Display device

Abstract

A display device according to one embodiment of the present invention comprises a substrate including a display area and a non-display area adjacent to the display area, a first flattening layer having at least a portion disposed in the display area, a second flattening layer disposed in the non-display area and spaced apart from the first flattening layer, a contact portion disposed between the first flattening layer and the second flattening layer in the non-display area, and a cathode extending from the display area to the non-display area and electrically connected to the contact portion. Accordingly, by spaced apart the first flattening layer and the second flattening layer, the path for moisture to pass through the second flattening layer into the display area can be blocked.

Description

Technology Field

[0001] The present invention relates to a display device, and more specifically, to a display device that improves the degradation of an organic light-emitting diode by minimizing moisture penetrating through a planarization layer and a bank. Background Technology

[0002] Display devices used in computer monitors, TVs, mobile phones, etc., include Organic Light Emitting Displays (OLEDs) that emit light on their own, and Liquid Crystal Displays (LCDs) that require a separate light source.

[0003] The application range of display devices is expanding to include not only computer monitors and TVs but also personal portable devices, and research is underway on display devices that have a large display area while possessing reduced volume and weight.

[0004] In addition, recently, flexible display devices are attracting attention as next-generation display devices, which are manufactured by forming display elements and wiring on a flexible substrate such as plastic, a flexible material, so that images can be displayed even when bent like paper or rolled up. The problem to be solved

[0005] The problem that the present invention aims to solve is to provide a display device that minimizes moisture penetration into the interior.

[0006] Another problem that the present invention aims to solve is to provide a display device that improves the degradation of an organic light-emitting diode caused by moisture.

[0007] Another problem that the present invention aims to solve is to provide a display device that improves the contact resistance between a contact part supplying a low-potential power supply voltage to the cathode and the cathode.

[0008] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0009] To solve the problem described above, a display device according to one embodiment of the present invention comprises a substrate including a display area and a non-display area adjacent to the display area, a first flattening layer having at least a portion disposed in the display area, a second flattening layer disposed in the non-display area and spaced apart from the first flattening layer, a contact portion disposed between the first flattening layer and the second flattening layer in the non-display area, and a cathode extending from the display area to the non-display area and electrically connected to the contact portion. Accordingly, by spaced apart the first flattening layer and the second flattening layer, the path for moisture to pass through the second flattening layer into the display area can be blocked.

[0010] To solve the problem described above, a display device according to another embodiment of the present invention comprises: a substrate including a display area and a plurality of routing areas extending from the display area and a plurality of contact areas disposed between the plurality of routing areas; a plurality of flexible films electrically connected to each of the plurality of routing areas at one end of the substrate; a first planarization layer disposed in a portion of a plurality of routing areas adjacent to the display area and a portion of a plurality of contact areas adjacent to the plurality of routing areas; a second planarization layer disposed in the plurality of contact areas and spaced apart from the first planarization layer; a cathode disposed in a portion of a plurality of routing areas adjacent to the display area and a portion of a plurality of contact areas adjacent to the display area; and a contact portion disposed in each of the plurality of contact areas and electrically connected to the cathode. The plurality of routing areas are arranged radially around the plurality of flexible films, and the plurality of contact areas are arranged radially around the display area. Accordingly, the reliability of the display device can be improved by minimizing moisture penetrating into the first planarization layer through the second planarization layer.

[0011] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0012] The present invention can minimize the degradation of an organic light-emitting device by moisture by changing the design of a planarization layer and a bank having moisture-absorbing properties.

[0013] The present invention can minimize the penetration of moisture into the display area through the flattening layer by separating the flattening layer of the display area from the flattening layer of the non-display area.

[0014] The present invention can improve the step coverage of the contact portion for supplying a low potential power supply voltage and lower the resistance of the cathode by placing a flattening layer and a bank in a non-display area.

[0015] The effects according to the present invention are not limited to those exemplified above, and a wider variety of effects are included within the present invention. Brief explanation of the drawing

[0016] FIG. 1 is a plan view of a display device according to one embodiment of the present invention. Figure 2 is a cross-sectional view according to II-II' of Figure 1. FIG. 3 is an enlarged plan view of a contact area of ​​a display device according to one embodiment of the present invention. FIGS. 4a to 4e are enlarged plan views of area A of FIG. 3. Figure 5 is a cross-sectional view along V-V' of Figure 3. Figure 6 is a cross-sectional view along VI-VI' of Figure 3. Specific details for implementing the invention

[0017] The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0018] Shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related prior art may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in the present invention, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0019] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0020] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0021] When an element or layer is referred to as "on" another element or layer, it includes cases where another layer or element is placed directly on top of or in between.

[0022] Additionally, terms such as first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.

[0023] Throughout the specification, the same reference numerals refer to the same components.

[0024] The area and thickness of each component shown in the drawings are illustrated for convenience of explanation, and the present invention is not necessarily limited to the area and thickness of the illustrated components.

[0025] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0026] Various embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0027] FIG. 1 is a plan view of a display device according to an embodiment of the present invention. For convenience of explanation, FIG. 1 shows only the substrate (110), a plurality of subpixels (SP), a plurality of link wirings (LL), a plurality of flexible films (140) and a printed circuit board (150) among the various components of the display device (100).

[0028] The substrate (110) is a support member for supporting other components of the display device (100) and may be made of an insulating material.

[0029] The substrate (110) is a supporting member for supporting other components of the display device (100) and may be made of an insulating material. For example, the substrate (110) may be made of glass or resin, etc. Additionally, the substrate (110) may be made of a plastic such as a polymer or polyimide (PI), etc., or may be made of a material having flexibility.

[0030] In the case of a display device (100) comprising a substrate (110) made of a flexible material, the display device (100) may be implemented as a foldable display device or a rollable display device manufactured to enable image display even when folded or rolled up. For example, if the display device (100) is a foldable display device, the display device (100) can fold or unfold the substrate (110) around a folding axis. In another example, if the display device (100) is a rollable display device, the display device (100) may include a back cover disposed on one side of the flexible substrate (110) and a roller on which the substrate (110) and the back cover are wound or unwound. And when the rollable display device is not in use, the substrate (110) and the back cover can be rolled up on the roller to reduce their volume for storage. Conversely, when using a rollable display device, the rolled-up rollable display device can be unfolded and used again. A display device (100) according to one embodiment of the present invention may be made of a flexible display device such as a foldable display device or a rollable display device, but is not limited thereto.

[0031] The substrate (110) includes a display area (AA) and a non-display area (NA).

[0032] The display area (AA) is an area for displaying an image. A plurality of subpixels (SP) for displaying an image and a circuit unit for driving the plurality of subpixels (SP) may be disposed in the display area (AA). The circuit unit may include various transistors, capacitors, and wiring, etc., for driving the plurality of subpixels (SP). For example, the circuit unit may be composed of various components such as a driving thin-film transistor, a switching thin-film transistor, a storage capacitor, gate wiring, and data wiring, but is not limited thereto.

[0033] The non-display area (NA) is an area where an image is not displayed, and it is an area where various wiring, driving ICs, etc. are placed to drive multiple subpixels (SP) placed in the display area (AA). For example, various driving ICs, such as gate driver ICs and data driver ICs, can be placed in the non-display area (NA).

[0034] Meanwhile, in FIG. 1, the non-display area (NA) is defined as surrounding the display area (AA), but the non-display area (NA) may be defined as an area extending from one side of the display area (AA), and is not limited thereto.

[0035] The non-display area (NA) includes a plurality of routing areas (RA) and a plurality of contact areas (CA).

[0036] A plurality of routing areas (RA) are areas extending from a display area (AA) toward a plurality of flexible films (140), and are areas where a plurality of link wires (LL) are arranged.

[0037] A plurality of link wires (LL) can transmit signals from a printed circuit board (150) and a plurality of flexible films (140) to a plurality of subpixels (SP). The link wires (LL) can each connect the driving ICs of the printed circuit board (150) and the plurality of flexible films (140) to a plurality of wires of a display area (AA). Accordingly, the link wires (LL) can transmit signals to a plurality of wires of the display area (AA).

[0038] A plurality of link wirings (LL) may be formed from a conductive material. For example, the plurality of link wirings (LL) may be formed from one of the various materials used in the manufacture of organic light-emitting diodes and transistors of a display area (AA), and may be composed of a single layer or multiple layers. For example, the link wirings (LL) may be formed from molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg).

[0039] Multiple link wires (LL) can be arranged radially around multiple flexible films (140). Multiple wires of the display area (AA) can be arranged at regular intervals throughout the entire display area (AA). In order to transmit signals from each of the multiple flexible films (140) to the multiple wires of the display area (AA), each of the multiple link wires (LL) can be arranged to correspond to the multiple wires. For example, a multiple link wire (LL) connected to the flexible film (140) positioned on the far left among the multiple flexible films (140) can be connected from the wire on the far left of the display area (AA) to the wire within the display area (AA). Accordingly, the multiple link wires (LL) can be arranged to extend radially from each of the multiple flexible films (140) toward the multiple wires of the display area (AA).

[0040] Additionally, a plurality of routing regions (RA) in which a plurality of link wirings (LL) are arranged may also be formed radially. Each of the plurality of routing regions (RA) may be arranged radially around a plurality of flexible films (140). For example, the plurality of routing regions (RA) may be triangular in shape, but are not limited thereto.

[0041] A plurality of contact areas (CA) are areas placed between a plurality of routing areas (RA), and are areas where a plurality of contact parts (160) are placed.

[0042] A plurality of contact portions are disposed in each of the plurality of contact regions (CA). The plurality of contact portions are disposed in the contact region (CA) between the plurality of routing regions (RA) and can supply a low potential power supply voltage (VSS) to the display region (AA). Each of the plurality of contact portions is electrically connected to a plurality of flexible films (140) and can receive a low potential power supply voltage from the plurality of flexible films (140). The plurality of contact portions will be described in more detail later with reference to FIG. 3 and FIG. 4a to 4e.

[0043] Multiple contact areas (CA) may be arranged radially around a display area (AA). Multiple contact areas (CA) surrounded by radially formed routing areas (RA) may also be formed radially. For example, multiple link wiring (LL) and multiple routing areas (RA) may be arranged radially around each of the multiple flexible films (140), so that the multiple routing areas (RA) may be formed in a triangular shape. And multiple contact areas (CA) surrounded by the multiple routing areas (RA) of the triangular shape may be formed in an inverted triangular shape. However, the shape of the multiple contact areas (CA) may vary depending on the arrangement of the multiple routing areas (RA) and the multiple link wiring (LL), and is not limited thereto.

[0044] A plurality of flexible films (140) are disposed on one end of a substrate (110). A plurality of flexible films (140) are connected to each of a plurality of routing areas (RA) at one end of the substrate (110). The plurality of flexible films (140) are films for supplying signals to a plurality of sub-pixels (SP) and a driving circuit of a display area (AA), with various components disposed on a flexible base film. A plurality of flexible films (140) has one end disposed in a routing area (RA) of a non-display area (NA) of the substrate (110) and can supply power voltage, data voltage, etc. to a plurality of sub-pixels (SP) and a driving circuit of the display area (AA) through a plurality of link wires (LL). Meanwhile, although the plurality of flexible films (140) are shown as four in FIG. 1, the number of the plurality of flexible films (140) can be varied according to the design and is not limited thereto.

[0045] Meanwhile, driving ICs such as gate driver ICs and data driver ICs may be placed on multiple flexible films (140). A driving IC is a component that processes data for displaying an image and a driving signal for processing it. Depending on the mounting method, the driving IC may be placed in a Chip On Glass (COG), Chip On Film (COF), Tape Carrier Package (TCP), etc. However, for the convenience of explanation, it has been described as a Chip On Film method in which the driving IC is mounted on multiple flexible films (140), but it is not limited thereto.

[0046] A printed circuit board (150) is connected to a plurality of flexible films (140). The printed circuit board (150) is a component that supplies signals to a driving IC. Various components for supplying various driving signals, such as driving signals and data signals, to the driving IC may be arranged on the printed circuit board (150). Meanwhile, although FIG. 1 is illustrated as having one printed circuit board (150), the number of printed circuit boards (150) can be varied according to the design and is not limited thereto.

[0047] A plurality of subpixels (SP) are arranged in a display area (AA) of a substrate (110). Each of the plurality of subpixels (SP) is an individual unit that emits light, and a light-emitting element and a driving circuit are formed in each of the plurality of subpixels (SP). For example, the plurality of subpixels (SP) may include a red subpixel, a green subpixel, and a blue subpixel, but is not limited thereto, and the plurality of subpixels (SP) may further include a white subpixel.

[0048] For a more detailed explanation of the multiple subpixels (SP) below, refer to FIG. 2.

[0049] FIG. 2 is a cross-sectional view according to II-II' of FIG. 1. Referring to FIG. 2, a display device (100) according to one embodiment of the present invention includes a substrate (110), a buffer layer (111), a gate insulating layer (GI), a transistor (120), a passivation layer (113), a first planarization layer (114a), an organic light-emitting element (130), and a first bank (115a).

[0050] A buffer layer (111) is disposed on a substrate (110). The buffer layer (111) can prevent moisture and / or oxygen that has penetrated from the outside of the substrate (110) from diffusing. The buffer layer (111) may be made of an inorganic material, and for example, the buffer layer (111) may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0051] A transistor (120) is disposed on a buffer layer (111). The transistor (120) may be disposed in each of a plurality of subpixels (SP) of a display area (AA). The transistor (120) disposed in each of a plurality of subpixels (SP) may be used as a driving element of a display device (100). The transistor (120) may be, for example, a thin film transistor (TFT), an N-channel metal oxide semiconductor (NMOS) transistor, a P-channel metal oxide semiconductor (PMOS) transistor, a complementary metal oxide semiconductor (CMOS) transistor, a field effect transistor (FET), etc., but is not limited thereto. In the following description, it is assumed that a plurality of transistors (120) are thin film transistors, but is not limited thereto.

[0052] The transistor (120) includes a gate electrode (122), an active layer (121), a source electrode (123), and a drain electrode (124).

[0053] An active layer (121) of a transistor (120) is disposed on a buffer layer (111). For example, the active layer (121) may be made of an oxide semiconductor, amorphous silicon, or polysilicon, but is not limited thereto.

[0055] A gate electrode (122) is disposed on the active layer (121). The gate electrode (122) may be composed of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof, but is not limited thereto.

[0056] A gate insulating layer (GI) is disposed between the gate electrode (122) and the active layer (121). The gate insulating layer (GI) is a layer for insulating the gate electrode (122) and the active layer (121). The gate insulating layer (GI) may be made of an inorganic material, and for example, the gate insulating layer (GI) may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0057] An interlayer insulating layer (112) is disposed on the gate electrode (122) and the active layer (121). The interlayer insulating layer (112) is a layer for insulating the gate electrode (122), the source electrode (123), and the drain electrode (124). The interlayer insulating layer (112) may be made of an inorganic material, and for example, the interlayer insulating layer (112) may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0058] A source electrode (123) and a drain electrode (124) are spaced apart from each other on an interlayer insulating layer (112). The source electrode (123) and the drain electrode (124) can be electrically connected to an active layer (121) through a contact hole formed in the interlayer insulating layer (112). The source electrode (123) and the drain electrode (124) may be composed of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof, but are not limited thereto.

[0059] A passivation layer (113) is disposed on the transistor (120). The passivation layer (113) is an insulating layer for protecting the configuration below the passivation layer (113). The passivation layer (113) may be made of an inorganic material, and for example, the passivation layer (113) may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Additionally, the passivation layer (113) may be omitted depending on the design.

[0060] A first flattening layer (114a) is disposed on the passivation layer (113). The first flattening layer (114a) can flatten the upper surface of the substrate (110) containing the transistor (120). The first flattening layer (114a) can be disposed over the entire display area (AA) and a part of the non-display area (NA). The first flattening layer (114a) may be made of an organic material, for example, the first flattening layer (114a) may be made of a single layer or a multilayer of an acrylic-based organic material, but is not limited thereto. The first flattening layer (114a) disposed over a part of the non-display area (NA) will be described in detail later with reference to FIG. 3.

[0061] A light-emitting element is disposed on the first flattening layer (114a) in the display area (AA). The organic light-emitting element (130) is a self-emissive element that emits light and can be disposed in each of a plurality of subpixels (SP) and driven by a plurality of transistors (120). The organic light-emitting element (130) may include an anode (131), an organic light-emitting layer (132), and a cathode (133).

[0062] Meanwhile, depending on the direction in which light emitted from the organic light-emitting element (130) is emitted, the display device (100) may be configured in a top emission or bottom emission manner.

[0063] The top emission method is a method in which light emitted from an organic light-emitting element (130) is emitted to the upper part of a substrate (110) on which the organic light-emitting element (130) is formed. In the case of the top emission method, a reflective layer may be formed on the lower part of the anode (131) to allow the light emitted from the organic light-emitting element (130) to proceed to the upper part of the substrate (110), that is, toward the cathode (133).

[0064] The bottom emission method is a method in which light emitted from an organic light-emitting element (130) is emitted to the bottom of a substrate (110) on which the organic light-emitting element (130) is formed. In the case of the bottom emission method, in order to propel the light emitted from the organic light-emitting element (130) to the bottom of the substrate (110), the anode (131) may be made only of a transparent conductive material, and the cathode (133) may be made of a metal material with high reflectivity.

[0065] For convenience of explanation, the following description assumes that the display device (100) according to one embodiment of the present invention is a bottom emission type display device (100), but is not limited thereto.

[0066] The anode (131) can supply holes to the organic light-emitting layer (132) and can be made of a conductive material with a high work function. For example, the anode (131) can be made of tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), etc., but is not limited thereto.

[0067] A first bank (115a) is placed on an anode (131). The first bank (115a) is placed to overlap the display area (AA) and to cover the edge of the anode (131). The first bank (115a) is placed at the boundary between adjacent subpixels (SP) to reduce the mixing of light emitted from each organic light-emitting element (130) of a plurality of subpixels (SP). The first bank (115a) may be made of an insulating material, for example, the first bank (115a) may be made of polyimide, acryl, or benzocyclobutene (BCB)-based resin, but is not limited thereto.

[0068] An organic light-emitting layer (132) is disposed on an anode (131) exposed from the first bank (115a). The organic light-emitting layer (132) can emit light by receiving holes from the anode (131) and electrons from the cathode (133). The organic light-emitting layer (132) may be composed of a red organic light-emitting layer (132), a green organic light-emitting layer (132), a blue organic light-emitting layer (132), and a white organic light-emitting layer (132), depending on the color of the light emitted from the organic light-emitting layer (132). In this case, if the organic light-emitting layer (132) is a white organic light-emitting layer (132), a color filter of various colors may be additionally disposed.

[0069] A cathode (133) is disposed on the organic light-emitting layer (132) and the first bank (115a). The cathode (133) may be disposed on at least the front of the display area (AA). The cathode (133) may be made of a conductive material with a low work function that can supply electrons to the organic light-emitting layer (132). For example, the cathode (133) may be made of one or more selected from the group consisting of metals such as magnesium (Mg), silver (Ag), aluminum (Al), etc., and alloys thereof, but is not limited thereto. Additionally, since the display device (100) is a bottom emission type, the cathode (133) may reflect light emitted from the organic light-emitting layer (132) toward the substrate (110).

[0070] Meanwhile, the cathode (133) may be positioned not only in the display area (AA) but also in part of the non-display area (NA) and may be electrically connected to a plurality of contact parts and may receive a low-potential power supply voltage from the plurality of contact parts.

[0071] Hereinafter, a plurality of contact parts will be described in detail with reference to FIG. 3 and FIG. 4a to 4e.

[0072] FIG. 3 is an enlarged plan view of a contact area of ​​a display device according to an embodiment of the present invention. FIG. 4a to 4e are enlarged plan views of area A of FIG. 3. FIG. 4a to 4e are schematic plan views for explaining a contact portion (160) of a display device (100) according to an embodiment of the present invention. FIG. 4a is a schematic plan view for explaining a metal layer (161) and a contact hole (CH) of a contact portion (160). FIG. 4b is a schematic plan view for explaining a first flattening layer (114a) and a second flattening layer (114b). FIG. 4c is a schematic plan view for explaining a transparent conductive layer (162) of a contact portion (160). FIG. 4d is a schematic plan view for explaining a second bank (115b). FIG. 4e is a schematic plan view for explaining a cathode (133).

[0073] Referring to FIG. 3, each of the plurality of contact portions (160) includes one or more metal layers (161) and a transparent conductive layer (162).

[0074] Referring to FIG. 3 and FIG. 4a together, one or more metal layers (161) are disposed on a substrate (110). The metal layer (161) may be made of the same material as part of the driving element of the display area (AA). The metal layer (161) may be made of the same material as any one of the materials forming the transistor (120) which is the driving element of the display area (AA). For example, the metal layer (161) may include a first metal layer (161a) and a second metal layer (161b) disposed on the first metal layer (161a). The first metal layer (161a) may be made of the same material as the gate electrode (122) of the transistor (120), and the second metal layer (161b) may be made of the same material as the source electrode (123) and drain electrode (124) of the transistor (120). However, one or more metal layers (161) of the contact portion (160) may be made of the same material as any one of the materials forming a plurality of wirings, storage capacitors, etc. placed in the display area (AA) in addition to the transistor (120), but are not limited thereto.

[0075] Meanwhile, the metal layer (161) may be extended toward a plurality of flexible films (140) and electrically connected to the plurality of flexible films (140). For example, the first metal layer (161a) among the metal layers (161) may be extended toward a plurality of flexible films (140) and may receive a low potential power supply voltage from the plurality of flexible films (140).

[0076] At this time, the metal layer (161) is made of the same material as the gate electrode (122), source electrode (123), and drain electrode (124), which are made of copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof, as described above. Since copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof have low resistivity, signal delay can be reduced. Accordingly, the metal layer (161) made of a material having low resistivity is electrically connected to a plurality of flexible films (140) to receive a low potential power supply voltage, so the transmission delay of the low potential power supply voltage is minimized, and the low potential power supply voltage can be easily supplied to the display area (AA).

[0077] Meanwhile, one or more insulating layers may be disposed on the metal layer (161). In order to electrically connect the metal layer (161) and the transparent conductive layer (162) to be described later, a contact hole (CH) that exposes the metal layer (161) may be formed in one or more insulating layers. For example, a passivation layer (113) disposed between the metal layer (161) and the transparent conductive layer (162) extending from a display area (AA) to a non-display area (NA) may be disposed, and a contact hole (CH) that exposes the metal layer (161) may be formed in the passivation layer (113). The passivation layer (113) and the contact hole (CH) will be described in detail later with reference to FIG. 5.

[0078] Additionally, although not illustrated in FIG. 3 for convenience of explanation, an insulating layer with a contact hole formed between each of the metal layers (161) may be further disposed. For example, an interlayer insulating layer (112) may be disposed between the first metal layer (161a) and the second metal layer (161b), and a contact hole exposing the first metal layer (161a) may be formed in the interlayer insulating layer (112) to electrically connect the first metal layer (161a) and the second metal layer (161b). However, although FIG. 3 and FIG. 4a describe the metal layer (161) as being composed of the first metal layer (161a) and the second metal layer (161b), the metal layer (161) may be composed of a single layer, and if the metal layer (161) is composed of a single layer, the interlayer insulating layer (112), etc. may not be disposed, and is not limited thereto.

[0079] Next, referring to FIG. 3 and FIG. 4b together, a first flattening layer (114a) and a second flattening layer (114b) are disposed on a metal layer (161).

[0080] The first flattening layer (114a) is positioned from the display area (AA) to a portion of the non-display area (NA). The first flattening layer (114a) is positioned in the display area (AA), a portion of a plurality of routing areas (RA) adjacent to the display area (AA), and a portion of a plurality of contact areas (CA) adjacent to the plurality of routing areas (RA). Specifically, the edge of the first flattening layer (114a) extending into a portion of a plurality of routing areas (RA) adjacent to the display area (AA) can be positioned parallel to the edge of the display area (AA) adjacent to the plurality of routing areas (RA). And since the first flattening layer (114a) is positioned in a portion of a contact area (CA) adjacent to the plurality of routing areas (RA), the edge of the first flattening layer (114a) in the plurality of contact areas (CA) can be positioned along the edge of the plurality of routing areas (RA). For example, the edge of the first flattening layer (114a) may be formed in a concave shape such as a V-shape in the portion corresponding to the plurality of contact areas (CA), and may be positioned horizontally with respect to the edge of the display area (AA) adjacent to the plurality of routing areas (RA) in the portion corresponding to the plurality of routing areas (RA).

[0081] A second flattening layer (114b) is disposed in a plurality of contact regions (CA). The second flattening layer (114b) may be disposed parallel to the edges of a display region (AA) adjacent to a plurality of routing regions (RA) and a plurality of contact regions (CA). The second flattening layer (114b) may be formed using the same material and the same process as the first flattening layer (114a). At this time, the second flattening layer (114b) may be formed spaced apart from the contact hole (CH) that exposes the metal layer (161) in the plurality of contact regions (CA) for electrical connection between the metal layer (161) and the transparent conductive layer (162) to be described later. That is, the second flattening layer (114b) may not be disposed to fill the contact hole (CH).

[0082] The second flattening layer (114b) may be spaced apart from the first flattening layer (114a). The second flattening layer (114b) may have an island shape spaced apart from the first flattening layer (114a). Since the second flattening layer (114b) and the first flattening layer (114a) are spaced apart, even if moisture penetrates the second flattening layer (114b), it may not affect the first flattening layer (114a), and moisture penetration into the organic light-emitting element (130) of the display area (AA) can be minimized. Specifically, the first flattening layer (114a) and the second flattening layer (114b) have the characteristic of absorbing moisture. In addition, if the organic light-emitting element (130) placed in the display area (AA) comes into contact with external moisture or oxygen, the organic light-emitting element (130) may deteriorate, leading to a defect in the display device (100). Accordingly, a second flattening layer (114b) having a moisture-absorbing characteristic and placed adjacent to the outermost side of the display device (100) is separated from the first flattening layer (114a) placed up to the display area (AA), thereby blocking the moisture penetration path to the first flattening layer (114a) through the second flattening layer (114b) and improving the reliability of the organic light-emitting element (130).

[0083] Referring to FIG. 3 and FIG. 4c together, a transparent conductive layer (162) of the contact portion (160) in the contact area (CA) is disposed on a metal layer (161). The transparent conductive layer (162) is disposed on a first flattening layer (114a) and a second flattening layer (114b) and can be electrically connected to the metal layer (161) through a contact hole (CH). The transparent conductive layer (162) may be made of the same material as a part of the organic light-emitting element (130) in the display area (AA). For example, the transparent conductive layer (162) may be made of the same material as the anode (131) of the organic light-emitting element (130), which is made of a transparent conductive material.

[0084] A transparent conductive layer (162) may be positioned to cover the edge of a first flattening layer (114a) placed in a contact area (CA). The edge of the transparent conductive layer (162) adjacent to the first flattening layer (114a) may be positioned on the upper surface of the first flattening layer (114a). The edge of the transparent conductive layer (162) placed in a portion of the contact area (CA) where the first flattening layer (114a) is not positioned may be positioned on one or more insulating layers.

[0085] The transparent conductive layer (162) may be positioned to cover the entire second flattening layer (114b) placed in the contact area (CA). The transparent conductive layer (162) may be in contact with the upper and side surfaces of the second flattening layer (114b), and the edges of the transparent conductive layer (162) may be positioned spaced apart from the second flattening layer (114b).

[0086] Meanwhile, as the edge of the transparent conductive layer (162) is spaced apart from the second flattening layer (114b), the breakage of the cathode (133) or the increase in resistance of the cathode (133) near the edge of the transparent conductive layer (162) can be minimized. This will be described in detail later with reference to FIG. 5.

[0087] Referring to FIG. 3 and FIG. 4d together, a second bank (115b) is disposed on the transparent conductive layer (162) in the contact area (CA). The second bank (115b) may be formed with the same material and the same process as the first bank (115a) in the display area (AA). The second bank (115b) may be disposed to cover the edge of the transparent conductive layer (162) that covers the edge of the first flattening layer (114a) disposed in the contact area (CA). The second bank (115b) may be disposed to cover the edge of the transparent conductive layer (162) that is disposed on the upper surface of the first flattening layer (114a).

[0088] Meanwhile, the edge of the transparent conductive layer (162) may be bent with respect to the second bank (115b). Specifically, among the edges of the transparent conductive layer (162) adjacent to the routing area (RA), some edges positioned outside the second bank (115b) may protrude to be closer to the routing area (RA) than other edges that overlap the second bank (115b). However, the edge of the transparent conductive layer (162) may be straight, and the shape of the transparent conductive layer (162) is not limited thereto.

[0089] Referring to FIG. 4e, a cathode (133) is disposed on a transparent conductive layer (162) and a second bank (115b). The cathode (133) may be disposed extending from a display area (AA) toward a non-display area (NA), and the cathode (133) may be disposed in a display area (AA), a portion of a plurality of routing areas (RA) adjacent to the display area (AA), and a portion of a plurality of contact areas (CA) adjacent to the display area (AA). The cathode (133) disposed in the plurality of contact areas (CA) may be disposed to cover the transparent conductive layer (162) and may be electrically connected to the transparent conductive layer (162). The cathode (133) may be electrically connected to the metal layer (161) by contacting the transparent conductive layer (162) which is electrically connected to the metal layer (161). Accordingly, the cathode (133) is electrically connected to a plurality of flexible films (140) and can receive a low potential power supply voltage through a metal layer (161) to which a low potential power supply voltage is supplied, and a transparent conductive layer (162) that contacts the metal layer (161) through a contact hole (CH).

[0090] Below, the plurality of contact parts (160) will be described in more detail with reference to FIGS. 5 and FIGS. 6.

[0091] FIG. 5 is a cross-sectional view along V-V' of FIG. 3. FIG. 6 is a cross-sectional view along VI-VI' of FIG. 3.

[0092] Referring to FIGS. 5 and 6, a buffer layer (111), a first metal layer (161a), an interlayer insulating layer (112), a second metal layer (161b), and a passivation layer (113) are sequentially arranged on a substrate (110).

[0093] As described above, the first metal layer (161a) and the second metal layer (161b) can be formed with the same material and the same process as the gate electrode (122), source electrode (123), and drain electrode (124) of the transistor (120) in the display area (AA). The interlayer insulating layer (112) and the passivation layer (113) can be arranged to extend from the display area (AA) to the non-display area (NA).

[0094] Referring to FIGS. 5 and 6, a contact hole (CH) is formed in the passivation layer (113) to expose a metal layer (161). A contact hole (CH) is formed in the passivation layer (113) to correspond to the edge of the first flattening layer (114a) and the edge of the second flattening layer (114b). Specifically, a contact hole (CH) in the passivation layer (113) is formed to correspond to the edge of the first flattening layer (114a) facing the second flattening layer (114b) and the edge of the second flattening layer (114b) facing the first flattening layer (114a). The contact hole (CH) in the passivation layer (113) can expose a second metal layer (161b) between the first flattening layer (114a) and the second flattening layer (114b).

[0095] A contact hole (CH) is also formed in the interlayer insulation layer (112) in an area adjacent to the edge of the first flattening layer (114a) and the edge of the second flattening layer (114b). Specifically, a contact hole (CH) can be formed between the first flattening layer (114a) and the second flattening layer (114b) to expose the first metal layer (161a) to the interlayer insulation layer (112). Then, the first metal layer (161a) and the second metal layer (161b) can be electrically connected by coming into contact with each other through the contact hole (CH) formed in the interlayer insulation layer (112) and the passivation layer (113).

[0096] Meanwhile, the edge of the transparent conductive layer (162) is disposed on the upper surface of the first flattening layer (114a). The edge of the transparent conductive layer (162) on the upper surface of the first flattening layer (114a) may be formed in an inverse taper shape. Specifically, the transparent conductive layer (162) may be formed by etching a material that forms the transparent conductive layer (162) on the first flattening layer (114a) and the second flattening layer (114b). When etching the material that forms the transparent conductive layer (162) using an etchant, the first flattening layer (114a), which is made of an organic material, has high hygroscopicity of the etchant, so more etching may occur on the lower surface of the transparent conductive layer (162) that is in contact with the first flattening layer (114a). Accordingly, when the edge of the transparent conductive layer (162) is placed on the first flattening layer (114a), over-etching occurs on the lower surface of the transparent conductive layer (162) in contact with the first flattening layer (114a), so that the edge of the transparent conductive layer (162) can be formed in an inverse taper shape.

[0097] A bank is arranged to cover the edge of the inverted tapered transparent conductive layer (162) on the first flattening layer (114a). By arranging the bank to cover the edge of the inverted tapered transparent conductive layer (162), the disconnection of the cathode (133) at the edge of the transparent conductive layer (162) can be minimized and the increase in resistance of the cathode (133) can be reduced. For example, if the cathode (133) is formed directly on the edge of the inverted tapered transparent conductive layer (162), the thickness of the cathode (133) at the edge of the transparent conductive layer (162) can be reduced. Accordingly, if the cathode (133) is formed directly on the edge of the inverted tapered transparent conductive layer (162), the resistance may increase or the cathode may be disconnected due to the reduction in the thickness of the cathode (133).

[0098] Accordingly, a bank can be formed on the edge of the inverted taper-shaped transparent conductive layer (162), and then a cathode (133) can be formed on the bank. The bank prevents the inverted taper-shaped transparent conductive layer (162) edge and the cathode (133) from coming into contact, thereby minimizing the reduction in thickness and increase in resistance of a portion of the cathode (133) adjacent to the edge of the transparent conductive layer (162).

[0099] A transparent conductive layer (162) is positioned to cover a second flattening layer (114b). The edge of the transparent conductive layer (162) is positioned spaced apart from the second flattening layer (114b). If the edge of the transparent conductive layer (162) is positioned on the second flattening layer (114b), the second flattening layer (114b), which is made of the same material as the first flattening layer (114a), has high hygroscopicity of the etchant, so over-etching is likely to occur on the lower surface of the transparent conductive layer (162) adjacent to the edge of the transparent conductive layer (162) positioned on the second flattening layer (114b). Accordingly, the edge of the transparent conductive layer (162) is spaced apart from the second flattening layer (114b), so that it may not be over-etched due to the hygroscopicity of the etchant of the second flattening layer (114b), and the edge of the transparent conductive layer (162) may be formed in a tapered shape.

[0100] Additionally, the second flattening layer (114b) can improve the step coverage of the transparent conductive layer (162) to lower the contact resistance between the cathode (133) and the transparent conductive layer (162). Specifically, the second flattening layer (114b) can be formed flat and smooth. And since the transparent conductive layer (162) covering the second flattening layer (114b) is also formed along the surface of the second flattening layer (114b), the transparent conductive layer (162) can have a flatter surface. Accordingly, the thickness of the cathode (133) formed on the flat surface of the second flattening layer (114b) and the transparent conductive layer (162) can also be more uniform. Accordingly, by placing a second flattening layer (114b), the step coverage of the transparent conductive layer (162) can be improved, and the cathode (133) formed on the transparent conductive layer (162) can also be formed with a uniform thickness, thereby lowering the contact resistance between the cathode (133) and the transparent conductive layer (162).

[0101] Referring to FIG. 6, the first flattening layer (114a) and the second flattening layer (114b) are spaced apart from each other in the contact area (CA), so there exists an area within the contact area (CA) where the first flattening layer (114a) and the second flattening layer (114b) are not placed. For example, the first flattening layer (114a) is placed in the lower part of the contact portion (160) of the contact area (CA), and the second flattening layer (114b) is placed in the upper part of the contact portion (160). Additionally, a separate flattening layer may not be placed in the middle part of the contact portion (160). The middle portion of the contact portion (160) where the first flattening layer (114a) and the second flattening layer (114b) are not placed may be a portion that blocks the moisture penetration path through the first flattening layer (114a) and the second flattening layer (114b). Accordingly, the first flattening layer (114a) and the second flattening layer (114b) are spaced apart with the middle portion of the contact portion (160) in between, so that even if moisture penetrates into the second flattening layer (114b), it may be difficult for moisture to be transferred from the second flattening layer (114b) to the first flattening layer (114a).

[0102] In the side portion of the contact portion (160) adjacent to the routing area (RA) in the middle portion of the contact portion (160), the edge of the transparent conductive layer (162) is placed on the passivation layer (113). In this case, depending on the circumstances, the edge of the transparent conductive layer (162) placed on the passivation layer (113) may be formed to be closer to an inverse taper shape rather than a taper shape. In this case, the thickness of the cathode (133) may be formed unevenly near the edge of the transparent conductive layer (162), and the resistance may increase. However, even if the resistance increases in the side portion of the contact portion (160), the resistance may decrease in the upper and lower portions of the contact portion (160), so the overall resistance of the contact portion (160) can be lowered. Specifically, even if the resistance of the cathode (133) increases in the side portion of the contact portion (160), the first flattening layer (114a) and bank are arranged in the lower portion of the contact portion (160) to minimize the increase in resistance of the cathode (133) caused by the edge of the transparent conductive layer (162) with an inverse taper shape, and the step coverage of the transparent conductive layer (162) is improved by the second flattening layer (114b) in the upper portion of the contact portion (160) so that the increase in resistance of the cathode (133) can be minimized, thereby reducing the overall contact resistance of the contact portion (160).

[0103] In a display device (100) according to one embodiment of the present invention, a first flattening layer (114a) and a second flattening layer (114b) are spaced apart to reduce the penetration of moisture into the display area (AA) through the second flattening layer (114b) and the first flattening layer (114a). The first flattening layer (114a), which is placed in a part of the display area (AA) and the non-display area (NA), is spaced apart from the second flattening layer (114b), which is placed in the contact area (CA). The first flattening layer (114a) and the second flattening layer (114b) have the characteristic of rapidly absorbing moisture. If the second flattening layer (114b) disposed adjacent to the outermost side of the display device (100) is formed integrally with the first flattening layer (114a), moisture that has penetrated into the second flattening layer (114b) can be easily transferred to the first flattening layer (114a). Accordingly, by separating the first flattening layer (114a) and the second flattening layer (114b), even if moisture penetrates into the second flattening layer (114b), the moisture cannot be transferred to the first flattening layer (114a). Therefore, the display device (100) according to one embodiment of the present invention can minimize the penetration of moisture into the display area (AA) by separating the second flattening layer (114b) from the first flattening layer (114a), and can minimize the degradation of the organic light-emitting element (130) caused by moisture.

[0104] Meanwhile, a display device (100) according to one embodiment of the present invention can easily form a contact hole (CH) in which both the second flattening layer (114b) and the passivation layer (113) are removed by placing a second flattening layer (114b) in a non-display area (NA). Specifically, the second flattening layer (114b) and the passivation layer (113) can be formed using a single halftone mask. When using a halftone mask, the area can be divided into a full open area where both the second flattening layer (114b) and the passivation layer (113) are etched, a halftone area where only the second flattening layer (114b) is etched and only the passivation layer (113) remains, and a full tone area where both the second flattening layer (114b) and the passivation layer (113) remain. At this time, the passivation layer (113) may be etched to form a contact hole (CH) for contacting the metal layer (161) and the transparent conductive layer (162) in the contact portion (160). However, the passivation layer (113) in the contact hole (CH) may be etched together with the second planarization layer (114b), and the contact hole (CH) may become a full-open area where both the second planarization layer (114b) and the passivation layer (113) are etched. At this time, a full-tone area is required between the full-open area and the half-tone area to form the full-open area. If the half-tone area and the full-open area are formed without a full-tone area, a portion of the passivation layer (113) in the half-tone area may be torn off when the full-open area is formed. Accordingly, in a display device (100) according to one embodiment of the present invention, a full tone area in which the second flattening layer (114b) and the passivation layer (113) remain is arranged within a contact area (CA), thereby allowing the contact hole (CH) of the passivation layer (113) of the contact portion (160) to be easily formed. Thus, since the full tone area in which the second flattening layer (114b) and the passivation layer (113) remain is arranged within the contact area (CA), a contact hole (CH) for connecting the metal layer (161) and the transparent conductive layer (162) can be easily formed.

[0105] In addition, in a display device (100) according to one embodiment of the present invention, a second flattening layer (114b) can be arranged to improve the step coverage of the transparent conductive layer (162) and reduce the resistance of the cathode (133). The second flattening layer (114b) is formed to have a flat surface, and the transparent conductive layer (162) covering the second flattening layer (114b) can also be formed flat along the surface of the second flattening layer (114b). Accordingly, the transparent conductive layer (162) can have a smoother surface. Furthermore, the cathode (133) formed on the transparent conductive layer (162) can also be formed with a more uniform thickness, so that the increase in resistance due to the reduction in the thickness of the cathode (133) can be minimized. Accordingly, in a display device (100) according to one embodiment of the present invention, a second flattening layer (114b) is arranged to improve the step coverage of the transparent conductive layer (162) and minimize the change in thickness of the cathode (133), thereby reducing the contact resistance between the cathode (133) and the contact portion (160).

[0106] In a display device (100) according to one embodiment of the present invention, a transparent conductive layer (162) is formed to completely cover the second flattening layer (114b) so as to prevent over-etching near the edge of the transparent conductive layer (162), and the increase in resistance can be minimized by securing the thickness of the cathode (133) covering the edge of the transparent conductive layer (162). Since the edge of the transparent conductive layer (162) is spaced apart from the second flattening layer (114b), it can be close to a tapered shape. If the edge of the transparent conductive layer (162) is placed on the second flattening layer (114b), the lower surface near the edge of the transparent conductive layer (162) in contact with the second flattening layer (114b) may be over-etched due to the excellent hygroscopicity of the etchant, and the edge of the transparent conductive layer (162) may become an inverse tapered shape. Therefore, the edges of the second flattening layer (114b) and the transparent conductive layer (162) must be spaced apart so that the edge of the transparent conductive layer (162) can be formed close to a tapered shape. Therefore, the transparent conductive layer (162) must be formed to completely cover the second flattening layer (114b) so that the thickness of the cathode (133) can be secured near the edge of the transparent conductive layer (162) and the resistance of the cathode (133) can be lowered near the edge of the transparent conductive layer (162). Accordingly, in the display device (100) according to one embodiment of the present invention, the edge of the transparent conductive layer (162) and the second flattening layer (114b) are spaced apart so that the edge of the transparent conductive layer (162) can be formed into a tapered shape and the contact resistance between the cathode (133) and the contact part (160) can be reduced near the edge of the transparent conductive layer (162).

[0107] In a display device (100) according to one embodiment of the present invention, a bank covering the edge of a transparent conductive layer (162) with an inverse taper shape is arranged to minimize disconnection of the cathode (133) at the edge of the transparent conductive layer (162) and to lower the resistance. The edge of the transparent conductive layer (162) is arranged on the upper surface of the first flattening layer (114a). The edge of the transparent conductive layer (162) on the upper surface of the first flattening layer (114a) may be formed in an inverse taper shape. Specifically, the first flattening layer (114a) has high hygroscopicity of the etchant, so over-etching may occur on the lower surface of the transparent conductive layer (162) in contact with the first flattening layer (114a). And due to the over-etching of the transparent conductive layer (162) arranged on the first flattening layer (114a), the edge of the transparent conductive layer (162) may be formed in an inverse taper shape. At this time, a bank is arranged to cover the edge of the transparent conductive layer (162) having an inverse taper shape on the first flattening layer (114a). By arranging the bank to cover the edge of the transparent conductive layer (162) having an inverse taper shape, direct contact between the edge of the transparent conductive layer (162) and the cathode (133) can be prevented, and the thickness of the cathode (133) can be prevented from decreasing. Accordingly, in the display device (100) according to one embodiment of the present invention, even if the edge of the transparent conductive layer (162) has an inverse taper shape, a bank is further arranged on the edge of the transparent conductive layer (162) to prevent contact between the edge of the transparent conductive layer (162) and the cathode (133), and the increase in resistance caused by the decrease in the thickness of the cathode (133) can be minimized.

[0108] Finally, in a display device (100) according to one embodiment of the present invention, even if the resistance of the cathode (133) is somewhat high in a part of the contact portion (160), the overall contact resistance between the contact portion (160) and the cathode (133) can be sufficiently reduced by applying a design that lowers the resistance of the cathode (133) in the upper and lower portions of the contact portion (160). Specifically, in order to separate the first flattening layer (114a) and the second flattening layer (114b), the first flattening layer (114a) and the second flattening layer (114b) are not placed in the middle portion of the contact portion (160). In the side portion of the contact portion (160) adjacent to the routing area (RA) in the middle portion of the contact portion (160), the edge of the transparent conductive layer (162) can be placed directly on the passivation layer (113). At this time, due to various factors such as the manufacturing process or the type of material, the edge of the transparent conductive layer (162) placed on the passivation layer (113) may be formed to be close to either a tapered shape or an inverse tapered shape. If the edge of the transparent conductive layer (162) on the passivation layer (113) is close to an inverse tapered shape, the thickness of the cathode (133) at the edge of the transparent conductive layer (162) is formed unevenly, and the resistance may increase slightly in the middle part of the contact part (160) and the side part of the contact part (160). However, in the upper part of the contact part (160), a second flattening layer (114b) may be placed to increase the step coverage of the transparent conductive layer (162) and reduce the resistance of the cathode (133). In the lower part of the contact portion (160), the first flattening layer (114a) and a bank are arranged to prevent the edge of the inversely tapered transparent conductive layer (162) from coming into direct contact with the cathode (133) and to reduce the increase in resistance of the cathode (133).Accordingly, in a display device (100) according to one embodiment of the present invention, even if the resistance increases in a part of the contact portion (160), a design is applied to reduce the resistance of the cathode (133) in the upper and lower portions of the contact portion (160), so that the total contact resistance of the contact portion (160) and the cathode (133) can be lowered and a low-potential power supply voltage can be smoothly supplied to the display area (AA).

[0109] A display device according to embodiments of the present invention can be described as follows.

[0110] A display device according to one embodiment of the present invention comprises a substrate including a display area and a non-display area adjacent to the display area, a first flattening layer having at least a portion disposed in the display area, a second flattening layer disposed in the non-display area and spaced apart from the first flattening layer, a contact portion disposed between the first flattening layer and the second flattening layer in the non-display area, and a cathode extending from the display area to the non-display area and electrically connected to the contact portion.

[0111] According to another feature of the present invention, the contact portion may include one or more metal layers disposed below a first flattening layer and a second flattening layer, and a transparent conductive layer disposed on the first flattening layer and the second flattening layer and electrically connected to the metal layer.

[0112] According to another feature of the present invention, the transparent conductive layer may be arranged to cover the entire second planarization layer.

[0113] According to another feature of the present invention, the edge of the transparent conductive layer may be spaced apart from the second planarization layer.

[0114] According to another feature of the present invention, the edge of the transparent conductive layer can be disposed on the first flattening layer.

[0115] According to another feature of the present invention, it may further include a bank arranged to cover the edge of a transparent conductive layer on a first planarization layer.

[0116] According to another feature of the present invention, the edge of a portion of the transparent conductive layer extending outwardly from the bank may protrude outwardly more than the edge of another portion of the transparent conductive layer overlapping the bank.

[0117] According to another feature of the present invention, a plurality of flexible films connected to a substrate in a non-display area are further included, and a metal layer extends outwardly to the second planarization layer and can be electrically connected to the plurality of flexible films.

[0118] According to another feature of the present invention, a plurality of routing regions are further included that extend radially from a plurality of flexible films toward a display area, and a contact portion may be disposed between the plurality of routing regions.

[0119] According to another feature of the present invention, a plurality of light-emitting elements disposed in a display area and a plurality of driving elements for driving the plurality of light-emitting elements are further included, the metal layer is made of the same material as a part of the plurality of driving elements, and the transparent conductive layer may be made of the same material as the anode of the plurality of light-emitting elements.

[0120] According to another feature of the present invention, one or more insulating layers are further included, disposed between a metal layer and a transparent conductive layer, and having a contact hole formed therein that exposes the metal layer, and the metal layer exposed from the contact hole in a non-display area between a first flattening layer and a second flattening layer can come into contact with the transparent conductive layer.

[0121] According to another feature of the present invention, the back cover supporting the substrate on one side of the substrate, and a roller on which the substrate and the back cover are wound or unwound may be further included.

[0122] A display device according to another embodiment of the present invention comprises a substrate including a display area and a plurality of routing areas extending from the display area and a plurality of contact areas disposed between the plurality of routing areas; a plurality of flexible films electrically connected to each of the plurality of routing areas at one end of the substrate; a first planarization layer disposed in a portion of a plurality of routing areas adjacent to the display area and a portion of a plurality of contact areas adjacent to the plurality of routing areas; a second planarization layer disposed in the plurality of contact areas and spaced apart from the first planarization layer; a cathode disposed in a portion of a plurality of routing areas adjacent to the display area and a portion of a plurality of contact areas adjacent to the display area; and a contact portion disposed in each of the plurality of contact areas and electrically connected to the cathode, wherein the plurality of routing areas are arranged radially around the plurality of flexible films and the plurality of contact areas are arranged radially around the display area.

[0123] According to another feature of the present invention, the contact portion comprises one or more metal layers disposed below a first flattening layer and a second flattening layer, and a transparent conductive layer disposed on the first flattening layer and the second flattening layer and electrically connected to the metal layer, wherein some of the edges of the transparent conductive layer may be disposed on the upper surface of the first flattening layer disposed in a plurality of contact regions.

[0124] According to another feature of the present invention, the metal layer extends outwardly toward a plurality of flexible films and can be electrically connected to the plurality of flexible films.

[0125] According to another feature of the present invention, in a plurality of contact regions, the edge of the first flattening layer is arranged along the edge of a plurality of routing regions to form a concave shape, and in a plurality of routing regions, the edge of the first flattening layer can be arranged parallel to the edge of the display region.

[0126] According to another feature of the present invention, it further includes a bank arranged to simultaneously cover some of the edges of a transparent conductive layer and a first planarization layer in a plurality of contact areas, and the bank may be V-shaped.

[0127] According to another feature of the present invention, the second flattening layer is positioned parallel to the edge of the display area, and the side and top surfaces of the second flattening layer may be in contact with a transparent conductive layer.

[0128] Although embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not to limit, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of protection of the present invention shall be interpreted by the claims below, and all technical spirits within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0129] 100: Display device 110: Substrate 111: Buffer layer 112: Interlayer insulation layer 113: Passivation layer 114a: First leveling layer 114b: Second leveling layer 115a: 1st Bank 115b: Second Bank 120: Transistor 121: Active layer 122: Gate electrode 123: Source electrode 124: Drain electrode 130: Organic light-emitting diode 131: Anode 132: Organic light-emitting layer 133: Cathode 140: Flexible film 150: Printed circuit board 160: Contact Department 161: Metal layer 161a: First metal layer 161b: Second metal layer 162: Transparent conductive layer AA: Display area CA: Contact Area CH: Contact hole GI: Gate insulation layer LL: Link wiring NA: Non-display area RA: Routing Area SP: Subpixel

Claims

Claim 1 A substrate comprising a display area and a non-display area adjacent to the display area; a buffer layer disposed on the substrate; a metal layer disposed on the non-display area and disposed on the buffer layer; a first planarization layer disposed on the metal layer and disposed on the display area and the non-display area; a second planarization layer disposed on the metal layer and spaced apart from the first planarization layer; a transparent conductive layer disposed on the first planarization layer and the second planarization layer of the non-display area and electrically connected to the metal layer; an insulating layer disposed between the metal layer and the first planarization layer and between the metal layer and the second planarization layer; and a plurality of light-emitting elements disposed in the display area and including an anode and a cathode. A display device comprising a plurality of thin-film transistors disposed in the display area and driving the plurality of light-emitting elements, each comprising a gate electrode, an active layer, a source electrode, and a drain electrode, wherein the cathode extends from the display area to the non-display area and is electrically connected to the transparent conductive layer, wherein the metal layer is formed of the same material as any one of the gate electrode, the source electrode, and the drain electrode, the transparent conductive layer is formed of the same material as the anode, and the insulating layer includes a contact hole connecting the metal layer and the transparent conductive layer. Claim 2 A display device according to claim 1, further comprising a plurality of flexible films connected to the substrate in the non-display area, wherein the metal layer extends outwardly toward the plurality of flexible films and is electrically connected to the plurality of flexible films. Claim 3 delete Claim 4 A display device according to claim 1, wherein the transparent conductive layer is directly connected to the metal layer through the contact hole of the insulating layer. Claim 5 A display device according to claim 1, wherein the insulating layer is a protective layer. Claim 6 A display device according to paragraph 2, wherein the non-display area includes a plurality of routing areas adjacent to the display area, each of the plurality of flexible films is electrically connected to the plurality of routing areas, and the contact hole of the insulating layer is disposed between the plurality of routing areas. Claim 7 A display device according to claim 1, wherein the edge of the transparent conductive layer disposed on the first flattening layer has an inverse taper shape. Claim 8 A display device according to claim 1, further comprising a bank disposed on the transparent conductive layer on the first planarization layer, wherein the bank covers the edge of the transparent conductive layer on the first planarization layer. Claim 9 A display device according to claim 1, wherein the edge of the first flattening layer is parallel to the edge of the display area, and the edge of the second flattening layer facing the display area is arranged parallel to the edge of the display area. Claim 10 A display device according to claim 1, wherein the second flattening layer is in the shape of an island. Claim 11 In claim 6, a display device wherein the edge of the first flattening layer in the plurality of routing regions is arranged parallel to the edge of the display region. Claim 12 In claim 8, the bank is a display device that simultaneously covers a portion of the edge of the transparent conductive layer and the first planarization layer. Claim 13 In Clause 12, the bank is a V-shaped display device. Claim 14 A display device according to claim 1, wherein the second flattening layer is arranged parallel to the edge of the display area, and the side and top surfaces of the second flattening layer are in contact with the transparent conductive layer. Claim 15 A display device according to claim 1, wherein the transparent conductive layer is in contact with the first planarization layer, the second planarization layer, and the insulating layer.

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