Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure

Abstract

A handling device (100) for handling a component carrier structure (102) composed of a plurality of preforms of component carriers (104) during temperature treatment, wherein the handling device (100) comprises a first jig (108) and a second jig (110) configured for accommodating the component carrier structure (102) in between, an array of magnets (112) forming part of one of the first jig (108) and the second jig (110), and a plate (114) forming part of the other one of the first jig (108) and the second jig (110), wherein the magnets (112) are configured for generating an attracting force with the plate (114) for suppressing deformation of the component carrier structure (102) in between. The most illustrative drawing: Figure 1