POWER CONNECTOR WITH INTEGRATED STATUS MONITORING
Patent Information
- Authority / Receiving Office
- MX · MX
- Patent Type
- Patents
- Current Assignee / Owner
- HUBBELL INC
- Filing Date
- 2019-11-29
- Publication Date
- 2026-06-12
AI Technical Summary
Existing electrical power connectors lack integrated monitoring capabilities for power consumption, temperature, and environmental conditions, making it difficult to accurately measure energy usage and identify abnormal operating conditions, which can lead to potential failures.
The integration of sensors, transformers, and an electronic controller within the power connector to monitor current, voltage, and temperature, along with an antenna for wireless communication, enabling real-time data analysis and predictive maintenance through a diagnostic analysis logic unit.
Enables precise energy measurement, early detection of abnormal conditions, and proactive maintenance, reducing the risk of equipment failure and optimizing energy allocation.
Smart Images

Figure MX435041B0
Abstract
Description
POWER CONNECTOR WITH INTEGRATED STATUS MONITORING bzcM nn / eznz / E / γΐΛΐ RELATED APPLICATIONS This application claims the benefit with respect to U.S. provisional patent application No. 62 / 544,097, filed on August 11, 2017, which claims the benefit with respect to U.S. provisional patent application No. 62 / 512,479, filed on May 30, 2017, the contents of which are incorporated herein by reference. FIELD The modalities refer to electrical power connectors. COMPENDIUM Electrical power connectors provide a connection between a power source and a load. Such electrical power connectors are described in U.S. Patent Application No. 15 / 07 2,67 2, filed March 17, 2016, which is incorporated herein by reference. Energy measurements can be used to monitor the energy consumption of equipment connected via a power outlet. In some cases, the ability to accurately measure energy consumption allows an operator to allocate energy costs to different users based on equipment usage. Internal and environmental monitoring, particularly of temperature, current, and voltage, can be used to identify normal versus abnormal operating conditions. Continuous measurement allows for the identification of changes in operating parameters that fall outside acceptable ranges, triggering a warning to notify operators of this condition. Furthermore, data analysis and an understanding of normal operating parameters help provide users with predictive or preventative warnings before a potential failure occurs due to anomalies in the environment, the facility, or internal hardware. Other aspects of the application will become clear when considering the detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of an electrical power supply system according to one embodiment of the invention. It is a perspective view of a connector of Figure bzo / nn / rznz / E / YiAi electrical power supply of the bzcM nn / eznz / E / YiAi power supply system Figure 1 according to some application modalities. Figure 3A is an exploded view of a contact holder of the electrical power connector of Figure 2 according to some application modalities. Figure 3B is an exploded view of a contact holder of the electrical power connector of Figure 2 according to some application modalities. Figure 4 is a top view of a transformer winding according to another embodiment of the present invention. Figure 5 is a top view of a contact holder that includes the transformer of the Figure according to a modality of the application. Figure 6 is a block diagram illustrating the logic applicable to the power supply system in Figure 1. Figure 7A is a graph illustrating a parameter and voltage parameter thresholds of the power supply system from Figure 1. Figure 7B is a graph illustrating a parameter and current parameter thresholds of the power supply system from Figure 1. Figure 7C is a graph illustrating a parameter and temperature parameter thresholds of the feed system from Figure 1. bzo / nn / rznz / E / YiAi DETAILED DESCRIPTION Before any embodiment of the invention is explained in detail, it should be understood that the application is not limited in its application to the construction details and component arrangements that will be indicated in the description that follows or illustrated in the drawings. For ease of description, some or all of the system examples presented herein are illustrated with a single example of each of their component parts. Some examples may not describe or illustrate all the system components. Other embodiments may include more or fewer of each of the illustrated components, may combine some components, or may include additional or alternative components. The application is subject to other embodiments and may be implemented or carried out in various ways. It should be understood that, while the described system example is an electrical connector system, the application can be applied to other systems that include electrical connections. For example, also illustrated as a bolt and sleeve device, in other configurations, the power system may include switches, disconnects, or other wiring devices. Figure 1 illustrates an electrical power system 100, according to some application modalities. The power system 100 includes a power supply 105, a load 110, an electrical power connector, or plug, 115, and a power supply cable 120. In some modalities, the power supply 105 is a single-phase power supply that provides a voltage in the range of approximately 100 VAC to approximately 240 VAC. In other modalities, the power supply 105 is a three-phase power supply that provides a voltage in the range of approximately 208 VAC to approximately 600 VAC. In some modalities, the power supply 105 is a direct current power supply that provides a voltage in the range of approximately 350 VDC to approximately 450 VDC.In other configurations, power supply 105 is a DC power supply that provides a voltage in the range of approximately 44 VDC to approximately 60 VDC (e.g., 48 VDC). In yet another configuration, power supply 105 is a DC power supply that provides a voltage in the range of approximately 15 VDC to approximately 30 VDC (e.g., 48 VDC). Load 110 can be any electrical device or system configured to receive power. Figure 2 illustrates connector 115, according to one application configuration. The electrical power connector 115 is configured to provide an electrical connection between the power source 105 and the load 110. Connector 115 can be configured to handle 20 amps, 30 amps, 60 amps, 100 amps, etc. As illustrated, connector 115 includes a contact holder 200 and a sleeve connector 205. The contact holder 200 includes one or more power terminals 210 located at a first end 215 of the contact holder 200. Although not illustrated, the contact holder 200 may also include one or more second power terminals located at a second end 220 of the contact holder 200.Although illustrated with four '210' power terminals, connector 115 can include any number of power terminals and second power terminals (e.g., one power terminal and one second power terminal, two power terminals and two second power terminals, three power terminals and three second power terminals, four power terminals and four second power terminals, five power terminals and five second power terminals, etc.). In some embodiments, the 210 power terminals have an electrical connection to the load 110, while the second power terminals have an electrical connection to the power supply 105. Figures 3A and 3B illustrate the contact holder 200 according to various application configurations. As illustrated, the contact holder 200 includes an enclosure 300, a cover 305, one or more contact transformer (CT) modules 400, one or more sensors 325, an electronic controller 335, and an antenna 330. Each CT module 400 includes one or more connector contacts 310 and one or more contact cores 315. The enclosure 300 is made of a non-conductive material, such as, but not limited to, a plastic material. The cover 305 is also made of a non-conductive material, such as, but not limited to, a plastic material. The 300 housing, together with the cover 305, contains various components of the 200 contact holder. The 310 bzcM nn / eznz / E / γΐΛΐ connector contact(s) provide an electrical connection between the 210 power terminals and the second power terminals.The contact cores 315 are configured to receive the respective connector contacts 310. The contact cores 315 include transformer windings 320 integrated within them. The transformer windings 320 detect the current displacement through the respective connector contacts 310. As illustrated in Figures 4 and 5, in some embodiments, the transformer windings 320 have a substantially toroidal shape. In some embodiments, a three-phase power supply can be monitored by using two sets of transformer windings 320. In some embodiments, the electronic controller 335 includes an electronic processor and memory (not shown). The electronic processor obtains and provides information (for example, from memory, sensors 325, and / or antenna 330) and processes the information by, for example, executing one or more instructions or software modules capable of being stored in memory or other non-transient computer readable media (not shown). The software may include firmware, one or more applications, program data, filters, bZQ / nn / rznz / E / YiAi standards, program modules, and other executable instructions. In some embodiments, the electronic controller 335 may also include a user interface (not shown). The user interface may receive inputs from, for example, a user via connector 115, provide system outputs, or a combination of both.System outputs can be provided through audio and / or visual feedback. For example, the 115 connector may include a display as part of the user interface. The display may be a suitable screen, such as a touchscreen liquid crystal display (LCD) or an organic light-emitting diode (OLED) touchscreen. Alternative modes may include other output mechanisms such as light sources (not shown). Inputs may be provided, for example, through a numeric keypad, multi-function keys, on-screen icons or multi-function buttons, a scroll ball, buttons, and the like.The user interface may include a graphical user interface (GUI) (e.g., generated by the electronic processor from instructions and data stored in memory and displayed on the screen) that allows a user to interact with connector 115. In some configurations, connector 115 may use a user interface from an external communication device and / or load 110 to receive inputs and provide information. In still other configurations, the user may provide and / or receive inputs / outputs with connector 115 through an external device (e.g., a smartphone, tablet, etc.). In some embodiments, one or more of the 325 sensors are temperature sensors configured to detect core temperatures within the 115 connector. In some embodiments, the 325 sensors can detect the temperature of one or more points on the 200 contact plate. For example, these sensors can be located at multiple connection points and terminals within the 115 connector and configured to detect individual temperatures of particular terminals. These sensors can also include an ambient temperature sensor to detect an external temperature relative to the 200 contact plate and / or external temperature relative to the 115 connector. Such a sensor can be located inside or outside the 115 connector. In some embodiments, the 325 sensors include thermistors, thermocouples, resistance temperature detectors (RTDs), or similar devices.In some configurations, any of the BZO / NN / RZNZ / E / YiAi sensors 325 include one or more humidity and / or moisture sensors. In some configurations, the sensor(s) 325 are configured to detect an electrical characteristic of the power supply system 100. For example, these sensors may be configured to detect the voltage between the power supply 105 and the load 110 and / or a contact temperature 310. In some configurations, one or more of the sensor(s) 325 are located outside of connector 115. In the illustrated embodiment, antenna 330 is directed from the electronic controller 335 along the outer wall of the enclosure 300. In such an embodiment, antenna 330 may be located inside and / or outside the enclosure 300. In some embodiments, antenna 330 may be held in position by one or more slots in support protrusions and / or holes adjacent to the outer wall. Antenna 330 may be a dipole antenna, a loop antenna, a planar chip antenna, or any other known antenna. Antenna 330 is configured to wirelessly transmit various characteristics of connector 115. For example, antenna 330 may wirelessly transmit current, voltage, and temperature measurements from one or more sensors 325 inside connector 115.In some configurations, features are transmitted wirelessly to one or more external devices. These external devices may include the charging device 110, a communication device (i.e., a phone, tablet, or computer), a wired device, and / or a remote server / database or cloud network. In some configurations, instead of or in addition to the antenna 330, the connector 200 may include an input / output port. In such a configuration, the various features described above may be transmitted via a physical connection (e.g., a wired connection).In some modalities, the electronic controller 335 is partially located (i.e., some of the components of the electronic controller 335) within connector 115 and is partially located in at least one of the group consisting of an external communication device, an external wired device, a remote server, and a cloud network. The memory may include random-access memory (RAM), read-only memory (ROM), or other non-transient computer read media, and may include a program storage area and a data storage area. The program storage area and the data storage area may include combinations of different memory types, as described herein. In one embodiment, the electronic processor of the 335 electronic controller is configured to retrieve from memory and execute, among other things, software related to control processes, such as the methods described herein.For example, as will be described in more detail later with reference to Figure 4, the electronic controller 335 (specifically, the electronic processor) can be fully configured to determine the state of a load device based on one or more environmental or operational inputs. In some embodiments, the electronic controller 335 can be configured to provide information to an external device and / or remote server / database so that the external device and / or remote server / database can determine the state of a load device based on one or more environmental or operational inputs. Figure 3B illustrates the contact holder 200 according to another embodiment. One such embodiment further includes an insulating sleeve 311 and a separator 312. The insulating sleeve 311 is configured to receive the connecting contact(s) 310. Figure 4 illustrates shunted 320 transformer windings according to another application modality. As illustrated in Figure 5, the shunted 320 transformer windings can be integrated into, or around, the CT 400 modules. In such a modality, the shunted 320 transformer windings can be a Ragowski helical coil or a shunt-wound toroid. Such a modality allows the CT 400 modules to be placed in geometric shapes that are typically very small for a complete transformer winding. Such a modality can allow for more accurate current readings. Figure 6 is a process block diagram 600 illustrating the diagnostic analysis logic unit 602 applicable to the power system 100 of Figure 1. For ease of description, Figure 6 includes both hardware and / or software implementations and hardware components of the power system 100. In one mode, some or all of the functions of the diagnostic analysis logic unit 602 are implemented by the electronic processor of the bzcM nn / eznz / E / YiAi electronic controller 335 (using software, hardware, or a combination of both). In other modes, some or all of the functions of the diagnostic analysis logic unit 602 are implemented by an external communication device, an external wiring device, and / or a remote server / database outside of the power system 100.For example, the electronic processor can transmit the measurements from the 325 sensors to an external communication device, an external wiring device, and / or a remote server / database or cloud network for further processing. In some configurations, some or all of the functions of the 602 diagnostic analysis logic unit are implemented in a user interface (e.g., a graphical user interface). The diagnostic analysis logic unit 602 is configured to receive data and information from a variety of sources, including, for example, sensors 325, antenna 330, and the electronic processor. The diagnostic analysis logic unit 602 can also receive information (including, as described later, installation condition information 604, measured / calculated parameters 606, and information on bzcM nn / eznz / E / YiAi parameter thresholds 608) from one or more of the load 110, the power supply 105, an external communication device, an external wiring device, and / or a remote server / database or cloud network. The data and information received relate to the operation of the power system 100.For example, as illustrated in Figure 6, the diagnostic analysis logic unit 602 receives information about the installation and application condition 604 of the power system 100, measured / calculated parameters 606, and parameter threshold information 608 from the load 110, sensors 325, antenna 330, and / or power supply 105. It should be understood that other types of data and information related to the operation of the power system 100 may also be received. As will be explained in more detail later, the diagnostic analysis logic unit 602 is configured to process the received data and information to monitor the operation of the power system 100 and to detect one or more anomalies in the system 100. It should be understood that, although the processes performed by the diagnostic analysis logic unit 602 are described herein as static logic, in some modes the diagnostic analysis logic unit 602 may be configured to perform one or more machine learning or artificial intelligence process algorithms to perform or improve predictive or diagnostic capabilities based on information received from load 110 and / or connector 115. In those modes, the diagnostic analysis logic unit 602 may be configured to use predictive monitoring and diagnostic analysis in order to predict one or more possible anomalies. Installation condition information 604 refers to expected environmental conditions such as an expected / permitted temperature range, indoor or outdoor use, a degree of climate control or no climate control, a humidity / humidification level, a natural temperature variation, a geographical location and a location of the installation to obtain parameter thresholds (which will be described more particularly later) and anticipated operating cycles. For example, an installation in a location without climate control may allow for low operating temperatures. Installations under such conditions may not rely solely on the maximum measured temperature to determine normal operation and identify potential problems such as poor terminations or connection issues. For example, connector 115 may operate in an ambient temperature of approximately -20°C, and a terminal temperature of connector 115 may be measured at approximately 20°C. A temperature increase of 40°C may suggest an abnormal condition within connector 115 or somewhere in the power system. Another example would be connector 115 installed in a climate where the temperature may vary from approximately 10°C to approximately 50°C over the course of a day.In such cases, the system 100 can be configured to allow cyclical temperature changes while simultaneously monitoring abnormal conditions. Climate / ambient temperature conditions can be inferred from internal or external sensors 325 with respect to connector 115 and / or received from a remote ambient sensor or external communication device. In some configurations, the diagnostic analysis logic unit 602 is configured to understand the thermal environment in which connector 115 is installed by using one or more machine learning / artificial intelligence processes. In some configurations, the information related to the acceptable operating requirements and operating ranges (bzo / nn / rznz / E / YiAi) of the power supply system 100 and / or load 110 may be representative of the installation type, such as an installation in an industrial facility or a data center. Identifying the installation allows for certain default parameter / threshold values that can serve as the initial configuration, as opposed to individual user configuration of each parameter. For example, in an industrial context where the 115 connector supplies power to balanced, multi-phase industrial machines, the currents and voltages of each machine can be expected to be equal. However, when supplying power to a data center, an imbalance in the current and voltage phases can be expected depending on the load on each phase.The default configuration can be further adjusted based on additional information and / or user input. This information regarding operating intervals and parameters can be received from load 110, an external communication device or server, or directly via user input through a graphical interface communicating with logic unit 602. bzo / nn / rznz / E / YiAi The measured / calculated parameters 606 may include data received from and / or derived from values of one or more of the sensors 325. The measured / calculated parameters 606 include one or more electrical and / or thermal characteristics within the power supply system 100. For example, the sensors 325 may be configured to measure electrical and / or thermal characteristics on the input and output sides of each contact (e.g., contacts 310) or on other electrical connections within connector 115. In some modes, the sensors 325 may be configured to measure characteristics at the power supply 105 and the power terminals 210. In additional modes, the measured / calculated parameters 606 may include humidity characteristics. The 602 diagnostic analysis logic unit uses calculated values and electrical characteristic measurements to identify abnormal operating conditions within other types of devices (for example, a soldered contact or switch when phase currents and voltages do not behave as expected). For example, if a switch is expected to be open, the current and voltage on one side of the electrical connection would be expected to be approximately zero. The presence of voltage on the load side of the electrical connection or current flow may indicate a closed contact. Alternatively, the 602 diagnostic analysis logic unit uses the multiple voltage measurement points of the 325 sensors in combination with the current level to identify high resistance conditions, which may indicate poor connections.Information about electrical characteristics can also be used to identify and confirm proper mating sequence of components within the 115 connector. For example, if a switch is expected to be closed, voltage and current are expected. If no voltage and / or current is detected, there may be improper mating. In some modes, the measured / calculated parameters 606 are used by the diagnostic analysis logic unit 602 to identify a proper sequence of connections / disconnections within the bzcM nn / eznz / E / YiAi power supply system 100. In some cases, certain connections within connector 115 may require an electrical ground (or power) connection before being made. For example, a data connection within the electronic controller 335 may be required after one or more power connections of the electronic controller 335 are made. Based on the measured / calculated parameters 606, the diagnostic analysis logic unit 602 can determine whether the power connection(s) are connected (and their connection order) before the data connection is made and determine an abnormal condition if the connections were made improperly. Similarly, the disconnection order can be evaluated to determine proper disconnection within the power system 100. The diagnostic analysis logic unit 602 can also use temperature measurements to monitor and identify abnormal conditions within the power system 100. For example, the diagnostic analysis logic unit 602 can receive temperature data from sensors 325 at each connection point (or line input) within connector 115. From this data, the diagnostic analysis logic unit 602 can identify variations related to the operating environment of the power system 100. Unlike single-point measurement, the multi-point measurement method implemented using sensors 325 allows the diagnostic analysis logic unit 602 to distinguish between operating and default conditions.For example, when the bzcM nn / eznz / E / γALA power supply 105 and / or connector 115 are three-phase, if the temperatures of the first and second phase contacts 310 within connector 115 are measured to be approximately equal, or within a predetermined range, the ambient temperature may be approximately equal to or lower than these temperatures. Therefore, if the temperature of the third phase contact 310 within connector 115 differs from the temperatures of the first and second contacts 310 (outside the predetermined range), the difference may be a temperature increase indicative of a possible abnormal condition. The abnormal condition could be, for example, an exposed wire termination. Accordingly, the diagnostic analysis logic unit 602 identifies which of these phase contacts 310 has the abnormal condition based on the sensor data 325. In some modes, the diagnostic analysis logic unit 602 is configured to calculate the actual ambient temperature. In some modes, the actual ambient temperature, or the minimum expected operating temperature, is the actual temperature in the environment surrounding contact holder 200. The diagnostic analysis logic unit 602 calculates the actual ambient temperature in bZQ / nn / rznz / E / YiAi based on at least sensor 325 data. The diagnostic analysis logic unit 602 can calculate the actual ambient temperature using current and previously obtained temperature and electrical measurements from the other sensors 325 at various points within connector 115. The actual ambient temperature can be used to determine an abnormality within connector 115. For example, in some modes, the diagnostic analysis logic unit 602 collects a series of current measurements from each of the sensors 325 corresponding to one or more of the contacts 310 over time to develop a temperature rise curve for the contacts 310 and connector 115. The diagnostic analysis logic unit 602 then identifies the contact 310 with the lowest measured temperature. The diagnostic analysis logic unit 61 then calculates the expected temperature rise for the lowest current. Under normal conditions, for a system in reverse 1, the contact 310 with the lowest current may be the one with the lowest temperature. When the contact 310 with the lowest current does not have the lowest measured temperature of the contacts 310 within a predetermined error threshold, an abnormality may be present. The diagnostic analysis logic unit 602 calculates the actual / expected ambient temperature by subtracting the expected temperature rise from the measured temperature. The diagnostic analysis logic unit 602 can also calculate the temperature deviation for each measured temperature for each contact 31C1 with respect to the actual / expected ambient temperature by comparing the temperature rise for each contact 310 with the expected temperature rise considering the current. When the temperature rise for one or more of the contacts 310 is not within a predetermined range of the expected temperature rise considering the current, an abnormality may be present. Additionally, an abnormal condition can be diagnosed based on the additional information provided to the diagnostic analysis logic unit 602. For example, if the temperatures of each of the 310 contacts are different, the diagnostic analysis logic unit 602 can examine / analyze their current values received from the 325 sensors to determine if the difference in their temperatures is abnormal. If the current within each of the 310 contacts is the same, a temperature difference may indicate an abnormal condition. However, if the current within each of bzcM nn / eznz / E / γΐΛΐ 6. Contacts 310 are different; a limited or predetermined temperature difference can be expected during normal operation. The diagnostic analysis logic unit 602 can further identify the location and / or components related to the abnormal condition based on the information. Parameter threshold information 608 includes parameter thresholds that are used by the diagnostic analysis logic unit 602 to compare measured parameters 606 to determine the operating status and conditions of the power system 100. Each parameter threshold corresponds to a desired parameter at a particular connection point and / or terminal within connector 115. Figures 7A-7C each illustrate various parameters over time series of parameter thresholds for voltage, current, and temperature, respectively. In some forms, parameter thresholds can be fixed values. For example, a parameter threshold can be a maximum threshold (e.g., 708) or a minimum threshold (e.g., 710). A parameter threshold can be based on material properties (e.g., the material limit of current or absolute temperature 720 and 734, respectively), material or product ratings (e.g., the maximum rated threshold 721), or application limitations (e.g., the application limit 724). A parameter threshold can also be based on a series of parameter data points that indicate known operating behavior of the connected system. For example, known operating behavior might be the anticipated temperature rise (or lack thereof) per ampere of current or the rate of temperature change given a change in current.This known operating behavior can be stored in memory or retrieved from a remote server / database or cloud network. Other parameter thresholds can be set at the time of manufacture based on calibration or configuration, or at the time of installation. When set at the time of installation, these parameter thresholds can be configured by a user in some modes. In some modes, the 602 analysis / diagnostic logic unit can receive user input via the user interface (e.g., included in load 110, connector 115, and / or an external communication device) specifying a default parameter value / default threshold or a custom parameter threshold setting.In these modes, the user entry bzo / nn / rznz / E / YiAi can be a default parameter threshold profile, which specifies a set of parameter thresholds for a particular application and / or environment. For example, the default limit threshold profile adjusts parameter thresholds based on the application, load type (balanced or unbalanced), and installation configuration (climate / temperature). In some modes, parameter thresholds are dynamically adjusted based on measured / calculated parameters 606. Parameter thresholds can be adjusted depending on ambient temperature, current levels, historical or operating cycle data, or other parameters. By adjusting to measured conditions and known parameters, and by being able to set these limits independently for each connection point, the diagnostic analysis logic unit 602 is able to: determine the exact location of an abnormal condition and avoid false positive warnings. When a condition is suspected based on the initial configuration, the 602 diagnostic analysis logic unit can notify the user about the condition and provide the user with an option to mark the condition as acceptable under certain conditions, such as a bzo / nn / rznz / E / YiAi 9. A higher absolute temperature if the ambient temperature increases substantially. Another example of a condition that needs normalization is when the 115 connector is oriented so that one of the connections is closer to an external heat source. This connection will permanently exhibit a higher temperature. Therefore, the user may choose to accept this as a "normal" condition. In some configurations, the 602 diagnostic analysis logic unit is configured to learn or normalize operating limits. The 602 diagnostic analysis logic unit can learn operating limits, for example, by implementing one or more machine learning / artificial intelligence processes. In these configurations, the 602 diagnostic analysis logic unit can use machine learning or artificial intelligence in addition to, or instead of, user input. For example, the 602 diagnostic analysis logic unit can automatically determine whether a condition is acceptable or not without providing the user with a choice. Figures 7A-7C illustrate parameter graphs that include possible parameter thresholds. It should be understood that additional thresholds may be considered for each parameter. Figure 7A illustrates a voltage-over-time graph 700. Graph 700 illustrates a first-phase voltage 702, a second-phase voltage 704, and a third-phase voltage 706 measured within the lid connector. Graph 700 illustrates a maximum voltage threshold 708 and a minimum voltage threshold 710. Figure 7B illustrates a current-over-time graph 712. Graph 712 illustrates a first-phase current 714, a second-phase current 716, and a third-phase current 718 measured within connector 115. The average current 719 is also measured or calculated. Graph 712 illustrates an absolute material limit 720, a maximum rated current threshold 721, and a maximum current difference threshold 722. These parameter thresholds may be based on application and material limitations and the application of connector 115 and / or charging device 110. In some modalities, similar parameter thresholds may be used with respect to voltage (Figure 7A). Graph 712 also illustrates an application limit 724, which may be a user-defined custom parameter threshold. Figure 7C illustrates a temperature-over-time graph 726. Graph 726 illustrates a first-phase contact temperature 728, a second-phase contact temperature 730, and a third-phase contact temperature 732 measured within the connector 115. The average temperature 733 is also measured or calculated. Graph 726 illustrates an absolute material limit 734, a maximum temperature limit difference 735, and a temperature rise rate threshold 736 (based on application limitations). Graph 726 also includes a custom user-selected application temperature rise rate threshold 737. Referring back to Figure 6, the diagnostic analysis logic unit 602 is configured to determine the operating status of power system 100 based on an analysis of one or more received inputs. For example, the status of connector 115, load 110, power supply 105, and the connections between them are evaluated / analyzed to determine the operating status of power system 100. The operating status may be normal if no abnormal conditions are detected. The operating status may be abnormal if at least one abnormal condition is detected. Connector 115 is configured to provide adaptive power to a variety of loads and equipment types.For example, when the 115 connector is in service to balanced multi-phase industrial machinery, the currents and voltages are expected to be similar in magnitude, so the system will react differently to variations in power and current through the 115 connector compared to being in service to a power strip in a data center where the phases are expected to be unbalanced depending on the load on each phase. In some modes, the diagnostic analysis logic unit 602 is further configured to determine the operating status of the power supply system 100 based on information received from the charging device 110. For example, if the charging device 110 provides its own measured electrical characteristics, the diagnostic analysis logic unit 602 compares the received electrical characteristics with the corresponding electrical characteristics within the measured / calculated parameters 606 to identify a possible abnormal condition (e.g., a power loss between connector 115 and the charging device 110). In additional modes, the comparison results can be used with machine learning and artificial intelligence algorithms to further improve the machine's predictive capability or identify process faults or malfunctions. The diagnostic analysis logic unit 602 can then generate, depending on the status, a status indication 610. Status indication 610 is at least one selectable option from a group consisting of an auditory, visual, and haptic signal. The indication can be presented as a visual signal for display on a communication device screen, an audio signal, or an error signal for storage in a log on the communication device or a remote server / database. In some configurations, the electronic processor is additionally configured to send the error signal bzcM nn / eznz / E / YiAi to an error log stored in local memory, such as memory, or to a remote server and / or database. In some modes, the diagnostic analysis logic unit 602 is configured to determine the operating status based on a comparison between the measured / calculated parameters 606 and the corresponding parameter threshold, and to generate a specific type of indication depending on the severity of the abnormal condition. For example, depending on the severity of the abnormal condition, the diagnostic analysis logic unit 602 may generate a notification, an alert, or an alarm. In some configurations, the diagnostic analysis logic unit 602 also includes a maintenance schedule tracking system. This system is configured to provide reminders via the user interface and record maintenance events in memory and / or on a remote server / database. The maintenance schedule can be user-defined, for example, via the user interface, or a default schedule based on the application and / or the power system environment 100. The diagnostic analysis logic unit 602 can also dynamically adjust the maintenance schedule based on installation condition information 604, measured / calculated parameters 606, parameter threshold information 608, and / or other operating conditions within the power system 100. Therefore, the application provides, among other things, an improved method and system for detecting various characteristics of an electronic power connector. bzcM nn / eznz / E / YiAi Specific embodiments have been described in the preceding specification. However, a person skilled in the art understands that various modifications and changes can be made without departing from the scope of the invention, as will be indicated in the following claims. Therefore, the specification and figures are to be considered illustrative rather than restrictive, and it is intended that all such modifications fall within the scope of the indications herein. The benefits, advantages, solutions to problems, and any element or elements that may cause any benefit, advantage, or solution to occur or become more pronounced shall not be considered a fundamental, necessary, or essential feature or element of any or all of the claims. The invention is defined only by the appended claims, including any modifications made during the processing of this application, and all granted equivalents of the claims. Furthermore, in this document, relational terms such as "first" and "second," "superior" and "inferior," and the like, may be used only to distinguish one entity or action from another and do not necessarily require or imply any actual relationship or order of that kind between those entities or actions. It is intended that the expressions "comprises," "comprising," "has," "having," "includes," "including," "contains," "containing," or any other variation thereof, encompass a non-exclusive inclusion, such that a process, method, article, or apparatus comprising, having, including, or containing a list of elements does not include only those elements but may include other elements not expressly enumerated or inherent in that process, method, article, or apparatus. An element preceded by "comprises... a," "has... a," "includes... a," or "contains..." .The term "a" does not, without further restriction, exclude the existence of additional identical elements in the process, method, article, or apparatus comprising, having, including, or containing the element. The terms "a" and "an" are defined as one or more, unless explicitly stated otherwise herein. The expressions "substantially," "essentially," "approximately," "around," or any other version thereof, are defined as close to what is understood by a person skilled in the art, and in one non-exhaustive modality the expression is defined to express an interval of 20%, in another modality, an interval of 10%, in another modality, an interval of 2%, and in yet another modality, an interval of 1%. The term "coupled," as used herein, is defined as connected, although not necessarily directly and not necessarily mechanically.A device or structure that is "configured" in a certain way is configured at least in that way, but it can also be configured in ways that are not listed. It will be appreciated that some modalities may comprise one or more generic or specialized processors (or "processing devices") such as microprocessors, digital signal processors, custom processors and field-programmable gate arrays (FPGAs) and particular stored program instructions (including software and firmware) that control the processor(s) to implement, together with certain non-processor circuits, some, most or all of the functions of the method and / or apparatus described herein.Alternatively, some or all of the functions could be implemented using a state machine that has no stored program instructions, or in one or more application-specific integrated circuits (ASICs), where each function or some combinations of some of the functions are implemented as custom logic. Work in the mind, a combination of the two approaches could be used. Furthermore, a pre-implemented modality may be implemented as a computer readable storage medium having computer readable code stored therein for programming a computer (e.g., comprising a processor) to carry out a method as described and claimed herein. Examples of such computer readable storage media include, but are not limited to, a hard disk, a CD-ROM, an optical storage device, a magnetic storage device, a ROM (read-only memory), a PROM (programmable read-only memory), an EPROM (erasable programmable read-only memory), an EEPROM (electrically erasable programmable read-only memory), and flash memory.Furthermore, it is expected that a person skilled in the art, regardless of a possibly significant effort and many design choices motivated, for example, by time available, current technology and economic considerations, when guided by the concepts and the bzo / nn / rznz / E / YiAi described in 1 to present, will be able to easily generate bzo / nn / rznz / E / YiAi such software and IC programs and instructions with minimal experimentation. The summary description is provided to enable the reader to quickly determine the nature of the technical description. It is presented with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Furthermore, in the preceding detailed description, it can be observed that various features are grouped into various embodiments to structure the description. This method of description should not be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly described in each claim. On the contrary, as reflected in the claims that follow, the subject matter of the invention consists of less than the totality of the features of a single embodiment described. Therefore, the claims that follow are incorporated into the detailed description, where each claim represents a separate claim.
Claims
1. An electrical power supply system comprising: an electrical power connector; a contact configured to electrically connect a power supply to a load; a first sensor configured to detect a first feature of the electrical power connector; a second sensor configured to detect a second feature of the electrical power connector;and an electronic controller configured to: receive a first signal indicative of the first characteristic, receive a second signal indicative of the second characteristic, compare the first signal with a first parameter threshold, wherein the first parameter threshold corresponds to at least one desired parameter selected from a group consisting of a power connector connection point and a power connector terminal, compare the second signal with a second parameter threshold, dynamically adjust to at least one selected from a group consisting of the first parameter threshold and the second parameter threshold, wherein the dynamic adjustment is based on at least one selected from a group consisting of an operating limit and a known operating behavior.
2. The electronic power supply system of claim 1, wherein the controller is further configured to determine an abnormal condition based on a comparison of the first signal with the first threshold.
3. The electronic power supply system of claim 1, wherein the controller is further configured to determine an abnormal condition based on a comparison of the second signal with the second threshold.
4. The electronic power supply system of claim 1, wherein the first sensor is a voltage sensor.
5. The electronic power supply system of claim 1, wherein the first sensor is a temperature sensor.
6. The electronic power supply system of claim 1, wherein the first sensor is a current sensor.
7. The electronic power system of claim 1, bzo / nn / rznz / E / YiAi wherein the default threshold is a default value based on an application of the power supply system.
8. The electronic power supply system of claim 1, wherein the electronic controller is located within the power supply connector.
9. The electronic power system of claim 1, wherein the electronic controller is located in at least one selected from the group consisting of an external communication device, an external wiring device, a remote server, and a cloud network.
10. The electronic power supply system of claim 1, wherein the controller is partially located within the electrical connector and partially located in at least one selected from the group consisting of an external communication device, an external wiring device, a remote server, and a cloud network.
11. The electronic power supply system of indication 1, wherein at least one of the first feature and the second feature are based on an installation condition.
12. The electronic power system of claim bzo / nn / rznz / E / YiAi wherein the installation condition is at least one selected from the group consisting of an expected / permitted temperature range, indoor versus outdoor use, a degree of climate or non-climate control, an ambient liquid / vapor level, a natural temperature variation, a geographical location, and an installation location.
13. The electronic power supply system of claim 1, wherein at least one of the first feature and the second feature is selected from the group consisting of a temperature, a voltage, and a current.
14. The power supply system of claim 1, wherein the controller is further configured to provide a maintenance program tracker.
15. The power supply system of claim 1, further comprising a load, wherein the controller is further configured to determine an abnormal condition of the power supply system based on information received from the load.
16. The power supply system of claim 1, wherein the controller is further configured to use machine learning and artificial intelligence algorithms to perform or improve the predictive or diagnostic capability based on information received from at least one selected load.
17. The power supply system of claim 16, wherein the controller is configured to use machine learning and artificial intelligence algorithms to further improve the predictive capability based on the information received from the load.