CONTACTLESS DEPOSITING SYSTEMS INCLUDING JET ASSEMBLIES

Abstract

A contactless deposition system comprises a jet assembly that includes at least one micro-valve. The micro-valve includes an orifice plate that defines an orifice through it. An actuating beam is positioned at intervals within the orifice plate. The actuating beam includes a base portion and a cantilever portion that extends from the base portion into the orifice and is movable between a closed and an open position. A sealing structure comprising a sealing member is positioned on the overlapping portion of the cantilever portion. A fluid collector is coupled to the micro-valve and defines a fluid reservoir containing a pressurized fluid.When the drive beam is in the closed position, the cantilevered portion is positioned so that the sealing structure seals the orifice to close the micro-valve, and in the open position, the fluid is dispensed from the orifice into a substrate and deposited therein.

Description

CONTACTLESS DEPOSITING SYSTEMS INCLUDING JET ASSEMBLIES Cross-reference to Related Requests

[0001] This application claims priority over the United States provisional application Serial Number 62 / 929,271 filed on November 1, 2019, the contents of which are incorporated herein by reference in their entirety. Field of Invention

[0002] This description refers generally to the field of micro-valves manufactured using micro-electromechanical system (MEMS) techniques. More specifically, this description refers to contactless deposition systems, including a jet assembly that incorporates MEMS micro-valves. Background of the Invention

[0003] Conventional dispensing and deposition systems have many disadvantages. For example, in biological or biomedical applications, solutions containing chemical, biochemical, or biological molecules are generally deposited manually onto a substrate using pipettes. Automated systems have been developed that are capable of simultaneously pipetting multiple solutions onto a substrate. However, these systems still generally use pipette tips, the orifices of which are exposed to air even when solutions are not being deposited. Other deposition systems, such as microarray printing assemblies, make contact with the substrate and deposit fluids using the fluid's surface tension. Such deposition assemblies suffer from inaccuracies in droplet size and volume and must be evaporated in controlled environments to prevent solvent evaporation.

[0004] Similar disadvantages also exist in deposition systems used for printing or marking. For example, continuous inkjet printers have certain shortcomings that are difficult to eliminate. The process of generating droplets from an ink supply, for instance, can lead to ink runoff in an undesired direction (e.g., away from a target), requiring maintenance. Additionally, the composition fluid is lost over time as a result of evaporation, necessitating continuous refilling. Other maintenance costs, such as orifice plate repair due to degradation, would also be incurred. Furthermore, the orifice or opening from which the fluids are expelled generally remains open to the air, which can cause solvent evaporation, resulting in blockages and, eventually, failure of conventional deposition systems.

[0005] Finally, when the fluid to be dispensed is a gas such as air, the systems of Conventional gas dispensing and deposition devices or valves capable of controlling gas dispensing are large and physically heavy, require excessive electrical power, and sometimes fail due to mechanical problems with their various components. For these and other reasons, there is a need to improve dispensing and deposition devices. Brief Description of the Invention

[0006] The modalities described herein refer generally to non-contact deposition systems and, in particular, to systems that include a jet assembly comprising a micro-valve. The micro-valve comprises an orifice defined in an orifice plate and an actuating rod, which can remain in a closed position in its initial position to seal the orifice, and opens selectively to eject and deposit fluid onto a substrate.

[0007] In some embodiments, a contactless deposition system comprises a jet assembly comprising at least one micro-valve. Each micro-valve comprises an orifice plate including a first surface and a second surface. The orifice plate comprises an orifice extending from the first surface to the second surface. A spacer member is positioned on the first surface and offset from the orifice. A valve seat surrounds the orifice and defines an opening in fluid communication with the orifice. An actuator rod is positioned on the spacer member and extends from the spacer member into the orifice. The actuator rod comprises a layer of piezoelectric material and is movable between a closed position and an open position by applying an electrical signal to the piezoelectric layer.A sealing member is positioned at one end of the actuator rod. A fluid collector is coupled to the micro-valve and defines a fluid reservoir containing pressurized fluid around the actuator rod. When the piezoelectric material layer is not receiving an electrical signal, the actuator rod is in the closed position, and a sealing member surface contacts the orifice plate to seal the orifice and close the micro-valve. In the open position, the fluid is expelled from the orifice onto a substrate and deposited there.

[0008] In another embodiment, the contactless deposition system further comprises: a platform spaced from the jet assembly and configured to receive a substrate on which the fluid is to be deposited; and a motion mechanism coupled to at least one of the jet assembly or the platform and configured to provide three-dimensional motion to the jet assembly or the platform to deposit the fluid at a predetermined location on the substrate.

[0009] In another embodiment, the substrate comprises a cartridge for histopathology and wherein the fluid comprises a cell stain.

[0010] In another embodiment, the substrate comprises a circuit board, and where the fluid ML / comprises a conductive fluid, a semiconducting fluid, or a piezoelectric fluid.

[0011] In another embodiment, the substrate comprises a ceramic mosaic, machined or laminated wood mosaic and wherein the fluid comprises at least one conductive ink, paint, a nanocoating, or antimicrobial coating. [ 0012 ] In another embodiment, the substrate comprises a slide and wherein the fluid comprises a solution of at least one of chemicals, biochemicals or biomolecules, and wherein the non-contact deposition system is configured to deposit an arrangement of droplets of the solution onto the slide. [ 0013 ] In another embodiment, the substrate comprises a microwell plate defining a plurality of microwells, and wherein the fluid comprises a solution of at least one chemical, biochemical or biological molecules, and wherein the non-contact deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

[0014] In another embodiment, the fluid comprises a polymer and wherein the non-contact deposition system is configured to deposit a plurality of layers of the polymer to form a three-dimensional object having a predetermined shape.

[0015] In another embodiment, the contactless deposition system further comprises: an interposition coil placed in and coupled to the fluid manifold; and a carrier placed in and coupled to the interposition coil such that the orifice plate, fluid manifold, interposition coil, and carrier collectively define a boundary of the fluid reservoir, the carrier further defining a first fluid channel configured to distribute a first fluid to the fluid reservoir.

[0016] In another embodiment, the carrier further comprises a second fluid channel configured to distribute a second fluid different from the first fluid to the fluid reservoir.

[0017] In another embodiment, the jet assembly is configured to selectively distribute the first fluid, the second fluid, or a mixture comprising the first and second fluids through the orifice, the mixture being formed within the fluid reservoir.

[0018] In another embodiment, the substrate comprises artificial or real nails wherein the first fluid comprises a first nail color and the second fluid comprises a second nail color.

[0019] In another embodiment, the substrate comprises a mixing paddle, and the first fluid and the second fluid comprise at least one of a powder, a liquid, or a gel.

[0020] In another embodiment, the carrier defines an internal volume, and a compressible fluid container holding the fluid is placed within the internal volume.

[0021] In another embodiment, the internal volume of the carrier is filled with a compressed gas, the compressed gas is configured to exert a pressure on the compressible fluid container, the pressure causes the fluid to be communicated through the fluid channel to the fluid reservoir. ML /

[0022] In another embodiment, a thrust member is placed within the internal volume; the thrust member is configured to exert pressure on the compressible fluid container; the pressure causes the fluid to be communicated through the fluid channel to the fluid reservoir.

[0023] In another embodiment, the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension. [ 0024 ] In another embodiment, the fluid includes a volatile fluid or an air-sensitive fluid, and wherein the jet assembly is structured to limit the exposure of the fluid to air present in an environment outside the jet assembly.

[0025] In another modality, an arrangement of holes is defined on the hole plate.

[0026] In another form, the arrangement comprises a rectangular arrangement, a square arrangement, a semicircular arrangement, an elliptical arrangement, a polygonal arrangement, or an asymmetrical arrangement. [ 0027 ] In another embodiment, the drive rod comprises a non-active portion, a setting layer, and a drive portion that includes said at least one layer of piezoelectric material, wherein the setting layer has a predetermined setting stress such that in the closed position, the sealing member makes contact and exerts a force on the valve seat to fluidly seal the orifice.

[0028] In another modality, the fluid is a gaseous fluid.

[0029] In another modality, there is a haptic interface device comprising the contactless deposition system of any of the modalities described above herein.

[0030] In some embodiments, a contactless deposition system comprises a jet assembly comprising at least one micro-valve. The at least one micro-valve comprises an orifice plate including a first surface and a second surface. The orifice plate includes an orifice extending from the first surface to the second surface. An actuator rod is positioned in a spaced relationship with the orifice plate. The actuator rod includes a base portion and a cantilever portion. The cantilever portion extends from the base portion into the orifice such that an overlapping portion of the cantilever portion overlaps the orifice. The actuator rod is movable between a closed position and an open position. A sealing structure comprising a sealing member is positioned on the overlapping portion of the cantilever portion.A fluid collector is coupled to the micro-valve and defines a fluid reservoir containing pressurized fluid around the actuator rod. When the actuator rod is in the closed position, the cantilevered portion is positioned so that the sealing structure seals the orifice to close the micro-valve. In the open position, the fluid is dispensed from the orifice onto a substrate and deposited there. MA /

[0031] In another embodiment, the drive bar comprises a layer of a piezoelectric material; the drive bar is movable between the closed position and the open position in response to an electrical signal that is applied to the piezoelectric material.

[0032] In another modality, no electrical signal is applied to the piezoelectric material when the microvalve is in the closed position. [ 0033 ] In another embodiment, the contactless deposition system further comprises: a platform spaced from the jet assembly and configured to receive the substrate; and a motion mechanism coupled to at least one of the jet assembly or the platform and configured to provide three-dimensional motion to the jet assembly or the platform to deposit the fluid at a predetermined location on the substrate. [ 0034 ] In another modality, the substrate comprises a cartridge for histopathology and wherein the fluid comprises a cell stain.

[0035] In another embodiment, the substrate comprises a circuit board, and wherein the fluid comprises a conductive fluid, a semiconducting fluid, or a piezoelectric fluid.

[0036] In another embodiment, the substrate comprises a fabric, a ceramic mosaic, a machined wood mosaic or laminate and wherein the fluid comprises at least one conductive ink, paint, a nanocoating, or antimicrobial coating. [ 0037 ] In another embodiment, the substrate comprises a slide and wherein the fluid comprises a solution of at least one of chemicals or biomolecules, and wherein the contactless deposition system is configured to deposit an arrangement of droplets of the solution onto the slide.

[0038] In another embodiment, the substrate comprises a microwell plate defining a plurality of microwells, and wherein the fluid comprises a solution of at least one chemical, biochemical or biological molecules, and wherein the non-contact deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

[0039] In another embodiment, the fluid comprises a polymer and wherein the non-contact deposition system is configured to deposit a plurality of layers of the polymer to form a three-dimensional object having a predetermined shape.

[0040] In another embodiment, the contactless deposition system further comprises: an interposition coil positioned in and coupled to the fluid manifold; and a carrier positioned in and coupled to the interposition coil such that the orifice plate, fluid manifold, interposition coil, and carrier collectively define a fluid reservoir boundary, the carrier further defining a first fluid channel configured to distribute a first fluid to the fluid reservoir.

[0041] In another embodiment, the carrier further comprises a second fluid channel configured MA / to distribute a second fluid, different from the first fluid, to the fluid reservoir.

[0042] In another embodiment, the jet assembly is configured to selectively distribute the first fluid, the second fluid, or a mixture comprising the first and second fluids through the orifice, the mixture being formed within the fluid reservoir.

[0043] In another embodiment, the substrate comprises artificial or real nails, and wherein the first fluid comprises a first nail color and the second fluid comprises a second nail color.

[0044] In another embodiment, the substrate comprises a mixing paddle, and wherein the first fluid and the second fluid comprise at least one of a powder, a liquid, or a gel.

[0045] In another modality, the carrier defines an internal volume, and a compressible fluid container that holds the fluid placed within the internal volume.

[0046] In another embodiment, the internal volume of the carrier is filled with a compressed gas, the compressed gas is configured to exert a pressure on the compressible fluid container, the pressure causes the fluid to be communicated through the fluid channel to the fluid reservoir.

[0047] In another embodiment, there is a thrust member placed within the internal volume, the thrust member is configured to exert pressure on the compressible fluid container, causing the pressure to communicate the fluid through the fluid channel to the fluid reservoir.

[0048] In another embodiment, the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

[0049] In another embodiment, the fluid includes a volatile fluid or an air-sensitive fluid, and wherein the jet assembly is structured to limit the exposure of the fluid to air present in an environment outside the jet assembly.

[0050] In another modality, an arrangement of holes is defined in the hole plate.

[0051] In another form, the arrangement comprises a rectangular arrangement, a square arrangement, a circular arrangement, a semicircular arrangement, an elliptical arrangement, a polygonal arrangement, or an asymmetrical arrangement.

[0052] In another embodiment, the drive bar comprises a non-active portion, a setting layer, and a drive portion that includes said at least one layer of piezoelectric material, wherein the setting layer has a predetermined setting stress such that in the closed position, the sealing member makes contact and exerts a force on the hole to fluidly seal the hole.

[0053] In another embodiment the micro-valve further comprises a valve seat that surrounds the orifice, the valve seat defining an opening in fluid communication with the orifice. [ 0054 ] In another modality, the fluid is a gaseous fluid.

[0055] In another modality, there is a haptic interface device comprising the contactless deposition system of any of the modalities described above herein.

[0056] It should be understood that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are considered to be part of the disclosed inventive matter. In particular, all combinations of the claimed subject matter appearing at the end of this description are considered to be part of the disclosed inventive matter herein. Brief Description of the Figures

[0057] The foregoing and other features of the present description will be more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. It being understood that these drawings only represent many implementations according to the description and are therefore not considered limiting of its scope, the description will be further specified and detailed by means of the accompanying drawings.

[0058] Figure 1 is a perspective view of a jet assembly placed in a fastener, according to one example modality.

[0059] Figure 2 is an exploded view of the jet assembly shown in Figure 1.

[0060] Figure 3 is a schematic cross-sectional view of the jet assembly shown in Figure 1.

[0061] Figure 4A-4B is a plan view of the jet assembly shown in Figure 1.

[0062] Figure 5A is a cross-sectional view of a jet assembly including a micro-valve, according to one example embodiment.

[0063] Figure 5B is a cross-sectional view of a jet assembly including a micro-valve, according to one example modality. [ 0064 ] Figure 6 is a cross-sectional view that provides a more detailed view of the jet assembly shown in Figures 5A-5B.

[0065] Figure 7A is a cross-sectional view of a micro-valve actuator rod, according to one example embodiment. Figure 7B is a front cross-sectional view of the actuator rod of Figure 7A, according to another example embodiment.

[0066] Figure 8 is a schematic illustration of a contactless deposition system, according to one modality.

[0067] Figures 9-14 are schematic illustrations of substrates and fluids deposited on such substrates by means of the system in Figure 8, according to different modalities.

[0068] Figure 15 is a schematic illustration of a jet assembly that can be used ML / in the contactless deposition system of Figure 8, according to a modality.

[0069] Figures 16-18 are schematic illustrations of jet assemblies that can be used in the contactless deposition system of Figure 8, according to different modalities. [ 0070 ] Figures 19-23 are schematic illustrations of orifice plates that define arrangements of holes of different shapes through them, according to different modalities.

[0071] Figure 24 is a schematic illustration of the contactless deposition system of Figure 8 for depositing fluids onto a microwell plate, according to one modality.

[0072] In the drawings, similar symbols generally identify similar components, unless the context dictates otherwise. The illustrative implementations described in the detailed description, drawings, and claims are not intended to be limiting. Other implementations may be used, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that the aspects of the present description described herein and illustrated in the figures may be accommodated, substituted, combined, and designed into a variety of different configurations, all of which may be contemplated and form part of this description. Detailed Description of the Invention

[0073] The modalities described herein refer generally to non-contact deposition systems and, in particular, to systems that include a jet assembly comprising a micro-valve. The micro-valve comprises an orifice defined in an orifice plate and an actuating rod, which can remain in a closed position in its initial position to seal the orifice, and opens selectively to eject and deposit fluid onto a substrate.

[0074] Before referring to the figures, which illustrate the example modalities in detail, it should be understood that this application is not limited to the details or methodology set forth in the description or illustrated in the figures. It should also be understood that the terminology is for descriptive purposes only and should not be considered a limitation.

[0075] With reference to the figures in general, this document describes jet assemblies that include multiple micro-valves, and contactless deposition systems that include such jet assemblies. The micro-valves described herein employ an actuator rod having a sealing member located thereon. The use of such an actuator rod allows the micro-valve to be adjusted to eliminate or reduce various shortcomings associated with conventional technologies, including continuous jet assemblies. For example, in different embodiments, the micro-valve includes a spacing member located between the actuator rod and the orifice plate. The actuator member maintains a spacing between a first end of the actuator rod and an orifice within the orifice plate to prevent damping of the compression film of the rod. MA / Actuation. The actuating rod extends over the orifice from the spacing member, and a sealing member extends into the orifice to contact the orifice directly or otherwise contact a valve seat, which may be located on the periphery or edge of the orifice. Thus, without the application of any electrical energy to the actuating rod, the sealing member seals the orifice. In other words, the starting position of the actuating rod (e.g., configured by carefully selecting the materials contained therein) is the position in which the micro-valve is closed. As such, the fluid (e.g., inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell stains, a colloidal solution, a suspension, an emulsion, etc.)The micro-valve, positioned to seal against the external environment of the jet assembly, eliminates fluid evaporation, thus reducing clogging. Additionally, the limited evaporation allows for faster drying of the fluid, enabling deposition at higher rates than in conventional systems.

[0076] To ensure proper sealing of the micro-valve described herein, a compatible relationship is maintained between the sealing member located on the actuating rod and the valve seat. Maintaining this relationship involves adjusting several factors pertaining to the construction of the jet assembly. In one aspect, steps are taken to ensure proper dimensionality of the various components of the micro-valve. For example, in some embodiments, the spacing and sealing members described herein are formed in a single manufacturing step (e.g., by etching a portion of a support to form the spacing and sealing member in a single etching step) to ensure they have the same thickness.Constructing these components in this manner allows for precise control over the arrangement of components attached to the actuator rod, such as the dimensions of the sealing member and the length of the actuator rod. This enables the sealing member to be precisely aligned with the valve seat, ensuring a proper seal between the valve seat and the sealing member, or between the orifice plate and the sealing member. Furthermore, manufacturing the sealing member and the spacing member in this way allows these structures to share a common thickness, facilitating proper spacing between the actuator rod and the orifice plate. A fluid collector is attached to the micro-valve and defines a fluid reservoir around the micro-valve, allowing fluid to be deposited onto a substrate when the actuator rod is in the open position.

[0077] Thus, a plurality of jet assembly components described herein are constructed with regard to the seal established at the interface between the sealing member and the orifice, and / or the valve seat. The proper seal beneficially prevents fluid leakage through the orifice, which occurs in ML / conventional continuous jet assemblies. Advantageously, the micro-valves employed herein can be adjusted to provide a desired droplet size. For example, in one embodiment, the orifice in the orifice plate is approximately 60 microns in diameter. In particular embodiments, the orifice plate can have a thickness ranging from 60 to 900 microns (e.g., 350 microns). In some embodiments, the length-to-orifice diameter ratio can range from 1:1 to 15:1. An electrical signal can be applied to the actuator rod, which, through at least one layer of piezoelectric material contained therein, causes the actuator rod to temporarily separate from the valve seat to create a fluid outlet at the valve seat and orifice for a predetermined period (e.g., based on a desired droplet frequency).As such, based on the orifice volume and droplet frequency, a volume of fluid is ejected from the orifice to form a droplet placed on a substrate to create a desired mark, pattern, solution, or object. In different configurations, with the droplet frequency set to approximately 10 kHz, the micro-valve employed herein can produce droplets with a volume of approximately 600 pL. This is larger than those produced by conventional deposition systems, which generally only generate droplets with a volume of approximately 30 pL. As a result of this larger droplet size, the jet assembly described herein can utilize a greater launch distance, thereby enabling imaging of a desired object at greater distances than conventional systems.

[0078] Different modalities of the contactless deposition system, including the jet assemblies described herein, provide benefits, including, for example: (1) preventing fluid evaporation by keeping the micro-valve closed in a start position when fluid deposition is not taking place; (2) using only electrical energy to open the micro-valve, thereby reducing energy consumption; (3) allowing precise deposition of fluid volumes in a range from 500 picoliters (pL) to 5 milliliters (mL), or even larger volumes; (4) allowing the deposition of a variety of fluids including, but not limited to, inks, conductive inks, paints, dyes, cell stains, polymers, adhesives, suspensions, emulsions, nanocoatings, antimicrobial coatings, powders, biological solutions, biochemical solutions, chemical solutions, etc.(5) permit the deposition of a plurality of fluids from a single micro-valve; (6) integrate pumping capabilities in such a way that an external pumping or compression system can be excluded to provide pressurized fluid to the jet assembly; and (7) permit the deposition of fluids in different patterns to allow movement capabilities and / or provide defined orifices in an orifice plate in a predetermined pattern.

[0079] As described herein, the term home position, when used to describe a micro-valve actuator rod, describes the position of the actuator rod relative to other micro-valve components without the application of any control signal (e.g., a load, current, or voltage) to the actuator rod. In other words, the home position is the position of the actuator rod (and any components coupled to it) when the actuator rod is in a passive state.

[0080] Now, referring to Figure 1, a perspective view of a jet assembly 100 placed in a holder 150 is shown, according to one exemplary embodiment. The jet assembly 100 includes a valve body 102 coupled to a carrier 108. The holder 150 includes a substantially circular body containing an opening adapted to receive the jet assembly 100. The holder body 150 may include notches 118 extending from a peripheral edge thereof to facilitate coupling the holder 150 to a marking device. The valve body 102 may be a component of a marking device. In one exemplary embodiment, the valve body 102 is used in a non-contact deposition system that includes a pressurized fluid supply.

[0081] As described herein, valve body 102 includes an inlet fluid manifold coupled to a plurality of micro-valves. The micro-valves and the inlet fluid manifold form a fluid chamber or reservoir configured to contain fluid received from an external fluid supply. In other embodiments, valve body 102 may define a plurality of fluid chambers, each fluid chamber corresponding to at least a portion of the plurality of micro-valves. In such embodiments, each fluid chamber may be filled with a fluid of a different color (e.g., a different colored ink such as black, green, yellow, cyan, etc., or different fluids) to provide the ability to deposit multiple fluids. In different embodiments, the micro-valves include an actuating rod configured to move (e.g., fold, bend, twist, etc.).In response to applied voltages, the device temporarily opens fluid outlets in orifices of an orifice plate. As a result, droplets are emitted from the fluid outlets toward a target to produce a desired pattern.

[0082] As shown, a circuit board 104 is attached to a side surface of the carrier 108. The circuit board 104 may include a plurality of electrical pathways and provide a connection point between the valve body 102 and an electrical controller (e.g., via a wiring harness). The electrical controller may supply control signals via the electrical pathways to control the actuation of the actuating rods of the multiple valves included in the valve body 102. The structure and operation of such micro-valves are described in more detail herein. In some embodiments, the circuit board 104 itself includes a microcontroller that generates and provides control signals to actuate the micro-valves. MA /

[0083] An identification marker 106 is attached to the jet assembly 100. In some embodiments, the identification marker 106 includes internal memory configured to store various forms of information (e.g., manufacturing information, serial number, valve calibration information, configuration, etc.) about the jet assembly 100. For example, in one embodiment, the identification marker 106 is a radio frequency identification (RFID) marker configured to transmit the stored information in a receptive manner in response to receiving a predetermined identifier from an external device. In this way, information about the jet assembly 100 can be retrieved quickly and efficiently.

[0084] Referring to Figure 2, an exploded view of the jet assembly 100 is shown, according to one example embodiment. The carrier 108 includes a front side surface 110, a rear side surface 112, and a side surface 124. In different embodiments, the valve body 102 is attached to the front side surface 110 by means of an adhesive. The rear side surface 112 has a cover 116 positioned over it. The cover 116 includes openings 120 that provide delivery ports for a fluid (e.g., ink) to be deposited onto a target by means of the valve body 102.For example, in some embodiments, the fluid (e.g., ink) is supplied to the valve body 102 through a first of the openings 120 (e.g., via an inlet supply line or hose), circulates through the valve body 102, and exits the valve body 102 through a second of the openings 120. In other words, the fluid is recirculated through the fluid chamber. A diaphragm may be positioned in each of the openings 120 and configured to allow the insertion of a fluid distribution or return pin through it to permit communication of the fluid to the fluid chamber while maintaining the fluidic seal of the jet assembly 100. Although not shown, in some embodiments, a heating element (e.g., a resistive wire) may be positioned near the valve body 102 or the carrier 108 (e.g., around or attached to its side wall).The heating element can be used to selectively heat the fluid (e.g., ink) contained within the fluid chamber to maintain the fluid at a desired temperature.

[0085] The front side surface 110 includes a cavity adapted to receive the valve body 102, such that the valve body 102 is fixedly mounted to the front side surface 110 (e.g., by means of an adhesive). The circuit board 104 is coupled to the carrier 108 by the side surface 124. As shown, the side surface 124 includes mounting pins 126. In various embodiments, the circuit board 104 includes openings arranged to correspond to the arrangement of the mounting pins 126 and adapted to receive the mounting pins 126 to align the circuit board 104 with the carrier 108.

[0086] As shown, circuit board 104 has a flexible printed circuit board 114 attached ML / to the same. The flexible printed circuit 114 extends at an angle from the circuit board 104 and attaches to the carrier 108 near the front side surface 110. The valve body 102 and the circuit board 104 are arranged perpendicularly to each other, as the flexible printed circuit 114 extends around a corner boundary of the front side surface 110. The circuit board 104 also includes a controller interface 122 that includes electrical connection members (e.g., bolts) configured to receive control signals, e.g., from a deposition system controller.

[0087] As described herein, in various embodiments, the flexible printed circuit board 114 may be positioned between a fluid collector and the carrier 108, or an interposing coil may be positioned between the carrier 108 and the valve body 102 to facilitate the formation of electrical connections between the flexible printed circuit board 114 and the electrodes of the plurality of micro-valves included in the valve body 102. In some embodiments, the flexible printed circuit board 114 is coupled to the front side surface 110 by means of a mounting member 148. An opening in the flexible printed circuit board 114 is aligned with the membrane in the carrier 108 to provide a fluid inlet to a fluid chamber formed by the valve body 102.

[0088] Now, referring to Figure 3, a schematic representation of different components of the jet assembly 100 is shown, according to an example configuration. For example, Figure 3 can represent a cross-sectional view of the jet assembly 100 on line 111 shown in Figure 1. As shown, the valve body 102 extends from the front side surface 110 of the carrier 108 by means of an interposing coil 170. The interposing coil 170 provides structural support to ensure maximum performance of the different components in the valve body 102.

[0089] The valve body 102 includes an inlet fluid manifold 162 and a plurality of micro-valves 164 coupled to the inlet fluid manifold 162. The micro-valves 164 and the inlet fluid manifold 162 form a fluid chamber 166 for a fluid (e.g., a combination of ink and a composition fluid) received from a pressurized fluid supply (e.g., via openings 120 in a cover 116 coupled to the rear side surface 112). In various embodiments, the fluid supply includes a fluid reservoir and a pump configured to provide pressurized fluid to the jet assembly 100 via a supply line coupled to the carrier 108. In various embodiments, the fluid supply delivers pressurized fluid between 7 and 15 PSI when one or more of the micro-valves 164 are open.For example, in one configuration, the fluid has a pressure of approximately 10 PSI when one or more of the micro-valves are open. The carrier 108 may include an internal cavity configured to receive the pressurized fluid and distribute the fluid to the fluid chamber 166. In different configurations, a pressure differential can be maintained between the fluid chamber and the fluid supply to drive the MA / fluid out of valve body 102. A pressure sensor may be provided in valve body 102 and / or carrier 108 to determine the pressure differential and / or pumping pressure of the fluid pumped through pump body 102.

[0090] The inlet fluid collector 162 may include a glass structure comprising a channel that forms the fluid chamber. In general, the micro-valves 164 include actuator rods held in a spaced relationship with the orifices in an orifice plate on the front side surface 110 from which the fluid is emitted. The actuator rods may include at least one layer of piezoelectric material configured to deflect in response to received control signals (e.g., electrical voltage waveforms provided by means of the controller interface 122 on the circuit board 104). As described herein, the application of such electrical signals causes the micro-valves 164 to open, thereby causing droplets to be released from the orifice plate. The droplets travel a launch distance 192 onto a substrate 190 to produce a desired pattern on the substrate 190.The structure and operation of the various components of the 164 micro-valves are described in more detail herein. In other embodiments, the actuator rod may include a stainless steel actuator rod (e.g., approximately 1 mm long). In still other embodiments, the actuator rod may include a bimorphous rod having two layers of piezoelectric material positioned on either side of a base layer (e.g., a silicon base layer or a stainless steel layer). An electrical signal (e.g., an electrical voltage) may be applied to either of the piezoelectric layers to cause the actuator rod to fold toward the corresponding piezoelectric layer. The two piezoelectric layers may contain the same piezoelectric material or different piezoelectric materials.In certain configurations, a different electrical signal can be applied to each of the piezoelectric layers to fold or bend the drive bar a predetermined distance towards the hole.

[0091] Although the embodiments described herein generally include a piezoelectric material in the drive bar, other embodiments may employ any other drive mechanism. For example, in some embodiments, the drive bars may include a capacitive coupling for moving the drive bars. In other embodiments, the drive bars may include an electrostatic coupling. In still other embodiments, the drive bars may include a magnetic coupling (e.g., an electromagnetic structure activated by an electromagnet) for moving the bar. In still other embodiments, the drive bars may comprise a thermosensitive bimetallic strip configured to move in response to temperature changes.

[0092] The interposition coil 170 generally adds rigidity to different portions of the body of MA / valve 102. For example, the interposing coil 170 may be constructed to be more rigid than the components (e.g., orifice plate, actuating rod, etc.) of the valve body 102 to counteract stress induced by coupling such components together. For example, the interposing coil 170 may be coupled to a valve body 102 to counteract stresses induced by an adhesive used to couple the carrier 108 to the valve body 102. Additionally, the interposing coil 170 may counteract stresses at interfaces between the inlet fluid manifold 162 and the micro-valves 164.

[0093] Now, referring to Figure 4A-4B, a plan view of the jet assembly 100 is shown, according to one example embodiment. Figure 4A-4B shows a plan view of the valve body 102 on line 111-11 shown in Figure 2.As such, Figure 4A-4B shows a plan view at an interface between the inlet fluid manifold 162 and the orifice plate. The inlet fluid manifold 162 includes a first opening 172 and a second opening 174. The first opening 172 exposes the plurality of micro-valves 164 to form the fluid chamber 166 configured to contain the fluid received from a fluid supply.

[0094] In the example shown, the plurality of micro-valves 164 includes a plurality of actuating rods 176 aligned in a single row. Each of the plurality of actuating rods 176 has a sealing member 178 positioned at one end. In some embodiments, the sealing members 178 are aligned with and in contact with valve seats positioned in holes in the orifice plate to prevent the fluid contained in the fluid chamber 166 from escaping in the absence of any electrical signal. The jet assembly 100 is shown to include 52 actuating rods 176 forming 52 micro-valves 164. In other embodiments, the jet assembly 100 may include any number of actuating rods.

[0095] In various embodiments, each of the plurality of drive bars 176 extends from a member positioned below a boundary between the first and second openings 172 and 174. Each of these members may include an electrical connection portion exposed through the second opening 174. Electrical contact pads 180 are positioned on each of the electrical connection portions. Wire links electrically connect each of the electrical connection portions to the controller interface 122 via the electrical contact pads 180. As such, electrical signals can be received by each of the drive bars 176 by means of the electrical contact pads 180. In some embodiments, Tape Automated Bonding (TAB) can be used to electrically connect each of the electrical connection portions to the controller interface.

[0096] The boundary between the first and second openings 172 and 174 isolates the electrical contact pads 180 from the fluid contained in a reservoir formed by the fluid opening 172. Also ML / Beneficially, the electrical contact pads 180 are positioned below the inlet fluid manifold 162. This means that the electrical connections between the drive bars 176 are positioned inside the carrier 108 and are protected against deterioration and external contamination.

[0097] To isolate the electrical contact pads 180 from the fluid contained in the fluid chamber 166, an adhesive structure 182 is placed on the inlet fluid manifold 162. The adhesive structure 182 couples the inlet fluid manifold 162 to the orifice plate. As shown in Figure 4A-4B, the adhesive structure 182 forms tracks around each of the first and second openings 172 and 174. The tracks provide barriers to fluid leakage between the inlet fluid manifold 162 and the orifice plate. For example, the tracks can be constructed of many concentric rectangular loops of an adhesive material (e.g., a photoprotectant such as a glycidyl ether bisphenol-A novalac photoprotectant sold under the trade name SU-8 or polymethyl methacrylate, polydimethylsiloxane, silicone rubber, etc.) around each of the first and second openings 172 and 174.Segments of adhesive material can be cut through the multiple rectangular loops to form compartments for receiving filter fluid. Such an adhesive structure 182 facilitates fluidic isolation between the micro-valves 164 and the electrical contact pads 180.

[0098] Now, referring to Figure 5A, a cross-sectional view of jet assembly 200, including a micro-valve 230, is shown, according to one example embodiment. In some embodiments, jet assembly 200 is an example embodiment of jet assembly 100 described with respect to Figures 1, 2, 3, and 4A-4B. As shown, jet assembly 200 includes a carrier 202 coupled to a valve body 298 by means of a structural layer 222. In some embodiments, the structural layer 222 may be part of the carrier 202.

[0099] The carrier 202 includes an upper portion 204 and a housing portion 206 extending from an edge of the upper portion 204. The upper portion 204 includes a membrane 208 through which pressurized ink is supplied. The housing portion 206 defines a cavity in which the valve body 298 is positioned. The valve body 298 includes an inlet fluid manifold 210 and the micro-valve 230. As shown, the inlet fluid manifold 210 and the micro-valve 230 define a reservoir 300 configured to hold a volume of pressurized fluid received from an external fluid supply by the membrane 208.In different forms, the pressurized fluid contained within the 300 tank may include, but is not limited to, inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell stains, a colloidal solution, a suspension, an emulsion, or any other suitable fluid.

[00100] Carrier 202 can be made of plastic, ceramic, or any other material MA / suitable. The carrier 202 facilitates the operation of the jet assembly 200 by providing structural support to the valve body 298. For example, in some embodiments, the peripheral edges of the valve body 298 are coupled to the housing portion 206 by means of adhesive layers 302 placed on the inner surface of the housing portion 206. Such adhesive facilitates the maintenance of a desired relative positioning between the micro-valve 230 and the inlet fluid manifold 210. [OO1O1] In various embodiments, the inlet fluid manifold 210 is preformed before being coupled to the additional components of the fluid jet assembly 200. The fluid manifold 210 consists of a body 310 (e.g., made of glass, silicon, silica, etc.) of any suitable thickness (e.g., 500 microns). As shown, the inlet fluid manifold 210 is preformed to include a first channel 212 and a second channel 214. The first and second channels 214 are substantially linear and parallel to each other in the embodiment shown, but the fluid manifold 210 can be accommodated as required for the arrangement of micro-valves to be placed therein. The first channel 212 is formed to have a width 304 that supports a predetermined ratio with a length 312 of a cantilever portion 308 of a drive rod 240 of the micro-valve 230.For example, the first channel 212 may be shaped to have a width 304 greater than a desired length 312 of the cantilever portion 308 by a threshold amount. The second channel 214 provides a pathway for an electrical connection to be formed between the drive bar 240 and a flexible printed circuit board 216 by means of intersecting wire links 220. Advantageously, using such an arrangement internalizes the electrical connections between the drive bar 240 and the flexible printed circuit board 216. In other words, the electrical connections between such components are not external to the carrier 202, and are therefore less vulnerable to degradation. In various embodiments, the first channel 212 and / or the second channel 214 may have sloped sidewalls.

[00102] As shown, the second channel 214 is substantially filled with an encapsulant 218. The encapsulant 218 may include any type of epoxy or any other suitable material. The encapsulant 218 encloses the electrical connections formed between the wire links 220, the flexible printed circuit board 216, and the drive bar 240 and is configured to protect the wire links 220 from physical damage, moisture, and corrosion. Thus, the encapsulant 218 ensures the maintenance of a proper electrical connection between the flexible printed circuit board 216 and the drive bars 240 to facilitate the provision of electrical control signals to the drive bars 240 to cause them to move and open and close the micro-valves 230.

[00103] Portion 314 of the inlet fluid manifold 210, which separates the first and second channels 212 and 214, serves as a barrier preventing fluid contained in the reservoir 300 from reaching the electrical connections. As such, the inlet fluid manifold 210 serves both as part of the reservoir 300 for pressurized fluid received from an external fluid supply and as an insulating barrier between the pressurized fluids and any electrical connections contained within the jet assembly 200. The first and second channels 212 and 214 can be formed using any suitable process (e.g., by sandblasting, physical or chemical etching, drilling, etc.). In some embodiments, instead of being constructed of glass, the inlet fluid manifold 210 is constructed of silicon, silica, ceramic, or any other suitable material.

[00104] With continued reference to Figure 5A, the micro-valve 230 includes an orifice plate 250 coupled to the actuating rod 240. The orifice plate 250 can be made of any suitable material, for example, glass, stainless steel, nickel, nickel with another electroplated metal layer (for example, stainless steel), polyimide (for example, Kapton), or a photoprotectant (for example, SU-8, polymethyl methacrylate, etc.). The orifice plate 250 is substantially flat and includes an orifice 260 extending between a first surface and a second surface opposite the first surface thereof. In various embodiments, the orifice 260 is substantially cylindrical and has a central axis that is perpendicular or substantially perpendicular to the surfaces of the orifice plate 250. A valve seat 270 is positioned on an inner surface 316 of the orifice plate 250 adjacent to the orifice 260.In various embodiments, the valve seat 270 comprises a flexible material that surrounds or substantially surrounds the orifice 260. In some embodiments, the valve seat 270 is constructed of an epoxy-based adhesive such as SU-8 photoprotectant. In other embodiments, the valve seat 270 may be formed from a moldable polymer, for example, polydimethylsiloxane or silicone rubber. The valve seat 270 defines an internal opening 318 substantially aligned with the orifice 260 to create an outlet for the pressurized fluid contained in the reservoir 300. In particular embodiments, the valve seat 270 may be excluded such that a sealing member surface of the actuating rod 240 contacts the orifice plate 250 around the orifice 260 to seal the orifice 260 and close the micro-valve 230.

[00105] The drive rod 240 includes a base portion 306 and a cantilever portion 308. The base portion 306 extends below portion 314 of the inlet fluid manifold 210, which separates the first and second channels 212 and 214. As shown, the base portion 306 includes an electrical connection portion 294 in a region that overlaps with the second channel 214. The electrical connection portion 294 includes an electrode through which an electrical connection is formed with the flexible printed circuit board 216 by means of wire links 220. The cantilever portion 308 extends into the reservoir 300 of portion 314 of the inlet fluid manifold 210. As shown, the cantilever portion 308 is positioned on a spacing member 280 and, as a result, is spatially separated from the orifice plate 250. Thus, there is space on each side of the cantilevered portion 308 such that the drive bar MA / 240 can be folded towards and / or away from the orifice plate 250 as a result of applying electrical signals to it by means of the electrical connection portion 294. The spacing member 280 is configured to prevent damping of the compression film of the drive bar.

[00106] The cantilever portion 308 has a length 312 such that the cantilever portion extends from a boundary of the reservoir 300 a predetermined distance. In various embodiments, the predetermined distance is specifically selected such that a portion 292 of the cantilever portion 308 overlaps the valve seat 270 and the bore 260. A sealing member 290 extends from the portion 292 of the drive rod 240 that overlaps the bore 260. In some embodiments, the sealing member 290 is constructed to have a shape that substantially corresponds to a shape of the bore 260. For example, in one embodiment, both the bore 260 and the sealing member 290 are substantially cylindrical, with the sealing member 290 having a larger outside diameter.This configuration allows the sealing member 290 to completely cover the orifice 260, enabling a seal to form between the sealing member 290 and the valve seat 270. In other embodiments, the orifice 260 may have any other shape, such as star, square, rectangular, polygonal, elliptical, or an asymmetrical shape. In certain embodiments, the valve seat 270 may define a cavity size and may be shaped to receive the sealing member 290. In various embodiments, the orifice plate 250, and therefore the orifice 260, may be formed from a non-wetting (e.g., hydrophobic) material such as silicon or Teflon. In other embodiments, a non-wetting (e.g., hydrophobic) coating may be applied to an inner wall of the orifice 260. Such coatings may include, for example, Teflon, nanoparticles, an oleophilic coating, or any other suitable coating.

[00107] In various embodiments, the spacing member 280 and the sealing member 290 are constructed of the same materials and have equivalent or substantially equivalent thicknesses 320 and 322 (e.g., silicon, SU-8, silicon rubber, polymethyl methacrylate, etc.). In such embodiments, when the drive bar 240 extends parallel to the bore plate 250, the lower surfaces of the spacing member 280 and the sealing member 290 are aligned with each other.When the actuating rod 240 is placed in a closed position (as described herein), a surface of the sealing member 290 contacts the valve seat 270 to close the fluid outlet formed in the orifice 260 (for example, a sealing member surface of the sealing member 290 may be configured to extend approximately 2 microns below a lower surface of the spacing member 280 if the valve seat 270 were not present). The valve seat 270 and the sealing member 290 may be sized such that the surface area of ​​the sealing member 290 contacts the valve seat 270 when the actuating rod 240 is placed in the closed position (for example, when an electrical signal is removed from or applied to the actuating rod 240). MA / through wire links) to prevent fluid from traveling from reservoir 300 to orifice 260. For example, the sealing member 290 may have a larger diameter or cross-section than the valve seat 270.

[00108] Various aspects of the jet assembly 200 are designed to ensure the formation of a proper seal between the valve seat 270 and the sealing member 290. For example, the structural layer 222 positioned in the inlet fluid manifold 210 prevents the orifice plate 250 from bending, resulting in stress induced on it by adhesives that bond the micro-valve components 230 to each other and the micro-valve 230 to the housing portion 206. In various embodiments, the structural layer 222 is constructed to have greater rigidity than the orifice plate 250 to perform this function. The structural layer 222 may be constructed of silicon or any other suitable material. As shown, the structural layer 222 includes protruding portions 224 extending from a main portion thereof.The protruding portions 224 are mated to an upper surface of the inlet fluid collector 210 (for example, at the boundaries of the first and second channels 212 and 214). In certain embodiments, the protruding portions 224 are omitted. A seal is formed on the protruding portions 224 by, for example, an adhesive placed between the structural layer 222 and the flexible printed circuit board 216. The protruding portions 224 provide clearance above the inlet fluid collector 210. This clearance facilitates the placement of the encapsulant 218, which completely covers all contact points between the wire link 220 and the flexible printed circuit board 216. In some embodiments, the carrier 202 includes the structural layer 222, such that the carrier 202 provides rigidity.

[00109] In another aspect, the actuating bar 240 is constructed such that a hermetic seal is formed at the interface between the valve seat 270 and the sealing member 290 when in the closed position. The actuating bar 240 may include at least one layer of piezoelectric material. The piezoelectric layer may include lead zirconate titanate (PZT) or any other suitable material. The piezoelectric layer has electrically connected electrodes. In various embodiments, wire links 220 are coupled to these electrodes so that electrical signals from the flexible printed circuit board 216 are delivered to the piezoelectric layer via the electrodes. The electrical signals cause the actuating bar 240 to move (e.g., fold, rotate, etc.) with respect to its home position.In other embodiments, the drive bar 240 may include a stainless steel drive bar (for example, approximately 1 mm long). In still other embodiments, the drive bar 240 may include a bimorphous bar having two layers of piezoelectric material positioned on either side of a base layer (for example, a silicon base layer). An electrical signal (for example, an electrical voltage) can be applied to either of the piezoelectric layers to cause the drive bar 240 to fold toward the layer. ML / corresponding piezoelectric layer. The two piezoelectric layers can include the same piezoelectric material or different piezoelectric materials. In certain configurations, a different electrical signal can be applied to each of the piezoelectric layers to bend or curve the drive bar a predetermined distance.

[00110] As shown, the wire links 220 are coupled to the drive rod 240 at an electrical connection portion 294 thereof. The electrical connection portion 294 includes a wire link pad (e.g., constructed of gold or platinum) conductively connected to at least one electrode within the drive rod 240. Advantageously, the electrical connection portion 294 is separated from the cantilever portion 308 of the drive rod 240. In other words, the electrical connection portion 294 is separated from the fluid contained in the jet assembly 200 by seals formed at the connection points between the inlet fluid manifold 210 and the drive rod 240. In some embodiments, the wire links 220 and / or the encapsulant 218 may be diverted outward through an opening provided in the orifice plate 250. [OOlll] In various embodiments, the actuating rod 240 is constructed such that the closed position is in its initial position. In other words, different layers in the actuating rod 240 are constructed such that the actuating rod 240 bends toward the orifice 260 as a result of the force supplied by the pressurized fluid contained in the reservoir 300. A tuning layer may be constructed within the actuating rod 240 to be in a state of compressive stress to induce a bend in the actuating rod 240 toward the orifice 260. As a result of this bending, the sealing member 290 comes into contact with the valve seat 270 in the absence of any electrical signal applied to the actuating rod 240 to close the orifice 260.The degree of curvature can be specifically selected to form a tight seal at the interface between the sealing member 290 and the valve seat 270 with the drive rod 240 in the starting position. This starting seal beneficially prevents evaporation of the fluid contained in the jet assembly 200, thus preventing blockages and other defects.

[00112] The drive bar 240, as shown in Figure 5A, folds from the hole plate 250. Such folding is achieved by applying an electrical signal to the drive bar 240 by means of the flexible printed circuit board 216. For example, the flexible printed circuit board 216 can be electrically connected to an external controller that supplies electrical signals transmitted to the drive bar 240.

[00113] As illustrated in Figure 5A, the application of the electrical signal causes the drive bar 240 to temporarily move away from its starting position. For example, in different modes, the drive bar 240 moves upward from hole 260 such that a portion of a The sealing member surface ML / is at least 10 microns from the top surface of the valve seat 270. In one embodiment, a central portion of the sealing member surface is approximately 15 microns from the valve seat 270 at a peak of its oscillating pattern. As a result, an opening temporarily forms between the valve seat 270 and the sealing member 290. The opening provides a path for a volume of fluid to enter the orifice 260 and form a droplet on an outer surface of the orifice plate 250. The droplets are deposited onto a substrate to form a pattern determined by control signals supplied to each of the bars 240 of each of the micro-valves 230 of the jet assembly 200.As will be understood, the frequency at which the drive bar 240 moves away from its starting position to a position such as that shown in Figure 5A-5B can vary depending on the implementation. In different configurations, the natural frequency of the drive bars 240 can be in the range of 1–30 kHz, and may depend on the length, width, thickness, and / or stiffness of the drive bar 240. For example, in one configuration, the drive bar 240 oscillates at a frequency of approximately 12 kHz. However, in other implementations, the drive bar 240 may oscillate at a lower frequency (e.g., 10 kHz) or a higher frequency (e.g., 20 kHz).

[00114] Now, referring to Figure 5B, a cross-sectional view of a jet assembly 200b, including a micro-valve 230b, is shown, according to one example embodiment. In some embodiments, the jet assembly 200b is an example embodiment of the jet assembly 100 described with respect to Figures 1, 2, 3, and 4A-4B. As shown, the jet assembly 200b includes a carrier 202b coupled to a valve body 298b by means of an interposing coil 222b.

[00115] The carrier 202b includes an upper portion 204b and a housing portion 206b extending from an edge of the upper portion 204b. A fluid channel 211b is provided in the upper portion 204b. A membrane 208b (for example, a rubber or foam membrane) is positioned at an inlet of the fluid channel 211b, and a filter 213b is positioned at an outlet of the fluid channel 211b. A cover 203b (for example, a plastic or glass cover) is positioned on the carrier 202b such that the membrane 208b is positioned between the carrier 202b and the cover 203b, and secured between them. An opening 209b can be defined in the cover 203b, and this corresponds to the inlet of the fluid channel 211b. A fluid connector 10b attaches to the cover 203b or to the fluid channel inlet 211b.The fluid connector 10b includes an insertion needle 12b configured to pierce the membrane 208b and be positioned through it into the fluid channel 211b. The fluid connector 10b is configured to pump pressurized fluid into an inlet fluid manifold 210b of the jet assembly 200b by means of the insertion needle 12b. Additionally, the filter 213b is configured to filter particles from the fluid before the fluid is communicated to the fluid manifold 210b. In some embodiments, the insertion needle 12b may be formed from or coated with a non-wetting agent (e.g., a hydrophobic material such as Teflon). In another embodiment, the insertion needle 12b may include heating elements, or an electric current may be supplied to the insertion needle 12b to heat the insertion needle 12b and thus the fluid flowing through it into the inlet fluid manifold 210b.In still other forms, metal needles or any other heating element may be provided in the inlet fluid manifold 210b to heat the fluid contained therein.

[00116] The housing portion 206b defines a cavity or boundary within which the valve body 298b is positioned. The valve body 298 includes an inlet fluid manifold 210b and the microvalve 230b. As shown, the inlet fluid manifold 210b and the microvalve 230b define a reservoir 300b configured to contain a volume of pressurized fluid received from an external fluid supply by the membrane 208b. In various configurations, the pressurized fluid contained within the reservoir 300b includes inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell stains, a colloidal solution, a suspension, an emulsion, or any other suitable fluid.

[00117] In various embodiments, the inlet fluid collector 210b is preformed before being coupled to the additional components of the jet assembly 200b. For example, the fluid collector 210b is formed from a glass body 310b having any suitable thickness (e.g., 500 microns). As shown, the inlet fluid collector 210b is preformed to include a first channel 212b and a second channel 214b. The first channel 212b is formed to have a width 304b that supports a predetermined ratio with a length 312b of a cantilevered portion 308b of an actuating rod 240b of the micro-valve 230b. The second channel 214b provides an avenue for an electrical connection to be formed between the drive bar 240b and a flexible printed circuit board 216b by means of wire links 220b extending in between.

[00118] As shown, the second channel 214b is substantially filled with an encapsulant 218b. The encapsulant 218b ensures the maintenance of a proper electrical connection between the flexible printed circuit board 216b and the drive bars 240b to facilitate the provision of electrical control signals to the drive bars 240b to cause their movement to open and close the micro-valve 230b and to protect a wire linkage 22b against physical damage or moisture, as described above herein.

[00119] Portion 314b of the inlet fluid manifold 210b, which separates the first and second channels 212b and 214b, serves as a barrier preventing fluid from the reservoir 300b from reaching the electrical connections. As such, the inlet fluid manifold 210b serves as both part of the reservoir and part of the fluid manifold. MA / t / ¿U¿¿ / U4yUÓ4 300b for pressurized fluid received from an external fluid supply as an insulating barrier between the pressurized fluids and any connection contained within the jet assembly 200b.

[00120] The micro-valve 230b includes an orifice plate 250b coupled to the actuating rod 240b. The orifice plate 250b is substantially flat and includes an orifice 260b extending between its surfaces. A valve seat 270b is positioned on an internal surface 316b of the orifice plate 250b adjacent to the orifice 260b. The valve seat 270b defines an internal opening 318b substantially aligned with the orifice 260b to create an outlet for the pressurized fluid contained in the reservoir 300b. In particular embodiments, the valve seat 270b may be excluded such that a sealing member surface of the actuating rod 290 contacts the orifice plate 250b around the orifice 260b to seal the orifice 260b and close the micro-valve 230b.

[00121] The drive rod 240b includes a base portion 306b and a cantilever portion 308b. The base portion 306b extends below portion 314b of the inlet fluid manifold 210b, which separates the first and second channels 212b and 214b. As shown, the base portion 306b includes an electrical connection portion 294b in a region that overlaps with the second channel 214b. The electrical connection portion 294b includes an electrode through which an electrical connection is formed with the flexible printed circuit board 216b by means of wire links 220b. The cantilever portion 308b extends into the reservoir 300b from portion 314b of the inlet fluid manifold 210b. As shown, the cantilever portion 308b is placed on a spacing member 280b and, as a result, is spatially separated from the orifice plate 250b.

[00122] The cantilever portion 308b has a length 312b such that the cantilever portion 308b extends from a boundary of the reservoir 300b a predetermined distance. In various embodiments, the predetermined distance is specifically selected such that a portion 292b of the cantilever portion 308b overlaps the valve seat 270b and the bore 260b. A sealing member 290b extends from the portion 292b of the drive rod 240b that overlaps the bore 260b. In some embodiments, the sealing member 290b is constructed to have a shape that substantially corresponds to a shape of the bore 260b.

[00123] The flexible printed circuit board 216b is positioned on the glass body 310b and portion 314b of the inlet fluid collector 210b, and bonded to it by means of a first adhesive layer (e.g., SU-8, silicone rubber, etc.). An interposition coil 222b is positioned between the upper portion 204b of the carrier 202b and the inlet fluid collector 210b to create a gap between the upper portion 204b and the inlet fluid collector 210b. This allows sufficient space to accommodate the encapsulant 218 and increases the volume of the inlet fluid collector 210b. As shown in Figure 5B, the interposition coil 222b is positioned on and bonded to a portion of the flexible printed circuit board 216b by means of MA / of a second adhesive layer 223b (e.g., SU-8, silicone, or any other adhesive). In addition, the interposition coil 222b is attached to a side wall of the upper portion 204b of the carrier 202b near the micro-valve 230b by means of a third adhesive layer 225b (e.g., SU-8, silicone, or any other adhesive).

[00124] The interposing coil 222b may be made of a strong, flat, rigid material (e.g., plastic, silicon, glass, ceramic, etc.) and placed in the inlet fluid manifold 210b to prevent the orifice plate 250b from warping due to induced stress. This is achieved by adhesives that couple the micro-valve components 230b to each other and the micro-valve 230b to the housing portion 206b. In various embodiments, the interposing coil 222b is constructed to have greater rigidity than the orifice plate 250b to perform this function.

[00125] In another aspect, the actuating bar 240b is constructed such that a hermetic seal is formed at the interface between the valve seat 270b and the sealing member 290b when it is in the closed position. The actuating bar 240b may include at least one layer of piezoelectric material (e.g., lead zirconate titanate (PTZ) or any suitable material). The piezoelectric layer has electrically connected electrons, and the wire links 220b are coupled to these electrodes such that electrical signals from the flexible printed circuit board 216b are supplied to the piezoelectric layer via the electrodes. The electrical signals cause the actuating bar 240b to move (e.g., fold, rotate, etc.) with respect to its starting position.

[00126] As shown, the wire links 220b are coupled to the drive rod 240b by an electrical connection portion 294b thereof, substantially similar to the wire links 220 described with respect to the jet assembly 200 of Figure 5A. In different embodiments, the drive rod 240b is constructed such that the closed position is in its start position, as described in detail with respect to the drive rod 240 of Figure 5A.

[00127] The drive bar 240b, as shown in Figure 5B, folds from the hole plate 250b. This folding is effected by applying an electrical signal to the drive bar 240b via the flexible printed circuit board 216b. For example, the flexible printed circuit board 216b may be electrically connected to a circuit board 215b (e.g., a printed circuit board) that extends perpendicular to a longitudinal axis of the drive bar 240b along a side wall of the carrier 202b. An identification marker 217b (e.g., identification marker 106) may be positioned between the circuit board 215b and the side wall of the carrier 202b.An electrical connector 219b is electrically coupled to the circuit board 215 and is configured to electrically connect the flexible printed circuit board 216b to an external controller that supplies electrical signals transmitted to the drive bar 240b via the circuit board 215b.

[00128] As illustrated in Figure 5B, the application of the electrical signal causes the actuating rod 240b to temporarily separate from its starting position. For example, in different modes, the actuating rod 240b moves upward from the bore 260b such that a portion of a sealing member surface of the sealing member 290b is at least 10 microns from a top surface of the valve seat 270b, as described in detail with respect to the actuating rod 240 in Figure 5A.

[00129] Now, referring to Figure 6, a more detailed view is shown, illustrating different components of the jet assembly 200 described in Figure 5A, according to one example embodiment. As shown, the drive rod 240 includes a drive portion 242, a tuning layer 244, and a non-active layer 246. The non-active layer 246 serves as a base for the tuning layer 244 and the drive portion 242. The structure of the drive portion 242 and the tuning layer 244 will be described in more detail with reference to Figures 7A-7B. In some embodiments, the non-active layer 246 is constructed of silicon or another suitable material. In some embodiments, the non-active layer 246, spacing member 280, and sealing member 290 are all constructed from the same material (e.g., monolithically formed from a silicon support).In one example embodiment, the non-active layer 246, the spacing member 280, and the sealing member 290 are formed from a double silicon-on-insulator (SOI) support.

[00130] The spacing member 280 is shown to include an intermediate layer interposed between two peripheral layers. In one example embodiment, the intermediate layer and the non-active layer 246 comprise two silicon layers of a double SOI support, with the peripheral layers positioned on either side of the intermediate layer including silicon oxide layers. In this example, the sealing member 290 and the spacing member 280 are formed by etching the surface of the double SOI support opposite the drive portion 242. The oxide layers serve to control or stop the etching process once, for example, the entire intermediate layer forming the spacing member 280 is removed in a region separating the spacing member 280 and the sealing member 290. Such a process provides precise control over both the width and thickness of the spacing and sealing members 280 and 290.

[00131] As will be seen, the size of the sealing member 290 can contribute to the resonant frequency of the drive rod 240. Larger amounts of material placed on or near one end of the drive rod 240 generally result in a lower resonant frequency of the drive rod. Additionally, such larger amounts of material can impact the initial bending of the drive rod 240 induced by the pressurized fluid in contact. ML / with the drive rod 240. Consequently, the desired size of the sealing member 290 impacts several other design choices for the drive rod 240. These design choices are described in more detail with reference to Figure 7A. In some embodiments, the sealing member 290 is sized based on the dimensions of the bore 260. In some embodiments, the sealing member 290 is substantially cylindrical and has a diameter approximately 1.5 times that of the bore 260. For example, in one embodiment, the sealing member 290 has a diameter of approximately 90 microns when the bore 260 has a diameter of approximately 60 microns. Such a configuration facilitates alignment between the sealing member 290 and the bore 260 such that the sealing member 290 completely covers the bore 260 after contacting the valve seat 270.In another embodiment, the sealing member 290 is dimensioned so that it has a surface area approximately twice that of the bore 260 (for example, the spacing member 280 may have a diameter of approximately 150 microns, while the bore 260 is approximately 75 microns in diameter). This embodiment provides greater tolerance for aligning the sealing member 290 and the bore 260 to facilitate sealing between the valve seat 270 and the sealing member 290. In other embodiments, the diameter of the sealing member 290 may be 2, 2.5, 3, 3.5, or 4 times the diameter of the bore 260. In different embodiments, the length-to-diameter ratio of the bore 260 may range from 1:1 to 15:1. The ratio can influence the shape, size and / or volume of a fluid droplet expelled through orifice 260 and may vary based on a particular application.

[00132] Beneficially, the gap 324 between the spacing member 280 and the sealing member 290 creates a separation volume 326 between the drive bar 240 and the orifice plate 250. The spacing volume 326 prevents the compression film from being damped by the oscillations of the drive bar 240. In other words, insufficient separation between the orifice plate 250 and the drive bar 240 would lead to drag resulting from air entering and / or leaving the separation volume 326 as the drive bar 240 opens and closes the orifice 260. Having the larger separation volume produced by the spacing member 280 reduces such drag and thus allows the drive bar 240 to oscillate at faster frequencies.

[00133] Continuing with reference to Figure 6, the orifice plate 250 includes a base layer 252 and an intermediate layer 254. For example, in one embodiment, the base layer 252 comprises a silicon layer and the intermediate layer 254 includes a silicon oxide layer. In the embodiment shown, a portion of the intermediate layer 254 adjacent to the orifice 260 is removed, and a first portion of the valve seat 270 is placed directly on the base layer 252, and a second portion of the valve seat 270 is placed on the intermediate layer 254. It is understood that, in alternative embodiments, the intermediate layer 254 extends completely to the limits of the orifice 260, and the valve seat 270 is placed on the intermediate layer. MA / 254. In still other embodiments, the removed portion of the drive layer 254 may have a cross-section equal to or larger than a cross-section of the valve seat 270 such that the valve seat 270 is placed completely on the base layer 252.

[00134] Due to the criticality of the spatial relationship between the spacing member 280 and the valve seat 270, the spacing member 280 is coupled to the orifice plate 250 in a manner that allows precise control over the resulting distance between the drive rod 240 and the orifice plate 250. As shown, the adhesive layer 256 is used to couple the spacing member 280 to the orifice plate 250. In various embodiments, a precise amount of epoxy-based adhesive (e.g., SU-8, polymethyl methacrylate, silicone, etc.) is applied to the intermediate layer 254 before the spacing member 280 and drive rod 240 assembly is placed on it. The adhesive is then cured to form an adhesive layer 256 of precisely controlled thickness.For example, in some embodiments, a lower surface of the spacing member 280 is substantially aligned with an upper surface of the valve seat 270. Any desired relationship between these surfaces can be achieved to create a relationship between the sealing member 290 and the valve seat 270 that creates a suitable seal when the actuating rod 240 is in the starting position. In different embodiments, the adhesive layer 256 and the valve seat 270 can be formed from the same material (e.g., SU-8) in a simple photolithographic process.

[00135] In various embodiments, once the drive rod 240 and the orifice plate 250 are coupled together by means of the adhesive plate 256 (for example, to form the micro-valve 230), an additional adhesive layer 248 is applied to the periphery of the drive rod 240. The additional adhesive layer 248 is used to couple the inlet fluid manifold 210 to the drive rod 240. An interposition coil (for example, the interposition coil 222b) can be positioned in the inlet fluid manifold 210 and coupled to it by means of a second adhesive layer 225. In some embodiments, the additional adhesive layer 248 and the second adhesive layer 225 may include the same material as the adhesive layer 256.

[00136] Now, referring to Figure 7A, a more detailed view of the drive bar 240 is shown, according to an example configuration that is not to scale. As shown, the drive bar 240 includes the non-active layer 246, the tuning layer 244, a barrier layer 400, a first electrode portion 402, the drive portion 242, a second electrode portion 404, and a passivation structure 406. As will be understood, the drive bar 240 may include more or fewer layers in different alternative configurations.

[00137] In some embodiments, the tuning layer 244 is placed directly onto the non-active layer 246. The tuning layer 244 generally serves as an adhesion layer to facilitate the MA / deposition of the additional layers described herein. Additionally, as described herein, the thickness of the setting layer 244 can play a critical role in determining the overall curvature of the drive rod 240 when it is in its starting position. Generally speaking, the setting layer 244 is configured to have a predetermined setting stress such that, in the closed position, the sealing member 290 of the drive rod 240 makes contact with and exerts a force on the valve seat 270 to fluidly seal the bore 260.In some embodiments, in the absence of an electrical signal, the predetermined setting effort is configured to cause the drive rod 240 to bend toward the bore 260 such that, in the absence of the valve seat 270, the sealing member surface of the sealing member 290 would be positioned a predetermined distance (e.g., 2 microns) below a lower surface of the spacing member 280. For example, the setting layer 244 may be placed in a state of compressive stress as a result of the deposition of the additional layers described herein. As such, the thicker setting layer 244 is the greatest curvature of the drive rod 240 toward the bore 260 when it is in its starting position.

[00138] The barrier layer 400 acts as a barrier against the diffusion of materials contained in the first piezoelectric layer 414 into the tuning layer 244. If left unchecked, such migration can lead to harmful mixing effects between constituent materials in the layers, adversely impacting performance. In different embodiments, the barrier layer 400 is constructed of, for example, zirconium oxide or zirconium dioxide. As shown, the first electrode portion 402 includes an adhesion layer 408 and a first electrode 410. The adhesion layer 408 facilitates the deposition of the first electrode 410 onto the barrier layer 400 and prevents the diffusion of material in the first electrode 410 into other layers. In different embodiments, the adhesion layer 408 is constructed of titanium.The first electrode 410 may be constructed of platinum or gold to provide a conductive path for delivering electrical signals to the drive portion 242. In some embodiments, the first electrode portion 402 is only included in selected portions of the drive bar 240. For example, the first electrode portion 402 may only be included adjacent to and / or within the electrical connection portion 294.

[00139] The drive portion 242 may consist of a single layer or multiple layers of any suitable piezoelectric material. In the example shown, the drive portion includes a growth pattern or seed layer 412 and a piezoelectric layer 414. The growth pattern layer 412 serves as a seed layer that facilitates the growth of the piezoelectric layer 414, which has a desired texture (e.g., crystal structure {001} and corresponding texture) to ensure maximum piezoelectric response. In some embodiments, the growth pattern layer 412 is constructed of lead titanate. The piezoelectric layer 414 may be constructed of any suitable material, such as MA / lead zirconate titanate (PZT).

[00140] The piezoelectric layer 414 can be deposited using any method, such as using vacuum deposition techniques or sol-gel deposition techniques. In some embodiments, the piezoelectric layer 414 may have a thickness in the range of approximately 20–200 microns (e.g., 20, 30, 40, 50, 60, 70, 80, 90, 100, 120, 140, 160, 180, or 100 microns) and is adapted to produce a deflection at one end of the drive rod 240 of approximately 10 microns when an electrical signal is applied to it. A deflection of 10 microns (e.g., such as a sealing member surface 290 separating from the valve seat 270 by slightly less than that amount) may be sufficient to produce drops in the orifice 260 that are of a desired size. In some embodiments, the piezoelectric layer 414 has a piezoelectric transverse coefficient (d31 value) of approximately 140 to 160 pm / Z.This value can enable the generation of a suitable deflection of the drive bar 240 by means of electrical signals supplied to the first and second portions of electrodes 402 and 404.

[00141] As shown, the second electrode portion 404 is positioned over the drive portion 242. In various configurations, the second electrode portion 404 is structured similarly to the first electrode portion 402 described herein. Applying a voltage to the first electrode portion 402 and / or the second electrode portion 404 induces deformation in the piezoelectric layer 414, causing the entire drive rod 240 to fold from the orifice plate 250. By applying periodic control signals to the first and second electrode portions 402 and 404, the periodic cycling of the drive rod 240 generates droplet output from the orifice 260 at a desired frequency. Although Figure 7A shows the first and second portions of electrode 402 and 404 overlapping each other, in other locations, the first and second portions of electrode 402 and 404 may not overlap.This can limit or prevent electron leakage between the first and second portions of electrode 402 and 404, which can damage the piezoelectric layer 414 or cause electrical shorts.

[00142] The materials shown in Figure 7A can extend substantially the entire length of the drive rod 240. As such, there is an overlap between the electrode portions 402 and 404 and the reservoir formed by the micro-valve 230. In various configurations, the fluid contained in the reservoir 300 is electrically conductive and / or corrosive to the materials forming the first and second electrode portions 402 and 404. Thus, it is preferable to isolate the electrode portions 402 and 404 from the fluid reservoir 501 to prevent the fluid contained in the reservoir 300 from coming into contact with the electrode portions 402 and 404.

[00143] With respect to this, passivation structure 406 is configured to carry out such ML / insulation. In the example shown, the passivation structure 406 includes a dielectric layer 416, an insulating layer 418, and a barrier layer 420. The barrier layer 420 may be constructed of silicon nitride, which acts as a diffusion barrier against water molecules and ions contained in the fluid to prevent corrosion of the electrode portions 402 and 404. In some embodiments, the insulating layer 418 includes a silicon dioxide layer that has a compressive strength that barely counteracts the tensile strength in the barrier layer 420. The dielectric layer 416 may be constructed of aluminum oxide to prevent oxidation of the additional layers contained in the drive bar 240. In some embodiments, an additional metal layer is placed over the barrier layer 420.For example, the metal layer may be constructed of tantalum oxide or any other chemically resistant metal suitable for further enhancing the protective properties of the passivation structure 406. In certain embodiments, the barrier layer 420 may be made of Teflon or parylene. In other embodiments, at least a portion of the drive bar 240, i.e., the structure formed by the layers shown in Figure 7A, may be coated with a layer of Teflon or parylene. Such a coating may prevent microcracks from forming in the layers of the drive bar 240. In still other embodiments, the coating may include a metallic layer, for example, a layer of tantalum or palladium.

[00144] The addition of the passivation structure 406 can significantly impact the starting positioning of the drive bar 240. This is because the passivation structure 406 is offset from a compression neutral axis 422 of the drive bar 240. As shown, the neutral axis 422 is within the non-active layer 246, meaning that the electrode portion 404 and the passivation structure 406 are the furthest from it on the drive bar 240. Therefore, tensile or compressive stresses induced in such layers will greatly influence the starting curvature of the drive bar 240. As such, the thickness of the tuning layer 244 is selected based on the structure of the different constituent layers of the passivation structure 406.

[00145] Figure 7B is a cross-sectional front view of drive bar 240 showing an arrangement of each of the layers included in the drive bar, according to an example modality and not to scale. As shown, drive bar 240 includes the non-active layer 246, the tuning layer 244, and a barrier layer 400, as described with respect to Figure 7A. The first electrode position 402 includes the adhesion layer 408 (e.g., titanium oxide) positioned over the barrier layer 400, and a conductive layer or electrode 410 (e.g., platinum or gold) positioned over it.The first portion of electrode 402 is configured to have a width that is less than a width of the barrier layer 400 such that the ends of the portion of electrode 402 in a direction perpendicular to a longitudinal axis of the drive bar 240 are located inside the ends of the barrier layer 400 in the same direction. ML /

[00146] The drive portion 242, which includes the seed layer 412 and the piezoelectric layer 414, is conformally positioned on the first electrode portion 402 to extend beyond the lateral ends of the first electrode portion 402 and make contact with the barrier layer 400. The piezoelectric layer thereby completely surrounds or encapsulates at least that portion of the first electrode portion 402 that overlaps or is adjacent to the second electrode portion 404. The second electrode portion 404 includes an adhesion layer 403 (for example, titanium) and a conductive layer 405 (for example, platinum or gold). In some embodiments, the second electrode portion 404 may include only the conductive layer 405 positioned directly on the piezoelectric layer 414 (i.e., the adhesion layer 403 is omitted).Since the drive portion 242 overlaps and extends beyond the ends of the first electrode portion 402, the drive portion effectively electrically isolates the first electrode portion 402 from the second electrode portion 404, to prevent electron leakage and current migration that may be detrimental to the performance of the drive bar 240.

[00147] The passivation structure 406 conformally coats the exposed portions of each of the other layers 246, 244, 400, 402, 242, and 404. However, the lower surface of the non-active layer 246 may not be coated with the passivation structure 406. The passivation structure 406 may include a dielectric layer 416, an insulating layer 418, a barrier layer 420, and a top passivation layer 424. The barrier layer 420 may be constructed of silicon nitride, which acts as a diffusion barrier against water molecules and ions contained in the fluid to prevent corrosion of the electrode portions 402 and 404. However, silicon nitride is generally in a state of tensile stress once deposited onto the remaining layer. The insulating layer 418 is configured to counteract this tensile stress.For example, in some embodiments, the insulating layer 418 includes a silicon dioxide layer that has a compressive strength that barely counteracts the tensile strength in the barrier layer 420. In other embodiments, the barrier layer 420 may be positioned beneath the insulating layer 418. The dielectric layer 416 may be constructed of aluminum oxide, titanium oxide, zirconium oxide, or zinc oxide to prevent oxidation of the additional layers contained in the actuating rod 240. Thus, the passivation structure 406 serves to prevent both corrosion and oxidation—two major sources of defects caused by the presence of fluids—in the actuating rod 240, thereby ensuring the long-term performance of the micro-valve 230. Furthermore, the top passivation layer 424 is placed over the barrier layer 420 and may include a layer of Teflon or parylene.Such a coating can prevent microcracks from forming in the layers of the drive bar 240 and can also prevent an underlying layer from being exposed to plasma (for example, to which the buried layers may be exposed in subsequent manufacturing operations). In certain embodiments, the top passivation layer 424 may include a metallic layer, for example, a tantalum or palladium layer. In some embodiments, an additional metal layer is placed over the barrier layer 420. For example, the metal layer may be made of tantalum oxide or any other chemically resistant metal suitable for further enhancing the protective properties of the passivation structure 406.

[00148] In some embodiments, a contactless deposition system may include a jet assembly, for example, any of the jet assemblies described herein. For example, Figure 8 is a schematic illustration of a contactless deposition system 10 that includes a jet assembly 500, according to one embodiment. The jet assembly 500 includes a micro-valve 530 coupled to a carrier 504 by means of an interposing coil 522.

[00149] The micro-valve 530 includes an orifice plate 550 comprising a first surface 551 and a second surface 553 opposite the first surface 551. An orifice 560 extends from the first surface 551 to the second surface 553. The orifice plate 550 may be substantially similar to the orifice plate 250 / 250b and therefore will not be described in detail later herein. In some embodiments, a valve seat 570 may surround the orifice 560. The valve seat 570 defines an opening 518 in fluid communication with the orifice 560. The valve seat 570 may be substantially similar to the valve seat 270 / 270b and therefore will not be described in detail later herein.

[00150] A spacing member 579 is placed on the first surface 551 and is offset from the hole 560. An actuating bar 540 is placed on the spacing member 579. The actuating bar 540 extends from the spacing member 579 into the hole 560. The actuating bar 540 comprises a layer of piezoelectric material and is movable between a closed position and an open position by applying an electrical signal to the piezoelectric layer. A sealing member 588 is placed on an end portion of the actuating bar 540 and overlaps the hole 560.

[00151] For example, when the piezoelectric layer does not have an electrical signal (for example, a voltage or differential voltage) applied to it, the actuating bar 540 is in the closed position (for example, in its start state).In the closed position, a sealing member surface 589 of the sealing member 588 is in contact with the valve seat 570 (or the orifice plate 550 in embodiments where the micro-valve 530 includes the valve seat 570) to seal the orifice 560 and close the micro-valve 530. In the open position, the actuating rod 540 folds or bends from the orifice 560 such that the sealing member 588 no longer seals the orifice 560 and fluid can be expelled from the orifice 560 to the substrate 590. The actuating rod 540 may be substantially similar to actuating rod 2407240b or any other actuating rod described herein and, therefore, will not be described in detail further herein.

[00152] A fluid manifold 514 is coupled to the micro-valve and defines a fluid reservoir 501 MA / t / ¿U¿¿ / U4yUÓ4 ML / around the drive rod 540. The fluid manifold 514 may be substantially similar to the fluid manifold 314 / 314b and will therefore not be described in detail later herein. In some embodiments, an interposing coil 522 may be positioned above and coupled to the fluid manifold 514. The interposing coil 522 may be substantially similar to the interposing coil 222b in structure and function and will therefore not be described in detail later herein.

[00153] In addition, a carrier 502 can be placed on and coupled to the interposing coil 522 such that the orifice plate 550, fluid manifold 514, interposing coil 522, and carrier 502 collectively define a boundary of the fluid reservoir 501. The carrier 502 includes a base portion 504 placed on and coupled to the interposing coil 522 to define a portion of the boundary of the fluid reservoir 501. Sidewalls 505 extend from the base portion 504 away from the micro-valve 530 such that the carrier defines a fluid channel 511 through it. A membrane 508 (for example, a rubber or foam membrane) can be positioned at an inlet of the fluid channel 511, and a filter 513 can be positioned at an outlet of the fluid channel 511.A cover 503 (for example, a plastic or glass cover) can be positioned on the side walls 505 such that the membrane 508 is positioned between the side walls 505, forming the fluid channel 511 and the cover 503, and secured between them. An opening 509 can be defined in the cover 503 and correspond to the inlet of the fluid channel 511. A fluid connector 51 can be attached to the cover 503 or the opening 509 of the fluid channel 511 (for example, by means of a fluidic coupler). The fluid connector 51 may include an insertion needle 52 configured to pierce the membrane 508 and be inserted through it into the fluid channel 511. The fluid connector 51 is configured to provide pressurized fluid to the fluid reservoir 501 (for example, pressurized by means of a pump positioned upstream of the fluid connector 51) by means of the insertion needle 52.In addition, filter 513 is configured to filter particles from the fluid before the fluid is communicated to fluid reservoir 501. In some embodiments, carrier 502 and needle 52 may be substantially similar to carrier 202b and needle 12b and therefore will not be described in detail later herein.

[00154] Although not shown in Figure 8 for clarity, the 500 jet assembly may include any other components as described with respect to the 200 / 200b jet assembly. Such components may include, for example, a 216 / 216b flexible printed circuit board, 220 / 220b wire links, a 218 / 218b encapsulant, a 219b electrical connector, a 215b circuit board, or any other components as described with respect to the 200 / 200b jet assembly. Such components may have the same structure, serve the same function, and be placed in the same locations as described above herein. It should be understood that although Figure 8 shows the contactless deposition system 10 including a single jet assembly 500, in other embodiments, the contactless deposition system 10 may include a plurality of jet assemblies 500.In such modalities, each of the plurality of 500 jet assemblies can be configured to deposit the same fluid on multiple corresponding substrates or to deposit a plurality of fluids on the same, or different, substrates.

[00155] In some embodiments, the contactless deposition system 10 may also include a platform 580 spaced from the micro-valve 530 of the jet assembly 500 on which the substrate 590 is positioned. In some embodiments, a motion mechanism 50 may be coupled to the jet assembly 500 by means of a coupling member 52 (for example, a coupling rod, shaft, or frame). Although shown coupled to the carrier 502, in other embodiments, the motion mechanism 50 may be coupled to the interposition coil 522, the fluid collector 514, or any other portion of the jet assembly 500. The motion mechanism 50 may include servomotors, a belt rail assembly, or any other component configured to provide two-dimensional (in the XY plane) or three-dimensional (in the XYZ plane) motion to the jet assembly 500 to allow fluid deposition at a predetermined location on the substrate 590.In other embodiments, the movement mechanism 50 may be additionally or alternatively coupled to the platform 580 and configured to move the platform 580, and therefore the substrate 590 relative to the jet assembly 500.

[00156] As described above, the fluid reservoir 501 is filled with a pressurized fluid supplied by the fluid connector 51 through the fluid channel 511. The fluid can be selectively expelled from the orifice 560 by applying an electrical signal (e.g., a differential voltage) to the drive rod 540, causing the cantilevered portion of the drive rod 540 to move from the orifice 560 and open the micro-valve 530. A drop of the fluid is expelled from the orifice 560 onto the substrate 590 and deposited thereon as a fluid reservoir 592 (e.g., a drop, a pattern, a mark, etc.).

[00157] The fluid may include any suitable fluid depending on the specific application in which the non-contact deposition system 10 is being used. The fluid may be a liquid, a gel, a powder, or a colloidal solution. Suitable fluids may include, but are not limited to, inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids, adhesives, powders, gels, dyes, cell stains, colloidal solutions, emulsions, suspensions, etc. In different modalities, the fluid may include a volatile fluid (e.g., solvent-based solutions such as inks, paint, or adhesive) or an air-sensitive fluid (e.g., a fluid containing components that are oxidized by oxygen in the air).In some embodiments, the contactless deposition system 10 can be configured to deposit a high-viscosity fluid having a viscosity in the range of 5-20 centipoise without using an external pump to pressurize the fluid supplied to the jet assembly 500. In addition, the contactless deposition system 10 may be capable of depositing fluids having a viscosity of up to 100. MA / t / ¿U¿¿ / U4yUÓ4 ML / centipoise by providing a pressurized fluid to the 500 jet assembly (e.g., pumped with an external pump).

[00158] The jet assembly 500 is structured to limit the exposure of such fluids to air present in the environment outside the jet assembly 500. For example, the initial position of the micro-valve 530 can be the closed position, as described earlier herein. Therefore, the fluid contained within the fluid reservoir 501 is only exposed to air when the micro-valve 530 opens, thus limiting air exposure. This can increase fluid life and eliminate the need for a controlled environment to perform the deposition operation, thereby reducing costs.

[00159] The substrate 590 may include any suitable substrate. Figures 9-14 are schematic illustrations of different substrates that can be used to deposit a fluid onto them using the contactless deposition system 10. Referring to Figure 9, in some embodiments, the substrate may include a histopathology cartridge 690. The histopathology cartridge 690 may include a plurality of slots 691, each configured to hold a different cell or tissue sample. In such embodiments, the fluid may include a cell stain, and the contactless deposition system 10 may be configured to deposit the same stain in each slot 691 or a different stain in different slots 691 (e.g., by means of a plurality of micro-valves included in the contactless deposition system 10).In some embodiments, the fluid may comprise an ink and the non-contact deposition system 10 may be configured to deposit ink on the histopathology cartridge 690 forming a mark 692 (e.g. a logo, a barcode, a serial number, etc.) on the histopathology cartridge 690.

[00160] In some embodiments, the substrate may comprise a slide 790 shown in Figure 10. For example, the slide 790 may include a microscope slide and may be made of glass or plastic. In such embodiments, the fluid may comprise a chemical, biological, or biochemical solution. Biochemical or biological solutions may include, for example, solutions containing biomolecules, such as proteins (e.g., antibodies, antigens, enzymes, protein fractions, etc.), oligonucleotides, DNA strands, cell lysate, etc., in a buffer solution or physiological solvent. In some embodiments, a gelling agent (e.g., a solgel or hydrogel) or a polymerizing agent may also be included in the solution.The non-contact deposition system 10 can be configured to deposit an array of droplets 794 of the solution (e.g., droplets with volumes from 500 pL to 10 nL) onto the slide 790 to form a microarray, which can be analyzed using fluorescent probes or any other suitable analytical technique. In some embodiments, the non-contact deposition system 10 can also be configured to deposit ink onto the slide 790 to form a mark 792 (e.g., a logo, barcode, serial number, etc.) on it. MA /

[00161] In other embodiments, the substrate may comprise a fabric (e.g., cotton, nylon, polyester, spandex, rayon, a carpet, etc.), a ceramic tile, a machined wood tile, or a laminate. In such embodiments, the contactless deposition system 10 may be configured to deposit any suitable fluid onto the substrate, e.g., conductive ink (e.g., silver conductive ink, polyethylene dioxythiophene (PEDOT), polypyrolyl (PPy), etc.), paint, nanocoatings, or antimicrobial coatings. For example, Figure 11 shows a fabric 890 that may include a garment formed from any suitable material described herein. The contactless deposition system 10 may be used to deposit conductive ink in a predetermined pattern onto the fabric 890 to form an electrical component 894 (e.g., a resistor, electrode conductors, or contacts) on a surface of the fabric 890.Furthermore, the non-contact deposition system 10 can also be configured to deposit ink onto fabric 890 to form a mark 892 on it. Similarly, Figure 13 shows a substrate 1090 that can include a fabric (e.g., cotton, nylon, polyester, spandex, rayon, a carpet, etc.), a ceramic tile, a machined wood tile, or a laminate, and the non-contact deposition system 10 is used to deposit a coating 1092, e.g., a nanocoating or an antimicrobial coating, onto the substrate 1090. Figure 14 shows a substrate 1090 that can include a fabric (e.g., cotton, nylon, polyester, spandex, rayon, a carpet, etc.), a ceramic tile, a machined wood tile, or a laminate, and the non-contact deposition system is configured to deposit an ink or paint onto the substrate 1090 to form a pattern 1192 on the substrate 1090.

[00162] In some embodiments, the substrate may comprise a circuit board. For example, Figure 12 shows a circuit board 990, e.g., a printed circuit board (PCB). The contactless deposition system 10 may be configured to deposit a conductive fluid (e.g., a conductive silver ink, polyethylene dioxythiophene (PEDOT), polypyrrole (PPy), etc.), a semiconductor fluid (e.g., hydrogenated amorphous silicon mixed with arsenic, selenium, and / or tellurium), or a piezoelectric fluid to print circuits onto the circuit board 990. For example, Figure 12 shows an exemplary circuit comprising an electrode conductor 994 between two contact points 996 printed on the circuit board 990 using the contactless deposition system 10.In other embodiments, the contactless deposition system 10 can also be used to deposit ink or paint on circuit board 990, for example, to form a mark 992 on circuit board 990. The contactless deposition system 10 may be capable of forming multiplexed electrical connections on circuit board 990.

[00163] In some embodiments, the contactless deposition system 10 may also be enabled to print fruit and vegetable decals or labels that are affixed to a food item to provide various information (for example, price, expiration date, origin, etc.). For example, the contactless deposition system 10 may be configured to deposit decals. MA / on such labels as well as printed marks on them.

[00164] In some embodiments, the fluid may comprise a polymer capable of phase change to a solid (e.g., a molten plastic solidifying on a cooling polymer or a liquid polymerizing upon exposure to air). In such embodiments, the non-contact deposition system 10 may be configured to deposit a plurality of polymer layers onto the substrate 590 to form a three-dimensional object having a predetermined shape. For example, the motion mechanism 50 may be configured to move the jet assembly 500 along a predetermined path such that a plurality of polymer layers are deposited sequentially onto the substrate to form the three-dimensional object. In other words, the non-contact deposition system 10 may be used for 3D printing.

[00165] In some embodiments, a jet assembly can be configured to receive a plurality of fluids. For example, Figure 15 is a schematic illustration of a jet assembly 1200 that can be used in the contactless deposition system 10, according to one embodiment. The jet assembly 1200 comprises a micro-valve 530 including the orifice plate 550 defining the orifice 560 therethrough, and the actuator rod 540 with the sealing member 588 positioned at one end thereof overlapping the orifice 560, as described earlier herein. Unlike jet assembly 500, jet assembly 1200 includes a carrier 1202 positioned over and coupled to the interposing coil 522 such that the orifice plate 550, fluid manifold 514, interposing coil 522, and carrier 1202 collectively define a boundary of the fluid reservoir 501.

[00166] Carrier 1202 includes a base portion 1204 positioned on and coupled to the interposing coil 522. Sidewalls 1205 extend from the base portion 1204 from the micro-valve 530. However, unlike the jet assembly 500, the sidewalls 1205 define a first fluid channel 1211a and a second fluid channel 1211b through carrier 1202. A first membrane 1208a is positioned at an inlet of the first fluid channel 1211a, and a second membrane 1208b is positioned at an inlet of the second fluid channel 1211b. In addition, a first filter 1213a and a second filter 1213b are positioned at an outlet of the first and second fluid channels 1211a and 1211b, respectively. A cover 1203 can be positioned on the side walls 1205 in such a way that the membrane 1208a / b is positioned between the side walls 1205 forming the fluid channels 1211 a / b and the cover 1203, and secured between them.On cover 1203 there are openings 1209a / by that correspond to the entrance of the fluid channel 1211 a / b.

[00167] A first fluid connector 51a is coupled to the first opening 1209a, and said second fluid connector 51b is coupled to the second opening 1209b defined in the cover 1203 corresponding to the inlets of the first and second fluid channels 1211a and 1211b, respectively (for example, by means of ML / fluidic couplers). The fluid connectors 51a / b include corresponding insertion needles 52a / b configured to pierce the membranes 1208a / b and be placed through them into the fluid channels 1211 a / b.

[00168] The first fluid connector 51a is configured to distribute a first fluid to the first fluid channel 1211a, and the second fluid connector 51b is configured to distribute a second fluid, different from the first fluid, to the second fluid channel 1211b. Thus, the first fluid channel 1211a is configured to distribute the first fluid (for example, an ink or paint having a first color) and the second fluid channel 1211b is configured to distribute the second fluid (for example, an ink or paint having a second color different from the first color) to the fluid reservoir 501. The jet assembly 1200 can be configured to selectively deposit the first fluid, the second fluid, or a mixture of the two formed within the fluid reservoir 501 onto the substrate (for example, the substrate 590).For example, the first fluid can be selectively distributed through the first fluid connector 51a to the fluid reservoir 501 and deposited onto a substrate (for example, substrate 590 or any other substrate described herein). The distribution of the first fluid through the first fluid connector 51a can be selectively stopped, and the second fluid can then be distributed to the fluid reservoir 501 by means of the second fluid connector 51b. In other embodiments, each of the first and second fluid connectors 51a / b can simultaneously distribute the first and second fluids to the fluid reservoir 501 such that a mixture of the two is formed in the fluid reservoir 501. The mixture is then selectively deposited onto the substrate by the micro-valve 530.Although Figure 15 shows that the carrier includes two fluid channels 1211a / b, any number of fluid channels can be provided in the carrier 1202 in such a way that any number of fluids can be distributed to the fluid reservoir 501 to be deposited individually on the substrate or a mixture of at least a portion of them can be deposited on the substrate.

[00169] The 1200 jet assembly can be used in any suitable application for depositing fluids or mixtures thereof onto a substrate. For example, in some embodiments, the substrate may include artificial or natural nails. In such embodiments, the first fluid may comprise a first nail color, and the second fluid may comprise a second nail color different from the first nail color. The 1200 jet assembly can be configured to deposit a predetermined pattern of the first color, the second color, or a mixture thereof onto the natural or artificial nails. In other embodiments, the substrate may comprise a mixing palette (for example, a palette for mixing art colors or hair dyes), and the first and second fluids may include a powder, a liquid, and / or a gel that is mixed within the 501 reservoir or deposited individually onto the palette so that they can be mixed on the palette.

[00170] In some embodiments, a jet assembly may include a predetermined fluid supply and a pressurization mechanism to pressurize the fluid within the fluid reservoir so that external fluid connectors are not required. For example, a jet assembly carrier may define an internal volume that contains the fluid. The fluid may be contained in a compressible fluid container placed within the internal volume and may be under constant pressure. In such embodiments, the carrier or a portion of the carrier may be removable.

[00171] For example, Figure 16 is a schematic illustration of a jet assembly 1300, according to one embodiment. The jet assembly 1300 includes a micro-valve 530 and a carrier 1310 coupled to the micro-valve 530. The carrier 1310 comprises a first portion of carrier 1302 that is coupled to the micro-valve 530. The first portion of carrier 1302 may be substantially similar to carrier 502 and, therefore, will not be described in detail later herein. The carrier 1310 also comprises a second carrier portion 1320 positioned over and coupled to the first carrier portion 1302. The second carrier portion 1320 includes a second carrier portion 1322 defining an internal volume 1324. A compressible fluid container 1326 (for example, a flexible bag or sleeve containing the fluid) is positioned in the internal volume.A needle 1321 can smoothly couple the compressive fluid container 1326 to a fluid channel 1311 defined in the first carrier portion 1302, as described above herein.

[00172] A portion of the internal volume surrounding the compressive fluid container 1326 is filled with a compressed gas (e.g., compressed air or nitrogen). The compressed gas exerts constant pressure on the compressive fluid container 1326, causing it to distribute the pressurized fluid through the needle 1321 and fluid channel 1311 to the fluid reservoir 501. As the micro-valve 530 opens and fluid is expelled from the orifice 560, the compressive fluid container 1326 distributes more fluid to the fluid reservoir 501 due to the continuous gas pressure acting upon it. In this way, a separate fluid connector and a pressurized fluid supply can be excluded from the contactless deposition system, including the jet assembly 1300.

[00173] In some embodiments, the jet assembly 1300 can be replaced with a new jet assembly once the fluid contained within the second carrier portion 1320 has been exhausted. In other embodiments, the carrier 1310, or a portion thereof, can be removably coupled to the micro-valve, which can be replaced with a new carrier 1310, or a portion thereof, once the fluid contained within it has been exhausted. For example, the second carrier portion 1320 can be removably coupled to the first carrier portion 1302, for example, by means of a snap-fit ​​mechanism (e.g., clips, protrusions, fasteners, holes, etc.), bands, screws, bolts, etc. Once all the fluid contained within the compressive fluid container 1326 has been distributed to the fluid reservoir 510, a user can replace the second carrier portion 1320 with a new one that is filled with fluid. MA / t / ¿U¿¿ / U4yUÓ4 M A /

[00174] Figure 17 is a schematic illustration of a jet assembly 1400, according to another embodiment. The jet assembly 1400 includes the micro-valve 530 and a carrier 1410 coupled to the micro-valve 530. The carrier 1410 comprises a first carrier portion 1402 that is coupled to the micro-valve 530. The first carrier portion 1402 may be substantially similar to the carrier 502 and, therefore, will not be described in detail later herein. The carrier 1410 also comprises a second carrier portion 1420 positioned over and coupled to the first carrier portion 1402. The second carrier portion 1420 includes a second carrier portion housing 1422 that defines an internal volume 1424 within which the compressible fluid container 1426 is placed.A needle 1421 can smoothly couple the compressive fluid container 1426 to a fluid channel 1411 defined in the first carrier portion 1402, as described above herein.

[00175] Unlike carrier 1310, carrier 1410 includes a thrust member 1428 positioned in the internal volume 1424 that can be coupled to a pressure plate 1429 in contact with the compressible fluid container 1426. The thrust member 1428 pushes the pressure plate 1429 into the compressible fluid container 1426 to exert pressure on the compressible fluid container 1426. The pressure causes the fluid to communicate to the fluid reservoir 501 through the fluid channel 1411.

[00176] Figure 18 is a schematic illustration of a 1500 jet assembly, according to yet another modality. The jet assembly 1500 includes a micro-valve 530 and a carrier 1510 coupled to the micro-valve 530. The carrier 1510 includes a first carrier portion 1502 coupled to the micro-valve 530, and a second carrier portion 1520 coupled to the first carrier portion 1502. The first carrier portion 1502 is substantially similar to the first carrier portion 1302. Unlike the second carrier portion 1320, the second carrier portion 1520 includes a diaphragm 1536 that divides an internal volume of the second carrier portion 1520 into a first volume 1524 and a second volume 1525. The first volume 1524 is filled with compressed gas (e.g., compressed air or nitrogen) and the second volume 1525 is filled with a fluid.The compressed gas exerts pressure on the diaphragm 1526 and therefore on the fluid, causing the fluid to be communicated to the fluid reservoir 501.

[00177] Although different jet assembly configurations shown herein include a single orifice, in other configurations, an arrangement of orifices may be defined in the jet assembly's orifice plate in any suitable pattern. For example, Figure 19 shows one configuration of an orifice plate 1650 that includes an arrangement of orifices defined in a circular pattern. Figure 20 shows another configuration of an orifice plate 1750 that includes an arrangement of orifices 1760 defined in a semicircular pattern. Figure 21 shows yet another configuration of an orifice plate 1850 that includes an arrangement of orifices 1860 defined in an elliptical pattern. Figure 22 shows yet another configuration of an orifice plate 1950 that includes an arrangement of orifices 1960 defined in an octagonal pattern. Figure 23 shows ML / still another modality of a 2050 hole plate that includes an arrangement of 2060 holes defined in an asymmetric pattern.

[00178] In some embodiments, a micro-valve including orifice plate 1650, 1750, 1850, 1950, 2050 may include a single actuating rod for depositing fluid through each of the plurality of orifices 1660, 1760, 1860, 1960, 2060. For example, a sealing member (for example, sealing member 588) of the actuating rod (for example, actuating rod 540) may be large enough to overlap and seal each of the plurality of orifices 1660, 1760, 1860, 1960, 2060 in the closed position of the micro-valve such that when the actuating rod is moved to the open position, fluid is expelled through each of the plurality of orifices 1660, 1760, 1860, 1960, 2060. 1860, 1960, 2060.In other embodiments, a specialized drive rod may be associated with a corresponding orifice from the plurality of orifices 1660, 1760, 1860, 1960, 2060 such that the fluid may be selectively deposited through one or more of the orifices 1660, 1760, 1860, 1960, 2060 based on a particular application. It is understood that although Figures 19-23 specify orifice patterns, in other embodiments, the orifices may be defined in orifice plates in any suitable pattern. All such arrangements should be considered to fall within the scope of this description.

[00179] In some embodiments, any of the contactless deposition systems described herein can be configured to deposit fluids onto a microwell plate. For example, Figure 24 is a schematic illustration of a contactless deposition system 10 with a microwell plate 2190 placed on the platform 580. The microwell plate 2190 defines a plurality of microwells 2191 (for example, arranged in a rectangular array). In some embodiments, the microwell plate 2190 may include an array of microwells 2192 (for example, 6, 12, 24, 48, 96, 384, 1,536, 3,456, or 9,600 microwells) arranged in any suitable configuration, for example, a 2:3 rectangular array. Each 2192 microwell can be configured to hold a fluid volume, for example, in a range from 10 nLs to 10 mL.

[00180] In such embodiments, the fluid may include a solution of chemical, biochemical, and / or biological molecules, and the contactless deposition system 10 may be configured to deposit a volume of the solution into each of a plurality of microwells. For example, the fluid may include solutions used to perform Enzyme-Linked Immunosorbent Assays (ELISA), Polymerase Chain Reactions (PCR), cell culture, filtration, separation, optical detection, reaction mixing, microbial activity detection, etc. In some embodiments, the contactless deposition system 10 may include a plurality of jet assemblies 500, each configured to deposit a separate solution into a corresponding microwell 2192. In other embodiments, the contactless deposition system 10 may include the assembly of MA / jet 1200 instead of jet assembly 500 or any other jet assembly that can deposit a plurality of fluids onto microwell plate 1290.

[00181] In still more configurations, deposition systems that include jet assemblies and micro-valves are configured to dispense a fluid that is a gas. Such fluids are collectively called gaseous fluids. The type of gas is not limited and may be one or more of air, oxygen, nitrogen, carbon dioxide, hydrogen, or a noble gas. Examples of noble gases include one or more of helium, neon, argon, krypton, xenon, and radon. In some configurations, the gaseous fluid may include one or more liquid particles, for example, water in atomized form. However, in other configurations, the gaseous fluid does not include any added liquid particles. It should be noted that when the gaseous fluid does not include any added liquid particles, there may still be some measurable amount of liquid particles incidental to the system, such as from the condensation of moisture in compressed atmospheric air.

[00182] When deposition systems are configured to dispense gaseous fluids, the pressure of the gaseous fluid within a reservoir of the jet assembly or micro-valves is greater than the atmospheric pressure surrounding the deposition system, jet assembly, or micro-valves. This ensures that the gaseous fluid is expelled from an orifice and into the atmosphere. In some configurations, the pressure can be changed during operation to provide different uses or different operating effects to the same deposition system.

[00183] When deposition systems are configured to dispense gaseous fluids, the deposition systems can be incorporated into various devices. For example, such deposition systems can be incorporated into one or more sorting equipment, dehydrators, air knives, air jet cleaners, liquid venting, spray coating, optical cleaners, surface cleaners, and haptic interface devices. Examples of haptic interface devices that incorporate the deposition systems described herein include one or more headsets, hand covers, gloves configured to fit the hands, foot covers, boots configured to fit the feet, pants, shirts, covers for any section of skin, head covers, and face covers.Such haptic interface devices direct the gaseous fluid towards a user, thereby enabling the user to perceive haptic sensations.

[00184] As used herein, the terms “around” and approximately, as used herein, generally mean plus or minus 10% of the stated value. For example, approximately 0.5 would include 0.45 and 0.55, approximately 10 would include 9 to 11, and approximately 1000 would include 900 to 1100.

[00185] The terms coupled, connected, and the like, as used herein, mean ML / The direct or indirect joining of two members to each other. Such a joining may be stationary (e.g., permanent) or movable (e.g., removable or detachable). Such a joining may be achieved with the two members or the two members and any additional intermediate members integrally formed as a single unitary body with each other, or with the two members or the two members and any additional intermediate members coupled together.

[00186] References made herein to the positions of elements (e.g., top, bottom, above, below, etc.) are used simply to describe the orientation of the different elements in the figures. It should be noted that the orientation of the different elements may differ according to other example modalities, and that such variations are intended to be covered by this description.

[00187] The construction and arrangement of the elements as shown in the example modalities are for illustrative purposes only. Although only some modalities have been described in detail in this description, those experienced in the subject who review this description will quickly understand that many modifications are possible (e.g., variations in size, dimensions, structures, shapes and proportions of the different elements, parameter values, assembly arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter mentioned. For example, the integrally formed elements shown may be constructed from multiple parts or elements, the position of the elements may be reversed or varied, and the nature or number of different elements or positions may be altered or varied.

[00188] Additionally, the word "exemplary" is used to mean that it serves as an example, instance, or illustration. Any embodiment or design described herein as exemplary or as an example is not necessarily considered preferred or advantageous with respect to other embodiments or designs (and such a term is not intended to connote that such embodiments are necessarily extraordinary or superlative examples). Rather, the use of the word "exemplary" is intended to present concepts in a concrete manner. Accordingly, all such modifications are intended to be included within the scope of this description. Other substitutions, modifications, changes, and omissions in the design, operating conditions, and arrangements of the preferred and other exemplary embodiments may be made without departing from the scope of the appended claims.

[00189] It is important to note that the construction and arrangement of the different modalities presented herein are for illustrative purposes only. Although only some modalities have been described in detail, those experienced in the subject who review this description will quickly understand that many modifications are possible (for example, variations in size, dimensions, structures, shapes and proportions of the different elements, parameter values, assembly arrangements, use of materials, colors, orientations, etc.) without significantly deviating from the novel teachings and advantages of the subject described herein. Additionally, it should be understood that the characteristics of one modality described herein can be combined with characteristics of other modalities described herein, as anyone experienced in the subject will understand.Five other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangements of the different example modalities without departing from the scope of the present invention.

[00190] While this specification contains many specific implementation details, these should not be considered as limitations on the scope of any invention or on what may be claimed, but rather as descriptions of specific features of particular implementations of particular inventions. Certain features described in this specification in the context of separate implementations may also be implemented in combination in a single implementation. Conversely, different features described in the context of a single implementation may also be implemented separately in multiple implementations or in any suitable subcombination.Furthermore, although features may have been previously described as acting in certain combinations and even initially claimed as such, one or more features of a claimed combination may in some cases be split off from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.

Claims

1. A contactless deposition system, comprising: a jet assembly comprising: at least one micro-valve, each micro-valve comprising: an orifice plate including a first surface and a second surface, the orifice plate comprising an orifice extending from the first surface to the second surface; a spacing member positioned on the first surface, the spacing member being offset from the orifice; a valve seat surrounding the orifice, the valve seat defining an opening in fluid communication with the orifice; and an actuating rod positioned on the spacing member, the actuating rod extending from the spacing member into the orifice.comprising the actuator rod comprising a layer of piezoelectric material and being movable between a closed position and an open position upon application of an electrical signal to the layer of piezoelectric material, and a sealing member positioned at an end portion of the actuator rod; and a fluid collector coupled to the micro-valve and defining a fluid reservoir containing a pressurized fluid around the actuator rod, wherein when the layer of piezoelectric material does not have an electrical signal applied thereto, the actuator rod is in the closed position and a sealing member surface of the sealing member is in contact with the orifice plate to seal the orifice and close the micro-valve, and wherein in the open position fluid is expelled from the orifice onto a substrate and deposited thereon.

2. The contactless deposition system according to claim 1 further comprises: a platform spaced from the jet assembly and configured to receive a substrate on which the fluid will be deposited; and a motion mechanism coupled to at least one of the jet assembly or the platform and configured to provide three-dimensional motion to the jet assembly or the platform to deposit the fluid at a predetermined location on the substrate.

3. The contactless deposition system according to claim 2, wherein the substrate comprises a circuit board, and wherein the fluid comprises a conductive fluid, a semiconducting fluid, or a piezoelectric fluid.

4. The contactless deposition system according to claim 2, wherein the substrate MA / comprises a slide and wherein the fluid comprises a solution of at least one of chemicals, biochemicals or biomolecules, and wherein the contactless deposition system is configured to deposit an arrangement of droplets of the solution onto the slide.

5. The contactless deposition system according to claim 2, wherein the substrate comprises a microwell plate defining a plurality of microwells, and wherein the fluid comprises a solution of at least one chemical, biochemical, or biological molecule, and wherein the contactless deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

6. The contactless deposition system according to claim 2, wherein the fluid comprises a polymer and wherein the contactless deposition system is configured to deposit a plurality of layers of the polymer to form a three-dimensional object having a predetermined shape.

7. The contactless deposition system according to claim 2, wherein the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

8. The contactless deposition system according to claim 1, wherein the fluid is a gaseous fluid.

9. A haptic interface device comprising the contactless deposition system according to claim 1.

10. A contactless deposition system, comprising: a jet assembly comprising: at least one micro-valve, comprising: an orifice plate including a first surface and a second surface, the orifice plate comprising an orifice extending from the first surface to the second surface; an actuator rod positioned in a spaced relationship with the orifice plate, the actuator rod including a base portion and a cantilever portion, the cantilever portion extending from the base portion into the orifice such that an overlapping portion thereof overlaps the orifice, the actuator rod being movable between a closed position and an open position; and a sealing structure comprising a sealing member positioned on the overlapping portion of the cantilever portion.and a fluid collector coupled to the micro-valve and defining a fluid reservoir containing a pressurized fluid around the actuating rod, wherein, when the actuating rod is in the closed position, the cantilevered portion is positioned such that the sealing structure seals the orifice to close the micro-valve, and in the open position, the fluid is dispensed from the orifice to a substrate and deposited thereon.

11. The contactless deposition system according to claim 10 further comprises: a platform spaced from the jet assembly and configured to receive a substrate; and a motion mechanism coupled to at least one of the jet assembly or the platform and configured to provide three-dimensional motion to the jet assembly or the platform to deposit the fluid at a predetermined location on the substrate.

12. The contactless deposition system according to claim 11, wherein the substrate comprises a circuit board, and wherein the fluid comprises a conductive fluid, a semiconducting fluid, or a piezoelectric fluid.

13. The contactless deposition system according to claim 11, wherein the substrate comprises a slide and wherein the fluid comprises a solution of at least one of chemicals or biomolecules, and wherein the contactless deposition system is configured to deposit an arrangement of droplets of the solution onto the slide.

14. The contactless deposition system according to claim 11, wherein the substrate comprises a microwell plate defining a plurality of microwells, and wherein the fluid comprises a solution of at least one chemical, biochemical, or biological molecule, and wherein the contactless deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

15. The contactless deposition system according to claim 11, wherein the fluid comprises a polymer and wherein the contactless deposition system is configured to deposit a plurality of layers of the polymer to form a three-dimensional object having a predetermined shape.

16. The contactless deposition system according to claim 11, wherein the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

17. The contactless deposition system according to claim 10, wherein the fluid is a gaseous fluid.

18. A haptic interface device comprising the contactless deposition system according to claim 10.

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