semiconductor processing system

Abstract

The system comprises a semiconductor processing tool (102) including a process chamber (108); a valve module (104) configured to receive fluid from the process chamber (108) and selectively direct the flow of said fluid; and a cooling device (402) configured to supply a flow of cooling fluid to the process chamber (108), wherein the valve module (104) and the cooling device (402) are arranged in a stacked configuration.

Description

Technology Field

[0001] The present invention relates to a system such as a semiconductor manufacturing system comprising a semiconductor processing tool. The system provides a cooling fluid for use in the semiconductor processing tool and a directed flow of process gas from the semiconductor processing tool. Background Technology

[0002] Integrated circuit chips are manufactured in semiconductor manufacturing plants. In the manufacturing of these devices, wafers are processed through a number of different processing stations, including stations where the wafer undergoes processes such as chemical vapor deposition, physical vapor deposition, implantation, etching, and lithography. Most of these processes utilize gaseous environments and often require the use of high vacuum and reduced gas pressure.

[0003] Vacuum pumps are used to provide this reduced gas pressure in the process chamber, provide chamber evacuation, and maintain the flow of process gases.

[0004] When the pressure inside the chamber of a semiconductor processing tool is not in an operating vacuum state, for example, after exhausting the gas chamber to atmospheric pressure for service or maintenance, a so-called "pump-down event" is performed to set the required reduced gas pressure inside the chamber. The pump-down event involves pumping gas out of the chamber to lower the pressure inside the chamber to the required level.

[0005] A vacuum and reduction system can be used to pump gas simultaneously from multiple gas chambers of a semiconductor processing tool using a common pump through a common manifold. The inventors realized that in such a system, since multiple chambers are fluidically connected to a common manifold, performing a pump-down event on one of these chambers can affect the conditions within other chambers among these chambers. For example, a pump-down event performed in one chamber can cause highly undesirable fluctuations in other chambers connected to the same manifold.

[0006] An embodiment of the present invention provides a valve module for controlling fluid from multiple chambers of a semiconductor processing tool in such a way that these defects are reduced or eliminated.

[0007] In a first embodiment, a system is provided comprising: a semiconductor processing tool including a process chamber; a valve module configured to receive fluid from the process chamber and selectively direct the flow of said fluid; and a cooling device configured to supply a flow of cooling fluid to the process chamber, wherein the valve module and the cooling device are arranged in a stacked configuration.

[0008] The above valve module can be placed on the upper part of the cooling device.

[0009] The system may further include a common power source configured to supply power to both the valve module and the cooling device.

[0010] The system may further include a common pneumatic fluid source configured to supply pneumatic fluid to both the valve module and the cooling device. The valve module includes a valve, and the valve module may be configured to actuate the valve using pneumatic fluid received from the common pneumatic fluid source. The valve module includes one or more conduits, and the valve module may be configured to purge one or more conduits using pneumatic fluid received from the common pneumatic fluid source. The valve module may be configured to perform a leak test using pneumatic fluid received from the common pneumatic fluid source.

[0011] The semiconductor processing tool may include a plurality of process chambers. The valve module may be configured to receive a fluid from each of the plurality of process chambers and to selectively direct the flow of each fluid. The system includes a plurality of cooling devices, each cooling device may be configured to supply a flow of cooling fluid to each of the plurality of cooling chambers. The valve module and the plurality of cooling devices may be arranged in a stacked configuration.

[0012] In a further embodiment, a method is provided comprising: providing a semiconductor processing tool including a process chamber; fluidically coupling a valve module to the process chamber such that the valve module is arranged to receive fluid from the process chamber — said valve module is configured to selectively direct the flow of said fluid —; fluidly coupling a cooling device to the process chamber such that the cooling device is arranged to supply a flow of cooling fluid to said process chamber; and arranging said valve module and said cooling device in a stacked configuration.

[0013] The above arrangement may include positioning the valve module on the upper part of the cooling device.

[0014] The above method may further include electrically coupling a common power source to both the valve module and the cooling device.

[0015] The above method may further include fluidically coupling a common pneumatic fluid source to both the valve module and the cooling device. The valve module includes a valve, and the method may further include operating the valve using pneumatic fluid received from the common pneumatic fluid source. The valve module includes one or more conduits, and the method may further include purging one or more conduits using pneumatic fluid received from the common pneumatic fluid source. It may further include performing a leak test using pneumatic fluid received from the common pneumatic fluid source. Brief explanation of the drawing

[0016] Figure 1 is a schematic diagram (not scale) of a semiconductor manufacturing facility. FIG. 2 is a schematic diagram (not scale) illustrating a perspective view of a valve module of a semiconductor manufacturing facility. Figure 3 is a process flow diagram illustrating a specific step of the gas pumping process in a semiconductor manufacturing facility. FIG. 4 is a schematic diagram (not scale) illustrating a system in which two valve modules are mounted on the upper part of a plurality of cooling devices. Specific details for implementing the invention

[0017] FIG. 1 is a schematic diagram (not scale) of a semiconductor manufacturing facility (100) according to one embodiment.

[0018] The semiconductor manufacturing facility (100) includes a semiconductor processing tool (102), a valve module (104), and a plurality of vacuum pumps (106).

[0019] The semiconductor processing tool (102) includes a plurality of process chambers (108) in which a semiconductor wafer undergoes each process. Examples of such processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and lithography processes.

[0020] A plurality of vacuum pumps (106) are configured to pump fluid (i.e., process gas) out of the process chamber (108) of the semiconductor processing tool (102) through the valve module (104).

[0021] The valve module (104) includes a plurality of inlets (110), a plurality of multi-branch conduits (112), a first fluid line manifold (114), and a second fluid line manifold (116).

[0022] Each inlet (110) is fluidically connected to each process chamber (108) so that pumped fluid can be received from the process chamber (108).

[0023] Each multi-branch conduit (112) fluidically connects each inlet (110) to both the first fluid line manifold (114) and the second fluid line manifold (116). More specifically, in this embodiment, the multi-branch conduit (112) is a branch conduit comprising each first and second branch section (118, 120). The first branch section (118) of each multi-branch conduit (112) fluidly connects each inlet (110) to the first fluid line manifold (114). The second branch section (120) of each multi-branch conduit (112) fluidly connects each inlet (110) to the second fluid line manifold (116).

[0024] The valve module (104) further includes a plurality of pressure sensors (122). Each pressure sensor (122) is operably coupled to each inlet (110), or to each multi-branch conduit (112) located at or near the inlet (110).

[0025] Each pressure sensor (122) is configured to measure the pressure associated with each process chamber (108). In particular, each pressure sensor (122) is configured to measure the pressure of the process gas pumped out of each process chamber (108). It is preferable for the pressure sensor (122) to be positioned as close as possible to the outlet of the process chamber (108).

[0026] The valve module (104) further includes a plurality of gate valves, more specifically a plurality of first gate valves (124) and a plurality of second gate valves (126). In this embodiment, the first gate valves (124) and the second gate valves (126) are pneumatic valves.

[0027] Each of the first gate valves (124) is positioned in each branch of the first branch (118) and is configured to control the flow of fluid passing through it.

[0028] Each second gate valve (126) is positioned in each branch of the second branch (120) and is configured to control the flow of fluid passing through it.

[0029] The valve module (104) further includes a valve controller (128).

[0030] A valve controller (128) is operably coupled to each of a plurality of pressure sensors (122) so that pressure measurements taken by a plurality of pressure sensors (122) via a wired or wireless connection (not shown) can be received by the valve controller (128).

[0031] The valve controller (128) is additionally operably coupled to each first gate valve (124) and each second gate valve (126) through each pneumatic line (not shown).

[0032] As described in more detail below with reference to FIG. 3, the valve controller (128) is configured to control the operation of the first and second gate valves (124, 126) based on pressure measurements received from the pressure sensor (122). The valve controller (128) is configured to control the operation of the first and second gate valves (124, 126) by delivering pneumatic fluid through a pneumatic line.

[0033] The valve module (104) further includes a plurality of manual valves (i.e., valves configured to be operated manually by a human operator), more specifically, a plurality of first manual valves (130), a plurality of second manual valves (132), and a plurality of third manual valves (134).

[0034] In this embodiment, each first manual valve (130) is placed on each multi-branch conduit (112) between the pressure sensor (122) of the multi-branch conduit (112) and the point where the multi-branch conduit (112) branches.

[0035] In this embodiment, each second manual valve (132) is positioned on each first branch (118) of the multi-branch conduit (112) between the first gate valve (124) of the multi-branch conduit (112) and the first fluid line manifold (114).

[0036] In this embodiment, each third manual valve (134) is positioned on each second branch (120) of the multi-branch conduit (112) between the second gate valve (126) of the multi-branch conduit (112) and the second fluid line manifold (116).

[0037] Accordingly, in this embodiment, each of the first and second gate valves (124, 126) is positioned between each pair of manual valves (130 to 134). In particular, each first gate valve (124) is positioned between the first manual valve (130) and the second manual valve (132). Additionally, each second gate valve (126) is positioned between the first manual valve (130) and the third manual valve (134).

[0038] In this embodiment, the first fluid line manifold (114) is a manifold through which process gas is pumped from a process chamber (108) where a semiconductor manufacturing process is being performed. The first fluid line manifold (114) may be considered a "process gas line." The second fluid line manifold (116) may be considered a "pump-down gas line." The fluid line manifolds (114, 116) are sized to suit gas flow and vacuum requirements.

[0039] A pump-down event may be performed to discharge gas from one or more process chambers (108) that may be at atmospheric pressure, thereby lowering the pressure within them to a level suitable for a semiconductor manufacturing process. For convenience, the gas discharged from the gas chamber during the pump-down is referred to as pump-down gas below. In this embodiment, the second fluid line manifold (116) is a manifold through which the pump-down gas is pumped out of the process chamber (108).

[0040] A device comprising a valve controller (128) for implementing the above arrangement and performing the method steps described below may be provided by configuring or adapting any suitable device, for example, one or more computers or other processing units or processors and / or by providing additional modules. The device may include a computer, a computer network, or one or more processors for implementing instructions and using data including instructions and data in the form of a computer program or a plurality of computer programs stored on or on a machine-readable storage medium such as computer memory, computer disk, ROM, PROM, etc. or a combination of these or other storage media.

[0041] FIG. 2 is a schematic diagram showing a perspective view of a valve module (104), but not scaled.

[0042] In this embodiment, specific components of a valve module (104), for example, including at least an inlet (110), a multi-branch conduit (112), a first fluid line manifold (114), a second fluid line manifold (116), gate valves (124, 126), a valve controller (128), and manual valves (130, 132, 134), are configured or arranged as a single integrated unit (hereinafter referred to as the “first integrated unit”). These components are housed in a common frame (200). The frame (200) may be made of steel.

[0043] In some embodiments, the pressure sensor (122) may also be included in the first integrated unit and accommodated in the frame (200). However, in some embodiments, the pressure sensor (122) is separate from the first integrated unit. For example, the pressure sensor (122) may be configured or arranged as a separate second integrated unit that may be coupled to the first integrated unit, for example, the top of the first integrated unit. The second integrated unit containing the pressure sensor (122) may be coupled between the process chamber (108) and the inlet (110) of the first integrated unit.

[0044] FIG. 3 is a process flow diagram illustrating a specific step of a process (300) for pumping gas in a semiconductor manufacturing facility (100).

[0045] It should be noted that certain process steps illustrated in the flowchart of FIG. 3 and described below may be omitted, or that these process steps may be performed in a different order than that presented below and illustrated in FIG. 3. Additionally, for convenience and ease of understanding, all process steps are illustrated as separate, sequential steps in time; however, some of the process steps may actually be performed simultaneously or at least overlap in time to some extent.

[0046] In step s302, the semiconductor manufacturing process is performed in a process chamber (108). In this semiconductor manufacturing process, a process gas is generated.

[0047] In this embodiment, at this stage, the first gate valve (124) is opened and the second gate valve (126) is closed. Also, all manual valves (130 to 134) are opened.

[0048] In step s304, a vacuum pump (106) coupled to a first fluid line manifold (114) pumps the generated process gas out of the process chamber (108) through a valve module (104). In particular, in this embodiment, the process gas is pumped from each process chamber (108) and then through an inlet (110) coupled thereto, a first branch (118) of a multi-branch conduit (112) coupled thereto (including passing through a first gate valve (124) placed thereon), and the first fluid line manifold (114).

[0049] In step s306, the pressure sensor (122) measures the pressure associated with the process chamber (108). In particular, each pressure sensor (122) measures the pressure of the process gas pumped through each inlet (110). In this embodiment, the pressure sensor (122) measures the pressure substantially continuously.

[0050] In step s308, the pressure sensor (122) transmits the measured pressure value to the valve controller (128). The valve controller (128) receives and processes the measured pressure value substantially continuously.

[0051] In step s310, one of the process chambers (108) (hereinafter referred to as "first process chamber (108)" for convenience) is shut down for inspection, service, repair, or maintenance. In this embodiment, the shutdown of the first process chamber (108) includes stopping the pumping of gas from the first process chamber (108). In this embodiment, this can be achieved by a worker closing the isolation valve of the inlet (110) associated with the first process chamber (108). In this embodiment, the shutdown of the first process chamber (108) further includes increasing the pressure inside the first process chamber (108) to approximately atmospheric pressure. This can be achieved by opening the valve connected to the first process chamber (108), thereby allowing air to flow into the first process chamber (108).

[0052] In step s312, a human operator performs inspection, maintenance, repair, or maintenance work on the first process chamber (108).

[0053] After inspection, maintenance, repair, or maintenance work, a low gas pressure environment is reset in the first process chamber (108) so that a semiconductor manufacturing process can be performed therein.

[0054] Accordingly, in step s314, the isolation valve associated with the first process chamber (108) is opened, thereby allowing gas to be pumped out of the first process chamber (108).

[0055] Pumping gas from the first process chamber (108) in step s314 is a pump-down event.

[0056] In step s316, the valve controller (128) processing the measured pressure value received from the pressure sensor (122) determines that a pump-down event is occurring.

[0057] In particular, in this embodiment, the valve controller (128) determines that a pump-down event is occurring for the first process chamber (108) in response to a measured pressure associated with the first process chamber (108) exceeding a first threshold value and / or a calculated rate of increase of the measured pressure associated with the first process chamber (108) exceeding a second threshold value.

[0058] The first threshold value may be any appropriate threshold value. The second threshold value may be any appropriate threshold value.

[0059] In some embodiments, the valve controller (128) determines that a pump-down event is occurring for the first process chamber (108) in response to a measured pressure associated with the first process chamber (108) that exceeds a first threshold value for at least a first period. The first period may be any suitable period.

[0060] In some embodiments, the valve controller (128) determines that a pump-down event is occurring for the first process chamber (108) in response to a calculated rate of increase of the measured pressure associated with the first process chamber (108) exceeding a second threshold value for at least a second period. The second period may be any appropriate period.

[0061] In step s318, in response to the detection of a pump-down event for the first process chamber (108), the valve controller (128) controls the first gate valve (124) associated with the first process chamber (108) to be closed. Thus, gas flow from the first process chamber (108) to the first fluid line manifold (114) is prevented or suppressed.

[0062] In this embodiment, the valve controller (128) controls the first gate valve (124) by delivering pneumatic fluid (e.g., nitrogen) to the first gate valve (124).

[0063] In step s320, after the first gate valve (124) is closed, the valve controller (128) controls the second gate valve (126) associated with the first process chamber (108) to be opened. Thus, gas flow from the first process chamber (108) to the second fluid line manifold (116) is allowed.

[0064] In this embodiment, the valve controller (128) controls the second gate valve (126) by delivering pneumatic fluid to the second gate valve (126).

[0065] In step s322, a vacuum pump (106) coupled to a second fluid line manifold (116) pumps pump-down gas out of the first process chamber (108) through a valve module (104). In particular, in this embodiment, pump-down gas is pumped from the first process chamber (108) and then through an inlet (110) coupled thereto, a second branch (120) of a multi-branch conduit (112) coupled thereto (including passing through an open second gate valve (126) placed thereon), and the second fluid line manifold (116).

[0066] Accordingly, the pump-down gas is pumped out of the first process chamber (108) to establish a low gas pressure or vacuum environment inside.

[0067] In step s324, the valve controller (128) processing the measured pressure value received from the pressure sensor (122) determines that the pump-down event has ended.

[0068] In particular, in this embodiment, the valve controller (128) determines that the pump-down event for the first process chamber (108) has ended in response to a calculated rate of reduction of the measured pressure associated with the first process chamber (108) that is less than or equal to a third threshold value and / or the measured pressure associated with the first process chamber (108) that is greater than or equal to a fourth threshold value. Alternatively, the pump-down event ends after being executed for a predefined period.

[0069] The third threshold value may be any appropriate threshold value. In some embodiments, the third threshold value is equal to or smaller than the first threshold value.

[0070] The fourth threshold value may be any appropriate threshold value. In some embodiments, the fourth threshold value is equal to or smaller than the second threshold value.

[0071] In some embodiments, the valve controller (128) determines that the pump-down event for the first process chamber (108) has ended in response to the measured pressure associated with the first process chamber (108) being less than or equal to a third threshold value for at least a third period. The third period may be any appropriate period.

[0072] In some embodiments, the valve controller (128) determines that the pump-down event for the first process chamber (108) has ended in response to a calculated rate of reduction of the measured pressure associated with the first process chamber (108) that is greater than or equal to a fourth threshold value during at least a fourth period. The fourth period may be any appropriate period.

[0073] In step s326, in response to detecting that the pump-down event for the first process chamber (108) has ended, the valve controller (128) controls the second gate valve (126) associated with the first process chamber (108) to be closed. Thus, gas flow from the first process chamber (108) to the second fluid line manifold (116) is prevented or suppressed.

[0074] In step s328, after the second gate valve (126) is closed, the valve controller (128) controls the first gate valve (124) associated with the first process chamber (108) to be opened. Thus, gas flow from the first process chamber (108) to the first fluid line manifold (114) is allowed.

[0075] In step s330, the semiconductor manufacturing process can be performed in the first process chamber (108). In this semiconductor manufacturing process, a process gas is generated.

[0076] In step s332, a vacuum pump (106) coupled to the first fluid line manifold (114) pumps the generated process gas out of the first process chamber (108) through the valve module (104).

[0077] Accordingly, a process (300) for pumping gas in a semiconductor manufacturing facility (100) is provided.

[0078] The aforementioned system and method tend to advantageously reduce or eliminate pump-down events that have a detrimental effect on conditions within the parallel gas chamber. This tends to be achieved by pumping the pump-down gas into a separate manifold different from the one in which the process gas is pumped.

[0079] Advantageously, pump-down events and pump-down event terminations tend to be automatically detected and mitigated.

[0080] Advantageously, the aforementioned valve module can be integrated inline with a horizontal manifold connecting a semiconductor processing tool to a vacuum pump.

[0081] Advantageously, the aforementioned valve module tends to be robust. The vacuum module can be fully assembled, leak-checked, and pre-tested, for example, externally or on-site before being shipped to a semiconductor manufacturing facility. This tends to simplify the installation process and reduce installation time.

[0082] Advantageously, the aforementioned valve module tends to be modular and expandable.

[0083] Components in the gas stream of the valve module tend to be easy to service, repair, or replace. For example, since each gate valve can be isolated from the fluid flow by closing manual valves upstream and downstream of the gate valve, a human operator can service, repair, or replace the gate valve.

[0084] Advantageously, the status and operating conditions of the system tend to be easily monitored, for example, through the Human Machine Interface of the valve module or remotely.

[0085] Advantageously, each valve module of the system tends to be easily controllable by the system controller using communication protocols such as, for example, EtherCAT or Ethernet.

[0086] Advantageously, the valve module described above allows for various mounting options. For example, the valve module can be suspended from the ceiling of a semiconductor manufacturing facility, which offers the advantage of not occupying floor space. Alternatively, the valve module can be mounted on a floor-standing frame or on top of other equipment.

[0087] What will be described now is an embodiment in which a valve module is mounted on top of a cooling device for controlling the temperature of another piece of equipment, particularly a process chamber of a semiconductor processing tool.

[0088] FIG. 4 is a schematic diagram (not scale) illustrating a system (400) in which two valve modules (104) are mounted on top of a plurality of cooling devices (402). The cooling devices (402) are generally referred to as "cooler racks" or "coolers."

[0089] The system (400) includes six cooling devices (402), two valve modules (104), a power source (404), and a pneumatic source (406).

[0090] In this embodiment, the valve module (104) may be substantially the same as described above with reference to FIGS. 1 and FIGS. 2. Each valve module (104) is configured to receive each of a plurality of pumped fluid flows from a process chamber (108) fluidically coupled thereto.

[0091] Each cooling device (402) is fluidically coupled to each process chamber (108). Each cooling device (402) is configured to supply a flow of cooling fluid to each process chamber (108) to which it is coupled. The cooling fluid can be used in the process chamber (108) to control the temperature.

[0092] In this embodiment, the valve module (104) and the cooling device (402) are arranged in a stacked configuration. More specifically, each valve module is placed on top of three cooling devices (402) that are positioned adjacent to each other, for example, in a side-by-side configuration.

[0093] Advantageously, the stacked array provides reduced installation space within the semiconductor manufacturing facility.

[0094] Additionally, the stacked arrangement tends to facilitate the connection of the cooling device (402) and the valve module (104) to the process chamber (108). For example, the stacked arrangement tends to allow for closer positioning of the cooling device (402) and / or the valve module (104) relative to the process chamber (108), thereby reducing the length of the conduit and consequently reducing installation time and difficulty. Furthermore, because the length is reduced, the possibility of leakage or damage to the conduit may be reduced.

[0095] In this embodiment, the power supply (404) is electrically coupled to the cooling device (402) and the valve module (104), respectively. The power supply (404) is configured to supply power to the cooling device (402) and the valve module (104), respectively. Thus, the power supply (404) can be considered as a common power supply.

[0096] Advantageously, using a common power source for the cooling device (402) and the valve module (104) makes installation easier and tends to reduce footprint and cabling.

[0097] In this embodiment, the pneumatic source (406) is fluidly coupled to the cooling device (402) and the valve module (104), respectively, through one or more conduits. The pneumatic source (406) is configured to supply pneumatic fluid to the cooling device (402) and the valve module (104), respectively. Thus, the pneumatic source (406) can be considered a common pneumatic source. The pneumatic fluid may be any suitable type of gas, including but not limited to nitrogen gas or CDA (Clean Dry Air).

[0098] Advantageously, the use of a common pneumatic source (406) for the cooling device (402) and valve module (104) tends to facilitate installation and provide a reduced footprint and pneumatic fluid conduit length.

[0099] In this embodiment, in the valve module (104), pneumatic fluid received from the pneumatic source (406) can be used to operate the valve of the valve module (104). More specifically, the valve controller (128) of the valve module (104) can be configured to deliver pneumatic fluid to each first gate valve (124) and each second gate valve (126) through each pneumatic line, thereby operating the first and second gate valves (124, 126). Thus, the pneumatic fluid can be considered as a "valve control fluid."

[0100] In this embodiment, in the valve module (104), pneumatic fluid received from the pneumatic source (406) can be used to perform a purge process to purge one or more parts of the multi-branch conduit (112). More specifically, a manual operator can deliver pneumatic fluid to each of the multi-branch conduits (112) through each purge port at each of the multi-branch conduits (112). The pneumatic fluid can be forced through at least a part of the multi-branch conduit (112) to purge at least a part of the multi-branch conduit (112). The pneumatic fluid can exit the multi-branch conduit (112) through the first fluid line manifold (114) and / or the second fluid line manifold (116). Thus, the pneumatic fluid can be considered as "purge fluid". Purge can generally be performed before maintaining or servicing the valve module (104), for example, before replacing the first gate valve (124) and / or the second gate valve (126). Advantageously, the first gate valve (124) and / or the second gate valve (126) can be isolated from the rest of the system by closing the first manual valve (130), the second manual valve (132), and the third manual valve (134).

[0101] In this embodiment, the purge port of the valve module (104) may be used to perform a leak test on one or more of the multi-branch conduits (112). More specifically, the valve module (104) may further include means for detecting a leak from the multi-branch conduits (112) using the purge port, or a human operator may detect the presence of a leak using appropriate detection equipment attached to the purge port.

[0102] The embodiment illustrated in FIG. 4 has six cooling devices (402) and two valve modules (104). However, in other embodiments, the system may include a different number of cooling devices and / or a different number of valve modules.

[0103] In the embodiment illustrated in FIG. 4, each valve module (104) is mounted on top of three cooling devices (402). However, in other embodiments, one or more valve modules may be mounted on top of a different number of cooling devices. In some embodiments, one or more cooling devices are mounted on top of one or more valve modules or other equipment.

[0104] In the above embodiment, the valve module is implemented in a semiconductor manufacturing facility to route pumped process gas. However, in other embodiments, the valve module may be implemented in a different system and may be used to route different types of fluids.

[0105] In the above embodiment, there is a single semiconductor processing tool comprising six gas chambers. However, in other embodiments, there is one or more semiconductor processing tools. One or more semiconductor processing tools may comprise a different number of gas chambers other than six.

[0106] In the above embodiment, there is a single valve module, or in the embodiment of FIG. 4, there are two valve modules. However, in other embodiments, there may be a different number of valve modules.

[0107] In the above embodiment, the valve module includes six inlets and six multi-branch conduits. However, in other embodiments, the valve module includes a different number of inlets and multi-branch conduits other than six.

[0108] In the above embodiments, each multi-branch conduit includes two gate valves, one for each branch. However, in other embodiments, the multi-branch conduit includes a different number of gate valves other than two. In some embodiments, the multi-branch conduit includes a single valve (e.g., a three-way valve) operable to guide fluid flow along a selected branch of the multi-branch conduit. In some embodiments, multiple gate valves are arranged along each branch. In some embodiments, the multi-branch conduit includes two or more branches, and each branch may include one or more gate valves.

[0109] In the above embodiment, each multi-branch conduit includes three manual valves. However, in other embodiments, the multi-branch conduit includes a different number of manual valves other than three. For example, in some embodiments, manual valves may be omitted. In some embodiments, the multi-branch conduit includes three or more manual valves arranged along the multi-branch conduit in any suitable manner. Explanation of the symbols

[0110] 100: Semiconductor manufacturing equipment 102: Processing Tools 104: Valve Module 106: Vacuum pump 108: Process Chamber 110: Entrance 112: Multi-branch conduit 114: First fluid line manifold 116: Second fluid line manifold 118: First Quarter 120: Second Quarter 122: Pressure sensor 124: 1st Gate Valve 126: Second gate valve 128: Valve Controller 130: 1st manual valve 132: Second manual valve 134: Third manual valve 200: Frame 300: Process s302 to s332: Steps 400: System 402: Cooling unit 404: Power 406: Pneumatic source

Claims

Claim 1 A semiconductor processing tool comprising a plurality of process chambers; a valve module configured to receive a fluid from each of the plurality of process chambers and selectively direct the flow of each fluid, and configured as a single integrated unit; and a plurality of cooling devices, wherein each of the plurality of cooling devices is configured to supply a flow of cooling fluid to each of the plurality of process chambers, wherein the plurality of cooling devices are positioned adjacent to each other in a parallel configuration, and wherein the valve module and the plurality of cooling devices are arranged in a stacked configuration. Claim 2 In claim 1, the valve module is positioned on the upper part of the cooling device. Claim 3 A system according to claim 1, further comprising a common power source configured to supply power to both the valve module and the cooling device. Claim 4 A system according to any one of claims 1 to 3, further comprising a common pneumatic fluid source configured to supply pneumatic fluid to both the valve module and the cooling device. Claim 5 In claim 4, the valve module comprises a valve, and the valve module is configured to operate the valve using pneumatic fluid received from the common pneumatic fluid source. Claim 6 In claim 4, the valve module comprises one or more conduits, and the valve module is configured to purge one or more conduits using pneumatic fluid received from the common pneumatic fluid source. Claim 7 In claim 4, the valve module is configured to perform a leak test using pneumatic fluid received from the common pneumatic fluid source. Claim 8 delete Claim 9 A method comprising: providing a semiconductor processing tool comprising a plurality of process chambers; fluidly coupling a valve module to a process chamber such that the valve module is arranged to receive a respective fluid from each of the plurality of process chambers — said valve module is configured to selectively direct the flow of said fluid and is configured as a single integrated unit —; fluidly coupling a plurality of cooling devices to a process chamber such that each of the plurality of cooling devices is arranged to supply a respective flow of cooling fluid to each of the plurality of process chambers — said cooling devices are positioned adjacent to each other in a parallel configuration —; and arranging the valve module and the plurality of cooling devices in a stacked configuration. Claim 10 In claim 9, the method of arranging includes positioning the valve module on the upper part of the cooling device. Claim 11 A method according to claim 9 further comprising electrically coupling a common power source to both the valve module and the cooling device. Claim 12 A method according to any one of claims 9 to 11, further comprising fluidically coupling a common pneumatic fluid source to both the valve module and the cooling device. Claim 13 In claim 12, the valve module comprises a valve, and the method further comprises operating the valve using a pneumatic fluid received from a common pneumatic fluid source. Claim 14 In claim 12, the valve module comprises one or more conduits, and the method further comprises purging one or more conduits using pneumatic fluid received from the common pneumatic fluid source. Claim 15 A method according to claim 12, further comprising performing a leak test using a pneumatic fluid received from the common pneumatic fluid source.

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