Device capable of selective transmission of frequency signals and how to design them

Abstract

The present invention is a device capable of selectively transmitting a frequency signal, comprising: first and second PCB substrates stacked vertically; at least one transmission line located on at least one of the first and second PCB substrates to transmit a frequency signal; a ground layer provided between the first and second PCB substrates; and a plurality of ports connected to the transmission line and the ground layer to apply the frequency signal or receive the frequency signal. The ground layer includes a frequency selector that allows the frequency signal to be selectively transmitted to the transmission line. Through this, a signal can be frequency-selectively transmitted in a stacked PCB substrate without using vias.

Description

Technology Field

[0001] The present invention relates to a device capable of selectively transmitting frequency signals based on a PCB substrate with a stacked structure, and a method for designing the same. Background Technology

[0002] Devices and circuits using PCB boards are classified into cases where the PCB is single-layer and cases where it is stacked.

[0003] First, in the case of a single-layer PCB, the direction of signal flow is limited because there is only one PCB substrate.

[0004] On the other hand, when PCBs are stacked, there are cases where a signal must be transmitted from one substrate to another.

[0005] And because inserting vias between the upper and lower substrates to provide electrical connections between different layers is the most representative method, vias are one of the essential elements in manufacturing PCBs.

[0006] These vias cannot select frequency signals and have the characteristic of transmitting across all frequency bands when a specific signal is applied.

[0007] In addition, vias have the problem of interference occurring between vias placed at different locations. Interference between vias is caused by various factors such as the spacing between vias, the spacing between transmission lines, and the frequency of the signal, and generally, the effect of interference increases as the frequency increases.

[0008] In addition, when the size of the PCB must be minimized, there is a problem that unwanted interference occurs due to the spacing between transmission lines and vias.

[0009] Therefore, there is a need for a method to frequency-selectively transmit signals without using vias on a stacked PCB substrate. Prior art literature

[0010] Korean Registered Patent Publication No. 10-0945289 The problem to be solved

[0011] The present invention was devised to solve the above-mentioned problems, and the objective of the present invention is to provide a device capable of selectively transmitting frequency signals without using vias in a stacked PCB substrate, and a method for designing the same. means of solving the problem

[0012] A device capable of selectively transmitting a frequency signal according to an embodiment of the present invention for achieving the above objective comprises: first and second PCB substrates stacked vertically; at least one transmission line located on at least one of the first and second PCB substrates to transmit a frequency signal; a ground layer provided between the first and second PCB substrates; and a plurality of ports connected to the transmission line and the ground layer to apply the frequency signal or receive the frequency signal, wherein the ground layer includes a frequency selection unit that allows the frequency signal to be selectively transmitted to the transmission line.

[0013] And the frequency selection unit may be at least one metastructure having a size and shape corresponding to the frequency band of the frequency signal, formed on one side of the ground layer facing the first PCB substrate.

[0014] In addition, when the first transmission line and the second transmission line are arranged parallel to each other on the first PCB substrate, a plurality of meta structures may be arranged continuously in the longitudinal direction of the first transmission line and the second transmission line at a position between the first transmission line and the second transmission line.

[0015] And a first transmission line is disposed on the first PCB substrate and a second transmission line is disposed on the second PCB substrate, and when the first transmission line and the second transmission line receive a frequency signal of the same frequency band, the first transmission line and the second transmission line are each disposed to partially overlap in the longitudinal direction when projected onto the ground layer, and the meta structure may be formed to include an area in which the first transmission line and the second transmission line mutually overlap.

[0016] In addition, a first transmission line and a second transmission line are arranged parallel to each other on the first PCB substrate, and a third transmission line and a fourth transmission line are arranged opposite to the first transmission line and the second transmission line, respectively, on the second PCB substrate to form pairs with the first transmission line and the second transmission line, respectively. When the first transmission line and the second transmission line receive frequency signals of different frequency bands and a pair of transmission lines receive frequency signals of the same frequency band, the pair of transmission lines are arranged to partially overlap in the longitudinal direction when projected onto a ground layer, and the meta structure may be formed such that the first meta structure, which is formed to include an area where the first transmission line and the third transmission line mutually overlap, and the second meta structure, which is formed to include an area where the second transmission line and the fourth transmission line mutually overlap, have different sizes.

[0017] And a first transmission line is disposed on the first PCB substrate and a second transmission line is disposed on the second PCB substrate, and when the first transmission line and the second transmission line receive frequency signals of different frequency bands, the first transmission line and the second transmission line are each disposed such that when projected onto the ground layer, they are orthogonal and the projected areas overlap each other, and the meta structure may be formed to include an area where the first transmission line and the second transmission line overlap each other.

[0018] Meanwhile, a method for designing a device capable of selectively transmitting a frequency signal according to an embodiment of the present invention for achieving the above objective comprises: a step of providing first and second PCB substrates stacked vertically; a step of providing at least one transmission line located on at least one of the first and second PCB substrates to transmit a frequency signal; a step of providing a ground layer between the first and second PCB substrates; and a step of providing a plurality of ports connected to the transmission line and the ground layer, which apply the frequency signal or receive the frequency signal, wherein the ground layer includes a frequency selection unit that allows the frequency signal to be selectively transmitted to the transmission line on the ground layer.

[0019] And the frequency selection unit may be at least one metastructure having a size and shape corresponding to the frequency band of the frequency signal, formed on one side of the ground layer facing the first PCB substrate.

[0020] In addition, when the first transmission line and the second transmission line are arranged parallel to each other on the first PCB substrate, a plurality of meta structures may be arranged continuously in the longitudinal direction of the first transmission line and the second transmission line at a position between the first transmission line and the second transmission line.

[0021] And a first transmission line is disposed on the first PCB substrate and a second transmission line is disposed on the second PCB substrate, and when the first transmission line and the second transmission line receive a frequency signal of the same frequency band, the first transmission line and the second transmission line are each disposed to partially overlap in the longitudinal direction when projected onto the ground layer, and the meta structure may be disposed to include an area in which the first transmission line and the second transmission line mutually overlap.

[0022] In addition, a first transmission line and a second transmission line are arranged parallel to each other on the first PCB substrate, and a third transmission line and a fourth transmission line are arranged opposite to the first transmission line and the second transmission line, respectively, on the second PCB substrate to form pairs with the first transmission line and the second transmission line, respectively. When the first transmission line and the second transmission line receive frequency signals of different frequency bands and a pair of transmission lines receive frequency signals of the same frequency band, the pair of transmission lines are arranged to partially overlap in the longitudinal direction when projected onto a ground layer, and the meta structure includes a first meta structure arranged to include an area where the first transmission line and the third transmission line overlap each other, and a second meta structure arranged to include an area where the second transmission line and the fourth transmission line overlap each other, and the sizes of the first meta structure and the second meta structure may be formed differently.

[0023] And a first transmission line is disposed on the first PCB substrate and a second transmission line is disposed on the second PCB substrate, and when the first transmission line and the second transmission line receive frequency signals of different frequency bands, the first transmission line and the second transmission line are each disposed such that when projected onto the ground layer, they are orthogonal and the projected areas overlap each other, and the meta structure may be disposed such that the meta structure includes an area where the first transmission line and the second transmission line overlap each other. Effects of the invention

[0024] According to one aspect of the present invention described above, by providing a device capable of selectively transmitting a frequency signal and a method for designing the same, a signal can be frequency-selectively transmitted without using vias in a stacked PCB substrate. Brief explanation of the drawing

[0025] FIG. 1 is a drawing for explaining an apparatus according to a first embodiment of the present invention, FIG. 2 is a diagram illustrating that the device of FIG. 1 selectively transmits a frequency signal through a metastructure. FIG. 3 is a drawing for explaining an apparatus according to a second embodiment of the present invention, FIG. 4 is a diagram illustrating that the device of FIG. 3 selectively transmits a frequency signal through a metastructure. FIG. 5 is a drawing for explaining an apparatus according to a third embodiment of the present invention, FIG. 6 is a graph for explaining the effect of the device shown in FIG. 5, FIG. 7 is a drawing for explaining an apparatus according to a fourth embodiment of the present invention, FIG. 8 is a graph for explaining the effect of the device shown in FIG. 7, FIG. 9 is a drawing for explaining an apparatus according to a fifth embodiment of the present invention, FIGS. 10 to 13 are graphs for explaining the effects of the device illustrated in FIG. 9, and, FIG. 14 is a flowchart illustrating a method for designing a device according to one embodiment of the present invention. Specific details for implementing the invention

[0026] The following detailed description of the invention refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that various embodiments of the invention are different but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. It should also be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Accordingly, the following detailed description is not intended to be limiting, and the scope of the invention is limited only by the appended claims, including all equivalents to those claimed therein, provided they are appropriately described. Similar reference numerals in the drawings refer to the same or similar functions across various aspects.

[0027] The components according to the present invention are defined by functional distinction rather than physical distinction, and can be defined by the functions each performs. Each component may be implemented as hardware or as program code and processing units that perform each function, and the functions of two or more components may be included and implemented in a single component. Therefore, it should be noted that the names assigned to the components in the following embodiments are not intended to physically distinguish each component but are assigned to imply the representative function performed by each component, and that the technical concept of the present invention is not limited by the names of the components.

[0028] The device of the present invention can be configured to transmit signals frequency-selectively without using vias in a stacked PCB substrate.

[0029] To this end, the device according to the various embodiments illustrated in FIGS. 1 to 13 may include a first PCB substrate (110), a second PCB substrate (120), a transmission line (130), a ground layer (140), and a port (150).

[0030] The first PCB substrate (110) and the second PCB substrate (120) can be arranged to be stacked vertically.

[0031] Meanwhile, at least one transmission line (130) is provided for transmitting frequency signals.

[0032] And the transmission line (130) may be located on at least one of the first PCB substrate (110) and the second PCB substrate (120).

[0033] In addition, the transmission line (130) according to the present embodiment can receive a frequency signal from the port (150) or transmit a frequency signal to the port (150).

[0034] At least one of these transmission lines (130) can be provided as microstrip-to-microstrips of a stacked structure PCB.

[0035] In addition, for a PCB structure of two or more layers, the ground layer (140) described later is omitted, and the transmission line (130) may be a CPW (Co-Planar Waveguide) structure rather than the entire ground layer (140), and may be provided as a microstrip-to-CPW or CPW-to-CPW.

[0036] Meanwhile, the ground layer (140) can be provided between the first PCB substrate (110) and the second PCB substrate (120).

[0037] And the ground layer (140) according to the present embodiment may include a frequency selection unit (160).

[0038] The frequency selection unit (160) according to the present embodiment may be provided to selectively transmit a frequency signal to the transmission line (130).

[0039] And the frequency selection unit (160) according to the present embodiment may be formed on one side of the ground layer (140) facing the first PCB substrate (110).

[0040] Additionally, the frequency selection unit (160) may be provided with at least one metastructure having a size and shape corresponding to the frequency band of the frequency signal.

[0041] The shape of such meta-structure (160) may be provided as at least one of a slot, SRR (Split Ring Resonators), CSRR (Complementary Split Ring Resonators), and DGS (Defected Ground Structure), but is not limited thereto.

[0042] And the meta structure (160) can be provided by etching (defect) on the ground layer (140) as shown in FIGS. 1 to 9.

[0043] Meanwhile, the port (150) may be provided in multiple numbers and may be connected to the transmission line (130) and the ground layer (140).

[0044] These ports (150) may apply the received frequency signal to the transmission line (130) or receive and output the frequency signal.

[0045] And the port (130) may be provided as a bidirectional port capable of both input and output.

[0046] Preferred embodiments of the present invention will be described in more detail below with reference to the drawings.

[0047] FIG. 1 is a drawing for explaining a device (100) according to a first embodiment of the present invention, and FIG. 2 is a drawing for explaining that the device (100) of FIG. 1 selectively transmits a frequency signal through a meta structure (160).

[0048] The device (100) illustrated in FIG. 1 is a device according to a first embodiment, wherein the first embodiment is a case in which a first transmission line (130-1) and a second transmission line (130-2) that transmit different frequency signals are arranged parallel to each other on a substrate.

[0049] In the case of this first embodiment, a plurality of meta structures (160) are provided and can be arranged continuously along the longitudinal direction of the first transmission line (130-1) and the second transmission line (130-2) at a position between the first transmission line (130-1) and the second transmission line (130-2) as shown in FIG. 1.

[0050] In addition, the metastructure (160) of the device (100) according to the first embodiment may be provided as a CSRR as shown in FIG. 1 and FIG. 2.

[0051] When the meta structure (160) is arranged as in the first embodiment, the frequency signal applied from the first port (150-1) can be output to the second port (150-2) through the first transmission line (130-1).

[0052] At this time, the frequency signal applied to the first transmission line (130-1) is absorbed by the meta structure (160) on the ground layer (140) as shown in FIG. 2, so that it does not interfere with the second transmission line (130-2).

[0053] That is, the frequency signal applied to the first transmission line (130-1) through the meta structure (160), which is the frequency selection unit (160), can be selectively transmitted only to the third port (150-3).

[0055] Meanwhile, FIG. 3 is a drawing for explaining a device (100) according to a second embodiment of the present invention, and FIG. 4 is a drawing for explaining that the device (100) of FIG. 3 selectively transmits a frequency signal through a meta structure (160).

[0056] The device (100) according to the second embodiment is configured to omit vias and transmit signals between specific transmission lines through a meta structure (160) and to improve isolation between specific transmission lines when transmission lines are arranged in parallel facing each other on the first PCB substrate (110) and the second PCB substrate (120) in a stacked structure.

[0057] As a specific example, this is the case of a second embodiment in which a first transmission line (130-1) and a second transmission line (130-2) are arranged parallel to each other on a first PCB substrate (110) as shown in FIG. 3, and a third transmission line (130-3) and a fourth transmission line (130-4) are arranged opposite to the first transmission line (130-1) and the second transmission line (130-2) respectively on a second PCB substrate (120) and are paired with the first transmission line (130-1) and the second transmission line (130-2) respectively.

[0058] According to the second embodiment, when the first transmission line (130-1) and the second transmission line (130-2) receive frequency signals of different frequency bands, and a pair of transmission lines (130-1 and 130-3 / 130-2 and 130-4) receive frequency signals of the same frequency band,

[0059] The paired transmission lines (130-1 and 130-3 / 130-2 and 130-4) can be arranged so as to partially overlap in the longitudinal direction when projected onto the ground layer (140) as in FIG. 3.

[0060] And the meta structure (160) according to the second embodiment may include a first meta structure (160-1) and a second meta structure (160-2) of different sizes.

[0061] The first metastructure (160-1) may be formed to include an area in which the first transmission line (130-1) and the third transmission line (130-3) overlap each other.

[0062] Meanwhile, the second meta structure (160-2) may be formed to include an area where the second transmission line (130-2) and the fourth transmission line (130-4) overlap each other.

[0063] More specifically, FIG. 3 is an example of a case where the frequency band of a frequency signal to be transmitted from the first transmission line (130-1) to the third transmission line (130-3) and the frequency band of a frequency signal to be transmitted from the second transmission line (130-2) to the fourth transmission line (130-4) are different, and FIG. 4 is a diagram briefly illustrating that the frequency signal applied to the first transmission line (130-1) cannot interfere with the fourth transmission line (130-4).

[0064] In the case of this second embodiment, if a frequency selector (160) is used that includes a first metastructure (160-1) and a second metastructure (160-2) of different sizes with different resonant frequencies, a frequency signal applied to the first port (150-1) can be transmitted to the second port (150-2) through the first transmission line (130-1) and the second transmission line (130-2).

[0065] On the other hand, signal transmission interference from the frequency signal applied to the first port (150-1) to the third port (150-3) and the fourth port (150-4) can be minimized.

[0066] This is because the first metastructure (160-1) and the second metastructure (160-2) have different resonant frequencies since they are provided with different sizes.

[0068] Meanwhile, FIG. 5 is a drawing for explaining a device (100) according to a third embodiment of the present invention, and FIG. 6 is a graph for explaining the effect of the device (100) shown in FIG. 5.

[0069] The device (100) according to the third embodiment has a first transmission line (130-1) disposed on a first PCB substrate (110) and a second transmission line (130-2) disposed on a second PCB substrate (120), wherein the first transmission line (130-1) and the second transmission line (130-2) receive a frequency signal of the same frequency band.

[0070] In this case, as illustrated in FIG. 5, in the device (100) according to the third embodiment, the first port (150-1) is connected to the first transmission line (130-1) and the ground layer (140), and the second port (150-2) can be connected to the ground layer (140) and the second transmission line (130-2).

[0071] And the first transmission line (130-1) and the second transmission line (130-2) can each be arranged to partially overlap in the longitudinal direction when projected onto the ground layer (140).

[0072] In this third embodiment, the meta structure (160) may be formed to include an area where the first transmission line (130-1) and the second transmission line (130-2) overlap each other.

[0073] FIG. 6 is a graph showing S-parameters in a device (100) according to a third embodiment, and the meta-structure (160) shown in FIG. 5 is a structure capable of transmitting frequency signals when the first transmission line (130-1) and the second transmission line (130-2) are arranged in parallel facing each other.

[0074] As shown in FIG. 6, the shape and size of the meta structure (160) shown in FIG. 5 can be confirmed to have an isolation of -50dB or less in the corresponding frequency band.

[0075] Specifically, S21, represented by a dotted line in FIG. 6, is a graph showing how much of the corresponding frequency signal is transmitted to the second port (150-2) when the frequency signal is applied to the first port (150-1). Through FIG. 6, it can be seen that S21 is close to 0dB, which indicates that the entire frequency can pass through without loss.

[0076] Meanwhile, S11, represented by a solid line, is a graph that allows verification of whether a frequency signal returns to the first port (150-1) when applied to the first port (150-1). Through FIG. 6, it can be seen that S11 drops to -10dB or lower, indicating that the frequency signal passes through almost entirely without reflection.

[0078] Meanwhile, FIG. 7 is a drawing for explaining a device (100) according to a fourth embodiment of the present invention, and FIG. 8 is a graph for explaining the effect of the device (100) shown in FIG. 7.

[0079] The device (100) according to the fourth embodiment has a first transmission line (130-1) disposed on a first PCB substrate (110) and a second transmission line (130-2) disposed on a second PCB substrate (120), wherein the first transmission line (130-1) and the second transmission line receive frequency signals of different frequency bands.

[0080] In this case, as shown in FIG. 7, the first port (150-1) is connected to the second transmission line (130-2) and the ground layer (140), and the second port (150-2) can be connected to the ground layer (140) and the first transmission line (130-1).

[0081] And the first transmission line (130-1) and the second transmission line (130-2) can be arranged so that when projected onto the ground layer (140), they are orthogonal and the projected areas overlap each other.

[0082] In this fourth embodiment, the meta structure (160) may be formed to include an area where the first transmission line (130-1) and the second transmission line (130-2) overlap each other, as in FIG. 7.

[0083] FIG. 8 is a graph illustrating the relationship between the first port (150-1) and the second port (150-2) in the device (160) according to the fourth embodiment. The meta-structure (160) shown in FIG. 7 is a structure that prevents the transmission of frequency signals when the first transmission line (130-1) and the second transmission line (130-2) are arranged to be orthogonal to each other.

[0084] As shown in FIG. 8, the shape and size of the meta structure (160) shown in FIG. 7 can be seen to have an isolation of -20dB or less in the corresponding frequency band, which means that the transmission of frequency signals is impossible.

[0085] Specifically, in Fig. 8, the solid line represents S11, and the dotted line represents S21.

[0086] Therefore, through S11, when the corresponding frequency signal is applied from the first port (150-1), the degree of return to the first port (150-1) is close to 0dB, so total reflection occurs, and through S21, when the corresponding frequency signal is applied from the first port (150-1), the degree of transmission to the second port (150-2) is close to -20dB, so transmission of the corresponding frequency signal is impossible.

[0087] Accordingly, in the device (100) according to the present embodiment, when the first transmission line (130-1) and the second transmission line (130-2) are projected onto the ground layer (140), they are arranged to partially overlap in the longitudinal direction as shown in FIG. 5 or are arranged to be orthogonal to each other as shown in FIG. 7, the frequency signal may be transmitted or blocked depending on the shape of the metastructure (160).

[0088] Through this, frequency signals can be selectively transmitted by arranging the size and shape of the meta structure (160) differently according to the arrangement of various transmission lines (130).

[0090] FIG. 9 is a drawing for explaining a device (100) according to a fifth embodiment of the present invention, and FIGS. 10 to 13 are graphs for explaining the effects of the device (100) shown in FIG. 9.

[0091] The device (100) according to the fifth embodiment illustrated in FIG. 9 is a specific embodiment for selectively transmitting frequency signals without additional components by arranging transmission lines (130) parallel to each other in the longitudinal direction or orthogonally, as illustrated in FIG. 5 and FIG. 7.

[0092] The metastructure of the device (100) according to this fifth embodiment may be provided with slots and CSRRs as shown in FIG. 9.

[0093] In the device (100) according to the fifth embodiment, a first transmission line (130-1) is disposed on a first PCB substrate (110), and a second transmission line (130-2) and a third transmission line (130-3) may be provided on a second PCB substrate (120).

[0094] At this time, among the metastructure (160) of the device (100) according to the fifth embodiment, a slot is provided for coupling the first transmission line (130-1) and the second transmission line (130-2), and a CSRR may be provided for coupling the first transmission line (130-1) and the third transmission line (130-3).

[0095] To this end, the first port (150-1) is connected to the first transmission line (130-1) and the ground layer (140), the second port (150-2) is connected to the ground layer (140) and the second transmission line (130-2), and the third port (150-3) can be connected to the ground layer (140) and the third transmission line (130-3).

[0096] For a more specific explanation, the device (100) according to the fifth embodiment illustrated in FIG. 9 will be described as an example in which a frequency signal A having a frequency band of 1 GHz to 20 GHz is applied.

[0097] If signal A is applied to the first port (150-1), it is transmitted to the CSRR through the first transmission line (130-1). Since the CSRR has the characteristic of resonating at a specific frequency, the CSRR resonance frequency within the frequency range of signal A can be transmitted to the third port (150-3) through the third transmission line (130-3).

[0098] And signal A, which has passed through the CSRR via the first transmission line (130-1), can be transmitted to the second port (150-2) via the second transmission line (130-2) through a slot that resonates at a specific frequency.

[0099] FIG. 10 is a diagram showing S11 (reflection coefficient) when viewed from the first port (150-1), and through FIG. 10, it can be seen that resonance of various ranges occurs.

[0100] In this case, in the fifth embodiment, the first port (150-1) and the second port (150-2) are coupled through a slot having a resonant value in the C-band.

[0101] The relationship between the first port (150-1) and the second port (150-2) according to this fifth embodiment is as shown in FIG. 11. In FIG. 11, S11 and S22 are reflection coefficients at the first port (150-1) and the second port (150-2), respectively, and S21 represents the transmission coefficient.

[0102] As shown in FIG. 11, in the device (100) according to the fifth embodiment, it can be seen that S11 and S22 in the 4.1GHz to 9.3GHz band are -10dB or less. At this time, since the transmission coefficient S21 is close to 0dB, it can be confirmed that the frequency signal is transmitted without loss in the 4.1GHz to 9.3GHz range.

[0103] Meanwhile, it can be confirmed that S22, unlike S11, does not resonate in the band above 15 GHz, and S21 is also found to be -30 dB or lower at 18 GHz to 19 GHz.

[0104] Therefore, it can be seen that the second and third resonances of S11 were not caused by the slot.

[0105] Meanwhile, FIG. 12 is a graph showing the relationship between the first port (150-1) and the third port (150-3). Unlike S11, S33 does not resonate at the resonant frequency of the slot, and S31 also shows that it is almost impermeable to -30dB or less.

[0106] On the other hand, in FIG. 12, S33 and S11 exhibit the same characteristics at 18 GHz to 19 GHz, which corresponds to the resonant frequency of the CSRR according to the fifth embodiment, and it can be confirmed that S31 also has only a loss of -1.3 dB.

[0107] FIG. 13 is a graph showing the S32 values, and through FIG. 13, it can be seen that the second port (150-2) and the third port (150-3) have a pattern of -30dB or less in each resonant frequency band and do not affect each other.

[0108] Accordingly, the device (100) according to the present embodiment has the advantage of being able to selectively transmit frequency signals and stably obtain isolation and transmittance between each port when etching on the ground layer (140) by adjusting the size and shape of the meta structure according to the required band on a PCB substrate of a stacked structure.

[0109] In particular, the device (100) according to the present embodiment can omit vias, which also enables miniaturization of the device, and since the meta structure is etched on the ground layer (140), no additional process is required to form vias, which has the advantage of being easy to manufacture for PCB production.

[0110] In the above description, the slot and CSRR are combined in a meta structure (160), but this is merely an example for convenience of explanation and is not limited thereto.

[0112] Meanwhile, FIG. 14 is a flowchart illustrating a method for designing a device according to one embodiment of the present invention.

[0113] The design method according to the present embodiment is a method for designing a device capable of selectively transmitting frequency signals, and includes the steps of providing first and second PCB substrates (S110), providing a transmission line (S130), providing a ground layer (S150), and providing a plurality of ports (S170).

[0114] In the step (S110) of providing the first and second PCB substrates, the first PCB substrate (110) and the second PCB substrate (120) that are stacked vertically can be provided.

[0115] In the step of providing a transmission line (S130), at least one transmission line (130) that transmits a frequency signal can be placed on at least one of the first PCB board (110) and the second PCB board (120).

[0116] In the step of providing a ground layer (S150), a ground layer (140) can be placed and connected between the first PCB substrate (110) and the second PCB substrate (120).

[0117] This ground layer (140) may include a frequency selection unit (160) that allows a frequency signal to be selectively transmitted to a transmission line (130).

[0118] To this end, the frequency selection unit (160) may be formed on one side of the ground layer (140) facing the first PCB substrate (110) and may be at least one metastructure having a size and shape corresponding to the frequency band of the frequency signal.

[0119] And when the first transmission line (130-1) and the second transmission line (130-2) are arranged parallel to each other on the first PCB substrate (110), a plurality of meta structures (160) can be arranged continuously along the longitudinal direction of the first transmission line (130-1) and the second transmission line (130-2) at a position between the first transmission line (130-1) and the second transmission line (130-2).

[0120] If a first transmission line (130-1) is placed on a first PCB substrate (110) and a second transmission line (130-2) is placed on a second PCB substrate (120), and the first transmission line (130-1) and the second transmission line (130-2) receive a frequency signal of the same frequency band, the first transmission line (130-1) and the second transmission line (130-2) may be arranged so as to partially overlap in the longitudinal direction when projected onto a ground layer (140).

[0121] At this time, the meta structure (160) may be arranged to include an area where the first transmission line (130-1) and the second transmission line (130-2) overlap each other.

[0122] Meanwhile, a first transmission line (130-1) and a second transmission line (130-2) are arranged parallel to each other on a first PCB substrate (110), and a third transmission line (130-3) and a fourth transmission line (130-4) are arranged opposite to the first transmission line (130-1) and the second transmission line (130-2) respectively on a second PCB substrate (120) and form pairs with the first transmission line (130-1) and the second transmission line (130-2), respectively; and when the first transmission line (130-1) and the second transmission line (130-2) receive frequency signals of different frequency bands, and a pair of transmission lines (130-1 and 130-3 / 130-2 and 130-4) receive frequency signals of the same frequency band, the paired transmission lines (130-1 and 130-3 / 130-2 and 130-4) can be arranged so as to partially overlap in the longitudinal direction when projected onto the ground layer (140).

[0123] At this time, the meta structure (160) can be arranged such that the first meta structure (160-1), which is arranged to include an area where the first transmission line (130-1) and the third transmission line (130-3) overlap each other, and the second meta structure (160-2), which is arranged to include an area where the second transmission line (130-2) and the fourth transmission line (130-4) overlap each other, are formed with different sizes.

[0124] On the other hand, a first transmission line (130-1) is placed on a first PCB substrate (110) and a second transmission line (130-2) is placed on a second PCB substrate (120). When the first transmission line (130-1) and the second transmission line (130-2) receive frequency signals of different frequency bands, the first transmission line (130-1) and the second transmission line (130-2) can be arranged such that when projected onto a ground layer (140), they are orthogonal and the projected areas overlap each other.

[0125] At this time, the meta structure (160) may be arranged to include an area where the first transmission line (130-1) and the second transmission line (130-2) overlap each other.

[0126] Meanwhile, in the step (S170) of providing a plurality of ports according to the present embodiment, a plurality of ports (150) that apply a frequency signal or receive a frequency signal are provided, and each port (150) can be connected to a transmission line (130) and a ground layer (140).

[0127] Although various embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above. It is understood that various modifications can be made by those skilled in the art without departing from the essence of the invention as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present invention. Explanation of the symbols

[0128] 100: Device 110: First PCB board 120: 2nd PCB board 130: Transmission line 140 : Ground layer 150 : Port

Claims

Claim 1 First and second PCB substrates stacked vertically; and at least one transmission line located on at least one of the first and second PCB substrates to transmit a frequency signal; and a ground layer provided between the first and second PCB substrates to allow vias for electrical connection between the first and second PCB substrates to be omitted; and a plurality of ports connected to the transmission line and the ground layer, and applying the frequency signal or receiving the frequency signal;The ground layer comprises a frequency selection unit that selectively transmits the frequency signal to the transmission line, wherein the frequency selection unit is formed on one surface of the ground layer facing the first PCB substrate and includes at least one meta-structure having a size and shape corresponding to the frequency band of the frequency signal, wherein a first transmission line and a second transmission line are arranged parallel to each other on the first PCB substrate, and a third transmission line and a fourth transmission line are arranged on the second PCB substrate opposite to the first transmission line and the second transmission line, respectively, and form pairs with the first transmission line and the second transmission line, respectively, wherein the first transmission line and the second transmission line receive frequency signals of different frequency bands, and a pair of transmission lines receive frequency signals of the same frequency band, wherein the pair of transmission lines are arranged to partially overlap in the longitudinal direction when projected onto the ground layer, and the at least one meta-structure is provided by etching on the ground layer and is formed to include a region in which the first transmission line and the third transmission line mutually overlap. A device capable of selectively transmitting a frequency signal, comprising a second metastructure formed to include a region in which the second transmission line and the fourth transmission line mutually overlap, wherein the first metastructure and the second metastructure are formed with different sizes to have different resonant frequencies, and wherein the first resonant frequency corresponds to the frequency band of the frequency signal transmitted from the first transmission line to the third transmission line and the second resonant frequency corresponds to the frequency band of the frequency signal transmitted from the second transmission line to the fourth transmission line. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 A method for designing a device capable of selectively transmitting a frequency signal comprises: providing first and second PCB substrates stacked vertically; providing at least one transmission line located on at least one of the first and second PCB substrates to transmit a frequency signal; and providing a ground layer provided between the first and second PCB substrates such that vias for electrical connection between the first and second PCB substrates can be omitted.The method includes the step of providing a plurality of ports connected to the transmission line and the ground layer, for applying the frequency signal or receiving the frequency signal, wherein the ground layer includes a frequency selection unit that selectively transmits the frequency signal to the transmission line on the ground layer, and the frequency selection unit includes at least one meta-structure having a size and shape corresponding to the frequency band of the frequency signal, formed on one surface of the ground layer facing the first PCB substrate, wherein a first transmission line and a second transmission line are arranged parallel to each other on the first PCB substrate, and a third transmission line and a fourth transmission line are arranged on the second PCB substrate opposite to the first transmission line and the second transmission line, respectively, and form pairs with the first transmission line and the second transmission line, respectively, wherein the first transmission line and the second transmission line receive frequency signals of different frequency bands, and a pair of transmission lines receive frequency signals of the same frequency band, wherein the pair of transmission lines are arranged to partially overlap in the longitudinal direction when projected onto the ground layer, and the at least one meta-structure is the ground A design method comprising a first meta-structure formed to include an area in which the first transmission line and the third transmission line mutually overlap, and a second meta-structure formed to include an area in which the second transmission line and the fourth transmission line mutually overlap, wherein the first meta-structure and the second meta-structure are formed to have different sizes so as to have different resonant frequencies, and are formed to have a first resonant frequency corresponding to the frequency band of a frequency signal transmitted from the first transmission line to the third transmission line and a second resonant frequency corresponding to the frequency band of a frequency signal transmitted from the second transmission line to the fourth transmission line. Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 delete

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