Light emitting display device and color conversion panel

Abstract

According to embodiments, the light-emitting display device comprises: a lower panel including an anode electrode, a light-emitting layer, a cathode electrode, and a pixel defining film having an opening for a light-emitting diode that exposes a portion of the anode electrode; and an upper panel located above the lower panel and including a partition and a plurality of spacers, wherein the partition may overlap with the plurality of spacers in a planar manner and includes a plurality of spacer-forming portions extending in a first direction, and the plurality of spacers overlap with a portion of the plurality of spacer-forming portions.

Description

Technology Field

[0001] The present disclosure relates to a light-emitting display device and a color-changing panel, and more specifically, to a light-emitting display device and a color-changing panel including a spacer. Background Technology

[0002] Light-emitting display devices are devices that display images, including Liquid Crystal Displays (LCDs) and Organic Light Emitting Diodes (OLEDs). These light-emitting display devices are used in a wide variety of electronic devices, such as mobile phones, navigation systems, digital cameras, e-books, portable game consoles, and various terminals.

[0003] An organic light-emitting display comprises two electrodes and an organic light-emitting layer located between them. Electrons injected from one electrode and holes injected from the other electrode combine in the organic light-emitting layer to form excitons. As the excitons transition from the excited state to the ground state, they release energy and emit light.

[0004] Recently, a light-emitting display device including a color conversion panel has been proposed to reduce light loss and realize a light-emitting display device with a high color reproduction rate. The color conversion panel may include a color conversion layer containing semiconductor nanocrystals such as quantum dots, and can convert incident light into different colors. The problem to be solved

[0005] The embodiments are for forming a spacer in an inkjet manner on a color conversion panel of a light-emitting display device. means of solving the problem

[0006] A light-emitting display device according to one embodiment comprises: a lower panel including an anode electrode, a light-emitting layer, a cathode electrode, and a pixel defining film having an opening for a light-emitting diode that exposes a portion of the anode electrode; and an upper panel located above the lower panel and including a partition wall and a plurality of spacers, wherein the partition wall may overlap with the plurality of spacers in a planar manner and includes a plurality of spacer forming portions that extend long in a first direction, and the plurality of spacers overlap with a portion of the plurality of spacer forming portions.

[0007] The spacing between the plurality of spacers adjacent in the first direction corresponds to an integer multiple of the spacing between adjacent pixels in the first direction, and the spacing between adjacent spacers adjacent in the second direction perpendicular to the first direction may not correspond to an integer multiple of the spacing between adjacent pixels in the second direction.

[0008] The first direction above is the same direction as the extension direction of the head of the inkjet equipment forming the spacer, and may be a direction perpendicular to the direction in which the head of the inkjet equipment moves.

[0009] The above spacer has a diameter of 10㎛ or more and 30㎛ or less, and may have a height of 2㎛ or more and 10㎛ or less.

[0010] In the spacer forming portion above, the margin in the first direction excluding the spacer may be 14.1㎛ or more and 70.5㎛.

[0011] The head of the inkjet equipment includes a plurality of nozzles, and the margin in the first direction may be equal to the spacing between the minimum nozzles in the first direction of the plurality of nozzles.

[0012] The length of the first direction of the spacer forming portion may be 24.1 μm or more and 90.5 μm or less.

[0013] The above bulkhead further includes an additional margin portion located around the spacer forming portion, and the additional margin portion may have a width of 5㎛ or more and 15㎛ or less.

[0014] The planar shape of the additional margin portion may be the same as or different from the planar shape of the spacer forming portion.

[0015] The upper panel further includes an upper capping layer, wherein the upper capping layer comprises one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon nitrate (SiOxNy), and the upper capping layer may cover the partition and the spacer.

[0016] The upper panel further includes an upper capping layer, wherein the upper capping layer comprises one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon nitrate (SiOxNy), and the upper capping layer may be located between the partition and the spacer.

[0017] The above partition wall includes a first opening, a second opening, and a third opening, and the upper panel may further include a first color conversion layer located within the first opening, a second color conversion layer located within the second opening, and a transparent layer located within the third opening.

[0018] The pixel defining film includes a plurality of openings for the light-emitting diode, and each of the plurality of openings for the light-emitting diode can overlap in a plane with the first opening, the second opening, and the third opening of the partition wall.

[0019] The upper panel further includes a first color filter, a second color filter, and a third color filter, wherein the first color filter overlaps planarly with the first color conversion layer, the second color filter overlaps planarly with the second color conversion layer, and the third color filter overlaps planarly with the transmission layer, and the light-blocking area where at least two of the first color filter, the second color filter, and the third color filter overlap can overlap planarly with the partition wall.

[0020] The above bulkhead further includes a dummy opening, and the dummy opening may overlap with the shading area in a plane.

[0021] A color conversion panel according to one embodiment comprises: a plurality of spacers; a partition wall including a first opening, a second opening, and a third opening, which can overlap in a plane with the plurality of spacers and includes a plurality of spacer-forming portions extending in a first direction; a first color conversion layer located within the first opening; a second color conversion layer located within the second opening; and a transparent layer located within the third opening, wherein each of the plurality of spacers overlaps with a portion of the plurality of spacer-forming portions.

[0022] The above plurality of spacers may have different spacing between adjacent spaces in the first direction and between adjacent spaces in the second direction perpendicular to the first direction.

[0023] The first direction above is the same direction as the extension direction of the head of the inkjet equipment forming the spacer, and may be a direction perpendicular to the direction in which the head of the inkjet equipment moves.

[0024] The above bulkhead further includes a plurality of additional margin portions located around each of the plurality of spacer forming portions, each of the plurality of spacers has a diameter of 10㎛ or more and 30㎛ or less and a height of 2㎛ or more and 10㎛ or less, the margin in the first direction excluding the spacers located in each of the plurality of spacer forming portions is 14.1㎛ or more and 70.5㎛, and each of the plurality of additional margin portions may have a width of 5㎛ or more and 15㎛ or less.

[0025] The apparatus further includes a first color filter, a second color filter, and a third color filter, wherein the first color filter overlaps planarly with the first color conversion layer, the second color filter overlaps planarly with the second color conversion layer, and the third color filter overlaps planarly with the transmission layer, and the light-blocking area where at least two of the first color filter, the second color filter, and the third color filter overlap overlaps planarly with the partition wall, and the partition wall further includes a dummy opening, and the dummy opening may overlap planarly with the light-blocking area. Effects of the invention

[0026] According to the embodiments, the partition wall in the portion where the spacer is formed among the partition walls located in the color conversion panel of the light-emitting display device is formed long in one direction, so that the spacer can be formed on it using an inkjet method. Brief explanation of the drawing

[0027] FIG. 1 is a schematic cross-sectional view of a light-emitting display device according to one embodiment. FIG. 2 is a cross-sectional view showing a color conversion panel among a light-emitting display device according to one embodiment. FIG. 3 is a cross-sectional view showing a light-emitting display device according to an embodiment of FIG. 2. FIG. 4 is a diagram illustrating the step of forming a spacer on a color conversion panel of a light-emitting display device using an inkjet method in one embodiment. FIG. 5 is a drawing illustrating a head of an inkjet equipment according to one embodiment. FIG. 6 is a plan view illustrating a spacer and a bulkhead around the spacer according to one embodiment. FIG. 7 is a drawing illustrating the planar position of a spacer according to an embodiment. FIG. 8 is a plan view of a color conversion panel of a light-emitting display device according to one embodiment. FIG. 9 is a plan view illustrating a spacer and a bulkhead around the spacer according to a comparative example. FIG. 10 is a plan view of a color conversion panel of a light-emitting display device according to a comparative example. FIGS. 11 to 15 are plan views illustrating spacers and bulkheads around spacers according to various embodiments. FIGS. 16 and FIGS. 17 are plan views of a color conversion panel of a light-emitting display device according to another embodiment. FIG. 18 is a cross-sectional view showing a part of a light-emitting display device according to another embodiment. FIG. 19 is a cross-sectional view showing a light-emitting display device according to an embodiment of FIG. 18. Specific details for implementing the invention

[0028] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein.

[0029] To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0030] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings.

[0031] Furthermore, when a part such as a layer, membrane, region, plate, or component is said to be "on" or "on" another part, this includes not only cases where it is "immediately above" the other part, but also cases where there is another part in between. Conversely, when a part is said to be "immediately above" another part, it means that there is no other part in between. Also, being "on" or "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "on" in the direction opposite to gravity.

[0032] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0033] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0034] Furthermore, throughout the specification, when the term "connected" is used, it does not mean only cases where two or more components are directly connected, but may also include cases where two or more components are indirectly connected through other components, cases where they are physically or electrically connected, as well as cases where each part, which is substantially one and referred to by different names depending on its location or function, is connected to one another.

[0035] In addition, throughout the specification, when a part of a wiring, layer, film, region, plate, component, etc. is described as "extending in a first direction or a second direction," this does not mean only a straight line shape extending in that direction, but also includes a structure that extends overall along the first direction or the second direction, and includes a structure that is bent in one part, has a zigzag structure, or extends while including a curved structure.

[0036] In addition, electronic devices including light-emitting display devices, display panels, etc. described in the specification (e.g., mobile phones, TVs, monitors, laptop computers, etc.) or electronic devices including light-emitting display devices, display panels, etc. manufactured by the manufacturing method described in the specification are not excluded from the scope of rights of this specification.

[0037] Hereinafter, a light-emitting display device according to one embodiment will be examined with reference to FIGS. 1 to 3.

[0038] FIG. 1 is a schematic cross-sectional view of a light-emitting display device according to one embodiment, FIG. 2 is a cross-sectional view showing a color conversion panel among the light-emitting display devices according to one embodiment, and FIG. 3 is a cross-sectional view showing a light-emitting display device according to the embodiment of FIG. 2.

[0039] As illustrated in FIG. 1, a light-emitting display device according to one embodiment includes a display panel (1000) and a color conversion panel (2000) that largely overlap each other.

[0040] A display panel (1000; hereinafter also referred to as a lower panel) may include a plurality of pixels (PX1, PX2, PX3), and a light-emitting element (ED) may be located at each pixel (PX1, PX2, PX3). That is, the display panel (1000) may include a plurality of light-emitting elements (ED). The plurality of pixels (PX1, PX2, PX3) may include a first pixel (PX1), a second pixel (PX2), and a third pixel (PX3). Each light-emitting element (ED) may emit light, and the display panel (1000) may display an image by expressing brightness by adjusting the intensity of light coming from the light-emitting elements (ED) of each pixel (PX1, PX2, PX3). Here, the color of the light emitted by the light-emitting element (ED) included in each of the multiple pixels (PX1, PX2, PX3) may all be the same, and the color may be converted into three primary colors in the color conversion panel (2000) described later to display the color.

[0041] The light-emitting element (ED) may be an organic light-emitting element, and the display panel (1000) may be an organic light-emitting display panel. However, the type of display panel (1000) is not limited to this and may be composed of various types of panels. For example, the display panel (1000) may be a liquid crystal display panel, an electrophoretic display panel, an electrowetting display panel, etc. Additionally, the display panel (1000) may be a next-generation display panel such as a micro light-emitting diode (Micro LED) display panel.

[0042] The display panel (1000) may be made of a flat rigid display panel or a flexible display panel that can be flexibly bent.

[0043] The color conversion panel (2000) may be positioned to overlap facing the display panel (1000). The color conversion panel (2000) may include a first color conversion layer (520a), a second color conversion layer (520b), and a transmission layer (520c). The first color conversion layer (520a) may overlap planarly with a light-emitting element (ED) located in the first pixel (PX1). Light emitted from the light-emitting element (ED) of the first pixel (PX1) may pass through the first color conversion layer (520a) and emit light of a first wavelength. The second color conversion layer (520b) may overlap planarly with a light-emitting element (ED) located in the second pixel (PX2). Light emitted from the light-emitting element (ED) of the second pixel (PX2) may pass through the second color conversion layer (520b) and emit light of a second wavelength. The transparent layer (520c) can be superimposed on a plane with the light-emitting element (ED) located in the third pixel (PX3). Light emitted from the light-emitting element (ED) of the third pixel (PX3) can pass through the transparent layer (520c) and emit light of the third wavelength as is. For example, the light of the first wavelength may be red light, the light of the second wavelength may be green light, and the light of the third wavelength may be blue light. That is, the first pixel (PX1), the second pixel (PX2), and the third pixel (PX3) may be a red pixel, a green pixel, and a blue pixel, respectively. However, this is not limited thereto, and the colors displayed by the first pixel (PX1), the second pixel (PX2), and the third pixel (PX3) may be varied. In addition, in addition to the first pixel (PX1), the second pixel (PX2), and the third pixel (PX3), additional pixels displaying other colors may be included.

[0044] Hereinafter, with reference to FIGS. 2 and FIGS. 3, a stacked structure of a color conversion panel (2000; hereinafter also referred to as the upper panel) of a light-emitting display device according to one embodiment will be described in detail.

[0045] The color conversion panel (2000) may include a substrate (210; also referred to as an upper substrate), and a first color filter (230a), a second color filter (230b), and a third color filter (230c) located on one side of the substrate (210).

[0046] The first color filter (230a) transmits light of the first wavelength and absorbs light of the remaining wavelengths, thereby increasing the purity of the light of the first wavelength emitted to the outside of the light-emitting display device.

[0047] The second color filter (230b) can transmit light of the second wavelength and absorb light of the remaining wavelength, thereby increasing the purity of the light of the second wavelength emitted to the outside of the light-emitting display device.

[0048] The third color filter (230c) transmits light of the third wavelength and absorbs light of the remaining wavelengths, thereby increasing the purity of the light of the third wavelength emitted to the outside of the light-emitting display device.

[0049] The first color filter (230a), the second color filter (230b), and the third color filter (230c) can each be positioned to overlap with different pixels (PX1, PX2, PX3). At the boundaries of each pixel (PX1, PX2, PX3), the first color filter (230a), the second color filter (230b), and the third color filter (230c) can overlap each other to form a light-blocking area. Although it is illustrated that the first color filter (230a), the second color filter (230b), and the third color filter (230c) all overlap in the light-blocking area, this is not limited thereto. For example, two of the first color filter (230a), the second color filter (230b), and the third color filter (230c) may overlap to form a light-blocking area. For example, at the boundary between the first pixel (PX1) and the second pixel (PX2), the first color filter (230a) and the second color filter (230b) may overlap. At the boundary between the second pixel (PX2) and the third pixel (PX3), the second color filter (230b) and the third color filter (230c) may overlap. At the boundary between the third pixel (PX3) and the first pixel (PX1), the third color filter (230c) and the first color filter (230a) may overlap.

[0050] A low refractive index layer (240) may be positioned on the first color filter (230a), the second color filter (230b), and the third color filter (230c). The low refractive index layer (240) may overlap the entirety of the first color filter (230a), the second color filter (230b), and the third color filter (230c). That is, the low refractive index layer (240) may be positioned entirely on the substrate (210). The low refractive index layer (240) may include an organic or inorganic material with a low refractive index. For example, the refractive index of the low refractive index layer (240) may be about 1.1 or higher and about 1.3 or lower.

[0051] A first capping layer (250; hereinafter also referred to as a lower capping layer) may be positioned on the low refractive index layer (240). The first capping layer (250) is a layer for protecting the low refractive index layer (240) and may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The first capping layer (250) may have a single layer or a multilayer structure of the above material.

[0052] A partition wall (265; hereinafter also referred to as a bank layer) may be positioned on the first capping layer (250). The partition wall (265) may include a first opening (267a) that overlaps planarly with the first color filter (230a), a second opening (267b) that overlaps planarly with the second color filter (230b), and a third opening (267c) that overlaps planarly with the third color filter (230c). The first opening (267a) may overlap planarly with the light-emitting region of the first pixel (PX1), the second opening (267b) may overlap planarly with the light-emitting region of the second pixel (PX2), and the third opening (267c) may overlap planarly with the light-emitting region of the third pixel (PX3). The partition wall (265) may overlap in a plane with the light-blocking area where the first color filter (230a), the second color filter (230b), and the third color filter (230c) overlap each other. Thus, the partition wall (265) may overlap with the boundary between each pixel (PX1, PX2, PX3). Meanwhile, the partition wall (265) may additionally include a dummy opening (see 267-v in FIG. 8) that overlaps in a plane with the light-blocking area where the first color filter (230a), the second color filter (230b), and the third color filter (230c) overlap each other.

[0053] A first color conversion layer (520a) may be located within the first opening (267a), a second color conversion layer (520b) may be located within the second opening (267b), and a transparent layer (520c) may be located within the third opening (267c). Meanwhile, the color conversion layer may not be located within the dummy opening, but when forming the color conversion layer, some of the material of the color conversion layer may flow into the dummy opening.

[0054] The first color conversion layer (520a) may overlap in a plane with the first color filter (230a). The first color conversion layer (520a) may not overlap in a plane with the second color filter (230b) and the third color filter (230c). The first color conversion layer (520a) may convert light incident from the light-emitting element (ED) of the first pixel (PX1) into light of a first wavelength. At this time, the light of the first wavelength may be red light having a maximum emission peak wavelength of about 600 nm to about 650 nm, for example, about 620 nm to about 650 nm. According to an embodiment, the first color conversion layer (520a) may include a plurality of first quantum dots (521a) and a plurality of scatterers (530).

[0055] The second color conversion layer (520b) may overlap in a plane with the second color filter (230b). The second color conversion layer (520b) may not overlap in a plane with the first color filter (230a) and the third color filter (230c). The second color conversion layer (520b) may convert light incident from the light-emitting element (ED) of the second pixel (PX2) into light of a second wavelength. At this time, the light of the second wavelength may be green light with a maximum emission peak wavelength of about 500 nm to about 550 nm, for example, about 510 nm to about 550 nm. According to an embodiment, the second color conversion layer (520b) may include a plurality of second quantum dots (521b) and a plurality of scatterers (530).

[0056] The transparent layer (520c) may overlap in a plane with the third color filter (230c). The transparent layer (520c) may not overlap in a plane with the first color filter (230a) and the second color filter (230b). The transparent layer (520c) may transmit light incident from the light-emitting element (ED) of the third pixel (PX3). The light passing through the transparent layer (520c) may be light of a third wavelength. The light of the third wavelength may be blue light with a maximum emission peak wavelength of about 380 nm to about 480 nm, for example, about 420 nm or more, about 430 nm or more, about 440 nm or more, or about 445 nm or more, and about 470 nm or less, about 460 nm or less, or about 455 nm or less. According to the embodiment, the transparent layer (520c) may include a plurality of scattering bodies (530) and may not include quantum dots.

[0057] A plurality of scatterers (530) can improve light efficiency by scattering light incident on the first color conversion layer (520a), the second color conversion layer (520b), and the transmission layer (520c). The scatterers (530) may include materials such as TiO2, SiO2, BaSO4, ZnO, Al2O3, and CaCO3. The particle size of the scatterers (530) may be about 50 nm or larger and about 800 nm or smaller.

[0058] Each of the first quantum dot (521a) and the second quantum dot (521b) (hereinafter also referred to as semiconductor nanocrystals) may independently comprise a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element or compound, a Group I-III-VI compound, a Group II-III-VI compound, a Group I-II-IV-VI compound, or a combination thereof. The quantum dots may not contain cadmium.

[0059] The above Group II-VI compounds are diatomic compounds selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and mixtures thereof; ternary compounds selected from the group consisting of AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and mixtures thereof; and may be selected from the group consisting of four-element compounds selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and mixtures thereof. The group II-VI compounds may further include a group III metal.

[0060] The above III-V group compounds may be selected from the group consisting of: diatomic compounds selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; ternary compounds selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, InPSb, and mixtures thereof; and quaternary compounds selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, InZnP, and mixtures thereof. The above III-V group compounds may further include a group II metal (e.g., InZnP).

[0061] The above IV-VI group compounds may be selected from the group consisting of diatomic compounds selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe and mixtures thereof; ternary compounds selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and mixtures thereof; and quaternary compounds selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe and mixtures thereof.

[0062] The above Group IV elements or compounds may be selected from the group consisting of monatomic compounds selected from the group consisting of Si, Ge, and combinations thereof; and diatomic compounds selected from the group consisting of SiC, SiGe, and combinations thereof, but are not limited thereto.

[0063] Examples of the above Group I-III-VI compounds include, but are not limited to, CuInSe2, CuInS2, CuInGaSe, and CuInGaS. Examples of the above Group I-II-IV-VI compounds include, but are not limited to, CuZnSnSe and CuZnSnS. The above Group IV element or compound may be selected from the group consisting of a monatomic element selected from the group consisting of Si, Ge, and mixtures thereof; and a diatomic compound selected from the group consisting of SiC, SiGe, and mixtures thereof.

[0064] The above Group II-III-VI compounds may be selected from the group consisting of ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe, HgAlTe, HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, MgInSe, and combinations thereof, but are not limited thereto.

[0065] The above Group I-II-IV-VI compounds may be selected from CuZnSnSe and CuZnSnS, but are not limited thereto.

[0066] In one embodiment, the quantum dots may not contain cadmium. The quantum dots may include semiconductor nanocrystals based on a Group III-V compound containing indium and phosphorus. The Group III-V compound may further include zinc. The quantum dots may include semiconductor nanocrystals based on a Group II-VI compound containing a chalcogen element (e.g., sulfur, selenium, tellurium, or a combination thereof) and zinc.

[0067] In quantum dots, the aforementioned binary compounds, ternary compounds, and / or quaternary compounds may exist within the particle at a uniform concentration, or may exist within the same particle with concentration distributions divided into partially different states. Additionally, one quantum dot may have a core / shell structure surrounding another quantum dot. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the center.

[0068] According to an embodiment, the quantum dot may have a core-shell structure comprising a core containing the aforementioned nanocrystal and a shell surrounding the core. The shell of the quantum dot may serve as a protective layer to maintain semiconductor properties by preventing chemical degradation of the core and / or as a charging layer to impart electrophoretic properties to the quantum dot. The shell may be a single layer or a multilayer. The interface between the core and the shell may have a concentration gradient in which the concentration of elements present in the shell decreases toward the center. Examples of the shell of the quantum dot include oxides of metals or non-metals, semiconductor compounds, or combinations thereof.

[0069] For example, the oxide of the metal or nonmetal mentioned above may be exemplified as a binary compound such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, or a ternary compound such as MgAl2O4, CoFe2O4, NiFe2O4, CoMn2O4, but the present invention is not limited thereto.

[0070] In addition, the above semiconductor compounds may be examples of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., but the present invention is not limited thereto.

[0071] According to an embodiment, the interface between the core and the shell may have a concentration gradient in which the concentration of an element present in the shell decreases toward the center. Additionally, the semiconductor nanocrystal may have a structure comprising a single semiconductor nanocrystal core and a multilayer shell surrounding it. In one embodiment, the multilayer shell may have two or more layers, e.g., two, three, four, five, or more layers. Two adjacent layers of the shell may have a single composition or different compositions. Each layer in the multilayer shell may have a composition that varies along the radius.

[0072] Quantum dots can have a full width of half maximum (FWHM) of the emission wavelength spectrum of about 45 nm or less, preferably about 40 nm or less, and more preferably about 30 nm or less, and color purity or color reproducibility can be improved in this range. In addition, since the light emitted through these quantum dots is emitted in all directions, the viewing angle can be improved.

[0073] The above quantum dot may have a shell material and a core material having different energy band gaps. For example, the energy band gap of the shell material may be larger than that of the core material. In another embodiment, the energy band gap of the shell material may be smaller than that of the core material. The above quantum dot may have a multilayer shell. In a multilayer shell, the energy band gap of the outer layer may be larger than that of the inner layer (i.e., the layer closest to the core). In a multilayer shell, the energy band gap of the outer layer may be smaller than that of the inner layer.

[0074] Quantum dots can control their absorption / emission wavelengths by adjusting their composition and size. The maximum emission peak wavelength of the quantum dots can have a wavelength range of ultraviolet to infrared or longer.

[0075] The quantum dot may include an organic ligand (e.g., having a hydrophobic residue and / or a hydrophilic residue). The organic ligand residue may be bonded to the surface of the quantum dot. The organic ligand may include RCOOH, RNH2, R2NH, R3N, RSH, R3PO, R3P, ROH, RCOOR, RPO(OH)2, RHPOOH, R2POOH, or a combination thereof, wherein R is independently a C3 to C40 (e.g., C5 or more and C24 or less) substituted or unsubstituted alkyl, a C3 to C40 (e.g., C5 or more and C24 or less) substituted or unsubstituted aliphatic hydrocarbon group such as a C3 to C40 (e.g., substituted or unsubstituted alkenyl), an C6 to C40 (e.g., C6 or more and C20 or less) substituted or unsubstituted aromatic hydrocarbon group such as a C6 to C40 (e.g., C6 or more and C20 or less) substituted or unsubstituted aryl group, or a combination thereof.

[0076] Examples of the above organic ligands include thiol compounds such as methanethiol, ethanethiol, propanethiol, butanethiol, pentanthiol, hexanethiol, octanethiol, dodecanethiol, hexadecanethiol, octadecanethiol, and benzylthiol; amines such as methaneamine, ethaneamine, propaneamine, butanamine, pentylamine, hexylamine, octylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dimethylamine, diethylamine, dipropylamine, tributylamine, and trioctylamine; and carboxylic acid compounds such as methanoic acid, ethanoic acid, propanoic acid, butanoic acid, pentanic acid, hexanoic acid, heptanoic acid, octanoic acid, dodecanoic acid, hexadecanoic acid, octadecanic acid, oleic acid, and benzoic acid. Phosphine compounds such as methylphosphine, ethylphosphine, propylphosphine, butylphosphine, pentylphosphine, octylphosphine, dioctylphosphine, tributylphosphine, trioctylphosphine, etc.; phosphine compounds or their oxide compounds such as methylphosphine oxide, ethylphosphine oxide, propylphosphine oxide, butylphosphine oxide, pentylphosphine oxide, tributylphosphine oxide, octylphosphine oxide, dioctylphosphine oxide, trioctylphosphine oxide, etc.; diphenylphosphine, triphenylphosphine compounds or their oxide compounds; C5 to C20 alkyl phosphine acids such as hexylphosphine, octylphosphine, dodecanephosphine, tetradecanephosphine, hexadecanephosphine, octadecanphosphine, etc., and C5 to C20 alkyl phosphonic acids; etc., but are not limited thereto. Quantum dots may include a hydrophobic organic ligand alone or as a mixture of one or more. The hydrophobic organic ligand may not include photopolymerizable residues (e.g., acrylate groups, methacrylate groups, etc.).

[0077] Each of the first color conversion layer (520a), the second color conversion layer (520b), and the transmission layer (520c) may further include a monomer. In this case, the monomer may be composed of a non-volatile monomer and may be composed of an organic material for photocuring. The monomer may have an acrylate functional group at one end or both ends. The monomer has a boiling point of about 200°C or higher and a vapor pressure of about 10 -2 It can have characteristics of mmHg or less.

[0078] Each of the first color conversion layer (520a), the second color conversion layer (520b), and the transmission layer (520c) may include two or more different monomers. That is, each of the first color conversion layer (520a), the second color conversion layer (520b), and the transmission layer (520c) may include a first monomer and a second monomer. In this case, the first monomer and the second monomer may include different materials. In this case, the first monomer and the second monomer may each have an acrylate functional group at one end or both ends.

[0079] A spacer (CS) is positioned on top of the partition wall (265). The spacer (CS) serves to maintain a gap between the two panels when the display panel (1000) and the color conversion panel (2000) are combined. In this embodiment, the spacer (CS) is formed using an inkjet method without using a mask to form a pattern.

[0080] When forming a spacer (CS) using an inkjet method, the position where the spacer (CS) is formed may not be consistent compared to when patterning using a mask; however, since no mask is used, there is an advantage in that manufacturing costs are reduced and process time is shortened. Accordingly, in this embodiment, in order to simply form the spacer (CS) using an inkjet method, a spacer forming portion (refer to the CSL portion in FIG. 6), which is a part of the partition wall (265), is formed in a long direction at the location where the spacer (CS) is to be formed among the partition walls (265), and the spacer (CS) is formed using an inkjet method in the portion that overlaps planarly with the spacer forming portion. This is examined in more detail in FIG. 6.

[0081] A second capping layer (280; hereinafter also referred to as the upper capping layer) may be positioned on top of the first color conversion layer (520a), the second color conversion layer (520b), the transparent layer (520c), the partition (265), and the spacer (CS). The second capping layer (280) is positioned entirely on the substrate (210) and may have a structure that covers the first color conversion layer (520a), the second color conversion layer (520b), the transparent layer (520c), the partition (265), and the spacer (CS). The second capping layer (280) is a layer that covers and protects the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c), and may be made of an inorganic material. For example, the second capping layer (280) may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The second capping layer (280) may be a single layer or a multilayer structure of the above material. In the embodiment of FIG. 2, the second capping layer (280) is formed after the first color conversion layer (520a), the second color conversion layer (520b), the transparent layer (520c), and the spacer (CS) are formed. In such an embodiment, the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c) are formed between the partitions (265) using an inkjet method, and then the spacer (CS) is also formed on the partitions (265) using an inkjet method, after which the second capping layer (280) is stacked. As a result, the inkjet process can be applied continuously, which offers the advantage of reducing the overall process time.

[0082] A filling layer (290) may be positioned on the second capping layer (280). The filling layer (290) may be positioned entirely on the substrate (210). The filling layer (290) is positioned between the display panel (1000) and the color conversion panel (2000) when the display panel (1000) and the color conversion panel (2000) are bonded together.

[0083] Hereinafter, with reference to FIG. 3, the state in which the display panel (1000) and the color conversion panel (2000) are bonded together will be described. In FIG. 3, the color conversion panel (2000) shown in FIG. 2 can be combined to face the display panel (1000) with its top and bottom flipped.

[0084] A display panel (1000) may include a substrate (110), a semiconductor (131) located on the substrate (110), a transistor (TFT) including a gate electrode (124), a source electrode (173) and a drain electrode (175), a gate insulating film (120), a first interlayer insulating film (160), an organic film (180), a pixel electrode (191), a light-emitting layer (370), a pixel defining film (350), a common electrode (270), and an encapsulation layer (400). Depending on the embodiment, the transistor (TFT) may not include a source electrode (173) or a drain electrode (175).

[0085] The substrate (110) may include a material having rigid properties such as glass, or a flexible material that can be bent such as plastic or polyimide. A buffer layer (111) may be further positioned on the substrate (110) to flatten the surface of the substrate (110) and to block impurities from penetrating into the semiconductor (131). The buffer layer (111) may include an inorganic material, for example, an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The buffer layer (111) may be a single layer or a multilayer structure of the above material. A barrier layer (not shown) may be further positioned on the substrate (110). At this time, the barrier layer may be located between the substrate (110) and the buffer layer (111). The barrier layer may include inorganic insulating materials such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon nitrate (SiOxNy). The barrier layer may have a single layer or a multilayer structure of the above materials.

[0086] The semiconductor (131) may be positioned on the substrate (110). The semiconductor (131) may include any one of amorphous silicon, polycrystalline silicon, and oxide semiconductor. For example, the semiconductor (131) may include low-temperature polysilicon (LTPS) or an oxide semiconductor material including at least one of zinc (Zn), indium (In), gallium (Ga), tin (Sn), and mixtures thereof. For example, the semiconductor (131) may include IGZO (Indium-Gallium-Zinc Oxide). The semiconductor (131) may include a channel region, a source region, and a drain region, which are distinguished depending on whether or not there is impurity doping. The source region and the drain region may have conductivity characteristics corresponding to a conductor.

[0087] The gate insulating film (120) can cover the semiconductor (131) and the substrate (110). The gate insulating film (120) may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The gate insulating film (120) may be a single layer or a multilayer structure of the above material.

[0088] The gate electrode (124) may be positioned on the gate insulating film (120). The gate electrode (124) may include a metal or metal alloy such as copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), or titanium (Ti). The gate electrode (124) may be composed of a single layer or multiple layers. The region of the semiconductor (131) that overlaps with the planar gate electrode (124) may be a channel region.

[0089] The first interlayer insulating film (160) can cover the gate electrode (124) and the gate insulating film (120). The first interlayer insulating film (160) may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The first interlayer insulating film (160) may have a single layer or a multilayer structure of the above material.

[0090] The source electrode (173) and the drain electrode (175) may be located on the first interlayer insulating film (160). The source electrode (173) and the drain electrode (175) are respectively connected to the source region and the drain region of the semiconductor (131) by an opening formed in the first interlayer insulating film (160) and the gate insulating film (120). The aforementioned semiconductor (131), gate electrode (124), source electrode (173), and drain electrode (175) constitute a single transistor (TFT). According to an embodiment, the transistor (TFT) may include only the source region and the drain region of the semiconductor (131) instead of the source electrode (173) and the drain electrode (175). Although one transistor (TFT) is shown for each pixel (PX1, PX2, PX3), it is not limited thereto, and multiple transistors (TFTs) may be located in each pixel (PX1, PX2, PX3).

[0091] The source electrode (173) and drain electrode (175) may include metals or metal alloys such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), and tantalum (Ta), or may include various transparent conductive oxide films such as ITO (Indium Tin Oxide). The source electrode (173) and drain electrode (175) may be composed of a single layer or multiple layers. According to one embodiment, the source electrode (173) and drain electrode (175) may be composed of a triple layer including an upper layer, a middle layer, and a lower layer, wherein the lower layer may include titanium (Ti), the middle layer may include copper (Cu), and the upper layer may include ITO (Indium Tin Oxide), which is a transparent conductive oxide film.

[0092] The organic film (180) may be positioned over the source electrode (173) and the drain electrode (175). The organic film (180) covers the source electrode (173), the drain electrode (175), and the first interlayer insulating film (160). The organic film (180) is intended to flatten the surface of the substrate (110) equipped with the transistor (TFT), and may be an organic insulating film and may include one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0093] The pixel electrode (191) may be positioned on the organic film (180). The pixel electrode (191) is also called an anode electrode and may be composed of a single layer or multiple layers including a transparent conductive oxide film or a metal material. The transparent conductive oxide film may include ITO (Indium Tin Oxide), poly-ITO, IZO (Indium Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), and ITZO (Indium Tin Zinc Oxide), etc. The metal material may include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al), etc.

[0094] The organic film (180) may include a via hole (81) that exposes the drain electrode (175). The drain electrode (175) and the pixel electrode (191) may be physically and electrically connected through the via hole (81) of the organic film (180). Accordingly, the pixel electrode (191) may receive an output current to be transmitted from the drain electrode (175) to the light-emitting layer (370).

[0095] A pixel defining film (350) may be positioned on the pixel electrode (191) and the organic film (180). The pixel defining film (350) includes a pixel opening (351; hereinafter also referred to as an opening for a light-emitting diode) that overlaps with at least a portion of the pixel electrode (191). At this time, the pixel opening (351) may overlap with the center of the pixel electrode (191) and may not overlap with the edge portion of the pixel electrode (191). Accordingly, the size of the pixel opening (351) may be smaller than the size of the pixel electrode (191). The pixel defining film (350) may define a formation location for a light-emitting layer (370) so that the light-emitting layer (370) can be positioned on the portion where the upper surface of the pixel electrode (191) is exposed. The pixel defining film (350) may be an organic insulating film comprising one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin. According to an embodiment, the pixel defining film (350) may be formed as a black pixel defining layer (BPDL) comprising a black pigment.

[0096] The pixel defining film (350) may be located at the boundary between multiple pixels (PX1, PX2, PX3). The pixel defining film (350) may overlap planarly with the partition wall (265) of the color conversion panel (2000), and the pixel opening (351) of the pixel defining film (350) may also overlap planarly with the first opening (267a), the second opening (267b), and the third opening (267c) of the partition wall (265). Additionally, the pixel opening (351) of the pixel defining film (350) may overlap planarly with the first color filter (230a), the second color filter (230b), and the third color filter (230c), and may also overlap planarly with the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c). Additionally, the pixel defining film (350) can overlap with the light-blocking area where the first color filter (230a), the second color filter (230b), and the third color filter (230c) overlap.

[0097] Each of the multiple pixel openings (351) may have a shape similar to the pixel electrode (191) on a plane. For example, the pixel openings (351) and the pixel electrode (191) may be polygonal on a plane. In this case, the corner portions of the pixel openings (351) and the pixel electrode (191) may be chamfered. However, the shape of the pixel openings (351) and the shape of the pixel electrode (191) are not limited thereto and may be changed in various ways.

[0098] At this time, a plurality of pixel electrodes (191) corresponding to each of the first pixel (PX1), the second pixel (PX2), and the third pixel (PX3) may have different sizes on a plane. Likewise, a plurality of pixel openings (351) corresponding to each of the first pixel (PX1), the second pixel (PX2), and the third pixel (PX3) may have different sizes on a plane. For example, the pixel opening (351) and pixel electrode (191) corresponding to the first pixel (PX1) may each have a larger size on a plane than the pixel opening (351) and pixel electrode (191) corresponding to the second pixel (PX2). Additionally, the pixel opening (351) and pixel electrode (191) corresponding to the first pixel (PX1) may each have a smaller or similar size on a plane than the pixel opening (351) and pixel electrode (191) corresponding to the third pixel (PX3). However, it is not limited to this, and each pixel opening (351) and pixel electrode (191) can be set to have various sizes.

[0099] The light-emitting layer (370) may be located within a pixel opening (351) partitioned by a pixel defining film (350). However, it is not limited thereto, and the light-emitting layer (370) may be located not only within the pixel opening (351) but also on the pixel defining film (350). The light-emitting layer (370) may be formed by performing a deposition process using an open mask in which a portion corresponding to the display area is opened. The light-emitting layer (370) may include a low-molecular or high-molecular organic material. Although the light-emitting layer (370) is shown as a single layer, in reality, auxiliary layers such as an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer may also be included above and below the light-emitting layer (370). A hole injection layer and a hole transport layer may be located below the light-emitting layer (370), and an electron transport layer and an electron injection layer may be located above the light-emitting layer (370). According to the embodiment, the hole injection layer, hole transport layer, electron transport layer, and electron injection layer may be located on top of the pixel definition film (350) and may be located over the entire area of ​​the substrate (110). Additionally, another light-emitting layer may be located on top of the light-emitting layer (370). That is, two or more light-emitting layers (370) may be stacked.

[0100] Although the city has been omitted, a lower spacer may be further positioned on the pixel defining film (350). The lower spacer may contain the same material as the pixel defining film (350). However, it is not limited thereto, and the lower spacer may be made of a material different from that of the pixel defining film (350). The lower spacer may be an organic insulating film comprising one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0101] The common electrode (270) may be positioned on the pixel defining film (350) and the light-emitting layer (370). The common electrodes (270) of each pixel (PX1, PX2, PX3) may be connected to each other. The common electrode (270) may be formed to be connected overall on the substrate (110). The common electrode (270) is also called a cathode electrode and may be formed as a transparent conductive layer including ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), and ITZO (Indium Tin Zinc Oxide). The common electrode (270) may be made of a metallic material such as silver (Ag), magnesium (Mg), etc., or may be made in a mixed form. At this time, the thickness of the common electrode (270) may be adjusted to form a transparent conductive layer. Additionally, the common electrode (270) may have a translucent characteristic, and in this case, it may form a micro cavity together with the pixel electrode (191).

[0102] The pixel electrode (191), the light-emitting layer (370), and the common electrode (270) can form a light-emitting element (ED). The portion where the pixel electrode (191), the light-emitting layer (370), and the common electrode (270) overlap in each pixel (PX1, PX2, PX3) can become the light-emitting region of each light-emitting element (ED).

[0103] The light-emitting element (ED) located in the first pixel (PX1) may overlap in a plane with the first color conversion layer (520a) and the first color filter (230a). The light-emitting element (ED) located in the first pixel (PX1) may not overlap in a plane with the second color conversion layer (520b), the transmission layer (520c), the second color filter (230b), and the third color filter (230c). Light emitted from the light-emitting element (ED) of the first pixel (PX1) is converted into light of a first wavelength as it passes through the first color conversion layer (520a) and may be emitted to the outside after passing through the first color filter (230a).

[0104] The light-emitting element (ED) located in the second pixel (PX2) may overlap in a plane with the second color conversion layer (520b) and the second color filter (230b). The light-emitting element (ED) located in the second pixel (PX2) may not overlap in a plane with the first color conversion layer (520a), the transmission layer (520c), the first color filter (230a), and the third color filter (230c). Light emitted from the light-emitting element (ED) of the second pixel (PX2) is converted into light of a second wavelength as it passes through the second color conversion layer (520b) and may be emitted to the outside as it passes through the second color filter (230b).

[0105] The light-emitting element (ED) located in the third pixel (PX3) may overlap in a plane with the transmission layer (520c) and the third color filter (230c). The light-emitting element (ED) located in the third pixel (PX3) may not overlap in a plane with the first color conversion layer (520a), the second color conversion layer (520b), the first color filter (230a), and the second color filter (230b). Light of a third wavelength emitted from the light-emitting element (ED) of the third pixel (PX3) may pass through the transmission layer (520c) and the third color filter (230c) in sequence and be emitted to the outside.

[0106] The encapsulation layer (400) may be positioned on the common electrode (270). The encapsulation layer (400) may include at least one inorganic film and at least one organic film. In this embodiment, the encapsulation layer (400) may include a first inorganic encapsulation layer (410), an organic encapsulation layer (420), and a second inorganic encapsulation layer (430). However, this is merely an example, and the number of inorganic films and organic films constituting the encapsulation layer (400) may be varied. For example, the encapsulation layer (400) may be stacked in the order of a first inorganic encapsulation layer, a second inorganic encapsulation layer, a first organic encapsulation layer, and a third inorganic encapsulation layer. Alternatively, the encapsulation layer (400) may be stacked in the order of a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, and a third inorganic encapsulation layer. The display panel (1000) may include a display area for displaying a screen and a surrounding area surrounding the display area. The first inorganic encapsulation layer (410), the organic encapsulation layer (420), and the second inorganic encapsulation layer (430) may be located in a part of the display area and the surrounding area. According to an embodiment, the organic encapsulation layer (420) may be formed centered on the display area, and the first inorganic encapsulation layer (410) and the second inorganic encapsulation layer (430) may be formed up to the surrounding area. The encapsulation layer (400) is intended to protect the light-emitting element (ED) from moisture or oxygen that may enter from the outside, and one end of the first inorganic encapsulation layer (410) and the second inorganic encapsulation layer (430) may be formed to make direct contact.

[0107] The encapsulation layer (400) can come into contact with the color conversion panel (2000), and specifically, the encapsulation layer (400) can come into contact with the filling layer (290). Therefore, the second inorganic encapsulation layer (430) among the encapsulation layers (400) can come into contact with the filling layer (290). However, this is merely an example, and other layers may be located between the encapsulation layer (400) and the filling layer (290).

[0108] Although the city has been omitted, the light-emitting display device according to one embodiment may further include a sensing unit that detects touch. The sensing unit may include a plurality of sensing electrodes, etc., and the sensing unit may be located between the display panel (1000) and the color conversion panel (2000).

[0109] Below, we examine the method of forming a spacer (CS) on a color conversion panel (2000) and the shape of the head of an inkjet equipment through FIGS. 4 and FIGS. 5.

[0110] FIG. 4 is a drawing illustrating the step of forming a spacer in an inkjet manner on a color conversion panel of a light-emitting display device in one embodiment, and FIG. 5 is a drawing illustrating a head of an inkjet facility according to one embodiment.

[0111] FIG. 4 illustrates a color conversion panel (2000) in the step of forming a partition (265) including a first opening (267a), a second opening (267b), and a third opening (267c) on a substrate (210), and then forming a first color conversion layer (520a), a second color conversion layer (520b), and a transmission layer (520c) in each of the first opening (267a), the second opening (267b), and the third opening (267c). After that, the step of forming a spacer (CS) by an inkjet method is illustrated in FIG. 4.

[0112] As illustrated in FIG. 4, the head of the inkjet equipment moves in the direction of the arrow (hereinafter also referred to as the movement direction) and discharges ink to form a spacer (CS). At this time, referring to FIG. 5, the head of the inkjet equipment has a structure that extends long in a direction perpendicular to the movement direction (hereinafter also referred to as the head extension direction).

[0113] In FIG. 5, a plurality of nozzles (NZ) are arranged in a structure in which the head of an inkjet equipment is viewed from the substrate side. Referring to FIG. 5, adjacent nozzles (NZ) can be arranged with a gap (gap-nz) between nozzles (NZ) in the direction of the head extension. The gap (gap-nz) between nozzles (NZ) can vary, and the minimum gap (gap-nz) between nozzles may be a value considered when determining the length formed in one direction of the spacer forming portion (refer to the CSL portion in FIG. 6) of the partition wall (265) formed at the location to form the spacer (CS). This will be examined in detail in FIG. 6.

[0114] Meanwhile, according to the embodiment, the head of the inkjet equipment may be used by arranging multiple heads at regular intervals to reduce the minimum gap between nozzles (gap-nz). In this case, the minimum gap between nozzles (gap-nz) reduced by using multiple heads may be a value considered when determining the length formed in one direction (hereinafter also referred to as the first direction) of the spacer forming portion of the partition wall (265).

[0115] Here, the direction of movement of the head is perpendicular to the direction of extension of the head and the direction determining the gap (gap-nz) between the nozzles, and the direction of extension of the head and the direction determining the gap (gap-nz) between the nozzles may be the same direction.

[0116] Below, the planar structure of the spacer forming portion and the position of the spacer (CS) according to one embodiment are examined in more detail through FIGS. 6 and 7.

[0117] FIG. 6 is a plan view illustrating a spacer and a bulkhead around the spacer according to one embodiment, and FIG. 7 is a plan view illustrating the position of the spacer in a plan according to an embodiment.

[0118] FIG. 6 illustrates a spacer forming portion (CSL), which is a part of the bulkhead (265), and a spacer (CS) that overlaps therewith in a plane. Here, the bulkhead (265) is further formed with a minimum width (b) around the spacer forming portion (CSL). The portion where the bulkhead (265) is further formed with a minimum width (b) is also referred to as an additional margin portion below. Since the shape of the bulkhead (265) shown in FIG. 6 illustrates only the minimum width (b) of the spacer forming portion (CSL), the bulkhead (265) may be formed with a wider width than this, and the planar structure of the bulkhead (265) according to a specific embodiment is examined in detail through FIG. 8, FIG. 16, and FIG. 17.

[0119] Referring to FIG. 7, a dotted line indicates that the spacer (CS) can be formed with a changing position according to the extension direction (hereinafter also referred to as the extension direction of the spacer forming part) of the spacer forming part (CSL). Here, the extension direction of the spacer forming part may be the same direction as the extension direction of the head of the inkjet equipment and may correspond to the direction of the arrow indicated by c in FIG. 6. FIG. 7 takes into account that the position where the spacer (CS) is formed may be formed differently depending on the position of the nozzle (NZ) used among the plurality of nozzles (NZ) formed in the head of the inkjet equipment.

[0120] Referring again to FIG. 6, the spacer (CS) has a circular shape and may have a diameter (a) of approximately 20 μm, and the diameter (a) of the spacer (CS) may be 10 μm or more and 30 μm or less. According to the embodiment, the spacer (CS) may have a polygonal shape similar to a circle. Here, the spacer (CS) may be formed with a height of 2 μm or more and 10 μm or less.

[0121] The spacer forming portion (CSL) is formed with a size that includes the diameter (a) of the spacer (CS), and is formed larger as the diameter (a) of the spacer (CS) being formed increases.

[0122] Among the spacer forming portions (CSL), the two ends of the spacer forming portion in the extension direction can be formed in a planar shape identical to the planar shape of the spacer (CS), and in FIG. 5, the planar shapes of the two ends of the spacer forming portions (CSL) are each formed in a semicircular structure according to the planar shape of the circular spacer (CS).

[0123] In addition, the spacer forming portion (CSL) is formed to be long in the direction in which the spacer (CS) can move and be positioned, that is, in the extension direction of the spacer forming portion. The length of the extension direction of the spacer forming portion (CSL) is formed so that there is room equal to the margin (c) even after the spacer (CS) is formed. Here, the margin (c) can be determined based on the minimum value of the gap between nozzles (gap-nz) in FIG. 5. In this embodiment, the margin (c) is set to the minimum gap between nozzles (gap-nz) value. The minimum gap between nozzles (gap-nz) may vary depending on the inkjet equipment, and the margin (c) value may be between 14.1 μm and 70.5 μm. Here, considering the margin (c) and the diameter (a) of the spacer (CS), the length of the extension direction of the spacer forming portion (CSL) may be between 24.1 μm and 90.5 μm.

[0124] However, when forming a spacer (CS) using an actual inkjet method, considering the precision and error, the partition (265) according to the present embodiment has an additional margin portion formed around the spacer forming portion (CSL) with a minimum width (b). As a result, the spacer (CS) can have a structure that always overlaps with the partition (265) in a plane. Here, the minimum width (b) can have a value of around 10 μm, and the minimum width (b) value can be 5 μm or more and 15 μm or less.

[0125] According to the above structure, the partition wall (265) can be formed with a minimum width (b) of the spacer forming portion (CSL) and its surroundings so that the spacer (CS) can be stably positioned on the partition wall (265) even if it is formed by inkjet.

[0126] In particular, the partition wall (265) of the present embodiment has a structure in which the spacer forming portion (CSL) extends in one direction (the extension direction of the spacer forming portion), and has an anisotropic planar structure having different widths based on the extension direction and the direction perpendicular thereto. As a result, it is formed so that a spacer (CS) can be formed on the partition wall (265) regardless of which nozzle (NZ) among the plurality of nozzles (NZ) in the head (HEAD) of the inkjet equipment forms the spacer (CS).

[0127] As a result, since masks are not used, there is the advantage of reduced manufacturing costs and shorter process time.

[0128] Meanwhile, the structure of the specific bulkhead (265) has a structure having a width of at least a minimum width (b) in various directions in the spacer forming portion (CSL), and the structure of the specific bulkhead (265) is examined in detail based on FIG. 8.

[0129] FIG. 8 is a plan view of a color conversion panel of a light-emitting display device according to one embodiment.

[0130] In FIG. 8, a partition (265), a spacer (CS), a first color conversion layer (520a), a second color conversion layer (520b), and a transparent layer (520c) are illustrated. Additionally, the partition (265) includes a first opening (267a), a second opening (267b), and a third opening (267c) to accommodate the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c), and additionally includes a dummy opening (267-v). The dummy opening (267-v) does not overlap in plane with the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c), but overlaps in plane with the light-blocking area. Additionally, all openings adjacent to the periphery of the bulkhead (265) where the spacer (CS) is located may be dummy openings (267-v), and the spacer (CS) may be located adjacent to the dummy openings (267-v) of the bulkhead (265) in the planar view.

[0131] Meanwhile, in FIG. 8, the pitch (Pitch-x, Pitch-y) between four adjacent spacers (CS) is shown.

[0132] The spacer (CS) can be positioned with varying locations along the extension direction of the spacer forming portion (CSL), so that the vertical pitch (Pitch-y) in FIG. 8 may have a different value from the horizontal pitch (Pitch-x). FIG. 8 also illustrates that adjacent vertical pitches may differ by additionally showing a second vertical pitch (Pitch-y2) as the vertical pitch (Pitch-y). FIG. 8 illustrates an embodiment in which the uppermost spacer (CS) is located at the top of the spacer forming portion (CSL), the middle spacer (CS) is located at the bottom of the spacer forming portion (CSL), and the lowest spacer (CS) is located in the middle of the spacer forming portion (CSL). However, the spacer (CS) can be formed at various locations within the spacer forming portion (CSL).

[0133] More specifically, the pitch between spacers (CS) can be as follows. The horizontal pitch (Pitch-x) can have a constant value and can be an integer multiple of the horizontal pixel pitch value. Meanwhile, the vertical pitch (Pitch-y) can have various values ​​as the position of the spacer (CS) changes along the extension direction, and adjacent vertical pitches (Pitch-y) may have different values. Additionally, the vertical pitch (Pitch-y) can have a value different from an integer multiple of the vertical pixel pitch value. Here, the pitch of a pixel can be determined based on the spacing between adjacent color filters, color conversion layers, and / or transmissive layers, and can also be determined based on the spacing between the openings overlapping the emissive layer at the partition.

[0134] However, compared to the comparative example in Fig. 10, there is a difference in that the vertical pitch (Pitch-y') and horizontal pitch (Pitch-x') of the spacer (CS') have the same value.

[0135] Below, we examine the structure of the spacer (CS') formed using a mask through FIGS. 9 and FIGS. 10, comparing it with the present embodiment.

[0136] FIG. 9 is a plan view illustrating a spacer and a partition wall around the spacer according to a comparative example, and FIG. 10 is a plan view of a color conversion panel of a light-emitting display device according to a comparative example.

[0137] The spacer (CS') according to the comparative example of FIG. 9 can be formed at an accurate location because it is formed using a mask. Therefore, the spacer formation portion matches the planar shape of the spacer (CS'), and the spacer formation portion is not formed long in one direction.

[0138] The diameter (a') of the spacer (CS) of the comparative example may be the same as the diameter (a) of the spacer (CS) of FIG. 6, and the minimum width (b') of the comparative example may be the same as the minimum width (b) of the embodiment of FIG. 6.

[0139] Additionally, referring to FIG. 10, in the comparative example, the pitches (Pitch-x', Pitch-y') between the four spacers (CS') may be identical. That is, in the comparative example of FIG. 10, the vertical pitch (Pitch-y') and the horizontal pitch (Pitch-x') of the spacers (CS') have the same value.

[0140] In the comparative examples of FIGS. 9 and 10, it is possible to form spacers at the correct positions using a mask, but when spacers are formed using an inkjet method, the spacers may be located in a part that does not overlap with the planar partition (265). In that case, a problem arises where the spacers cannot perform their function.

[0141] However, as shown in FIGS. 6 to 8, the spacer forming portion (CSL) of the partition wall (265) has an anisotropic planar structure that extends in one direction (the extension direction of the spacer forming portion), so that a spacer (CS) can be formed on the partition wall (265) regardless of which nozzle (NZ) among the plurality of nozzles (NZ) in the head (HEAD) of the inkjet equipment forms the spacer (CS). As a result, since a mask is not used, manufacturing costs are reduced and process time is reduced.

[0142] Below, various modified embodiments of the present invention are examined through FIGS. 11 to 19.

[0143] First, we will examine a modified embodiment of FIG. 6 through FIG. 11 to FIG. 15.

[0144] FIGS. 11 to 15 are plan views illustrating spacers and bulkheads around spacers according to various embodiments.

[0145] The embodiment of FIG. 11 is an embodiment formed by moving the position of the spacer (CS) downward in the structure of FIG. 6.

[0146] In the embodiment of FIG. 11, the spacer forming portion (CSL) and the spacer (CS) have a structure having a first margin (c1) and a second margin (c2), and the sum of the first margin (c1) and the second margin (c2) may be equal to the margin (c) value of FIG. 6. The sum of the first margin (c1) and the second margin (c2) may have a value of 14.1 μm or more and 70.5 μm or less.

[0147] The embodiments of FIG. 12 and FIG. 13 are embodiments in which the planar shape of an additional margin portion formed with a minimum width (b) located outside the spacer forming portion (CSL) in the embodiment of FIG. 11 is different from the planar shape of the spacer forming portion (CSL).

[0148] That is, as shown in FIG. 12, the planar shape of the additional margin may have an octagonal shape that is extended in one direction, or as shown in FIG. 13, it may have a quadrilateral shape (rectangular shape) that is extended in one direction. Depending on the embodiment, the shape of the additional margin may be formed to be extended in one direction and may have various shapes.

[0149] Variations of FIGS. 14 and 15 illustrate embodiments in which the spacer (CS) is not circular. In FIG. 14, the spacer (CS) has an octagonal shape, and in FIG. 15, the spacer (CS) has a square shape. Depending on the shape of the spacer (CS), the spacer forming portion (CSL) also has an octagonal and a square shape, respectively, and the spacer forming portion (CSL) is extended in one direction.

[0150] In the embodiments of FIGS. 14 and 15, the planar shape of the additional margin portion is the same as the planar shape of the spacer forming portion (CSL), and the additional margin portion may have a structure having a minimum width (b) outside the spacer forming portion (CSL).

[0151] As described above, a spacer (CS) is located inside a spacer forming portion (CSL) that is formed in a unidirectional manner, and the position of the spacer (CS) can be varied according to the extension direction of the spacer forming portion (CSL).

[0152] In this way, the spacer forming portion (CSL) of the partition wall (265) has an anisotropic planar structure that extends in one direction (the extension direction of the spacer forming portion), so that a spacer (CS) can be formed on the partition wall (265) regardless of which nozzle (NZ) among the multiple nozzles (NZ) of the head (HEAD) of the inkjet equipment forms the spacer (CS). As a result, since a mask is not used, manufacturing costs are reduced and process time is shortened.

[0153] Below, we examine the structure of the bulkhead (265), which is different from that of Fig. 8, through Figs. 16 and 17.

[0154] FIGS. 16 and FIGS. 17 are plan views of a color conversion panel of a light-emitting display device according to another embodiment.

[0155] In the embodiment of FIG. 16, similar to the embodiment of FIG. 8, the first opening (267a), the second opening (267b), and the third opening (267c) corresponding to the first color conversion layer (520a), the second color conversion layer (520b), and the transmission layer (520c) are formed in the partition wall (265) and have a rectangular shape. However, there is a difference in that the positions of the first opening (267a), the second opening (267b), and the third opening (267c) are formed in different positions than in FIG. 8. In the embodiment of FIG. 16, all openings adjacent to the periphery of the partition wall (265) where the spacer (CS) is located are dummy openings (267-v).

[0156] Referring to FIG. 16, a spacer (CS) is located in a portion of the bulkhead (265) that is formed long in one direction, and the position of the spacer (CS) may be moved and positioned in one direction unlike the portion shown in FIG. 16.

[0157] Meanwhile, in FIG. 17, unlike FIG. 8, the first opening (267a), the second opening (267b), and the third opening (267c) formed in the bulkhead (265) have a hexagonal structure modified based on a rhombus shape. Referring to FIG. 17, a spacer (CS) is located in a part of the bulkhead (265) that is formed long in one direction, and the position of the spacer (CS) may be moved and positioned in one direction, unlike the part shown in FIG. 16.

[0158] Unlike the embodiment of FIG. 8, the openings adjacent to the periphery of the bulkhead (265) where the spacer (CS) is located are not all dummy openings (267-v), and some of the openings may be one of the first opening (267a), the second opening (267b), and the third opening (267c), and one of the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c) may be located in the adjacent openings.

[0159] Below, we will examine modified embodiments of FIGS. 2 and FIG. 3 through FIGS. 18 and FIGS. 19.

[0160] FIG. 18 is a cross-sectional view showing a part of a light-emitting display device according to another embodiment, and FIG. 19 is a cross-sectional view showing a light-emitting display device according to the embodiment of FIG. 18.

[0161] In the embodiments of FIGS. 18 and 19, unlike FIGS. 2 and 3, the second capping layer (280) is located below the spacer (CS) and between the partition (265) and the spacer (CS). That is, the second capping layer (280) is located above the first color conversion layer (520a), the second color conversion layer (520b), the transparent layer (520c), and the partition (265). The second capping layer (280) can be located entirely on the substrate (210). The second capping layer (280) is a layer that covers and protects the first color conversion layer (520a), the second color conversion layer (520b), and the transparent layer (520c), and may be made of an inorganic material. For example, the second capping layer (280) may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon nitrate (SiOxNy). The second capping layer (280) may be a single layer or a multilayer structure of the said material.

[0162] A spacer (CS) is positioned on the second capping layer (280), and a filling layer (290) may be positioned on the spacer (CS) and the second capping layer (280).

[0163] In FIG. 19, a state in which a color conversion panel (2000) according to the embodiment of FIG. 18 is bonded with a display panel (1000) is shown.

[0164] In the embodiments of FIGS. 18 and 19, the spacer (CS) is formed by an inkjet method, and the spacer forming portion (CSL) of the partition wall (265) may have an anisotropic planar structure that extends in one direction (the extension direction of the spacer forming portion).

[0165] Although embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention. Explanation of the symbols

[0166] 1000: Display Panel 2000: Color Conversion Panel ED: Light-emitting element PX1, PX2, PX3: Pixels 210: Substrate 230a, 230b, 230c: Color filter 240: Low refractive index layer 250: First capping layer 265: Bulkhead 267a, 267b, 237c: Opening 267-v: Dummy opening 280: Second capping layer 290: Packing layer 520a, 520b: Color conversion layer 520c: Transmittance layer 521a, 521b: Quantum dots 530: Spawner CS: Spacer CSL: Spacer forming part HEAD: Head NZ: Nozzle Pitch-x, Pitch-y: Pitch a: Diameter b: Minimum width c, c1, c2: margin gap-nz: gap between nozzles 110: Substrate 111: Buffer layer 120: Gate insulating film 124: Gate electrode 131: Semiconductor 160: First interlayer insulating film 173: Source electrode 175: Drain electrode 180: Organic membrane 81: Via hole 191: Pixel electrode 270: Common electrode 350: Pixel definition membrane 351: Pixel aperture 370: Emitting layer 400: Encapsulation layer 410: First inorganic encapsulation layer 420: Organic encapsulation layer 430: Second weapon bag layer

Claims

Claim 1 A light-emitting display device comprising: a lower panel including an anode electrode, a light-emitting layer, a cathode electrode, and a pixel defining film having an opening for a light-emitting diode that exposes a portion of the anode electrode; and an upper panel located above the lower panel and including a partition and a plurality of spacers, wherein the partition may overlap with the plurality of spacers in a planar manner and includes a plurality of spacer forming portions extending in a first direction, wherein the plurality of spacers overlap with a portion of the plurality of spacer forming portions, and the partition includes a first opening, a second opening, a third opening, and a dummy opening, and the upper panel further includes a first color conversion layer located within the first opening, a second color conversion layer located within the second opening, and a transparent layer located within the third opening, wherein at least one of the openings adjacent to the periphery of the plurality of spacer forming portions where the plurality of spacers are located in the partition is the dummy opening. Claim 2 A light-emitting display device according to claim 1, wherein the spacing between the plurality of spacers adjacent in the first direction corresponds to an integer multiple of the spacing between adjacent pixels in the first direction, and the spacing adjacent in the second direction perpendicular to the first direction does not correspond to an integer multiple of the spacing between adjacent pixels in the second direction. Claim 3 A light-emitting display device according to claim 1, wherein the first direction is the same direction as the extension direction of the head of the inkjet equipment forming the spacer, and is a direction perpendicular to the direction in which the head of the inkjet equipment moves. Claim 4 In paragraph 3, the spacer has a diameter of 10㎛ or more and 30㎛ or less, and a height of 2㎛ or more and 10㎛ or less, in a light-emitting display device. Claim 5 A light-emitting display device according to claim 4, wherein the margin in the first direction excluding the spacer in the spacer forming portion is 14.1 μm or more and 70.5 μm. Claim 6 In paragraph 5, the head of the inkjet equipment comprises a plurality of nozzles, and the margin in the first direction is equal to the spacing between the minimum nozzles in the first direction of the plurality of nozzles, in a light-emitting display device. Claim 7 A light-emitting display device according to claim 5, wherein the length of the first direction of the spacer forming portion is 24.1 μm or more and 90.5 μm or less. Claim 8 In claim 5, the partition wall further includes an additional margin portion located around the spacer forming portion, and the additional margin portion has a width of 5㎛ or more and 15㎛ or less, in a light-emitting display device. Claim 9 In paragraph 8, the planar shape of the additional margin portion is the same as or different from the planar shape of the spacer forming portion of the light-emitting display device. Claim 10 In claim 1, the upper panel further comprises an upper capping layer, wherein the upper capping layer comprises one of silicon nitride (SiNx), silicon oxide (SiOx) and silicon nitride (SiOxNy), and the upper capping layer covers the partition and the spacer, forming a light-emitting display device. Claim 11 In claim 1, the upper panel further comprises an upper capping layer, wherein the upper capping layer comprises one of silicon nitride (SiNx), silicon oxide (SiOx) and silicon nitride (SiOxNy), and the upper capping layer is a light-emitting display device located between the partition and the spacer. Claim 12 delete Claim 13 In claim 1, the pixel defining film comprises a plurality of openings for the light-emitting diode, and the plurality of openings for the light-emitting diode each overlap in a plane with the first opening, the second opening, and the third opening of the partition wall. Claim 14 In claim 13, the upper panel further comprises a first color filter, a second color filter, and a third color filter, wherein the first color filter overlaps planarly with the first color conversion layer, the second color filter overlaps planarly with the second color conversion layer, the third color filter overlaps planarly with the transmission layer, and the light-blocking area where at least two of the first color filter, the second color filter, and the third color filter overlap overlaps planarly with the partition wall, a light-emitting display device. Claim 15 In paragraph 14, the dummy opening is a light-emitting display device that overlaps planarly with the light-blocking area. Claim 16 A color conversion panel comprising: a plurality of spacers; a plurality of spacer forming portions that can overlap in a plane with the plurality of spacers and are extended in a first direction, and a partition wall including a first opening, a second opening, and a third opening; a first color conversion layer located within the first opening; a second color conversion layer located within the second opening; and a transparent layer located within the third opening, wherein each of the plurality of spacers overlaps with a portion of the plurality of spacer forming portions, and the partition wall further includes a dummy opening, and at least one of the openings adjacent to the periphery of the plurality of spacer forming portions in the partition wall where the plurality of spacers are located is the dummy opening. Claim 17 In paragraph 16, the plurality of spacers are color conversion panels in which the spacing adjacent in the first direction and the spacing adjacent in the second direction perpendicular to the first direction are different. Claim 18 In claim 16, the color conversion panel, wherein the first direction is the same direction as the extension direction of the head of the inkjet equipment forming the spacer and is a direction perpendicular to the direction in which the head of the inkjet equipment moves. Claim 19 In claim 18, the bulkhead further comprises a plurality of additional margin portions located around each of the plurality of spacer forming portions, each of the plurality of spacers having a diameter of 10 μm or more and 30 μm or less and a height of 2 μm or more and 10 μm or less, the first direction margin excluding the spacers located in each of the plurality of spacer forming portions being 14.1 μm or more and 70.5 μm, and each of the plurality of additional margin portions having a width of 5 μm or more and 15 μm or less, a color conversion panel. Claim 20 In claim 16, the color conversion panel further comprises a first color filter, a second color filter, and a third color filter, wherein the first color filter overlaps planarly with the first color conversion layer, the second color filter overlaps planarly with the second color conversion layer, and the third color filter overlaps planarly with the transmission layer, and the light-blocking area where at least two of the first color filter, the second color filter, and the third color filter overlap overlaps planarly with the partition, and the dummy opening overlaps planarly with the light-blocking area.

Images