Coil component

Abstract

One embodiment of the present invention comprises a body, an insulating layer disposed within the body, a first coil disposed on one surface of the insulating layer, a second coil disposed on the other surface of the insulating layer, a plurality of conductive vias connecting the first and second coils, a first external electrode disposed in the body and connected to the first coil, and a second external electrode disposed in the body and connected to the second coil, wherein at least two of the plurality of conductive vias each comprise a plurality of sides, and at least one of the plurality of sides is exposed and not partially covered by the insulating layer.

Description

Technology Field

[0001] The present invention relates to a coil component. Background Technology

[0002] With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, and laptops, there is a growing demand for miniaturization and thinning of coil components applied to these devices. To meet these demands, research and development of various types of coil components, including winding and thin-film types, is actively underway.

[0003] A major issue arising from the miniaturization and thinning of coil components is achieving characteristics equivalent to existing ones despite this reduction. To satisfy this requirement, the proportion of magnetic material in the core filled with magnetic material must be increased; however, there are limitations to increasing this proportion due to factors such as changes in frequency characteristics resulting from the strength and insulation properties of the inductor body.

[0004] Meanwhile, in the case of a miniaturized thin-film power inductor, conductive vias for electrical connection between coil layers are included, and via pads with a line width larger than the end of the innermost turn of the coil pattern can be formed to ensure alignment between the conductive vias and the coils. However, in this case, the size of the core may not be sufficiently secured due to the via pad area, and the magnetic properties of the coil component may be degraded as a result. Prior art literature

[65535] Prior Art 1: Registered Patent Publication No. 10-2145308 Prior Art 2: Published Patent Publication No. 10-2022-0076087 Prior Art 3: Published Patent Publication No. 10-2017-0073167 The problem to be solved

[0005] One of the objectives of the present invention is to realize a coil component having excellent characteristics while being advantageous for miniaturization by sufficiently securing the size of the core. means of solving the problem

[0006] As a method to solve the above-mentioned problem, the present invention proposes a novel structure of a coil component through one example, specifically comprising a body, an insulating layer disposed within the body, a first coil disposed on one side of the insulating layer, a second coil disposed on the other side of the insulating layer, a plurality of conductive vias connecting the first and second coils, a first external electrode disposed in the body and connected to the first coil, and a second external electrode disposed in the body and connected to the second coil, wherein at least two of the plurality of conductive vias each comprise a plurality of sides, and at least one of the plurality of sides is in a form in which at least a portion is not covered by the insulating layer and is exposed.

[0007] In one embodiment, when the side among the plurality of sides that is not covered by the insulating layer and is exposed is referred to as the exposed side, the exposed side may form a co-plane with one side of the insulating layer.

[0008] In one embodiment, the exposed side may form a co-plane with one side of the first and second coils.

[0009] In one embodiment, the exposed side may be a cut surface.

[0010] In one embodiment, the exposed side may be exposed toward the cores of the first and second coils.

[0011] In one embodiment, when the side among the plurality of sides covered by the insulating layer is referred to as an unexposed side, the unexposed side may include a curved surface.

[0012] In one embodiment, the maximum width of the plurality of conductive vias measured in the line width direction of the first and second coils may be wider than half the width of the exposed side measured in a direction perpendicular to the line width direction.

[0013] In one embodiment, when one end of the first coil is connected to the first external electrode and the area connected to the plurality of conductive vias at the other end of the first coil is called the first pad area, the first pad area in the first coil may have the same line width as other areas connected thereto.

[0014] In one embodiment, when one end of the first coil is connected to the first external electrode and the area connected to the plurality of conductive vias at the other end of the first coil is called the first pad area, the first pad area in the first coil may have a wider line width than other areas connected thereto.

[0015] In one embodiment, the line width of the first pad region may be at least 1 time and no more than 2 times the width of the conductive via measured in the line width direction.

[0016] In one embodiment, one end of the second coil is connected to the second external electrode, and when the area connected to the plurality of conductive vias at the other end of the second coil is called the second pad area, the second pad area in the second coil may have the same line width as other areas connected thereto.

[0017] In one embodiment, one end of the second coil is connected to the second external electrode, and when the area connected to the plurality of conductive vias at the other end of the second coil is called the second pad area, the second pad area in the second coil may have a wider line width than other areas connected thereto.

[0018] In one embodiment, the line width of the second pad region may be at least 1 time and no more than 2 times the width of the conductive via measured in the line width direction.

[0019] In one embodiment, the plurality of conductive vias may be arranged in one direction.

[0020] In one embodiment, the coil component may include three or more of the plurality of conductive vias. Effects of the invention

[0021] As one effect of the present invention, a coil component having excellent characteristics while being advantageous for miniaturization can be realized by sufficiently securing the size of the core. Brief explanation of the drawing

[0022] FIG. 1 is a transparent perspective view schematically showing a coil component of one embodiment of the present invention. Figure 2 is a partial enlarged view of Figure 1 and is an assembly diagram showing the connection relationships between the components. Figure 3 is a plan view showing an enlarged portion of Figure 1. Figures 4 and 5 are cross-sectional views of one region of the coil part of Figure 1. FIGS. 6 to 8 show coil parts according to modified examples. Figures 9a and 9b are cross-sectional views by process showing the manufacturing process of a coil component. Specific details for implementing the invention

[0023] Embodiments of the present invention will be described below with reference to specific embodiments and the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0024] Various types of electronic components are used in electronic devices, and among these components, various types of coil components can be appropriately utilized for purposes such as noise removal. That is, coil components in electronic devices can be used as power inductors, high-frequency inductors (HF inductors), general beads, high-frequency beads (GHz beads), common mode filters, etc.

[0025] FIG. 1 is a transparent perspective view schematically showing a coil component of an embodiment of the present invention. FIG. 2 is an assembly drawing showing the connection relationships between components as a partial enlarged view of FIG. 1. FIG. 3 is a plan view showing an enlarged portion of FIG. 1. FIG. 4 and FIG. 5 correspond to cross-sectional views of a portion of the coil component of FIG. 1.

[0026] Referring to FIGS. 1 to 5 together, the coil component (1000) according to the present embodiment includes a body (100), an insulating layer (200), a first coil (311), a second coil (312), a plurality of conductive vias (320), a first external electrode (400), and a second external electrode (500). Here, at least two of the plurality of conductive vias (320) each include a plurality of sides (F1, N1), and at least one of the plurality of sides (F1, N1) (F1) is exposed without being partially covered by the insulating layer (200). Hereinafter, the main elements constituting the coil component (1000) of the present embodiment will be described.

[0027] The body (100) forms the exterior of the coil component (1000), and coils (311, 312) and an insulating layer (200), etc. are arranged inside it. As shown in the illustration, the body (100) may be formed in the shape of a cuboid overall. The body (100) may include a first surface (101) and a second surface (102) facing each other in a first direction (X direction), a third surface (103) and a fourth surface (104) facing each other in a second direction (Y direction), and a fifth surface (105) and a sixth surface (106) facing each other in a third direction (Z direction). As an example, the body (100) may be formed such that the coil component (1000) according to the present embodiment, having external electrodes (400, 500) to be described later, has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 1.0 mm, or a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, or a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.8 mm, or a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.5 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, but is not limited thereto. Meanwhile, since the above-described figures are merely design figures that do not reflect process errors, etc., they should be considered to fall within the scope of the present invention up to the range that can be recognized as a process error.

[0028] The length of the first direction (X direction) of the coil component (1000) described above may refer to the maximum value among the dimensions of each of the multiple line segments parallel to the first direction (X direction), formed by connecting the two outermost boundary lines facing in the first direction (X direction) of the coil component (1000) shown in the cross-section photograph of the first direction (X direction) - third direction (Z direction) at the center of the second direction (Y direction) of the coil component (1000). Alternatively, it may refer to the minimum value among the dimensions of each of the multiple line segments parallel to the first direction (X direction), formed by connecting the two outermost boundary lines facing in the first direction (X direction) of the coil component (1000) shown in the cross-section photograph. Alternatively, it may mean the arithmetic mean of at least three dimensions of each of the plurality of line segments parallel to the first direction (X direction) by connecting the two outermost boundary lines facing each other in the first direction (X direction) of the coil component (1000) shown in the cross-sectional photograph above. Here, the plurality of line segments parallel to the first direction (X direction) may be equally spaced from each other in the third direction (Z direction), but the scope of the present invention is not limited thereto.

[0029] The second direction (Y direction) length of the coil component (1000) described above may refer to the maximum value among the dimensions of each of the multiple line segments parallel to the second direction (Y direction), formed by connecting the two outermost boundary lines facing in the second direction (Y direction) of the coil component (1000) shown in the cross-section photograph of the first direction (X direction) - second direction (Y direction) cross-section at the center of the third direction (Z direction) of the coil component (1000). Alternatively, it may refer to the minimum value among the dimensions of each of the multiple line segments parallel to the second direction (Y direction), formed by connecting the two outermost boundary lines facing in the second direction (Y direction) of the coil component (1000) shown in the cross-section photograph. Alternatively, it may mean the arithmetic mean of at least three dimensions of each of the plurality of line segments parallel to the second direction (Y direction) by connecting the two outermost boundary lines facing each other in the second direction (Y direction) of the coil component (1000) shown in the cross-sectional photograph above. Here, the plurality of line segments parallel to the second direction (Y direction) may be equally spaced from each other in the first direction (X direction), but the scope of the present invention is not limited thereto.

[0030] The third direction (Z direction) length of the coil component (1000) described above may refer to the maximum value among the dimensions of each of the multiple line segments parallel to the third direction (Z direction), formed by connecting the two outermost boundary lines facing in the third direction (Z direction) of the coil component (1000) shown in the cross-section photograph of the first direction (X direction) - third direction (Z direction) cross-section at the center of the second direction (Y direction) of the coil component (1000). Alternatively, it may refer to the minimum value among the dimensions of each of the multiple line segments parallel to the third direction (Z direction), formed by connecting the two outermost boundary lines facing in the third direction (Z direction) of the coil component (1000) shown in the cross-section photograph. Alternatively, it may mean the arithmetic mean of at least three dimensions of each of the plurality of line segments parallel to the third direction (Z direction) by connecting the two outermost boundary lines facing each other in the third direction (Z direction) of the coil component (1000) shown in the cross-sectional photograph above. Here, the plurality of line segments parallel to the third direction (Z direction) may be equally spaced from each other in the first direction (X direction), but the scope of the present invention is not limited thereto.

[0031] Meanwhile, each of the lengths in the first to third directions of the coil component (1000) may be measured using a micrometer measurement method. The micrometer measurement method can be performed by setting a zero point with a micrometer that has Gage R&R (Repeatability and Reproducibility), inserting the coil component (1000) according to the present embodiment between the tips of the micrometer, and rotating the measuring lever of the micrometer. Meanwhile, when measuring the length of the coil component (1000) using the micrometer measurement method, the length of the coil component (1000) may refer to a value measured once, or it may refer to the arithmetic mean of values ​​measured multiple times.

[0032] The body (100) may include an insulating resin and a magnetic material. Specifically, the body (100) may be formed by laminating one or more magnetic composite sheets in which the magnetic material is dispersed in the insulating resin. The magnetic material may be a ferrite or a metallic magnetic powder. The ferrite may be, for example, at least one of spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn systems; hexagonal ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co systems; garnet-type ferrites such as Y-type ferrites; and Li-type ferrites. The metallic magnetic powder may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, and Fe-Cr-Al alloy powder. The metallic magnetic powder may be amorphous or crystalline. For example, the metallic magnetic powder may be an Fe-Si-B-Cr-based amorphous alloy powder, but is not necessarily limited thereto. The ferrite and the metallic magnetic powder may each have an average diameter of about 0.1 μm to 30 μm, but are not limited thereto. The body (100) may include two or more types of magnetic materials dispersed in a resin. Here, the term "different types of magnetic materials" means that the magnetic materials dispersed in the resin are distinguished from one another by any one of average diameter, composition, crystallinity, and shape.Meanwhile, the following description is based on the premise that the magnetic material is a metal magnetic powder, but the scope of the present invention is not limited to a body (100) having a structure in which metal magnetic powder is dispersed in an insulating resin. The insulating resin may include epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination, but is not limited thereto.

[0033] Meanwhile, the body (100) may include a core (110) that penetrates the insulating layer (200) and coils (311, 312) to be described later. The core (110) may be formed by filling a through hole (111h) that penetrates the center of the first and second coils (311, 312) and the center of the insulating layer (200) with a magnetic composite sheet containing a magnetic material.

[0034] The insulating layer (200) is disposed inside the body (100) and can support the coils (311, 312). As described below, the insulating layer (200) can support the partition (230) used during the process of forming the first and second coils (311, 312), and during the trimming process for forming the core (110), the central part of the insulating layer (200) can be removed to form a through hole (111h). Meanwhile, the insulating layer (200) can be trimmed along the shape of the pad area (341, 342) described below to have a shape corresponding to the via area (341, 342). Referring to FIGS. 1 to 4, the via hole (321h) described below can be partially removed on the side of the insulating layer (200) facing the core (110) to form a concave curved surface. This part of the insulating layer (200) is in contact with the unexposed side (N1) of the conductive via (320) to be described later, and may have an inwardly concave arc shape.

[0035] Meanwhile, the insulating layer (200) may be formed from an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed from an insulating material in which a reinforcing material such as glass fiber or an inorganic filler is impregnated into such insulating resin. For example, the insulating layer (200) may be formed from insulating materials such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric), but is not limited thereto. As an inorganic filler, at least one selected from the group consisting of silica (silicon dioxide, SiO2), alumina (aluminum oxide, Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) may be used. If the insulating layer (200) is formed from an insulating material including a reinforcing material, the insulating layer (200) may provide superior rigidity. If the insulating layer (200) is formed from an insulating material that does not include glass fibers, it may be advantageous to thin the thickness of the coil component (1000) according to the present embodiment. Additionally, based on a body (100) of the same size, the volume occupied by the coils (311, 312) and / or metal magnetic powder can be increased, thereby improving the characteristics of the component. If the insulating layer (200) is formed from an insulating material including a photosensitive insulating resin, the number of processes for forming the coils (311, 312) is reduced, which is advantageous for reducing production costs, and the conductive vias (320) can be formed finely. The thickness of the insulating layer (200) may be, for example, 10㎛ or more and 50㎛ or less, but is not limited thereto.

[0036] The first coil (311) is disposed on one side (S1) of the insulating layer (200), and the second coil (312) is disposed on the other side (S2) of the insulating layer (200). At one end of the first and second coils (311, 312), the first and second lead portions (331, 332) are respectively formed, and at the other end, the first and second pad regions (341, 342) are respectively formed. Here, the first and second lead portions (331, 332) are respectively connected to the first and second external electrodes (400, 500), and the first and second pad regions (341, 342) can be connected to a plurality of conductive vias (320). The first coil (311) and the second coil (312) may each be in the form of a planar spiral forming at least one turn with the core (110) as the axis.

[0037] Conductive vias (320) connect the first and second coils (311, 312) and are provided in multiple numbers in this embodiment. As they are connected by multiple conductive vias (320), the connectivity of the first and second coils (311, 312) can be improved in terms of structural and electrical aspects. However, if multiple conductive vias (320) are used, the size of the core (110) of the first and second coils (311, 312) may be reduced, and consequently, there is a possibility that the magnetic properties of the coil component (1000) may be degraded. In this embodiment, such degradation of magnetic properties is minimized by optimizing the shape and further arrangement method of the multiple conductive vias (320). Specifically, at least two of the multiple conductive vias (320) each include multiple sides (F1, N1), and at least one of the multiple sides (F1, N1) (F1) is exposed without being partially covered by the insulating layer (200). In this embodiment, the entire side (F1) is exposed, but depending on the embodiment, a portion of the side (F1) may be covered by an insulating layer (200). In this embodiment, two conductive vias (320) are provided, however, three conductive vias (320) may be included as in the modified example of FIGS. 7 and FIGS. 8. Additionally, if necessary to further improve the connectivity of the first and second coils (311, 312), four or more conductive vias (320) may be included. In this embodiment, an example is shown in which one exposed side (F1) is defined as the side that is not covered by the insulating layer (200) among the multiple sides (F1, N1) of the conductive via (320), but there may be two or more exposed sides (F1).

[0038] Among the multiple sides (F1, N1) of the conductive via (320), the exposed side (F1) may be co-plane with one side (S3) of the insulating layer (200), wherein the one side (S3) of the insulating layer (200) may be a surface facing the core (110). Additionally, the exposed side (F1) of the conductive via (320) may be co-plane with one side of the first and second coils (311, 312), specifically, a surface facing the core (110). This co-plane structure can be obtained by simultaneously cutting the conductive via (320), the insulating layer (200), and furthermore the first and second coils (311, 312). In this case, the exposed side (F1) of the conductive via (320) may be a cut surface and may be exposed toward the core (110). As in the present embodiment, when a plurality of conductive vias (320) have exposed sides (F1), the size of the area facing the core (110) from the conductive vias (320), furthermore the insulating layer (200) and pad areas (341, 423) can be reduced, and accordingly, the size of the core (110) can be sufficiently secured. Therefore, as described above, the connectivity between the first and second coils (311, 312) is improved through the plurality of conductive vias (320), and the magnetic properties of the coil component (1000) can also be improved by securing the size of the core (110).

[0039] Referring to FIG. 3 for more specific examples, when the side covered by the insulating layer (200) among the plurality of sides (F1, N1) of the conductive via (320) is called the unexposed side (N1), the unexposed side (N1) may include a curved surface. Additionally, the maximum width (W1) of the plurality of vias (320), measured in the line width direction (Y direction based on the drawing) of the first and second coils (311, 312), may be wider than half the width (W1) of the exposed side (F1) measured in the direction perpendicular to the line width direction (X direction). By making the maximum width (W1) wider than half the width (W1) of the exposed side (F1), high connectivity of the first and second coils (311, 312) can be achieved. And, as shown in the illustrated form, a plurality of conductive vias (320) may be arranged in one direction, wherein the one direction may be the extension direction of the first and second coils (311, 312). When a plurality of conductive vias (320) are provided, arranging them in one direction may be suitable for sufficiently securing the size of the core (110). Meanwhile, although FIG. 3 shows the second coil (312), the first coil (311) may also have the same shape, and this will also be the case for the variations of FIG. 6 to 8.

[0040] Additionally, in the present embodiment, the pad regions (341, 342) may have a relatively narrow line width (W3) compared to the prior art. Specifically, the first pad region (341) in the first coil (311) may have the same line width (W3) as the other region connected thereto. Similarly, the second pad region (342) in the second coil (312) may have the same line width (W3) as the other region connected thereto. Alternatively, as shown in the variations of FIGS. 7 and 8, the first pad region (341) in the first coil (311) may have a wider line width (W3) than the other region connected thereto, FIG. 7 shows the case where there are two conductive vias (320), and FIG. 8 shows the case where there are three conductive vias (320). Likewise, the second pad region (342) in the second coil (312) may have a wider line width (W3) than the other region connected thereto. In the embodiments of FIGS. 3, 7, and 8, the relative size of the width (W1) of the conductive via (320) to the line width (W3) of the pad areas (341, 342) can be determined by considering the connectivity of the first and second coils (311, 312). Specifically, the line width (W3) of the first pad area (341) may be at least 1 time and at least 2 times the width (W1) of the conductive via (320) measured in the line width direction (Y direction), and similarly, the line width (W3) of the second pad area (342) may be at least 1 time and at least 2 times the width of the conductive via (W1) measured in the line width direction (Y direction). Compared to the embodiment of FIG. 3, FIG. 7 and FIG. 8 have an increased width (W1) of the conductive via (320) and a line width (W3) of the pad area (341, 342), and may be suitable for further improving the connectivity of the first and second coils (311, 312).

[0041] Meanwhile, referring to FIGS. 4 and 5, the first and second coils (311, 312) may include at least one conductive layer. Specifically, the first and second coils (311, 312) may be formed by a plating process, in which case they may include a seed layer (310) and an electroplating layer. Here, the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer of the multi-layer structure may be formed as a conformal film structure in which another electroplating layer is formed along the surface of one electroplating layer, or it may be formed in a shape in which another electroplating layer is stacked on only one side of one electroplating layer. The seed layer (310) may be formed by an electroless plating method or a vapor deposition method such as sputtering. The first and second coils (311, 312) may be formed integrally with the seed layer (310) so that no boundary is formed between them, but are not limited thereto. Additionally, the respective electroplating layers in the first and second coils (311, 312) may be formed integrally so that no boundary is formed between them, but are not limited thereto. The first and second coils (311, 312) may be formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or alloys thereof, but are not limited thereto.

[0042] An insulating film (IF) may be formed on the surface of the first and second coils (311, 312). The insulating film (IF) may integrally cover the first and second coils (311, 312) and the insulating layer (200). Specifically, the insulating film (IF) may be positioned between the first and second coils (311, 312) and the body (100), and between the insulating layer (200) and the body (100). The insulating film (IF) may be formed along the surface of the insulating layer (200) on which the first and second coils (311, 312) are formed, but is not limited thereto. Additionally, the exposed side (F1) of the conductive via (320) may come into contact with the insulating film (IF). The insulating film (IF) may fill areas such as between each adjacent turn of the first and second coils (311, 312). The insulating film (IF) is intended to electrically separate the first and second coils (311, 312) from the body (100) and may include known insulating materials such as parylene, but is not limited thereto. As another example, the insulating film (IF) may include insulating materials such as epoxy resin other than parylene. The insulating film (IF) may be formed by vapor deposition, but is not limited thereto. As another example, the insulating film (IF) may be formed by laminating and curing an insulating film for forming the insulating film (IF) on both sides of the insulating layer (200) on which the first and second coils (311, 312) are formed, or by applying and curing an insulating paste for forming the insulating film (IF) on both sides of the insulating layer (200) on which the first and second coils (311, 312) are formed. Meanwhile, for the reasons mentioned above, the insulating film (IF) is a component that can be omitted in this embodiment. That is, if the body (100) has sufficient electrical resistance at the designed operating current and voltage of the coil component (1000), the insulating film (IF) can be omitted in this embodiment.

[0043] The first and second external electrodes (400, 500) are spaced apart from each other on the body (100) and are connected to the first and second coils (311, 312), respectively. Specifically, the first external electrode (400) is placed on the first surface (101) of the body (100) and is connected to the first lead portion (331) exposed to the first surface (101) of the body (100), and the second external electrode (500) is placed on the second surface (102) of the body (100) and is connected to the second lead portion (332) exposed to the second surface (102) of the body (100). The first external electrode (400) is disposed on the first surface (101) of the body (100) and may extend to at least a portion of the third to sixth surfaces (103, 104, 105, 106) of the body (100). The second external electrode (500) is disposed on the second surface (102) of the body (100) and may extend to at least a portion of the third to sixth surfaces (103, 104, 105, 106) of the body (100). Meanwhile, the first and second external electrodes (400, 500), disposed respectively on the first surface (101) and the second surface (102) of the body (100), may each have a structure that extends only to the sixth surface (106) of the body (100).

[0044] The external electrode (400, 500) may be formed by a vapor deposition method such as sputtering and / or plating, but is not limited thereto. The external electrode (400, 500) may be formed from a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or an alloy thereof, but is not limited thereto. The external electrode (400, 500) may be formed in a single layer or a multi-layer structure. For example, the external electrode (400, 500) may include a first conductive layer containing copper (Cu), a second conductive layer disposed on the first conductive layer containing nickel (Ni), and a third conductive layer disposed on the second conductive layer containing tin (Sn). At least one of the second conductive layer and the third conductive layer may be formed in a shape that covers the first conductive layer, but the scope of the present invention is not limited thereto. The first conductive layer may be a plating layer, or a conductive resin layer formed by applying and curing a conductive resin comprising a conductive powder containing at least one of copper (Cu) and silver (Ag) and a resin. The second and third conductive layers may be plating layers, but the scope of the present invention is not limited thereto.

[0045] The coil component (1000) according to the present embodiment may further include an external insulating layer disposed on the third to sixth surfaces (103, 104, 105, 106) of the body (100). The external insulating layer may be disposed in an area other than the area where the external electrode (400, 500) is disposed. At least some of the external insulating layers disposed on each of the third to sixth surfaces (103, 104, 105, 106) of the body (100) may be formed in the same process so as not to form a boundary between them, but the scope of the present invention is not limited thereto. The external insulating layer may be formed by forming an insulating material for forming the external insulating layer by methods such as printing, vapor deposition, spray coating, or film lamination, but is not limited thereto. The outer insulation layer is made of thermoplastic resins such as polystyrene-based, vinyl acetate-based, polyester-based, polyethylene-based, polypropylene-based, polyamide-based, rubber-based, and acrylic-based resins; thermosetting resins such as phenolic-based, epoxy-based, urethane-based, melamine-based, and alkyd-based resins; photosensitive resins; parylene; and SiO₂. x or SiN x It may include. The outer insulating layer may further include insulating fillers such as inorganic fillers, but is not limited thereto.

[0046] Hereinafter, an example of a method for manufacturing a coil component having the structure described above is explained. First, FIGS. 9a and 9b are drawings showing the process of forming a coil using a partition method in sequence. Referring to FIG. 9a, an insulating layer (200) is prepared first. The insulating layer (200) can be obtained from a conventional copper foil laminate (CCL), etc., and in this case, a thin copper foil (210) may be formed on both sides thereof. Next, the copper foil (210) is removed from the insulating layer (200) and a via hole (321h) is formed. The via hole (321h) can be formed using a mechanical drill and / or a laser drill. At this time, the process of removing the copper foil (210) may be omitted and the copper foil (210) itself may be used as a seed, but is not limited thereto. In this case, it may be necessary to create a separate seed layer (310) on the side of the via hole (321h). Next, a seed layer (310) is formed on both sides of the insulating layer (200) and on the wall of the via hole (321h). The seed layer (310) can be formed by a known method, for example, using a dry film, and can be formed by CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), sputtering, etc., but is not limited thereto.

[0047] Next, partition walls (230) are formed on both sides of the insulating layer (200). Each partition wall (230) may be a resist film, and may be formed by a method of laminating and curing the resist film or by a method of applying and curing the resist film material, but is not limited thereto. As a lamination method, for example, a hot press method in which pressure is applied at a high temperature for a certain period of time and then reduced to cool to room temperature, followed by cooling in a cold press and separating the work tool, may be used. As a coating method, for example, a screen printing method in which ink is applied with a squeegee, or a spray printing method in which ink is atomized and applied, may be used. Curing may be performed by drying so as not to completely cure in order to use a photolithography method or the like as a subsequent process. The partition wall (230) has an opening (231h) having a flat coil shape, and the opening (231h) can be patterned using a known photolithography method, i.e., a known exposure and development method, and can be patterned sequentially or at once. The exposure equipment or developer solution is not particularly limited and can be appropriately selected and used depending on the photosensitive material used. At this time, the partition wall (230) is positioned to correspond to the shape of the pad area (341, 342), and by positioning the partition wall (230) in a part of the interior of the via hole (321h), a conductive via (320) can be formed along the shape of the pad area (341, 342) in the subsequent plating process.

[0048] Referring to FIG. 9b, the opening (231h) of the partition wall (230) can be utilized as a plating growth guide to form first and second coils (311, 312) on the seed layer (310). At this time, since they are formed by a single plating process, the conductive via (320) and the pad area (341, 342) can be formed integrally. At this time, the formed plurality of conductive vias (320) are placed in the via hole (321h) to connect the upper and lower first and second coils (311, 312) to each other, and may have an unexposed side (N1) covered by the insulating layer (200) and an exposed side (F1) not covered by the insulating layer (200). That is, it may have an unexposed side (N1) in contact with the inner wall of the via hole (321h) and an exposed side (F1) that does not contact the inner wall of the via hole (321h). As the first and second coils (311, 312) and the conductive via (320) are formed integrally in one process, the exposed side (F1) of the conductive via (320) may be coplanar with one side of the insulating layer (200) or one side of the first and second coils (311, 312).

[0049] Meanwhile, the manufacturing method of the first and second coils (311, 312) using the partition wall (230) involves first forming an opening pattern within the insulator and then using this as a guide for plating; unlike conventional anisotropic plating technology, this method has the advantage of facilitating the shape control of the coil conductor. That is, the first and second coils (311, 312) formed each have a flat side surface that contacts the partition wall (230). Here, the term "flat" includes not only completely flat but also substantially flat. That is, it takes into account that the wall surface of the opening pattern has a certain roughness through the photolithography method. The plating method is not particularly limited and may use electrolytic plating, electroless plating, etc., but is not limited thereto. Next, after forming the first and second coils (311, 312), the partition wall (230) is removed. The removal of the partition wall (230) may be performed using a known stripping solution, etc. At this time, after removing the partition wall (230), the seed layer (310) can be etched to form a pattern.

[0050] Next, a through hole (111h) penetrating the insulating layer (200) is formed through a trimming process. During this process, a portion of the insulating layer (200) and the conductive via (320) may also be trimmed together, and the sides of the first and second coils (311, 312), the conductive via (320), and the insulating layer (200) that are in contact with the through hole (111h) may have corresponding shapes and substantially form a coplanar plane. The through hole (111h) may be formed using a mechanical drill and / or a laser drill, etc. The through hole (111h) may be connected to the via hole (321h) to form a single hole. During the trimming process, a penetrating area may be formed not only in the center but also in the outer part. That is, during the trimming process, an insulating layer (200) can form a penetrating area in the center and outer part so that it has a shape corresponding to the planar shape of the first and second coils (311, 312), and such an area can be filled with a magnetic material, thereby enabling the realization of superior coil characteristics.

[0051] Next, an insulating film (IF) is formed to integrally cover the insulating layer (200) and the first and second coils (311, 312). The insulating film (IF) coating can be performed using CVD (Chemical Vapor Deposition), etc. Finally, a magnetic sheet is laminated to cover the manufactured insulating layer (200) and the first and second coils (311, 312) to form a body (100), and then first and second external electrodes (400, 500) can be placed on the surface of the formed body (100) so as to be connected to the first and second coils (311, 312) respectively and spaced apart from each other.

[0052] The present invention is not limited by the embodiments described above and the attached drawings, but is intended to be limited by the appended claims. Accordingly, various substitutions, modifications, and changes may be made by those skilled in the art within the scope of the technical concept of the present invention as described in the claims, and such are also to be considered to fall within the scope of the present invention. Explanation of the symbols

[0053] 1000: Coil parts 100: Body 110: Core 111h: Through hole 200: Insulating layer 210: Copper foil 230: Bulkhead, 231h: Opening 310: Seed layer 311, 312: Coil 320: Challenging Vial 321h: Via hole 331, 332: Withdrawal section 341, 342: Pad area 400, 500: External electrodes N1: Unexposed side F1: Exposed side IF: Insulating film

Claims

Claim 1 A coil component comprising: a body; an insulating layer disposed within the body; a first coil disposed on one side of the insulating layer; a second coil disposed on the other side of the insulating layer; a plurality of conductive vias connecting the first and second coils; a first external electrode disposed in the body and connected to the first coil; and a second external electrode disposed in the body and connected to the second coil; wherein at least two of the plurality of conductive vias each comprise a plurality of sides, and at least one of the plurality of sides is exposed without being partially covered by the insulating layer, and when the side among the plurality of sides that is exposed without being covered by the insulating layer is referred to as an exposed side, the plurality of conductive vias is a coil component in which the maximum width measured in the line width direction of the first and second coils is wider than half the width of the exposed side measured in a direction perpendicular to the line width direction. Claim 2 In claim 1, the exposed side is a coil component that forms a co-plane with one side of the insulating layer. Claim 3 In paragraph 2, the exposed side is a coil component that forms a co-plane with one side of the first and second coils. Claim 4 In paragraph 2, the exposed side is a coil part that is a cut surface. Claim 5 In paragraph 2, the exposed side is a coil component exposed toward the core of the first and second coils. Claim 6 In paragraph 2, when the side among the plurality of sides covered by the insulating layer is referred to as the unexposed side, the unexposed side is a coil component including a curved surface. Claim 7 delete Claim 8 In claim 1, when one end of the first coil is connected to the first external electrode and the region connected to the plurality of conductive vias at the other end of the first coil is called the first pad region, the first pad region in the first coil is a coil component having the same line width as another region connected thereto. Claim 9 In claim 1, one end of the first coil is connected to the first external electrode, and the region connected to the plurality of conductive vias at the other end of the first coil is called the first pad region, wherein the first pad region in the first coil has a wider line width than other regions connected thereto. Claim 10 A coil component according to claim 8 or 9, wherein the line width of the first pad region is at least 1 time and no more than 2 times the width of the conductive via measured in the line width direction. Claim 11 In claim 1, one end of the second coil is connected to the second external electrode, and the region connected to the plurality of conductive vias at the other end of the second coil is called the second pad region, wherein the second pad region in the second coil is a coil component having the same line width as another region connected thereto. Claim 12 In claim 1, one end of the second coil is connected to the second external electrode, and the region connected to the plurality of conductive vias at the other end of the second coil is called the second pad region, wherein the second pad region in the second coil has a wider line width than other regions connected thereto. Claim 13 A coil component according to claim 11 or 12, wherein the line width of the second pad region is at least 1 time and no more than 2 times the width of the conductive via measured in the line width direction. Claim 14 In claim 1, the plurality of conductive vias are coil components arranged in one direction. Claim 15 A coil component according to claim 1, comprising three or more of the plurality of conductive vias.

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