes too low (e.g., less than 60%), flexibility may be insufficient, resulting in reduced adhesion.

[0079] The conductive buffer member (320) can become more dense when properly compressed by the fastening pressure of the second carrier unit (120) and the electrode part (200), thereby reducing electrical resistance and simultaneously filling in fine irregularities on the surface of the carrier without gaps, thus providing optimal adhesion performance.

[0080] FIG. 2(d) is a front view of a self-heating carrier module (10-3) including a conductive case (330) according to an embodiment of the present invention.

[0081] The conductive case (330) may be formed of a conductive material. The conductive case (330) may be formed in the shape of a case that surrounds the side portion of the second carrier unit.

[0082] The conductive case (330) can be formed to form a single assembly by accommodating and securing the second carrier unit (120) inside. This allows the second carrier unit (120) to be easily replaced in a cartridge format.

[0083] The conductive case (330) is formed of multiple divided case members rather than a single frame, so that the second carrier unit (120) housed inside can be divided into multiple regions. As a result, even if local damage occurs to the second carrier unit (120), only the case of a specific section can be selectively separated and replaced without replacing the entire unit, thereby reducing maintenance costs and time.

[0084] Although not shown, the first carrier (111) and the second carrier (121) can be detachably combined with each other.

[0085] A plurality of first carriers (111) can be integrally combined with each other to form a first carrier unit (110), and the first carrier unit (110) can be detachably combined with a second carrier unit (120).

[0086] A plurality of second carrier units (120) can be detachably coupled to an inner second carrier (121b) adjacent to the second carrier unit (120) among a plurality of second carriers (121).

[0087] The second carrier unit (120) can be detachably coupled to the first carrier (111) or the second carrier (121) adjacent to the second carrier unit (120).

[0088] That is, the present invention can be configured to enable physical detachment between the first carrier (111) and the second carrier (121), or between adjacent carriers. This independent separation structure allows for the selective separation and cleaning or replacement of only the damaged carrier without discarding the entire module in the event of clogging due to dust adsorption or damage caused by thermal stress. As a result, the convenience of maintenance work can be greatly improved, and the effect of drastically reducing equipment operating costs can be provided.

[0089] The second carrier unit (120) may further include a carrier guide (not shown) formed on the second carrier unit (120) to allow the second carrier unit (120) to slide detachably from an adjacent first carrier (111) or second carrier (121).

[0090] The self-heating carrier module (10) may further include a carrier guide (not shown) that guides the detachment movement path of the second carrier unit (120). The carrier guide can form a movement path when the second carrier unit is separated from an adjacent first carrier (111) or second carrier. The carrier guide may be of a rail type, T-bar type, coupling type, dovetail type, etc. As a result, it can be configured so that vertical detachment is prevented, while sliding detachment is possible in the longitudinal direction (in the direction of the front and rear of the carrier).

[0091] Specifically, the second carrier unit (120) can be inserted in the longitudinal direction by entering through the front or rear portion of the electrode portion. At this time, the mutual coupling of the guide rail and the groove can provide a restraining force that prevents deviation in the vertical direction intersecting the longitudinal direction.

[0092] FIG. 3(a) is an exploded perspective view of a self-heating carrier module (10-4) having a first guide coupling part (410) arranged according to one embodiment of the present invention, and FIG. 3(b) is an assembled perspective view of a self-heating carrier module (10-4) having a first guide coupling part (410) arranged according to one embodiment of the present invention and a drawing showing the form in which the second carrier unit (120) is detached.

[0093] Referring to FIG. 3, the self-heating carrier module (10-4) may include a linear first guide coupling part (410) composed of a conductive material that guides the electrode part (200) and the second carrier unit (120) to be detached in a sliding manner. The first guide coupling part (410) may include a first guide rail (411) formed on either the electrode part (200) or the second carrier unit (120), and a first guide groove (412) formed on the other of the electrode part (200) and the conductive member (340) into which the first guide rail (411) is inserted.

[0094] The first guide rail (411) and the first guide groove (412) can be slidably coupled to each other.

[0095] The first guide coupling part (410) may be configured to have a shape such as a rail type, T-bar type, coupling type, or dovetail type. At this time, the first guide rail (411) and the guide groove (412) may be configured to be interlocked and fixed so that vertical detachment is prevented, while allowing sliding detachment in the longitudinal direction.

[0096] FIG. 4(a) is an exploded perspective view of a self-heating carrier module (10-5) further comprising a conductive member (340) having a second guide coupling part (420) arranged thereon according to one embodiment of the present invention, FIG. 4(b) is an assembled perspective view of a self-heating carrier module (10-5) having a second guide coupling part (420) arranged thereon according to one embodiment of the present invention, and a drawing showing the form in which the second carrier unit (120) and the conductive member (340) are detached.

[0097] Referring to FIG. 4, a conductive member (340) may be disposed between the electrode portion (200) and the second carrier unit (120) of the self-heating carrier module (10-5). A linear second guide coupling portion (420) composed of a conductive material that guides the electrode portion (200) and the conductive member (340) to be detached in a sliding manner may be further included. The second guide coupling portion (420) may include a second guide rail (421) formed on either the electrode portion (200) or the conductive member (340), and a second guide groove (422) formed on the other of the electrode portion (200) and the conductive member (340) into which the second guide rail (421) is inserted.

[0098] The second guide rail (421) and the second guide groove (422) can be slidably coupled to each other.

[0099] The second guide coupling part (420) may be configured to have a rail type, T-bar type, coupling type, dovetail type, etc. At this time, the second guide rail (421) and the second guide groove (422) may be configured to be interlocked and fixed so that vertical detachment is prevented, while allowing sliding detachment in the longitudinal direction.

[0100] The conductive member (340) can be configured to be attached in close contact with the second carrier unit (120). For example, by applying a conductive adhesive or using a separate auxiliary fixing means, they can be joined together and moved as a single unit so as not to be separated by sliding movement.

[0101] The surfaces to which the conductive member (340) and the second carrier unit (120) are attached can be formed with corresponding shapes to allow for surface-to-surface contact. This minimizes contact resistance between the two members and prevents localized concentration of current, thereby ensuring uniform heating performance.

[0102] The effect of the lack of conductivity (340) is as follows.

[0103] First, maintenance convenience is maximized through the integration of the conductive member (340) and the second carrier unit (120). The second carrier unit (120) and the conductive member (340) can be configured to be attached to each other and move as a single unit. Accordingly, when a worker separates the second carrier unit (120) from the electrode part (200) during maintenance, the integrated unit can be quickly detached with a single sliding motion, thereby significantly improving work convenience and maintenance efficiency. There is an advantage in that cost losses, such as process interruptions caused by conventional carrier replacement, can be minimized.

[0104] Second, the conductive member (340) may include the function of the conductive buffer member (320). With this configuration, excellent airtightness can be secured by filling the fine gaps between the electrode part (200) and the second carrier unit (120) and ensuring close contact, thereby providing the effect of lowering contact resistance and maximizing current conduction efficiency.

[0105] Third, it is possible to prevent current concentration and induce uniform performance through the formation (arrangement) of a guide coupling part. When a guide rail or groove is formed directly on a carrier unit and an electrode made of ceramic material to bring them into contact with the electrode, there is a risk that a hot spot phenomenon may occur in which the current is excessively concentrated at the corners or contact points of the rail or groove. The present invention forms a second guide coupling part (420) between a conductive member (340) made of a conductive material and an electrode part (200), so that the current flowing in from the electrode part (200) through the second guide coupling part (420) is primarily diffused inside the conductive member (340) and then evenly transmitted to the entire second carrier unit (120) through a wide contact surface. As a result, the hot spot phenomenon is fundamentally prevented to induce uniform heat generation performance and provide the effect of preventing the lifespan of the carrier unit from deteriorating due to thermal stress.

[0106] FIG. 5 is a top view of FIG. 4. Specifically, it is a drawing illustrating the step of detaching the second carrier unit (120) and the conductive member (340) from the self-heating carrier module (10-4).

[0107] FIG. 6(a) is an exploded perspective view of a self-heating carrier module (10-6) further comprising a divided conductive member (340D) having a second divided guide coupling part (420D) arranged thereon according to one embodiment of the present invention, FIG. 6(b) is an assembled perspective view of a self-heating carrier module (10-6) having a second divided guide coupling part (420D) arranged thereon according to one embodiment of the present invention, and a drawing showing the form in which the second divided carrier unit (120D) and the conductive member (340) are detached.

[0108] Referring to FIG. 6, the second carrier unit (120) of the self-heating carrier module (10-6) can be divided into a second divided carrier unit (120D) which is divided into a plurality of sections (e.g., a plurality of units in which the second carrier unit is independently arranged. The same applies hereinafter) along the longitudinal direction of the electrode portion.

[0109] Between the electrode portion (200) and the second divided carrier unit (120D), a divided conductive member (340D) may be disposed, which is divided into multiple sections corresponding one-to-one with each section of the second divided carrier unit (120D).

[0110] It may further include a linear second split guide coupling part (420D) composed of a conductive material that guides the electrode part (200) and the split conductive member (340D) to be detached in a sliding manner.

[0111] The second split guide coupling part (420D) may be configured so that each of the split conductive members (340D) can slide independently of each other with respect to the electrode part (200).

[0112] It may include a second split guide rail (421D) formed on either the electrode portion (200) or the split conductive member (340D), and a second split guide groove (422D) formed on the other electrode portion (200) or the split conductive member (340D) into which the second split guide rail (421D) is inserted.

[0113] The second split guide rail (421D) and the second split guide groove (422D) can be slidably coupled to each other.

[0114] The divided conductive member (340D) can be configured to be attached in close contact with the second divided carrier unit (120D). For example, by applying a conductive adhesive or using a separate auxiliary fixing means, they can be joined together and moved as a single unit so as not to be separated by sliding movement.

[0115] The surfaces to which the divided conductive member (340D) and the second divided carrier unit (120D) are attached can be formed with corresponding shapes to allow for surface-to-surface contact. This minimizes contact resistance between the two members and prevents localized concentration of current, thereby ensuring uniform heating performance.

[0116] The divided conductive member (340D) may include the effect of the conductive member (340) of FIG. 3.

[0117] The divided conductive member (340D) is divided into multiple sections by the second divided carrier unit (120D) and the divided conductive member (340D), so that each can slide independently through the second divided guide coupling part (420D). As a result, the second divided carrier unit (120D) and the divided conductive member (340D) in a specific section where damage has occurred can be individually detached without the need to replace the entire second carrier unit (120). This has the advantage of minimizing maintenance costs.

[0118] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0119] Although various embodiments have been described above, it should be understood that various modifications are possible. For example, suitable results may be achieved even if the described techniques are performed in a different order, and / or the elements of the described system, structure, device, circuit, etc. are combined in a different way, or are replaced or supplemented by other elements or equivalents. Accordingly, other embodiments fall within the scope of the claims set forth below. Explanation of the symbols

[0120] 10: Self-heating carrier module 100: Carrier module 110: First carrier unit 111: First carrier 120: Second carrier unit 120D: Second divided carrier unit 121: Second carrier 121a: Outer second carrier 121b: Inner second carrier 200: Electrode part 310: Conductive bulkhead 320: Conductive buffer member 330: Conductivity Case 340: Absence of Conductivity 340D: Split conductive member 410: First guide coupling part 411: 1st guide rail 412: 1st guide groove 420: Second guide coupling part 420D: Second split guide coupling part 421: Second guide rail 421D: Second split guide rail 422: Second guide groove 422D: Second split guide groove

Claims

Claim 1 A self-heating carrier module comprising: a plurality of first carriers; a plurality of second carriers disposed on the outer side of the plurality of first carriers; and an electrode portion disposed on the outer side of the plurality of second carriers; wherein at least some of the carriers among the plurality of second carriers that are electrically connected to the electrode portion are integrally coupled to each other to form a second carrier unit, and the second carrier unit is configured to be integrally detachable from the self-heating carrier module, and further comprising a carrier guide portion formed on the second carrier unit to allow the second carrier unit to be slidably detachable from an adjacent first carrier or second carrier. Claim 2 A self-heating carrier module comprising: a plurality of first carriers; a plurality of second carriers disposed on the outer side of the plurality of first carriers; and an electrode portion disposed on the outer side of the plurality of second carriers; wherein at least some of the carriers among the plurality of second carriers that are electrically connected to the electrode portion are integrally coupled to form a second carrier unit, and the second carrier unit is configured to be integrally detachable from the self-heating carrier module, and a conductive buffer member is disposed between the electrode portion and the second carrier unit, and the conductive buffer member is disposed to be in close contact with the second carrier unit and the electrode portion. Claim 3 A self-heating carrier module according to claim 1 or 2, characterized in that the plurality of second carriers form a polygonal second carrier frame that surrounds the outer periphery of the entire plurality of first carriers. Claim 4 A self-heating carrier module according to claim 1 or 2, characterized in that a plurality of second carriers constituting the second carrier unit are integrally formed by mutually bonding via a conductive adhesive. Claim 5 A self-heating carrier module according to claim 1 or 2, further comprising a conductive partition disposed between the plurality of first carriers and the second carrier unit, electrically connecting the plurality of first carriers and the second carrier unit. Claim 6 A self-heating carrier module according to claim 1 or 2, further comprising a conductive case accommodating the second carrier unit, wherein the second carrier unit is accommodated and fixed inside the conductive case to form an integral assembly. Claim 7 A self-heating carrier module according to claim 1 or 2, wherein the plurality of first carriers are integrally combined with each other to form a first carrier unit, and the first carrier unit is detachably coupled to the second carrier unit. Claim 8 A self-heating carrier module according to claim 1 or 2, wherein the second carrier unit is detachably coupled to a second carrier adjacent to the second carrier unit among the plurality of second carriers. Claim 9 A self-heating carrier module according to claim 8, wherein the second carrier unit is detachably coupled to a first carrier adjacent to the second carrier unit. Claim 10 delete Claim 11 A self-heating carrier module according to claim 1, further comprising: a linear first guide coupling portion composed of a conductive material; wherein the first guide coupling portion comprises: a first guide rail formed on either the electrode portion or the second carrier unit; and a first guide groove formed on the other of the electrode portion or the second carrier unit into which the guide rail is inserted; and wherein the first guide rail and the first guide groove are slidably coupled to each other. Claim 12 A self-heating carrier module according to claim 1, wherein a conductive member is disposed between the electrode portion and the second carrier unit; and further comprises a linear second guide coupling portion composed of a conductive material, wherein the second guide coupling portion comprises: a second guide rail formed on either the electrode portion or the conductive member; and a second guide groove formed on the other of the electrode portion or the second carrier unit into which the second guide rail is inserted.

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