A method for producing solder paste stencil aperture

Abstract

The present invention relates to a method for producing a solder paste stencil aperture in electronic board fabrication comprising: providing a solder paste stencil aperture substrate (100); coating the solder paste stencil aperture substrate (200); characterised in that the coating step comprises conducting a vapour-deposition sputtering process (201) which uniformly deposits a metal vapour coating on both the stencil aperture walls and the stencil foil surfaces, the coating having a thickness of 30–1000 nm; wherein the sputtering process is carried out in a chamber (201a) maintained at a humidity of approximately 75%, within a temperature range of 10–30°C, and in an environment that is free of corrosive or conductive dust or gas, and the sputtering is performed using two indirect water-cooled cylindrical magnetron sputtering targets (201c) arranged to coat fine stencil aperture geometries.