Jig for flux cleaning apparatus

Abstract

The present invention relates to a jig for a flux cleaning device, wherein the jig is used to support and fix an ultra-thin substrate in a flux cleaning device for a semiconductor packaging process, and comprises a lower jig having an opening into which the ultra-thin substrate is disposed, and an upper jig for fixing the ultra-thin substrate disposed on the lower jig from above, wherein the lower jig comprises a support frame defining the opening having a width in a first direction and a length in a second direction orthogonal to the first direction, and a plurality of support rods extending in the first direction and fixed between mutually opposing inner walls of the opening, and arranged spaced apart from each other in the second direction to support the ultra-thin substrate from below when the ultra-thin substrate is received within the opening, wherein the diameter of the plurality of support rods is 10 times or more and 20 times or less the thickness of the ultra-thin substrate, and the spacing between the plurality of support rods is 100 times or more and 200 times or less the thickness of the ultra-thin substrate. Provides

Description

Technology Field

[0001] The present invention relates to a jig for a flux cleaning device, and more specifically, to a jig for a flux cleaning device that can stably support and fix an ultra-thin substrate in a flux cleaning process performed after a chip mounting process, such as a semiconductor packaging process, for example, a flip-chip process, thereby suppressing sagging of the substrate after the cleaning and drying process and reducing the occurrence of stains caused by residual moisture. Background Technology

[0002] In semiconductor packaging processes, particularly flip-chip processes, flux residue remains on the surface and bottom of the substrate after solder bonding, and a cleaning process using a flux cleaning device is performed to remove it. This flux cleaning process typically includes a water rinsing process, an air blowing process, and a hot air drying process.

[0003] With the recent increase in the integration and thinning of semiconductor packages, the substrates used in the process are gradually transitioning to ultra-thin substrates with a thickness of approximately 0.1 mm or less. These ultra-thin substrates can easily bend or sag due to the cleaning water, air, and hot air sprayed during the flux cleaning process. In particular, if moisture remains on the underside of the substrate, water marks may occur, potentially degrading product reliability.

[0004] Conventional flux cleaning jigs often consist of structures that merely support or fix the substrate, which has limitations in that they fail to adequately consider the reduction in mechanical strength of ultra-thin substrates and the sagging issues caused by process flow.

[0005] The technology forming the background of the present invention is disclosed in Korean Patent Publication No. 10-2001-0058114. The problem to be solved

[0006] The technical problem to be solved by the present invention is to provide a jig capable of stably supporting and fixing an ultra-thin substrate during a flux cleaning process, thereby maintaining the flatness of the substrate within a certain range even after the cleaning and drying processes and suppressing the occurrence of water droplet stains caused by residual moisture.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] A jig for a flux cleaning apparatus according to embodiments of the present invention for achieving the above objective is a jig used to support and fix an ultra-thin substrate in a flux cleaning apparatus of a semiconductor packaging process, comprising: a lower jig having an opening in which the ultra-thin substrate is disposed; and an upper jig for fixing the ultra-thin substrate disposed on the lower jig from above, wherein the lower jig comprises: a support frame defining the opening having a width in a first direction and a length in a second direction orthogonal to the first direction; The apparatus comprises a plurality of support rods that are extended and fixed in the first direction between the mutually opposing inner walls of the opening and spaced apart from each other in the second direction, and support the ultra-thin substrate from below when the ultra-thin substrate is received within the opening, wherein the diameter of the plurality of support rods is 10 times or more and 20 times or less the thickness of the ultra-thin substrate, and the spacing between the plurality of support rods is 100 times or more and 200 times or less the thickness of the ultra-thin substrate.

[0009] According to one embodiment, the spacing between the support rod positioned at the outermost side in the second direction and the inner wall of the support frame facing it may be characterized as being 0.3 times or more and 1.0 times or less the spacing between the plurality of support rods.

[0010] According to one embodiment, the spacing between the plurality of support rods may be characterized in that, when the ultra-thin substrate is placed in a free state on a reference plane after a flux cleaning process, the flatness, defined as the maximum spacing distance between the reference plane and the ultra-thin substrate, is set to be 10 times or less the thickness of the ultra-thin substrate.

[0011] According to one embodiment, the thickness of the ultra-thin substrate is 0.08 to 0.12 mm, the spacing between the plurality of support rods is 10 to 20 mm, the diameter of the plurality of support rods is 1.4 to 1.6 mm, and the ratio of the length to the width of the opening is 3.4 or more and 3.8 or less. Effects of the invention

[0012] A jig for a flux cleaning device according to the present invention comprises a lower jig including a plurality of support rods that support an ultra-thin substrate from below, and an upper jig that fixes the ultra-thin substrate from above, thereby enabling stable support and fixation of the ultra-thin substrate during the flux cleaning process.

[0013] In particular, in the present invention, by setting the spacing between support rods in conjunction with the thickness of the ultra-thin substrate, the sagging or deformation of the ultra-thin substrate caused by fluid loads generated during the water rinsing, air blowing, and hot air drying processes during the flux cleaning process can be effectively suppressed. Accordingly, when the ultra-thin substrate is placed in a free state on a reference plane after the cleaning process is completed, the flatness of the substrate can be maintained at a predetermined multiple or less of the substrate thickness.

[0014] In addition, the spacing of the support rods and the opening structure allow cleaning water and air to flow smoothly along the bottom surface of the substrate, thereby suppressing the phenomenon of moisture remaining on the surface and bottom surface of the substrate even after the air blow and hot air drying processes, and providing the effect of preventing water droplet stains.

[0015] In addition, the diameter of the support rod according to the present invention is set to correspond to the thickness range of the ultra-thin substrate, thereby ensuring contact stability with the substrate, while simultaneously ensuring that the flatness maintenance and drainage / drying effects resulting from the spacing of the support rods are stably realized throughout the flux cleaning process.

[0016] Consequently, the present invention can simultaneously satisfy the requirements for support stability of an ultra-thin substrate during a flux cleaning process, maintenance of flatness after cleaning, and suppression of water droplet stains, thereby providing the effect of improving process reliability and product yield in semiconductor packaging processes. Brief explanation of the drawing

[0017] FIG. 1 is a drawing for explaining a jig for a flux cleaning device according to embodiments of the present invention, and is a top view of a state in which an ultra-thin substrate is mounted. FIG. 2 is a drawing for explaining a jig for a flux cleaning device according to embodiments of the present invention, and is a drawing viewed from below with an ultra-thin substrate mounted thereon. FIGS. 3 and FIGS. 4 are a plan view and a side view, respectively, for explaining the lower jig of a jig for a flux cleaning device according to embodiments of the present invention. FIGS. 5 to 9 are stepwise drawings illustrating an example of a flux cleaning process performed by introducing a jig for a flux cleaning device according to embodiments of the present invention into a flux cleaning device. Specific details for implementing the invention

[0018] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the entire specification, the same reference numerals refer to the same components.

[0019] In this specification, when it is stated that a component is located “on” another component, this includes not only cases where a component is in contact with another component, but also cases where another component exists between the two components. Furthermore, in this specification, when it is stated that a part “includes” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0020] Embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0021] FIG. 1 is a drawing for explaining a jig for a flux cleaning device according to embodiments of the present invention, viewed from above with an ultra-thin substrate mounted thereon. FIG. 2 is a drawing for explaining a jig for a flux cleaning device according to embodiments of the present invention, viewed from below with an ultra-thin substrate mounted thereon. FIG. 3 and FIG. 4 are a plan view and a side view, respectively, for explaining a lower jig of a jig for a flux cleaning device according to embodiments of the present invention.

[0022] Referring to FIGS. 1 to 4, a jig (10) for a flux cleaning device according to embodiments of the present invention (hereinafter abbreviated as jig (10)) is used to support and fix an ultra-thin substrate (20) introduced into the flux cleaning device during a flux cleaning process, and includes a lower jig (100) and an upper jig (200).

[0023] In the present specification, “flux cleaning process” may refer to a series of processes performed through a flux cleaning device to remove flux or contaminants remaining on an ultra-thin substrate (20) in a semiconductor packaging process.

[0024] In addition, the term “ultra-thin substrate” in this specification may refer to a substrate for a semiconductor package having a thickness in the range of about 0.08 mm to 0.12 mm. That is, the thickness of the ultra-thin substrate (20) to which the present invention is applied may be 0.08 mm to 0.12 mm. Since such an ultra-thin substrate (20) can be easily deformed by external force during the flux cleaning process, a stable support structure is required.

[0025] The lower jig (100) may include a support frame (110) that defines an opening (105) in which an ultra-thin substrate (20) is placed. The opening (105) has a width in a first direction (D1) and a length in a second direction (D2) orthogonal to the first direction (D1), and may be formed to accommodate a strip-shaped ultra-thin substrate (20). The ratio of the length to the width of the opening (105) may be 1.0 or more and 5.0 or less, and preferably 3.4 or more and 3.8 or less. As an example, the width of the opening (105) may be 60 mm or more and 68 mm or less, and the length of the opening (105) may be 225 mm or more and 238 mm or less.

[0026] A plurality of support rods (120) may be disposed between the mutually opposing inner walls of the opening (105). The support rods (120) may be extended in a first direction (D1) and fixed on the inner wall of the opening (105), and may be disposed spaced apart from each other in a second direction (D2). Accordingly, when an ultra-thin substrate (20) is received within the opening (105), the ultra-thin substrate (20) may be supported by the plurality of support rods (120).

[0027] According to the concept of the present invention, the diameter of the support rods (120) may be 10 to 20 times the thickness of the ultra-thin substrate (20), and preferably 14 to 16 times. For example, when the thickness of the ultra-thin substrate (20) is 0.1 mm, the diameter of the support rods (120) may be 1.0 to 2.0 mm, and preferably 1.4 to 1.6 mm.

[0028] Since the plurality of support rods (120) according to the present invention directly support the ultra-thin substrate (20) from below, the diameter of the support rod (120) can affect both the support stability of the substrate and the drainage and drying performance during the cleaning process. For example, if the diameter of the support rod (120) is excessively small compared to the thickness of the ultra-thin substrate (20), the contact area with the substrate is not sufficiently secured, resulting in localized stress concentration and localized sagging or micro-deformation of the substrate during the flux cleaning process. On the other hand, if the diameter of the support rod (120) is excessively large, the space between the bottom surface of the substrate and the support rod is reduced, so the flow of cleaning water and air during the water rinse and air blow processes is not smooth, and there is a risk of water droplet stains occurring due to residual moisture.

[0029] Accordingly, in the present invention, by setting the diameter of the support rod (120) to be 10 times or more and 20 times or less the thickness of the ultra-thin substrate (20), sufficient contact area with the substrate is secured to ensure support stability, and at the same time, a space is secured through which cleaning water and air can flow smoothly along the lower surface of the substrate.

[0030] In addition, according to the concept of the present invention, the spacing (P1) between the support rods (120) may be 100 times or more and 200 times or less the thickness of the ultra-thin substrate (20). For example, when the thickness of the ultra-thin substrate (20) is 0.1 mm, the spacing (P1) between the support rods (120) may be 10 to 20 mm. This spacing range is set to suppress sagging caused by the low bending rigidity of the ultra-thin substrate (20), while allowing cleaning water and air to flow smoothly along the bottom surface of the substrate during the water rinse, air blow, and hot air drying processes in the flux cleaning process. That is, if the spacing (P1) between the support rods is larger than the above range, the support stability of the substrate may be reduced and the flatness may increase, and conversely, if it is smaller than the above range, the drainage and drying performance may be reduced and a problem of moisture retention may occur.

[0031] Accordingly, by setting the spacing (P1) between the support rods (120) to be 100 times or more and 200 times or less the thickness of the ultra-thin substrate (20), the effects of maintaining the flatness of the ultra-thin substrate (20) and suppressing water droplet stains after the flux cleaning process can be achieved simultaneously.

[0032] Additionally, the gap (P2) between the support rod (120) positioned at the outermost side in the second direction (D2) and the inner wall of the support frame (110) facing it can be set to be at least 0.3 times and no more than 1.0 times the spacing (P1) between the support rods (120). Accordingly, sufficient support can be provided even in the edge region of the ultra-thin substrate (20), and drainage and drying performance can be secured.

[0033] The upper jig (200) serves to fix the ultra-thin substrate (20) placed on the lower jig (100) from above. The upper jig (200) is configured to stably maintain the position of the ultra-thin substrate (20) and can be implemented to prevent the substrate (20) from detaching or lifting during the cleaning process. The upper jig (200) is formed to be coupled with the lower jig (100) and can be coupled using bolts, pins, clamps, or magnetic structures as needed. Since the upper jig (200) can be a known one, a detailed description thereof is omitted.

[0034] Since the jig (10) for the flux cleaning device according to the present invention is repeatedly exposed to cleaning water, air, and hot air during the flux cleaning process, it is preferable that it be formed of a material having water resistance, chemical resistance, and heat resistance.

[0035] Since the lower jig (100) includes a component that directly supports the ultra-thin substrate (20) from below, it can be formed from a material having sufficient rigidity and dimensional stability, for example, stainless steel, aluminum alloy, or a metal material equivalent thereto. In particular, it is preferable that the plurality of support rods (120) included in the lower jig (100) be formed in the shape of metal rods so as to stably support the ultra-thin substrate (20).

[0036] The upper jig (200) serves to fix the ultra-thin substrate (20) placed on the lower jig (100) from above and is configured to prevent movement or lifting of the substrate during the flux cleaning process. The upper jig (200) may be formed of a metal material or a high-strength engineering plastic material having water resistance and heat resistance, for example, stainless steel, aluminum alloy, or a material equivalent thereto may be used.

[0037] The materials of the lower jig (100) and the upper jig (200) may be the same or different from each other, and the present invention is not limited to the materials exemplified above.

[0038] Hereinafter, focusing on the flux cleaning process illustrated in FIGS. 5 to 9, the structural features of the jig according to the present invention will be explained in detail as to what effects they exert at each process step.

[0039] FIGS. 5 to 9 are stepwise drawings illustrating an example of a flux cleaning process performed by introducing a jig for a flux cleaning device according to embodiments of the present invention into a flux cleaning device.

[0040] The flux cleaning process used in the present invention is a process performed to remove flux remaining on an ultra-thin substrate (20) after a chip mounting process such as a flip-chip process, and may include, as shown in FIGS. 5 to 9, a jig (10) being introduced into a flux cleaning device and then performing a stepwise water rinsing, air blowing, and hot air drying process.

[0041] First, referring to FIG. 5, an ultra-thin substrate (20) is placed within the opening (105) of a lower jig (100) and is inserted into a flux cleaning device while being fixed from above by an upper jig (200). At this time, the ultra-thin substrate (20) is maintained in a state of being supported from below by a plurality of support rods (120) provided in the lower jig (100).

[0042] Since the spacing (P1) of the support rods (120) according to the present invention is set in conjunction with the thickness of the ultra-thin substrate (20), it is possible to effectively suppress vibrations that may occur during the process of the jig (10) being inserted into the device or initial sagging caused by the weight of the substrate itself.

[0043] Referring to FIG. 6, when the jig (10) is transferred into the device, a water rinsing process is performed. In the water rinsing process, cleaning water is sprayed downward toward the ultra-thin substrate (20), and in one embodiment, the spray pressure of the cleaning water can be set to a high pressure in the range of about 3 kg / cm² to 10 kg / cm².

[0044] Through this water rinsing process, flux and contaminants remaining on the upper surface of the ultra-thin substrate (20) can be effectively removed. During this process, the cleaning water sprayed comes into direct contact with the upper surface of the substrate, and instantaneous loads can be repeatedly applied to the ultra-thin substrate (20).

[0045] In the jig (10) according to the present invention, support rods (120) are extended in a first direction (D1) and spaced apart at a certain distance in a second direction (D2), so that the load generated by the cleaning water sprayed toward the substrate during the water rinsing process is distributed and supported by the support rods (120) throughout the substrate. Accordingly, local bending or central sagging of the substrate is suppressed, and a stable support state of the substrate is maintained even during the cleaning process.

[0046] Referring to FIG. 7, after the water rinsing process, an air blow process is performed to remove residual moisture on the surface (e.g., upper and lower surfaces) of the ultra-thin substrate (20). In the air blow process, air is blown downward, and in one embodiment, the air blowing pressure can be set to about 0.1 kg / cm².

[0047] The spacing (P1) of the support rods (120) according to the present invention and the spacing (P2) between the outermost support rod (120) and the inner wall of the support frame (110) are designed so that air can flow smoothly between the support rods (120) and along the lower surface of the ultra-thin substrate (20) during the air blow process, thereby ensuring that moisture is effectively discharged without remaining on the lower surface of the ultra-thin substrate (20).

[0048] Referring to Fig. 8, a hot air drying process is performed to remove trace amounts of moisture that may remain even after the air blow process.

[0049] In the hot air drying process, the jig (10) passes through a section where hot air is supplied, and in one embodiment, the temperature of the hot air can be set to approximately 110°C. During this process, the ultra-thin substrate (20) is maintained in a state supported by a plurality of support rods (120) of the lower jig (100), so deformation or sagging caused by the hot air is suppressed. In addition, as the hot air reaches the bottom surface of the substrate through the space between the support rods, moisture on the bottom surface of the substrate is also effectively evaporated.

[0050] Referring to FIG. 9, the jig (10) that has completed the hot air drying process is discharged outside the device.

[0051] The ultra-thin substrate (20) after the cleaning process is completed may have a state in which no water droplet stains are observed on the surface of the substrate and the flatness measured on a reference plane is maintained at a predetermined multiple of the substrate thickness or less.

[0052] In this specification, “flatness” may be defined as the maximum separation distance between the reference plane and the ultra-thin substrate (20) when the ultra-thin substrate (20) is placed in a free state on a reference plane. The reference plane may be a glass substrate, a surface plate, or a flat plane equivalent thereto, and the flatness may be measured by visual observation or by using an optical or contact measuring device.

[0053] When a flux cleaning process is performed using a jig (10) for a flux cleaning device according to embodiments of the present invention, the flatness of the ultra-thin substrate (20) is maintained at 10 times or less the thickness of the substrate, and preferably at 5 times or less.

[0054] As described above, the jig (10) for a flux cleaning device according to the present invention is designed with the diameter, spacing, and arrangement structure of the support rods to respond to external forces and fluid flow occurring in each process step, from the jig insertion step to the water rinsing, air blow, and hot air drying process.

[0055] Accordingly, sagging of the ultra-thin substrate (20) during the water rinsing process is suppressed, moisture residue on the upper surface of the substrate is prevented during the air blow and hot air drying process, and after the cleaning process is completed, the ultra-thin substrate (20) can maintain excellent flatness and provide the effect of not causing water droplet stains.

[0056] In the following, experimental examples are presented for cases where the spacing between support rods is varied in order to explain how the flatness of the ultra-thin substrate (20) and the effect of suppressing water droplet stains are manifested by the structural features of the jig (10) for the flux cleaning device according to the present invention.

[0057] The following experimental examples are intended to aid in understanding the present invention and do not limit the scope of the present invention.

[0058] [Experimental Example 1] Measurement of flatness according to support rod spacing

[0059] (1) Experimental conditions In this experiment, the flatness of an ultra-thin substrate according to the spacing of the support rods was measured using a jig for a flux cleaning device according to the present invention.

[0060] - Thickness of ultra-thin substrate (t): 0.1 mm

[0061] - Diameter of support rod (d): 1.5 mm

[0062] - Support rod material: Stainless steel

[0063] - Support rod spacing (P1): 35 mm, 30 mm, 25 mm, 20 mm, 15 mm, 10 mm, 5 mm

[0064] - Flux cleaning process conditions:

[0065] ① Rinse: 3~10 kg / cm² downward spray

[0066] ② Air Blow: 0.1 kg / cm² downward injection

[0067] ③ Hot air drying: Approx. 110°C

[0068] After the flux cleaning process was completed, the ultrathin substrate was placed in a free state on the glass substrate, and the flatness was evaluated by measuring the maximum separation distance between the glass substrate and the ultrathin substrate.

[0070] (2) Flatness measurement results

[0071] Support rod spacing (mm) Measured flatness (mm) Multiple relative to substrate thickness (t) 35 mm Approximately 1.72 mm Approximately 17.2 tons 30 mm Approximately 1.68 mm Approximately 16.8 tons 25 mm Approximately 1.56 mm Approximately 15.6 tons 20 mm Approx. 0.93 mm Approx. 9.3 tons 15 mm Approximately 0.85 mm Approximately 8.5 tons 10 mm Approximately 0.67 mm Approximately 6.7 tons 5 mm Approx. 0.54 mm Approx. 5.4 tons

[0072] (3) Result Analysis

[0073] As confirmed in the table above, when the spacing between support rods is 20 mm or less, the flatness of the ultra-thin substrate is maintained at 10 times or less the substrate thickness (≤ 10t).

[0074] On the other hand, when the spacing between support rods was 25 mm or more, the flatness exceeded 10 times the substrate thickness, and the sagging of the substrate tended to increase significantly.

[0075] From this, it can be confirmed that the spacing of the support rods critically affects the maintenance of flatness of the ultra-thin substrate, and that the flatness suppression effect is particularly significant at a spacing of 20 mm or less.

[0077] [Experimental Example 2] Visual verification of water droplet stains according to support rod spacing

[0078] (1) Experimental conditions

[0079] After performing a flux cleaning process under the same conditions as Experimental Example 1, the surface (upper and lower surfaces) of the ultrathin substrate was visually observed to check for the occurrence of water marks due to residual moisture.

[0081] (2) Results of observing water droplet stains

[0082] Support rod spacing (mm) Whether water droplet stains occur 35 mm Non-occurrence 30 mm Non-occurrence 25 mm Non-occurrence 20 mm Non-occurrence 15 mm Non-occurrence 10 mm Non-occurrence 5 mm generation

[0084] (3) Result Analysis

[0085] When the spacing between support rods was 10 mm or more, cleaning water and air were smoothly discharged along the bottom surface of the substrate, and no water droplet stains were observed.

[0086] On the other hand, when the spacing between the support rods was 5 mm, the space between the support rods became excessively narrow, preventing the smooth discharge of moisture from the bottom surface of the substrate, and water droplet stains were observed in some areas.

[0087] From this, it can be confirmed that if the spacing between support rods is excessively small, drainage and drying performance may be reduced, and that there exists a range of support rod spacing that simultaneously satisfies support stability and drainage performance.

[0088] This specification discloses preferred embodiments of the present invention. Although specific terms have been used, they are used merely in a general sense to facilitate the explanation of the technical content of the invention and to aid in understanding the invention, and are not intended to limit the scope of the invention. It is obvious to those skilled in the art that, in addition to the embodiments disclosed herein, other variations based on the technical concept of the present invention are possible. Explanation of the symbols

[0089] 10: Jig for flux cleaning device 20: Ultra-thin substrate 100: Lower jig 110: Support frame 120: Support rod 200: Upper jig

Claims

Claim 1 A jig used to support and fix an ultra-thin substrate in a flux cleaning device for a semiconductor packaging process comprises: a lower jig having an opening into which the ultra-thin substrate is disposed; and an upper jig for fixing the ultra-thin substrate disposed on the lower jig from above, wherein the lower jig comprises: a support frame defining the opening having a width in a first direction and a length in a second direction orthogonal to the first direction; and includes a plurality of support rods that extend in the first direction and are fixed on mutually opposing inner walls of the opening, and are spaced apart from each other in the second direction to contact the lower surface of the ultra-thin substrate when the ultra-thin substrate is received within the opening and support the ultra-thin substrate from below, wherein cleaning water and air sprayed onto the ultra-thin substrate received in the opening during the flux cleaning process pass along the lower surface of the ultra-thin substrate through the space between the support rods, and when the ultra-thin substrate is placed in a free state on a reference plane after the flux cleaning process, the flatness defined as the maximum separation distance between the reference plane and the ultra-thin substrate is 10 times or less the thickness of the ultra-thin substrate, the diameter of the plurality of support rods is 10 times or more and 20 times or less the thickness of the ultra-thin substrate, the spacing between the plurality of support rods is 100 times or more and 200 times or less the thickness of the ultra-thin substrate, and on the outermost side in the second direction A jig for a flux cleaning device, characterized in that the gap between the arranged support rod and the inner wall of the support frame facing the outermost support rod is set to be 0.3 times or more and 1.0 times or less the spacing between the plurality of support rods. Claim 2 delete Claim 3 delete Claim 4 A jig for a flux cleaning device according to claim 1, characterized in that the thickness of the ultra-thin substrate is 0.08 to 0.12 mm, the spacing between the plurality of support rods is 10 to 20 mm, the diameter of the plurality of support rods is 1.4 to 1.6 mm, and the ratio of the length to the width of the opening is 3.4 or more and 3.8 or less.

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