Laminating method for a multilayer flexible printed circuit board

Abstract

Disclosed is a lamination method for multilayer flexible circuit boards, comprising: laminating the multilayer flexible circuit board using a vacuum hot press process, wherein the vacuum hot press process implements intelligent gradient pressing based on temperature field simulation; Executing the pressing process according to a preset temperature gradient and pressure curve while maintaining vacuum pressure below a predetermined threshold throughout the entire process; Controlling the flowability of the prepreg within a preset range through the intelligent gradient pressing.