Display device
The display device's power supply unit, with a dual-substrate configuration and strategic slotting and connection system, addresses high power, thinness, and durability issues, improving manufacturing efficiency and stability.
Patent Information
- Application Number
- KR1020260045031
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2026-01-09
- Filing Date
- 2026-03-12
- Publication Date
- 2026-11-05
- Estimated Expiration
- 2046-03-12
AI Technical Summary
Existing display devices face challenges in providing high power, thin form factor, improved manufacturing efficiency, and enhanced durability for their power supply units.
A display device design comprising a power supply unit with a first substrate mounted with power elements and a second substrate with capacitors, connected via a coupling member, featuring aligned mount and cover slots and electrical connections through connecting pins and soldering, to enhance space efficiency and stability.
The design enables high-power supply with improved durability and manufacturing efficiency, while maintaining a thin profile and enhancing assembly efficiency.
Smart Images

Figure 112026030448180-PAT00001_ABST
Abstract
Description
Technology Field
[0001] The present disclosure relates to a display device. Background Technology
[0002] As the information society develops, the demand for display devices is increasing in various forms; in response to this, various display devices such as LCD (Liquid Crystal Display Device), OLED (Organic Light Emitting Diodes), and Micro LED are being researched and used in recent years.
[0003] Among these, an LCD panel is equipped with a TFT substrate and a color substrate facing each other with a liquid crystal layer in between, and can display an image using light provided from a backlight unit. Additionally, an OLED panel can display an image by depositing a self-emissive organic layer on a substrate having a transparent electrode formed thereon. In particular, a display device equipped with an OLED panel has the advantage of being able to be implemented as an ultra-thin form factor because it does not require a backlight unit.
[0004] Recently, much research is being conducted on power supply units that meet the high power requirements of large-screen, high-resolution display devices and the thin thickness requirements of ultra-slim display devices. The problem to be solved
[0005] The present disclosure aims to solve the aforementioned problems and other problems.
[0006] Another objective may be to provide a display device equipped with a power supply unit capable of providing high power.
[0007] Another objective may be to provide a display device equipped with a thin power supply unit.
[0008] Another objective may be to provide a display device equipped with a power supply unit with improved manufacturing process efficiency.
[0009] Another objective may be to provide a display device equipped with a power supply unit with improved durability. means of solving the problem
[0010] According to one aspect of the present disclosure for achieving the above-described purpose, a display device comprises: a display panel; a frame to which the display panel is coupled; and a power supply unit located opposite the display panel with respect to the frame and providing power to the display panel, wherein the power supply unit comprises: a first substrate on which a power element is mounted; a second substrate facing the first substrate on which a capacitor is mounted; and a coupling member fixed to the first substrate and supporting the second substrate, wherein the first substrate comprises: a mount slot aligned with the capacitor, and the second substrate comprises: a cover slot located opposite the mount slot with respect to the capacitor, and the second substrate may be fixed to the coupling member. Effects of the invention
[0011] The effects of the display device according to the present disclosure are described as follows.
[0012] According to at least one of the embodiments of the present disclosure, a display device having a power supply unit capable of providing high power can be provided.
[0013] According to at least one of the embodiments of the present disclosure, a display device having a thin power supply unit can be provided.
[0014] According to at least one of the embodiments of the present disclosure, a display device having a power supply unit with improved manufacturing process efficiency can be provided.
[0015] According to at least one of the embodiments of the present disclosure, a display device having a power supply unit with improved durability can be provided.
[0016] Further scopes of the applicability of the present disclosure will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present disclosure are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present disclosure, should be understood as being given merely as examples. Brief explanation of the drawing
[0017] FIGS. 1 to 11 are drawings illustrating examples of display devices according to embodiments of the present disclosure. Specific details for implementing the invention
[0018] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are given the same reference number, and redundant descriptions thereof will be omitted.
[0019] The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification, and do not inherently possess distinct meanings or roles.
[0020] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art may obscure the essence of the embodiments disclosed in this specification, such detailed description is omitted. Furthermore, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.
[0021] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.
[0022] When a component is described as being “coupled,” “fixed,” “mounted,” “connected,” or “linked” with another component, another component may exist between that component and the other component. When a component is described as being “directly coupled,” “directly fixed,” “directly mounted,” “directly connected,” or “directly linked” to another component, there may not be another component existing between them.
[0023] A singular expression includes a plural expression unless the context clearly indicates otherwise.
[0024] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0025] The directional indications of Up (U), Down (D), Left (Le), Right (Ri), Front (F), and Rear (R) shown in the drawings are for convenience of explanation only and do not limit the technical concepts disclosed in this specification.
[0027] Referring to FIG. 1, the display device (1) may include a display panel (10). The display panel (10) can display an image on the front.
[0028] The display device (1) may include a first long side (LS1), a second long side (LS2) facing the first long side (LS1), a first short side (SS1) adjacent to the first long side (LS1) and the second long side (LS2), and a second short side (SS2) facing the first short side (SS1). Meanwhile, for convenience of explanation, the lengths of the first and second long sides (LS1, LS2) are shown and described as being longer than the lengths of the first and second short sides (SS1, SS2), but it is also possible for the lengths of the first and second long sides (LS1, LS2) to be approximately the same as the lengths of the first and second short sides (SS1, SS2).
[0029] A direction parallel to the long side (LS1, LS2) of the display device (1) can be referred to as the left-right direction or the first direction (DR1). A direction parallel to the short side (SS1, SS2) of the display device (1) can be referred to as the up-down direction or the second direction (DR2). A direction perpendicular to the long side (LS1, LS2) and short side (SS1, SS2) of the display device (1) can be referred to as the front-back direction or the third direction (DR3).
[0030] The direction in which the display panel (10) displays an image can be called the front (F, z), and the opposite direction can be called the rear (R, -z). The first long side (LS1) can be called the upper side (U, y). The second long side (LS2) can be called the lower side (D, -y). The first short side (SS1) can be called the left side (Le, x). The second short side (SS2) can be called the right side (Ri, -x).
[0031] The first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) can be referred to as edges of the display device (1). Additionally, the point where the first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) meet each other can be referred to as a corner.
[0032] For example, the point where the first short side (SS1) and the first long side (LS1) meet can be called the first corner (C1). The point where the first long side (LS1) and the second short side (SS2) meet can be called the second corner (C2). The point where the second short side (SS2) and the second long side (LS2) meet can be called the third corner (C3). The point where the second long side (LS2) and the first short side (SS1) meet can be called the fourth corner (C4).
[0034] Referring to FIGS. 1 and 2, the display device (1) may include a display panel (10), a frame (20), a side frame (30), and a back cover (40).
[0035] The display panel (10) can form the front surface of the display device (1) and can display an image forward. For example, the display panel (10) may be an OLED (Organic Light Emitting Diode) panel. However, the display panel applicable to the present disclosure is not limited to an OLED panel.
[0036] The display panel (10) can output an image by dividing the image into multiple pixels and matching the color, brightness, and saturation for each pixel. The display panel (10) can be divided into an active area where the image is displayed and a de-active area where the image is not displayed. The display panel (10) can generate light corresponding to the color red, green, or blue according to a control signal.
[0037] The frame (20) may be located at the rear of the display panel (10), and the display panel (10) may be coupled to the frame (20). For example, the frame (20) may include a metal material. A cable hole (CH) may be formed by penetrating the frame (20). Meanwhile, the frame (20) may be referred to as a main frame (20), a module cover (20), a rear frame (20), or a rear cover (20).
[0038] The side frame (30) may extend along the perimeter of the frame (20). The frame (20) may be connected to the side frame (30) at the front or rear of the side frame (30). The side frame (30) may cover the sides of the display panel (10) and the frame (20). Meanwhile, the side frame (30) may be referred to as a guide panel.
[0039] The back cover (40) may be located at the rear of the frame (20) and may be attached to the frame (20). For example, the back cover (40) may be an injection-molded product made of resin. As another example, the back cover (40) may include a metal material.
[0041] Referring to FIG. 3, boards (50) can be mounted on the frame (20) at the rear of the frame (20). Multiple electronic components can be mounted on the boards (50). The board (50) may be a Printed Circuit Board (PCB) and may be electrically connected to the electronic components of a display device.
[0042] For example, the boards (50) may include a power supply board (51) that provides power to each component of the display device, a timing controller board (52) that provides a video signal to the display panel (10), and a main board (53) that provides a video signal to the display panel (10) and / or the timing controller board (52) and controls the display device.
[0043] Meanwhile, the S-PCB (11, see FIG. 2, Source PCB) may be adjacent to the lower edge of the display panel (10) and may be coupled to the rear of the display panel (10). The cable (C) may pass through a cable hole (CH) formed in the lower part of the frame (20) and may connect the S-PCB (11) and the timing controller board (52). Accordingly, the cable (C) may transmit digital video data and timing control signals from the timing controller board (52) to the S-PCB (11). For example, the cable (C) may be a Flexible Flat Cable (FFC).
[0045] Referring to FIG. 4, there may be multiple power supply units (51). The multiple power supply units (51) may include a master power board (51a) and a slave power board (51b). The slave power board (51b) may be connected in parallel with the master power board (51a). A timing controller board (52) may be located between the master power board (51a) and the slave power board (51b).
[0046] There may be multiple speaker units (60). The multiple speaker units (60) may include a left speaker unit (60a) and a right speaker unit (60b). A main board (53) may be located between the multiple speaker units (60).
[0048] Referring to FIG. 5, the capacitor (130) may be a capacitor (130) for preventing momentary static electricity. The capacitor (130) may be cylindrical in shape overall. The cross-section of the capacitor (130) may be circular. The first substrate (110) may form a base. The first substrate (110) may be referred to as a lower substrate (110), a base substrate (110), or a mother board (110). The second substrate (120) may face the first substrate (110). The second substrate (120) may be spaced apart from the first substrate (110). The second substrate (120) may be referred to as an upper substrate (120), a cover substrate (120), or a daughter board (120). Power devices (511, see FIG. 4) may be mounted on the first substrate (110). For example, the power devices (511, see FIG. 4) may include an integrated circuit (IC), a transformer, an EMI filter, and / or a relay. A capacitor (130) may be mounted on the second substrate (120).
[0049] The first substrate (110) may include a mount slot (111). The mount slot (111) may be formed through the first substrate (110). The width (W1) of the mount slot (111) may be smaller than the diameter of the capacitor (130). The capacitor (130) may be located in the mount slot (111) of the first substrate (110). The capacitor (130) may be inserted or fitted into the mount slot (111) of the first substrate (110). For example, the diameter of the capacitor (130) may be 5 millimeters, and the thickness (T1) of the first substrate (110) may be 1.5 to 1.8 millimeters.
[0050] The second substrate (120) may include a cover slot (121). The cover slot (121) may be formed through the second substrate (120). The width (W2) of the cover slot (121) may be smaller than the diameter of the capacitor (130). The second substrate (120) may face the first substrate (110) with a gap (G), and the cover slot (121) may be aligned with the mount slot (111). The capacitor (130) may be secured by the mount slot (111) and the cover slot (121). For example, the thickness (T2) of the second substrate (120) may be 1.5 to 1.8 millimeters, and the gap (G) between the first substrate (110) and the second substrate (120) may be 1.6 to 2 millimeters.
[0051] The connecting member (140) may be located on the side or edge of the second substrate (120). The connecting member (140) may be supported or fixed on the upper surface of the first substrate (110). The connecting member (140) may be coupled to the first substrate (110) and the second substrate (120). There may be multiple connecting members (140). The first connecting member (140a) may be located opposite the second connecting member (140b) with respect to the capacitor (130). The second substrate (120) may maintain a gap (G) with respect to the first substrate (110) by means of the first connecting member (140a) and the second connecting member (140b).
[0052] For example, the first solder (113) may be formed on the upper surface of the first substrate (110). The second solder (123) may be formed on the side or edge of the second substrate (120). The first solder (113) may come into contact with the connecting member (140). The second solder (123) may come into contact with the connecting member (140). The connecting member (140) may electrically connect the first solder (113) and the second solder (123).
[0053] As another example, the first solder (113) may be formed on the upper surface of the first substrate (110). The second solder (123) may be formed on the lower surface of the second substrate (120). The first solder (113) may come into contact with the connecting member (140). The second solder (123) may come into contact with the connecting member (140). The second solder (123) may be located opposite the first solder (113) with respect to the connecting member (140). The connecting member (140) may electrically connect the first solder (113) and the second solder (123).
[0055] Referring to FIGS. 6 through 8 together with FIG. 5, the first substrate (110) may include a plurality of mount slots (111). The plurality of mount slots (111) may form rows and columns. The number of the plurality of mount slots (111) may correspond to the number of the plurality of cover slots (121) and / or the number of capacitors (130).
[0056] The second substrate (120) may include a plurality of cover slots (121). The plurality of cover slots (121) may form rows and columns. The number of the plurality of cover slots (121) may correspond to the number of capacitors (130) and / or the number of the plurality of mount slots (111).
[0057] Each of the plurality of capacitors (130) may be arranged corresponding to each of the plurality of cover slots (121). Each capacitor (130) may be electrically connected to the second substrate (120) on the lower surface (120a) of the second substrate (120). The plurality of capacitors (130) may be placed in the plurality of cover slots (121) on the lower surface (120a) of the second substrate (120). The wire (a) of the capacitor (130) may be bonded to the second substrate (120).
[0058] Referring to FIG. 8, a plurality of capacitors (130) on the upper surface (120b) of the second substrate (120) may be exposed to the outside by a plurality of cover slots (121). Since the diameter of the capacitor (130) is larger than the width (W2, see FIG. 5) of the cover slot (121), the second substrate (120) can prevent the capacitor (130) from protruding from the upper surface (120b) of the second substrate (120).
[0059] Referring to FIGS. 6 and 7, the first solder (113) may be applied to the upper surface (110a) of the first substrate (110) by extending along the longitudinal direction of the edge of the first substrate (110) adjacent to the edge of the first substrate (110). The first solder (113) may be formed adjacent to both edges of the first substrate (110). The second solder (123) may be applied by extending along the longitudinal direction of the edge of the second substrate (120) adjacent to the edge of the second substrate (120). The second solder (123) may be formed adjacent to both edges of the second substrate (120). When the lower surface (120a) of the second substrate (120) faces the upper surface (110a) of the first substrate (110), a connecting member (140, see FIG. 5) can electrically connect the first substrate (110) and the second substrate (120) by connecting the first solder (113) and the second solder (123).
[0060] Accordingly, the capacitors (130) coupled to the second substrate (120) can be separated from the power elements mounted on the first substrate (110) and electrically connected to the power elements of the first substrate (110). This not only increases the space efficiency of the display device but also increases the stability of the power supply. In addition, the assembly efficiency of the display device can be improved.
[0062] Referring to FIG. 9, the coupling member (114) may be mounted or fixed on the first substrate (110). There may be a plurality of coupling members (114). A plurality of coupling members (114) may be arranged sequentially along the longitudinal direction of one edge of the first substrate (110). Each of the plurality of coupling members (114) may be spaced apart from one another. For example, the coupling member (114) may be a pham nut.
[0063] A pad (115) can be mounted on a first substrate (110). There may be multiple pads (115). Each of the multiple pads (115) may be located adjacent to a coupling member (114). A pair of pads (115a, 115b) may face each other with respect to the coupling member (114). A first pad (115a) may be located adjacent to one side of the coupling member (114), and a second pad (115b) may be located opposite the first pad (115a) with respect to the coupling member (114). A pair of pads (115a, 115b) may be arranged sequentially along the longitudinal direction of one edge of the first substrate (110).
[0064] A pinhole (116) may be formed in the first substrate (110). The pinhole (116) may penetrate the first substrate (110). The pinhole (116) may be slit-shaped. The first pinhole (116a) may be located between the first pad (115a) and one edge of the first substrate (110). The second pinhole (116b) may be located opposite the first pinhole (116a) with respect to the first pad (115a). A pair of pinholes (116a, 116b) may be aligned with each of the plurality of pads (115).
[0066] Referring to FIG. 10, the connecting pin (150) may include a connecting portion (151). The connecting portion (151) may contact or be electrically connected to a pad (115, see FIG. 9). The connecting portion (151) may include a first connecting portion (151a) and a second connecting portion (151b). For example, the first connecting portion (151a) may contact the first pad (115a), and the second connecting portion (151b) may contact the second pad (115b).
[0067] The connecting pin (150) may include a connecting pin (152). The connecting pin (152) may be bent and extended at the edge of the connecting portion (151). The connecting pin (152) may be a pair. A pair of connecting pins (152) may be formed in the connecting portion (151). A first connecting pin (152a) may be formed at one end of the connecting portion (151), and a second connecting pin (152b) may be formed at the other end of the connecting portion (151). The first connecting pin (152a) may face or opposite the second connecting pin (152b). A pair of connecting pins (152) may be formed in each of the first connecting portion (151a) and the second connecting portion (151b). The connecting pin (152) may be inserted into a pin hole (116, see FIG. 9). For example, when the first connection part (151a) is positioned on the first pad (115a), the first connection pin (152a) of the first connection part (151a) can be inserted into the first pin hole (116a), and the second connection pin (152b) of the first connection part (151a) can be inserted into the second pin hole (116b). For example, when the second connection part (151b) is positioned on the second pad (115b), the first connection pin (152a) of the second connection part (151b) can be inserted into the first pin hole (116a), and the second connection pin (152b) of the second connection part (151b) can be inserted into the second pin hole (116b).
[0068] The base portion (153) may be supported on the first substrate (110) or on the second substrate (120). The base portion (153) may extend from the connection portion (151). The insertion pin (154) may be in the shape of a pillar protruding from the base portion (153). The insertion pin (154) may be inserted into a connection hole (120h) formed in the second substrate (120). There may be multiple insertion pins (154). Multiple insertion pins (154) may be inserted into multiple connection holes (120h) formed in the second substrate (120).
[0070] Referring to FIG. 11, the coupling member (114) can be inserted into and fixed to the first substrate (110). A portion of the coupling member (114) may protrude from the first substrate (110). The second substrate (120) may be supported on a portion of the coupling member (114). The coupling member (114) may maintain a gap between the first substrate (110) and the second substrate (120). The second substrate (120) may be fixed to the coupling member (114) by fastening a fastening member (f) to the coupling member (114). For example, the coupling member (114) may be a pham nut, and the fastening member (f) may be a screw. Solder (S) may be filled into the gap formed between the coupling member (114) and the first substrate (110).
[0071] The connection portion (151) of the connection pin (150, see FIG. 10) may be located on the first substrate (110). The first connection pin (152a) may extend from one end of the connection portion (151) and be inserted into the first pinhole (116a) of the first substrate (110). Solder (S) may be filled into the gap formed between the first connection pin (152a) and the first pinhole (116a). The second connection pin (152b) may extend from the other end of the connection portion (151) and be inserted into the second pinhole (116b) of the first substrate (110). Solder (S) may be filled into the gap formed between the second connection pin (152b) and the second pinhole (116b). An electrode line (L) may be connected to the first connection pin (152a) and / or the second connection pin (152b).
[0072] The base portion (153) extending from the connection portion (151) may be located on the upper surface of the first substrate (110). The base portion (153) may also be located on the lower surface of the second substrate (120). An insertion pin (154) may be extended from the base portion (153) and inserted into the connection hole (120h) of the second substrate (120). Solder (S) may be filled into the gap formed between the insertion pin (154) and the connection hole (120h). An electrode line (L) may be connected to the insertion pin (154).
[0073] Referring to FIGS. 9 through 11, a plurality of capacitors (130) may be mounted in a plurality of cover slots (121) formed in a second substrate (120) (see FIGS. 7 and 8). The second solder (123, see FIG. 7) of the second substrate (120) may be omitted. A connecting pin (150) may be coupled to the second substrate (120) (see FIG. 10). The second substrate (120) with the capacitors (130) and the connecting pins (150) coupled thereto may be wave soldered. The second substrate (120) may be positioned facing the first substrate (110). At this time, the capacitor (130) may be positioned between the first substrate (110) and the second substrate (120) (see FIG. 5). The connecting pins (152) of the connecting pin (150) can be inserted into the pin holes (116) of the first substrate (110). The connecting member (114) can maintain the gap between the first substrate (110) and the second substrate (120). The second substrate (120) can be reflowed and soldered while maintaining the gap on the first substrate (110). During the soldering process, the aforementioned solder (S) can be filled into the pin holes (116) of the first substrate (110) and / or the connecting holes (120h) of the second substrate (120). A fastening member (f) can be fastened to the connecting member (114) to maintain a stable connection between the first substrate (110) and the second substrate (120).
[0074] Accordingly, the capacitors (130) coupled to the second substrate (120) can be separated from the power elements mounted on the first substrate (110) and electrically connected to the power elements of the first substrate (110). This not only increases the space efficiency of the display device but also increases the stability of the power supply. In addition, the assembly efficiency of the display device can be improved.
[0076] Referring to FIGS. 1 to 11, the display device comprises: a display panel; a frame to which the display panel is coupled; and a power supply unit located opposite the display panel to the frame and providing power to the display panel, wherein the power supply unit comprises: a first substrate on which a power element is mounted; a second substrate facing the first substrate on which a capacitor is mounted; and a coupling member fixed to the first substrate and supporting the second substrate, wherein the first substrate comprises: a mount slot aligned with the capacitor, and the second substrate comprises: a cover slot located opposite the mount slot to the capacitor, and the second substrate may be fixed to the coupling member.
[0077] The width of the cover slot may be smaller than the diameter of the capacitor, and the width of the mount slot may be smaller than the diameter of the capacitor.
[0078] The above-mentioned coupling member is positioned between the first substrate and the second substrate to maintain a gap between the first substrate and the second substrate.
[0079] The power supply unit may further include a connecting pin located between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate.
[0080] The above connecting pin comprises: a connecting portion facing the first substrate; and a connecting pin extending from the connecting portion and inserted into a pinhole formed in the first substrate, and the connecting pin can be electrically connected to the first substrate.
[0081] The first substrate may include a pad formed on the first substrate that contacts the connection portion of the connecting pin.
[0082] The above pads are in the plurality, and the connecting pins and connecting parts are each in the plurality corresponding to each of the plurality of pads, and the coupling member may be located between the plurality of pads and the plurality of connecting parts.
[0083] The above connecting pin further includes an insertion pin that extends from the connecting portion toward the second substrate and is inserted into a connecting hole formed in the second substrate, and the insertion pin can be electrically connected to the capacitor mounted on the second substrate.
[0084] The width of the cover slot corresponds to the width of the mount slot, and the width of the cover slot may be smaller than the diameter of the capacitor.
[0085] The above capacitor is a capacitor for electrostatic discharge prevention and may have a diameter of 5 millimeters.
[0086] The power supply unit may further include: a first solder that fills the gap formed between the pin hole of the first substrate and the connection pin; and a second solder that fills the gap formed between the connection hole of the second substrate and the insertion pin.
[0087] The power supply unit may further include a fastening member that is fastened to the coupling member and fixes the second substrate to the coupling member.
[0088] The gap between the first substrate and the second substrate may be greater than the thickness of the first substrate or the thickness of the second substrate.
[0089] The diameter of the capacitor may be smaller than the sum of the thickness of the first substrate, the thickness of the second substrate, and the gap.
[0091] Some or other embodiments of the present disclosure described above are not exclusive or distinct from one another. Some or other embodiments of the present disclosure described above may be used in combination or combined for their respective configurations or functions.
[0092] For example, this means that configuration A described in a specific embodiment and / or drawing and configuration B described in another embodiment and / or drawing can be combined. That is, even if the combination between configurations is not directly described, it means that combination is possible, except in cases where it is described that combination is impossible.
[0093] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.
Claims
Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A display device comprising: a display panel; a frame to which the display panel is coupled; and a power supply unit located opposite the display panel with respect to the frame and providing power to the display panel, wherein the power supply unit comprises: a first substrate on which a power element is mounted; a second substrate facing the first substrate on which a capacitor is mounted; and a coupling member fixed to the first substrate and supporting the second substrate, wherein the first substrate comprises: a mount slot aligned with the capacitor, and the second substrate comprises: a cover slot located opposite the mount slot with respect to the capacitor, wherein the second substrate is fixed to the coupling member, and the coupling member is located between the first substrate and the second substrate to maintain a gap between the first substrate and the second substrate, and the power supply unit further comprises: a connecting pin located between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate. Claim 6 In claim 5, the connecting pin comprises: a connecting portion facing the first substrate; and a connecting pin extending from the connecting portion and inserted into a pinhole formed in the first substrate, and the connecting pin is electrically connected to the first substrate. Claim 7 In claim 6, the first substrate comprises: a display device including a pad formed on the first substrate, which contacts the connection portion of the connecting pin. Claim 8 In claim 7, the pads are a plurality, the connecting pins and connecting parts are each a plurality corresponding to each of the plurality of pads, and the coupling member is a display device located between the plurality of pads and the plurality of connecting parts. Claim 9 In claim 6, the connecting pin further comprises an insertion pin that extends from the connecting portion toward the second substrate and is inserted into a connecting hole formed in the second substrate, and the insertion pin is electrically connected to the capacitor mounted on the second substrate. Claim 10 In claim 5, the width of the cover slot corresponds to the width of the mount slot, and the width of the cover slot is smaller than the diameter of the capacitor in the display device. Claim 11 In claim 5, the capacitor is an electrostatic discharge protection capacitor and is a display device having a diameter of 5 millimeters. Claim 12 In claim 9, the power supply unit further comprises: a first solder filled in a gap formed between a pinhole of the first substrate and a connection pin; and a second solder filled in a gap formed between a connection hole of the second substrate and an insertion pin. Claim 13 In claim 5, the power supply unit further comprises a fastening member that is fastened to the coupling member and fixes the second substrate to the coupling member. Claim 14 A display panel; a frame to which the display panel is coupled; and a power supply unit positioned opposite the display panel with respect to the frame and providing power to the display panel, wherein the power supply unit comprises: a first substrate on which a power element is mounted; a second substrate facing the first substrate on which a capacitor is mounted; and a coupling member fixed to the first substrate and supporting the second substrate. A display device comprising a connecting pin positioned between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate, wherein the first substrate comprises a mount slot aligned with the capacitor, and the second substrate comprises a cover slot positioned opposite to the mount slot with respect to the capacitor, and the second substrate is fixed to the coupling member, and the coupling member is positioned between the first substrate and the second substrate to maintain a gap between the first substrate and the second substrate, and the gap between the first substrate and the second substrate is greater than the thickness of the first substrate or the thickness of the second substrate. Claim 15 In claim 14, the diameter of the capacitor is smaller than the sum of the thickness of the first substrate, the thickness of the second substrate, and the gap of the display device. Claim 16 A display panel; a frame to which the display panel is coupled; and a power supply unit located opposite the display panel with respect to the frame and providing power to the display panel, wherein the power supply unit comprises: a first substrate on which a power element is mounted; a second substrate facing the first substrate on which a capacitor is mounted; a coupling member for fixing the second substrate to the first substrate; and a connecting pin located between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate, wherein the first substrate comprises: a mount slot aligned with the capacitor, and the second substrate comprises: a cover slot located opposite the mount slot with respect to the capacitor, and the connecting pin comprises: a connection portion facing the first substrate; and a connecting pin extending from the connection portion and inserted into a pinhole formed in the first substrate to be electrically connected to the first substrate. A display device comprising: a first solder filling a gap formed between a pin hole of the first substrate and a connection pin formed in the second substrate, the first solder filling a gap formed between a pin hole of the first substrate and a connection pin, and a second solder filling a gap formed between a connection hole of the second substrate and a insertion pin. Claim 17 In claim 16, the first substrate comprises: a display device including a pad formed on the first substrate, which contacts the connection portion of the connecting pin. Claim 18 In claim 17, the pads are a plurality, the connecting pins and connecting parts are each a plurality corresponding to each of the plurality of pads, and the coupling member is a display device located between the plurality of pads and the plurality of connecting parts. Claim 19 In claim 16, the width of the cover slot corresponds to the width of the mount slot, and the width of the cover slot is smaller than the diameter of the capacitor in the display device. Claim 20 In claim 16, the capacitor is an electrostatic discharge protection capacitor and is a display device having a diameter of 5 millimeters.
Citation Information
Patent Citations
Slot member and power electronic apparatus include the same
KR1020230130256A
display device
KR1020240055781A
Power conversion apparatus
US20190243431A1
