Display appartus

Abstract

According to the concept of the present invention, a display device comprises a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, and each of the plurality of display modules comprises a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member in contact with the rear surface of the substrate to dissipate heat generated from the substrate, and the display panel comprises a panel heat dissipation member connecting each module heat dissipation member to dissipate heat between each of the module heat dissipation members of the plurality of display modules.

Description

Technology Field

[0001] The present invention relates to a display device that displays an image by combining modules in which self-luminous inorganic light-emitting elements are mounted on a substrate. Background Technology

[0002] A display device is a type of output device that visually displays data information, such as characters and shapes, as well as images.

[0003] Generally, liquid crystal panels requiring a backlight or organic light-emitting diode (OLED) panels, composed of films of organic compounds that emit light in response to an electric current, have been primarily used as display devices. However, liquid crystal panels have issues such as slow response times, high power consumption, and difficulty in achieving a compact design because they cannot emit light themselves and require a backlight. Additionally, while OLED panels do not require a backlight because they emit light themselves and can be made thin, they are susceptible to burn-in—a phenomenon where specific parts of the previous image remain visible even after a screen change—as the lifespan of subpixels expires when the same image is displayed for an extended period.

[0004] Accordingly, micro light-emitting diode (microLED or μLED) display panels are being researched as new panels to replace them, in which inorganic light-emitting elements are mounted on a substrate and the inorganic light-emitting elements themselves are used as pixels.

[0005] A micro light-emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and is composed of a plurality of inorganic light-emitting diodes (inorganic LEDs) each having a size of 100 micrometers or less.

[0006] Although these LED panels are also self-emissive devices, they are inorganic light-emitting devices, so the burn-in phenomenon of OLEDs does not occur, and they offer excellent brightness, resolution, power consumption, and durability.

[0007] Compared to liquid crystal display (LCD) panels that require backlighting, microLED display panels offer better contrast, response time, and energy efficiency. While both organic light-emitting diodes (OLEDs) and inorganic light-emitting devices like microLEDs are energy-efficient, microLEDs offer higher brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, it is possible to manufacture display modules at the board level, and it is easy to produce them in various resolutions and screen sizes to meet customer orders. The problem to be solved

[0009] The present invention relates to a display device, and in particular, aims to provide a display device in which the display performance of a portion of a screen is not degraded by high heat generated from an inorganic light-emitting element in a portion of the display module, such that the screen displayed by a plurality of display modules is not degraded. means of solving the problem

[0010] According to the concept of the present invention, a display device comprises a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules comprises a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member in contact with the rear surface of the substrate to dissipate heat generated from the substrate, and the display panel comprises a panel heat dissipation member connecting each of the module heat dissipation members to dissipate heat between each of the plurality of display modules.

[0011] In addition, the above module heat dissipation member is made of a metal material.

[0012] In addition, the above-mentioned module heat dissipation member is provided as a vapor chamber.

[0013] In addition, the above panel heat dissipation member is made of a metal material.

[0014] In addition, the above panel heat dissipation member is formed of a nickel alloy.

[0015] In addition, the thermal expansion coefficient of the above-mentioned panel heat dissipation member is provided as a value approximately corresponding to the thermal expansion coefficient of the above-mentioned substrate.

[0016] In addition, the panel heat dissipation member is provided to support the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form.

[0017] In addition, the module heat dissipation member is provided such that high heat generated at one point on the substrate is transferred to the entire surface area of ​​the substrate in a direction horizontal to the substrate, so that the substrate is maintained in a state of thermal equilibrium in a direction horizontal to the substrate.

[0018] In addition, the module heat dissipation member includes four edges corresponding to each of the four edges of the substrate, and the area of ​​the substrate is provided to be at least equal to or larger than the area of ​​the module heat dissipation member.

[0019] In addition, the plurality of display modules includes a first display module including a first substrate and a second display module including a second substrate that is horizontally arranged with respect to the first display module, and the module heat dissipation member includes a first module heat dissipation member corresponding to the first display module and a second module heat dissipation member corresponding to the second display module, and the panel heat dissipation member is provided to be in contact with the rear surface of the first module heat dissipation member and the rear surface of the second module heat dissipation member, respectively.

[0020] In addition, the panel heat dissipation member is configured to transfer heat from the first module heat dissipation member to the second module heat dissipation member so that when the amount of heat remaining in the first module heat dissipation member by the first substrate is greater than the amount of heat remaining in the second module heat dissipation member by the second substrate, the first module heat dissipation member and the second module heat dissipation member are each in a state of thermal equilibrium.

[0021] In addition, the panel heat dissipation member is provided to cover all four edges of the module heat dissipation member of each of the plurality of display modules in the rear direction.

[0022] In addition, the plurality of display modules are further included in a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, and the panel heat dissipation member is arranged to be in contact with the frame in the front-rear direction.

[0023] In addition, the thermal expansion coefficient of the above-mentioned panel heat dissipation member is provided with a value that roughly corresponds to the thermal expansion coefficient of the above-mentioned frame.

[0024] According to the concept of the present invention, a display device comprising a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules comprises a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member in contact with the rear surface of the substrate to dissipate heat generated from the substrate, wherein the module heat dissipation member is formed as a vapor chamber configured to transfer high heat generated at one point of the substrate to the entire surface area of ​​the substrate in a direction horizontal to the substrate so as to maintain a state of thermal equilibrium of the substrate in a direction horizontal to the substrate.

[0025] In addition, the display panel includes a panel heat dissipation member that connects each module heat dissipation member to dissipate heat between each module heat dissipation member of each of the plurality of display modules.

[0026] In addition, the above panel heat dissipation member is formed of a metal material.

[0027] In addition, the thermal expansion coefficient of the above-mentioned panel heat dissipation member is provided as a value approximately corresponding to the thermal expansion coefficient of the above-mentioned substrate.

[0028] In addition, the plurality of display modules are further included in a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, and the panel heat dissipation member is arranged to be in contact with the frame in the front-rear direction.

[0029] According to the concept of the present invention, a display device comprises a display panel including a plurality of display modules and a frame supporting the plurality of display panels so that the plurality of display modules are horizontally arranged in an M*N matrix form. Each of the plurality of display modules includes a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member in contact with the rear surface of the substrate to dissipate heat generated from the substrate. The display panel is provided in a shape corresponding to the frame in the front-rear direction and includes a panel heat dissipation member connecting each of the module heat dissipation members to dissipate heat between each of the plurality of display modules. Effects of the invention

[0030] A display device according to an embodiment of the present invention maintains uniform image quality within a display module by making the temperature within the display module uniform through a module heat dissipation member when high heat is generated in a part of a plurality of display modules. Additionally, it can maintain uniform image quality in a display panel by making the temperature between the plurality of display modules uniform through a panel heat dissipation member. Brief explanation of the drawing

[0031] FIG. 1 is a drawing illustrating a display device according to an embodiment of the present invention. FIG. 2 is a diagram showing the main components of the display device of FIG. 1 in disassembly. FIG. 3 is an enlarged cross-sectional view of a part of the configuration of the display module shown in FIG. 1. FIG. 4 is a rear perspective view of one display module of the display device shown in FIG. 1. FIG. 5 is a rear perspective view of a part of the display panel of the display device of FIG. 1. FIG. 6 is a diagram showing the main components of the display device in FIG. 1 disassembled and viewed from the rear. FIG. 7 is a simplified cross-sectional view illustrating the movement of heat in a part of the display device of FIG. 1. FIG. 8 is a simplified rear view illustrating the movement of heat in a part of the display device of FIG. 1. Specific details for implementing the invention

[0032] The embodiments described in this specification are merely the most preferred embodiments of the present invention and do not represent all technical concepts of the present invention; therefore, it should be understood that various equivalents or modifications that can replace them at the time of filing this application are also included within the scope of the rights of the present invention.

[0033] Singular expressions used in the description may include plural expressions unless the context clearly indicates otherwise. In the drawings, the shapes and sizes of elements may be exaggerated to provide a clearer description.

[0034] In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not excluding in advance the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0035] Furthermore, in this specification, the meaning of "identical" includes items that are similar in attributes or similar within a certain range. Additionally, "identical" means "substantially identical." It should be understood that "substantially identical" means that numerical values ​​corresponding to a manufacturing error range or differences within a range that do not hold significance relative to a reference value are included within the scope of being "identical."

[0036] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0037] FIG. 1 is a drawing illustrating a display device according to an embodiment of the present invention, FIG. 2 is a drawing illustrating the main configuration of the display device of FIG. 1 in disassembly, FIG. 3 is an enlarged cross-sectional view of a part configuration of a display module shown in FIG. 1, and FIG. 4 is a rear perspective view of a display module of the display device shown in FIG. 1.

[0038] Some components of the display device (1), including the plurality of inorganic light-emitting elements (50) shown in the drawing, are micro-sized components with a size of several μm to several hundred μm. For convenience of explanation, the scale of some components (multiple inorganic light-emitting elements (50), black matrix (58), etc.) has been exaggerated.

[0039] A display device (1) is a device that displays information, data, etc., in the form of characters, shapes, graphs, images, etc., and can be implemented as a TV, PC, mobile, digital signage, etc.

[0040] According to an embodiment of the present invention, as shown in FIGS. 1 and 2, a display device (1) may include a display panel (20) for displaying images, a power supply unit (not shown) for supplying power to the display panel (20), a main board (25) for controlling the overall operation of the display panel (20), a frame (60) for supporting the display panel (20), and a rear cover (10) for covering the rear of the frame (60).

[0041] The display panel (20) may include a plurality of display modules (30A-30P), a driving board (not shown) for driving each of the display modules (30A-30P), and a TOCN board (Timing controller board) for generating timing signals required for controlling each of the display modules (30A-30P).

[0042] The rear cover (10) can support the display panel (20). The rear cover (10) can be installed on the floor via a stand (not shown) or on the wall via a hanger (not shown), etc.

[0043] Multiple display modules (30A-30P) can be arranged vertically and horizontally so as to be adjacent to each other. Multiple display modules (30A-30P) can be arranged in an M * N matrix form. In this embodiment, 16 multiple display modules (30A-30P) are provided and arranged in a 4 * 4 matrix form, but there are no restrictions on the number or arrangement method of the multiple display modules (30A-30P).

[0044] Multiple display modules (30A-30P) can be installed on the frame (60). Multiple display modules (30A-30P) can be installed on the frame (60) by various known methods, such as magnetic force using a magnet, a mechanical fitting structure, or adhesive. A rear cover (10) is attached to the rear of the frame (60), and the rear cover (10) can form the rear exterior of the display device (1).

[0045] The rear cover (10) may include a metal material. Accordingly, heat generated from the plurality of display modules (30A-30P) and the frame (60) can be easily conducted to the rear cover (10), thereby increasing the heat dissipation efficiency of the display device (1).

[0046] In this way, the display device (1) according to the embodiment of the present invention can realize a large screen by tiling a plurality of display modules (30A-30P).

[0047] Unlike the embodiment of the present invention, each of the plurality of display modules (30A-30P) can be applied to a display device. That is, the display module (30A-30P) can be installed and applied as a single unit to electronic products or battlefields requiring various displays, such as wearable devices, portable devices, handheld devices, and various other displays, and can be applied to display devices such as PC (personal computer) monitors, high-resolution TVs, signage, and electronic displays through a plurality of assembled arrangements in a matrix type, as in the embodiment of the present invention.

[0048] Multiple display modules (30A-30P) may have the same configuration. Therefore, the description of any one display module described below may be applied equally to all other display modules.

[0049] As an example, among the plurality of display modules (30A-30P), the first display module (30A) can be formed in a quadrangle shape. The first display module (30A) can be provided in a rectangular shape or a square shape.

[0050] Accordingly, the first display module (30A) may include edges (31, 32, 33, 34) formed in the up, down, left, and right directions relative to the first direction (X) which is the front.

[0051] As illustrated in FIG. 3, a plurality of display modules (30A-30P) may each include a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted on the substrate (40). The plurality of inorganic light-emitting elements (50) may be mounted on a mounting surface (41) of the substrate (40) facing a first direction (X). In FIG. 3, for convenience of explanation, the thickness of the substrate (40) in the first direction (X) is depicted as exaggeratedly thick.

[0052] The substrate (40) can be formed in a quadrangle shape. As described above, a plurality of display modules (30A-30P) can each be provided in a quadrangle shape, and the substrate (40) can be formed in a quadrangle shape to correspond to this.

[0053] The substrate (40) can be provided in a rectangular (Rectangle type) or square (Square type) shape.

[0054] Accordingly, with the first display module (30A) as an example, the substrate (40) may include four borders corresponding to the borders (31, 32, 33, 34) of the first display module (30A) formed in the up, down, left, and right directions with respect to the first direction (X) which is the front.

[0055] The substrate (40) may include a base substrate (42), a mounting surface (41) forming one side of the base substrate (42), a rear surface (43) forming the other side of the base substrate (42) and positioned opposite to the mounting surface (41), and a side surface (45) positioned between the mounting surface (41) and the rear surface (43). (Refer to FIG. 4)

[0056] The substrate (40) may include a TFT layer (Thin Film Transistor, 44) formed on a base substrate (42) to drive inorganic light-emitting elements (50). The base substrate (42) may include a glass substrate. That is, the substrate (40) may include a COG (Chip on Glass) type substrate. The substrate (40) may have first and second pad electrodes (44a, 44b) formed thereon so that the inorganic light-emitting elements (50) are electrically connected to the TFT layer (44).

[0057] The TFT (Thin Film Transistor) constituting the TFT layer (44) is not limited to a specific structure or type and can be composed of various embodiments. That is, the TFT of the TFT layer (43) according to one embodiment of the present invention can be implemented as an LTPS (Low Temperature Poly Silicon) TFT, oxide TFT, Si (poly silicon, or a-silicon) TFT, as well as an organic TFT, graphene TFT, etc.

[0058] Additionally, the TFT layer (44) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET, or p-type MOSFET transistor when the base substrate (42) of the substrate (40) is provided as a silicon wafer.

[0059] A plurality of inorganic light-emitting elements (50) are formed from an inorganic material and may include inorganic light-emitting elements having a width, length, and height of several μm to several tens of μm, respectively. Micro inorganic light-emitting elements may have a short side length of 100 μm or less among the width, length, and height. That is, the inorganic light-emitting elements (50) can be picked up from a wafer formed of sapphire or silicon material and directly transferred onto a substrate (40). The plurality of inorganic light-emitting elements (50) can be picked up and transferred using an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

[0060] A plurality of inorganic light-emitting elements (50) may be light-emitting structures comprising an n-type semiconductor (58a), an active layer (58c), a p-type semiconductor (58b), a first contact electrode (57a), and a second contact electrode (57b).

[0061] Although not shown in the drawing, one of the first contact electrodes (57a) may be electrically connected to the second contact electrode (57b) n-type semiconductor (58a) and the other may be electrically connected to the p-type semiconductor (58b).

[0062] The first contact electrode (57a) and the second contact electrode (57b) may be in the form of a flip chip arranged horizontally and facing the same direction (opposite direction of light emission).

[0063] When mounted on the mounting surface (41), the inorganic light-emitting element (50) has a light-emitting surface (54) positioned toward the first direction (X), a side surface (55), and a bottom surface (56) positioned opposite the light-emitting surface (54), and a first contact electrode (57a) and a second contact electrode (57b) can be formed on the bottom surface (56).

[0064] That is, the contact electrodes (57a, 57b) of the inorganic light-emitting element (50) are positioned on the opposite side of the light-emitting surface (54) and thus can be positioned on the opposite side of the direction in which light is irradiated.

[0065] Contact electrodes (57a, 57b) are arranged to face the mounting surface (41) and are electrically connected to the TFT layer (44), and a light-emitting surface (54) that irradiates light in a direction opposite to the direction in which the contact electrodes (57a, 57b) are arranged may be arranged.

[0066] Therefore, when light generated from the active layer (58c) is irradiated in the first direction (X) through the light-emitting surface (54), the light can be irradiated toward the first direction (X) without interference from the first contact electrode (57a) or the second contact electrode (57b).

[0067] That is, the first direction (X) can be defined as the direction in which the light-emitting surface (54) is positioned to irradiate light.

[0068] The first contact electrode (57a) and the second contact electrode (57b) can be electrically connected to the first pad electrode (44a) and the second pad electrode (44b), respectively, formed on the mounting surface (41) side of the substrate (40).

[0069] The inorganic light-emitting element (50) can be directly connected to the pad electrodes (44a, 44b) through a bonding configuration such as an anisotropic conductive layer (47) or solder.

[0070] An anisotropic conductive layer (47) may be formed on the substrate (40) to mediate electrical connection between contact electrodes (57a, 57b) and pad electrodes (44a, 44b). The anisotropic conductive layer (47) may have a structure in which an anisotropic conductive adhesive is attached to a protective film and conductive balls (47a) are dispersed in an adhesive resin. The conductive balls (47a) are conductive spheres surrounded by a thin insulating film, and can electrically connect conductors to each other as the insulating film breaks under pressure.

[0071] The anisotropic conductive layer (47) may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0072] Accordingly, when a plurality of inorganic light-emitting elements (50) are mounted on a substrate (40), if pressure is applied to the anisotropic conductive layer (47), the insulating film of the conductive ball (47a) is broken so that the contact electrodes (57a, 57b) of the inorganic light-emitting elements (50) and the pad electrodes (44a, 44b) of the substrate (40) can be electrically connected.

[0073] However, although not shown in the drawing, a plurality of inorganic light-emitting elements (50) may be mounted on the substrate (40) via solder (not shown) instead of an anisotropic conductive layer (47). After the inorganic light-emitting elements (50) are aligned on the substrate (40), the inorganic light-emitting elements (50) may be bonded to the substrate (40) through a reflow process.

[0074] A plurality of inorganic light-emitting elements (50) may include a red light-emitting element (51), a green light-emitting element (52), and a blue light-emitting element (53). The light-emitting elements (50) may be mounted on the mounting surface (41) of a substrate (40) by forming a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) as a single unit. A series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) may form a single pixel. At this time, the red light-emitting element (51), green light-emitting element (52), and blue light-emitting element (53) may each form a sub-pixel.

[0075] The red light-emitting element (51), the green light-emitting element (52), and the blue light-emitting element (53) may be arranged in a line at predetermined intervals as in the embodiment of the present invention, or they may be arranged in other shapes such as a triangular shape.

[0076] The substrate (40) may include a light-absorbing layer (44c) to absorb external light and improve contrast. The light-absorbing layer (44c) may be formed on the entire mounting surface (41) of the substrate (40). The light-absorbing layer (44c) may be formed between the TFT layer (44) and the anisotropic conductive layer (47).

[0077] A plurality of display modules (30A-30P) may further include a black matrix (48) formed between a plurality of inorganic light-emitting elements (50).

[0078] The black matrix (48) can perform the function of complementing the light absorption layer (44c) formed entirely on the mounting surface (41) side of the substrate (40). That is, the black matrix (48) can improve the contrast of the screen by absorbing external light and making the substrate (40) appear black.

[0079] The black matrix (48) can preferably have a black color.

[0080] In this embodiment, the black matrix (48) is formed to be placed between pixels formed by a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53). However, unlike this embodiment, it may be formed more finely to partition each of the light-emitting elements (51, 52, 53) which are subpixels.

[0081] The black matrix (48) can be formed in a grid shape having horizontal and vertical patterns to be placed between pixels.

[0082] The black matrix (48) can be formed by applying a light-absorbing ink onto an anisotropic conductive layer (47) and then curing it through an ink-jet process, or by coating a light-absorbing film onto an anisotropic conductive layer (46).

[0083] That is, in the anisotropic conductive layer (47) formed entirely on the mounting surface (41), a black matrix (48) can be formed between a plurality of inorganic light-emitting elements (50) that are not mounted.

[0084] Each of the plurality of display modules (30A-30P) may include a front cover (49) disposed on the mounting surface (41) in a first direction (X) to cover the mounting surface (41) of each of the plurality of display modules (30A-30P).

[0085] The front cover (49) may be provided in multiple numbers so as to be formed on each of the multiple display modules (30A-30P) in the first direction (X).

[0086] The front cover (49) may include a film (not shown). The front cover (49) may include an adhesive layer (not shown) provided so that the front cover (49) is bonded to the mounting surface (41) of the substrate (40).

[0087] The film (not shown) of the front cover (49) can be provided as a functional film having optical performance.

[0088] The front cover (49) is provided to cover the substrate (40) and can protect the substrate (40) from external forces.

[0089] Typically, the adhesive layer (not shown) of the front cover (49) may be provided to have a height greater than a predetermined height in the first direction (X) toward the mounting surface (41) or the light-emitting surface (54). This is to sufficiently fill the gap that may be formed between the front cover (49) and the plurality of inorganic light-emitting elements (50) when the front cover (49) is placed on the substrate (40).

[0090] Each of the multiple display modules (30A-30P) may include a module heat dissipation member (110) provided on the rear surface (43) of the substrate (40) to dissipate heat generated from the substrate (40).

[0091] The heat generated from the substrate (40) may include heat generated from various configurations. The heat generated from the substrate (40) and transferred to the rear surface (43) accounts for the largest proportion of the heat generated when a plurality of inorganic light-emitting elements (50) emit light. However, in addition to this, heat may be generated from a plurality of configurations disposed on the mounting surface (41) of the substrate (40), such as the TFT layer (44), and the heat generated from the plurality of configurations may be introduced into the substrate (40).

[0092] In addition, heat can be transferred from the outside of the substrate (40) to the substrate (40), and heat can be transferred to the substrate (40) through the external configuration of the substrate (40) so that heat can be generated in the substrate (40).

[0093] The heat generated in the substrate (40) described below refers to the heat generated in a plurality of configurations disposed on the substrate (40) which substantially includes a plurality of inorganic light-emitting elements (50), and which is then introduced into the substrate (40).

[0094] In particular, as described above, the heat generated from the plurality of inorganic light-emitting elements (50) flows most into the substrate (40), and thus the heat generated in the substrate (40) has the largest proportion of heat generated from the plurality of inorganic light-emitting elements (50). However, as described above, it can be said that heat is generated in the substrate (40) by various configurations other than the plurality of inorganic light-emitting elements (50) and by heat generated outside the substrate (40). Additionally, the plurality of display modules (30A-30P) may each include an adhesive tape (70) placed between the rear surface (43) and the module heat dissipation member (110) to bond the rear surface (43) of the substrate (40) and the module heat dissipation member (110).

[0095] A plurality of inorganic light-emitting elements (50) can be electrically connected to a pixel driving wiring (not shown) formed on a mounting surface (41) and an upper surface wiring layer (not shown) formed by the pixel driving wiring (not shown) and extending through the side (45) of the substrate (40).

[0096] An upper wiring layer (not shown) may be formed on the lower side of an anisotropic conductive layer (47). The upper wiring layer (not shown) may be electrically connected to a side wiring (not shown) formed on the side (45) of the substrate (40). The side wiring (not shown) may be provided in the form of a thin film.

[0097] The upper wiring layer (not shown) can be connected to the side wiring (not shown) by an upper connecting pad (not shown) formed on the edge side of the substrate (41).

[0098] Side wiring (not shown) can be extended along the side (45) of the substrate (40) and connected to a rear wiring layer (43b) formed on the rear surface (43).

[0099] An insulating layer (43c) covering the rear wiring layer (43b) can be formed on the rear wiring layer (43b) in the direction in which the rear side of the substrate (40) faces.

[0100] That is, a plurality of inorganic light-emitting elements (50) can be electrically connected sequentially to an upper wiring layer (not shown), a side wiring layer (not shown), and a rear wiring layer (43b).

[0101] Additionally, as illustrated in FIG. 4, the display module (30A) may include a driving circuit board (80) provided to electrically control a plurality of inorganic light-emitting elements (50) mounted on a mounting surface (41). The driving circuit board (80) may be formed as a printed circuit board. The driving circuit board (80) may be placed on the rear surface (43) of the substrate (40) in a first direction (X). Although to be described in detail later, it may be placed on a module heat dissipation member (110) that is attached to the rear surface (43) of the substrate (40).

[0102] The display module (30A) may include a flexible film (81) connecting the driving circuit board (80) and the rear wiring layer (43b) so that the driving circuit board (80) is electrically connected to a plurality of inorganic light-emitting elements (50).

[0103] More specifically, one end of the flexible film (81) can be placed on the rear surface (43) of the substrate (40) and connected to a rear connection pad (43d) that is electrically connected to a plurality of inorganic light-emitting elements (50).

[0104] The rear connection pad (43d) can be electrically connected to the rear wiring layer (43b). Accordingly, the rear connection pad (43a) can electrically connect the rear wiring layer (43b) and the flexible film (81).

[0105] The flexible film (81) can transmit power and a signal from the driving circuit board (80) to a plurality of inorganic light-emitting elements (50) as it is electrically connected to the rear connection pad (43d).

[0106] The flexible film (81) can be formed from an FFC (Flexible Flat cable) or COF (Chip On Film), etc.

[0107] The flexible film (81) may include a first flexible film (81a) and a second flexible film (81b) respectively arranged in the up and down directions with respect to the first direction (X) which is the front.

[0108] The first and second flexible films (81a, 81b) are not limited thereto and may be arranged in the left and right directions with respect to the first direction (X), or arranged in at least two directions respectively in the up, down, left, and right directions.

[0109] The second flexible film (81b) may be provided in multiple numbers. However, it is not limited thereto, and the second flexible film (81b) may be provided as a single unit, and the first flexible film (81a) may also be provided in multiple numbers.

[0110] The first flexible film (81a) can transmit a data signal from the driving circuit board (80) to the board (40). The first flexible film (81a) can be provided as a COF.

[0111] The second flexible film (81b) can transmit power from the driving circuit board (80) to the board (40). The second flexible film (81b) can be made of FFC.

[0112] However, not limited to this, the first and second flexible films (81a, 81b) may be formed opposite to each other.

[0113] The driving circuit board (80) may be electrically connected to the main board (25, see FIG. 2), although not shown in the drawing. The main board (25) may be placed on the rear side of the frame (60), and the main board (25) may be connected to the driving circuit board (80) via a cable (not shown) at the rear of the frame (60).

[0114] As described above, the module heat dissipation member (110) can be arranged to be in contact with the substrate (40). The module heat dissipation member (110) and the substrate (40) can be bonded by an adhesive tape (70) placed between the rear surface (43) of the substrate (40) and the module heat dissipation member (110).

[0116] The module heat dissipation member (110) may be formed of a material with high thermal conductivity or implemented with a configuration with high thermal conductivity. This will be described in detail later.

[0117] Heat generated from a plurality of inorganic light-emitting elements (50) and a TFT layer (44) mounted on a substrate (40) can be transferred to a module heat dissipation member (110) through an adhesive tape (70) along the rear surface (43) of the substrate (40).

[0118] Accordingly, heat generated from the substrate (40) is easily transferred to the module heat dissipation member (110), and the substrate (40) can be prevented from rising above a certain temperature.

[0119] Multiple display modules (30A-30P) can be arranged in various positions in the form of an M * N matrix. Each display module (30A-30P) is provided to be movable individually. At this time, each display module (30A-30P) individually includes a module heat dissipation member (110) so that a certain level of heat dissipation performance can be maintained regardless of where each display module (30A-30P) is placed.

[0120] Multiple display modules (30A-30P) can form screens of various sizes of the display device (1) in the form of various M * N matrices. Accordingly, rather than heat dissipation through a single heat dissipation member provided for heat dissipation, as in one embodiment of the present invention, each display module (30A-30P) includes an independent module heat dissipation member (110) so that each display module (30A-30P) dissipates heat individually, which can improve the heat dissipation performance of the entire display device (1).

[0121] When a single heat dissipation member is placed inside the display device (1), a portion of the heat dissipation member may not be placed at a position corresponding to where a display module is placed based on the front-rear direction, and a heat dissipation member may be placed at a position where a display module is not placed, so the heat dissipation efficiency of the display device (1) may be reduced.

[0122] That is, through the module heat dissipation member (110) placed on each display module (30A-30P), all display modules (30A-30P) can self-dissipate heat through each module heat dissipation member (110) regardless of where each display module (30A-30P) is placed, thereby improving the heat dissipation performance of the entire display device (1).

[0123] The module heat dissipation member (110) can be provided in a rectangular shape that corresponds approximately to the shape of the substrate (40).

[0124] The area of ​​the substrate (40) may be at least equal to or larger than the area of ​​the module heat dissipation member (110). When the substrate (40) and the module heat dissipation member (110) are arranged side by side in the first direction (X), the four edges of the rectangular substrate (40) with respect to the center of the substrate (40) and the module heat dissipation member (110) may be formed to correspond to the four edges of the module heat dissipation member (110), or may be arranged to be positioned further outward with respect to the center of the substrate (40) and the module heat dissipation member (110) than the four edges of the module heat dissipation member (110).

[0125] Preferably, the four edges of the substrate (40) may be arranged to be positioned further outward than the four edges of the module heat dissipation member (110). That is, the area of ​​the substrate (40) may be arranged to be larger than the area of ​​the module heat dissipation member (110).

[0126] This means that when heat is transferred to each display module (30A-30P), the substrate (40) and the module heat dissipation member (110) may undergo thermal expansion. If the module heat dissipation member (110) is formed of a material with high thermal conductivity or implemented with a configuration with high thermal conductivity, the thermal expansion rate is higher than that of the substrate (40), so the expansion value of the module heat dissipation member (110) is higher than the expansion value of the substrate (40).

[0127] At this time, when the four edges of the substrate (40) correspond to the four edges of the module heat dissipation member (110) or are positioned further inward, the edges of the module heat dissipation member (110) may protrude outward from the substrate (40).

[0128] Accordingly, the spacing length of the gap formed between each display module (30A-30P) may be irregularly formed due to the thermal expansion of the module heat dissipation member (110) of each module (30A-30P), and as a result, the visibility of some parts may increase, and the sense of unity of the screen of the display panel (20) may be reduced.

[0129] However, when the four edges of the substrate (40) are arranged to be positioned outside the four edges of the module heat dissipation member (110), even if the substrate (40) and the module heat dissipation member (110) undergo thermal expansion, the module heat dissipation member (110) does not protrude outside the four edges of the substrate (40), and accordingly, the spacing length of the gap formed between each display module (30A-30P) can be maintained at a constant level.

[0130] According to one embodiment of the present invention, the area of ​​the substrate (40) and the area of ​​the module heat dissipation member (110) can be arranged to correspond approximately. Accordingly, heat generated from the substrate (40) can be dissipated uniformly over the entire area of ​​the substrate (40) without being isolated in some areas.

[0131] The module heat dissipation member (110) can be provided to be attached to the rear surface (43) of the substrate (40) by means of an adhesive tape (70).

[0132] The adhesive tape (70) can be provided with a size corresponding to that of the module heat dissipation member (110). That is, the area of ​​the adhesive tape (70) can be provided to correspond to the area of ​​the module heat dissipation member (110). The module heat dissipation member (110) is provided in a roughly rectangular shape, and the adhesive tape (70) can be provided in a rectangular shape to correspond thereto.

[0133] Based on the center of the module heat dissipation member (110) and the adhesive tape (70), the edges of the rectangular module heat dissipation member (110) and the edges of the adhesive tape (70) can be formed to correspond to each other.

[0134] Accordingly, the module heat dissipation member (110) and the adhesive tape (70) can be easily manufactured as a single combined configuration, thereby increasing the manufacturing efficiency of the entire display device (1).

[0135] That is, when the module heat dissipation member (110) is cut into unit numbers on a single plate, the adhesive tape (70) is pre-adhered to the single plate before the module heat dissipation member (110) is cut, and the adhesive tape (70) and the module heat dissipation member (110) are cut into unit numbers simultaneously, thereby reducing the process.

[0136] Heat generated from the substrate (40) can be transferred to the module heat dissipation member (110) through the adhesive tape (70). Accordingly, the adhesive tape (70) can be configured to attach the module heat dissipation member (110) to the substrate (40) and simultaneously transfer the heat generated from the substrate (40) to the module heat dissipation member (110).

[0137] Accordingly, the adhesive tape (70) may include a material with high heat dissipation performance.

[0138] Basically, the adhesive tape (70) may include an adhesive material to bond the substrate (40) and the module heat dissipation member (110).

[0139] Additionally, the adhesive tape (70) may include a material with higher heat dissipation performance than a material with general adhesive properties. Accordingly, heat can be efficiently transferred between the substrate (40) and the module heat dissipation member (110) to each component.

[0140] In addition, the adhesive material of the adhesive tape (70) can be formed from a material with higher heat dissipation performance than the adhesive material constituting a general adhesive.

[0141] Materials with high heat dissipation performance refer to materials that have high thermal conductivity, high heat transfer, and low specific heat, enabling effective heat transfer.

[0142] For example, the adhesive tape (70) may include a graphite material. However, it is not limited to this, and the adhesive tape (70) may generally be made of a material with high heat dissipation performance.

[0143] The flexibility of the adhesive tape (70) can be configured to be greater than the flexibility of the substrate (40) and the flexibility of the module heat dissipation member (110). Accordingly, the adhesive tape (70) can be provided with a material having high flexibility while possessing adhesiveness and heat dissipation properties. The adhesive tape (70) can be formed as a double-sided tape without a substrate. As described above, since the adhesive tape (70) is formed as a tape without a substrate, it can be formed as a single layer without a substrate supporting the one side and the other side between the one side attached to the substrate (40) and the other side attached to the module heat dissipation member (110).

[0144] Since the adhesive tape (70) does not contain a substrate, it does not contain a material that hinders heat conduction, and thus the heat dissipation performance can be improved. However, the adhesive tape (70) is not limited to a substrate-free double-sided tape and can be provided as a heat dissipation tape with better heat dissipation performance than a general double-sided tape.

[0145] Since the substrate (40) is made of glass and the module heat dissipation member (110) is made of a material with a higher thermal conductivity than the substrate (40), the material properties of each component differ, so the degree of deformation of the material due to the same heat may differ. That is, when heat is generated in the substrate (40), the substrate (40) and the module heat dissipation member (110) may each expand by different sizes due to the heat. Accordingly, a problem may occur in which the display module (30A) is damaged.

[0146] This is because, while the substrate (40) and the module heat dissipation member (110) are fixed to each other, the substrate (40) and the module heat dissipation member (110) have different expansion values ​​at the same temperature, so the substrate (40) and the module heat dissipation member (110) expand to different sizes, and stress may be generated in each component.

[0147] In particular, among the material properties, the thermal expansion coefficients of each material are different, so the degree to which the material is physically deformed by heat varies. In particular, when the thermal expansion coefficient of the module heat dissipation member (110) is greater than that of the substrate (40), when the same amount of heat is transferred to the substrate (40) and the module heat dissipation member (110), the module heat dissipation member (110) may expand and deform more than the substrate (40).

[0148] Conversely, even when heat generation in the substrate (40) ends and the substrate (40) and the module heat dissipation member (110) are each cooled, the module heat dissipation member (110) may shrink and deform more than the substrate (40).

[0149] Since the substrate (40) and the module heat dissipation member (110) are bonded to each other by an adhesive tape (70), an external force can be transmitted to the substrate (40) when the module heat dissipation member (110) is deformed more than the substrate (40).

[0150] Conversely, an external force may be transmitted to the module heat dissipation member (110) by the substrate (40), but if the rigidity of the glass substrate (40) is less than the rigidity of the module heat dissipation member (110), the substrate (40) may be damaged.

[0151] The adhesive tape (70) can be provided to absorb external forces transmitted from different configurations as the substrate (40) and the module heat dissipation member (110) expand to different sizes between the substrate (40) and the module heat dissipation member (110).

[0152] Accordingly, external force is transmitted to the substrate (40) and the module heat dissipation member (110), and in particular, damage to the substrate (40) can be prevented.

[0153] The adhesive tape (70) can be made of a highly flexible material to absorb external forces transmitted from the substrate (40) and the module heat dissipation member (110). Specifically, the flexibility of the adhesive tape (70) can be made greater than the flexibility of the substrate (40) and the flexibility of the module heat dissipation member (110).

[0154] Accordingly, when an external force generated from the size change of the substrate (40) and the module heat dissipation member (110) is transmitted to the adhesive tape (70), the adhesive tape (70) itself is deformed, thereby preventing the external force from being transmitted to different configurations.

[0155] The adhesive tape (70) may have a predetermined thickness in the first direction (X). When heat is transferred to the module heat dissipation member (110) and it expands or contracts due to cooling, the module heat dissipation member (110) may expand or contract not only in the first direction (X) but also in a direction orthogonal to the first direction (X), and accordingly, an external force may be transferred to the substrate (40).

[0156] As described above, the display panel (20) can display an image using a plurality of display modules (30A-30P). At this time, the integrity of the image may be reduced by a seam formed by the gap between the plurality of display modules (30A-30P).

[0157] Accordingly, to minimize the perception of the depth of the display panel (20), a plurality of display modules (30A-30P) may be arranged on the frame (60) to form a certain gap. This is because if the gap formed by the plurality of display modules (30A-30P) is not uniform, the perception of the depth caused by some gaps may be amplified.

[0158] In the case of conventional display devices, the frame supporting the display panel is made of metal. Multiple display modules can be tiled on the metal frame.

[0159] As the display device is operated, the substrate forming the plurality of display modules (30A-30P) may undergo thermal expansion due to heat generated from the display panel. As described above, the plurality of display modules (30A-30P) are supported by a metal frame, and due to the thermal expansion of the substrate and the thermal expansion of the frame, gaps between the plurality of display modules (30A-30P) may be irregularly formed, which may cause a problem in which the perception of the depth is amplified.

[0160] That is, the substrates of the multiple display modules (30A-30P) are all made of glass material so that each substrate can undergo thermal expansion to a certain degree, but due to the thermal expansion of the metal frame supporting each substrate, the width of some of the gaps between the multiple display modules (30A-30P) may be formed irregularly. This is because the physical properties of the metal material and the physical properties of the glass material are different.

[0161] The material properties of a material may differ depending on the coefficient of thermal expansion, specific heat, thermal conductivity, etc. In particular, the degree of thermal expansion of the substrate and the frame may differ due to the difference between the coefficient of thermal expansion of the metal material and the coefficient of thermal expansion of the glass.

[0162] In addition to the thermal expansion of the substrates of the plurality of display modules (30A-30P), the frame itself to which the plurality of display modules (30A-30P) are bonded expands thermally, so the spacing between the plurality of display modules (30A-30P) may change irregularly.

[0163] In order to prevent irregular gaps between the multiple display modules (30A-30P) due to thermal expansion as the multiple display modules (30A-30P) are arrayed on a metal frame as described above, the frame (60) of the display device (1) according to one embodiment of the present invention may be made of a material that is formed with material properties similar to the material properties of the substrate (40) of the multiple display modules (30A-30P) to which the multiple display modules (30A-30P) are bonded.

[0164] That is, the frame (60) may be provided to have material properties similar to those of the substrate (40) so that the spacing length of the gap formed between each display module (30A-30P) is maintained constant.

[0165] The meaning that it is formed with material properties similar to the material properties of the substrate (40) described above may include the meaning that the coefficient of thermal expansion, specific heat, and thermal conductivity of the substrate (40) are similar. In particular, according to one embodiment of the present invention, it may be interpreted to mean that the coefficient of thermal expansion of the substrate (40) and the coefficient of thermal expansion of the frame (60) correspond.

[0166] The frame (60) may be formed from a material having material properties similar to those of the substrate (40) or provided with a material having a similar coefficient of thermal expansion. Preferably, it may be formed from a material having the same value as the coefficient of thermal expansion of the substrate (40).

[0167] Not limited thereto, the frame (60) may include a front layer (not shown) formed of a material having material properties corresponding to the material properties of the substrate (40).

[0168] As the substrate (40) is bonded to the front layer (not shown) in the first direction (X), it can be arranged to expand to a corresponding length when the same heat is transferred to the substrate (40) and the front layer (not shown) in the second direction (Y) or the third direction (Z) which is orthogonal to the first direction (X).

[0169] That is, in any embodiment, when the frame (60) is formed entirely of a material having material properties corresponding to the substrate (40), or when only the front layer (not shown) constituting the front of the frame (60) is formed of a material having material properties corresponding to the substrate (40), the front of the frame (60) to which the substrates (40) of the display modules (30A-30P) are attached can be thermally expanded to the same value as the substrate (40) when the substrates (40) of the plurality of display modules (30A-30P) are thermally expanded due to heat generated while the display device (1) is operating.

[0170] As the front surface of the frame (60), which is the base surface to which the plurality of display modules (30A-30P) are bonded, expands thermally by the same amount as the substrate (40) of the plurality of display modules (30A-30P), the gap formed between the plurality of display modules (30A-30P) can be maintained at the same level.

[0171] Accordingly, the gap formed between the multiple display modules (30A-30P) can maintain a gap spacing distance identical to the state in which the substrate (40) is not thermally expanded, thereby maintaining a certain level of seam and maintaining the integrity of the screen of the display panel (20).

[0172] Therefore, even if heat generated by the operation of the display device (1) is supplied to the substrate (40) of the plurality of display modules (30A-30P), the gap distance between the plurality of display modules (30A-30P) is maintained at a constant, thereby preventing the phenomenon in which some of the cores are amplified and the integrity of the screen is reduced.

[0173] The frame (60) is configured to support the display panel (20) and may be provided to have a rigidity greater than a certain size. Accordingly, the main body of the frame (60) may be formed of a metal material having a rigidity greater than a certain level, and the front surface of the frame (60) may be formed of a glass material corresponding to the substrate (40).

[0174] However, the frame (60) is not limited to this and may be formed of a material having a thermal expansion coefficient different from that of the substrate (40). This is because a panel heat dissipation member (120) is additionally disposed between the frame (60) and the plurality of display modules (30A-30P). This will be described in detail later.

[0175] Hereinafter, a heat dissipation member (100) according to one embodiment of the present invention will be described in detail.

[0176] FIG. 5 is a rear perspective view of a part of the display panel of the display device of FIG. 1, FIG. 6 is a rear view showing the main components of the display device of FIG. 1 disassembled, FIG. 7 is a simplified cross-sectional view showing heat transfer in a part of the display device of FIG. 1, FIG. 8 is a simplified rear view showing heat transfer in a part of the display device of FIG. 1.

[0177] As described above, the display panel (20) of the display device (1) according to one embodiment of the present invention is composed of a plurality of inorganic light-emitting elements (50) themselves as pixels, and accordingly, when configuring the display, the power consumption of each of the plurality of inorganic light-emitting elements (50) may differ depending on the image displayed. Accordingly, the heat generated from each of the plurality of inorganic light-emitting elements (50) may differ from one another.

[0178] In particular, in the case of a red light-emitting element (51), the brightness of the light generated according to the temperature of the light-emitting element itself is large, so when concentrated heat is generated in some areas on the display panel (20), the brightness of the red light-emitting element (51) in the concentrated heat area may be particularly reduced, and accordingly, the uniformity of the screen of the display panel (20) may be reduced.

[0179] Non-uniformity resulting from the reduction in brightness of a portion of the screen may occur within each module of the plurality of display modules (30A-30P) and between the plurality of display modules (30A-30P), which may reduce the reliability of the display device (1).

[0180] Accordingly, in the case of a display device (1) in which a plurality of inorganic light-emitting elements (50) themselves are composed of pixels, it must be provided not only to dissipate heat generated from a plurality of display modules (30A-30P) but also to maintain a constant temperature within the modules and between the modules of the plurality of display modules (30A-30P).

[0181] To solve such problems, a display device (1) according to one embodiment of the present invention may include a heat dissipation member (100) provided to maintain a constant temperature within and between modules of a plurality of display modules (30A-30P).

[0182] The heat dissipation member (100) may include a module heat dissipation member (110) that is attached to the rear surface of each substrate (40) of the plurality of display modules (30A-30P) described above.

[0183] The heat dissipation member (100) may include a panel heat dissipation member (120) that connects each module heat dissipation member (110) to dissipate heat between each module heat dissipation member (110) of a plurality of display modules (30A-30P) and is positioned at the rear end of the display panel (20).

[0184] The module heat dissipation member (110) can be provided to dissipate heat generated from the substrate (40) as described above.

[0185] The heat generated in the substrate (40) can be viewed as the sum of the heat transferred from the substrate (40) and from the outside of the substrate (40) and the configuration within the substrate (40) including a plurality of inorganic light-emitting elements (50).

[0186] Given that the heat generated from the plurality of inorganic light-emitting elements (50) accounts for the largest proportion of the heat generated from the substrate (40), the heat generated from the substrate (40) or the plurality of display modules (30A-30P) described below is explained primarily based on the heat transferred from the plurality of inorganic light-emitting elements (50) to the substrate (40).

[0187] However, as described above, the meaning of the heat generated in the substrate (40) can be seen as the sum of the heat generated from the plurality of inorganic light-emitting elements (50), as well as the heat transferred from the configuration placed on the substrate (40) and from the outside of the substrate (40).

[0188] When heat is generated at any point in the second direction (Y) or the third direction (Z) on the substrate (40), this heat can be interpreted as heat generated from a portion of a plurality of inorganic light-emitting elements (50) positioned at a location corresponding to the first direction (X) and the point in the second direction (Y) or the third direction (Z) on the substrate (40) being transferred to the substrate (40).

[0189] More specifically, it is the sum of the heat generated from the part of the plurality of inorganic light-emitting elements (50) itself, which is positioned at a point on the substrate (40) in the second direction (Y) or the third direction (Z) and a position corresponding to the first direction (X), as well as other components on the substrate (40) supplied to a point on the substrate (40) and the heat generated from outside the substrate (40).

[0190] That is, when high heat is generated at one point on the substrate (40), high heat can be generated in some of the plurality of inorganic light-emitting elements (50) that are positioned at a location corresponding to this point and the first direction (X) among the plurality of inorganic light-emitting elements (50), and the high heat can be transferred to one point on the substrate (40).

[0191] However, not limited to this, even if high heat is not generated in some of the plurality of inorganic light-emitting elements (50) that are positioned at a location corresponding to a point on the substrate (40) and the first direction (X) among the plurality of inorganic light-emitting elements (50), high heat may be generated at a point on the substrate (40) by other configurations on the substrate (40) supplied to the point on the substrate (40) and by heat generated from outside the substrate (40).

[0192] In addition, when heat generated from other configurations on the substrate (40) and from the outside of the substrate (40) is supplied to a portion of a plurality of inorganic light-emitting elements (50) positioned at a location corresponding to a point on the substrate (40) and the first direction (X), high heat may be generated for reasons other than light emission in a portion of the plurality of inorganic light-emitting elements (50) positioned at a location corresponding to a point on the substrate (40) and the first direction (X), and this may be transferred to a point on the substrate (40) and high heat may be generated at a point on the substrate (40).

[0193] However, below, when high heat is generated at one point on the substrate (40), this is described as an example in which high heat is generated in some of the plurality of inorganic light-emitting elements (50) that are positioned at a location corresponding to this point and the first direction (X) among the plurality of inorganic light-emitting elements (50), and the high heat is transferred to one point on the substrate (40).

[0194] The module heat dissipation member (110) may be configured to preferentially move heat generated from the substrate (40) in the opposite direction of the first direction (X) from the substrate (40), while simultaneously moving it in the second direction (Y) or the third direction (Z). Accordingly, even if high heat is transferred in the opposite direction of the first direction (X) to a part of the module heat dissipation member (110), heat is transferred uniformly over the entire surface area of ​​the module heat dissipation member (110), and accordingly, the module heat dissipation member (110) can be in a state of thermal equilibrium in the second direction (Y) and the third direction (Z).

[0195] As the module heat dissipation member (110) reaches a state of thermal equilibrium, heat is transferred uniformly in the area direction to the substrate (40) that is in contact with the module heat dissipation member (110), so that the substrate (40) can also reach a state of thermal equilibrium.

[0196] More specifically, heat generated in a part of the substrate (40) in the opposite direction of the first direction (X) is transferred to the module heat dissipation member (110), then transferred to the entire surface of the module heat dissipation member (110), and the heat can be transferred again to the entire surface of the substrate (40) in the first direction (X).

[0197] Accordingly, the temperature of the entire substrate (40) is maintained at a constant level, and accordingly, a decrease in brightness due to temperature may not occur in some areas.

[0198] That is, the module heat dissipation member (110) can transfer heat received from the substrate (40) in the opposite direction of the first direction (X) from the substrate (40), and can additionally be provided to rapidly diffuse heat in the second direction (Y) or the third direction (Z).

[0199] Afterward, heat generated in a part of the substrate (40) can be transferred back to the substrate (40) after reaching a state of thermal equilibrium in the module heat dissipation member (110). At this time, heat of uniform temperature is transferred back to the substrate (40) from the entire surface area of ​​the module heat dissipation member (110) in the first direction (X), and accordingly, the temperature of the substrate (40) can be maintained uniformly in the second direction (Y) and the third direction (Z).

[0200] Afterwards, heat that forms a state of thermal equilibrium over the entire surface area of ​​the substrate (40) can be uniformly transferred to the plurality of inorganic light-emitting elements (50) mounted on the substrate (40).

[0201] Accordingly, even if heat is generated intensively in some of the multiple inorganic light-emitting elements (50), the heat is transferred uniformly from the substrate (40) to the multiple inorganic light-emitting elements (50) in the first direction (X), so that the multiple inorganic light-emitting elements (50) can maintain a roughly uniform temperature, and thus the brightness of the light generated from the multiple inorganic light-emitting elements (50) can be maintained at a constant level.

[0202] The module heat dissipation member (110) may be made of a material with high thermal conductivity. For example, the module heat dissipation member (110) may be made of a metal material such as aluminum or copper. In addition, the module heat dissipation member (110) may be made of graphite.

[0203] Accordingly, the module heat dissipation member (110) can easily spread heat in the second direction (Y) or the third direction (Z) through heat conduction.

[0204] Preferably, the module heat dissipation member (110) can be provided as a vapor chamber. The vapor chamber is provided in a plate shape corresponding to the substrate (40) and can rapidly transfer heat in a second direction (Y) or a third direction (Z) through evaporation and condensation processes.

[0205] As shown in FIGS. 5 and 6, the panel heat dissipation member (120) may be positioned at the rear of each module heat dissipation member (110) of a plurality of display modules (30A-30P) in the opposite direction of the first direction (X).

[0206] The panel heat dissipation member (120) can be arranged to be in contact with the module heat dissipation member (110) of each of the plurality of display modules (30A-30P).

[0207] The panel heat dissipation member (120) may include a first area (121) that extends in a second direction (Y) and covers each upper and lower side (45a) of a plurality of display modules (30A-30P) in the opposite direction of the first direction (X), and a second area (122) that extends in a third direction (Z) and covers each left and right side (45) of a plurality of display modules (30A-30P) in the opposite direction of the first direction (X).

[0208] The first region (121) and the second region (122) may be provided with a plurality of rib shapes that are orthogonal to the second direction (Y) and the third direction (Z).

[0209] Accordingly, the rear portions of the four edges of the module heat dissipation member (110) of each of the plurality of display modules (30A-30P) can be arranged to be in contact with the first area (121) and the second area (122).

[0210] A plurality of display modules (30A-30P) may include a first display module (30A), a second display module (30E) horizontally arranged in a second direction relative to the first display module (30A), a third display module (30B) arranged in a third direction (Z) relative to the first display module (30A), and a fourth display module (30F) arranged in a second direction (Y) relative to the third display module (30B).

[0211] For example, the first region (121) of the panel heat dissipation member (120) can cover the upper and lower sides of the module heat dissipation member (110) corresponding to the upper and lower sides (45a) of the first, second, third, and fourth display modules (30A, 30E, 30B, 30F) in the first direction (X).

[0212] In addition, the second area (122) of the panel heat dissipation member (120) can cover the left and right sides of the module heat dissipation member (110) corresponding to the left and right sides (45b) of the first, second, third, and fourth display modules (30A, 30E, 30B, 30F) in the first direction (X).

[0213] Accordingly, the panel heat dissipation member (120) can be arranged to be connected to the entire module heat dissipation member (110) of the plurality of display modules (30A-30P).

[0214] The panel heat dissipation member (120) may be configured to transfer heat between the module heat dissipation members (110) so that each of the module heat dissipation members (110) of the plurality of display modules (30A-30P) becomes in a state of thermal equilibrium when the amount of heat remaining between the module heat dissipation members (110) of the plurality of display modules (30A-30P) is different.

[0215] That is, heat is conducted through the panel heat dissipation member (120) to the module heat dissipation member (110) of an adjacent display module among the module heat dissipation members (110) of the plurality of display modules (30A-30P), so that the entire module heat dissipation member (110) of the plurality of display modules (30A-30P) can gradually reach a state of thermal equilibrium. This will be described in detail later.

[0216] The panel heat dissipation member (120) can be attached to the module heat dissipation member (110) by means of an adhesive tape. However, it is not limited to this and can be attached to the module heat dissipation member (110) by various methods.

[0217] The panel heat dissipation member (120) can be in contact with a plurality of display modules (30A-30P) as described above in the first direction (X), and can be arranged to be in contact with the frame (60) in the opposite direction of the first direction (X).

[0218] The panel heat dissipation member (120) can be provided in a shape corresponding to the frame (60) in the first direction (X).

[0219] The panel heat dissipation member (120) may be made of a material with high thermal conductivity. The panel heat dissipation member (120) may be made of a metal material.

[0220] Preferably, the panel heat dissipation member (120) may be made of a metal material having a thermal expansion coefficient corresponding to the thermal expansion coefficient of the substrate (40). The panel heat dissipation member (120) may be made of a nickel alloy.

[0221] As described above, a plurality of display modules (30A-30P) can be attached to the front of the panel heat dissipation member (120), and a frame (60) can be attached to the rear of the panel heat dissipation member (120).

[0222] Accordingly, a panel heat dissipation member (120) can be placed between a plurality of display modules (30A-30P) and a frame (60) in the first direction (X).

[0223] That is, since a plurality of display modules (30A-30P) are directly attached to the panel heat dissipation member (120), in order to maintain the spacing formed between the plurality of display modules (30A-30P), the panel heat dissipation member (120) must have a thermal expansion coefficient value corresponding to the thermal expansion coefficient value of the substrate (40).

[0224] The thermal expansion coefficient of the nickel alloy is provided to be approximately the same value as the thermal expansion coefficient of the glass. Preferably, when the panel heat dissipation member (120) is provided with a nickel alloy, it is possible to prevent the spacing between the multiple display modules (30A-30P) from changing irregularly even when heat is generated in the multiple display modules (30A-30P).

[0225] Accordingly, the thermal expansion coefficient of the frame (60) is provided with a material having a value different from the thermal expansion coefficient of the substrate (40), so that even if the gap between the multiple display modules (30A-30P) changes irregularly due to the panel heat dissipation member (120), it is possible to prevent the gap between the multiple display modules (30A-30P) from changing irregularly.

[0226] However, the nickel alloy is merely an example of forming the panel heat dissipation member (120) and is not limited thereto.

[0227] Unlike one embodiment of the present invention, the panel heat dissipation member (120) may be formed as a component of the frame (60).

[0228] That is, the panel heat dissipation member (120) can be replaced with the front layer (not shown) of the frame (60) described above. At this time, a plurality of display modules (30A-30P) can be arranged to be directly attached to the frame (60).

[0229] More specifically, a plurality of display modules (30A-30P) can be directly attached to a front layer (not shown) of a frame (60). The front layer (not shown) is provided in the same manner as a panel heat dissipation member (120), so that heat can be transferred between the module heat dissipation members (110) of the plurality of display modules (30A-30P), and even if heat is generated, it can prevent the spacing between the plurality of display modules (30A-30P) from changing irregularly.

[0230] Below, the characteristics of heat transfer in the module heat dissipation member (110) and the panel heat dissipation member (120) are described in detail.

[0231] As illustrated in FIGS. 7 and 8, when high heat is generated at a point on the substrate (40A) of the first display module (30A) (hereinafter referred to as the hot spot (H)), the high heat can be transferred to the first module heat dissipation member (110A) of the first display module (30A) corresponding to the hot spot (H) in the opposite direction of the first direction (X).

[0232] As described above, the hot spot (H) is a point where heat generated from a plurality of inorganic light-emitting elements (50) positioned in a location corresponding to the first direction (X) is transferred to the substrate (40), and can be formed as some of the inorganic light-emitting elements (50) generate more heat than other inorganic light-emitting elements.

[0233] As described above, the reason high heat is generated at the hot spot (H) is not only due to heat generated from the part of the plurality of inorganic light-emitting elements (50) itself that is positioned in the first direction (X) corresponding to the hot spot (H) among the plurality of inorganic light-emitting elements (50), but also due to other causes. However, below, the heat generated from the part of the plurality of inorganic light-emitting elements (50) itself that is positioned in the first direction (X) corresponding to the hot spot (H) among the plurality of inorganic light-emitting elements (50) will be explained as an example.

[0234] High heat transferred in the opposite direction of the first direction (X) can be diffused (T1) in the second direction (Y) and the third direction (Z) on the first module heat dissipation member (110A). Accordingly, the first module heat dissipation member (110A) can reach thermal equilibrium. Therefore, the difference in brightness of the display screen that may be caused by a temperature difference inside the first display module (30A) can be reduced.

[0235] At this time, since a hot spot (H) is generated only on the first display module (30A), the first display module (30A) may retain high heat compared to the second display module (30E) and the third display module (30B) adjacent to the first display module (30A).

[0236] Accordingly, the brightness of the display screen displayed in the first display module (30A) may be reduced compared to the second display module (30E) and the third display module (30B).

[0237] However, the high heat remaining in the first module heat dissipation member (110A) can be transferred to the second module heat dissipation member (110E) of the second display module (30E) and the third module heat dissipation member (110B) of the third display module (30B) by the panel heat dissipation member (120).

[0238] More specifically, the heat remaining in the first module heat dissipation member (110A) can be conducted (T2) to the second module heat dissipation member (110E) through the first part (122a) of the second area (122) positioned between the first display module (30A) and the second display module (30E).

[0239] In addition, the high heat remaining in the first module heat dissipation member (110A) can be conducted to the second module heat dissipation member (110E) through the first region (121) and transferred to the second module heat dissipation member (110E).

[0240] Due to the high heat transferred from the first module heat dissipation member (110E) to the second module heat dissipation member (110E) through the panel heat dissipation member (120), the high heat is transferred to only a part of the second module heat dissipation member (110E), and a temperature imbalance may occur on the second module heat dissipation member (110E).

[0241] At this time, thermal equilibrium can be reached inside the second module heat dissipation member (110E) through diffusion (T3) from within in a high-temperature region on the second module heat dissipation member (110E). Accordingly, the first module heat dissipation member (110A) and the second module heat dissipation member (110E) can each reach thermal equilibrium at the same temperature.

[0242] Likewise, the high heat remaining in the first module heat dissipation member (110A) can be conducted (T2) to the third module heat dissipation member (110B) through the first part (121a) of the first area (121) disposed between the first display module (30A) and the third display module (30B).

[0243] In addition, the high heat remaining in the first module heat dissipation member (110A) can be conducted to the third module heat dissipation member (110B) through the second region (122) and transferred to the third module heat dissipation member (110B).

[0244] Due to the high heat transferred from the first module heat dissipation member (110E) to the third module heat dissipation member (110B) through the panel heat dissipation member (120), the high heat is transferred to only a part of the third module heat dissipation member (110B), and a temperature imbalance may occur on the third module heat dissipation member (110B).

[0245] At this time, thermal equilibrium can be reached inside the third module heat dissipation member (110B) through diffusion (T3) from within in a high-temperature region on the third module heat dissipation member (110B). Accordingly, the first module heat dissipation member (110A) and the third module heat dissipation member (110B) can each reach thermal equilibrium at the same temperature.

[0246] Similarly, heat can be transferred to a fourth display module (30F) positioned between the second display module (30E) and the third display module (30B).

[0247] High heat remaining in the second and third module heat dissipation members (110E, 110B) can be conducted to the fourth module heat dissipation member (110F) through the second part (121b) of the first area (121) positioned between the second display module (30E) and the fourth display module (30F), and the second part (122b) of the second area (122) positioned between the third display module (30B) and the fourth display module (30F).

[0248] In this way, heat is conducted to the display modules adjacent to the first display module (30A), and as each display module gradually reaches thermal equilibrium, the entire plurality of display modules (30A-30P) reach thermal equilibrium, and accordingly, the decrease in brightness due to the temperature imbalance between the plurality of display modules (30A-30P) can be reduced.

[0249] Although the technical concept of the present invention has been explained above through specific embodiments, the scope of the present invention is not limited to these embodiments. Various embodiments that can be modified or varied by those skilled in the art within the scope that does not deviate from the gist of the technical concept of the present invention as specified in the claims shall also be considered to fall within the scope of the present invention. Explanation of the symbols

[0250] 1 : Display device 10 : Rear cover 20: Display panel 30, 30A - 30P: Display module 40 : Substrate 41 : Mounting surface 42 : Base board 43 : Rear 44: TFT layer 50, 51, 52, 53: Inorganic light-emitting diode 60 : Frame 70 : Adhesive tape 100 : Heat dissipation member 110 : Module heat dissipation member 120 : Panel heat dissipation member

Claims

Claim 1 A display device comprising a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules includes a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member having an area corresponding to the rear surface of the substrate to dissipate heat generated from the substrate and in contact with the rear surface of the substrate, wherein the display panel includes a panel heat dissipation member connecting each of the module heat dissipation members to dissipate heat between each of the plurality of display modules, and wherein the panel heat dissipation member is provided to extend along adjacent edges between each of the module heat dissipation members and is provided to connect adjacent module heat dissipation members among each of the module heat dissipation members. Claim 2 In claim 1, the module heat dissipation member is provided in a metal material for the display device. Claim 3 In claim 1, the module heat dissipation member is provided as a vapor chamber in a display device. Claim 4 In claim 1, the panel heat dissipation member is provided in a metal material for the display device. Claim 5 In paragraph 4, the panel heat dissipation member is a display device formed of a nickel alloy. Claim 6 A display device according to claim 1, wherein the thermal expansion coefficient of the panel heat dissipation member is provided as a value corresponding to the thermal expansion coefficient of the substrate. Claim 7 In claim 1, the panel heat dissipation member is provided to support the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, thereby forming a display device. Claim 8 A display device according to claim 1, wherein the module heat dissipation member is provided such that high heat generated at one point of the substrate is transferred to the entire surface area of ​​the substrate in a direction horizontal to the substrate, so that the substrate is maintained in a state of thermal equilibrium in a direction horizontal to the substrate. Claim 9 A display device according to claim 1, wherein the module heat dissipation member comprises four edges corresponding to each of the four edges of the substrate, and the area of ​​the substrate is provided to be at least equal to or larger than the area of ​​the module heat dissipation member. Claim 10 In claim 1, the plurality of display modules includes a first display module including a first substrate and a second display module including a second substrate arranged horizontally with respect to the first display module, the module heat dissipation member includes a first module heat dissipation member corresponding to the first display module and a second module heat dissipation member corresponding to the second display module, and the panel heat dissipation member is arranged to contact the rear surface of the first module heat dissipation member and the rear surface of the second module heat dissipation member, respectively. Claim 11 In claim 10, the panel heat dissipation member is configured to transfer heat from the first module heat dissipation member to the second module heat dissipation member so that the first module heat dissipation member and the second module heat dissipation member are each in a state of thermal equilibrium when the amount of heat remaining in the first module heat dissipation member by the first substrate is greater than the amount of heat remaining in the second module heat dissipation member by the second substrate. Claim 12 In claim 9, the panel heat dissipation member is a display device configured to cover all four edges of the module heat dissipation members of each of the plurality of display modules in the rear direction. Claim 13 A display device according to claim 1, further comprising a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, and wherein the panel heat dissipation member is arranged to be in contact with the frame in the front-rear direction. Claim 14 A display device according to claim 13, wherein the thermal expansion coefficient of the panel heat dissipation member is provided as a value corresponding to the thermal expansion coefficient of the frame. Claim 15 A display device comprising a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules comprises a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member having an area corresponding to the rear surface of the substrate and in contact with the rear surface of the substrate to dissipate heat generated from the substrate, wherein the module heat dissipation member is formed as a vapor chamber configured to transfer high heat generated at one point of the substrate to the entire area of ​​the substrate in a direction horizontal to the substrate so that the substrate is maintained in a state of thermal equilibrium in a direction horizontal to the substrate, and wherein the display panel comprises a panel heat dissipation member connecting each of the module heat dissipation members to dissipate heat between each of the plurality of display modules, wherein the panel heat dissipation member is configured to extend along adjacent edges between each of the module heat dissipation members and is configured to connect adjacent module heat dissipation members among each of the module heat dissipation members by contacting each of the module heat dissipation members. Display device. Claim 16 delete Claim 17 In claim 15, the panel heat dissipation member is a display device formed of a metal material. Claim 18 A display device according to claim 17, wherein the thermal expansion coefficient of the panel heat dissipation member is provided as a value corresponding to the thermal expansion coefficient of the substrate. Claim 19 A display device according to claim 18, further comprising a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, wherein the panel heat dissipation member is arranged to be in contact with the frame in the front-rear direction. Claim 20 A display device comprising a display panel in which a plurality of display modules are horizontally arranged in an M*N matrix form, wherein the display device comprises: a display panel comprising a plurality of display modules; and a frame supporting the plurality of display panels so that the plurality of display modules are horizontally arranged in an M*N matrix form; wherein each of the plurality of display modules comprises a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and a module heat dissipation member having an area corresponding to the rear surface of the substrate to dissipate heat generated from the substrate and contacting the rear surface of the substrate, wherein the display panel is provided in a shape corresponding to the frame in the front-rear direction and includes a panel heat dissipation member connecting each of the module heat dissipation members to dissipate heat between each of the plurality of display modules, and wherein the panel heat dissipation member is provided to extend along adjacent edges between each of the module heat dissipation members and is provided to connect adjacent module heat dissipation members among each of the module heat dissipation members.

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