Wire bonding system including a wire biasing tool

Abstract

A wire bonding system has a bonding tool (12) and a wire guide (14) for guiding a bonding wire (42) to a tip of the bonding tool (12) for conducting wire bonding operations. A wire biasing tool (20) is located adjacent to the wire guide (14), and a rotary actuator (30) is operatively connected to the wire biasing tool (20) by a linkage mechanism (24). The rotary actuator (30) is operable to move the wire biasing tool (20) along a predetermined travel path (34) to apply a biasing force onto a length of bonding wire (42) extending from the tip of the bonding tool (12). (Most illustrative figure: Fig.1)