Shunt Resistance Type Current Sensor

Abstract

A shunt resistor type current sensor comprising: a housing having a receiving space formed therein with an open upper surface; a shunt resistor body including a pair of busbars spaced apart from each other and a shunt resistor positioned between the pair of busbars to connect the pair of busbars; a PCB assembly including a printed circuit board having a pair of insertion holes and a plurality of through holes formed therein, which measures current by detecting the voltage across the shunt resistor; and a press-fit connector in which a pair of connecting pins protruding downward from the lower surface of a spacer part are coupled to the pair of busbars, and a pair of coupling pins protruding upward from the upper surface of a spacer part are coupled to the pair of insertion holes by a press-fit method. The structure includes a cover coupled to the housing to cover the receiving space, wherein the spacer is formed to have a predetermined length and a predetermined height, and the shunt resistor and the PCB assembly are configured to be received within the receiving space while being coupled and spaced apart from each other by the press-fit connector, thereby firmly coupling the shunt resistor, PCB, housing, and cover in which the shunt resistor is positioned between the busbars, without requiring the use of a separate coupling member or a separate coupling process, thereby minimizing coupling processes and material costs, minimizing process risks, and improving cost competitiveness.

Description

Technology Field

[0001] The present invention relates to a shunt resistance type current sensor, and more specifically, to a shunt resistance type current sensor that can minimize assembly processes and material costs, minimize process risks, and improve cost competitiveness by firmly coupling a shunt resistor body in which a shunt resistor is disposed between busbars, a PCB, a housing, and a cover without requiring the use of a separate coupling member or a separate coupling process. Background Technology

[0003] Generally, automobiles are equipped with numerous electrical devices—that is, electrical loads—for driver convenience and safety, including electrical components such as engine starters and ignition systems, as well as lamps and air conditioning systems. The power sources supplying these loads are batteries and alternators. In supplying power to the loads within the vehicle using the power provided by these batteries and alternators, the vehicle's electrical wiring converges from the battery and main relay to the junction box, where it is then connected to distribute power to the vehicle's overall electrical loads, such as motors, lamps, clocks, audio systems, buzzers, and other components. Furthermore, these electrical devices detect the supplied current to determine whether sufficient current is being provided for operation, and they display their operating status or issue warnings accordingly.

[0004] Recently, electric vehicles, hybrid vehicles, and fuel cell vehicles have been receiving significant attention as eco-friendly vehicles. Electric vehicles use batteries as their primary power source, and the management of energy input and output for this primary power source is controlled by the amount of current detected by a current sensor installed at the output terminal of the main battery and processed by the Battery Management System (BMS).

[0005] A typical shunt resistor type current sensor used in such a battery management system (BMS) is generally formed by inserting a shunt resistor, in which a shunt resistor is placed between busbars, a PCB assembly that detects a current value by receiving an electrical signal according to the voltage across the shunt resistor, and a connector part for connecting the current sensor and an external device into the sensor body.

[0006] At this time, the PCB assembly is connected to the shunt resistor by multiple lead wires, specifically by soldering both ends of the lead wires to the shunt resistor and the PCB assembly.

[0007] However, the process of soldering multiple lead wires to a shunt resistor and a PCB assembly in this manner has poor workability, and there were problems such as cold solder joints and missing wires as heat escaped through the lead wires toward the shunt resistor when soldering the lead wires to the PCB assembly. In addition, there were problems such as the lead wires becoming disconnected when vibration or shock was applied to the current sensor.

[0008] In addition, conventional shunt resistance type current sensors often use parts such as bolts to securely connect the housing and cover while fixing busbars, PCB assemblies, etc., inside to prevent movement, which has problems such as requiring a separate process during the assembly of the current sensor and increasing costs. Prior art literature

[0010] Korean Patent Publication No. 10-1407664 (Date of publication: June 13, 2014) The problem to be solved

[0011] The objective of the present invention, which aims to solve the aforementioned problems, is to provide a shunt resistor type current sensor that can minimize assembly processes and material costs, minimize process risks, and improve cost competitiveness by firmly coupling a shunt resistor body, a PCB, a housing, and a cover in which a shunt resistor is disposed between busbars, without requiring the use of separate coupling members or separate coupling processes. means of solving the problem

[0013] The present invention, for solving the problem described above, comprises a shunt resistance type current sensor, wherein the housing has a receiving space formed therein with an open upper surface; a shunt resistor body including a pair of busbars spaced apart from each other and a shunt resistor positioned between the pair of busbars to connect the pair of busbars; a PCB assembly including a printed circuit board having a pair of insertion holes and a plurality of through holes formed therein, and measuring current by detecting the voltage across the shunt resistor; and a press-fit connector in which a pair of connecting pins protruding downward from the lower surface of a spacer part are coupled to the pair of busbars, and a pair of coupling pins protruding upward from the upper surface of the spacer part are coupled to the pair of insertion holes by a press-fit method. and a cover coupled to the housing to cover the receiving space; wherein the spacer is formed to have a predetermined length and a predetermined height, and the shunt resistor and the PCB assembly are received within the receiving space in a coupled state while being spaced apart from each other by the press-fit connector.

[0014] Here, the housing comprises: a pair of busbar penetrations formed to be open on both sides of the housing for a length equal to the width of the pair of busbars; and a pair of cantilever snap-fits extending upward from the lower surface of the housing and having a first protrusion formed on one side thereof; wherein, when the shunt resistor is received in the receiving space such that the outer end of the pair of busbars protrudes outward from the pair of busbar penetrations, the lower surface of the first protrusion of the pair of cantilever snap-fits engages with the upper surface of one side of the pair of busbars to prevent vertical movement of the shunt resistor.

[0015] Here, the housing comprises: a plurality of PCB support portions formed by extending upward from the lower portion of the housing to support the printed circuit board of the PCB assembly from below; and a plurality of coupling rods formed by extending upward from the center of the upper surface of the plurality of PCB support portions to be inserted into and coupled to the plurality of through holes of the printed circuit board; and the cover comprises a plurality of coupling rod coupling portions formed by extending downward from the inner upper surface of the cover; wherein the plurality of coupling rods penetrate the plurality of through holes of the printed circuit board and their upper portions are coupled and fixed to the plurality of coupling rod coupling portions, and the printed circuit board is characterized in that its lower portion is supported by the plurality of PCB support portions and its upper portion is restrained by the plurality of coupling rod coupling portions, thereby preventing movement of the printed circuit board.

[0016] Here, the plurality of connecting rods may be characterized by being connected by penetrating the plurality of through holes of the printed circuit board in a press fit manner.

[0017] Herein, the housing may further include a plurality of resin chip receiving portions formed on the upper surface of the plurality of PCB support portions so as to accommodate resin chips generated during the process in which the plurality of coupling rods penetrate and are coupled to the plurality of through holes of the printed circuit board in a press-fit manner.

[0018] Here, the invention may further include a stopper formed by extending from the lower surface and / or side surface of the housing, or by extending from the inner upper surface and / or side surface of the cover, so as to be inserted into a groove formed between the pair of busbars of the shunt resistor to prevent longitudinal movement of the shunt resistor.

[0019] Herein, the housing further includes a plurality of second protrusions formed on the side portion of the housing; and the cover further includes a plurality of sleeve-type snap-fits formed on the side portion of the cover and having coupling holes formed therein, and may be characterized in that the lower portion of the coupling hole engages with the lower portion of the second protrusion and is coupled to the housing. Effects of the invention

[0021] According to the shunt resistance type current sensor of the present invention, a shunt resistor body, a PCB, a housing, and a cover, in which a shunt resistor is disposed between busbars, are firmly coupled without the need for a separate coupling member or a separate coupling process, thereby minimizing coupling processes and material costs, minimizing process risks, and improving cost competitiveness. Brief explanation of the drawing

[0023] FIG. 1 is an exploded perspective view of a shunt resistance type current sensor according to one embodiment of the present invention, FIG. 2 is a perspective view showing a state in which a press-fit connector is coupled to the upper surface of a cent resistor. FIG. 3 is a drawing illustrating a cantilever snap-fit ​​of a housing, FIG. 4 is a drawing illustrating the PCB support and connecting rod of the housing, FIG. 5 is a drawing showing the connecting rod joint of the cover, FIG. 6 is a drawing illustrating a stopper formed on a cover, Figure 7 is a drawing showing the state in which the housing and the cover are joined by a sleeve-type snap-fit. Specific details for implementing the invention

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms; the embodiments provided are merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention.

[0025] The terms used herein are for describing the embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, actions, and / or elements to the mentioned components, steps, actions, and / or elements.

[0026] As used herein, terms such as “examples,” “examples,” “aspects,” “examples,” etc., are not to be interpreted as implying that any described aspect or design is superior or more advantageous than other aspects or designs.

[0027] Furthermore, the term 'or' refers to an inclusive or rather an exclusive or. That is, unless otherwise noted or is clear from the context, the expression 'x uses a or b' refers to any one of the natural inclusive permutations.

[0028] Additionally, singular expressions (“a” or “an”) used in this specification and claims should generally be interpreted to mean “one or more” unless otherwise stated or it is clear from the context that they relate to the singular form.

[0029] Additionally, terms such as "first," "second," etc., as used in this specification and claims may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0030] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0031] Meanwhile, in describing the present invention, if it is determined that a detailed description of related known functions or configurations could unnecessarily obscure the essence of the invention, such detailed description will be omitted. Furthermore, the terminology used in this specification is used to appropriately express embodiments of the present invention, and such terminology may vary depending on the intent of the user or operator, or the conventions of the field to which the invention belongs. Accordingly, the definitions of these terms should be based on the content throughout this specification.

[0033] Hereinafter, the configuration of a shunt resistance type current sensor according to one embodiment of the present invention will be described.

[0035] A shunt resistance type current sensor according to one embodiment of the present invention comprises a housing (10), a shunt resistor (20), a PCB assembly (30), a press-fit connector (40), and a cover (50).

[0036] FIG. 1 is an exploded perspective view of a shunt resistance type current sensor according to one embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which a press-fit connector is coupled to the upper surface of a shunt resistor.

[0038] The housing (10) is a component that functions as a case for housing and protecting a shunt resistor (20) and a PCB assembly (30) that are spaced apart from each other by a press-fit connector (40). A housing space with an open top surface is formed inside, and the shunt resistor (20), PCB assembly (30), and press-fit connector (40) are housed and fixed in the housing space.

[0040] The shunt resistor (20) is a component that enables the calculation of the current flowing through the shunt resistor (20) by measuring the voltage drop across the shunt resistor (22) placed between a pair of busbars (21) when current flows through the shunt resistor (20).

[0041] This shunt resistor (20) is configured to include a pair of busbars (21) and a shunt resistor (22) placed between the pair of busbars (21) to connect the pair of busbars (21).

[0043] The busbar (21) is a solid metal rod used to transmit current, and is generally made of copper or aluminum.

[0044] The shunt resistor (22) is a component placed between a pair of busbars (21) to connect between a pair of busbars (21), and is made of a metal material with a low resistance temperature coefficient, such as a copper-manganese-nickel alloy, a copper-nickel alloy, a nickel-chromium alloy, or an iron-chromium alloy.

[0045] These shunt resistors (22) can be combined with a pair of busbars (21) by welding.

[0046] A pair of busbars (21) have fastening holes formed therein. Through the fastening holes, one busbar (21) is connected to a terminal where current flows in, and the other busbar (21) is connected to a terminal where current flows out.

[0048] A PCB assembly (30) is a component that calculates the current value flowing through a shunt resistor (20) by measuring the voltage drop in a shunt resistor (22) placed between a pair of bus bars (21), and is configured to include a printed circuit board (31) having a pair of insertion holes (not shown) and a plurality of through holes formed therein, and circuit elements mounted on the printed circuit board (31).

[0049] A connector terminal for sending a signal for a measured current value to the outside may be installed on the printed circuit board (31).

[0050] In addition, to perform these functions, the printed circuit board (31) may be equipped with an A / D converter for converting a voltage drop value or a calculated current value generated in a shunt resistor (22) into a digital signal, a Controller Area Network (CAN) driver for transmitting and receiving data, a temperature sensor for measuring the temperature of the shunt resistor (22), a multiplexer for selecting one of a plurality of input signals and outputting a single output, and a microprocessor for control.

[0052] The press-fit connector (40) is a component that electrically connects a pair of bus bars (21) of the shunt resistor (20) and a pair of insertion holes (not shown) of the printed circuit board (31), respectively, while separating the shunt resistor (20) and the PCB assembly (30) at a predetermined distance.

[0053] This press-fit connector (40) may be configured to include a spacer portion (41), a pair of connecting pins (42), and a pair of coupling pins (43).

[0055] The spacer (41) is a part that functions to separate the shunt resistor (20) and the PCB assembly (30) at a predetermined distance, and is made of a non-conductive material having sufficient compressive strength.

[0056] In this embodiment, the spacer portion (41) is formed to have a predetermined length and a predetermined height.

[0057] A pair of connecting pins (42) and a pair of coupling pins (43) are coupled to the spacer (41), and the connecting pins (42) and coupling pins (43), which are arranged vertically, are formed from a single conductive metal member and are electrically connected to each other.

[0058] And, the distance between a pair of connecting pins (42) must be longer than the distance between a pair of bus bars (21).

[0059] Therefore, in order for a pair of connecting pins (42) to be installed on the lower surface of the spacer part (41), the spacer part (41) must be formed with a length greater than a predetermined length.

[0060] And, within the receiving space of the housing (10), the space to accommodate the shunt resistor (20) and the space to accommodate the PCB assembly (30) are limited by the shapes inside the housing (10) and the cover (50).

[0061] Therefore, since the shunt resistor (20) and PCB assembly (30) must be fixed at a predetermined distance within the housing (10), the spacer part (41) must be formed to have a predetermined height.

[0063] A pair of connecting pins (42) are components coupled to a pair of busbars (21) and can be formed to protrude downward from the lower surface of the spacer portion (41).

[0064] These pair of connecting pins (42) are formed from a conductive metal material and connected to a pair of busbars (21). When manufacturing the shunt resistor (20), the pair of connecting pins (42) of the press-fit connector (40) can be soldered to the pair of busbars (21) in advance so that the shunt resistor (20) and the press-fit connector (40) are connected.

[0065] However, the present invention is not necessarily limited thereto, and a press-fit connector (40) may be connected to a shunt resistor (20) by forming a pair of connecting holes of appropriate diameters in a pair of busbars (21) and then connecting a pair of connecting pins (42) to the pair of connecting holes in a press-fit manner.

[0067] A pair of connecting pins (43) are components that are connected to a pair of insertion holes (not shown) of a printed circuit board (31), and can be formed to protrude upward from the upper surface of the spacer portion (41).

[0068] These pair of connecting pins (43) are formed from a conductive metal material and can be inserted into a pair of insertion holes (not shown) of a printed circuit board (31) in a press-fit manner to be connected.

[0069] In this way, a pair of coupling pins (43) can be coupled to a pair of insertion holes (not shown) of a printed circuit board (31) by a press-fit method such as pushing them in with human force or lightly tapping them with a wooden hammer. Thus, when manufacturing a shunt resistance type current sensor according to the present invention, a pair of coupling pins (43) can be easily coupled to a pair of insertion holes (not shown) of a printed circuit board (31) by a person or a robot.

[0070] In addition, since no separate process such as soldering is required when combining the press-fit connector (40) and the PCB assembly (30), manufacturing costs and time can be saved, and the possibility of defects such as cold solder joints is reduced.

[0072] The cover (50) is a component that is combined with the housing (10) to cover the receiving space inside the housing (10).

[0073] The cover (50) is combined with the housing (10) and secures the shunt resistor (20) and PCB assembly (30) housed in the housing (10)'s internal space, thereby reducing the risk of failure caused by internal components shaking up, down, left, and right as the vehicle moves.

[0075] According to various embodiments, the housing (10) may include a pair of busbar penetrations (11) and a pair of cantilever snap-fits (12).

[0076] Figure 3 is a drawing illustrating a cantilever snap-fit ​​of a housing.

[0078] A pair of busbar penetration portions (11) are parts formed on both sides of the housing (10) to be open with a length equal to the width of the pair of busbars (21) so that when a shunt resistor (20) is received in the receiving space inside the housing (10), the movement of the pair of busbars (21) in the width direction is restricted.

[0079] Accordingly, when a shunt resistor (20) is received in a receiving space inside the housing (10) such that the outer ends of a pair of busbars (21) protrude to the outside of a pair of busbar penetrations (11) of the housing (10), the widthwise movement of the shunt resistor (20) is restricted by the pair of busbar penetrations (11).

[0081] A pair of cantilever snap-fits (12) are parts formed extending upward from the lower portion of the housing (10) to restrict the vertical movement of the shunt resistor (20).

[0082] And, as shown in FIG. 3, a first protrusion (12a) is formed on one side of this pair of cantilever snap-fits (12).

[0083] Accordingly, when the shunt resistor (20) is received in the receiving space inside the housing (10) such that the outer end of a pair of bus bars (21) protrudes outward from the pair of bus bar penetrations (11) of the housing (10), the lower portion of the first protrusion (12a) of a pair of cantilever snap-fits (12) engages with the upper portion of one side of the pair of bus bars (21), thereby preventing the shunt resistor (20) from moving up and down.

[0085] According to various embodiments, the housing (10) may be configured to include a plurality of PCB support members (14) and a plurality of connecting rods (15), and the cover (50) may be configured to include a plurality of connecting rod connecting members (55).

[0086] FIG. 4 is a drawing showing the PCB support portion and connecting rod of the housing, and FIG. 5 is a drawing showing the connecting rod connecting portion of the cover.

[0088] The PCB support portion (14) is a part that functions to support the lower portion of the printed circuit board (31) when the PCB assembly (30) is received in the receiving space inside the housing (10), and is formed by extending upward from the lower portion of the housing (10).

[0089] The PCB support (14) may be formed in the shape of a rectangular parallelepiped or a cylinder, but the present invention is not necessarily limited thereto, and as shown in FIG. 4, the PCB support (14) may also be formed in a shape in which four protrusions are formed in a vertical direction on the side of a large diameter cylinder.

[0091] A plurality of connecting rods (15) are components that function to prevent lateral movement of the printed circuit board (31) by penetrating through the through hole of the printed circuit board (31) of the PCB assembly (30) and connecting with the printed circuit board (31), and to allow the housing (10) to be connected with the cover (50), and are formed by extending upward from the center of the upper surface of a plurality of PCB support members (14).

[0092] These connecting rods (15) may be formed in the shape of a rectangular parallelepiped or a cylinder, but the present invention is not necessarily limited thereto, and as shown in FIG. 4, the connecting rods (15) may also be formed in a shape in which four protrusions are formed in a vertical direction on the side of the cylinder.

[0093] Four vertical protrusions formed on the side of the connecting rod (15) may be provided so that when the connecting rod (15) is coupled with the printed circuit board (31) while penetrating the through hole of the printed circuit board (31), the direction of the printed circuit board (31) can be maintained in a direction corresponding to the receiving space inside the housing (10).

[0094] Accordingly, if four vertical protrusions are provided on the side of the connecting rod (15), additional openings corresponding to the four vertical protrusions must also be formed on the side of the circular through hole of the printed circuit board (31).

[0096] A plurality of connecting rod connecting portions (55) are portions that are connected to the upper portions of a plurality of connecting rods (15) when the housing (10) and the cover (50) are connected, and are formed by extending downward from the inner upper surface of the cover (50).

[0097] This connecting rod connecting part (55) can be formed in the shape of a hollow pipe, and if four vertical protrusions are provided on the side of the connecting rod (15), as shown in FIG. 5, the connecting rod connecting part (55) is also formed to have an inner diameter that can be inserted and connected into the hollow part inside the connecting rod connecting part (55) up to the side of the four vertical protrusions of the connecting rod (15).

[0098] Accordingly, the plurality of connecting rods (15) of the housing (10) pass through the plurality of through holes of the printed circuit board (31), and the upper portions are connected to the plurality of connecting rod connecting portions (55) of the cover (50) to be fixed.

[0100] In this embodiment, the printed circuit board (31) of the PCB assembly (30) is restricted from moving in the vertical direction by the upper surface of the plurality of PCB support portions (14) of the housing (10) and the lower surface of the plurality of connecting rod connecting portions (55) of the cover (50).

[0101] That is, when the housing (10) and the cover (50) are combined, the lower surface of the printed circuit board (31) is supported by a plurality of PCB support members (14), and the upper surface of the printed circuit board (31) is restrained by the lower ends of a plurality of connecting rod members (55), thereby preventing vertical movement of the printed circuit board (31).

[0103] According to various embodiments, a plurality of connecting rods (15) of the housing (10) can be connected by passing through a plurality of through holes of the printed circuit board (31) in a press fit manner.

[0105] An interference fit is a joining method in which the shaft is slightly larger than the hole, so that the two parts are tightly joined and require significant force to disassemble them later.

[0106] In this embodiment, a plurality of connecting rods (15) of the housing (10) are connected by being inserted through a plurality of through holes of the printed circuit board (31) in a press fit manner. Since the strength of the printed circuit board (31) is higher than that of the plurality of connecting rods (15) of the housing (10), which are generally made of synthetic resin material, resin chips will be separated and fall off from the side portions of the plurality of connecting rods (15) when the two are connected.

[0107] In this way, as the multiple connecting rods (15) of the housing (10) are connected by passing through the multiple through holes of the printed circuit board (31) in a press-fit manner, the vertical movement of the printed circuit board (31) can be restricted solely by the frictional force between the multiple connecting rods (15) of the housing (10) and the multiple through holes of the printed circuit board (31).

[0108] Accordingly, when the housing (10) and the cover (50) are joined after the multiple connecting rods (15) of the housing (10) are passed through the through holes of the printed circuit board (31), the risk of the printed circuit board (31) being in a lifted state and the assembly being defective is reduced.

[0110] According to various embodiments, the housing (10) may further comprise a plurality of resin chip receiving portions (14a) formed on the upper surface of a plurality of PCB support portions (14).

[0112] As described above, when the plurality of connecting rods (15) of the housing (10) and the plurality of through holes of the printed circuit board (31) are connected by a press fit method, resin chips are separated and fall off from the side portions of the plurality of connecting rods (15).

[0113] These resin chips may be moved near the heat-generating elements provided in the PCB assembly (30) and heated, thereby fusing to the elements of the PCB assembly (30) or, in severe cases, causing a fire.

[0114] Accordingly, in order to reduce even slightly the phenomenon of resin chips separated from the coupling rod (15) moving to other locations, a plurality of resin chip receiving portions (14a) with an open upper surface are formed on the upper surface of a plurality of PCB support portions (14).

[0115] This resin chip receiving portion (14a) can be formed with an open upper surface in the upper surface portion excluding the upper surface center portion where the connecting rod (15) is formed on the upper surface portion of the PCB support portion (14).

[0116] Accordingly, generally, a resin chip receiving portion (14a) is formed in a concave ring shape in the upper surface portion of the cylindrical PCB support portion (14), excluding the upper surface central portion where the cylindrical connecting rod (15) is formed.

[0117] However, if the PCB support portion (14) is formed in a shape in which four protrusions are formed in a vertical direction on the side of a large diameter cylinder and the connecting rod (15) is formed in a shape in which four protrusions are formed in a vertical direction on the side of a cylinder, then, as shown in FIG. 4, the resin chip receiving portion (14a) may be formed in the shape of four concave straight grooves, etc.

[0119] According to various embodiments, a shunt resistance current sensor according to one embodiment of the present invention may further include a stopper (59).

[0120] Figure 6 is a drawing illustrating a stopper formed on a cover.

[0122] The stopper (59) is a component that functions to prevent longitudinal movement of the shunt resistor (20) by being inserted into a groove (29) formed between a pair of bus bars (21) of the shunt resistor (20), and may be formed by extending from the lower surface and / or side surface of the housing (10), or may be formed by extending from the inner upper surface and / or side surface of the cover (50).

[0123] FIG. 6 shows a stopper (59) formed protruding from the inner side portion of the cover (50), the upper side of FIG. 6 is a bottom view of the cover (50) seen from below, and the lower side of FIG. 6 is a view of the stopper (59) seen from the opposite direction to the direction in which the stopper (59) protrudes.

[0125] As shown in FIG. 2, a shunt resistor (22) is positioned between a pair of busbars (21) of a shunt resistor (20), and the width of the shunt resistor (22) is formed to be slightly narrower than the width of the pair of busbars (21), so that a groove (29) is formed concavely between the side portions of the pair of busbars (21).

[0126] Accordingly, when the housing (10) and the cover (50) are combined, a stopper formed extending from the lower surface and / or side surface of the housing (10) or a stopper (59) formed extending from the inner upper surface and / or side surface of the cover (50) is inserted into the groove (29) of the shunt resistor (20), thereby preventing longitudinal movement of the shunt resistor (20).

[0128] According to various embodiments, the housing (10) may be configured to further include a plurality of second protrusions (17), and the cover (50) may be configured to further include a plurality of sleeve-type snap-fits (57).

[0129] Figure 7 is a drawing showing the state in which the housing and the cover are joined by a sleeve-type snap-fit.

[0131] A plurality of second protrusions (17) are parts formed on the side of the housing (10) to engage with the coupling holes (57a) of a plurality of sleeve-type snap-fits (57).

[0132] And, a plurality of sleeve-type snap-fits (57) are formed on the side of the cover (50), and a coupling hole (57a) is formed in the plurality of sleeve-type snap-fits (57).

[0133] Generally, a plurality of second protrusions (17) are formed with a horizontal straight shape on the lower surface, and the coupling hole (57a) can be formed in the shape of a through hole with a horizontal straight shape on the lower surface.

[0134] Accordingly, the lower portion of the coupling hole (57a) engages with the lower portion of the second protrusion (17), thereby enabling the housing (10) and the cover (50) to be coupled.

[0136] According to the shunt resistance type current sensor of the present invention, the shunt resistor body, PCB, housing, and cover, in which a shunt resistor is disposed between busbars, are firmly coupled without the need for a separate coupling member or a separate coupling process, thereby having the advantage of minimizing coupling processes and material costs, minimizing process risks, and improving cost competitiveness.

[0138] Although the present invention has been described above with specific details such as specific components, limited embodiments, and drawings, this is provided merely to aid in a more comprehensive understanding of the invention, and the invention is not limited to the above embodiments.

[0139] Furthermore, those skilled in the art to which the present invention pertains will understand that other specific forms can be easily modified without altering the technical concept or essential features of the present invention, and the above-described embodiments should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may also be implemented in a combined form.

[0140] Accordingly, the concept of the present invention should not be limited to the embodiments described above, and should be interpreted as including not only the claims set forth below but also all forms modified equivalently or equivalently to the claims below within the scope of the rights of the present invention. Explanation of the symbols

[0142] 10: Housing 11: Busbar penetration 12: Cantilever snap-fit ​​12a: First protrusion (12a) 14: PCB support 14a: Resin chip receiving portion 15: Connecting rod 17: Second protrusion 20: Shunt resistor 21: Busbar 22: Shunt resistor 29: Home 30: PCB assembly 31: Printed circuit board 40: Press-fit connector 41: Spacer section 42: Connecting pin 43: Joining pin 50: Cover 55: Connecting rod connecting part 57: Sleeve-type snap fit 57a: Connecting hole 59: Stopper

Claims

Claim 1 A housing having a receiving space formed therein with an open upper surface; a shunt resistor comprising a pair of busbars spaced apart from each other and a shunt resistor positioned between the pair of busbars to connect the two of the busbars; a PCB assembly comprising a printed circuit board having a pair of insertion holes and a plurality of through holes formed therein, which detects the voltage across the shunt resistor to measure current; and a press-fit connector in which a pair of connecting pins protruding downward from the lower surface of a spacer part are coupled to the pair of busbars, and a pair of coupling pins protruding upward from the upper surface of a spacer part are coupled to the pair of insertion holes by a press-fit method. and a cover coupled to the housing to cover the receiving space; wherein the spacer portion is formed to have a predetermined length and a predetermined height, and the shunt resistor and the PCB assembly are received within the receiving space in a coupled state while being spaced apart from each other by the press-fit connector, and the housing includes a plurality of PCB support portions formed extending upward from the lower portion of the housing to support the printed circuit board of the PCB assembly from below; and a plurality of coupling rods formed extending upward from the center of the upper surface of the plurality of PCB support portions to be inserted into and coupled to the plurality of through holes of the printed circuit board; and the cover includes a plurality of coupling rod coupling portions formed extending downward from the inner upper surface of the cover;A shunt resistance type current sensor comprising: a plurality of coupling rods, wherein the plurality of coupling rods penetrate the plurality of through holes of the printed circuit board and their upper portions are fixedly coupled to the plurality of coupling rod coupling portions; wherein the printed circuit board has its lower portion supported by the plurality of PCB support portions and its upper portion restrained by the plurality of coupling rod coupling portions, thereby preventing movement of the printed circuit board; wherein the plurality of coupling rods penetrate and are coupled to the plurality of through holes of the printed circuit board in a press-fit manner; and wherein the housing further comprises a plurality of resin chip receiving portions formed on the upper portions of the plurality of PCB support portions so as to accommodate resin chips generated during the process in which the plurality of coupling rods penetrate and are coupled to the plurality of through holes of the printed circuit board in a press-fit manner. Claim 2 A shunt resistor current sensor according to claim 1, wherein the housing comprises: a pair of busbar penetrations formed to be open on both sides of the housing with a length equal to the width of the pair of busbars; and a pair of cantilever snap-fits extending upward from the lower surface of the housing and having a first protrusion formed on one side; wherein, when the shunt resistor is received in the receiving space such that the outer end of the pair of busbars protrudes outward from the pair of busbar penetrations, the lower surface of the first protrusion of the pair of cantilever snap-fits engages with the upper surface of one side of the pair of busbars so as to prevent vertical movement of the shunt resistor. Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 A shunt resistor current sensor according to claim 1, further comprising a stopper formed by extending from the lower surface or side surface of the housing, or by extending from the inner upper surface or side surface of the cover, so as to be inserted into a groove formed between the pair of busbars of the shunt resistor to prevent longitudinal movement of the shunt resistor. Claim 7 A shunt resistance type current sensor according to any one of claims 1, 2 and 6, wherein the housing further comprises a plurality of second protrusions formed on the side portion of the housing; and the cover further comprises a plurality of sleeve-type snap-fits formed on the side portion of the cover and having coupling holes formed therein, wherein the lower portion of the coupling hole engages with the lower portion of the second protrusion and is coupled to the housing.

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