Ink composition for plating and manufacturing method of printed circuit board using same

Abstract

The present invention relates to a plating ink composition comprising a metal catalyst, ethylene glycol, triethylene glycol, glycerin, isopropyl alcohol, diethylene glycol monomethyl ether, and an additive having a viscosity of 30 cP or more and 900 cP or less, a method for manufacturing a printed circuit board using the same, and a printed circuit board manufactured by the method.

Description

Technology Field

[0001] The present invention relates to a plating ink composition, a method for manufacturing a printed circuit board using the same, and a printed circuit board.

[0002] A printed circuit board manufactured by the manufacturing method of the present invention using a plating ink composition in which the difference between the substrate and the surface energy of the present invention is controlled can have a fine line width with high adhesion without bulging (ink spreading) phenomenon. Background Technology

[0003] Printed electronics is a general term for electronic circuits or electronic products created by printing functional inks, such as conductive, insulating, or semiconducting inks, onto various substrates (plastic, film, paper, glass, etc.).

[0004] Printed electronics technology is an eco-friendly technology that uses printable functional ink materials in a printing process to drastically reduce process steps compared to the complex and high-cost photolithography technique used in the past, and manufactures various electronic devices with almost no harmful substance emissions.

[0005] Printed electronics technology, possessing these advantages, has been commercialized primarily in LCD displays, solar modules, OLED lighting, displays, and touch panels, and is also being applied in various sensors and RFID technologies. Recently, it has begun to be applied to the development of PCB technology, where it was previously rarely used, leading to the emergence of printed electronics hybrid PCBs incorporating this printing technology.

[0006] Hybrid PCB technology integrates and applies printed electronics process technology to the manufacturing of PCB products. Compared to conventional production methods, it offers advantages such as a reduction in the number of processes, the ability to perform non-vacuum processes, and the elimination of the need for cleanrooms, thereby enabling significant reductions in equipment investment costs and environmentally friendly, high-efficiency production. Through this innovation in production methods, it strengthens the competitiveness of the existing electronics industry and creates new markets through the development of innovative convergence product lines, making it a promising industry of the future.

[0007] Recently, in the actual application of printed electronics in fields such as PCBs, difficulties in ensuring reliability are being encountered due to low circuit adhesion, and therefore, solutions to improve circuit adhesion are required.

[0008] In particular, existing plating ink compositions are based on water-based solvents, which practically limits the range of solvents that can be used; therefore, there is a need to develop plating ink compositions based on various non-water-based solvents that offer excellent stability and adhesion.

[0009] In particular, conventional plating ink compositions have the disadvantage that it is difficult to achieve fine line widths due to the strong absorbency of the substrate.

[0010] For example, when an epoxy substrate is used as a substrate, the substrate has strong absorbency for conventional plating ink compositions, so after the plating ink composition is inkjet printed on the substrate, it cannot maintain the ink droplet size and spreads beyond the droplet size, making it difficult to achieve fine line widths.

[0011] In addition, when attempting to control the absorbency of conventional plating ink compositions on a substrate, a bulging phenomenon (ink clumping) occurs due to the difference in surface energy between the ink and the substrate, resulting in areas where the ink clumps rather than a straight line, causing circuit errors.

[0012] Therefore, there is a need to develop a plating ink composition for producing fine line widths with high adhesion using an inkjet printing method without bulging, and a method for manufacturing a printed circuit board using the same. Prior art literature

[0013] Republic of Korea Published Patent Application No. 10-2022-0116955 Republic of Korea Published Patent Application No. 10-2022-0054944 The problem to be solved

[0014] The present invention aims to provide an excellent non-aqueous plating ink composition with a controlled surface energy difference with respect to a substrate, which enables the formation of a uniform pattern having high resolution thickness and fine line width while suppressing the occurrence of bulging phenomena and having high adhesion to the substrate.

[0015] In particular, the above plating ink composition is intended to be applied to inkjet printing technology (especially non-contact inkjet printing technology) to improve productivity.

[0016] In addition, the present invention aims to provide a method for manufacturing a printed circuit board having uniform and fine high-resolution line width, thickness, and line spacing using the plating ink, and a printed circuit board manufactured thereby. means of solving the problem

[0017] Metal catalyst;

[0018] ethylene glycol;

[0019] triethylene glycol;

[0020] Glycerin;

[0021] isopropyl alcohol;

[0022] diethylene glycol monomethyl ether; and

[0023] Additive having a viscosity of 30 cP or more and 900 cP or less; comprising

[0024] A plating ink composition is provided.

[0025] According to another aspect of the present invention, the step of forming a precursor pattern on a substrate by extruding the plating ink composition;

[0026] A step of performing a first heat treatment on a substrate having the above-mentioned precursor pattern formed thereon;

[0027] A step of electroless copper plating of the above heat-treated substrate; and

[0028] A step of performing a second heat treatment on the above electroless copper-plated substrate; comprising

[0029] A method for manufacturing a printed circuit board is provided.

[0031] According to these aspects, the aforementioned conventional problems can be resolved, and the present invention has the substantial purpose of providing specific embodiments thereof. Effects of the invention

[0032] As described above, the present invention provides a plating ink composition and a method for manufacturing a printed circuit board using the same, and enables the formation of a uniform pattern having high resolution thickness and fine line width by suppressing bulging phenomena.

[0033] In addition, based on the adhesion between the reinforced insulating layer and the circuit pattern, improved reliability of the circuit pattern is secured, and when the precursor pattern is formed at 600 to 1,500 DPI (Dots per inch), the line width immediately after printing is maintained even during subsequent processes, and it is possible to implement a highly conductive circuit.

[0034] In addition, large area (300×300 mm) 2 Above) and mass production are possible.

[0035] The manufactured printed circuit board can be applied to various future electronic devices, such as flexible, wearable, stretchable, and structural electronics. Brief explanation of the drawing

[0036] Figure 1 is the result of observing the line width of a circuit of a printed circuit board manufactured according to the manufacturing example of the present invention using the plating ink composition of Example 1 of the present invention using an Olympus optical microscope before electroless copper plating. Figure 2 is the result of observing the line widths of circuits in the horizontal, vertical, and diagonal directions of a printed circuit board manufactured according to the manufacturing example of the present invention using the plating ink composition of Example 1 of the present invention using an Olympus optical microscope. FIGS. 3(a) to 3(e) are the results of observing the line width of a circuit of a printed circuit board manufactured according to the manufacturing example of the present invention using the plating ink compositions of Comparative Examples 1 to 5 of the present invention, respectively, using an Olympus optical microscope before electroless copper plating. Specific details for implementing the invention

[0037] In the following, embodiments of the invention will be described in more detail.

[0039] Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention.

[0040] Therefore, it should be understood that the configuration of the embodiments described in this specification is merely one of the most preferred embodiments of the present invention and does not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0041] In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “comprising,” “comprising,” or “having” are intended to specify the existence of the implemented features, numbers, steps, components, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, components, or combinations thereof.

[0042] Where various parameters in this specification are given as an enumeration of ranges, preferred ranges, preferred upper limits, and preferred lower limits, it should be understood that any pair of any upper range limit or preferred value and any lower range limit or preferred value specifically discloses all ranges formed by any pair of any upper range limit or preferred value, regardless of whether the range is disclosed separately.

[0043] Where a range of numerical values ​​is mentioned in this specification, unless otherwise stated, the range is intended to include its endpoint and all integers and fractions within that range. The scope of the invention is not intended to be limited to the specific values ​​mentioned when defining the range.

[0044] In the present specification, "a to b" and "a~b" indicating numerical ranges, "to" and "~" are defined as ≥ a and ≤ b.

[0046] A plating ink composition according to one aspect of the present invention may include a metal catalyst, ethylene glycol, triethylene glycol, glycerin, isopropyl alcohol, diethylene glycol monomethyl ether, and an additive having a viscosity of 30 cP or more and 900 cP or less.

[0047] For example, the viscosity of the above additive may be 35 cP or more, 500 cP or less, 40 cP or more, 300 cP or less, 50 cP or more, 100 cP or less, 60 cP or more, 90 cP or less, or 65 cP or more, 80 cP or less.

[0048] If the viscosity of the above additive exceeds or falls below the range of the present invention, it may be difficult to eject the plating ink composition when forming a pattern on a substrate, or bulging may occur, making it difficult to achieve the desired fine line width.

[0049] In one embodiment, the surface energy of the additive may be 20 mN / m or more.

[0050] For example, the surface energy of the above additive may be 20 mN / m or more, 70 mN / m or less, 35 mN / m or more, 60 mN / m or less, 35 mN / m or more, 50 mN / m or less, or 35 mN / m or more, 45 mN / m or less.

[0051] If the surface energy of the above additive exceeds or falls below the range of the present invention, it may be difficult to eject the plating ink composition when forming a pattern on a substrate, or bulging may occur, making it difficult to achieve the desired fine line width.

[0052] The above additive can lower the surface energy of the plating ink composition and improve the wettability and dispersibility of the plating ink composition.

[0053] The above additive may be a wetting dispersant containing a copolymer, for example, BYK’s ANTI-TERRA-210.

[0054] In one embodiment, based on 100% by weight of the total weight of the plating ink composition, the content of the metal catalyst may be 0.1% by weight or more and 5% by weight or less, the content of the ethylene glycol may be 5% by weight or more and 15% by weight or less, the content of the triethylene glycol may be 5% by weight or more and 15% by weight or less, the content of the glycerin may be 5% by weight or more and 35% by weight or less, the content of the isopropyl alcohol may be 5% by weight or more and 20% by weight or less, the content of the diethylene glycol monomethyl ether may be 25% by weight or more and 60% by weight or less, and the content of the additive may be 0.1% by weight or more and 5% by weight or less.

[0055] If the content of the metal catalyst exceeds the above content range, plating contamination may become severe in the margins of the substrate where the precursor pattern is formed by extruding the plating ink composition (the overplated area may become wider). In addition, if the content of the metal catalyst falls below the above content range, copper plating may not be formed, or the copper peel strength may become very low.

[0056] Meanwhile, if the content of the ethylene glycol is below the above content range or the content of the isopropyl alcohol is above the above content range, the copper peel strength of the formed copper plating may be reduced. In addition, if the content of the ethylene glycol is above the above content range or the content of the isopropyl alcohol is below the above content range, the viscosity of the plating ink composition increases significantly, making it difficult to form a precursor pattern and significantly reducing productivity.

[0057] The above triethylene glycol can improve ejection stability when ejecting the plating ink composition as a non-aqueous solvent.

[0058] If the content of the above triethylene glycol exceeds or falls below the content range of the present invention, it exhibits problems similar to those of the above ethylene glycol.

[0059] In addition, the glycerin can increase the contact angle of the plating ink composition and reduce the hygroscopicity of the substrate.

[0060] If the glycerin content exceeds the range of the present invention, the viscosity of the plating ink composition increases significantly, making it difficult to form a precursor pattern and significantly reducing productivity.

[0061] In addition, if the glycerin content falls below the range of the present invention, spreading of the plating ink composition may occur in the subsequent process, making it difficult to maintain the line width immediately after printing.

[0062] If the content of the diethylene glycol monomethyl ether above exceeds the range of the present invention, the viscosity value of the plating ink composition decreases, making it difficult to form a precursor pattern, and if it falls below the range of the present invention, the difference in surface energy with the substrate increases, which may cause bulging to occur frequently.

[0063] If the content of the above additive exceeds the range of the present invention, it may be difficult to eject the plating ink composition when forming a pattern on a substrate, and if it falls below the range of the present invention, a bulging phenomenon may occur, making it difficult to achieve a desired fine line width.

[0064] In one embodiment, the metal of the metal catalyst may be one or more selected from the group consisting of Ag, Fe, Co, Ni, Cu, Pd, Pt, Sn, and Au, and the metal ion may function as a plating catalyst.

[0065] Meanwhile, the metal catalyst may exist in ionic form and may be provided in the form of a metal salt within the ink composition.

[0066] For example, AgNO3, PdCl2, CuSO4, NiSO4, or a combination thereof may be used as the metal catalyst.

[0067] Meanwhile, the above plating ink composition may not be in a colloidal form.

[0068] In one embodiment, the viscosity of the plating ink composition may be 5.0 cP or more and 10.0 cP or less, the surface energy may be 20 mN / m or more and 40 mN / m or less, and the contact angle may be 20° or more and 35° or less.

[0069] For example, the viscosity of the plating ink composition may be 6.6 cP or more and 7.5 cP or less, the surface energy may be 20 mN / m or more and 30 mN / m or less, and the contact angle may be 30° or more and 32° or less.

[0070] If the viscosity of the above plating ink composition exceeds the range of the present invention, it may be difficult to eject during printing.

[0071] In addition, if the surface energy of the plating ink composition exceeds the range of the present invention, a bulging phenomenon may occur during printing.

[0072] Meanwhile, if the contact angle of the above plating ink composition exceeds the range of the present invention, a bulging phenomenon may occur during printing, and the line width may not be properly realized.

[0074] A method for manufacturing a printed circuit board according to another aspect of the present invention may include the step of forming a precursor pattern on a substrate by discharging the plating ink composition; the step of performing a first heat treatment on the substrate having the precursor pattern formed thereon; the step of electrolessly copper plating the heat-treated substrate; and the step of performing a second heat treatment on the electrolessly copper-plated substrate.

[0075] The above description may include an epoxy resin or a polyimide resin, and in particular, may include an epoxy resin.

[0076] The surface energy of polyimide resin is about 40 dynes / cm, and the surface energy of epoxy resin can be 30 to 38 dynes / cm.

[0077] Typically, the contact angle of the plating ink composition can be reduced as the surface energy acting between the substrate surface and air increases, as the surface energy acting between the plating ink composition and air decreases, and as the surface energy acting between the plating ink composition and the substrate decreases.

[0078] Therefore, as the surface energy of the substrate increases and the surface energy of the plating ink composition decreases, the contact angle of the plating ink composition may tend to decrease.

[0079] In one embodiment, the first heat treatment step is performed at 100°C or higher for 15 minutes or more, the second heat treatment step is performed at 15°C or higher for 15 minutes or more, the electroless copper plating step is performed at 20°C or higher for 3 hours or more, and the thickness of the formed copper plating may be 10 μm or more and the line width may be 65 μm or less.

[0080] For example, the processing temperature of the first heat treatment step may be 100°C or higher, 130°C or higher, or 150°C or higher, and the processing time of the first heat treatment step may be 15 minutes or higher, 20 minutes or higher, or 30 minutes or higher.

[0081] In addition, the processing temperature of the second heat treatment step may be 150°C or higher, 160°C or higher, 170°C or higher, or 180°C or higher, and the processing time of the second heat treatment step may be 15 minutes or higher, 20 minutes or higher, or 30 minutes or higher.

[0082] In particular, by undergoing a second heat treatment step after electroless copper plating, the adhesion between the insulating layer and the circuit pattern, which can be measured by the copper peel strength of the substrate, can be maximized.

[0083] This improvement in adhesion is due to the growth of copper crystal grains through the aforementioned heat treatment, and the improvement in interfacial adhesion between the circuit pattern and the insulating layer as the copper crystal grains grow.

[0084] The processing temperature of the above electroless copper plating step may be, for example, 20°C or higher, 30°C or higher, or 40°C or higher, and the processing time may be 3 hours or higher, 5 hours or higher, or 7 hours or higher.

[0085] Since the plating speed of the above electroless copper plating is proportional to the execution time and temperature, the longer the execution time and the higher the execution temperature, the thicker the copper plating can become. As the thickness of the copper plating increases, the copper crystal grains also become larger, which affects the adhesion between the insulating layer and the circuit pattern.

[0086] The thickness of the copper plating on the printed circuit board manufactured by the above manufacturing method may be, for example, 10 μm or more, 15 μm or more, or 20 μm or more.

[0087] Meanwhile, the line width of the copper plating of the printed circuit board manufactured by the above manufacturing method may be 65 μm or less, 60 μm or less, or 55 μm or less.

[0088] The plating ink composition derived to form a pattern on the substrate in the above electroless copper plating step is used as a catalyst for electroless copper plating.

[0089] That is, a copper plating layer is formed by using a reducing agent (e.g., HCHO, etc.) to precipitate copper ions as metallic copper on a pattern formed by a plating ink composition (catalyst). In addition to copper ions, a complexing agent, NaOH, a stabilizer, etc. may be used together.

[0090] In addition, the above-mentioned substrate may be any substrate used as a substrate for a printed circuit board, but preferably it may be an epoxy substrate (e.g., FR4 substrate) or a polyimide substrate.

[0091] When the above epoxy substrate is used, the roughness of the epoxy substrate may be Ra 0.4~0.6μm and Rz 2.5~4.0μm.

[0092] Meanwhile, the above-mentioned material may be pre-heat-treated before the step of forming a precursor pattern on the material.

[0093] The heat treatment temperature of the above pre-heat treatment is 60 to 100°C, and the heat treatment time may be 10 minutes to 1 hour.

[0094] In one embodiment, the step of forming a precursor pattern on a substrate by dispensing the plating ink composition may be performed by forming the precursor pattern by inkjet printing.

[0095] Any known inkjet printing method capable of using a plating ink composition can be used to form a pattern.

[0096] The pressure inside the discharge nozzle of the print head of the inkjet printer for the above inkjet printing may be a negative pressure. The negative pressure may be -5 kPa or higher and less than 0 kPa.

[0097] For example, the above sound pressure may be -1 kPa or less.

[0098] In addition, the temperature of the print head may be 35 to 55 ℃.

[0099] Meanwhile, the discharge voltage of the inkjet printer may be 2 to 8 V, the discharge droplet diameter may be 15 to 45 μm, the discharge speed may be 1 to 5 m / s, the discharge duration may be 60 minutes or more, and the resolution may be 600 to 1500 DPI (dots per inch).

[0100] A printed circuit board according to another aspect of the present invention is manufactured by the above manufacturing method, and when a precursor pattern is formed at 600 to 1,500 DPI (Dots per inch), a copper plating with a line width of 65 μm or less and a thickness of 10 μm or more can be formed.

[0101] Meanwhile, the copper peel strength of the above printed circuit board may be 1.0 kgf / cm or more.

[0102] In addition, the above printed circuit board can be applied to various electronic components of various electronic devices.

[0104] The operation and effects of the invention will be described in more detail below through specific embodiments. However, these embodiments are merely examples of the invention and do not define the scope of the invention.

[0106] As shown in the following examples and comparative examples, a plating ink composition was prepared.

[0108] Examples and Comparative Examples

[0109] A plating ink composition was prepared by mixing silver nitrate (AgNO3), ethylene glycol (EG), triethylene glycol (TEG), glycerin (GLY), isopropyl alcohol (IPA), diethylene glycol monomethyl ether (DGME) and additives at room temperature as shown in Table 1 below.

[0110] Example 1 used ANTI-TERRA-210 as an additive, and Comparative Example 1 did not use an additive.

[0111] Meanwhile, Comparative Example 2 used BYK-103, Comparative Example 3 used BYK-110, Comparative Example 4 used BYK-111, and Comparative Example 5 used BYK-333 as additives, respectively.

[0113] Composition (weight%) IPA EG TEG GLY DGME AgNO3 additives Example 1 10 10 10 10 58 1 1 Comparative Example 1 10 10 10 10 59 1 0 Comparative Example 2 10 10 10 10 58 1 1 Comparative Example 3 10 10 10 10 58 1 1 Comparative Example 4 10 10 10 10 58 1 1 Comparative Example 5 10 10 10 10 58 1 1

[0115] The viscosity and surface energy of ANTI-TERRA-210, BYK-103, BYK-110, BYK-111, and BYK-333 used as additives in the examples and comparative examples are shown in Table 2.

[0117] The viscosity of the additive was measured using a Brookfield rotational viscometer at a rotational speed of 200 rpm and a temperature of 25°C.

[0118] The surface energy of the additive was measured using Phoenix-MT(T).

[0120] additives Viscosity (cP, 25℃) Surface energy (mN / m) ANTI-TERRA-210 69.3 40.91 BYK-103 24.3 26.44 BYK-110 24.3 32.57 BYK-111 966.0 31.70 BYK-333 1068.0 16.48

[0122] Only ANTI-TERRA-210, used as the additive in Example 1, had a viscosity of 30 cP or more and 900 cP or less, and a surface energy of 20 mN / m or more, which corresponded to the characteristic range of the additive of the present invention, while the viscosity and surface energy of BYK-103, BYK-110, BYK-111, and BYK-333 were outside the characteristic range of the additive of the present invention.

[0124] The viscosity, surface energy, and contact angle of the plating ink compositions of the examples and comparative examples are shown in Table 3 below.

[0126] The viscosity of the plating ink composition was measured using a Brookfield rotational viscometer at a rotational speed of 200 rpm and a temperature of 50°C.

[0127] The surface energy of the plating ink composition was measured using Pheonix-MT(T).

[0128] The contact angle of the plating ink composition was measured using the sessile drop method with the Phoenix-MT(T) as a measuring instrument.

[0130] Viscosity (cP) (50℃) Surface energy (mN / m) Contact angle (degrees (˚)) (based on FR4 substrate) Example 1 6.88 27.50 31.58 Comparative Example 1 4.44 31.29 32.86 Comparative Example 2 6.55 27.60 31.61 Comparative Example 3 8.30 31.61 29.64 Comparative Example 4 7.78 31.39 27.54 Comparative Example 5 4.52 21.87 16.46

[0132] The viscosity of the plating ink composition of Example 1 was 5.0 cP or higher and 10.0 cP or lower, the surface energy was 20 mN / m or higher and 40 mN / m or lower, and the contact angle was 20° or higher and 35° or lower, which corresponds to the characteristic range of the plating ink composition of the present invention.

[0134] Manufacturing Example: Manufacturing of printed circuit boards

[0135] A pattern was printed on an epoxy substrate (FR4, Ra: 0.51 μm, Rz: 2.99 μm) that had been cleaned and pre-heat-treated (80°C, 30 min) using KM1024i (6 pl) with the plating ink composition of Example 1 and Comparative Examples 1 to 5.

[0136] At this time, the print head pressure was negative pressure (-3 kPa), the print head temperature was 50°C, the ejection voltage was 5 V, the ejection droplet diameter was 23 μm, the ejection speed was 3 m / s, and the resolution was 1,440 DPI (dots per inch).

[0137] A patterned substrate was subjected to a first heat treatment (150°C, 30 minutes), followed by electroless copper plating to form a copper plating with a thickness of 10 to 20 μm. The electroless copper plating was performed by immersing a pattern printed using a plating ink composition in a Cu electroless plating solution, potassium hydrogen tartrate, and sodium hydroxide maintained at a temperature of approximately 36°C for 6 hours.

[0138] Afterwards, a second heat treatment (180℃, 30 minutes) was performed.

[0140] As shown in FIG. 1, the pattern of the printed circuit board manufactured using the plating ink composition of Example 1 did not exhibit a bulge (ink spreading) phenomenon, and it was confirmed that a uniform fine line width could be achieved.

[0141] In addition, as shown in Figure 2, it was possible to achieve a uniform fine line width in the horizontal, vertical, and diagonal circuit pattern printing, and it was confirmed that the image quality was excellent.

[0142] That is, it was possible to confirm circuit patterns in the horizontal, vertical, and diagonal directions having a line width of 65 μm or less, more specifically, an average line width of 55 μm or less.

[0143] Meanwhile, the copper peel strength of a printed circuit board manufactured using the plating ink composition of Example 1 was measured using a Universal Testing Machine (UTM) according to IPC-TM-650 No. 2.4.8 (measurement angle: 90°, Measurement speed: 50 mm / min, maximum load (load max): 5 kgf), measured at 1.0 kgf / cm or higher.

[0144] In contrast, the patterns of printed circuit boards manufactured using the plating ink compositions of Comparative Example 1, Comparative Example 2, Comparative Example 3, Comparative Example 4, and Comparative Example 5 showed bulging or ink spreading phenomena as shown in FIG. 3(a), FIG. 3(b), FIG. 3(c), FIG. 3(d), and FIG. 3(e), respectively, and it was confirmed that there were difficulties in realizing a uniform fine line width.

[0146] Therefore, when using the plating ink composition of Example 1 manufactured within the appropriate range of the present invention, productivity, adhesion (copper peel strength), and uniformity of the manufactured copper plating were all excellent without bulging, and it was possible to maintain a fine line width; however, it was confirmed that when the composition was outside the appropriate range of the present invention, it was difficult to achieve the full capability to implement fine patterns of copper plating due to bulging.

[0147] In other words, it was confirmed that the plating ink composition, which satisfies all conditions for application in fields by possessing both adhesive strength (copper peel strength) and the possibility of realizing fine patterns of the manufactured copper plating, is a plating ink composition manufactured within the appropriate scope of the present invention.

[0149] Although the present invention has been described with reference to embodiments thereof, those skilled in the art will be able to make various applications and modifications within the scope of the present invention based on the above description.

Claims

Claim 1 Metal catalyst; ethylene glycol; triethylene glycol; glycerin; isopropyl alcohol; diethylene glycol monomethyl ether; A plating ink composition comprising: an additive including a copolymer, wherein the viscosity measured at a temperature of 25°C is 30 cP or more and 900 cP or less; and, based on 100 wt% of the total weight of the plating ink composition, the content of the metal catalyst is 0.1 wt% or more and 5 wt% or less, the content of the ethylene glycol is 5 wt% or more and 15 wt% or less, the content of the triethylene glycol is 5 wt% or more and 15 wt% or less, the content of the glycerin is 5 wt% or more and 35 wt% or less, the content of the isopropyl alcohol is 5 wt% or more and 20 wt% or less, the content of the diethylene glycol monomethyl ether is 25 wt% or more and 60 wt% or less, and the content of the additive is 0.1 wt% or more and 5 wt% or less. Claim 2 A plating ink composition according to claim 1, wherein the surface energy of the additive measured at a temperature of 25°C is 20 mN / m or more. Claim 3 delete Claim 4 A plating ink composition according to claim 1, wherein the metal of the metal catalyst is one or more selected from the group consisting of Ag, Fe, Co, Ni, Cu, Pd, Pt, Sn and Au. Claim 5 A plating ink composition according to claim 1, wherein the viscosity measured at a temperature of 50°C is 5.0 cP or more and 10.0 cP or less, the surface energy measured at a temperature of 25°C is 20 mN / m or more and 40 mN / m or less, and the contact angle measured at a temperature of 25°C is 20° or more and 35° or less. Claim 6 A method for manufacturing a printed circuit board comprising: a step of forming a precursor pattern on a substrate by extruding a plating ink composition of any one of claims 1, 2, 4 and 5; a step of performing a first heat treatment on the substrate having the precursor pattern formed thereon; a step of electroless copper plating on the heat-treated substrate; and a step of performing a second heat treatment on the electroless copper-plated substrate. Claim 7 A method for manufacturing a printed circuit board according to claim 6, wherein the first heat treatment step is performed at 100°C or higher for 15 minutes or more, the second heat treatment step is performed at 15°C or higher for 15 minutes or more, the electroless copper plating step is performed at 20°C or higher for 3 hours or more, and the thickness of the formed copper plating is 10 μm or more and the line width is 65 μm or less. Claim 8 A method for manufacturing a printed circuit board according to claim 6, wherein, in the step of forming the precursor pattern on a substrate, the precursor pattern is formed by inkjet printing.

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