Posture turning apparatus and substrate processing apparatus including the same

Abstract

A posture conversion device for converting the posture of a plurality of substrates, wherein the device comprises the following elements: a reversing chuck for holding a plurality of substrates; an opening / closing driving mechanism for driving the reversing chuck in the radial direction of the substrates between an opening position for holding the plurality of substrates between the reversing chuck and a holding position for holding the plurality of substrates with the reversing chuck; a rotary driving mechanism for driving the reversing chuck around a horizontal axis to convert the posture of the plurality of substrates from a vertical posture to a horizontal posture; and a control unit for operating the rotary driving mechanism such that the processing surface of the plurality of substrates faces upward when converting the posture of the plurality of substrates from a vertical posture to a horizontal posture, after having the reversing chuck hold the plurality of substrates in a vertical posture by operating the opening / closing driving mechanism.

Description

Technology Field

[0001] The present invention relates to an attitude change device for performing a predetermined treatment on a substrate such as a semiconductor substrate, a substrate for a Flat Panel Display (FPD) such as a liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, or a substrate for an optical disc, and a substrate processing device equipped with the same. Background Technology

[0002] Conventionally, there is a device of this type equipped with a batch module, a single-wafer module, and an orientation change module. For example, refer to Japanese Publication No. 2016-502275. A batch module performs processing on multiple substrates in a batch. A single-wafer module performs processing on substrates one by one. Generally, compared to drying processing by a batch module, drying processing by a single-wafer module has a smaller processing atmosphere space affected by the substrate, resulting in higher particle performance. Therefore, it is easier to increase drying performance in a single-wafer module than in a batch module. Thus, for example, there are cases where etching and rinsing are performed in a batch module, and then drying is performed in a single-wafer module.

[0003] In the batch module, processing is performed on multiple substrates in a vertical position. On the other hand, in the single-wafer module, processing is performed on the substrates in a horizontal position. Therefore, the vertically positioned substrates that have finished processing in the batch module are converted to a horizontal position by the position conversion module before being returned to the single-wafer module.

[0004] Specifically, the orientation change module comprises a chuck having two side supports that contact and support both sides of a substrate, a lower cross-section support that contacts and supports the lower side among cross-sections orthogonal to both sides on the substrate surface, and a rotation mechanism that rotates the chuck by 90 degrees to one side around a horizontal axis. The rotation mechanism rotates the chuck by 90 degrees around a horizontal axis so that, when viewed from a plane, the lower cross-section support is positioned on the side opposite to the direction in which a robot that receives substrates one by one into a single-wafer module is positioned. After the chuck is rotated by the rotation mechanism, the robot can receive the substrate from the direction in which the lower cross-section support is not positioned in the chuck.

[0005] However, in the case of conventional examples having such a configuration, the following problems exist.

[0006] In other words, conventional devices can only rotate the chuck by 90 degrees in one direction around the horizontal axis. With this configuration, for example, when the processing surfaces of multiple substrates are facing the robot side in a vertical position, they cannot be converted to a horizontal position with the processing surfaces facing upward. That is, there is a problem in that the orientation of multiple substrates cannot be changed except when the processing surfaces of multiple substrates are facing the opposite side from the robot side in a vertical position.

[0007] In batch modules, to improve throughput, multiple substrates constituting one lot and multiple substrates constituting another lot are combined into one to perform processing as a batch lot unit. In such cases, depending on the method of combining processing surfaces to determine which direction the processing surface of the lot faces when constituting the batch lot, there are two types: face-to-face and face-to-back. In conventional orientation change modules, since they can only rotate in one direction, they cannot normally perform orientation change so that the processing surface faces upward for lots with opposite processing surfaces. The problem to be solved

[0008] The present invention is made in consideration of these circumstances and aims to provide an attitude change device capable of performing an attitude change normally regardless of the orientation of the processing surface of a substrate, and a substrate processing device equipped with the same. means of solving the problem

[0009] To achieve this objective, the present invention takes the following configuration.

[0010] That is, the present invention is an orientation changing device for changing the orientation of a plurality of substrates, wherein the device comprises the following elements: an inversion chuck for holding a plurality of substrates; an opening / closing driving mechanism for driving the inversion chuck in the radial direction of the substrates between an open position for holding the plurality of substrates between the inversion chuck and a holding position for holding the plurality of substrates with the inversion chuck; a rotary driving mechanism for driving the inversion chuck around a horizontal axis to change the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation; and a control unit for operating the rotary driving mechanism such that, after operating the opening / closing driving mechanism to have the inversion chuck hold the plurality of substrates in a vertical orientation, the processing surface of the plurality of substrates faces upward when changing the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation.

[0011] According to the present invention, the control unit operates an opening and closing drive mechanism to have the inversion chuck maintain a plurality of substrates in a vertical position. Then, when converting the position of the plurality of substrates from a vertical position to a horizontal position, the control unit operates a rotation drive mechanism so that the processing surface of the plurality of substrates faces upward. Accordingly, regardless of the direction of the processing surface of the substrate, the position conversion can be performed normally so that the processing surface of the plurality of substrates faces upward.

[0012] In addition, the processing surface of the substrate in the present invention refers to a surface on which processing is performed after the orientation is changed to a horizontal orientation in the orientation changing device. The processing surface is a surface facing upward when the substrate is placed in a horizontal orientation.

[0013] In addition, in the present invention, the control unit preferably operates the rotational driving mechanism to rotate in one direction or the other direction opposite thereto, depending on the direction of the processing surface of the plurality of substrates.

[0014] Multiple substrates in a vertical position have their processing surfaces facing either one direction or the other. Accordingly, the control unit can make the processing surfaces of the multiple substrates face upward by operating a rotary driving mechanism to rotate them at a predetermined angle to the other direction opposite to one direction, or to the one direction opposite to the other direction, depending on the direction of the processing surface.

[0015] In addition, in the present invention, it is preferable that the control unit operates the rotational driving mechanism to rotate in only one direction according to the direction of the processing surface of the plurality of substrates.

[0016] Multiple substrates in a vertical position have their processing surfaces facing either one direction or the other. Accordingly, the control unit can make the processing surfaces of the multiple substrates face upward by operating a rotary drive mechanism to rotate them in only one direction or the other. Since they are rotated in only one direction, rotation control by the control unit can be facilitated.

[0017] In addition, in the present invention, it is preferable that the inversion chuck holds only the two sides of the plurality of substrates in a direction orthogonal to the direction in which the plurality of substrates are held.

[0018] When converting the orientation of multiple substrates from a vertical orientation to a horizontal orientation, the inversion chuck does not interfere during transport regardless of the direction of rotation. Therefore, subsequent manual operations can be performed smoothly.

[0019] In addition, in the present invention, it is preferable that the control unit operates the rotary driving mechanism based on a recipe that specifies how to process the plurality of substrates.

[0020] The control unit operates the rotary drive mechanism based on the recipe, so it can appropriately operate the rotary drive mechanism for each of the multiple substrates.

[0021] In addition, in the present invention, the control unit preferably operates the rotary driving mechanism according to a method of combining processing surfaces, such as which direction the processing surfaces are combined in a batch lot in which a plurality of substrates and another plurality of substrates are placed together in the recipe.

[0022] The control unit operates the rotary drive mechanism according to the method of combining processing surfaces in the recipe. Accordingly, since the control unit knows the direction of the processing surfaces of multiple substrates, it can appropriately operate the rotary drive mechanism for each of the multiple substrates.

[0023] Furthermore, the present invention relates to a substrate processing apparatus for processing substrates, wherein the apparatus comprises the following elements: a batch processing unit for processing a plurality of substrates collectively in a vertical position; a single-wafer processing unit for processing a single substrate in a horizontal position; an orientation conversion unit for converting the plurality of substrates processed in the batch processing unit from a vertical position to a horizontal position; a first conveying unit for conveying the plurality of substrates processed in the batch processing unit to the orientation conversion unit; and a second conveying unit for conveying the plurality of substrates converted to a horizontal position in the orientation conversion unit to the single-wafer processing unit. The above-mentioned orientation changer comprises an inversion chuck for holding the plurality of substrates, an opening position for holding the plurality of substrates between the inversion chuck and the inversion chuck, a holding position for holding the plurality of substrates with the inversion chuck, an opening / closing driving mechanism for driving the inversion chuck in the radial direction of the substrates, and a rotary driving mechanism for driving the inversion chuck around a horizontal axis to change the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation. After processing the plurality of substrates in the batch processing unit and before returning the plurality of substrates to the single-wafer processing unit, the control unit operates the opening / closing driving mechanism to have the inversion chuck hold the plurality of substrates in a vertical orientation, and then operates the rotary driving mechanism to make the processing surface of the plurality of substrates face upward when changing the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation.

[0024] According to the present invention, the control unit processes multiple substrates in a batch processing unit and, before returning the multiple substrates to a single-wafer processing unit, operates an opening / closing drive mechanism to have the inversion chuck maintain the multiple substrates in a vertical position. Then, when changing the position of the multiple substrates from a vertical position to a horizontal position, the control unit operates a rotation drive mechanism so that the processing surface of the multiple substrates faces upward. Accordingly, regardless of the direction of the processing surface of the substrates, the position change can be performed normally so that the processing surface of the multiple substrates faces upward. Brief explanation of the drawing

[0025] For illustrative purposes, various currently preferred forms of the invention are depicted in the drawings, but it should be understood that the invention is not limited to such arrangements and means. FIG. 1 is a plan view showing the overall configuration of a substrate processing device according to an embodiment. FIG. 2 is a cross-sectional view in the direction of the AA arrow in FIG. 1. FIGS. 3(a) and FIGS. 3(b) are schematic diagrams for explaining the method of combining processing surfaces that constitute a batch lot. FIGS. 4(a) and FIGS. 4(b) are schematic diagrams for explaining the method of combining processing surfaces that constitute a batch lot. FIG. 5 is a plan view showing the configuration of a 25-sheet chuck and an inversion chuck. FIG. 6 is a front view of the inversion chuck in the open position. FIG. 7 is a front view of the inversion chuck in the holding position. FIG. 8 is a front view showing the configuration of the orientation changer and the state in which the substrate is maintained in a vertical orientation. FIG. 9 is a front view showing the configuration of the attitude changer and the state in which the substrate is maintained in a horizontal attitude. Figure 10 is a block diagram showing a control system. Figures 11(a) to 11(d) are schematic diagrams showing an example of a change in orientation in a batch lot of surface abutment. FIGS. 12(a) to FIGS. 12(d) are schematic diagrams showing an example of a change in orientation in a batch lot of surface abutment. Figures 13(a) to 13(d) are schematic diagrams showing different examples of attitude transformation. FIG. 14 is a block diagram showing a modified example of a control system. Specific details for implementing the invention

[0026] Hereinafter, suitable embodiments of the present invention will be described in detail with reference to the drawings.

[0027] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0028] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a cross-sectional view in the direction of the AA arrow in FIG. 1.

[0029] <1. Overall Structure>

[0030] The substrate processing device (1) processes the substrate (W). The substrate processing device (1) performs, for example, chemical treatment, cleaning treatment, drying treatment, etc. on the substrate (W). The substrate processing device (1) adopts a processing method that combines batch and single-wafer processing (so-called hybrid method). The batch method processes multiple substrates (W) in a vertical position all at once. The single-wafer method processes a single substrate (W) in a horizontal position.

[0031] The substrate processing device (1) is equipped with a batch processing device (3) and a single-wafer processing device (5). In this embodiment, the single-wafer processing device (5) is arranged adjacent to the batch processing device (3). The batch processing device (3) and the single-wafer processing device (5) are spaced apart. The batch processing device (3) and the single-wafer processing device (5) are connected by a cross-linking section (7).

[0032] <2. Batch Processing Unit>

[0033] The batch processing device (3) processes multiple substrates (W) in batches. The batch processing device (3) is equipped with an incoming block (9), a stocker block (11), a transfer block (13), an orientation change block (15), and a processing block (17).

[0034] In this specification, for convenience, the direction in which the receiving block (9), the stoker block (11), the material block (13), and the processing block (17) are arranged is referred to as the "front-back direction (X)." The front-back direction (X) is horizontal. Among the front-back direction (X), the direction from the stoker block (11) toward the receiving block (9) is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-back direction (X) is referred to as the "width direction (Y)." One direction within the "width direction (Y)" is appropriately referred to as the "right direction." The direction opposite to the right direction is referred to as the "left direction." The direction perpendicular to the horizontal direction is referred to as the "vertical direction (Z)." In each drawing, the front, back, right, left, up, and down directions are appropriately indicated for reference.

[0035] <3. Incoming Blocks>

[0036] The receiving block (9) is equipped with an input section (19). The input section (19) is positioned at the front (X) of the batch processing device (3). The carrier (C) stores multiple substrates (W) (e.g., 25) in a horizontal position, stacked at regular intervals in the vertical direction (Z). The carrier (C) has multiple grooves (not shown) formed to accommodate substrates (W) one by one, spaced apart from the surfaces of the substrates (W). As for the carrier (C), for example, a FOUP (Front Opening Unify Pod) is used. The FOUP is a sealed container. The carrier (C) may be an open container, and the type is irrelevant. The input section (19) is equipped with two loading platforms (21) on which the carrier (C) is loaded, for example. The two loading platforms (21) are arranged, for example, along the width direction (Y). The input section (19) is also called a load port.

[0037] <4. Stalker Block>

[0038] The stoker block (11) is positioned adjacent to the rear (X) of the receiving block (9). The stoker block (11) is equipped with a return storage unit (ACB). The return storage unit (ACB) is equipped with a return mechanism (23) and a shelf (25).

[0039] The return mechanism (23) returns the carrier (C). The return receiving unit (ACB) is equipped with a plurality of shelves (25). The shelves (25) may have carriers (C) simply placed on them temporarily, or carriers (C) placed on them for watering between the first return mechanism (HTR). The return receiving unit (ACB) brings in carriers (C) containing unprocessed substrates (W) from the input unit (19) and places them on the shelves (25). The return receiving unit (ACB) returns and places carriers (C) on the shelves (25) for watering according to a schedule that defines the order of processing. The return receiving unit (ACB) returns and places carriers (C) that have been emptied from the shelves (25) for watering on the shelves (25). The return receiving unit (ACB) discharges the empty carrier (C) placed on the shelf (25) to the loading unit (21) according to the empty condition of the loading unit (21). The empty carrier (C) is returned to the single-wafer processing unit (5). For example, the substrate (W) that was stored in the carrier (C) before processing and has finished processing is received in the single-wafer processing unit (5) from the empty carrier (C) returned to the single-wafer processing unit (5).

[0040] <5. Lee Jae Block>

[0041] The material block (13) is positioned adjacent to the rear (X) of the stocker block (11). The material block (13) is equipped with a material transfer mechanism (CTC). The material transfer mechanism (CTC) is equipped with a first conveying mechanism (HTR), a conversion mechanism (HVC), a pusher (PH), and a second conveying mechanism (WTR).

[0042] A first conveying mechanism (HTR) is positioned on the right side (Y) of the rear (X) of the conveying storage unit (ACB). The first conveying mechanism (HTR) conveys multiple substrates (W) in bulk. In other words, the first conveying mechanism (HTR) is equipped with multiple hands (not shown). One hand supports one substrate (W). The first conveying mechanism (HTR) may also convey only one substrate (W). The first conveying mechanism (HTR) takes multiple substrates (W) (e.g., 25) in bulk from a carrier (C) placed on a shelf (25) for water supply in the conveying storage unit (ACB) and conveys them to a conversion mechanism (HVC) while they are in a horizontal position. At this time, the conversion mechanism (HVC) converts the position of the substrate (W) from a horizontal position to a vertical position.

[0043] A conversion mechanism (HVC) and a pusher (PH) are arranged in sequence on the left side (Y) of the first conveying mechanism (HTR). The conversion mechanism (HVC) receives multiple substrates (W) to the pusher (PH). After receiving multiple substrates (W) from the conversion mechanism (HVC), the pusher (PH) moves to the second conveying mechanism (WTR) in the width direction (Y). At that time, the conversion mechanism (HVC) and the pusher (PH) perform assembly of the batch lot or release of the batch lot. The pusher (PH) receives multiple substrates (W) to the second conveying mechanism (WTR).

[0044] The transfer mechanism (CTC) combines, for example, multiple substrates (W) constituting a lot extracted from one carrier (C) and multiple substrates (W) constituting another lot extracted from another carrier (C) into a single batch lot. This is the assembly of the batch lot. The batch lot consists of twice the number of substrates (W) of the first lot. In the batch lot, each substrate (W) of the other lot is arranged adjacent to each substrate (W) of the first lot. That is, each substrate (W) of the first lot is arranged in an odd-numbered position, and each substrate (W) of the other lot is arranged in an even-numbered position. Typically, the spacing of the multiple substrates (W) extracted from the carrier (C) is the same as the spacing of the carrier (C). This is called full pitch. In a batch lot, for example, the spacing of the multiple substrates (W) becomes half of the full pitch. This is called half pitch. A batch lot is formed by combining one lot and another lot as described above, and depending on the combination method, there are two types: face-to-face (also called face to face) and face-to-back (also called face to back). The combination method of the lot is determined by the operation of the pusher (PH). In addition, in the following description, multiple substrates (W) are referred to as a lot, and if a specific description of the batch lot is required, multiple substrates (W) are referred to as a batch lot.

[0045] Here, refer to FIGS. 3(a), FIGS. 3(b) and FIGS. 4(a), FIGS. 4(b) are schematic diagrams for explaining a method of combining processing surfaces that constitute a batch lot. In FIGS. 3(a), FIGS. 3(b) and FIGS. 4(a), FIGS. 4(b), each lot is composed of three substrates (W) to facilitate understanding of the invention.

[0046] The above-described material handling mechanism (CTC) assembles batch lots as shown in FIG. 3 (a), FIG. 3 (b) and FIG. 4 (a), FIG. 4 (b).

[0047] (1) Face to Face

[0048] As shown in FIG. 3(a), by combining one lot (LT1) and another lot (LT2), a batch lot (BL1) of surface bonding (FTF) shown in FIG. 3(b) is assembled. Specifically, each substrate (W) of lot (LT1) has its processing surface facing left (Y) immediately after being converted to a vertical orientation by, for example, a conversion mechanism (HVC). For example, lot (LT1) is rotated 180 degrees around the vertical axis by a pusher (PH). As a result, lot (LT1) has its processing surface facing right (Y). Each substrate (W) of lot (LT2) has its processing surface facing the opposite side, that is, left (Y), to the processing surface of lot (LT1). A white triangle is attached to the processing surface of each substrate (W) of lot (LT1). A black triangle is attached to the processing surface of each substrate (W) of the lot (LT2). The processing surface referred to here is the surface on which processing is performed after the orientation is changed to a horizontal orientation in the orientation change block (15). The processing surface is the surface facing upward when the substrate (W) is placed. The processing surface may also be called the main surface, the surface, or the back surface.

[0049] In addition, the order in which lot (LT1) and lot (LT2) are brought into the transfer mechanism (CTC) may be changed. As a result, in FIG. 3 (b), the odd-numbered elements of the arrangement in batch lot (BL1) can be made into lot (LT1).

[0050] (2) Face to Back

[0051] As shown in FIG. 4(a), by combining one lot (LT1) and another lot (LT2), a batch lot (BL2) of the front-side butt joint (FTB) shown in FIG. 4(b) is assembled. Specifically, each substrate (W) of lot (LT1) and lot (LT2) has its processing surface facing to the left (Y), for example. When assembling the batch lot with this front-side butt joint (FTB), only a half-pitch linear movement in the width direction (Y) is performed, and no rotational movement by the pusher (PH) is performed.

[0052] The second conveying mechanism (WTR) is positioned to the left (Y) of the material transfer mechanism (CTC). The second conveying mechanism (WTR) is configured to be movable across the material transfer block (13) and the processing block (17). The second conveying mechanism (WTR) is configured to be movable in the front-rear direction (X). The second conveying mechanism (WTR) is equipped with a pair of hands (27) for conveying the lot. The pair of hands (27) are equipped with a rotation axis oriented, for example, in the width direction (Y). The pair of hands (27) oscillate around this rotation axis. The pair of hands (27) grip the side cross-section located in the front-rear direction (X) of the plurality of substrates (W) constituting the lot. The second conveying mechanism (WTR) holds the plurality of substrates (W) constituting the lot between the material transfer mechanism (CTC). The second conveying mechanism (WTR) receives multiple unprocessed substrates (W) constituting a lot with respect to the processing block (17). The second conveying mechanism (WTR) receives multiple substrates (W) processed in the processing block (17) between the orientation change block (15).

[0053] Here, the processing block (17) is described before the posture conversion block (15).

[0054] <6. Processing Block>

[0055] Refer to FIGS. 1 and FIGS. 2. The processing block (17) is provided with, for example, a batch processing unit (BPU). For example, the batch processing unit (BPU) is provided with six processing units. Specifically, the batch processing unit (BPU) is provided with a first batch processing unit (BPU1), a second batch processing unit (BPU2), a third batch processing unit (BPU3), a fourth batch processing unit (BPU4), a fifth batch processing unit (BPU5), and a sixth batch processing unit (BPU6). In addition, the number of batch processing units (BPU) is not limited to six. That is, the number of batch processing units (BPU) may be less than six or seven or more.

[0056] The first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) are arranged in a row in the front-rear direction (X). Each of the first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) is equipped with a processing tank (BB) and a lifter (LF). The processing tank (BB) stores a processing liquid. The processing liquid is pure water or a chemical solution. The chemical solution is, for example, an organic solvent or an etching solution. The organic solvent is, for example, IPA (isopropyl alcohol). The etching solution is, for example, a phosphoric acid solution.

[0057] The lifter (LF) moves up and down between a processing position inside the processing tank (BB) and a watering position above the liquid level of the processing tank (BB). At the watering position, the lifter (LF) carries multiple substrates (W) between the second conveying mechanism (WTR). The first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) correspond to each pair, for example. Specifically, the first batch processing unit (BPU1) and the second batch processing unit (BPU2) form one pair, the third batch processing unit (BPU3) and the fourth batch processing unit (BPU4) form one pair, and the fifth batch processing unit (BPU5) and the sixth batch processing unit (BPU6) form one pair. Each pair is assigned a role, for example, chemical treatment and cleaning treatment. The first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) can process up to 50 substrates (W) in batches, for example. In other words, the first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) can process up to one batch lot simultaneously, for example.

[0058] In each treatment tank (BB), the treatment liquid is supplied from below. In each treatment tank (BB), the treatment liquid is discharged beyond the upper edge. In each treatment tank (BB), multiple substrates (W) placed on the lifter (LF) are immersed in the treatment liquid. Each lifter (LF) holds the lower edge of the substrate (W) in contact. Each lifter (LF) carries multiple substrates (W) between itself and the second conveying mechanism (WTR).

[0059] <7. Pose Transformation Block>

[0060] As shown in FIG. 2, the attitude conversion block (15) is equipped with a 25-sheet chuck (TFC), a standby unit (31), and an attitude conversion unit (33). In addition, in the drawings referenced from the standby unit (31) and the attitude conversion unit (33), the liquid surface is omitted to make it easier to see each component.

[0061] The standby tank (31) is equipped with a processing tank (BB0) and a lifter (LF0). The processing tank (BB0) has the same configuration as the processing tank (BB) equipped by the first batch processing unit (BPU1) to the sixth batch processing unit (BPU6) described above. The lifter (LF0) moves up and down between a waiting position inside the processing tank (BB0) and a water position above the liquid level of the processing tank (BB0). The standby tank (BB0) holds the processing liquid. The processing liquid is, for example, pure water. At the waiting position, the entire substrate (W) placed on the lifter (LF0) is submerged in the processing liquid.

[0062] Here, refer to FIG. 5. FIG. 5 is a plan view showing the configuration of a 25-piece chuck and an inversion chuck.

[0063] The 25-sheet chuck (TFC) moves horizontally only in the width direction (Y). The 25-sheet chuck (TFC) does not move up or down in the vertical direction (Z). The 25-sheet chuck (TFC) does not move horizontally in the front-back direction (X). However, the 25-sheet chuck (TFC) opens and closes the hand (35) across the holding position (PC) and the passing position (PT). In the holding position (PC), the 25-sheet chuck (TFC) holds multiple substrates (W). In the passing position (PT), the 25-sheet chuck (TFC) does not hold multiple substrates (W). In other words, in the passing position (PT), the lifter (LF0) holding multiple substrates (W) allows movement between the holding position and the standby position. The 25th chuck (TFC) moves across three locations in the width direction (Y), for example, a first cutting position (P1), a second cutting position (P2), and a third cutting position (P3).

[0064] The 25-sheet chuck (TFC) is equipped with a locking part (37). The locking part (37) is installed on the inner side of the hand (35). The locking part (37) is formed in the width direction (Y) at the full pitch interval described above. The first receiving position (P1) and the second receiving position (P2) differ in position in the width direction (Y) by a distance equivalent to a half pitch. The third receiving position (P3) is a position for receiving multiple substrates (W) to the position changer (33). The 25-sheet chuck (TFC) receives only one lot from the lifter (LF0) at the first receiving position (P1). Specifically, among the two lots constituting the batch lot, it receives only the odd number of multiple substrates (W) constituting one lot. The 25th chuck (TFC) receives only one other lot from the lifter (LF0) at the second water supply position (P2). Specifically, among the two lots constituting the batch lot, it receives only an even number of multiple substrates (W) constituting the other lot.

[0065] For example, the odd number of multiple substrates (W) corresponds to Lot (LT2) in the example of FIG. 3 described above. The even number of multiple substrates (W) corresponds to Lot (LT1) in the example of FIG. 3 described above. For example, the odd number of multiple substrates (W) corresponds to Lot (LT1) in the example of FIG. 4 described above. The even number of multiple substrates (W) corresponds to Lot (LT2) in the example of FIG. 4 described above.

[0066] Here, also refer to FIGS. 6 to 9. FIG. 6 is a front view with the inversion chuck in an open position. FIG. 7 is a front view with the inversion chuck in a held position. FIG. 8 is a front view showing the configuration of the orientation changer and the substrate in a vertical position. FIG. 9 is a front view showing the configuration of the orientation changer and the substrate in a horizontal position.

[0067] As shown in FIGS. 8 and 9, the posture conversion tank (33) is equipped with an immersion tank (DB) and a posture conversion unit (41).

[0068] First, the main parts will be described. The orientation changer (33) changes the orientation of multiple substrates (W) collectively by means of the inversion chuck (43) within the immersion tank (DB). Specifically, the inversion chuck (43) changes the orientation of multiple substrates (W) from a vertical orientation to a horizontal orientation. For example, the inversion chuck (43) changes the orientation for half of the substrates (W) constituting a batch lot. For example, the inversion chuck (43) changes the orientation for 25 substrates (W). The inversion chuck (43) is positioned oppositely in the radial direction of the substrate (W) and clamps the peripheral portion of the substrate (W). The immersion tank (DB) stores the processing liquid. The processing liquid is, for example, pure water.

[0069] As shown in FIGS. 6 and 7, the inversion chuck (43) is provided with a pair of chuck members (45). The length of the chuck member (45) in the vertical direction (Z) when receiving or holding a substrate (W) in a vertical position is shorter than the radius of the substrate (W). As shown in FIG. 5, the length of the chuck member (45) in the width direction (Y) when receiving or holding a substrate (W) in a vertical position is slightly longer than the length in the alignment direction of multiple substrates (W) in a lot.

[0070] As shown in FIGS. 6 and 7, each chuck member (45) has a groove (47) on the opposite surface. The groove (47) has an arc shape when viewed in the width direction (Y) in a vertical position for receiving or holding a substrate (W) in a vertical position. The arc shape of the groove (47) follows the outer edge of the substrate (W).

[0071] A pair of chuck members (45) move in the forward and backward direction (X) over a first gap (WD1) and a second gap (WD2). A pair of chuck members (45) can change the distance between opposing grooves (47). The first gap (WD1) is a gap for holding a substrate between the 25-sheet chuck (TFC) and the bridge section (7). The second gap (WD2) is narrower in the forward and backward direction (X) than the first gap (WD1) and is a gap for holding multiple substrates (W).

[0072] The inversion chuck (43) holds only the two sides of the substrate (W) in a direction orthogonal to the direction in which the substrate (W) is being moved. Therefore, when changing the orientation of multiple substrates (W) from a vertical orientation to a horizontal orientation, the inversion chuck (43) does not interfere during transport regardless of which direction they are rotated. Consequently, the subsequent moving operation can be performed smoothly.

[0073] The posture changer (33) is equipped with a lifting mechanism (61), a driving mechanism (63), and a rotating mechanism (65).

[0074] The lifting mechanism (61) raises the inversion chuck (43). The driving mechanism (63) opens and closes the inversion chuck (43). The rotating mechanism (65) rotates the inversion chuck (43).

[0075] The lifting mechanism (61) is positioned outside the immersion tank (DB). The lifting mechanism (61) is positioned along the outer surface of two of the four side walls of the immersion tank (DB) that are installed in the front-rear direction (X) when viewed from a planar view. As shown in FIG. 8, the lifting mechanism (61) moves the inversion chuck (43) up and down over a receiving height (HP1), a clamping height (HP2), a hanging height (HP3), and an immersion height (HP4). The receiving height (HP1) is a height for receiving a vertically positioned substrate (W) in the inversion chuck (43). The clamping height (HP2) is a height for clamping a vertically positioned substrate (W) with the inversion chuck (43). The hanging height (HP3) is a height for hanging a vertically positioned substrate (W) clamped by the inversion chuck (43). The immersion height (HP4) is a height for immersing a vertically positioned substrate (W), which is hung by an inversion chuck (43), into the processing liquid in the immersion tank (DB).

[0076] The lifting mechanism (61) is equipped with a base member (61a) and a lifting motor (61b). The base member (61a) is fixed to the bottom of the position changer (33). The lifting motor (61b) raises the upper part of the base member (61a) in the vertical direction (Z). The lifting motor (61b) may be configured as an actuator such as a multi-stage air cylinder.

[0077] The driving mechanism (63) is mounted on the upper part of the lifting mechanism (61). The driving mechanism (63) is equipped with an air cylinder (63a), a moving part (63b), and a suspension arm (63c). The operating axis of the air cylinder (63a) is oriented in the front-rear direction (X). The suspension arm (63c) has an inverted L shape. The horizontal part of the suspension arm (63c) is mounted on the upper part of the base member (61a). The suspension arm (63c) is mounted to allow horizontal movement in the front-rear direction (X). The driving mechanism (63) moves the suspension arm (63c) in the front-rear direction (X) by operating the air cylinder (63a). The driving mechanism (63) drives the inversion chuck (43) by operating the air cylinder (63a). In detail, the driving mechanism (63) moves the chuck member (45) over the first gap (WD1) and the second gap (WD2).

[0078] The air cylinder (63a) contracts its operating axis when not in operation, for example. The air cylinder (63a) extends its operating axis when in operation, for example. That is, when the air cylinder (63a) is not in operation, the inversion chuck (43) becomes the first gap (WD1). When the air cylinder (63a) is in operation, the inversion chuck (43) becomes the second gap (WD2).

[0079] The rotating mechanism (65) is equipped with a rotating shaft (65a) and a motor (65b).

[0080] One end of the rotation shaft (65a) is connected to the outer surface of the chuck member (45). The motor (65b) is built into the lower part of the suspension arm (63c). The motor (65b) is positioned facing the front-rear direction (X). The rotation shaft (65a) is mounted on the suspension arm (63c) via a seal member not shown. Therefore, pure water stored in the immersion tank (DB) does not enter the suspension arm (63c). The motor (65b) rotates the rotation shaft (65a) around the axis AX1. When the motor (65b) is driven, the inversion chuck (43) is driven to rotate around the axis AX1. The rotation of the inversion chuck (43) by the motor (65b) is possible in clockwise and counterclockwise directions around the axis AX1 when viewed from the front (X). The rotation control of the inversion chuck (43) by this motor (65b) will be described in detail later.

[0081] The attitude change unit (41), configured as described above, can change the attitude of the substrate (W) just like the material transfer mechanism (CTC). However, the attitude change unit (41) rotates the direction of the surface of the substrate (W) around an axis AX1 oriented in the horizontal direction. The material transfer mechanism (CTC) changes the attitude by a combination of the conversion mechanism (HVC) and the pusher (PH). Therefore, the attitude change unit (41) can be miniaturized compared to the material transfer mechanism (CTC).

[0082] Here, we return to Fig. 1 and Fig. 2.

[0083] <8. Bridge Section>

[0084] The bridge section (7) connects the batch processing unit (3) and the single-wafer processing unit (5). The bridge section (7) is in communication only with the batch processing unit (3) and the single-wafer processing unit (5). The bridge section (7) is equipped with a bridge robot (BR). The bridge robot (BR) is configured to be movable only in the width direction (Y). The bridge robot (BR) does not move up and down in the vertical direction (Z). The bridge robot (BR) is equipped with a hand (71). The hand (71) is configured to be rotatable within a horizontal plane including the front-rear direction (X) and the width direction (Y). The hand (71) is configured to be extendable in the horizontal direction. The bridge robot (BR) moves the hand (71) forward and backward to receive a single substrate in a horizontal position from the position change block (15). The bridge robot (BR) receives a single substrate in a horizontal position to the single-wafer processing unit (5).

[0085] <9. Single-wafer processing device>

[0086] The single-wafer processing device (5) is equipped with an outgoing block (81), an indexer block (83), and a processing block (85).

[0087] <10. Export Block>

[0088] The discharge block (81) is equipped with a discharge section (87). The discharge section (87) is positioned at the front (X) of the single-wafer processing device (5). A carrier (C) is placed in the discharge section (87). The discharge block (81) is equipped with, for example, four discharge sections (87). The four discharge sections (87) are arranged along the width direction (Y). The discharge section (87) is also called a load port.

[0089] <11. Indexer Block>

[0090] The indexer block (83) is equipped with an indexer robot (IR). The indexer robot (IR) is equipped with, for example, a multi-joint arm (89) and a hand (91). The indexer robot (IR) does not move in the width direction (Y) and the front-back direction (X). The indexer robot (IR) moves the hand (91) by bending the multi-joint arm (89). The indexer robot (IR) raises and lowers the hand (91) in the vertical direction (Z). The indexer robot (IR) can access each cassette (C) placed in the four output sections (87). The indexer robot (IR) returns one substrate (W) with the hand (91). The indexer robot (IR) returns one substrate (W) from the processing block (85) to the output section (87).

[0091] <12. Processing Block>

[0092] The processing block (85) is equipped with four towers (TW1 to TW4) and a center robot (CR).

[0093] Tower (TW1) is positioned at the rear (X) of the indexer block (83). Tower (TW1) is positioned adjacent to the indexer block (83). Tower (TW1) is provided with processing chambers (MPCs) stacked in the vertical direction (Z). Tower (TW1) is provided with, for example, three processing chambers (MPCs). The processing chambers (MPCs) process substrates (W) one by one. The processing chambers (MPCs) perform a drying treatment on the substrates (W), for example.

[0094] Tower (TW2) is positioned at the rear (X) of Tower (TW1). Tower (TW2) is positioned adjacent to Tower (TW1). Tower (TW2) has the same configuration as Tower (TW1). That is, Tower (TW2) is equipped with three processing chambers (MPC) stacked in the vertical direction (Z).

[0095] Tower (TW3) is positioned to the left (Y) of Tower (TW2). Tower (TW3) is positioned to the left (Y) of Tower (TW2) with the center robot (CR) in between. Tower (TW3) also has the same configuration as Towers (TW1, TW2). That is, Tower (TW3) is equipped with three processing chambers (MPC) stacked in the vertical direction (Z).

[0096] Tower (TW4) differs in some configuration from Towers (TW1 to TW4). That is, Tower (TW4) is equipped with processing chambers (MPC) at the very bottom and very top in the vertical direction (Z). Tower (TW4) is equipped with a receiving section (93) in the central part in the vertical direction (Z). A single substrate (W) is placed in the receiving section (93). The receiving section (93) is equipped with a lifting pin (93a). The lifting pin (93a) is raised when receiving the substrate (W) from the bridge robot (BR). A single substrate (W) is placed in the receiving section (93) from the bridge robot (BR). The placed single substrate (W) is received by the center robot (CR) in the receiving section (93).

[0097] The center robot (CR) is configured to be movable in the forward direction (X). The center robot (CR) is equipped with a hand (95). The hand (95) moves up and down in the vertical direction (Z). The hand (95) is configured to be pivotable within a plane including the forward direction (X) and the width direction (Y). The hand (95) is moved to access the processing chamber (MPC) and the receiving section (93) of the towers (TW1~TW4). That is, the center robot (CR) can freely move the hand (95) in the vertical direction (Z), the forward direction (X), and the width direction (Y). The center robot (CR) receives the processed substrate (W) from the indexer robot (83).

[0098] <13. Control Systems>

[0099] Here, refer to FIG. 10. FIG. 10 is a block diagram showing a control system.

[0100] The substrate processing device (1) is equipped with a control unit (101). The control unit (101) is equipped with a CPU or memory. The control unit (101) is composed of electronic circuits. The control unit (101) operates each of the above-described parts according to a pre-stored program. The control unit (101) is connected to an operation unit (103). The operation unit (103) is mounted, for example, on the front (X) of the batch processing device (3) as shown in FIG. 1. The operation unit (103) is composed, for example, of a keyboard, a pointing device, a display unit, or a touch display panel. The operation unit (103) is operated by an operator of the substrate processing device (1). The operator operates the operation unit (103) to specify, for example, a desired recipe for each lot. The operator operates the operation unit (103) to specify, for example, a combination method of the desired processing surface for the batch lot. As mentioned above, there are two types of combination methods for this treatment surface: face-to-face and face-to-back.

[0101] A recipe storage unit (105) is connected to the control unit (101). The recipe storage unit (105) is composed of memory. The recipe storage unit (105) stores a recipe that specifies how to process each lot. The recipe may also be edited by an operator through the operation unit (103). The method of combining processing surfaces for the batch lot described above corresponds to the recipe, for example. That is, when a recipe is specified by the operation unit (103) for each lot, surface matching or front-to-back surface matching is specified for the batch lot that combines the lot and the lot.

[0102] In addition, in a configuration where the substrate processing device (1) is connected to a network within the factory, the method of combining processing surfaces for a batch lot may be pre-specified to a host computer not shown. The host computer not shown can comprehensively manage not only the substrate processing device (1) but also all devices within the factory or clean room. In addition, a recipe for each lot may be pre-specified to the host computer.

[0103] The control unit (101) operates the rotation mechanism (65) in the position conversion block (15) according to the recipe of the batch lot, that is, the method of combining the processing surface for the batch lot. The details thereof will be described later.

[0104] <14. Operation Description>

[0105] Referring to FIGS. 1 and FIGS. 2, an example of processing by a substrate processing device (1) will be described.

[0106] First, I will explain the general flow of the overall process.

[0107] <15. Batch Processing>

[0108] A carrier (C) containing multiple unprocessed substrates (W) is placed in the input section (19). At this time, for example, an operator may operate the operation section (103) as needed to specify a recipe for the lot of the carrier (C). Here, it is assumed that a recipe has already been specified for the carrier (C) and a method for combining processing surfaces for the batch lot has also been specified. That is, a recipe is associated with the carrier (C) constituting the lot, and a method for combining processing surfaces for the batch lot is associated with the recipe. In other words, a method for combining the batch lot is associated with the recipe. The recipe and the method for combining processing surfaces for the batch lot are referenced by the control section (101). The control section (101) refers to the recipe memory section (105) and operates each section based on the corresponding recipe. In particular, the control unit (101) operates the attitude conversion unit (41) of the attitude conversion block (15) based on the combination method of the batch lot corresponding to the recipe. Although details will be described later, the rotation mechanism (65) of the attitude conversion block (15) is operated according to the direction of the processing surface of the substrate (W) constituting the lot.

[0109] A carrier (C) is brought into the stoker block (11) by the return mechanism (23). By the first return mechanism (HTR) and the transfer mechanism (CTC), two sets of multiple substrates (W) are assembled as a batch lot. The multiple substrates (W) constituting the batch lot are returned to the processing block (17) by the second return mechanism (WTR). In the processing block (17), for example, etching treatment with phosphoric acid is performed in the second batch processing unit (BPU2). Afterward, the multiple substrates (W) constituting the batch lot are subjected to pure cleaning treatment in the first batch processing unit (BPU1). Next, the multiple substrates (W) constituting the batch lot are returned to the position conversion block (15) by the second return mechanism (WTR). In the position conversion block (15), only one lot of the batch lot is returned to the position conversion tank (33). In the orientation conversion unit (33), only one lot of the batch lot is in the liquid, so multiple substrates (W) in a vertical orientation are converted to a horizontal orientation. Afterwards, multiple substrates (W) constituting one lot of the batch lot are sequentially transferred one by one to the single-wafer processing unit (5). Afterwards, the other lot of the batch lot is converted to the same orientation and then transferred to the single-wafer processing unit (5).

[0110] <16. Single-wafer processing>

[0111] A single substrate (W) converted to a horizontal position is conveyed to a single-wafer processing device (5) by a bridge robot (BR). Specifically, a single substrate (W) is placed in a water supply section (93). A single substrate (W) placed in the water supply section (93) is received by a center robot (CR). The center robot (CR) brings the single substrate (W) into, for example, a processing chamber (MPC) of a tower (TW1). In the processing chamber (MPC), a drying process is performed on the substrate (W), for example. Specifically, pure water is supplied while rotating the substrate (W), for example. Then, IPA is supplied to the substrate (W), and the pure water of the substrate (W) is replaced with IPA. After that, the substrate (W) is dried by rotating it at high speed. Additionally, if necessary, it is preferable to perform a drying process using supercritical carbon dioxide in another processing chamber (MPC). A final drying treatment is performed on the substrate (W) by drying treatment with a supercritical fluid. As a result, the substrate (W) is completely dried, and the collapse of the pattern formed on the substrate (W) is suppressed.

[0112] A single substrate (W) that has completed drying treatment is transferred to the discharge section (87) via the center robot (CR) and the indexer robot (IR). The indexer robot (IR) receives the single substrate (W) into a carrier (C) placed in the discharge section (87). Substrates (W) constituting the same lot that are continuously processed are stored in the same carrier (C).

[0113] <17. Pose Transformation Processing>

[0114] The above is the approximate flow of processing by the substrate processing device (1). Next, the orientation change will be explained.

[0115] Multiple substrates (W) constituting a batch lot that has completed batch processing are transferred to a lifter (LF0) of a standby tank (31) by a second conveying mechanism (WTR). The lifter (LF0) moves the multiple substrates (W) constituting the batch lot to a waiting position inside the standby tank (31). Since the multiple substrates (W) constituting the batch lot are waiting in this state, drying can be prevented. That is, the collapse of patterns formed on the substrates (W) after batch processing can be prevented.

[0116] The 25-sheet chuck (TFC) is positioned, for example, at the second water level position (P2). The 25-sheet chuck (TFC) opens the hand (35). That is, the 25-sheet chuck (TFC) is set to the pass position (PT) with the hand (35) (see FIG. 5). The lifter (LF0) is raised to the water level position above the liquid level of the standby tank (BB0). At this time, since the 25-sheet chuck (TFC) has the hand (35) at the pass position (PT), multiple substrates (W) can pass through the 25-sheet chuck (TFC) and be raised. Additionally, the inversion chuck (43) is raised to the receiving height (HP1) by the position conversion unit (41) in the position conversion tank (33) (see FIG. 8).

[0117] The 25-sheet chuck (TFC) closes the hand (35). That is, the 25-sheet chuck (TFC) is in a holding position (PC) with the hand (35) (see FIG. 5). In this state, the lifter (LF0) is lowered to a standby position. As a result, among the multiple substrates (W) of the batch lot that were loaded on the lifter (LF0), only the multiple substrates (W) that are an even number constituting one lot are loaded on the 25-sheet chuck (TFC). Among the multiple substrates (W) of the batch lot that were loaded on the lifter (LF0), the multiple substrates (W) that are an odd number constituting another lot are lowered into the standby unit (BB0) together with the lifter (LF0). As a result, the hand (35) of the 25-sheet chuck (TFC) is set to the first water position (PT1), allowing the odd-numbered substrates (W) to wait in a state where drying is prevented until they are moved to the position change tank (33). Therefore, pattern collapse caused by drying of multiple substrates (W) constituting another lot can also be prevented.

[0118] As shown in FIG. 5, the 25th chuck (TFC) advances the hand (35) to the right (Y) to the third hand position (P3). At this time, as shown in FIG. 8, the inversion chuck (43) is positioned at the receiving height (HP1), so no interference occurs with the substrate (W).

[0119] The inversion chuck (43) is set to a first gap (WD1) (see FIG. 6). In this state, the inversion chuck (43) is lowered toward a plurality of substrates (W) placed on a 25-sheet chuck (TFC). Specifically, as shown in FIG. 8, the inversion chuck (43) is lowered to a clamping height (HP2). The plurality of substrates (W) are received in the inversion chuck (43).

[0120] The inversion chuck (43) is set to a second width (WD2) (see FIG. 7). As a result, the substrate (W) contained in the inversion chuck (43) is clamped. Additionally, as shown in FIG. 8, the inversion chuck (43) is raised to a catch height (HP3). As a result, the lower edge of the cross section of the substrate (W) clamped in the inversion chuck (43), which is lower than the side, comes into contact and catches. Additionally, while the inversion chuck (43) is temporarily raised to a receiving height (HP1), the 25-sheet chuck (TFC) is moved to a second receiving position (P2). As a result, the 25-sheet chuck (TFC) is prepared to receive multiple substrates (W) constituting another lot placed on the lifter (LF0).

[0121] As shown in FIG. 8, the inversion chuck (43) is lowered to an immersion height (HP4). As a result, a plurality of substrates (W) held in the inversion chuck (43) are immersed in the processing liquid of the immersion tank (DB). The entire plurality of substrates (W) is submerged under the processing liquid of the immersion tank (DB). In the position change block (15), the plurality of substrates (W) constituting a lot are exposed from the liquid for a short period of time until they are raised from the standby tank (BB0) and immersed in the immersion tank (DB).

[0122] For example, the inversion chuck (43) is rotated 90°. More specifically, in this example, it is rotated 90° counterclockwise. The direction of rotation is determined by which direction the processing surface (surface) of the substrate (W) is positioned. That is, the direction of rotation is determined so that the processing surface of the substrate (W) faces upward. As a result, multiple substrates (W) are converted to a horizontal position.

[0123] The inversion chuck (43) is raised. Specifically, the inversion chuck (43) is raised so that only the substrate (W) held in the uppermost groove (47) of the inversion chuck (43) is exposed from the liquid of the immersion tank (DB). The height of the inversion chuck (43) is such that the hand (71) of the bridge robot (BR) can enter a position slightly below the lower surface of the substrate (W) exposed from the liquid.

[0124] The hand (71) of the bridge robot (BR) is introduced into the posture conversion unit (41). The hand (71) is introduced into a position slightly downward from the lower surface of the substrate (W).

[0125] The inversion chuck (43) is moved downward. As the inversion chuck (43) moves, the substrate (W) is transferred to the hand (71).

[0126] The bridge robot (BR) moves the hand (71) to the right (Y) to remove the uppermost substrate (W) from the inversion chuck (43).

[0127] The bridge robot (BR) rotates the hand (71) to position the substrate (W) in the right (Y). Specifically, it rotates the hand (71) to move the substrate (W) toward the receiving section (93). Then, it receives one substrate (W) at the receiving section (93).

[0128] By the operation of the aforementioned posture conversion block (15), a single substrate (W) is transported in a horizontal posture from the batch processing device (3) to the single-wafer processing device (5).

[0129] <18. Detailed Operation of Pose Transformation Processing>

[0130] Here, the detailed operation of the aforementioned attitude transformation process is described. Refer to FIGS. 11 (a) to FIGS. 11 (d) and FIGS. 12 (a) to FIGS. 12 (d). FIGS. 11 (a) to FIGS. 11 (d) and FIGS. 12 (a) to FIGS. 12 (d) are schematic diagrams showing an example of attitude transformation in a batch lot of face-to-face. Here, the batch lot (BL1) described with reference to FIG. 3 is used as an example. Batch lot (BL1) is a combination of lot (LT1) and lot (LT2) in face-to-face (FTF).

[0131] As shown in FIG. 11 (a) and FIG. 11 (b), the 25-sheet chuck (TFC) receives, for example, a plurality of substrates (W) constituting lot (LT1) from a batch lot (BL1) held by a lifter (LF0). Each substrate (W) constituting lot (LT1) has its processing surface facing, for example, to the right (Y). Next, as shown in FIG. 11 (c), the inversion chuck (43) receives each substrate (W) constituting lot (LT1) from the 25-sheet chuck (TFC).

[0132] Next, the control unit (101) operates the rotation mechanism (65) based on the lot combination method associated with the recipe at this time. In this case, since the batch lot (BL1) is a surface-to-face (FTF), the control unit (101) can determine which direction the processing surface of each substrate (W) constituting the lot (LT1) is held in the inversion chuck (43). The control unit (101) operates the rotation mechanism (65) so that the processing surface faces upward.

[0133] Specifically, as shown in (d) of FIG. 11, the control unit (101) rotates the rotation mechanism (65) counterclockwise by a predetermined angle when viewed from the rear (X). The predetermined angle is, for example, 90 degrees. That is, the control unit (101) rotates the rotation mechanism (65) by 90 degrees in one direction.

[0134] The control unit (101) performs a position change for the remaining lot (LT2) of the batch lot (BL1). Specifically, as shown in FIG. 12 (a) and FIG. 12 (b), the 25-sheet chuck (TFC) receives a plurality of substrates (W) constituting the lot (LT2) held by the lifter (LF0). Next, as shown in FIG. 12 (c), the inversion chuck (43) receives each substrate (W) constituting the lot (LT2) from the 25-sheet chuck (TFC). The lot (LT2) is in a state where the processing surface faces left (Y).

[0135] Next, the control unit (101) operates the rotation mechanism (65) so that the processing surface of the lot (LT2) faces upward. Specifically, as shown in (d) of FIG. 12, the control unit (101) rotates the rotation mechanism (65) clockwise by a predetermined angle when viewed from the rear (X). The predetermined angle is, for example, 90 degrees. That is, the control unit (101) rotates the rotation mechanism (65) by 90 degrees in the other direction, which is opposite to one direction.

[0136] In addition, the corresponding relationship between each component in the present invention and the above-described embodiment is as follows.

[0137] The batch processing device (3) corresponds to the “batch processing unit” in the present invention. The single-wafer processing device (5) corresponds to the “single-wafer processing unit” in the present invention. The position conversion unit (33) corresponds to the “position conversion unit” in the present invention. The 25-sheet chuck (TFC) corresponds to the “first conveying unit” in the present invention. The bridge robot (BR) corresponds to the “second conveying unit” in the present invention. The driving mechanism (63) corresponds to the “opening / closing driving mechanism” in the present invention. The rotation mechanism (65) corresponds to the “rotation driving mechanism” in the present invention. The first gap (WD1) corresponds to the “open position” in the present invention. The second gap (WD2) corresponds to the “holding position” in the present invention.

[0138] According to the present embodiment, the control unit (101) operates the driving mechanism (63) to have the inversion chuck (43) hold a plurality of substrates (W) in a vertical position. Then, when the control unit (101) changes the position of the plurality of substrates (W) from a vertical position to a horizontal position, it operates the rotation mechanism (65) so that the processing surface of the plurality of substrates (W) faces upward. Accordingly, regardless of the direction of the processing surface of the substrate (W), the position change can be performed normally so that the processing surface of the plurality of substrates (W) faces upward.

[0139] Additionally, the processing surface of the multiple substrates (W) in a vertical position is oriented toward either one direction or the other. Accordingly, the control unit (101) can make the processing surface of the multiple substrates (W) face upward by operating the rotation mechanism (65) to rotate them 90 degrees toward the other direction or one direction depending on the direction of the processing surface.

[0140] Additionally, if the target of the orientation change is the batch lot (BL2) shown in FIG. 4, that is, the batch lot (BL2) of the front-side bonding (FTB) with the processing surface facing to the left (Y), first, the control unit (101) operates the rotation mechanism (65) so that the processing surface of the substrate (W) faces upward with respect to the lot (LT1) and rotates it 90 degrees in one direction. Next, the control unit (101) operates the rotation mechanism (65) so that the processing surface of the substrate (W) faces upward with respect to the lot (LT2) and rotates it 90 degrees in one direction. Also, if the processing surface of each substrate (W) of the batch lot (BL2) faces to the right (Y), the control unit (101) operates the rotation mechanism (65) so that the processing surface of the substrate (W) faces upward and rotates it 90 degrees in the other direction.

[0141] The present invention is not limited to the above embodiments and can be modified as follows.

[0142] (1) In the above-described embodiment, the control unit (101) operates the rotation mechanism (65) in the reverse direction from lot (BL1) and lot (BL2) when changing the orientation of the batch lot (BL1). However, the present invention is not limited to such rotation control. For example, the rotation mechanism (65) may be operated as follows.

[0143] Here, refer to FIGS. 13(a) to FIGS. 13(d). FIGS. 13(a) to FIGS. 13(d) are schematic diagrams showing different examples of attitude transformation.

[0144] In the example described above, the control unit (101) operates the rotation mechanism (65) in one direction or the opposite direction depending on the direction of the processing surface of the lot (LT1, LT2). However, the control unit (101) may operate the rotation mechanism (65) as follows.

[0145] The control unit (101) operates the rotation mechanism (65) for lot (LT2) to rotate it in only one direction. That is, the control unit (101) operates the rotation mechanism (65) for lot (LT1) to rotate it in one direction by a first angle. The first angle is, for example, 90 degrees. The control unit (101) operates the rotation mechanism (65) for lot (LT2) to rotate it in one direction by a second angle so that the processing surface of the substrate (W) faces upward. The second angle is greater than the first angle. The second angle is, for example, 270 degrees. That is, regardless of lot (LT1, LT2), the control unit (101) rotates the rotation mechanism (65) in the same direction so that the processing surface of the substrate (W) faces upward.

[0146] In this way, the control unit (101) can make the processing surface of a plurality of substrates (W) face upward by operating the rotation mechanism (65) to rotate 90 degrees or 270 degrees in one direction. Accordingly, the control of the rotation mechanism (65) by the control unit (101) can be simplified.

[0147] (2) In the above-described embodiment, the substrate processing device (1) is equipped with a control unit (101), and the control unit (101) controls each unit collectively. However, the present invention is not limited to this control method. Herein, refer to FIG. 14. FIG. 14 is a block diagram showing a modified example of a control system.

[0148] That is, the substrate processing device (1A) is equipped with a control unit (101) that controls the whole, a sub-control unit (101A) that controls the batch processing device (3), a sub-control unit (101B) that controls the position conversion block (15), a sub-control unit (101C) that controls the single-wafer processing device (5), and W.

[0149] According to this configuration, the control unit (101) transmits information regarding the recipe for each lot to the sub-control units (101A, 101B, 101C). The control unit (101) also transmits information regarding the combination method of the processing surface for the batch lot. The sub-control unit (101A) operates the rotational movement or linear movement of the pusher (PH) in the attitude change block (13) according to the recipe of the lot constituting the batch lot received from the control unit (101), for example. The sub-control unit (101B) operates the rotation direction and angle of the rotation mechanism (65) according to the recipe of the lot constituting the batch lot received from the control unit (101), for example. The sub-control unit (101C) controls each tower (TW1~3) according to the recipe of the lot constituting the batch lot received from the control unit (101), for example.

[0150] According to this configuration, the load of the control unit (101) can be distributed by the sub-control units (101A, 101B, 101C). Therefore, the load of the control unit (101) can be reduced.

[0151] (3) In the above-described embodiment, the inversion chuck (43) is provided with a pair of chuck members (45). However, the present invention is not limited to this configuration of the inversion chuck (43).

[0152] (4) In the above-described embodiment, the attitude changer (33) changes the attitude of multiple substrates (W) in pure water. However, the present invention does not require attitude change in liquid. That is, the attitude changer (33) may change the attitude of multiple substrates (W) in a gas such as air or nitrogen gas. In this case, since the resistance during rotation is low, the speed of attitude change can be increased and throughput can be improved.

[0153] (5) In the above-described embodiment, the substrate processing device (1) was described as having a configuration in which a batch processing device (3) and a single-wafer processing device (5) are connected by a cross-linking part (7). However, the present invention can also be applied to a single substrate processing device (1) in which a batch processing device (3) and a single-wafer processing device (5) are provided within the same housing.

[0154] The present invention may be embodied in other specific forms without departing from its concept or essential attributes, and thus, as to the scope of the invention, reference should be made to the accompanying claims rather than the specification above.

Claims

Claim 1 An attitude change device for changing the attitude of a plurality of substrates, comprising: an inversion chuck for holding a plurality of substrates; an opening / closing driving mechanism for driving the inversion chuck in the radial direction of the substrates between an opening position for receiving the plurality of substrates and the inversion chuck, and a holding position for holding the plurality of substrates with the inversion chuck; a rotary driving mechanism for driving the inversion chuck around a horizontal axis to change the attitude of the plurality of substrates from a vertical attitude to a horizontal attitude; and a control unit that, after operating the opening / closing driving mechanism to have the inversion chuck hold the plurality of substrates in a vertical attitude, when changing the attitude of the plurality of substrates from a vertical attitude to a horizontal attitude, operates the rotary driving mechanism according to the direction of the processing surface of the plurality of substrates in the vertical attitude to rotate the inversion chuck around the horizontal axis so that the processing surface of the plurality of substrates in the horizontal attitude faces upward. Claim 2 An attitude change device according to claim 1, wherein the control unit operates the rotational driving mechanism to rotate in either one direction or the other direction opposite thereto, depending on the direction of the processing surface of the plurality of substrates. Claim 3 An attitude change device according to claim 1, wherein the control unit operates the rotational driving mechanism to rotate in only one direction according to the direction of the processing surface of the plurality of substrates. Claim 4 An attitude conversion device according to claim 1, wherein the inversion chuck maintains only both sides of the plurality of substrates in a direction orthogonal to the direction in which the plurality of substrates are held. Claim 5 An attitude change device according to any one of claims 1 to 4, wherein the control unit operates the rotary driving mechanism based on a recipe that defines the direction in which the processing surface faces when processing the plurality of substrates. Claim 6 An attitude change device according to claim 5, wherein the control unit operates the rotary driving mechanism according to a method of combining processing surfaces in which the processing surface of the certain plurality of substrates and the processing surface of the other plurality of substrates are combined to face in a certain direction when the certain plurality of substrates and the other plurality of substrates are brought together in a batch lot configured by bringing the certain plurality of substrates and the other plurality of substrates together in the recipe. Claim 7 A substrate processing apparatus for processing substrates comprises: a batch processing unit that processes a plurality of substrates collectively in a vertical position; a single-wafer processing unit that processes a single substrate in a horizontal position; a posture conversion unit that converts the plurality of substrates processed in the batch processing unit from a vertical position to a horizontal position; a first conveying unit that conveys the plurality of substrates processed in the batch processing unit to the posture conversion unit; and a second conveying unit that conveys the plurality of substrates converted to a horizontal position in the posture conversion unit to the single-wafer processing unit. The posture conversion unit comprises an inversion chuck that holds the plurality of substrates; an opening / closing driving mechanism that drives the inversion chuck in the radial direction of the substrate between an opening position for receiving the plurality of substrates and the inversion chuck, and a holding position for holding the plurality of substrates with the inversion chuck; and a rotary driving mechanism that drives the inversion chuck around a horizontal axis to convert the posture of the plurality of substrates from a vertical position to a horizontal position. In the batch processing unit, a plurality of A substrate processing apparatus characterized by having a control unit that, after processing a substrate and before returning a plurality of substrates to a single-wafer processing unit, operates the opening and closing drive mechanism to have the inversion chuck hold the plurality of substrates in a vertical position, and when converting the position of the plurality of substrates from a vertical position to a horizontal position, operates the rotation drive mechanism according to the direction of the processing surface of the plurality of substrates in the vertical position to rotate the inversion chuck around the horizontal axis so that the processing surface of the plurality of substrates in the horizontal position faces upward.

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