High frequency output device and invasive tip therefor
The invasive tip's mechanical structure and cap protection address damage and excessive penetration issues, ensuring stable and pain-free high-frequency skin treatment with integrated functionality.
Patent Information
- Application Number
- KR1020240121868
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2026-11-05
- Estimated Expiration
- 2044-09-06
AI Technical Summary
Existing invasive tips with micro-needles are prone to damage from external forces and have issues with excessive penetration depth, leading to pain and bleeding during high-frequency skin treatment procedures.
The invasive tip features a mechanical structure with a bracket that can move vertically within a housing, limiting needle exposure and penetration depth, and includes a cap to protect the needles during transport and use, along with a double substrate structure for shock mitigation and electrical insulation.
The design prevents micro-needle damage, stabilizes needle placement, limits excessive penetration, and reduces pain and bleeding, while allowing for various functional applications like high-frequency treatment and information processing.
Smart Images

Figure 112024098440713-PAT00003_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to an invasive tip that is detachably attached to a handpiece of a high-frequency output device, and more specifically, to an invasive tip that penetrates into the skin to irradiate high-frequency energy while having a mechanical structure capable of protecting the needle from shock or external force during operation. Background Technology
[0002] With the advancement of medicine, various devices for performing skin care using various energy sources have been disclosed. Among them is a high-frequency output device that delivers high-frequency energy beneath the skin to raise the internal temperature of the skin, thereby reorganizing the collagen layer and obtaining various effects such as improving skin elasticity and wrinkles.
[0003] Treatment using high-frequency output devices includes a non-invasive method in which a non-invasive high-frequency electrode is brought into contact with the skin surface and high-frequency current is irradiated into the skin, and an invasive method in which a needle-shaped invasive electrode is inserted into the skin and high-frequency current is directly delivered into the skin.
[0004] Among them, the invasive tip used in the invasive method utilizes micro-needles of a fine diameter to minimize pain and bleeding during the procedure. Due to their fine diameter, these micro-needles have low durability and carry the risk of easily breaking or deforming if they collide with other components within the invasive tip or are exposed to external forces during operation.
[0005] In addition, since excessive insertion of microneedles into the skin during the procedure can cause unnecessary pain and bleeding, a method to mechanically limit the depth of microneedle penetration is also required. Prior art literature
[65535] Republic of Korea Published Patent Application No. 10-2019-0141043 (Published Dec. 23, 2019) The problem to be solved
[0006] The technical problem to be solved through the embodiments of the present invention is to provide an invasive tip equipped with a mechanical structure capable of protecting micro-needles from shock or external force during operation.
[0007] Another technical problem to be solved through the embodiments of the present invention is to provide an invasive tip that can prevent excessive pain and bleeding during the procedure by mechanically limiting the excessive depth of insertion of micro-needles when they penetrate the skin.
[0008] The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem
[0009] An invasive tip according to embodiments of the present invention for solving the above technical problem comprises a substrate, a needle array extending from a first surface of the substrate, one or more conductive pins extending from a second surface of the substrate, a bracket supporting the substrate and guiding the one or more conductive pins, and a housing that accommodates the bracket internally, has a plurality of through holes formed at one end facing the first surface, and a side wall formed between the one end and the other end surrounding the needle array, wherein the side wall has the shape of an inclined surface in which the cross-sectional area decreases from a first point on the side wall to the one end, the substrate includes wiring that electrically conducts to the one or more conductive pins to the needle array, electrical energy provided to the one or more conductive pins is distributed to the needle array via the wiring, the plurality of through holes are formed to be aligned with the needle array, the bracket is configured to be vertically movable within the housing, and depending on the vertical movement of the bracket, the needle array is exposed to the outside of the housing by passing through the through holes or is housed inside the housing. When the above bracket is raised, the height of the rise of the above bracket may be limited by the side wall on which the inclined surface is formed.
[0010] In one embodiment, the device further includes a cap coupled to the housing to cover one end of the housing, and when the cap is coupled to the housing, a predetermined gap may be formed between the outer surface of the housing where the through hole is formed and the inner surface of the cap.
[0011] In one embodiment, a protruding ridge having a predetermined height is formed on the edge of the outer surface of the housing, and a step opposite to the protruding ridge is formed on the inner surface of the cap, and when the cap is coupled to the housing, the protruding ridge comes into contact with the step to form the gap.
[0012] In one embodiment, the cap includes one or more legs extending in the longitudinal direction, a stopper is formed at one position of the one or more legs, and one or more trench grooves are formed on the side wall of the housing, and when the cap is coupled to the housing, the stopper of the one or more legs is inserted into the one or more trench grooves to secure the cap to the housing.
[0013] In one embodiment, the one or more conductive pins include a first conductive pin located at a first point on the substrate and a second conductive pin located at a second point facing the first point on the substrate, wherein the first conductive pin is electrically connected to one or more first needles of the needle array and the second conductive pin may be electrically connected to one or more second needles of the needle array that are different from the first needle.
[0014] In one embodiment, the substrate includes a first substrate to which the needle array is fixed, and a second substrate disposed adjacent to the first substrate, and an insulating layer may be inserted between the first substrate and the second substrate.
[0015] In one embodiment, a semiconductor chip is mounted on the second substrate, the first substrate has a first wiring routed inside, the second substrate has a second wiring routed inside, and the one or more conductive pins may include a first conductive pin electrically connected to the first wiring and a third conductive pin electrically connected to the second wiring.
[0016] In one embodiment, the bracket further includes an alignment plate having a hole formed therein that supports the bottom surface of the bracket, the alignment plate is coupled to the interior of the housing, and the bracket can be accommodated in the space between the alignment plate and the inner wall of the housing, which is partitioned by the alignment plate.
[0017] In one embodiment, the bracket further includes a lifting projection extending from the bottom surface, and the lifting projection may extend toward the other end of the housing by penetrating the hole of the alignment plate.
[0018] A high-frequency output device according to embodiments of the present invention for solving the above technical problem comprises a main body that generates high-frequency energy and a handpiece that receives high-frequency energy from the main body and transmits it to an invasive tip, wherein the invasive tip comprises a substrate, a needle array extending from a first surface of the substrate, one or more conductive pins extending from a second surface of the substrate, a bracket that supports the substrate and guides the one or more conductive pins, and a housing that accommodates the bracket internally, has a plurality of through holes formed at one end facing the first surface, and a side wall formed between the one end and the other end that surrounds the needle array, wherein the side wall has the shape of an inclined surface in which the cross-sectional area decreases from a first point on the side wall to the one end, wherein the substrate comprises wiring that electrically conducts to the one or more conductive pins to the needle array, and electrical energy provided to the one or more conductive pins is distributed to the needle array via the wiring, wherein the plurality of through holes are formed to be aligned with the needle array, and the bracket is configured to be vertically movable within the housing, and Depending on the raising and lowering of the bracket, the needle array may be exposed to the outside of the housing by penetrating the through hole or housed inside the housing, and the handpiece may include an electrical circuit that provides high-frequency energy to one or more conductive pins, and a pressurizing part that generates a mechanical force to raise or lower the substrate within the housing. Effects of the invention
[0019] According to the embodiments of the present invention described above, by attaching a cap to a tip end where the micro-needle may be exposed, damage to the micro-needle by external force can be prevented. At this time, a predetermined gap (or space) is formed between the housing and the cap to minimize damage caused by the micro-needle striking the inner surface of the cap placed over the housing.
[0020] According to this mechanical structure, even if the micro-needles protrude out of the housing due to some shaking or external impact during the shipping, transportation, or storage of the invasive tip, the micro-needles can be protected from damage by the cap.
[0021] In addition, the invasive tip according to the present invention provides a structure in which the micro-needles are stably housed within the housing by accommodating the micro-needles in a space partitioned by the housing and the alignment plate, and by manufacturing the side wall of the housing in a shape having an inclined surface, when the micro-needles penetrate the skin (i.e., when the needles rise within the housing), if they penetrate beyond a certain depth, the bracket surrounding the micro-needles comes into contact with the side wall to prevent further penetration, thereby limiting the penetration depth of the micro-needles (i.e., limiting the height of the bracket's rise) and preventing excessive pain and bleeding during the procedure.
[0022] In addition, the substrate on which the micro-needles are soldered is manufactured with a double substrate structure having a buffer film inserted in the middle to mitigate shock during invasive tip driving, and by configuring the buffer film as an insulating layer, electrical interference between each substrate is prevented, and each substrate can perform electrical operations independently of each other.
[0023] According to this, the invasive tip can be designed in various forms, such as by providing micro-needles on the upper substrate and mounting a separate semiconductor chip on the lower substrate, and various functional applications can be realized, such as applying high-frequency output through the micro-needles on the upper substrate while simultaneously performing information storage and processing through the semiconductor chip on the lower substrate.
[0024] The technical effects of the present invention are not limited to those mentioned above, and other unmentioned technical effects will be clearly understood by a person skilled in the art from the description below. Brief explanation of the drawing
[0025] FIG. 1 is a perspective view showing the configuration of a high-frequency output device according to one embodiment of the present invention. FIG. 2 is a perspective view showing the external shape of an invasive tip mounted on a handpiece according to one embodiment of the present invention. FIG. 3 is a cross-sectional view showing the configuration of an invasive tip according to one embodiment of the present invention. FIG. 4 is a drawing showing the external shape of a needle array, a substrate, and a conductive pin according to one embodiment of the present invention. FIG. 5 is a drawing showing the external shape of a bracket according to one embodiment of the present invention. FIG. 6 is a drawing showing the external shape of an alignment plate according to one embodiment of the present invention. FIG. 7 is a drawing showing the external shape of a housing according to one embodiment of the present invention. FIG. 8 is a drawing showing the external shape of a cap according to one embodiment of the present invention. Specific details for implementing the invention
[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the attached drawings. However, the technical concept of the present invention is not limited to the following embodiments but can be implemented in various different forms. The following embodiments are provided merely to complete the technical concept of the present invention and to fully inform those skilled in the art of the scope of the present invention, and the technical concept of the present invention is defined only by the scope of the claims.
[0027] It should be noted that when assigning reference numerals to the components of each drawing, the same components are assigned the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description is omitted.
[0028] Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. The terms used herein are for describing embodiments and are not intended to limit the present invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text.
[0029] Additionally, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the present invention. These terms are intended merely to distinguish the components from other components, and the nature, order, or sequence of the components is not limited by such terms. Where it is stated that a component is "connected," "combined," or "joined" to another component, it should be understood that the component may be directly connected or joined to the other component, but that another component may also be "connected," "combined," or "joined" between each component.
[0030] Hereinafter, several embodiments of the present invention will be described in detail with reference to the attached drawings.
[0031] FIG. 1 is a perspective view showing the configuration of a high-frequency output device (10) according to one embodiment of the present invention. Referring to FIG. 1, the high-frequency output device (10) may include an invasive tip (100), a handpiece (200), and a main body (300).
[0032] The main body (300) generates high-frequency energy (e.g., high-frequency current) of a predetermined frequency required for skin treatment, and the frequency of the high-frequency energy may be determined differently depending on the patient's treatment purpose or treatment area, etc. For example, when the purpose is skin treatment, the frequency of the high-frequency energy may be adjusted to a range of 0.1 to 0.8 MHz.
[0033] The main body (300) may include an operating unit for controlling the power or frequency of the device (10), and may further include a touchscreen that displays the overall status of the device (10) or patient information and provides a user interface for operating the device (10).
[0034] The handpiece (200) is configured such that an invasive tip (100) is attached to its end, and provides high-frequency energy for skin treatment to the invasive tip (100). Specifically, the handpiece (200) receives high-frequency energy from the main body (300) and transmits it to the invasive tip (100), and controls the high-frequency output and operation of the invasive tip (100).
[0035] In one embodiment, the handpiece (200) can control the movement of the needle array so that the needle array within the invasive tip (100) penetrates into the skin of the patient during the procedure. To this end, the handpiece (200) may be provided with a pressurizing part (not shown) inside.
[0036] The pressurizing unit is configured to generate a mechanical force to move (e.g., up or down) the needle array within the invasive tip (100), for example, by applying a mechanical force to a substrate to which the needle array is attached to push the substrate, thereby causing the needle array to protrude out of the housing of the invasive tip (100) and penetrate into the patient's skin.
[0037] In one embodiment, the pressurizing unit may include a linear actuator such as a cylinder or a solenoid. Alternatively, the pressurizing unit may include a stepper motor or a servo motor.
[0038] In one embodiment, the outer housing of the handpiece (200) may be provided with an operation button, and the user may turn the pressurizing part on / off, operate the penetration depth of the needle array, or turn the high-frequency energy output of the invasive tip (100) on / off through the operation button.
[0039] The invasive tip (100) includes a needle array, and a through hole is formed at one end of the housing so that the needle array is exposed to the outside or stored inside through the through hole. For example, during the procedure, the needle array is exposed to the outside of the invasive tip (100) and penetrates into the patient's skin, and at the end of the procedure, the needle array is stored inside the invasive tip (100).
[0040] The invasive tip (100) has a structure that is detachable from the handpiece (200) and receives high-frequency energy from the handpiece (200) and irradiates it into the skin through a needle array.
[0041] The detailed configuration and operation of the invasive tip (100) will be explained with reference to FIG. 2 and below.
[0042] FIG. 2 is a perspective view showing the external shape of an invasive tip mounted on a handpiece according to one embodiment of the present invention. Referring to FIG. 2, the invasive tip (100) may include a housing (110) and a cap (Cap, 120) covering one end of the housing (110).
[0043] The housing (110) is configured to provide a mechanical casing for the invasive tip (100) and protects the components of the invasive tip (100) from various external forces or impacts.
[0044] The cap (120) is configured to be detachably attached to one end of the housing (110), and when attached to the housing (110), it covers a through hole formed at one end of the housing (110) to prevent external foreign matter from entering the interior of the invasive tip (100) through the through hole.
[0045] Additionally, during the process of transporting, shipping, and storing the invasive tip (100), the needle array may unintentionally pass through the through hole of the invasive tip (100) and be exposed to the outside. In this case, if the cap (120) is attached to the housing (110), the cap (120) functions as a cover for the needle array exposed outside the through hole, thereby preventing the needle array from being damaged by external force or impact.
[0046] Meanwhile, when the cap (120) is attached to the housing (110), it may be attached such that a certain gap is formed between the inner surface of the cap (120) and the outer surface of the housing (110). This reduces the possibility of damage caused by collision with the inner surface of the cap (120) when the needle array is unintentionally exposed outside the through hole.
[0047] If there is no gap between the housing (110) and the cap (120), as soon as the needle array is exposed outside the through hole, the tip of the needle comes into contact with the inner wall of the cap (120), and there is a possibility that the needle may be damaged by a collision with the cap (120).
[0048] On the other hand, if there is a gap between the cap (120) and the housing (110), even if the needle array is exposed outside the through hole, the degree of exposure is not large, so the end of the needle array remains only in the gap between the housing (110) and the cap (120) and does not collide with the inner surface of the cap (120), thus reducing the possibility of the needle array being damaged by collision with the cap (120).
[0049] FIG. 3 is a cross-sectional view showing the configuration of an invasive tip according to one embodiment of the present invention. Referring to FIG. 3, the invasive tip (110) may include a housing (110), a needle array (130), a substrate (140), a conductive pin (150), a bracket (160), and an alignment plate (170).
[0050] The housing (110) accommodates a needle array (130), a substrate (140), a conductive pin (150), a bracket (160), and an alignment plate (170) inside, and a plurality of through holes (112) are formed at one end (A) that is coupled with a cap (120). At this time, the plurality of through holes (112) can be formed to be aligned with the needle array (130).
[0051] Additionally, the housing (110) may have a side wall (111) formed between one end (A) and the other end (B) that surrounds the needle array (130), substrate (140), conductive pin (150), bracket (160), and alignment plate (170).
[0052] The needle array (130) is a conductive needle array composed of a plurality of micro-needles, and when the needle array (130) is inserted into the human body, current flows through each of the plurality of micro-needles, and high-frequency energy is irradiated into the human body.
[0053] The substrate (140) is configured to support and / or fix the needle array (130), and the needle array (130) extends from a first surface of the substrate (140) (the upper surface of the substrate in Fig. 3) toward a through hole (112) of the housing (110).
[0054] The needle array (130) is fixedly coupled to the substrate (140) and can be electrically connected to wiring (not shown) formed on the substrate (140). For example, one or more holes may be formed on a wiring path formed inside the substrate (140), and the needle array (130) may be inserted into the one or more holes, and the holes may be soldered to form an electrical connection between the wiring of the substrate (140) and the needle array (130).
[0055] The conductive pin (150) is one or more conductive pins (151, 152) extending from a second surface of the substrate (140) (the bottom surface of the substrate in Fig. 3), said second surface may be the back surface of the first surface where the needle array (130) is located.
[0056] The conductive pin (150) is electrically connected to the wiring formed on the substrate (140) and can receive high-frequency energy from the handpiece (200). The high-frequency energy transmitted from the handpiece (200) to the conductive pin (150) is distributed to each micro-needle of the needle array (130) sequentially via the conductive pin (150) and the wiring, depending on the electrical connection between the conductive pin (150), the wiring, and the needle array (130).
[0057] In one embodiment, the conductive pin (150) may be a spring pin connector capable of elastic contact with an electrode pad provided in the handpiece (200). For example, the conductive pin (150) may be a POGO pin.
[0058] The bracket (160) supports the substrate (140) and guides the conductive pin (150). To this end, the bracket (160) may have a receiving groove for receiving the substrate (140) and / or a guide groove or guide hole for guiding the conductive pin (150).
[0059] In one embodiment, the bracket (160) is configured to be able to move up and down within the housing (110), and depending on the movement of the bracket (160), the needle array (130) may be exposed outside the housing (110) by passing through the through hole (i.e., when the bracket is raised) or may be housed inside the housing (110) (i.e., when the bracket is lowered).
[0060] The alignment plate (170) supports the bottom surface of the bracket (160), and a hole penetrating the alignment plate (170) may be formed at some location of the alignment plate (170) (e.g., the center).
[0061] The alignment plate (170) can be fixedly coupled inside the housing (110), and at this time, a needle array (130), a substrate (140), and / or a bracket (160) can be accommodated in the space partitioned by the alignment plate (170) and the housing (110), that is, the space between the alignment plate (170) and the side wall (111) of the housing (110).
[0062] In this case, the internal components of the invasive tip (100), such as the needle array (130), substrate (140), and / or bracket (160), are stably accommodated in the space partitioned by the alignment plate (170) and do not move out of the space even if there is a significant impact from the outside.
[0063] In one embodiment, the side wall (111) of the housing (110) may have a cross-sectional profile in the shape of an inclined surface. According to this shape of the side wall (111), the penetration depth of the micro-needle (or needle array) can be mechanically limited, thereby preventing excessive pain or bleeding during the procedure. This will be explained in more detail.
[0064] In this embodiment, the side wall (111) of the housing (110) may have the shape of an inclined surface (113) in which the cross-sectional area decreases from a first point on the side wall (e.g., a point between one end and the other end of the points on the side wall, C) to one end (A) where a through hole (112) is formed.
[0065] Thus, when the side wall (111) of the housing (110) is manufactured in a shape having an inclined surface (113), when the needle array (130) penetrates the skin (i.e., when the needle array rises within the housing), if it penetrates beyond a certain depth, the bracket (160) around the needle array (130) comes into contact with the inclined surface (113) of the side wall (111) and cannot proceed further, thereby limiting the penetration depth of the needle array (130). Accordingly, during the procedure, the needle array (130) can effectively prevent excessive penetration into the skin and cause excessive pain and bleeding using only a simple mechanical structure.
[0066] In one embodiment, the lifting of the needle array (130) can be controlled by a pressure portion (not shown) of the handpiece (200). To this end, a lifting projection (163) extending from the bottom surface of the bracket (160) may be provided. The lifting projection (163) passes through a hole formed in the alignment plate (170) and extends toward the other end (B) of the housing (110), and may be coupled with a drive shaft (not shown) extending from the pressure portion of the handpiece (200).
[0067] In this case, when the pressurizing part pushes the drive shaft, the lifting projection (163) coupled with the drive shaft is pushed toward one end (A) of the housing (110), and accordingly, the bracket (160) and the substrate (140) are raised so that the needle array (130) is exposed to the outside of the housing (110) through the through hole (112).
[0068] Conversely, when the pressurizing part pulls the drive shaft, the lifting projection (163) coupled with the drive shaft is pulled toward the other end (B) of the housing (110), and accordingly, the bracket (160) and the substrate (140) are lowered so that the needle array (130) is housed inside the housing (110).
[0069] In one embodiment, a protruding ridge (115) having a predetermined height may be formed on the outer surface (110A) of one end (A) where the through hole (112) of the housing (110) is formed. At this time, the protruding ridge (115) may be formed on the edge of the outer surface (110A) or along the edge.
[0070] At this time, a step may be formed on the inner surface of the cap (120) that is opposite to the protruding ridge (115), and when the cap (120) is coupled to one end (A) of the housing (110), the protruding ridge (115) comes into contact with the step, thereby forming a predetermined gap between the inner surface of the cap (120) and the outer surface (110A) of the housing (110). This will be described in more detail later in FIG. 8.
[0071] FIG. 4 is a drawing showing the external shape of a needle array (130), a substrate (140), and a conductive pin (150) according to one embodiment of the present invention.
[0072] The needle array (130) is a conductive needle array comprising a plurality of micro needles, each micro needle may have a diameter of approximately 20 μm and may have a portion from the tip to approximately 0.3 mm formed as a conductive sheath so that high-frequency current may flow into the skin through the sheath portion.
[0073] In one embodiment, the portion of the micro-needle other than the conductive outer shell may be coated with an insulating material such as silicone, thereby preventing high-frequency current from flowing to a portion other than the treatment site.
[0074] Meanwhile, FIG. 4 illustrates a plurality of micro-needles constituting a needle array (130) arranged in a matrix form (i.e., arranged in rows and columns), but the scope of the present invention is not limited thereto. For example, the needle array (130) may be configured such that a plurality of micro-needles are arranged along one or more concentric circles, and the number and arrangement of the micro-needles may vary depending on the treatment purpose and / or the treatment site.
[0075] In one embodiment, the plurality of micro-needles are configured in the form of hollow tubes so that a drug supplied from the handpiece (200) can be injected into the patient's skin through the hollow tubes of the micro-needles.
[0076] The substrate (140) is configured to support the needle array (130), and the needle array (130) can be joined to the substrate (140) by a soldering method, and the needle array (130) can be electrically connected to the conductive pin (150) by wiring inside the substrate (140).
[0077] In this case, electrical energy (e.g., high-frequency current) supplied to the conductive pin (150) can be distributed to the needle array (130) through the wiring of the substrate (140).
[0078] Meanwhile, although the substrate (140) in FIG. 4 is depicted as having a rectangular shape, the scope of the present invention is not limited thereto. For example, the substrate (140) may be determined to have various shapes and sizes depending on the number of micro-needles to be soldered and the internal space of the housing (110).
[0079] In one embodiment, the substrate (140) may be formed in a double structure in which a first substrate (141) and a second substrate (142) are stacked. Additionally, a buffer film (143) may be inserted between the first substrate (141) and the second substrate (142).
[0080] In this way, if the substrate (140) is manufactured as a double substrate structure with a buffer film (143) inserted therein, there is an advantage in that physical shock transmitted to the substrate (140) and the needle array (130) during the operation of the invasive tip (110) can be mitigated.
[0081] As one embodiment, the buffer film (143) may be configured as an insulating layer to support various applications of the invasive tip (110). This will be explained in more detail.
[0082] For example, an application may be possible in which a needle array (130) is provided on the first substrate (141) and a separate semiconductor chip (not shown) is mounted on the second substrate (142). In this case, while applying a high-frequency output through the needle array (130) of the first substrate (141), other functions such as information storage and processing can be performed simultaneously through the semiconductor chip of the second substrate (142).
[0083] At this time, electrical insulation between the two substrates (141, 142) can be provided by configuring the buffer film (143) with an insulating material to prevent electrical interference between each substrate (141, 142) and to enable each substrate (141, 142) to perform electrical operations independently of each other. In this case, even if a high-frequency current flows through the first substrate (141), the second substrate (142) is insulated from the first substrate (141) by the buffer film (143), so it can perform its function normally without being affected by the high-frequency current flowing through the first substrate (141).
[0084] In one embodiment, the buffer film (143) may include an insulating tape composed of silicone, urethane, or elastomer.
[0085] Meanwhile, the double substrate structure of such a substrate (140) can also contribute to efficiently utilizing the space inside the invasive tip (110). For example, if the first substrate (141) and the second substrate (142) are provided individually at different locations, they will occupy relatively more space inside the invasive tip (110), and consequently, various problems may arise, such as the need to increase the size of the invasive tip (110).
[0086] In contrast, as in the present embodiment, if the substrate (140) is configured as a double substrate structure with a buffer film (143) inserted in the middle, two substrates can be accommodated in almost the same space as one substrate, so the internal space of the invasive tip (110) can be utilized efficiently and the problem of insufficient internal space can be effectively overcome.
[0087] Meanwhile, the conductive pin (150) extends from the bottom surface of the substrate (140) and is connected to the electrical circuit of the handpiece (200) to receive electrical energy from the handpiece (200).
[0088] In one embodiment, the conductive pin (150) may include two or more conductive pins that are distinct from each other. For example, the conductive pin (150) may include a first conductive pin (151) and a second conductive pin (152) that are electrically connected to the needle array (130). This will be explained with reference to FIG. 4(a).
[0089] In FIG. 4(a), the first conductive pin (151) and the second conductive pin (152) may function as electrodes of the same polarity so that current flows in the same direction, or they may function as electrodes of different polarities so that current flows in different directions.
[0090] For example, when the high-frequency output device (10) operates in monopolar mode, both the first conductive pin (151) and the second conductive pin (152) function as (+) electrodes so that current can flow in both directions toward the needle array (130).
[0091] On the other hand, when the high-frequency output device (10) operates in bipolar mode, the first conductive pin (151) functions as a (+) electrode and the second conductive pin (152) functions as a (-) electrode, so that current flows in the direction toward the needle array (130) through the first conductive pin (151), but current flows in the direction toward the needle array (130) through the second conductive pin (152).
[0092] In one embodiment, the first conductive pin (151) and the second conductive pin (152) are each provided at positions spaced apart from each other on the first substrate (141) and can be electrically connected to different micro-needles among a plurality of micro-needles in the needle array (130) through a first wiring (not shown) routed inside the first substrate (141).
[0093] For a specific example, the first conductive pin (151) may be located at a first point (e.g., the left corner in FIG. 4) of the first substrate (141), and the second conductive pin (152) may be located at a second point (e.g., the right corner in FIG. 4) facing the first point. The first conductive pin (151) may be electrically connected to one or more first microneedles (e.g., microneedles located in odd columns) among a plurality of microneedles in the needle array (130), and the second conductive pin (152) may be electrically connected to one or more second microneedles (e.g., microneedles located in even columns) among a plurality of microneedles in the needle array (130) that are distinct from the first microneedles.
[0094] Under this connection structure, when the high-frequency output device (10) operates in monopolar mode, the high-frequency current provided through the first conductive pin (151) is distributed to the first micro needle, and the high-frequency current provided through the second conductive pin (152) is distributed to the second micro needle. Accordingly, the high-frequency current supply to the needle array (130) can be done through the two conductive pins (151, 152), thereby enabling the rapid supply of more current.
[0095] As another example, under this connection structure, when the high-frequency output device (10) operates in bipolar mode, the first micro-needle connected to the first conductive pin (151) functions as a (+) electrode, and the second micro-needle connected to the second conductive pin (152) functions as a (-) electrode. Then, when high-frequency current is irradiated, the high-frequency current is output through the first micro-needle and recovered through the second micro-needle after passing through the inside of the skin. Through this, it is possible to effectively implement the bipolar mode.
[0096] In this way, by electrically connecting two conductive pins (151, 152) to the first substrate (141), two modes, monopolar and bipolar, can be implemented with the same configuration of the invasive tip (110).
[0097] Meanwhile, the conductive pin (150) may further include a third and / or fourth conductive pin (153, 154) electrically connected to the second substrate (142), in addition to the first and / or second conductive pin (151, 152) electrically connected to the first substrate (141). This will be explained with reference to FIG. 4(b).
[0098] In FIG. 4(b), the second substrate (142) may have a semiconductor chip mounted thereon as previously described, and in this case, the third conductive pin (153) and the fourth conductive pin (154) may be electrically connected to the semiconductor chip through a second wiring (not shown) routed inside the second substrate (142). At this time, the third conductive pin (153) may function as a (+) electrode providing power to the semiconductor chip, and the fourth conductive pin (154) may function as a (-) electrode providing ground to the semiconductor chip.
[0099] In one embodiment, one or more conductive pins electrically connected to the same substrate may be located at points facing each other. For example, as shown in FIG. 4, when the first substrate (141) is configured in a rectangular shape, the first conductive pin (151) and the second conductive pin (152) are provided at corner positions facing each other, thereby ensuring sufficient separation distance between them so that mutual electrical interference is minimized.
[0100] FIG. 5 is a drawing showing the external shape of a bracket according to an embodiment of the present invention. Referring to FIG. 5, the bracket (160) may include a bracket base (161) having a receiving groove (164) formed therein for receiving a substrate (140), and a guide hole or guide groove (162) for guiding a conductive pin (150).
[0101] In one embodiment, the guide hole or guide groove (162) may be configured to extend from the bottom surface of the bracket base (161) and have a predetermined height. A conductive pin (160) may be inserted into the guide hole or guide groove (162), and the conductive pin (160) may be aligned within a predetermined error range (e.g., within the diameter range of the guide hole or guide groove) by the guide hole or guide groove (162).
[0102] In one embodiment, a lifting projection (163) may be formed on the bottom surface of the bracket base (161) to move the bracket (160) coupled to the substrate (140) and coupled to the pressure portion (or drive shaft) of the handpiece (200). The lifting projection (163) may be configured in various forms that can be coupled to the pressure portion (or drive shaft). However, if the invasive tip (110) is manufactured in a structure in which the pressure portion (or drive shaft) of the handpiece (200) can directly press the bracket (160), the lifting projection (163) may be omitted.
[0103] FIG. 6 is a drawing showing the external shape of an alignment plate according to one embodiment of the present invention.
[0104] The alignment plate (170) includes an alignment plate base (171) that supports the bottom surface of the bracket (160), and at least one hole (172, 173) may be formed in the alignment plate base (171).
[0105] At this time, the holes (172, 173) may include a hole (172) for fixing or aligning a conductive pin (150), or a hole (173) for fixing or aligning a lifting projection (173).
[0106] Additionally, the alignment plate (170) is coupled with the housing (110) to partition the space in which the needle array (130), substrate (140), and / or bracket (160) are accommodated. This prevents the bracket (160), coupled with the pressure member (or drive shaft), from being pulled out of the invasive tip (110) during the process of detaching the invasive tip (100) from the handpiece (200), or prevents the bracket (160) from being detached from inside the housing (110).
[0107] FIG. 7 is a drawing showing the external shape of a housing (110) according to one embodiment of the present invention, and FIG. 8 is a drawing showing the external shape of a cap (120) according to one embodiment of the present invention.
[0108] Referring to FIG. 7, the housing (110) may have a plurality of through holes (112) formed at one end (A) through which a needle array (130) passes, and the other end (B) may have an open shape.
[0109] The side wall (111) of the housing (110) may have the shape of an inclined surface (113) in which the cross-sectional area decreases from a first point (C) between one end (A) and the other end (B) to the one end (A) where the through hole (112) is formed. Accordingly, when the needle array (130) rises above a certain level, the bracket (160) comes into contact with the inclined surface (113) of the side wall (111), thereby preventing the needle array (130) from rising further, and thus preventing the needle array (130) from penetrating too deeply into the skin.
[0110] Meanwhile, as previously explained, the cap (120) is configured to be detachably connected to the housing (110), and when the cap (120) is attached to the housing (110), the cap (120) may be configured to cover one end (A) of the housing (110) in which a through hole (112) is formed.
[0111] In one embodiment, the cap (120) includes one or more legs (121) extending in the longitudinal direction, and a stopper (122) may be formed at one location (e.g., end portion) of the one or more legs (121). Additionally, one or more trench grooves (114) are formed in the side wall (111) of the housing (110), so that when the cap (120) is coupled to the housing (110), the stopper (122) of the one or more legs is inserted into the trench groove (114), thereby allowing the cap (120) to be more firmly fixed to the housing (110).
[0112] In one embodiment, the catch (122) may be a straight projection corresponding to the shape of the trench groove (114), or a serrated projection as shown in FIG. 8 (a). When the catch (122) is a serrated projection, each serrated part is sequentially caught in the trench groove (114) when the cap (120) is removed from the housing (110), so the cap (120) can be more firmly fixed to the housing (110).
[0113] In one embodiment, a protruding ridge (115) having a predetermined height may be formed on the outer surface (110A) of one end (A) of the housing (110) in which the through hole (112) is formed. Additionally, correspondingly, a step (122) having a predetermined height may be formed in one area of the inner surface (120A) of the cap (120) as shown in (b) of FIG. 8.
[0114] Accordingly, when the cap (120) is attached to the housing (110), the protruding ridge (115) and the step (122) come into contact with each other, thereby stably forming a gap between the housing (110) and the cap (120). At this time, by adjusting the height of the protruding ridge (115) or the step (122), the size of the gap when the cap (120) is attached to the housing (110) can be adjusted.
[0115] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within the equivalent scope shall be interpreted as being included within the scope of rights of the technical concept defined by the present invention. Explanation of the symbols
[0117] 10: High-frequency output device 100: Invasive tip 110: Housing 120: Cap 130: Needle array 140: Substrate 150: Conductive pin 160: Bracket 170: Alignment board 200: Handpiece 300: Main body
Claims
Claim 1 A substrate; a needle array extending from a first surface of the substrate; one or more conductive pins extending from a second surface of the substrate; a bracket supporting the substrate and guiding the one or more conductive pins; and includes a housing that accommodates the bracket internally, has a plurality of through holes formed at one end facing the first surface, and a side wall surrounding the needle array is formed between the one end and the other end, wherein the side wall has the shape of an inclined surface in which the cross-sectional area decreases from a first point on the side wall to the one end, and the substrate includes a first substrate to which the needle array is fixed, and a second substrate disposed adjacent to the first substrate, wherein an insulating layer is inserted between the first substrate and the second substrate, the first substrate includes a first wiring routed internally, and the second substrate includes a second wiring routed internally, and a semiconductor chip is mounted on the second substrate, and the one or more conductive pins include a first conductive pin electrically connected to the first wiring, and a third conductive pin electrically connected to the second wiring, and the electrical energy provided to the first conductive pin is the First An invasive tip distributed to the needle array via wiring, wherein the plurality of through holes are formed to be aligned with the needle array, the bracket is configured to be vertically movable within the housing, and depending on the vertical movement of the bracket, the needle array is exposed to the outside of the housing by penetrating the through holes or is housed inside the housing, and when the needle array penetrates the skin, the penetration depth of the needle array is limited by the side wall having the inclined surface. Claim 2 An invasive tip according to claim 1, further comprising a cap coupled to the housing to cover one end of the housing, wherein when the cap is coupled to the housing, a predetermined gap is formed between the outer surface of the housing where the through hole is formed and the inner surface of the cap. Claim 3 In claim 2, a protruding ridge having a predetermined height is formed on the edge of the outer surface of the housing, a step opposite to the protruding ridge is formed on the inner surface of the cap, and when the cap is coupled to the housing, the protruding ridge comes into contact with the step to form the gap, an invasive tip. Claim 4 In claim 2, the cap comprises one or more legs extending in the longitudinal direction, a stopper is formed at one position of the one or more legs, and one or more trench grooves are formed in the side wall of the housing, and when the cap is coupled to the housing, the stopper of the one or more legs is inserted into the one or more trench grooves to secure the cap to the housing. Claim 5 In claim 1, the one or more conductive pins include a first conductive pin located at a first point on the substrate and a second conductive pin located at a second point facing the first point on the substrate, wherein the first conductive pin is electrically connected to one or more first needles of the needle array and the second conductive pin is electrically connected to one or more second needles of the needle array that are different from the first needles, an invasive tip. Claim 6 delete Claim 7 delete Claim 8 In claim 1, the invasive tip further comprises an alignment plate having a hole formed therein that supports the bottom surface of the bracket, wherein the alignment plate is coupled to the interior of the housing, and the bracket is accommodated in the space between the alignment plate and the inner wall of the housing that is partitioned by the alignment plate. Claim 9 In claim 8, the invasive tip further comprises a lifting projection extending from the bottom surface of the bracket, wherein the lifting projection penetrates the hole of the alignment plate and extends toward the other end of the housing. Claim 10 A main body that generates high-frequency energy; and a handpiece that receives high-frequency energy from the main body and transmits it to an invasive tip, wherein the invasive tip comprises: a substrate; a needle array extending from a first surface of the substrate; one or more conductive pins extending from a second surface of the substrate; and a bracket that supports the substrate and guides the one or more conductive pins. The above bracket is housed internally, and a plurality of through holes are formed at one end facing the first surface, and a side wall surrounding the needle array is formed between the one end and the other end, and the side wall includes a housing having the shape of an inclined surface in which the cross-sectional area decreases from a first point on the side wall to the one end, and the substrate includes a first substrate to which the needle array is fixed, and a second substrate disposed adjacent to the first substrate, and an insulating layer is inserted between the first substrate and the second substrate, the first substrate includes a first wiring routed internally, and the second substrate includes a second wiring routed internally, and a semiconductor chip is mounted on the second substrate, and the one or more conductive pins include a first conductive pin electrically connected to the first wiring, and a third conductive pin electrically connected to the second wiring, and electrical energy provided to the first conductive pin is distributed to the needle array via the first wiring, and the plurality of through holes are formed to be aligned with the needle array, and the bracket is the A high-frequency output device configured to be able to move up and down within a housing, wherein, depending on the raising and lowering of the bracket, the needle array is exposed to the outside of the housing by passing through the through hole or is housed inside the housing, and the handpiece comprises: an electrical circuit that provides high-frequency energy to one or more conductive pins; and a pressurizing part that generates a mechanical force to raise or lower the substrate within the housing.
Citation Information
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