Heat sink with scraped fins and integrated pulsating heat pipe

LU509793B1Active Publication Date: 2026-07-24SIEMENS AG
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Patent Information

Application Number
LU509793
Authority / Receiving Office
LU · LU
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-01-24
Publication Date
2026-07-24
Estimated Expiration
2045-01-24
Patent Text Reader

Abstract

The invention relates to a method for manufacturing a heat sink (10), comprising the steps of: - manufacturing a first component (1) from a first metallic material, such that the first component (1) comprises a contact surface (3) for a component (12) to be cooled and a mounting surface (4) for a second component (2), wherein a cavity structure (HS) is incorporated into the mounting surface (4), which later receives a working medium (7), - manufacturing the second component (2) from a second metallic material, such that the second component (1) has a cover surface (5) for the mounting surface (4) and a ribbed surface (6), wherein the second component (2) is designed such that, in a machining step for manufacturing a plurality of cooling fins (F) projecting from the ribbed surface (6), a material thickness (MS) above the cover surface (5) is sufficiently dimensioned.the cooling fins (F) are scraped out of the material of the second component (2) using the skiving process, - joining the cover surface (5) onto the mounting surface (4), wherein the processing step for the production of a large number of cooling fins (F) is optionally carried out before or after joining.
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Citation Information

Patent Citations

  • Semiconductor module assembly comprising a heat sink and at least one semiconductor module

    EP4071801A1

  • Method for manufacturing phase change type heat sink

    US20070261242A1