Multifunctional process for the metallization of polymethyl methacrylate (PMMA) surfaces

Abstract

The invention proposes an integrated and innovative process for the metallization of polymethyl methacrylate (PMMA) substrates by combining mechanical, chemical, and electrochemical techniques. The process begins with mechanical polishing of the PMMA to improve surface roughness and adhesion. This is followed by chemical etching using hydrogen peroxide in sulfuric acid to increase surface reactivity. A layer of a conductive polymer-based coating is then deposited onto the etched PMMA. The polymer's conductivity is further enhanced by the incorporation of silver particles and electrochemical doping, and finally, metallization is performed by electrodeposition in baths containing metal ions. This process results in metallized PMMA substrates exhibiting significantly improved adhesion, conductivity, and functionality. Metallized PMMA finds advanced applications requiring high-performance, durable, and conductive materials.