SPLIT DEHUMIDIFICATION SYSTEM WITH SECONDARY EVAPORATOR AND CONDENSER COILS

Abstract

A dehumidification system includes a compressor, a primary evaporator, a primary condenser, a secondary evaporator, and a secondary condenser. The secondary evaporator receives an inlet airflow and discharges a first airflow to the primary evaporator. The primary evaporator receives the first airflow and discharges a second airflow to the secondary condenser. The secondary condenser receives the second airflow and discharges a third airflow to the primary condenser. The primary condenser receives the third airflow and discharges a dehumidified airflow. The compressor receives a refrigerant flow from the primary evaporator and supplies refrigerant to the primary condenser.

Description

SPLIT DEHUMIDIFICATION SYSTEM WITH SECONDARY EVAPORATOR AND CONDENSER COILS TECHNICAL FIELD This invention relates generally to dehumidification and more particularly to a dehumidifier with secondary evaporator and condenser coils. BACKGROUND OF THE INVENTION In certain situations, it is desirable to reduce the humidity of the air inside a structure. For example, in fire and flood restoration applications, it may be desirable to quickly remove water from damaged areas of a structure. To accomplish this, one or more portable dehumidifiers can be placed inside the structure to direct dry air toward the water-damaged areas. Current dehumidifiers, however, have proven inefficient in several respects. BRIEF DESCRIPTION OF THE INVENTION According to the modalities of the present description, the disadvantages and problems associated with the previous systems can be reduced or eliminated. In certain embodiments, a dehumidification system comprises a dehumidification unit comprising a primary dosing device, a secondary dosing device, and a secondary evaporator. The secondary evaporator is operable to receive a refrigerant flow from the primary dosing device; and to receive an inlet air flow and discharge a first air flow, the first air flow comprising air cooler than the inlet air flow, the first air flow being generated by transferring heat from the inlet air flow to the refrigerant flow as the inlet air flow passes through the secondary evaporator.The dehumidification unit further comprises a primary evaporator operable to receive the refrigerant flow from the secondary dosing device and receive the first airflow and discharge a second airflow, the second airflow comprising air cooler than the first airflow, the second airflow being generated by transferring heat from the first airflow to the refrigerant flow as the first airflow passes through the primary evaporator.The dehumidification unit further comprises a secondary condenser operable to receive the refrigerant flow from the secondary evaporator and to receive a second airflow and discharge a third airflow, the third airflow comprising warmer air with a lower relative humidity than the second airflow, the third airflow being generated by heat transfer from the refrigerant flow to the third airflow as the second airflow passes through the secondary condenser. The dehumidification unit further comprises a compressor operable to receive the refrigerant flow from the primary evaporator and supply the refrigerant flow to a primary condenser, the refrigerant flow supplied to the primary condenser comprising a higher pressure than the refrigerant flow received at the compressor.The dehumidification system further comprises a condenser unit comprising the primary condenser operable to receive the refrigerant flow from the compressor and transfer heat from the refrigerant flow to a fourth air flow as the fourth air flow makes contact with the primary condenser. Certain variations of the system described herein may provide one or more technical advantages. For example, some variations include two evaporators, two condensers, and two metering devices utilizing a closed refrigeration circuit. This configuration causes some of the refrigerant within the system to evaporate and condense twice in a refrigeration cycle, thereby increasing compressor capacity over typical systems without adding any additional power or energy to the compressor. This, in turn, increases the overall system efficiency by providing more dehumidification per kilowatt of power used. The lower humidity of the outlet airflow may allow for increased drying potential, which can be beneficial in certain applications (e.g., fire and flood restoration). Certain embodiments of the present description may include some, all, or none of the foregoing advantages. One or more other technical advantages may be readily apparent to those skilled in the art from the figures, descriptions, and claims included herein. BRIEF DESCRIPTION OF THE DRAWINGS To provide a more complete understanding of the present invention and its features and advantages, reference is made to the following description taken in conjunction with the accompanying drawings, in which: FIG. 1 illustrates an example split system for reducing air humidity within a structure, according to certain modalities; FIG. 2 illustrates an example portable system for reducing air humidity within a structure, according to certain modalities; Figures 3 and 4 illustrate an example dehumidification system that can be used by the systems in Figures 1 and 2 to reduce the humidity of the air within a structure, according to certain modalities; FIG. 5 illustrates an example dehumidification method that can be used by the systems in FIGS. 1 and 2 to reduce the humidity of the air within a structure, according to certain modalities; FIGS. 6A and 6B illustrate an example air conditioning and dehumidification system, according to certain modalities; FIG. 7 illustrates an example capacitor system for use in the system described herein, according to certain modalities; FIGS. 8A, 8B and 8C illustrate an example air conditioning and dehumidification system, according to certain modalities; FIGS. 9 and 10 illustrate examples of single-coil packages for use in the system described herein, according to certain modalities; FIGS. 11, 12, 13 and 14 illustrate an example of a primary evaporator comprising three circuits for use in the system described herein, according to certain modalities; FIGS. 15A and 15B illustrate an example dehumidification system with a liquid-cooled condenser, according to certain embodiments; and FIGS. 16A, 16B, 16C and 16D illustrate an example dehumidification system with a modulating valve, according to certain embodiments. DETAILED DESCRIPTION OF THE DRAWINGS In certain situations, it is desirable to reduce the humidity of the air inside a structure. For example, in > In NCNN fire and flood restoration applications, removing water from a damaged structure by placing one or more portable dehumidifiers inside may be desirable. As another example, in areas experiencing high humidity, or in buildings where low humidity levels are required (e.g., libraries), installing a dehumidification unit within a central air conditioning system may be desirable. Furthermore, maintaining a desired humidity level may be necessary in some commercial applications. Current dehumidifiers, however, have proven inadequate or inefficient in several respects. To address inefficiencies and other problems with current dehumidification systems, the described methods provide a dehumidification system that includes a secondary evaporator and a secondary condenser, causing some of the refrigerant within the multi-stage system to evaporate and condense twice in a refrigeration cycle. This increases the compressor's capacity over typical systems without adding any additional power to the compressor. This, in turn, increases the overall system efficiency by providing more dehumidification per kilowatt of power or energy used. FIG. 1 illustrates an example dehumidification system 100 for supplying dehumidified air 106 to a N Structure 102, according to certain modalities. The dehumidification system 100 includes an evaporator system 104 located within the structure 102. The structure 102 may include all or a portion of a building or other suitable enclosed space, such as an apartment building, a hotel, an office space, a commercial building, or a private dwelling (e.g., a house). The evaporator system 104 receives inlet air 101 from inside the structure 102, reduces the moisture in the received inlet air 101, and supplies dehumidified air 106 back to the structure 102. The evaporator system 104 may distribute the dehumidified air 106 throughout the structure 102 via an air duct, as illustrated. In general, the dehumidification system 100 is a split system where the evaporator system 104 is coupled to a remote condenser system 108 located external to the structure 102. The remote condenser system 108 may include a condenser unit 112 and a compressor unit 114 that assists the evaporator system 104 by processing a refrigerant flow as part of a refrigeration cycle. The refrigerant flow may include any suitable refrigerant, such as R410a. In certain configurations, the compressor unit 114 may receive the refrigerant vapor flow from the evaporator system 104 via a refrigerant line 116. The compressor unit 114 can pressurize the refrigerant flow, thereby increasing its temperature. The compressor speed can be modulated to achieve desired operating characteristics.The condenser unit 112 can receive the pressurized refrigerant vapor flow from the compressor unit 114 and cool the pressurized refrigerant by facilitating heat transfer from the refrigerant flow to the ambient air outside the structure 102. In certain embodiments, the remote condenser system 108 can utilize a heat exchanger, such as a microchannel heat exchanger, to remove heat from the refrigerant flow. The remote condenser system 108 can include a fan that draws ambient air from the outside structure 102 for use in cooling the refrigerant flow. In certain embodiments, the speed of this fan is modulated to effect desired operating characteristics. An illustrative embodiment of an example condenser system is shown, for instance, in FIG. 7 (described in further detail below). After being cooled and condensed to a liquid by the condenser unit 112, the refrigerant flow can travel through a refrigerant line 118 to the evaporator system 104. In certain configurations, the refrigerant flow can be received by an expansion device (described in further detail below) that reduces the pressure of the refrigerant flow, thereby lowering its temperature. An evaporator unit (described in further detail below) of the evaporator system 104 can receive the refrigerant flow from the expansion device and use it to dehumidify and cool an incoming airflow. The refrigerant flow can then return to the condenser system 108 and repeat the cycle. In certain configurations, evaporator system 104 can be installed in series with an air mover. An air mover may include a fan that blows air from one location to another. An air mover can facilitate the distribution of incoming air from evaporator system 104 to various parts of structure 102. An air mover and evaporator system 104 may have separate return inlets from which air is drawn. In certain configurations, the incoming air from evaporator system 104 can be mixed with air produced by another component (e.g., an air conditioner) and blown through air ducts by the air mover. In other configurations, evaporator system 104 can perform both cooling and dehumidification and can thus be used without a conventional air conditioner. Although a particular implementation of the Dehumidification System 100 is primarily illustrated and described, this description encompasses any suitable implementation of the Dehumidification System 100, according to specific needs. Furthermore, although several components of the Dehumidification System 100 are depicted as being located in specific positions, this description considers those components to be positioned in any suitable location, according to specific needs. Figure 2 illustrates an example portable dehumidification system 200 for reducing the humidity of the air within structure 102, according to certain embodiments of the present description. The dehumidification system 200 can be positioned anywhere within structure 102 in order to direct the dehumidified air 106 to areas requiring dehumidification (e.g., water-damaged areas). In general, the dehumidification system 200 receives the inlet airflow 101, removes water from the inlet airflow 101, and discharges the dehumidified air 106 back into structure 102. In certain embodiments, structure 102 includes a space that has suffered water damage (e.g., as a result of a flood or fire).In order to restore the water-damaged structure 102, one or more dehumidification systems 200 can be strategically positioned within the structure 102 in order to rapidly reduce the humidity of the air within the structure 102 and thereby dry the portions of the structure 102 that suffered water damage. Although a specific implementation of the Portable Dehumidification System 200 is primarily illustrated and described, this description encompasses any suitable implementation of the Portable Dehumidification System 200, according to specific needs. Furthermore, although several components of the Portable Dehumidification System 200 have been reported to be located in specific positions within Structure 102, this description encompasses those components that can be positioned in any suitable location, according to specific needs. Figures 3 and 4 illustrate an example dehumidification system 300 that can be used by the dehumidification system 100 and the portable dehumidification system 200 of Figures 1 and 2 to reduce the humidity of the air inside the structure 102. The dehumidification system 300 includes a primary evaporator 310, a primary condenser 330, a secondary evaporator 340, a secondary condenser 320, a compressor 360, a primary dosing device 380, a secondary dosing device 390, and a fan 370. In some embodiments, the dehumidification system 300 may additionally include a subcooling coil 350. In certain embodiments, the subcooling coil 350 and the primary condenser 330 are combined into a single coil. A flow of refrigerant 305 is circulated through the dehumidification system 300 as illustrated.In general, the dehumidification system 300 receives the inlet airflow 101, removes water from the inlet airflow 101, and discharges the dehumidified air 106. The water is removed from the inlet air 101 using a refrigerant flow 305 refrigeration cycle. By including the secondary evaporator 340 and secondary condenser 320, however, the dehumidification system 300 causes at least some of the refrigerant flow 305 to evaporate and condense twice in a single refrigeration cycle. This increases the cooling capacity over typical systems without adding any additional compressor power, thereby increasing the overall dehumidification efficiency of the system. In general, the dehumidification system 300 attempts to match the saturation temperature of the secondary evaporator 340 to the saturation temperature of the secondary condenser 320. The saturation temperature of the secondary evaporator 340 and the secondary condenser 320 is generally controlled according to the equation: (Inlet air temperature 101 + second airflow temperature 315) / 2. Since the saturation temperature of the secondary evaporator 340 is lower than the inlet air temperature 101, evaporation occurs in the secondary evaporator 340. Since the saturation temperature of the secondary condenser 320 is higher than the second airflow temperature 315, condensation occurs in the secondary condenser 320. The amount of refrigerant 305 that evaporates in the secondary evaporator 340 is substantially equal to that which condenses in the secondary condenser 320. The primary evaporator 310 receives the refrigerant flow 305 from the secondary dosing device 390 and discharges the refrigerant flow 305 to the compressor 360. The primary evaporator 310 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary evaporator 310 receives the first airflow 345 from the secondary evaporator 340 and discharges the second airflow 315 to the secondary condenser 320. The second airflow 315 is generally at a cooler temperature than the first airflow 345. To cool the first incoming airflow 345, the primary evaporator 310 transfers heat from the first airflow 345 to the refrigerant flow 305, thereby causing the refrigerant flow 305 to evaporate at least partially from liquid to gas. This heat transfer from the first airflow 345 to the coolant flow 305 also removes water from the first airflow 345. The secondary condenser 320 receives the refrigerant flow 305 from the secondary evaporator 340 and discharges the refrigerant flow 305 to the secondary dosing device 390. The secondary condenser 320 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary condenser 320 receives the second air flow 315 from the primary evaporator 310 and discharges the third air flow 325. The third air flow 325 is generally warmer and drier (i.e., the dew point will be the same, but the relative humidity will be lower) than the second air flow 315. The secondary condenser 320 generates the third air flow 325 by transferring heat from the refrigerant flow 305 to the second air flow 315, thereby causing the refrigerant flow 305 to at least partially condense from gas to liquid. The primary condenser 330 receives the refrigerant flow 305 from the compressor 360 and discharges the refrigerant flow 305 to either the primary dosing device 380 or the subcooling coil 350. The primary condenser 330 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary condenser 330 receives either the third air flow 325 or the fourth air flow 355 and discharges the dehumidified air 106. The dehumidified air 106 is generally warmer and drier (i.e., has a lower relative humidity) than the third air flow 325 and the fourth air flow 355. The primary condenser 330 generates dehumidified air 106 by transferring heat from the refrigerant flow 305, thereby causing the refrigerant flow 305 to condense at least partially from gas to liquid.In some embodiments, the primary condenser 330 completely condenses the refrigerant flow 305 to a liquid (i.e., 100% liquid). In other embodiments, the primary condenser 330 partially condenses the refrigerant flow 305 to a liquid (i.e., less than 100% liquid). In certain embodiments, as shown in FIG. 4, a portion of the primary condenser 330 receives a separate airflow in addition to the airflow 101. For example, the rightmost edge of the primary condenser 330 in FIG. 4 extends beyond, or overhangs, the rightmost edges of the secondary evaporator 340, primary evaporator 310, secondary condenser 320, and subcooling coil 350. This overhanging portion of the primary condenser 330 may receive an additional separate airflow. The secondary evaporator 340 receives the refrigerant flow 305 from the primary dosing device 380 and discharges the refrigerant flow 305 to the secondary condenser 320. The secondary evaporator 340 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary evaporator 340 receives the inlet air 101 and discharges the first air flow 345 to the primary evaporator. 310. The first airflow 345 is generally at a cooler temperature than the inlet air 101. To cool the incoming inlet air 101, the secondary evaporator 340 transfers heat from the inlet air 101 to the refrigerant flow 305, thereby causing the refrigerant flow 305 to evaporate at least partially from liquid to gas. The 350 subcooling coil, an optional component of the 300 dehumidification system, subcools the 305 liquid refrigerant as it leaves the 330 primary condenser. This, in turn, supplies the 380 primary dosing device with a liquid refrigerant that is up to 30 degrees (or more) cooler than before it enters the 350 subcooling coil. For example, if the 305 refrigerant flow entering the 350 subcooling coil is 340 psig / 105°F / 60% vapor, the 305 refrigerant flow may be 340 psig / 80°F / 0% vapor as it leaves the 350 subcooling coil. The subcooled 305 refrigerant has a higher heat enthalpy factor as well as a higher density, resulting in reduced cycle times and a lower evaporation cycle frequency for the refrigerant flow. 305. This results in greater efficiency and lower energy use of the dehumidification system 300.The 300 dehumidification system models may or may not include a 350 subcooling coil. For example, the 300 dehumidification system models used within the 200 portable dehumidification system that has a 330 or 320 microchannel condenser may include a 350 subcooling coil, whereas the 300 dehumidification system models that use a different type of 330 or 320 condenser may not include a 350 subcooling coil. As another example, the 300 dehumidification system used within a split system such as the 100 dehumidification system may not include a 350 subcooling coil. Compressor 360 pressurizes the flow of refrigerant 305, thereby increasing its temperature. For example, if the refrigerant 305 entering compressor 360 is 128 psig / 52°F / 100% vapor, it may exit compressor 360 at 340 psig / 150°F / 100% vapor. Compressor 360 receives the refrigerant 305 flow from the primary evaporator 310 and supplies the pressurized refrigerant 305 flow to the primary condenser 330. The fan 370 may include any of the suitable components operable to remove the intake air 101 into the dehumidification system 300 and through the secondary evaporator 340, the primary evaporator 310, the secondary condenser 320, the subcooling coil 350 and the primary condenser 330. The fan 370 can be any type of air mover (e.g., axial fan, forward-slanted impeller, and backward-slanted impeller, etc.). For example, the fan 370 can be a backward-slanted impeller positioned adjacent to the primary condenser 330 as illustrated in FIG. 3. While the fan 370 is represented in FIG. 3. Because it is located adjacent to the primary condenser 330, it should be understood that the fan 370 can be located anywhere along the airflow path of the dehumidification system 300. For example, the fan 370 can be positioned in the airflow path of any of the airflows 101, 345, 315, 325, 355, or 106. Furthermore, the dehumidification system 300 may include one or more additional fans positioned within any one or more of these airflow paths. The primary dosing device 380 and the secondary dosing device 390 are any suitable type of dosing / expansion device. In some embodiments, the primary dosing device 380 is a thermostatic expansion valve (TXV) and the secondary dosing device 390 is a fixed-orifice device (or vice versa). In certain embodiments, the dosing devices 380 and 390 remove pressure from the refrigerant 305 flow to allow expansion or phase change from a liquid to a vapor in the evaporators 310 and 340. The high-pressure liquid (or mostly liquid) refrigerant entering the dosing devices 380 and 390 is at a higher temperature than the liquid refrigerant 305 leaving the dosing devices 380 and 390.For example, if the refrigerant 305 flow entering the primary dosing device 380 is 340 psig / 80°F / 0% vapor, the refrigerant 305 flow may be 196 psig / 68°F / 5% vapor as it leaves the primary dosing device 380. As another example, if the refrigerant 305 flow entering the secondary dosing device 390 is 196 psig / 68°F / 4% vapor, the refrigerant 305 flow may be 128 psig / 44°F / 14% vapor as it leaves the secondary dosing device 390. Refrigerant 305 can be any suitable refrigerant such as R410a. In general, the dehumidification system 300 uses a closed refrigeration circuit of refrigerant 305 that passes from the compressor 360 through the primary condenser 330, (optionally) the subcooling coil 350, the primary dosing device 380, the secondary evaporator 340, the secondary condenser 320, the secondary dosing device 390, and the primary evaporator 310. The compressor 360 pressurizes the flow of refrigerant 305, thereby increasing the temperature of the refrigerant 305. The primary and secondary condensers 330 and 320, which may include any of the suitable heat exchangers, cool the pressurized flow of refrigerant 305 by facilitating heat transfer from the refrigerant 305 flow to the respective airflows passing through them (i.e., the fourth airflow 355 and the second airflow 315).The cooled refrigerant 305 flow leaving the primary and secondary condensers 330 and 320 may enter a respective expansion device (i.e., the primary dosing device 380 and the secondary dosing device 390) that is operable to reduce the pressure of the refrigerant 305 flow, thereby reducing its temperature. The primary and secondary evaporators 310 and 340, which may include any suitable heat exchanger, receive the refrigerant 305 flow from the secondary dosing device 390 and the primary dosing device 380, respectively. The primary and secondary evaporators 310 and 340 facilitate heat transfer from the respective airflows passing through them (i.e., inlet air 101 and first airflow 345) to the refrigerant 305 flow.The flow of refrigerant 305, after leaving the primary evaporator 310, passes back to the compressor 360 and the cycle is repeated. In certain configurations, the refrigeration circuit described above can be configured so that evaporators 310 and 340 operate in a flooded state. In other words, the refrigerant 305 flow can enter evaporators 310 and 340 in a liquid state, and a portion of the refrigerant 305 flow can still be in a liquid state as it exits evaporators 310 and 340. Consequently, the phase change of the refrigerant 305 flow (from liquid to vapor as heat is transferred to the refrigerant 305 flow) occurs across evaporators 310 and 340, resulting in nearly constant pressure and temperature across the entire 310 and 340 evaporators (and, consequently, increased cooling capacity). In the example operation modes of the dehumidification system 300, the inlet air 101 can be drawn into the dehumidification system 300 by the fan 370. The inlet air 101 passes through the secondary evaporator 340, where heat is transferred from the inlet air 101 to the cold refrigerant flow 305 passing through the secondary evaporator 340. As a result, the inlet air 101 can be cooled. For example, if the inlet air 101 is 80°F / 60% humidity, the secondary evaporator 340 can discharge the first air flow 345 at 70°F / 84% humidity. This can cause the refrigerant 305 flow to partially vaporize inside the secondary evaporator 340. For example, if the refrigerant 305 flow entering the secondary evaporator 340 is 196 psig / 68°F / 5% vapor, the refrigerant 305 flow may be 196 psig / 68°F / 38% vapor as it leaves the secondary evaporator 340. The cooled inlet air 101 leaves the secondary evaporator 340 as the first airflow 345 enters the primary evaporator 310. Similar to the secondary evaporator 340, the primary evaporator 310 transfers heat from the first airflow 345 to the cold refrigerant flow 305 passing through it. As a result, the first airflow 345 can be cooled below its dew point temperature, causing the moisture in the first airflow 345 to condense (thus reducing the absolute humidity of the first airflow 345). For example, if the first airflow 345 is 70°F / 84% humidity, the primary evaporator 310 can discharge the second airflow 315 at 54°F / 98% humidity. This can cause the 305 refrigerant flow to partially or completely vaporize inside the 310 primary evaporator.For example, if the refrigerant 305 flow entering the primary evaporator 310 is 128 psig / 44°F / 14% vapor, the refrigerant 305 flow may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator 310. In certain embodiments, the liquid condensate from the first airflow 345 may be collected in a drain pan connected to a condensate tank, as illustrated in FIG. 4. Additionally, the condensate tank may include a condensate pump that moves the collected condensate, either continuously or at periodic intervals, out of the dehumidification system 300 (for example, via a drain hose) to a suitable drain or storage location. The first cooled airflow 345 leaves the primary evaporator 310 as the second airflow 315 and enters the secondary condenser 320. The secondary condenser 320 facilitates heat transfer from the hot refrigerant flow 305 passing through the secondary condenser 320 to the second airflow 315. This reheats the second airflow 315, thereby decreasing its relative humidity. For example, if the second airflow 315 is 54°F / 98% humidity, the secondary condenser 320 can discharge the third airflow 325 at 65°F / 68% humidity. This can cause the refrigerant 305 flow to partially or completely condense inside the secondary condenser 320. For example, if the refrigerant 305 flow entering the secondary condenser 320 is 196 psig / 68°F / 38% vapor, the refrigerant 305 flow may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 320. In some configurations, the second dehumidified airflow 315 leaves the secondary condenser 320 as the third airflow 325 and enters the primary condenser 330. The condenser 330 facilitates heat transfer from the warm refrigerant flow 305 passing through the primary condenser 330 to the third airflow 325. This further heats the third airflow 325, thereby further decreasing its relative humidity. For example, if the third airflow 325 is 65°F / 68% humidity, the secondary condenser 320 might discharge the dehumidified air 106 at 102°F / 19% humidity. This can cause the refrigerant flow 305 to partially or completely condense within the primary condenser 330.For example, if the refrigerant flow 305 entering the 330 primary condenser is 340 psig / 150°F / 100% vapor, the refrigerant flow 305 may be 340 psig / 105°F / 60% vapor as it leaves the 330 primary condenser. As described above, some configurations of the 300 dehumidification system may include a subcooling coil 350 in the airflow entering the secondary condenser 320 and the primary condenser 330. The subcooling coil 350 facilitates heat transfer from the warm refrigerant flow 305 passing through the subcooling coil 350 to the third airflow 325. This further warms the third airflow 325, thereby further decreasing its relative humidity. For example, if the third airflow 325 is 65°F / 68% humidity, the subcooling coil 350 can discharge the fourth airflow 355 into 81°F / 37% humidity. This can cause the 305 refrigerant flow to partially or completely condense inside the 350 subcooler coil. For example, if the 305 refrigerant flow entering the 350 subcooler coil is 340 psig / 150°F / 60% vapor, the 305 refrigerant flow may be 340 psig / 80°F / 0% vapor as it leaves the 350 subcooler coil. Some versions of the 300 dehumidification system may include a controller that can incorporate one or more computer systems in one or more locations. Each computer system may include any appropriate input devices (such as a keyboard, touchscreen, mouse, or other device capable of accepting information), output devices, mass storage media, or other components suitable for receiving, processing, storing, and communicating data. Both input and output devices may include fixed or removable storage media such as a magnetic computer disk, CD-ROM, or other media for both receiving input from and providing output to a user.Each computer system may include a personal computer, workstation, network computer, kiosk, wireless data port, personal data assistant (PDA), one or more processors within these or other devices, or any other suitable processing device. In short, the controller may include any suitable combination of software, firmware, and hardware. The controller may additionally include one or more processing modules. Each processing module may include one or more microprocessors, controllers, or any other suitable computing devices or resources and may operate, either alone or in conjunction with other components of the 300 dehumidification system, to provide some or all of the functionality described herein. The controller may additionally include (or be communicatively coupled to the wired or wireless communication path of) computer memory. Memory may include any memory or database module and may take the form of volatile or non-volatile memory, including, without limitation, magnetic media, optical media, random access memory (RAM), read-only memory (ROM), removable media, or any other suitable local or remote memory component. Although specific implementations of the 300 dehumidification system are primarily illustrated and described, this description encompasses any suitable implementation of the 300 dehumidification system, according to specific needs. Furthermore, although several components of the 300 dehumidification system are depicted as being located in specific positions and in relation to one another, this description encompasses those components that can be positioned in any suitable location, according to specific needs. Figure 5 illustrates an example dehumidification method 500 that can be used by the dehumidification system 100 and the portable dehumidification system 200 of Figures 1 and 2 to reduce the humidity of the air inside the structure 102. Method 500 can begin at stage 510 where a secondary evaporator receives an inlet airflow and discharges a first airflow. In some embodiments, the secondary evaporator is secondary evaporator 340. In some embodiments, the inlet airflow is inlet air 101 and the first airflow is first airflow 345. In some embodiments, the secondary evaporator of stage 510 receives a refrigerant flow from a primary dosing device such as primary dosing device 380 and supplies the refrigerant flow (in a changed state) to a secondary condenser such as secondary condenser 320.In some configurations, the refrigerant flow of method 500 is the refrigerant flow of 305 described above. In stage 520, a primary evaporator receives the first airflow from stage 510 and discharges a second airflow. In some embodiments, the primary evaporator is primary evaporator 310 and the second airflow is second airflow 315. In some embodiments, the primary evaporator of stage 520 receives the refrigerant flow from a secondary dosing device such as secondary dosing device 390 and supplies the refrigerant flow (in a changed state) to a compressor such as compressor 360. In stage 530, a secondary condenser receives the second airflow from stage 520 and discharges a third airflow. In some embodiments, the secondary condenser is secondary condenser 320 and the third airflow is third airflow 325. In some embodiments, the secondary condenser of stage 530 receives a refrigerant flow from the secondary evaporator of stage 510 and supplies the refrigerant flow (in a changed state) to a secondary dosing device such as secondary dosing device 390. In stage 540, a primary condenser receives the third airflow from stage 530 and discharges a dehumidified airflow. In some embodiments, the primary condenser is primary condenser 330, and the dehumidified airflow is dehumidified air 106. In some embodiments, the primary condenser of stage 540 receives a refrigerant flow from the compressor of stage 520 and supplies the refrigerant flow (in a changed state) to the primary metering device of stage 510. In alternate embodiments, the primary condenser of stage 540 supplies the refrigerant flow (in a changed state) to a subcooling coil, such as subcooling coil 350, which in turn supplies the refrigerant flow (in a changed state) to the primary metering device of stage 510. In stage 550, a compressor receives the refrigerant flow from the primary evaporator of stage 520 and provides the refrigerant flow (in a changed state) to the primary condenser of stage 540. After stage 550, method 500 can end. The specific methods may repeat one or more steps of the method in Figure 5, where appropriate. Although this description describes and illustrates specific steps of the method in Figure 5 as occurring in a particular order, it encompasses any suitable steps of the method in Figure 5 occurring in any suitable order. Furthermore, although this description describes and illustrates an example dehumidification method for reducing air humidity within a structure that includes specific steps of the method in Figure 5, it encompasses any suitable method for reducing air humidity within a structure that includes any suitable steps, which may include all, some, or none of the steps of the method in Figure 5, where appropriate.Furthermore, although this description describes and illustrates particular components, devices, or systems for carrying out particular steps of the method in FIG. 5, this description contemplates any suitable combination of any of the components, devices, or systems suitable for carrying out any of the suitable steps of the method in FIG. 5. While the example method in FIG. 5 is described above with respect to the 300 dehumidification system in FIG. 3, it should be understood that the same or similar methods can be carried out using any of the dehumidification systems described herein, including the 600 and 800 dehumidification systems in FIGS. 6A-6B and 8 (described below). Furthermore, it should be understood that, with respect to the example method in FIG. 5, the reference to an evaporator or condenser may refer to a portion of the evaporator or condenser of a single coil package operable to perform the functions of these components, for example, as described above with respect to the examples in FIGS. 9 and 10. Figures 6A and 6B illustrate an example air conditioning and dehumidification system 600 that can be used in accordance with the split dehumidification system 100 of Figure 1 to reduce the humidity of the air inside structure 102. The dehumidification system 600 includes a dehumidification unit 602, which is usually located inside, and a condenser system 604 (for example, condenser system 108 in FIG. 1). As illustrated in FIG. 6A, the dehumidifying unit 602 includes a primary evaporator 610, a secondary evaporator 640, a secondary condenser 620, a primary dosing device 680, a secondary dosing device 690, and a first fan 670, while the condenser system 604 includes a primary condenser 630, a compressor 660, an optional subcooling coil 650, and a second fan 695. In the embodiment illustrated in FIG. 6B, the compressor 660 may be arranged inside the dehumidifying unit 602 rather than inside the condenser system 604. With reference to both Figures 6A and 6B, a flow of refrigerant 605 is circulated through the dehumidification system 600 as illustrated. In general, the dehumidification unit 602 receives the inlet airflow 601, removes water from the inlet airflow 601, and discharges the dehumidified air 625 into a conditioned space. The water is removed from the inlet air 601 using a refrigerant flow 605 refrigeration cycle. The flow of refrigerant 605 through the system 600 in Figures 6A and 6B proceeds in a manner similar to that of the flow of refrigerant 305 through the dehumidification system 300 in Figure 3. However, the airflow path through the system 600 is different from that through the system 300, as described herein.By including the secondary evaporator 640 and secondary condenser 620, however, the dehumidification system 600 causes at least part of the refrigerant flow 605 to evaporate and condense twice in a single refrigeration cycle. This increases the cooling capacity over typical systems without requiring any additional compressor power, thereby increasing the overall system efficiency. The split configuration of system 600, which includes the dehumidifying unit 602 and the condenser system 604, allows the heat from the cooling and dehumidification process to be rejected to the outside or to an unconditioned space (e.g., outside the space being dehumidified). This allows the dehumidifying system 600 to have a footprint similar to that of typical central air conditioning systems or heat pumps. In general, the temperature of the third airflow 625 discharged into the conditioned space from system 600 is significantly lower compared to that of the airflow outlet 106 of system 300 in FIG. 3. In this way, the configuration of system 600 allows the dehumidified air to be supplied to the conditioned space at a lower temperature.Therefore, the 600 system can perform the functions of both a dehumidifier (air dehumidification) and a central air conditioner (air cooling). In general, the 600 dehumidification system attempts to match the saturation temperature of the secondary evaporator 640 with the saturation temperature of the secondary condenser 620. The saturation temperatures of the secondary evaporator 640 and the secondary condenser 620 are generally controlled according to the equation: (inlet air temperature 601 + second airflow temperature 615) / 2. Since the saturation temperature of the secondary evaporator 640 is lower than that of the inlet air 601, evaporation occurs in the secondary evaporator 640. Since the saturation temperature of the secondary condenser 620 is higher than that of the second airflow 615, condensation occurs in the secondary condenser 620. The amount of refrigerant 605 that evaporates in the secondary evaporator 640 is substantially equal to the amount that condenses in the secondary condenser 620. The primary evaporator 610 receives the refrigerant flow 605 from the secondary dosing device 690 and discharges the refrigerant flow 605 to the compressor 660. The primary evaporator 610 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary evaporator 610 receives the first airflow 645 from the secondary evaporator 640 and discharges the second airflow 615 to the secondary condenser 620. The second airflow 615 is generally at a cooler temperature than the first airflow 645. To cool the first incoming airflow 645, the primary evaporator 610 transfers heat from the first airflow 645 to the refrigerant flow 605, thereby causing the refrigerant flow 605 to evaporate at least partially from liquid to gas. This heat transfer from the first airflow 645 to the coolant flow 605 also removes water from the first airflow 645. The secondary condenser 620 receives the refrigerant flow 605 from the secondary evaporator 640 and discharges the refrigerant flow 605 to the secondary dosing device 690. The secondary condenser 620 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary condenser 620 receives the second air flow 615 from the primary evaporator 610 and discharges the third air flow 625. The third air flow 625 is generally warmer and drier (i.e., the dew point will be the same, but the relative humidity will be lower) than the second air flow 615. The secondary condenser 620 generates the third air flow 625 by transferring heat from the refrigerant flow 605 to the second air flow 615, thereby causing the refrigerant flow 605 to at least partially condense from gas to liquid. As described above, the third airflow 625 is discharged into the conditioned space.In other embodiments (for example, as shown in FIGS. 8A and 8B), the third airflow 625 may first pass through and / or over the sub-cooling coil 650 before being discharged into the conditioned space at an additional decreased relative humidity. As shown in FIG. 6A, refrigerant 605 flows to the outside or to an unconditioned space to the compressor 660 of the condenser system 604. Alternatively, refrigerant 605 may continue to flow to the compressor 660 within the dehumidifying unit 602 before flowing to the outside or to an unconditioned space, as shown in FIG. 6B. In both of the FIGS. In sections 6A and 6B, compressor 660 pressurizes the flow of refrigerant 605, thereby increasing the temperature of the refrigerant 605. For example, if the refrigerant 605 flow entering compressor 660 is 128 psig / 52°F / 100% vapor, the refrigerant 605 flow may be 340 psig / 150°F / 100% vapor as it leaves compressor 660. Compressor 660 receives the refrigerant 605 flow from the primary evaporator 610 and supplies the pressurized refrigerant 605 flow to the primary condenser 630. The primary condenser 630 receives the refrigerant flow 605 from the compressor 660 and discharges the refrigerant flow 605 to the subcooling coil 650. The primary condenser 630 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary condenser 630 and the subcooling coil 650 receive the first airflow at outside 606 and discharge the second airflow at outside 608. The second airflow at outside 608 is generally warmer (i.e., has lower relative humidity) than the first airflow at outside 606. The primary condenser 630 transfers heat from the refrigerant flow 605, thereby causing the refrigerant flow 605 to condense at least partially from gas to liquid. In some configurations, the primary condenser 630 completely condenses the refrigerant flow 605 into a liquid (i.e., 100% liquid).In other configurations, the primary condenser 630 partially condenses the refrigerant flow 605 into a liquid (i.e., less than 100% liquid). The subcooling coil 650, an optional component of the dehumidification system 600, subcools the liquid refrigerant 605 as it leaves the primary condenser 630. This, in turn, supplies the primary dosing device 680 with liquid refrigerant that is 30 degrees (or more) cooler than before it enters the subcooling coil 650. For example, if the refrigerant 605 entering the subcooling coil 650 is 340 psig / 105°F / 60% vapor, the refrigerant 605 might be 340 psig / 80°F / 0% vapor as it leaves the subcooling coil 650. The subcooled refrigerant 605 has a higher heat enthalpy factor and a greater density, which improves energy transfer between the airflow and the evaporator, resulting in the removal of additional latent heat from refrigerant 605.This also results in greater efficiency and less energy use of the 600 dehumidification system. The 600 dehumidification system options may or may not include a 650 sub-cooling coil. In certain embodiments, the subcooling coil 650 and the primary condenser 630 are combined into a single coil. Such a single coil includes the appropriate circuit for the flow of air streams 606 and 608 and the refrigerant 605. An illustrative example of a condenser system 604 comprising a single-coil condenser and the subcooling coil is shown in FIG. 7. The single-unit coil comprises inner tubes 710 corresponding to the condenser and outer tubes 705 corresponding to the subcooling coil. The refrigerant can be directed through the inner tubes 710 before flowing through the outer tubes 705. In the illustrative example shown in FIG. 7, the air stream is drawn through the single-unit coil by the fan 695 and expelled upwards.It should be understood, however, that condenser systems of other types may include a condenser, compressor, optional sub-cooling coil and fan with other configurations known in the art. The secondary evaporator 640 receives the refrigerant flow 605 from the primary dosing device 680 and discharges the refrigerant flow 605 to the secondary condenser 620. The secondary evaporator 640 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary evaporator 640 receives the inlet air 601 and discharges the first air flow 645 to the primary evaporator 610. The first air flow 645 is generally cooler than the inlet air 601. To cool the incoming inlet air 601, the secondary evaporator 640 transfers heat from the inlet air 601 to the refrigerant flow 605, thereby causing the refrigerant flow 605 to evaporate at least partially from liquid to gas. The fan 670 may include any of the suitable components operable to remove the inlet air 601 into the dehumidifying unit 602 and through the secondary evaporator 640, the primary evaporator 610, and the secondary condenser 620. The fan 670 may be any type of air mover (e.g., axial fan, forward-sloping impeller, and backward-sloping impeller, etc.). For example, the fan 670 may be a backward-sloping impeller positioned adjacent to the secondary condenser 620. While fan 670 is shown in FIGS. 6A and 6B as being located adjacent to condenser 620, it should be understood that fan 670 can be located anywhere along the airflow path of the dehumidifying unit 602. For example, fan 670 can be positioned in the airflow path of any of airflows 601, 645, 615, or 625. Furthermore, the dehumidifying unit 602 may include one or more additional fans positioned within any one or more of these airflow paths. Similarly, while fan 695 of the condenser system 604 is shown in FIGS.6A and 6B being located above the primary condenser 630, it should be understood that the fan 695 can be located anywhere (e.g., above, below, besides) with respect to the condenser 630 and the sub-cooling coil 650, while the fan 695 is appropriately positioned and configured to facilitate airflow 606 to the primary condenser 630 and the sub-cooling coil 650. The airflow rate generated by the fan 670 may be different from that generated by the fan 695. For example, the airflow rate 606 generated by the fan 695 may be higher than the airflow rate 601 generated by the fan 670. This difference in airflow rates can provide several advantages for the dehumidification systems described herein. For example, a large airflow generated by the fan 695 can provide improved heat transfer in the subcooling coil 650 and the primary condenser 630 of the condenser system 604. In general, the airflow rate generated by the second fan 695 is approximately 2 to 5 times that of the airflow rate generated by the first fan 670. For example, the airflow rate generated by the first fan 670 may be approximately 200 to 400 cubic feet per minute (cfm).For example, the airflow rate generated by the second 695 fan can be approximately 900 to 1200 cubic feet per minute (cfm). The primary dosing device 680 and the secondary dosing device 690 are any suitable type of dosing / expansion device. In some embodiments, the primary dosing device 680 is a thermostatic expansion valve (TXV) and the secondary dosing device 690 is a fixed-orifice device (or vice versa). In certain embodiments, the dosing devices 680 and 690 remove pressure from the refrigerant flow 605 to allow expansion or phase change from a liquid to a vapor in the evaporators 610 and 640. The high-pressure liquid (or mostly liquid) refrigerant entering the dosing devices 680 and 690 is at a higher temperature than the liquid refrigerant 605 leaving the dosing devices 680 and 690.For example, if the refrigerant flow 605 entering the primary dosing device 680 is 340 psig / 80°F / 0% vapor, the refrigerant flow 605 may be 196 psig / 68°F / 5% vapor as it leaves the primary dosing device 680. As another example, if the refrigerant flow 605 entering the secondary dosing device 690 is 196 psig / 68°F / 4% vapor, the refrigerant flow 605 may be 128 psig / 44°F / 14% vapor as it leaves the secondary dosing device 690. In certain embodiments, the secondary dosing device 690 is operated in a substantially open state (referred to herein as a fully open state) such that the pressure of the refrigerant 605 entering the dosing device 690 is substantially the same as the pressure of the refrigerant 605 leaving the dosing device 605. For example, the pressure of the refrigerant 605 may be 80%, 90%, 95%, 99%, or up to 100% of the pressure of the refrigerant 605 entering the dosing device 690. With the secondary dosing device 690 operated in a fully open state, the primary dosing device 680 is the primary source of pressure drop in the dehumidification system 600.In this configuration, the airflow 615 is not substantially heated as it passes through the secondary condenser 620, and the secondary evaporator 640, primary evaporator 610, and secondary condenser 620 effectively act as a single evaporator. Although less water can be removed from the airflow 601 when the secondary dosing device 690 is operated in a fully open state, the airflow 606 will be discharged into the conditioned space at a lower temperature than when the secondary dosing device 690 is not in a fully open state. This configuration corresponds to a relatively high sensible heat ratio (SHR) operating mode such that the dehumidification system 600 can produce a cool airflow 625 with properties similar to those of an airflow produced by a central air conditioner.If the airflow rate 601 is increased to a threshold value (for example, by increasing the speed of fan 670 or one or more of the other fans in the dehumidification system 600), the dehumidification system 600 can perform sensible cooling without removing water from the airflow 601. Refrigerant 605 can be any suitable refrigerant such as R410a. In general, the dehumidification system 600 uses a closed refrigeration circuit of refrigerant 605 that passes from compressor 660 through the primary condenser 630, (optionally) the subcooling coil 650, the primary dosing device 680, the secondary evaporator 640, the secondary condenser 620, the secondary dosing device 690, and back to the primary evaporator 610. Compressor 660 pressurizes the flow of refrigerant 605, thereby increasing its temperature.The primary and secondary condensers 630 and 620, which may include any suitable heat exchangers, cool the pressurized flow of refrigerant 605 by facilitating heat transfer from the refrigerant 605 flow to the respective airflows passing through them (i.e., the first outside airflow 606 and the second airflow 615). The cooled flow of refrigerant 605 leaving the primary and secondary condensers 630 and 620 may enter a respective expansion device (i.e., primary dosing device 680 and secondary dosing device 690) which is operable to reduce the pressure of the refrigerant 605 flow, thereby reducing the flow temperature of the refrigerant 605.The primary and secondary evaporators 610 and 640, which may include any suitable heat exchanger, receive the refrigerant flow 605 from the secondary dosing device 690 and the primary dosing device 680, respectively. The primary and secondary evaporators 610 and 640 facilitate heat transfer from the respective airflows passing through them (i.e., inlet air 601 and first airflow 645) to the refrigerant flow 605. The refrigerant flow 605, after leaving the primary evaporator 610, returns to the compressor 660, and the cycle is repeated. In certain configurations, the refrigeration circuit described above can be configured so that evaporators 610 and 640 operate in a flooded state. In other words, the refrigerant 605 flow can enter evaporators 610 and 640 in a liquid state, and a portion of the refrigerant 605 flow can still be in a liquid state as it exits evaporators 610 and 640. Consequently, the phase change of the refrigerant 605 flow (from liquid to vapor as heat is transferred to the refrigerant 605 flow) occurs across evaporators 610 and 640, resulting in nearly constant pressure and temperature across the entire evaporator 610 and 640 (and, consequently, increased cooling capacity). In the operation of the example modes of the dehumidification system 600, the inlet air 601 can be removed in the dehumidification system 600 by the > you NCNN fan 670. Inlet air 601 passes through secondary evaporator 640, where heat is transferred from the inlet air 601 to the cold refrigerant flow 605 passing through the secondary evaporator 640. As a result, the inlet air 601 can be cooled. For example, if the inlet air 601 is 80°F / 60% humidity, the secondary evaporator 640 can discharge the first air flow 645 at 70°F / 84% humidity. This can cause the refrigerant flow 605 to partially vaporize inside the secondary evaporator 640. For example, if the refrigerant flow 605 entering the secondary evaporator 640 is 196 psig / 68°F / 5% vapor, the refrigerant flow 605 may be 196 psig / 68°F / 38% vapor as it leaves the secondary evaporator 640. The cooled inlet air 601 leaves the secondary evaporator 640 as the first airflow 645 and enters the primary evaporator 610. Similar to the secondary evaporator 640, the primary evaporator 610 transfers heat from the first airflow 645 to the cold refrigerant flow 605 passing through it. As a result, the first airflow 645 can be cooled below its dew point temperature, causing the moisture in the first airflow 645 to condense (thus reducing the absolute humidity of the first airflow 645). For example, if the first airflow 645 is 70°F / 84% humidity, the primary evaporator 610 can discharge the second airflow 615 into the first airflow 645. 54°F / 98% humidity. This can cause the refrigerant flow 605 to partially or completely vaporize within the primary evaporator 610. For example, if the refrigerant flow 605 entering the primary evaporator 610 is 128 psig / 44°F / 14% vapor, the refrigerant flow 605 may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator 610. In certain embodiments, the liquid condensate from the first airflow 645 can be collected in a drain band connected to a condensate tank, as illustrated in Figure 4. Additionally, the condensate tank may include a condensate pump that moves the collected condensate, either continuously or at periodic intervals, out of the dehumidification system 600 (for example, via a drain hose) to a suitable drain or storage location. The first cooled airflow 645 leaves the primary evaporator 610 as the second airflow 615 and enters the secondary condenser 620. The secondary condenser 620 facilitates heat transfer from the hot refrigerant flow 605 passing through the secondary condenser 620 to the second airflow 615. This reheats the second airflow 615, thereby decreasing its relative humidity. For example, if the second airflow 615 is 54°F / 98% humidity, the secondary condenser 620 can discharge the dehumidified airflow 625 at 65°F / 68% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the secondary condenser 620. For example, if the refrigerant flow 605 entering the secondary condenser 620 is 196 psig / 68°F / 38% vapor, the refrigerant flow 605 may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 620.In some configurations, the second airflow 615 leaves the secondary condenser 620 as the dehumidified airflow 625 and is discharged into an conditioned space. The primary condenser 630 facilitates heat transfer from the hot refrigerant flow 605 passing through the primary condenser 630 to a first outdoor airflow 606. This heats the outdoor airflow 606, which is discharged to the unconditioned space (e.g., outdoors) as the second outdoor airflow 608. For example, if the first outdoor airflow 606 is 65°F / 68% humidity, the primary condenser 630 can discharge the second outdoor airflow 608 at 102°F / 19% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the primary condenser 630. For example, if the refrigerant flow 605 entering the primary condenser 630 is 340 psig / 150°F / 100% vapor, the refrigerant flow 605 may be 340 psig / 105°F / 60% vapor as it leaves the primary condenser 630. As described above, some configurations of the 600 dehumidification system may include a subcooling coil 650 in the airflow between a condenser system inlet 604 and the primary condenser 630. The subcooling coil 650 facilitates heat transfer from the warm refrigerant flow 605 passing through the subcooling coil 650 to the first outdoor airflow 606. This heats the first outdoor airflow 606, thereby increasing its temperature. For example, if the first outdoor airflow 606 is 65°F / 68% humidity, the subcooling coil 650 can discharge an airflow at 81°F / 37% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the subcooling coil 650.For example, if the refrigerant flow 605 entering the subcooling coil 650 is 340 psig / 150°F / 60% vapor, the refrigerant flow 605 may be 340 psig / 80°F / 0% vapor as it leaves the subcooling coil 650. In the configuration shown in FIGS. 6A and 6B, the subcooling coil 650 is inside the condenser system 604. This configuration minimizes the temperature of the third airflow 625, which is discharged into the conditioned space. An alternative configuration is shown as the dehumidification system 800 in FIGS. 8A and 8B in which the dehumidifying unit 802 includes the subcooling coil 650. In these embodiments, the airflow 62b first passes through the subcooling coil 650 before being discharged into the conditioned space as the airflow 855 by way of the fan 670. As described herein, the fan 670 can alternatively be located anywhere along the airflow path in the dehumidifying unit 802, and one or more additional fans can be included in the dehumidifying unit 802. Without wishing to be limited by any particular theory, the configuration of the dehumidification system 800 is believed to be more energy-efficient under common operating conditions than that of the dehumidification system 600 of FIGS. 6A-6B. For example, if the temperature of the third airflow 625 is lower than the outside temperature (i.e., the temperature of airflow 606), then the refrigerant 605 will be more effectively cooled, or subcooled, with the subcooling coil 650 placed in the dehumidification unit 802. Such operating conditions may be common, for example, in locations with hot climates and / or during the summer months. As illustrated in FIG. 8B, the indoor dehumidification unit 802 also includes the compressor 660, which, for example, can be located near the secondary evaporator 640, the primary evaporator 610 and / or secondary condenser 620.In certain embodiments, the dehumidification unit 802 may comprise the compressor 660, but in the dehumidification system 800 it may lack the optional subcooling coil 650, as illustrated in FIG. 8C. The dehumidification system 800 of FIG. 8C may not require the subcooling coil 650, for example, if the primary condenser 630 is operable to facilitate heat transfer from the refrigerant flow 605 to a first air flow outside 606 in order to effectively condense the refrigerant before the refrigerant flow enters a primary dosing device 680. In the operation of the example modes of the dehumidification system 800, as illustrated in each of FIGS. 8A–8C, the inlet air 601 can be drawn into the dehumidification system 800 by the fan 670. The inlet air 601 passes through the secondary evaporator 640, in which heat is transferred from the inlet air 601 to the cold flow of refrigerant 605 passing through the secondary evaporator 640. As a result, the inlet air 601 can be cooled. For example, if the inlet air 601 is 80°F / 60% humidity, and the secondary evaporator 640 can discharge the first airflow 645 at 70°F / 84% humidity. This can cause the refrigerant flow 605 to partially vaporize inside the secondary evaporator 640. For example, if the refrigerant flow 605 entering the secondary evaporator 640 is 196 psig / 68°F / 5% vapor, the refrigerant flow 605 may be 196 psig / 68°F / 38% vapor as it leaves the secondary evaporator 640. The cooled inlet air 601 leaves the secondary evaporator 640 as the first airflow 645 and enters the primary evaporator 610. Similar to the secondary evaporator 640, the primary evaporator 610 transfers heat from the first airflow 645 to the cold refrigerant flow 605 passing through it. As a result, the first airflow 645 can be cooled below its dew point temperature, causing the moisture in the first airflow 645 to condense (thus reducing the absolute humidity of the first airflow 645). For example, if the first airflow 645 is 70°F / 84% humidity, the primary evaporator 610 can discharge the second airflow 615 at 54°F / 98% humidity. This can cause the refrigerant flow 605 to partially or completely vaporize inside the primary evaporator 610.For example, if the refrigerant flow 605 entering the primary evaporator 610 is 128 psig / 44°F / 14% vapor, the refrigerant flow 605 may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator 610. In certain embodiments, the liquid condensate from the first airflow 645 may be collected in a drain pan connected to a condensate reservoir, as illustrated in FIG. 4. Additionally, the condensate reservoir may include a condensate pump that moves the collected condensate, either continuously or at periodic intervals, out of the dehumidification system 800 (for example, via a drain hose) to a suitable drain or appropriate location. The first cooled airflow 645 leaves the primary evaporator 610 as a second airflow 615 and enters the secondary condenser 620. The secondary condenser 620 facilitates heat transfer from the hot refrigerant flow 605 passing through the secondary condenser 620 to the second airflow 615. This reheats the second airflow 615, thereby decreasing its relative humidity. For example, if the second airflow 615 is 54°F / 98% humidity, the secondary condenser 620 can discharge the dehumidified airflow 625 at 65°F / 68% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the secondary condenser 620. For example, if the refrigerant flow 605 entering the secondary condenser 620 is 196 psig / 68°F / 38% vapor, the refrigerant flow 605 may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 620.In some configurations, the second airflow 615 leaves the secondary condenser 620 as the dehumidified airflow 625 and is discharged into an conditioned space. In both Figures 8A and 8B, the dehumidified airflow 625 enters the subcooling coil 650, which facilitates heat transfer from the hot refrigerant flow 605 passing through the subcooling coil 650 to the dehumidified airflow 625. This heats the dehumidified airflow 625, thereby further decreasing its humidity. For example, if the dehumidified airflow 625 is 65°F / 68% humidity, the subcooling coil 650 can discharge an airflow 855 at 81°F / 37% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the subcooling coil 650. For example, if the refrigerant flow 605 entering the subcooling coil 650 is 340 psig / 150°F / 60% vapor, the refrigerant flow 605 may be 340 psig / 80°F / 0% vapor as it leaves the subcooling coil 650. With reference again to each of FIGS. 8A-8C, the primary condenser 630 facilitates the transfer of heat from the hot refrigerant flow 605 passing through the primary condenser 630 to a first airflow outside 606. This heats the airflow outside 606, which is discharged to the unconditioned space as the second airflow outside 608. As an example, if the first airflow outside 606 is 65°F / 68% humidity, the primary condenser 630 can discharge the second airflow outside 608 at 102°F / 19% humidity. This can cause the refrigerant flow 605 to partially or completely condense inside the primary condenser 630. For example, if the refrigerant flow 605 entering the primary condenser 630 is 340 psig / 150°F / 100% vapor, the refrigerant flow 605 may be 340 psig / 105°F / 60% vapor as it leaves the primary condenser 630. Some versions of the 600 and 800 dehumidification systems in FIGS. 6A-6B and 8A-8C may include a controller that can incorporate one or more computer systems in one or more locations. Each computer system may include any of the appropriate input devices (such as a keyboard, touchscreen, mouse, or other device capable of accepting information), output devices, mass storage media, or other components suitable for receiving, processing, storing, and communicating data. Both input and output devices may include fixed or removable storage media such as a magnetic computer disk, A CD-ROM or other suitable media can both receive input from and provide output to a user. Each computer system may include a personal computer, workstation, network computer, kiosk, wireless data port, personal data assistant (PDA), one or more processors within these or other devices, or any other suitable processing device. In short, the controller may include any suitable combination of software, firmware, and hardware. The controller may additionally include one or more processing modules. Each processing module may include one or more microprocessors, controllers, or any other suitable computing devices or resources and may operate, either alone or in conjunction with other components of the 600 and 800 dehumidification systems, to provide some or all of the functionality described herein. The controller may additionally include (or be communicatively coupled to the wired or wireless communication path of) computer memory. Memory may include any memory or database module and may take the form of volatile or non-volatile memory, including, without limitation, magnetic media, optical media, random access memory (RAM), read-only memory (ROM), removable media, or any other suitable local or remote memory component. Although specific implementations of the 600 and 800 dehumidification systems are primarily illustrated and described, this description encompasses any suitable implementation of the 600 and 800 dehumidification systems, according to specific needs. Furthermore, although several components of the 600 and 800 dehumidification systems are depicted as being located in specific positions and in relation to one another, this description considers those components to be positioned in any suitable location, according to specific needs. In certain embodiments, the secondary evaporator (340, 640), primary evaporator (310, 610), and secondary condenser (320, 620) of Figures 3, 6A–6B, or 8A–8C are combined into a single coil package. This single coil package may include portions (e.g., separate refrigerant circuits) to accommodate the respective functions of the secondary evaporator, primary evaporator, and secondary condenser described above. An illustrative example of such a single coil package is shown in Figure 9. Figure 9 shows a single coil package 900 comprising a plurality of coils (represented by circles in Figure 9). The coil package 900 includes a secondary evaporator portion 940, a primary evaporator portion 910, and a secondary condenser portion 920. The coil package may include and / or be fluidly connectable to the dosing devices 980 and 990 as shown in the exemplary case of FIG. 9.In certain embodiments, dosing devices 980 and 990 correspond to the primary dosing device 380 and the secondary dosing device 390 of FIG. 3. In general, dosing devices 980 and 990 can be any suitable type of dosing / expansion device. In some embodiments, the dosing device 980 is a thermostatic expansion valve (TXV) and the secondary dosing device 990 is a fixed-orifice device (or vice versa). Generally, dosing devices 980 and 990 remove pressure from the refrigerant flow 905 to allow expansion, or the phase change from a liquid to a vapor, at evaporator positions 910 and 940. The high-pressure liquid (or mostly liquid) refrigerant 905 entering dosing devices 980 and 990 is at a higher temperature than the liquid refrigerant 905 leaving them.For example, if the refrigerant 905 flow entering the dosing device 980 is 340 psig / 80°F / 0% vapor, the refrigerant 905 flow may be 196 psig / 68°F / 5% vapor as it leaves the primary dosing device 980. As another example, if the refrigerant 905 flow entering the secondary dosing device 990 is 196 psig / 68°F / 4% vapor, the refrigerant 905 flow may be 128 psig / 44°F / 14% vapor as it leaves the secondary dosing device 990. The refrigerant 905 may be any suitable refrigerant, as described above with respect to refrigerant 305 in Figure 3. In the example operation of a single coil pack 900, the inlet airflow 901 passes through the secondary evaporator portion 940, where heat is transferred from the inlet air 901 to the cold refrigerant flow 905 passing through the secondary evaporator portion 940. As a result, the inlet air 901 can be cooled. For example, if the inlet air 901 is 80°F / 60% humidity, the secondary evaporator portion 940 can discharge the first airflow at 70°F / 84% humidity. This can cause the refrigerant flow 905 to partially vaporize within the secondary evaporator portion 940. For example, if the refrigerant flow 905 entering the secondary evaporator portion 940 is 196 psig / 68°F / 5% vapor, the refrigerant flow 905 may be 196 psig / 68°F / 38% vapor as it leaves the secondary evaporator portion 940. The cooled intake air 901 proceeds through the coil pack 900, reaching the primary evaporator portion 910. Similar to the secondary evaporator portion In section 940, the primary evaporator portion 910 transfers heat from the airflow 901 to the cold refrigerant flow 905 passing through the primary evaporator portion 910. As a result, the airflow 901 can be cooled below its dew point temperature, causing the moisture in the airflow 901 to condense (thus reducing the absolute humidity of the airflow 901). For example, if the airflow 901 is 70°F / 84% humidity, the primary evaporator portion 910 can cool the airflow 901 to 54°F / 98% humidity. This can cause the refrigerant flow 905 to partially or completely vaporize within the primary evaporator portion 910. For example, if the refrigerant flow 905 entering the primary evaporator portion 910 is 128 psig / 44°F / 14% vapor, the refrigerant flow 905 may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator portion 910.In certain embodiments, the liquid condensate from the airflow through the primary evaporator portion 910 can be collected in a drain pan connected to a condensate tank (for example, as illustrated in FIG. 4 and described herein). Additionally, the condensate tank may include a condensate pump that moves the collected condensate, either continuously or at periodic intervals, out of the coil pack 900 (for example, via a drain hose) to a suitable drain or storage location. The cooled airflow 901 leaving the primary evaporator portion 910 enters the secondary condenser portion 920. The secondary condenser portion 920 facilitates heat transfer from the hot refrigerant flow 905 passing through the secondary condenser portion 920 to the airflow 901. This reheats the airflow 901, thereby decreasing its relative humidity. For example, if the airflow 901 is 54°F / 98% humidity, the secondary condenser portion 920 can discharge an outlet airflow 925 at 65°F / 68% humidity. This can cause the refrigerant flow 905 to partially or completely condense within the secondary condenser portion 920. For example, if the refrigerant flow 905 entering the secondary condenser portion 920 is 196 psig / 68°F / 38% vapor, the refrigerant flow 905 may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser portion 920.Outlet airflow 925, for example, can enter the primary condenser portion 330 or the sub-cooling coil 350 of FIG. 3. Although a particular implementation of the 900 coil package is primarily illustrated and described, this description encompasses any implementation suitable to the 900 coil package, according to specific needs. Furthermore, although several components of the 900 coil package are depicted as being located in specific positions, this description encompasses those components positioned in any suitable location, according to specific needs. In certain embodiments, the secondary evaporator (340, 640) and the secondary condenser (320, 620) of FIGS. 3, 6A-6B, or 8A-8C are combined into a single coil package such that the single coil package includes portions (e.g., separate refrigerant circuits) to accommodate the respective functions of the secondary evaporator and the secondary condenser. An illustrative example of such an embodiment is shown in FIG. 10. FIG. 10 shows a single coil package 1000 that includes a secondary evaporator portion 1040 and a secondary condenser portion 1020. As shown in the illustrative example in FIG. 10, a primary evaporator 1010 is located between the secondary evaporator portion 1040 and the secondary condenser portion 1020 of the single coil package 1000. In this exemplary embodiment, the single coil package 1000 is shown as a U-shaped coil.However, in alternative configurations, they can be used while the airflow 1001 passes sequentially through the secondary evaporator portion 1040, the primary evaporator 1010, and the secondary condenser portion 1020. Generally, the single coil package 1000 can include the same or a different type of coil compared to that of the primary evaporator 1010. For example, the single coil package 1000 can include a microchannel coil, while the primary evaporator 1010 can include a finned-tube coil. This can provide additional flexibility for optimizing a dehumidification system in which a single coil package 1000 and the primary evaporator 1010 are used. In the operation of the example modes for the single coil package 1000, the inlet air 1001 passes through the secondary evaporator portion 1040, where heat is transferred from the inlet air 1001 to the cold refrigerant flow passing through the secondary evaporator portion 1040. As a result, the inlet air 1001 can be cooled. For example, if the inlet air 1001 is 80°F / 60% humidity, the secondary evaporator portion 1040 can discharge the airflow at 70°F / 84% humidity. This can cause the refrigerant flow to partially vaporize within the 1040 secondary evaporator portion. For example, if the refrigerant flow entering the 1040 secondary evaporator is 196 psig / 68°F / 5% vapor, the 1005 refrigerant flow may be 196 psig / 68°F / 38% vapor as it leaves the 1040 secondary evaporator portion. The cooled inlet air 1001 leaves the secondary evaporator portion 1040 and enters the primary evaporator 1010. Similar to the secondary evaporator portion 1040, the primary evaporator 1010 transfers heat from the airflow 1001 to the cold refrigerant flow passing through it. As a result, the airflow 1001 can be cooled below its dew point temperature, causing the moisture in the airflow 1001 to condense (thus reducing the absolute humidity of the airflow 1001). For example, if the airflow 1001 entering the primary evaporator 1010 is 70°F / 84% humidity, the primary evaporator 1010 can discharge the airflow at 54°F / 98% humidity. This can cause the refrigerant flow to partially or completely vaporize within the primary evaporator 1010. For example, if the refrigerant flow entering the primary evaporator 1010 is 128 psig / 44°F / 14% vapor, the refrigerant flow may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator 1010.In certain embodiments, the liquid condensate from the airflow 1010 can be collected in a drain pan connected to a condensate tank, as illustrated in FIG. 4. Additionally, the condensate tank may include a condensate pump that moves the collected condensate, either continuously or at periodic intervals, away from the primary evaporator 1010 and the associated dehumidification system (e.g., via a drain hose) to a suitable drain or storage location. The cooled airflow 1001 leaves the primary evaporator 1010 and enters the secondary condenser portion 1020. The secondary condenser portion 1020 facilitates heat transfer from the hot refrigerant flow passing through the secondary condenser 1020 to the airflow 1001. This reheats the airflow 1001, thereby decreasing its relative humidity. For example, if the airflow 1001 entering the secondary condenser portion 1020 is 54°F / 98% humidity, the secondary condenser 1020 can discharge the airflow 1025 at 65°F / 68% humidity. This can cause the refrigerant flow to partially or completely condense within the secondary condenser 1020. For example, if the refrigerant flow entering the secondary condenser portion 1020 is 196 psig / 68°F / 38% vapor, the refrigerant flow may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 1020.The outlet airflow 925, for example, can enter the primary condenser 330 or the sub-cooling coil 350 of FIG. 3. Although a particular implementation of the 1000 coil package is primarily illustrated and described, this description encompasses any implementation suitable to the 1000 coil package, according to specific needs. Furthermore, although several components of the 1000 coil package are depicted as being located in specific positions, this description encompasses those components positioned in any suitable location, according to specific needs. In certain configurations, one or both of the secondary evaporator (340, 640) and the primary evaporator (310, 610) of Figures 3, 6A–6B, or 8A–8C are subdivided into two or more circuits. In such configurations, each subdivided evaporator circuit is supplied with refrigerant by a corresponding metering device. The metering devices may include passive metering devices, active metering devices, or combinations thereof. For example, metering device 380 (or 690) may be an active thermostatic expansion valve (TXV), and secondary metering device 390 (or 690) may be a passive fixed-orifice device (or vice versa). The metering devices can be configured to supply refrigerant to each circuit within the evaporators at a desired mass flow rate.The dosing devices for supplying refrigerant to each subdivided evaporator circuit(s) can be used in combination with dosing devices 380 and 390 or can replace one or both of dosing devices 380 and 390. FIGS. 11 Figures 12, 13, and 14 show an illustrative example of a portion 1100 of a dehumidification system in which the primary evaporator 1110 comprises three circuits for refrigerant flow, according to certain embodiments. The portion 1100 includes a primary metering device 1180, secondary metering devices 1190a-c, a secondary evaporator 1140, a primary evaporator 1110, and a secondary condenser 1120. The primary evaporator 1110 includes three circuits for receiving refrigerant flow from the secondary metering devices 1190a-c. In the example of Figures 11, 12, 13, and 14, each of the secondary metering devices 1190a-c is a passive metering device (i.e., with an orifice of a fixed inside diameter and length).However, it should be understood that one or more (up to all) of the secondary dosing devices 1190a-c may be active dosing devices (e.g., thermostatic expansion valves). In the operation of the example modalities of portion 1100 of a dehumidification system, the cooled (or subcooled) refrigerant flow is received at inlet 1102, for example, from the subcooling coil 350 or the primary condenser 330 of the dehumidification system 300 of FIG. 3. The primary metering device 1180 determines the refrigerant flow rate in the secondary evaporator 1140. While FIGS. 11, 12, 13, and 14 are shown to have a single primary metering device 1180, other modalities may include multiple primary metering devices in parallel (for example, if the secondary evaporator 1140 comprises two or more circuits for refrigerant flow). As the cooled refrigerant passes through the 1140 secondary evaporator, heat is exchanged between the refrigerant and the airflow passing through the evaporator, cooling the inlet air. For example, if the inlet air is 80°F / 60% humidity, the 1140 secondary evaporator may discharge the airflow at 70°F / 84% humidity. This can cause the refrigerant flow to partially vaporize within the 1140 secondary evaporator. For example, if the refrigerant flow entering the 1140 secondary evaporator is 196 psig / 68°F / 5% vapor, the refrigerant flow may be 196 psig / 68°F / 38% vapor as it leaves the 1140 secondary evaporator. The secondary condenser 1120 receives heated refrigerant from the secondary evaporator 1140 via pipe 1106. The secondary condenser 1120 facilitates heat transfer from the hot refrigerant flow passing through the secondary condenser 1120 to the airflow. This reheats the airflow, thereby decreasing its relative humidity. For example, if the airflow is At 54°F / 98% humidity, the secondary condenser 1120 may discharge an airflow at 65°F / 68% humidity. This can cause the refrigerant flow to partially or completely condense within the secondary condenser 1120. For example, if the refrigerant flow entering the secondary condenser 1120 is 196 psig / 68°F / 38% vapor, the refrigerant flow may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 1120. The cooled refrigerant exits the secondary condenser at 1108 and is received by the metering devices 1190a-c, which distribute the refrigerant flow to the three circuits of the primary evaporator 1110. Figure 14 shows a view including the circuit system of the primary evaporator 1110. The airflow passing through the primary evaporator 1110 can be cooled below its dew point temperature, causing the moisture in the airflow to condense (thus reducing the absolute humidity of the air). As an example, if the airflow is 70°F / 84% humidity, the primary evaporator 1110 can discharge the airflow at 54°F / 98% humidity. This can cause the refrigerant flow to partially or completely vaporize within the primary evaporator 1110. Each of the secondary dosing devices 1190a, 1190b, and 1190c is configured to provide refrigerant flow to each primary evaporator circuit. 1110 at a desired flow rate. For example, the flow rate supplied to each circuit can be optimized to improve the performance of the primary evaporator 1110. For example, under certain operating conditions, it may be beneficial to prevent the entire refrigerant flow from passing through the entire evaporator, as occurs in a traditional evaporator coil. Refrigerant flowing through an evaporator could undergo a phase change from liquid to gas before exiting the coil, resulting in poor performance in the portion of the evaporator that only comes into contact with the gaseous refrigerant. To significantly reduce or eliminate this problem, the present description provides the refrigerant flow at a desired flow rate through each circuit.The desired flow rate can be predetermined (e.g., based on known design criteria and / or operating conditions) and / or variable (e.g., manually and / or automatically adjustable in real time) during operation. The flow rate can be configured so that the refrigerant flow exits its respective circuit immediately after transitioning to a gas. For example, the airflow rate near the edges of an evaporator may be lower than near the center of the evaporator. Therefore, a lower refrigerant flow rate can be supplied by secondary dosing devices 1190ac to the circuits corresponding to the edge of the primary evaporator 1110. While the examples in Figures 11, 12, 13, and 14 include a primary evaporator that is subdivided into two or more circuits, in other embodiments, the secondary evaporator 1110 can also, or alternatively, be subdivided into two or more circuits. It should also be noted that the circuit system exemplified by Figures 11, 12, 13, and 14 can also be achieved in single coil packages such as those shown in Figures 9 and 10. Although a particular implementation of Part 1100 of a dehumidification system is primarily illustrated and described, this description encompasses any suitable implementation of Part 1100 of a dehumidification system, according to specific needs. Furthermore, although several components of Part 1100 of a dehumidification system are depicted as being located in specific positions, this description encompasses those components that can be positioned in any suitable position, according to specific needs. Figures 15A–15B illustrate an example dehumidification system 1500 that can be used in accordance with the dehumidification system 300 of Figure 3 to reduce the humidity of the air inside a structure. The dehumidification system 1500 includes a dehumidification unit 1502, which is generally located indoors, and > you NCNN a heat exchanger 1504 or an external source 1506 configured to contain a volume of an operable fluid to be used by the dehumidification system 1500 to cool a separate fluid flow within the dehumidification unit 1502. FIG. 15A illustrates the dehumidification system 1500 comprising the heat exchanger 1504, and FIG. 15B illustrates the dehumidification system comprising the external source 1506. With reference to both of FIGS. 15A - 15B, the dehumidification unit 1502 includes a primary evaporator 1508, a primary condenser 1510, a secondary evaporator 1512, a secondary condenser 1514, a compressor 1516, a primary dosing device 1518, a secondary dosing device 1520, and a fan 1522. With continuous reference to both of FIGS. 15A 15B, a flow of refrigerant 1524 is circulated through the dehumidification unit 1502 as illustrated. In general, the dehumidification unit 1502 receives an inlet air flow 1526, removes water from the inlet air flow 1526, and discharges the dehumidified air 1528. The water is removed from the inlet air 1526 using a refrigeration cycle of the refrigerant flow 1524. By including a secondary evaporator 1512 and a secondary condenser 1514, however, the dehumidification system 1500 causes at least some of the refrigerant flow 1524 to evaporate and condense twice in a single refrigeration cycle. This increases the cooling capacity over typical systems without adding any additional compressor power, thereby increasing the overall dehumidification efficiency of the system. In general, the dehumidification system 1500 attempts to match a saturation temperature of the secondary evaporator 1512 with the saturation temperature of the secondary condenser 1514. The saturation temperature of the secondary evaporator 1512 and the secondary condenser 1514 is generally controlled according to the equation: (inlet air temperature 1526 + second air flow temperature 1530) / 2. Since the saturation temperature of the secondary evaporator 1512 is lower than that of the inlet air 1526, evaporation occurs in the secondary evaporator 1512. Since the saturation temperature of the secondary condenser 1514 is higher than that of the second air flow 1530, condensation occurs in the secondary condenser 1514. The amount of refrigerant 1524 that evaporates in the secondary evaporator 1512 is substantially equal to that which condenses in the secondary condenser 1514. The primary evaporator 1508 receives refrigerant flow 1524 from the secondary dosing device 1520 and discharges refrigerant flow 1524 to the compressor 1516. The primary evaporator 1508 can be any suitable type of coil (e.g., finned tube, microchannel, etc.). The primary evaporator 1508 receives a first airflow 1532 from the secondary evaporator 1512 and discharges a second airflow 1530 to the secondary condenser 514. The second airflow 1530 is generally at a cooler temperature than the first airflow 1532. To cool the first incoming airflow 1532, the primary evaporator 1508 transfers heat from the first airflow 1532 to the refrigerant flow 1524, thereby causing the refrigerant flow 1524 to evaporate at least partially from liquid to gas. This heat transfer from the first air stream 1532 to the coolant stream 1524 also removes water from the first air stream 1532. The secondary condenser 1514 receives the refrigerant flow 1524 from the secondary evaporator 1512 and discharges the refrigerant flow 1524 to the secondary dosing device 1520. The secondary condenser 1514 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary condenser 1514 receives the second airflow 1530 from the primary evaporator 1508 and discharges the dehumidified airflow 1528. The dehumidified airflow 1528 is generally warmer and drier (i.e., the dew point will be the same but the relative humidity will be lower) than the second airflow 1530. The secondary condenser 1514 generates the dehumidified airflow 1528 by transferring heat from the refrigerant flow 1524 to the second airflow 1530, thereby causing the refrigerant flow 1524 to at least partially condense from gas to liquid. The primary condenser 1510 receives the refrigerant flow 1524 from the compressor 1516 and discharges the refrigerant flow 1524 to the primary dosing device 1518. The primary condenser 1510 can be any type of liquid-cooled heat exchanger operable to transfer heat from the refrigerant flow 1524 to the flow of a fluid 1534. In some embodiments, the fluid 1534 can be any suitable fluid, such as water or a mixture of water and glycol. The primary condenser 1510 receives both the fluid 1534 flow and the refrigerant flow 1524 during the operation of the dehumidification system 1500, wherein the primary condenser 1510 is operable to transfer heat from the refrigerant flow 1524, thereby causing the refrigerant flow 1524 to condense at least partially from gas to liquid.In some configurations, the primary condenser 1510 completely condenses the refrigerant flow 1524 into a liquid (i.e., 100% liquid). In other configurations, the primary condenser 1510 partially condenses the refrigerant flow 1524 into a liquid (i.e., less than 100% liquid). As illustrated, the dehumidification system 1500 may further comprise a first water pump 1536. The first water pump 1536 may be arranged internally or externally to the dehumidifying unit 1502. The first water pump 1536 may be any suitable device operable to provide fluid flow 1534. As depicted in FIG. 15A, the first water pump 1536 may be arranged in any suitable position relative to the primary condenser 1510 and the heat exchanger 1504 operable to cycle fluid flow 1534 between the heat exchanger 1504 and the primary condenser 1510. As depicted in FIG. 15B, the first water pump 1536 can be arranged in any suitable position relative to the primary condenser 1510 and the external source 1506 operable to cycle the fluid flow 1534 between the external source 1506 and the primary condenser 1510. With reference to FIG. 15A, the heat exchanger 1504 can receive fluid flow 1534 from the primary condenser 1510 at a first temperature and discharge fluid flow 1534 to the primary condenser 1510 at a second temperature after transferring heat away from the fluid flow 1534, where the second temperature is lower than the first temperature. The heat exchanger 1504 can be any suitable type of heat exchanger, such as, for example, a cooling tower or a dry cooler. The heat exchanger 1504 receives fluid flow 1534 and a first air flow 1540 from the outside, where heat is transferred between the fluid flow 1534 and the first air flow 1540.The heat exchanger 1504 can further discharge fluid flow 1534 and a second air flow to the outside 1542, wherein the fluid flow 1534 leaving the heat exchanger 1504 is at a lower temperature than the fluid flow 1534 received by the heat exchanger 1504, and the second air flow to the outside 1542 is at a higher temperature than the first air flow to the outside 1540. In embodiments where the heat exchanger 1504 is a cooling tower, the heat exchanger 1504 can be operated to supply the flow of fluid 1534 within its internal structure, wherein the fluid 1534 makes direct contact with the first airflow on the outside 1540 as the fluid 1534 flows through the heat exchanger 1504 and transfers heat to the first airflow on the outside 1540. At least a portion of the fluid 1534 may evaporate and escape to the atmosphere as heat is transferred from the fluid 1534 to the first airflow on the outside 1540, and the heat exchanger 1504 can collect a remaining portion of the fluid 1534 after it has transferred heat to the first airflow on the outside 1540, wherein the remaining portion of the fluid 1534 is at a lower temperature.In embodiments where the heat exchanger 1504 is a dry cooler, the heat exchanger 1504 can be operated to induce the first airflow on the outside 1540 to flow through the heat exchanger 1504 where heat is transferred indirectly between the first airflow on the outside 1540 and the fluid flow 1534. In these embodiments, the heat transfer would not result in the loss of a portion of the fluid 1534 through evaporation to the atmosphere. With reference now to FIG. 15B, the external source 1506 can receive the fluid flow 1534 from the primary condenser 1510 and discharge the fluid flow 1534 to the primary condenser 1510 via the first water pump 1536. The external source 1506 can be configured to contain and / or store a volume of fluid 1534 to be used by the primary condenser 1510 to lower the temperature of the refrigerant flow 1524 in the dehumidification unit 1502. The external source 1506 can be configured to receive the fluid flow 1534 from the primary condenser 1510 at a first temperature and discharge the fluid flow 1534 to the primary condenser 1510 at a second temperature after transferring heat away from the fluid flow 1534, where the second temperature is lower than the first temperature.Without limitations, the external source 1506 can be any suitable number and combination of an earthen reservoir, a pool, and a body of water in the refrigerant 1524. For example, if the refrigerant 1524 flow entering compressor 1516 is 128 psig / 52°F / 100% vapor, the refrigerant 1524 flow can be 340 psig / 150°F / 100% vapor as it leaves compressor 1516. Compressor 1516 receives the refrigerant 1524 flow from the primary evaporator 1508 and supplies the pressurized refrigerant 1524 flow to the primary condenser 1510. The fan 1522 may include any of the suitable components operable to remove the intake air 1526 into the dehumidifying unit 1502 and through the secondary evaporator 1512, the primary evaporator 1508, and the secondary condenser 1514. The fan 1522 may be any type of air mover (e.g., axial fan, forward-inclined impeller, backward-inclined impeller, etc.). For example, the fan 1522 may be a backward-sloping impeller positioned adjacent to the secondary condenser 1514. While the fan 1522 is represented as being located adjacent to a secondary condenser 1514, it should be understood that the fan 1522 can be located anywhere along the airflow path of the dehumidifying unit 1502. For example, the fan 1522 can be positioned in the airflow path of any of the airflows 1526, 1532, 1530, or 1528.Furthermore, the 1502 dehumidification unit may include one or more additional fans positioned within any one or more of these airflow paths. The primary dosing device 1518 and the secondary dosing device 1520 are any suitable type of dosing / expansion device. In some embodiments, the primary dosing device 1518 is a thermostatic expansion valve (TXV) and the secondary dosing device 1520 is a fixed-orifice device (or vice versa). In certain embodiments, the dosing devices 1518 and 1520 remove pressure from the refrigerant flow 1524 to allow expansion or phase change from a liquid to a vapor in the evaporators 1512 and 1508. The high-pressure liquid (or mostly liquid) refrigerant 1524 entering the dosing devices 1518 and 1520 is at a higher temperature than the liquid refrigerant 1524 leaving the dosing devices 1518 and 1520.For example, if the refrigerant flow 1524 entering the primary dosing device 1518 is 340 psig / 80°F / 0% vapor, the refrigerant flow 1524 may be 196 psig / 68°F / 5% vapor as it leaves the primary dosing device 1518. As another example, if the refrigerant flow 1524 entering the secondary dosing device 1520 is 196 psig / 68°F / 4% vapor, the refrigerant flow 1524 may be 128 psig / 44°F / 14% vapor as it leaves the secondary dosing device 1520. N C Refrigerant 1524 can be any suitable refrigerant such as R410a. In general, the dehumidification system 1500 uses a closed refrigeration circuit of refrigerant 1524 that passes from the compressor 1516 through the primary condenser 1510, the primary dosing device 1518, the secondary evaporator 1512, the secondary condenser 1514, the secondary dosing device 1520, and the primary evaporator 1508. The compressor 1516 pressurizes the flow of refrigerant 1524, thereby increasing the temperature of the refrigerant 1524. The primary condenser 1510, which may include any suitable water-cooled heat exchanger, cools the pressurized flow of refrigerant 1524 by facilitating heat transfer from the refrigerant 1524 flow to the fluid flow supplied by the external source 1506 that passes through it (i.e., fluid flow 1534).The secondary condenser, which may include any suitable air-cooled heat exchanger, cools the pressurized flow of refrigerant 1524 by facilitating heat transfer from the refrigerant flow 1524 to the respective air flow passing through it (i.e., the second air flow 1530). The cooled flow of refrigerant 1524 leaving the primary and secondary condensers 1510 and 1514 may enter a respective expansion device (i.e., primary dosing device 1518 and secondary dosing device 1520) that is operable to reduce the pressure of the refrigerant 1524 flow, thereby reducing its temperature. The primary and secondary evaporators 1508 and 1512, which may include any suitable heat exchanger, receive the refrigerant 1524 flow from the secondary dosing device 1520 and the primary dosing device 1518, respectively. The primary and secondary evaporators 1508 and 1512 facilitate heat transfer from the respective airflows passing through them (i.e., inlet air 1526 and first airflow 1532) to the refrigerant 1524 flow.The refrigerant flow 1524, after leaving the primary evaporator 1508, passes back to the compressor 1516, and the cycle is repeated. In certain configurations, the refrigeration circuit described above can be configured such that evaporators 1508 and 1512 operate in a flooded state. In other words, the refrigerant 1524 flow may enter evaporators 1508 and 1512 in a liquid state, and a portion of the refrigerant 1524 flow may still be in a liquid state as it exits evaporators 1508 and 1512. Consequently, the phase change of the refrigerant 1524 flow (from liquid to vapor as heat is transferred to the refrigerant 1524 flow) occurs across evaporators 1508 and 1512, resulting in a nearly constant pressure and temperature. N constant C across the complete evaporators 1508 and 1512 (and, as a result, increased cooling capacity). In the example operation modes of the dehumidification system 1500, the inlet air 1526 can be drawn into the dehumidification unit 1502 by the fan 1522. The inlet air 1526 passes through the secondary evaporator 1512, where heat is transferred from the inlet air 1526 to cool the refrigerant flow 1524 passing through the secondary evaporator 1512. As a result, the inlet air 1526 can be cooled. For example, if the inlet air 1526 is 80°F / 60% humidity, the secondary evaporator 1512 can discharge the first air flow 1532 at 70°F / 84% humidity. This can cause the refrigerant flow 1524 to partially vaporize inside the secondary evaporator 1512. For example, if the refrigerant flow 1524 entering the secondary evaporator 1512 is 196 psig / 68°F / 5% vapor, the refrigerant flow 1524 may be 196 psig / 68°F / 38% vapor as it leaves the secondary evaporator 1512. The cooled inlet air 1526 leaves the secondary evaporator 1512 as the first airflow 1532 and enters the primary evaporator 1508. Similar to the secondary evaporator 1512, the primary evaporator 1508 transfers heat from the first airflow 1532 to the cold refrigerant flow 1524 passing through the primary evaporator 1508. As a result, the first airflow 1532 can be cooled below its dew point temperature, causing the moisture in the first airflow 1532 to condense (thus reducing the absolute humidity of the first airflow 1532). As an example, if the first airflow 1532 is At 70°F / 84% humidity, the primary evaporator 1508 can discharge the second airflow 1530 at 54°F / 98% humidity. This can cause the refrigerant flow 1524 to partially or completely vaporize from the primary evaporator 1508. For example, if the refrigerant flow 1524 entering the primary evaporator 1508 is 128 psig / 44°F / 14% vapor, the refrigerant flow 1524 may be 128 psig / 52°F / 100% vapor as it leaves the primary evaporator 1508. The first cooled airflow 1532 leaves the primary evaporator 1508 as the second airflow 1530 and enters the secondary condenser 1514. The secondary condenser 1514 facilitates heat transfer from the hot refrigerant flow 1524 passing through the secondary condenser 1514 to the second airflow 1530. This reheats the second airflow 1530, thereby decreasing its relative humidity. For example, if the second airflow 1530 is 54°F / 98% humidity, the secondary condenser 1514 can discharge the dehumidified airflow 1528 at 65°F / 68% humidity. This can cause > you NCNN that the refrigerant flow 1524 partially or completely condenses inside the secondary condenser 1514. For example, if the refrigerant flow 1524 entering the secondary condenser 1514 is 196 psig / 68°F / 38% vapor, the refrigerant flow 1524 may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 1514. Some types of dehumidification system 1500 may include a controller that can include one or more computer systems in one or more locations. Each computer system may include any of the appropriate input devices (such as a keyboard, touchscreen, mouse, or other device that can accept information), output devices, mass storage media, or other components suitable for receiving, processing, storing, and communicating data. Both input and output devices may include fixed or removable storage media such as a magnetic computer disk, CD-ROM, or other media suitable for both receiving input from and providing output to a user.Each computer system may include a personal computer, workstation, network computer, kiosk, wireless data station, personal data assistant (PDA), one or more processors with these or other devices, or any other suitable processing device. In short, the controller may include any suitable combination of software, firmware, and hardware. The controller may additionally include one or more processing modules. Each processing module may include one or more microprocessors, controllers, or any other suitable computing devices or resources and may operate, either alone or in conjunction with other components of the 1500 dehumidification system, to provide some or all of the functionality described herein. The controller may additionally include (or be communicatively coupled to the wired or wireless communication path) computer memory. Memory may include any memory or database module and may take the form of volatile or non-volatile memory, including, without limitation, magnetic media, optical media, random access memory (RAM), read-only memory (ROM), removable media, or any other suitable local or remote memory component. Although specific implementations of the 1500 dehumidification system are primarily illustrated and described, this description encompasses any suitable implementation of the 1500 dehumidification system, according to specific needs. Furthermore, although several components of the 1500 dehumidification system are depicted in particular positions and in relation to one another, this description encompasses > You are those components that are positioned in any suitable location, according to particular needs. NCNN FIGS. 16A, 16B, 16C and 16D illustrate an example dehumidification system 1600 with a modulating valve 1602 that can be used in accordance with the split dehumidification system 600 of FIGS. 6A - 6B to reduce the humidity of an airflow. The dehumidification system 1600 includes the modulating valve 1602, a primary evaporator 1604, a primary condenser 1606, a secondary evaporator 1608, a secondary condenser 1610, a compressor 1612, a primary dosing device 1614, a secondary dosing device 1616, a fan 1618, and an alternate condenser 1620. In some embodiments, the dehumidification system 1600 may additionally include an optional subcooling coil 1622. As illustrated in Figures 16A and 16B, the alternate condenser 1620 may be arranged in an external condenser unit 1624. With reference to Figure 16B, the alternate condenser 1620 may be arranged in an external condenser unit 1624.16A, the optional subcooling coil 1622 can be arranged in the external condenser unit 1624 with the alternate condenser 1620, wherein the subcooling coil 1622 and the alternate condenser 1620 can be combined into a single coil. With reference to FIG. 16B, the optional subcooling coil 1622 can be arranged adjacent to the primary condenser 1606, wherein the subcooling coil 1620 and the primary condenser 1606 can be combined into a single coil. FIGS. 16C and 16D illustrate an embodiment of the dehumidification system 1600 wherein neither the optional subcooling coil 1622 nor the alternate condenser 1620 is in the external condenser unit 1624 and wherein the alternate condenser 1620 is liquid-cooled. With reference to each of Figures 16A-16D, a refrigerant flow 1626 is circulated through the dehumidification system 1600 as illustrated. In general, the dehumidification system 1600 receives the inlet air flow 1628, removes water from the inlet air flow 1628, and discharges the dehumidified air 1630. The water is removed from the inlet air 1628 using a refrigeration cycle of the refrigerant flow 1626. By including the secondary evaporator 1608 and the secondary condenser 1610, however, the dehumidification system 1600 causes at least some of the refrigerant flow 1626 to evaporate and condense twice in a single refrigeration cycle. This increases the cooling capacity over typical systems without adding any additional compressor power, thereby increasing the overall dehumidification efficiency of the system. In general, the dehumidification system 1600 attempts to match the saturation temperature of the secondary evaporator 1608 with the saturation temperature of the secondary condenser 1610. The saturation temperature of the secondary evaporator 1608 and the secondary condenser 1610 is generally controlled according to the equation: (inlet air temperature 1628 + second air flow temperature 1632) / 2. Since the saturation temperature of the secondary evaporator 1608 is lower than that of the inlet air 1628, evaporation occurs in the secondary evaporator 1608. Since the saturation temperature of the secondary condenser 1610 is higher than that of the second air flow 1632, condensation occurs in the secondary condenser 1610. The amount of refrigerant 1626 that evaporates in the secondary evaporator 1608 is substantially equal to that which condenses in the secondary condenser 1610. The primary evaporator 1604 receives refrigerant flow 1626 from the secondary dosing device 1616 and discharges refrigerant flow 1626 to the compressor 1612. The evaporator 1604 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary evaporator 1604 receives a first airflow 1634 from the secondary evaporator 1608 and discharges a second airflow 1632 to the secondary condenser 1610. The second airflow 1632 is generally at a cooler temperature than the first airflow 1634. To cool the first incoming airflow 1634, the primary evaporator 1604 transfers heat from the first airflow 1634 to the refrigerant flow 1626, thereby causing the refrigerant flow 1626 to evaporate at least partially from liquid to gas. This heat transfer from the first air stream 1634 to the coolant stream 1626 also removes water from the first air stream 1634. The secondary condenser 1610 receives refrigerant flow 1626 from the secondary evaporator 1608 and discharges refrigerant flow 1626 to the secondary dosing device 1616. The secondary condenser 1610 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary condenser 1610 receives a second airflow 1632 from the primary evaporator 1604 and discharges a third airflow 1636. The third airflow 1636 is generally warmer and drier (i.e., the dew point will be the same, but the relative humidity will be lower) than the second airflow 1632. The secondary condenser 1610 generates the third airflow 1632 by transferring heat from the refrigerant flow 1626 to the second airflow 1632, thereby causing the refrigerant flow 1626 to condense at least partially from gas to liquid. The primary condenser 1606 can be any type of coil (e.g., finned tube, microchannel, etc.). The primary condenser 1606 is operable to receive the refrigerant flow 1626 from the modulating valve 1602 and discharges the refrigerant flow 1626 to either the primary dosing device 1614 or the subcooling coil 1622. As shown in FIG. 16A, the primary condenser 1606 discharges the refrigerant flow 1626 to the primary dosing device 1614. In these configurations, the primary condenser 1606 receives the third air flow 1636 and discharges the dehumidified air 1630. But with reference to FIGS. 16B - 16D, the primary condenser 1606 discharges the refrigerant flow 1626 to the optional sub-cooling coil 1622 before the refrigerant flow 1626 flows to the primary dosing device 1614.In these embodiments, the primary condenser 1606 receives a fourth airflow 1638 generated by the subcooling coil 1622 and discharges the dehumidified air 1630. With reference to each of FIGS. 16A–16D, the dehumidified air 1630 is, in general, warmer and drier (i.e., has a lower relative humidity) than either the third airflow 1636 or the fourth airflow 1638. The primary condenser 1606 generates dehumidified air 1630 by transferring heat away from the refrigerant flow 1626, thereby causing the refrigerant flow 1626 to condense at least partially from gas to liquid. In some embodiments, the primary condenser 1606 completely condenses the refrigerant flow 1626 to a liquid (i.e., N C 100% liquid). In other configurations, the primary condenser 1606 partially condenses the refrigerant flow 1626 to a liquid (i.e., less than 100% liquid). The secondary evaporator 1608 receives the refrigerant flow 1626 from the primary dosing device 1614 and discharges the refrigerant flow 1626 to the secondary condenser 1610. The secondary evaporator 1608 can be any type of coil (e.g., finned tube, microchannel, etc.). The secondary evaporator 1608 receives the inlet air 1628 and discharges the first air flow 1634 to the primary evaporator 1604. The first air flow 1634 is generally at a cooler temperature than the inlet air 1628. To cool the incoming inlet air 1628, the secondary evaporator 1608 transfers heat from the inlet air 1608 to the refrigerant flow 1626, thereby causing the refrigerant flow 1626 to evaporate at least partially from liquid to gas. The subcooling coil 1622, which is an optional component of the dehumidification system 1600, subcools the liquid refrigerant 1626 as it leaves the primary condenser 1606, the alternate condenser 1620, or combinations thereof. In configurations where the subcooling coil 1622 is located inside the external condenser unit 1624, the subcooling coil 1622 can receive refrigerant 1626 as it leaves the alternate condenser 1620, as shown in Figure 16A. In configurations where the subcooling coil 1622 is located adjacent to the primary condenser 1606, the subcooling coil 1622 can receive refrigerant 1626 as it leaves the primary condenser 1606 and / or the alternate condenser 1620, as shown in Figures 16A and 16B. 16B - 16D. With reference to each of the FIGS.16A 16D, this, in turn, supplies the primary dosing device 1614 with a liquid refrigerant that is up to 30 degrees (or more) cooler than before it enters the subcooling coil 1622. For example, if the refrigerant flow 1626 entering the subcooling coil 1622 is 340 psig / 105°F / 60% vapor, the refrigerant flow 1626 may be 340 psig / 80°F / 0% vapor as it leaves the subcooling coil 1622. The subcooled refrigerant 1626 has a larger heat enthalpy factor as well as a higher density, resulting in reduced cycle times and evaporation cycle frequency for the refrigerant flow 1626. This results in greater efficiency and less energy use by the dehumidification system 1600. Compressor 1612 pressurizes the flow of refrigerant 1626, thereby increasing its temperature. For example, if the refrigerant 1626 entering compressor 1612 is 128 psig / 52°F / 100% vapor, the refrigerant 1626 may be 340 psig / 150°F / 100% vapor as it leaves compressor 1612. Compressor 1612 receives the refrigerant 1626 flow from the primary evaporator 1604 and supplies the pressurized flow of refrigerant 1626 to the modulating valve 1602. The modulating valve 1602 is operable to receive the pressurized refrigerant flow 1626 from the compressor 1612 and to direct the refrigerant flow to the primary condenser 1606, the alternate condenser 1620, or both. In some modes, the modulating valve 1602 can operate based, at least in part, on a predetermined temperature setpoint for the dehumidified airflow 1630 and on the actual temperature of the dehumidified airflow 1630 discharged by the dehumidification system 1600. The dehumidification system 1600 can utilize the modulating valve 1602 to direct the heat rejected from the refrigerant flow 1626 away from the primary condenser 1606 and toward the alternate condenser 1620.Depending on a feedback loop comprising the predetermined temperature setpoint and the actual temperature of the dehumidified airflow 1630, the modulating valve 1602 can be set to partially open and / or close to direct at least a portion of the refrigerant flow 1626 to the alternate condenser 1620 and direct a remaining portion of the refrigerant flow 1626 to the primary condenser 1606. During operation of the dehumidification system 1600, the modulating valve 1602 can direct the flow of refrigerant 1626 to the primary condenser 1606 if the temperature of the dehumidified airflow 1630 discharged by the primary condenser 1606 does not exceed the preset temperature setpoint monitored by the dehumidification system 1600. If the temperature of the dehumidified airflow 1630 is higher than the preset temperature setpoint, the modulating valve 1602 can be actuated to direct at least a portion of the refrigerant flow 1626 to the alternate condenser 1620 and direct a remaining portion of the refrigerant flow to the primary condenser 1606. As the dehumidification system 1600 operates, the reduction in the volume of refrigerant flow 1626 to the primary condenser 1606 can reduce the amount of available heat rejected in the dehumidified airflow. 1630.With the reduced flow of refrigerant 1626 passing through the primary condenser 1606 (e.g., the remaining portion of the refrigerant flow), the rate of heat transfer to the dehumidified airflow 1630 can be subsequently reduced, thereby minimizing the temperature difference between the incoming and outgoing dehumidified airflow 1630. Once the temperature of the dehumidified airflow 1630 falls below the predetermined temperature setpoint, the modulating valve 1602 can be actuated to direct at least a portion of the refrigerant flow 1626 back to the primary condenser 1606. Any remaining refrigerant 1626 that has been directed to the alternate condenser 1620 can be combined with the additional downstream refrigerant flow 1626. With reference to Figures 16A and 16B, the alternate condenser 1620 can be arranged in the external condenser unit 1624 and can be any type of coil (e.g., finned tube, microchannel, etc.) operable to receive the refrigerant flow 1626 from the modulating valve 1602 and discharge the refrigerant flow 1626 at a lower temperature. The alternate condenser 1620 transfers heat from the refrigerant flow 1626, thereby causing the refrigerant flow 1626 to condense at least partially from gas to liquid. In some embodiments, the alternate condenser 1620 completely condenses the refrigerant flow 1626 to a liquid (i.e., 100% liquid). In other embodiments, the alternate condenser 1620 partially condenses the refrigerant flow 1626 to a liquid (i.e., less than 100% liquid). As shown in Figure 16B, the alternate condenser 1620 can be arranged in the external condenser unit 1624.16A, the refrigerant flow 1626 can be discharged to the subcooling coil 1622 arranged adjacent to the alternate condenser 1620 within the external condenser unit 1624. The alternate condenser 1620 and the subcooling coil. 1622 can receive a first airflow from the outside 1640 and discharge a second airflow from the outside 1642. The second airflow from the outside 1642 is generally warmer (i.e., has a lower relative humidity) than the first airflow from the outside 1640. In other embodiments, as shown in FIG. 16B, the first airflow from the outside 1640 can be received by the alternate condenser 1620 without first flowing through the subcooling coil 1622. In FIG. 16B, the external condenser unit 1624 may include the alternate condenser 1620 and a fan 1644 and may not include the subcooling coil 1622, wherein the fan 1644 can be configured to facilitate the flow of the first airflow from the outside 1640 to the alternate condenser 1620. With reference now to FIGS. 16C - 16D, the alternate condenser 1620 can be any type of liquid-cooled heat exchanger operable for transferring heat from the refrigerant flow 1626 to the flow of a fluid 1646, wherein the alternate condenser 1620 receives the refrigerant flow 1626 from the modulating valve 1602 and discharges the refrigerant flow 1626 to the subcooling coil 1622. In various embodiments, the fluid 1646 can be any suitable fluid, such as water or a mixture of water and glycol. The alternate condenser 1620 receives both the fluid flow 1646 and the refrigerant flow 1626 during the operation of the dehumidification system 1600, wherein the alternate condenser 1620 is operable to transfer heat from the refrigerant flow 1626, thereby causing the refrigerant flow 1626 to condense at least partially from gas to liquid.In some configurations, the 1620 reciprocating condenser completely condenses the 1626 refrigerant flow to a liquid (i.e., 100% liquid). In other configurations, the 1620 reciprocating condenser partially condenses the 1626 refrigerant flow to a liquid (i.e., less than 100% liquid). As illustrated in FIGS. 16C-16D, the dehumidification system 1600 may further comprise a first water pump 1648. The first water pump 1648 may be arranged external to the alternate condenser 1620. The first water pump may be any suitable device operable to provide fluid flow 1646. As depicted in FIG. 16C, the first water pump 1648 may be arranged at any suitable location between the alternate condenser 1620 and a heat exchanger 1654 operable to cycle fluid flow 1646 between the heat exchanger 1654 and the alternate condenser 1620. As depicted in FIG. 16D, the first water pump 1648 may be arranged at any suitable location between the alternate condenser 1620 and an external source 1652 operable to cycle fluid flow. 1646 between the external source 1652 and the alternating capacitor > you 1620. NCNN With reference to FIG. 16C, the heat exchanger 1654 can receive fluid flow 1646 from the alternating condenser 1620 and discharge fluid flow 1646 after transferring heat away from the fluid flow 1646. The heat exchanger 1654 can be any suitable type of heat exchanger, such as a cooling tower or a dry cooler. The heat exchanger 1654 receives fluid flow 1646 and a first air flow 1656 from the outside, where heat is transferred between the fluid flow 1646 and the first air flow 1656.The heat exchanger 1654 can further discharge fluid flow 1646 and a second air flow to the outside 1658, wherein the fluid flow 1646 leaving the heat exchanger 1654 is at a lower temperature than the fluid flow 1646 received by the heat exchanger 1654, and the second air flow to the outside 1658 is at a higher temperature than the first air flow to the outside 1654. In modalities where the heat exchanger 1654 is a cooling tower, the heat exchanger 1654 can be operated to supply fluid flow 1646 within its internal structure, where fluid 1646 directly makes contact with the first airflow on the outside 1656 as fluid 1646 flows through the Heat exchanger 1654 transfers heat to the first airflow outside 1656. At least a portion of the fluid 1646 may evaporate and escape to the atmosphere as heat is transferred from the fluid 1646 to the first airflow outside 1656, and the heat exchanger 1654 may collect a remaining portion of the fluid 1646 after transferring heat to the first airflow outside 1656, where the remaining portion of the fluid 1646 is at a lower temperature. In embodiments where the heat exchanger 1654 is a dry cooler, the heat exchanger 1654 may be operable to induce the first airflow outside 1656 to flow through the heat exchanger 1654 where heat is transferred indirectly between the first airflow outside 1656 and the fluid flow 1646.In these modes, the heat transfer will not result in the loss of a portion of fluid 1646 through evaporation into the atmosphere. With reference to FIG. 16D, the external source 1652 can receive the fluid flow 1646 and discharge the fluid flow 1646 to the alternate condenser 1620 via the first water pump 1648. The external source 1652 can be configured to contain and / or store a volume of fluid 1646 to be used by the alternate condenser 1620 to lower the temperature of the refrigerant flow 1626 in the dehumidification system 1600. Without limitations, the source External source 1652 may be selected from a group consisting of an earthen reservoir, a swimming pool, an outdoor body of water, and any combination thereof. In modalities where the external source 1652 is an earthen reservoir, the external source 1652 may implement an open or closed earthen water system, wherein the conduit providing fluid flow 1646 within the earthen reservoir may be arranged substantially parallel to a horizontal plane of the earth surface, substantially perpendicular to the horizontal plane of the earth surface, or combinations thereof. In configurations where the external source 1652 is a pool, the external source 1652 may be within a multi-loop system operable to contain and cool the fluid flow 1646 before the alternate condenser 1620 uses the fluid flow 1646 to lower the temperature of the refrigerant flow 1626. The external source 1652 may be configured to receive the fluid flow 1646 from the alternate condenser 1620 at a first temperature and discharge the fluid flow 1646 to the alternate condenser 1620 at a second temperature after transferring heat away from the fluid flow 1646, where the second temperature is lower than the first temperature. The external source 1652 receives the fluid flow 1646 and may also receive a flow of a secondary fluid (not shown), where heat is transferred between 102 the fluid flow 1646 and the secondary fluid flow. The external source 1652 can then discharge the fluid flow 1646 and the secondary fluid flow, wherein the fluid flow 1646 leaving the external source 1652 is at a lower temperature than the fluid flow 1646 received by the external source 1652, and wherein the secondary fluid flow leaving the external source 1652 is at a higher temperature than the secondary fluid flow received by the external source 1652. The secondary fluid flow can then be directed to a tertiary condenser (not shown). The tertiary condenser receives the secondary fluid flow from the external source 1652 and discharges the secondary fluid flow back to the external source 1652 at a lower temperature. The tertiary condenser can be any type of air-cooled or liquid-cooled heat exchanger operable to transfer heat away from the secondary fluid flow. In some embodiments, a second pump (not shown) can be in any suitable position relative to the external source 1652 and the tertiary condenser operable to cycle the secondary fluid flow between the external source 1652 and the tertiary condenser, wherein the second pump can be any suitable device operable to provide the secondary fluid flow. With reference again to each of FIGS. 16Ά 103 - 16D, the fan 1618 may include any of the suitable components operable to remove the intake air 1628 in the dehumidification system 1600 and through the secondary evaporator 1608, the primary evaporator 1604, the secondary condenser 1610, the subcooling coil 1622, and the primary condenser 1606. The fan 1618 may be any type of air mover (e.g., axial fan, forward-sloping impeller, and backward-sloping impeller, etc.). For example, the fan 1618 may be a backward-sloping impeller positioned adjacent to the primary condenser 1606 as illustrated in FIGS. 16A and 16D. While the fan 1618 is represented in FIGS. 16A - 16D being located adjacent to the primary condenser 1606, it should be understood that the fan 1618 can be located anywhere along the airflow path of the dehumidification system 1600.For example, fan 1618 can be positioned in the airflow path of any of the airflows 1628, 1634, 1632, 1636, 1638, or 1630. Furthermore, the dehumidification system 1600 can include one or more additional fans positioned within any one or more of these airflow paths. Similarly, with reference to FIGS. 16A–16B, while a fan 1644 of the external condenser unit 1624 is represented as being located above the alternate condenser 1620, it should be >. you 104 NCNN understands that the fan 1644 can be located anywhere (e.g., above, below, besides) with respect to the alternate condenser 1620 and the optional sub-cooling coil 1622, while the fan 1644 is appropriately positioned and configured to facilitate the flow of the first airflow on the outside 1640 towards the alternate condenser 1620. The primary dosing device 1614 and the secondary dosing device 1616 are any suitable type of dosing / expansion device. In some embodiments, the primary dosing device 1614 is a thermostatic expansion valve (TXV) and the secondary dosing device 1616 is a fixed-orifice device (or vice versa). In certain embodiments, the dosing devices 1614 and 1616 remove flow pressure from refrigerant 1626 to permit expansion or phase change from liquid to vapor in the evaporators 1604 and 1608. The high-pressure liquid (or mostly liquid) refrigerant entering the dosing devices 1614 and 1616 is at a higher temperature than the liquid refrigerant 1626 leaving the dosing devices 1614 and 1616.For example, if the refrigerant flow 1626 entering the primary dosing device 1614 is 340 psig / 80°F / 0% vapor, the refrigerant flow 1626 may be 196 psig / 68°F / 5% vapor as it leaves the primary dosing device 1614. 105 As another example, if the refrigerant flow 1626 entering the secondary dosing device 1616 is 196 psig / 68°F / 4% vapor, the refrigerant flow 1626 may be 128 psig / 44°F / 14% vapor as it leaves the secondary dosing device 1616. Refrigerant 1626 can be any suitable refrigerant such as R410a. In general, the dehumidification system 1600 uses a closed refrigeration circuit of refrigerant 1626 that passes from compressor 1612 through modulating valve 1602, primary condenser 1612 and / or alternate condenser 1620, (optionally) subcooling coil 1622, primary dosing device 1614, secondary evaporator 1608, secondary condenser 1610, secondary dosing device 1616, and primary evaporator 1604. Compressor 1612 pressurizes the flow of refrigerant 1626, thereby increasing its temperature.The primary and secondary condensers 1606 and 1610, which may include any suitable heat exchangers, cool the pressurized refrigerant flow 1626 by facilitating heat transfer from the refrigerant flow 1626 to the respective air flows passing through them (i.e., third or fourth air flow 1636, 1638 and second air flow 1632). Additionally, the alternate condenser 1620, which may include any suitable heat exchanger, 106 cools the pressurized flow of refrigerant 1626 by facilitating heat transfer from the refrigerant flow 1626 to either the airflow passing through it (i.e., the first airflow on the outside 1640 as illustrated in FIGS. 16A - 16B) or to the fluid flow supplied by the external source 1652 that passes through it (i.e., fluid flow 1646 as illustrated in FIGS. 16C - 16D). The cooled flow of refrigerant 1626 leaving the primary and / or alternate condensers 1606 and 1620 can enter the primary metering device 1614, which is operable to reduce the pressure of the refrigerant flow 1626, thereby reducing the temperature of the refrigerant flow 1626.The cooled refrigerant flow 1626 leaving the secondary condenser 1610 can enter the secondary dosing device 1616, which is operable to reduce the pressure of the refrigerant flow 1626, thereby reducing its temperature. The primary and secondary evaporators 1604 and 1608, which may include any suitable heat exchanger, receive the refrigerant flow 1626 from the secondary dosing device 1616 and the primary dosing device 1614, respectively. The primary and secondary evaporators 1604 and 1608 facilitate heat transfer from the respective airflows passing through them (i.e., inlet air 1628 and first airflow 1634) to the evaporator flow. 107 refrigerant 1626. The flow of refrigerant 1626, after leaving the primary evaporator 1604, passes back to the compressor 1612 and the cycle repeats. In certain configurations, the refrigeration circuit described above can be configured such that evaporators 1604 and 1608 operate in a flooded state. In other words, the refrigerant flow 1626 can enter evaporators 1604 and 1608 in a liquid state, and a portion of the refrigerant flow 1626 can still be in a liquid state as it exits evaporators 1604 and 1608. Consequently, the phase change of the refrigerant flow 1626 (from liquid to vapor as heat is transferred to the refrigerant flow 1626) occurs across evaporators 1604 and 1608, resulting in nearly constant pressure and temperature across the entire evaporator 1604 and 1608 (and, consequently, increased cooling capacity). In the example operation modes of dehumidification system 1600, inlet air 1628 is drawn into the dehumidification system 1600 by fan 1618. The inlet air 1628 passes through secondary evaporator 1608, where heat is transferred from the inlet air 1628 to the cold refrigerant flow 1626 passing through the secondary evaporator 1608. As a result, the inlet air 1628 is cooled. For example, if the inlet air 1628 is 80°F / 60% humidity, the evaporator 109 psig / 44°F / 14%, the refrigerant flow 1626 can be vapor of 128 psig / 52°F / 100% as it leaves the primary evaporator 1604. The first cooled airflow 1634 leaves the primary evaporator 1604 as the second airflow 1632 and enters the secondary condenser 1610. The secondary condenser 1610 facilitates heat transfer from the hot refrigerant flow 1626 passing through it to the second airflow 1632. This reheats the second airflow 1632, thereby decreasing its relative humidity. For example, if the second airflow 1632 is 54°F / 98% humidity, the secondary condenser 1610 might discharge the third airflow 1636 at 65°F / 68% humidity. This can cause the refrigerant flow 1626 to partially or completely condense within the secondary condenser 1610.For example, if the refrigerant flow 1626 entering the secondary condenser 1610 is 196 psig / 68°F / 38% vapor, the refrigerant flow 1626 may be 196 psig / 68°F / 4% vapor as it leaves the secondary condenser 1610. In some embodiments, the second dehumidified airflow 1632 leaves the secondary condenser 1610 as the third airflow 1636 and enters the primary condenser 1606, as illustrated in FIG. 16A. The primary condenser 1606 facilitates heat transfer from the hot flow of 110 refrigerant 1626 passes through the primary condenser 1606 to the third air stream 1636. This further heats the third air stream 1636, thereby further decreasing the relative humidity of the third air stream 1636. As an example, if the third air stream 1636 is 65°F / 68% humidity, the primary condenser 1606 can discharge the dehumidified air 1630 at 102°F / 19% humidity. This can cause the refrigerant flow 1626 to partially or completely condense inside the primary condenser 1606. For example, if the refrigerant flow 1626 entering the primary condenser 1606 is 340 psig / 150°F / 100% vapor, the refrigerant flow 1626 may be 340 psig / 105°F / 60% vapor as it leaves the primary condenser 1606. As described above, some embodiments of the 1600 dehumidification system may include a subcooling coil 1622 in the airflow between the secondary condenser 1610 and the primary condenser 1606, as best seen in Figures 16B–16D. The subcooling coil 1622 facilitates heat transfer from the hot refrigerant flow 1626 passing through the subcooling coil 1622 to the third airflow 1636. This further heats the third airflow 1636, thereby further decreasing its relative humidity. For example, if the 111 third airflow 1636 is 65°F / 68% humidity, the sub-cooling coil 1622 can discharge the fourth airflow 1638 at 81°F / 37% humidity. This can cause the refrigerant flow 1626 to partially or completely condense within the subcooling coil 1622. For example, if the refrigerant flow 1626 entering the subcooling coil 1622 is 340 psig / 150°F / 60% vapor, the refrigerant flow 1626 may be 340 psig / 80°F / 0% vapor as it leaves the subcooling coil 1622. In these modes, the fourth airflow 1638 can subject the heat transfer in the primary condenser 1606 to produce the dehumidified airflow 1630. Some versions of the 1600 dehumidification system may include a controller that can incorporate one or more computer systems in one or more locations. Each computer system may include any appropriate input devices (such as a keyboard, touchscreen, mouse, or other device capable of accepting information), output devices, mass storage media, or other components suitable for receiving, processing, storing, and communicating data. Both input and output devices may include fixed or removable storage media such as a magnetic computer disk, CD-ROM, or other media suitable for receiving input from, or 112. To provide output to a user. Each computer system may include a personal computer, workstation, network computer, kiosk, wireless data port, personal data assistant (PDA), one or more processors within these or other devices, or any other suitable processing device. In short, the controller may include any suitable combination of software, firmware, and hardware. The controller may additionally include one or more processing modules. Each processing module may include one or more microprocessors, controllers, or any other suitable computing devices or resources and may operate, either alone or in conjunction with other components of the 1600 dehumidification system, to provide some or all of the functionality described herein. The controller may additionally include (or be communicatively coupled to the wired or wireless communication path) computer memory. Memory may include any memory or database module and may take the form of volatile or non-volatile memory, including, without limitation, magnetic media, optical media, random access memory (RAM), read-only memory (ROM), removable media, or any other suitable local or remote memory component. Although specific implementations of the 1600 dehumidification system are illustrated and described > you 113 NCNN primarily, this description encompasses any suitable implementation of the 1600 dehumidification system, according to specific needs. Furthermore, although several components of the 1600 dehumidification system are depicted as being located in specific positions and in relation to one another, this description considers those components to be positioned in any suitable location, according to specific needs. In this document, a computer-readable non-transient storage medium or media may include one or more semiconductor-based or other integrated circuit (IC) circuits (such as, for example, field-programmable gate arrays (FPGAs) or application-specific ICs (ASICs)), hard disk drives (HDDs), hybrid disk drives (HHDs), optical disks, optical disk drives (ODDs), magneto-optical disks, magneto-optical drives, floppy disks, floppy disk drives (FDDs), magnetic tapes, solid-state drives (SSDs), RAM drives, cards or drives, or any other suitable non-transient or computer-readable storage media, or any suitable combination of two or more of these, where appropriate. A computer-readable non-transient storage medium may be volatile, non-volatile, or a combination of volatile and non-volatile, where appropriate. In the present, it is inclusive and not exclusive, to 114 unless expressly stated otherwise or otherwise indicated by the context. Therefore, herein, A or B means A, B, or both unless expressly stated otherwise or otherwise indicated by the context. Furthermore, and means both joint and separate, unless expressly stated otherwise or otherwise indicated by the context. Therefore, herein, A and B means A and B, jointly or separately, unless expressly stated otherwise or otherwise indicated by the context. The scope of this description covers all changes, substitutions, variations, alterations, and modifications to the example modalities described or illustrated herein that a person of ordinary skill in the technique would understand. The scope of this description is not limited to the example modalities described or illustrated herein.Furthermore, although this description describes and illustrates the respective embodiments herein by including particular components, elements, features, functions, operations, or steps, any of these embodiments may include any combination or permutation of any of the components, elements, features, functions, operations, or steps described or illustrated anywhere herein that a person of ordinary skill in the art would understand. Moreover, the reference in the claims... 115 attached to an apparatus or system or a component of an apparatus or system that is adapted, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, 5 system, component, whether or not that or that particular function is activated, turned on, or unlocked while that apparatus, system, or component is thus adapted, arranged, capable, configured, permitted, operable, or operative. Additionally, although this description describes or illustrates 10 particular modes as providing particular advantages, the particular modes may provide none, some, or all of these advantages.

Claims

1. A dehumidification system, characterized in that it comprises: a dehumidification unit comprising: a primary dosing device; a secondary dosing device; a secondary evaporator operable to: receive a refrigerant flow from the primary dosing device; and receive an inlet air flow and discharge a first air flow, the first air flow comprising air cooler than the inlet air flow, the first air flow being generated by transferring heat from the inlet air flow to the refrigerant flow as the inlet air flow passes through the secondary evaporator; a primary evaporator operable to: receive the refrigerant flow from the secondary dosing device;and receiving the first airflow and discharging a second airflow, the second airflow comprising air cooler than the first airflow, the second airflow being generated by transferring heat from the first airflow to the refrigerant flow as the first airflow passes through the primary evaporator; a secondary condenser operable to: > your NCNNCC ü NC 117 receive the refrigerant flow from the secondary evaporator; and receive the second airflow and discharge a third airflow, the third airflow comprising warmer air with a lower relative humidity than the second airflow, the third airflow being generated by transferring heat from the refrigerant flow to the third airflow as the second airflow passes through the secondary condenser;and a compressor operable to: receive refrigerant flow from the primary evaporator and supply refrigerant flow to a primary condenser, the refrigerant flow supplied to the primary condenser comprising a higher pressure than the refrigerant flow received at the compressor; and a condenser unit comprising: the primary condenser operable to: receive refrigerant flow from the compressor; and transfer heat from the refrigerant flow to a fourth air flow as the fourth air flow makes contact with the primary condenser.

2. The dehumidification system according to claim 1, characterized in that the condenser unit further comprises a subcooling coil operable to: > tu NCNNCC ü 118 N c receive the refrigerant flow from the primary condenser; discharge the refrigerant flow to the primary dosing device; and transfer heat from the refrigerant flow to the first airflow on the outside as the first airflow on the outside makes contact with the subcooling coil.

3. The dehumidification system according to claim 2, characterized in that the subcooling coil and the primary condenser are combined into a single coil unit.

4. The dehumidification system according to claim 1, characterized in that the fourth airflow comprises air that is hotter than the first airflow on the outside.

5. The dehumidification system according to claim 1, characterized in that the dehumidification unit further comprises a subcooling coil operable to: receive the refrigerant flow from the primary condenser; discharge the refrigerant flow to the primary dosing device; and receive the third airflow and discharge a dehumidified airflow, the dehumidified airflow comprising air that is warmer and less humid than the third airflow, the dehumidified airflow being generated by transferring heat from the refrigerant flow to the dehumidified airflow as the third airflow passes through the subcooling coil.

6. The dehumidification system according to claim 1, characterized in that it further comprises a first operable fan for generating the first, second, and third inlet airflows.

7. The dehumidification system according to claim 1, characterized in that two or more members selected from the group consisting of a secondary evaporator, the primary evaporator, the secondary condenser and the sub-cooling coil are combined into a single coil package.

8. The dehumidification system according to claim 1, characterized in that at least one of the primary evaporator and the secondary evaporator comprise two or more circuits for the refrigerant flow.

9. The dehumidification system according to claim 8, characterized in that it comprises at least one of the passive and active dosing devices operable to provide the subdivided flow of refrigerant to at least one of the primary evaporator and the secondary evaporator.

10. The dehumidification system according to claim 8, characterized in that the primary dosing device and the secondary dosing device are operable to provide subdivided refrigerant flow to the primary evaporator and the secondary evaporator.

11. The dehumidification system according to claim 1, characterized in that the dehumidification system is operable to cause the refrigerant to evaporate twice and condense twice in one refrigeration cycle.

12. The dehumidification system according to claim 1, characterized in that the condenser unit further comprises a second operable fan to generate a fourth airflow.

13. The dehumidification system according to claim 12, characterized in that the second fan is operable to generate the fourth airflow at an airflow rate of approximately 2 to approximately 5 times the airflow rate of the first airflow generated by a first fan.

14. A dehumidification system, characterized in that it comprises: a dehumidification unit comprising: 121 a secondary evaporator operable to receive an inlet airflow and discharge a first airflow, the first airflow comprising air cooler than the inlet airflow, the first airflow being generated by transferring heat from the inlet airflow to a refrigerant flow as the inlet airflow passes through the secondary evaporator; a primary evaporator operable to receive the first airflow and discharge a second airflow, the second airflow comprising air cooler than the first airflow, the second airflow being generated by transferring heat from the first airflow to the refrigerant flow as the first airflow passes through the primary evaporator;a secondary condenser operable to receive the second airflow and discharge a third airflow, the third airflow comprising air that is warmer and less humid than the second airflow, the third airflow being generated by transferring heat from the refrigerant flow to the third airflow as the second airflow passes through the secondary condenser; a compressor operable to receive the refrigerant flow from the primary evaporator and provide the refrigerant flow to a condenser unit, the refrigerant flow provided to the condenser unit comprising a higher pressure than the refrigerant flow received at the compressor; and a first fan operable to generate the inlet, first, second, and third airflows; and a condenser unit comprising: a second fan operable to generate a fourth airflow;and the primary condenser operable to: receive the refrigerant flow from the compressor; and transfer heat from the refrigerant flow to the fourth air flow as the fourth air flow makes contact with the primary condenser.

15. The dehumidification system according to claim 14, characterized in that the condenser unit further comprises a sub-cooling coil operable to: receive a refrigerant flow from the primary condenser; discharge the refrigerant flow to the primary dosing device; and transfer heat from the refrigerant flow to a first flow outside as the first air flow outside makes contact with the sub-cooling coil.

16. The dehumidification system according to claim 15, characterized in that the sub-cooling coil and the primary condenser are combined into a single coil unit.

17. The dehumidification system according to claim 15, characterized in that the fourth airflow comprises air that is hotter than the first airflow on the outside.

18. The dehumidification system according to claim 14, characterized in that the dehumidification unit further comprises a subcooling coil operable to: receive a refrigerant flow from the primary condenser; discharge the refrigerant flow to the primary dosing device; and receive the third airflow and discharge a dehumidified airflow, the dehumidified airflow comprising air that is warmer and less humid than the third airflow, the dehumidified airflow being generated by transferring heat from the refrigerant flow to the dehumidified airflow as the third airflow passes through the subcooling coil.

19. The dehumidification system according to claim 14, characterized in that the second fan is operable to generate the fourth airflow at an airflow rate of approximately 2 to 124 times the airflow rate of the first airflow generated by the first fan.

20. The dehumidification system according to claim 14, characterized in that the dehumidification system is operable to cause the refrigerant to evaporate twice and condense twice in one refrigeration cycle.

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