Display Apparatus

Abstract

According to one embodiment of the present invention, a light-emitting element package is proposed, wherein the light-emitting element package comprises a plurality of heterogeneous interposers including a light-emitting element; and a substrate connected to an electrode of the heterogeneous interposer and having a via formed therein for connection to a wiring electrode, wherein the via may be formed on a wiring electrode that is commonly connected to at least two of the plurality of heterogeneous interposers.

Description

Technology Field

[0001] The present invention relates to a light-emitting element package or a display device including the same, and more specifically, to a light-emitting element package utilizing an interposer or a display device including the same. Background Technology

[0002] Recently, display devices with excellent characteristics such as thinness and flexibility are being developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes).

[0003] Meanwhile, light-emitting diodes (LEDs) are semiconductor light-emitting devices well known for converting electric current into light. Starting with the commercialization of red LEDs using GaAsP compound semiconductors in 1962, they have been used as light sources for display images in electronic devices, including information and communication equipment, along with green LEDs of the GaP:N series.

[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are being used as pixels in display devices.

[0005] Compared to other display devices / panels, such LED technology exhibits characteristics of low power consumption, high brightness, and high reliability, and can also be applied to flexible devices. Consequently, it has recently been actively researched by research institutions and companies.

[0006] Various markets for LED displays are expanding through applications that leverage the high brightness and high reliability characteristics of LEDs. The field leading the market most significantly due to these characteristics is signage displays.

[0007] Manufacturing Micro LED or Mini LED-based products requires transferring a very large number of LEDs, which can worsen yield. Since LEDs assembled in a panel are typically inspected after assembly is complete, repairing LEDs that have already been transferred is a very difficult task.

[0008] Accordingly, when an interposer is manufactured by combining RGB LEDs to form a display, the number of transfers required is reduced to one-third or less, and since the size of the interposer itself increases, pre-inspection before assembly is easy, and repairing defects after assembly is also easy.

[0009] However, while RGB pixels must be arranged at equal intervals, the interposer must be smaller than the corresponding pixel to have a process margin during assembly.

[0010] Referring to FIGS. 1 and 2, a structure comprising one interposer (10) corresponding to one pixel is illustrated. One pixel is composed of an individual PCB (20), and solder pads (21, 22) formed on the PCB (20) are electrically connected to the electrode (11) of the interposer. The interposer (10) is configured to include an electrode (11) for electrical connection with the PCB (20), and LEDs (12, 13, 14) that emit R, G, and B light on the interposer substrate.

[0011] Therefore, the gap (d) between the interposers must be assembled very narrowly, which makes the PCB assembly process difficult.

[0012] This specification proposes a method to improve the margins of PCB design and production / assembly by configuring an interposer having a heterogeneous electrode structure.

[0013] In this specification, “interposer” refers to a device or apparatus configured to include at least one pixel (one each of R, G, and B light-emitting elements) and an electrode (11) for electrically connecting a wiring electrode and a pad of a light-emitting element. The problem to be solved

[0014] The present invention proposes a display device using an interposer having a heterogeneous electrode structure.

[0015] The problems to be solved by the present invention are not limited to the problems to be solved above, and other problems not mentioned will be clearly understood by those skilled in the art to which the present invention belongs from the description below. means of solving the problem

[0016] According to one embodiment of the present invention, a light-emitting element package is proposed, wherein the light-emitting element package comprises a plurality of heterogeneous interposers including a light-emitting element; and a substrate connected to an electrode of the heterogeneous interposer and having a via formed therein for connection to a wiring electrode, wherein the via may be formed on a wiring electrode that is commonly connected to at least two of the plurality of heterogeneous interposers.

[0017] Additionally or alternatively, each of the above interposers may be configured to include at least one pixel.

[0018] Additionally or alternatively, each of the above interposers is 2 n It is configured to include pixels, and n can be an integer greater than or equal to 0.

[0019] Additionally or alternatively, the plurality of heterogeneous interposers may be configured to have different electrode placement structures.

[0020] Additionally or alternatively, the wiring electrode commonly connected to the at least two heterogeneous interposers may be configured to be connected to a scan line or a data line.

[0021] Additionally or alternatively, the at least two heterogeneous interposers may be configured to have a rotational or symmetrical structure such that electrodes commonly connected to each other face each other.

[0022] According to another embodiment of the present invention, a display device is proposed, wherein the display device comprises a plurality of heterogeneous interposers including light-emitting elements; and a plurality of light-emitting element packages including a substrate connected to an electrode of the heterogeneous interposer and having a via formed therein for connection to a wiring electrode, and the via may be formed on a wiring electrode that is commonly connected to at least two of the plurality of heterogeneous interposers.

[0023] Additionally or alternatively, the plurality of light-emitting element packages may be attached to a main substrate for the display device.

[0024] The above-mentioned problem-solving methods are merely some of the embodiments of the present invention, and various embodiments reflecting the technical features of the present invention can be derived and understood by those skilled in the art based on the detailed description of the present invention to be described below.

[0025] The above-mentioned problem-solving methods are merely some of the embodiments of the present invention, and various embodiments reflecting the technical features of the present invention can be derived and understood by those skilled in the art based on the detailed description of the present invention to be described below. Effects of the invention

[0026] The present invention has the following effects.

[0027] The present invention can improve the margins for substrate and component design by using heterogeneous interposers to reduce the possibility of electrical short circuits between adjacent interposers caused by the narrow gap between interposers when the interposers are attached to the parent substrate.

[0028] The present invention can also reduce the number of vias required when designing a main board (or parent board).

[0029] The present invention can also improve the process margin of the wiring board by reducing the number of scan lines or data lines of the main board.

[0030] The effects obtainable from the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0031] The accompanying drawings, which are included as part of the detailed description to aid in understanding the present invention, provide embodiments of the present invention and explain the technical concept of the present invention together with the detailed description. FIGS. 1 and FIGS. 2 illustrate a light-emitting device package using an interposer. FIG. 3 illustrates a plurality of single interposers. FIG. 4 illustrates a heterogeneous interposer and a circuit configuration thereof according to an embodiment of the present invention. Figure 5 illustrates an example of a light-emitting device package using a single interposer. FIG. 6 illustrates an example of a light-emitting device package using a heterogeneous interposer. FIG. 7 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention. FIG. 8 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention. FIG. 9 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention. FIG. 10 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention. FIG. 11 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention. Specific details for implementing the invention

[0032] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.

[0033] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0034] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0035] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0036] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0038] FIG. 3 illustrates a plurality of single interposers.

[0039] FIG. 3 illustrates two single interposers according to the prior art. The first interposer (101) and the second interposer (102) each include R, G, and B light-emitting elements and have the same structure. One wiring electrode (23) is formed for each electrode (R, G, B, C), and one via is also formed.

[0040] According to this, 4 vias are required per pixel.

[0041] However, when using a single interposer according to the conventional technology, the gap between adjacent electrodes (d, see FIG. 1) is narrow during the assembly process, so there is a high possibility of a short circuit.

[0043] FIG. 4 illustrates a heterogeneous interposer and a circuit configuration thereof according to an embodiment of the present invention.

[0044] Referring to FIG. 4(a), two heterogeneous interposers are illustrated. The first interposer (101) and the second interposer (102) have different structures. More specifically, the first interposer and the second interposer form a common wiring electrode (233), so that the arrangement of the electrodes facing each other in each interposer can be formed in a symmetrical structure. That is, a plurality of heterogeneous interposers can be configured to have different electrode arrangement structures.

[0045] That is, electrodes B and C are formed such that the first interposer (101) and the second interposer (102) are symmetrically formed with respect to each other, and electrodes R and G are formed such that the first interposer (101) and the second interposer (102) are symmetrically formed with respect to each other.

[0046] Referring to FIG. 2, the interposer (101, 102) is attached to the main substrate (20), and electrical connections can be made through the wiring electrodes and vias formed on the main substrate (20). That is, electrodes are formed on the substrate (10) of the interposer (101, 102), and vias for common wiring electrodes can also be formed. Additionally, vias for common wiring electrodes can also be formed on the main substrate (20), which may correspond to vias formed on the interposer or the substrate (10). In this specification, the interposer coupled to the substrate (10) in this manner may be referred to as a "light-emitting device package."

[0047] Referring to FIG. 4(b), an equivalent circuit of the first interposer (101) or the second interposer (102) is shown.

[0048] According to the interposer structure of FIG. 4(a), 2.5 vias are required per pixel. Compared to the interposer structure of FIG. 3, the number of vias per pixel is reduced by 1.5. In particular, since electrode B is connected to the common wiring electrode, the possibility of a short circuit between the two interposers can be significantly reduced.

[0049] Although only two interposers are shown, a larger number of interposers may be included depending on the required display resolution or size.

[0050] In addition, although each interposer is illustrated as constituting one pixel (one R, G, and B light-emitting element each), the interposer according to the present invention is 2 n It is configured to include pixels, and n can be an integer greater than or equal to 0.

[0051] As another example, the interposer according to the present invention is 4 kIt is configured to include pixels, and k can be an integer greater than or equal to 0.

[0053] Figure 5 illustrates an example of a light-emitting device package using a single interposer.

[0054] FIG. 5(a) illustrates an example of a PCB design using a single interposer, and FIG. 5(b) is an enlarged view of section A of FIG. 5(a). The interposers in FIG. 5 all use interposers of the same structure, that is, multiple single interposers, and do not have common wiring electrodes or vias.

[0056] FIG. 6 illustrates an example of a light-emitting device package using a heterogeneous interposer.

[0057] FIG. 6(a) illustrates an example of a PCB design using heterogeneous interposers, and FIG. 6(b) is an enlarged view of section A in FIG. 6(a). The interposer of FIG. 6 utilizes two types of interposers with different structures, namely multiple heterogeneous interposers, and is configured to have common wiring electrodes and vias.

[0059] The structure according to Figures 5 and 6 has the following characteristics.

[0060] Resolution Number of horizontal interposers Number of horizontal interposers 2 4 Total pixels 8 Via number (existing, Fig. 5) 4*8=32 Via number (present invention, FIG. 6) 2.5 * 8 = 20 pieces Reduction in vias 12 Via count reduction rate approximately 38%

[0062] Figures 5 and 6 illustrate 2*8 pixels, but if extended to a 4K display, it can be summarized as follows.

[0063] Resolution Number of horizontal interposers Number of horizontal interposers 3840 2160 Total pixels 8,294,400 Via number (existing, Fig. 5) 4 * 8,294,400 = 33,177,600 pieces Via number (present invention, FIG. 6) 2.5 * 8,294,400 = 20,736,000 pieces Reduction in vias 12,441,600 Via count reduction rate approximately 38%

[0064] According to the present invention, the reduction rate of the number of vias is about 38%, and accordingly, the possibility of a short circuit between adjacent electrodes is reduced.

[0066] FIG. 7 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention.

[0067] In FIG. 7(a), two single interposers according to the prior art are shown. Each of the two interposers includes four pixel (R, G, B) light-emitting elements and has the same structure as each other. One wiring electrode is formed for each electrode (R1, B1, G1, R2, B2, G2, S1, S2), and one via is also formed.

[0068] According to this, the number of vias required is 8 per interposer, meaning 2 per pixel.

[0069] However, when using a single interposer according to the conventional technology, the gap between adjacent electrodes (d, see FIG. 1) is narrow during the assembly process, so there is a high possibility of a short circuit.

[0070] Referring to FIG. 7(b), two different types of interposers are shown. The two interposers have different structures. More specifically, the first interposer and the second interposer form a common wiring electrode (R1, G1, B1, R2), and accordingly, the arrangement of the electrodes facing each other in each interposer can be formed in a symmetrical structure.

[0071] That is, electrodes R1, G1, B1, and R2 have the first interposer and the second interposer formed symmetrically with respect to each other, and electrodes S1, S2, G2, and B2 have the first interposer and the second interposer formed symmetrically with respect to each other.

[0072] Referring to Fig. 7 (c), an equivalent circuit of the first interposer or the second interposer is shown.

[0073] According to the interposer structure of FIG. 7(b), 5 vias are required per interposer and 1.25 vias per pixel. Compared to the interposer structure of FIG. 7(a), the number of vias per pixel is reduced by 0.75. Since the electrodes facing each other are connected to a common wiring electrode, the possibility of a short circuit between the two interposers can be significantly reduced. Accordingly, design and assembly margins can be significantly improved.

[0074] Although only two interposers are shown, a larger number of interposers may be included depending on the required display resolution or size.

[0076] FIG. 8 illustrates a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention.

[0077] Referring to FIG. 8(a), two types of interposers are shown. The two interposers have different structures. More specifically, the first type of interposer and the second type of interposer form a common wiring electrode (G, B, R, S1, S2, S3, S4), and a total of four interposers are configured to have a 2-row, 2-column structure, so the arrangement of the electrodes facing each other in each interposer can be formed in a symmetrical structure.

[0078] More specifically, the first type of interposer can form a common wiring electrode with the second type of interposer in the vertical direction and a common wiring electrode with the second type of interposer in the horizontal direction. That is, the first type of interposer can form a common wiring electrode (G, B, or R) with the second type of interposer in the vertical direction and a common wiring electrode (S3, S4 or S1, S2) with the second type of interposer in the horizontal direction.

[0079] Accordingly, the electrodes (S1, S2, S3, S4) connected or arranged in the left-right direction (transverse direction) of the first type of interposer and the second type of interposer are formed symmetrically with respect to each other around the longitudinal axis, and the electrodes (R, G, B) connected or arranged in the up-down direction (transverse direction) can be formed symmetrically with respect to each other around the transverse axis.

[0080] In addition, the common wiring electrode can be connected to the scan lines (S1, S2, S3, S4) or to the data lines (R, G, B).

[0081] Referring to FIG. 8(b), an equivalent circuit of a first type interposer or a second type interposer is shown.

[0082] According to the interposer structure of FIG. 8(a), 3.5 vias are required per interposer and 0.875 vias per pixel. Compared to the interposer structure of FIG. 7(a), the number of vias per pixel is reduced by 1.125. Since the electrodes facing each other are connected to a common wiring electrode, the possibility of a short circuit between the two interposers can be significantly reduced. Accordingly, design and assembly margins can be significantly improved.

[0083] In addition, the wiring spacing is 2 per pixel in the longitudinal direction (scan line) and 1.5 per pixel in the transverse direction (data line), so the precision requirements of the wiring board can also be eased.

[0084] Although only four interposers are shown, a larger number of interposers may be included depending on the required display resolution or size.

[0086] FIGS. 9 to 11 illustrate a heterogeneous interposer and a circuit configuration thereof according to another embodiment of the present invention.

[0087] FIGS. 9 to 11 each illustrate an example in which 4 rows and 4 columns, totaling 16 pixels, are formed in one interposer.

[0088] Referring to (a) of FIGS. 9 to 11, a structure is illustrated in which a total of two types of interposers are arranged adjacent to each other. Although only three interposers are illustrated, a larger number of interposers may be included depending on the required display resolution or size.

[0089] Referring to (b) of FIGS. 9 to 11, an equivalent circuit of any one interposer is shown.

[0090] In the case of Fig. 9, the number of vias is 8 per interposer and 0.5 per pixel, and

[0091] In the case of Fig. 10, the number of vias is 7 per interposer and 0.4375 per pixel, and

[0092] In the case of Fig. 11, the number of vias is 7 per interposer and 0.4375 per pixel.

[0094] As such, the present invention can improve the margin for substrate and component design by using heterogeneous interposers, thereby reducing the possibility of electrical short circuits between adjacent interposers caused by the narrow gap between interposers when the interposers are attached to the main substrate.

[0095] The present invention can also reduce the number of vias required when designing a main board (or parent board).

[0096] The present invention can also improve the process margin of the wiring board by reducing the number of scan lines or data lines of the main board.

[0098] The detailed description of the preferred embodiments of the present invention disclosed above is provided to enable those skilled in the art to implement and practice the present invention. Although the present invention has been described with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the present invention as described in the following claims. Accordingly, the present invention is not intended to be limited to the embodiments shown herein, but to be given the broadest scope consistent with the principles and novel features disclosed herein. Explanation of the symbols

[0099] 10: Interposer (substrate) 11: Electrode 12, 13, 14: Subpixels (or R, G, B LEDs) 20: Unit pixel (main board) 21: Solder pad 22: Interposer placement area d: Spacing between solder pads 23: Wiring Electrodes and Via 101: First Interposer 102: Second Interposer 231, 232, 234, 235, 236, 237: Wiring electrodes and vias 233: Common Wiring Electrodes and Via

Claims

Claim 1 A light-emitting element package comprising: a plurality of heterogeneous interposers including a light-emitting element; and a substrate connected to an electrode of the heterogeneous interposer and having a via formed therein for connection to a wiring electrode, wherein the via is formed on a wiring electrode that is commonly connected to at least two of the plurality of heterogeneous interposers, wherein the plurality of heterogeneous interposers are configured to have different electrode arrangement structures, and wherein the at least two heterogeneous interposers are configured to have a symmetrical structure such that electrodes commonly connected to each other face each other. Claim 2 In claim 1, each of the interposers is configured to include at least one pixel, a light-emitting element package. Claim 3 In paragraph 2, each of the above interposers is: 2 n A light-emitting device package configured to include pixels, where n is an integer greater than or equal to 0. Claim 4 delete Claim 5 A light-emitting device package according to claim 1, wherein the wiring electrode commonly connected to at least two heterogeneous interposers is configured to be connected to a scan line or a data line. Claim 6 delete Claim 7 A display device comprising: a plurality of heterogeneous interposers including light-emitting elements; and a plurality of light-emitting element packages including a substrate connected to an electrode of the heterogeneous interposer and having a via formed therein for connecting to a wiring electrode, wherein the via is formed on a wiring electrode that is commonly connected to at least two of the plurality of heterogeneous interposers, wherein the plurality of heterogeneous interposers are configured to have different electrode arrangement structures, and wherein the at least two heterogeneous interposers are configured to have a symmetrical structure such that electrodes commonly connected to each other face each other. Claim 8 In claim 7, the plurality of light-emitting element packages are attached to a main substrate for the display device, the display device.

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