Electronic device

Abstract

Disclosed in the present invention is an electronic device, comprising a housing (100), a first functional module (210), a second functional module (220), and a third functional module. The third functional module is provided in the housing (100), and comprises an acoustic device (230); a sound guide channel (400) is provided in the housing (100); the second functional module (220) and the first functional module (210) are mounted on the housing (100), and an assembly gap (221) is provided between the second functional module (220) and the first functional module (210); the acoustic device (230) is communicated with the assembly gap (221) by means of the sound guide channel (400).

Description

electronic devices

[0001] Cross-references

[0002] This application claims priority to Chinese Patent Application No. 202010234120.3, filed on March 27, 2020, entitled “Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of communication technology, and more particularly to an electronic device. Background Technology

[0004] Smartphones, tablets, and other electronic devices have become indispensable products in modern life. Electronic devices typically contain acoustic components, such as receivers, microphones, and speakers, which enable the acoustic performance of electronic devices.

[0005] In related technologies, acoustic devices are installed inside the housing of electronic devices, and sound guide holes are opened on the housing of electronic devices. The sound information emitted by the user can be transmitted to the acoustic device through the sound guide holes, or the sound information emitted by the acoustic device can be transmitted to the user through the openings, so as to realize the interaction of sound information between the user and the electronic device.

[0006] However, in the above solution, a sound guide hole needs to be opened on the shell to transmit sound information. At this time, the sound guide hole destroys the integrity of the shell, resulting in a lower appearance consistency of the electronic device. At the same time, it also leads to a lower water resistance and dust resistance of the electronic device, resulting in poor safety and reliability of the electronic device.

[0007] Summary of the Invention

[0008] This invention discloses an electronic device to solve the problems of inconsistent appearance, low security, and low reliability of electronic devices.

[0009] To solve the above-mentioned technical problems, the present invention is implemented as follows:

[0010] In a first aspect, embodiments of the present invention disclose an electronic device, including a housing, a first functional module, a second functional module, and a third functional module. The third functional module is disposed within the housing and includes an acoustic device. A sound guiding channel is provided within the housing. The second functional module and the first functional module are mounted on the housing, and an assembly gap exists between the second functional module and the first functional module. The acoustic device communicates with the assembly gap through the sound guiding channel.

[0011] The technical solution adopted in this invention can achieve the following beneficial effects:

[0012] In this embodiment of the invention, the second functional module and the first functional module are installed in the housing, and there is an assembly gap between the second functional module and the first functional module. The acoustic device communicates with the assembly gap through a sound guide channel. When the user emits sound information, the sound information enters the housing through the assembly gap, and the assembly gap transmits it to the acoustic device through the sound guide channel; or, when the acoustic device emits sound information, the sound information is transmitted to the assembly gap through the sound guide channel, and then transmitted to the user through the assembly gap, thereby realizing the interaction of sound information between the user and the electronic device. In this solution, the first functional module and the second functional module have an assembly gap after assembly, so the assembly gap between the first functional module and the second functional module can be used to transmit sound information, thereby eliminating the need to open a sound guide hole on the housing, reducing the number of openings in the housing, thereby improving the integrity and appearance consistency of the housing, resulting in a better appearance and texture of the housing, improving the user experience. At the same time, the assembly gap is narrower than the sound guide hole, thereby effectively preventing moisture and dust from entering the housing, thus improving the waterproof and dustproof performance of the electronic device. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments or background art of the present invention, the drawings used in the description of the embodiments or background art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 is a partial structural schematic diagram of the electronic device disclosed in an embodiment of the present invention;

[0015] Figure 2 is a magnified view of a portion of Figure 1;

[0016] Figure 3 is a cross-sectional view of the electronic device disclosed in an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures:

[0018] 100-Shell

[0019] 210 - First Functional Module

[0020] 220 - Second functional module, 221 - Assembly gap, 222 - Connection channel

[0021] 230-Acoustic Devices

[0022] 400 - Sound guide channel, 410 - First sound guide segment, 420 - Second sound guide segment, 430 - Third sound guide segment

[0023] 510 - Motherboard bracket, 511 - Second recess, 520 - Cover plate, 521 - First through hole, 530 - Circuit board, 531 - Second through hole

[0024] 610 - First seal, 611 - First clearance space, 620 - Second seal, 621 - Second clearance hole, 630 - Dustproof part. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0026] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] As shown in Figures 1 to 3, an embodiment of the present invention discloses an electronic device, which includes a housing 100, a first functional module 210, a second functional module 220, and a third functional module.

[0028] The housing 100 provides a mounting base for other components of the electronic device. A third functional module may be disposed within the housing 100, and the third functional module includes an acoustic device 230, which may include at least one of a microphone, receiver, and speaker, or a sound-generating device or a sound-collecting device. A sound guide channel 400 is provided within the housing 100 for transmitting sound information. A second functional module 220 and a first functional module 210 are mounted on the housing 100, and an assembly gap 221 is provided between the second functional module 220 and the first functional module 210. One port of the assembly gap 221 is exposed on the outer surface of the electronic device. The assembly gap 221 can be used for sound guiding in the electronic device, and the acoustic device 230 communicates with the assembly gap 221 through the sound guide channel 400.

[0029] In specific operation, when the acoustic device 230 is a pickup device, when the user emits a sound, the sound enters the housing 100 through the assembly gap 221, and is then transmitted to the acoustic device 230 through the sound guide channel 400. In this embodiment, the acoustic device 230 can be a microphone. When the acoustic device 230 is a sound-emitting device, when the acoustic device 230 emits a sound, the sound is transmitted to the assembly gap 221 through the sound guide channel 401, and then to the user through the assembly gap 221. In this embodiment, the acoustic device 230 can be a receiver or a speaker.

[0030] Optionally, the housing 100 may include a front cover and a rear cover. The front cover may provide a mounting base for the display screen of the electronic device, and the rear cover may be the battery cover of the electronic device. When the first functional module 210 and the second functional module 220 are mounted on the rear cover of the housing 100, the first functional module 210 may be a rear camera module, a flash module, a fingerprint module, or a second display module disposed on the rear cover of the housing, etc. To better illustrate this embodiment, the first functional module 210 is taken as a rear camera module as an example below. The second functional module 220 may be a decorative element of the first functional module 210. Therefore, there is an assembly gap 221 between the rear camera module, the flash, or the fingerprint module disposed on the back and their corresponding decorative rings. Of course, the first functional module 210 and the second functional module 220 may also be other functional modules, which are not limited herein.

[0031] In this embodiment of the invention, the first functional module 210 and the second functional module 220 have an assembly gap 221 after assembly. Therefore, sound information can be transmitted through the assembly gap 221 between the first functional module 210 and the second functional module 220, thereby eliminating the need to open a sound guide hole on the housing 100, reducing the number of openings in the housing 100, thereby improving the integrity and appearance consistency of the housing 100, resulting in a better appearance and texture of the housing 100, and improving the user experience. At the same time, the assembly gap 221 is narrower than the sound guide hole, thereby effectively preventing moisture and dust from entering the housing 100, thereby improving the waterproof and dustproof performance of the electronic device.

[0032] In addition, by using the assembly gap 221 between the first functional module 210 and the second functional module 220 to transmit sound information, the housing 100 does not need to be additionally processed with a sound guide hole, thereby optimizing the processing technology of the housing 100, simplifying the processing steps of the housing 100, and thus reducing the manufacturing cost of electronic devices.

[0033] In one optional embodiment, the assembly gap 221 can be elongated and narrow. By reducing the width of the assembly gap 221, it can be made more concealed. This width is the distance between the portions of the first functional module 210 and the second functional module 220 that form the assembly gap 221. In this case, the user is less likely to see the assembly gap 221, thus improving the appearance and texture of the electronic device. The extension direction of the assembly gap 221 is the length direction of the assembly gap 221. By increasing the length of the assembly gap 221, the area of ​​the assembly gap 221 can be increased, thereby meeting the sound conduction requirements of the acoustic device 230. The shape and structure of the assembly gap 221 can be determined by the external structure of the first functional module 210 and the second functional module 220.

[0034] In another embodiment, the assembly gap 221 can be an arc-shaped structure, which is smoother and has no sharp edges than a straight structure, making the electronic device more aesthetically pleasing and further improving the user experience.

[0035] To further improve the performance of the acoustic device 230, in one optional embodiment, a notch is provided on the edge where the second functional module 220 fits against the first functional module 210, forming an assembly gap 221. In this solution, some material is removed from the edge where the second functional module 220 fits against the first functional module 210, thereby increasing the size of the assembly gap 221 between the two modules. This increases the area of ​​the assembly gap 221, allowing it to transmit more sound information, thus improving the performance of the acoustic device 230 and resulting in better sound quality for the electronic device. Optionally, the notch can be elongated or strip-shaped, or it can be other shapes; this is not limited to these shapes. Alternatively, a notch can be provided on the edge of the first functional module 210 and the second functional module 220 that are in contact with each other. This can also increase the area of ​​the assembly gap 221, thereby enabling the assembly gap 221 to transmit more sound information, improving the performance of the acoustic device 230, and achieving a better sound quality for the electronic device.

[0036] In an optional embodiment, the first functional module 210 may include a first functional device and a module bracket. The first functional device is mounted on the module bracket, and both the first functional device and the module bracket are exposed on the outer surface of the housing 100. An assembly gap 221 is formed between the module bracket and the second functional module 220. In this design, sound is less likely to affect the first functional device during transmission, and moisture and dust from the external environment are less likely to enter the first device, thereby improving the reliability of the electronic device.

[0037] For example, when the first functional module 210 is a camera module, the first functional device may include a camera and other electronic components, and the module bracket provides a mounting base for the camera and other electronic components.

[0038] In the above embodiments, dust and moisture from the external environment can enter the housing 100 along the assembly gap 221, potentially causing blockage of the sound guide hole of the acoustic device 230 or short circuit of the electronic components of the acoustic device 230, resulting in damage to the acoustic device 230 and lower safety and reliability of the electronic device. To solve the above problems, in an optional embodiment, the sound guide channel 400 may include a first sound guide segment 410, a second sound guide segment 420, and a third sound guide segment 430 connected in sequence. The first sound guide segment 410 is connected to the assembly gap 221, and the acoustic device 230 is located at the end of the third sound guide segment 430 opposite to the second sound guide segment 420. The central axis of the first sound guide segment 410 intersects the central axis of the second sound guide segment 420, and the central axis of the first sound guide segment 410 is parallel to the central axis of the third sound guide segment 430. In this design, the sound guide channel 400 has a bent structure, which allows the side walls of each sound guide segment to block dust and moisture. At the same time, the sound guide channel 400 has a long path, which allows most of the dust and moisture to settle and adhere to the side walls of each sound guide segment. This makes it difficult for dust and moisture to reach the installation position of the acoustic device 230, thus making it less likely for the sound guide port of the acoustic device 230 to be blocked, resulting in better sound quality of the acoustic device 230.

[0039] Optionally, the angle between the central axis of the first sound guide segment 410 and the central axis of the second sound guide segment 420 can be 90°. In this case, the central axes of the first sound guide segment 410 and the second sound guide segment 420 can be perpendicular. This results in a more compact structure for the sound guide channel 400, thus reducing the space occupied by the sound guide channel 400 within the housing 100. Of course, the angle between the central axes of the first sound guide segment 410 and the second sound guide segment 420 can also be other angles, such as 30°, 45°, or 60°, etc. This invention does not impose any limitation on the specific angle.

[0040] In the above scheme, the central axis of the first sound guide segment 410 can intersect with the central axis of the second sound guide segment 420, and the central axis of the first sound guide segment 410 can be parallel to the central axis of the third sound guide segment 430. In this case, the second sound guide segment 420 can guide the third sound guide segment 430 to the edge of the housing 100, thereby bringing the acoustic device 230 closer to the edge of the housing 100, thus optimizing the structure of the electronic device.

[0041] In another optional embodiment, a connecting channel 222 can be formed between the first functional module 210 and the second functional module 220. The first sound guide segment 410 is offset from the assembly gap 221, and the first sound guide segment 410 is connected to the assembly gap 221 through the connecting channel 222. At this time, the assembly gap 221, the connecting channel 222, and the first sound guide segment 410 form a bent structure. The sidewall of the bent structure can block dust and moisture. At this time, most of the dust and moisture can adhere to the sidewall of the bent structure, thereby preventing dust and moisture from entering the acoustic device 230. This makes the sound guide port of the acoustic device 230 less likely to be blocked, and the electronic components of the acoustic device 230 less likely to be short-circuited and damaged, further improving the safety and reliability of the electronic device.

[0042] Optionally, when the first functional device includes the first functional device and the module bracket, the connection channel 222 is composed of the module bracket and the portion of the second functional module 220 that is not exposed on the surface of the housing 100.

[0043] In the above embodiments, the electronic device disclosed in the present invention may further include a motherboard bracket 510. The motherboard bracket 510 is used to install electronic components of the electronic device. The motherboard bracket 510 is disposed within the housing 100. The first sound guide segment 410 may be formed in the first functional module 210. The second sound guide segment 420 and the third sound guide segment 430 may be formed in the motherboard bracket 510. The first sound guide segment 410 and the third sound guide channel 400 have a certain angle with the second sound guide channel 400. When the second sound guide segment 420 is manufactured by casting, the second sound guide segment 420 is located inside the motherboard bracket 510. The motherboard bracket 510 is difficult to demold, which makes the electronic device difficult to process and has a high cost.

[0044] In one optional embodiment, the electronic device disclosed in this invention further includes a cover plate 520, which can be located within the housing 100. A first groove can be formed on the side of the motherboard bracket 510 facing the first functional module 210. The cover plate 520 covers the opening of the first groove, thus forming a second sound guide segment 420 with the first groove. A first through hole 521 can be formed at one end of the cover plate 520, through which the second sound guide segment 430 and the first sound guide segment 410 can communicate. A third sound guide segment 430 can be formed on the bottom wall of the first groove, with the first through hole 521 and the third sound guide segment 430 being staggered. The motherboard bracket 510 can be pre-processed using a casting method to create the first groove. Since the first groove is an open structure, the motherboard bracket 510 is easier to demold. Then, the cover plate 520 is placed over the opening of the first groove to form the second sound guide segment 420. In this solution, the second sound guide segment 420 is easy to process, thus reducing the processing difficulty and cost of the electronic device.

[0045] Optionally, the cover plate 520 can be bonded to the motherboard bracket 510 using double-sided adhesive tape. The cover plate 520 can be a PET (Polyethylene terephthalate) sheet or a metal sheet. When the cover plate 520 is a metal sheet, it reinforces the rigidity of the motherboard bracket 510, enhancing its overall rigidity.

[0046] In the above embodiments, the first sound guide segment 410 can be disposed on the first functional module 210, and the second sound guide segment 420 can be disposed on the motherboard bracket 510. In this case, there is a gap between the first sound guide segment 410 and the second sound guide segment 420, allowing sound to enter the gap, thus causing sound leakage in the electronic device and resulting in poor sound quality. In an optional embodiment, the electronic device disclosed in this invention may further include a first sealing member 610. The first functional module 210 and the cover plate 520 are sealed together by the first sealing member 610. A first clearance hole 611 is provided on the portion of the first sealing member 610 opposite to the first through hole 521. The first sound guide segment 410 and the second sound guide segment 420 are connected through the first clearance hole 611 and the first through hole 521. In this case, the first sealing member 610 can seal the gap between the first sound guide segment 410 and the second sound guide segment 420, thereby preventing sound leakage in the electronic device and resulting in better sound quality. Additionally, the first seal 610 can block dust and moisture within the sound-conducting channel 400, thereby preventing dust and moisture from damaging the electronic components of the electronic device. Optionally, the first seal 610 can be made of materials such as silicone or rubber.

[0047] In the above embodiments, the cover plate 520 overlaps the surface of the motherboard bracket 510. At this time, the stacking height of the motherboard bracket 510 and the cover plate 520 is relatively large, and the stacked structure of the motherboard bracket 510 and the cover plate 520 occupies a large space in the housing 100, resulting in a larger thickness of the electronic device and a poorer user experience. In an optional embodiment, a second groove 511 can be formed on the side of the motherboard bracket 510 facing the first functional module 210. The first groove can be formed at the bottom of the second groove 511, with the opening of the first groove located at the bottom of the second groove 511. The cover plate 520 overlaps the bottom of the second groove 511, and the first groove and the second groove 511 can form a recessed platform structure, with at least a portion of the cover plate 520 located within the second groove 511. In this design, at least part of the cover plate 520 can be hidden in the second groove 511, thereby reducing the exposed volume of the cover plate 520. Consequently, the stacking height of the motherboard bracket 510 and the cover plate 520 is smaller, and the stacking structure of the motherboard bracket 510 and the cover plate 520 occupies less space in the housing 100, resulting in a smaller thickness of the electronic device.

[0048] In another embodiment, the electronic device disclosed in this invention may further include a circuit board 530 for mounting electronic components. The circuit board 530 may be disposed on the side of the motherboard bracket 510 opposite to the first functional module 210. The circuit board 530 may have a second through-hole 531. An acoustic device 230 may be disposed on the side of the circuit board 530 opposite to the motherboard bracket 510, and the acoustic device 230 is connected to the third sound guide segment 430 through the second through-hole 531. In this solution, the acoustic device 230 is disposed on the side of the circuit board 530 opposite to the motherboard bracket 510, thereby preventing interference between the acoustic device 230 and the motherboard bracket 510, thus improving the reliability of the electronic device.

[0049] Optionally, the circuit board 530 can be a motherboard or a sub-board of an electronic device. In this embodiment of the invention, the circuit board 530 can be a rigid circuit board or a flexible circuit board. For example, the circuit board 530 can be a printed circuit board, a rigid-flex board, or the circuit board 530 can include a flexible circuit board and a reinforcing board that are bonded together. Of course, other structural forms can also be used, and this document does not limit them.

[0050] To prevent sound leakage at the connection between the second through-hole 531 and the third sound guide segment 430, the electronic device disclosed in this embodiment of the invention may optionally include a second sealing member 620. The circuit board 530 can be sealed to the motherboard bracket 510 through the second sealing member 620. A second clearance hole 621 is provided on the part of the second sealing member 620 opposite to the second through-hole 531, and the third sound guide segment 430 is connected to the second through-hole 531 through the second clearance hole 621. In this solution, the second sealing member 620 can seal the gap between the third sound guide segment 430 and the second through-hole 531, thereby preventing sound leakage from the electronic device and further improving the sound quality of the electronic device. Optionally, the second sealing member 620 can be made of materials such as silicone or rubber.

[0051] In another embodiment, a third groove may be provided on the side of the motherboard bracket 510 away from the first functional module 210, and the second seal 620 is disposed in the third groove. In this case, the second seal 620 can be hidden in the third groove, thereby reducing the exposed volume of the second seal 620. As a result, the stacking height of the structure formed by the motherboard bracket 510, the second seal 620 and the circuit board 530 is smaller, and the structure formed by the motherboard bracket 510, the second seal 620 and the circuit board 530 occupies less space in the housing 100, thereby reducing the thickness of the electronic device.

[0052] In an optional embodiment, the electronic device disclosed in this invention may further include a dustproof section 630, which may be disposed between the third sound guide section 430 and the second through hole 531. In this case, the dustproof section 630 can block most of the dust within the third sound guide section 430, thereby making it difficult for dust to enter the second through hole 531. The amount of dust in the second through hole 531 is relatively small, thus not affecting the sound quality of the acoustic device 230. Furthermore, the dustproof section 630 can be sandwiched between the motherboard bracket 510 and the circuit board 530, thereby eliminating the need for a component on the motherboard bracket 510 to mount the dustproof section 630, making the installation of the dustproof section 630 simple and convenient.

[0053] In one optional embodiment, the first functional module 210 can be a disk structure, and the second functional module 220 can be a ring structure. The second functional module 220 can be arranged around the first functional module 210, and the assembly gap 221 can be an annular structure, with a portion of the assembly gap 221 communicating with the sound guide channel 400. In this solution, the assembly gap 221 can be an annular structure, which is relatively smooth and has no sharp edges, making the electronic device more aesthetically pleasing and further improving the user experience.

[0054] In another embodiment, all assembly gaps 221 are connected to the sound guiding channel 400. In this case, the annular assembly gaps 221 can all realize sound collection or sound emission of the electronic device, thereby realizing the stereo sound effect of the electronic device. In addition, the assembly gaps 221 have a large area, which makes the sound quality of the electronic device better.

[0055] The electronic devices disclosed in the embodiments of this invention can be smartphones, tablets, e-book readers, wearable devices (such as smartwatches), video game consoles, etc. The embodiments of this invention do not limit the specific types of electronic devices.

[0056] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0057] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An electronic device comprising a housing (100), a first functional module (210), a second functional module (220), and a third functional module, wherein the third functional module is disposed within the housing (100) and includes an acoustic device (230), wherein a sound guiding channel (400) is provided within the housing (100), the second functional module (220) and the first functional module (210) are mounted on the housing (100), and an assembly gap (221) is provided between the second functional module (220) and the first functional module (210), wherein the acoustic device (230) communicates with the assembly gap (221) through the sound guiding channel (400).

2. The electronic device according to claim 1, wherein, The assembly gap (221) has an arc-shaped structure.

3. The electronic device according to claim 1, wherein, The second functional module (220) has a notch on one side edge that fits with the first functional module (210); or, the first functional module (210) has a notch on one side edge that fits with the second functional module (220); the notch forms the assembly gap (211).

4. The electronic device according to claim 1, wherein, The first functional module (210) includes a first functional device and a module bracket. The first functional device is mounted on the module bracket, and the first functional device and the module bracket are exposed on the outer surface of the housing (100). The assembly gap (221) is formed between the module bracket and the second functional module (220).

5. The electronic device according to claim 1, wherein, The sound guide channel (400) includes a first sound guide segment (410), a second sound guide segment (420), and a third sound guide segment (430) connected in sequence. The first sound guide segment (410) is connected to the assembly gap (221). The acoustic device (230) is located at the end of the third sound guide segment (430) away from the second sound guide segment. The central axis of the first sound guide segment (410) intersects with the central axis of the second sound guide segment (420). The central axis of the first sound guide segment (410) is parallel to the central axis of the third sound guide segment (430).

6. The electronic device according to claim 5, wherein, A connecting channel (222) is formed between the first functional module (210) and the second functional module (220). The first sound guide segment (410) is offset from the assembly gap (221). The first sound guide segment (410) is connected to the assembly gap (221) through the connecting channel (222).

7. The electronic device according to claim 5, wherein, The electronic device further includes a motherboard bracket (510) and a cover plate (520). The motherboard bracket (510) and the cover plate (520) are both located inside the housing (100). The motherboard bracket (510) has a first groove on the side facing the first functional module (210). The cover plate (520) covers the opening of the first groove. The cover plate (520) and the first groove form a second sound guide segment (420). A first through hole (521) is provided at one end of the cover plate (520). The second sound guide segment (420) and the first sound guide segment (410) are connected through the first through hole (521). The bottom wall of the first groove has a third sound guide segment (430). The first through hole (521) and the third sound guide segment (430) are staggered.

8. The electronic device according to claim 7, wherein, It also includes a first sealing element (610), the first functional module (210) and the cover plate (520) are sealed together by the first sealing element (610), the first sealing element (610) is provided with a first clearance hole (611) at the part opposite to the first through hole (521), and the first sound guide section (410) and the second sound guide section (420) are connected through the first clearance hole (611) and the first through hole (521).

9. The electronic device according to claim 7, wherein, The motherboard bracket (510) also has a second groove (511) on the side facing the first functional module (210). The first groove is opened at the bottom of the second groove (511). The first groove and the second groove (511) form a recessed platform structure. At least part of the cover plate (520) is located in the second groove (511).

10. The electronic device according to claim 7, wherein, The electronic device also includes a circuit board (530), which is disposed on the side of the motherboard bracket (510) away from the first functional module (210). The circuit board (530) has a second through hole (531). The acoustic device (230) is disposed on the side of the circuit board (530) away from the motherboard bracket (510). The acoustic device is connected to the third sound guide segment (430) through the second through hole (531).

11. The electronic device according to claim 10, wherein, It also includes a second sealing element (620). The motherboard bracket (510) has a third groove on the side opposite to the first functional module (210). The second sealing element is disposed in the third groove. The circuit board (530) is sealed to the motherboard bracket (510) through the second sealing element (620). The second sealing element (620) has a second clearance hole (621) at the part opposite to the second through hole (531). The third sound guide segment (430) is connected to the second through hole (531) through the second clearance hole (621).

12. The electronic device according to claim 10, wherein, The electronic device also includes a dustproof part (630) disposed between the third sound guide section (430) and the second through hole (532).

13. The electronic device according to claim 1, wherein, The first functional module (210) is a disc structure, the second functional module (220) is a ring structure, the second functional module (220) is arranged in a ring around the first functional module (210), the assembly gap (221) is a ring structure, and the assembly gap (221) is at least partially connected to the sound guide channel (400).