Heat sink with scraped fins and integrated pulsating heat pipe
LU509793B1Active Publication Date: 2026-07-24SIEMENS AG
2 Cites 0 Cited by
Patent Information
- Application Number
- LU509793
- Authority / Receiving Office
- LU · LU
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2045-01-24
Abstract
The invention relates to a method for manufacturing a heat sink (10), comprising the steps of: - manufacturing a first component (1) from a first metallic material, such that the first component (1) comprises a contact surface (3) for a component (12) to be cooled and a mounting surface (4) for a second component (2), wherein a cavity structure (HS) is incorporated into the mounting surface (4), which later receives a working medium (7), - manufacturing the second component (2) from a second metallic material, such that the second component (1) has a cover surface (5) for the mounting surface (4) and a ribbed surface (6), wherein the second component (2) is designed such that, in a machining step for manufacturing a plurality of cooling fins (F) projecting from the ribbed surface (6), a material thickness (MS) above the cover surface (5) is sufficiently dimensioned.the cooling fins (F) are scraped out of the material of the second component (2) using the skiving process, - joining the cover surface (5) onto the mounting surface (4), wherein the processing step for the production of a large number of cooling fins (F) is optionally carried out before or after joining.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Semiconductor module assembly comprising a heat sink and at least one semiconductor module
EP4071801A1
Method for manufacturing phase change type heat sink
US20070261242A1