Touchless tray of printed circuit board for automated method and transpotation method of printed circuit board using the same

Abstract

A touchless tray for printed circuit boards and a method for transporting printed circuit boards using the same are disclosed, wherein the tray body, the tray bottom plate, and the tray top cover are designed to be mutually separable, thereby preventing circuit damage and breakage defects when a finished PCB board is loaded into the touchless tray and transported, as well as enabling free insertion and ejection of the finished PCB board loaded into the touchless tray. A touchless tray for a printed circuit board for an automation method according to the present invention is characterized by comprising: a tray body having a recess for accommodating a plurality of printed circuit boards inside and a step on the edge of the bottom surface; and a tray bottom plate formed separately so as to be separable from the tray body, seated on the step of the tray body, and mounted to cover the bottom surface of the tray body to support the plurality of printed circuit boards.

Description

Technology Field

[0001] The present invention relates to a touchless tray for printed circuit boards for an automated method and a method for transporting printed circuit boards using the same. More specifically, the tray body, the tray bottom plate, and the tray top cover are designed to be mutually separable, thereby preventing circuit damage and breakage defects when transporting finished PCB boards loaded in the touchless tray, as well as allowing for the free insertion and ejection of finished PCB boards loaded in the touchless tray. Background Technology

[0003] Generally, a printed circuit board (PCB) is a board on which printed circuits are formed and components are mounted on one or both sides of an insulating material, and recently, it is used as an essential tool in almost all industrial fields.

[0004] As such, printed circuit boards are formed by printing circuits using materials such as copper on one or both sides of an insulating material. They possess excellent heat resistance and flexibility resistance, and due to the high versatility for mounting electronic components on the board, they have diverse applications, such as being used for the miniaturization and lightweighting of electrical and electronic equipment and products.

[0005] These printed circuit boards are used in smartphones, tablet PCs, satellite equipment, military equipment, medical equipment, and battlefield components.

[0006] Printed circuit boards manufactured as finished products must inevitably be moved to at least one inspection device from the visual inspection stage to the packaging and shipping stage to proceed with unit processes for various quality inspections.

[0007] However, during the process of inserting and ejecting finished printed circuit boards into at least one inspection device for various quality inspections, defects such as circuit damage and breakage occur, which ultimately leads to the disposal of the finished products and causes a problem of reduced production yield.

[0009] FIG. 1 is a schematic diagram illustrating a conventional method of transferring a printed circuit board.

[0010] As illustrated in FIG. 1, in the past, to perform various quality inspections on a printed circuit board (P) in a finished product state, at least two printed circuit boards (P) in a finished product state were fed into a lift table (10) in a stacked manner using an adsorption unit (50), and after the inspection was completed, the printed circuit boards (P) were transported by discharging the stacked multiple printed circuit boards (P) one by one using an adsorption unit (20).

[0011] However, in the past, during the process of inserting and discharging the printed circuit board (P) in a finished product state into at least one inspection device (20) for various quality inspections, defects such as circuit damage and breakage of the printed circuit board (P) in a finished product state occurred, which ultimately caused a problem of lowering the production yield due to the need to dispose of the finished product.

[0012] To improve this problem, there was an attempt to move the finished printed circuit board (P) in a tray.

[0013] However, since conventional trays are designed as an integrated type in which the tray body and the tray bottom plate are connected as a single unit, it was impossible to insert and discharge printed circuit boards (P) in a finished state into various equipment (20).

[0014] As a result, conventional trays were unable to carry out operations in an automated manner due to the limitation that they had to rely on manual labor to input and output printed circuit boards (P) in a finished state.

[0015] A relevant prior art document is Korean Registered Patent Publication No. 10-1830921 (published on March 29, 2018), which discloses a PCB substrate transport device and a method thereof. The problem to be solved

[0017] The objective of the present invention is to provide a touchless tray for printed circuit boards for an automated method in which the tray body, the tray bottom plate, and the tray top cover are designed to be mutually separable, thereby preventing circuit damage and breakage defects when a finished PCB board is loaded into the touchless tray and transported, as well as allowing for the free insertion and ejection of the finished PCB board loaded into the touchless tray. Additionally, the invention provides a method for transporting printed circuit boards using the same. means of solving the problem

[0019] A touchless tray for a printed circuit board for an assimilation method according to an embodiment of the present invention for achieving the above objective comprises: a tray body having a recess for accommodating a plurality of printed circuit boards inside and a step on the edge of the bottom surface; and a tray bottom plate formed separately so as to be separable from the tray body, seated on the step of the tray body, and mounted to cover the bottom surface of the tray body to support the plurality of printed circuit boards.

[0020] The tray body comprises: a rectangular frame-shaped horizontal portion having an opening in the center of the bottom surface and a step at the edge portion; and a vertical portion extending vertically from the horizontal portion to form a recess for accommodating a plurality of printed circuit boards.

[0021] The vertical portion extends from the horizontal portion in four plane directions, and the vertical portion is provided with a cut pattern on at least one plane to expose a portion of a plurality of printed circuit boards inserted into the touchless tray to the outside.

[0022] The above-mentioned cut pattern has an inverted trapezoidal shape when viewed in cross-section.

[0023] The touchless tray is connected to the tray bottom plate by a hinge connection method and further includes an angle adjustment pin for adjusting the inclination angle of the tray bottom plate; the angle adjustment pin adjusts the tray bottom plate to an angle of 5 to 40 degrees relative to the ground.

[0024] The touchless tray may further include a tray upper cover that is formed separately so as to be separable from the tray body and is mounted to cover the upper part of the tray body.

[0026] A method for transporting printed circuit boards using a touchless tray according to an embodiment of the present invention for achieving the above objective involves inserting and discharging printed circuit boards in a finished product state into and out of at least one inspection equipment from the visual inspection stage to the packaging and shipping stage, wherein when inserting the printed circuit boards, a plurality of printed circuit boards are sequentially loaded into the recess of a touchless tray placed on a lift table, and when discharging the printed circuit boards, the plurality of printed circuit boards loaded into the recess of the touchless tray are sequentially unloaded.

[0027] When the above printed circuit boards are inserted, the tray body of the touchless tray is fixed in position, and only the tray bottom plate of the touchless tray and a plurality of printed circuit boards are raised using a lift table and loaded sequentially using a suction unit.

[0028] When discharging the above printed circuit board, the tray bottom plate is positioned at an angle using an angle adjustment pin coupled to the tray bottom plate of the touchless tray, and then sequentially unloaded using a suction unit.

[0029] The insertion and discharge of the above printed circuit board are performed at least twice, from the visual inspection stage to the packaging and shipment stage. Effects of the invention

[0031] The touchless tray for printed circuit boards for automation according to the present invention and the method for transporting printed circuit boards using the same are designed such that the tray body, the tray bottom plate, and the tray top cover are mutually separable, so that when a printed circuit board is introduced into the interior of at least one inspection equipment, it is possible to sequentially load the tray bottom plate and a plurality of printed circuit boards using a suction unit while the tray body is fixed in position and only the tray bottom plate and a plurality of printed circuit boards are raised using a lift table.

[0032] As a result, the touchless tray for printed circuit boards for automation according to the present invention and the method for transporting printed circuit boards using the same are designed such that the tray body, the tray bottom plate, and the tray top cover are mutually separable, thereby preventing circuit damage and breakage defects when a printed circuit board in a finished product state is loaded into the touchless tray and transported.

[0033] In addition, the touchless tray for printed circuit boards for automation according to the present invention and the method for transporting printed circuit boards using the same make it possible to selectively adjust the inclination angle of the tray bottom plate by means of an angle adjustment pin connected to the tray bottom plate in a hinge-coupled manner, thereby enabling automatic alignment of a plurality of printed circuit boards loaded on the tray bottom plate.

[0034] As a result, the touchless tray for printed circuit boards for automation according to the present invention and the method for transporting printed circuit boards using the same can perform the insertion and discharge of printed circuit boards in a finished product state into and out of at least one inspection equipment in an automated manner from the visual inspection stage to the packaging and shipping stage, thereby enabling the insertion and discharge of printed circuit boards in a finished product state loaded in the touchless tray to be performed freely and automatically. Brief explanation of the drawing

[0036] FIG. 1 is a schematic diagram illustrating a conventional method of transferring a printed circuit board. FIG. 2 is a perspective view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention. FIG. 3 is a cross-sectional view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention. FIG. 4 is a plan view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention. FIG. 5 is a plan view showing the tray body of FIG. 4. FIG. 6 is a plan view showing the tray bottom plate of FIG. 4. FIG. 7 is a plan view showing a modified example of the tray bottom plate of FIG. 4. FIGS. 8 and 9 are a cross-sectional view and a schematic diagram showing, in more detail, a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention. FIG. 10 is a plan view showing the touchless tray of FIG. 8. FIGS. 11 and 12 are process cross-sectional views for explaining a method of transferring a printed circuit board using a touchless tray according to an embodiment of the present invention. FIG. 13 is a schematic diagram of a process for explaining a method of transferring a printed circuit board using a touchless tray according to an embodiment of the present invention. Specific details for implementing the invention

[0037] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0038] The following is a detailed description of a touchless tray for a printed circuit board for automation according to a preferred embodiment of the present invention and a method for transporting a printed circuit board using the same, with reference to the attached drawings.

[0040] FIG. 2 is a perspective view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention. In addition, FIG. 4 is a plan view showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention, FIG. 5 is a plan view showing the tray body of FIG. 4, and FIG. 6 is a plan view showing the tray bottom plate of FIG. 4.

[0041] Referring to FIGS. 2 to 6, a touchless tray (100) for a printed circuit board for an automation method according to an embodiment of the present invention includes a tray body (120) and a tray bottom plate (140).

[0043] The tray body (120) has a recess (R) for accommodating a plurality of printed circuit boards inside, and has a step (125) on the edge of the bottom surface.

[0044] It is preferable that such a tray body (120) be made of one or more materials having excellent durability, such as a metal material, an electrostatic material, and an antistatic material. To this end, it is preferable that the tray body (120) use one or more materials selected from metal materials including stainless steel, aluminum, tungsten, copper, titanium, molybdenum, and iron, and electrostatic and antistatic materials including ABS, PC, PE, PVC, MC nylon, PP, PS, etc. Although it is acceptable to use an electrostatic material for such a tray body (120) to prevent foreign matter from adhering, it is more preferable to use an antistatic material as the top priority for foreign matter management.

[0045] The tray body (120) includes a rectangular horizontal portion (120a) having an open central portion of the bottom surface and a stepped portion (125) at the edge portion, and a vertical portion (120b) extending vertically from the horizontal portion (120a) to form a recess (R) for accommodating a plurality of printed circuit boards. Here, the stepped portion (125) can be formed by selectively removing only the central portion excluding the edge portion of the bottom surface of the tray body (120). Accordingly, the stepped portion (125) can be formed in a form that has substantially the same thickness as the bottom surface of the tray body (120) and is integrally connected along the edge of the bottom surface of the tray body (120).

[0046] Here, the vertical section (120b) extends from the horizontal section (120a) in four planar directions, and the vertical section is provided with a cut pattern (C) on at least one surface to expose a portion of a plurality of printed circuit boards inserted into a touchless tray (100) to the outside. Through this cut pattern (C), a portion of the plurality of printed circuit boards is exposed to the outside, allowing the movement process of the printed circuit boards to be observed in real time by visual inspection. It is preferable that the cut pattern (C) has an inverted trapezoidal shape when viewed in cross-section.

[0048] The tray bottom plate (140) is formed separately so as to be separable from the tray body (120) and is seated on the step (125) of the tray body (120), and is mounted to cover the bottom surface of the tray body (120) and serves to support a plurality of printed circuit boards.

[0049] Thus, the present invention has a structure in which the tray body (120) and the tray bottom plate (140) are formed separately, allowing the tray body (120) and the tray bottom plate (140) to be separated from each other. To this end, it is preferable that the tray bottom plate (140) be formed as a plate-shaped structure that covers the entire central opening of the tray body (120).

[0050] It is preferable that the tray bottom plate (140), like the tray body (120), be made of one or more materials having excellent durability, such as metal materials, electrostatic materials, and non-static materials. To this end, it is preferable that the tray bottom plate (140) be made of one or more materials selected from metal materials including stainless steel, aluminum, tungsten, copper, titanium, molybdenum, and iron, and electrostatic and non-static materials including ABS, PC, PE, PVC, MC nylon, PP, PS, etc. More preferably, the tray bottom plate (140) is made of one or more alloy materials selected from stainless steel, aluminum, tungsten, copper, titanium, molybdenum, iron, ABS, etc., which are resistant to softening, bending, and breaking.

[0051] The tray bottom plate (140) may be formed in a plate-like structure to align the printed circuit board when it is inserted into and discharged into various equipment for inspection of the printed circuit board in a finished product state. At this time, the tray bottom plate (140) may be formed in a rectangular shape with a width of 150 to 300 mm and a height of 60 to 120 mm, but is not limited thereto.

[0052] Additionally, FIG. 7 is a plan view showing a modified example of the tray bottom plate of FIG. 4. As shown in FIG. 7, the tray bottom plate (140) may be provided with alignment guide grooves (H) on the edge portions of the horizontal and vertical sides. These alignment guide grooves (H) may be formed by removing a portion of the edge portions of the horizontal and vertical sides of the tray bottom plate (140). The alignment guide grooves (H) may be formed on the horizontal and vertical sides facing each other of the tray bottom plate (140), but are not limited thereto. That is, the alignment guide grooves (H) may be formed only on the long sides facing each other of the tray bottom plate (140), or only on the short sides facing each other.

[0053] Here, when discharging a printed circuit board from the interior of various equipment, a touchless tray (100) having a tray bottom plate (140) with a plate-shaped structure or a tray bottom plate (140) having an alignment guide groove (H) can be sequentially unloaded using a suction unit while the tray bottom plate (140) of the touchless tray (100) is positioned at an angle using an angle-maintaining guide unit mounted on the unloader loading section.

[0055] Additionally, although not shown in detail in the drawings, the touchless tray (100) of the present invention may further include a tray upper cover (not shown) that is formed separately so as to be separable from the tray body (120) and is mounted to cover the upper part of the tray body (120).

[0056] This tray upper cover is formed separately so as to be detachable from the tray body (120) and covers the upper part of the tray body (120). The tray upper plate is not necessarily designed and may be omitted if necessary.

[0058] Meanwhile, FIGS. 8 and 9 are a cross-sectional view and a schematic view, respectively, showing a touchless tray for a printed circuit board for an automation method according to an embodiment of the present invention in more detail, and FIG. 10 is a plan view showing the touchless tray of FIG. 8.

[0059] Referring to FIGS. 8 to 10, a touchless tray (100) for a printed circuit board for an automation method according to an embodiment of the present invention further includes an angle adjustment pin (145) in addition to a tray body (120) and a tray bottom plate (140).

[0060] The angle adjustment pin (145) is connected to the tray bottom plate (140) in a hinge-like manner and serves to adjust the inclination angle of the tray bottom plate (140).

[0061] A touchless tray (100) equipped with such an angle adjustment pin (145) may be applied exclusively to equipment that does not have an angle-maintaining guide unit in the unloader loading section. Here, the angle-maintaining guide unit may be an angle-maintaining guide bar or an angle-maintaining guide pin.

[0062] The angle adjustment pin (145) connected to the tray bottom plate (140) in a hinge-like manner is preferably designed to adjust the tray bottom plate (140) to an angle of 5 to 40 degrees relative to the ground, and more preferably to adjust it to an angle of 20 to 35 degrees.

[0063] In this way, the touchless tray (100) according to the embodiment of the present invention makes it possible to adjust the inclination angle of the tray bottom plate (140) to an angle of 5 to 40 degrees by means of an angle adjustment pin (145) connected to the tray bottom plate (140) in a hinge-connected manner, even in equipment where there is no angle-maintaining guide unit in the unloader loading section, thereby enabling automatic alignment of a plurality of printed circuit boards loaded on the tray bottom plate (140).

[0064] That is, in the present invention, when a printed circuit board is inserted into the interior of at least one inspection equipment, the tray body (120) of the touchless tray (100) is fixed in position, and only the tray bottom plate (140) of the touchless tray (100) and a plurality of printed circuit boards are raised using a lift table and can be loaded sequentially using an adsorption unit.

[0065] In addition, in the present invention, when discharging a printed circuit board from the interior of at least one inspection equipment, even in equipment where there is no angle-maintaining guide unit in the unloader loading section, the tray bottom plate (140) is positioned at an angle using an angle-adjusting pin (145) coupled to the tray bottom plate (140) of the touchless tray (100), and then the board can be sequentially unloaded using an adsorption unit.

[0067] This will be explained in more detail through a method for transporting a printed circuit board using a touchless tray according to an embodiment of the present invention.

[0068] FIGS. 11 and 12 are process cross-sectional views for explaining a method of transferring a printed circuit board using a touchless tray according to an embodiment of the present invention, and FIG. 13 is a process schematic diagram for explaining a method of transferring a printed circuit board using a touchless tray according to an embodiment of the present invention.

[0069] As illustrated in FIGS. 11 to 13, the method of transporting a printed circuit board using a touchless tray according to an embodiment of the present invention proceeds in a manner that inserts and discharges the printed circuit board in a finished product state into and out of at least one inspection equipment from the visual inspection stage to the packaging and shipping stage.

[0070] First, in the visual inspection stage, a camera is used to inspect and image the external defects of multiple printed circuit boards.

[0071] In the IVS stage, after the visual inspection, an inspector identifies images of defective points to sort out good and defective products.

[0072] In the marking stage, printed circuit boards selected as defective are marked by laser processing.

[0073] In the rinsing step, contaminants and foreign matter on the surface of multiple printed circuit boards that have completed the marking step are cleaned with ultrapure water.

[0074] In the X-out separation step, the strips are separated according to the number of defective units within the strips of multiple printed circuit boards.

[0075] In the packaging and shipping stage, individual finished products separated via X-out are packaged according to the customer's specifications and shipped.

[0076] At this time, it is desirable to perform the insertion and discharge of printed circuit boards at least twice, from the visual inspection stage to the packaging and shipment stage.

[0078] From the above-described external inspection stage to the packaging and shipping stage, when a printed circuit board (P) is inserted into at least one inspection device (220), a plurality of printed circuit boards (P) are sequentially loaded into the recess (R) of a touchless tray (100) mounted on a lift table (210).

[0079] Here, a rise detection sensor (230) for detecting whether a plurality of printed circuit boards (P) are being raised may be mounted on the upper side of at least one inspection equipment (220). Additionally, a board mounting detection sensor (240) for detecting whether a plurality of printed circuit boards (P) are being mounted may be mounted on the lift table (210).

[0080] In this way, in the present invention, when a printed circuit board (P) is inserted into at least one inspection device (220), the tray body (120) of the touchless tray (100) is fixed in position, and only the tray bottom plate (140) of the touchless tray (100) and a plurality of printed circuit boards (P) are raised using a lift table (210) and then sequentially loaded using an adsorption unit (250).

[0081] In addition, from the external inspection stage to the packaging and shipping stage, when a printed circuit board (P) is discharged from inside at least one inspection equipment (220), a plurality of printed circuit boards (P) mounted in the recess (R) of the touchless tray (100) are sequentially unloaded.

[0082] In this way, when discharging a printed circuit board (P) from the interior of at least one inspection equipment (220) in the present invention, the tray bottom plate (140) having a plate-shaped structure or the tray bottom plate (140) having an alignment guide groove (H) is positioned at an angle using an angle-maintaining guide unit (265) mounted on the unloader loading section (260), and then sequentially unloaded using an adsorption unit (250).

[0083] If, in at least one inspection device (220), an angle-maintaining guide unit (265) is not installed on the unloader loading section (260), the tray bottom plate (140) of the touchless tray (100) described with reference to FIGS. 8 to 10 may be positioned at an angle using an angle-adjusting pin (145) and then sequentially unloaded using a suction unit (250).

[0084] In this way, in the present invention, the angle of inclination of the tray bottom plate (140) can be adjusted to an angle of 5 to 40 degrees by means of an angle maintaining guide unit (265) mounted on the unloader loading section (260) or an angle adjustment pin (145) connected to the tray bottom plate (140) in a hinge-connected manner, thereby enabling automatic alignment of a plurality of printed circuit boards (P) loaded on the tray bottom plate (140).

[0085] As a result, the present invention is designed so that the tray body (120), the tray bottom plate (140), and the tray top cover are mutually separable, thereby preventing circuit damage and defects when a finished printed circuit board (P) is loaded into a touchless tray (100) and moved.

[0086] In addition, since the present invention makes it possible to automatically insert and discharge a printed circuit board (P) in a finished product state into and out of at least one inspection equipment (220) from the external inspection stage to the packaging and shipping stage, the insertion and discharge of the printed circuit board (P) in a finished product state loaded in the touchless tray (100) can be freely and automatically performed.

[0088] As described above, the touchless tray for printed circuit boards for automation according to the embodiment of the present invention and the method for transporting printed circuit boards using the same are designed such that the tray body, the tray bottom plate, and the tray top cover are mutually separable, so that when a printed circuit board is introduced into the interior of at least one inspection equipment, it is possible to sequentially load the tray bottom plate and a plurality of printed circuit boards using a suction unit while the tray body is fixed in position and only the tray bottom plate and a plurality of printed circuit boards are raised using a lift table.

[0089] As a result, the touchless tray for printed circuit boards for automation according to an embodiment of the present invention and the method for transporting printed circuit boards using the same are designed such that the tray body, the tray bottom plate, and the tray top cover are mutually separable, thereby preventing circuit damage and breakage defects when a printed circuit board in a finished product state is loaded into the touchless tray and transported.

[0090] In addition, the touchless tray for printed circuit boards for automation according to the embodiment of the present invention and the method for transporting printed circuit boards using the same make it possible to selectively adjust the inclination angle of the tray bottom plate by means of an angle adjustment pin coupled to the tray bottom plate in a hinge-coupled manner, thereby enabling automatic alignment of a plurality of printed circuit boards loaded on the tray bottom plate.

[0091] As a result, the touchless tray for printed circuit boards for automation according to an embodiment of the present invention and the method for transporting printed circuit boards using the same can perform the insertion and discharge of printed circuit boards in a finished product state into and out of at least one inspection equipment in an automated manner from the external inspection stage to the packaging and shipping stage, thereby enabling the insertion and discharge of printed circuit boards in a finished product state loaded in the touchless tray to be performed freely and automatically.

[0093] Although the present invention has been described above with reference to embodiments, various changes and modifications can be made by those skilled in the art to which the present invention pertains. Such changes and modifications are considered to be within the scope of the present invention as long as they do not depart from the technical concept provided by the present invention. Accordingly, the scope of rights of the present invention should be determined by the claims set forth below. Explanation of the symbols

[0095] 100 : Touchless Tray 120 : Tray body 120a: Horizontal part of the tray body 120b: Vertical part of the tray body 125 : Step 140 : Tray bottom plate 145 : Angle adjustment pin R: Recess C: Incision pattern

Claims

Claim 1 A touchless tray for printed circuit boards for an automated method, comprising: a tray body having a recess for accommodating a plurality of printed circuit boards internally and a step on the edge portion of the bottom surface; and a tray bottom plate formed separately so as to be separable from the tray body, seated on the step portion of the tray body, and mounted to cover the bottom surface of the tray body to support the plurality of printed circuit boards; wherein the tray body comprises: a rectangular frame-shaped horizontal portion having an opening in the center portion of the bottom surface and the step on the edge portion; and a vertical portion extending vertically from the horizontal portion to form the recess for accommodating the plurality of printed circuit boards.It includes, wherein the vertical portion extends from the horizontal portion in four planar directions, and the vertical portion is provided with a cut pattern on at least one surface to expose a portion of a plurality of printed circuit boards inserted into the touchless tray to the outside, wherein the cut pattern has an inverted trapezoidal shape when viewed in cross-section, and the tray bottom plate is formed as a plate-shaped structure covering the entire central opening of the tray body and is formed to cover the entire step of the tray body, and the step is formed by selectively removing only the central portion excluding the edge portion of the bottom surface of the tray body, has the same thickness as the bottom surface of the tray body, and is integrally connected along the edge of the bottom surface of the tray body, and while the tray body is fixed in position inside the inspection equipment, the lift table passes through the central opening of the tray body and contacts the lower surface of the tray bottom plate, and is configured to raise only the tray bottom plate and the plurality of printed circuit boards stacked on the tray bottom plate without raising the tray body, and whenever the tray bottom plate is raised, the uppermost of the plurality of printed circuit boards A touchless tray for printed circuit boards for an automated method, characterized in that the printed circuit boards are raised to a position corresponding to the cut pattern, and the suction unit approaches the uppermost printed circuit board exposed to the outside by the cut pattern and sequentially extracts the uppermost printed circuit boards one by one to the outside of the tray body. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A touchless tray for a printed circuit board for an automation method, wherein, in claim 1, the touchless tray is coupled to the tray bottom plate in a hinge-coupling manner and further comprises an angle adjustment pin for adjusting the inclination angle of the tray bottom plate, wherein the angle adjustment pin adjusts the tray bottom plate to an angle of 5 to 40 degrees with respect to the ground. Claim 6 A touchless tray for a printed circuit board for an automation method, characterized in that, in claim 1, the touchless tray is separately formed so as to be separable from the tray body and further comprises a tray upper cover mounted to cover the upper part of the tray body. Claim 7 A method for transporting printed circuit boards using a touchless tray for an automated method according to any one of claims 1, 5 to 6, wherein printed circuit boards in a finished product state are fed into and discharged from at least one inspection equipment from the visual inspection stage to the packaging and shipment stage, wherein when the printed circuit boards are fed, a plurality of printed circuit boards are sequentially loaded into the recess of a touchless tray seated on a lift table, and when the printed circuit boards are discharged, the plurality of printed circuit boards loaded into the recess of the touchless tray are sequentially unloaded, wherein, while the tray body of the touchless tray is fixed in position inside the inspection equipment, the lift table passes through the central opening of the tray body and contacts the lower surface of the tray bottom plate, and only the tray bottom plate and the plurality of printed circuit boards stacked on the tray bottom plate are raised without raising the tray body, and whenever the tray bottom plate is raised, the uppermost printed circuit board among the plurality of printed circuit boards corresponds to the cutting pattern A method for transporting printed circuit boards using a touchless tray, characterized by rising to a position, and the adsorption unit approaching the printed circuit board at the top that is exposed to the outside by a cut pattern, and sequentially extracting the printed circuit boards at the top one by one to the outside of the tray body. Claim 8 delete Claim 9 A method for transporting printed circuit boards using a touchless tray according to claim 7, characterized in that, when discharging the printed circuit boards, the tray bottom plate is positioned at an angle using an angle adjustment pin coupled to the tray bottom plate of the touchless tray, and then sequentially unloaded using a suction unit. Claim 10 A method for transporting a printed circuit board using a touchless tray, characterized in that, in claim 7, the insertion and discharge of the printed circuit board are performed at least twice from the visual inspection stage to the packaging and shipment stage.

Images