WIRE DRAWING MONITORING SYSTEM

Abstract

A wire drawing system is described that has at least two probes for measuring various characteristics of the die box components or the wire being drawn through the die box. The system includes a smart die, in which multiple probes send information to a data processing unit. The data processing unit takes the information from the various probes and controls the various parameters of the wire drawing process. A smart die has a probe that gathers information directly from a wire drawing die. The smart die also includes a force sensor and is configured so that a die box can be moved along an axis that is parallel to the direction in which the wire is drawn. The data processing unit controls the various wire drawing parameters, such as drawing speed, coolant pressure, and the rate at which the coolant is pumped through the system.

Description

WIRE DRAWING MONITORING SYSTEM Field of invention This invention relates to the field of manufacturing metal wires using wire drawing machines. More specifically, it relates to dies, die holders, and monitoring systems for such manufacturing. Background of the invention Wire requirements have become increasingly demanding from both a technical and commercial standpoint. This has required wire producers to increase production speeds and draw wire to very tight tolerances and specific mechanical properties with minimal downtime. Examples include the production of carbon wire, super duplex stainless steels, titanium, Inconel, and many others. To produce finished wire of a target diameter and mechanical properties, wire rods of various metal alloys are drawn through one or more drawing dies in specialized wire drawing machinery to reduce their diameter or change their shape. To achieve the required wire diameter and mechanical properties, the wire is cold-drawn in as few as one pass and as many as 27 consecutive passes. In the current state of the industry, most wire drawing die tips are permanently encased in steel or other metal boxes, which are discarded as soon as the carbide or diamond tip material has exceeded its service life. At that point, the boxes and permanently encased tips are discarded and recycled. A wire drawing die tip is the core material in a wire drawing die, made of tungsten carbide, polycrystalline diamond, natural or synthetic diamond, or other hard materials. In certain applications, die tips are replaceable. The wiring process places significant stress on the various components of the wire drawing system. Due to this high stress, system components often fail before their expected lifespan. Measuring the system's physical characteristics is very difficult. The prior art includes various probes and sensors that can be externally attached to the components of a wire drawing machine. However, there are no internal sensors that provide a clear picture of the condition of the various components and that can be combined to monitor the various parameters of the wire drawing process. Brief description of the invention This application pertains to a wire drawing monitoring system and the components that facilitate control of the wire drawing process. One embodiment is a wire drawing frame that includes a drawing channel and a die probe channel extending from an outer wall to an inner wall of the frame. Another embodiment is a die box that has two or more probes that measure various characteristics of the die box components or a wire being drawn through it. MA / I / UO I υÓO of the die box. Another modality is a system consisting of a wire drawing monitoring system that has a wire drawing box comprising two or more probes that measure two or more properties of a wire drawing device. One of these two or more properties is measured on a die surface that is parallel to a surface of the drawing device, and a control unit, where the two or more probes send information to the control unit. Additional objects of this invention will become apparent from a consideration of this specification. Brief description of the drawings The above features, aspects, and advantages, and others, of the present invention are considered in greater detail, in relation to the following description of its embodiments shown in the accompanying drawings, in which: Figure 1A is a front perspective view of a dice box. Figure 1B is a perspective rear view of a dice box. Figure 2A is a perspective view of a die. Figure 2B is a cross-section along the RR axis of the die. Figure 2C is a bottom view of a die. Figure 3A is a cross-sectional view of a die holder having a two-piece die. Figure 3B shows a cross-sectional view of a die holder that has a three-piece die. Figure 4A is a front view of a die box. Figure 4B is a cross-section along axis AA of the die box. Figure 40 is a cross-section along the BB axis of the die box. Figure 5A is a front view of a die box. Figure 5B is a cross-section along the FF axis of the die box. Figure 5C is a cross-section along the JJ axis of the die box. Figure 6A is a cross-section along the GG axis. Figure 6B is an enlarged view of square H in Figure 6A. Figure 6C is a rear view of a dice box. Figure 7A and Figure 7B are cross-sectional views of drawing die covers having a filler material in the probe channel of the die. Figure 8 is a cross-section of a die box undergoing direct cooling. Figure 9 is a perspective view of a die box with a coolant flow regulator. Detailed description of the invention The invention summarized above and defined by the listed claims can be better understood by referring to the following description, which should be read in conjunction with the drawings. ML / t / ZU¿ I / UO I annexes, in which similar reference numbers are used for similar parts. This description of one embodiment, which is set forth below to enable a person skilled in the art to develop and use an implementation of the invention, is not intended to limit the invention, but rather to serve as a particular example thereof. Those skilled in the art should appreciate that they can readily use the concept and further specific embodiments described as a basis for modifying or designing other methods and systems to accomplish the same purposes of the present description. Those skilled in the art should also realize that such equivalent assemblies do not depart from the spirit and scope of the invention in its broadest sense. This application describes a wire drawing monitoring system that gathers various characteristics of the components of one or more wire drawing machines to improve wire drawing machine efficiency, reduce downtime due to component failure, and lower costs. In some embodiments, the wire drawing monitoring system includes an Intelligent Die System component, as described herein. The system gathers information from one or more probes that measure the physical characteristics of wire drawing machine components, such as the dies used in the process, the dies themselves, and the wire. As described herein, the term “probe” means any type of device that gathers information to be used by the system, whether it is a physical probe or any type of sensor.In some configurations, the system gathers information from two or more probes that measure the physical characteristics of the wire drawing machine components. In some configurations, the monitoring system includes a die box 200, as shown in Figures 1A and 1B. The die box 200 has a drawing die holder 100 that houses a die 102, as shown in Figures 2A, 2B, and 2C. As is known in the industry, the die 102 is made of a hard material such as tungsten carbide, polycrystalline diamond, natural diamond, or any other similar material. In certain applications, the die may also be referred to as a "point." As shown in Figures 3A, 3B, and 3C, the die 102 may be of single construction or of several components, such as a pressure die 129 or point, a drawing die 126, or a secondary die 131. Figure 3A shows a drawing die holder 100 that houses a two-piece die 102, comprising a drawing die 126 and a pressure die 129 or point. Figures 3B and 3C show a die housing a three-piece die 102, comprising a drawing die 126, a pressure die 129 and a secondary die 131.Figure 3C is an enlarged view of a three-piece die 102 in a die box 200. The drawing die holder 100 is configured to accept a probe 115 that measures one or more properties or physical characteristics of the die 102 used during a wire drawing process. The drawing die holder 100 has a drawing channel 103, which supports the die 102 during the wire drawing process. The drawing channel 103 extends longitudinally along the direction of wire travel during the wire drawing process. The drawing die 100 also has a die probe channel 106 that extends from an outer wall 109 of the die to an inner wall 112 of the drawing die 100. As described herein, the drawing channel 103 is the boundary between the outer wall 110 of the die and the drawing die 100; the drawing channel 103 is the channel formed. MA / E / ZυZΊ / UO I300 through the inner wall of the drawing die 100. The drawing channel 103 is different and runs parallel to the wire forming channel 105, which is the channel formed by the inner wall 113 of the die. In some embodiments, the probe channel of die 106 is perpendicular or orthogonal to the drawing channel 103. It is contemplated, however, that in other embodiments the probe channel of die 106 may have an orientation with respect to the drawing channel 103 that has a different angle, provided that the probe has access to die 102. For example, if the drawing channel 103 is tapered, the probe channel 106 may extend vertically from the drawing channel 106, without necessarily being perpendicular or orthogonal to the drawing channel 106. In some models, die 102 is enclosed within drawing die 100. In other models, die 102 may be separate from drawing die 100. Drawing die 100, in some models, may be divided into a first base 118 and a lid 121. The first base 118 holds a drawing die 126 that can be removed from the first base 118. In other models, the drawing die 126 is enclosed within the first base 118 and cannot be removed or replaced. The cap 121 of the drawing die holder 100 supports a pressure die 129 or tip that can be removed from the cap 121. In some embodiments, the die holder 100 supports more than one pressure die 129. In other embodiments, the pressure die 129 is enclosed within the cap 121 and cannot be removed or replaced. In yet another embodiment, the drawing die holder 100 includes a second base 123. The second base 123 supports a secondary die 131 that can be removed or replaced.In other embodiments, the secondary die 131 is enclosed within the second base 123 and cannot be removed or replaced. The secondary die 131 is an additional die used to impart specific properties to the wire, in addition to those imparted by the drawing die 126 and the pressure die 129. In some embodiments, the secondary die 131 has a small clearance from the drawn wire. In other embodiments, the secondary die 131 imparts a further reduction in wire diameter. In still other embodiments, the drawing die 131 can impart a small weaving pass to harden the outer surface of the wire. The probe channel of die 106, in some embodiments, is within the first base 118. In some embodiments, the drawing die 126 is permanently enclosed within the first base 118, meaning that the drawing die 126 cannot be removed from the base 118; the probe channel of die 106 extends into the inner wall 112 of the drawing die holder 100, which is the portion of the first base 118 that encloses the drawing die 126. In other embodiments, the drawing die 126 is not enclosed, but can be removed, from the first base 118; the probe channel of die 126 extends into the inner wall 112 of the drawing die holder 100, which is the portion of the first base 118 that comes into contact with the drawing die 126. The probe channel of die 106 houses a probe 115. In one embodiment, the probe 115 gathers information from any portion of die 102, drawing die 126, pressure die 129, or secondary die 131. In some embodiments, the probe 115 makes contact with die 102. The probe 115, in some embodiments, is a transducer that sends information to a sensor. The probe 115, in some embodiments, is the transducer or data collector for one or more temperature sensors. ML / I / uo I uoo a vibration sensor, a pressure sensor, an infrared sensor, a pyrometer, a magnetic field sensor, or any other type of sensor that can meet the physical characteristics of die 102, the drawing die 100, or the wire being pulled through the drawing die 100. In some embodiments, when the sensor gathers temperature information, the temperature sensor is a thermocouple or infrared sensor, and the probe 115 is the portion of that sensor that gathers and sends the temperature information to a data processing device 210. In some embodiments, the probe 115 physically makes contact with die 102. In other embodiments, the probe 115 has access to die 102 through the die probe channel 106 and gathers information from die 102 without making direct contact with die 102. In some embodiments, probe 115 is enclosed within the probe channel of die 106; that is, probe 115 is fixed within the probe channel of die 106 and cannot slide in or out of it. In other embodiments, probe 115 can be removed from the probe channel of die 106. In some embodiments, a retainer, such as a spring, applies pressure to probe 115 against die 102. In other embodiments, as shown in Figures 7A and 7B, the die probe channel 106 contains a conductive filler material 141. A conductive filler material 141 is one that readily carries a physical characteristic. In some embodiments, the conductive filler material 141 is thermally conductive to allow an accurate reading of the temperature of die 102. In some embodiments, the conductive filler material 141 is located in a lower portion of the die probe channel 106 and makes contact with die 102. In some embodiments, the probe 115 makes contact with the conductive filler material 141, indirectly gathering information from die 102. In some embodiments, the probe 115 is enclosed within the die probe channel 106; that is, the probe 115 is held in a fixed position within the die probe channel 106 and cannot slide in or out, and it makes contact with the conductive filler material 141.In other embodiments, the probe 115 can be removed from the die probe channel 106. In some embodiments, a retainer, such as a spring, provides pressure to the probe 115 against the conductive filler material 141. In some embodiments, probe 115 transmits information from die 102, die 100, or other components to a data processing device 210. The data processing device 210 is, in some embodiments, a data reader, transmitter, or recorder. In some embodiments, probe 115 is physically connected to the data processing device 210. In other embodiments, probe 115 communicates wirelessly with the data processing device 210. Wireless communication reduces the possibility of physical connections being damaged during machine operation or in the event of a drawing failure, where a loose, high-tension wire can damage the wired connections. In some embodiments, the drawing die holder 100 is housed within a die box 200, as shown in Figures 4A, 4B, and 4C. The die box 200 includes a box probe channel 203. The box probe channel 203 extends from the outer wall 206 of the box into the inner wall 209 of the box, which is adjacent to and runs parallel to the outer support wall 109. MA / I / UO I υÓO The probe channel in box 203 houses probe 115. In one configuration, probe 115 can gather information from any portion of the drawing die 100. In some configurations, probe 115 physically makes contact with die 100. In other configurations, probe 115 accesses die 100 through probe channel 203 and gathers information from drawing die 100 without making direct contact with it. In more configurations, probe 115 extends through die 100 and makes contact with die 102, gathering information from die 102. In some configurations, probe 115 makes contact with drawing die 126. In still more configurations, probe 115 extends through die 100 but does not make contact with die 102. The probe 115 gathers information from die 102 without making direct contact with die 102. In some embodiments, probe 115 is enclosed within the probe channel of the die housing 203; that is, probe 115 is fixed within the probe channel of the die housing 203 and does not allow sliding in or out of the probe channel of the die housing 203. In other embodiments, probe 115 can be removed from the probe channel of the die housing 203. In some embodiments, a retainer, such as a spring, applies pressure to probe 115 against the die housing 100. In other embodiments, the probe channel of the die housing 203 contains a filler material 141. The conductive filler material 141, in some embodiments, is in a lower portion of the probe channel of the die housing 203 and makes contact with the die holder 100. The probe 115, in some embodiments, makes contact with the conductive filler material 141, indirectly gathering information from the die holder 100. The probe 115, in some embodiments, is enclosed within the probe channel of the die housing 203; that is, the probe 115 is fixed within the probe channel of the die housing 203 and cannot slide in or out of the probe channel of the die housing 203 and makes contact with the conductive filler material 141. In other embodiments, the probe 115 can be removed from the probe channel of the die housing 203. In some embodiments, a retainer, such as a spring, provides pressure to the probe. 115 against conductive filler material 141. In one illustrative embodiment, the die box 200 houses a die holder 100, which includes a die probe channel 106. The die box in Figure 2B, wherein the box probe channel 203 and the die probe channel 106 are aligned, allows the probe 115 to be extended through both channels. In some embodiments, the die box 200 and the die holder 100 have an alignment element 213 that helps to properly align the die box probe channel 203 and the die probe channel 106. In some embodiments, the alignment is radial. The alignment element 213, for radial alignment, in some embodiments, has two components: an alignment pin 216 and a depression 219 that matches the alignment pin 216. In some embodiments, the alignment pin 16 is part of the die box 200 and the depression 219 is in the die cover 100.In other configurations, alignment pin 216 is part of socket 100 and depression 219 is part of socket 200. As shown in Figure 5B, the die box 200 has a die box alignment channel 222. The die box alignment channel 222, in some embodiments, is parallel to the die box probe channel 203. The die box alignment channel 222 is also parallel to the die probe channel 106. In some embodiments, a first portion 225 of the alignment channel 222 is in the drawing die 100 and a second portion 228 of the die box alignment channel 222 is in the drawing die 100. MA / t / ZU¿ I / UO I is adjacent to the drawing die 100. The first portion 225 of the alignment channel 222 joins with the second portion 228 of the alignment channel 222 to form a single alignment channel that accommodates an alignment pin 216. In some embodiments, the first portion 225 of the alignment channel has an oblong or irregular shape. In other embodiments, the oblong or irregular shape is in the second portion 228 of the alignment channel 222 of the die housing. In some embodiments, the die housing 200 has a jacket 234 for indirect cooling of the die holder 100. Indirect cooling, as discussed herein, refers to a type of cooling where the die holder 100 is surrounded by the jacket 234, which comprises cooling channels through which coolant flows, removing heat from the jacket 234, which, in turn, removes heat from the die holder 100. The jacket 234 is a cooling jacket; in some embodiments, the coolant is water. The jacket 234 supports the die holder 100. The jacket 234 further provides a cooling channel 237, which provides indirect cooling to the die holder 100 and the die 102. The die housing 200, in some embodiments, includes a third portion of the housing alignment channel 222 that extends through the sleeve 234. The third portion 240 of the housing alignment channel 222 is aligned with the first portion 225 and the second portion 228 of the housing alignment channel 222. The alignment pin 216, in some embodiments, extends through the first portion 225, the second portion 228, and the third portion 240 of the housing alignment channel 222. The die housing 200 has a top side 243 that also has a sliding locking block 246. The sliding locking block 246 is pressed against the die housing 200 by means of a center-locking crank clamp 252. In some embodiments, the sliding locking block 246 of the die housing 200 is secured above the sleeve 234, on the top side 243 of the die housing 200. In some embodiments, the pin 216 is removably attached to the sliding locking block 246. When the center-locking crank clamp 252 is actuated in the closed position, the sliding locking block 246 and the pin 216 are secured. When the angled clamp 252 of the closing type is actuated in the untraced position, the safety block 246 and the pin 216 are led so that they can be removed from the die housing 246.In some cases, the pin 216 and / or the safety block 246 may become attached and need to be removed from the socket box 200. There are multiple displacement options in such cases. The sliding safety block 246, in some embodiments, has a first displacement device 249 for levering the safety block when it is joined. The primary displacement device 255, in some embodiments, is a flat channel 258 on a lower side 261 of the sliding safety block 246. The channel 258, in some embodiments, extends through the sliding safety block 246 from a first side to a second side. In other embodiments, the safety channel does not run through the entire length of the sliding safety block 246, but consists of two grooves, one on each side, laminated into the sliding safety block 246 to allow a recess to be used to lever the safety block 246 away from the top face of the die case 200. In other illustrative embodiments, a secondary displacement device 264 is used to MA / t / ZUZ I / UO I uoo further assist a user in removing pin 216 from the die box 200. In one illustrative embodiment, the secondary displacement device 264 is a screw that is pushed against the sleeve and separates the displaceable locking block from the die box 200 when the screw is turned. In another embodiment, a third displacement device 249 includes a displacement channel 276 that extends from a lower side 279 of the die box into the alignment channel 222 of the box and has a diameter that is smaller than that of the alignment pin 216. A displacement pin (not shown) can be inserted through the displacement channel 276 to push the alignment pin 216 out of the die box 200. One version includes a sliding support 267, which can slide under the safety block to prevent it from falling while the die 102 or the cover 100 is being removed. In another embodiment, the die holder 100 is aligned within the die box 200 in an axial plane. Axial alignment, in some embodiments, is achieved through a tapered drawing channel 105 of the die box, meaning that the diameter at one end of the drawing channel 105 is different from the diameter of the drawing channel 105 at the other end. In one illustrative embodiment, the die box 200 includes a force transducer 303. In some embodiments, the force transducer 303 is in a no-load state. To achieve a no-load state of the force transducer 303, the die box 200 has a guide bar 306 that allows the die box 200 to move along an axis parallel to the drawing channel 103. The die box 200, in some embodiments, includes a plurality of guide bars 306. The die box 200 may also have two or more linear bearings 309 or a plurality of linear bearings 309. In one embodiment, when indirect cooling is used, the die housing 200 includes a sleeve 234 that connects to a backplate 270. A force transfer plate 401 connects to the force transducer 303. The force transducer 303 is retained by the backplate 270, and the durability of the backplate 270 is enhanced by a hardened washer 403 located between the force transducer 303 and the backplate 270. The force transducer 303 is held in place by a retaining ring 402. The retaining ring 402 applies pressure to the outer ring of the force transducer 303, and spring pressure is supplied through the wave washers 404, which are retained by retaining fasteners 405. This configuration secures the force transducer 303 in a non-preloaded state.The sliding plate 330 ensures radial alignment of the force transfer plate 401 while still allowing linear movement to compress the force transducer as required by the sleeve 234 during wire drawing. The sleeve 234 is connected to the back plate 270 via one or more guide bars 306 or a plurality of guide bars 306. In another embodiment, the die box 200 has a sliding plate 330 between the sleeve 234 and the back plate 270. A force transducer 303 is positioned between the sliding plate 330 and the back plate 270. In other embodiments, a force transfer plate 330 is positioned between the force transducer 303 and the sleeve 234. In some configurations, the 200 die box provides direct cooling. Figure 8 shows one configuration of direct cooling. As discussed in this document, the cooling Direct cooling refers to a coolant that is able to enter the die holder 100. In order to provide direct cooling, the die box 200 includes a die holder gasket 309 and a die box O-ring 312, both of which allow direct cooling of the die holder 100. A coolant inlet 803 supplies coolant to the cooling channel 800, which is in direct contact with the drawing die holder 100. As discussed previously, the die holder 100 within the die box 200 can be cooled directly or indirectly. In either type of cooling, the die box is connected to a coolant flow regulator 327, as shown in Figure 9. The coolant flow regulator 327 changes the rate of coolant being pushed through the system to cool the die 126 to a specific temperature.The information from several sensors, described in this document, is used to adjust the output of the 327 flow regulator. The die box 200, in some embodiments, includes a die box nut 315, which restricts the movement of the die holder 100 along an axis parallel to the drawing channel 103. In some embodiments, the installation of the die box nut 315 is configured to prevent axial preload after installation. In direct cooling applications, the die box nut 315 only penetrates the die box 200 to a predetermined position that prevents loading of the force transducer 303, giving the drawing die holder space to move. In such embodiments, the drawing die holder 100 can move along the drawing axis. The drawing die holder 100 can only travel far enough to prevent preload—that is, pressure when the wire is not being drawn—on the force transducer. The die box 200, in some embodiments, includes any of the following sensors: a vibration sensor 318, a magnetic sensor 321, a Hall effect sensor 324, and any other sensors. The die box 200, in some embodiments, is contemplated to include a rotating die holder. A rotating die holder is one that is allowed to rotate as the wire is drawn. The rotating die holder includes sensors that wirelessly transmit the information collected from the die holder to the control unit. The die box 200 and the die holder 100 are part of a wire drawing system that includes two or more probes that measure two or more physical properties of the die box 200, the die holder 100, the die 102, and other components of a wire drawing system. At least one of the probes measures properties on a die surface that is parallel to a die holder surface and a control unit. As used herein, the term “physical property” refers to an average quantity of the die box 200, die holder 100, die 120, or the wire. Such “physical properties” may be almost permanent to the materials from which the components of the die box 200, the drawing holder 100, die 102, and wire are made, such as temperature, conductivity, etc. Other “physical properties”, as used in this document, refer to measurable quantities that change depending on the wire drawing process.For example, the temperature of die 100 or die 102, the vibrations in die box 200, and other similar qualities. Two or more probes send this information to the control unit. The control unit can then send the information to a graphical user interface for the user to evaluate it or to a program that manages the machine parameters to take a specific action. In some configurations, the control unit processes the information and makes automatic adjustments to the specified wire drawing parameters. For example, in some configurations, the control unit combines the information gathered from the various probes and automatically adjusts the process drawing speed, the coolant flow supplied to the die box, and other similar parameters. In some configurations, the control unit controls the coolant flow supplied to the die box via a coolant flow regulator.One advantage of the system described here is that the probes send information to the control unit or data processing device 210 in “real time”, which is while the wire is being drawn through the machine in order to make adjustments to the drawing process without having to stop the system. In some embodiments, a system comprises a plurality of die boxes 200 with a plurality of probes and sensors that send information to a single control unit, which, in turn, adjusts the parameters of the wire drawing machine. The system regulates the machine parameters based on the information gathered from the probes 115 in the die box 200 and the wire drawing die 100. The plurality of die boxes 200 of the system, in some embodiments, are within a single wire drawing machine. In other embodiments, the plurality of die boxes 200 may be in multiple wire drawing machines operating simultaneously. The control unit is designed to change the various parameters in different machines based on real-time readings from each die box 200. A wire drawing monitoring system that includes a drawing box comprises two or more probes that measure two or more properties of a wire drawing device. As described above, one of the two or more properties is measured on a die surface that is parallel to a die holder surface. The system also has a control unit, and the two or more probes send information to the control unit. The wire drawing system also includes a wire drawing holder. The wire drawing system has a control unit that is configured to receive and process the information from the two or more probes. In some embodiments, the wire drawing system includes two or more drawing boxes. The system implements a method for controlling the parameters of a wire drawing machine based on information gathered from probes in die box 200 and drawing die holder 100, as described above. In the first step of the method, a wire drawing machine equipped with probes and sensors in one or more of the die boxes 200 and drawing die holder 100 initiates a drawing operation through drawing die holder 100. In the second step, information is collected from probes 115 in die holder 100 and die box 200. In some embodiments, probe 115 is located inside a die holder 100. Probe 115 makes contact with die 102, and other probes or sensors gather additional information directly from die box 200 and drawing die holder 100. In the third step, the information is sent to a data processing device 210.The data processing device 210 comprises a processing unit or computer programmed to collect and process the data received from the various probes. In a further step, the collected information is processed. In another step, the data processing device 210 controls the various parameters of the wire drawing machine in the die box 200 or die holder 100. The invention has been described with reference to a preferred embodiment. Although the values, MA / I / uo ι υοο Specific relationships, materials, and steps have been established for the purpose of describing the concepts of the invention. It will be appreciated by those skilled in the art that numerous variations and / or modifications can be made to the invention as shown in the specific embodiments without departing from the spirit or scope of the basic concepts and operating principles of the invention as broadly described. It should be recognized that, in view of the foregoing teachings, those skilled in the art may modify those specific aspects without departing from the invention taught herein. Having fully established the preferred embodiments and certain modifications of the concept underlying the present invention, other embodiments, as well as certain variations and modifications of the embodiments shown and described herein, will obviously occur to those skilled in the art upon becoming familiar with said underlying concept.It is intended to include all such modifications, alternatives, and other embodiments to the extent that they fall within the scope of the appended claims or their equivalents. Therefore, it should be understood that the invention may be practiced in a manner other than that specifically set forth herein. Consequently, the embodiments herein should be considered in all respects as illustrative and not restrictive. Industrial applicability The present invention relates to the manufacture of metal wires using wire drawing machines. More specifically, it relates to dies, die holders, and monitoring systems for such manufacture, and is used in industry.

Claims

CLAIMS 1. A wire drawing frame, comprising: a wire drawing channel, and a die probe channel extending from an outer wall to an inner wall of the wire drawing frame.

2. The drawing die according to claim 1, wherein the die probe channel is perpendicular to the drawing channel.

3. The wire drawing cover according to claim 1, wherein the wire drawing cover further comprises a first base and a lid.

4. The wire drawing cover according to claim 2, wherein the wire drawing cover further comprises a first base and a lid.

5. The wire drawing cover according to claim 3, further comprising a second base.

6. The drawing cover according to claim 3, wherein the die probe channel is located within the first base.

7. The wire drawing cover according to claim 4, further comprising a second base.

8. The drawing cover according to claim 4, wherein the die probe channel is located within the first base.

9. The wire drawing cover according to claim 1, further comprising a probe housed within the die probe channel.

10. The wire drawing cover according to claim 9, wherein the probe is one or more of a temperature sensor, a vibration sensor, a pressure sensor, an infrared sensor, a pyrometer, a magnetic field sensor.

11. The wire drawing cover according to claim 10, wherein the temperature sensor is a thermocouple.

12. The wire drawing die according to claim 9, comprising a die.

13. The drawing die according to claim 12, wherein the die is one or more of a pressure die, a drawing die and a secondary die.

14. The wire drawing cover according to claim 12, wherein the probe is in contact with the die.

15. The wire drawing die according to claim 12, further comprising a spring that provides pressure to the probe against the die.

16. The drawing die cover according to claim 9, wherein the probe is in a fixed position or can slide in the probe channel of the die.

17. The wire drawing die according to claim 9, wherein the die probe channel comprises a conductive filler material. MA / / uo I uoo 18. The wire drawing die according to claim 17, wherein the conductive filler material is in contact with a die.

19. The wire drawing cover according to claim 18, wherein the probe is in contact with the conductive filler material.

20. The wire drawing housing according to claim 18, further comprising a spring that provides pressure to the probe against the conductive filler material.

21. The drawing die according to claim 18, wherein the probe is in a fixed position or can slide in the probe channel of the die.

22. The wire drawing die according to claim 9, wherein the probe is configured to gather information from a die without making contact with the die.

23. The wire drawing cover according to claim 22, wherein the probe is configured to send the information that the probe collects to a data processing device.

24. The wire drawing cover according to claim 23, wherein the data processing device is a data reader, transmitter or recorder.

25. A die box, comprising: two or more probes measuring the various characteristics of the die box components or a wire being drawn through the die box.

26. The die box according to claim 25, further comprising a wire drawing holder.

27. The die box according to claim 26, further comprising a box probe channel and a die probe channel.

28. The die box according to claim 27, wherein the box probe channel and the die probe channel are aligned.

29. The die box according to claim 28, wherein the die box and the drawing die holder comprise an alignment element.

30. The die box according to claim 29, wherein the box probe channel and the die probe channel are radially aligned.

31. The die box according to claim 30, wherein the alignment element is a pin on the drawing die holder that coincides with a depression in the die box.

32. The die box according to claim 30, further comprising a box alignment channel.

33. The die box according to claim 32, wherein the box alignment channel is parallel to the box probe channel.

34. The die box according to claim 33, wherein a first portion of the box alignment channel is in the drawing die holder and a second portion of the box alignment channel is adjacent to the drawing die holder.

35. The die box according to claim 34, wherein the first portion of the box alignment channel has an oblong or irregular shape. MA / I / UO I υÓO 36. The die box according to claim 34, further comprising a third portion of the box alignment channel extending through a sleeve.

37. The die box according to claim 36, wherein the third portion of the box alignment channel is aligned with the first portion and the second portion of the box alignment channel.

38. The die box according to claim 37, further comprising an alignment pin extending through the first portion, the second portion, and the third portion of the box alignment channel.

39. The die box according to claim 38, further comprising a safety block movable on an upper side of the sleeve.

40. The die box according to claim 39, wherein the alignment pin is removably attached to the movable safety block.

41. The die box according to claim 39, further comprising a primary displacement device.

42. The die box according to claim 41, wherein the primary displacement device comprises a pivotable lever.

43. The die box according to claim 39, further comprising a secondary displacement device.

44. The die box according to claim 43, wherein the secondary displacement device is a channel on a lower side of the movable safety block.

45. The die box according to claim 39, further comprising a tertiary displacement device.

46. ​​The die box according to claim 45, wherein the tertiary displacement device is a screw that pushes against the sleeve and separates the movable safety block when the screw is turned.

47. The dice box according to claim 39, further comprising a sliding support.

48. The die box according to claim 28, wherein the box probe channel and the die probe channel are axially aligned.

49. The die box according to claim 48, wherein the drawing die has a drawing channel that is tapered.

50. The die box according to claim 25, further comprising a force transducer.

51. The die box according to claim 50, wherein the force transducer is in an unloaded state.

52. The die box according to claim 26, further comprising a jacket for indirect cooling of the drawing die holder.

53. The die box according to claim 52, wherein the shirt is a MA / t / ZUZ I / UO I υooo water shirt.

54. The die box according to claim 52, wherein the shirt supports the wire drawing carrier.

55. The die box according to claim 52, wherein the sleeve comprises a water channel.

56. The die box according to claim 52, wherein the die box comprises a guide bar that allows the die box to move along an axis that is parallel to a drawing channel in the drawing die holder.

57. The die box according to claim 55, wherein the die box comprises a plurality of guide bars.

58. The die box according to claim 56, further comprising a linear bearing.

59. The die box according to claim 46, further comprising a plurality of linear bearings.

60. The die box according to claim 26, wherein the drawing die holder is subjected to direct cooling.

61. The die box according to claim 60, comprising a die holder O-ring and a die box O-ring, which allow direct cooling of the drawing die holder.

62. The die box according to claim 60, further comprising a die box nut.

63. The die box according to claim 62, wherein the die box nut allows movement of the drawing die holder along an axis that is parallel to a drawing channel in the drawing die holder.

64. The die box according to claim 63, wherein the die nut is configured to prevent axial preload after installation.

65. The die box according to claim 52, further comprising a vibration sensor.

66. The die box according to claim 60, further comprising a vibration sensor.

67. The die box according to claim 52, further comprising a magnetic sensor or Hall effect sensor.

68. The die box according to claim 60, further comprising a magnetic sensor or Hall effect sensor.

69. The die box according to claim 25, further comprising a coolant flow regulator.

70. The die box according to claim 53, wherein the sleeve is connected to a backplate. MA / I / UO I υÓO 71. The die box according to claim 70, wherein the sleeve is connected to the back plate via a slide.

72. The die box according to claim 71, wherein the sleeve is connected to the back plate via a plurality of slides.

73. The die box according to claim 71, wherein the sleeve is connected to the back plate via four slides.

74. The die box according to claim 70, further comprising a sliding plate between the sleeve and the back plate.

75. The die box according to claim 74, further comprising a force sensor between the sliding plate and the back plate.

76. The die box according to claim 75, further comprising a force transfer plate between the force sensor and the sleeve.

77. A wire drawing monitoring system, comprising: a wire drawing box comprising two or more probes that measure two or more properties of a wire drawing device, and wherein one of said two or more properties is measured on a die surface that is parallel to a drawing surface, and a control unit, wherein the two or more probes send information to the control unit.

78. The wire drawing monitoring system according to claim 77, wherein the wire drawing box comprises a wire drawing holder.

79. The wire drawing monitoring system according to claim 77, wherein the control unit is configured to receive and process information from two or more probes.

80. The wire drawing monitoring system according to claim 77, further comprising two or more wire drawing boxes.

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