Magnetic rod assembly for circuit board cutting device

KR301359856SActive Publication Date: 2026-08-11KONIC SEMITECH CO LTD
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Patent Information

Application Number
KR3020250028115
Authority / Receiving Office
KR · KR
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-07-21
Publication Date
2026-08-11
Estimated Expiration
2045-07-21

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Description

Draw 15 The item that is the subject of the design Magnetic rod assembly for circuit board cutting device Description of the design 1. The material is synthetic resin or metal. 2. The present design is a magnetic rod assembly installed in a device for cutting substrates such as wafers, PCBs, and panels, for removing magnetic materials such as iron filings generated during the cutting process. 3. Drawing 1 is a drawing showing the overall shape of the present invention's design. 4. Drawing 2 is a drawing showing the front view of the present design. 5. Drawing 3 is a drawing showing the back side of the present design. 6. Drawing 4 is a drawing showing the left side of the present design. 7. Drawing 5 is a drawing showing the right side of the present design. 8. Drawing 6 is a drawing showing the plan of the present design. 9. Drawing 7 is a drawing showing the bottom surface of the present design. 10. Reference Drawing 1 is a drawing illustrating the usage state of the present design. Key points of the design creation The key point of the design creation is the combination of the shape and form of the "magnetic rod assembly for a substrate cutting device."