METAL ASSEMBLY SYSTEM, ASSOCIATED METHODS AND PRODUCTS

Abstract

A metal joining system includes a power source and a metal joiner. The metal joiner includes a cleaning head, a cutting head, a joining head, and a joint terminator, each of which is communicatively coupled to the power source. The cutting head and the cleaning head are configured to direct a first laser beam to prepare a joining region, and the joining head is configured to direct a second laser beam to form a joint in the joining region. A method of joining metal substrates includes forming a joining region in butt contact with the metal substrates, directing the first laser beam to the joining region in a joint preparation stage, and directing the second laser beam to the joining region to form a weld.A product of a metal assembler, a weld, has a portion of weld metal removed in the weld start and weld crater regions.

Description

This application claims the benefit of United States Provisional Patent Application No. 62 / 705,580, filed on July 6, 2020, and entitled METAL ASSEMBLY SYSTEM, ASSOCIATED METHODS AND PRODUCTS, the contents of which are incorporated herein by reference in their entirety. FIELD OF INVENTION This invention relates to metal processing, and more specifically, to systems and methods for joining metal substrates. BACKGROUND OF THE INVENTION Metal processing can sometimes involve joining two (or more) metal substrates with a joint. For example, a joining process can be used to join two coils of sheet metal. Such joining processes are sometimes mechanical joining processes in the continuous processing of an aluminum coil, which include overlapping the sheet, local cutting of the sheet, bending, and placing a metal insert between the adjacent edges of the two metal sheets to join them. With such processes, it can be difficult to join thin-gauge sheets due to the size of the metal insert or the strength without the insert. It can also be difficult to join thicker-gauge sheets because the inserts can come loose during subsequent processing. For example, the cut edges for the inserts can stick to a nearby roller, which, in turn, can negatively affect the surface quality of the metal sheets.When a mechanical joint undergoes chemical processing for surface treatment, any hidden chemical residues remaining in the gaps of the mechanical joint can negatively affect the surface quality of the sheet. Additionally, metal inserts increase the thickness of the metal in the joint, which may require downstream joint processing equipment to be adjusted to account for the increased metal thickness. For example, when a thicker joint passes through a tension leveling roller, the tension leveling rollers may need to be raised to allow the thicker joint to pass through the tension leveler and then closed after the joint passes through.In such a scenario, the length of the metal substrate that is not worked by the tension leveling rollers (because they rise), will need to be cut to ensure that the required quality of the metal substrate is met. SUMMARY OF THE INVENTION The modalities covered by this patent are defined by the following claims, not by this summary. This summary is a high-level generalization of several modalities and introduces some of the concepts further described in the Detailed Description section below. This summary is not intended to identify the key or essential characteristics of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter shall be understood with reference to the appropriate portions of the entire specification of this patent, any or all of the drawings, and each claim. According to some embodiments, a metal joining system includes a power source and a metal joining unit. The metal joining unit includes a cutting head and a joining head connected to the cutting head, such that the joining head moves with the cutting head. The cutting head is communicatively coupled to the power source and prepares a joining region for joint formation by directing a first laser beam from the metal joining unit to the joining region. The joining head is communicatively coupled to the power source and forms the joint in the joining region by directing a second laser beam from the metal joining unit to the joining region. In some embodiments, at least one feature of the second laser beam differs from the first laser beam. In some configurations, the metal joiner may also include a cleaning head and / or a joint finisher. The cleaning head can be positioned on the underside of the metal substrates and can remove contaminants from the underside, including, but not limited to, oil, lubricant, dust, dirt, etc. In certain examples, the cutting head is positioned on the top of the metal substrates. In several examples, the cleaning head and the cutting head can be operated or run separately for joint preparation. The joint finisher can be positioned to remove a portion of weld metal at the start of the weld, a weld crater, and / or other weld defects. According to certain embodiments, a metal joiner for a metal joining system includes a cutting head and a joining head connected to the cutting head, such that the joining head moves with the cutting head. The cutting head prepares a joining region to form a joint by directing a first laser beam from the metal joiner to the joining region. The joining head forms the joint in the joining region by directing a second laser beam from the metal joiner to the joining region. In some examples, at least one feature of the second laser beam differs from the first laser beam. In several configurations, the metal joiner may also include a cleaning head and / or a joint finisher. In some examples, a front cleaning head may be connected to both the cutting head and a rear joining head and move at the same operating speed. In such configurations, the cleaning head, cutting head, and joining head can operate simultaneously at the same travel speed. In some configurations, the cutting head, with the front cleaning head attached, prepares the joint area. The joint finisher may be positioned to remove a portion of the weld metal at the start of the weld, a weld crater, and / or other weld defects. According to some embodiments, a metal assembler for a metal joining system includes a cutting head that prepares a joining region to form a joint by directing a first laser beam from the metal assembler to the joining region. The metal assembler also includes a joining head that forms the joint in the joining region by directing a second laser beam from the metal assembler to the joining region. In certain embodiments, at least one feature of the second laser beam differs from the first laser beam. In several examples, the metal assembler moves along a travel path during a metal joining process, and the joining head is connected to the cutting head, such that the joining head is downstream of the cutting head along the travel path. In certain configurations, the metal assembler also includes a cleaning head that removes contaminants from the underside of the metal substrates, including but not limited to oil, lubricant, dust, dirt, etc. In some configurations, the cutting head is positioned on top of the metal substrates. In some aspects, the cleaning head may be a front component and the cutting head a rear component, and the front cleaning head and rear cutting head may operate simultaneously at the same travel speed. According to several embodiments, one method includes aligning an end edge of a first metal substrate with a leading edge of a second metal substrate, such that a surface of the end edge butts with a surface of the leading edge. In certain embodiments, the alignment is optionally less than or equal to 10% of the thickness of the metal substrate. As a non-limiting example, a 2 mm thick metal substrate may have an alignment within 0.2 mm. In several embodiments, the bottom surfaces of the first metal substrate and the second metal substrate are optionally substantially level (e.g., within 10% of the minimum gauge) when aligned. The trailing edge and the leading edge, aligned together, define a bonding region. The method includes preparing the bonding region for joining by directing a first laser beam to the bonding region with a cutting head. The method also includes directing a second laser beam to the bonding region with a joining head to form a weld. At least one feature of the first laser beam differs from that of the second laser beam. The weld formation joins the first metal substrate to the second metal substrate. In some modalities, the method may also include directing a cleaning process to the joint region with a cleaning head positioned on the underside of the metal substrates. The method may also include preparing the joint region for joining by directing the first laser beam from the cutting head position on top of the metal substrates. The method may also include directing a joint terminator to the joint region to remove a portion of the weld metal at the start of the weld, a weld crater, and / or other weld defects. According to some methods, a weld joins a first metal substrate to a second metal substrate. The weld includes an upper weld surface and a lower weld surface. In some examples, the upper weld surface is recessed relative to an upper surface of the first metal substrate and relative to an upper surface of the second metal substrate, and the lower weld surface is recessed relative to a lower surface of the first metal substrate and relative to a lower surface of the second metal substrate. In several embodiments, the first metal substrate and the second metal substrate may have the same or different thicknesses. In certain embodiments, welding joins the first metal substrate to the second metal substrate. The weld includes an upper weld surface and a lower weld surface. In some examples, the upper weld surface is thicker relative to the upper surface of the first metal substrate and relative to the upper surface of the second metal substrate, and the lower weld surface is thicker relative to the lower surface of the first metal substrate and relative to the lower surface of the second metal substrate. The additional thickness of the weld metal beyond the upper surface of the first metal substrate and the upper portion of the second metal substrate is optionally no greater than 0.2 mm and / or 10% of the thickness of both the first and second metal substrates. The additional thickness of the welded metal beyond the lower surface of the first metal substrate and the lower portion of the second metal substrate is optionally no greater than 0.2 mm and / or 10% of the thickness of both the first and second metal substrates. According to certain embodiments, a weld joins a first metal substrate to a second metal substrate. The weld includes a weld thickness, and the weld thickness transitions from a thickness of the first metal substrate to a thickness of the second metal substrate. In some embodiments, the weld thickness is optionally less than at least one part of the thickness of the first metal substrate or the thickness of the second metal substrate. In some configurations, the first and second metal substrates have the same or different thicknesses. In several configurations, the weld thickness is optionally greater than one of the thicknesses of the first or second metal substrate. In certain configurations, the weld joins the first and second metal substrates regardless of whether their thicknesses are the same or different. In some examples, a portion of the weld metal is removed at the weld start, the weld crater, and / or other weld metal defect locations. Several implementations described herein may include additional systems, methods, and advantages that may not necessarily be expressly described herein, but which will be apparent to someone skilled in the art upon examination of the following detailed description and accompanying drawings. It is intended that all such systems, methods, features, and advantages be included within this description and protected by the accompanying claims. BRIEF DESCRIPTION OF THE DRAWINGS The specification refers to the following attached Figures, in which the use of similar reference numbers in different Figures is intended to illustrate similar or analogous components. Figure 1 illustrates a metal assembly system with a metal assembler having a cutting head and a joining head, according to the modalities. Figure 2 illustrates the metal assembly system of Figure 1, prior to a joining process with the metal assembly system. Figure 3 illustrates the metal assembler of the processing system of Figure 1 during a preparation stage of the joining process, according to the modalities. Figure 4 illustrates the metal assembler of Figure 1 during a joining stage of the joining process, according to the modalities. Figure 5 is a flowchart of a method for joining metal substrates with the metal assembly system of Figure 1, according to the modalities. Figure 6 illustrates a metal assembly system with a cleaning head, supports, and a metal cutting head, according to the modalities. Figure 7 is a flowchart of a method for joining metal substrates with the metal assembly system of Figure 6, according to the modalities. Figure 8 is an end view of the metal substrates during an input stage of the method in Figure 7, according to the modalities. Figure 9 is an end view of the metal assembly system of Figure 6, during a method assurance stage of Figure 7, according to the modalities. Figure 10 is a side view of the metal assembly system of Figure 6, during a joint preparation stage of the method of Figure 7, according to the modalities. Figure 11 is a side view of the cleaning head of the metal assembly system of Figure 6, during the joint preparation stage, according to the modalities. Figure 12 is a bottom view of the cleaning head of Figure 6, according to the modalities. Figure 13 is an end view of the metal assembly system of Figure 6, during a joint deformation stage of the method of Figure 7, according to the modalities. Figure 14 is a top view of the metal substrates during the joint formation stage of the method in Figure 7, according to the modalities. Figure 15 is an end view of the metal assembly system of Figure 6, during a welding deformation stage of Figure 7, according to the modalities. Figure 16 is an end view of a weld formed by the metal joining system of Figure 6, with the metal substrates having the same gauge, according to the modalities. Figure 17 is an end view of a weld formed with the metal substrates using the metal assembly system of Figure 6, with the metal substrates having different gauges, according to the modalities. Figure 18 is a side view of the metal assembly system of Figure 6, during the welding formation stage of the method of Figure 7, according to the modalities. Figure 19 is a top view of the metal substrates during a welding completion stage of the method in Figure 7, according to the modalities. Figure 20 is an end view and a top view of the bonded metal substrates that have the same gauge, and during an exit stage of the method in Figure 7. Figure 21 is an end view and a top view of the bonded metal substrates, which have different gauges, during an exit stage of the method in Figure 7. iviA / a / zu¿ o / uuuoo / Figure 22 is a top view of the bonded metal substrates during an exit stage of the method in Figure 7. Figure 23 is a top view of the bonded metal substrates during an exit stage of the method in Figure 7. Figure 24 is a top view of the bonded metal substrates during an exit stage of the method in Figure 7. Figure 25 is a top view of the bonded metal substrates during an exit stage of the method in Figure 7. DETAILED DESCRIPTION OF THE INVENTION The subject matter of the modalities is described herein with specificity to comply with regulatory requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be incorporated in other forms, may include different elements or steps, and may be used in conjunction with other existing or future technologies. This description shall not be construed as implying any particular order or arrangement among various steps or elements, except where the order of individual steps or the arrangement of elements is explicitly described. Directional references such as “up,” “down,” “top,” “bottom,” “left,” “right,” “front,” and “back,” among others, are intended to refer to the orientation as illustrated and described in the Figure(s), to which the components and directions refer. This description refers to alloys identified by aluminum industry designations such as “series” or “Zxxx”. For an understanding of the numerical designation system most commonly used in the nomenclature and identification of aluminum and its alloys, see “International Alloy Designations and Chemical Composition Limits for Wrought Aluminum and Wrought Aluminum Alloys” or “Aluminum Association Registration File of Alloy Designations and Chemical Composition Limits for Aluminum Alloys in the Form of Castings and Ingots”, both published by the Aluminum Association. This document describes a metal joining system for joining two (or more) metal substrates. In some embodiments, the metal substrates may be sheared or mechanically cut prior to the metal joining system. The metal joining system can be used to join any suitable metal substrates; however, it may be particularly useful for joining metal substrates made of aluminum and / or aluminum alloys, as well as steel and / or steel alloys.In several non-limiting examples, metal substrates may include aluminum and aluminum alloys, including, but not limited to, 1xxx series aluminum alloys, 2xxx series aluminum alloys, 3xxx series aluminum alloys, 4xxx series aluminum alloys, 5xxx series aluminum alloys, 6xxx series aluminum alloys, 7xxx series aluminum alloys, and / or 8xxx series aluminum alloys, and / or various other types of metal materials. As another non-limiting example, in certain embodiments, metal substrates may include steel, high-strength steel used in the automotive industry, including, but not limited to, carbon steel, dual-phase steel, and / or advanced high-strength steel. In certain non-limiting examples, a gauge or thickness of each metal substrate may be 0.3 mm to 6 mm, although various other gauges within or outside this range can be used. The metal substrates can be of the same material (e.g., the same aluminum alloy) or of different materials (e.g., two different aluminum alloys). The metal substrates have the same gauge or can have different gauges, as desired, so that the weld or joint can be formed between metal substrates of the same or different thicknesses. In some embodiments, the metal substrates can be metal sheets, although they do not need to be sheets in other examples. In some non-limiting examples, the metal joining system can be used to join two metal coils. The metal joining system includes a metal joiner with a cutting head and a joining head. The metal joiner may also include a cleaning head and / or a joint finisher. The metal joining system may include a power source that is communicatively coupled to the cutting head and the joining head. The metal joining system may also include a controller that is communicatively coupled to the metal joiner and that can control the metal joiner during a joining process, which includes a preparation stage, a joining stage, and / or a weld finishing stage. In many ways, the joining head is connected to the cutting head, so that the joining head moves with the cutting head during the joining process.In several respects, the cutting head is connected to a cleaning head, so that the cutting head moves with the cleaning head during the cutting process in the preparation stage, although it does not need to do so in other examples. In certain examples, during the preparation stage of the joining process, the cutting head can prepare a joining region for joint formation by directing a first laser beam to the joining region. In some examples, such a controller operates the cutting head during the preparation stage so that the first laser beam creates a gap between the contact edges of a first metal substrate and a second metal substrate. Alternatively, the controller can also operate the cutting head during the preparation stage so that the first laser beam is directed toward the top and bottom surfaces of the first and second metal substrates to remove contaminants such as lubricants, grease, fingerprints, etc., and / or otherwise prepare the top and bottom surfaces for joint formation. In several examples, during the joining stage of the joining process, the joining head can form a joint (also referred to as a weld) by directing a second laser beam to the joining region. The second laser beam can have at least one characteristic that differs from the first laser beam, including, but not limited to, beam size, beam intensity, beam pattern, and / or other suitable characteristics as desired. In some embodiments, the controller controls the joining head so that the second laser beam heats a portion of the joining region and forms a weld. In certain embodiments, the controller controls the joining head so that the second laser beam forms a weld that is thinner than the thickness of the metal substrate forming the joining region.In several respects, the controller controls the joining head so that the second laser beam forms a weld that is recessed relative to an upper surface of the metal substrates forming the joining region and / or recessed relative to a lower surface of the metal substrates forming the joining region. In several respects, the controller controls the joining head so that the second laser beam forms a weld with additional thickness in the weld metal, relative to an upper surface of the metal substrates forming the joining region and / or additional thickness relative to a lower surface of the metal substrates forming the joining region. The additional thickness of the weld metal beyond the upper surface of the first metal substrate and the top of the second metal substrate is optionally no greater than 0.2 mm or 10% of the thickness of both the first and second metal substrates. The additional thickness of the welded metal (weld reinforcement), beyond the lower surface of the first metal substrate and the lower part of the second metal substrate, is optionally no greater than 0.2 mm or 10% of the thickness of both the first and second metal substrates. The metal joining system described herein can improve the speed at which a joint is formed between two metal substrates because a single metal joiner can prepare the joint area and form the joint. In some embodiments, the metal joining system described herein can operate at a welding speed of at least 3 meters per minute. In some cases, the metal joining system described herein can operate at a welding speed of up to 20 meters per minute. In additional embodiments, the metal joining system can operate at a welding speed of 60 meters per minute. Furthermore, the metal joiner of the metal joining system can improve the surface quality of the metal substrate using the first and second laser beams.The metal joining system can also minimize or reduce metal loss when using a joining process and / or subsequent processing of the joined metal substrates. For example, the laser beams used to cut and form the joint can create minimal waste and / or loss of the metal substrate. Furthermore, because the welds formed by the metal joining system are thinner, subsequent processing does not have to stop or otherwise account for the thicker joint section that would otherwise be present in the existing mechanical joint (e.g., due to excessive weld reinforcements greater than 0.2 mm or 10% of the metal substrate thickness). The metal joining system described herein can also enable joint formation between metal substrates without requiring a chemical solvent.In some respects, the process can have a reduced processing time because preparation and joining are done in close succession. Figure 1 illustrates an example of a metal joining system 100 according to various embodiments, and Figures 2-4 illustrate the metal joining system 100 during various stages of a joining process. The metal joining system 100 includes a metal joining unit 102, which selectively forms a weld 116 in a joining region 106, joining a first metal substrate 104A to a second metal substrate 104B. The metal joining system 100 may also include a power source 136 and a controller 134. The first metal substrate 104A and the second metal substrate 104B can be various suitable metals as desired, and the metal of the first metal substrate 104A need not be the same as the metal of the second metal substrate 104B. In several examples, the first metal substrate 104A may be a portion of a first coil of a metal substrate and the second metal substrate 104B may be a portion of a second coil of a metal substrate.Various metals suitable for the first metal substrate 104A and / or the second metal substrate 104B may include, but are not limited to, aluminum, aluminum alloys, steel, stainless steel, or other metals as desired. As best illustrated in Figures 2-4, the first metal substrate 104A and the second metal substrate 104B each include a top surface 124, a bottom surface 122, and an edge surface 126 extending between the top surface 124 and the bottom surface 122. As discussed in detail below, in various respects, the bonding region 106 may include at least a portion of the top surfaces 124, at least a portion of the bottom surfaces 122, and the edge surfaces 126. In some examples, and as illustrated in Figures 2 and 3, a coating 120 (or other contaminants) may be present on portions of one or more of the upper surfaces 124, the lower surfaces 122, or the edge surfaces 126. In some embodiments, the coating 120 may be intentionally provided on the surfaces, or it may be provided on the surfaces as a byproduct of prior handling or processing. As some examples, the coating 120 may be contaminants for the joining process such as grease, lubricant, fingerprints, dust, dirt, oil, etc. As discussed in detail below, during the joining process, the metal joining system 100 may at least partially remove some of the coating 120, which may improve weld formation 116 and enhance the surface quality of the metal substrates. Referring to Figure 1, the metal joiner 102 includes a cutting head 110 and a joining head 108. In several respects, the cutting head 110 is communicatively coupled with the power source 136, such that the power source 136 energizes the cutting head 110, and the cutting head 110 can direct a first laser beam 112 to the joining region 106 during the joining process. Similarly, the joining head 108 is communicatively coupled with the power source 136, such that the power source 136 energizes the joining head 108, and the joining head 108 can direct a second laser beam 114 to the joining region 106 during the joining process. In several respects, at least one feature of the first laser beam 112 of the cutting head 110 may be different from the second laser beam 114 of the joining head 108.In certain modalities, at least one characteristic may include, but is not limited to, a beam intensity, a beam size, or a beam pattern directed at the junction region 106. In some non-limiting examples, the beam size of the first laser beam 112 is smaller than the beam size of the second laser beam 114. The joining head 108 is connected to the cutting head 110, such that the joining head 108 moves with the cutting head 110. Optionally, the joining head 108 is connected to the cutting head 108, such that as the metal assembler 102 moves in a travel direction 118, the portion of the joining region 106 to which the joining head 108 directs the second laser beam 114 is substantially the same as the portion of the joining region 106 to which the cutting head 110 directs the first laser beam 112. In the example in Figure 1, a bracket 138 connects the joining head 108 to the cutting head 110; However, in other examples, several other suitable devices or mechanisms can connect the joining head 108 with the cutting head 110, so that the joining head 108 moves with the cutting head 110.In several respects, the joining head 108 connected to the cutting head 110 allows for the use of a single power source. The connected heads can also reduce the time required to install and calibrate the metal joiner 102 compared to existing joiner systems, as a single installation and calibration step can be optionally implemented. Furthermore, the connected heads of the metal joiner 102 allow the joiner 102 to complete the joining process without operator intervention. Controller 134 is communicatively coupled with joining head 108 and cutting head 110. Controller 134 can optionally be communicatively coupled with power source 136. As discussed in detail below, controller 134 can selectively control metal assembler 102 during the joining process. The 134 controller may include one or more general-purpose processing units, a processor specifically designed for bond control analysis and / or metal bonding applications, a processor specifically designed for wireless communications (such as a Cypress Semiconductor Programmable System-on-a-Chip), or other suitable processors. Memory may be provided with the 134 controller, although it is not required in other examples. When included, the memory may consist of long-term storage and / or short-term working memory, and the memory may be used by the 134 controller to store a working set of the processor's instructions (i.e., the processor may write data to the memory).In some aspects, the memory may include a disk-based storage device and / or one of several other types of storage media, including, but not limited to, a memory disk, a USB drive, a snapshot, a remotely attached storage medium, a virtual disk drive, or the like. Various other features, including, but not limited to, a communication circuit / unit, an optional display, an optional speaker, and / or an energy storage unit, may also be included in the 134 controller. In some aspects, some or all of the components of the 134 controller may be included together in a single sensor package or assembly, such as within the same enclosure. In other aspects, some of the components may be included together in an enclosure, and the other components may be separate (i.e., the 134 controller may be a distributed system).Other configurations of the controller 134 may be used as desired. In several respects, the controller 134 communicates data with the joining head 108 and the cutting head 110 to control at least one of the following: the position or orientation of the metal joiner 102 relative to the joining region 106, the first laser beam 112, the second laser beam 114, the welding speed of the metal joiner 102, the size of a gap formed during the preparation stage of the joining process, the thickness of a weld formed by the metal joiner 102 during the joining stage of the joining process, combinations thereof, or other suitable characteristics of the metal joiner system 100, as desired during the joining process. Optionally, and as illustrated in Figure 1, the metal joining system 100 may include a shielding gas nozzle 111. In certain embodiments, the shielding gas nozzle 111 may provide shielding gas 113 to the weld side 116. When included, the shielding gas nozzle iviA / a / zu¿ o / uuuoo i 111 can optionally not block any monitoring and / or scanning of weld quality. The shielding gas nozzle 111 can be connected to the joining head 108 and / or the cutting head 110, although this is not required in other modes. In other modes, the shielding gas nozzle 111 can be omitted. Figure 5 illustrates several stages of a joining process for joining the first metal substrate 104A to the second metal substrate 104B with the metal assembly system 100, and Figures 2-4 illustrate the metal assembly system 100 during the various stages. Referring to block 502 and Figure 5, a step in forming the bonding region of the joining process may include positioning the first metal substrate 104A relative to the second metal substrate 104B to form the bonding region 106. In some embodiments, and as illustrated in Figure 2, forming the bonding region 106 may include positioning the first metal substrate 104A relative to the second metal substrate 104B such that the edge surface 126 of the first metal substrate 104A butts with the edge surface 126 of the second metal substrate 104B. Optionally, block 502 may include initially positioning the metal assembler 102 relative to the bonding region 106.In several respects, the initial positioning of the metal assembler 102 may include positioning the metal assembler 102 so that the metal assembler 102 is substantially aligned with the contact edge surfaces 126. In some embodiments, the metal assembler 102 may be initially positioned above the upper surfaces 124 of the metal substrates 104A-B, although in other examples, the metal assembler 102 may be initially positioned below the lower surfaces 122 of the metal substrates 104A-B. Referring to block 504 in Figure 5 and Figure 3, a preparation step in the joining process may include preparing the joining region 106 for joint formation with the cutting head 110 of the metal assembler 102. In several instances, the controller 134 controls the cutting head 110 to direct the first laser beam 112 to the joining region 106. In several embodiments, the controller 134 controls the cutting head 110 to direct the first laser beam 112 such that the first laser beam 112 cuts portions of the first metal substrate 104A and the second metal substrate 104B adjacent to the edge surfaces 126 and forms a gap 140 between the first metal substrate 104A and the second metal substrate 104B. In certain aspects, the controller 134 controls the cutting head 110, such that the gap 140 formed by the first laser beam 112 has a gap width 128 of less than or equal to approximately 0.5 mm, such as less than or equal to approximately 0.4 mm, such as less than or equal to approximately 0.3 mm, such as less than or equal to approximately 0.2 mm, such as less than or equal to approximately 0.1 mm. In other embodiments, the gap width 128 may optionally be greater than 0.4 mm, such as greater than 0.5 mm, and / or any other gap width 128 as desired. In certain aspects, the cutting head 110 is controlled to produce an irregular (high-speed) laser cut, which may produce microgaps when the metal substrates 104A-B are placed together. In such examples, the molten metal (produced by the laser beam of the 108 joining head) occupies these spaces during welding, and the spaces themselves contribute to the weld thickness, which is approximately equal to or less than the metal substrates.In some embodiments, the weld may have a thickness that is up to approximately 10% greater than the thickness of one or more metal substrates, for example, approximately 1% greater, approximately 2% greater, approximately 3% greater, approximately 4% greater, approximately 5% greater, approximately 6% greater, approximately 7% greater, approximately 8% greater, approximately 9% greater, approximately 10% greater, and any intervals in between. In some embodiments, the weld may have a thickness that is from approximately 0.1 mm to approximately 0.5 mm greater than one or both metal substrates, for example, approximately 0.1 mm, approximately 0.2 mm, approximately 0.3 mm, approximately 0.4 mm, approximately 0.5 mm, or any intervals in between.Advantageously, welds that are thinner than one or both metal substrates allow the weld to be further processed downstream without adjusting downstream equipment, such as passing through tension levelers and rollers. Additionally or alternatively, during the preparation stage, the controller 134 can control the cutting head 110 to direct the first laser beam 112 to portions of the upper surfaces 124 and / or portions of the lower surfaces 122 of the first metal substrate 104A and / or the second metal substrate 104B, to remove at least some of the coating 120 that may or may not be present on such surfaces. In some embodiments, the controller 134 can control the cutting head 110 so that the cavity 140 is formed first or the coating 120 is removed first. In block 506 of Figure 5 and as illustrated in Figure 4, during the joining stage of the joining process, the controller 134 can control the joining head 108 to direct the second laser beam 114 to the joining region 106. The joining head 108 directs the second laser beam 114 into the gap 140 to heat the surfaces of the metal substrates 104A-B within the gap 140, forming the weld 116. By forming the gap 140 in the preparation stage, the metal joining system 100 can form the weld 116 during the joining stage with minimal waste and improved thickness, because the second laser beam 114 can be directed into the gap 140.As illustrated in Figure 4, in several aspects, the controller 134 controls the joining head 108 such that the weld 116 formed by the second laser beam 118 has a thickness 142 that is less than a thickness (i.e., the distance between the upper surface 124 and the lower surface 122) of the first metal substrate 104A and / or a thickness of the second metal substrate 104B. In certain instances, the controller 134 controls the joining head 108 such that the weld 116 formed by the second laser beam 118 has external weld surfaces 132 that are recessed relative to the upper surfaces 124 and / or the lower surfaces 122. In some embodiments, the external weld surfaces 132 are recessed by a recessed distance 130 relative to the upper surfaces 124 and / or the lower surfaces 122.The weld 116, which has reduced thickness and / or is recessed relative to surfaces 124, 122, can provide an improved joint between metal substrates 104A-B, compared to traditional joints because the weld 116 can be further processed by other equipment (such as a strain leveler), without requiring the equipment to be adjusted for a thicker joint as was traditionally required. As mentioned, during the preparation and joining stages of the joining process, the controller 134 can control the metal assembler 102 to move along the travel direction 118 at the welding speed. In some non-limiting examples, the welding speed can be greater than or equal to approximately 3 meters per minute, such as approximately 20 meters per minute, or as otherwise desired. In other examples, the welding speed can be less than approximately 3 meters per minute. Although the preparation and joining stages of the joining process have been described separately, the two stages can be performed simultaneously by the metal assembler 102.For example, referring again to Figure 1, during the joining process, the controller 134 can control the metal assembler 102, so that the cutting head 110 directs the first laser beam 112 towards a first portion of the joining region 106, while the joining head 108 directs the second laser beam 114 towards a second portion of the joining region 106, and while the metal assembler 102 is moving in the displacement direction 118. Figures 6 and 8-25 illustrate another example of a metal assembly system 200, according to various embodiments. The metal assembly system 200 is substantially similar to the metal assembly system 100, and includes the metal assembler 102 having the cutting head 110 and the joining head 108. Similar to the metal assembly system 100, the metal assembly system 200 also includes the controller 134. Although not illustrated, the metal assembly system 200 may also include a power source. In comparison with bracket 138 of the metal assembler system 200, bracket 238 of the metal assembler system 200 is modified so that bracket 238 can support more than one metal assembler 102. As illustrated in Figure 6, in comparison with metal assembler system 100, metal assembler system 200 also includes at least one cleaning head 244 and at least one support 246. In the example in Figure 6, metal assembler system 200 includes two cleaning heads 244 and two supports 246, although any desired number of cleaning heads 244 and / or supports 246 may be used. In several embodiments, the cleaning heads 244 are connected to at least one metal assembler 102 via the support 238 (or other suitable structure), so that the cleaning head 244 moves in conjunction with at least one metal assembler 102.In the illustrated example, a single bracket 238 supports both metal assemblers 102 and both cleaning heads 244. In other examples, all metal assemblers 102 and / or cleaning heads 244 do not need to be supported on a single bracket. As best illustrated in Figures 11 and 12, in some embodiments, each cleaning head 244 includes an internal nozzle 248 configured to direct a cleaning force 252 to the bonding region and an external nozzle 250 configured to provide a vacuum force 254 and suction out air containing dust and / or other debris. In certain embodiments, the cleaning force 252 may be provided by a cleaning agent including, but not limited to, compressed air, acetone, a laser beam, or other suitable cleaning agents or means as desired. Furthermore, in other embodiments, the cleaning heads 244 may be other suitable devices or components capable of selectively applying the cleaning force 252 as desired. By way of non-limiting example, one or more cleaning heads 244 may be a scraper that can move parallel to (or otherwise as desired) and in front of the cutting head 244.In this mode, the scraper (for example, a blade or other suitable cleaning device) can optionally be attached to the same unit, and the scraper would apply a cleaning force before the cutting head 110. iviA / a / zu¿ o / uuuoo i In some embodiments, the inner nozzle 248 and the outer nozzle 250 are each positioned at an oblique angle to the surface being cleaned, so that the cleaning force 252 and the vacuum force 254 are applied at an oblique angle. In other examples, the nozzles 248 and 250 need not be at an oblique angle. Optionally, as illustrated in Figure 10, the cleaning head 244 includes a supplementary nozzle 255 configured to provide the vacuum force 254. In certain configurations, the supplementary nozzle 255 is configured to align vertically with (or be close to) the cutting head 110, so that the supplementary nozzle 255 can collect the dust and / or other debris generated by the cutting head 110 when it applies the first laser beam 112.The cleaning heads 244 can be positioned on the same side of a metal substrate as the metal assembler 102, or on an opposite side of the metal substrate from the metal assembler 102. In certain embodiments, the cleaning head 244 is configured to direct the cleaning force 252 and the vacuum force 254 ahead of the laser beams of the metal assembler 102 in the travel direction 118. As illustrated in Figure 11, the cleaning head 244 can be offset from a metal substrate by a gap 257. In some non-limiting examples, the gap 157 can be from 1 mm to 2 mm, although it can be less than 1 mm and / or greater than 2 mm in other embodiments. Each support 246 is configured to grasp and / or otherwise retain a metal substrate during processing. Supports 246 can be various mechanisms or devices suitable for grasping a metal substrate, including, but not limited to, mechanical grippers for creating direct contact, robotic arms, or other suitable devices, as required. In certain configurations, the Metal Joiner System 200 (and / or the Metal Joiner System 100) can be used to join various metal substrates as required. As a few non-limiting examples, the Metal Joiner System 200 (and / or the Metal Joiner System 100) can be used to join similar or different rolled steel sheets, similar or different rolled aluminum sheets, and / or other metal sheets or metal products as required. Figure 7 illustrates another example of a method for joining metal substrates according to various modalities. In certain aspects, the method can be used to join various metal substrates as desired, including, but not limited to, steel and aluminum. In certain aspects, the method has an improved processing time (i.e., the time required to perform all the steps illustrated in Figure 7). In one non-limiting example, the processing time can be less than one minute, such as approximately 50 seconds. In other examples, the processing time can be greater than one minute and / or less than 50 seconds, as desired. Block 702 is an input stage of the method. Referring to Figure 8, in various configurations, during the input stage, the two 204A-B metal substrates are initially supplied. In some respects, the 204A-B metal substrates are metal coils. Each 204A-B metal substrate may have its own unique identifier.The 204A-B metal substrates can have different gauges, the same gauge, a different alloy type, the same alloy type, can be cold-rolled, or hot-rolled, each can have its own temper condition (e.g., F temper), can be cut by shearing, band sawing, or other suitable cutting techniques, and have any desired cut edge quality, and / or include any grade of metal (e.g., rolled sheets of any grade of steel and / or any grade of aluminum) as desired. In the embodiment of Figure 8, the 204A-B metal substrates have different gauges. Optionally, the 204A-B metal substrates have a gauge of 6 mm or less. Block 704 is a securing stage of the method. Referring to Figure 8, during the securing stage, the metal substrates 204A-B are each supported by the metal supports 246. In a non-limiting example, the securing stage may take approximately 10 seconds, although it does not need to be 10 seconds in other modalities. Block 706 is a joint preparation stage of the method. Referring to Figures 6 and 9, during the joint preparation stage, the cutting heads 110 direct the first laser beams 112 to cut portions of the metal substrates 204A-B. During the joint preparation stage, the internal nozzle 248 of the cleaning head 244 directs the cleaning agent so that the cleaning force 252 is applied directly to the bonding region to remove the lubricant and / or otherwise prepare the bonding region as desired. As mentioned previously, in certain aspects, the cutting head 110 is controlled to produce an irregular laser cut (at high speed), which can produce microgaps 261 (see Figure 14) when the metal substrates 204A-B are placed together.In such examples, the molten metal (produced by the laser of the joining head 108) occupies these microspaces 261 during welding, and the microspaces 261 themselves contribute to the weld thickness 116, being approximately the same as or less than the metal substrates. As mentioned previously, in certain embodiments, the weld may have a thickness that is up to approximately 10% greater than the thickness of one or both metal substrates, for example, approximately 1% greater, approximately 2% greater, approximately 3% greater, approximately 4% greater, approximately 5% greater, approximately 6% greater, approximately 7% greater, approximately 8% greater, approximately 9% greater, approximately 10% greater, and any intervals in between. In some embodiments, the weld may have a thickness that is from approximately 0.1 mm to approximately 0.5 mm greater than one or both metal substrates, for example, approximately 0.1 mm, approximately 0.5 ...10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately 10%, approximately2 mm, approximately 0.3 mm, approximately 0.4 mm, approximately 0.5 mm, or any intervals in between. Advantageously, welds of a thickness less than one or both of the metal substrates allow the weld to be further processed downstream without adjusting downstream equipment, such as passing through tension levelers and rollers. During the gasket preparation stage, the external nozzle 248 applies vacuum force 254, so that debris is removed by the cleaning force 252 and / or is removed by the first laser beam 112. In a non-limiting example, the gasket preparation stage may take approximately 10 seconds, although it does not need to be 10 seconds in other modes. Block 708 is a joint-forming step of the method. In a non-limiting example, the joint preparation step may take approximately 5 seconds, although it need not be 5 seconds in other modalities. Referring to Figures 13 and 14, during the joint-forming step, at least one substrate of iviA / a / zu¿ o / uuuoo i metal 204A-B, and optionally both metal 204A-B substrates, are advanced toward each other from the gap 140 between the contact edges of the metal 204A-B substrates. As mentioned previously, in certain aspects, the gap 140 is less than or equal to approximately 0.5 mm, such as less than or equal to approximately 0.4 mm, such as less than or equal to approximately 0.3 mm, such as less than or equal to approximately 0.2 mm, such as less than or equal to approximately 0.1 mm. In other configurations, the 140 gap is greater than 0.5 mm.As illustrated in Figure 14, the contact edges may have full or half microgaps (exaggerated in size in Figure 14 for illustrative purposes). In some optional examples, the gasket forming stage may be performed before the gasket preparation stage (block 706). Block 710 is a weld formation stage of the method. Referring to Figures 1518, during the weld formation stage, the joining head 108 directs the second laser beam 114 to the joint region to join the metal substrates 204A-B, while supports 246 hold the metal substrates 204A-B in place. Optionally, the metal assembly system 200 includes a purge nozzle 260, which is configured to direct a purging agent (e.g., argon) to the joint region to minimize direct contact of the weld metal with the ambient atmosphere during the joining process and to remove gases or vapors that could be harmful to the welded joint during and immediately after welding.Optionally, the weld forming stage can be performed simultaneously with the joint preparation stage or separately from the joint preparation stage (e.g., in a separate step over the joining region). Referring to Figures 15 and 17, in the examples where the metal substrates 204A-B have different gauges, the weld 116 is thinner than the metal substrate with the thicker gauge. In such examples with different gauges, during the weld formation stage, the second laser beam 114 of the joining head 108 can be displaced from the joining region and applied to the metal substrate with the thicker gauge (see, for example, Figure 15). Referring to Figure 16, in other configurations, the 204A metal substrate can be joined to a 204C metal substrate that has the same gauge as the 204A metal substrate. In these configurations, the weld 116 can optionally have a welded reinforcement of less than 0.2 mm and / or 10% of the metal substrate thickness. In examples with similar gauges, during the weld formation stage, the second laser beam 114 can be applied to the joint region (e.g., on both of the metal substrates). Block 712 is a weld termination stage of the method. In certain respects, the weld termination stage may be optional. Referring to Figure 19, during the weld termination stage, the initial weld region 262 and the final weld region 264 of weld 116 are removed by means of a weld or joint terminator 265, which may be various suitable mechanisms or devices, as desired. As non-limiting examples, the initial weld region 262 and the final weld region 264 may be removed by means of a joint terminator 265 via a die, local shear cut, laser cut, or various other mechanisms or devices, as desired. In certain respects, the removal of the initial weld region 262 and the final weld region 264,It can eliminate stress locations and remove defects from the weld of the joined metal substrates, thereby improving their suitability for further processing without (or minimizing) weld breakage or causing damage to processing machines. In some embodiments, the joined metal substrates, having had the initial weld region 262 and the final weld region 264 removed, may be able to pass through a set of processing rollers with various diameters, ranging from 600 mm to 1200 mm, at least 50 times up and down without weld breakage, for example, approximately 50 times, approximately 60 times, approximately 70 times, approximately 80 times, approximately 90 times, or approximately 100 times, or any intervals between these. Block 714 is an exit stage of the method. Figure 20 illustrates the 204A and 204C metal substrates (which have the same gauge) in the exit stage, and Figure 21 illustrates the 204A-B metal substrates (which have different gauges) in the exit stage. As illustrated in Figures 20 and 21, in several embodiments, in the exit stage, the thickness of weld 116 is less than the thickness of at least one of the metal substrates, and optionally less than the thickness of both metal substrates. In several embodiments, in the exit stage, the thickness of weld 116 is greater than the thickness of at least one of the metal substrates, and optionally greater than the thickness of both metal substrates, with the weld reinforcement being within 0.2 mm or 10% of the metal substrate thickness for welds of the same gauge. It will be noted that in embodiments where the metal assembly system 200 in Figure 6 includes two metal assemblers 102 (each with a cutting head 110) and at least one cleaning head 244, a single cutting head 110 (for example, from one of the metal assemblers 102) and the cleaning head 244 can be used in a first pass, and a second cutting head 110 (from the other metal assembler 102) and cleaning head 244 can be used in a second pass, or both pairs of metal assemblers 102 (and thus both cutting heads 110) and cleaning heads 244 can be used simultaneously. In some embodiments, the use of more than one pair of metal assemblers 102 and cleaning heads 244 at the same time can make cutting non-linear shapes easier and / or more accurate. Figures 22-25 illustrate non-limiting examples of various orientations of welds 116 with respect to a processing direction 270, which can be produced via the metal joining system 100 or the metal joining system 200. As illustrated, welds 116 can be perpendicular, inclined, curved, or have other shapes or orientations as desired. In some embodiments, a non-perpendicular weld 116 can minimize the portion of the weld that is under pressure from downstream rollers 274 (or other processing) at any time, while still requiring less metal removal than current mechanical joining methods. Figure 21 illustrates an example of a weld 116 that is substantially perpendicular to the machining direction 270. In certain modalities, the weld 116 of Figure 21 may be suitable for joining metal substrates of similar or different gauge. Figure 22 illustrates an example of a weld 116 that is curved with respect to the processing direction 270. As illustrated in Figure 22, during processing, a first portion 272 of the weld iviA / a / zu¿ o / uuuoo i 116 can be coupled to a roller 274 (or other processing equipment), before other portions of weld 116. The weld 116 of Figure 22 may be suitable for joining metal substrates of similar or different gauge. Figure 23 illustrates an example of a weld 116 that is at a perpendicular or right angle to the machining direction 270. Figure 24 illustrates an example of a weld 116 that is at an oblique angle to the machining direction 270. The weld 116 in Figure 24 may be suitable for joining similar gauges. In a non-limiting example, the oblique angle may be less than or equal to 5° to the machining direction 270, such as less than or equal to 4°, less than or equal to 3°, less than or equal to 2°, or less than or equal to 1°. In other embodiments, the oblique angle may be greater than 5°. As some non-limiting examples, the oblique angle may be greater than 0° to less than 90°. In other modalities, the weld 116 can be at any other angle as desired, with respect to the processing direction 270. Figure 25 illustrates an example of another weld 116 that is curved with respect to the machining direction 270. Compared to weld 116 in Figure 23, the first portion 272 of weld 116 in Figure 25 has a reduced length. Weld 116 in Figure 25 may be suitable for joining metal substrates of similar or different gauges. A collection of exemplary embodiments is provided below, including at least some explicitly listed as “Illustrations,” which provide further description of a variety of exemplary embodiments, in accordance with the concepts described herein. These illustrations are not intended to be mutually exclusive, exhaustive, or restrictive; and the description is not limited to these exemplary illustrations, but instead encompasses all possible modifications and variations within the scope of the issued claims and their equivalents. Illustration 1. A metal joining system comprising: a power source; and a metal joiner comprising: a cutting head communicatively coupled to the power source and configured to prepare a joining region to form a joint, directing a first laser beam from the metal joiner to the joining region; and a joining head communicatively coupled to the power source and configured to form the joint in the joining region, directing a second laser beam from the metal joiner to the joining region, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head. Illustration 1a. The metal joining system of any illustration or combination of illustrations above or below, wherein the metal joining system further comprises a cleaning head configured to prepare the joining region by directing a cleaning force from the cleaning head to the joining region. Illustration 1b. The metal joining system of any illustration or combination of illustrations above or below, wherein the joining head is connected to the cutting head with the cleaning head attached, such that the joining head moves with the cutting head simultaneously or separately. Illustration 1c. The metal joining system of any illustration or combination of illustrations above or below, wherein the metal joining system further comprises a joint terminator communicatively coupled to the power source, and configured to remove metal in the weld start and crater regions of the joint. Illustration 2. The metal joining system of any illustration or combination of illustrations above or below, wherein the joining region is formed by the contacting edges of a first metal substrate and a second metal substrate during a metal joining process. Illustration 3. The metal assembly system of any illustration or combination of illustrations above or below, further comprising a controller communicatively coupled to the metal assembler, wherein the controller is configured to control the cutting head, such that the first laser beam forms a gap between the contacting edges of the first metal substrate and the second metal substrate, and wherein the gap is less than 0.5 mm. Illustration 4 The metal joining system of any illustration or combination of illustrations above or below, wherein the joining region further comprises an upper surface and a lower surface of each of the first metal substrate and the second metal substrate, wherein the metal joining system further comprises a controller communicatively coupled to the metal joining system, and wherein the controller is configured to control the cutting head such that the first laser beam is directed to at least one of the upper or lower surface. Illustration 5. The metal assembly system of any illustration or combination of illustrations above or below, further comprising a controller communicatively coupled to the metal assembly, and wherein the controller is configured to move the metal assembly along a displacement path at a speed of at least 3 meters per minute, while at least one of the first laser beam or the second laser beam is directed from the metal assembly. Illustration 6. The metal assembly system of any illustrations or combination of illustrations above or below, wherein at least one feature of the second laser beam is different from the first laser beam, and wherein the at least one feature comprises at least one beam size or beam pattern. Illustration 7. The metal joining system of any illustration or combination of illustrations above or below, wherein the metal joining system moves along a travel path, and wherein the joining head is connected to the cutting head, such that the first laser beam is applied in the travel path before the second laser beam is applied in the travel path. Illustration 8. The metal joining system of any illustration or combination of illustrations above or below, wherein the joining head is configured to direct the second laser beam toward a joining area formed by the contact edges of a first metal substrate and a second metal substrate during a metal joining process, and form a joint in the joining area. Illustration 8a. The metal assembly system of any illustration or combination of preceding or subsequent illustrations, further comprising a cleaning head configured to direct a cleaning force to the bonding region, and to apply a vacuum force to the bonding region. Illustration 8b. The metal assembly system of any illustration or combination of illustrations above or below, wherein the cleaning head is configured to direct the cleaning force to at least one of an upper and one lower joint surface. Illustration 8c. The metal assembly system of any illustration or combination of illustrations above or below, wherein the cleaning force comprises at least one of a chemical solvent, a scraper blade, compressed air, or a laser beam. Illustration 8d. The metal assembly system of any illustration or combination of illustrations above or below, further comprising a joint terminator configured to remove a portion of the joint from at least one upper or lower joint surface. Illustration 9 A metal joiner for a metal joiner system, the metal joiner comprising: a cutting head configured to prepare a joining region to form a joint, directing a first laser beam from the metal joiner to the joining region; and a joining head configured to form the joint in the joining region by directing a second laser beam from the metal joiner to the joining region, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head. Illustration 9a. The metal assembler of any illustration or combination of illustrations above or below, wherein the metal assembler further comprises a cleaning head and a joint terminator, wherein the joint terminator is configured to remove a portion of the joint from the joining region. Illustration 9b. The metal joiner of any illustration or combination of illustrations above or below, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head simultaneously or separately. Illustration 10. The metal assembler of any illustrations or combination of illustrations preceding or following, wherein at least one feature of the second laser beam is different from the first laser beam, and wherein the at least one feature comprises at least one of a beam size, a beam intensity, or a beam pattern. Illustration 11. The metal assembler of any illustration or combination of illustrations above or below, wherein the metal assembler moves along a travel path, and wherein the joining head is connected to the cutting head, such that the first laser beam is applied in the travel path before the second laser beam is applied in the same travel path. Illustration 11a. The metal joiner of any illustration or combination of illustrations above or below, wherein the joining region comprises a first metal substrate and a second metal substrate, and wherein the joining head is configured to form a joint having a thickness that is less than a thickness of the first metal substrate, and less than a thickness of the second metal substrate. Illustration 12. A metal assembly system comprising: the metal assembler of any illustration or combination of illustrations above or below; a controller communicatively coupled to the metal assembler; and a power source communicatively coupled to the cutting head and the joining head. Illustration 13. A metal joiner for a metal joining system, the metal joiner comprising: a cutting head configured to prepare a joining region to form a joint, directing a first laser beam from the metal joiner to the joining region; and a joining head configured to form the joint in the joining region, directing a second laser beam from the metal joiner to the joining region, wherein the metal joiner moves along a travel path during a metal joining process, and wherein the joining head is connected to the cutting head, such that the joining head is downstream of the cutting head along the travel path. Illustration 14. The metal joiner of any illustration or combination of illustrations above or below, wherein the joining head is connected to the cutting head, such that the first laser beam is applied in the travel path before the second laser beam is applied in the travel path. Illustration 14a. The method of any illustration or combination of illustrations above or below, wherein the preparation of the bonding region further comprises directing a cleaning head to the bonding region ahead of the cutting head on a lower portion of the metal substrates. Illustration 14b. The method of any illustration or combination of illustrations above or below, further comprising directing a joint terminator to remove a portion of the weld at one or more of a weld start, weld crater, or weld defects. Illustration 15. The metal assembler of any illustrations or combination of illustrations above or below, wherein at least one feature of the second laser beam is different from the first laser beam, and wherein the at least one feature comprises at least one of a beam size or beam pattern. Illustration 16. The metal joiner of any illustration or combination of illustrations above or below, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head. Illustration 16a. The method of any illustrations or combination of illustrations above or below, wherein the preparation of the bonding region comprises removing a contaminant from the bonding region with a cleaning head. Illustration 17. A metal assembly system comprising: the metal assembler of any illustration or combination of illustrations above or below; a controller communicatively coupled to the metal assembler; and a power source communicatively coupled to the cutting head and the joining head. Illustration 18. A method comprising: aligning an end edge of a first metal substrate with a mid-edge of a second metal substrate, such that a surface of the end edge butts together with a surface of the lead edge, wherein the aligned end edge and lead edge define a joining region; preparing the joining region for joining by directing a first laser beam to the joining region with a cutting head of a metal joiner; and directing a second laser beam to the joining region with a joining head of a metal joiner to form a weld, wherein the weld formation joins the first metal substrate to the second metal substrate. Illustration 19. The method of any illustration or combination of illustrations above or below, wherein the preparation of the bonding region comprises forming a gap in the bonding region between the first metal substrate and the second metal substrate with the first laser beam, wherein the gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate, and wherein a width of the gap is less than 0.5 mm. Illustration 20. The method of any illustration or combination of illustrations above or below, wherein the preparation of the junction region comprises removing a contaminant from the junction region with the first laser beam. Illustration 21. The method of any illustrations or combination of illustrations above or below, wherein the removal of the contaminant comprises removing a lubricant from the bonding region. Illustration 22. The method of any illustration or combination of illustrations above or below, wherein the preparation of the bonding region comprises directing the first laser beam to an upper surface of the first metal substrate, a lower surface of the first metal substrate, an upper surface of the second metal substrate, a lower surface of the second metal substrate, the edge surface of the end edge, and the edge surface of the beginning edge. Illustration 23. The method of any illustration or combination of illustrations above or below, wherein the weld formation comprises forming a weld having a weld thickness that is less than a thickness of the first metal substrate and less than a thickness of the second metal substrate. Illustration 24. The method of any illustration or combination of illustrations above or below, wherein the formation of the weld comprises forming a weld with an upper welded surface that is recessed relative to the upper surfaces of the first metal substrate and the second metal substrate, and a lower welded surface that is recessed relative to the lower surfaces of the first metal substrate and the second metal substrate. Illustration 24a. The method of any illustrations or combination of illustrations above or below, wherein directing the second laser beam comprises directing the second laser beam comprising at least one feature that is different from the first laser beam. Illustration 25. The weld formed by the method of any of the above or subsequent illustrations or combinations thereof. Illustration 26. A weld joining a first metal substrate to a second metal substrate, ivi A / a / zu¿ o / uuuoo i wherein the weld comprises an upper welded surface and a lower welded surface, wherein the upper welded surface is recessed relative to at least one of an upper surface of the first metal substrate or an upper surface of the second metal substrate, and wherein the lower welded surface is recessed relative to at least one of a lower surface of the first metal substrate or a lower surface of the second metal substrate. Illustration 27. The welding of any illustrations or combination of illustrations above or below, wherein the welding extends substantially perpendicular to a processing direction of the first metal substrate and the second metal substrate being joined. Illustration 28. Welding of any illustrations or combination of illustrations above or below, wherein the welding is not perpendicular to a processing direction of the first metal substrate and the second metal substrate being joined Illustration 28a. The welding of any illustrations or combination of illustrations above or below, wherein the weld metals in one or more of the weld start regions or weld crater are removed from the first metal substrate and the second metal substrate. Illustration 29. The welding of any illustration or combination of illustrations above or below, wherein the upper welded surface is recessed relative to both the upper surface of the first metal substrate and the upper surface of the second metal substrate, and wherein the lower welded surface is recessed relative to both the lower surface of the first metal substrate and the lower surface of the second metal substrate. Illustration 30. A weld joining a first metal substrate to a second metal substrate, wherein the weld comprises a weld thickness, and wherein the weld thickness is less than at least one of a thickness of the first metal substrate or a thickness of the second metal substrate. Illustration 30a. The welding of any illustration or combination of illustrations above or below, wherein the formation of the weld comprises forming a weld having a weld thickness that extends beyond an upper surface of the first metal substrate and beyond an upper surface of the second metal substrate by less than 0.2 mm or 10% of the thickness of both the first metal substrate and the second metal substrate. Illustration 31. The welding of any illustrations or combination of illustrations above or below, wherein the welding extends substantially perpendicular to a processing direction of the first metal substrate and the second metal substrate being joined. Illustration 32. Welding of any illustrations or combination of illustrations above or below, wherein the welding is not perpendicular to a processing direction of the first metal substrate and the second metal substrate being joined. Illustration 33. The welding of any illustrations or combination of illustrations above or below, wherein the thickness of the weld is less than both the thickness of the first metal substrate and the thickness of the second metal substrate. iviA / a / zu¿ o / uuuoo i Illustration 34. A method comprising: preparing a first metal substrate comprising a first end edge, clamping the first metal substrate and directing a first laser beam from a metal joiner to a first side of the first metal substrate to create a first contact surface on the first end edge of the first metal substrate; preparing a second metal substrate comprising a second end edge, clamping the second metal substrate and directing a second laser beam from the metal joiner to a first side of the second metal substrate to create a second contact surface on the second end edge of the second metal substrate; forming a bonding region for the first metal substrate and the second metal substrate by butting the first contact surface with the second contact surface;and directing a third laser beam to the joining region with the metal joiner to form a weld, where the weld formation joins the first metal substrate with the second metal substrate.; Illustration 35. The method of any illustration or combination of illustrations above or below, wherein the preparation of the first metal substrate further comprises applying a cleaning force on a second side of the first metal substrate opposite the first side, while directing the first laser beam, and wherein the preparation of the second metal substrate further comprises applying a cleaning force on a second side of the second metal substrate opposite the first side, while directing the second laser beam. The aspects described above are merely possible examples of implementations, presented simply for a clear understanding of the principles of this description. Many variations and modifications can be made to the modalities described above without substantially departing from the spirit and principles of this description. All such modifications and variations are intended to be included in this document, within the scope of this description, and all possible claims for individual aspects or combinations of elements or steps are intended to be supported by this description. Furthermore, although specific terms are used herein, as well as in the claims that follow, they are used only in a generic and descriptive sense, and not for the purpose of limiting the modalities described or the claims that follow.

Claims

1. A metal joining system, comprising: a power source; and a metal joining unit, comprising: a cutting head communicatively coupled to the power source and configured to prepare a joining region to form a joint, directing the first laser beam of the metal joining unit to the joining region; and a joining head communicatively coupled to the power source and configured to form the joint in the joining region, directing a second laser beam of the metal joining unit to the joining region, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head.

2. The metal joining system according to claim 1, wherein the joining region comprises contact edges of a first metal substrate and a second metal substrate during a metal joining process.

3. The metal assembly system according to claim 2, further comprising a controller communicatively coupled to the metal assembler, wherein the controller is configured to control the cutting head such that the first laser beam forms a gap between the contact edges of the first metal substrate and the second metal substrate, and wherein the gap is less than 0.5 mm.

4. The metal assembly system according to claim 2, wherein the joining region further comprises an upper surface and a lower surface of each of the first metal substrate and the second metal substrate, wherein the metal assembly system further comprises a controller communicatively coupled to the metal assembler, and wherein the controller is configured to control the cutting head such that the first laser beam is directed towards at least one of the upper or lower surface.

5. The metal joining system according to claim 2, wherein the joining head is configured to direct the second laser beam towards a joining area formed by the contact edges of a first metal substrate and a second metal substrate, during a metal joining process, and forms a joint in the joining area.

6. The metal assembly system according to claim 1, further comprising a controller communicatively coupled to the metal assembly, wherein the controller is configured to move the metal assembly along a displacement path at a speed of at least 3 meters per minute, while at least one of the first laser beam or the second laser beam is directed from the metal assembly.

7. The metal assembly system according to claim 1, wherein at least one feature of the second laser beam is different from the first laser beam, and wherein the at least one feature comprises at least one of a beam size, a beam intensity, or a beam pattern.

8. The metal joining system according to claim 1, wherein the metal joining system moves along a displacement path, and wherein the joining head is connected to the cutting head, such that the first laser beam is applied to the displacement path before the second laser beam is applied to the displacement path.

9. The metal assembly system according to claim 1, further comprising a cleaning head configured to direct a cleaning force to the joining region and apply a suction force to the joining region.

10. The metal assembly system according to claim 9, wherein the cleaning head is configured to direct the cleaning force to at least one upper and one lower joint surface.

11. The metal assembly system according to claim 9, wherein the cleaning force comprises at least one of a chemical solvent, compressed air, or a laser beam.

12. The metal assembly system according to claim 1, further comprising a joint terminator configured to remove a portion of a weld starter forming the joint, or a weld end forming the joint.

13. The metal assembly system according to claim 1, wherein the metal assembly system further comprises a cleaning head configured to prepare the joining region by directing a cleaning force from the cleaning head to the joining region.

14. The metal assembly system according to claim 13, wherein the joining head is connected to the cutting head with the cleaning head attached, such that the joining head moves with the cutting head simultaneously or separately.

15. The metal joining system according to claim 13, wherein the metal joining system further comprises a joint terminator communicatively coupled to the power source, and configured to remove metal in one or more of a joint weld start or crater region.

16. A metal joiner for a metal joiner system, the metal joiner comprising: a cutting head configured to prepare a joining region to form a joint, directing a first laser beam from the metal joiner to the joining region, to form a gap in the joining region; and a joining head configured to form the joint in the joining region, directing a second laser beam from the metal joiner to the joining region, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head.

17. The metal assembler according to claim 16, wherein at least one feature of the second laser beam is different from the first laser beam, and wherein the at least one feature comprises at least one of a beam intensity, a beam size, or a beam pattern.

18. The metal assembler according to claim 16, wherein the metal assembler moves along a displacement path, and wherein the joining head is connected to the cutting head, such that the first laser beam is applied in the displacement path before the second laser beam is applied in the displacement path.

19. The metal joiner according to claim 16, wherein the joining region comprises a first metal substrate and a second metal substrate, and wherein the joining head is configured to form a joint having a thickness that is less than a thickness of the first metal substrate, and that is less than a thickness of the second metal substrate.

20. The metal assembler according to claim 16, wherein the metal assembler further comprises a cleaning head and a joint terminator, wherein the joint terminator is configured to remove a portion of the joint from the joining region.

21. The metal joiner according to claim 20, wherein the joining head is connected to the cutting head, such that the joining head moves with the cutting head simultaneously or separately.

22. A metal assembly system, comprising: the metal assembler according to claim 16; a controller communicatively coupled to the metal assembler; and a power source communicatively coupled to the cutting head and the joining head.

23. A method comprising: aligning an end edge of a first metal substrate with a leading edge of a second metal substrate, such that a surface of the end edge butts together with a surface of the leading edge, wherein the aligned end edge and leading edge define a joining region; preparing the joining region for joining by directing a first laser beam to the joining region with a cutting head of a metal joiner; and directing a second laser beam to the joining region with a joining head of a metal joiner to form a weld, wherein the weld formation joins the first metal substrate to the second metal substrate.

24. The method according to claim 23, wherein the preparation of the bonding region comprises forming a gap in the bonding region between the first metal substrate and the second metal substrate, with the first laser beam, wherein the gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate, and wherein a width of the gap is less than 0.5 mm.

25. The method according to claim 23, wherein the preparation of the bonding region comprises removing a contaminant from the bonding region with a cleaning head.

26. The method according to claim 23, wherein the preparation of the ivi A / a / zu¿ o / uuuoo i junction region comprises removing a contaminant from the junction region with the first laser beam.

27. The method according to claim 26, wherein directing the second laser beam comprises directing the second laser beam comprising at least one feature that is different from the first laser beam.

28. The method according to claim 23, wherein the preparation of the bonding region comprises directing the first laser beam to an upper surface of the first metal substrate, a lower surface of the first metal substrate, an upper surface of the second metal substrate, a lower surface of the second metal substrate, the surface of the end edge, and the surface of the beginning edge.

29. The method according to claim 23, wherein the weld formation comprises forming a weld having a weld thickness that is less than a thickness of the first metal substrate and less than a thickness of the second metal substrate.

30. The method according to claim 23, wherein forming the weld comprises forming a weld having a weld thickness that extends beyond an upper surface of the first metal substrate and beyond an upper surface of the second metal substrate by less than 0.2 mm or 10% of the thickness of both the first metal substrate and the second metal substrate.

31. The method according to claim 23, wherein the weld formation comprises forming a weld with an upper welded surface that is recessed relative to the upper surfaces of the first metal substrate and the second metal substrate, and a lower welded surface that is recessed relative to the lower surfaces of the first metal substrate and the second metal substrate.

32. The method according to claim 23, wherein the preparation of the joining region further comprises directing a cleaning head to the joining region ahead of the cutting head on a lower part of the metal substrates.

33. The method according to claim 23, further comprising directing a joint terminator to remove a portion of the weld at one or more of a weld start, weld crater, or weld defects.

34. A weld joining a first metal substrate to a second metal substrate, wherein the weld comprises an upper welded surface and a lower welded surface, wherein the upper welded surface is recessed relative to at least one of an upper surface of the first metal substrate or an upper surface of the second metal substrate, and wherein the lower welded surface is recessed relative to at least one of a lower surface of the first metal substrate or a lower surface of the second metal substrate.

35. The weld according to claim 34, wherein the weld extends substantially perpendicular to a processing direction of the first metal substrate and the second metal substrate joined together.

36. The welding according to claim 34, wherein the welding is not perpendicular to a processing direction of the first metal substrate and the second metal substrate being joined.

37. The weld according to claim 34, wherein the upper welded surface is recessed relative to both the upper surface of the first metal substrate and the upper surface of the second metal substrate, and wherein the lower welded surface is recessed relative to both the lower surface of the first metal substrate and the lower surface of the second metal substrate.

38. A weld joining a first metal substrate to a second metal substrate, wherein the weld comprises a weld thickness, and wherein the weld thickness is less than at least one of a thickness of the first metal substrate or a thickness of the second metal substrate.

39. The weld according to claim 38, wherein the weld extends substantially perpendicular to a processing direction of the first metal substrate and the second metal substrate joined together.

40. The welding according to claim 38, wherein the welding is not perpendicular to a processing direction of the first metal substrate and the second metal substrate joined together.

41. The welding according to claim 38, wherein the thickness of the weld is less than both the thickness of the first metal substrate and the thickness of the second metal substrate.

42. The welding according to claim 38, wherein the weld metals in the regions of the start of the weld and the weld crater are removed from the first metal substrate and the second metal substrate.

43. A method comprising: preparing a first metal substrate comprising a first end edge, by clamping the first metal substrate and directing a first laser beam from a metal joiner onto a first side of the first metal substrate to create a first contact surface on the first end edge of the first metal substrate; preparing a second metal substrate comprising a second end edge, by clamping the second metal substrate and directing a second laser beam from the metal joiner onto a first side of the second metal substrate to create a second contact surface on the second end edge of the second metal substrate; forming a bonding region for the first metal substrate and the second metal substrate by butting the first contact surface with the second contact surface;and directing a third laser beam to the joining region with the metal assembler to form a weld, where the weld formation joins the first metal substrate with the second metal substrate.; 44. The method according to claim 43, wherein the preparation of the first metal substrate further comprises applying a cleaning force on a second side of the first metal substrate, opposite the first side, while directing the first laser beam, and wherein the preparation of the second metal substrate further comprises applying a cleaning force on a second side of the second metal substrate opposite the first side, while directing the second laser beam.

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