Alignment device and method of forming external electrode

Abstract

An alignment device is provided that can accurately hold multiple workpieces at each of multiple set holding positions and obtain a sufficient filling rate. The apparatus includes a flat plate portion (21) and a side wall portion (25) that partitions the surface (21a) of the flat plate portion (21) into an alignment area (22) into which a plurality of chips (1) are supplied as workpieces, a pallet (20) to which vibration is applied, a plurality of recesses (23) that are set in the alignment area (22) and are set as multiple holding positions to maintain the alignment state of a plurality of chips (1), a supply port (26) that is provided by opening a part of the side wall portion (25) of the pallet (20) and enables supplying a plurality of chips (1) to the alignment area (22) from the outside of the side wall portion (25), and a first magnet (40) that is disposed on at least one of the flat plate portion (21) and the side wall portion (25) and is a moving holding portion that moves each of the plurality of chips (1) supplied from the supply port (26) to the alignment area (22) to each of the plurality of recesses (23) and holds them in the recesses (23).

Description

Technology Field

[0001] The present invention relates to an alignment device for aligning a plurality of workpieces, such as chip components, and a method for forming external electrodes on the workpieces. Background Technology

[0002] Conventionally, in chip-shaped electronic components such as semiconductor devices or multilayer ceramic capacitors, multiple components during the manufacturing process or multiple components after manufacturing are aligned from their individual states toward a certain direction using an alignment device. For example, Patent Document 1 discloses a vibration insertion jig as an alignment device of that type, which aligns multiple workpieces by holding multiple upwardly opening recesses as holding positions and accommodating one workpiece in each of the recesses. Prior art literature

[0003] Japanese Patent Publication No. JP 2004-75519 The problem to be solved

[0004] In conventional alignment devices such as the aforementioned vibrating insertion jig, it was difficult to achieve a state where the workpiece is accommodated in the entire recess, resulting in a low filling rate in the recess. Furthermore, it was difficult to securely maintain the workpiece within the recess, which consequently led to problems such as unstable posture within the recess or the workpiece protruding from the recess due to vibration.

[0005] Therefore, the main objective of the present invention is to provide an alignment device capable of accurately maintaining a plurality of workpieces at each of a set plurality of holding positions, and consequently obtaining a sufficient filling rate. means of solving the problem

[0006] The alignment device according to the present invention comprises a flat plate having a surface and a back surface, a side wall portion that is erected on the surface side of the flat plate and divides the inner surface into an alignment area where a plurality of workpieces are supplied, a pallet to which vibration is applied, a plurality of holding positions that are set in the alignment area and each of the plurality of workpieces supplied to the alignment area is positioned to maintain the alignment state of the plurality of workpieces, a supply port that is provided by opening a part of the side wall portion of the pallet and enables the supply of a plurality of workpieces to the alignment area from the outside of the side wall portion, and a moving holding portion disposed with respect to the flat plate and maintaining each of the plurality of workpieces supplied to the alignment area from the supply port at each of the plurality of holding positions while moving them to each of the holding positions. Effects of the invention

[0007] According to the present invention, an alignment device can be provided that can accurately maintain a plurality of workpieces at each of a plurality of set maintenance positions and obtain a sufficient filling rate. Brief explanation of the drawing

[0008] FIG. 1 is a schematic plan view showing an alignment device according to a first embodiment and a linear feeder connected to the alignment device. FIG. 2 is a perspective view showing a chip as a workpiece according to a first embodiment. FIG. 3 is a perspective view showing a pallet included in an alignment device according to a first embodiment. FIG. 4 is a plan view of a pallet including an alignment device according to a first embodiment. FIG. 5 is a schematic diagram showing the configuration of an alignment device including a cross-sectional view corresponding to the VV line of FIG. 4. FIG. 6 is an enlarged cross-sectional view showing a state in which a chip is received in the concave portion of a pallet according to the first embodiment. Figure 7 is a view taken from the direction of arrow VII in Figure 6. FIG. 8 is a flowchart showing the method of forming an external electrode according to an embodiment in process order. FIG. 9 is a transition diagram showing the movement of a chip according to the process of the method for forming an external electrode according to an embodiment in the order of (a) to (i). FIG. 10 is a plan view of an alignment device according to a second embodiment. FIG. 11 is a cross-sectional view of an alignment device according to a second embodiment. FIG. 12 is a cross-sectional view of an alignment device according to a third embodiment. FIG. 13 is a cross-sectional view of an alignment device according to a fourth embodiment. FIG. 14 is a cross-sectional view of an alignment device according to the fifth embodiment. FIG. 15 is a plan view showing an alignment device according to the sixth embodiment. FIG. 16 is a cross-sectional view of an alignment device according to the seventh embodiment. FIG. 17 is a cross-sectional view of a modified example of an alignment device according to the seventh embodiment. FIG. 18 is a plan view of an alignment device according to the eighth embodiment. FIG. 19 is a cross-sectional view of an alignment device according to the eighth embodiment. FIG. 20 is a plan view of an alignment device according to a modified example of the eighth embodiment. Specific details for implementing the invention

[0009] Hereinafter, embodiments of the present invention will be described.

[0010] [Alignment device]

[0011] FIG. 1 is a plan view showing an alignment device (10) according to a first embodiment and a linear feeder (100) connected to the alignment device (10). A plurality of chips (1) are supplied to the alignment device (10) from the linear feeder (100). A chip (1) is an example of a workpiece.

[0012] As shown in FIG. 2, the chip (1) according to the embodiment is a small electronic component in the shape of a rectangular body having a length direction (L), a width direction (W) perpendicular to the length direction (L), and a thickness direction (T) perpendicular to the length direction (L) and the width direction (W), respectively. The chip (1) has a first end face (1a) and a second end face (2a) at each of the two ends in the length direction. In addition, the end face in the length direction on the side of the first end face (1a) is referred to as the first end face side end (1b), and the other end face in the length direction on the side of the second end face (2a) is referred to as the second end face side end (2b).

[0013] The chip (1) has a pair of main surfaces (1c) facing each other in the thickness direction (T) and a pair of side surfaces (1d) facing each other in the width direction (W).

[0014] The chip (1) of the embodiment is a laminated element in a multilayer ceramic capacitor before external electrodes are formed on each of the first cross-sectional side end (1b) and the second cross-sectional side end (2b). The laminated element is a multilayer structure in which an internal electrode layer and a dielectric ceramic layer are alternately stacked. As the chip (1) of the embodiment, a laminated element having magnetism by including Ni, etc. in the internal electrode layer is applied.

[0015] The alignment device (10) of the embodiment is a device that aligns a plurality of chips (1) supplied from a linear feeder (100) in a matrix shape while ensuring that the longitudinal direction is uniformly aligned.

[0016] FIG. 3 is a perspective view of a pallet (20) included in an alignment device (10). FIG. 4 is a plan view of the pallet (20). FIG. 5 is a schematic diagram showing the configuration of an alignment device (10) including a cross-sectional view corresponding to the VV line of FIG. 4.

[0017] As shown in FIG. 5, the alignment device (10) includes a pallet (20), a plurality of first magnets (40), and an imaging unit (50). The first magnets (40) are an example of a movement holding unit.

[0018] The pallet (20) has a pallet body (29) and a base (30).

[0019] The pallet body (29) includes a flat plate (21) and a side wall (25) provided at the periphery edge of the flat plate (21). The flat plate (21) is a rectangular plate-shaped member having a surface (21a) and a back surface (2lb). The pallet body (29) is installed such that the surface (21a) faces upward and is approximately horizontal. The side wall (25) stands upright toward the surface (21a) of the flat plate (21) and surrounds the flat plate (21). The surface (21a) of the flat plate (21) surrounded by the side wall (25) is partitioned as an alignment area (22) into which a plurality of chips (1) are supplied. Meanwhile, the flat plate (21) and the side wall (25) may be separate or integral. Additionally, the side wall portion (25) may be positioned on the inner side of the perimeter edge rather than on the perimeter edge of the flat plate portion (21).

[0020] As shown in FIG. 4, the pallet (20) of the embodiment is rectangular when viewed from a planar perspective. A supply port (26) is provided in the center of the shorter side portion of one side (the lower side in FIG. 4) of the pallet (20) to enable the supply of a plurality of chips (1) to the alignment area (22). The supply port (26) is provided by cutting out and opening a portion of the circumferential direction of the side wall portion (25). The end of the linear feeder (100) shown in FIG. 1 is positioned at the supply port (26). Chips (1) are supplied from the linear feeder (100) through the supply port (26) to the alignment area (22). The supply port (26) is an inlet through which a plurality of chips (1) are supplied to the alignment area (22) from the outside of the side wall portion (25).

[0021] A plurality of holding positions (70) are set in the alignment area (22). A holding position (70) is a position where the chip (1) is held. In FIG. 4, the holding position (70) is shown as having a shape corresponding to a cross-section (WT cross-section) along the width direction (W) and height direction (T), assuming the case where the chip (1) is placed vertically. In the first embodiment, a concave portion (23) is provided in each of the plurality of holding positions (70).

[0022] As shown in FIG. 4, between the plurality of concave portions (23) and the side wall portion (25) arranged on the outermost perimeter side of the alignment area (22), there is an excess portion (24) where the concave portion (23) is not arranged.

[0023] As shown in FIGS. 6 and 7, the concave portion (23) is a pit surrounded by a cylindrical inner wall surface (23a) and a bottom surface (23b), and has an opening (23c) that opens to the surface (21a). The axial direction of the inner wall surface (23a) is approximately orthogonal to the surface (21a). As shown in FIG. 4, in the embodiment, the plurality of concave portions (23) are arranged in a matrix shape of 4 rows × 5 columns with 20 concave portions (23). The spacing between adjacent concave portions (23) is generally the same, and the plurality of chips (1) are evenly distributed. Meanwhile, the number and arrangement of the concave portions (23) are examples and are not limited thereto.

[0024] The diameter of the recess (23) is slightly larger than the diagonal length of the first cross section (1a) and the second cross section (2a) of the chip (1). The depth of the recess (23) is slightly shorter than the length of the chip (1) (the dimension in the longitudinal direction (L)). A single chip (1) is accommodated within the recess (23) in a longitudinal insertion position along the longitudinal direction. The chip (1) is burrowed into the recess (23) along the inner wall surface (23a) through the opening (23c) from the first cross section side end (1b) or the second cross section side end (2b) and accommodated in a longitudinal insertion position. As shown in FIG. 7, the chip (1) maintains the longitudinal insertion position by having four longitudinally extending corner sections (1e) close to or in contact with the inner wall surface (23a). Since the depth of the concave portion (23) is somewhat shorter than the length of the chip (1), as shown in FIG. 6, the longitudinal end of the chip (1) protrudes upward from the opening (23c) above the surface (21a) by a predetermined length.

[0025] The chip (1) supplied from the supply port (26) to the alignment area (22) moves from the front end (20a), which is the end on the supply port (26) side of the pallet (20), toward the inner end (20b), which is the side opposite to the supply port (26), and is received into the concave portion (23) during the movement.

[0026] The base (30) is a plate-like member having dimensions equivalent to those of the pallet body (29) when viewed from a planar view. The pallet body (29) is placed on the upper surface (30a) of the base (30). It is preferable that the pallet body (29) be detachably fixed to the base (30).

[0027] As shown in FIG. 5, a plurality of magnet receiving portions (31) are provided on the upper surface (30a) of the base (30), corresponding to each recess (23) arranged at each of the plurality of holding positions (70) of the pallet (20). The magnet receiving portions (31) are pits that open to the upper surface (30a) and are each arranged directly below each recess (23). A first magnet (40) is fitted and received in each of the plurality of magnet receiving portions (31). A plurality of first magnets (40) are arranged on the back side (2lb) of the flat plate portion (21) of the pallet body (29), corresponding to each of the plurality of recesses (23). The first magnet (40) of the first embodiment is an electromagnet whose magnetic force is turned ON / OFF by the ON / OFF of current supply. It is preferable that the ON / OFF of current supply is performed for the plurality of first magnets (40) individually.

[0028] The linear feeder (100) shown in FIG. 1 is installed to extend approximately horizontally toward the alignment device (10). The end of the linear feeder (100) is positioned at the supply port (26) of the alignment device (10). A plurality of chips (1) are supplied onto the linear feeder (100) and are continuously conveyed toward the alignment device (10) by the linear feeder (100) vibrating under a predetermined condition. The chips (1) are conveyed one by one or in a combined state as they are pushed by subsequent chips (1), and are supplied to the alignment device (10) in a scattered state from the supply port (26). In the alignment device (10), vibration is applied to the pallet (20) by a vibration source not shown. The chips (1) are moved from the front end (20a) to the inner end (20b) by the vibrating pallet (20). A rectangular chip (1) is easily moved in a transverse position where the main surface (1c) or side surface (1d) contacts the surface (21a).

[0029] Direct vibration may not be applied to the pallet (20), but rather the vibration of the linear feeder (100) connected to the pallet (20) may be transmitted to the pallet (20) so that the pallet (20) vibrates, thereby causing the chip (1) to move within the pallet (20). That is, the vibration of the linear feeder (100) connected to the supply port (26) of the pallet (20) may be transmitted to the pallet (20), so that the pallet (20) may have a vibration common to the linear feeder (100). In this way, the vibration source of the pallet (20) and the linear feeder (100) can be shared, thereby simplifying the configuration.

[0030] In the first embodiment, as shown in FIG. 5, an imaging unit (50) is positioned above the pallet (20). The imaging unit (50) is a camera capable of capturing the entire alignment area (22). The image captured by the imaging unit (50) is displayed on a monitor (51). By observing the monitor (51), the acceptance status of the chip (1) in the concave portion (23) can be determined.

[0031] According to the alignment device (10) of the first embodiment including the above configuration, a plurality of chips (1) supplied to the alignment area (22) in a scattered state from the linear feeder (100) move to each concave portion (23) by the attractive force of the first magnet (40) which is energized and has its magnetic force turned ON, and are received one by one into the concave portion (23) in a vertical insertion position. As described above, the chip (1) has magnetism because it is a stacked element of a multilayer ceramic capacitor in which an internal electrode layer including Ni, etc. is stacked. For this reason, the chip (1) can be attracted to the first magnet (40).

[0032] When a chip (1) is received one by one in each concave portion (23), multiple chips (1) are arranged in a 4x5 row configuration corresponding to the concave portion (23). While observing the monitor (51), the status of receiving the chip (1) in the concave portion (23) is determined, and the power supply to the first magnet (40) corresponding to the concave portion (23) in which the chip (1) is received is turned OFF, that is, the first magnet (40) located directly below the concave portion (23), and power supply to the first magnet (40) corresponding to the concave portion (23) may be maintained until the chip (1) is received.

[0033] According to the alignment device (10) according to the first embodiment, each of the plurality of chips (1) supplied from the feeder (100) to the alignment area (22) of the pallet (20) moves from the front end (20a) to the inner end (20b) by the vibration of the pallet (20), and during the movement, is attracted by the first magnet (40) and received one by one in the concave portion (23) and maintained within the concave portion (23). In this way, each of the plurality of chips (1) can be accurately maintained in each concave portion (23) provided at each of the set plurality of holding positions (70). Since the chips (1) are attracted by the first magnet (40) and maintained in the state of being received in the concave portion (23), the situation of them popping out of the concave portion (23) is suppressed even when the pallet (20) is vibrating. Therefore, since the chip (1) is easily filled throughout the multiple concave portions (23), a sufficient filling rate can be obtained.

[0034] [Method for forming external electrodes]

[0035] Next, an example of a method for forming external electrodes on each of the first cross-sectional side end (1b) and the second cross-sectional side end (2b) of a plurality of chips (1) using the alignment device (10) of the first embodiment will be explained with reference to FIGS. 8 and 9.

[0036] FIG. 8 is a flowchart showing the method of forming an external electrode according to an embodiment in the order of processes. FIG. 9 is a transition diagram showing the movement of a chip (1) according to the process in the order of (a) to (i). Meanwhile, for the sake of explanation, FIG. 9(a) to (i) represents a single chip (1), but in reality, all chips (1) accommodated in multiple concave portions (23) are processed in the same manner.

[0037] First, vibration is applied to the pallet (20) of the alignment device (10) (step (S101)). Next, a plurality of chips (1) are conveyed toward the alignment device (10) by a linear feeder (100), and a plurality of chips (1) are supplied from the supply port (26) to the alignment area (22) of the pallet (20) (step (S102)). Each of the plurality of chips (1) is attracted by the first magnet (40) and moved to a plurality of concave portions (23), and is received and maintained in a longitudinally inserted position within the concave portions (23) from one end in the longitudinal direction, as shown in FIG. 9(a) (step (S103)). Here, the end of the side that enters the concave portion (23) and contacts the bottom surface (23b) is designated as the first cross-sectional side end (1b), and the end of the side that protrudes from the opening (23c) of the concave portion (23) toward the surface (21a) of the flat portion (21) and is separated from the surface (21a) is designated as the second cross-sectional side end (2b). That is, in step (S103), the first cross-sectional side end (1b) of the chip (1) is maintained within the concave portion (23), while the second cross-sectional side end (2b) is maintained separated from the surface (21a) of the pallet (20).

[0038] Next, as shown in FIG. 9(b), each of the second cross-sectional side ends (2b) of a plurality of chips (1) held in a plurality of concave portions (23) is held collectively in a second holding sheet (220) (step (S104)). The second holding sheet (220) includes a substrate (221) and an adhesive layer (222) formed on one side of the substrate (221). The second cross-section (2a) of each chip (1) is pressed firmly against the adhesive layer (222) of the second holding sheet (220), thereby holding the second cross-sectional side ends (2b) in an adhesive manner in the second holding sheet (220).

[0039] Next, as shown in FIG. 9(c), a plurality of chips (1) held in the second holding sheet (220) are collectively detached from the concave portion (23) (step (S105)). Next, a first external electrode (5A) as an external electrode is collectively formed on the first cross-sectional side end (1b) exposed from the plurality of chips (1) held in the second holding sheet (220) (step (S106)). Step (S106) involves immersing the first cross-sectional side end (1b) of the plurality of chips (1) held in the second holding sheet (220) into the conductive paste (231) held on the plate (230), as shown in FIG. 9(d), and then, as shown in FIG. 9(e), the plurality of chips (1) together with the second holding sheet (220) are collectively detached from the conductive paste (231). Thus, a conductive paste (231) is attached to the first cross-sectional side end (1b) of a plurality of chips (1). By drying the conductive paste (231), a first external electrode (5A) is formed on the first cross-sectional side end (1b).

[0040] Next, as shown in FIG. 9(f), each of the first cross-sectional side end (1b) on which the first external electrode (5A) is formed of a plurality of chips (1) held in the second holding sheet (220) is held in the first holding sheet (210) (step (S107)). The first holding sheet (210) includes a substrate (211) and an adhesive layer (212) formed on one side of the substrate (211). The first external electrode (5A) of each chip (1) is pressed firmly against the adhesive layer (212) of the first holding sheet (210), thereby holding each of the first cross-sectional side end (1b) in the first holding sheet (210).

[0041] Next, the second cross-sectional side end (2b) of a plurality of chips (1) held in the second holding sheet (220) is peeled off and separated from the second holding sheet (220) (step (S108)). That is, as shown in FIG. 9(g), the second cross-sectional side (2a) of each chip (1) is separated from the second holding sheet (220). For example, if the adhesive strength of the adhesive layer (222) of the second holding sheet (220) is made weaker than that of the adhesive layer (212) of the first holding sheet (210), it is easy to peel the second holding sheet (220) from the chip (1) while holding the chip (1) in the first holding sheet (210).

[0042] Next, a second external electrode (5B) as an external electrode is formed collectively on the second cross-sectional side end (2b) of a plurality of chips (1) held in the first holding sheet (210) and separated from the second holding sheet (220) (step (S109)). Step (S109) involves inverting the first holding sheet (210) as shown in FIG. 9(h) to position the second cross-section (2a) of the chip (1) downward. Subsequently, the second cross-sectional side end (2b) of the plurality of chips (1) is immersed in the conductive paste (231) in the same manner as in FIG. 9(d), and then the conductive paste (231) is attached to the second cross-sectional side end (2b) of the plurality of chips (1) by pulling it up from the conductive paste (231). By drying the conductive paste (231), a second external electrode (5B) is formed on the second cross-sectional side end (2b) as shown in FIG. 9(i).

[0043] Meanwhile, the external electrode (5A) and the external electrode (5B) may have a single-layer structure made of conductive paste (231) as described above, or may have a multi-layer structure such as additionally forming a plating layer on the surface.

[0044] According to the method for forming external electrodes described above, a plurality of chips (1) aligned in an alignment device (10) are held in a first holding sheet (210) and a second holding sheet (220), and a first external electrode (5A) and a second external electrode (5B) are formed collectively on the plurality of chips (1), respectively. Thus, the first external electrode (5A) and the second external electrode (5B) can be formed efficiently.

[0045] According to the embodiment described above, the following effects are achieved.

[0046] An alignment device (10) according to an embodiment comprises a flat plate portion (21) having a surface (21a) and a back surface (2lb), a side wall portion (25) that is erected on the side of the surface (21a) of the flat plate portion (21) and partitions the inner surface (21a) thereof into an alignment area (22) into which a plurality of work-in chips (1) are supplied, a pallet (20) to which vibration is applied, a plurality of holding positions (70) that are set in the alignment area (22) and in which each of the plurality of chips (1) supplied to the alignment area (22) is positioned to maintain the alignment state of the plurality of chips (1), a supply port (26) that is provided by opening a part of the side wall portion (25) of the pallet (20) and enables supplying a plurality of chips (1) to the alignment area (22) from the outside of the side wall portion (25), and a supply port (26) that is disposed with respect to the flat plate portion (21) and from the supply port (26) to the alignment area (22). It includes a first magnet (40) as a moving holding part that moves each of the supplied multiple chips (1) to each of the multiple holding positions (70) and holds them in the holding positions (70).

[0047] Thus, multiple chips (1) can be accurately maintained and aligned at multiple set maintenance positions (70), and a sufficient filling rate can be obtained.

[0048] Since the side wall (25) of the pallet (20) has a supply port (26), the chip (1) can be supplied into the pallet (20) from the supply port (26) in a horizontal movement or a state close to it. As a result, it is difficult for the chip (1) to be damaged by impact.

[0049] In the alignment device (10) according to the embodiment, there is a recess (23) in which one chip (1) is received at each of the plurality of holding positions (70).

[0050] Since the chip (1) received in the concave portion (23) is difficult to move in the direction of the surface (21a) of the pallet (20) because movement is restricted, the chip (1) can be securely maintained in the holding position (70) and the chip (1) can be positioned and aligned in the holding position (70) with high precision.

[0051] In the alignment device (10) according to the embodiment, the moving holding part is a first magnet (40) that moves the chip (1) to the holding position (70) by the magnetic attraction force and holds it at the holding position (70).

[0052] Thus, a plurality of chips (1) can be accurately maintained by magnetic force in a plurality of set maintenance positions (70). Since the chips (1) are attracted by the first magnet (40) and maintained in a state of being received in the concave portion (23) of the maintenance position (70), the situation of them popping out of the concave portion (23) is suppressed even when the pallet (20) is vibrating. Therefore, since the chips (1) are filled and maintained throughout the entire plurality of concave portions (23), a sufficient filling rate can be obtained.

[0053] In the alignment device (10) according to the embodiment, the first magnet (40) is arranged in multiple numbers on the back side (2lb) of the flat plate portion (21) of the pallet (20), corresponding to each of the multiple holding positions (70).

[0054] Since a first magnet (40) is placed at each holding position (70), the chip (1) at each holding position (70) can be securely held by the first magnet (40) and a sufficient filling rate can be obtained.

[0055] The alignment device (10) according to the embodiment includes a linear feeder (100) that is connected to the supply port (26) of the pallet (20) and vibrates to convey a chip (1) to the alignment area (22) of the pallet (20), and it is preferable that the vibration of the linear feeder (100) is transmitted to the pallet (20) so that a vibration common to the linear feeder (100) is imparted.

[0056] Thus, the vibration source of the pallet (20) and the linear feeder (100) can be shared, thereby simplifying the configuration.

[0057] A method for forming external electrodes according to an embodiment is a method for forming external electrodes on each of the first cross-sectional side end (1b) and the second cross-sectional side end (2b) included in each of the plurality of chips (1) using the alignment device (10), comprising: a step (S101) of applying vibration to a pallet (20); a step (S102) of supplying a plurality of chips (1) from a supply port (26) to an alignment area (22); a step (S103) of moving each of the plurality of chips (1) supplied to the alignment area (22) to a plurality of holding positions (70) by means of a first magnet (40) which is a moving holding part, thereby maintaining the first cross-sectional side end (1b) of the chips (1) at the holding position (70) and maintaining the second cross-sectional side end (2b) in a state separated from the surface (21a) of the flat plate part (21); and the second cross-sectional side end (2b) of the plurality of chips (1) maintained at each of the plurality of holding positions (70). A step of collectively maintaining each of them on a second holding sheet (220) (S104), a step of collectively moving a plurality of chips (1) maintained on the second holding sheet (220) away from a holding position (70) (S105), a step of collectively forming a first external electrode (5A) as an external electrode on a first cross-sectional side end (1b) of a plurality of chips (1) maintained on the second holding sheet (220) (S106), a step of maintaining each of the first cross-sectional side end (1b) on which the first external electrode (5A) is formed on a plurality of chips (1) maintained on the second holding sheet (220) on a first holding sheet (210) (S107), a step of moving a plurality of chips (1) maintained on the second holding sheet (220) and a second cross-sectional side end (2b) away from the second holding sheet (220) (S108), and a step of maintaining on the first holding sheet (210) It includes the step (S109) of forming a second external electrode (5B) as an external electrode collectively on a second cross-sectional side end (2b) separated from a plurality of chips (1) and a second retaining sheet (220).

[0058] Thus, the first external electrode (5A) and the second external electrode (5B) can be efficiently formed on multiple chips (1), and the reduction in yield can be suppressed.

[0059] [Another embodiment of the alignment device]

[0060] Next, embodiments 2 through 8 are described as other embodiments of the alignment device. Meanwhile, in the drawings referenced for this description, components identical to or having the same function as those in the first embodiment described above are given the same reference numerals to omit or simplify their description.

[0061] (Second embodiment)

[0062] FIG. 10 is a plan view of an alignment device (10) according to a second embodiment. FIG. 11 is a cross-sectional view of an alignment device (10) according to a second embodiment. The alignment device (10) of the second embodiment includes a plurality of second magnets (42) and a plurality of air ejection parts (44) as movement aids.

[0063] Among the multiple chips (1) supplied to the alignment area (22), there are cases where they pass through the concave portion (23) and move to the surrounding excess portion (24) and remain in the excess portion (24). The multiple second magnets (42) and the multiple air blower portions (44) have the function of assistly moving the chips (1) that have moved to the excess portion (24) toward the concave portion (23) and promoting the acceptance of the chips (1) into the concave portion (23).

[0064] Four second magnets (42) are arranged at each of the front end (20a) and inner end (20b) of the pallet (20). These second magnets (42) are arranged along the side wall (25) above the side wall (25). It is preferable that the second magnets (42) be placed directly on or near the side wall (25). The second magnets (42) are arranged in parallel at positions corresponding to each concave portion (23) that are arranged in the width direction (left-right direction in FIG. 10) of the pallet (20). The second magnets (42) are electromagnets, and the magnetic force is adjusted so that the magnetic force repelling the chip (1) is directed inward, that is, toward the alignment area (22).

[0065] As shown in FIG. 10, when a chip (1) is present in the excess portion (24a) on the front end (20a) side of the excess portion (24), the chip (1) can be moved into the alignment area (22) as indicated by the arrow (M1) by the repulsive force of the magnetic force of the second magnet (42) located near the chip (1). Additionally, when a chip (1) is present in the excess portion (24b) on the inner end (20b) side of the excess portion (24), the chip (1) can be moved into the alignment area (22) as indicated by the arrow (M2) by the repulsive force of the magnetic force of the second magnet (42) located near the chip (1). The chip (1) that has moved into the alignment area (22) becomes easier to accommodate in the concave portion (23).

[0066] An air ejector (44) is positioned on each side (20c) and side (20d) of the pallet (20). Each air ejector (44) is positioned above the side wall (25). It is preferable that the air ejector (44) be positioned directly or near the side wall (25). The air ejector (44) is a tubular member extending along the side wall (25), and compressed air is supplied to its internal space. The air ejector (44) has a plurality of outlets (not shown) that eject air toward the alignment area (22). The plurality of outlets are arranged in a line from one end to the other in the direction of extension of the air ejector (44).

[0067] As shown in FIG. 10, when a chip (1) is present in the excess portion (24c) on the side (left side in FIG. 10) of the excess portion (24), the chip (1) can be moved into the alignment area (22) as indicated by arrow (R1) by the air flow ejected from the air ejector (44) on the side (20c). Additionally, when a chip (1) is present in the excess portion (24d) on the side (right side in FIG. 10) of the excess portion (24), the chip (1) can be moved into the alignment area (22) as indicated by arrow (R2) by the air flow ejected from the air ejector (44) on the side (20d). The chip (1) that has moved into the alignment area (22) becomes easier to accommodate in the concave portion (23).

[0068] The alignment device (10) of the second embodiment includes a moving aid that is positioned at the side wall (25) of the pallet (20) or near the side wall (25) and assistly moves the chip (1) supplied to the alignment area (22) to the concave portion (23).

[0069] Specific moving aids include a second magnet (42) that moves the chip (1) into the concave portion (23) by the repulsive force of the magnetic force, or an air blower (44) that moves the chip (1) into the concave portion (23) by blowing air.

[0070] By doing so, the chip (1) remaining in the excess portion (24), which is the surrounding part of the alignment area (22), can be moved toward the concave portion (23), and the filling rate can be further improved.

[0071] Meanwhile, the position where the second magnet (42) and the air blower (44) are placed is arbitrary, and for example, the second magnet (42) and the air blower (44) may be arranged in a reversed manner to be the opposite of FIG. 10.

[0072] Additionally, multiple second magnets (42) may be integrated. Also, the air ejection part (44) may be divided into multiple parts and arranged side by side.

[0073] Additionally, the movement assist unit may consist only of a second magnet (42) that moves the chip (1) toward the concave portion (23) by repulsion of magnetic force, or conversely, an air blower (44) that moves the chip (1) toward the concave portion (23) by blowing air. That is, in FIG. 10, a plurality of second magnets (42) may be placed at the location of the air blower (44) to form the entire movement assist unit as the second magnets (42), or conversely, an air blower (44) may be placed at the location of the second magnets (42) to form the entire movement assist unit as the air blower (44).

[0074] Next, the third to fifth embodiments are described, in which the aspect of the first magnet (40) that attracts and retains the chip (1) in the concave portion (23) is modified.

[0075] (Third embodiment)

[0076] FIG. 12 is a cross-sectional view of an alignment device (10) according to a third embodiment. In the third embodiment, there is one first magnet (40), and the first magnet (40) has a size that covers the entirety of each recess (23) provided at each of the plurality of holding positions (70). The first magnet (40) is received in a single magnet receiving portion (32) formed on the upper surface (30a) of the base (30). The magnet receiving portion (32) is a pit that opens to the upper surface (30a) of the base (30). The first magnet (40) is received by fitting into the magnet receiving portion (32).

[0077] In the third embodiment, the first magnet (40) has a size that covers the entirety of the plurality of concave portions (23).

[0078] Thus, since the first magnet (40) can be one, the number of parts is reduced and the configuration is simplified.

[0079] Meanwhile, the first magnet (40) may be a single magnet covering all of the multiple concave portions (23), but may also cover all of the multiple concave portions (23) by multiple first magnets (40) of appropriate size (e.g., 2, 4, 8, etc.). In that case, the first magnet (40) has a size that covers a portion of the multiple concave portions (23) of the entire concave portion (23).

[0080] (Fourth embodiment)

[0081] FIG. 13 is a cross-sectional view of an alignment device (10) according to a fourth embodiment. In the fourth embodiment, a magnet receiving portion (32) identical to that of the third embodiment is provided in the base (30). A plurality of first magnets (40) are movably provided within the magnet receiving portion (32). The plurality of first magnets (40) are fitted into the pallet body (29) and the base (30) and are movable in a roughly horizontal direction parallel to the surface (21a) while sliding. In this case, the number of first magnets (40) is arbitrary, but is considered to be an appropriate number that can move vertically and horizontally within the magnet receiving portion (32).

[0082] The first magnet (40) is driven by an unillustrated driving unit positioned on the lower surface (30b) of the base (30). The driving unit may be a magnet that attracts the first magnet (40) or a suitable actuator that enables the first magnet (40) to move. A plurality of first magnets (40) are provided on the back surface (2lb) of the flat plate (21) so as to be movable along the back surface (2lb). By moving the first magnet (40), the chip (1) can be guided into the concave portion (23).

[0083] When including the above-described imaging unit (50) and monitor (51), the situation of receiving the chip (1) in the concave portion (23) can be determined while looking at the monitor (51), and the first magnet (40) can be moved downward to the concave portion (23) where the chip (1) is not received, thereby inducing the first magnet (40) into the concave portion (23) to receive it.

[0084] In the fourth embodiment, the first magnet (40) is provided on the back side (2lb) of the flat plate (21) so as to be movable along the back side (2lb), and by moving, guides the chip (1) into the concave part (23).

[0085] Thus, the chip (1) can be actively moved to the concave portion (23), and the chip (1) can be aligned efficiently and quickly.

[0086] (Fifth embodiment)

[0087] FIG. 14 is a cross-sectional view of an alignment device (10) according to a fifth embodiment. In the fifth embodiment, a first magnet (40) is disposed on the surface (21a) of the flat plate portion (21) of the pallet body (29) in the pallet (20), corresponding to each of the plurality of concave portions (23). The plurality of first magnets (40) are inserted into the interior of each concave portion (23) and disposed on the bottom surface (23b).

[0088] In the fifth embodiment, the first magnet (40) is arranged in multiple numbers on the surface (21a) side of the flat plate (21), corresponding to each of the multiple concave portions (23).

[0089] According to the fifth embodiment, since the first magnet (40) is positioned on the side of the surface (21a) where the chip (1) moves, the magnetic force of the first magnet (40) that attracts the chip (1) acts directly on the chip (1), and the chip (1) can be accommodated more smoothly within the concave portion (23).

[0090] (6th embodiment)

[0091] FIG. 15 illustrates a sixth embodiment in which a plurality of small holes (90) are distributed on the surface (21a) of the flat portion (21) of the pallet body (29) described above. The plurality of small holes (90) are arranged on the surface (21a) excluding each concave portion (23). In this modified embodiment, air is ejected from the plurality of small holes (90) toward the surface (21a). For example, at least the surface (21a) side of the flat portion (21) of the pallet body (29) can be formed as a porous plate (91), and compressed air can be supplied to a sealed space provided on the back side of the porous plate (91) to eject air from the plurality of small holes (90) toward the surface (21a).

[0092] The chip (1) supplied from the supply port (26) to the alignment area (22) moves by sliding along the surface (21a) by air blown toward the surface (21a) from a plurality of small holes (90), and is attracted to the first magnet (40) while moving and is maintained within the concave portion (23).

[0093] In the sixth embodiment, the surface (21a) side of at least the alignment area (22) of the flat plate (21) is composed of a porous plate (91) in which a plurality of small holes (90) are dispersed, and air is ejected from the plurality of small holes (90) toward the surface (21a) side.

[0094] Thus, since multiple chips (1) move quickly through the alignment area (22), the time required for alignment is shortened, thereby improving efficiency.

[0095] Next, a seventh embodiment is described in which an air suction part (60) is used instead of a first magnet (40) as a moving holding part that sucks and holds the chip (1) in the concave part (23).

[0096] (Seventh embodiment)

[0097] FIG. 16 is a cross-sectional view of an alignment device (10) according to a seventh embodiment. The alignment device (10) of the seventh embodiment includes an air suction part (60) that sucks air into a concave part (23). The air suction part (60) has an intake passage (61) and an intake mechanism (65) provided in a pallet (20).

[0098] The intake passage (61) includes a main passage (62) provided on the upper surface (30a) of the base (30), a plurality of intake holes (63) branched from the main passage (62) to each concave portion (23), and an intake port (64) extending from the main passage (62) to the lower surface (30b) of the base (30). The main passage (62) is formed by a concave portion formed on the upper surface (30a) of the base (30). Each of the plurality of intake holes (63) penetrates from the bottom surface (23b) of each concave portion (23) to the lower surface (30b) of the pallet body (29) and is connected to the main passage (62). The intake port (64) is formed in the center of the base (30) and is connected to the main passage (62).

[0099] The intake mechanism (65) includes an intake pipe (66) connected to the base (30) and communicating with the intake port (64), and an air intake source (67), such as a vacuum pump, connected to the intake pipe (66).

[0100] According to the air intake section (60), when the air intake source (67) is operated, air within each concave section (23) is sucked in through the intake pipe (66), intake port (64), main flow path (62), and intake hole (63). As a result, the chip (1) is sucked into and received within the concave section (23).

[0101] In the seventh embodiment, the moving holding part is an air suction part (60) that sucks in air within the concave part (23) on the holding position (70) to hold the chip (1) within the concave part (23).

[0102] Thus, multiple chips (1) can be accurately maintained in each of the concave portions (23) of the set multiple maintenance positions (70). Since the chips (1) are in a state where air inside the concave portions (23) is sucked in and adsorbed to the bottom surface (23b), the popping out of the concave portions (23) is suppressed even when the pallet (20) is vibrating. Therefore, since the chips (1) are filled and maintained throughout the multiple concave portions (23), a sufficient filling rate can be obtained.

[0103] In addition, since the chip (1) is maintained within the concave portion (23) by the suction of air, even if the chip (1) does not have magnetism, such a chip (1) can be reliably maintained and aligned within the concave portion (23).

[0104] In the seventh embodiment, as shown in FIG. 17, a valve (63a) for opening and closing the intake hole (63) may be provided in each intake hole (63). When the valve (63a) is closed, air within the concave portion (23) is not sucked in. When the above-described imaging unit (50) and monitor (51) are included, the status of receiving the chip (1) in the concave portion (23) can be determined while viewing the monitor (51), and the valve (63a) corresponding to the concave portion (23) in which the chip (1) is not received can be opened to make the chip (1) sucked in, and the valve (63a) corresponding to the concave portion (23) can be closed when the chip (1) is received.

[0105] Next, an eighth embodiment is described in which the surface (21a) of the pallet body (29) does not have a plurality of concave portions (23) for accommodating the chip (1) and the entire surface (21a) is flat.

[0106] (Eighth embodiment)

[0107] FIG. 18 is a plan view of an alignment device (10) according to the eighth embodiment. FIG. 19 is a cross-sectional view of an alignment device (10) according to the eighth embodiment. In the eighth embodiment, the front surface (21a) of the pallet body (29) constituting the alignment area (22) is flat. In the alignment area (22), a plurality of holding positions (70) are set as positions for holding and aligning a plurality of chips (1). In this embodiment, similar to the plurality of concave portions (23) of the first embodiment, the holding positions (70) of the pallet (20) are evenly arranged in a matrix shape of 4 rows × 5 columns. The holding positions (70) are rectangular sections corresponding to the shape of the chip (1) when viewed from a plane, but are not limited to such a shape.

[0108] As shown in FIG. 19, a first magnet (40) is disposed on the back side (2lb) of the flat plate (21) and directly below a plurality of holding positions (70). Each of the plurality of first magnets (40) is fitted and received in a magnet receiving portion (31) provided on the upper surface (30a) of the base (30).

[0109] According to the eighth embodiment, a plurality of chips (1) supplied from the supply port (26) to the alignment area (22) are stopped and held at each holding position (70) by the suction force of the first magnet (40) while moving toward the inner end (20b) and are aligned. Since the chips (1) are likely to move in a horizontal position where the main surface (1c) or the side surface (1d) contacts the surface (21a), they are held at the holding position (70) in a horizontal position.

[0110] Meanwhile, in the case where the chip (1) is maintained in a horizontal position, as shown in FIG. 9, the external electrodes can be formed at both ends of the chip (1) in the longitudinal direction by, for example, by moving the chip (1) to change the position to vertical insertion.

[0111] FIG. 20 illustrates a modified example of the eighth embodiment. When the surface (21a) of the alignment area (22) is flat, it is preferable to provide a blocking part (80) that blocks and holds the chip (1) at each holding position (70), as shown in FIG. 20. The blocking part (80) is an L-shaped member when viewed from a plane, comprising a longitudinal part (80a) along the long side of one of the rectangular holding positions (70) and a transverse part (80b) along the short side of the inner end (20b). The height of the blocking part (80) is a height that can block and hold the vibrating chip (1). The chip (1) that has moved to the holding position (70) is stopped by the blocking part (80), thereby restricting further movement toward the inner end (20b) and is stopped and held at the holding position (70).

[0112] In the eighth embodiment, it is preferable to have a blocking part (80) that blocks the chip (1) moved to the holding position (70) at the holding position (70).

[0113] Thus, even if the surface (21a) of the alignment area (22) is flat, the chip (1) can be stopped and maintained at the holding position (70), and the alignment state can be secured.

[0114] In the eighth embodiment described above, the air suction part (60) of the seventh embodiment may be applied instead of the first magnet (40) as a moving holding part that sucks and holds the chip (1).

[0115] In addition, in the third to eighth embodiments described above, the second magnet (42) or the air blower (44) as a moving aid shown in the second embodiment may be combined.

[0116] The embodiments have been described above, but the present invention is not limited to these embodiments, and modifications, improvements, etc. within the scope of achieving the objectives of the present invention are included in the present invention.

[0117] For example, the first magnet (40) that attracts and holds the chip (1) may be a permanent magnet. In that case, although the magnetic force cannot be turned ON / OFF like an electromagnet, it can be used as long as it has sufficient function to attract the chip (1).

[0118] A second magnet (42) and an air blower (44) were shown as moving aids that assistly move the chip (1) staying in the excess portion (24) of the alignment area (22) toward the holding position (70), but these are examples and any form that includes such a function may be used.

[0119] In the embodiment, a chip that is a multilayer element before the external electrodes are formed in a multilayer ceramic capacitor is used as an example of a workpiece, but the workpiece is not limited to this, and other chip-shaped electronic components, such as multilayer ceramic capacitors or semiconductor devices that have been made into products, can be applied as workpieces. Explanation of the symbols

[0120] 1: Chip (Work) 5A: First external electrode 5B: Second external electrode 10: Alignment device 20: Pallet 21: Flatbed 21a: Surface 2lb: Back side 22: Alignment area 23: Recess (holding position) 25: Side wall 26: Supply port 40: 1st magnet 42: 2nd magnet (movement aid) 44: Air discharge section (movement aid) 60: Air intake section 70: Retention position 90: Small hole 91: Perforated plate 210: First retention sheet 220: Second maintenance sheet

Claims

Claim 1 A pallet to which vibration is applied, comprising a flat plate having a surface and a back surface, a side wall portion erected on the surface side of the flat plate and partitioning the inner surface thereof into an alignment area to which a plurality of magnetic workpieces are supplied, a plurality of holding positions set in the alignment area and in which each of the plurality of workpieces supplied to the alignment area is positioned to maintain the alignment state of the plurality of workpieces, a supply port provided by opening a part of the side wall portion of the pallet and enabling the supply of a plurality of workpieces to the alignment area from the outside of the side wall portion, and a moving holding unit disposed relative to the flat plate and moving each of the plurality of workpieces supplied to the alignment area from the supply port to each of the plurality of holding positions and holding them in the holding positions, wherein the moving holding unit is a first magnet that moves the workpiece to the holding position by the magnetic attraction force and holds it in the holding position, wherein the first magnet is an electromagnet that is individually energized and arranged in a plurality corresponding to each of the plurality of holding positions, and above the pallet, the alignment area is captured and regarding the holding position An alignment device in which an imaging unit is positioned to determine the acceptance status of the above-mentioned work. Claim 2 An alignment device according to claim 1, having a recess in which a workpiece is received in each of the plurality of holding positions. Claim 3 delete Claim 4 An alignment device according to claim 1, wherein the first magnet is arranged in plurality on the back side corresponding to each of the plurality of holding positions. Claim 5 An alignment device according to claim 1, wherein the first magnet has a size that covers all or part of the plurality of holding positions. Claim 6 An alignment device according to claim 1, wherein the first magnet is movably provided along the rear side of the flat plate portion and guides the work to the holding position by moving. Claim 7 An alignment device according to claim 1, wherein the first magnet is arranged in plurality on the surface side of the flat plate portion corresponding to each of the plurality of holding positions. Claim 8 In claim 1, the alignment device is an air suction unit that sucks air on the maintenance position to suck and maintain the work at the maintenance position. Claim 9 An alignment device according to any one of claims 1, 2, and 4 through 8, having a blocking part that blocks a work moved to the holding position from being stopped at the holding position. Claim 10 An alignment device according to any one of claims 1, 2, and 4 through 8, further comprising a movement aid disposed in the vicinity of the side wall portion or the side wall portion and assistly moving a work supplied to the alignment area to the holding position. Claim 11 A pallet to which vibration is applied, comprising a flat plate having a surface and a back surface, a side wall portion erected on the surface side of the flat plate and partitioning the inner surface thereof into an alignment area to which a plurality of magnetic workpieces are supplied, a plurality of holding positions set in the alignment area and in which each of the plurality of workpieces supplied to the alignment area is positioned to maintain the alignment state of the plurality of workpieces, a supply port provided by opening a part of the side wall portion of the pallet and enabling the supply of a plurality of workpieces to the alignment area from the outside of the side wall portion, and a moving holding unit disposed relative to the flat plate and moving each of the plurality of workpieces supplied to the alignment area from the supply port to each of the plurality of holding positions and holding them in the holding positions, wherein the moving holding unit is a first magnet that moves the workpiece to the holding position by the magnetic attraction force and holds it in the holding position, wherein the first magnet is an electromagnet that is individually energized and disposed in a plurality corresponding to each of the plurality of holding positions, and is disposed on or near the side wall portion and supplied to the alignment area An alignment device further comprising a moving aid that assistly moves a work to the holding position, wherein the moving aid is a second magnet that moves the work to the holding position by means of the repulsive force of a magnetic force. Claim 12 In item 10, the above-mentioned moving aid is an air blower that moves the work to the holding position by blowing air, an alignment device. Claim 13 An alignment device according to any one of claims 1, 2, and 4 through 8, wherein at least the surface side of the alignment area of ​​the flat plate portion is composed of a porous plate having a plurality of small holes dispersed therein, and air is ejected from the plurality of small holes toward the surface side. Claim 14 An alignment device according to any one of claims 1, 2, and 4 through 8, further comprising a feeder connected to the supply port and conveying a workpiece to the alignment area of ​​the pallet by vibrating, wherein the vibration of the feeder is transmitted to the pallet and a vibration common to the feeder is imparted thereto. Claim 15 A method for forming external electrodes on each of a first end face side end and a second end face side end of each of a plurality of workpieces using an alignment device described in any one of claims 1, 2, and 4 to 8, comprising: a step of applying vibration to the pallet; a step of supplying a plurality of workpieces from a supply port to an alignment area; a step of moving each of the plurality of workpieces supplied to the alignment area to a plurality of holding positions by means of a moving holding unit, thereby maintaining the first end face side end of the workpieces at the holding positions while maintaining the second end face side end in a state separated from the surface; a step of collectively holding each of the second end face side end of the plurality of workpieces held at each of the plurality of holding positions on a second holding sheet; a step of collectively separating the plurality of workpieces held on the second holding sheet from the holding positions; and a first external electrode as the external electrode on the first end face side end of the plurality of workpieces held on the second holding sheet. A method for forming an external electrode, comprising: a step of forming collectively; a step of maintaining each of the first cross-sectional side ends of the plurality of workpieces maintained on the second holding sheet, on the first holding sheet, wherein the first external electrode is formed thereon; a step of separating the second cross-sectional side ends of the plurality of workpieces maintained on the second holding sheet from the second holding sheet; and a step of collectively forming a second external electrode as the external electrode on the second cross-sectional side ends of the plurality of workpieces maintained on the first holding sheet that have been separated from the second holding sheet.

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