That aperture alignment

Abstract

Examples of photolithography machines having high-speed alignment are disclosed herein. The machine may include a stage for holding and moving a substrate and a projection system for projecting an image onto a plurality of exposed areas of the substrate. The machine may also include an alignment system positioned adjacent to the projection system. The alignment system may include a plurality of microscope cameras having a fixed focus, and each microscope camera is configured to detect a respective reference point within its respective exposed area of ​​the substrate.

Description

Technology Field

[0001] Cross-reference of related applications

[0002] This application claims the benefit of priority to U.S. Patent Application No. 18 / 061,737 filed December 5, 2022, and this application claims priority to U.S. Provisional Patent Application No. 63 / 327,075 filed April 4, 2022, the contents of which are incorporated herein by reference in their entirety.

[0003] Technology field

[0004] The present disclosure relates to alignment techniques generally associated with photolithographic processing. Background Technology

[0005] Photolithography is typically used to manufacture patterns on substrates such as silicon (semiconductor) wafers or flat panel displays. Generally, photolithography involves transferring a pattern from a photomask (or reticle) to a photosensitive surface on a substrate.

[0006] To manufacture a substrate for processing, a robot is used to place the substrate on a substrate stage within a photolithographic machine. Typically, one or more fiducial markers (e.g., notches or flat areas on the edges of the substrate) are etched or otherwise formed within the substrate. An alignment process is used to align the substrate using the fiducial markers. Conventional alignment techniques typically use high-resolution, high-numerical-aperture (NA) microscopes to perform alignment. However, these high-NA microscopes have a small depth of focus (e.g., less than 9 microns). A small depth of focus can be problematic because the substrate may not be perfectly flat; for example, the substrate may warp or bend. Furthermore, other components within the photolithographic machine can also add irregularities to the substrate processing. Therefore, conventional alignment techniques are not well equipped with image fiducials at various heights.

[0007] The present invention discloses examples of a photolithography machine and a processing technique using an alignment system for aligning an exposure area based on a reference point. The alignment system may include a plurality of microscope cameras having a fixed focus. Thus, the microscope cameras may have a low numerical aperture, so independent focus adjustment is not required. The use of cameras with a lower NA can increase the speed of operation by eliminating the need to focus each microscope camera individually.

[0008] The present disclosure describes a photolithography machine having high-speed alignment. The photolithography machine includes a stage for holding and moving a substrate and a projection system for projecting an image onto a plurality of exposed areas of the substrate. The photolithography machine also includes an alignment system positioned adjacent to the projection system, the alignment system includes a plurality of microscope cameras having a fixed focus, each microscope camera being configured to detect a respective reference point within its respective exposed area of ​​the substrate.

[0009] The present disclosure also describes a method for photolithographing a substrate, the method comprising: loading a substrate onto a stage of a photolithography machine; positioning the stage such that an alignment system of the photolithography machine faces a first exposure area of ​​the substrate, wherein the alignment system comprises a plurality of microscope cameras having a fixed focus; capturing a first set of images using a plurality of microscope cameras of the first exposure area, wherein each image comprises a reference point associated with the first exposure area; determining alignment correction information for the first exposure area based on the first set of images; and projecting an image onto the first exposure area based on the alignment correction information.

[0010] The present disclosure further describes an alignment system for a photolithography machine. The alignment system comprises a support structure positioned adjacent to a projection system of the photolithography machine. The alignment system also comprises a plurality of microscope cameras coupled to the support structure having a fixed focus, each microscope camera configured to detect a respective reference point within its respective exposure area of ​​a substrate. Brief explanation of the drawing

[0011] The various drawings in the attached drawings merely illustrate exemplary embodiments of the present disclosure and should not be construed as limiting the scope of the present disclosure. Figure 1a illustrates an exemplary part of a photolithography machine. Figure 1b illustrates an exemplary part of a projection system. Figure 1c illustrates an exemplary part of a sorting system. Figure 2 shows an exemplary part of a microscope camera. Figure 3 shows a simplified block diagram of the components of a microscope camera. Figure 4 shows an exemplary part of the stage. FIG. 5 illustrates a substrate having multiple exposed areas. Figure 6 illustrates a flowchart for a method for photolithographic processing using alignment. FIG. 7 illustrates a block diagram of an exemplary machine in which any one or more of the techniques (e.g., methodologies) discussed herein may be performed. Specific details for implementing the invention

[0012] The substrate may include a reference point. As described herein, a photolithography machine having an alignment system may align the exposure area based on the reference point. The alignment system may include a plurality of microscope cameras having a fixed focus. The microscope cameras may have a low numerical aperture (NA). The use of cameras with a lower NA can increase the speed of operation by eliminating the need to focus each microscope camera individually.

[0013] FIGS. 1a through 1c illustrate exemplary parts of a photolithography machine (100). The photolithography machine may include a projection system (102), an alignment system (104), and a stage for carrying one or more substrates (108). The projection system (102) and the alignment system (104) may be positioned adjacent to each other and may be positioned opposite to (e.g., on the stage (106)).

[0014] The projection system (102) may include one or more projection camera systems. FIG. 1b illustrates an exemplary portion of the projection system (102). The projection system (102) may include an illuminator (112), a reticle stage (114), and a projection lens (116). The projection system (102) may be configured to expose a pattern or image on a substrate in its respective exposure area. If multiple projection camera systems are provided, the projection camera systems may be configured to expose their respective patterns or images at substantially the same time (e.g., simultaneously or all at once).

[0015] Each illuminator (112) may include a light source for generating light on top of a reticle placed on a reticle stage. The light source may be provided using an ultra-violet light emitting diode (UV LED) system and an associated optical device.

[0016] The reticle stage (114) may include an alignment device for aligning a reticle placed thereon with respect to the stage (106). The alignment device may include, for example, a 6-axis reticle chuck as described in USP 7,385,671, titled “High Speed ​​Lithography Machine and Method,” which is incorporated herein by reference in its entirety and includes, but is not limited to, the relevant parts which are specifically described below, and inclusion by reference is made except as follows: Where any part of the patent referenced above does not correspond to the present application, the present application replaces the patent referenced above. Each axis of the 6-axis chuck may have an integrated single-axis, low-precision, speed and position sensor.

[0017] In the example of a multiple camera system, each reticle stage may be configured to hold a separate reticle (or photomask or image source) to enable different pattern fabrication. The reticle stages may be aligned independently of the stage to account for different variations on the substrate or different pattern fabrication. Each camera system may have its own set of sensors to align its photomask (or reticle) with the substrate plane to ensure that the optical axis of the camera is perpendicular to the substrate plane. For example, the sensors for each camera (e.g., six sensors) may use a metrology frame as a reference for proper alignment. The metrology frame may be linear and rigid, and thus may provide a reference for flatness, straightness, height, position, etc.

[0018] The reticle stage (114) may be aligned independently with respect to the stage to account for different variations or different pattern fabrication on the substrate. The projection lens (116) may project a pattern or image on each reticle onto a substrate placed on the stage. The projection lens (116) may include one or more optical lenses. The projection lens (116) may include individual real-time autofocus sensors. The optical characteristics of the projection lens (116) may be adjusted based on the autofocus sensors to focus the projected pattern or image on the substrate as needed.

[0019] The stage (106) may be provided below the camera and may carry one or more substrates during manufacturing. The stage may include a granite structure. The stage may be movable in the x, y, and θ directions.

[0020] The alignment system (104) can be used to align the respective exposure areas of the substrate, particularly before exposure by a projection camera system. The alignment system may include a plurality of microscope cameras (118.1 to 118.4). For example, the alignment system may include four microscope cameras (118.1 to 118.4).

[0021] The alignment system (104) may include a support structure (120) that supports a plurality of microscope cameras (118.1 to 118.4). The microscope cameras (118.1 to 118.4) may be movable in the x and y directions, but the microscope cameras (118.1 to 118.4) have a fixed z position. Thus, the microscope cameras (118.1 to 118.4) have a fixed focus. That is, independent actuators may not be used to move the microscope cameras (118.1 to 118.4) to adjust the focus of each of them. Instead, the microscope cameras (118.1 to 118.4) include microscope objective lenses having a low numerical aperture (NA), and accordingly, independent focus adjustment is not required. In some examples, the microscope cameras (118.1 to 118.4) may each have an NA of 0.15 or less. A low NA yields a higher depth of focus, and consequently, independent focus adjustment on the z-axis is not required. The depth of focus of a microscope camera is related to the NA. In particular, the depth of focus is the square of the NA (NA 2 It is proportional to ). Using a lower NA may sacrifice resolution, but it offers the benefit of faster processing by eliminating the need to focus each microscope camera individually.

[0022] Accordingly, the microscope camera (118.1 to 118.4) as described herein can achieve high-speed alignment by rapidly imaging and detecting reference points at various and uncertain heights without adjusting the focus of the camera on the z-axis. Additionally, the microscope camera (118.1 to 118.4) can be used to detect reference points on the bottom surface or intermediate layer as well as the top surface of the substrate (using an infrared sensor).

[0023] Each microscope camera (118.1 to 118.4) can simultaneously perform x,y detection of its respective reference point. In an example with four microscope cameras, this results in providing eight information points simultaneously for each exposure area (each camera providing two information points). This can lead to faster throughput and better overlay.

[0024] Microscope cameras (118.1 to 118.4) may be mounted on top of a support structure (120). In some examples, the microscope cameras (118.1 to 118.4) may be arranged in a rectangular shape as illustrated, and each camera may be positioned at a corner of the rectangular shape. The microscope cameras (118.1 to 118.4) may be movable in the x,y direction to accommodate different reference point positions for various substrate recipes. The x,y actuator may be provided with a gripper arm for gripping each microscope and positioning each microscope camera (118.1 to 118.4). In some examples, one microscope camera (118.1) may be held stationary, and the other microscope cameras (118.2 to 118.4) may be moved relative to the stationary microscope camera (118.1).

[0025] FIG. 2 shows an exemplary portion of a microscope camera (118). The microscope camera (118) may include air bearings (202.1 to 202.3) and magnets (204.1 to 204.3) for positioning the microscope camera in the x and y directions. In this example, three air bearings and three magnets are provided, but more or fewer air bearings and magnets may be used. Using the air bearings (202.1 to 202.3) and magnets (204.1 to 204.3), the microscope camera (118) can be held by magnetically pre-loaded air bearings. That is, the air within the air bearings (202.1 to 202.3) can be turned on to separate the magnetic holding and move the microscope camera (118) to its designated position, and then the air can be turned off to hold the microscope camera in place using the magnets (204.1 to 204.3).

[0026] FIG. 3 shows a simplified block diagram of the components of a microscope camera (118). The microscope camera (118) may include a microscope objective lens (302) having a low NA as described herein, an optical system (304) having a fold mirror (306.1 to 306.2) and a lens (308.1 to 308.2), a camera (310), and an illuminator (312). The microscope objective lens (302) may provide an NA of 0.15 or less for the microscope camera. The illuminator (312) may provide brightfield and / or darkfield LED illumination. The camera (310) may be provided as an image sensor such as a CMOS or CCD sensor. In some examples, the camera (310) may be provided as an infrared sensor such as an InGaAs sensor.

[0027] The camera (310) can be coupled to a processor (313) including a vision system module (314) and an image analysis module (316). The processor (313) can process the image generated by the camera and analyze the image to detect and determine the position of a reference point. The processor (313) can determine the position of the reference point by executing machine vision and edge detection algorithms. Alignment correction information can be calculated based on the positions of different reference points associated with multiple cameras. Based on the alignment correction, the stage (106) can be moved by a stage control servo (318) to adjust the position of the substrate prior to the exposure of each exposure area.

[0028] Alignment correction information can also be used to adjust its components by the projection system (102) as described above before exposure of each exposure area. Alignment correction information can be used to adjust x, y offset, θ, magnification, etc.

[0029] FIG. 4 shows an exemplary portion of a stage (106) having a substrate (108). The substrate (108) can be held in place on the stage (106) using an edge clamp (402). For example, a four-sided edge clamping mechanism may be used. The stage (106) may also include interferometer mirrors (404.1 to 404.2) for providing laser interferometer position feedback for stage movement. As previously described, the stage (106) can move in the x, y, and θ directions. A measurement sensor (406) may also be provided and may be used for system calibration.

[0030] FIG. 5 illustrates a substrate (108) having multiple exposed areas. In this example, the substrate (108) may have four exposed areas (labeled 1 to 4) separated by a copper material for mechanical handling. The substrate (108) may have a different number of exposed areas, and the four exposed areas are described only for illustrative purposes; a different number of exposed areas may be provided. Each exposed area may have multiple reference points (alignment marks). In this example, each exposed area may have four reference points corresponding to four microscope cameras of an alignment system. The reference points may be located at the corners of the exposed areas on the top surface of the substrate (108). Examples of reference points include cross shapes, drill holes, drill hole patterns, etc.

[0031] In some examples, the reference point may be located on the bottom surface of the substrate or on an intermediate layer of the substrate. In these examples, the microscope camera may include an infrared sensor, as described above, to detect the reference point.

[0032] FIG. 6 illustrates a flowchart for a method (600) for photolithographic processing using alignment. For example, the method can be performed using a photolithography machine (100) on a substrate (108) having four exposed areas as described above.

[0033] In operation 602, the photolithographic machine can be calibrated and initialized. For example, instructions for manufacturing (e.g., a recipe) can be retrieved and loaded. The instructions may include information such as the manufacturing layout, exposure time, size of each exposure area, number of exposure areas, layout of the exposure areas, location of reference points, etc. Instructions for different reticle patterns may be pre-stored in memory associated with a controller associated with the photolithographic machine, and instructions for a specific reticle(s) may be retrieved based on the loaded reticle. Based on the instructions, the microscope camera of the alignment system may be moved in the x,y direction to match the reference point position specified in the recipe.

[0034] In operation 604, the substrate can be loaded onto the machine. For example, a loading robot can place the substrate on the stage. The substrate can be clamped in place using an edge clamp.

[0035] Next, an alignment process may be initiated for each exposure area. In operation 606, the stage may be moved so that the alignment system is over the first exposure area. In operation 608, each microscope camera may take or capture an image of its respective reference point within the first exposure area. For example, the reference point may be located at a corner of the exposure area, and each microscope camera may take an image of its respective corner of the first exposure area. The microscope camera has a low NA as described herein, and thus no z-axis focus adjustment is required. The z-position of the microscope camera is fixed. The microscope camera may have a fixed focus.

[0036] In operation 610, the stage can be moved so that the alignment system is over the second exposure area. In operation 612, each microscope camera can take an image of its respective reference point within the second exposure area.

[0037] In operation 614, the stage can be moved so that the alignment system is over the third exposure area. In operation 616, each microscope camera can take an image of its respective reference point within the third exposure area.

[0038] In operation 618, the stage can be moved so that the alignment system is over the fourth exposure area. In operation 620, each microscope camera can take an image of its respective reference point within the fourth exposure area.

[0039] In operation 622, alignment information for each exposure area can be calculated based on an image taken in each exposure area. Based on the information extracted from the image, the position of the reference point can be determined and compared with a specified position in the recipe.

[0040] In operation 624, alignment correction information can be calculated and stored for each exposure area. As described above, the alignment correction information may be related to the stage position and projection system settings for each exposure area. For example, a regression algorithm may be used to determine the alignment correction information.

[0041] Next, an exposure process may be initiated. In operation 626, patterns on different regions may be manufactured using alignment information for their respective exposure regions. For example, a stage is moved so that a first exposure region is provided under a projection system, and alignment correction is performed for each exposure region based on alignment correction information for the corresponding exposure region. Then, the projection system may project an image on the reticle to manufacture a pattern on the image on the first exposure region of the substrate. Then, the exposure process continues to another region.

[0042] In some embodiments, exposure may be applied in a different order from the alignment process to minimize stage movement. For example, the alignment process is performed in the order of exposure areas 1→2→3→4, while the exposure process is performed in the order of exposure areas 3→4→1→2 (see FIG. 5).

[0043] After all exposed areas are manufactured, the stage is moved to an unload position, the substrate is released, and unloaded in operation 628. For example, a loading robot can remove the substrate from the stage. Another substrate can be loaded into the machine, and the method can be repeated (e.g., performing alignment and exposure processes).

[0044] The techniques illustrated and described herein may be performed using part or all of a photolithographic machine as illustrated in FIGS. 1a through 1c, or otherwise may be performed using a machine (700) as discussed below in relation to FIG. 7. FIG. 7 illustrates a block diagram of an example comprising a machine (700) on which any one or more of the techniques (e.g., methodologies) discussed herein may be performed. In various examples, the machine (700) may operate as a standalone device or may be connected to other machines (e.g., networked).

[0045] In a networked deployment, the machine (700) may operate as a server machine, a client machine, or both in a server-client network environment. In example, the machine (700) may act as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. The machine (700) may be a personal computer (PC), a tablet device, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a network router, a switch or a bridge, or any machine capable of executing commands (sequentially or otherwise) that specify the action to be taken by said machine. Furthermore, although only a single machine is exemplified, the term “machine” should also be considered to include any collection of machines that execute a set (or multiple sets) of commands individually or jointly to perform any one or more of the methodologies discussed herein, such as cloud computing, software as a service (SaaS), or other computer cluster configurations.

[0046] An example may include logic or a number of components or mechanisms, or be operated by them, as described herein. A circuit is a collection of circuits implemented as a tangible entity that includes hardware (e.g., simple circuits, gates, logic, etc.). The circuit membership may be flexible over time and with respect to the underlying hardware variability. A circuit includes members capable of performing a specified operation, either alone or in combination, when operated. In an example, the hardware of the circuit may be designed immutably to perform a specific operation (e.g., may be hardwired). In one example, the hardware including the circuit may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.) that include a computer-readable medium that is physically modified (e.g., magnetically, electrically, through changes in physical state or other physical characteristics, etc.) to encode instructions for a specific operation. In connecting the physical components, the underlying electrical characteristics of the hardware components may be changed, for example, from insulating characteristics to conductive characteristics or vice versa. Instructions enable the creation of members of a circuit in the hardware via variable connections to perform part of a specific operation while the embedded hardware (e.g., an execution unit or a loading mechanism) is in operation. Thus, a computer-readable medium is coupled to communicate with other components of the circuit while the device is in operation. In one example, any of the physical components may be used in more than one member of more than one circuit. For example, during operation, an execution unit may be used in the first circuit of the first circuit at one time and may be reused by the second circuit within the first circuit or by the third circuit within the second circuit at different times.

[0047] A machine (700) (e.g., a computer system) may include a hardware-based processor (701) (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), main memory (703), and static memory (705), some or all of which may communicate with each other via an interlink (730) (e.g., a bus). The machine (700) may further include a display device (709), an input device (711) (e.g., an alphanumeric keyboard), and a user interface (UI) navigation device (713) (e.g., a mouse). In one example, the display device (709), the input device (711), and the UI navigation device (713) may include at least a portion of a touch screen display. The machine (700) may additionally include a storage device (720) (e.g., a drive unit), a signal generating device (717) (e.g., a speaker), a network interface device (750), and one or more sensors (715), such as a GPS (global positioning system) sensor, a compass, an accelerometer, or other sensors. The machine (700) may include a serial controller or interface (e.g., a universal serial bus (USB)), a parallel controller or interface, or other wired or wireless (e.g., an infrared (IR) controller or interface, near-field communication (NFC), etc.) coupled to communicate with or control one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0048] The storage device (720) may include a machine-readable medium in which one or more sets of data structures or instructions (724) (e.g., software or firmware) that implement or utilize any one or more of the techniques or functions described herein are stored. The instructions (724) may also reside, wholly or at least partially, in the main memory (703), in static memory (705), in the mass storage device (707), or in the hardware-based processor (701) during execution by the machine (700). In the example, one of the hardware-based processor (701), the main memory (703), the static memory (705), or the storage device (720), or any combination thereof, may constitute the machine-readable medium.

[0049] Although the machine-readable medium is considered as a single medium, the term “machine-readable medium” may include a single medium or multiple media configured to store one or more instructions (724) (e.g., a centralized or distributed database, and / or associated cache and server).

[0050] The term “machine-readable medium” may include any medium capable of storing, encoding, or carrying instructions for execution by a machine (700), causing the machine (700) to perform one or more of the techniques of the present disclosure, or storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media may include solid-state memory, and optical and magnetic media. Thus, a machine-readable medium is not a transient propagating signal. Specific examples of a large number of machine-readable media may include: non-volatile memory such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic or other phase-shifting or state-shifting memory circuits; magnetic disks such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0051] The command (724) may also be transmitted or received through a communication network (721) using a transmission medium through a network interface device (750) utilizing any one of a number of transfer protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Exemplary communication networks may include, among others, a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), a mobile phone network (e.g., a cellular network), a Plain Old Telephone (POTS) network, and a wireless data network (e.g., the Institute of Electrical and Electronics Engineers (IEEE) 802.22 standard family known as Wi-Fi®, the IEEE 802.26 standard family known as WiMax®), the IEEE 802.27.4 standard family, and a peer-to-peer (P2P) network. In the example, the network interface device (750) may include one or more physical jacks (e.g., Ethernet, coaxial, or phone jack) or one or more antennas for connecting to a communication network (721). In the example, the network interface device (750) may include a plurality of antennas for communicating wirelessly using at least one of SIMO (single-input multiple-output), MIMO (multiple-input multiple-output), or MISO (multiple-input single-output) techniques.The term “transmission medium” should be considered to include any intangible medium capable of storing, encoding, or carrying instructions for execution by the machine (700), and includes digital or analog communication signals or other intangible media to facilitate communication of such software.

[0052] Various references

[0053] Each of the above non-limiting modes may exist independently or may be combined in various permutations or combinations with one or more of the other modes or other subjects described in this document.

[0054] Specific details for carrying out the above invention include reference to the accompanying drawings, which form part of the specific details for carrying out the invention. The drawings illustrate, as examples, specific embodiments in which the invention may be carried out. Such embodiments are also generally referred to as “Examples.” Such Examples may include elements in addition to the elements illustrated or described. However, the inventors also consider examples in which only such elements illustrated or described are provided. Furthermore, the inventors also consider examples using any combination or permutation of such elements illustrated or described (or one or more of such embodiments) in connection with a specific example (or one or more of its embodiments) illustrated or described herein, or in connection with another example (or one or more of its embodiments).

[0055] In the event of any inconsistency in usage between this document and any document included by reference, the usage in this document shall prevail.

[0056] In this document, the term “indefinite article (a or an)” is used to include one or more than one, regardless of any other instance or usage of “at least one” or “one or more,” as is common in patent documents. In this document, the term “or” is used to refer to a nonexclusive or, and accordingly, “A or B” includes “A but not B,” “B but not A,” and “A and B” unless otherwise indicated. In this document, the terms “including” and “in which” are used as plain English equivalents of the terms “comprising” and “wherein,” respectively. Furthermore, in the following embodiments, the terms “including” and “in which” are open, that is, a system, device, article, composition, formulation, or process including an element in addition to the element listed after such term in the embodiment is still considered to be within the scope of that embodiment. Furthermore, in the following modalities, the terms "first," "second," and "third," etc., are used merely as indicators and are not intended to impose numerical requirements on the object thereof.

[0057] Examples of methods described herein may be implemented at least partially by machine or computer. Some examples may include a computer-readable medium or a machine-readable medium encoded with operable instructions to configure an electronic device to perform the method described in the examples above. Examples of such methods may include code such as microcode, assembly language code, high-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Additionally, in the examples, the code may be tangibly stored on one or more volatile, non-transient, or non-volatile tangible computer-readable media, for example, during execution or at other times. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), etc.

[0058] The foregoing description is intended to be illustrative rather than limiting. For example, the examples (or one or more of their embodiments) described above may be used in combination with one another. For instance, other embodiments may be used by those skilled in the art at the time of reviewing the foregoing description. The abstract is provided to enable readers to quickly ascertain the essence of the technical disclosure. It is submitted with the understanding that it is not intended to be used to interpret or limit the scope or meaning of the embodiments. Furthermore, in the specific details for carrying out the invention described above, various features may be grouped together to simplify the disclosure. This should not be interpreted as intended to imply that any unclaimed disclosed features are essential to any claim. Rather, the subject matter of the invention may be less than all features of a specific disclosed embodiment. Accordingly, it is considered that the following embodiments are included in the specific details for carrying out the invention as examples or embodiments in which each embodiment exists independently as a distinct embodiment, and that such embodiments may be combined with one another in various combinations or permutations.

Claims

Claim 1 A photolithography machine having high-speed alignment, comprising: a stage for holding and moving a substrate; a projection system for projecting an image onto a plurality of exposed areas of the substrate; and an alignment system positioned adjacent to the projection system, wherein the alignment system comprises a plurality of microscope cameras having a fixed focus, each microscope camera comprises a single microscope objective lens providing a single fixed focus position, each microscope camera is configured to detect a respective fiducial within its respective exposed area of ​​the substrate, and each of the plurality of microscope cameras is configured to detect fiducials at different heights between the stage and the plurality of microscope cameras using its respective fixed focus. Claim 2 A photolithography machine according to claim 1, wherein at least one of the plurality of microscope cameras has a numerical aperture of 0.15 or less. Claim 3 A photolithography machine according to claim 1, wherein each of the plurality of microscope cameras comprises a CMOS image sensor or an infrared sensor. Claim 4 delete Claim 5 A photolithography machine according to claim 1, wherein the plurality of microscope cameras comprises four microscope cameras arranged in a rectangular shape. Claim 6 A photolithography machine according to claim 1, further comprising at least one air bearing and at least one magnet for positioning the plurality of microscope cameras. Claim 7 A photolithography machine according to claim 1, further comprising a processor for receiving images from a plurality of microscope cameras, determining the position of a reference point based on the images, and determining alignment correction information, wherein the processor determines the position of the reference point using machine vision and an edge detection algorithm, wherein the stage is configured to move based on the position of the reference point, and at least one component of the projection system is adjusted based on the alignment correction information. Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 An alignment system for a photolithography machine, comprising: a support structure positioned adjacent to a projection system of the photolithography machine; and a plurality of microscope cameras coupled to the support structure having a fixed focus, wherein each microscope camera comprises a single microscope objective lens providing a single fixed focus position, each microscope camera is configured to detect a reference point within its respective exposure area of ​​a substrate, and each of the plurality of microscope cameras is configured to detect reference points at different heights between a stage and the plurality of microscope cameras using its respective fixed focus. Claim 19 An alignment system according to claim 18, wherein at least one of the plurality of microscope cameras has an aperture of 0.15 or less. Claim 20 An alignment system according to claim 18, wherein each of the plurality of microscope cameras comprises a CMOS image sensor or an infrared sensor. Claim 21 delete Claim 22 In claim 1, a photolithography machine in which each microscope camera has an numerical aperture of 0.15 or less. Claim 23 A photolithography machine according to claim 1, wherein the alignment system is configured to capture reference point images of a plurality of regions, alignment information is generated for each region of the plurality of regions based on the reference point images, and the projection system is configured to project the images onto each region of the plurality of regions based on their respective alignment information after all reference point images of the plurality of regions have been captured. Claim 24 delete Claim 25 In paragraph 18, an alignment system in which each microscope camera has an numerical aperture of 0.15 or less. Claim 26 In claim 18, the alignment system is configured to capture reference point images of a plurality of regions, alignment information is generated for each region of the plurality of regions based on the reference point images, and the projection system is configured to project the images onto each region of the plurality of regions based on their respective alignment information after all reference point images of the plurality of regions have been captured.

Images