Paddle and plating apparatus equipped with the paddle

Abstract

A paddle according to an embodiment is a paddle that flows a plating solution used for plating onto a substrate, and comprises a frame portion arranged parallel to the surface of the substrate; and a guide portion detachably coupled to the frame portion in a first direction and flowing the plating solution onto the surface of the substrate, wherein the guide portion comprises a bent portion formed at the center of a bent axis extending in the first direction.

Description

Technology Field

[0001] The embodiment relates to a paddle, and in particular to a paddle for the flow of an electroplating solution and a plating apparatus including the same. Background Technology

[0002] Conventional electroplating devices utilize a vertical and horizontal continuous plating method (VCP) to plate substrates through liquid circulation using nozzles, considering productivity. However, this vertical and horizontal continuous plating method has issues with plating quality.

[0003] Accordingly, batch-type electroplating devices are being used recently to improve the plating quality of substrates. While nozzles are sometimes used in these batch-type devices to circulate the plating solution, paddles are generally used to circulate the solution.

[0004] Here, general paddles have a cavity type or wing type structure, but most electroplating devices use wing type paddles, which have better plating solution circulation characteristics compared to cavity type, to circulate the plating solution.

[0005] The above wing-type paddle forms a slit using a rib made of thin metal or plastic material, and circulates the plating solution using the rib.

[0006] However, such conventional electroplating devices have a problem in that the ribs of the paddle bend during the process of moving the paddle to circulate the plating solution. Furthermore, if the ribs of the paddle bend, uniform circulation of the plating solution cannot be achieved, which may result in problems with the uniformity of the thickness of the plating layer formed on the substrate. The problem to be solved

[0007] In the embodiment, we aim to provide a paddle with a new structure that enables uniform circulation of the plating solution and improves the thickness uniformity of the plating layer formed on the substrate, and a plating apparatus including the same.

[0008] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below. means of solving the problem

[0009] A paddle according to an embodiment is a paddle that flows a plating solution used for plating onto a substrate, and comprises a frame portion arranged parallel to the surface of the substrate; and a guide portion detachably coupled to the frame portion in a first direction and flowing the plating solution onto the surface of the substrate, wherein the guide portion comprises a bent portion formed at the center of a bent axis extending in the first direction.

[0010] Additionally, the frame portion includes a first frame and a second frame that extend in a second direction perpendicular to the first direction and are spaced apart from each other in the first direction, and one end of the guide portion is coupled to the first frame and the other end of the guide portion is coupled to the second frame.

[0011] Additionally, the frame portion includes a coupling projection formed at one end, and at least one of the first frame and the second frame includes a first fixing portion into which the one end of the frame portion is inserted; and a second fixing portion into which the coupling projection is inserted.

[0012] In addition, the guide portion includes a first wing portion extending toward the surface of the substrate from the bend portion, and a second wing portion extending toward the substrate from the bend portion.

[0013] In addition, the first wing portion is positioned at an angle of inclination to the first frame or the second frame, and the angle of inclination is an internal angle between the first frame or the second frame and the end of the first wing portion, and the internal angle satisfies a range of 30° to 80°.

[0014] In addition, the bending angle of the above-mentioned bending portion satisfies a range of 90° to 170°, and the bending angle corresponds to the internal angle between the first wing portion and the second wing portion.

[0015] In addition, the width of the first wing portion is greater than the width of the second wing portion.

[0016] In addition, the width of the second wing portion is 30% to 80% of the width of the first wing portion.

[0017] In addition, the guide portion includes a plurality of guide portions, and the plurality of guide portions are spaced apart from each other in the second direction on the first frame and the second frame, and the spacing between the plurality of guide portions is 15 mm to 50 mm.

[0018] In addition, the inner surface of the bending portion connecting the inner surface of the first wing portion and the inner surface of the second wing portion includes a curved surface. Effects of the invention

[0019] The paddle according to the embodiment includes a guide portion. The guide portion includes a bent portion formed with the extension direction as the bending axis. Specifically, the guide portion may have an L-shape including the bent portion. Accordingly, in the embodiment, the rigidity of the guide portion can be secured, and the reliability problem caused by bending of the guide portion can be resolved. In addition, in the embodiment, since the guide portion may have a rigidity of a certain level or higher, the flow of the plating solution by the guide portion can be improved, and the plating reliability can be improved by ensuring that a uniform plating solution is supplied to the substrate.

[0020] In addition, the bent portion of the guide part according to the embodiment includes a curved surface. Accordingly, in the embodiment, the flow resistance of the plating solution can be minimized, and the flow force of the plating solution can be further improved. Brief explanation of the drawing

[0021] Fig. 1a is a front view of a paddle of a comparative example. Figure 1b is a plan view of the paddle of the comparative example. Figure 1c is a drawing illustrating the reliability problem of the guide part of the paddle of the comparative example. FIG. 2 is a schematic diagram showing a plating apparatus according to an embodiment. FIG. 3a is a perspective view of a paddle according to an embodiment. Figure 3b is an enlarged view of a specific area of ​​Figure 3a. Figure 4 is a perspective view of the guide portion of Figure 3a. FIG. 5a is a front view of a paddle according to an embodiment. FIG. 5b is a plan view of a paddle according to an embodiment. FIG. 5c is a diagram illustrating the flow of the plating solution by the guide portion of the paddle of an embodiment. FIG. 6 is a perspective view showing a guide portion of a paddle according to another embodiment. Figure 7 is a diagram illustrating the flow of the plating solution by the guide portion of the paddle in Figure 6. Specific details for implementing the invention

[0022] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" for components used in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate easy understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings and should be understood to include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.

[0023] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0024] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0025] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0026] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0028] Before describing the present embodiment, a comparative example that is compared with the present embodiment will be described.

[0029] FIG. 1a is a front view of a paddle of a comparative example, FIG. 1b is a top view of a paddle of a comparative example, and FIG. 1c is a drawing illustrating the reliability problem of the guide part of a paddle of a comparative example.

[0030] Referring to FIGS. 1a to 1c, the paddle (10) of the comparative example includes a frame portion (11) and a guide portion (12) coupled to the frame portion (11). A plurality of guide portions (12) are arranged on the frame portion (11) at mutually spaced intervals. The space between the plurality of guide portions (12) forms a slit, and a plating solution flows to a substrate (S) through the slit.

[0031] The paddle (10) of the comparative example described above is positioned on each side of the substrate (S) with the substrate (S) in between. That is, the paddle (10) includes a first paddle (10A) and a second paddle (10B). The second paddle (10B) is coupled to the first paddle (10A) at a position spaced apart by a certain distance. The substrate (S) is positioned in the spaced-apart space between the first paddle (10A) and the second paddle (10B). The first paddle (10A) flows the plating solution to one side of the substrate (S), and the second paddle (10B) flows the plating solution to the other side of the substrate (S).

[0032] The first paddle (10A) and the second paddle (10B) move around the direction of paddle movement to flow the plating solution within the plating tank (not shown).

[0033] At this time, the guide portion (12) of the paddle (10) as described above is formed of a thin metal or plastic material. Specifically, the guide portion (12) has a thin plate-like shape and is coupled to the frame portion (11).

[0034] However, with a guide part (12) having the shape as described above, there is a limit to increasing the flow rate of the plating solution, and consequently, there is a limit to improving the plating quality of the substrate (S). For example, the substrate (S) includes a via hole (not shown) having a certain depth, and the paddle (10) causes the plating solution to flow into the via hole of the substrate (S) so that a plating layer (e.g., via) is formed to fill the via hole. At this time, the quality of the plating layer is determined by the flow rate of the plating solution by the guide part (12) of the paddle (10). However, using a guide part (12) having a thin plate-like shape as described above, there is a limit to increasing the flow rate of the plating solution, and consequently, there is a limit to improving the quality of the plating layer.

[0035] Furthermore, the guide part (12) described above controls the flow of the plating solution when the paddle (10) moves along the direction of paddle movement, thereby causing the plating solution to flow to the substrate (S). At this time, as shown in FIG. 1c, when the guide part (12) moves in the direction of paddle movement, a problem may occur in which the guide part (12) bends due to pressure from the plating solution. And, if the guide part (12) bends, there is a problem in that the plating solution does not flow uniformly across the entire area of ​​the substrate (S). For example, if the guide part (12) bends, the plating solution flow becomes concentrated in a specific area among the entire area of ​​the substrate (S), and a problem with plating reliability occurs accordingly.

[0036] Accordingly, the embodiment aims to provide a paddle with a new structure and a plating apparatus including the same, which can maximize the flow of the plating solution while solving the bending problem of the guide part of the comparative example during paddle movement.

[0038] FIG. 2 is a schematic diagram showing a plating apparatus according to an embodiment.

[0039] Referring to FIG. 2, the plating device (100) can form a plating layer on a substrate (S) using a plating solution (114). For example, the plating device (100) may be a device for plating a circuit pattern (not shown) or a via (not shown) on a substrate (S) using a plating solution (114) containing copper.

[0040] The plating device (100) includes a plating tank (110).

[0041] And, the plating solution (114) can be contained within the plating tank (110). The plating tank (110) can maintain the plating solution (114) inside. The plating tank (110) may include a sub-plating tank (110). For example, the plating tank (110) may be called a main plating tank, and the main plating tank may include a sub-plating tank (110).

[0042] The sub-plating tank (112) may be formed on the outer side of the plating tank (110). For example, the sub-plating tank (112) may be formed on the upper outer side of the plating tank (110). The sub-plating tank (112) is formed to surround the perimeter of the upper outer side of the plating tank (110). The plating solution overflowing from the plating tank (110) may be contained in the sub-plating tank (112).

[0043] The plating device (100) may include a plating solution supply unit (116). For example, the plating device (100) may include a plating solution supply unit (116) formed on one side of the plating tank (110) to allow the plating solution (114) to be supplied into the plating tank (110).

[0044] Additionally, a plating solution supply path (112) may be located between the sub-plating tank (112) and the plating solution supply unit (116). The plating solution supply path (112) can supply the plating solution contained in the sub-plating tank (112) to the plating tank (110). To this end, the plating solution supply path (112) may be equipped with a pump (120). The pump (112) can supply the plating solution contained in the sub-plating tank (112), which overflows from the plating tank (110), back into the plating tank (110). At this time, a temperature maintenance unit (130) and a filter unit (140) may be arranged in the plating solution supply path (112). The temperature maintenance unit (130) can control the temperature of the plating solution supplied into the plating tank (110) through the plating solution supply path (112). For example, the temperature maintenance unit (130) can control the temperature of the plating solution flowing through the plating solution supply line (112) to the same temperature as the plating solution contained in the plating tank (110). Additionally, the filter unit (140) can remove foreign substances contained in the plating solution flowing through the plating solution supply line (112). That is, the plating solution overflowing from the plating tank (110) is contained in the plating solution supply line (112), and foreign substances may be included during the process of the plating solution overflowing. Therefore, the filter unit (140) can perform a filtering function to remove foreign substances contained in the plating solution being supplied back to the plating tank (110).

[0045] The plating device (100) includes a substrate mounting part (150) on which a substrate (S) is mounted. The substrate (S) can be detachably disposed on the substrate mounting part (150).

[0046] The plating device (100) includes an anode (162). The anode (162) is mounted on an anode mounting portion (160) and may be located within the plating tank (110). The anode (162) may be made of copper containing phosphorus, but is not limited thereto.

[0047] The plating device (100) includes a power supply unit (170). The power supply unit (170) is positioned between an anode mounting unit (160) and a substrate mounting unit (150) and can be electrically connected to them. Preferably, the power supply unit (170) can be electrically connected to an anode (162) mounted on the anode mounting unit (160) and a substrate (S) mounted on the substrate mounting unit (150), respectively. Then, current applied through the power supply unit (170) can be supplied to the substrate (S), thereby forming a plating layer (not shown) on the substrate (S). That is, the anode (162) can be connected to the positive electrode of the power supply unit (170), and the substrate mounting unit (150) and the substrate (S) can be connected to the negative electrode of the power supply unit.

[0048] Meanwhile, the plating device (100) includes a paddle (200) positioned parallel to the surface of the substrate (S). At this time, the paddle (200) may include a first paddle (200A) and a second paddle (200B). The first paddle (200A) and the second paddle (200B) may be positioned spaced apart at a certain distance within the plating tank (110). Furthermore, the substrate mounting part (150) and the substrate (S) may be positioned between the first paddle (200A) and the second paddle (200B). Accordingly, the first paddle (200A) may be positioned facing one side of the substrate (S), and the second paddle (200B) may be positioned facing the other side of the substrate (S). However, the embodiments are not limited thereto and may include only one paddle positioned facing one or the other side of the substrate (S).

[0049] The first paddle (200A) can reciprocate parallel to one side of the substrate (S), thereby enabling uniform supply of the plating solution (114) to one side of the substrate (S). Additionally, the second paddle (200B) can reciprocate parallel to the other side of the substrate (S), thereby enabling uniform supply of the plating solution (114) to the other side of the substrate (S).

[0050] The paddle (200) in the embodiment can increase the flow force of the plating solution (114) toward the substrate (S) and enable a more uniform flow of the plating solution (114). To this end, the paddle (200) includes a guide portion (described later) that guides the flow of the plating solution (114). The guide portion may include a bent portion (described later) that is bent with respect to a first direction (or vertical direction or vertical direction) as an axis. For example, the guide portion may have an 'L' shape. In the embodiment, the guide portion is made to have an 'L' shape including a bent portion so that the flow force of the plating solution (114) by the guide portion can be increased while ensuring the rigidity of the guide portion. This will be explained in more detail below.

[0051] Additionally, the plating device (100) may include an adjustment plate (180). The adjustment plate (180) may be positioned between the paddle (200) and the anode (162). The adjustment plate (180) may be a dielectric. The adjustment plate (180) may cause a uniform potential distribution to appear over the entire surface of the substrate (S).

[0053] FIG. 3a is a perspective view of a paddle according to an embodiment, FIG. 3b is an enlarged view of a specific area of ​​FIG. 3a, FIG. 4 is a perspective view of a guide portion of FIG. 3a, FIG. 5a is a front view of a paddle according to an embodiment, FIG. 5b is a plan view of a paddle according to an embodiment, and FIG. 5c is a drawing for explaining the flow of a plating solution by the guide portion of a paddle according to an embodiment. Hereinafter, a paddle according to an embodiment will be described in detail with reference to FIG. 3a to FIG. 5c.

[0054] The paddle (200) includes a first paddle (200A) and a second paddle (200B).

[0055] The first paddle (200A) may be positioned facing the first surface (S1) of the substrate (S). For example, the first paddle (200A) may be positioned parallel to the first surface (S1) of the substrate (S). Here, the first surface (S1) may be the upper or lower surface of the substrate (S). That is, the substrate (S) may be positioned in a vertically upright state within the plating tank (110), and the first paddle (200A) may be positioned parallel to the first surface (S1) of the vertically upright substrate (S).

[0056] The second paddle (200B) may be positioned facing the second surface (S2) of the substrate (S). For example, the second paddle (200B) may be positioned parallel to the second surface (S2) of the substrate (S). The second surface (S2) may be the opposite side of the first surface (S1), for example, the bottom surface or the top surface.

[0057] The first paddle (200A) and the second paddle (200B) may each include a frame portion. Specifically, the first paddle (200A) may include a first frame portion (210A). Additionally, the second paddle (200B) may include a second frame portion (210B). The first frame portion (210A) and the second frame portion (210) may have the same shape or structure as each other. Furthermore, the paddle (200) may include a third frame portion (210C) that mutually connects the first paddle (200A) and the second paddle (200B). That is, the first frame part (210A) may be a first mounting frame on which the first guide part (300A) is mounted, the second frame part (210B) may be a second mounting frame on which the second guide part (300B) is mounted, and the third frame part (210C) may be a coupling frame for mutually coupling the first frame part (210A) and the second frame part (210B). Meanwhile, since the first paddle (200A) and the second paddle (200B) in the embodiment have the same structure, only one of them will be described below. The frame part below may refer to either the first frame part (210A) or the second frame part (210B). Additionally, the guide part (300) below may refer to either the first guide part (300A) mounted on the first frame part (210A) or the second guide part (300B) mounted on the second frame part (210B).

[0058] The frame portion may include an opening (not shown). And, the guide portion (300) may be disposed in the opening of the frame portion. The guide portion (300) may be mounted or fixed to the frame portion.

[0059] The above frame portion may include a plurality of frames surrounding the opening. For example, the frame portion may include a first frame (211), a second frame (212), a third frame (213), and a fourth frame (214). The first frame (211) may be referred to as an upper frame, the second frame (212) as a lower frame, the third frame (213) as a left frame, and the fourth frame (214) as a right frame. The first frame (211), the second frame (212), the third frame (213), and the fourth frame (214) may be connected or combined with each other.

[0060] The first frame (211) and the second frame (212) are each extended in the x-axis direction, the horizontal direction, or the horizontal direction, and may be spaced apart from each other in the vertical direction, the vertical direction, or the z-axis direction.

[0061] The third frame (213) and the fourth frame (214) are each extended in the vertical direction or the vertical direction or the z-axis direction, and may be spaced apart from each other in the x-axis direction or the horizontal direction or the horizontal direction.

[0062] One end of the first frame (211) may be connected to one end of the third frame (213), and one end of the fourth frame (214) may be connected to the other end of the first frame (211). Additionally, the other end of the third frame (213) may be connected to one end of the second frame (212), and the other end of the fourth frame (214) may be connected to the other end of the second frame (212).

[0063] The guide portion (300) can be detachably mounted to the frame portion. Specifically, one end of the guide portion (300) may be connected to the first frame (211), and the other end may be connected to the second frame (212).

[0064] To this end, the guide portion (300) may have a connecting projection (310) formed at each end. The connecting projection (310) may be implemented, for example, as a bolt. For example, a screw thread may be formed on the outer surface of the connecting projection (310). Additionally, the first frame (211) and the second frame (212) may each include a fixing portion (220, 230) to which the guide portion (300) is mounted or fixed. Specifically, each of the first frame (211) and the second frame (212) may include a first fixing portion (220) into which the end of the guide portion (300) is inserted. The first fixing portion (220) may be a recess that does not penetrate the first frame (211) and the second frame (212), but is not limited thereto. The guide portion (300) can be fixed in position as its end is fitted into the first fixing portion (220). Additionally, each of the first frame (211) and the second frame (212) may include a second fixing portion (230) into which a coupling projection (310) formed on the guide portion (300) is fitted. The second fixing portion (230) may be a through hole penetrating the first frame (211) and the second frame (212), respectively. Accordingly, the coupling projection (310) of the guide portion (300) can be firmly mounted or fixed to the frame portion through a separate fixing member (not shown), such as a nut, while inserted into the through hole corresponding to the second fixing portion (230).

[0065] The guide portion (300) may include a bend portion (301). For example, the guide portion (300) may include a bend portion (301) formed around an axis corresponding to the extension direction of the guide portion (300). For example, in FIG. 5a, the bend portion (301) may be formed around a central axis corresponding to the vertical direction. Specifically, the guide portion (300) may include a bend portion (301) that is bent around the vertical axis in FIG. 5a. Accordingly, the guide portion (300) may have a horizontal L-shape.

[0066] The guide portion (300) may be divided into a first wing portion (302) and a second wing portion (303) centered on the bend portion (301). The first wing portion (302) of the guide portion (300) may extend toward the substrate (S). For example, the first wing portion (302) of the guide portion (300) may be bent in a direction closer to one side (S1) or the other side (S2) of the substrate (S) centered on the bend portion (301). For example, the second wing portion (303) of the guide portion (300) may be bent in a direction further away from the substrate (S). Meanwhile, in the drawing, the bending angle of the bend portion (301) between the first wing portion (302) and the second wing portion (303) is shown as 90°, but is not limited thereto. However, if the bending angle is less than 90°, it may affect the flow of the plating solution (114) by the guide part (300), so it is preferable that the bending angle be greater than 90°. Preferably, the bending angle may be an internal angle between the first wing part (302) and the second wing part (303). And, the internal angle between the first wing part (302) and the second wing part (303) may be 90° to 170°.

[0067] In the embodiment, the guide portion (300) is configured to include a bend portion (301), thereby allowing it to be divided into a first wing portion (302) and a second wing portion (303), so as to increase the flow rate of the plating solution (114) while ensuring the rigidity of the guide portion (300). That is, in the comparative example, only the first wing portion (302) of the guide portion (300) of the embodiment was included. In contrast, in the embodiment, the guide portion (300) is configured to include a second wing portion (303) that is bent and extended from the first wing portion (302) with the bend portion (301) as the center, so as to ensure the rigidity of the guide portion (300). Furthermore, in the embodiment, as the rigidity of the guide portion (300) is ensured, the flow rate of the plating solution (114) by the guide portion (300) can be increased. Meanwhile, in the embodiment, the first wing portion (302) of the guide portion (300) serves to flow the plating solution (114) to the surface of the substrate (S), and the second wing portion (303) can serve to supply the plating solution (114) present on the outside of the paddle (200) to the first wing portion (302) while increasing the rigidity of the guide portion (300).

[0068] Meanwhile, the first wing portion (302) of the guide portion (300) may be positioned toward the substrate (S) with an angle of inclination (θ) to the frame portion. The angle of inclination (θ) may be an inward angle between one end of the first wing portion (302) and the first frame (201) or the second frame (202). The angle of inclination (θ) may be 30° to 80°. For example, the angle of inclination (θ) may be 35° to 75°. For example, the angle of inclination (θ) may be 40° to 70°. If the angle of inclination (θ) is less than 30°, the flow distance of the plating solution (114) flowing through the first wing portion (302) may be reduced. That is, if the inclination angle (θ) is less than 30°, the distance between the substrate (S) and the first wing portion (302) must be reduced in order to flow the plating solution (114) to the substrate (S) through the first wing portion (302), and a reliability problem may occur due to contact between the first wing portion (302) and the surface of the substrate (S). In addition, if the inclination angle (θ) is greater than 80°, the power required to reciprocate the paddle (200) may increase, and the power consumption may increase accordingly.

[0069] Additionally, the thickness (T) of the first wing portion (302) and the second wing portion (303) of the guide portion (300) may be 1 mm to 3 mm. For example, the thickness of the first wing portion (302) and the second wing portion (303) of the guide portion (300) may be 1.5 mm to 2.5 mm. For example, the thickness of the first wing portion (302) and the second wing portion (303) of the guide portion (300) may be 1.5 mm to 2 mm. If the thickness of the first wing portion (302) and the second wing portion (303) of the guide portion (300) is less than 1 mm, bending may occur during the reciprocating motion of the paddle (200). If the thickness of the first wing portion (302) and the second wing portion (303) of the guide portion (300) is greater than 3mm, the weight of the paddle (200) may increase, and the overall volume of the plating device (100) may increase accordingly.

[0070] Additionally, the width of the guide portion (300) may be 8mm to 25mm. For example, the width of the guide portion (300) may be 10mm to 20mm. For example, the width of the guide portion (300) may be 10mm to 15mm. The width of the guide portion (300) may be the sum of the width (W1) of the first wing portion (302) and the width (W2) of the second wing portion (303). If the width of the guide portion (300) is smaller than 8mm, sufficient flow of the plating solution (114) may not be secured. Additionally, if the width of the guide portion (300) is larger than 25mm, the unit price of the paddle may increase due to the increase in the material cost of the guide portion (300). In addition, if the width of the guide portion (300) is greater than 25mm, the power required to reciprocate the paddle (200) may increase, and the power consumption may increase accordingly.

[0071] Meanwhile, in the embodiment, the first wing portion (302) may have a first width (W1). Additionally, the second wing portion (303) may have a second width (W2) different from the first width (W1). Specifically, the first wing portion (302) may have a first width (W1) that is greater than the second width (W2) of the second wing portion (303). Accordingly, in the embodiment, the flow force of the plating solution (114) can be increased through the first wing portion (302), while securing an appropriate level of rigidity that the guide portion (300) must have. At this time, the second width (W2) may be 30% to 80% of the first width (W1). For example, the second width (W2) may be 35% to 70% of the first width (W1). For example, the second width (W2) may be 45% to 55% of the first width (W1). If the second width (W2) is smaller than 30% of the first width (W1), the rigidity of the guide portion (300) by the second wing portion (303) is not sufficiently secured, and bending of the guide portion (300) may occur. If the second width (W2) is larger than 80% of the first width (W1), the flow direction of the plating solution (114) by the guide portion (300) may change, and consequently, a uniform plating solution (114) may not be supplied to the substrate (S).

[0072] Accordingly, in the embodiment, as shown in FIG. 5b, the plating solution on the first outer side of the paddle (200) can be moved to the inner side of the paddle (200) (or the direction in which the first wing portion (302A) is located) by the second wing portion (303A) of the first guide portion (300A) of the first paddle (200A), and can be supplied to one side (S1) of the substrate (S) by the first wing portion (302A) of the first guide portion (300A). Additionally, the plating solution on the second outer side of the paddle (200) can be moved to the inner side of the paddle (200) (or the direction in which the first wing portion (302B) is located) by the second wing portion (303B) of the second guide portion (300B) of the second paddle (200B), and can be supplied to the other side (S2) of the substrate (S) by the first wing portion (302B) of the second guide portion (300B).

[0073] Meanwhile, the guide section (300) may be composed of a plurality of guide sections. For example, a plurality of guide sections (300) may be arranged in the frame section at a mutually spaced interval. Additionally, the spaced interval between the plurality of guide sections may form a slit. The slit may be an inflow space for the plating solution (114) located outside the paddle (200) to flow into the area where the substrate (S) is located. At this time, the spacing (P) between the plurality of guide sections may be 15 mm to 50 mm. For example, the spacing (P) between the plurality of guide sections may be 17 mm to 40 mm. For example, the spacing (P) between the plurality of guide sections may be 20 mm to 30 mm. Here, the spacing (P) between the plurality of guide sections may also be defined by the width of the slit. If the spacing (P) between the plurality of guide parts is smaller than 15 mm, a problem may occur in which the plating solution (114) does not flow sufficiently toward the substrate (S). Additionally, if the spacing (P) between the plurality of guide parts is larger than 50 mm, the uniformity of the plating solution supplied to the substrate (S) by the guide part (300) may be reduced.

[0074] Meanwhile, as shown in FIG. 5c, the bend portion (301) between the first wing portion (302) and the second wing portion (303) of the guide portion (300) may be at a right angle, and accordingly, the bend portion (301) may have an edge. In this case, the flow rate of the plating solution provided toward the first wing portion (302) through the second wing portion (303) may be reduced by the edge of the bend portion (301). In other words, if the bend portion (301) is at a right angle including an edge, the flow resistance of the plating solution (114) may increase. Accordingly, in the embodiment, the flow resistance of the plating solution (114) can be minimized.

[0076] FIG. 6 is a perspective view showing a guide portion of a paddle according to another embodiment, and FIG. 7 is a drawing for explaining the flow of a plating solution by the guide portion of the paddle of FIG. 6.

[0077] Referring to FIGS. 6 and FIGS. 7, the guide portion (400) includes a bend portion (401), a first wing portion (402), and a second wing portion (403). At this time, the guide portion (400) of FIG. 6 is substantially identical to the guide portion (300) of FIG. 4 except for the bend portion (401), and accordingly, only the bend portion (401) will be described.

[0078] The guide section (300) of FIG. 4 has a bending section (301) connecting the first wing section (302) and the second wing section (303) formed as a vertical surface having an edge, and the flow resistance is increased accordingly, thereby reducing the flow force of the plating solution.

[0079] Alternatively, the guide portion (400) of FIG. 6 may have a rounded shape in which the bend portion (401) connecting the first wing portion (402) and the second wing portion (403) does not include an edge. For example, the bend portion (401) may include a curved surface. That is, the bend portion (401) may connect the first wing portion (402) and the second wing portion (403) with a curved surface. For example, the inner surface of the bend portion (401) connecting the inner surface of the first wing portion (402) and the inner surface of the second wing portion (403) may include a curved surface.

[0080] Accordingly, in the embodiment, the bending portion (401) is formed as a rounded curved surface, thereby minimizing flow resistance and further improving the flow of the plating solution.

[0082] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the embodiments.

[0083] Although the above description has focused on the embodiments, this is merely an example and is not intended to limit the embodiments. A person skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For instance, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

Claim 1 A paddle for flowing a plating solution used for plating onto a substrate, comprising: a frame portion arranged parallel to the surface of the substrate; and a guide portion detachably coupled to the frame portion in a first direction and flowing the plating solution onto the surface of the substrate, wherein the guide portion comprises a bend portion formed around a bend axis extending in the first direction, wherein the guide portion comprises a first wing portion extending toward the surface of the substrate from the bend portion and a second wing portion extending away from the substrate from the bend portion, and wherein the inner surface of the bend portion connecting the inner surface of the first wing portion and the inner surface of the second wing portion comprises a curved surface. Claim 2 In claim 1, the frame portion extends in a second direction perpendicular to the first direction and includes a first frame and a second frame spaced apart from each other in the first direction, and one end of the guide portion is coupled to the first frame and the other end of the guide portion is coupled to the second frame, a paddle. Claim 3 In paragraph 2, the guide portion includes a coupling projection formed at one end, and at least one of the first frame and the second frame includes a first fixing portion into which the one end of the guide portion is inserted; and a second fixing portion into which the coupling projection of the guide portion is inserted. Claim 4 delete Claim 5 In paragraph 2, the first wing portion is positioned with respect to the first frame or the second frame at an angle of inclination, the angle of inclination is an internal angle between the first frame or the second frame and the end of the first wing portion, and the internal angle satisfies a range of 30° to 80°, a paddle. Claim 6 In claim 5, the bending angle of the above-mentioned bending portion satisfies the range of 90° to 170°, and the bending angle corresponds to the inner angle between the first wing portion and the second wing portion, paddle. Claim 7 In paragraph 5, the width of the first wing portion is greater than the width of the second wing portion, a paddle. Claim 8 In claim 7, the width of the second wing portion is 30% to 80% of the width of the first wing portion, a paddle. Claim 9 In paragraph 2, the guide portion comprises a plurality of guide portions, the plurality of guide portions are spaced apart from each other in the second direction on the first frame and the second frame, and the spacing between the plurality of guide portions is 15 mm to 50 mm, a paddle. Claim 10 delete Claim 11 A plating apparatus comprising: a plating tank containing a plating solution; an anode connected to the positive electrode of a power supply unit; a substrate connected to the negative electrode of a power supply unit; a paddle included in any one of claims 1 to 3 and claims 5 to 9, which is arranged parallel to the substrate and reciprocates in a direction parallel to the substrate to supply the plating solution to the surface of the substrate.

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