TEMPERATURE CONTROL SYSTEM AND DEVICE AND TEMPERATURE CONTROL METHOD
Patent Information
- Authority / Receiving Office
- MX · MX
- Patent Type
- Patents
- Current Assignee / Owner
- CHANGCHUN JETTY AUTOMOTIVE PARTS CORPORATION
- Filing Date
- 2023-05-16
- Publication Date
- 2026-06-12
Smart Images
Figure MX435496B0
Abstract
Description
This description relates to the technical field of electrical equipment and specifically to a temperature control system for a device and a method of temperature control. BACKGROUND OF THE INVENTION As is well known, a power supply device generates heat when supplying power to a load. To prevent abnormal operation and a reduction in the lifespan of the power supply device caused by increased temperature, heat dissipation measures will be implemented. In the prior art, the temperature of the power supply device is obtained using a temperature acquisition device, and the power supply device is then cooled by means of radiant fins, liquid-cooled radiators, etc. A sampling circuit of the temperature acquisition device typically includes a thermistor, which generates different resistances depending on the temperature change, thus providing the temperature of the power supply device. However, when a large current flows through the thermistor, it generally affects the accuracy of the thermistor's reading; that is, the thermistor cannot quickly detect the temperature change, resulting in inaccurate temperature readings of the power supply device, thereby affecting the operation and lifespan of the power supply device. BRIEF DESCRIPTION OF THE INVENTION In view of the problems in the prior art, the modalities of the present description provide a temperature control system for a device and a method of temperature control, thereby solving, at least partially, the problems in the prior art. In one respect, the present description provides a temperature control system for a device, including a sensing module, a temperature control module, and a temperature adjustment module. The temperature sensing module is configured to detect and obtain the current temperature of a device. The temperature control module is configured to obtain a predicted temperature at a later time based on the current temperature and the temperature prediction model. RO / cnn / pznz / e / Yi / u to issue a temperature adjustment instruction to the temperature adjustment module based on the expected temperature at the next time and a temperature threshold. And the temperature adjustment module is configured to adjust a device temperature based on the temperature adjustment instruction. In another aspect, the present description provides a method of temperature control, including: obtaining a current temperature of a device; obtain a predicted temperature at a later time based on the current temperature and a temperature prediction model, and issue a temperature adjustment instruction to adjust a device temperature based on the predicted temperature at a later time and a temperature threshold. In yet another aspect, the present description provides an electronic device, including a memory, a processor, and a computer program stored in memory and executable by the processor. The processor is configured to execute the program and implement the steps of the temperature control method according to any of the above modalities. In another aspect, the present description provides a computer-readable storage medium containing a computer program. When executed by a processor, the computer program implements the steps of the temperature control method according to any of the above modalities. The temperature control system for the device and the temperature control method provided in the modalities described herein includes a temperature sensing module, a temperature control module, and a temperature adjustment module. The temperature sensing module is configured to detect and obtain the current temperature of the device. The temperature control module is configured to obtain the predicted temperature at a later time based on the current temperature and the temperature prediction model, and to issue a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at a later time and a temperature threshold.The temperature adjustment module is configured to adjust the device temperature based on the temperature adjustment instruction, thereby improving the device's temperature stability during operation, thus ensuring the efficiency of the device's electrical power conversion. BRIEF DESCRIPTION OF THE FIGURES For a clearer illustration of the technical characteristics in the modalities of the present description, a brief description of the figures for the modalities will be given RO / cnn / pznz / e / Yi / u continued. Obviously, the figures described below involve only some modalities of this description. For those skilled in the art, other figures can be derived from these figures without inventive effort. In the figures, Figure 1 illustrates a structural day of a temperature control system for a device according to one modality of the present description. Figure 2 illustrates a structural diagram of a temperature measurement circuit of a thermal resistance according to one modality of the present description. Figure 3 illustrates a structural diagram of a temperature control system for a device according to another modality of the present description. Figure 4 illustrates a structural diagram of a precision temperature detection processing unit according to one modality of the present description. Figure 5 illustrates a structural diagram of a voltage follower circuit according to one modality of the present description. Figure 6 illustrates a structural diagram of a feedback amplifier circuit according to one modality of the present description. Figure 7 illustrates a structural diagram of a filter circuit according to one modality of the present description. Figure 8 illustrates a structural diagram of a temperature control system for a device according to yet another modality of the present description. Figure 9 illustrates a structural diagram of a heating unit according to one modality of the present description. Figure 10 illustrates a structural diagram of a cooling unit according to RO / cnn / pznz / e / Yi / u with a modality of the present description. Figure 11 illustrates a flowchart of an agreement with one modality of the present description. Figure 12 illustrates a flowchart of an agreement with another modality of the present description. Figure 13 illustrates a flow diagram of a method for temperature control according to yet another modality of the present description. Figure 14 illustrates a temperature graph of a device according to one modality of the present description. Figure 15 illustrates a structural entity diagram of an electronic device according to one modality of the present description. Reference numbers: (1): temperature sensing module; (2): temperature control module; (3): temperature adjustment module; (11): temperature sensing unit; (12): temperature sensing processing unit; (31): heating unit; (32): cooling unit; (121): first comparator; (122): first capacitor; (123): second comparator; (124): first capacitor; (125): second capacitor; (126): third capacitor; (127): fourth capacitor; (128): second capacitor; (129): inductor; (311): heating resistor; (312): first MOS transistor; (313): fifth resistor; (314): sixth resistor; (321): second MOS transistor; (322): sixth resistor; (323): radiant fan. DETAILED DESCRIPTION OF THE PREFERRED MODALITIES To more clearly understand the objectives, technical characteristics, and effects of the embodiments described herein, the specific embodiments will now be described with reference to the figures. The embodiments described are intended only to illustrate and schematically explain this invention and do not limit the scope of this description. It should be appreciated that the embodiments described herein and their characteristics may be combined arbitrarily with one another without conflict. The device in the forms described herein includes, but is not limited to, an AC-DC converter, a DC charger, and other devices in a DC charging stack. Figure 1 illustrates a structural diagram of a temperature control system for a device according to one embodiment of the present description. As illustrated in Figure 1, a temperature control system for a device according to one embodiment of the present description includes a temperature sensing module (1), a temperature control module (2), and a temperature adjustment module (3). The temperature detection module (1) is configured to detect and obtain a current temperature reading from the device. The temperature control module (2) is configured to obtain a predicted temperature at a later time based on the current temperature and a temperature prediction model, and to issue a temperature adjustment instruction to the temperature adjustment module (3) based on the predicted temperature at the later time and a temperature threshold. The temperature adjustment module (3) is configured to adjust the device temperature based on the temperature adjustment instruction. Specifically, the temperature detection module (1) detects the device's temperature in real time to obtain the current device temperature and then sends this temperature to the temperature control module (2). The temperature control module (2) sends the received current temperature to the temperature prediction model to obtain the predicted temperature at a later time and then receives the temperature adjustment instruction based on the predicted temperature at a later time and the temperature threshold. If there is a difference obtained by subtracting the temperature threshold from the predicted temperature at a later time, the temperature adjustment instruction is applied. If the expected temperature (RO / cnn / pznz / e / Yi / u) is greater than a first threshold, the temperature adjustment instruction causes the temperature adjustment module (3) to cool the device. If the expected temperature at the next time is less than the temperature threshold, and a second difference obtained by subtracting the expected temperature from the temperature threshold is greater than a second threshold, the temperature adjustment instruction (3) causes the device to heat up. The temperature control module (2) issues the temperature adjustment instruction to the temperature adjustment module (3), which adjusts the device temperature based on the received temperature adjustment instruction. The temperature threshold is preset depending on actual needs, which are not limited by the modalities described herein. The temperature adjustment instruction is preset.A time interval between the current moment and the later moment is established depending on the actual needs, which are not limited in the modalities of the present description. The temperature control system for the device, according to the modality described herein, includes a temperature detection module, a temperature control module, and a temperature adjustment module. The temperature detection module is configured to detect and obtain the device's current temperature. The temperature control module is configured to obtain the predicted temperature at the next time based on the current temperature and the temperature prediction model, and to issue a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the next time and the temperature threshold.The temperature adjustment module is configured to adjust the device's temperature based on the temperature setting instruction, thereby improving temperature stability during operation and ensuring efficient power conversion. Furthermore, since the device's temperature is adjusted based on the anticipated future temperature, it can be compensated for, thus enabling pre-regulation of the device's temperature. Based on the above methods, the temperature prediction model is also obtained beforehand. Specifically, the temperature control module can collect historical temperature training data from the device, train and obtain a temperature prediction model based on this historical training data and an initial model, and configure the resulting temperature prediction model within the temperature control module. The initial model includes, but is not limited to, a neural network model and is configured according to actual needs, which are not limited in this description. Based on the above methods, the temperature prediction model is obtained RO / cnn / pznz / e / Yi / u through self-learning based on historical temperature data. Specifically, the temperature control module can collect historical device temperature data and generate a temperature prediction model through machine learning based on that historical data. This machine learning can be implemented using a machine learning model and is configured according to actual needs, which are not limited to the modalities described here. It is understood that since the device's temperature data is continuously updated, the historical temperature data can be updated periodically and the temperature prediction model can be obtained through self-learning again. For example, historical temperature data is used to develop the temperature prediction model by training it based on this historical temperature data and the initial model. Then, the historical temperature data is periodically updated as the temperature training data, and the temperature prediction model is again developed by training it based on this historical temperature data and the initial model. Based on the above modalities, and as illustrated in Figure 3, the temperature sensing module (1) includes a temperature sensing unit (11), which is a thermocouple temperature measuring circuit, a thermal resistance temperature measuring circuit, or a temperature acquisition chip, to perform temperature sensing for the device. The temperature acquisition chip is selected depending on the actual requirements, which are not limited by the modalities described herein. Figure 2 illustrates a structural diagram of a thermal resistance temperature measurement circuit according to one embodiment of the present description. As illustrated in Figure 2, based on the previous embodiments, the thermal resistance temperature measurement circuit according to the embodiment of the present description further includes a resistor R1, a capacitor C1, and a thermistor TH1. Resistor R1 has one end connected to the power supply VCC and one end connected to the first terminal of capacitor C1 and the first terminal of thermistor TH1, respectively. The second terminal of capacitor C1 and the second terminal of thermistor TH1 are connected to ground. The thermocouple temperature measurement circuit can be configured as a circuit structure similar to that illustrated in Figure 2, simply by replacing the thermistor TH1 in Figure 2 with a thermocouple. Figure 3 illustrates a structural diagram of a temperature control system for a device according to another embodiment of the present description. Figure 4 illustrates a RO / cnn / pznz / e / Yi / u Structural diagram of a temperature detection precision processing unit according to one modality of the present description. As illustrated in Figure 3 and Figure 4, based on the above modalities, in addition, the temperature detection module (1) includes a temperature detection precision processing unit (12) which includes a voltage follower circuit, a feedback amplifier circuit, and a filter circuit. The voltage follower circuit includes a first comparator (121) and a first capacitor (122). The first capacitor (121) has a first end connected to the temperature sensing unit (11), a second end connected to an output terminal of the first comparator (121), a third end connected to a first power supply VCC1, and a fourth end connected to ground. The first capacitor (122) has a first end connected to ground and a second end connected to the first power supply VCC1. The feedback amplifier circuit includes a second comparator (123), a first resistor (124), a second resistor (125), and a third resistor (126). One end of the first resistor (124) is connected to the output terminal of the first comparator (121). One end of the first resistor (124) is connected to the second terminal of the second comparator (123). One end of the second comparator (123) is connected to the first terminal of the third resistor (126) and the second terminal of the second resistor (125), respectively. One end of the third resistor (126) is connected to the output terminal of the second comparator (123). One end of the second resistor (125) is connected to ground. One end of the second comparator (123) is connected to the first power supply VCC1, and one end of the second comparator (123) is connected to ground. The filter circuit includes a fourth resistor (127), a second capacitor (128), and an inductor (129). One end of the fourth resistor (127) is connected to the output terminal of the second comparator (123). One end of the fourth resistor (127) is connected to the first terminal of the second capacitor (128) and one end of the inductor (129), respectively. One end of the second capacitor (128) is connected to ground. One end of the inductor (129) is connected to the temperature control module (2). The voltage follower circuit is used to isolate the acquisition circuit from a subsequent processing unit. The feedback amplifier circuit is used to amplify the small isolated signal proportionally to improve accuracy. The filter circuit is used for signal filtering and to eliminate line conduction interference. The precision temperature sensing processing unit improves the accuracy of the device's temperature acquisition. Figure 5 illustrates a structural diagram of a voltage follower circuit according to one embodiment of the present description. As illustrated in Figure 3 and Figure 5, based RO / cnn / pznz / e / Yi / u of the above modalities, in addition, the temperature detection module (1) includes a temperature detection precision processing unit (12) including a voltage follower circuit. The voltage follower circuit includes a first comparator (121) and a first capacitor (122). The first comparator (121) has a first terminal connected to the temperature sensing unit (11), a second terminal connected to an output terminal of the first comparator (121), a third terminal connected to the first power supply VCC1, and a fourth terminal connected to ground. The first capacitor (122) has a first terminal connected to ground and a second terminal connected to the first power supply VCC1. An output terminal of the first comparator (121) can be connected to the temperature control module (2). Figure 6 illustrates a structural diagram of a feedback amplifier circuit according to one embodiment of the present description. As illustrated in Figure 3 and Figure 6, based on the above embodiments, the temperature sensing module (1) further includes a temperature sensing precision processing unit (12) including a feedback amplifier circuit. The feedback amplifier circuit includes a second comparator (123), a first resistor (124), a second resistor (125), and a third resistor (126). One end of the first resistor (124) is connected to one end of the second comparator (123). One end of the second comparator (123) is connected to the first end of the third resistor (126) and the second end of the second resistor (125), respectively. One end of the third resistor (126) is connected to one output end of the second comparator (123). One end of the second resistor (125) is connected to ground. One end of the second comparator (123) is connected to the first power supply VCC1. One end of the second comparator (123) is connected to ground. One end of the first resistor (124) can be connected to the temperature sensing unit (11).One output end of the second comparator can be connected to the temperature control module (2). Figure 7 illustrates a structural diagram of a filter circuit according to one embodiment of the present description. As illustrated in Figure 3 and Figure 7, based on the above embodiments, the temperature sensing module (1) further includes a temperature sensing precision processing unit (12) including a filter circuit. The filter circuit includes a fourth resistor (127), a second capacitor (128), and an inductor (129). One end of the fourth resistor (127) is connected to one end of the second capacitor (128) and one end of the inductor (129), respectively. One end of the second capacitor (128) is connected to ground. One end of the inductor (129) is connected to the temperature control module (2). RO / cnn / pznz / e / Yi / u fourth resistor (127) can be connected to the temperature detection unit (11). Figure 8 illustrates a structural diagram of a temperature control system for a device according to another embodiment of the present description. As illustrated in Figure 8, based on the previous embodiments, the temperature adjustment module (3) further includes a heating unit (31) configured to heat the device to increase its temperature, and a cooling unit (32) configured to cool the device to decrease its temperature. The temperature control system for the device according to a modality of the present description can increase and decrease the temperature of the device by means of the temperature adjustment module and is suitable for all types of climate. Specifically, for an outdoor device, it is necessary to cool the device in summer and heat the device in winter to ensure the efficiency of the device's electrical energy conversion. Based on the above methods, the heating unit (31) can also perform heating by means of a heating resistance, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, stainless steel electric heating tube, circulating air duct heating control, or chemical reagent reaction heating, etc. The heating element, copper electric heating plate, aluminum electric heating plate, ceramic electric heating element, and stainless steel electric heating tube can work in conjunction with a MOS transistor for temperature adjustment and heating control, and air is supplied by a fan. The principle of circulating air duct heating involves controlling the opening and closing of an air duct for cooling air; that is, closing an outlet of the air duct when heating is needed, so that the hot air around the electronic component circulates within the device to provide heat to any other electronic component that does not generate heat, instead of drawing it out of the device.The chemical reagent heating system is designed to house a separate unit within the device. The reaction temperature is controlled by regulating the amount of chemical reagent fed into the unit, and the heat is then transferred, via a fan, to the electronic component in the device, which requires temperature compensation. The chemical reagents can be, for example, CaO and H₂O, which react with each other to produce CaOH₂, generating heat in the process. Figure 9 illustrates a structural diagram of a heating unit according to one embodiment of the present description. As illustrated in Figure 9, the heating unit (31) includes a heating resistor (311), a first MOS transistor (312), a fifth resistor (313), and a sixth resistor (314). A first end of a heating resistor (311) is connected to a second supply RO / cnn / pznz / e / Yi / u of power VCC2. A second end of the heating resistor (311) is connected to a drain of the first MOS resistor (312). A gate of the first transistor (312) is connected to a first end of the fifth resistor (313) and a first end of the sixth resistor (314), respectively. A source of the first MOS transistor (312) and a second end of the fifth resistor (313) is connected to ground. A second end of the sixth resistor (314) is connected to the temperature control module (2). When the device needs to be heated, its temperature can be increased by heating the heating element (311). The heating element can be replaced with a copper electric heating plate, an aluminum electric heating plate, ceramic electric heating, a stainless steel electric heating tube, circulating air duct heating control, or chemical reagent reaction heating. Based on the above methods, the cooling unit (32) can also be cooled by means of liquid circulation cooling, metal heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling, or radiant fan cooling, etc. Liquid circulation cooling is implemented by using a coolant as the medium, which removes heat through circulation and then discharges the excess heat from the device via the radiator and radiant fan.Metal heat pipe and graphite sheet conduction cooling involve attaching a heat-conducting material (metal or graphite) to the surface of a heat-generating component. Excess air is then blown through an exhaust duct by a radiant fan to dissipate the heat from the device. Semiconductor cooling involves connecting a semiconductor to a power supply to energize it. One cold end is near a heat-generating component, and the hot end is near a radiant fan. The heat is then discharged from the device to achieve heat dissipation.Chemical reagent cooling involves arranging a separate, enclosed chemical reagent unit within the device, so that excess heat around a heat-generating electrical component can be reduced by absorbing heat from the environment through the chemical reaction to cool the device. Figure 10 illustrates a structural diagram of a cooling unit according to one embodiment of the present description. As illustrated in Figure 10, based on the previous embodiments, the cooling unit (32) further includes a second MOS transistor (321), a fifth resistor (322), and a radiant fan (323). One end of the seventh resistor (322) and one drain of the second MOS transistor (321) are connected to a third power supply VCC3. One gate of the second MOS transistor (321) and one end of the seventh resistor (322) are connected to the module RO / cnn / pznz / e / Yi / u temperature control (2). A source of the second MOS transistor (321) is connected to a first end of the radiant fan (323). A second end of the radiant fan (323) is connected to ground. When the device needs to be cooled, its temperature can be lowered by means of the radiant fan (323). It is understood that the temperature can also be lowered in other ways such as cooling water, which are selected depending on the actual situation and are not limited to the modes described herein. Based on the above modalities, in addition, the temperature control module (2) is a microprocessor, a Field Programmable Gate Array (FPGA), or a Complex Programmable Logic Device (CPLD). For example, an analog quantity acquisition pin of a microprocessor's analog-to-digital converter is connected to the second end of the inductor (129) in the filter circuit, so that a current temperature reading is obtained at an output via the temperature sensing module (1). A first output pin from the microprocessor's control is connected to the second end of the seventh resistor (322) and the gate of the second MOS transistor (321), respectively, so that a temperature adjustment instruction is issued to control the fan (323) to rotate for cooling. A second output pin from the microprocessor's control is connected to the second end of the sixth resistor (314), so that a temperature adjustment instruction is issued to control the heating element (311) to heat. The modalities of the present description provide a charging system, including the temperature control system for the device described in any of the above modalities. The application scenarios for the temperature control system for the device, according to the modalities described herein, will be described below with the specific modality. The device is an AC-DC converter located in the charging stack capable of charging an electric vehicle, and the temperature control system for the device, according to the modalities described herein, is configured for the AC-DC converter in the charging stack. When the charging station is located outdoors in northeastern China, the climate is cold in winter with low outdoor temperatures and hot in summer with high outdoor temperatures. When the electric vehicle is charged using the charging station in winter, the AC-DC converter needs to be heated due to the low outdoor temperature. The temperature sensing module (1) can collect the current temperature of the AC-DC converter in real time. The temperature control module (2) obtains a predicted temperature for the AC-DC converter at a later time based on the current temperature and a temperature prediction model, and issues a temperature adjustment command to the The temperature adjustment module (3) is based on the predicted temperature and the temperature threshold. The temperature adjustment module (3) heats the AC-DC converter to ensure it operates within a certain temperature threshold range. When the electric vehicle is charged with the battery pack in summer, the AC-DC converter needs to be cooled due to the high ambient temperature and the fact that its temperature increases during operation. The temperature sensing module (1) can collect the current temperature of the AC-DC converter in real time.The temperature control module (2) obtains a predicted temperature for the AC-DC converter based on the current temperature and a temperature prediction model, and issues a temperature adjustment instruction to the temperature adjustment module (3) based on the predicted temperature and a temperature threshold. The temperature adjustment module (3) cools the AC-DC converter to operate it within a certain temperature threshold range. In a case where the charging station is located outdoors in the Xinjiang region of China, with a large temperature difference between day and night, when the electric vehicle is charged at midday, the temperature control system cools the AC-DC converter due to the high ambient temperature, thus ensuring its operation within a certain temperature threshold range. When the electric vehicle is charged at night, the temperature control system warms the AC-DC converter due to the low ambient temperature, thus ensuring its operation within a certain temperature threshold range. Figure 11 illustrates a flowchart of a temperature control method according to one embodiment of the present description. As illustrated in Figure 11, the temperature control method according to one embodiment of the present description can be applied to the temperature control system for the described device in any of the above embodiments, including: S801: obtaining a current temperature of a device. Specifically, a temperature detection module can detect a device's temperature in real time to obtain the device's current temperature and then send the current temperature to a temperature control module, which can receive the current temperature. S802: Obtain a predicted temperature at the later time based on the temperature at the later time and a temperature prediction model. Specifically, the temperature control module inputs the current temperature into the temperature prediction model to obtain a temperature RO / cnn / pznz / e / Yi / u predicted at the device's later time. The temperature prediction model can be obtained by training based on historical temperature data. S803: Issue a temperature setting instruction to adjust a device temperature based on the expected temperature at the later time and a temperature threshold. Specifically, the temperature control module can obtain a temperature adjustment instruction based on the predicted temperature obtained at the later time and a temperature threshold, and then send the temperature adjustment instruction to the temperature adjustment module, which adjusts a device temperature based on the temperature adjustment instruction. For example, the temperature control module issues a temperature adjustment instruction to decrease the device temperature after determining that the predicted temperature at a later time is greater than the temperature threshold, and the first difference obtained by subtracting the predicted temperature at a later time from the temperature threshold is greater than the first threshold. The temperature control module issues a temperature adjustment instruction to increase the device temperature after determining that the predicted temperature at a later time is less than the temperature threshold, and the second difference obtained by subtracting the predicted temperature at a later time from the temperature threshold is greater than a second threshold. The temperature control method described herein obtains the device's current temperature, calculates the predicted temperature at a later time based on the current temperature and the temperature prediction model, and issues a temperature adjustment instruction to set the device's temperature based on the predicted temperature at a later time and the temperature threshold. This improves the device's temperature stability during operation, thereby ensuring the efficiency of the device's electrical energy conversion. Furthermore, since the device's temperature is adjusted based on the predicted temperature at a later time, the predicted temperature can be compensated for, thus enabling pre-regulation of the device's temperature. Based on the above methods, the temperature prediction model is also obtained beforehand. Specifically, the temperature control module can collect historical temperature data from the device, train the temperature prediction model based on this historical data and an initial model, and configure the resulting prediction model within the temperature control module. The initial model includes, but is not limited to, a neural network model and is configured based on current needs, which are not limited to the specific requirements outlined herein. RO / cnn / pznz / e / Yi / u description. Building on the previous methods, the temperature prediction model is further obtained through self-learning based on historical temperature data. Specifically, the temperature control module can collect historical temperature data from the device and generate a temperature prediction model through machine learning based on that data. This machine learning can be implemented using a machine learning model and is configured according to actual needs, which are not limited to the modalities described here. It is understood that since the device's temperature data is continuously updated, the historical temperature data can be updated periodically and the temperature prediction model can be obtained through self-learning again. Figure 12 illustrates a flowchart of a temperature control method according to another modality of the present description. As illustrated in Figure 12, the temperature prediction model is obtained by training based on historical temperature data, and the steps to obtain the temperature prediction model by training based on historical temperature data include: S901: Obtain the historical temperature data. Specifically, when the device operates normally, its temperature is collected at unit time intervals within a preset period to obtain a device temperature at each point in time. The server can obtain the temperature at each point in time as historical temperature data, which includes a temperature at a given moment and a temperature at time a+1, where a is a positive integer less than the number of data points in the historical temperature data. The number of data points in the historical temperature data is determined based on actual experience, which is not limited by the modes described herein. The preset period is determined based on actual needs, which are not limited by the modes described herein.The unit time interval can be set as 1 to 3 seconds according to actual experiences, which are not limited in the modalities of the present description. S902: Obtain the temperature prediction model by training based on historical temperature data and an initial model. Specifically, the server can split historical temperature data into a training set and a verification set. By taking a temperature at time b in the training set as input data and a temperature at time b+1 as output data, the initial model can be trained to obtain a temperature prediction model, where b is a positive integral less than or equal to b+1. RO / cnn / pznz / e / Yi / u number d data points in the training set. By taking a temperature at time f in the verification set as input data and feeding it into the prediction model to be determined, a predicted temperature at time f+1 can be output, where f is a positive integer less than or equal to the number of data points in the verification set. The temperature at the later time of each moment in the training set is compared with the corresponding predicted temperature, and if the absolute value of the difference between them is less than or equal to a deviation threshold, the predicted temperature is accurate; otherwise, the predicted temperature is not accurate. By counting the number of accurate and inaccurate predicted temperatures at each time in the verification set, a prediction accuracy of the temperature prediction model can be calculated.If the prediction accuracy exceeds a certain threshold, the resulting temperature prediction model will be adopted. Otherwise, the parameters and / or historical temperature data must be adjusted to retrain the model. The initial model includes, but is not limited to, a neural network model. The deviation threshold is established based on real-world experience, which is not limited to the scope of this description. The accuracy threshold is also established based on real-world experience, which is not limited to the scope of this description. For example, the initial model is a three-layer neural network model, which can be expressed as follows: 7n / T' x(t + 1) = v¿g ( J a>i(t)f(xt)dt — θ·\ — Θ where x(t + 1) represents a predicted temperature at time t+1, m represents the number of hidden layer nodes, v¡ represents a connection weight from a hidden layer node i-th to an output node, & represents a fine-tuning coefficient, C°' represents a connection weight function that corresponds to the hidden layer node i-th;,=1) where v represents a temperature at time t, T represents the number of samples; (y,-1.(16)2 / (A'z) 0.982í where L' represents the temperature at time t, represents a hidden layer i-th neuronal threshold, $ represents an output layer neuronal threshold, ei is a positive integer less than or equal to m. The m is set depending on current needs (e.g., set as 5 or 6), which is not limited in the modalities of the present description. The es is set depending on actual needs (e.g., set as 1), which is not limited in the modalities of the present description. For example, it can be established that the number m of hidden layer nodes is 6, the initial value of the connection weight v, from the hidden layer node to the output node is 0.01, the initial value RO / cnn / pznz / e / Yi / uq The hidden layer neuronal threshold ' is 0.002, the initial value of the hidden layer neuronal threshold $ is 0.03, the learning rate is 0.07 to 0.22, and the number of samples of historical temperature data is 49 to 130. The temperature prediction model obtained through training with the three-layer neural network model has high efficiency and prediction accuracy. Figure 13 illustrates a flowchart of a temperature control method according to yet another embodiment of the present description. As illustrated in Figure 13, based on the above embodiments, furthermore, issuing a temperature adjustment instruction to adjust the device temperature based on the predicted later time temperature and a temperature threshold includes: S8031: issuing the temperature adjustment instruction to decrease the device temperature, if it is determined that the predicted later time temperature is greater than the temperature threshold and a first difference obtained by subtracting the temperature threshold from the predicted later time temperature is greater than a first threshold. Specifically, the temperature control module compares the predicted temperature at a later time with the temperature threshold. If the predicted temperature at a later time is higher than the temperature threshold, a first difference is calculated by subtracting the temperature threshold from the predicted temperature at a later time and then comparing it to the first threshold. If the first difference is greater than the first threshold, it means that the predicted temperature at a later time is too high and the temperature must be lowered. In this case, a temperature adjustment instruction can be issued to lower the device's temperature, thus controlling the temperature at a later time in advance. For example, the temperature control module can send a temperature adjustment instruction to the cooling unit of the temperature adjustment module to lower the device's temperature, so that the actual temperature at the later time is lower than the predicted temperature at the later time, thus meeting the operating temperature requirements of the device and achieving the purpose of pre-regulating the device's temperature. S8032: Issue the temperature adjustment instruction to increase the device temperature if the predicted temperature at the next time is determined to be lower than the temperature threshold, and a second difference, calculated by subtracting the predicted temperature at the next time from the temperature threshold, is greater than the second threshold. Specifically, the temperature control module compares the predicted temperature at the next time with the temperature threshold, and if the predicted temperature at the next time is lower than the temperature threshold, a second difference is calculated by subtracting the temperature threshold from the predicted temperature at the next time. RO / cnn / pznz / e / Yi / u compared to a second threshold. If the second difference is greater than the second threshold, it means that the expected temperature at the next moment is too low and the temperature should be increased. In this case, the temperature adjustment instruction can be issued to increase the device temperature, thus controlling the temperature at the next moment in advance. For example, the temperature control module can send a temperature adjustment instruction to the heating unit of the temperature adjustment module to increase the device's temperature, so that the actual temperature at the later time is higher than the predicted temperature at the later time, thereby meeting the operating temperature requirements of the device and achieving the purpose of pre-regulating the device's temperature. Figure 14 illustrates a temperature graph of a device according to one embodiment of the present description. As illustrated in Figure 14, a temperature control method according to one embodiment of the present description is adopted to control a device temperature, and 65°C is a device temperature threshold, i.e., an ideal operating temperature. As can be seen from Figure 14, the actual temperature fluctuation range around 65°C after adjustment at time t+1 is much smaller than the expected temperature range around 65°C at time t+1, which greatly improves the temperature stability of the device during operation. Figure 15 illustrates a structural entity diagram of an electronic device according to one embodiment of the present description. As illustrated in Figure 15, an electronic device (600) may include a processor (100) and a memory (140). The memory (140) is coupled to the processor (100). The processor (100) may call a logical instruction on the memory (140) to perform the following method: obtain a current temperature of a device; obtain a predicted temperature at a later time based on the current temperature and a temperature prediction model obtained through training based on historical temperature data; and issue a temperature adjustment instruction to adjust the device's temperature based on the predicted temperature at a later time and a temperature threshold. This modality describes a computer program product including a computer program stored on a non-transient, computer-readable storage medium, and the computer program includes a program instruction. When the program instruction is executed by a computer, the computer can implement methods according to the modalities of the previous method, including, for example, obtaining a current temperature of a device, obtaining a predicted temperature at a later time based on the current temperature, and a predictive model. RO / cnn / pznz / e / Yi / u of temperature obtained through training based on historical temperature data and issue a temperature setting instruction to adjust a device temperature based on the expected temperature at the later time and a temperature threshold. This mode provides a computer-readable storage medium that stores a computer program. When executed by a processor, the computer program implements methods according to the modes of the previous method, including, for example, obtaining the current temperature of a device; obtaining a predicted temperature at a later time based on the current temperature and a temperature prediction model obtained through training based on historical temperature data; and issuing a temperature adjustment instruction to adjust the device's temperature based on the predicted temperature at a later time and a temperature threshold. As illustrated in Figure 15, the electronic device (600) may further include a communication module (110), an input unit (120), an audio processing unit (130), a display (160), and a power supply (170). It should be noted that the electronic device (600) does not necessarily include all the components illustrated in Figure 15. Furthermore, the electronic device (600) may also include a component not illustrated in Figure 15, for which reference may be made to the prior art. It should be noted that Figure 15 is an example, and any other type of structure may also be adopted to complement or replace the structure shown to perform the telecommunication function or other functions. As illustrated in Figure 15, the processor (100) is sometimes called a controller or operating control and may include a microprocessor or any other processor and / or logic device. The processor (100) receives input and controls the operations of various components of the electronic device (600). The memory (140) can be, for example, one or more buffers, flash memory, a hard disk, removable media, volatile memory, non-volatile memory, or any other suitable device. The memory can store fault-related information and a program to execute the relevant information. Furthermore, the processor (100) can be configured to execute the program stored in memory (140) to perform information storage or processing, etc. The input unit (120) is configured to provide input to the processor (100). The input unit (120) is, for example, a key or a touch input device. The power supply (170) is configured to supply power to the electronic device (600). The display (160) is configured to display a display object such as an image or text, etc. The display (160) can be, for example, an LCD screen, but it is not RO / cnn / pznz / e / Yi / u limits this. Memory (140) can be solid-state memory, for example, read-only memory (ROM), random-access memory (RAM), a SIM card, etc. It can also be memory that retains information even when power is turned off and can be selectively erased and fed with more data. An example of memory (140) is sometimes called ERROM, etc. Memory (140) can also be another type of device. Memory (140) includes a buffer (141) (also called buffer memory). Memory (140) may include an application / function storage section (142) configured to store application programs and function programs or to execute the flow of operation of the electronic device (600) by the processor (100). The memory (140) may also include a data storage section (143) which stores data such as contacts, digital data, images, sounds, and / or any other data used by the electronic device. A processor storage section (144) within the memory (140) may include various processor programs for the communication function and / or other functions (e.g., messaging application, directory application, etc.) of the electronic device. The communication module (110) includes a transmitter / receiver which transmits and receives signals through an antenna (111). The communication module (110) is coupled to the processor (100) to provide an input signal and receive an output signal, which can be the same as in the case of a conventional mobile communication terminal. Based on different communication technologies, a plurality of communication modules (110), such as a cellular network module, a Bluetooth module, and / or a wireless local area network module, can be provided in a single electronic device. The communication module (110) is further coupled to a speaker (131) and a microphone (132) via an audio processor (130) to provide audio output through the speaker (131) and receive audio input from the microphone (132), thereby performing the general telecommunications function. The audio processor (130) may include any buffer, decoder, amplifier, etc. Furthermore, the audio processor (130) is also coupled to the processor (100) so that audio can be recorded locally through the microphone (132) and the locally stored sound can be played back through the speaker (131). Those skilled in the art should understand that the modalities described herein can be provided as methods, systems, or software products. Therefore, this description can be implemented in the form of all-hardware modalities or combined software-hardware modalities. Furthermore, this description can take the form of a software product implemented on one or more computer storage media (including, but not limited to, disk memory, CD-ROM, and memory). RO / cnn / pznz / e / Yi / u optical) containing computer programming code. This description is established by reference to the flowcharts and / or block diagrams for the methods, devices (systems), and products of the software program for the modalities. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or sections in the flowcharts and / or block diagrams, can be implemented using instructions from the software program.These computer program instructions can be provided to general-purpose computers, special-purpose computers, embedded processors, or processors of other programmable data processing devices to produce a machine, in such a way that an apparatus for implementing the functions designated in one or more processes of the flowcharts and / or one or more blocks of the block diagrams can be produced by the instructions executed by the computer processor or other programmable data processing device. These computer program instructions can also be stored on a computer-readable storage medium which can guide a computer and other programmable data processing device to operate in a specific manner, such that an article or manufacture including an instruction apparatus can be produced by the instructions stored on the storage medium, with the instruction apparatus implementing the designated functions in one or more flowchart processes and / or one or more block diagram blocks. These computer program instructions can also be loaded into a computer or other programmable data processing device to cause the computer or other programmable data processing device to perform a sequence of computer-implemented operations, such that the instructions executed by the computer or other programmable data processing device perform one or more processes from the flowcharts and / or one or more blocks from the block diagram. In this description, references to terms such as “a modality,” “a specific modality,” “some modalities,” “for example,” “an example,” “a specific example,” or “some examples” mean that the specific functions, structures, materials, or characteristics described in connection with the modality(ies) or example(s) are included in at least one modality or example of this description. Schematic representations of the above terms in this description do not necessarily refer to the same modality or example. Furthermore, the specific functions, structures, materials, or characteristics described may be combined in any or more modalities or examples in an appropriate manner. The purpose, technical characteristics, and technical effects of this description have been further described previously by means of some RO / cnn / pznz / e / Yi / u modalities. It should be understood that the modalities are intended to facilitate the understanding of the principles of this description, rather than limit its scope. Any modifications, alterations, improvements, etc., made by those skilled in the art without departing from the concepts and principles of this description will fall within its scope.
Claims
1. The temperature control system for a device, comprising a temperature detection module, a temperature control module, and a temperature adjustment module, wherein the temperature detection module is configured to detect and obtain a current temperature of a device; the temperature control module is configured to obtain a predicted temperature at a later time based on the current temperature and a temperature prediction model, and issue a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the later time and a temperature threshold; and the temperature adjustment module is configured to adjust a temperature of the device based on the temperature adjustment instruction.
2. The temperature control system according to claim 1, wherein the temperature prediction model is obtained through self-learning based on historical temperature data.
3. The temperature control system according to claim 1, wherein the temperature prediction model is obtained beforehand.
4. The temperature control system according to claim 1, wherein the temperature detection module comprises a temperature detection unit which is a thermocouple temperature measuring circuit, a thermal resistance temperature measuring circuit, or a temperature acquisition chip.
5. The temperature control system according to claim 4, wherein the temperature sensing module further comprises a temperature sensing precision processing unit comprising a voltage follower circuit, wherein the voltage follower circuit comprises a first comparator and a first capacitor, the first comparator comprising a first end connected to the temperature sensing unit, a second end connected to an output end of the first comparator, a third end connected to a first power supply, and a fourth end connected to ground, and the first capacitor comprising a first end connected to ground and a second end connected to the first power supply.
6. The temperature control system according to claim 4, wherein the temperature sensing module comprises a temperature sensing precision processing unit comprising a feedback amplifier circuit, wherein the feedback amplifier circuit comprises a second comparator, a first resistor, a second resistor, and a third resistor, wherein a second end of the first resistor is connected to a second end of the second comparator, a first end of the second comparator is connected to an output end of the second comparator and a second end of the second resistor, respectively, a first end of the second resistor is connected to ground, a third end of the second comparator is connected to the first power supply, and a fourth end of the second comparator is connected to ground.
7. The temperature control system according to claim 4, wherein the temperature sensing module further comprises a temperature sensing precision processing unit comprising a filter circuit, wherein the filter circuit comprises a fourth resistor, a second capacitor, and an inductor, wherein a second end of the fourth resistor is connected to a first end of the second capacitor and a first end of the inductor, respectively, a second end of the second capacitor is grounded, and a second end of the inductor is connected to the temperature control module.
8. The temperature control system according to claim 1, wherein the temperature adjustment module comprises a heating unit and a cooling unit.
9. The temperature control system according to claim 8, wherein the heating unit performs heating by means of a heating element, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, stainless steel electric heating tube, circulating air duct heating control, or chemical reagent reaction heating.
10. The temperature control system according to claim 8, wherein the heating unit comprises a heating resistor, a first MOS transistor, a fifth resistor, and a sixth resistor, wherein a first end of the heating resistor is connected to a second power supply, a second end of the heating resistor is connected to a drain of the first MOS transistor, a gate of the first MOS transistor is connected to the first end of the fifth resistor and a first end of the sixth resistor, respectively, a source of the first MOS transistor and a second end of the fifth resistor are connected to ground, and a second end of the sixth resistor is connected to the temperature control module.
11. The temperature control system according to claim 8, wherein the cooling unit performs cooling by means of liquid circulation cooling, metallic heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling, or radiant fan. RO / cnn / pznz / e / Yi / u 12. The temperature control system according to claim 8, wherein the cooling unit comprises a second MOS transistor, a seventh resistor, and a radiant fan, wherein a first end of the seventh resistor and a drain of the second MOS resistor are connected to the third power supply, a gate of the second MOS resistor and a second end of the seventh resistor are connected to the temperature control module, a source of the second MOS transistor is connected to the first end of the radiant fan, and a second end of the radiant fan is connected to ground.
13. The temperature control system according to any of claims 1 to 12, wherein the temperature control module is a microprocessor, a field-programmable gate array, or a complex programmable logic device.
14. A charging system, comprising the temperature control system for the device according to any of claims 1 to 13.
15. A temperature control method comprising: obtaining a current temperature of a device; obtaining a predicted temperature at a later time based on the current temperature and time; and issuing a temperature setting instruction to adjust a device temperature based on the predicted temperature at the later time and a temperature threshold.
16. The method according to claim 15, wherein the temperature prediction model is obtained by self-learning based on historical temperature data.
17. The method according to claim 15, wherein the temperature prediction model is obtained beforehand.
18. The method according to claim 15, wherein the temperature prediction model is obtained by training based on historical temperature training data, comprising: obtaining historical temperature training data; obtaining the temperature prediction model by training based on historical temperature training data and an initial model.
19. The method according to any of claims 15 to 18, wherein issuing the temperature setting instruction to adjust the device temperature based on the predicted temperature at the next time and the temperature threshold comprises: issuing the temperature setting instruction to decrease the device temperature, if it is determined that the predicted temperature at the next time is greater than the temperature threshold and a first difference obtained by subtracting the predicted temperature at the next time from the temperature threshold is greater than the first threshold; and issuing the temperature setting instruction to increase the device temperature, if it is determined that the predicted temperature at the later time is less than the temperature threshold and a second difference obtained by subtracting the predicted temperature at the next time from the temperature threshold is greater than a second threshold.
20. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor is configured to execute the computer program to implement the steps of the method according to any one of claims 15 to 19.
21. A computer-readable storage medium that stores a computer program, wherein when being executed by a processor, the computer program implements the steps of the method according to any one of claims 15 to 19.